September 15, 2008
LMX9830
Bluetooth® Serial Port Module
1.0 General Description
The National Semiconductor LMX9830 Bluetooth Serial Port
module is a highly integrated Bluetooth 2.0 baseband con-
troller and 2.4 GHz radio, combined to form a complete small
form factor (6.1 mm x 9.1 mm x 1.2 mm) Bluetooth node.
All hardware and firmware is included to provide a complete
solution from antenna through the complete lower and upper
layers of the Bluetooth stack, up to the application including
the Generic Access Profile (GAP), the Service Discovery Ap-
plication Profile (SDAP), and the Serial Port Profile (SPP).
The module includes a configurable service database to fulfil
service requests for additional profiles on the host. Moreover,
the LMX9830 is pre-qualified as a Bluetooth Integrated Com-
ponent. Conformance testing through the Bluetooth qualifi-
cation program enables a short time to market after system
integration by insuring a high probability of compliance and
interoperability.
Based on National's CompactRISC® 16-bit processor archi-
tecture and Digital Smart Radio technology, the LMX9830 is
optimized to handle the data and link management process-
ing requirements of a Bluetooth node.
The firmware supplied in the on-chip ROM memory offers a
complete Bluetooth (v2.0) stack including profiles and com-
mand interface. This firmware features point-to-point and
point-to-multipoint link management supporting data rates up
to the theoretical maximum over RFComm of 704 kbps (Best
in Class in the industry). The internal memory supports up to
7 active Bluetooth data links and one active SCO link.
The on-chip Patch RAM provided for lowest cost and risk, al-
lows the flexibility of firmware upgrade.
The LMX9830 module is lead free and RoHS (Restriction of
Hazardous Substances) compliant. For more information on
those quality standards, please visit our green compliance
website at http://www.national.com/quality/green/
2.0 Features
Compliant with the Bluetooth 2.0 Core Specification
Qualified Design ID (PRD 2.0): B012364
Better than -80 dBm input sensitivity
Class 2 operation
Low power consumption
High integration:
Implemented in 0.18 μm CMOS technology
RF includes antenna filter and switch on-chip
3.0 Other Features
3.1 DIGITAL HARDWARE
Baseband and Link Management processors
CompactRISC Core
Embedded ROM and Patch RAM memory
UART Command/Data Port:
Support for up to 921.6k baud rate
Auxiliary Host Interface Ports:
Link Status
Transceiver Status (Tx or Rx)
Three General Purpose I/Os, available through the API
Alternative IO functions:
Link Status
Transport layer activity
Advanced Power Management (APM) features:
Advanced power management functions
Advanced Audio Interface for external PCM codec
ACCESS.bus and SPI/Microwire for interfacing with
external non-volatile memory
3.2 FIRMWARE
Complete Bluetooth Stack including:
Baseband and Link Manager
L2CAP, RFCOMM, SDP
Profiles:
GAP
SDAP
SPP
Additional Profile support on Host, e.g.:
Dial Up Networking (DUN)
Facsimile Profile (FAX)
File Transfer Protocol (FTP)
Object Push Profile (OPP)
Synchronization Profile (SYNC)
Headset (HSP)
Handsfree Profile (HFP)
Basic Imaging Profile (BIP)
Basic Printing Profile (BPP)
On-chip application including:
Default connections
Command Interface:
Link setup and configuration (also Multipoint)
Configuration of the module
Service database modifications
UART Transparent mode
Optimized cable replacement :
Automatic transparent mode
Bluetooth® is a registered trademark of Bluetooth SIG, Inc. and is used under license by National Semiconductor Corporation.
CompactRISC® is a registered trademark of National Semiconductor Corporation.
© 2008 National Semiconductor Corporation 201800 www.national.com
LMX9830 Bluetooth Serial Port Module
Event filter
3.3 DIGITAL SMART RADIO
Accepts external clock or crystal input:
13 MHz Typical
Supports 10 - 20 MHz
Secondary 32.768 kHz oscillator for low-power modes
20 ppm cumulative clock error required for Bluetooth
Synthesizer:
Integrated VCO
Provides all clocking for radio and baseband functions
Antenna Port (50 nominal impedance):
Embedded front-end filter for enhanced out of band
performance
Integrated transmit/receive switch (full duplex operation
via antenna port)
Better than -80 dBm input sensitivity
0 dBm typical output power
3.4 PHYSICAL
Compact size - 6.1 mm x 9.1 mm x 1.2 mm
Complete system interface provided in Ball Grid Array on
underside for surface mount assembly
4.0 Applications
Personal Digital Assistants
POS Terminals
Data Logging Systems
Audio Gateway application
Telemedicine/Medical, Industrial and Scientific
5.0 Functional Block Diagram
20180028
6.0 Ordering Information
Order Number Spec. Shipment Method
LMX9830SM NOPB (Note 1) 388 pcs Tray
LMX9830SMX NOPB (Note 1) 2500 pcs Tape & Reel
Note 1: NOPB = No Pb (No Lead)
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LMX9830
7.0 Connection Diagram
FBGA, Plastic, Laminate, 9x6x1.2mm, 60 Ball, 0.8mm Pitch Package (SLF60A)
20180001
7.1 PAD DESCRIPTIONS
TABLE 1. Pin Descriptions
Pad Name Pad Location Type Default Layout Description
X1_CKO F7 O Crystal 10-20 MHz
X1_CKI E7 I Crystal or External Clock 10-20 MHz
X2_CKI F5 I GND
(if not used)
32.768 kHz Crystal Oscillator
X2_CKO E5 O NC
(if not used)
32.768 kHz Crystal Oscillator
RESET_RA# B8 I Radio Reset (active low)
B_RESET_RA# B6 O NC Buffered Reset Radio Output (active low)
RESET_BB# B7 I Baseband Reset (active low)
ENV1# C6 I NC ENV1: Environment Select (active low) used for
manufacturing test only
TE A9 I GND Test Enable - Used for manufacturing test only
TST1/DIV2# B10 I NC TST1: Test Mode. Leave not connected to permit use
with VTune automatic tuning algorithm
DIV2#: No longer supported
TST2 C7 I GND Test Mode, Connect to GND
TST3 C8 I GND Test Mode, Connect to GND
TST4 C9 I GND Test Mode, Connect to GND
TST5 D8 I GND Test Mode, Connect to GND
TST6 D9 I VCO_OUT Test Input,
Connect to VCO_OUT via 0 resistor to permit use
with VTune automatic tuning algorithm
MDODI (Note 2) D1 I/O SPI Master Out Slave In
OP6/SCL/MSK C1 OP6: I
SCL/MSK: I/O
See Table 16 OP6: Pin checked during Startup Sequence for
configuration option
SCL: ACCESS.Bus Clock
MSK: SPI Shift
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LMX9830
Pad Name Pad Location Type Default Layout Description
OP7/SDA/
MDIDO
D4 OP7: I
SDA/MDIDO: I/O
See Table 16 OP7: Pin checked during Startup Sequence for
configuration option
SDA: ACCESS.Bus Serial Data
MDIDO: SPI Master In Slave Out
OP3/MWCS# D3 I See Table 16 and
Table 17
OP3: Pin checked during Startup Sequence for
configuration option
MWCS#: SPI Slave Select Input (active low)
OP4/PG4 D6 OP4: I
PG4: I/O
See Table 16 and
Table 17
OP4: Pin checked during Startup Sequence for
configuration option
PG4: GPIO
OP5 F4 I/O See Table 16 and
Table 17
OP5: Pin checked during Startup Sequence for
configuration option
SCLK F1 I/O Audio PCM Interface Clock
SFS F2 I/O Audio PCM Interface Frame Synchronization
SRD F3 I Audio PCM Interface Receive Data Input
STD E3 O Audio PCM Interface Transmit Data Output
XOSCEN A6 O Clock Request. Toggles with X2 (LP0) crystal enable/
disable
PG6 A7 I/O GPIO
PG7 D2 I/O GPIO - Default setup RF traffic LED indication
CTS#(Note 3) C2 I GND (if not used) Host Serial Port Clear To Send (active low)
RXD B3 I Host Serial Port Receive Data
RTS#(Note 4) B1 O NC (if not used) Host Serial Port Request To Send (active low)
TXD C3 O Host Serial Port Transmit Data
RDY# A4 O NC JTAG Ready Output (active low)
TCK B4 I NC JTAG Test Clock Input
TDI B5 I NC JTAG Test Data Input
TDO D5 O NC JTAG Test Data Output
TMS A5 I NC JTAG Test Mode Select Input
VCO_OUT F8 O Charge Pump Output, connect to Loop filter
VCO_IN F9 I VCO Tuning Input, feedback from Loop filter
ANT D10 I/O RF Antenna 50 Nominal Impedance
VCC_PLL F6 O 1.8V Core Logic Power Supply Output
VCC_CORE C5 O 1.8V Voltage Regulator Output
VDD_X1 E8 I Power Supply Crystal Oscillator
VDD_VCO F10 I Power Supply VCO
VDD_RF A10 I Power Supply RF
VDD_IOR E6 I Power Supply I/O Radio/BB
VDD_IF A8 I Power Supply IF
VCC_IOP E4 I Power Supply Audio Interface
VCC_IO C4 I Power Supply I/O
VCC E1 I Voltage Regulator Input
GND_VCO E9 Ground
GND_RF B9, C10, E10 Ground
GND_IF D7 Ground
GND B2,E2 Ground
NC A1,A2,A3 NC Treat as no connect. Place pad for mechanical stability
Note 2: Must use 1k pull up.
Note 3: Connect to GND if CTS is not use.
Note 4: Treat as No Connect if RTS is not used. Pad required for mechanical stability.
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LMX9830
8.0 General Specifications
Absolute Maximum Ratings (see Table 2) indicate limits be-
yond which damage to the device may occur. Operating
Ratings (see Table 3) indicate conditions for which the device
is intended to be functional.
This device is a high performance RF integrated circuit and is
ESD sensitive. Handling and assembly of this device should
be performed at ESD free workstations.
The following conditions are true unless otherwise stated in
the tables below:
TA = -40°C to +85°C
VCC = 3.3V
RF system performance specifications are guaranteed on
National Semiconductor Mesa board rev 1.1 reference
design platform.
TABLE 2. Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VCC Digital Voltage Regulator input -0.2 4 V
VIVoltage on any pad with GND = 0V -0.2 VCC + 0.2 V
VDD_RF Supply Voltage Radio 0.2 3.3 V
VDD_IF
VDD_X1
VDD_VCO
PINRF RF Input Power 0 dBm
VANT Applied Voltage to ANT pad 1.95 V
TSStorage Temperature Range -65 +150 °C
TLLead Temperature (Note 5) (solder 4 sec.) 225 °C
TLNOPB Lead Temperature NOPB (Note 5), (Note 6)
(solder 40 sec.) 260 °C
ESDHBM ESD - Human Body Model 2000 V
ESDMM ESD - Machine Model 200 (Note 7) V
Note 5: Reference IPC/JDEC J-STD-20C spec.
Note 6: NOPB = No Pb (No Lead).
Note 7: A 200V ESD rating applies to all pins except OP3, OP6, OP7, MDODI, SCLK, SFS, STD, TDO, and ANT pins = 150V.
TABLE 3. Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VCC Digital Voltage Regulator input 2.5 2.75 3.6 V
TRDigital Voltage Regulator Rise Time 10 μs
TAAmbient Operating Temperature Range -40 +25 +125 °C
Fully Functional Bluetooth Node
VCC_IO Supply Voltage Digital I/O 1.6 3.3 3.6 V
VCC_PLL Internally connected to VCC_Core
VDD_RF Supply Voltage Radio 2.5 2.75 3 V
VDD_IF
VDD_X1
VDD_VCO
VDD_IOR Supply Voltage Radio I/O 1.6 2.75 VDD_RF V
VCC_IOP Supply Voltage PCM Interface 1.6 3.3 3.6 V
VCC_CORE Supply Voltage Output 1.8 V
VCC_COREMAX Supply Voltage Output Max Load 5 mA
VCC_CORESHORT When used as Supply Input (VCC grounded) 1.6 1.8 2 V
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LMX9830
TABLE 4. Power Supply Requirements (Notes 8, 9)
Symbol Parameter Min Typ
(Note 10) Max Unit
ICC-TX Power supply current for continuous transmit 65 mA
ICC-RX Power supply current for continuous receive 65 mA
IRXSL Receive Data in SPP Link, Slave (Note 11) 26 mA
IRXM Receive Data in SPP Link, Master (Note 11) 23 mA
ISnM Sniff Mode, Sniff interval 1 second (Note 11) 5.6 mA
ISC-TLDIS Scanning, No Active Link, TL Disabled (Note 11) 0.43 mA
IIdle Idle, Scanning Disabled, TL Disabled (Note 11) 100 µA
Note 8: Power supply requirements based on Class II output power.
Note 9: Based on UART Baudrate 921.6 kbit/s.
Note 10: VCC = 3.3V, VCC_IO = 3.3V, Ambient Temperature = +25°C.
Note 11: Average values excluding IO.
8.1 DC CHARACTERISTICS
TABLE 5. Digital DC Characteristics
Symbol Parameter Condition Min Max Units
VIH Logical 1 Input Voltage high
(except oscillator I/O)
1.6V VCC_IO 3.0V
3.0V VCC_IO 3.6V
0.7 x VCC_IO
2
VCC_IO + 0.2
VCC_IO + 0.2
V
VIL Logical 0 Input Voltage low 1.6V VCC_IO 3.0V -0.2 0.25 x VCC_IO V
(except oscillator I/O) 3.0V VCC_IO 3.6V -0.2 0.8
VHYS Hysteresis Loop Width (Note 12) 0.1 x VCC_IO V
IOH Logical 1 Output Current VOH = 2.4V,
VCC_IO = 3.0V
-10 mA
IOL Logical 0 Output Current VOH = 0.4V,
VCC_IO = 3.0V
10 mA
Note 12: Guaranteed by design.
8.2 RF PERFORMANCE CHARACTERISTICS
In the performance characteristics tables the following applies:
All tests performed are based on Bluetooth Test Specification revision 2.0.
All tests are measured at antenna port unless otherwise specified
TA = -40°C to +85°C
VDD_RF = 2.8V unless otherwise specified.
RF system performance specifications are guaranteed on National Semiconductor Mesa Board rev 1.1 reference design platform.
TABLE 6. Receiver Performance Characteristics
Symbol Parameter Condition Min Typ
(Note 13) Max Unit
RXsense Receive Sensitivity BER < 0.001 2.402 GHz -80 -76 dBm
2.441 GHz -80 -76 dBm
2.480 GHz -80 -76 dBm
PinRF Maximum Input Level -10 0 dBm
IMP
(Note 14), (Note 15)
Intermodulation Performance F1= + 3 MHz,
F2= + 6 MHz,
PinRF = -64 dBm
-38 -36 dBm
RSSI RSSI Dynamic Range at LNA
Input
-72 -52 dBm
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LMX9830
Symbol Parameter Condition Min Typ
(Note 13) Max Unit
ZRFIN (Note 15) Input Impedance of RF Port
(RF_inout)
Single input impedance
Fin = 2.5 GHz
32
Return Loss
(Note 15)
Return Loss -8 dB
OOB (Note 14),
(Note 15)
Out Of Band Blocking
Performance
PinRF = -10 dBm,
30 MHz < FCWI < 2 GHz,
BER < 0.001
-10 dBm
PinRF = -27 dBm,
2000 MHz < FCWI < 2399 MHz,
BER < 0.001
-27 dBm
PinRF = -27 dBm,
2498 MHz < FCWI < 3000 MHz,
BER < 0.001
-27 dBm
PinRF = -10 dBm,
3000 MHz < FCWI < 12.75 GHz,
BER < 0.001
-10 dBm
Note 13: Typical operating conditions are at 2.75V operating voltage and 25°C ambient temperature.
Note 14: The f0 = -64 dBm Bluetooth modulated signal, f1 = -39 dbm sine wave, f2 = -39 dBm Bluetooth modulated signal, f0 = 2f1 - f2, and |f2 - f1| = n * 1 MHz,
where n is 3, 4, or 5. For the typical case, n = 3.
Note 15: Not tested in production.
TABLE 7. Transmitter Performance Characteristics
Symbol Parameter Condition Min Typ
(Note 13) Max Unit
POUTRF Transmit Output Power 2.402 GHz −4 0 +3 dBm
2.441 GHz −4 0 +3 dBm
2.480 GHz −4 0 +3 dBm
MOD ΔF1AVG Modulation Characteristics Data = 00001111 140 165 175 kHz
MOD ΔF2MAX (Note 17) Modulation Characteristics Data = 10101010 115 125 kHz
ΔF2AVG/DF1AVG (Note 18) Modulation Characteristics 0.8
20 dB Bandwidth 1000 kHz
POUT2*fo (Note 19) PA 2nd Harmonic Suppression Maximum gain setting:
f0 = 2402 MHz,
Pout = 4804 MHz
-30 dBm
ZRFOUT (Note 20) RF Output Impedance/Input
Impedance of RF Port (RF_inout)
Pout @ 2.5 GHz 47 Ω
Note 16: Typical operating conditions are at 2.75V operating voltage and 25°C ambient temperature.
Note 17: ΔF2max 115 kHz for at least 99.9% of all Δf2max.
Note 18: Modulation index set between 0.28 and 0.35.
Note 19: Out-of-Band spurs only exist at 2nd and 3rd harmonics of the CW frequency for each channel.
Note 20: Not tested in production.
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LMX9830
TABLE 8. Synthesizer Performance Characteristics
Symbol Parameter Condition Min Typ Max Unit
fVCO VCO Frequency Range 2402 2480 MHz
tLOCK Lock Time f0 ± 20 kHz 120 µs
Δf0offset (Note 21) Initial Carrier Frequency Tolerance During preamble -75 0 75 kHz
Δf0drift (Note 21) Initial Carrier Frequency Drift DH1 data packet -25 0 25 kHz
DH3 data packet -40 0 40 kHz
DH5 data packet -40 0 40 kHz
Drift Rate -20 0 20 kHz/50µs
tD - Tx Transmitter Delay Time From Tx data to antenna 4 µs
Note 21: Frequency accuracy is dependent on crystal oscillator chosen. The crystal must have a cumulative accuracy of < +/-20ppm to meet Bluetooth
specifications.
8.3 PERFORMANCE DATA (typical)
20180002
Modulation
20180004
Transmit Spectrum
20180005
Corresponding Eye Diagram
20180006
Synthesizer Phase Noise
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LMX9830
20180050
Front-End Bandpass Filter Response
20180007
TX and RX Pin 50 Impedance Characteristics
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LMX9830
20180008
Transceiver Return Loss
9.0 Functional Description
9.1 BASEBAND AND LINK MANAGEMENT
PROCESSORS
Baseband and Lower Link control functions are implemented
using a combination of National’s CompactRISC 16-bit pro-
cessor and the Bluetooth Lower Link Controller. These pro-
cessors operate from integrated ROM memory and RAM and
execute on-board firmware implementing all Bluetooth func-
tions.
9.1.1 Bluetooth Lower Link Controller
The integrated Bluetooth Lower Link Controller (LLC) com-
plies with the Bluetooth Specification version 2.0 and imple-
ments the following functions:
Adaptive Frequency Hopping
Interlaced Scanning
Fast Connect
Support for 1, 3, and 5 slot packet types
79 Channel hop frequency generation circuitry
Fast frequency hopping at 1600 hops per second
Power management control
Access code correlation and slot timing recovery
9.1.2 Bluetooth Upper Layer Stack
The integrated upper layer stack is prequalified and includes
the following protocol layers:
L2CAP
RFComm
SDP
9.1.3 Profile support
The on-chip application of the LMX9830 allows full stand-
alone operation, without any Bluetooth protocol layer neces-
sary outside the module. It supports the Generic Access
Profile (GAP), the Service Discovery Application Profile
(SDAP), and the Serial Port Profile (SPP).
The on-chip profiles can be used as interfaces to additional
profiles executed on the host. The LMX9830 includes a con-
figurable service database to answer requests with the pro-
files supported.
9.1.4 Application with command interface
The module supports automatic slave operation eliminating
the need for an external control unit. The implemented trans-
parent option enables the chip to handle incoming data raw,
without the need for packaging in a special format. The device
uses a pin to block unallowed connections. This pincode can
be fixed or dynamically set.
Acting as master, the application offers a simple but versatile
command interface for standard Bluetooth operation like in-
quiry, service discovery, or serial port connection. The
firmware supports up to seven slaves. Default Link Policy set-
tings and a specific master mode allow optimized configura-
tion for the application specific requirements. See also
Section 11.0 Integrated Firmware.
9.1.5 Memory
The LMX9830 introduces 16 kB of combined system and
Patch RAM memory that can be used for data and/or code
upgrades of the ROM based firmware. Due to the flexible
startup used for the LMX9830 operating parameters like the
Bluetooth Device Address (BD_ADDR) are defined during
boot time. This allows reading out the parameters of an ex-
ternal EEPROM or programming them directly over UART.
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LMX9830
9.1.6 External memory interfaces
As the LMX9830 is a ROM based device with no on-chip non
volatile storage, the operation parameters will be lost after a
power cycle or hardware reset. In order to prevent re initial-
izing such parameters, patches or even user data, the
LMX9830 offers two interfaces to connect an external EEP-
ROM to the device:
μ-wire/SPI
Access.bus (I2C compatible)
The selection of the interface is done during start up based
on the option pins. See Table 16 for the option pin descrip-
tions.
9.1.7 µ-wire/SPI interface
In case the firmware is configured by the option pins to use a
µ-wire/SPI EEPROM, the LMX9830 will activate that interface
and try to read out data from the EEPROM. The external
memory needs to be compatible to the reference listed in
Table 10. The largest size EEPROM supported is limited by
the addressing format of the selected NVM.
The device must have a page size equal to N x 32 bytes.
The firmware requires that the EEPROM supports Page write.
Clock must be HIGH when idle.
TABLE 9. M95640-S EEPROM 8k x 8
Parameter Value
Supplier ST Microelectronics
Supply Voltage (Note 22) 1.8 - 3.6V
Interface SPI compatible (positive clock SPI Modes)
Memory Size 8k x 8, 64 kbit
Clock Rate (Note 22) 2 MHz
Access Byte and Page Write (up to 32 bytes)
Note 22: Parameter range reduced to requirements of National reference design.
9.1.8 Access.bus Interface
In case the firmware is configured by the option pins to use
an access.bus or I2C compatible EEPROM, the LMX9830 will
activate that interface and try to read out data from the EEP-
ROM. The external memory needs to be compatible to the
reference listed in Table 10.
The largest size EEPROM supported is limited by the ad-
dressing format of the selected NVM. The device must have
a page size equal to N x 32 bytes.
The device uses a 16 bit address format. The device address
must be “000”.
TABLE 10. 24C64 EEPROM 8kx8
Parameter Value
Supplier Atmel
Supply Voltage(Note 23) 2.7 - 5.5 V
Interface 2 wire serial interface
Memory Size 8K x 8, 64 kbit
Clock Rate (Note 23) 100 kHz
Access 32 Byte Page Write Mode
Note 23: Parameter range reduced to requirements of National reference design.
9.2 TRANSPORT PORT - UART
The LMX9830 provides one Universal Asynchronous Receiv-
er Transmitter (UART). The UART interface consists out of
Receive (RX), Transmit (TX), Ready-to-Send (RTS) and
Clear-to-Send signals. RTS and CTS are used for hardware
handshaking between the host and the LMX9830. Since the
LMX9830 acts as gateway between the bluetooth and the
UART interface, National recommends to use the handshak-
ing signals especially for transparent operation. In case two
signals are used CTS needs to be pulled to GND. Please refer
also to “LMX9830 Software User’s Guide” for detailed infor-
mation on 2-wire operation.
The UART interface supports formats of 8-bit data with or
without parity, with one or two stop bits. It can operate at
standard baud rates from 2400bits/s up to a maximum baud
rate of 921.6 kbits/s. DMA transfers are supported to allow for
fast processor independent receive and transmit operation.
The UART baudrate is configured during startup by checking
option pins OP3, OP4 and OP5 for reference clock and bau-
drate. In case Auto baud rate detect is chosen, the firmware
check the NVS area if a valid UART baudrate has been stored
in a previous session. In case, no useful value can be found
the device will switch to auto baud rate detection and wait for
an incoming reference signal.
The UART offers wakeup from the power save modes via the
multi-input wakeup module. When the LMX9830 is in low
power mode, RTS# and CTS# can function as Host_WakeUp
and Bluetooth_WakeUp respectively. Table 11 represents the
operational modes supported by the firmware for implement-
ing the transport via the UART.
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LMX9830
TABLE 11. UART Operation Modes
Item Range Default at Power-Up With Auto-Detect
Baud Rate 2.4 to 921.6 kbits/s Either configured by option pins, NVS
parameter or auto baud rate detection
2.4 to 921.6 kbits/s
Flow Control RTS#/CTS# or None RTS#/CTS# RTS#/CTS#
Parity Odd, Even, None None None
Stop Bits 1,2 1 1
Data Bits 8 8 8
9.3 AUDIO PORT
9.3.1 Advanced Audio Interface
The Advanced Audio Interface (AAI) is an advanced version
of the Synchronous Serial Interface (SSI) that provides a full-
duplex communications port to a variety of industry-standard
13/14/15/16-bit linear or 8-bit log PCM codecs, DSPs, and
other serial audio devices.
The interface allows the support one codec or interface. The
firmware selects the desired audio path and interface config-
uration by a parameter that is located in RAM (imported from
non-volatile storage or programmed during boot-up). The au-
dio path options include the Motorola MC145483 codec, the
OKI MSM7717 codec, the Winbond W681360/W681310
codecs and the PCM slave through the AAI.
In case an external codec or DSP is used the LMX9830 audio
interface generates the necessary bit and frame clock driving
the interface.
Table 12 summarizes the audio path selection and the con-
figuration of the audio interface at the specific modes.
The LMX9830 supports one SCO link.
TABLE 12. Audio Path Configuration
Audio setting Interface Freq Format AAI Bit Clock AAI Frame Clock AAI Frame Sync
Pulse Length
OKI Advanced audio
interface
ANY
(Note 24)
8-bit log PCM 480 kHz 8 kHz 14 Bits
MSM7717 (a-law only)
Motorola MC145483
(Note 25)
Advanced audio
interface
13-bit linear 480 kHz 8 kHz 13 Bits
OKI Advanced audio
interface
13 MHz 8-bit log PCM 520 kHz 8 kHz 14 Bits
MSM7717 (a-law only)
Motorola MC145483
(Note 26)
Advanced audio
interface
13-bit linear 520 kHz 8 kHz 13 Bits
Winbond W681310
Advanced audio
interface
13 MHz 8 bit log PCM 520 kHz 8 kHz 14 Bits
A-law and μ-law
Winbond W681360
Advanced audio
interface
13 MHz 13-bit linear 520 kHz 8 kHz 13 Bits
PCM slave (Note 27)
Advanced audio
interface
ANY
(Note 24)
8/16 bits 128 - 1024 kHz 8 kHz 8/16 Bits
Note 24: For supported frequencies see Table 20.
Note 25: Due to internal clock divider limitations the optimum of 512 kHz, 8 kHz can not be reached. The values are set to the best possible values. The clock
mismatch does not result in any discernible loss in audio quality.
Note 26: Due to internal clock divider limitations the optimum of 512 kHz, 8 kHz can not be reached. The values are set to the best possible values. The clock
mismatch does not result in any discernible loss in audio quality.
Note 27: In PCM slave mode, parameters are stored in NVS. Bit clock and frame clock must be generated by the host interface.
PCM slave configuration example: PCM slave uses the slot
0, 1 slot per frame, 16 bit linear mode, long frame sync, normal
frame sync. In this case, 0x03E0 should be stored in NVS.
See “LMX9830 Software Users Guide” for more details.
9.4 AUXILIARY PORTS
9.4.1 RESET#
There are two reset inputs: RESET_RA# for the radio and
RESET_BB# for the baseband. Both are active low.
There is also a reset output, B_RESET_RA# (Buffered Radio
Reset) active low. This output follows input RESET_RA#.
When RESET_RA# is released, going high, B_RESET_RA#
stays low until the clock has started.
Please see Section 9.5 SYSTEM POWER UP for details.
9.4.2 General Purpose I/Os
The LMX9830 offers 3 pins which either can be used as indi-
cation and configuration pins or can be used for General
Purpose functionality. The selection is made out of settings
derived out of the power up sequence.
In General Purpose configuration the pins are controlled hard-
ware specific commands giving the ability to set the direction,
set them to high or low or enable a weak pull-up.
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LMX9830
In alternate function the pins have pre-defined indication func-
tionality. Please see Table 13 for a description on the alter-
nate indication functionality.
TABLE 13. Alternate GPIO Pin Configuration
Pin Description
OP4/PG4 Operation Mode pin to configure Transport Layer settings during boot-up
PG6 GPIO
PG7 RF Traffic indication
9.5 SYSTEM POWER UP
In order to correctly power-up the LMX9830 the following se-
quence is recommended to be performed:
Apply VCC_IO and VCC to the LMX9830.
The RESET_RA# should be driven high. Then RESET_BB#
should be driven high at a recommended time of 1ms after
the LMX9830 voltage rails are high. The LMX9830 is properly
reset.
Please see timing diagram, Figure 1.
ESR of the crystal also has impact on the startup time of the
crystal oscillator circuit of the LMX9830 (See Table 14 and
Table 15).
20180009
FIGURE 1. LMX9830 Power on Reset Timing
TABLE 14. LMX9830 Power to Reset timing
Symbol Parameter Condition Min Typ Max Unit
tPTORRA Power to Reset _RA# VCC and VCC_IO at operating voltage
level to valid reset
<500
(Note 28) µs
tPTORBB Reset_RA# to Reset_BB# VCC and VCC_IO at operating voltage
level to valid reset
1
(Note 29) ms
Note 28: Rise time on power must switch on fast, rise time <500us.
Note 29: Recommended value.
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LMX9830
TABLE 15. ESR vs. Startup Time
ESR (Ω) Typical (Note 30), (Note 31) Unit
10 12 ms
25 13 ms
40 16 ms
50 24 ms
80 30 ms
Note 30: Frequency, loading caps and ESR all must be considered for determining startup time.
Note 31: For reference only, must be tested on each system to accurately design POR and correctly startup system.
9.6 STARTUP SEQUENCE
During startup the LMX9830 checks the options register pins
OP3 to OP7 for configuration on operation mode, external
clock source, transport layer and available non volatile stor-
age PROM.
The different options for startup are described in Table 16.
9.6.1 Options Register
External pads in Table 16 are latched in this register at the
end of Reset. The Options register can be read by firmware
at any time.
All pads are inputs with weak on-chip pull-up/down resistors
during Reset. Resistors are disconnected at the end of
RESET_BB#.
1 = Pull-up resistor connected in application
0 = Pull-down resistor connected in application
x = Don’t care
9.6.2 Startup With External PROM Available
To be able to read out information from an external PROM the
option pins have to be set according to Table 16.
Startup sequence activities:
1. From the Options registers OP6 and OP7, the LMX9830
checks if a serial PROM is available to use (ACCESS.bus
or Microwire).
2. If serial PROM is available, the permanent parameter
block, patch block, and non-volatile storage (NVS) are
read from it. If the BD Address is not present, enter the
BD address to be saved in the NVS. For more information
see Section 9.6.4 Configuring the LMX9830 Through
Transport Layer.
3. From the Options register OP3, OP4 and OP5, the
LMX9830 checks for clocking information and transport
layer settings. If the NVS information are not sufficient,
the LMX9830 will send the “Await Initialization” event on
the TL (Transport Layer) and wait for additional
information (see Section 9.6.3 Startup Without External
PROM Available.)
4. The LMX9830 compensates the UART for new BBCLK
information from the NVS.
5. The LMX9830 starts up the Bluetooth core.
9.6.3 Startup Without External PROM Available
The following sequence will take place if OP6 and OP7 have
been set to “No external memory” as described in Table 16.
Startup sequence activities:
1. From the Options registers OP6 and OP7, the LMX9830
checks if a serial PROM is available to use.
2. From the Options register OP3, OP4 and OP5, the
LMX9830 checks for clocking mode and transport layer.
3. The LMX9830 sends the “Await Initialization” Event on
the TL (Transport Layer) and waits for NVS configuration
commands. The configuration is finalized by sending the
“Enter Bluetooth Mode” command.
4. The LMX9830 compensates the UART for new BBCLK
information from the NVS.
5. The LMX9830 starts up the Bluetooth core.
TABLE 16. Startup Sequence Options (Note 32)
Package Pad Comment
OP3 OP4 OP5 OP6 (Note 33) OP7 (Note 34) ENV1#
PD PD PD PD PD PU PD = Internal Pull-down during Reset
PU = Internal Pull-up during Reset
x x x Open (0) Open (0) Open (1)
BBCLK
No serial memory
x x x 1 Open (0) Open (1)
BBCLK
Reserved
x x x Open (0) 1 Open (1)
BBCLK
Microwire serial memory
x x x 1 1 Open (1)
BBCLK
ACCESS.bus serial memory
T_SCLK x x T_RFDATA T_RFCE 0 BBCLK Test mode
Note 32: 1/0 pull-up/down resistor connected in application.
Note 33: If OP6 is 1, must use 1k pull up, If OP6 is 0, must use 10k pull down.
Note 34: If OP7 is 1, must use 1k pull up.
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LMX9830
20180010
FIGURE 2. Flow Diagram for the Start-up Sequence
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LMX9830
TABLE 17. Fixed Frequencies
Osc Freq. (MHz) BBCLK (MHz) PLL (48 MHz) OP3 (Note 35) OP4 (Note 36) OP5 (Note 37) Function
12 12 OFF 0 0 0 UART speed read from NVS
10-20 (Note 38) 10-20 (Note 35) ON 0 1 0 Clock and UART baudrate
detection
13 13 OFF 1 0 0 UART speed read from NVS
13 13 OFF 1 0 1 UART speed 9.6 kbps
13 13 OFF 1 1 0 UART speed 115.2 kbps
13 13 OFF 1 1 1 UART speed 921.6 kbps
Note 35: If OP3 is 1, must use 1k pull up.
Note 36: If OP4 is 1, must use 1k pull up.
Note 37: If OP5 is 1, must use 1k pull up.
Note 38: Supported frequencies see Table 21.
9.6.4 Configuring the LMX9830 Through Transport Layer
As described in Section 9.5 SYSTEM POWER UP, the
LMX9830 will check during startup the Options Registers if an
external PROM is available. If the information on the PROM
are incomplete or no PROM is installed the LMX9830 will boot
into the “initialization Mode”.
The mode is confirmed by the “Await Initialization” Event.
The following information are needed to enter Bluetooth
Mode:
Bluetooth Device Address (BD_Addr)
External clock source (only if 10 - 20 MHz has been
selected)
UART Baudrate (only if Auto baudrate detection has been
selected)
In general the following procedure will initialize the LMX9830:
1. Wait for “Await initialization” Event
— Event will only appear if transport layer speed is set
or after successful baudrate detection.
2. Send “Set Clock and Baudrate” Command only if the
clock speed is not known through hardware
configuration (i.e only if OP3, OP4, OP5 = 0 1 0).
3. Send “Write BD_Addr” to Configure Local Bluetooth
Device Address.
4. Send “Enter Bluetooth Mode”
— LMX9830 will use configured clock and UART speed
and start the command interface.
Note: In case no EEPROM is used, BDAddr, clock source and Baudrate are
only valid until the next power-cycle or hardware reset.
9.6.5 Auto Baud Rate Detection
The LMX9830 supports an Automatic Baudrate Detection in
case the external clock is different to 12, 13MHz or the range
10-20 MHz or the baudrate is different to 9.6 kbps, 115.2 or
921.6 kbit/s.
The baudrate detection is based on the measurement of a
single character. The following issues need to be considered:
The flow control pin CTS must be low or else the host is in
flow stop.
The Auto Baudrate Detector measures the length of the
0x01 character from the positive edge of bit 0 to the
positive edge of stop bit.
Therefore the very first received character must always be
a 0x01.
The host can restrict itself to send only a 0x01 character
or also can send a command.
The host must flush the TX buffer within 50-100
milliseconds depend on clock frequency on the host
controller.
After 50-100 milliseconds the UART is about to be
initialized and short after the host should receive a “Await
Initialization” Event or an “Command Status” Event.
20180011
FIGURE 3. Auto Baudrate Detection Timing Diagram
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LMX9830
9.7 USING AN EXTERNAL EEPROM FOR NON-VOLATILE
DATA
The LMX9830 offers two interfaces to connect to external
memory. Depending on the EEPROM used, the interface is
activated by setting the correct option pins during start up.
See Table 16 for the option pin settings.
The external memory is used to store mandatory parameters
like the BD_Address as well as many optional parameters like
Link Keys or even User data.
The NVM is organized with fixed addresses for the parame-
ters. Because of that the EEPROM can be preprogrammed
with default parameters in manufacturing. Refer to "Operation
Parameters Stored in LMX9830" for the organization of the
NVS map.
In case the external memory is empty on first startup the
LMX9830 will behave as like no memory is connected. (See
Section 9.6.3 Startup Without External PROM Available).
During the startup process parameters can be written directly
to the EEPROM to be available after next bootup. On first
bootup, the EEPROM will be automatically programmed to
default values, including the UART speed of 9600 BPS.
Patches supplied over the TL will be stored automatically into
the EEPROM.
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LMX9830
10.0 Digital Smart Radio
10.1 FUNCTIONAL DESCRIPTION
The integrated Digital Smart Radio utilizes a heterodyne re-
ceiver architecture with a low intermediate frequency (2 MHz)
such that the intermediate frequency filters can be integrated
on chip. The receiver consists of a low-noise amplifier (LNA)
followed by two mixers. The intermediate frequency signal
processing blocks consist of a poly-phase bandpass filter
(BPF), two hard-limiters (LIM), a frequency discriminator
(DET), and a post-detection filter (PDF). The received signal
level is detected by a received signal strength indicator
(RSSI).
The received frequency equals the local oscillator frequency
(fLO) plus the intermediate frequency (fIF):
fRF = fLO + fIF (supradyne).
The radio includes a synthesizer consisting of a phase de-
tector, a charge pump, an (off-chip) loop-filter, an RF-fre-
quency divider, and a voltage controlled oscillator (VCO).
The transmitter utilizes IQ-modulation with bit-stream data
that is gaussian filtered. Other blocks included in the trans-
mitter are a VCO buffer and a power amplifier (PA).
10.2 RECEIVER FRONT-END
The receiver front-end consists of a low-noise amplifier (LNA)
followed by two mixers and two low-pass filters for the I- and
Q-channels.
The intermediate frequency (IF) part of the receiver front-end
consists of two IF amplifiers that receive input signals from
the mixers, delivering balanced I- and Q-signals to the poly-
phase bandpass filter. The poly-phase bandpass filter is di-
rectly followed by two hard-limiters that together generate an
AD-converted RSSI signal.
10.2.1 Poly-Phase Bandpass Filter
The purpose of the IF bandpass filter is to reject noise and
spurious (mainly adjacent channel) interference that would
otherwise enter the hard limiting stage. In addition, it takes
care of the image rejection.
The bandpass filter uses both the I- and Q-signals from the
mixers. The out-of-band suppression should be higher than
40 dB (f<1 MHz, f>3 MHz). The bandpass filter is tuned over
process spread and temperature variations by the autotuner
circuitry. A 5th order Butterworth filter is used.
10.2.2 Hard-Limiter and RSSI
The I- and Q-outputs of the bandpass filter are each followed
by a hard-limiter. The hard-limiter has its own reference cur-
rent. The RSSI (Received Signal Strength Indicator) mea-
sures the level of the RF input signal.
The RSSI is generated by piece-wise linear approximation of
the level of the RF signal. The RSSI has a mV/dB scale, and
an analog-to-digital converter for processing by the baseband
circuit. The input RF power is converted to a 5-bit value. The
RSSI value is then proportional to the input power (in dBm).
The digital output from the ADC is sampled on the BPKTCTL
signal low-to-high transition.
10.3 RECEIVER BACK-END
The hard-limiters are followed by a two frequency discrimina-
tors. The I-frequency discriminator uses the 90× phase-shift-
ed signal from the Q-path, while the Q-discriminator uses the
90× phase-shifted signal from the I-path. A poly-phase band-
pass filter performs the required phase shifting. The output
signals of the I- and Q-discriminator are substracted and fil-
tered by a low-pass filter. An equalizer is added to improve
the eye-pattern for 101010 patterns.
After equalization, a dynamic AFC (automatic frequency off-
set compensation) circuit and slicer extract the RX_DATA
from the analog data pattern. It is expected that the Eb/No of
the demodulator is approximately 17 dB.
10.3.1 Frequency Discriminator
The frequency discriminator gets its input signals from the
limiter. A defined signal level (independent of the power sup-
ply voltage) is needed to obtain the input signal. Both inputs
of the frequency discriminator have limiting circuits to opti-
mize performance. The bandpass filter in the frequency dis-
criminator is tuned by the autotuning circuitry.
10.3.2 Post-Detection Filter and Equalizer
The output signals of the FM discriminator first go through a
post-detection filter and then through an equalizer. Both the
post-detection filter and equalizer are tuned to the proper fre-
quency by the autotuning circuitry. The post-detection filter is
a low-pass filter intended to suppress all remaining spurious
signals, such as the second harmonic (4 MHz) from the FM
detector and noise generated after the limiter.
The post-detection filter also helps for attenuating the first
adjacent channel signal. The equalizer improves the eye-
opening for 101010 patterns. The post-detection filter is a
third order Butterworth filter.
10.4 AUTOTUNING CIRCUITRY
The autotuning circuitry is used for tuning the bandpass filter,
the detector, the post-detection filter, the equalizer, and the
transmit filters for process and temperature variations. The
circuit also includes an offset compensation for the FM de-
tector.
10.5 SYNTHESIZER
The synthesizer consists of a phase-frequency detector, a
charge pump, a low-pass loop filter, a programmable fre-
quency divider, a voltage-controlled oscillator (VCO), a delta-
sigma modulator, and a lookup table.
The frequency divider consists of a divide-by-2 circuit (divides
the 5 GHz signal from the VCO down to 2.5 GHz), a divide-
by-8-or-9 divider, and a digital modulus control. The delta-
sigma modulator controls the division ratio and also gener-
ates an input channel value to the lookup table.
10.5.1 Phase-Frequency Detector
The phase-frequency detector is a 5-state phase-detector. It
responds only to transitions, hence phase-error is indepen-
dent of input waveform duty cycle or amplitude variations.
Loop lockup occurs when all the negative transitions on the
inputs, F_REF and F_MOD, coincide. Both outputs (i.e., Up
and Down) then remain high. This is equal to the zero error
mode. The phase-frequency detector input frequency range
operates at 12MHz.
10.6 TRANSMITTER CIRCUITRY
The transmitter consists of ROM tables, two Digital to Analog
(DA) converters, two low-pass filters, IQ mixers, and a power
amplifier (PA).
The ROM tables generate a digital IQ signal based on the
transmit data. The output of the ROM tables is inserted into
IQ-DA converters and filtered through two low-pass filters.
The two signal components are mixed up to 2.5 GHz by the
TX mixers and added together before being inserted into the
transmit PA.
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LMX9830
10.6.1 IQ-DA Converters and TX Mixers
The ROM output signals drive an I- and a Q-DA converter.
Two Butterworth low-pass filters filter the DA output signals.
The 6 MHz clock for the DA converters and the logic circuitry
around the ROM tables are derived from the autotuner.
The TX mixers mix the balanced I- and Q-signals up to 2.4-2.5
GHz. The output signals of the I- and Q-mixers are summed.
10.7 CRYSTAL REQUIREMENTS
The LMX9830 contains a crystal driver circuit. This circuit op-
erates with an external crystal and capacitors to form an
oscillator. shows the recommended crystal circuit. Table 21
specifies system clock requirements.
The RF local oscillator and internal digital clocks for the
LMX9830 is derived from the reference clock at the CLK+ in-
put. This reference may either come from an external clock
or a dedicated crystal oscillator. The crystal oscillator con-
nections require an Xtal and two grounded capacitors.
It is also important to consider board and design dependant
capacitance in tuning crystal circuit. Equations that follow al-
low a close approximation of crystal tuning capacitance re-
quired, but actual values on board will vary with capacitive
properties of the board. As a result, there is some fine tuning
of crystal circuit that has to be done that can not be calculated,
must be tuned by testing different values of load capacitance.
Many different crystals can be used with the LMX9830. Key
requirements from Bluetooth specification is + 20ppm. Addi-
tionally, ESR (Equivalent Series Resistance) must be care-
fully considered. LMX9830 can support maximum of 230
ESR, but it is recommended to stay <100 ESR for best per-
formance over voltage and temperature. Reference Figure 9
for ESR as part of crystal circuit for more information.
10.7.1 Crystal
The crystal appears inductive near its resonant frequency. It
forms a resonant circuit with its load capacitors. The resonant
frequency may be trimmed with the crystal load capacitance.
1. Load Capacitance
For resonance at the correct frequency, the crystal
should be loaded with its specified load capacitance,
which is the value of capacitance used in conjunction with
the crystal unit. Load capacitance is a parameter
specified by the crystal, typically expressed in pF. The
crystal circuit shown in Figure 5 is composed of:
C1 (motional capacitance)
R1 (motional resistance)
L1 (motional inductance)
C0 (static or shunt capacitance)
The LMX9830 provides some of the load with internal
capacitors Cint. The remainder must come from the
external capacitors and tuning capacitors labeled Ct1
and Ct2 as shown in Figure 4. Ct1 and Ct2 should have
the same the value for best noise performance.
The LMX9830 has an additional internal capacitance
CTUNE of 2.6pF. Crystal load capacitance (CL) is
calculated as the following:
CL = Cint + CTUNE + Ct1//Ct2
The CL above does not include the crystal internal self-
capacitance C0 as shown in Figure 5, so the total
capacitance is:
Ctotal = CL + C0
Based on crystal spec and equation:
CL = Cint + CTUNE + Ct1//Ct2
CL = 8pF + 2.6pF + 6pF = 16.6pF
16.6pF is very close to the TEW crystal requirement of
16pF load capacitance. With the internal shunt
capacitance Ctotal:
Ctotal = 16.6pF + 5pF = 21.6pF
2. Crystal Pullability
Pullability is another important parameter for a crystal,
which is the change in frequency of a crystal with units of
ppm/pF, either from the natural resonant frequency to a
load resonant frequency, or from one load resonant
frequency to another. The frequency can be pulled in a
parallel resonant circuit by changing the value of load
capacitance. A decrease in load capacitance causes an
increase in frequency, and an increase in load
capacitance causes a decrease in frequency.
3. Frequency Tuning
Frequency Tuning is achieved by adjusting the crystal
load capacitance with external capacitors. It is a
Bluetooth requirement that the frequency is always within
±20 ppm. Crystal/oscillator must have cumulative
accuracy specifications of ±15 ppm to provide margin for
frequency drift with aging and temperature.
TEW Crystal
The LMX9830 has been tested with the TEW TAS-4025A
crystal, reference Table 18 for specification. Since the
internal capacitance of the crystal circuit is 8 pF and the
load capacitance is 16 pF, 12 pF is a good starting point
for both Ct1 and Ct2. The 2480 MHz RF frequency offset
is then tested. Figure 6shows the RF frequency offset
test results.
Figure 6 shows the results are -20 kHz off the center
frequency, which is –1 ppm. The pullability of the crystal
is 2 ppm/pF, so the load capacitance must be decreased
by about 1.0 pF. By changing Ct1 or Ct2 to 10 pF, the
total load capacitance is decreased by 1.0 pF. Figure 7
shows the frequency offset test results. The frequency
offset is now zero with Ct1 = 10 pF, Ct2 = 10 pF.
Reference Table 19 for crystal tuning values used on
Mesa Development Board with TEW crystal.
20180012
FIGURE 4. LMX9830 Crystal Recommended Circuit
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LMX9830
20180013
FIGURE 5. Crystal Equivalent Circuit
TABLE 18. TEW TAS-4025A
Specification Value
Package 4.0x2.5x0.65 mm - 4 pads
Frequency 13.000 MHz
Mode Fundamental
Stability > ±15 ppm @ -40 to +85°C
CL Load Capacitance 16pF
ESR 80 Ω max.
C0 Shunt Capacitance 5pF
Drive Level 50 ±10 µV
Pullability 2 ppm/pF min
Storage Temperature -40 to +85°C
TABLE 19. TEW on LMX9830 DONGLE
Reference LMX9830
Ct1 12 pF
Ct2 12 pF
20180014
FIGURE 6. Frequency Offset with 12 pF//12 pF Capacitors
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LMX9830
20180015
FIGURE 7. Frequency Offset with 10 pF//10 pF Capacitors
10.7.2 TCXO (Temperature Compensated Crystal
Oscillator)
The LMX9830 also can operate with an external TCXO (Tem-
perature Compensated Crystal Oscillator). The TCXO signal
is directly connected to the CLK+.
1. Input Impedance
The LMX9830 CLK+ pin has in input impedance of 2pF
capacitance in parallel with >400kW resistance
10.7.3 Optional 32 kHz Oscillator
A second oscillator is provided (see Figure 8) that is tuned to
provide optimum performance and low-power consumption
while operating with a 32.768 kHz crystal. An external crystal
clock network is required between the X2_CKI clock input and
the X2_CKO clock output signals.The oscillator is built in a
Pierce configuration and uses two external capacitors. Table
20 provides the oscillator’s specifications.
In case the 32kHz is not used, it is recommended to leave
X2_CKO open and connect X2_CKI to GND.
20180016
FIGURE 8. 32.768 kHz Oscillator
TABLE 20. 32.768 kHz Oscillator Specifications
Symbol Parameter Condition Min Typ Max Unit
VDD Supply Voltage 1.62 1.8 1.98 V
IDDACT Supply Current (Active) 2 µA
f Nominal Output Frequency 32.768 kHz
VPPOSC Oscillating Amplitude 1.8 V
Duty Cycle 40 60 %
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LMX9830
10.7.4 ESR (Equivalent Series Resistance)
LMX9830 can operate with a wide range of crystals with dif-
ferent ESR ratings. Reference Table 21 and Figure 9 for more
details.
TABLE 21. System Clock Requirements
Parameter Min Typ Max Unit
External Reference Clock Frequency (Note 39) 10 13 20 MHz
Frequency Tolerance (over full operating temperature and aging) -20 ±15 +20 ppm
Crystal Serial Resistance 230
External Reference Clock Power Swing, pk to pk 100 200 400 mV
Aging ±1 ppm per year
Note 39: Supported frequencies from external oscillator (in MHz): 10.00, 10.368, 12.00, 12.60, 12.80, 13.00, 13.824, 14.40, 15.36, 16.00, 16.20, 16.80, 19.20,
19.68, 19.80
20180017
FIGURE 9. ESR vs. Load Capacitance for the Crystal Circuit
10.8 ANTENNA MATCHING AND FRONT-END FILTERING
Figure 10 shows the recommended component layout to be
used between RF output and antenna input. Allows for ver-
satility in the design such that the match to the antenna maybe
improved and/or the blocking margin increased by addition of
a LC filter. Refer to antenna application note for further details.
20180018
FIGURE 10. Front End Layout
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LMX9830
10.9 LOOP FILTER DESIGN
The LMX9830 has an external loop filter which must be de-
signed for best performance by the end customer. This sec-
tion therefore gives some foresight into its design. Refer also
to Loop Filter application note and National’s Webench on-
line design tool for more information.
10.9.1 Component Calculations
The following parameters are required for component value calculation of a third order passive loop filter.
ΦPhase Margin: Phase of the open loop transfer function
FcLoop Bandwidth
Fcomp Comparison Frequency: Phase detector frequency
KVOC VCO gain: Sensitivity of the VCO to control volts
KΦCharge Pump gain: Magnitude of the alternating current during lock
FOUT Maximum RF output frequency
T31 Ratio of the poles T3 to T1 in a 3rd order filter
γGamma optimization parameter
The third order loop filter being defined has the following topology. shown in Figure 11.
20180019
FIGURE 11. Third Order Loop Filter
20180041
Calculate the poles and zeros. Use exact method to solve for T1 using numerical methods,
20180042
20180043
Calculate the loop filter coefficients,
20180044
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LMX9830
Summary:
Symbol Description Units
n N counter value None
Loop Bandwidth rad/s
T1 Loop filter pole S
T2 Loop filter zero S
T3 Loop filter zero S
A0 Total capacitance nF
A1 First order loop filter coefficient nFs
A2 Second order loop filter coefficient nFs2
Components can then be calculated from loop filter coefficients
20180045
20180046
20180047
Some typical values for the LMX9830 are:
Comparison Frequency 13 MHz
Phase Margin 48 Pl rad
Loop bandwidth 100 kHz
T3 over T1 ratio 40 %
Gamma 1.0
VCO gain 120 MHz per V
Charge pump gain 0.6 mA
Fout 2441 MHz
Which give the following component values:
C1 0.17 nF
C2 2.38 nF
C3 0.04 nF
R2 1737
R3 7025
10.9.2 Phase Noise and Lock-Time Calculations
Phase noise has three sources, the VCO, crystal oscillator
and the rest of the PLL consisting of the phase detector, di-
viders, charge pump and loop filter. Assuming the VCO and
crystal are very low noise, it is possible to put down approxi-
mate equations that govern the phase noise of the PLL.
Phase noise (in-band) = PN1Hz + 20Log[N] + 10Log[Fcomp]
Where PH1Hz is the PLL normalized noise floor in 1 Hz res-
olution bandwidth.
Further out from the carrier, the phase noise will be affected
by the loop filter roll-off and hence its bandwidth.
As a rule-of-thumb; ΔPhase noise = 40Log[ΔFc]
Where Fc is the relative change in loop BW expressed as a
fraction.
For example if the loop bandwidth is reduced from 100 kHz
to 50 kHz or by one half, then the change in phase noise will
be -12dB. Loop BW in reality should be selected to meet the
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LMX9830
lower limit of the modulation deviation, this will yield the best
possible phase noise.
Even further out from the carrier, the phase noise will be
mainly dominated by the VCO noise assuming the crystal is
relatively clean.
Lock-time is dependent on three factors, the loop bandwidth,
the maximum frequency jump that the PLL must make and
the final tolerance to which the frequency must settle. As a
rule-of-thumb it is given by:
20180048
These equations are approximations of the ones used by
Webench to calculate phase noise and lock-time.
10.9.3 Practical Optimization
In an example where frequency drift and drift rate can be im-
proved though loop filter tweaks, consider the results taken
below. The drift rate is 26.1 kHz per 50μs and the maximum
drift is 25 kHz for DH1 packets, both of which are exceeding
or touching the Bluetooth pass limits. These measurements
are taken with component values shown above.
TRM/CA/09/C (Carrier Drift
Hoppong On- Low Channel
DH1 DH3 DH5 Limits
Drift Rate/50 μs26.1 kHz N/A −30.5 kHz ±20 kHz
Max Drift 25 kHz N/A 36 kHz DHI: ±25 kHz
Average Drift −1 kHz N/A 12 kHz DH3: ±40 kHz
Packets Tested 10 N/A 10 D5I: ±40 kHz
Packets Failed 2 N/A 10
Overall Result Failed N/A Failed
Results below were taken on the same board with three loop
filter values changed. C2 and R2 have been increased in val-
ue and C1 has been reduced. The drift rate has improved by
13 kHz per 50 µs and the maximum drift has improved by 10
kHz.
TRM/CA/09/C (Carrier Drift
Hoppong On- Low Channel
DH1 DH3 DH5 Limits
Drift Rate/50 μs−13.6 kHz N/A −15.6 kHz ±20 kHz
Max Drift 15 kHz N/A 21 kHz DHI: ±25 kHz
Average Drift 3 kHz N/A 1 kHz DH3: ±40 kHz
Packets Tested 10 N/A 10 D5I: ±40 kHz
Packets Failed 0 N/A 0
Overall Result Passed N/A Passed
The effect of changing these three components is to reduce
the loop bandwidth which reduces the phase noise. The re-
duction in this noise level corresponds directly to the reduction
of noise in the payload area where drift is measured. This
noise reduction comes at the expense of lock-time which can
be increased to 120 µs without suffering any ill effects, how-
ever if we continue to reduce the loop BW further the lock-
time will increase such that the PLL does not have time to lock
before data transmission and the drift will again increase. Be-
fore the lock-time goes out of spec, the modulation index will
start to fall since it is being cut by the reducing loop BW.
Therefore a compromise has to be found between lock-time,
phase noise and modulation, which yields best performance.
Note: The values shown in the LMX9830 datasheet, are the best case op-
timized values that have been shown to produce the best overall
results and are recommended as a starting point for this design.
Another example of how the loop filter values can affect fre-
quency drift rate, these results below show the DUT with
maximum drift on mid and high channels failing. Adjusting the
loop bandwidth as shown provides the improvement required
to pass qualification.
25 www.national.com
LMX9830
Original results:
Hoppong On- Low Channel
DH1 DH3 DH5 Limits
Drift Rate/50 μs15.00 15.00 kHz −28.10 kHz −19.10 kHz ±20 kHz
Maximum Drift 19 kHz −37 kHz −20kHz DHI: ±25 kHz
Average Drift 11 kHz −32 kHz −10 kHz DH3: ±40 kHz
Packets Tested 10 10 10 D5I: ±40 kHz
Packets Failed 0 1 0
Result Pass Fail Pass
Hoppong On- Med Channel
DH1 DH3 DH5 Limits
Drift Rate/50 μs15.00 kHz −28.10 kHz −19.10 kHz ±20 kHz
Max Drift 19 kHz −37 kHz −20kHz DHI: ±25 kHz
Average Drift 11 kHz −32 kHz −10 kHz DH3: ±40 kHz
Packets Tested 10 10 10 D5I: ±40 kHz
Packets Failed 0 1 0
Overall Result Pass Fail Pass
Hoppong On- High Channel
DH1 DH3 DH5 Limits
Drift Rate/50 μs15.00 kHz −28.10 kHz −19.10 kHz ±20 kHz
Max Drift 19 kHz −37 kHz −20kHz DHI: ±25 kHz
Average Drift 11 kHz −32 kHz −10 kHz DH3: ±40 kHz
Packets Tested 10 10 10 D5I: ±40 kHz
Packets Failed 0 1 0
Overall Result Pass Fail Pass
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LMX9830
New results:
Hoppong On- Low Channel
DH1 DH3 DH5 Limits
Drift Rate/50 μs−12.00 kHz −15.10 kHz 18.8 kHz ±20 kHz
Max Drift −15 kHz −35 kHz −19 kHz DHI: ±25 kHz
Average Drift −6 kHz −25 kHz −9 kHz DH3: ±40 kHz
Packets Tested 10 10 10 D5I: ±40 kHz
Packets Failed 0 0 0
Overall Result Pass Pass Pass
Hoppong On- Med Channel
DH1 DH3 DH5 Limits
Drift Rate/50 μs−14.20 kHz −16.10kHz 17.20 kHz ±20 kHz
Max Drift −16 kHz −354 kHz −22 kHz DHI: ±25 kHz
Average Drift −11kHz −27 kHz −9 kHz DH3: ±40 kHz
Packets Tested 10 10 10 D5I: ±40 kHz
Packets Failed 0 0 0
Overall Result Pass Pass Pass
Hoppong On- High Channel
DH1 DH3 DH5 Limits
Drift Rate/50 μs−12.70 kHz −17.40 kHz 16.50 kHz ±20 kHz
Max Drift −23 kHz −29 kHz −25 kHz DHI: ±25 kHz
Average Drift −12 kHz −25 kHz −16 kHz DH3: ±40 kHz
Packets Tested 10 10 10 D5I: ±40 kHz
Packets Failed 0 0 0
Overall Result Pass Pass Pass
10.9.4 Component Values for NSC Reference Designs
The following is a list of components for the loop filter values
used on National reference design, (Serial Dongle) they have
been tweaked and optimized in each case to yield optimum
performance for each case. The values differ slightly from one
platform to another due to board paracitics caused by layout
differences.
Platform C8 C7 C9 R23 R14
LMX9830 Dongle 220pF 2200pF 39pF 3.3k 10k
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LMX9830
11.0 Integrated Firmware
The LMX9830 includes the full Bluetooth stack up to RF-
Comm to support the following profiles:
GAP (Generic Access Profile)
SDAP (Service Discovery Application Profile)
SPP (Serial Port Profile)
Figure 12 shows the Bluetooth protocol stack with command
interpreter interface. The command interpreter offers a num-
ber of different commands to support the functionality given
by the different profiles. Execution and interface timing is han-
dled by the control application.
The chip has an internal data area in RAM that includes the
parameters shown in Table 22.
20180020
FIGURE 12. LMX9830 Software Implementation
11.1 FEATURES
11.1.1 Operation Modes
On boot-up, the application configures the module following
the parameters in the data area.
Automatic Operation
No Default Connections Stored:
In Automatic Operation the module is connectable and dis-
coverable and automatically answers to service requests.
The command interpreter listens to commands and links can
be set up. The full command list is supported.
If connected by another device, the module sends an event
back to the host, where the RFComm port has been connect-
ed, and switches to transparent mode.
Default Connections Stored:
If default connections were stored on a previous session,
once the LMX9830 is reset, it will attempt to connect each
device stored within the data RAM three times. The host will
be notified about the success of the link setup via a link status
event.
Non-Automatic Operation
In Non-Automatic Operation, the LMX9830 does not check
the default connections section within the Data RAM. If con-
nected by another device, it will NOT switch to transparent
mode and continue to interpret data sent on the UART.
Transparent Mode
The LMX9830 supports transparent data communication from
the UART interface to a bluetooth link.
If activated, the module does not interpret the commands on
the UART which normally are used to configure and control
the module. The packages don’t need to be formatted as de-
scribed in Table 24. Instead all data are directly passed
through the firmware to the active bluetooth link and the re-
mote device.
Transparent mode can only be supported on a point-to-point
connection. To leave Transparent mode, the host must send
a UART_BREAK signal to the module.
Force Master Mode
In Force Master mode tries to act like an Accesspoint for mul-
tiple connections. For this it will only accept the link if a Master/
slave role switch is accepted by the connecting device. After
successful link establishment the LMX9830 will be Master
and available for additional incoming links. On the first incom-
ing link the LMX9830 will switch to transparent depending on
the setting for automatic or command mode. Additional links
will only be possible if the device is not in transparent mode.
11.1.2 Default Connections
The LMX9830 supports the storage of up to 3 devices within
its NVS. Those connections can either be connected after re-
set or on demand using a specific command.
11.1.3 Event Filter
The LMX9830 uses events or indicators to notify the host
about successful commands or changes at the bluetooth in-
terface. Depending on the application the LMX9830 can be
configured. The following levels are defined:
No Events:
– The LMX9830 is not reporting any events. Optimized for
passive cable replacement solutions.
Standard LMX9830 events:
– Only necessary events will be reported
All events:
– Additional to the standard all changes at the physical
layer will be reported.
11.1.4 Default Link Policy
Each Bluetooth Link can be configured to support M/S role
switch, Hold Mode, Sniff Mode and Park Mode. The default
link policy defines the standard setting for incoming and out-
going connections.
11.1.5 Audio Support
The LMX9830 offers commands to establish and release syn-
chronous connections (SCO) to support Headset or Hands-
free applications. The firmware supports one active link with
all available package types (HV1, HV2, HV3), routing the au-
dio data between the bluetooth link and the advanced audio
interface. In order to provide the analog data interface, an ex-
ternal audio codec is required. The LMX9830 includes a list
of codecs which can be used.
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LMX9830
TABLE 22. Operation Parameters Stored in LMX9830
Parameter Default Value Description
BDADDR (To be requested from IEEE) Bluetooth device address
Local Name Serial port device Friendly Name
PinCode 0000 Bluetooth PinCode
Operation Mode Automatic ON Automatic mode ON or OFF
Default Connections 0 Up to seven default devices to connect to
SDP Database 1 SPP entry:
Name: COM1
Authentication and encryption enabled
Service discovery database, control for supported profiles
UART Speed 9600 Sets the speed of the physical UART interface to the host
UART Settings 1 Stop bit, parity disabled Parity and stop bits on the hardware UART interface
Ports to Open 0000 0001 Defines the RFComm ports to open
Link Keys No link keys Link keys for paired devices
Security Mode 2 Security mode
Page Scan Mode Connectable Connectable/Not connectable for other devices
Inquiry Scan Mode Discoverable Discoverable/Not Discoverable/Limited Discoverable for other
devices
Default Link Policy All modes allowed Configures modes allowed for incoming or outgoing connections
(Role switch, Hold mode, Sniff mode...)
Default Link Timeout 20 seconds The Default Link Timeout configures the timeout, after which the
link is assumed lost, if no packages have been received from the
remote device.
Event Filter Standard LMX9830 events reported Defines the level of reporting on the UART
― no events
― standard events
― standard including ACL link events
Default Audio Settings non Configures the settings for the external codec and the air format.
• Codecs:
Motorola MC145483 / Winbond W681360
OKI MSM7717 / Winbond W681310
PCM Slave
• Airformat:
CVSD
µ-Law
A-Law
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LMX9830
12.0 Low Power Modes
The LMX9830 supports different Low Power Modes to reduce
power in different operating situations. The modular structure
of the LMX9830 allows the firmware to power down unused
modules.
The Low power modes have influence on:
UART transport layer
– enabling or disabling the interface
Bluetooth Baseband activity
– firmware disables LLC and Radio if possible
12.1 POWER MODES
The following LMX9830 power modes, which depend on the
activity level of the UART transport layer and the radio activity
are defined:
The radio activity level mainly depends on application re-
quirements and is defined by standard bluetooth operations
like inquiry/page scanning or an active link.
A remote device establishing or disconnecting a link may also
indirectly change the radio activity level.
The UART transport layer by default is enabled on device
power up. In order to disable the transport layer the command
“Disable Transport Layer” is used. Thus only the Host side
command interface can disable the transport layer. Enabling
the transport layer is controlled by the HW Wakeup signalling.
This can be done from either the Host or the LMX9830. See
also “LMX9830 Software User’s Guide” for detailed informa-
tion on timing and implementation requirements.
TABLE 23. Power Mode Activity
Power
Mode
UART
Activity
Radio
Activity
Reference
Clock
PM0 OFF OFF none
PM1 ON OFF Main Clock
PM2 OFF Scanning Main Clock / 32.768 kHz
PM3 ON Scanning Main Clock
PM4 OFF SPP Link Main Clock
PM5 ON SPP Link Main Clock
20180021
FIGURE 13. Transition between different Hardware Power Modes
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LMX9830
12.2 ENABLING AND DISABLING UART TRANSPORT
12.2.1 Hardware Wake up functionality
In certain usage scenarios the host is able to switch off the
transport layer of the LMX9830 in order to reduce power con-
sumption. Afterwards both devices, host and LMX9830 are
able to shut down their UART interfaces.
In order to save system connections the UART interface is
reconfigured to hardware wakeup functionality. For a detailed
timing and command functionality please see also the
“LMX9830 Software User’s Guide”.
The interface between host and LMX9830 is defined as de-
scribed in Figure 14.
20180022
FIGURE 14. UART NULL Modem Connection
12.2.2 Disabling the UART Transport Layer
The Host can disable the UART transport layer by sending
the “Disable Transport Layer” Command. The LMX9830 will
empty its buffers, send the confirmation event and disable its
UART interface. Afterwards the UART interface will be re-
configured to wake up on a falling edge of the CTS pin.
12.2.3 LMX9830 Enabling the UART Interface
As the Transport Layer can be disabled in any situation the
LMX9830 must first make sure the transport layer is enabled
before sending data to the host. Possible scenarios can be
incoming data or incoming link indicators. If the UART is not
enabled the LMX9830 assumes that the Host is sleeping and
waking it up by activating RTS. To be able to react on that
Wake up, the host has to monitor the CTS pin.
As soon as the host activates its RTS pin, the LMX9830 will
first send a confirmation event and then start to transmit the
events.
12.2.4 Enabling the UART Transport Layer from the Host
If the host needs to send data or commands to the LMX9830
while the UART Transport Layer is disabled it must first as-
sume that the LMX9830 is sleeping and wake it up using its
RTS signal.
When the LMX9830 detects the Wake-Up signal it activates
the UART HW and acknowledges the Wake-Up signal by set-
tings its RTS. Additionally the Wake up will be confirmed by
a confirmation event. When the Host has received this “Trans-
port Layer Enabled” event, the LMX9830 is ready to receive
commands.
13.0 Command Interface
The LMX9830 offers Bluetooth functionality in either a self
contained slave functionality or over a simple command in-
terface. The interface is listening on the UART interface.
The following sections describe the protocol transported on
the UART interface between the LMX9830 and the host in
command mode (see Figure 15). In Transparent mode, no
data framing is necessary and the device does not listen for
commands.
13.1 FRAMING
The connection is considered “Error free”. But for packet
recognition and synchronization, some framing is used.
All packets sent in both directions are constructed per the
model shown in Table 24.
13.1.1 Start and End Delimiter
The “STX” char is used as start delimiter: STX = 0x02. ETX =
0x03 is used as end delimiter.
13.1.2 Packet Type ID
This byte identifies the type of packet. See Table 25 for de-
tails.
13.1.3 Opcode
The opcode identifies the command to execute. The opcode
values can be found within the “LMX9830 Software User’s
Guide” included within the LMX9830 Evaluation Board.
13.1.4 Data Length
Number of bytes in the Packet Data field. The maximum size
is defined with 333 data bytes per packet.
13.1.5 Checksum:
This is a simple Block Check Character (BCC) checksum of
the bytes “Packet type”, “Opcode” and “Data Length”. The
BCC checksum is calculated as low byte of the sum of all
bytes (e.g., if the sum of all bytes is 0x3724, the checksum is
0x24).
20180023
FIGURE 15. Bluetooth Functionality
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LMX9830
TABLE 24. Package Framing
StartD
elimiter
Packet
Type ID Opcode Data
Length
Check
sum
Packet
Data
End
Delimiter
1 Byte 1 Byte 1 Byte 2 Bytes 1 Byte <Data Length>
Bytes
1 Byte
- - - - - - - - - - - - - Checksum - - - - - - - - - - - - -
TABLE 25. Packet Type Identification
ID Direction Description
0x52
'R'
REQUEST
(REQ)
A request sent to the Bluetooth module.
All requests are answered by exactly one confirm.
0x43
'C'
Confirm
(CFM)
The Bluetooth modules confirm to a request.
All requests are answered by exactly one confirm.
0x69
'i'
Indication
(IND)
Information sent from the Bluetooth module that is not a direct confirm to a request.
Indicating status changes, incoming links, or unrequested events.
0x72
'r'
Response
(RES)
An optional response to an indication.
This is used to respond to some type of indication message.
13.2 COMMAND SET OVERVIEW
The LMX9830 has a well defined command set to:
Configure the device:
Hardware settings
Local Bluetooth parameters
Service database
Set up and handle links
Table 26 through Table 36 show the actual command set and
the events coming back from the device. A full documented
description of the commands can be found in the “LMX9830
Software User’s Guide”.
Note: For standard Bluetooth operation only commands from Table 26
through Table 28 will be used. Most of the remaining commands are
for configuration purposes only.
TABLE 26. Device Discovery
Command Event Description
Inquiry Inquiry Complete Search for devices
Device Found Lists BDADDR and class of device
Remote Device Name Remote Device Name Confirm Get name of remote device
TABLE 27. SDAP Client Commands
Command Event Description
SDAP Connect SDAP Connect Confirm Create an SDP connection to remote device
SDAP Disconnect SDAP Disconnect Confirm Disconnect an active SDAP link
Connection Lost Notification for lost SDAP link
SDAP Service Browse Service Browse Confirm Get the services of the remote device
SDAP Service Search SDAP Service Search Confirm Search a specific service on a remote device
SDAP Attribute Request SDAP Attribute Request Confirm Searches for services with specific attributes
TABLE 28. SPP Link Establishment
Command Event Description
Establish SPP Link Establishing SPP Link Confirm Initiates link establishment to a remote device
Link Established Link successfully established
Incoming Link A remote device established a link to the local device
Set Link Timeout Set Link Timeout Confirm Confirms the Supervision Timeout for the existing Link
Get Link Timeout Get Link Timeout Confirm Get the Supervision Timeout for the existing Link
Release SPP Link Release SPP Link Confirm Initiate release of SPP link
SPP Send Data SPP Send Data Confirm Send data to specific SPP port
Incoming Data Incoming data from remote device
Transparent Mode Transparent Mode Confirm Switch to Transparent mode on the UART
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LMX9830
TABLE 29. Storing Default Connections
Command Event Description
Connect Default Connection Connect Default Connection Confirm Connects to either one or all stored default connections
Store Default Connection Store Default Connection Confirm Store device as default connection
Get list of Default Connections List of Default Devices
Delete Default Connections Delete Default Connections Confirm
TABLE 30. Bluetooth Low Power Modes
Command Event Description
Set Default Link Policy Set Default Link Policy Confirm Defines the link policy used for any incoming or outgoing
link
Get Default Link Policy Get Default Link Policy Confirm Returns the stored default link policy
Set Link Policy Set Link Policy Confirm Defines the modes allowed for a specific link
Get Link Policy Get Link Policy Confirm Returns the actual link policy for the link
Enter Sniff Mode Enter Sniff Mode Confirm
Exit Sniff Mode Exit Sniff Mode Confirm
Enter Hold Mode Enter Hold Mode Confirm
Power Save Mode Changed Remote device changed power save mode on the link
TABLE 31. Audio Control Commands
Command Event Description
Establish SCO Link Establish SCO Link Confirm Establish SCO Link on existing RFComm Link
SCO Link Established Indicator A remote device has established a SCO link to the local
device
Release SCO Link Release SCO Link Confirm Release SCO Link Audio Control
SCO Link Released Indicator SCO Link has been released
Change SCO Packet Type Change SCO Packet Type Confirm Changes Packet Type for existing SCO link
SCO Packet Type changed indicator SCO Packet Type has been changed
Set Audio Settings Set Audio Settings Confirm Set Audio Settings for existing Link
Get Audio Settings Get Audio Settings Confirm Get Audio Settings for existing Link
Set Volume Set Volume Confirm Configure the volume
Get Volume Get Volume Confirm Get current volume setting
Mute Mute Confirm Mutes the microphone input
TABLE 32. Wake Up Functionality
Command Event Description
Disable Transport Layer Transport Layer Enabled Disabling the UART Transport Layer and
activates the Hardware Wakeup function
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LMX9830
TABLE 33. SPP Port Configuration and Status
Command Event Description
Set Port Config Set Port Config Confirm Set port setting for the virtual serial port link over the air
Get Port Config Get Port Config Confirm Read the actual port settings for a virtual serial port
Port Config Changed Notification if port settings were changed from remote
device
SPP Get Port Status SPP Get Port Status Confirm Returns status of DTR, RTS (for the active RFComm link)
SPP Port Set DTR SPP Port Set DTR Confirm Sets the DTR bit on the specified link
SPP Port Set RTS SPP Port Set RTS Confirm Sets the RTS bit on the specified link
SPP Port BREAK SPP Port BREAK Indicates that the host has detected a break
SPP Port Overrun Error SPP Port Overrun Error Confirm Used to indicate that the host has detected an overrun error
SPP Port Parity Error SPP Port Parity Error Confirm Host has detected a parity error
SPP Port Framing Error SPP Port Framing Error Confirm Host has detected a framing error
SPP Port Status Changed Indicates that remote device has changed one of the port
status bits
TABLE 34. Local Bluetooth Settings
Command Event Description
Read Local Name Read Local Name Confirm Read actual friendly name of the device
Write Local Name Write Local Name Confirm Set the friendly name of the device
Read Local BDADDR Read Local BDADDR Confirm
Change Local BDADDR Change Local BDADDR Confirm Note: The BDADDR has to be obtained from the IEEE
organization. See http://standarts.ieee.org/regauth/oui/
Store Class of Device Store Class of Device Confirm
Set Scan Mode Set Scan Mode Confirm Change mode for discoverability and connectability
Set Scan Mode Indication Reports end of Automatic limited discoverable mode
Get Fixed Pin Get Fixed Pin Confirm Reads current PinCode stored within the device
Set Fixed Pin Set Fixed Pin Confirm Set the local PinCode
PIN request A PIN code is requested during authentication of an ACL
link
Get Security Mode Get Security Mode Confirm Get actual Security mode
Set Security Mode Set Security Mode Confirm Configure Security mode for local device (default 2)
Remove Pairing Remove Pairing Confirm Remove pairing with a remote device
List Paired Devices List of Paired Devices Get list of paired devices stored in the LMX9830 data
memory
Set Default Link Timeout Set Default Link Timeout Confirm Store default link supervision timeout
Get Default Link Timeout Get Default Link Timeout Confirm Get stored default link supervision timeout
Force Master Role Force Master Role Confirm Enables/Disables the request for master role at incoming
connections
TABLE 35. Local Service Database Configuration
Command Event Description
Store generic SDP Record Store SDP Record Confirm Create a new service record within the service database
Enable SDP Record Enable SDP Record Confirm Enable or disable SDP records
Delete All SDP Records Delete All SDP Records Confirm
Ports to Open Ports to Open Confirmed Specify the RFComm Ports to open on startup
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LMX9830
TABLE 36. Local Hardware Commends
Command Event Description
Get Default Audio Settings Get Default Audio Settings Confirm Get stored Default Audio Settings
Set Default Audio Settings Set Default Audio Settings Confirm Configure Default Settings for Audio Codec and Air Format,
stored in NVS
Set Event Filter Set Event Filter Confirm Configures the reporting level of the command interface
Get Event Filter Get Event Filter Confirm Get the status of the reporting level
Read RSSI Read RSSI Confirm Returns an indicator for the incoming signal strength
Change UART Speed Change UART Speed Confirm Set specific UART speed; needs proper ISEL pin setting
Change UART Settings Change UART Settings Confirm Change configuration for parity and stop bits
Test Mode Test Mode Confirm Enable Bluetooth, EMI test, or local loopback
Restore Factory Settings Restore Factory Settings Confirm
Reset Dongle Ready Soft reset
Firmware Upgrade Stops the bluetooth firmware and executes the In-system-
programming code
Set Clock Frequency Set Clock Frequency Confirm Write Clock Frequency setting in the NVS
Get Clock Frequency Get Clock Frequency Confirm Read Clock Frequency setting from the NVS
Set PCM Slave Configuration Set PCM Slave Configuration
Confirm
Write the PCM Slave Configuration in the NVS
Write ROM Patch Write ROM Patch Confirm Store ROM Patch in the SimplyBlue module
Read Memory Read Memory Confirm Read from the internal RAM
Write Memory Write Memory Confirm Write to the internal RAM
Read NVS Read NVS Confirm Read from the NVS (EEPROM)
Write NVS Write NVS Confirm Write to the NVS (EEPROM)
TABLE 37. Initialization Commands
Command Event Description
Set Clock and Baudrate Set Clock and Baudrate Confirm Write Baseband frequency and Baudrate used
Enter Bluetooth Mode Enter Bluetooth Mode Confirm Request SimplyBlue module to enter BT mode
Set Clock and Baudrate Set Clock and Baudrate Confirm Write Baseband frequency and Baudrate used
TABLE 38. GPIO Control commands
Command Event Description
Set GPIO WPU Set GPIO WPU Confirm Enable/Disable weak pull up resistor on GPIOs
Get GPIO Input State Get GPIO Input States Confirm Read the status of the GPIOs
Set GPIO Direction Set GPIO Direction Confirm Set the GPIOs direction (Input, Ouput)
Set GPIO Output High Set GPIO Output High Confirm Set GPIOs Output to logical High
Set GPIO Output Low Set GPIO Output Low Confirm Set GPIOs Output to logical Low
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LMX9830
14.0 Usage Scenarios
14.1 SCENARIO 1: POINT-TO-POINT CONNECTION
LMX9830 acts only as slave, no further configuration is re-
quired.
Example: Sensor with LMX9830; hand-held device with stan-
dard Bluetooth option.
The SPP conformance of the LMX9830 allows any device
using the SPP to connect to the LMX9830.
Because of switching to Transparent automatically, the con-
troller has no need for an additional protocol layer; data is sent
raw to the other Bluetooth device.
On default, a PinCode is requested to block unallowed tar-
geting.
20180024
FIGURE 16. Point-to-Point Connection
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LMX9830
14.2 SCENARIO 2: AUTOMATIC POINT-TO-POINT
CONNECTION
LMX9830 at both sides.
Example: Serial Cable Replacement.
Device #1 controls the link setup with a few commands as
described.
If step 5 is executed, the stored default device is connected
(step 4) after reset (in Automatic mode only) or by sending the
command “Connect to Default Device”. The command can be
sent to the device at any time.
If step 6 is left out, the microcontroller has to use the com-
mand “Send Data” instead of sending data directly to the
module.
20180025
FIGURE 17. Automatic Point-to-Point Connection
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LMX9830
14.3 SCENARIO 3: POINT-TO-MULTIPOINT
CONNECTION
LMX9830 acts as master for several slaves.
Example: Two sensors with LMX9830; one hand-held device
with implemented LMX9830.
Serial Devices #2 and #3 establish the link automatically as
soon as they are contacted by another device. No controller
interaction is necessary for setting up the Bluetooth link. Both
switch automatically into Transparent mode. The host sends
raw data over the UART.
Serial Device #1 is acting as master for both devices. As the
host has to decide to or from which device data is coming
from, data must be sent using the “Send data command”. If
the device receives data from the other devices, it is packaged
into an event called “Incoming data event”. The event includes
the device related port number.
If necessary, a link configuration can be stored as default in
the master Serial Device #1 to enable the automatic recon-
nect after reset, power-up, or by sending the “connect default
connection” command.
20180026
FIGURE 18. Automatic Point-to-Point Connection
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LMX9830
15.0 Application Information
Figure 19 represents a typical system functional schematic
for the LMX9830 in its normal 3.0V or 3.3V system interface
operation.
In Figure 20 represents a typical system functional schematic
for the LMX9830 in its 1.8V system interface operation.
15.1 ANTENNA MATCHING NETWORK
The antenna matching network may or may not be required,
depending upon the impedance of the antenna chosen and
the trace impedance on the PCB. A 6.8 pF blocking capacitor
is recommended.
Note: Additional L network placement is recommended for tuning the trace
impedance if needed.
15.2 FILTERED POWER SUPPLY
It is important to provide the LMX9830 with adequate ground
planes and a filtered power supply. It is highly recommended
that a 0.1 µF and a 10 pF bypass capacitor be placed as close
as possible to VCC (pin E1) on the LMX9830 for 2.5V and 3.3V
operations.
Note: For 1.8V operations VCC filtering is not required and VCC should be
tied directly to ground.
15.3 HOST INTERFACE
To set the logic thresholds of the LMX9830 to match the host
system, IOVCC (pin C4) must be connected to the logic power
supply of the host system. It is highly recommended that a 10
pF bypass capacitor be placed as close as possible to the
IOVCC pad on the LMX9830.
15.4 FREQUENCY AND BAUD RATE SELECTIONS
OP3, OP4, OP5 can be strapped to the host logic 0 and 1
levels to set the host interface boot-up configuration. Alterna-
tively all OP3, OP4, OP5 can be hardwired over 1kW pullup/
pulldown resistors. See Table 18.
15.5 START UP SEQUENCE OPTIONS
OP6, OP7, and Env1 can be left unconnected (both OP6 and
OP7 are pulled low and ENV1 is pulled high internally), These
can be hardwired over 1kW pullup/pulldown resistors. See
Table 17.
15.6 CLOCK INPUT
The clock source must be placed as close as possible to the
LMX9830. The quality of the radio performance is directly re-
lated to the quality of the clock source connected to the
oscillator port on the LMX9830. Careful attention must be paid
to the crystal/oscillator parameters or radio performance
could be drastically reduced.
15.7 SCHEMATIC AND LAYOUT EXAMPLES
See Figure 19, Figure 20, and full schematic in Section 16.0
Reference Design.
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LMX9830
20180032
Note 40: Capacitor values, Ct1 and Ct2 may vary depending on board design crystal manufacturer specification.
Note: (CL = crystal capacitance load rating) of 12pF or greater rating is required from the crystal vendor of choice to best match module impedance and give a
viable tuning range for the system.
For grounding a single ground plane is used for both RF and Digital Grounding.
For Antenna it is recommend that a 3 component L type pad with series 6.8pF blocker cap be used between RF output and antenna matching L network. This
allows for versatility in the design such that the match to the antenna maybe improved and/or the blocking margin increased by use a LC filter.
FIGURE 19. 2.5V to 3.3V Example Functional System Schematic
www.national.com 40
LMX9830
20180031
Note 41: Capacitor values, Ct1 and Ct2 may vary depending on board design crystal manufacturer specification.
Note: (CL = crystal capacitance load rating) of 12pF or greater rating is required from the crystal vendor of choice to best match module impedance and give a
viable tuning range for the system.
For grounding a single ground plane is used for both RF and Digital Grounding.
For Antanna it is recommend that a 3 component L type pad with series 6.8pF blocker cap be used between RF output and antenna matching L network as shown
above. This allows for versatility in the design such that the match to the antenna maybe improved and/or the blocking margin increased by use a LC filter.
FIGURE 20. 1.8V Example Functional System Schematic
41 www.national.com
LMX9830
16.0 Reference Design
20180029
Note: For a schematic including an RS232 communication with the host,
please refer to the “LMX9830DONGLE designer guide”.
Recommended that a 4 component T-PI pad be used be-
tween RF out and antenna input. Allows for versatility in the
design such that the match to the antenna maybe improved
and/or blocking margin increased by adding a LC filter.
www.national.com 42
LMX9830
17.0 Soldering
The LMX9830 bumps are designed to melt as part of the Sur-
face Mount Assembly (SMA) process. In order to ensure
reflow of all solder bumps and maximum solder joint reliability
while minimizing damage to the package, recommended re-
flow profiles should be used.
Table 39, Table 40 and Figure 21provide the soldering details
required to properly solder the LMX9830 to standard PCBs.
The illustration serves only as a guide and National is not li-
able if a selected profile does not work.
See IPC/JEDEC J-STD-020C, July 2004 for more informa-
tion.
TABLE 39. Soldering Details
Parameter Value
PCB Land Pad Diameter 13 mil
PCB Solder Mask Opening 19 mil
PCB Finish (HASL details) Defined by customer or manufacturing facility
Stencil Aperture 17 mil
Stencil Thickness 5 mil
Solder Paste Used Defined by customer or manufacturing facility
Flux Cleaning Process Defined by customer or manufacturing facility
Reflow Profiles See Figure 21
TABLE 40. Classification Reflow Profiles (Note 42), (Note 43)
Profile Feature NOPB Assembly
Average Ramp-Up Rate (TsMAX to Tp) 3°C/second maximum
Preheat:
Temperature Min (TsMIN)
Temperature Max (TsMAX)
Time (tsMIN to tsMAX)
150°C
200°C
60180 seconds
Time maintained above:
Temperature (TL)
Time (tL)
217°C
60150 seconds
Peak/Classification Temperature (Tp) 260 + 0°C
Time within 5°C of actual Peak Temperature (tp) 20 – 40 seconds
Ramp-Down Rate 6°C/second maximum
Time 25 °C to Peak Temperature 8 minutes maximum
Reflow Profiles See Figure 21
Note 42: See IPC/JEDEC J-STD-020C, July 2004.
Note 43: All temperatures refer to the top side of the package, measured on the package body surface.
20180027
FIGURE 21. Typical Reflow Profiles
43 www.national.com
LMX9830
www.national.com 44
LMX9830
18.0 Physical Dimensions inches (millimeters) unless otherwise noted
FBGA, Plastic, Laminate, 9x6x1.2mm, 60 Ball, 0.8mm Pitch Package
NS Package Number SLF60A
45 www.national.com
LMX9830
Notes
LMX9830 Bluetooth Serial Port Module
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