KADS-8072ZG10Z4S - KINGBRIGHT - Datasheet.Directory

SPEC NO: DSAM0386 REV NO: V.7B DATE: APR/30/2014 PAGE: 1 OF 8

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201200401

ATTENTION

OBSERVE PRECAUTIONS

FOR HANDLING

ELECTROSTATIC

DISCHARGE

SENSITIVE

DEVICES

Package Dimensions

Application Notes

Electrostatic discharge and power surge could damage

the LEDs.

It is recommended to use a wrist band or anti-

electrostatic glove when handling the LEDs.

All devices, equipments and machineries must be

electrically grounded.

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.

4. The device has a single mounting surface. The device must be mounted according to the specifications.

Features

●High efficient lightsource.

●Designed for high current operation.

●Low thermal resistance.

●Encapsulation : Silicone resin.

●Compatible with IR-reflow processes.

Moisture sensitivity level : level 4.

●ESD protection.

●RoHS compliant.

Applications

Substitution of micro incandescent lamps.

Portable light source.

Signal and symbol luminaire for orientation.

Marker lights (e.g. steps, exit ways, etc).

Decorative and entertainment lighting.

Commercial and residential lighting.

Emergency-vehicle lighting.

Part Number: KADS-8072ZG10Z4S Green

SPEC NO: DSAM0386 REV NO: V.7B DATE: APR/30/2014 PAGE: 2 OF 8

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201200401

Handling Precautions

Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic

significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.

As a result, special handling precautions need to be observed during assembly using silicone encapsulated

LED products. Failure to comply might lead to damage and premature failure of the LED.

1. Handle the component along the side surfaces by using forceps or appropriate tools.

2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.

3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or

damage the internal circuitry.

4.1.There should be enough space inside the nozzle to avoid contact with the dome lens during pick up.

4.2. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.

4.3. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.

4.4. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup

and avoid damage during production.

5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of

Leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.

SPEC NO: DSAM0386 REV NO: V.7B DATE: APR/30/2014 PAGE: 3 OF 8

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201200401

Flux Characteristics at 350mA Ambient Temperature, Ta = 25°C

Color Part No. Code. Min. Max. Typ.

Green (AlGaInN) KADS-8072ZG10Z4S

B12 70 80

82 B13 80 90

Luminous Flux (lm)

@ 350mA [1]

B14 90 100

Electrical Characteristics at 350m A Ambient Temperature, Ta = 25°C

Color

Forward Voltage Vf [1]

(V)

Typical Temperature

Coefficient of

Forward

Voltage [2]

(mV/°C)

Vf T

Typical

Thermal

Resistance

(°C/W)

Rth j-slug

Min. Typ. Max.

Green 2.7 3.3 3.8 -2.9 11

Color Dominant Wavelength [1] D

(nm)

Typical

Spectral

Halfwidth [2]

(nm)

1/2

Typical

Temperature

Coefficient of

Dominant

Wavelength

(nm/°C)

D T

Typical

V

iewing

Angle [3]

(degrees)

21/2

Min. Typ. Max.

Green 520 530 535 35 0.11 150

Notes:

1.Kingbright maintains a tolerance of +/- 0.1V on forward voltage measurements.

2.Measured between 25 °C TJ 110 °C at IF = 350 mA.

Optical Characteristics at 350mA Amb i ent Temperature, Ta = 25°C

Notes:

1. Minimum luminous flux performance guaranteed within published operating conditions. Kingbright maintains tolerance of +/-15% on flux.

2. Luminous Flux value is traceable to the CIE127-2007 compliant national standards.

Notes:

1.Dominant wavelength is derived from the CIE 1931 Chromaticity diagram and represents the perceived color.

2.Spectral width at 1/2 of the peak intensity.

3.Viewing angle is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.

4.Wavelength value is traceable to the CIE127-2007 compliant national standards.

SPEC NO: DSAM0386 REV NO: V.7B DATE: APR/30/2014 PAGE: 4 OF 8

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201200401

Absolute Maximum Ratings

Note:

1. Proper current derating must be observed to maintain junction temperature below the maximum.

Parameter Green

DC Forward Current (mA) [1] 500

Peak Pusled Forward Current (mA) 700

Average Forward Current (mA) 500

ESD Sensitivity 8000V HBM

LED Junction Temperature (°C) 120

Operation Temperature (°C) -40 to+100

Soldering Temperature (°C) 260 For 5 Seconds

Storage Temperature (°C) -40 to+120

Reverse Voltage (V) 5

Wavelength Characteristi cs T a = 25°C

ZG-10

SPEC NO: DSAM0386 REV NO: V.7B DATE: APR/30/2014 PAGE: 5 OF 8

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201200401

SPEC NO: DSAM0386 REV NO: V.7B DATE: APR/30/2014 PAGE: 6 OF 8

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201200401

Current Derating Curves

Representative Typical Spatial Radiation Pattern

SPEC NO: DSAM0386 REV NO: V.7B DATE: APR/30/2014 PAGE: 7 OF 8

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201200401

Reflow soldering is recommended and the soldering profile is shown below.

Other soldering methods are not recommended as they might cause damage to the product.

Recommended Soldering Pattern

(Units : mm ; Tolerance: ± 0.1)

1. Solder pad dimensions are as shown above.

2. Recommended solder paste stencil pattern dimensions:

 The center circular opening of the stencil (for the heat slug) should have the same size as the solder pad.

 Each side of the two rectangular openings (for the leads) should exceed those of the solder pads by 0.06 – 0.10 mm.

 Solder paste thickness should be greater than 0.25 mm.

SPEC NO: DSAM0386 REV NO: V.7B DATE: APR/30/2014 PAGE: 8 OF 8

APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.Cui ERP: 1201200401

PACKING & LABEL SPECIFICATIONS KADS-8072ZG10Z4S

Terms and conditions for the usage of this doc ument

1.The information included in this document reflects representative usage scenarios and is intended

for technical reference only.

2.The part number, type, and specificati ons mentioned in this document are subject to future chang e

and improvement without notice. Before produ ction usage customer should refer to the latest

datasheet for the updated specifications.

3.When using the products referenced in this document, please ma ke sure the product is being

operated within the environmental and electrical limi ts specified in the datash eet. If customer usage

exceeds the specified limits, Kingbright will not be responsible for any subse quent issues.

4.The information in this document applies to typical usage in consumer electronics applications.

If customer's application has special reliability requirements or h ave life-threatening liabilities,

such as automotive or medical usage, please consult with Kingbright re presentative for further

assistance.

5.The contents and information of this do cument may not be reproduced or re-transmitted without

permission by Kingbright.

6.All design applications should refer to Kingbright application notes available at

http://www.kingbright.com/application_notes