White Electronic Designs WS512K32-XXX 512Kx32 SRAM MODULE, SMD 5962-94611 FEATURES Access Times of 15, 17, 20, 25, 35, 45, 55ns TTL Compatible Inputs and Outputs Packaging 5 Volt Power Supply * 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400). Low Power CMOS * 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140") (Package 502)1 * 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square (Package 510) 3.56mm (0.140") height. * 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880") square, 5.08mm (0.200") high (Package 528). Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation Weight WS512K32N-XH1X - 13 grams typical WS512K32-XG2UX - 8 grams typical WS512K32-XG4TX1 - 20 grams typical WS512K32-XG2LX - 8 grams typical * This product is subject to change without notice. Note 1: Package Not Recommended For New Design Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8 Commercial, Industrial and Military Temperature Ranges FIGURE 1 - PIN CONFIGURATION FOR WS512K32N-XH1X Top View 1 11 12 23 Pin Description 34 45 I/O8 WE2# I/O15 I/O24 VCC I/O31 I/O9 CS2# I/O14 I/O25 CS4# I/O30 I/O10 GND I/O13 I/O26 WE4# I/O29 A13 I/O11 I/O12 A6 I/O27 I/O28 A14 A10 OE# A7 A3 A0 A15 A11 A18 NC A4 A1 A16 A12 WE1# A8 A5 A2 A17 VCC I/O7 A9 WE3# I/O23 I/O0 CS1# I/O6 I/O16 CS3 I/O22 I/O1 NC I/O5 I/O17 GND I/O21 I/O2 I/O3 I/O4 I/O18 I/O19 I/O20 22 33 44 55 I/O0-31 A0-18 WE1-4# CS1-4# OE# VCC GND NC 56 Block Diagram WE1# CS1# WE2# CS2# WE3# CS3# WE4# CS4# OE# A0-18 512K X 8 8 512K X 8 8 512K X 8 8 512K X 8 8 66 I/O0 - 7 May 2006 Rev. 17 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected 1 I/O8 - 15 I/O16 - 23 I/O24 - 31 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs WS512K32-XXX FIGURE 2 - PIN CONFIGURATION FOR WS512K32-XG4TX1 Top View Pin Description NC A0 A1 A2 A3 A4 A5 CS3# GND CS4# WE# A6 A7 A8 A9 A10 VCC I/O0-31 A0-18 WE# CS1-4# OE# VCC GND NC 9 8 7 6 5 4 I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 3 2 1 68 67 66 65 64 63 62 61 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected Block Diagram CS1# WE# OE# A0-18 CS2# 512K X 8 512K X 8 CS3# 512K X 8 CS4# 512K X 8 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 8 8 8 NC NC NC NC NC A18 A17 A16 A15 CS1# OE# CS2# A14 A13 A12 A11 VCC 8 I/O8 - 15 I/O0 - 7 I/O16 - 23 I/O24 - 31 Note 1: Package Not Recommended For New Design FIGURE 3 - PIN CONFIGURATION FOR WS512K32-XG2UX AND WS512K32-XG2LX Pin Description NC A0 A1 A2 A3 A4 A5 CS3# GND CS4# WE1# A6 A7 A8 A9 A10 VCC Top View 9 8 7 6 5 4 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 3 2 1 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O16 I/O17 I/O18 I/O19 I/O20 I/O21 I/O22 I/O23 GND I/O24 I/O25 I/O26 I/O27 I/O28 I/O29 I/O30 I/O31 WE2# CS2# WE3# CS3# WE4# CS4# OE# A0-18 512K X 8 8 I/O0 - 7 May 2006 Rev. 17 Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected Block Diagram WE1# CS1# VCC A11 A12 A13 A14 A15 A16 CS1# OE# CS2# A17 WE2# WE3# WE4# A18 NC NC I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 GND I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 I/O0-31 A0-18 WE1-4# CS1-4# OE# VCC GND NC 2 512K X 8 8 I/O8 - 15 512K X 8 8 I/O16 - 23 512K X 8 8 I/O24 - 31 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs WS512K32-XXX ABSOLUTE MAXIMUM RATINGS Parameter Operating Temperature Storage Temperature Signal Voltage Relative to GND Junction Temperature Supply Voltage Symbol TA TSTG VG TJ VCC Min -55 -65 -0.5 TRUTH TABLE Max +125 +150 VCC+0.5 150 7.0 -0.5 Unit C C V C V CS H L L L OE X L H X WE X H H L RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Input High Voltage Input Low Voltage Operating Temp (Mil) Symbol VCC VIH VIL TA Min 4.5 2.2 -0.5 -55 Max 5.5 VCC + 0.3 +0.8 +125 Mode Standby Read Out Disable Write Data I/O High Z Data Out High Z Data In Power Standby Active Active Active CAPACITANCE Ta = +25C Unit V V V C Parameter OE# capacitance WE1-4# capacitance HIP (PGA) CQFP G4T CQFP G2U/G2L CS1-4# capacitance Data I/O capacitance Address input capacitance Symbol Conditions Max Unit COE VIN = 0 V, f = 1.0 MHz 50 pF pF CWE VIN = 0 V, f = 1.0 MHz 20 50 20 CCS VIN = 0 V, f = 1.0 MHz 20 pF CI/O VI/O = 0 V, f = 1.0 MHz 20 pF CAD VIN = 0 V, f = 1.0 MHz 50 pF This parameter is guaranteed by design but not tested. DC CHARACTERISTICS VCC = 5.0V, VSS = 0V, -55C TA +125C Parameter Symbol Input Leakage Current Conditions Min VCC = 5.5, VIN = GND to VCC ILI Units Max 10 A ILO CS# = VIH, OE# = VIH, VOUT = GND to VCC 10 A ICC x 32 CS# = VIL, OE# = VIH, f = 5MHz, VCC = 5.5 660 mA Standby Current ISB CS# = VIH, OE# = VIH, f = 5MHz, VCC = 5.5 80 mA Output Low Voltage VOL IOL = 6mA for 15 - 35ns, IOL = 2.1mA for 45 - 55ns, VCC = 4.5 0.4 V Output High Voltage VOH IOH = -4.0mA for 15 - 35ns, IOH = -1.0mA for 45 - 55ns, VCC = 4.5 Output Leakage Current Operating Supply Current x 32 Mode 2.4 V NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V DATA RETENTION CHARACTERISTICS (Ta = -55C to +125C) Parameter Symbol Conditions VDR CS VCC - 0.2V Data Retention Current ICCDR1 Low Power Data Retention Current (WS512K32L-XXX) ICCDR2 Data Retention Supply Voltage May 2006 Rev. 17 Units Min Max 2.0 5.5 V VCC = 3V 28 mA VCC = 3V 16 mA 3 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs WS512K32-XXX AC CHARACTERISTICS VCC = 5.0V, VSS = 0V, -55C TA +125C Parameter Read Cycle Symbol Read Cycle Time Address Access Time Output Hold from Address Change Chip Select Access Time Output Enable to Output Valid Chip Select to Output in Low Z Output Enable to Output in Low Z Chip Disable to Output in High Z Output Disable to Output in High Z tRC tAA tOH tACS tOE tCLZ1 tOLZ1 tCHZ1 tOHZ1 -15 Min 15 -17 Max Min 17 -20 Max 15 Min 20 17 0 -45 Max 0 25 12 2 0 12 12 Min 35 0 4 0 12 12 -55 Max Min 55 55 0 45 25 4 0 15 15 Units Max 45 35 25 2 0 12 12 Min 45 35 0 20 10 2 0 -35 Max 25 0 17 9 12 12 Min 25 20 0 15 8 2 0 -25 Max 55 25 4 0 20 20 20 20 ns ns ns ns ns ns ns ns ns 1. This parameter is guaranteed by design but not tested. AC CHARACTERISTICS VCC = 5.0V, VSS = 0V, -55C TA +125C Parameter Write Cycle Symbol Write Cycle Time Chip Select to End of Write Address Valid to End of Write Data Valid to End of Write Write Pulse Width Address Setup Time Address Hold Time Output Active from End of Write Write Enable to Output in High Z Data Hold Time tWC tCW tAW tDW tWP tAS tAH tOW1 tWHZ1 tDH Min -15 Max 15 13 13 10 13 2 0 2 Min -17 Max 17 15 15 11 15 2 0 2 8 0 Min -20 Max 20 15 15 12 15 2 0 3 9 Min 25 17 17 13 17 2 0 4 11 0 0 -25 Max Min -35 Max 35 25 25 20 25 2 0 4 13 Min 45 35 35 25 35 2 5 5 15 0 -45 Max 0 Min -55 Units Max 55 50 50 25 40 2 5 5 20 0 20 0 ns ns ns ns ns ns ns ns ns ns 1. This parameter is guaranteed by design but not tested. 2. The Address Setup Time of minimum 2ns is for the G2U, G1U and H1 packages. tAS minimum for the G4T package is 0ns. FIGURE. 4 - AC TEST CIRCUIT AC Test Conditions Parameter Input Pulse Levels Input Rise and Fall Input and Output Reference Level Output Timing Reference Level IOL Current Source VZ 1.5V (Bipolar Supply) D.U.T. Ceff = 50 pf Current Source May 2006 Rev. 17 Typ VIL = 0, VIH = 3.0 5 1.5 1.5 Unit V ns V V Notes: V Z is programmable from -2V to +7V. IOL & IOH programmable from 0 to 16mA. Tester Impedance Z0 = 75 . V Z is typically the midpoint of VOH and VOL. IOL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. IOH 4 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs WS512K32-XXX FIGURE 5 - TIMING WAVEFORM - READ CYCLE CS# OE# READ CYCLE 2, (CS# = OE# = VIL, WE# = VIH) READ CYCLE 2 (WE# = VIH) FIGURE 6 - WRITE CYCLE - WE# CONTROLLED CS# WE# WRITE CYCLE 2, CS# CONTROLLED FIGURE 7 - WRITE CYCLE - CS# CONTROLLED WS32K32-XHX CS# WE# WRITE CYCLE 2, CS# CONTROLLED May 2006 Rev. 17 5 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs WS512K32-XXX PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1) 4.60 (0.181) MAX ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1 Note 1: Package Not Recommended For New Design ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES May 2006 Rev. 17 6 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs WS512K32-XXX PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES PACKAGE 528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L) 25.15 (0.990) 0.25 (0.010) MAX 5.10 (0.200) MAX 22.36 (0.880) 0.25 (0.010) MAX 0.25 (0.010) 0.10 (0.002) 0.23 (0.009) REF R 0.127 (0.005) 24.0 (0.946) 0.25 (0.010) 1.37 (0.054) MIN 0.004 2O / 9O 1.01 (0.040) 0.13 (0.005) 1.27 (0.050) TYP 0.38 (0.015) 0.05 (0.002) 20.31 (0.800) REF 0.940" TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES May 2006 Rev. 17 7 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs WS512K32-XXX ORDERING INFORMATION W S 512K 32 X - XXX X X X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads DEVICE GRADE: Q = MIL-STD-883 Compliant M = Military Screened -55C to +125C I = Industrial -40C to 85C C = Commercial 0C to +70C PACKAGE TYPE: H1 = Ceramic Hex-In-line Package, HIP (Package 400) G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510) G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528) G4T1 = 40mm Low Profile CQFP (Package 502) ACCESS TIME (ns) IMPROVEMENT MARK: Blank = Standard Power N = No Connect at pin 21 and 39 in HIP for Upgrades L = Low Power Data Retention ORGANIZATION, 512Kx32 User configurable as 1Mx16 or 2Mx8 SRAM WHITE ELECTRONIC DESIGNS CORP. Note 1: Package Not Recommended For New Design May 2006 Rev. 17 8 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs DEVICE TYPE SPEED WS512K32-XXX PACKAGE SMD NO. 512K x 32 SRAM Module 55ns 66 pin HIP (H1) 5962-94611 05HTX 512K x 32 SRAM Module 45ns 66 pin HIP (H1) 5962-94611 06HTX 512K x 32 SRAM Module 35ns 66 pin HIP (H1) 5962-94611 07HTX 512K x 32 SRAM Module 25ns 66 pin HIP (H1) 5962-94611 08HTX 512K x 32 SRAM Module 20ns 66 pin HIP (H1) 5962-94611 09HTX 512K x 32 SRAM Module 17ns 66 pin HIP (H1) 5962-94611 10HTX 512K x 32 SRAM Module 15ns 66 pin HIP (H1) 5962-94611 19HTX 512K x 32 SRAM Module 55ns 68 lead CQFP Low Profile (G4T)1 5962-94611 05HYX 512K x 32 SRAM Module 45ns 68 lead CQFP Low Profile (G4T)1 5962-94611 06HYX 512K x 32 SRAM Module 35ns 1 68 lead CQFP Low Profile (G4T) 5962-94611 07HYX 512K x 32 SRAM Module 25ns 68 lead CQFP Low Profile (G4T)1 5962-94611 08HYX 512K x 32 SRAM Module 20ns 1 68 lead CQFP Low Profile (G4T) 5962-94611 09HYX 512K x 32 SRAM Module 17ns 68 lead CQFP Low Profile (G4T)1 5962-94611 10HYX 512K x 32 SRAM Module 55ns 68 lead CQFP (G2U) 5962-94611 05HMX 512K x 32 SRAM Module 45ns 68 lead CQFP (G2U) 5962-94611 06HMX 512K x 32 SRAM Module 35ns 68 lead CQFP (G2U) 5962-94611 07HMX 512K x 32 SRAM Module 25ns 68 lead CQFP (G2U) 5962-94611 08HMX 512K x 32 SRAM Module 20ns 68 lead CQFP (G2U) 5962-94611 09HMX 512K x 32 SRAM Module 17ns 68 lead CQFP (G2U) 5962-94611 10HMX 512K x 32 SRAM Module 15ns 66 pin HIP (H1) 5962-94611 19HMX 512K x 32 SRAM Module 55ns 68 lead CQFP (G2L) 5962-94611 05HAX 512K x 32 SRAM Module 45ns 68 lead CQFP (G2L) 5962-94611 06HAX 512K x 32 SRAM Module 35ns 68 lead CQFP (G2L) 5962-94611 07HAX 512K x 32 SRAM Module 25ns 68 lead CQFP (G2L) 5962-94611 08HAX 512K x 32 SRAM Module 20ns 68 lead CQFP (G2L) 5962-94611 09HAX 512K x 32 SRAM Module 17ns 68 lead CQFP (G2L) 5962-94611 10HAX 512K x 32 SRAM Module 15ns 66 pin HIP (H1) 5962-94611 19HAX Note 1: Package Not Recommended For New Design May 2006 Rev. 17 9 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs WS512K32-XXX Document Title 512K x 32 SRAM Multi-Chip Package Revision History Rev # History Release Date Status Initial October 1996 Preliminary Change (Pg. 1, 3) 1.1 Change Operation Supply Current from 520mA To 540mA 1.2 Change Data Retention Current from 12mA to 28mA. January 1997 Preliminary Change (Pg. 1, 2, 8, 10, 11) 1.1 Delete G2 Package November 1997 Preliminary Change (Pg. 1, 9) 1.1 Add SMD Case Outline M for G2T February 1998 Preliminary Change (Pg. 1, 3, 8) 1.1 Remove Low Capacitance package option April 1998 Preliminary Change (Pg. 1, 6, 8) 1.1 Add H1 package December 1998 Preliminary Change (Pg. 1, 4, 6, 9, 10) 1.1 Remove H2 package March 1999 Preliminary May 1999 Final 1.2 Change logo to WEDC logo Rev 2 Change (Pg. 1, 3, 4, 8) 1.1 Change status from Preliminary to Final 1.2 Make package descriptions consistent 1.3 Add 15ns as available in Commercial and Industrial Temperatures only. Rev 4 Change (Pg. 1, 3) June 1999 1.1 Change Standby Current (Isb) from 60mA to 80mA Maximum Final Rev 5 Change (Pg. 1, 2, 3, 4, 7, 8) 1.1 Add G1U package November 1999 Final Rev 6 Change (Pg. 1, 8) 1.1 Change G1U lead foot length from 0.64mm to 0.84mm Ref February 2000 Final May 2006 Rev. 17 10 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com White Electronic Designs WS512K32-XXX Rev 7 Change (Pg. 1, 3, 9) October 2000 Final 1.1 Change Operating Supply Current from 540mA to 660mA Maximum 1.2 Add Low Power Data Retention Current of 16mA to Data Retention Characteristics table 1.3 Add Low Power Data Retention (L) option to Ordering Information Rev 8 Change (Pg. 1, 2, 6, 7, 9, 10) October 2001 1.1 Change G2T and G4T package status to Not Recommended For New Design Final Rev 9 Change (Pg. 1, 2, 3, 8, 9, 10) 1.1 Add G1T package 1.2 Remove `Hi-Reliability Product' Title November 2001 Final Rev 10 Change (Pg. 1, 2, 3, 4, 7, 8, 9, 10, 11) 1.1 Remove G2T package 1.2 Add G2U package 1.3 Remove `Package to be Developed' note for G4T August 2002 Final Rev 11 Change (Pg. 1,2,4,8,10,11,13) February 2002 1.1 Change G1U package status to Not Recommended For New Designs Final Rev 12 Change (Pg. 1,2,3,7,8,10,11,13) 1.1 Add G2L package May 2003 Final Rev 13 Change (Pg. 1,2,3,7,8,10,11,13) 1.1 Remove all reference to G1U package 1.2 Remove all reference to G1T package December 2003 Final Rev 14 Change (Pg. 1,3,11) 1.1 Change IOL to 6mA for 15-35 ns May 2004 Final Rev 15 Change (Pg. 1,4,11) 1.1 Add 15ns for Military Temperature November 2004 Final Rev 16 Change (Pg. 1, 6, 11) 1.1 Correct thickness to 0.181"per PCN#140A00143 March 2006 Final May 2006 Final Rev 17 May 2006 Rev. 17 Change ( Pg. 1, 2, 11) 1.1 Correct pinout of G4T 1.2 Correct G2L foot length 11 White Electronic Designs Corporation * (602) 437-1520 * www.whiteedc.com