Ver. 201207 Multilayer Power Inductor CIG21L Series (2012/ EIA 0805) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN Super Low DC resistance Low Profile (1.0mm max) Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION TYPE 21 Dimension [mm] L W T D 2.00.1 1.250.1 0.90.1 0.5+0.2 -0.3 DESCRIPTION Part no. Size Inductance DC Rated Current (A) (inch/mm) (uH)@1MHz Resistance() Max. CIG21LR47MNE 0805/2012 0.47 20 % 0.080 20 % 1.30 CIG21L1R0MNE 0805/2012 1.0 20 % 0.110 20 % 1.15 CIG21L1R2MNE 0805/2012 1.2 20 % 0.125 20 % 1.10 CIG21L1R5MNE 0805/2012 1.5 20 % 0.140 20 % 1.05 CIG21L2R2MNE 0805/2012 2.2 20 % 0.160 20 % 0.95 CIG21L3R3MNE 0805/2012 3.3 20 % 0.220 20 % 0.80 CIG21L4R7MNE 0805/2012 4.7 20 % 0.260 20 % 0.75 Rated Current: DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25) Operating temperature range: -40 to +125C ( Including self-temperature rise) Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201207 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 21 (3) L (4) 1R0 (5) M (6) N (7) E (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (L:Low RDC Type) Inductance (R47:0.47uH, 1R0:1.0uH) (6) Tolerance (M:20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3,000 NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.