Ver. 201207
※Rated Current: DC current value when the self-generation of heat risesto 40℃(Reference ambient temperature:25℃)
※Operating temperature range: –40 to +125°C (Including self-temperature rise)
※Test equipment: Agilent :E4991A+16092A
1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.)
FEATURES
APPLICATION
CHARACTERISTIC DATA
Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter
DIMENSION
TYPE Dimension [mm]
L W T D
21 2.0±0.1 1.25±0.1 0.9±0.1 0.5+0.2
-0.3
DESCRIPTION
Part no. Size
(inch/mm) Inductance
(uH)@1MHz DC
Resistance(Ω)Rated Current (A)
Max.
CIG21LR47MNE 0805/2012 0.47 ±20 % 0.080 ±20 % 1.30
CIG21L1R0MNE 0805/2012 1.0 ±20 % 0.110 ±20 % 1.15
CIG21L1R2MNE 0805/2012 1.2 ±20 % 0.125 ±20 % 1.10
CIG21L1R5MNE 0805/2012 1.5 ±20 % 0.140 ±20 % 1.05
CIG21L2R2MNE 0805/2012 2.2 ±20 % 0.160 ±20 % 0.95
CIG21L3R3MNE 0805/2012 3.3 ±20 % 0.220 ±20 % 0.80
CIG21L4R7MNE 0805/2012 4.7 ±20 % 0.260 ±20 % 0.75
Multilayer Power Inductor
RECOMMENDED LAND PATTERN
CIG21L Series (2012/ EIA 0805)
Super Low DC resistance
Low Profile (1.0mm max)
Magnetically shielded structure
Free of all RoHS-regulated substances
Monolithic structure for high reliability
Ver. 201207
CI G 21 L 1R0 M N E
(1) (2) (3) (4) (5) (6) (7) (8)
(1) Chip Inductor (2) Power Inductor
(3) Dimension (4) Product Series (L:Low RDC Type)
(5) Inductance (R47:0.47uH, 1R0:1.0uH) (6) Tolerance (M:±20%)
(7) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(8) Packaging(C:paper tape, E:embossed tape)
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
PACKAGING
Packaging Style Quantity(pcs/reel)
Embossed Taping 3,000
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING FLOW SOLDERING
PRODUCT IDENTIFICATION
