CD4069UBE**CH-ATL - TEXAS INSTRUMENTS

Dual-Channel Digital Isolators,

Enhanced System-Level ESD Reliability

Data Sheet

ADuM3210/ADuM3211

Rev. K Document Feedback

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FEATURES

Enhanced system-level ESD performance per IEC 61000-4-x

High temperature operation: 125°C

Default low output

Narrow body, RoHS-compliant, 8-lead SOIC

Low power operation

5 V operation

1.7 mA per channel maximum at 0 Mbps to 2 Mbps

3.8 mA per channel maximum at 10 Mbps

7.5 mA per channel maximum at 25 Mbps

3.3 V operation

1.5 mA per channel maximum at 0 Mbps to 2 Mbps

2.5 mA per channel maximum at 10 Mbps

4.7 mA per channel maximum at 25 Mbps

3.3 V/5 V level translation

High data rate: dc to 25 Mbps (NRZ)

Precise timing characteristics

3 ns maximum pulse width distortion at 5 V operation

3 ns maximum channel-to-channel matching

High common-mode transient immunity: >25 kV/µs

Safety and regulatory approvals

UL recognition: 2500 V rms for 1 minute per UL 1577

CSA Component Acceptance Notice #5A

VDE certificate of conformity

DIN V VDE V 0884-10 (VDE V 0884-10):2006-12

VIORM = 560 V peak

Qualified for automotive applications

APPLICATIONS

Size-critical multichannel isolation

SPI interface/data converter isolation

RS-232/RS-422/RS-485 transceiver isolation

Digital field bus isolation

Gate drive interfaces

Hybrid electric vehicles, battery monitor, and motor drive

GENERAL DESCRIPTION

The ADuM3210/ADuM32111 are dual-channel digital isolators

based on Analog Devices, Inc., iCoupler® technology. Combining

high speed CMOS and monolithic transformer technology, this

isolation component provides outstanding performance charac-

teristics superior to alternatives such as optocoupler devices.

By avoiding the use of LEDs and photodiodes, iCoupler devices

remove the design difficulties commonly associated with opto-

couplers. The typical optocoupler concerns regarding uncertain

current transfer ratios, nonlinear transfer functions, and temperature

and lifetime effects are eliminated with the simple iCoupler digital

interfaces and stable performance characteristics. The need for

external drivers and other discrete components is eliminated with

these iCoupler products. Furthermore, iCoupler devices consume

one-tenth to one-sixth the power of optocouplers at comparable

signal data rates.

The ADuM3210/ADuM3211 isolators provide two independent

isolation channels in two channel configurations with data rates

up to 25 Mbps (see the Ordering Guide). They operate with 3.3 V

or 5 V supply voltages on either side, providing compatibility with

lower voltage systems, as well as enabling voltage translation func-

tionality across the isolation barrier. The ADuM3210/ADuM3211

isolators have a default output low characteristic in comparison

to the ADuM3200/ADuM3201 models, which have a default output

high characteristic. The ADuM3210W and ADuM3211W models

are automotive grade versions qualified for 125°C operation.

In comparison to the ADuM1200/ADuM1201 isolator, the

ADuM3210/ADuM3211 isolators contain various circuit and

layout changes providing increased capability relative to system-

level IEC 61000-4-x testing (ESD, burst, and surge). The precise

capability in these tests for either the ADuM1200/ADuM1201 or

ADuM3210/ADuM3211 products is strongly determined by the

design and layout of the user’s board or module. For more

information, see the AN-793 Application Note, ESD/Latch-Up

Considerations with iCoupler Isolation Products.

FUNCTIONAL BLOCK DIAGRAMS

ENCODE DECODE

VDD1

VIA

VIB

GND1

VDD2

VOA

VOB

GND2

06866-001

ADuM3210

ENCODE DECODE

DD1

GND

DD2

GND

06866-017

ADuM3211

Figure 1. ADuM3210 Figure 2. ADuM3211

1 Protected by U.S. Patents 5,952,849; 6,873,065; and 7,075,239.

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 2 of 21

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

General Description ......................................................................... 1

Functional Block Diagrams ............................................................. 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 4

Electrical Characteristics—5 V, 105°C Operation ................... 4

Electrical Characteristics—3.3 V, 105°C Operation ................ 5

Electrical Characteristics—Mixed 5 V/3.3 V,

105°C Operation ........................................................................... 6

Electrical Characteristics—Mixed 3.3 V/5 V,

105°C Operation ........................................................................... 7

Electrical Characteristics—5 V, 125°C Operation ................... 8

Electrical Characteristics—3.3 V, 125°C Operation ................ 9

Electrical Characteristics—Mixed 5 V/3.3 V,

125°C Operation ......................................................................... 10

Electrical Characteristics—Mixed 3.3 V/5 V,

125°C Operation ......................................................................... 11

Package Characteristics ............................................................. 12

Regulatory Information ............................................................. 12

Insulation and Safety-Related Specifications .......................... 12

Insulation Characteristics (DIN V VDE V 0884-10

(VDE V 0884-10):2006-12) ....................................................... 13

Recommended Operating Conditions .................................... 13

Absolute Maximum Ratings ......................................................... 14

ESD Caution................................................................................ 14

Pin Configurations and Function Descriptions ......................... 15

Truth Tables................................................................................. 15

Typical Performance Characteristics ........................................... 16

Applications Information .............................................................. 17

PC Board Layout ........................................................................ 17

System-Level ESD Considerations and Enhancements ........ 17

Propagation Delay-Related Parameters ................................... 17

DC Correctness and Magnetic Field Immunity.......................... 17

Power Consumption .................................................................. 18

Insulation Lifetime ..................................................................... 19

Outline Dimensions ....................................................................... 20

Ordering Guide .......................................................................... 21

Automotive Products ................................................................. 21

REVISION HISTORY

10/15—Rev. J to Rev. K

Changes to Features Section............................................................ 1

Changes to Table 3 ............................................................................ 4

Changes to Table 6 ............................................................................ 5

Changes to Table 9 ............................................................................ 6

Changes to Table 12 .......................................................................... 7

Changes to Table 14 and Table 15 .................................................. 8

Changes to Table 17 and Table 18 .................................................. 9

Changes to Table 20 and Table 21 ................................................ 10

Changes to Table 23 and Table 24 ................................................ 11

6/15—Rev. I to Rev. J

Changes to Table 26 and Table 27 ................................................ 12

4/14—Rev. H to Rev. I

Changes to Table 14 .......................................................................... 8

3/14—Rev. G to Rev. H

Changes to Features .......................................................................... 1

Changes to Table 2 ............................................................................. 4

Changed Electrical Characteristics—3 V, 105°C Operation

Section to Electrical Characteristics—3.3 V, 105°C Operation

Section; Changes to Table Summary Statement and Table 5 ....... 5

Changed Electrical Characteristics—Mixed 5 V/3 V, 105°C

Section to Electrical Characteristics—Mixed 5 V/3.3 V, 105°C

Section; Changes to Table Summary Statement and Table 8 ....... 6

Changed Electrical Characteristics—Mixed 3 V/5 V, 105°C

Section to Electrical Characteristics—Mixed 3.3V/5 V, 105°C

Section; Changes to Table Summary Statement and Table 11 ..... 7

Changes to Table 14 .......................................................................... 8

Changed Electrical Characteristics—3 V, 125°C Operation

Section to Electrical Characteristics—3.3 V, 125°C Operation

Section; Changes to Table Summary Statement and Table 17 ..... 9

Changed Electrical Characteristics—Mixed 5 V/3 V, 125°C

Section to Electrical Characteristics—Mixed 5 V/3.3 V, 125°C

Section; Changes to Table Summary Statement and Table 20 .. 10

Changed Electrical Characteristics—Mixed 3 V/5 V, 125°C

Section to Electrical Characteristics—Mixed 3.3V/5 V, 125°C

Section; Changes to Table Summary Statement and Table 23 .. 11

Changes to Table 27 ....................................................................... 12

Changes to Figure Captions, Figure 6 through Figure 11 ......... 16

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 3 of 21

11/12—Rev. F to Rev. G

Changes to Table Summary Statement, Electrical

Characteristics—3 V, 105°C Operation Section ............................ 5

Changes to Table Summary Statement, Electrical

Characteristics—Mixed 5 V/3 V, 105°C Operation Section ........ 6

Changes to Table Summary Statement, Electrical

Characteristics—Mixed 3 V/5 V, 105°C Operation Section ........ 7

Changes to Column Headings, Table 13, Table 14, Table 15 ....... 8

Changes to Column Headings, Table 16, Table 17, Table 18 ....... 9

Changes to Column Headings, Table 19, Table 20, Table 21 ..... 10

Changes to Column Headings, Table 22, Table 23, Table 24 ..... 11

Changes to Table 29 ........................................................................ 13

Changes to Table 32 and Table 33 ................................................. 15

Change to PC Board Layout Section ............................................ 17

2/12—Rev. E to Rev. F

Created Hyperlink for Safety and Regulatory Approvals

Entry in Features Section ................................................................. 1

Change to PC Board Layout Section ............................................ 16

11/11—Rev. D to Rev. E

Changes to Table 1, Pulse Width Parameter .................................. 3

Changes to Table 4, Pulse Width Parameter .................................. 4

Changes to Table 7, Pulse Width Parameter .................................. 5

Changes to Table 10, Pulse Width Parameter ................................ 6

6/11—Rev. C to Rev. D

Changes to Features Section, Applications Section,

and General Description Section .................................................... 1

Changes to Propagation Delay Skew Parameter, Table 1;

Opposing-Direction Parameter, Table 1; and Quiescent

Output Supply Current Parameter, Table 3 .................................... 3

Changes to Opposing-Direction Parameter, Table 4 .................... 4

Changes to Opposing-Direction Parameter, Table 7 and

Logic Low Input Threshold Parameter, Table 9 ............................ 5

Changes to Propagation Delay Skew Parameter, Table 10

and Changes to Table 12 ................................................................... 6

Changes to Table 13, Table 14, and Quiescent Output

Supply Current Parameter, Table 15 ............................................... 7

Changes to Table 16 and Table 17 ................................................... 8

Changes to Table 19, Table 20, and Logic Low Input

Threshold Parameter, Table 21 ........................................................ 9

Changes to Table 22, Table 23, and Table 24 ............................... 10

Changes to Side 1 Current Parameter, Table 28; Side 2

Current Parameter, Table 28; and Table 29 .................................. 12

Changes to Ambient Operating Temperature, Table 30

and Average Output Current per Pin, Table 30 ........................... 13

Changes to Figure 9, Figure 10, and Figure 11 Captions ........... 15

Changes to Ordering Guide ........................................................... 20

Added Automotive Products Section ........................................... 20

9/09—Rev. B to Rev. C

Added ADuM3210A and ADuM3211A ..................... Throughout

Changes to General Description Section ....................................... 1

Reformatted Electrical Characteristics Tables ............................... 3

Moved Truth Tables Section .......................................................... 14

Changes to Ordering Guide ........................................................... 20

7/09—Rev. A to Rev. B

Added ADuM3211 ......................................................... Throughout

Changes to Specifications Section .................................................. 3

Added Table 16 ................................................................................ 19

Added Figure 5 and Table 18 ......................................................... 20

Added Figure 11 .............................................................................. 21

Changes to Power Consumption Section .................................... 23

Changes to Ordering Guide ........................................................... 25

9/08—Revision A: Initial Version

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 4 of 21

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS—5 V, 105°C OPERATION

All typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. Minimum/maximum specifications apply over the entire recommended

operation range: 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications

are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.

Table 1.

A Grade

B Grade

Test Conditions/

Parameter Symbol Min Typ Max Min Typ Max Unit Comments

SWITCHING SPECIFICATIONS

Data Rate 1 10 Mbps Within PWD limit

Propagation Delay tPHL, tPLH 20 50 20 50 ns 50% input to 50% output

Pulse Width Distortion PWD 5 3 ns |tPLH − tPHL|

Change vs. Temperature 6 5 ps/°C

Pulse Width PW Within PWD limit

ADuM3210 1000 22 ns

ADuM3211 1000 33 ns

Propagation Delay Skew tPSK 20 18 ns Between any two units

Channel Matching

Codirectional tPSKCD 5 3 ns

Opposing Directional tPSKOD 20 18 ns

Output Rise/Fall Time tR/tF 2.5 2.5 ns 10% to 90%

Table 2.

Parameter Symbol

1 Mbps—A Grade, B Grade 10 Mbps—B Grade

Unit Min Typ Max Min Typ Max

SUPPLY CURRENT

ADuM3210 IDD1 1.3 1.7 3.5 4.8 mA

IDD2 1.0 1.6 2.0 2.8 mA

ADuM3211 IDD1 1.1 1.5 3.0 4.0 mA

IDD2 1.3 1.8 3.1 4.1 mA

Table 3. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 VDDx V

Logic Low Input Threshold VIL 0.3 VDDx V

Logic High Output Voltages

DDx

− 0.1

5.0

= −20 µA, V

= V

IxH

DDx

− 0.5

4.8

= −3.2 mA, V

= V

IxH

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = VIxL

0.2 0.4 V IOx = 3.2 mA, VIx = VIxL

Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ VDDx

Supply Current per Channel

Quiescent Input Supply Current IDDI(Q) 0.4 0.8 mA

Quiescent Output Supply Current IDDO(Q) 0.4 0.8 mA

Dynamic Input Supply Current IDDI(D) 0.19 mA/Mbps

Dynamic Output Supply Current IDDO(D) 0.05 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate fr 1.2 Mbps

1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 5 of 21

ELECTRICAL CHARACTERISTICS—3.3 V, 105°C OPERATION

All typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.3 V. Minimum/maximum specifications apply over the entire recommended

operation range: 3.0 V ≤ VDD1 ≤ 3.6 V, 3.0 V ≤ VDD2 ≤ 3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications

are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.

Table 4.

A Grade B Grade Test Conditions/

Parameter Symbol Min Typ Max Min Typ Max Unit Comments

SWITCHING SPECIFICATIONS

Data Rate 1 10 Mbps Within PWD limit

Propagation Delay tPHL, tPLH 20 60 20 60 ns 50% input to 50% output

Pulse Width Distortion PWD

ADuM3210 5 3 ns |tPLH − tPHL|

ADuM3211 6 4 ns |tPLH − tPHL|

Change vs. Temperature 6 5 ps/°C

Pulse Width

Within PWD limit

ADuM3210 1000 22 ns

ADuM3211 1000 33 ns

Propagation Delay Skew tPSK 29 22 ns Between any two units

Channel Matching

Codirectional tPSKCD 5 3 ns

Opposing Directional tPSKOD 29 20 ns

Output Rise/Fall Time tR/tF 3.0 3.0 ns 10% to 90%

Table 5.

Parameter Symbol

1 Mbps—A Grade, B Grade 10 Mbps—B Grade

Unit Min Typ Max Min Typ Max

SUPPLY CURRENT

ADuM3210 IDD1 0.8 1.3 2.1 3.2 mA

IDD2 0.7 1.0 1.3 1.9 mA

ADuM3211 IDD1 0.7 1.3 1.8 2.6 mA

IDD2 0.8 1.6 1.9 2.5 mA

Table 6. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

DC SPECIFICATIONS

Logic High Input Threshold

0.7 V

DDx

Logic Low Input Threshold VIL 0.3 VDDx V

Logic High Output Voltages VOH VDDx − 0.1 3.0 V IOx = −20 µA, VIx = VIxH

VDDx − 0.5 2.8 V IOx = −3.2 mA, VIx = VIxH

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = VIxL

0.2 0.4 V IOx = 3.2 mA, VIx = VIxL

Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ VDDx

Supply Current per Channel

Quiescent Input Supply Current IDDI(Q) 0.3 0.5 mA

Quiescent Output Supply Current IDDO(Q) 0.3 0.5 mA

Dynamic Input Supply Current IDDI(D) 0.10 mA/Mbps

Dynamic Output Supply Current IDDO(D) 0.03 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate fr 1.1 Mbps

1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 6 of 21

ELECTRICAL CHARACTERISTICS—MIXED 5 V/3.3 V, 105°C OPERATION

All typical specifications are at TA = 25°C, VDD1 = 5 V, V DD2 = 3.3 V. Minimum/maximum specifications apply over the entire recommended

operation range: 4.5 V ≤ VDD1 ≤ 5.5 V, 3.0 V ≤ VDD2 ≤ 3.6 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications

are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.

Table 7.

A Grade B Grade Test Conditions/

Parameter Symbol Min Typ Max Min Typ Max Unit Comments

SWITCHING SPECIFICATIONS

Data Rate 1 10 Mbps Within PWD limit

Propagation Delay tPHL, tPLH 15 55 15 55 ns 50% input to 50% output

Pulse Width Distortion PWD 5 3 ns |tPLH − tPHL|

Change vs. Temperature 6 5 ps/°C

Pulse Width PW Within PWD limit

ADuM3210 1000 22 ns

ADuM3211

1000

Propagation Delay Skew tPSK 29 22 ns Between any two units

Channel Matching

Codirectional tPSKCD 5 3 ns

Opposing Directional tPSKOD 29 20 ns

Output Rise/Fall Time tR/tF 3.0 3.0 ns 10% to 90%

Table 8.

Parameter Symbol

1 Mbps—A Grade, B Grade 10 Mbps—B Grade

Unit

Min

Typ

Max

Min

Typ

Max

SUPPLY CURRENT

ADuM3210 IDD1 1.3 1.7 3.5 4.8 mA

IDD2 0.7 1.0 1.3 1.9 mA

ADuM3211 IDD1 1.1 1.5 2.9 4.0 mA

IDD2 0.8 1.6 1.9 2.5 mA

Table 9. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 VDDx V

Logic Low Input Threshold VIL 0.3 VDDx V

Logic High Output Voltages VOH VDDx − 0.1 VDDx V IOx = −20 µA, VIx = VIxH

VDDx − 0.5 VDDx − 0.2 V IOx = −3.2 mA, VIx = VIxH

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = VIxL

0.2 0.4 V IOx = 3.2 mA, VIx = VIxL

Input Current per Channel

−10

+0.01

+10

µA

0 V ≤ V

≤ V

DDx

Supply Current per Channel

Quiescent Input Supply Current IDDI(Q) 0.4 0.8 mA

Quiescent Output Supply Current IDDO(Q) 0.3 0.5 mA

Dynamic Input Supply Current IDDI(D) 0.19 mA/Mbps

Dynamic Output Supply Current IDDO(D) 0.03 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate fr 1.2 Mbps

1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 7 of 21

ELECTRICAL CHARACTERISTICS—MIXED 3.3 V/5 V, 105°C OPERATION

All typical specifications are at TA = 25°C, VDD1 = 3.3 V, V DD2 = 5.0 V. Minimum/maximum specifications apply over the entire recommended

operation range: 3.0 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +105°C, unless otherwise noted. Switching specifications

are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.

Table 10.

A Grade B Grade Test Conditions/

Parameter Symbol Min Typ Max Min Typ Max Unit Comments

SWITCHING SPECIFICATIONS

Data Rate 1 10 Mbps Within PWD limit

Propagation Delay tPHL, tPLH 15 55 15 55 ns 50% input to 50% output

Pulse Width Distortion PWD

ADuM3210 5 3 ns |tPLH − tPHL|

ADuM3211 6 4 ns |tPLH − tPHL|

Change vs. Temperature 6 5 ps/°C

Pulse Width

Within PWD limit

ADuM3210 1000 22 ns

ADuM3211 1000 33 ns

Propagation Delay Skew tPSK 29 20 ns Between any two units

Channel Matching

Codirectional tPSKCD 15 3 ns

Opposing Directional tPSKOD 29 22 ns

Output Rise/Fall Time tR/tF 2.5 2.5 ns 10% to 90%

Table 11.

Parameter Symbol

1 Mbps—A Grade, B Grade 10 Mbps—B Grade

Unit Min Typ Max Min Typ Max

SUPPLY CURRENT

ADuM3210 IDD1 0.8 1.3 2.1 3.2 mA

IDD2 1.0 1.6 2.0 2.8 mA

ADuM3211 IDD1 0.7 1.3 1.8 2.6 mA

IDD2 1.3 1.8 3.1 4.1 mA

Table 12. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

DC SPECIFICATIONS

Logic High Input Threshold

0.7 V

DDx

Logic Low Input Threshold VIL 0.3 VDDx V

Logic High Output Voltages VOH VDDx − 0.1 VDDx V IOx = −20 µA, VIx = VIxH

VDDx − 0.5 VDDx − 0.2 V IOx = −3.2 mA, VIx = VIxH

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = VIxL

0.2 0.4 V IOx = 3.2 mA, VIx = VIxL

Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ VDDx

Supply Current per Channel

Quiescent Input Supply Current IDDI(Q) 0.4 0.8 mA

Quiescent Output Supply Current IDDO(Q) 0.5 0.8 mA

Dynamic Input Supply Current IDDI(D) 0.10 mA/Mbps

Dynamic Output Supply Current IDDO(D) 0.05 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate fr 1.1 Mbps

1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 8 of 21

ELECTRICAL CHARACTERISTICS—5 V, 125°C OPERATION

All typical specifications are at TA = 25°C, VDD1 = VDD2 = 5 V. Minimum/maximum specifications apply over the entire recommended

operation range: 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications

are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.

Table 13.

WA Grade WB Grade, T Grade WC Grade Test Conditions/

Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Comments

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit

Propagation Delay tPHL, tPLH 20 50 20 50 20 50 ns 50% input to 50%

output

Pulse Width Distortion PWD 5 3 3 ns |tPLH − tPHL|

Change vs. Temperature 6 5 5 ps/°C

Pulse Width PW 1000 100 40 ns Within PWD limit

Propagation Delay Skew

PSK

Between any two units

Channel Matching

Codirectional tPSKCD 5 3 3 ns

Opposing Directional tPSKOD 20 18 18 ns

Output Rise/Fall Time tR/tF 2.5 2.5 2.5 ns 10% to 90%

Table 14.

Parameter Symbol

1 Mbps—WA Grade,

WB Grade, WC Grade,

T Grade

10 Mbps—WB Grade,

WC Grade 10 Mbps—T Grade 25 Mbps—WC Grade

Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max

SUPPLY CURRENT

ADuM3210 IDD1 1.3 1.7 3.5 4.8 3.5 4.8 7.6 9.9 mA

IDD2 1.0 1.6 2.0 2.8 2.0 2.8 3.8 5.1 mA

ADuM3211 IDD1 1.1 1.5 3.0 4.0 3.0 4.0 6.4 8.7 mA

IDD2 1.3 1.8 3.1 4.1 3.1 4.1 6.1 8.0 mA

Table 15. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 VDDx V

Logic Low Input Threshold VIL 0.3 VDDx V

Logic High Output Voltages VOH VDDx − 0.1 5.0 V IOx = −20 µA, VIx = VIxH

VDDx − 0.5 4.8 V IOx = −3.2 mA, VIx = VIxH

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = VIxL

0.2 0.4 V IOx = 3.2 mA, VIx = VIxL

Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ VDDx

Supply Current per Channel

Quiescent Input Supply Current

DDI(Q)

0.4

0.8

Quiescent Output Supply Current IDDO(Q) 0.4 0.8 mA

Dynamic Input Supply Current IDDI(D) 0.19 mA/Mbps

Dynamic Output Supply Current IDDO(D) 0.05 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate fr 1.2 Mbps

1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 9 of 21

ELECTRICAL CHARACTERISTICS—3.3 V, 125°C OPERATION

All typical specifications are at TA = 25°C, VDD1 = VDD2 = 3.3 V. Minimum/maximum specifications apply over the entire recommended

operation range: 3.0 V ≤ VDD1 ≤ 3.6 V, 3.0 V ≤ VDD2 ≤ 3.6 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications

are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.

Table 16.

WA Grade WB Grade, T Grade WC Grade Test Conditions/

Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Comments

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit

Propagation Delay tPHL, tPLH 20 60 20 60 20 60 ns 50% input to 50%

output

Pulse Width Distortion PWD 6 4 4 ns |tPLH − tPHL|

Change vs. Temperature 6 5 5 ps/°C

Pulse Width PW 1000 100 40 ns Within PWD limit

Propagation Delay Skew

PSK

Between any two units

Channel Matching

Codirectional tPSKCD 5 3 3 ns

Opposing Directional tPSKOD 29 20 20 ns

Output Rise/Fall Time tR/tF 3.0 3.0 3.0 ns 10% to 90%

Table 17.

Parameter Symbol

1 Mbps—WA Grade,

WB Grade, WC Grade,

T Grade

10 Mbps—WB Grade,

WC Grade 10 Mbps—T Grade 25 Mbps—WC Grade

Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max

SUPPLY CURRENT

ADuM3210 IDD1 0.8 1.3 2.1 3.2 2.1 3.2 4.6 6.1 mA

IDD2 0.7 1.0 1.3 1.9 1.3 1.9 2.4 3.4 mA

ADuM3211 IDD1 0.7 1.3 1.8 2.6 1.8 2.6 3.8 5.4 mA

IDD2 0.8 1.6 1.9 2.5 1.9 2.5 3.7 5.0 mA

Table 18. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 VDDx V

Logic Low Input Threshold VIL 0.3 VDDx V

Logic High Output Voltages VOH VDDx − 0.1 3.0 V IOx = −20 µA, VIx = VIxH

VDDx − 0.5 2.8 V IOx = −3.2 mA, VIx = VIxH

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = VIxL

0.2 0.4 V IOx = 3.2 mA, VIx = VIxL

Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ VDDx

Supply Current per Channel

Quiescent Input Supply Current

DDI(Q)

0.3

0.5

Quiescent Output Supply Current IDDO(Q) 0.3 0.5 mA

Dynamic Input Supply Current IDDI(D) 0.10 mA/Mbps

Dynamic Output Supply Current IDDO(D) 0.03 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate fr 1.1 Mbps

1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 10 of 21

ELECTRICAL CHARACTERISTICS—MIXED 5 V/3.3 V, 125°C OPERATION

All typical specifications are at TA = 25°C, VDD1 = 5 V, V DD2 = 3.3 V. Minimum/maximum specifications apply over the entire recommended

operation range: 4.5 V ≤ VDD1 ≤ 5.5 V, 3.0 V ≤ VDD2 ≤ 3.6 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications

are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.

Table 19.

WA Grade WB Grade, T Grade WC Grade Test Conditions/

Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Comments

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit

Propagation Delay tPHL, tPLH 15 55 15 55 15 55 ns 50% input to 50%

output

Pulse Width Distortion PWD 5 3 3 ns |tPLH − tPHL|

Change vs. Temperature 6 5 5 ps/°C

Pulse Width PW 1000 100 40 ns Within PWD limit

Propagation Delay Skew

PSK

Between any two units

Channel Matching

Codirectional tPSKCD 5 3 3 ns

Opposing Directional tPSKOD 29 20 20 ns

Output Rise/Fall Time tR/tF 3.0 3.0 3.0 ns 10% to 90%

Table 20.

Parameter Symbol

1 Mbps—WA Grade,

WB Grade, WC Grade,

T Grade

10 Mbps—WB Grade,

WC Grade 10 Mbps—T Grade 25 Mbps—WC Grade

Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max

SUPPLY CURRENT

ADuM3210 IDD1 1.3 1.7 3.5 4.8 3.5 4.8 7.6 9.9 mA

IDD2 0.7 1.0 1.3 1.9 1.3 1.9 2.4 3.4 mA

ADuM3211 IDD1 1.1 1.5 2.9 4.0 2.9 4.0 6.4 8.7 mA

IDD2 0.8 1.6 1.9 2.5 1.9 2.5 3.7 5.0 mA

Table 21. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 VDDx V

Logic Low Input Threshold VIL 0.3 VDDx V

Logic High Output Voltages VOH VDDx − 0.1 VDDx V IOx = −20 µA, VIx = VIxH

VDDx − 0.5 VDDx − 0.2 V IOx = −3.2 mA, VIx = VIxH

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = VIxL

0.2 0.4 V IOx = 3.2 mA, VIx = VIxL

Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ VDDx

Supply Current per Channel

Quiescent Input Supply Current

DDI(Q)

0.4

0.8

Quiescent Output Supply Current IDDO(Q) 0.3 0.5 mA

Dynamic Input Supply Current IDDI(D) 0.19 mA/Mbps

Dynamic Output Supply Current IDDO(D) 0.03 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate fr 1.2 Mbps

1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 11 of 21

ELECTRICAL CHARACTERISTICS—MIXED 3.3 V/5 V, 125°C OPERATION

All typical specifications are at TA = 25°C, VDD1 = 3.3 V, V DD2 = 5.0 V. Minimum/maximum specifications apply over the entire recommended

operation range: 3.0 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V, and −40°C ≤ TA ≤ +125°C, unless otherwise noted. Switching specifications

are tested with CL = 15 pF and CMOS signal levels, unless otherwise noted.

Table 22.

WA Grade WB Grade, T Grade WC Grade Test Conditions/

Parameter Symbol Min Typ Max Min Typ Max Min Typ Max Unit Comments

SWITCHING SPECIFICATIONS

Data Rate 1 10 25 Mbps Within PWD limit

Propagation Delay tPHL, tPLH 15 55 15 55 15 55 ns 50% input to 50%

output

Pulse Width Distortion PWD 6 4 4 ns |tPLH − tPHL|

Change vs. Temperature 6 5 5 ps/°C

Pulse Width PW 1000 100 40 ns Within PWD limit

Propagation Delay Skew

PSK

Between any two units

Channel Matching

Codirectional tPSKCD 15 3 3 ns

Opposing Directional tPSKOD 29 20 20 ns

Output Rise/Fall Time tR/tF 2.5 2.5 2.5 ns 10% to 90%

Table 23.

Parameter Symbol

1 Mbps—WA Grade,

WB Grade, WC Grade,

T Grade

10 Mbps—WB Grade,

WC Grade 10 Mbps—T Grade 25 Mbps—WC Grade

Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max

SUPPLY CURRENT

ADuM3210 IDD1 0.8 1.3 2.1 3.2 2.1 3.2 4.6 6.1 mA

IDD2 1.0 1.6 2.0 2.8 2.0 2.8 3.7 5.1 mA

ADuM3211 IDD1 0.7 1.3 1.8 2.6 1.8 2.6 3.8 5.4 mA

IDD2 1.3 1.8 3.1 4.1 3.1 4.1 6.1 8.0 mA

Table 24. For All Models

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

DC SPECIFICATIONS

Logic High Input Threshold VIH 0.7 VDDx V

Logic Low Input Threshold VIL 0.3 VDDx V

Logic High Output Voltages VOH VDDx − 0.1 VDDx V IOx = −20 µA, VIx = VIxH

VDDx − 0.5 VDDx − 0.2 V IOx = −3.2 mA, VIx = VIxH

Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = VIxL

0.2 0.4 V IOx = 3.2 mA, VIx = VIxL

Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIx ≤ VDDx

Supply Current per Channel

Quiescent Input Supply Current

DDI(Q)

0.4

0.8

Quiescent Output Supply Current IDDO(Q) 0.5 0.8 mA

Dynamic Input Supply Current IDDI(D) 0.10 mA/Mbps

Dynamic Output Supply Current IDDO(D) 0.05 mA/Mbps

AC SPECIFICATIONS

Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx = VDDx, VCM = 1000 V,

transient magnitude = 800 V

Refresh Rate fr 1.1 Mbps

1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining VO > 0.8 VDD. The common-mode voltage slew rates apply to both

rising and falling common-mode voltage edges.

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 12 of 21

PACKAGE CHARACTERISTICS

Table 25.

Parameter Symbol Min Typ Max Unit Test Conditions/Comments

Resistance (Input-to-Output)

I-O

Ω

Capacitance (Input-to-Output)1 CI-O 1.0 pF f = 1 MHz

Input Capacitance CI 4.0 pF

IC Junction-to-Case Thermal Resistance, Side 1 θJCI 46 °C/W Thermocouple located at center

of package underside

IC Junction-to-Case Thermal Resistance, Side 2 θJCO 41 °C/W

1 The device is considered a 2-terminal device; Pin 1 through Pin 4 are shorted together, and Pin 5 through Pin 8 are shorted together.

REGULATORY INFORMATION

The ADuM3210/ADuM3211 are approved by the organizations listed in Table 26.

Table 26.

UL CSA CQC VDE

Recognized under UL

1577 component

recognition program1

Approved under CSA Component

Acceptance Notice #5A

Approved under CQC11-471543-

2012

Certified according to DIN

V VDE V 0884-10 (VDE V

0884-10):2006-122

Single/basic 2500 V rms

isolation voltage

Basic insulation per CSA 60950-1-03 and IEC

60950-1, 400 V rms (566 V peak) maximum

working voltage

Basic insulation per GB4943.1-2011

400 V rms (588 V peak) maximum

working voltage, tropical climate,

altitude ≤ 5000 meters

Reinforced insulation,

560 V peak

Functional insulation per CSA 60950-1-03

and IEC 60950-1, 800 V rms (1131 V peak)

maximum working voltage

File E214100 File 205078 File CQC14001114896 File 2471900-4880-0001

1 In accordance with UL 1577, each ADuM3210/ADuM3211 is proof tested by applying an insulation test voltage ≥ 3000 V rms for 1 sec (current leakage detection limit = 5 µA).

2 In accordance with DIN V VDE V 0884-10 (VDE V 0884-10):2006-12, each ADuM3210/ADuM3211 is proof tested by applying an insulation test voltage ≥ 1050 V peak for

1 sec (partial discharge detection limit = 5 pC). The asterisk (*) marking branded on the component designates DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 approval.

INSULATION AND SAFETY-RELATED SPECIFICATIONS

Table 27.

Parameter Symbol Value Unit Test Conditions/Comments

Rated Dielectric Insulation Voltage 2500 V rms 1-minute duration

Clearance in the Plane of the PCB CLPCB 4.5 mm min Measured from input terminals to output terminals,

shortest line of sight distance through air in the

plane of the PCB

Minimum External Air Gap (Clearance) L(I01) 4.0 mm min Measured from input terminals to output terminals,

shortest distance through air

Minimum External Tracking (Creepage) L(I02) 4.0 mm min Measured from input terminals to output terminals,

shortest distance path along body

Minimum Internal Distance (Internal Clearance) 0.017 min mm min Insulation distance through insulation

Tracking Resistance (Comparative Tracking Index) CTI >400 V DIN IEC 112/VDE 0303, Part 1

Isolation Group II Material Group (DIN VDE 0110, 1/89, Table 1)

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 13 of 21

INSULATION CHARACTERISTICS (DIN V VDE V 0884-10 (VDE V 0884-10):2006-12)

These isolators are suitable for reinforced isolation only within the safety limit data. Maintenance of the safety data is ensured by protective

circuits. The asterisk (*) marking branded on the component designates DIN V VDE V 0884-10 (VDE V 0884-10):2006-12 approval for

a 560 V peak working voltage.

Table 28.

Description Test Conditions/Comments Symbol Characteristic Unit

Installation Classification per DIN VDE 0110

For Rated Mains Voltage ≤ 150 V rms I to IV

For Rated Mains Voltage ≤ 300 V rms I to III

For Rated Mains Voltage ≤ 400 V rms I to II

Climatic Classification 40/105/21

Pollution Degree per DIN VDE 0110, Table 1 2

Maximum Working Insulation Voltage VIORM 560 V peak

Input-to-Output Test Voltage, Method B1 VIORM × 1.875 = VPR, 100% production test, tm = 1 sec,

partial discharge < 5 pC

VPR 1050 V peak

Input-to-Output Test Voltage, Method A

After Environmental Tests Subgroup 1 VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC VPR 896 V peak

After Input and/or Safety Tests

Subgroup 2 and Subgroup 3

VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC VPR 672 V peak

Highest Allowable Overvoltage Transient overvoltage, tTR = 10 sec VTR 4000 V peak

Safety-Limiting Values Maximum value allowed in the event of a failure

(see Figure 3)

Case Temperature TS 150 °C

Side 1 Current IS1 160 mA

Side 2 Current IS2 170 mA

Insulation Resistance at TS VIO = 500 V RS >109 Ω

CASE TEMPERATURE (° C)

SAF ETY- LI M IT ING CURRE NT (mA)

200

180

100

50 100 150 200

SIDE 1 SIDE 2

120

140

160

06866-002

Figure 3. Thermal Derating Curve, Dependence of Safety-Limiting

Values on Case Temperature per DIN V VDE V 0884-10

RECOMMENDED OPERATING CONDITIONS

Table 29.

Parameter Symbol Rating

Operating Temperature TA

ADuM3210A/ADuM3211A −40°C to +105°C

ADuM3210B/ADuM3211B −40°C to +105°C

ADuM3210T/ADuM3211T −40°C to +125°C

ADuM3210WA/ADuM3211WA −40°C to +125°C

ADuM3210WB/ADuM3211WB −40°C to +125°C

ADuM3210WC/ADuM3211WC −40°C to +125°C

Supply Voltages1 VDD1, VDD2 3 V to 5.5 V

Maximum Input Signal Rise and

Fall Times

1 ms

1 All voltages are relative to their respective ground. See the DC Correctness

and Magnetic Field Immunity section for information about immunity to

external magnetic fields.

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 14 of 21

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 30.

Parameter Rating

Storage Temperature (TST) −55°C to +150°C

Ambient Operating Temperature (TA) −40°C to +125°C

Supply Voltages (VDD1, VDD2)1 −0.5 V to +7.0 V

Input Voltage (VIA, VIB)1, 2 −0.5 V to VDDI + 0.5 V

Output Voltage (VOA, VOB)1, 2 −0.5 V to VDDO + 0.5 V

Average Output Current per Pin (IO)3 −22 mA to +22 mA

Common-Mode Transients

(CMH, CML)4

−100 kV/µs to +100 kV/µs

1 Each voltage is relative to its respective ground.

2 VDDI and VDDO refer to the supply voltages on the input and output sides

of a given channel, respectively.

3 See Figure 3 for maximum allowable current values for various temperatures.

4 Refers to common-mode transients across the insulation barrier. Common-

mode transients exceeding the absolute maximum rating can cause latch-up

or permanent damage.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Table 31. Maximum Continuous Working Voltage1

Parameter Max Unit Constraint

AC Voltage, Bipolar

Waveform

565 V peak 50-year minimum

lifetime

AC Voltage, Unipolar

Waveform

Functional Insulation 1131 V peak Maximum approved

working voltage per

IEC 60950-1

Basic Insulation

560

V peak

Maximum approved

working voltage per

IEC 60950-1 and

VDE V 0884-10

DC Voltage

Functional Insulation

1131

V peak

Maximum approved

working voltage per

IEC 60950-1

Basic Insulation 560 V peak Maximum approved

working voltage per

IEC 60950-1 and

VDE V 0884-10

1 Refers to the continuous voltage magnitude imposed across the isolation

barrier. See the Insulation Lifetime section for more information.

ESD CAUTION

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 15 of 21

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

06866-003

DD1 1

IA 2

IB 3

GND

DD2

GND

ADuM3210

TOP VIEW

(No t t o Scale)

Figure 4. ADuM3210 Pin Configuration

06866-016

DD1 1

OA 2

IB 3

GND

DD2

GND

ADuM3211

TOP VIEW

(No t t o Scale)

Figure 5. ADuM3211 Pin Configuration

Table 32. ADuM3210 Pin Function Descriptions

Pin No. Mnemonic Description

1 VDD1 Supply Voltage for Isolator Side 1,

3.0 V to 5.5 V.

2 VIA Logic Input A.

3 VIB Logic Input B.

4 GND1 Ground 1. Ground reference for

Isolator Side 1.

5 GND2 Ground 2. Ground reference for

Isolator Side 2.

6 VOB Logic Output B.

7 VOA Logic Output A.

8 VDD2 Supply Voltage for Isolator Side 2,

3.0 V to 5.5 V.

Table 33. ADuM3211 Pin Function Descriptions

Pin No. Mnemonic Description

1 VDD1 Supply Voltage for Isolator Side 1,

3.0 V to 5.5 V.

2 VOA Logic Output A.

3 VIB Logic Input B.

4 GND1 Ground 1. Ground reference for

Isolator Side 1.

5 GND2 Ground 2. Ground reference for

Isolator Side 2.

6 VOB Logic Output B.

7 VIA Logic Input A.

8 VDD2 Supply Voltage for Isolator Side 2,

3.0 V to 5.5 V.

TRUTH TABLES

Table 34. ADuM3210 Truth Table (Positive Logic)

VIA Input1 V

IB Input1 V

DD1 State VDD2 State VOA Output1 V

OB Output1 Notes

H H Powered Powered H H

L L Powered Powered L L

H L Powered Powered H L

L H Powered Powered L H

X X Unpowered Powered L L Outputs return to the input state within

1 μs of VDDI power restoration

X X Powered Unpowered Indeterminate Indeterminate

Outputs return to the input state within

1 μs of VDDO power restoration

1 H is logic high, L is logic low, and X is don’t care.

Table 35. ADuM3211 Truth Table (Positive Logic)

VIA Input1 V

IB Input1 V

DD1 State VDD2 State VOA Output1 V

OB Output1 Notes

H H Powered Powered H H

L L Powered Powered L L

H L Powered Powered H L

L H Powered Powered L H

X X Unpowered Powered Indeterminate L Outputs return to the input state within

1 μs of VDDI power restoration

X X Powered Unpowered L Indeterminate

Outputs return to the input state within

1 μs of VDDO power restoration

1 H is logic high, L is logic low, and X is don’t care.

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 16 of 21

TYPICAL PERFORMANCE CHARACTERISTICS

DATA RATE (M bp s)

CURRENT/CHANNEL (mA)

10 20 30

06866-004

Figure 6. Typical Input Supply Current per Channel vs. Data Rate

for 5 V and 3.3 V Operation

DATA RATE (M bp s)

CURRENT/CHANNEL (mA)

10 20 30

06866-005

Figure 7. Typical Output Supply Current per Channel vs. Data Rate

for 5 V and 3.3 V Operation (No Output Load)

DATA RATE (M bp s)

CURRENT/CHANNEL (mA)

10 20 30

06866-006

Figure 8. Typical Output Supply Current per Channel vs. Data Rate

for 5 V and 3.3 V Operation (15 pF Output Load)

DATA RATE (M bp s)

CURRENT ( mA)

10 20 30

06866-007

Figure 9. ADuM3210 Typical IDD1 Supply Current vs. Data Rate

for 5 V and 3.3 V Operation

DATA RATE (M bp s)

CURRENT ( mA)

10 20 30

06866-008

Figure 10. ADuM3210 Typical IDD2 Supply Current vs. Data Rate

for 5 V and 3.3 V Operation

DATA RATE (M bp s)

CURRENT ( mA)

10 20 30

06866--015

Figure 11. ADuM3211 Typical IDD1 or IDD2 Supply Current vs. Data Rate

for 5 V and 3.3 V Operation

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 17 of 21

APPLICATIONS INFORMATION

PC BOARD LAYOUT

The ADuM3210/ADuM3211 digital isolators require no external

interface circuitry for the logic interfaces. Power supply bypassing

is strongly recommended at the input and output supply pins.

The capacitor value should be between 0.01 µF and 0.1 µF. The

total lead length between both ends of the capacitor and the

input power supply pin should not exceed 2 mm.

See the AN-1109 Application Note for board layout guidelines.

SYSTEM-LEVEL ESD CONSIDERATIONS AND

ENHANCEMENTS

System-level ESD reliability (for example, per IEC 61000-4-x)

is highly dependent on system design, which varies widely by

application. The ADuM3210/ADuM3211 incorporate many

enhancements to make ESD reliability less dependent on system

design. The enhancements include

• ESD protection cells are added to all input/output interfaces.

• Key metal trace resistances are reduced using wider

geometry and paralleling of lines with vias.

• The SCR effect inherent in CMOS devices is minimized

by use of a guarding and isolation technique between the

PMOS and NMOS devices.

• Areas of high electric field concentration are eliminated

using 45° corners on metal traces.

• Supply pin overvoltage is prevented with larger ESD clamps

between each supply pin and its respective ground.

Although the ADuM3210/ADuM3211 improve system-level

ESD reliability, they are no substitute for a robust system-level

design. For detailed recommendations on board layout and

system-level design, see the AN-793 Application Note, ESD/

Latch-Up Considerations with iCoupler Isolation Products.

PROPAGATION DELAY-RELATED PARAMETERS

Propagation delay is a parameter that describes the time it takes

a logic signal to propagate through a component. The propaga-

tion delay to a logic low output can differ from the propagation

delay to a logic high output.

INPUT (VIx)

OUTPUT (VOx)

PLH

PHL

50%

06866-009

Figure 12. Propagation Delay Parameters

Pulse width distortion is the maximum difference between

these two propagation delay values and is an indication of

how accurately the timing of the input signal is preserved.

Channel-to-channel matching refers to the maximum amount

that the propagation delay differs between channels within a

single ADuM3210/ADuM3211 component.

Propagation delay skew refers to the maximum amount that

the propagation delay differs between multiple ADuM3210/

ADuM3211 components operating under the same conditions.

DC CORRECTNESS AND MAGNETIC FIELD IMMUNITY

Positive and negative logic transitions at the isolator input cause

narrow (~1 ns) pulses to be sent to the decoder via the transformer.

The decoder is bistable and is, therefore, either set or reset by

the pulses, indicating input logic transitions. In the absence of

logic transitions at the input for more than 2 µs, a periodic set

of refresh pulses indicative of the correct input state is sent to

ensure dc correctness at the output. If the decoder receives no

internal pulses for more than approximately 5 µs, the input side

is assumed to be unpowered or nonfunctional, and the isolator

output is forced to a default state by the watchdog timer circuit

(see Table 34 and Table 35).

The ADuM3210/ADuM3211 are immune to external magnetic

fields. The limitation on the magnetic field immunity of the

ADuM3210/ADuM3211 is set by the condition in which induced

voltage in the receiving coil of the transformer is sufficiently large

to either falsely set or reset the decoder. The following analysis

defines the conditions under which this can occur. The 3 V oper-

ating condition of the ADuM3210/ADuM3211 is examined

because it represents the most susceptible mode of operation.

The pulses at the transformer output have an amplitude greater

than 1.0 V. The decoder has a sensing threshold at approximately

0.5 V, thus establishing a 0.5 V margin in which induced voltages

can be tolerated. The voltage induced across the receiving coil

is given by

V = (−dβ/dt) ∑ πrn2; n = 1, 2, … , N

where:

β is the magnetic flux density (gauss).

rn is the radius of the nth turn in the receiving coil (cm).

N is the total number of turns in the receiving coil.

Given the geometry of the receiving coil in the ADuM3210/

ADuM3211 and an imposed requirement that the induced voltage

be, at most, 50% of the 0.5 V margin at the decoder, a maximum

allowable magnetic field is calculated as shown in Figure 13.

MAGNE TI C FIE LD FRE QUENCY ( Hz )

100

MAXIMUM ALLOWABLE MAGNETIC FLUX

DENSI TY ( kgauss)

0.001 1M

0.01

1k 10k 10M

0.1

100M100k

06866-010

Figure 13. Maximum Allowable External Magnetic Flux Density

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 18 of 21

For example, at a magnetic field frequency of 1 MHz, the maxi-

mum allowable magnetic field of 0.2 kgauss induces a voltage of

0.25 V at the receiving coil. The voltage is approximately 50% of

the sensing threshold and does not cause a faulty output transition.

Similarly, if such an event occurs during a transmitted pulse (and

is of the worst-case polarity), it reduces the received pulse from

>1.0 V to 0.75 V, which is still well above the 0.5 V sensing

threshold of the decoder.

The preceding magnetic flux density values correspond to specific

current magnitudes at given distances from the ADuM3210/

ADuM3211 transformers. Figure 14 expresses these allowable

current magnitudes as a function of frequency for selected

distances. As shown in Figure 14, the ADuM3210/ADuM3211

are immune and can be affected only by extremely large currents

operated at high frequency very close to the component. For the

1 MHz example, a 0.5 kA current placed 5 mm away from the

ADuM3210/ADuM3211 is required to affect the operation of

the component.

MAG NETI C FI E LD F RE QUENCY ( Hz )

MAXI MUM AL LO WABL E CURRE NT (kA)

1000

100

0.1

0.011k 10k 100M100k 1M 10M

DISTANCE = 5mm

DISTANCE = 1m

DISTANCE = 100mm

06866-011

Figure 14. Maximum Allowable Current for Various

Current-to-ADuM3210/ADuM3211 Spacings

Note that at combinations of strong magnetic fields and high

frequency, any loops formed by the printed circuit board (PCB)

traces can induce error voltages sufficiently large to trigger the

thresholds of succeeding circuitry. Care should be taken in the

layout of such traces to avoid this possibility.

POWER CONSUMPTION

The supply current at a given channel of the ADuM3210/

ADuM3211 isolator is a function of the supply voltage, channel

data rate, and channel output load.

For each input channel, the supply current is given by

IDDI = IDDI(Q) f ≤ 0.5fr

IDDI = IDDI(D) × (2f − fr) + IDDI(Q) f > 0.5fr

For each output channel, the supply current is given by

IDDO = IDDO(Q) f ≤ 0.5fr

IDDO = (IDDO(D) + (0.5 × 10−3) × CLVDDO) × (2f − fr) + IDDO(Q)

f > 0.5fr

where:

IDDI(D), IDDO(D) are the input and output dynamic supply currents

per channel (mA/Mbps).

IDDI(Q), IDDO(Q) are the specified input and output quiescent supply

currents (mA).

CL is the output load capacitance (pF).

VDDO is the output supply voltage (V).

f is the input logic signal frequency (MHz, half of the input data

rate, NRZ signaling).

fr is the input stage refresh rate (Mbps).

To calculate the total IDD1 and IDD2 supply current, the supply

currents for each input and output channel corresponding to

IDD1 and IDD2 are calculated and totaled.

Figure 6 provides the input supply currents per channel as a

function of data rate. Figure 7 and Figure 8 provide the output

supply currents per channel as a function of data rate for an

unloaded output condition and for a 15 pF output condition,

respectively. Figure 9 through Figure 11 provide total IDD1 and

IDD2 supply current as a function of data rate for the ADuM3210

and ADuM3211 channel configurations.

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 19 of 21

INSULATION LIFETIME

All insulation structures eventually break down when subjected to

voltage stress over a sufficiently long period. The rate of insulation

degradation is dependent on the characteristics of the voltage

waveform applied across the insulation. In addition to the testing

performed by the regulatory agencies, Analog Devices carries

out an extensive set of evaluations to determine the lifetime of

the insulation structure within the ADuM3210/ADuM3211.

Analog Devices performs accelerated life testing using voltage

levels higher than the rated continuous working voltage. Accel-

eration factors for several operating conditions are determined.

These factors allow calculation of the time to failure at the actual

working voltage.

The values shown in Table 31 summarize the peak voltage for

50 years of service life for a bipolar ac operating condition and

the maximum CSA/VDE approved working voltages. In many

cases, the approved working voltage is higher than the 50-year

service life voltage. Operation at these high working voltages

can lead to shortened insulation life in some cases.

The insulation lifetime of the ADuM3210/ADuM3211 depends

on the voltage waveform type imposed across the isolation barrier.

The iCoupler insulation structure degrades at different rates

depending on whether the waveform is bipolar ac, unipolar ac, or

dc. Figure 15, Figure 16, and Figure 17 illustrate these different

isolation voltage waveforms.

Bipolar ac voltage is the most stringent environment. The goal

of a 50-year operating lifetime under the bipolar ac condition

determines the maximum working voltage recommended by

Analog Devices.

In the case of unipolar ac or dc voltage, the stress on the insulation

is significantly lower. This allows operation at higher working

voltages while still achieving a 50-year service life. The working

voltages listed in Table 31 can be applied while maintaining the

50-year minimum lifetime, provided that the voltage conforms

to either the unipolar ac or dc voltage cases.

Any cross-insulation voltage waveform that does not conform

to Figure 16 or Figure 17 should be treated as a bipolar ac wave-

form, and its peak voltage should be limited to the 50-year lifetime

voltage value listed in Table 31.

Note that the voltage presented in Figure 16 is shown as sinusoidal

for illustration purposes only. It is meant to represent any voltage

waveform varying between 0 V and some limiting value. The

limiting value can be positive or negative, but the voltage cannot

cross 0 V.

RATED P E AK V OL TAG E

06866-012

Figure 15. Bipolar AC Waveform

RATED P E AK V OL TAG E

06866-013

Figure 16. Unipolar AC Waveform

RATED P E AK V OL TAG E

06866-014

Figure 17. DC Waveform

ADuM3210/ADuM3211 Data Sheet

Rev. K | Page 20 of 21

OUTLINE DIMENSIONS

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

012407-A

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099) 45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

8 5

5.00(0.1968)

4.80(0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

Figure 18. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

Data Sheet ADuM3210/ADuM3211

Rev. K | Page 21 of 21

ORDERING GUIDE

Model1, 2

Number

of Inputs,

VDD1 Side

Number

of Inputs,

VDD2 Side

Maximum

Data Rate

(Mbps)

Maximum

Propagation

Delay, 5 V (ns)

Maximum

Pulse Width

Distortion (ns)

Temperature

Range

Package

Description

Package

Option

ADuM3210ARZ 2 0 1 50 5 −40°C to +105°C 8-Lead SOIC_N R-8

ADuM3210ARZ-RL7 2 0 1 50 5 −40°C to +105°C 8-Lead SOIC_N R-8

ADuM3210BRZ 2 0 10 50 3 −40°C to +105°C 8-Lead SOIC_N R-8

ADuM3210BRZ-RL7 2 0 10 50 3 −40°C to +105°C 8-Lead SOIC_N R-8

ADuM3210TRZ 2 0 10 50 3 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3210TRZ-RL7 2 0 10 50 3 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3210WARZ 2 0 1 50 5 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3210WARZ-RL7 2 0 1 50 5 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3210WBRZ 2 0 10 50 3 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3210WBRZ-RL7 2 0 10 50 3 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3210WCRZ 2 0 25 50 3 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3210WCRZ-RL7 2 0 25 50 3 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3211ARZ 1 1 1 50 6 −40°C to +105°C 8-Lead SOIC_N R-8

ADuM3211ARZ-RL7 1 1 1 50 6 −40°C to +105°C 8-Lead SOIC_N R-8

ADuM3211BRZ 1 1 10 50 4 −40°C to +105°C 8-Lead SOIC_N R-8

ADuM3211BRZ-RL7 1 1 10 50 4 −40°C to +105°C 8-Lead SOIC_N R-8

ADuM3211TRZ 1 1 10 50 4 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3211TRZ-RL7 1 1 10 50 4 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3211WARZ 1 1 1 50 6 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3211WARZ-RL7 1 1 1 50 6 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3211WBRZ 1 1 10 50 4 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3211WBRZ-RL7 1 1 10 50 4 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3211WCRZ 1 1 25 50 4 −40°C to +125°C 8-Lead SOIC_N R-8

ADuM3211WCRZ-RL7 1 1 25 50 4 −40°C to +125°C 8-Lead SOIC_N R-8

1 Z = RoHS Compliant Part.

2 W = Qualified for Automotive Applications.

AUTOMOTIVE PRODUCTS

The ADuM3210W/ADuM3211W models are available with controlled manufacturing to support the quality and reliability requirements

of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore,

designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for

use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and

to obtain the specific Automotive Reliability reports for these models.

registered trademarks are the property of their respective owners.

D06866-0-10/15(K)