LM185-ADJ, LM285-ADJ, LM385-ADJ
www.ti.com
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
LM185/LM285/LM385 Adjustable Micropower Voltage References
Check for Samples: LM185-ADJ,LM285-ADJ,LM385-ADJ
Careful design of the LM185 has made the device
1FEATURES tolerant of capacitive loading, making it easy to use in
2• Adjustable from 1.24V to 5.30V almost any reference application. The wide dynamic
• Operating Current of 10μA to 20mA operating range allows its use with widely varying
supplies with excellent regulation.
• 1% and 2% Initial Tolerance
• 1ΩDynamic Impedance The extremely low power drain of the LM185 makes it
useful for micropower circuitry. This voltage reference
• Low Temperature Coefficient can be used to make portable meters, regulators or
general purpose analog circuitry with battery life
DESCRIPTION approaching shelf life. Further, the wide operating
The LM185/LM285/LM385 are micropower 3-terminal current allows it to replace older references with a
adjustable band-gap voltage reference diodes. tighter tolerance part.
Operating from 1.24 to 5.3V and over a 10μA to The LM185 is rated for operation over a −55°C to
20mA current range, they feature exceptionally low 125°C temperature range, while the LM285 is rated
dynamic impedance and good temperature stability. −40°C to 85°C and the LM385 0°C to 70°C. The
On-chip trimming is used to provide tight voltage LM185 is available in a hermetic TO package and a
tolerance. Since the LM185 band-gap reference uses LCCC package, while the LM285/LM385 are
only transistors and resistors, low noise and good available in a low-cost TO-92 package, as well as
long-term stability result. SOIC.
Connection Diagram
Figure 1. TO-92 Package Figure 2. TO Package
Bottom View Bottom View
Figure 3. SOIC Package Figure 4. 20-LCCC
Top View Top View
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Block Diagram
Typical Applications
Figure 5. 1.2V Reference
Figure 6. 5.0V Reference
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Absolute Maximum Ratings(1)(2)(3)
Reverse Current 30mA
Forward Current 10mA
Operating Temperature Range (4)
LM185 Series −55°C to 125°C
LM285 Series −40°C to 85°C
LM385 Series 0°C to 70°C
ESD Susceptibility (5) 2kV
Storage Temperature −55°C to 150°C
Soldering Information
TO-92 Package (10 sec.) 260°C
TO Package (10 sec.) 300°C
SOIC Package
Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
See An-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications
apply only for the test conditions listed.
(2) Refer to RETS185H for military specifications.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For elevated temperature operation, see Table 1 and Thermal Characteristics.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin.
Table 1. TJ(max) for Elevated Temperature Operation
DEVICE TJ(max) (°C)
LM185 150
LM285 125
LM385 100
Thermal Characteristics
Over operating free-air temperature range (unless otherwise noted)
Thermal Resistance TO-92 TO-46 SOIC
180°C/W (0.4″leads)
θJA (Junction to Ambient) 440°C/W 165°C/W
170°C/W (0.125″leads)
θJC (Junction to Case) N/A 80°C/W N/A
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Electrical Characteristics(1)
LM185, LM285 LM385
LM185BX, LM285 LM385
LM185BY LM385BX,
LM185B, LM385BY Units
Parameter Conditions LM285BX, (Limit)
Typ Typ
LM285BY
Tested Design Tested Design Tested Design Tested Design
Limit Limit Limit Limit Limit Limit Limit Limit
(2) (3) (2) (3) (2) (3) (2) (3)
Reference IR= 100μA 1.240 1.252 1.265 1.270 1.240 1.252 1.255 1.265 1.270 V (max)
Voltage 1.255
1.228 1.215 1.205 1.228 1.215 1.215 1.205 V (min)
1.215
Reference IMIN< IR< 1mA 0.2 1 1.5 11.5 0.2 1 1.5 11.5 mV
Voltage (max)
1mA < IR< 20mA 4 10 20 10 20 5 15 25 15 25
Change with
Current
Dynamic IR= 100μA, f =
Output 100Hz
Impedance IAC = 0.1 IRVOUT = 0.3 0.4 Ω
VREF
VOUT = 0.7 1
5.3V
Reference IR= 100μA
Voltage mV
Change with 1 3 6362 5 10 510 (max)
Output
Voltage
Feedback 13 20 25 20 25 16 30 35 30 35 nA (max)
Current
Minimum VOUT = VREF 6 9 10 910 7 11 13 11 13 μA
Operating (max)
VOUT = 5.3V 30 45 50 45 50 35 55 60 55 60
Current (see
curve)
Output IR= 100μA, 10Hz < f μVrms
Wideband < 10kHz
Noise VOUT = VREF 50 50
VOUT = 5.3V 170 170
Average IR= 100μA X Suffix 30 30
Temperature Y Suffix 50 50 ppm/°c
Coefficient (max)
All 150 150 150 150
(4) Others
Long Term IR= 100μA, T = 1000 20 20 ppm
Stability Hr,
TA= 25°C ± 0.1°C
(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA= TJ= 25°C. Unless otherwise
specified, all parameters apply for VREF < VOUT < 5.3V.
(2) Production tested.
(3) Not production tested. These limits are not to be used to calculate average outgoing quality levels.
(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures from TMIN
to TMAX, divided by TMAX −TMIN. The measured temperatures are −55, −40, 0, 25, 70, 85, 125°C.
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Typical Performance Characteristics
Temperature Drift of 3
Representative Units Feedback Current
Figure 7. Figure 8.
Minimum Operating Current Reverse Characteristics
Figure 9. Figure 10.
Reverse Characteristics Forward Characteristics
Figure 11. Figure 12.
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Output Noise Voltage Dynamic Output Impedance
Figure 13. Figure 14.
Response Time
Figure 15.
Temperature Coefficient Typical
LM185 (left), LM285 (center), LM385 (right)
Figure 16.
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
TYPICAL APPLICATIONS
Figure 17. Precision 10V Reference Figure 18. Low AC Noise Reference
Figure 19. 25V Low Current Shunt Regulator Figure 20. 200 mA Shunt Regulator
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
Figure 21. Series-Shunt 20 mA Regulator Figure 22. High Efficiency Low Power Regulator
Figure 23. Voltage Level Detector Figure 24. Voltage Level Detector
Figure 25. Fast Positive Clamp Figure 26. Bidirectional Clamp
2.4V + ΔVD1 ±2.4V
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
Figure 27. Bidirectional Adjustable Clamp Figure 28. Bidirectional Adjustable Clamp
±1.8V to ±2.4V ±2.4V to ±6V
Figure 29. Simple Floating Current Detector
Figure 30. Current Source
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SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
*D1 can be any LED, VF=1.5V to 2.2V at 3 mA. D1 may act as an indicator. D1 will be on if ITHRESHOLD falls below the
threshold current, except with I=O.
Figure 31. Precision Floating Current Detector
Figure 32. Centigrade Thermometer, 10mV/°C
Figure 33. Freezer Alarm
10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
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LM185-ADJ, LM285-ADJ, LM385-ADJ
SNVS741F –FEBRUARY 2000–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision E (April 2013) to Revision F Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 11
12 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM185BH ACTIVE TO NDV 3 1000 TBD Call TI Call TI -55 to 125 LM185BH
LM185BH/NOPB ACTIVE TO NDV 3 1000 Green (RoHS
& no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185BH
LM185H-2.5 ACTIVE TO NDU 2 1000 TBD Call TI Call TI -55 to 125 LM185H2.5
LM185H-2.5/NOPB ACTIVE TO NDU 2 1000 Green (RoHS
& no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 LM185H2.5
LM285BXZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285
BXZ
LM285BYM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285
BYM
LM285BYMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285
BYM
LM285BYZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285
BYZ
LM285M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285
M
LM285MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM -40 to 85 LM285
M
LM285Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN | CU SN N / A for Pkg Type -40 to 85 LM285
Z
LM385BM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385
BM
LM385BM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385
BM
LM385BMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385
BM
LM385BXZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385
BXZ
LM385BYZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385
BYZ
LM385BZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385
BZ
LM385M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
M
LM385M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385
M
LM385MX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385
M
LM385MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 LM385
M
LM385Z/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS
& no Sb/Br) SN | CU SN N / A for Pkg Type 0 to 70 LM385
Z
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 3
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM285BYMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM285MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385BMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM385MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM285BYMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM285MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM385BMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM385MX SOIC D 8 2500 367.0 367.0 35.0
LM385MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2
MECHANICAL DATA
NDU0002A
www.ti.com
H02A (Rev F)
MECHANICAL DATA
NDV0003H
www.ti.com
H03H (Rev F)
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