© Semiconductor Components Industries, LLC, 2000
October, 2020 − Rev. 3
1Publication Order Number:
NC7WZ00/D
TinyLogic UHS Dual
2-Input NAND Gate
NC7WZ00
Description
The NC7WZ00 is a dual 2−Input NAND Gate from
ON Semicoductor’s Ultra High Speed Series of TinyLogic. The
device is fabricated with advanced CMOS technology to achieve ultra
high speed with high output drive while maintaining low static power
dissipation over a broad VCC operating range. The device is specified
to operate over the 1.65 V to 5.5 V VCC operating range. The inputs
and output are high impedance when VCC is 0 V. Inputs tolerate
voltages up to 5.5 V independent of VCC operating voltage.
Features
•Space Saving US8 Surface Mount Package
•MicroPak™ Leadless Package
•Ultra High Speed: tPD 2.4 ns Typ. into 50 pF at 5 V VCC
•High Output Drive: ±24 mA at 3 V VCC
•Broad VCC Operating Range: 1.65 V − 5.5 V
•Matches the Performance of LCX when Operated at 3.3 V VCC
•Power Down High Impedance Inputs / Output
•Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation
•Proprietary Noise / EMI Reduction Circuitry Implemented
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
A2Y2
Figure 1. Logic Symbol
&Y1
A1
B2
B1
IEEE/IEC
&
WZ00
ALYW
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
www.onsemi.com
N6, WZ00 = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code Format
Z = Assembly Plant Code
A = Assembly Site
L = Wafer Lot Number
YW = Assembly Start Week
UQFN8
1.6X1.6, 0.5P
CASE 523AY
US8
CASE 846AN
N6KK
XYZ
NC7WZ00
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2
Pin Configurations
Figure 2. Connection Diagram (Top View)
AAA represents Product Code Top Mark − see ordering code
NOTE: Orientation of Top Mark determines Pin One location.
Read the top product code mark left to right, Pin One
is the lower left pin (see diagram).
Figure 3. Pin One Orientation Diagram
Pin One
AAA
Figure 4. Pad Assignments for MicroPak
(Top Thru View)
1
Y1
2
B2
3
A2
A1
7
B1
6
Y2
5
VCC 8 4 GND
A1VCC
1
2
3
8
7
6
45
B1Y1
Y2B2
GND A2
(Top View)
PIN DESCRIPTION
Pin Names Description
An, Bn Inputs
Yn Output
FUNCTION TABLE (Y = AB)
Inputs Output
A B Y
L L H
L H H
H L H
H H L
H = HIGH Logic Level
L = LOW Logic Level
NC7WZ00
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3
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
VCC Supply Voltage −0.5 6.5 V
VIN DC Input Voltage −0.5 6.5 V
VOUT DC Output Voltage −0.5 6.5 V
IIK DC Input Diode Current VIN < 0 V − −50 mA
IOK DC Output Diode Current VOUT < 0 V − −50 mA
IOUT DC Output Current −±50 mA
ICC / IGND DC VCC / GND Current −±100 mA
TSTG Storage Temperature −65 +150 °C
TJJunction Temperature Under Bias −150 °C
TLJunction Lead Temperature (Soldering, 10 Seconds) −260 °C
PDPower Dissipation in Still Air US8
MicroPak−8
−
−
500
539
mW
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Supply Voltage Operating 1.65 5.5 V
Supply Voltage Data Retention 1.5 5.5
VIN Input Voltage 0 5.5 V
VOUT Output Voltage 0 VCC V
TAOperating Temperature −40 +85 °C
tr, tfInput Rise and Fall Time VCC = 1.65 V ±0.15 V, 2.5 V ±0.2 V 0 20 ns/V
VCC = 3.3 V ±0.3 V 0 10
VCC = 5.0 V ±0.5 V 0 5
qJA Thermal Resistance US8
MicroPak−8
−
−
250
232
°C/W
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
NC7WZ00
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4
DC ELECTICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = −40 to +85°C
Unit
Min Typ Max Min Max
VIH HIGH Level Input
Voltage
1.65 − 1.95 0.65 VCC − − 0.65 VCC −V
2.3 − 5.5 0.70 VCC − − 0.70 VCC −
VIL LOW Level Input
Voltage
1.65 − 1.95 − − 0.35 VCC −0.35 VCC V
2.3 − 5.5 − − 0.30 VCC −0.30 VCC
VOH HIGH Level Output
Voltage
1.65 VIN = VIL IOH = −100 mA 1.55 1.65 −1.55 −V
2.3 2.2 2.3 −2.2 −
3.0 2.9 3.0 −2.9 −
4.5 4.4 4.5 −4.4 −
1.65 IOH = −4 mA 1.29 1.52 −1.69 −
2.3 IOH = −8 mA 1.9 2.15 −1.9 −
3.0 IOH = −16 mA 2.4 2.80 −2.4 −
3.0 IOH = −24 mA 2.3 2.68 −2.3 −
4.5 IOH = −32 mA 3.8 4.20 −3.8 −
VOL LOW Level Output
Voltage
1.65 VIN = VIH IOL = 100 mA−0.0 0.1 −0.1 V
2.3 −0.0 0.1 −0.1
3.0 −0.0 0.1 −0.1
4.5 −0.0 0.1 −0.1
1.65 IOL = 4 mA −0.08 0.24 −0.24
2.3 IOL = 8 mA −0.10 0.3 −0.3
3.0 IOL = 16 mA −0.15 0.4 −0.4
3.0 IOL = 24 mA −0.22 0.55 −0.55
4.5 IOL = 32 mA −0.22 0.55 −0.55
IIN Input Leakage Current 1.65 − 5.5 VIN = 5.5 V, GND − − ±0.1 −±1mA
IOFF Power Off Leakage
Current
0.0 VIN or VOUT = 5.5 V − − 1−10 mA
ICC Quiescent Supply
Current
1.65 − 5.5 VIN = 5.5 V, GND − − 1−10 mA
NC7WZ00
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5
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = −40 to +85°C
Unit
Min Typ Max Min Max
tPLH, tPHL Propagation Delay
(Figure 5, 7)
1.8 ±0.15 CL = 15 pF,
RL = 1 MW,
−5.3 9.6 −9.8 ns
2.5 ±0.2 −3.2 5.3 −5.7
3.3 ±0.3 −2.4 3.7 −4.0
5.0 ±0.5 −1.9 2.9 −3.2
3.3 ±0.3 CL = 50 pF,
RL = 500 W,
−3.0 4.6 −4.9
5.0 ±0.5 −2.4 3.6 −3.9
CIN Input Capacitance 0−2.5 − − − pF
CPD Power Dissipation Capacitance
(Figure 6)
3.3 (Note 2) −13 −− − pF
5.0 −17 −− −
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. (see Figure 6) CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
Figure 5. AC Test Circuit Figure 6. ICCD Test Circuit
tr = 3 ns
50%
50%
90%
10%
90%
10%
INPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
50%
50%
tPLH tPHL
tW
Figure 7. AC Waveforms
Input = AC Waveform; tr = tf = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%.
CL includes load and stray capacitance
Input PRR = 1.0 MHz, tW = 500 ns
A
VCC
INPUT
VCC
CL
INPUT OUTPUT
RL
NC7WZ00
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6
ORDERING INFORMATION
Order Number Top Mark Package Shipping
†
NC7WZ00K8X WZ00 8−Lead US8, JEDEC MO−187, Variation CA
3.1 mm Wide
3000 / Tape & Reel
NC7WZ00L8X N6 8−Lead MicroPak, 1.6 mm Wide 5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
3. All packages are lead free per JEDEC: J−STD−020B standard.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
UQFN8 1.6X1.6, 0.5P
CASE 523AY
ISSUE O
DATE 31 AUG 2016
C
SEATING
PLANE
0.05 C
SIDE VIEW
0.05 C
AB
2X
1.60
1.60
0.05 C
TOP VIEW
PIN#1 IDENT
NOTES:
A. PACKAGE CONFORMS TO JEDEC MO−255
VARIATION UAAD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
0.025±0.025
4
123
567
80.30±0.05
(0.15)
(0.20)
0.30±0.05
0.05 C
0.50±0.05
BOTTOM VIEW
1.60±0.05
1.60±0.05
0.50
0.20±0.05 (8X)
1.00±0.05
0.30±0.05 (7X)
0.10 C A B
0.05 C
(0.20)3X
(0.09)
DETAIL A
DETAIL A
SCALE : 2X
(0.10)
RECOMMENDED
LAND PATTERN
1.60
0.45
(2X)
0.40
(6X)
1.61
0.25
(8X)
0.50
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13591G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
UQFN8 1.6X1.6, 0.5P
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
US8
CASE 846AN
ISSUE O
DATE 31 DEC 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13778G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
US8
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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1
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PUBLICATION ORDERING INFORMATION
TECHNICAL SUPPORT
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Phone: 011 421 33 790 2910
LITERATURE FULFILLMENT:
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