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LMZ10505
SNVS633K –JANUARY 2010–REVISED APRIL 2019
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Product Folder Links: LMZ10505
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 7
7 Detailed Description............................................ 10
7.1 Overview................................................................. 10
7.2 Functional Block Diagram....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 13
8 Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application.................................................. 14
8.3 System Examples ................................................... 20
9 Power Supply Recommendations...................... 23
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Examples................................................... 24
10.3 Estimate Power Dissipation and Thermal
Considerations......................................................... 27
10.4 Power Module SMT Guidelines ............................ 28
11 Device and Documentation Support................. 29
11.1 Device Support...................................................... 29
11.2 Documentation Support ........................................ 29
11.3 Receiving Notification of Documentation Updates 29
11.4 Community Resources.......................................... 29
11.5 Trademarks........................................................... 31
11.6 Electrostatic Discharge Caution............................ 31
11.7 Glossary................................................................ 31
12 Mechanical, Packaging, and Orderable
Information........................................................... 31
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision J (June 2016) to Revision K Page
• Editorial changes only; no change to technical data ............................................................................................................. 1
Changes from Revision I (September 2015) to Revision J Page
• Changed language of WEBENCH list item; added additional content and links for WEBENCH further in data sheet ......... 1
• Updated Equation 1 ............................................................................................................................................................. 10
Changes from Revision H (October 2013) to Revision I Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
Changes from Revision G (April 2013) to Revision H Page
• Deleted 10 mils....................................................................................................................................................................... 4
• Changed 10 mils................................................................................................................................................................... 23
• Changed 10 mils................................................................................................................................................................... 27
• Added Power Module SMT Guidelines................................................................................................................................. 28