NPN-Silizium-Fototransistor in SMT-Gehause mit Linse Silicon NPN Phototransistor in SMT-Package with lens Lead (Pb) Free Product - RoHS Compliant SFH 3219 Vorlaufige Daten / Preliminary Data OS-PCN-2010-033-A. To be used for design-in Wesentliche Merkmale Features * TOPLED mit Linse * Speziell geeignet fur Anwendungen im Bereich von 430 nm bis 1150 nm * Hohe Linearitat * Fur alle Lotverfahren geeignet * Gehausegleich mit SFH 4209, SFH 4219, SFH 4289 * TOPLED with lens * Especially suitable for applications from 430 nm to 1150 nm * High linearity * Suitable for all soldering methods * Same package as SFH 4209, SFH 4219, SFH 4289 Anwendungen Applications * * * * * * * * Miniaturlichtschranken Industrieelektronik Messen/Steuern/Regeln" Sensorik Miniature photointerrupters Industrial electronics For control and drive circuits Sensor technology Typ Type Bestellnummer Ordering Code Fotostrom , (Ee=0,1mW/cm2,=950nm VCE = 5 V) Photocurrent Ipce (A) SFH 3219 Q65110A2651 > 63 2010-07-08 1 SFH 3219 Grenzwerte Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Kollektor-Emitterspannung Collector-emitter voltage VCE 35 V Kollektorstrom Collector current IC 15 mA Kollektorspitzenstrom, < 10 s Collector surge current ICS 75 mA Verlustleistung, TA = 25 C Total power dissipation Ptot 165 mW Warmewiderstand fur Montage auf PC-Board Thermal resistance for mounting on pcb RthJA 450 K/W 2010-07-08 2 SFH 3219 Kennwerte (TA = 25 C, = 950 nm) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der max. Fotoempfindlichkeit Wavelength of max. sensitivity S max 990 nm Spektraler Bereich der Fotoempfindlichkeit S = 10% von Smax Spectral range of sensitivity S = 10% of Smax 430 ... 1150 nm Bestrahlungsempfindliche Flache ( 220 m) Radiant sensitive area A 0.038 mm2 Abmessung der Chipflache Dimensions of chip area LxB LxW 0.45 x 0.45 mm x mm Halbwinkel Half angle 25 Grad deg. Kapazitat, VCE = 0 V, f = 1 MHz, E = 0 Capacitance CCE 5.0 pF Dunkelstrom Dark current VCE = 20 V, E = 0 ICEO 1 ( 50) nA Fotostrom Photo current Ee = 0.1 mW/cm2, VCE = 5 V IPCE 63 A Anstiegszeit/Abfallzeit Rise and fall time IC = 1 mA, VCC = 5 V, RL = 1 k tr, tf 7 s Kollektor-Emitter-Sattigungsspannung Collector-emitter saturation voltage IC = 20 A Ee = 0.1 mW/cm2 VCEsat 150 mV 2010-07-08 3 SFH 3219 Directional Characteristics Srel = f () 40 30 20 10 0 50 OHF00006 1.0 0.8 0.6 60 0.4 70 0.2 80 0 90 100 1.0 2010-07-08 0.8 0.6 0.4 0 20 40 60 80 4 100 120 SFH 3219 Relative Spectral Sensitivity Srel = f () Srel OHF00207 100 % Photocurrent IPCE = f (VCE), Ee = Parameter OHF00007 10 0 mA PCE 0.4 mW cm 2 0.2 mW cm 2 0.1 mW cm 2 PCE OHF01524 1.6 PCE 25 1.4 80 70 60 10 -1 50 Photocurrent IPCE /IPCE25 = f (TA), VCE = 5 V 1.2 1.0 0.8 40 0.6 30 0.4 20 0.2 10 0 400 500 600 700 800 900 10 -2 nm 1100 0 5 10 15 20 Total Power Dissipation Ptot = f (TA) OHF00871 200 P tot 25 Capacitance CCE = f (VCE), f = 1 MHz, E = 0 OHF01528 5.0 mW C CE pF 160 4.0 0 -25 30 V 35 V CE 0 25 50 75 C 100 TA Dark Current ICEO = f (VCE), E = 0 OHF01527 10 1 nA CEO 10 0 3.5 120 3.0 10 -1 2.5 80 2.0 1.5 10 -2 40 1.0 0.5 0 0 20 40 60 80 C 100 TA 0 10 -2 10 -1 10 0 Dark Current ICEO = f (TA), VCE = 5 V, E = 0 OHF01530 10 3 nA CEO 10 2 10 1 10 0 10 -1 -25 0 2010-07-08 25 50 75 C 100 TA 5 10 1 V 10 2 V CE 10 -3 0 5 10 15 20 25 30 V 35 V CE SFH 3219 Mazeichnung Package Outlines 3.5 (0.138) max. 2.1 (0.083) 1.7 (0.067) 3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 0.9 (0.035) o2.60 (0.102) 0.5 (0.020) Package marking 1.1 (0.043) 3.7 (0.146) 3.3 (0.130) 3.4 (0.134) 3.0 (0.118) 2 o2.55 (0.100) 0.7 (0.028) 2.1 (0.083) 1 0.6 (0.024) 0.4 (0.016) 0.1 (0.004) (typ.) 0.18 (0.007) 0.13 (0.005) GEOY6956 Mae in mm (inch) / Dimensions in mm (inch). Gehause / Package TOPLED(R) mit Linse (P-LCC-2) / TOPLED(R) with lens (P-LCC-2) Anschlussbelegung pin configuration 1 = Emitter / emitter 2 = Kollektor / collector Farbe Color wei white 2010-07-08 6 SFH 3219 Empfohlenes Lotpaddesign Recommended Solderpad Design 2.6 (0.102) 4.5 (0.177) 1.5 (0.059) 1.5 (0.059) 4.5 (0.177) 2.6 (0.102) Padgeometrie fur verbesserte Warmeableitung Lotstopplack Solder resist Paddesign for improved heat dissipation Cu-Flache > 16 mm 2 Cu-area > 16 mm 2 OHLPY970 Lotbedingungen Soldering Conditions Reflow Lotprofil fur bleifreies Loten Reflow Soldering Profile for lead free soldering Vorbehandlung nach JEDEC Level 2 Preconditioning acc. to JEDEC Level 2 (nach J-STD 020-D.01) (acc. to J-STD 020-D.01) OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 250 s 300 t 2010-07-08 7 SFH 3219 Pb-Free (SnAgCu) Assembly Profile Feature Recommendation Max. Ratings Ramp-up Rate to Preheat*) 25C to 150C 2C / sec 3C / sec Time ts from TSmin to TSmax (150C to 200C 100s min. 60sec max. 120sec Ramp-up Rate to Peak*) TSmax to TP 2C / sec 3C / sec Liquidus Temperture TL 217C Time tL above TL 80sec max. 100sec Peak Temperature TP 245C max. 250C Time tP within 5C of the specified peak temperature TP - 5K 20sec min. 10sec max. 30sec Ramp-down Rate* TP to 100C 3C / sec 4C / sec maximum Time 25C to Peak temperature max. 8 min. All temperatures refer to the center of the package, measured on the top of the component * slope calculation T/t: t max. 5 sec; fulfillment for the whole T-range Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 t 2010-07-08 8 s 250 SFH 3219 Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2010-07-08 9