© Semiconductor Components Industries, LLC, 2011
May, 2011 Rev. 17
1Publication Order Number:
MC74VHC1G07/D
MC74VHC1G07
Single Non-Inverting Buffer
with Open Drain Output
The MC74VHC1G07 is an advanced high speed CMOS buffer with
open drain output fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer and an open drain output which provides the capability to set the
output switching level. This allows the MC74VHC1G07 to be used to
interface any 2 V to 5.5 V circuit to circuits of any voltage between
1.5 V and 7 V using an external resistor and power supply.
The MC74VHC1G07 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage.
Features
High Speed: tPD = 3.8 ns (Typ) at VCC = 5 V
Low Internal Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Power Down Protection Provided on Inputs
Pin and Function Compatible with Other Standard Logic Families
Chip Complexity: FETs = 105
These Devices are PbFree and are RoHS Compliant
VCC
NC
IN A
OUT Y
GND
IN A OUT Y
1
OVT
Figure 1. Pinout
Figure 2. Logic Symbol
1
2
34
5
FUNCTION TABLE
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
L
H
A Input Y Output
L
Z
PIN ASSIGNMENT
1
2
3 GND
NC
IN A
4
5V
CC
OUT Y
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MARKING
DIAGRAMS
V7 = Device Code
M = Date Code*
G= PbFree Package
SC88A / SOT353 / SC70
DF SUFFIX
CASE 419A
TSOP5 / SOT23 / SC59
DT SUFFIX
CASE 483
V7 M G
G
1
5
V7 M G
G
M
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
MC74VHC1G07
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage 0.5 to 7.0 V
VIN DC Input Voltage 0.5 to +7.0 V
VOUT DC Output Voltage 0.5 to 7.0 V
IIK DC Input Diode Current 20 mA
IOK DC Output Diode Current VOUT GND; VOUT VCC 20 mA
IOUT DC Output Sink Current, per Pin 25 mA
ICC DC Supply Current, VCC and GND Pin +50 mA
TSTG Storage Temperature Range 65 to 150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction Temperature Under Bias 150 °C
qJA Thermal Resistance SC705/SC88A/SOT353 (Note 1)
SOT235/TSOP5/SC595
350
230
°C/W
PDPower Dissipation in Still Air at 85°CSC705/SC88A/SOT353
SOT235/TSOP5/SC595
150
200
mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
VESD ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
2000
200
N/A
V
ILATCHUP Latchup Performance Above VCC and Below GND at 125°C (Note 5) 500 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A.
3. Tested to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC DC Supply Voltage 2.0 5.5 V
VIN DC Input Voltage 0.0 5.5 V
VOUT DC Output Voltage 0.0 7.0 V
TAOperating Temperature Range 55 125 °C
tr , tfInput Rise and Fall Time VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
0
0
100
20
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °CTime, Hours Time, Years
80 1,032,200 117.8
90 419,300 47.9
100 178,700 20.4
110 79,600 9.4
120 37,000 4.2
130 17,800 2.0
140 8,900 1.0
1
1 10 100 1000
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Figure 3. Failure Rate vs. Time Junction Temperature
NORMALIZED FAILURE RATE
TIME, YEARS
TJ = 130°C
TJ = 120°C
TJ = 110°C
TJ = 100°C
TJ = 90°C
TJ = 80°C
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3
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Test Conditions
VCC
(V)
TA = 255C TA 855C*555C TA 1255C
Unit
Min Typ Max Min Max Min Max
VIH Minimum
HighLevel
Input Voltage
2.0
3.0
4.5
5.5
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
V
VIL Maximum
LowLevel
Input Voltage
2.0
3.0
4.5
5.5
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
V
VOL Maximum
LowLevel
Output Voltage
VIN = VIH or VIL
VIN = VIL
IOL = 50 mA
2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
VIN = VIL
IOL = 4 mA
IOL = 8 mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
ILKG ZState Output
Leakage Current
VIN = VIH
VOUT = VCC or GND
5.5 0.25 2.5 5.0 mA
IIN Maximum Input
Leakage Current
VIN = 5.5 V or GND 0 to 5.5 0.1 1.0 1.0 mA
ICC Maximum
Quiescent Supply
Current
VIN = VCC or GND 5.5 1.0 20 40 mA
IOFF Power OffOutput
Leakage Current
VOUT = 5.5 V
VIN = 5.5 V
0 0.25 2.5 5 mA
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
TA = 255C TA 855C*555C TA 1255C
Symbol Parameter Test Conditions Min Typ Max Min Max Min Max Unit
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tPZL
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
Maximum Output
Enable Time,
Input A to Y
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 3.3 0.3 V CL = 15 pF
RL = RI = 500 WCL = 50 pF
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
5.0
7.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
7.1
10.6
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
8.5
12.0
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
10.0
14.5
ÎÎ
ÎÎ
ÎÎ
ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 5.0 0.5 V CL = 15 pF
RL = RI = 500 WCL = 50 pF
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
3.8
5.3
ÎÎÎ
ÎÎÎ
ÎÎÎ
5.5
7.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
6.5
8.5
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
8.0
10.0
ÎÎ
ÎÎ
ÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
tPLZ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
Maximum Output
Disable Time
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 3.3 0.3 V CL = 50 pF
RL = RI = 500 W
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
7.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
10.6
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
12.0
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
14.5
ÎÎ
ÎÎ
ÎÎ
ns
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
VCC = 5.0 0.5 V CL = 50 pF
RL = RI = 500 W
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
5.3
ÎÎÎ
ÎÎÎ
7.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
8.5
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
10.0
ÎÎ
ÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
CIN
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
Maximum Input
Capacitance
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
4
ÎÎÎ
ÎÎÎ
ÎÎÎ
10
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
10
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
10
ÎÎ
ÎÎ
ÎÎ
pF
Typical @ 25°C, VCC = 5.0 V
CPD Power Dissipation Capacitance (Note 6) 18 pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the noload dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
MC74VHC1G07
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4
Figure 4. Switching Waveforms
RL
1.5 V to 7 V
OVT
VCC
A
50%
50% VCC
tPZL tPLZ
VOL 0.3 V
VCC
GND
HIGH
IMPEDANCE
*Includes jig and probe capacitance.
RL = R1 = 500 W
Figure 5. Test Circuit
Figure 6. Output Voltage Mismatch Application
A
Y
RL
A
CL*
R1
VCC 2
F = (A B) (CD) E
VCC
2.2 kW
220 W
Figure 7. Complex Boolean Functions
Figure 8. LED Driver Figure 9. GTL Driver
A
B
C
D
E
MC74VHC1G01
MC74VHC1G03
MC74VHC1G07
A
1
2
3
5
4
VCC VCC
RLED
MC74VHC1G07
A
3.3 V 1.5 V
GTL
ORDERING INFORMATION
Device Package Shipping
MC74VHC1G07DFT1G SC705/SC88A/SOT353
(PbFree)
3000/Tape & Reel
MC74VHC1G07DFT2G SC705/SC88A/SOT353
(PbFree)
MC74VHC1G07DTT1G SOT235/TSOP5/SC595
(PbFree)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC74VHC1G07
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5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A01 OBSOLETE. NEW STANDARD
419A02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
B
SC88A (SC705/SOT353)
CASE 419A02
ISSUE K
MC74VHC1G07
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6
PACKAGE DIMENSIONS
TSOP5
CASE 48302
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM MIN MAX
MILLIMETERS
A3.00 BSC
B1.50 BSC
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
L1.25 1.55
M0 10
S2.50 3.00
123
54 S
A
G
L
B
D
H
C
J
__
0.7
0.028
1.0
0.039
mm
inches
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
T
SEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
MC74VHC1G07/D
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