2011-2015 Microchip Technology Inc. DS40001615C-page 1
PIC12(L)F1501
High-Performance RISC CPU:
• C Compiler Optimized Architecture
• Only 49 Instructions
• Operating Speed:
- DC – 20 MHz clock input
- DC – 200 ns instruction cycle
• Interrupt Capability with Automatic Context
Saving
• 16-Level Deep Hardware Stack with Optional
Overflow/Underflow Reset
• Direct, Indirect and Relative Addressing modes:
- Two full 16-bit File Select Registers (FSRs)
- FSRs can read program and data memory
Flexible Oscil lator Structure:
• 16 MHz Internal Oscillator Block:
- Factory calibrated to ±1%, typical
- Software selectable frequency range from
16 MHz to 31 kHz
• 31 kHz Low-Power Internal Oscillator
• Three External Clock modes up to 20 MHz
S pecial Microcontr oller Features:
• Operating Voltage Range:
- 1.8V to 3.6V (PIC12LF1501)
- 2.3V to 5.5V (PIC12F1501)
• Self-Programmable under Software Control
• Power-on Reset (POR)
• Power-up Timer (PWRT)
• Programmable Low-Power Brown-out Reset
(LPBOR)
• Extended Watchdog Timer (WDT):
- Programmable period from 1 ms to 256s
• Programmable Code Protection
• In-Circuit Serial Programming™ (ICSP™) via Two
Pins
• Enhanced Low-Voltage Programming (LVP)
• In-Circuit Debug (ICD) via Two Pins
• Power-Saving Sleep mode:
- Low-Power Sleep mode
- Low-Power BOR (LPBOR)
• Integrated Temperature Indicator
• 128 Bytes High-Endurance Flash
- 100,000 write Flash endurance (minimum)
Memory:
• 1 Kwords Linear Program Memory Addressing
• 64 bytes Linear Data Memory Addressing
• High-Endurance Flash Data Memory (HEF)
- 128 bytes if nonvolatile data storage
- 100k erase/write cycles
eXtreme Low-Power (XLP) Features
(PIC12LF1501):
• Sleep Current:
- 20 nA @ 1.8V, typical
• Watchdog Timer Current:
- 260 nA @ 1.8V, typical
• Operating Current:
-30 A/MHz @ 1.8V, typical
Peripheral Feat ures:
• Analog-to-Digital Converter (ADC):
- 10-bit resolution
- Four external channels
- Three internal channels:
- Fixed Voltage Reference
- Digital-to-Analog Converter (DAC)
- Temperature Indicator channel
- Auto acquisition capability
- Conversion available during Sleep
• 5-Bit Digital-to-Analog Converter (DAC):
- Output available externally
- Positive reference selection
- Internal connections to comparators and ADC
• One Comparator:
- Rail-to-rail inputs
- Power mode control
- Software controllable hysteresis
• Voltage Reference:
- 1.024V Fixed Voltage Reference (FVR) with
1x, 2x and 4x Gain output levels
• Six I/O Pins (1 Input-only Pin):
- High current sink/source 25 mA/25 mA
- Individually programmable weak pull-ups
- Individually programmable
Interrupt-on-Change (IOC) pins
• Timer0: 8-Bit Timer/Counter with 8-Bit
Programmable Prescaler
• Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Gate Input mode
• Timer2: 8-Bit Timer/Counter with 8-Bit Period
Register, Prescaler and Postscaler
• Four 10-bit PWM modules
8-Pin Flash, 8- Bit Micro contr ollers
PIC12(L)F1501
DS40001615C-page 2 2011-2015 Microchip Technology Inc.
Peripheral Feat ures (Continued):
• Two Configurable Logic Cell (CLC) modules:
- 16 selectable input source signals
- Four inputs per module
- Software control of combinational/sequential
logic/state/clock functions
- AND/OR/XOR/D Flop/D Latch/SR/JK
- Inputs from external and internal sources
- Output available to pins and peripherals
- Operation while in Sleep
• Numerically Controlled Oscillator (NCO):
- 20-bit accumulator
- 16-bit increment
- True linear frequency control
- High-speed clock input
- Selectable Output modes
- Fixed Duty Cycle (FDC) mode
- Pulse Frequency (PF) mode
• Complementary Waveform Generator (CWG):
- Eight selectable signal sources
- Selectable falling and rising edge dead-band
control
- Polarity control
- Four auto-shutdown sources
- Multiple input sources: PWM, CLC, NCO
PIC12(L)F1501/PIC16(L)F150X FAMILY TYPES
Device
Data Sheet Index
Program Memory
Flash (words)
Data SRAM
(bytes)
I/O’s(2)
10-bit ADC (ch)
Comparators
DAC
Timers
(8/16-bit)
PWM
EUSART
MSSP (I2C/SPI)
CWG
CLC
NCO
Debug(1)
XLP
(1) 1024 64 6 4 1 1 2/1 4 — — 1 2 1 H —
PIC16(L)F1503 (2) 2048 128 12 8 2 1 2/1 4 — 1 1 2 1 H —
PIC16(L)F1507 (3) 2048 128 18 12 — — 2/1 4 — — 1 2 1 H —
(4) 4096 256 18 12 2 1 2/1 4 1 1 1 4 1 I/H Y
(4) 8192 512 18 12 2 1 2/1 4 1 1 1 4 1 I/H Y
Note 1: Debugging Methods: (I) - Integrated on Chip; (H) - using Debug Header; (E) - using Emulation Header.
2: One pin is input-only.
Dat a Shee t Index: (Unshaded devices are described in this document.)
1: DS40001615 PIC12(L)F1501 Data Sheet, 8-Pin Flash, 8-bit Microcontrollers.
2: DS40001607 PIC16(L)F1503 Data Sheet, 14-Pin Flash, 8-bit Microcontrollers.
3: DS40001586 PIC16(L)F1507 Data Sheet, 20-Pin Flash, 8-bit Microcontrollers.
4: DS40001609 PIC16(L)F1508/9 Data Sheet, 20-Pin Flash, 8-bit Microcontrollers.
Note: For other small form-factor package availability and marking information, please visit
http://www.microchip.com/packaging or contact your local sales office.
2011-2015 Microchip Technology Inc. DS40001615C-page 3
PIC12(L)F1501
PIN DIAGRAMS
Note: See Table 1 for location of all peripheral functions.
1
2
3
4
8
7
6
5
VDD
RA5
RA4
MCLR/VPP/RA3
VSS
RA0/ICSPDAT
RA1/ICSPCLK
RA2
8-pin PDIP, SOIC, MSOP, DFN, UDFN
PIC12(L)F1501
DS40001615C-page 4 2011-2015 Microchip Technology Inc.
PIN ALLOCATION TABLE
TABLE 1: 8-PIN ALLOCATION TABLE (PIC12(L)F1501)
I/O
8-Pin PDIP/SOIC/MSOP/DFN/UDFN
ADC
Reference
Comparator
Timer
CWG
NCO
CLC
PWM
Interrupt
Pull-Up
Basic
RA0 7AN0 DACOUT1 C1IN+ —CWG1B —CLC2IN1 PWM2 IOC YICSPDAT
RA1 6AN1 VREF+C1IN0- — — NCO1 CLC2IN0 —IOC YICSPCLK
RA2 5AN2 DACOUT2 C1OUT T0CKI CWG1A
CWG1FLT
—CLC1 PWM1 INT
IOC
Y —
RA3 4 — — — T1G(1) — — CLC1IN0 —IOC YMCLR
VPP
RA4 3AN3 —C1IN1- T1G CWG1B(1) CLC1(1) PWM3 IOC YCLKOUT
RA5 2 — — — T1CKI CWG1A(1) NCO1(1)
NCO1CLK
CLC1IN1
CLC2
PWM4 IOC YCLKIN
VDD 1 — — — — — — — — — — VDD
VSS 8— — — — — — — — —— VSS
Note 1: Alternate pin function selected with the APFCON (Register 11-1) register.
2011-2015 Microchip Technology Inc. DS40001615C-page 5
PIC12(L)F1501
TABLE OF CONTENTS
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Enhanced Mid-Range CPU ........................................................................................................................................................ 11
3.0 Memory Organization ................................................................................................................................................................. 13
4.0 Device Configuration.................................................................................................................................................................. 37
5.0 Oscillator Module........................................................................................................................................................................ 42
6.0 Resets ........................................................................................................................................................................................ 51
7.0 Interrupts .................................................................................................................................................................................... 59
8.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 72
9.0 Watchdog Timer (WDT) ............................................................................................................................................................. 75
10.0 Flash Program Memory Control ................................................................................................................................................. 79
11.0 I/O Ports ..................................................................................................................................................................................... 95
12.0 Interrupt-On-Change ................................................................................................................................................................ 101
13.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 105
14.0 Temperature Indicator Module ................................................................................................................................................. 107
15.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 109
16.0 5-Bit Digital-to-Analog Converter (DAC) Module...................................................................................................................... 123
17.0 Comparator Module.................................................................................................................................................................. 126
18.0 Timer0 Module ......................................................................................................................................................................... 133
19.0 Timer1 Module with Gate Control............................................................................................................................................. 136
20.0 Timer2 Module ......................................................................................................................................................................... 147
21.0 Pulse-Width Modulation (PWM) Module .................................................................................................................................. 150
22.0 Configurable Logic Cell (CLC).................................................................................................................................................. 156
23.0 Numerically Controlled Oscillator (NCO) Module ..................................................................................................................... 172
24.0 Complementary Waveform Generator (CWG) Module ............................................................................................................ 179
25.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 191
26.0 Instruction Set Summary .......................................................................................................................................................... 193
27.0 Electrical Specifications............................................................................................................................................................ 207
28.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 230
29.0 Development Support............................................................................................................................................................... 265
30.0 Packaging Information.............................................................................................................................................................. 269
Appendix A: Data Sheet Revision History.......................................................................................................................................... 286
The Microchip Web Site..................................................................................................................................................................... 287
Customer Change Notification Service .............................................................................................................................................. 287
Customer Support .............................................................................................................................................................................. 287
Product Identification System ............................................................................................................................................................ 288
PIC12(L)F1501
DS40001615C-page 6 2011-2015 Microchip Technology Inc.
TO OUR VALUED CUSTOMERS
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The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
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An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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2011-2015 Microchip Technology Inc. DS40001615C-page 7
PIC12(L)F1501
1.0 DEVICE OVERVIEW
The block diagram of these devices are shown in
Figure 1-1, the available peripherals are shown in
Table 1-1, and the pinout descriptions are shown in
Table 1-2.
TABLE 1-1: DEVICE PERIPHERAL SUMMARY
Peripheral
PIC12(L)F1501
PIC16(L)F1503
PIC16(L)F1507
PIC16(L)F1508
PIC16(L)F1509
Analog-to-Digital Converter (ADC) ●●●●●
Complementary Wave Generator (CWG) ●●●●●
Digital-to-Analog Converter (DAC) ●● ● ●
Enhanced Universal
Synchronous/Asynchronous Receiver/
Transmitter (EUSART)
● ●
Fixed Voltage Reference (FVR) ●●●●●
Numerically Controlled Oscillator (NCO) ●●●●●
Temperature Indicator ●●●●●
Comparators
C1 ● ● ● ●
C2 ● ● ●
Configurable Logic Cell (CLC)
CLC1 ●●●●●
CLC2 ●●●●●
CLC3 ● ●
CLC4 ● ●
Master Synchronous Serial Ports
MSSP1 ● ● ●
PWM Modules
PWM1 ●●●●●
PWM2 ●●●●●
PWM3 ●●●●●
PWM4 ●●●●●
Timers
Timer0 ●●●●●
Timer1 ●●●●●
Timer2 ●●●●●
PIC12(L)F1501
DS40001615C-page 8 2011-2015 Microchip Technology Inc.
FIGURE 1-1: PIC12(L)F1501 BLOCK DIAGRAM
CLKOUT
CLKIN
RAM
CPU
(Note 3)
Timing
Generation
INTRC
Oscillator
MCLR
Program
Flash Memory
FVRDAC
ADC
10-bit
Temp
Indicator
C1TMR0TMR1TMR2
PWM1PWM2PWM3PWM4CLC1CLC2NCO1CWG1
PORTA
Rev. 10-000039C
12/16/2013
Note 1: See applicable chapters for more information on peripherals.
2: See Table 1-1 for peripherals on specific devices.
3: See Figure 2-1.
2011-2015 Microchip Technology Inc. DS40001615C-page 9
PIC12(L)F1501
TABLE 1-2: PIC12(L)F1501 PINOUT DESCRIPTION
Name Function Input
Type Output
Type Description
RA0/AN0/C1IN+/DACOUT1/
CWG1B(1)/CLC2IN1/PWM2/
ICSPDAT
RA0 TTL CMOS General purpose I/O.
AN0 AN — A/D Channel input.
C1IN+ AN — Comparator positive input.
DACOUT1 — AN Digital-to-Analog Converter output.
CWG1B — CMOS CWG complementary output.
CLC2IN1 ST — Configurable Logic Cell source input.
PWM2 — CMOS Pulse Width Module source output.
ICSPDAT ST CMOS ICSP™ Data I/O.
RA1/AN1/VREF+/C1IN0-/
NCO1(1)/CLC2IN0/ICSPCLK
RA1 TTL CMOS General purpose I/O.
AN1 AN — A/D Channel input.
VREF+ AN — A/D Positive Voltage Reference input.
C1IN0- AN — Comparator negative input.
NCO1 — CMOS Numerically Controlled Oscillator output.
CLC2IN0 ST — Configurable Logic Cell source input.
ICSPCLK ST — ICSP™ Programming Clock.
RA2/AN2/C1OUT/DACOUT2/
T0CKI/INT/PWM1/CLC1(1)/
CWG1A(1)/CWG1FLT
RA2 ST CMOS General purpose I/O.
AN2 AN — A/D Channel input.
C1OUT — CMOS Comparator output.
DACOUT2 — AN Digital-to-Analog Converter output.
T0CKI ST — Timer0 clock input.
INT ST — External interrupt.
PWM1 — CMOS Pulse Width Module source output.
CLC1 — CMOS Configurable Logic Cell source output.
CWG1A — CMOS CWG complementary output.
CWG1FLT ST — Complementary Waveform Generator Fault input.
RA3/CLC1IN0/VPP/T1G(1)/MCLR RA3 TTL — General purpose input.
CLC1IN0 ST — Configurable Logic Cell source input.
VPP HV — Programming voltage.
T1G ST — Timer1 Gate input.
MCLR ST — Master Clear with internal pull-up.
RA4/AN3/C1IN1-/CWG1B(1)/
CLC1(1)/PWM3/CLKOUT/T1G(1) RA4 TTL CMOS General purpose I/O.
AN3 AN — A/D Channel input.
C1IN1- AN — Comparator negative input.
CWG1B — CMOS CWG complementary output.
CLC1 — CMOS Configurable Logic Cell source output.
PWM3 — CMOS Pulse Width Module source output.
CLKOUT — CMOS FOSC/4 output.
T1G ST — Timer1 Gate input.
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C
HV = High Voltage XTAL = Crystal levels
Note 1: Alternate pin function selected with the APFCON (Register 11-1) register.
PIC12(L)F1501
DS40001615C-page 10 2011-2015 Microchip Technology Inc.
RA5/CLKIN/T1CKI/CWG1A(1)/
NCO1(1)/NCO1CLK/CLC1IN1/
CLC2/PWM4
RA5 TTL CMOS General purpose I/O.
CLKIN CMOS — External clock input (EC mode).
T1CKI ST — Timer1 clock input.
CWG1A — CMOS CWG complementary output.
NCO1 ST — Numerically Controlled Oscillator output.
NCO1CLK ST — Numerically Controlled Oscillator Clock source input.
CLC1IN1 ST —Configurable Logic Cell source input.
CLC2 — CMOS Configurable Logic Cell source output.
PWM4 — CMOS Pulse Width Module source output.
VDD VDD Power — Positive supply.
VSS VSS Power — Ground reference.
TABLE 1-2: PIC12(L)F1501 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type Output
Type Description
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C
HV = High Voltage XTAL = Crystal levels
Note 1: Alternate pin function selected with the APFCON (Register 11-1) register.
2011-2015 Microchip Technology Inc. DS40001615C-page 11
PIC12(L)F1501
2.0 ENHANCED MID-RANGE CP U
This family of devices contain an enhanced mid-range
8-bit CPU core. The CPU has 49 instructions. Interrupt
capability includes automatic context saving. The
hardware stack is 16 levels deep and has Overflow and
Underflow Reset capability. Direct, Indirect, and
Relative addressing modes are available. Two File
Select Registers (FSRs) provide the ability to read
program and data memory.
• Automatic Interrupt Context Saving
• 16-level Stack with Overflow and Underflow
• File Select Registers
• Instruction Set
FIGURE 2-1: CORE BLOCK DIAGRAM
15
15
15
15
8
8
8
12
14
7
5
3
Program Counter
MUX
Addr MUX
16-Level Stack
(15-bit)
Program Memory
Read (PMR)
Instruction Reg
Configuration
FSR0 Reg
FSR1 Reg
BSR Reg
STATUS Reg
RAM
WReg
Power-up
Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
Instruction
Decode and
Control
Timing
Generation
Internal
Oscillator
Block
ALU
Flash
Program
Memory
MUX
Data Bus
Program
Bus
Direct Addr
Indirect
Addr
RAM Addr
CLKIN
CLKOUT
VDD VSS
Rev. 10-000055A
7/30/2013
12
12
PIC12(L)F1501
DS40001615C-page 12 2011-2015 Microchip Technology Inc.
2.1 Automatic Interrupt Context
Saving
During interrupts, certain registers are automatically
saved in shadow registers and restored when returning
from the interrupt. This saves stack space and user
code. See Section 7.5 “Automatic Context Saving”,
for more information.
2.2 16-Level Stack with Overflow and
Underflow
These devices have a hardware stack memory 15 bits
wide and 16 words deep. A Stack Overflow or Under-
flow will set the appropriate bit (STKOVF or STKUNF)
in the PCON register, and if enabled, will cause a soft-
ware Reset. See Section 3.5 “St ack” for more details.
2.3 File Select Regis ters
There are two 16-bit File Select Registers (FSR).
FSRs can access all file registers and program mem-
ory, which allows one Data Pointer for all memory.
When an FSR points to program memory, there is one
additional instruction cycle in instructions using INDF
to allow the data to be fetched. General purpose mem-
ory can now also be addressed linearly, providing the
ability to access contiguous data larger than 80 bytes.
There are also new instructions to support the FSRs.
See Section 3.6 “Indirect Addressing” for more
details.
2.4 Instruction Set
There are 49 instructions for the enhanced mid-range
CPU to support the features of the CPU. See Section
26.0 “Instruction Set Summary” for more details.
2011-2015 Microchip Technology Inc. DS40001615C-page 13
PIC12(L)F1501
3.0 MEMORY ORGANIZATION
These devices contain the following types of memory:
• Program Memory
- Configuration Words
- Device ID
-User ID
- Flash Program Memory
• Data Memory
- Core Registers
- Special Function Registers
- General Purpose RAM
- Common RAM
The following features are associated with access and
control of program memory and data memory:
• PCL and PCLATH
•Stack
• Indirect Addressing
3.1 Program Memory Organization
The enhanced mid-range core has a 15-bit program
counter capable of addressing a 32K x 14 program
memory space. Table 3-1 shows the memory sizes
implemented. Accessing a location above these
boundaries will cause a wrap-around within the
implemented memory space. The Reset vector is at
0000h and the interrupt vector is at 0004h (See
Figure 3-1).
3.2 High-Endurance Flash
This device has a 128 byte section of high-endurance
program Flash memory (PFM) in lieu of data EEPROM.
This area is especially well suited for nonvolatile data
storage that is expected to be updated frequently over
the life of the end product. See Section 10.2 “Flash
Program Me mor y Ove rview ” for more information on
writing data to PFM. See Section 3.2.1.2 “Indirect
Read with FSR” for more information about using the
FSR registers to read byte data stored in PFM.
TABLE 3-1: DEVICE SIZES AND ADDRESSES
Device Program Memor y
Space (Words) Last Program Memory
Address High-Endurance Flash
Memory Address Range (1)
PIC12LF1501
PIC12F1501 1,024 03FFh 0380h-03FFh
Note 1: High-endurance Flash applies to low byte of each address in the range.
PIC12(L)F1501
DS40001615C-page 14 2011-2015 Microchip Technology Inc.
FIGURE 3-1: PROGRAM MEMORY MAP
AND STACK FOR
PIC12(L)F1501
3.2.1 READING PROGRAM MEMORY AS
DATA
There are two methods of accessing constants in
program memory. The first method is to use tables of
RETLW instructions. The second method is to set an
FSR to point to the program memory.
3.2.1.1 RETLW Instruction
The RETLW instruction can be used to provide access
to tables of constants. The recommended way to create
such a table is shown in Example 3-1.
EXAMPL E 3-1: RETLW INSTRUCTION
The BRW instruction makes this type of table very
simple to implement. If your code must remain portable
with previous generations of microcontrollers, then the
BRW instruction is not available so the older table read
method must be used.
Stack Level 0
Stack Level 15
Stack Level 1
Reset Vector
PC<14:0>
Interrupt Vector
Page 0
Rollover to Page 0
Rollover to Page 0
0000h
0004h
0005h
03FFh
0400h
7FFFh
CALL, CALLW
RETURN, RETLW
Interrupt, RETFIE
On-chip
Program
Memory
15
Rev. 10-000040D
7/30/2013
constants
BRW ;Add Index in W to
;program counter to
;select data
RETLW DATA0 ;Index0 data
RETLW DATA1 ;Index1 data
RETLW DATA2
RETLW DATA3
my_function
;… LOTS OF CODE…
MOVLW DATA_INDEX
call constants
;… THE CONSTANT IS IN W
2011-2015 Microchip Technology Inc. DS40001615C-page 15
PIC12(L)F1501
3.2.1.2 Indirect Read with FSR
The program memory can be accessed as data by set-
ting bit 7 of the FSRxH register and reading the match-
ing INDFx register. The MOVIW instruction will place the
lower eight bits of the addressed word in the W register.
Writes to the program memory cannot be performed via
the INDF registers. Instructions that access the pro-
gram memory via the FSR require one extra instruction
cycle to complete. Example 3-2 demonstrates access-
ing the program memory via an FSR.
The HIGH operator will set bit<7> if a label points to a
location in program memory.
EXAMPLE 3-2: ACCESSING PROGRAM
MEMORY VIA FSR
constants
DW DATA0 ;First constant
DW DATA1 ;Second constant
DW DATA2
DW DATA3
my_function
;… LOTS OF CODE…
MOVLW DATA_INDEX
ADDLW LOW constants
MOVWF FSR1L
MOVLW HIGH constants;MSb sets
automatically
MOVWF FSR1H
BTFSC STATUS, C ;carry from ADDLW?
INCF FSR1h, f ;yes
MOVIW 0[FSR1]
;THE PROGRAM MEMORY IS IN W
PIC12(L)F1501
DS40001615C-page 16 2011-2015 Microchip Technology Inc.
3.3 Data Memory Organization
The data memory is partitioned in 32 memory banks
with 128 bytes in a bank. Each bank consists of
(Figure 3-2):
• 12 core registers
• 20 Special Function Registers (SFR)
• Up to 80 bytes of General Purpose RAM (GPR)
• 16 bytes of common RAM
The active bank is selected by writing the bank number
into the Bank Select Register (BSR). Unimplemented
memory will read as ‘0’. All data memory can be
accessed either directly (via instructions that use the
file registers) or indirectly via the two File Select
Registers (FSR). See Section 3.6 “Indirect
Addressing” for more information.
Data memory uses a 12-bit address. The upper five bits
of the address define the Bank address and the lower
seven bits select the registers/RAM in that bank.
3.3.1 CORE REGISTERS
The core registers contain the registers that directly
affect the basic operation. The core registers occupy
the first 12 addresses of every data memory bank
(addresses x00h/x08h through x0Bh/x8Bh). These
registers are listed below in Ta ble 3- 2 . For detailed
information, see Tab le 3 -4 .
TABLE 3-2: CORE REGISTERS
Addresses BANKx
x00h or x80h INDF0
x01h or x81h INDF1
x02h or x82h PCL
x03h or x83h STATUS
x04h or x84h FSR0L
x05h or x85h FSR0H
x06h or x86h FSR1L
x07h or x87h FSR1H
x08h or x88h BSR
x09h or x89h WREG
x0Ah or x8Ah PCLATH
x0Bh or x8Bh INTCON
2011-2015 Microchip Technology Inc. DS40001615C-page 17
PIC12(L)F1501
3.3.1.1 STATUS Register
The STATUS register, shown in Register 3-1, contains:
• the arithmetic status of the ALU
• the Reset status
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not
affecting any Status bits (Refer to Section
26.0 “Instruction Set Summary”).
Note 1: The C and DC bits operate as Borrow
and Digit Borrow out bits, respectively, in
subtraction.
REGISTER 3-1: STAT US : STATUS REGIST ER
U-0 U-0 U-0 R-1/q R-1/q R/W-0/u R/W-0/u R/W-0/u
— — — TO PD ZDC
(1) C(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7-5 Unimplemented: Read as ‘0’
bit 4 TO: Time-Out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Power-Down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order
bit of the source register.
PIC12(L)F1501
DS40001615C-page 18 2011-2015 Microchip Technology Inc.
3.3.2 SPECIAL FUNCTION REGISTER
The Special Function Registers are registers used by
the application to control the desired operation of
peripheral functions in the device. The Special Function
Registers occupy the 20 bytes after the core registers of
every data memory bank (addresses x0Ch/x8Ch
through x1Fh/x9Fh). The registers associated with the
operation of the peripherals are described in the appro-
priate peripheral chapter of this data sheet.
3.3.3 GENERAL PURPOSE RAM
There are up to 80 bytes of GPR in each data memory
bank. The Special Function Registers occupy the 20
bytes after the core registers of every data memory
bank (addresses x0Ch/x8Ch through x1Fh/x9Fh).
3.3.3.1 Linear Access to GPR
The general purpose RAM can be accessed in a
non-banked method via the FSRs. This can simplify
access to large memory structures. See Section
3.6.2 “Linear Data Memory” for more information.
3.3.4 COMMON RAM
There are 16 bytes of common RAM accessible from all
banks.
FIGURE 3-2: BANKED MEMORY
PARTITIONING
Memory Region7-bit Bank Offset
00h
0Bh
0Ch
1Fh
20h
6Fh
7Fh
70h
Core Registers
(12 bytes)
Special Function Registers
(20 bytes maximum)
General Purpose RAM
(80 bytes maximum)
Common RAM
(16 bytes)
Rev. 10-000041A
7/30/2013
2011-2015 Microchip Technology Inc. Status DS40001615C-page 19
PIC12(L)F1501
3.3.5 DEVICE MEMORY MAPS
The memory maps for Bank 0 through Bank 31 are shown in the tables in this section.
TABLE 3-3: PIC12(L)F1501 MEMORY MAP
BANK 0 BANK 1 BANK 2 BANK 3 BANK 4 BANK 5 BANK 6 BANK 7
000h
Core Registers
(Table 3-2)
080h
Core Registers
(Table 3-2)
100h
Core Registers
(Table 3-2)
180h
Core Registers
(Table 3-2)
200h
Core Registers
(Table 3-2)
280h
Core Registers
(Table 3-2)
300h
Core Registers
(Table 3-2)
380h
Core Registers
(Table 3-2)
00Bh 08Bh 10Bh 18Bh 20Bh 28Bh 30Bh 38Bh
00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch WPUA 28Ch — 30Ch — 38Ch —
00Dh — 08Dh — 10Dh — 18Dh — 20Dh — 28Dh — 30Dh — 38Dh —
00Eh —08Eh—10Eh—18Eh—20Eh—28Eh—30Eh—38Eh—
00Fh —08Fh—10Fh—18Fh—20Fh—28Fh—30Fh—38Fh—
010h —090h—110h—190h—210h—290h—310h — 390h —
011h PIR1 091h PIE1 111h CM1CON0 191h PMADRL 211h —291h—311h —391h IOCAP
012h PIR2 092h PIE2 112h CM1CON1 192h PMADRH 212h —292h—312h —392h IOCAN
013h PIR3 093h PIE3 113h — 193h PMDATL 213h —293h—313h —393h IOCAF
014h —094h—114h— 194h PMDATH 214h —294h—314h —394h —
015h TMR0 095h OPTION_REG 115h CMOUT 195h PMCON1 215h —295h—315h —395h —
016h TMR1L 096h PCON 116h BORCON 196h PMCON2 216h —296h — 316h — 396h —
017h TMR1H 097h WDTCON 117h FVRCON 197h VREGCON 217h —297h — 317h — 397h —
018h T1CON 098h —118h
DACCON0 198h —218h—298h — 318h — 398h —
019h T1GCON 099h OSCCON 119h DACCON1 199h —219h —299h— 319h — 399h —
01Ah TMR2 09Ah OSCSTAT 11Ah —19Ah—21Ah —29Ah—31Ah—39Ah—
01Bh PR2 09BhADRESL11Bh —19Bh—21Bh —29Bh—31Bh—39Bh —
01Ch T2CON 09Ch ADRESH 11Ch — 19Ch —21Ch — 29Ch — 31Ch —39Ch —
01Dh — 09Dh ADCON0 11Dh APFCON 19Dh —21Dh —29Dh —31Dh —39Dh —
01Eh —09Eh ADCON1 11Eh —19Eh —21Eh —29Eh —31Eh —39Eh —
01Fh —09Fh ADCON2 11Fh —19Fh—21Fh —29Fh —31Fh —39Fh —
020h
General Purpose
Register
48 Bytes
0A0h
Unimplemented
Read as ‘0’
120h
Unimplemented
Read as ‘0’
1A0h
Unimplemented
Read as ‘0’
220h
Unimplemented
Read as ‘0’
2A0h
Unimplemented
Read as ‘0’
320h
Unimplemented
Read as ‘0’
3A0h
Unimplemented
Read as ‘0’
04Fh
0EFh
050h Unimplemented
Read as ‘0’
06Fh 16Fh 1EFh 26Fh 2EFh 36Fh 3EFh
070h
Common RAM
0F0h Common RAM
(Accesses
70h – 7Fh)
170h Common RAM
(Accesses
70h – 7Fh)
1F0h Common RAM
(Accesses
70h – 7Fh)
270h Common RAM
(Accesses
70h – 7Fh)
2F0h Common RAM
(Accesses
70h – 7Fh)
370h Common RAM
(Accesses
70h – 7Fh)
3F0h Common RAM
(Accesses
70h – 7Fh)
07Fh 0FFh 17Fh 1FFh 27Fh 2FFh 37Fh 3FFh
Legend: = Unimplemented data memory locations, read as ‘0’
PIC12(L)F1501
DS40001615C-page 20 Status 2011-2015 Microchip Technology Inc.
TABLE 3-3: PIC12(L)F1501 MEMORY MAP (CONTINUED)
BANK 8 BANK 9 BANK 10 BANK 11 BANK 12 BANK 13 BANK 14 BANK 15
400h
40Bh
Core Registers
(Table 3-2)
480h
48Bh
Core Registers
(Table 3-2)
500h
50Bh
Core Registers
(Table 3-2)
580h
58Bh
Core Registers
(Table 3-2)
600h
60Bh
Core Registers
(Table 3-2)
680h
68Bh
Core Registers
(Table 3-2)
700h
70Bh
Core Registers
(Table 3-2)
780h
78Bh
Core Registers
(Table 3-2)
40Ch — 48Ch — 50Ch — 58Ch — 60Ch — 68Ch — 70Ch — 78Ch —
40Dh — 48Dh — 50Dh — 58Dh — 60Dh — 68Dh — 70Dh — 78Dh —
40Eh —48Eh—50Eh—58Eh—60Eh—68Eh—70Eh—78Eh—
40Fh —48Fh—50Fh—58Fh—60Fh—68Fh—70Fh—78Fh—
410h —490h—510h—590h—610h—690h— 710h — 790h —
411h —491h—511h—591h— 611h PWM1DCL 691h CWG1DBR 711h — 791h —
412h —492h—512h—592h— 612h PWM1DCH 692h CWG1DBF 712h — 792h —
413h —493h—513h—593h— 613h PWM1CON 693h CWG1CON0 713h — 793h —
414h —494h—514h—594h— 614h PWM2DCL 694h CWG1CON1 714h — 794h —
415h —495h—515h—595h— 615h PWM2DCH 695h CWG1CON2 715h — 795h —
416h —496h—516h—596h— 616h PWM2CON 696h — 716h — 796h —
417h —497h—517h—597h— 617h PWM3DCL 697h — 717h — 797h —
418h — 498h NCO1ACCL 518h —598h— 618h PWM3DCH 698h — 718h — 798h —
419h — 499h NCO1ACCH 519h —599h— 619h PWM3CON 699h — 719h — 799h —
41Ah — 49Ah NCO1ACCU 51Ah —59Ah— 61Ah PWM4DCL 69Ah —71Ah—79Ah—
41Bh — 49Bh NCO1INCL 51Bh —59Bh— 61Bh PWM4DCH 69Bh —71Bh—79Bh—
41Ch — 49Ch NCO1INCH 51Ch — 59Ch — 61Ch PWM4CON 69Ch — 71Ch — 79Ch —
41Dh — 49Dh — 51Dh — 59Dh — 61Dh — 69Dh — 71Dh — 79Dh —
41Eh — 49Eh NCO1CON 51Eh —59Eh—61Eh—69Eh—71Eh—79Eh—
41Fh — 49Fh NCO1CLK 51Fh —59Fh—61Fh—69Fh—71Fh—79Fh—
420h
Unimplemented
Read as ‘0’
4A0h
Unimplemented
Read as ‘0’
520h
Unimplemented
Read as ‘0’
5A0h
Unimplemented
Read as ‘0’
620h
Unimplemented
Read as ‘0’
6A0h
Unimplemented
Read as ‘0’
720h
Unimplemented
Read as ‘0’
7A0h
Unimplemented
Read as ‘0’
46Fh 4EFh 56Fh 5EFh 66Fh 6EFh 76Fh 7EFh
470h
Common RAM
(Accesses
70h – 7Fh)
4F0h
Common RAM
(Accesses
70h – 7Fh)
570h
Common RAM
(Accesses
70h – 7Fh)
5F0h
Common RAM
(Accesses
70h – 7Fh)
670h
Common RAM
(Accesses
70h – 7Fh)
6F0h
Common RAM
(Accesses
70h – 7Fh)
770h
Common RAM
(Accesses
70h – 7Fh)
7F0h
Common RAM
(Accesses
70h – 7Fh)
47Fh 4FFh 57Fh 5FFh 67Fh 6FFh 77Fh 7FFh
BANK 16 BANK 17 BANK 18 BANK 19 BANK 20 BANK 21 BANK 22 BANK 23
800h
80Bh
Core Registers
(Table 3-2 )
880h
88Bh
Core Registers
(Table 3-2)
900h
90Bh
Core Registers
(Table 3-2)
980h
98Bh
Core Registers
(Table 3-2)
A00h
A0Bh
Core Registers
(Table 3-2)
A80h
A8Bh
Core Registers
(Table 3-2)
B00h
B0Bh
Core Registers
(Table 3-2)
B80h
B8Bh
Core Registers
(Table 3-2)
80Ch
Unimplemented
Read as ‘0’
88Ch
Unimplemented
Read as ‘0’
90Ch
Unimplemented
Read as ‘0’
98Ch
Unimplemented
Read as ‘0’
A0Ch
Unimplemented
Read as ‘0’
A8Ch
Unimplemented
Read as ‘0’
B0Ch
Unimplemented
Read as ‘0’
B8Ch
Unimplemented
Read as ‘0’
86Fh 8EFh 96Fh 9EFh A6Fh AEFh B6Fh BEFh
870h Common RAM
(Accesses
70h – 7Fh)
8F0h Common RAM
(Accesses
70h – 7Fh)
970h Common RAM
(Accesses
70h – 7Fh)
9F0h Common RAM
(Accesses
70h – 7Fh)
A70h Common RAM
(Accesses
70h – 7Fh)
AF0h Common RAM
(Accesses
70h – 7Fh)
B70h Common RAM
(Accesses
70h – 7Fh)
BF0h Common RAM
(Accesses
70h – 7Fh)
87Fh 8FFh 97Fh 9FFh A7Fh AFFh B7Fh BFFh
Legend: = Unimplemented data memory locations, read as ‘0’
2011-2015 Microchip Technology Inc. Status DS40001615C-page 21
PIC12(L)F1501
TABLE 3-3: PIC12(L)F1501 MEMORY MAP (CONTINUED)
PIC12(L)F1501
DS40001615C-page 22 Status 2011-2015 Microchip Technology Inc.
TABLE 3-3: PIC12(L)F1501 MEMORY MAP (CONTINUED)
Bank 30
F0Ch —
F0Dh —
F0Eh —
F0Fh CLCDATA
F10h CLC1CON
F11h CLC1POL
F12h CLC1SEL0
F13h CLC1SEL1
F14h CLC1GLS0
F15h CLC1GLS1
F16h CLC1GLS2
F17h CLC1GLS3
F18h CLC2CON
F19h CLC2POL
F1Ah CLC2SEL0
F1Bh CLC2SEL1
F1Ch CLC2GLS0
F1Dh CLC2GLS1
F1Eh CLC2GLS2
F1Fh CLC2GLS3
F20h Unimplemented
Read as ‘0’
F6Fh
Bank 31
F8Ch
FE3h
Unimplemented
Read as ‘0’
FE4h STATUS_SHAD
FE5h WREG_SHAD
FE6h BSR_SHAD
FE7h PCLATH_SHAD
FE8h FSR0L_SHAD
FE9h FSR0H_SHAD
FEAh FSR1L_SHAD
FEBh FSR1H_SHAD
FECh —
FEDh STKPTR
FEEh TOSL
FEFh TOSH
Legend: = Unimplemented data memory locations, read as ‘0’.
2011-2015 Microchip Technology Inc. DS40001615C-page 23
PIC12(L)F1501
3.3.6 CORE FUNCTION REGISTERS
SUMMARY
The Core Function registers listed in Tabl e 3-4 can be
addressed from any Bank.
TABLE 3-4: CORE FUNCTION REGISTERS SUMMARY
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Value on all
other R esets
Bank 0-31
x00h or
x80h INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory
(not a physical register) xxxx xxxx uuuu uuuu
x01h or
x81h INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory
(not a physical register) xxxx xxxx uuuu uuuu
x02h or
x82h PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000
x03h or
x83h STATUS — — —TOPD ZDCC---1 1000 ---q quuu
x04h or
x84h FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu
x05h or
x85h FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000
x06h or
x86h FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu
x07h or
x87h FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000
x08h or
x88h BSR — — —BSR<4:0>---0 0000 ---0 0000
x09h or
x89h WREG Working Register 0000 0000 uuuu uuuu
x0Ah or
x8Ah PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000
x0Bh or
x8Bh INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
PIC12(L)F1501
DS40001615C-page 24 2011-2015 Microchip Technology Inc.
TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY
Address Nam e Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bi t 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Bank 0
00Ch PORTA —— RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --xx xxxx
00Dh
to
010h
—Unimplemented — —
011h PIR1 TMR1GIF ADIF ———— TMR2IF TMR1IF 00-- --00 00-- --00
012h PIR2 ——C1IF—— NCO1IF — — --0- -0-- --0- -0--
013h PIR3 — — — — — — CLC2IF CLC1IF ---- --00 ---- --00
014h —Unimplemented — —
015h TMR0 Holding Register for the 8-bit Timer0 Count xxxx xxxx uuuu uuuu
016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Count xxxx xxxx uuuu uuuu
017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Count xxxx xxxx uuuu uuuu
018h T1CON TMR1CS<1:0> T1CKPS<1:0> — T1SYNC —TMR1ON0000 -0-0 uuuu -u-u
019h T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
DONE
T1GVAL T1GSS<1:0> 0000 0x00 uuuu uxuu
01Ah TMR2 Timer2 Module Register 0000 0000 0000 0000
01Bh PR2 Timer2 Period Register 1111 1111 1111 1111
01Ch T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000
01Dh
to
01Fh
—Unimplemented — —
Bank 1
08Ch TRISA —— TRISA5 TRISA4 —(2) TRISA2 TRISA1 TRISA0 --11 1111 --11 1111
08Dh
to
090h
—Unimplemented — —
091h PIE1 TMR1GIE ADIE ———— TMR2IE TMR1IE 00-- --00 00-- --00
092h PIE2 ——C1IE—— NCO1IE — — --0- -0-- --0- -0--
093h PIE3 — — — — — — CLC2IE CLC1IE ---- --00 ---- --00
094h —Unimplemented — —
095h
OPTION_REG
WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 1111 1111 1111 1111
096h PCON STKOVF STKUNF —RWDTRMCLR RI POR BOR 00-1 11qq qq-q qquu
097h WDTCON —— WDTPS<4:0> SWDTEN --01 0110 --01 0110
098h —Unimplemented — —
099h OSCCON — IRCF<3:0> —SCS<1:0>-011 1-00 -011 1-00
09Ah OSCSTAT — — —HFIOFR—— LFIOFR HFIOFS ---0 --00 ---q --qq
09Bh ADRESL ADC Result Register Low xxxx xxxx uuuu uuuu
09Ch ADRESH ADC Result Register High xxxx xxxx uuuu uuuu
09Dh ADCON0 — CHS<4:0>
GO/DONE
ADON -000 0000 -000 0000
09Eh ADCON1 ADFM ADCS<2:0> — —
ADPREF<1:0>
0000 --00 0000 --00
09Fh ADCON2 TRIGSEL<3:0> — — — — 0000 ---- 0000 ----
Bank 2
10Ch LATA ——LATA5LATA4— LATA2 LATA1 LATA0 --xx -xxx --uu -uuu
10Dh
to
110h
—Unimplemented — —
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’.
Note 1: PIC12F1501 only.
2: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001615C-page 25
PIC12(L)F1501
111h CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 0000 -100 0000 -100
112h
to
114h
—Unimplemented — —
115h CMOUT — — — — — — —MC1OUT---- --00 ---- --00
116h BORCON SBOREN BORFS — — — — — BORRDY 10-- ---q uu-- ---u
117h FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 0q00 0000 0q00 0000
118h DAC1CON0 DACEN — DACOE1 DACOE2 —DACPSS — — 0-00 -0-- 0-00 -0--
119h DAC1CON1 — — — DACR<4:0> ---0 0000 ---0 0000
11Ah
to
11Ch
—Unimplemented — —
11Dh APFCON CWG1BSEL CWGA1SEL —— T1GSEL — CLC1SEL NCO1SEL 00-- 0-00 00-- 0-00
11Eh —Unimplemented — —
11Fh —Unimplemented — —
Bank 3
18Ch ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 ---1 -111 ---1 -111
18Dh
to
190h
—Unimplemented — —
191h PMADRL Flash Program Memory Address Register Low Byte 0000 0000 0000 0000
192h PMADRH —(2) Flash Program Memory Address Register High Byte 1000 0000 1000 0000
193h PMDATL Flash Program Memory Read Data Register Low Byte xxxx xxxx uuuu uuuu
194h PMDATH —— Flash Program Memory Read Data Register High Byte --xx xxxx --uu uuuu
195h PMCON1 —(2) CFGS LWLO FREE WRERR WREN WR RD 1000 x000 1000 q000
196h PMCON2 Flash Program Memory Control Register 2 0000 0000 0000 0000
197h VREGCON(1) — — ————VREGPMReserved ---- --01 ---- --01
198h
to
19Fh
—Unimplemented — —
TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’.
Note 1: PIC12F1501 only.
2: Unimplemented, read as ‘1’.
PIC12(L)F1501
DS40001615C-page 26 2011-2015 Microchip Technology Inc.
Bank 4
20Ch WPUA —— WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 --11 1111 --11 1111
20Dh
to
21Fh
—Unimplemented — —
Bank 5
28Ch
to
29Fh
—Unimplemented — —
Bank 6
30Ch
to
31Fh
—Unimplemented — —
Bank 7
38Ch
to
390h
—Unimplemented — —
391h IOCAP —— IOCAP5 IOCAP4 IOCAP3
IOCAP2 IOCAP1 IOCAP0
--00 0000 --00 0000
392h IOCAN — — IOCAN5 IOCAN4 IOCAN3
IOCAN2 IOCAN1 IOCAN0
--00 0000 --00 0000
393h IOCAF —— IOCAF5 IOCAF4 IOCAF3
IOCAF2 IOCAF1 IOCAF0
--00 0000 --00 0000
394h
to
39Fh
—Unimplemented — —
Bank 8
40Ch
to
41Fh
—Unimplemented — —
Bank 9
48Ch
to
497h
—Unimplemented — —
498h NCO1ACCL NCO1ACC<7:0> 0000 0000 0000 0000
499h NCO1ACCH NCO1ACC<15:8> 0000 0000 0000 0000
49Ah NCO1ACCU NCO1ACC<19:16> 0000 0000 0000 0000
49Bh NCO1INCL NCO1INC<7:0> 0000 0001 0000 0001
49Ch NCO1INCH NCO1INC<15:8> 0000 0000 0000 0000
49Dh —Unimplemented — —
49Eh NCO1CON N1EN N1OE N1OUT N1POL — — —N1PFM0000 ---0 0000 ---0
49Fh NCO1CLK N1PWS<2:0> — — —N1CKS<1:0>0000 --00 0000 --00
TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Nam e Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bi t 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’.
Note 1: PIC12F1501 only.
2: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001615C-page 27
PIC12(L)F1501
Bank 10
50Ch
to
51Fh
—Unimplemented — —
Bank 11
58Ch
to
59Fh
—Unimplemented — —
Bank 12
60Ch
to
610h
—Unimplemented — —
611h PWM1DCL PWM1DCL<7:6> — — — — — — 00-- ---- 00-- ----
612h PWM1DCH PWM1DCH<7:0> xxxx xxxx uuuu uuuu
613h PWM1CON0 PWM1EN PWM1OE PWM1OUT PWM1POL — — — — 0000 ---- 0000 ----
614h PWM2DCL PWM2DCL<7:6> — — — — — — 00-- ---- 00-- ----
615h PWM2DCH PWM2DCH<7:0> xxxx xxxx uuuu uuuu
616h PWM2CON0 PWM2EN PWM2OE PWM2OUT PWM2POL — — — — 0000 ---- 0000 ----
617h PWM3DCL PWM3DCL<7:6> — — — — — — 00-- ---- 00-- ----
618h PWM3DCH PWM3DCH<7:0> xxxx xxxx uuuu uuuu
619h PWM3CON0 PWM3EN PWM3OE PWM3OUT PWM3POL — — — — 0000 ---- 0000 ----
61Ah PWM4DCL PWM4DCL<7:6> — — — — — — 00-- ---- 00-- ----
61Bh PWM4DCH PWM4DCH<7:0> xxxx xxxx uuuu uuuu
61Ch PWM4CON0 PWM4EN PWM4OE PWM4OUT PWM4POL — — — — 0000 ---- 0000 ----
61Dh
to
61Fh
—Unimplemented — —
Bank 13
68Ch
to
690h
—Unimplemented — —
691h CWG1DBR ——CWG1DBR<5:0>--00 0000 --00 0000
692h CWG1DBF ——CWG1DBF<5:0>--xx xxxx --xx xxxx
693h CWG1CON0 G1EN G1OEB G1OEA G1POLB G1POLA ——G1CS00000 0--0 0000 0--0
694h CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> — G1IS<2:0> 0000 -000 0000 -000
695h CWG1CON2 G1ASE G1ARSEN ——— G1ASDSC1 G1ASDSFLT G1ASDSCLC2 00-- -000 00-- -000
696h
to
69Fh
—Unimplemented — —
TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’.
Note 1: PIC12F1501 only.
2: Unimplemented, read as ‘1’.
PIC12(L)F1501
DS40001615C-page 28 2011-2015 Microchip Technology Inc.
Banks 14-29
x0Ch/
x8Ch
—
x1Fh/
x9Fh
—Unimplemented — —
Bank 30
F0Ch
to
F0Eh
—Unimplemented — —
F0Fh CLCDATA — — — — — — MLC2OUT MLC1OUT ---- --00 ---- --00
F10h CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN LC1MODE<2:0> 0000 0000 0000 0000
F11h CLC1POL LC1POL — — — LC1G4POL LC1G3POL LC1G2POL LC1G1POL 0--- xxxx 0--- uuuu
F12h CLC1SEL0 — LC1D2S<2:0> — LC1D1S<2:0> -xxx -xxx -uuu -uuu
F13h CLC1SEL1 — LC1D4S<2:0> — LC1D3S<2:0> -xxx -xxx -uuu -uuu
F14h CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N xxxx xxxx uuuu uuuu
F15h CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N xxxx xxxx uuuu uuuu
F16h CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N xxxx xxxx uuuu uuuu
F17h CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N xxxx xxxx uuuu uuuu
F18h CLC2CON LC2EN LC2OE LC2OUT LC2INTP LC2INTN LC2MODE<2:0> 0000 0000 0000 0000
F19h CLC2POL LC2POL — — — LC2G4POL LC2G3POL LC2G2POL LC2G1POL 0--- xxxx 0--- uuuu
F1Ah CLC2SEL0 — LC2D2S<2:0> — LC2D1S<2:0> -xxx -xxx -uuu -uuu
F1Bh CLC2SEL1 — LC2D4S<2:0> — LC2D3S<2:0> -xxx -xxx -uuu -uuu
F1Ch CLC2GLS0 LC2G1D4T LC2G1D4N LC2G1D3T LC2G1D3N LC2G1D2T LC2G1D2N LC2G1D1T LC2G1D1N xxxx xxxx uuuu uuuu
F1Dh CLC2GLS1 LC2G2D4T LC2G2D4N LC2G2D3T LC2G2D3N LC2G2D2T LC2G2D2N LC2G2D1T LC2G2D1N xxxx xxxx uuuu uuuu
F1Eh CLC2GLS2 LC2G3D4T LC2G3D4N LC2G3D3T LC2G3D3N LC2G3D2T LC2G3D2N LC2G3D1T LC2G3D1N xxxx xxxx uuuu uuuu
F1Fh CLC2GLS3 LC2G4D4T LC2G4D4N LC2G4D3T LC2G4D3N LC2G4D2T LC2G4D2N LC2G4D1T LC2G4D1N xxxx xxxx uuuu uuuu
F20h
to
F6Fh
—Unimplemented — —
TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Nam e Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bi t 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’.
Note 1: PIC12F1501 only.
2: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001615C-page 29
PIC12(L)F1501
Bank 31
F8Ch
—
FE3h
—Unimplemented — —
FE4h STATUS_
SHAD
— — — — — Z_SHAD DC_SHAD C_SHAD ---- -xxx ---- -uuu
FE5h WREG_
SHAD
Working Register Shadow xxxx xxxx uuuu uuuu
FE6h BSR_
SHAD
— — — Bank Select Register Shadow ---x xxxx ---u uuuu
FE7h PCLATH_
SHAD
— Program Counter Latch High Register Shadow -xxx xxxx uuuu uuuu
FE8h FSR0L_
SHAD
Indirect Data Memory Address 0 Low Pointer Shadow xxxx xxxx uuuu uuuu
FE9h FSR0H_
SHAD
Indirect Data Memory Address 0 High Pointer Shadow xxxx xxxx uuuu uuuu
FEAh FSR1L_
SHAD
Indirect Data Memory Address 1 Low Pointer Shadow xxxx xxxx uuuu uuuu
FEBh FSR1H_
SHAD
Indirect Data Memory Address 1 High Pointer Shadow xxxx xxxx uuuu uuuu
FECh —Unimplemented — —
FEDh STKPTR — — — Current Stack Pointer ---1 1111 ---1 1111
FEEh TOSL Top-of-Stack Low byte xxxx xxxx uuuu uuuu
FEFh TOSH — Top-of-Stack High byte -xxx xxxx -uuu uuuu
TABLE 3-5: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved. Shaded locations are unimplemented, read as ‘0’.
Note 1: PIC12F1501 only.
2: Unimplemented, read as ‘1’.
PIC12(L)F1501
DS40001615C-page 30 2011-2015 Microchip Technology Inc.
3.4 PCL and PCLATH
The Program Counter (PC) is 15 bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<14:8>) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 3-3 shows the five
situations for the loading of the PC.
FIGURE 3-3: LOADING OF PC IN
DIFFERENT SITUATIONS
3.4.1 MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC<14:8> bits (PCH) to be replaced by the
contents of the PCLATH register. This allows the entire
contents of the program counter to be changed by
writing the desired upper seven bits to the PCLATH
register. When the lower eight bits are written to the
PCL register, all 15 bits of the program counter will
change to the values contained in the PCLATH register
and those being written to the PCL register.
3.4.2 COMPUTED GOTO
A computed GOTO is accomplished by adding an offset to
the program counter (ADDWF PCL). When performing a
table read using a computed GOTO method, care should
be exercised if the table location crosses a PCL memory
boundary (each 256-byte block). Refer to Application
Note AN556, “Implementing a Table Read” (DS00556).
3.4.3 COMPUTED FUNCTION CALLS
A computed function CALL allows programs to maintain
tables of functions and provide another way to execute
state machines or look-up tables. When performing a
table read using a computed function CALL, care
should be exercised if the table location crosses a PCL
memory boundary (each 256-byte block).
If using the CALL instruction, the PCH<2:0> and PCL
registers are loaded with the operand of the CALL
instruction. PCH<6:3> is loaded with PCLATH<6:3>.
The CALLW instruction enables computed calls by com-
bining PCLATH and W to form the destination address.
A computed CALLW is accomplished by loading the W
register with the desired address and executing CALLW.
The PCL register is loaded with the value of W and
PCH is loaded with PCLATH.
3.4.4 BRANCHING
The branching instructions add an offset to the PC.
This allows relocatable code and code that crosses
page boundaries. There are two forms of branching,
BRW and BRA. The PC will have incremented to fetch
the next instruction in both cases. When using either
branching instruction, a PCL memory boundary may be
crossed.
If using BRW, load the W register with the desired
unsigned address and execute BRW. The entire PC will
be loaded with the address PC + 1 + W.
If using BRA, the entire PC will be loaded with PC + 1 +,
the signed value of the operand of the BRA instruction.
78
6
14
0
0
411
0
60
14
78
60
014
15
014
15
014
PCL
PCL
PCL
PCL
PCL
PCH
PCH
PCH
PCH
PCH
PC
PC
PC
PC
PC
PCLATH
PCLATH
PCLATH
Instruction
with PCL as
Destination
GOTO,
CALL
CALLW
BRW
BRA
ALU result
OPCODE <10:0>
W
PC + W
PC + OPCODE <8:0>
Rev. 10-000042A
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2011-2015 Microchip Technology Inc. DS40001615C-page 31
PIC12(L)F1501
3.5 Stack
All devices have a 16-level x 15-bit wide hardware
stack (refer to Figures 3-4 through 3-7). The stack
space is not part of either program or data space. The
PC is PUSHed onto the stack when CALL or CALLW
instructions are executed or an interrupt causes a
branch. The stack is POPed in the event of a RETURN,
RETLW or a RETFIE instruction execution. PCLATH is
not affected by a PUSH or POP operation.
The stack operates as a circular buffer if the STVREN
bit is programmed to ‘0‘ (Configuration Words). This
means that after the stack has been PUSHed sixteen
times, the seventeenth PUSH overwrites the value that
was stored from the first PUSH. The eighteenth PUSH
overwrites the second PUSH (and so on). The
STKOVF and STKUNF flag bits will be set on an Over-
flow/Underflow, regardless of whether the Reset is
enabled.
3.5.1 ACCESSING THE STACK
The stack is available through the TOSH, TOSL and
STKPTR registers. STKPTR is the current value of the
Stack Pointer. TOSH:TOSL register pair points to the
TOP of the stack. Both registers are read/writable. TOS
is split into TOSH and TOSL due to the 15-bit size of the
PC. To access the stack, adjust the value of STKPTR,
which will position TOSH:TOSL, then read/write to
TOSH:TOSL. STKPTR is 5 bits to allow detection of
overflow and underflow.
During normal program operation, CALL, CALLW and
Interrupts will increment STKPTR while RETLW,
RETURN, and RETFIE will decrement STKPTR. At any
time STKPTR can be inspected to see how much stack
is left. The STKPTR always points at the currently used
place on the stack. Therefore, a CALL or CALLW will
increment the STKPTR and then write the PC, and a
return will unload the PC and then decrement the
STKPTR.
Reference Figure 3-4 through Figure 3-7 for examples
of accessing the stack.
FIGURE 3-4: ACCESSING THE STACK EXAMPLE 1
Note 1: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, CALLW, RETURN, RETLW and
RETFIE instructions or the vectoring to
an interrupt address.
Note: Care should be taken when modifying the
STKPTR while interrupts are enabled.
STKPTR = 0x1F Stack Reset Disabled
(STVREN = 0)
Stack Reset Enabled
(STVREN = 1)
Initial Stack Configuration:
After Reset, the stack is empty. The
empty stack is initialized so the Stack
Pointer is pointing at 0x1F. If the Stack
Overflow/Underflow Reset is enabled, the
TOSH/TOSL register will return ‘0’.Ifthe
Stack Overflow/Underflow Reset is
disabled, the TOSH/TOSL register will
return the contents of stack address
0x0F.
0x0000 STKPTR = 0x1F
TOSH:TOSL 0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x04
0x05
0x03
0x02
0x01
0x00
0x1F
TOSH:TOSL
Rev. 10-000043A
7/30/2013
PIC12(L)F1501
DS40001615C-page 32 2011-2015 Microchip Technology Inc.
FIGURE 3-5: ACCESSING THE STACK EXAMPLE 2
FIGURE 3-6: ACCESSING THE STACK EXAMPLE 3
STKPTR = 0x00
Return Address
This figure shows the stack configuration
after the first CALL or a single interrupt.
If a RETURN instruction is executed, the
return address will be placed in the
Program Counter and the Stack Pointer
decremented to the empty state (0x1F).
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x04
0x05
0x03
0x02
0x01
0x00
TOSH:TOSL
Rev. 10-000043B
7/30/2013
STKPTR = 0x06
After seven CALLsorsixCALLs and an
interrupt, the stack looks like the figure on
the left. A series of RETURN instructions will
repeatedly place the return addresses into
the Program Counter and pop the stack.
Return Address
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x04
0x05
0x03
0x02
0x01
0x00
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
TOSH:TOSL
Rev. 10-000043C
7/30/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 33
PIC12(L)F1501
FIGURE 3-7: ACCESSING THE STACK EXAMPLE 4
3.5.2 OVERFLOW/UNDERFLOW RESET
If the STVREN bit in Configuration Words is
programmed to ‘1’, the device will be reset if the stack
is PUSHed beyond the sixteenth level or POPed
beyond the first level, setting the appropriate bits
(STKOVF or STKUNF, respectively) in the PCON
register.
3.6 Indirect Addressing
The INDFn registers are not physical registers. Any
instruction that accesses an INDFn register actually
accesses the register at the address specified by the
File Select Registers (FSR). If the FSRn address
specifies one of the two INDFn registers, the read will
return ‘0’ and the write will not occur (though Status bits
may be affected). The FSRn register value is created
by the pair FSRnH and FSRnL.
The FSR registers form a 16-bit address that allows an
addressing space with 65536 locations. These locations
are divided into three memory regions:
• Traditional Data Memory
• Linear Data Memory
• Program Flash Memory
STKPTR = 0x10
When the stack is full, the next CALL or
an interrupt will set the Stack Pointer to
0x10. This is identical to address 0x00 so
the stack will wrap and overwrite the
return address at 0x00. If the Stack
Overflow/Underflow Reset is enabled, a
Reset will occur and location 0x00 will
not be overwritten.
Return Address0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x04
0x05
0x03
0x02
0x01
0x00
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
TOSH:TOSL
Rev. 10-000043D
7/30/2013
PIC12(L)F1501
DS40001615C-page 34 2011-2015 Microchip Technology Inc.
FIGURE 3-8: INDIRECT ADDRESSI NG
0x0000
0x0FFF
0x0000
0x7FFF0xFFFF
0x0000
0x0FFF
0x1000
0x1FFF
0x2000
0x29AF
0x29B0
0x7FFF
0x8000
Reserved
Reserved
Traditional
Data Memory
Linear
Data Memory
Program
Flash Memory
FSR
Address
Range
Note: Not all memory regions are completely implemented. Consult device memory tables for memory limits.
Rev. 10-000044A
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2011-2015 Microchip Technology Inc. DS40001615C-page 35
PIC12(L)F1501
3.6.1 TRADITIONAL DATA MEMORY
The traditional data memory is a region from FSR
address 0x000 to FSR address 0xFFF. The addresses
correspond to the absolute addresses of all SFR, GPR
and common registers.
FIGURE 3-9: TRAD ITIO NAL DATA MEMORY MAP
Direct Addressing
40BSR 60
From Opcode
0
07FSRxH
000
07FSRxL
Indirect Addressing
00000 00001 00010 11111
Bank Select Location Select
0x00
0x7F
Bank Select Location Select
Bank 0 Bank 1 Bank 2 Bank 31
Rev. 10-000056A
7/31/2013
PIC12(L)F1501
DS40001615C-page 36 2011-2015 Microchip Technology Inc.
3.6.2 LINEAR DATA MEMORY
The linear data memory is the region from FSR
address 0x2000 to FSR address 0x29AF. This region is
a virtual region that points back to the 80-byte blocks of
GPR memory in all the banks.
Unimplemented memory reads as 0x00. Use of the
linear data memory region allows buffers to be larger
than 80 bytes because incrementing the FSR beyond
one bank will go directly to the GPR memory of the next
bank.
The 16 bytes of common memory are not included in
the linear data memory region.
FIGURE 3-10: LINEAR DATA MEMORY
MAP
3.6.3 PROGRAM FLASH MEMORY
To make constant data access easier, the entire
program Flash memory is mapped to the upper half of
the FSR address space. When the MSb of FSRnH is
set, the lower 15 bits are the address in program
memory which will be accessed through INDF. Only the
lower eight bits of each memory location is accessible
via INDF. Writing to the program Flash memory cannot
be accomplished via the FSR/INDF interface. All
instructions that access program Flash memory via the
FSR/INDF interface will require one additional
instruction cycle to complete.
FIGURE 3-11: PROGRAM FLASH
MEMORY MAP
0x020
Bank 0
0x06F
0x0A0
Bank 1
0x0EF
0x120
Bank 2
0x16F
0xF20
Bank 30
0xF6F
001
0077FSRnH FSRnL
Location Select 0x2000
0x29AF
Rev. 10-000057A
7/31/2013
0x0000
Program
Flash
Memory
(low 8 bits)
0x7FFF
1
0077FSRnH FSRnL
Location Select 0x8000
0xFFFF
Rev. 10-000058A
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2011-2015 Microchip Technology Inc. DS40001615C-page 37
PIC12(L)F1501
4.0 DEVICE CONFIGURATION
Device configuration consists of Configuration Words,
Code Protection and Device ID.
4.1 Configuration Words
There are several Configuration Word bits that allow
different oscillator and memory protection options.
These are implemented as Configuration Word 1 at
8007h and Configuration Word 2 at 8008h.
Note: The DEBUG bit in Configuration Words is
managed automatically by device
development tools including debuggers
and programmers. For normal device
operation, this bit should be maintained as
a ‘1’.
PIC12(L)F1501
DS40001615C-page 38 2011-2015 Microchip Technology Inc.
4.2 Register Definitions: Configuration Words
REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1
U-1 U-1 R/P-1 R/P-1 R/P-1 U-1
— — CLKOUTEN BOREN<1:0>(1) —
bit 13 bit 8
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 U-1 R/P-1 R/P-1
CP(2) MCLRE PWRTE WDTE<1:0> — FOSC<1:0>
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase
bit 13-12 Unimplemented: Read as ‘1’
bit 11 CLKOUTEN: Clock Out Enable bit
1 = CLKOUT function is disabled. I/O function on the CLKOUT pin
0 = CLKOUT function is enabled on the CLKOUT pin
bit 10-9 BOREN<1:0>: Brown-Out Reset Enable bits(1)
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
01 = BOR controlled by SBOREN bit of the BORCON register
00 = BOR disabled
bit 8 Unimplemented: Read as ‘1’
bit 7 CP: Code Protection bit(2)
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 6 MCLRE: MCLR/VPP Pin Function Select bit
If LVP bit = 1:
This bit is ignored.
If LVP bit = 0:
1 =MCLR
/VPP pin function is MCLR; Weak pull-up enabled.
0 =MCLR
/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of
WPUA3 bit.
bit 5 PWRTE: Power-Up Timer Enable bit
1 = PWRT disabled
0 = PWRT enabled
bit 4-3 WDTE<1:0>: Watchdog Timer Enable bits
11 = WDT enabled
10 = WDT enabled while running and disabled in Sleep
01 = WDT controlled by the SWDTEN bit in the WDTCON register
00 = WDT disabled
bit 2 Unimplemented: Read as ‘1’
bit 1-0 FOSC<1:0>: Oscillator Selection bits
11 = ECH: External Clock, High-Power mode: on CLKIN pin
10 = ECM: External Clock, Medium Power mode: on CLKIN pin
01 = ECL: External Clock, Low-Power mode: on CLKIN pin
00 = INTOSC oscillator: I/O function on CLKIN pin
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.
2: Once enabled, code-protect can only be disabled by bulk erasing the device.
2011-2015 Microchip Technology Inc. DS40001615C-page 39
PIC12(L)F1501
REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2
R/P-1 U-1 R/P-1 R/P-1 R/P-1 U-1
LVP(1) —LPBORBORV(2) STVREN —
bit 13 bit 8
U-1 U-1 U-1 U-1 U-1 U-1 R/P-1 R/P-1
— — ————WRT<1:0>
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase
bit 13 LVP: Low-Voltage Programming Enable bit(1)
1 = Low-voltage programming enabled
0 = High-voltage on MCLR must be used for programming
bit 12 Unimplemented: Read as ‘1’
bit 11 LPBOR: Low-Power BOR Enable bit
1 = Low-Power Brown-out Reset is disabled
0 = Low-Power Brown-out Reset is enabled
bit 10 BORV: Brown-Out Reset Voltage Selection bit(2)
1 = Brown-out Reset voltage (VBOR), low trip point selected
0 = Brown-out Reset voltage (VBOR), high trip point selected
bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit
1 = Stack Overflow or Underflow will cause a Reset
0 = Stack Overflow or Underflow will not cause a Reset
bit 8-2 Unimplemented: Read as ‘1’
bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits
1 kW Flash memory (PIC12(L)F1501 only):
11 = Write protection off
10 = 000h to 0FFh write-protected, 100h to 3FFh may be modified
01 = 000h to 1FFh write-protected, 200h to 3FFh may be modified
00 = 000h to 3FFh write-protected, no addresses may be modified
Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
2: See VBOR parameter for specific trip point voltages.
PIC12(L)F1501
DS40001615C-page 40 2011-2015 Microchip Technology Inc.
4.3 Code Protection
Code protection allows the device to be protected from
unauthorized access. Internal access to the program
memory is unaffected by any code protection setting.
4.3.1 PROGRAM MEMORY PROTECTION
The entire program memory space is protected from
external reads and writes by the CP bit in Configuration
Words. When CP = 0, external reads and writes of
program memory are inhibited and a read will return all
‘0’s. The CPU can continue to read program memory,
regardless of the protection bit settings. Writing the
program memory is dependent upon the write
protection setting. See Section 4.4 “Write
Protection” for more information.
4.4 Write Prote c tion
Write protection allows the device to be protected from
unintended self-writes. Applications, such as
bootloader software, can be protected while allowing
other regions of the program memory to be modified.
The WRT<1:0> bits in Configuration Words define the
size of the program memory block that is protected.
4.5 User ID
Four memory locations (8000h-8003h) are designated as
ID locations where the user can store checksum or other
code identification numbers. These locations are
readable and writable during normal execution. See
Section 10.4 “User ID, Device ID and Configuration
Word Access” for more information on accessing these
memory locations. For more information on checksum
calculation, see the “PIC12(L)F1501/PIC16(L)F150X
Memory Programming Specification” (DS41573).
2011-2015 Microchip Technology Inc. DS40001615C-page 41
PIC12(L)F1501
4.6 Device ID and Revision ID
The memory location 8006h is where the Device ID and
Revision ID are stored. The upper nine bits hold the
Device ID. The lower five bits hold the Revision ID. See
Section 10.4 “User ID, Device ID and Configuration
Word Access” for more information on accessing
these memory locations.
Development tools, such as device programmers and
debuggers, may be used to read the Device ID and
Revision ID.
4.7 Register Definitions: Device ID
REGISTER 4-3: DEVID: DEVICE ID REGISTER
RRRRRR
DEV<8:3>
bit 13 bit 8
RRRRRRRR
DEV<2:0> REV<4:0>
bit 7 bit 0
Legend:
R = Readable bit
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 13-5 DEV<8:0>: Device ID bits
bit 4-0 REV<4:0>: Revision ID bits
These bits are used to identify the revision (see Table under DEV<8:0> above).
Device DEVID<13:0> Values
DEV<8:0> REV<4:0>
PIC12LF1501 10 1101 100 x xxxx
PIC12F1501 10 1100 110 x xxxx
PIC12(L)F1501
DS40001615C-page 42 2011-2015 Microchip Technology Inc.
5.0 OSCILLATOR MODULE
5.1 Overview
The oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing perfor-
mance and minimizing power consumption. Figure 5-1
illustrates a block diagram of the oscillator module.
Clock sources can be supplied from an external clock or
from one of two internal oscillators, with a choice of
speeds selectable via software. Additional clock features
include:
• Selectable system clock source between external
or internal sources via software.
• Fast start-up oscillator allows internal circuits to
power-up and stabilize before switching to the 16
MHz HFINTOSC
The oscillator module can be configured in one of the
following clock modes.
1. ECL – External Clock Low-Power mode
(0 MHz to 0.5 MHz)
2. ECM – External Clock Medium Power mode
(0.5 MHz to 4 MHz)
3. ECH – External Clock High-Power mode
(4 MHz to 20 MHz)
4. INTOSC – Internal oscillator (31 kHz to 16 MHz)
Clock Source modes are selected by the FOSC<1:0>
bits in the Configuration Words. The FOSC bits
determine the type of oscillator that will be used when
the device is first powered.
The ECH, ECM, and ECL clock modes rely on an
external logic level signal as the device clock source.
The INTOSC internal oscillator block produces a low and
high-frequency clock source, designated LFINTOSC and
HFINTOSC. (See Internal Oscillator Block, Figure 5-1). A
wide selection of device clock frequencies may be derived
from these two clock sources.
2011-2015 Microchip Technology Inc. DS40001615C-page 43
PIC12(L)F1501
FIGURE 5-1: SIMPLI FIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM
Start-up
Control Logic
16 MHz
Oscillator
Fast Start-up
Oscillator
31 kHz
Oscillator
Prescaler
HFINTOSC(1)
16 MHz
8MHz
4MHz
2MHz
1MHz
*500 kHz
*250 kHz
*125 kHz
62.5 kHz
*31.25 kHz
*31 kHz
IRCF<3:0>
4
INTOSC
HFINTOSC
LFINTOSC
to CPU and
Peripherals
Sleep
FOSC(1)
LFINTOSC(1)
to WDT, PWRT, and
other Peripherals
* Available with more than one IRCF selection
Clock
Control
FOSC<2:0> SCS<1:0>
32
600 kHz
Oscillator
FRC
FRC(1) to ADC and
other Peripherals
Rev. 10-000030C
7/30/2013
CLKIN EC
(2)
Note 1: See Section 5.2.2.4 “Peripheral Clock Sources”.
2: ST Buffer is high speed type when using T1CKI.
PIC12(L)F1501
DS40001615C-page 44 2011-2015 Microchip Technology Inc.
5.2 Clock Source Types
Clock sources can be classified as external, internal or
peripheral.
External clock sources rely on external circuitry for the
clock source to function. Examples are: oscillator mod-
ules (ECH, ECM, ECL modes).
Internal clock sources are contained within the oscillator
module. The internal oscillator block has two internal
oscillators that are used to generate the internal system
clock sources: the 16 MHz High-Frequency Internal
Oscillator (HFINTOSC) and the 31 kHz Low-Frequency
Internal Oscillator (LFINTOSC).
The peripheral clock source is a nominal 600 kHz
internal RC oscillator, FRC. The FRC is traditionally
used with the ADC module, but is sometimes available
to other peripherals. See Section 5.2.2.4 “Peripheral
Clock Sources”.
The system clock can be selected between external or
internal clock sources via the System Clock Select
(SCS) bits in the OSCCON register. See Section
5.3 “Clock Switching” for additional information.
5.2.1 EXTERNAL CLOCK SOURCES
An external clock source can be used as the device
system clock by performing one of the following
actions:
• Program the FOSC<1:0> bits in the Configuration
Words to select an external clock source that will
be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to:
- Secondary oscillator during run-time, or
- An external clock source determined by the
value of the FOSC bits.
See Section 5.3 “Clock Switching” for more informa-
tion.
5.2.1.1 EC Mode
The External Clock (EC) mode allows an externally
generated logic level signal to be the system clock
source. When operating in this mode, an external clock
source is connected to the OSC1 input.
OSC2/CLKOUT is available for general purpose I/O or
CLKOUT. Figure 5-2 shows the pin connections for EC
mode.
EC mode has three power modes to select from through
the FOSC bits in the Configuration Words:
• ECH – High power, 4-20 MHz
• ECM – Medium power, 0.5-4 MHz
• ECL – Low power, 0-0.5 MHz
FIGURE 5-2: EXTERNAL CLOCK (EC)
MODE OPERATION
Clock from
Ext. system
FOSC/4 or I/O(1)
OSC1/CLKIN
PIC®MCU
OSC2/CLKOUT
Note 1: Output depends upon the CLKOUTEN bit
of the Configuration Words.
Rev. 10-000045A
7/30/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 45
PIC12(L)F1501
5.2.2 INTERNAL CLOCK SOURCES
The device may be configured to use the internal oscil-
lator block as the system clock by performing one of the
following actions:
• Program the FOSC<1:0> bits in Configuration
Words to select the INTOSC clock source, which
will be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to the internal
oscillator during run-time. See Section
5.3 “Clock Switching”for more information.
In INTOSC mode, CLKIN is available for general
purpose I/O. CLKOUT is available for general purpose
I/O or CLKOUT.
The function of the CLKOUT pin is determined by the
CLKOUTEN bit in Configuration Words.
The internal oscillator block has two independent
oscillators that provides the internal system clock
source.
1. The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at
16 MHz.
2. The LFINTOSC (Low-Frequency Internal
Oscillator) operates at 31 kHz.
5.2.2.1 HFINTOSC
The High-Frequency Internal Oscillator (HFINTOSC) is
a factory calibrated 16 MHz internal clock source.
The output of the HFINTOSC connects to a postscaler
and multiplexer (see Figure 5-1). The frequency derived
from the HFINTOSC can be selected via software using
the IRCF<3:0> bits of the OSCCON register. See
Section 5.2.2.6 “Internal Oscillator Clock Switch
Timing” for more information.
The HFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired HF frequency, and
•FOSC<1:0> = 00, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’.
A fast start-up oscillator allows internal circuits to
power-up and stabilize before switching to HFINTOSC.
The High-Frequency Internal Oscillator Ready bit
(HFIOFR) of the OSCSTAT register indicates when the
HFINTOSC is running.
The High-Frequency Internal Oscillator Stable bit
(HFIOFS) of the OSCSTAT register indicates when the
HFINTOSC is running within 0.5% of its final value.
5.2.2.2 LFINTOSC
The Low-Frequency Internal Oscillator (LFINTOSC) is
a 31 kHz internal clock source.
The output of the LFINTOSC connects to a multiplexer
(see Figure 5-1). Select 31 kHz, via software, using the
IRCF<3:0> bits of the OSCCON register. See Section
5.2.2.6 “Internal Oscillator Clock Switch Timing” for
more information. The LFINTOSC is also the frequency
for the Power-up Timer (PWRT) and the, Watchdog
Timer (WDT).
The LFINTOSC is enabled by selecting 31 kHz
(IRCF<3:0> bits of the OSCCON register = 000) as the
system clock source (SCS bits of the OSCCON
register = 1x), or when any of the following are
enabled:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired LF frequency, and
•FOSC<1:0> = 00, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’.
Peripherals that use the LFINTOSC are:
• Power-up Timer (PWRT)
• Watchdog Timer (WDT)
The Low-Frequency Internal Oscillator Ready bit
(LFIOFR) of the OSCSTAT register indicates when the
LFINTOSC is running.
5.2.2.3 FRC
The FRC clock is an uncalibrated, nominal 600 kHz
peripheral clock source.
The FRC is automatically turned on by the peripherals
requesting the FRC clock.
The FRC clock continues to run during Sleep.
PIC12(L)F1501
DS40001615C-page 46 2011-2015 Microchip Technology Inc.
5.2.2.4 Peripheral Clock Sources
The clock sources described in this chapter and the
Timer’s are available to different peripherals. Table 5-1
lists the clocks and timers available for each peripheral.
5.2.2.5 Internal Oscillator Frequency
Selection
The system clock speed can be selected via software
using the Internal Oscillator Frequency Select bits
IRCF<3:0> of the OSCCON register.
The postscaled output of the 16 MHz HFINTOSC and
31 kHz LFINTOSC connect to a multiplexer (see
Figure 5-1). The Internal Oscillator Frequency Select
bits IRCF<3:0> of the OSCCON register (Register 5-1)
select the frequency output of the internal oscillators.
The IRCF<3:0> bits of the OSCCON register allow
duplicate selections for some frequencies. These dupli-
cate choices can offer system design trade-offs. Lower
power consumption can be obtained when changing
oscillator sources for a given frequency. Faster transi-
tion times can be obtained between frequency changes
that use the same oscillator source.
5.2.2.6 Internal Oscillator Clock Switch
Timing
When switching between the HFINTOSC and the
LFINTOSC, the new oscillator may already be shut
down to save power (see Figure 5-3). If this is the case,
there is a delay after the IRCF<3:0> bits of the
OSCCON register are modified before the frequency
selection takes place. The OSCSTAT register will
reflect the current active status of the HFINTOSC and
LFINTOSC oscillators. The sequence of a frequency
selection is as follows:
1. IRCF<3:0> bits of the OSCCON register are
modified.
2. If the new clock is shut down, a clock start-up
delay is started.
3. Clock switch circuitry waits for a falling edge of
the current clock.
4. The current clock is held low and the clock
switch circuitry waits for a rising edge in the new
clock.
5. The new clock is now active.
6. The OSCSTAT register is updated as required.
7. Clock switch is complete.
See Figure 5-3 for more details.
If the internal oscillator speed is switched between two
clocks of the same source, there is no start-up delay
before the new frequency is selected. Clock switching
time delays are shown in Table 5-2.
Start-up delay specifications are located in Table 27-8,
“Oscillator Parameters”.
TABLE 5-1: PERIPHERAL CLOCK
SOURCES
FOSC
FRC
HFINTOSC
LFINTOSC
TMR0
TMR1
TMR2
ADC ●●
CLC ●●●●●●●
COMP ●
CWG ●●
NCO ●●
PWM ●●
PWRT ●
TMR0 ●
TMR1 ●●
TMR2 ●
WDT ●
Note: Following any Reset, the IRCF<3:0> bits
of the OSCCON register are set to ‘0111’
and the frequency selection is set to
500 kHz. The user can modify the IRCF
bits to select a different frequency.
2011-2015 Microchip Technology Inc. DS40001615C-page 47
PIC12(L)F1501
FIGURE 5-3: INTERNAL OSCILLATOR SWITCH TIMING
HFINTOSC
LFINTOSC
IRCF <3:0>
System Clock
HFINTOSC
LFINTOSC
IRCF <3:0>
System Clock
00
00
2-cycle Sync Running
2-cycle Sync Running
HFINTOSC LFINTOSC (WDT disabled)
HFINTOSC LFINTOSC (WDT enabled)
LFINTOSC
HFINTOSC
IRCF <3:0>
System Clock
= 0 0
2-cycle Sync Running
LFINTOSC HFINTOSC LFINTOSC turns off unless WDT is enabled(2)
Note 1: See Tab le 5-2, “Oscillator Switching Delays” for more information.
2: LFINTOSC will continue to run if a peripheral has selected it as the clock source. See
Section 5.2.2.4 “Peripheral Clock Sources”.
Oscillator Delay(1)
Oscillator Delay(1)
PIC12(L)F1501
DS40001615C-page 48 2011-2015 Microchip Technology Inc.
5.3 Clock Switching
The system clock source can be switched between
external and internal clock sources via software using
the System Clock Select (SCS) bits of the OSCCON
register. The following clock sources can be selected
using the SCS bits:
• Default system oscillator determined by FOSC
bits in Configuration Words
• Internal Oscillator Block (INTOSC)
5.3.1 SYSTEM CLOCK SELECT (SCS)
BITS
The System Clock Select (SCS) bits of the OSCCON
register selects the system clock source that is used for
the CPU and peripherals.
• When the SCS bits of the OSCCON register = 00,
the system clock source is determined by value of
the FOSC<1:0> bits in the Configuration Words.
• When the SCS bits of the OSCCON register = 01,
the system clock source is the secondary
oscillator.
• When the SCS bits of the OSCCON register = 1x,
the system clock source is chosen by the internal
oscillator frequency selected by the IRCF<3:0>
bits of the OSCCON register. After a Reset, the
SCS bits of the OSCCON register are always
cleared.
When switching between clock sources, a delay is
required to allow the new clock to stabilize. These oscil-
lator delays are shown in Table 5-2 .
5.3.2 CLOCK SWITCHING BEFORE
SLEEP
When clock switching from an old clock to a new clock
is requested just prior to entering Sleep mode, it is
necessary to confirm that the switch is complete before
the SLEEP instruction is executed. Failure to do so may
result in an incomplete switch and consequential loss
of the system clock altogether. Clock switching is
confirmed by monitoring the clock status bits in the
OSCSTAT register. Switch confirmation can be
accomplished by sensing that the ready bit for the new
clock is set or the ready bit for the old clock is cleared.
For example, when switching between the internal
oscillator with the PLL and the internal oscillator without
the PLL, monitor the PLLR bit. When PLLR is set, the
switch to 32 MHz operation is complete. Conversely,
when PPLR is cleared, the switch from 32 MHz
operation to the selected internal clock is complete.
TABLE 5-2: OSCILLATOR SWITCHING DELAYS
Switch From Switch To Oscillator Delay
Any clock source
LFINTOSC 1 cycle of each clock source
HFINTOSC 2 s (approx.)
ECH, ECM, ECL 2 cycles
2011-2015 Microchip Technology Inc. DS40001615C-page 49
PIC12(L)F1501
5.4 Register Definitions: Oscillator Control
REGISTER 5-1: OSCCON: OSCILLATOR CONTROL REGISTER
U-0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-1/1 U-0 R/W-0/0 R/W-0/0
—IRCF<3:0> —SCS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits
1111 =16MHz
1110 =8MHz
1101 =4MHz
1100 =2MHz
1011 =1MHz
1010 = 500 kHz(1)
1001 = 250 kHz(1)
1000 = 125 kHz(1)
0111 = 500 kHz (default upon Reset)
0110 = 250 kHz
0101 = 125 kHz
0100 = 62.5 kHz
001x = 31.25 kHz
000x =31kHz LF
bit 2 Unimplemented: Read as ‘0’
bit 1-0 SCS<1:0>: System Clock Select bits
1x = Internal oscillator block
01 = Reserved
00 = Clock determined by FOSC<1:0> in Configuration Words.
Note 1: Duplicate frequency derived from HFINTOSC.
PIC12(L)F1501
DS40001615C-page 50 2011-2015 Microchip Technology Inc.
TABLE 5-3: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
TABLE 5-4: SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES
REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER
U-0 U-0 U-0 R-0/q U-0 U-0 R-0/q R-0/q
—— — HFIOFR — — LFIOFR HFIOFS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Conditional
bit 7-5 Unimplemented: Read as ‘0’
bit 4 HFIOFR: High-Frequency Internal Oscillator Ready bit
1 = HFINTOSC is ready
0 = HFINTOSC is not ready
bit 3-2 Unimplemented: Read as ‘0’
bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit
1 = LFINTOSC is ready
0 = LFINTOSC is not ready
bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit
1 = HFINTOSC 16 MHz Oscillator is stable and is driving the INTOSC
0 = HFINTOSC 16 MHz is not stable, the Start-up Oscillator is driving INTOSC
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
OSCCON — IRCF<3:0> —SCS<1:0>49
OSCSTAT — — —HFIOFR —— LFIOFR HFIOFS 50
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — — —CLKOUTEN BOREN<1:0> —38
7:0 CP MCLRE PWRTE WDTE<1:0> —FOSC<1:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.
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PIC12(L)F1501
6.0 RESETS
There are multiple ways to reset this device:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
• Low-Power Brown-out Reset (LPBOR)
•MCLR Reset
•WDT Reset
•RESET instruction
• Stack Overflow
• Stack Underflow
• Programming mode exit
To allo w V DD to stabilize, an optional power-up timer
can be enabled to extend the Reset time after a BOR
or POR event.
A simplified block diagram of the On-chip Reset Circuit
is shown in Figure 6-1.
FIGURE 6-1: SIMPLI FIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
Device
Reset
Power-on
Reset
WDT
Time-out
Brown-out
Reset
LPBOR
Reset
RESET Instruction
MCLRE
Sleep
BOR
Active(1)
PWRTE
LFINTOSC
VDD
ICSP™ Programming Mode Exit
Stack Underflow
Stack Overlfow
VPP/MCLR
RPower-up
Timer
Rev. 10-000006A
8/14/2013
Note 1: See Table 6-1 for BOR active conditions.
PIC12(L)F1501
DS40001615C-page 52 2011-2015 Microchip Technology Inc.
6.1 Power-On Reset (POR)
The POR circuit holds the device in Reset until VDD has
reached an acceptable level for minimum operation.
Slow rising VDD, fast operating speeds or analog
performance may require greater than minimum VDD.
The PWRT, BOR or MCLR features can be used to
extend the start-up period until all device operation
conditions have been met.
6.1.1 POWER-UP TIMER (PWRT)
The Power-up Timer provides a nominal 64 ms
time-out on POR or Brown-out Reset.
The device is held in Reset as long as PWRT is active.
The PWRT delay allows additional time for the VDD to
rise to an acceptable level. The Power-up Timer is
enabled by clearing the PWRTE bit in Configuration
Words.
The Power-up Timer starts after the release of the POR
and BOR.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
6.2 Brown-Out Reset (BOR)
The BOR circuit holds the device in Reset when VDD
reaches a selectable minimum level. Between the
POR and BOR, complete voltage range coverage for
execution protection can be implemented.
The Brown-out Reset module has four operating
modes controlled by the BOREN<1:0> bits in Configu-
ration Words. The four operating modes are:
• BOR is always on
• BOR is off when in Sleep
• BOR is controlled by software
• BOR is always off
Refer to Tab le 6-1 for more information.
The Brown-out Reset voltage level is selectable by
configuring the BORV bit in Configuration Words.
A VDD noise rejection filter prevents the BOR from
triggering on small events. If VDD falls below Vpor for a
duration greater than parameter TBORDC, the device
will reset. See Figure 6-2 for more information.
TABLE 6-1: BOR OPERATING MODES
6.2.1 BOR IS ALWAYS ON
When the BOREN bits of Configuration Words are pro-
grammed to ‘11’, the BOR is always on. The device
start-up will be delayed until the BOR is ready and VDD
is higher than the BOR threshold.
BOR protection is active during Sleep. The BOR does
not delay wake-up from Sleep.
6.2.2 BOR IS OFF IN SLEEP
When the BOREN bits of Configuration Words are pro-
grammed to ‘10’, the BOR is on, except in Sleep. The
device start-up will be delayed until the BOR is ready
and VDD is higher than the BOR threshold.
BOR protection is not active during Sleep. The device
wake-up will be delayed until the BOR is ready.
6.2.3 BOR CONTROLLED BY SOFTWARE
When the BOREN bits of Configuration Words are
programmed to ‘01’, the BOR is controlled by the
SBOREN bit of the BORCON register. The device
start-up is not delayed by the BOR ready condition or
the VDD level.
BOR protection begins as soon as the BOR circuit is
ready. The status of the BOR circuit is reflected in the
BORRDY bit of the BORCON register.
BOR protection is unchanged by Sleep.
BOREN<1:0> SBOREN Device Mode BOR Mode Instruction Execution upon:
Release of POR or Wake-up from Sleep
11 X X Active Waits for BOR ready(1)
(BORRDY = 1)
10 X Awake Active Waits for BOR ready
(BORRDY = 1)
Sleep Disabled
01
1XActive Waits for BOR ready(1)
(BORRDY = 1)
0X Disabled Begins immediately
(BORRDY = x)
00 X XDisabled
Note 1: In these specific cases, “release of POR” and “wake-up from Sleep,” there is no delay in start-up. The BOR
ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR
circuit is forced on by the BOREN<1:0> bits.
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PIC12(L)F1501
FIGURE 6-2: BROWN-OUT SITUATIONS
6.3 Register Defini tion s : B O R C o nt rol
REGISTER 6-1: BORCON: BROWN-OUT RESET CONTROL REGISTER
R/W-1/u R/W-0/u U-0 U-0 U-0 U-0 U-0 R-q/u
SBOREN BORFS — — — — —BORRDY
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 SBOREN: Software Brown-Out Reset Enable bit
If BOREN <1:0> in Configuration Words = 01:
1 = BOR Enabled
0 = BOR Disabled
If BOREN <1:0> in Configuration Words 01:
SBOREN is read/write, but has no effect on the BOR
bit 6 BORFS: Brown-Out Reset Fast Start bit(1)
If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control):
1 = Band gap is forced on always (covers sleep/wake-up/operating cases)
0 = Band gap operates normally, and may turn off
If BOREN<1:0> = 11 (Always on) or BOREN<1:0> = 00 (Always off)
BORFS is Read/Write, but has no effect.
bit 5-1 Unimplemented: Read as ‘0’
bit 0 BORRDY: Brown-Out Reset Circuit Ready Status bit
1 = The Brown-out Reset circuit is active
0 = The Brown-out Reset circuit is inactive
Note 1: BOREN<1:0> bits are located in Configuration Words.
TPWRT(1)
VBOR
VDD
Internal
Reset
VBOR
VDD
Internal
Reset TPWRT(1)
< TPWRT
TPWRT(1)
VBOR
VDD
Internal
Reset
Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’.
PIC12(L)F1501
DS40001615C-page 54 2011-2015 Microchip Technology Inc.
6.4 Low-Power Brown-Out Reset
(LPBOR)
The Low-Power Brown-out Reset (LPBOR) operates
like the BOR to detect low voltage conditions on the
VDD pin. When too low of a voltage is detected, the
device is held in Reset. When this occurs, a register bit
(BOR) is changed to indicate that a BOR Reset has
occurred. The BOR bit in PCON is used for both BOR
and the LPBOR. Refer to Register 6-2.
The LPBOR voltage threshold (Lapboard) has a wider
tolerance than the BOR (Vpor), but requires much less
current (LPBOR current) to operate. The LPBOR is
intended for use when the BOR is configured as dis-
abled (BOREN = 00) or disabled in Sleep mode
(BOREN = 10).
Refer to Figure 6-1 to see how the LPBOR interacts
with other modules.
6.4.1 ENABLING LPBOR
The LPBOR is controlled by the LPBOR bit of
Configuration Words. When the device is erased, the
LPBOR module defaults to disabled.
6.5 MCLR
The MCLR is an optional external input that can reset
the device. The MCLR function is controlled by the
MCLRE bit of Configuration Words and the LVP bit of
Configuration Words (Table 6-2).
6.5.1 MCLR ENABLED
When MCLR is enabled and the pin is held low, the
device is held in Reset. The MCLR pin is connected to
VDD through an internal weak pull-up.
The device has a noise filter in the MCLR Reset path.
The filter will detect and ignore small pulses.
6.5.2 MCLR DISABLED
When MCLR is disabled, the pin functions as a general
purpose input and the internal weak pull-up is under
software control. See Section 11.3 “PORTA Regis-
ters” for more information.
6.6 Watchdog T imer (WDT) Reset
The Watchdog Timer generates a Reset if the firmware
does not issue a CLRWDT instruction within the time-out
period. The TO and PD bits in the STATUS register are
changed to indicate the WDT Reset. See Section
9.0 “Watchdog Timer (WDT)” for more information.
6.7 RESET Instruction
A RESET instruction will cause a device Reset. The RI
bit in the PCON register will be set to ‘0’. See Ta bl e 6- 4
for default conditions after a RESET instruction has
occurred.
6.8 Stack Overflow/Underflow Reset
The device can reset when the Stack Overflows or
Underflows. The STKOVF or STKUNF bits of the PCON
register indicate the Reset condition. These Resets are
enabled by setting the STVREN bit in Configuration
Words. See Section 3.5.2 “Overflow/Underflow
Reset” for more information.
6.9 Programming Mode Exit
Upon exit of Programming mode, the device will
behave as if a POR had just occurred.
6.10 Power-Up Timer
The Power-up Timer optionally delays device execution
after a BOR or POR event. This timer is typically used to
allow VDD to stabilize before allowing the device to start
running.
The Power-up Timer is controlled by the PWRTE bit of
Configuration Words.
6.11 Start-up Sequence
Upon the release of a POR or BOR, the following must
occur before the device will begin executing:
1. Power-up Timer runs to completion (if enabled).
2. MCLR must be released (if enabled).
The total time-out will vary based on oscillator configu-
ration and Power-up Timer configuration. See Section
5.0 “Oscillator Module” for more information.
The Power-up Timer runs independently of MCLR
Reset. If MCLR is kept low long enough, the Power-up
Timer will expire. Upon bringing MCLR high, the device
will begin execution after 10 FOSS cycles (see
Figure 6-3). This is useful for testing purposes or to
synchronize more than one device operating in parallel.
TABLE 6-2: MCLR CONFIGURATION
MCLRE LVP MCLR
00Disabled
10Enabled
x1Enabled
Note: A Reset does not drive the MCLR pin low.
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PIC12(L)F1501
FIGURE 6-3: RESET START-UP SEQUENCE
Note 1: Code execution begins 10 FOSC cycles after the FOSC clock is released.
VDD
Internal POR
External Clock (EC modes), PWRTEN = 0
Internal RESET
MCLR
FOSC
Begin Execution
Ext. Clock (EC)
Power-up Timer
External Clock (EC modes), PWRTEN = 1
code execution
(1)
code execution
(1)
TPWRT
Int. Oscillator
code execution
(1)
Internal Oscillator, PWRTEN = 0Internal Oscillator, PWRTEN = 1
code execution
(1)
TPWRT
VDD
Internal POR
Internal RESET
MCLR
FOSC
Begin Execution
Power-up Timer
Rev. 10-000032B
7/30/2013
PIC12(L)F1501
DS40001615C-page 56 2011-2015 Microchip Technology Inc.
6.12 Determini ng the Cause of a Reset
Upon any Reset, multiple bits in the STATUS and
PCON registers are updated to indicate the cause of
the Reset. Tabl e 6-3 and Table 6 -4 show the Reset
conditions of these registers.
TABLE 6-3: RESET STATUS BITS AND THEIR SIGNIFICANCE
TABLE 6-4: RESET CONDITION FOR SPECIAL REGISTERS
STKOVF STKUNF RWDT RMCLR RI POR BOR TO PD Condition
001110x11Power-on Reset
001110x0xIllegal, TO is set on POR
001110xx0Illegal, PD is set on POR
00u11u011Brown-out Reset
uu0uuuu0uWDT Reset
uuuuuuu00WDT Wake-up from Sleep
uuuuuuu10Interrupt Wake-up from Sleep
uuu0uuuuuMCLR Reset during normal operation
uuu0uuu10MCLR Reset during Sleep
u u u u 0 u u u u RESET Instruction Executed
1uuuuuuuuStack Overflow Reset (STVREN = 1)
u1uuuuuuuStack Underflow Reset (STVREN = 1)
Condition Program
Counter STATUS
Register PCON
Register
Power-on Reset 0000h ---1 1000 00-- 110x
MCLR Reset during normal operation 0000h ---u muumuu uu-- 0uuu
MCLR Reset during Sleep 0000h ---1 0uuu uu-- 0uuu
WDT Reset 0000h ---0 muumuu uu-- uuuu
WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-- uuuu
Brown-out Reset 0000h ---1 1uuu 00-- 11u0
Interrupt Wake-up from Sleep PC + 1(1) ---1 0uuu uu-- uuuu
RESET Instruction Executed 0000h ---u uuuu uu-- u0uu
Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-- uuuu
Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-- uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’.
Note1: When the wake-up is due to an interrupt and the Global Interrupt Enable bit (GIE) is set, the return address
is pushed on the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.
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6.13 Power Control (PCON) Register
The Power Control (PCON) register contains flag bits
to differentiate between a:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
• Reset Instruction Reset (RI)
•MCLR
Reset (RMCLR)
• Watchdog Timer Reset (RWDT)
• Stack Underflow Reset (STKUNF)
• Stack Overflow Reset (STKOVF)
The PCON register bits are shown in Register 6-2.
6.14 Register Definitions: Power Control
REGISTER 6-2: PCON: POWER CONTROL REGISTER
R/W/HS-0/q R/W/HS-0/q U-0 R/W/HC-1/q R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u
STKOVF STKUNF —RWDT RMCLR RI POR BOR
bit 7 bit 0
Legend:
HC = Bit is cleared by hardware HS = Bit is set by hardware
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 STKOVF: Stack Overflow Flag bit
1 = A Stack Overflow occurred
0 = A Stack Overflow has not occurred or cleared by firmware
bit 6 STKUNF: Stack Underflow Flag bit
1 = A Stack Underflow occurred
0 = A Stack Underflow has not occurred or cleared by firmware
bit 5 Unimplemented: Read as ‘0’
bit 4 RWDT: Watchdog Timer Reset Flag bit
1 = A Watchdog Timer Reset has not occurred or set by firmware
0 = A Watchdog Timer Reset has occurred (cleared by hardware)
bit 3 RMCLR: MCLR Reset Flag bit
1 = A MCLR Reset has not occurred or set by firmware
0 = A MCLR Reset has occurred (cleared by hardware)
bit 2 RI: RESET Instruction Flag bit
1 = A RESET instruction has not been executed or set by firmware
0 = A RESET instruction has been executed (cleared by hardware)
bit 1 POR: Power-On Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-Out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset
occurs)
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DS40001615C-page 58 2011-2015 Microchip Technology Inc.
TABLE 6-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS
TABLE 6-6: SUMMARY OF CONFIGURATION WORD WITH RESETS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BORCON SBOREN BORFS ————— BORRDY 53
PCON STKOVF STKUNF —RWDTRMCLR RI POR BOR 57
STATUS — — —TOPD ZDC C17
WDTCON —— WDTPS<4:0> SWDTEN 77
Legend: — = unimplemented bit, reads as ‘0’. Shaded cells are not used by Resets.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — — — CLKOUTEN BOREN<1:0> —38
7:0 CP MCLRE PWRTE WDTE<1:0> —FOSC<1:0>
CONFIG2 13:8 — — LVP DEBUG LPBOR BORV STVREN —39
7:0 — — — — — — WRT<1:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets.
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7.0 INTERRUPTS
The interrupt feature allows certain events to preempt
normal program flow. Firmware is used to determine
the source of the interrupt and act accordingly. Some
interrupts can be configured to wake the MCU from
Sleep mode.
This chapter contains the following information for
Interrupts:
• Operation
• Interrupt Latency
• Interrupts During Sleep
•INT Pin
• Automatic Context Saving
Many peripherals produce interrupts. Refer to the
corresponding chapters for details.
A block diagram of the interrupt logic is shown in
Figure 7-1.
FIGURE 7-1: INTERRUPT LOGIC
TMR0IF
TMR0IE
INTF
INTE
IOCIF
IOCIE Interrupt
to CPU
Wake-up
(If in Sleep mode)
GIE
(TMR1IF) PIR1<0>
PIRn<7>
PEIE
(TMR1IE) PIE1<0>
Peripheral Interrupts
PIEn<7>
Rev. 10-000010A
1/13/2014
PIC12(L)F1501
DS40001615C-page 60 2011-2015 Microchip Technology Inc.
7.1 Operation
Interrupts are disabled upon any device Reset. They
are enabled by setting the following bits:
• GIE bit of the INTCON register
• Interrupt Enable bit(s) for the specific interrupt
event(s)
• PEIE bit of the INTCON register (if the Interrupt
Enable bit of the interrupt event is contained in the
PIE1, PIE2 and PIE3 registers)
The INTCON, PIR1, PIR2 and PIR3 registers record
individual interrupts via interrupt flag bits. Interrupt flag
bits will be set, regardless of the status of the GIE, PEIE
and individual interrupt enable bits.
The following events happen when an interrupt event
occurs while the GIE bit is set:
• Current prefetched instruction is flushed
• GIE bit is cleared
• Current Program Counter (PC) is pushed onto the
stack
• Critical registers are automatically saved to the
shadow registers (See “Section 7.5 “Automatic
Context Savi ng”.”)
• PC is loaded with the interrupt vector 0004h
The firmware within the Interrupt Service Routine (ISR)
should determine the source of the interrupt by polling
the interrupt flag bits. The interrupt flag bits must be
cleared before exiting the ISR to avoid repeated
interrupts. Because the GIE bit is cleared, any interrupt
that occurs while executing the ISR will be recorded
through its interrupt flag, but will not cause the
processor to redirect to the interrupt vector.
The RETFIE instruction exits the ISR by popping the
previous address from the stack, restoring the saved
context from the shadow registers and setting the GIE
bit.
For additional information on a specific interrupt’s
operation, refer to its peripheral chapter.
7.2 Interrupt Latency
Interrupt latency is defined as the time from when the
interrupt event occurs to the time code execution at the
interrupt vector begins. The latency for synchronous
interrupts is three or four instruction cycles. For
asynchronous interrupts, the latency is three to five
instruction cycles, depending on when the interrupt
occurs. See Figure 7-2 and Figure 7-3 for more details.
Note 1: Individual interrupt flag bits are set,
regardless of the state of any other
enable bits.
2: All interrupts will be ignored while the GIE
bit is cleared. Any interrupt occurring
while the GIE bit is clear will be serviced
when the GIE bit is set again.
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FIGURE 7-2: INTERRUPT LATENCY
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Fosc
PC 0004h 0005h
PC
Inst(0004h)NOP
GIE
Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4
1-Cycle Instruction at PC
PC
Inst(0004h)NOP
2-Cycle Instruction at PC
FSR ADDR PC+1 PC+2 0004h 0005h
PC
Inst(0004h)NOP
GIE
PCPC-1
3-Cycle Instruction at PC
Execute
Interrupt
Inst(PC)
Interrupt Sampled
during Q1
Inst(PC)
PC-1 PC+1
NOP
PC New PC/
PC+1 0005hPC-1 PC+1/FSR
ADDR 0004h
NOP
Interrupt
GIE
Interrupt
INST(PC) NOPNOP
FSR ADDR PC+1 PC+2 0004h 0005h
PC
Inst(0004h)NOP
GIE
PCPC-1
3-Cycle Instruction at PC
Interrupt
INST(PC) NOPNOP NOP
Inst(0005h)
Execute
Execute
Execute
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FIGURE 7-3: INT PIN INTERRUPT TIMING
Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
FOSC
CLKOUT
INT pin
INTF
GIE
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Interrupt Latency
PC PC + 1 PC + 1 0004h 0005h
Inst (0004h) Inst (0005h)
Forced NOP
Inst (PC) Inst (PC + 1)
Inst (PC – 1) Inst (0004h)
Forced NOP
Inst (PC)
—
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: For minimum width of INT pulse, refer to AC specifications in Section 27.0 “Electrical Specifications”.
4: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1) (2)
(3)
(4)
(1)
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7.3 Interrupts During Sleep
Some interrupts can be used to wake from Sleep. To
wake from Sleep, the peripheral must be able to
operate without the system clock. The interrupt source
must have the appropriate Interrupt Enable bit(s) set
prior to entering Sleep.
On waking from Sleep, if the GIE bit is also set, the
processor will branch to the interrupt vector. Otherwise,
the processor will continue executing instructions after
the SLEEP instruction. The instruction directly after the
SLEEP instruction will always be executed before
branching to the ISR. Refer to Section 8.0 “Power-
Down Mode (Sleep)” for more details.
7.4 INT Pin
The INT pin can be used to generate an asynchronous
edge-triggered interrupt. This interrupt is enabled by
setting the INTE bit of the INTCON register. The
INTEDG bit of the OPTION_REG register determines on
which edge the interrupt will occur. When the INTEDG
bit is set, the rising edge will cause the interrupt. When
the INTEDG bit is clear, the falling edge will cause the
interrupt. The INTF bit of the INTCON register will be set
when a valid edge appears on the INT pin. If the GIE and
INTE bits are also set, the processor will redirect
program execution to the interrupt vector.
7.5 Automatic Context Saving
Upon entering an interrupt, the return PC address is
saved on the stack. Additionally, the following registers
are automatically saved in the shadow registers:
• W register
• STATUS register (except for TO and PD)
• BSR register
• FSR registers
• PCLATH register
Upon exiting the Interrupt Service Routine, these regis-
ters are automatically restored. Any modifications to
these registers during the ISR will be lost. If modifica-
tions to any of these registers are desired, the corre-
sponding shadow register should be modified and the
value will be restored when exiting the ISR. The
shadow registers are available in Bank 31 and are
readable and writable. Depending on the user’s appli-
cation, other registers may also need to be saved.
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DS40001615C-page 64 2011-2015 Microchip Technology Inc.
7.6 Regist er D e finitions: Interru pt C on t ro l
REGISTER 7-1: INTCON: INTERRUPT CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0
GIE(1) PEIE(2) TMR0IE INTE IOCIE TMR0IF INTF IOCIF(3)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 GIE: Global Interrupt Enable bit(1)
1 = Enables all active interrupts
0 = Disables all interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit(2)
1 = Enables all active peripheral interrupts
0 = Disables all peripheral interrupts
bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4 INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt
0 = Disables the INT external interrupt
bit 3 IOCIE: Interrupt-on-Change Enable bit
1 = Enables the interrupt-on-change
0 = Disables the interrupt-on-change
bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed
0 = TMR0 register did not overflow
bit 1 INTF: INT External Interrupt Flag bit
1 = The INT external interrupt occurred
0 = The INT external interrupt did not occur
bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit(3)
1 = When at least one of the interrupt-on-change pins changed state
0 = None of the interrupt-on-change pins have changed state
Note 1: Interrupt flag bits are set when an interrupt condition occurs, regardless of the state of its corresponding
enable bit or the Global Interrupt Enable bit, GIE of the INTCON register. User software should ensure the
appropriate interrupt flag bits are clear prior to enabling an interrupt.
2: Bit PEIE of the INTCON register must be set to enable any peripheral interrupt.
3: The IOCIF Flag bit is read-only and cleared when all the interrupt-on-change flags in the IOCxF registers
have been cleared by software.
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REGISTER 7-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
TMR1GIE ADIE — — — — TMR2IE TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit
1 = Enables the Timer1 gate acquisition interrupt
0 = Disables the Timer1 gate acquisition interrupt
bit 6 ADIE: Analog-to-Digital Converter (ADC) Interrupt Enable bit
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5-2 Unimplemented: Read as ‘0’
bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables the Timer1 overflow interrupt
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
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DS40001615C-page 66 2011-2015 Microchip Technology Inc.
REGISTER 7-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
U-0 U-0 R/W-0/0 U-0 U-0 R/W-0/0 U-0 U-0
——C1IE—— NCO1IE — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5 C1IE: Comparator C1 Interrupt Enable bit
1 = Enables the Comparator C1 interrupt
0 = Disables the Comparator C1 interrupt
bit 4-3 Unimplemented: Read as ‘0’
bit 2 NCO1IE: Numerically Controlled Oscillator Interrupt Enable bit
1 = Enables the NCO interrupt
0 = Disables the NCO interrupt
bit 1-0 Unimplemented: Read as ‘0’
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
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REGISTER 7-4: PIE3: PERIPHERAL INTERRUPT ENABLE REGISTER 3
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
— — — — — — CLC2IE CLC1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’
bit 1 CLC2IE: Configurable Logic Block 2 Interrupt Enable bit
1 = Enables the CLC 2 interrupt
0 = Disables the CLC 2 interrupt
bit 0 CLC1IE: Configurable Logic Block 1 Interrupt Enable bit
1 = Enables the CLC 1 interrupt
0 = Disables the CLC 1 interrupt
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
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DS40001615C-page 68 2011-2015 Microchip Technology Inc.
REGISTER 7-5: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
TMR1GIF ADIF — — — — TMR2IF TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6 ADIF: ADC Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 5-2 Unimplemented: Read as ‘0’
bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Interrupt Enable bit, GIE of the INTCON
register. User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
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REGISTER 7-6: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2
U-0 U-0 R/W-0/0 U-0 U-0 R/W-0/0 U-0 U-0
——C1IF—— NCO1IF — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5 C1IF: Comparator C1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4-3 Unimplemented: Read as ‘0’
bit 2 NCO1IF: Numerically Controlled Oscillator Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 1-0 Unimplemented: Read as ‘0’
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Interrupt Enable bit, GIE of the INTCON
register. User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
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DS40001615C-page 70 2011-2015 Microchip Technology Inc.
REGISTER 7-7: PIR3: PERIPHERAL INTERRUPT REQUEST REGISTER 3
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
— — — — — — CLC2IF CLC1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’
bit 1 CLC2IF: Configurable Logic Block 2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0 CLC1IF: Configurable Logic Block 1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
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TABLE 7-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 135
PIE1 TMR1GIE ADIE ———— TMR2IE TMR1IE 65
PIE2 ——C1IE—— NCO1IE — — 66
PIE3 — — — — — — CLC2IE CLC1IE 67
PIR1 TMR1GIF ADIF ———— TMR2IF TMR1IF 68
PIR2 ——C1IF—— NCO1IF — — 68
PIR3 — — — — — — CLC2IF CLC1IF 70
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupts.
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8.0 POWER-DOWN MODE (SLEEP)
The Power-down mode is entered by executing a
SLEEP instruction.
Upon entering Sleep mode, the following conditions exist:
1. WDT will be cleared but keeps running, if
enabled for operation during Sleep.
2. PD bit of the STATUS register is cleared.
3. TO bit of the STATUS register is set.
4. CPU clock is disabled.
5. 31 kHz LFINTOSC is unaffected and peripherals
that operate from it may continue operation in
Sleep.
6. Timer1 and peripherals that operate from
Timer1 continue operation in Sleep when the
Timer1 clock source selected is:
•LFINTOSC
•T1CKI
7. ADC is unaffected, if the dedicated FRC oscillator
is selected.
8. I/O ports maintain the status they had before
SLEEP was executed (driving high, low or high-
impedance).
9. Resets other than WDT are not affected by
Sleep mode.
Refer to individual chapters for more details on
peripheral operation during Sleep.
To minimize current consumption, the following
conditions should be considered:
• I/O pins should not be floating
• External circuitry sinking current from I/O pins
• Internal circuitry sourcing current from I/O pins
• Current draw from pins with internal weak pull-ups
• Modules using 31 kHz LFINTOSC
• CWG, NCO and CLC modules using HFINTOSC
I/O pins that are high-impedance inputs should be
pulled to VDD or VSS externally to avoid switching
currents caused by floating inputs.
Examples of internal circuitry that might be sourcing
current include the FVR module. See Section
13.0 “Fixed Voltage Reference (FVR)” for more
information on this module.
8.1 Wake-up fr om Sleep
The device can wake-up from Sleep through one of the
following events:
1. External Reset input on MCLR pin, if enabled
2. BOR Reset, if enabled
3. POR Reset
4. Watchdog Timer, if enabled
5. Any external interrupt
6. Interrupts by peripherals capable of running
during Sleep (see individual peripheral for more
information)
The first three events will cause a device Reset. The
last three events are considered a continuation of pro-
gram execution. To determine whether a device Reset
or wake-up event occurred, refer to Section
6.12 “Determining the Cause of a Reset”.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
enabled, the device executes the instruction after the
SLEEP instruction, the device will then call the Interrupt
Service Routine. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
8.1.1 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction
-SLEEP instruction will execute as a NOP.
- WDT and WDT prescaler will not be cleared
-TO
bit of the STATUS register will not be set
-PD
bit of the STATUS register will not be
cleared.
• If the interrupt occurs during or after the execu-
tion of a SLEEP instruction
-SLEEP instruction will be completely
executed
- Device will immediately wake-up from Sleep
- WDT and WDT prescaler will be cleared
-TO
bit of the STATUS register will be set
-PD
bit of the STATUS register will be cleared
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
2011-2015 Microchip Technology Inc. DS40001615C-page 73
PIC12(L)F1501
FIGURE 8-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT
8.2 Low-Power Sleep Mode
This device contains an internal Low Dropout (LDO)
voltage regulator, which allows the device I/O pins to
operate at voltages up to 5.5V while the internal device
logic operates at a lower voltage. The LDO and its
associated reference circuitry must remain active when
the device is in Sleep mode.
Low-Power Sleep mode allows the user to optimize the
operating current in Sleep. Low-Power Sleep mode can
be selected by setting the VREGPM bit of the
VREGCON register, putting the LDO and reference
circuitry in a low-power state whenever the device is in
Sleep.
8.2.1 SLEEP CURRENT VS. WAKE-UP
TIME
In the Default Operating mode, the LDO and reference
circuitry remain in the normal configuration while in
Sleep. The device is able to exit Sleep mode quickly
since all circuits remain active. In Low-Power Sleep
mode, when waking up from Sleep, an extra delay time
is required for these circuits to return to the normal con-
figuration and stabilize.
The Low-Power Sleep mode is beneficial for applica-
tions that stay in Sleep mode for long periods of time.
The Normal mode is beneficial for applications that
need to wake from Sleep quickly and frequently.
8.2.2 PERIPHERAL USAGE IN SLEEP
Some peripherals that can operate in Sleep mode will
not operate properly with the Low-Power Sleep mode
selected. The LDO will remain in the Normal Power
mode when those peripherals are enabled. The Low-
Power Sleep mode is intended for use with these
peripherals:
• Brown-out Reset (BOR)
• Watchdog Timer (WDT)
• External interrupt pin/Interrupt-on-change pins
• Timer1 (with external clock source)
The Complementary Waveform Generator (CWG), the
Numerically Controlled Oscillator (NCO) and the Con-
figurable Logic Cell (CLC) modules can utilize the
HFINTOSC oscillator as either a clock source or as an
input source. Under certain conditions, when the
HFINTOSC is selected for use with the CWG, NCO or
CLC modules, the HFINTOSC will remain active
during Sleep. This will have a direct effect on the
Sleep mode current.
Please refer to sections Section 22.5 “Operation
During Sleep”, 23.7 “Operation In Sleep” and 24.10
“Operation During Sleep” for more information.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
CLKIN(1)
CLKOUT(2)
Interrupt flag
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC - 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency(4)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Forced NOP
PC + 2 0004h 0005h
Forced NOP
TOST(3)
PC + 2
Note 1: External clock. High, Medium, Low mode assumed.
2: CLKOUT is shown here for timing reference.
3: TOST = 1024 TOSC. This delay does not apply to EC, RC and INTOSC Oscillator modes.
4: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.
Note: The PIC12LF1501 does not have a con-
figurable Low-Power Sleep mode.
PIC12LF1501 is an unregulated device
and is always in the lowest power state
when in Sleep, with no wake-up time pen-
alty. This device has a lower maximum
VDD and I/O voltage than the
PIC12F1501. See Section
27.0 “Electrical Specifications” for
more information.
PIC12(L)F1501
DS40001615C-page 74 2011-2015 Microchip Technology Inc.
8.3 Register Definitions: Voltage Regulator Control
TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE
REGISTER 8-1: VREGCON: VOLTAGE REGULATOR CONTROL REGISTER(1)
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-1/1
— — — — — —VREGPMReserved
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’
bit 1 VREGPM: Voltage Regulator Power Mode Selection bit
1 = Low-Power Sleep mode enabled in Sleep(2)
Draws lowest current in Sleep, slower wake-up
0 = Normal Power mode enabled in Sleep(2)
Draws higher current in Sleep, faster wake-up
bit 0 Reserved: Read as ‘1’. Maintain this bit set.
Note 1: PIC12F1501 only.
2: See Section 27.0 “Electrical Specifications”.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register on
Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
IOCAF —— IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 103
IOCAN —— IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 103
IOCAP —— IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 103
PIE1 TMR1GIE ADIE ———— TMR2IE TMR1IE 65
PIE2 ——C1IE—— NCO1IE — — 66
PIE3 —————— CLC2IE CLC1IE 67
PIR1 TMR1GIF ADIF ———— TMR2IF TMR1IF 68
PIR2 ——C1IF—— NCO1IF — — 67
PIR3 —————— CLC2IF CLC1IF 70
STATUS — — —TOPD ZDC C17
WDTCON —— WDTPS<4:0> SWDTEN 77
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in Power-Down mode.
2011-2015 Microchip Technology Inc. DS40001615C-page 75
PIC12(L)F1501
9.0 WATCHDOG TIMER (WDT)
The Watchdog Timer is a system timer that generates
a Reset if the firmware does not issue a CLRWDT
instruction within the time-out period. The Watchdog
Timer is typically used to recover the system from
unexpected events.
The WDT has the following features:
• Independent clock source
• Multiple operating modes
- WDT is always on
- WDT is off when in Sleep
- WDT is controlled by software
- WDT is always off
• Configurable time-out period is from 1 ms to 256
seconds (nominal)
• Multiple Reset conditions
• Operation during Sleep
FIGURE 9-1: WATCHDOG TIMER BLOCK DIAGRAM
WDTE<1:0> = 01
SWDTEN
WDTE<1:0> = 11
WDTE<1:0> = 10
23-%it Programmable
Prescaler WDT
LFINTOSC
WDTPS<4:0>
WDT
Time-out
Sleep
Rev. 10-000141A
7/30/2013
PIC12(L)F1501
DS40001615C-page 76 2011-2015 Microchip Technology Inc.
9.1 Independent Clock Source
The WDT derives its time base from the 31 kHz
LFINTOSC internal oscillator. Time intervals in this
chapter are based on a nominal interval of 1 ms. See
Section 27.0 “Electrical Specifications” for the
LFINTOSC tolerances.
9.2 WDT Operating Modes
The Watchdog Timer module has four operating modes
controlled by the WDTE<1:0> bits in Configuration
Words. See Ta bl e 9 - 1 .
9.2.1 WDT IS ALWAYS ON
When the WDTE bits of Configuration Words are set to
‘11’, the WDT is always on.
WDT protection is active during Sleep.
9.2.2 WDT IS OFF IN SLEEP
When the WDTE bits of Configuration Words are set to
‘10’, the WDT is on, except in Sleep.
WDT protection is not active during Sleep.
9.2.3 WDT CONTROLLED BY SOFTWARE
When the WDTE bits of Configuration Words are set to
‘01’, the WDT is controlled by the SWDTEN bit of the
WDTCON register.
WDT protection is unchanged by Sleep. See Table 9-1
for more details.
TABLE 9-1: WDT OPERATING MODES
9.3 Time-Out Period
The WDTPS bits of the WDTCON register set the
time-out period from 1 ms to 256 seconds (nominal).
After a Reset, the default time-out period is two
seconds.
9.4 Clearing the WDT
The WDT is cleared when any of the following condi-
tions occur:
•Any Reset
•CLRWDT instruction is executed
• Device enters Sleep
• Device wakes up from Sleep
• Oscillator fail
• WDT is disabled
See Table 9-2 for more information.
9.5 Operation During Sleep
When the device enters Sleep, the WDT is cleared. If
the WDT is enabled during Sleep, the WDT resumes
counting. When the device exits Sleep, the WDT is
cleared again.
When a WDT time-out occurs while the device is in
Sleep, no Reset is generated. Instead, the device
wakes up and resumes operation. The TO and PD bits
in the STATUS register are changed to indicate the
event. The RWDT bit in the PCON register can also be
used. See Section 3.0 “Memory Organization” for
more information.
WDTE<1:0> SWDTEN Device
Mode WDT
Mode
11 X XActive
10 X Awake Active
Sleep Disabled
01 1XActive
0X Disabled
00 X X Disabled
TABLE 9-2: WDT CLEARING CONDITIONS
Conditions WDT
WDTE<1:0> = 00
Cleared
WDTE<1:0> = 01 and SWDTEN = 0
WDTE<1:0> = 10 and enter Sleep
CLRWDT Command
Oscillator Fail Detected
Exit Sleep + System Clock = INTOSC, EXTCLK
Change INTOSC divider (IRCF bits) Unaffected
2011-2015 Microchip Technology Inc. DS40001615C-page 77
PIC12(L)F1501
9.6 Register Definitions: Watchdog Timer Control
REGISTER 9-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0 U-0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0
—— WDTPS<4:0> SWDTEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits(1)
Bit Value = Prescale Rate
11111 = Reserved. Results in minimum interval (1:32)
•
•
•
10011 = Reserved. Results in minimum interval (1:32)
10010 = 1:8388608 (223) (Interval 256s nominal)
10001 = 1:4194304 (222) (Interval 128s nominal)
10000 = 1:2097152 (221) (Interval 64s nominal)
01111 = 1:1048576 (220) (Interval 32s nominal)
01110 = 1:524288 (219) (Interval 16s nominal)
01101 = 1:262144 (218) (Interval 8s nominal)
01100 = 1:131072 (217) (Interval 4s nominal)
01011 = 1:65536 (Interval 2s nominal) (Reset value)
01010 = 1:32768 (Interval 1s nominal)
01001 = 1:16384 (Interval 512 ms nominal)
01000 = 1:8192 (Interval 256 ms nominal)
00111 = 1:4096 (Interval 128 ms nominal)
00110 = 1:2048 (Interval 64 ms nominal)
00101 = 1:1024 (Interval 32 ms nominal)
00100 = 1:512 (Interval 16 ms nominal)
00011 = 1:256 (Interval 8 ms nominal)
00010 = 1:128 (Interval 4 ms nominal)
00001 = 1:64 (Interval 2 ms nominal)
00000 = 1:32 (Interval 1 ms nominal)
bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit
If WDTE<1:0> = 1x:
This bit is ignored.
If WDTE<1:0> = 01:
1 = WDT is turned on
0 = WDT is turned off
If WDTE<1:0> = 00:
This bit is ignored.
Note 1: Times are approximate. WDT time is based on 31 kHz LFINTOSC.
PIC12(L)F1501
DS40001615C-page 78 2011-2015 Microchip Technology Inc.
TABLE 9-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
TABLE 9-4: SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
OSCCON — IRCF<3:0> —SCS<1:0>
49
PCON STKOVF STKUNF —RWDTRMCLR RI POR BOR 57
STATUS ———TOPD ZDC C17
WDTCON —— WDTPS<4:0> SWDTEN 77
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer.
Name Bits Bi t -/7 Bit -/6 B it 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — — — CLKOUTEN BOREN<1:0> —38
7:0 CP MCLRE PWRTE WDTE<1:0> —FOSC<1:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer.
2011-2015 Microchip Technology Inc. DS40001615C-page 79
PIC12(L)F1501
10.0 FLASH PROGRAM MEMORY
CONTROL
The Flash program memory is readable and writable
during normal operation over the full VDD range.
Program memory is indirectly addressed using Special
Function Registers (SFRs). The SFRs used to access
program memory are:
•PMCON1
•PMCON2
•PMDATL
•PMDATH
• PMADRL
•PMADRH
When accessing the program memory, the
PMDATH:PMDATL register pair forms a 2-byte word
that holds the 14-bit data for read/write, and the
PMADRH:PMADRL register pair forms a 2-byte word
that holds the 15-bit address of the program memory
location being read.
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip charge
pump rated to operate over the operating voltage range
of the device.
The Flash program memory can be protected in two
ways; by code protection (CP bit in Configuration Words)
and write protection (WRT<1:0> bits in Configuration
Words).
Code protection (CP = 0)(1), disables access, reading
and writing, to the Flash program memory via external
device programmers. Code protection does not affect
the self-write and erase functionality. Code protection
can only be reset by a device programmer performing
a Bulk Erase to the device, clearing all Flash program
memory, Configuration bits and User IDs.
Write protection prohibits self-write and erase to a
portion or all of the Flash program memory, as defined
by the bits WRT<1:0>. Write protection does not affect
a device programmers ability to read, write or erase the
device.
10.1 PMADRL and PMADRH Registers
The PMADRH:PMADRL register pair can address up
to a maximum of 32K words of program memory. When
selecting a program address value, the MSB of the
address is written to the PMADRH register and the LSB
is written to the PMADRL register.
10.1.1 PMCON1 AND PMCON2
REGISTERS
PMCON1 is the control register for Flash program
memory accesses.
Control bits RD and WR initiate read and write,
respectively. These bits cannot be cleared, only set, in
software. They are cleared by hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental, premature
termination of a write operation.
The WREN bit, when set, will allow a write operation to
occur. On power-up, the WREN bit is clear. The
WRERR bit is set when a write operation is interrupted
by a Reset during normal operation. In these situations,
following Reset, the user can check the WRERR bit
and execute the appropriate error handling routine.
The PMCON2 register is a write-only register. Attempting
to read the PMCON2 register will return all ‘0’s.
To enable writes to the program memory, a specific
pattern (the unlock sequence), must be written to the
PMCON2 register. The required unlock sequence
prevents inadvertent writes to the program memory
write latches and Flash program memory.
10.2 Flash Program Memory Overview
It is important to understand the Flash program memory
structure for erase and programming operations. Flash
program memory is arranged in rows. A row consists of
a fixed number of 14-bit program memory words. A row
is the minimum size that can be erased by user software.
After a row has been erased, the user can reprogram
all or a portion of this row. Data to be written into the
program memory row is written to 14-bit wide data write
latches. These write latches are not directly accessible
to the user, but may be loaded via sequential writes to
the PMDATH:PMDATL register pair.
See Table 10-1 for Erase Row size and the number of
write latches for Flash program memory.
Note 1: Code protection of the entire Flash
program memory array is enabled by
clearing the CP bit of Configuration Words.
Note: If the user wants to modify only a portion
of a previously programmed row, then the
contents of the entire row must be read
and saved in RAM prior to the erase.
Then, new data and retained data can be
written into the write latches to reprogram
the row of Flash program memory. How-
ever, any unprogrammed locations can be
written without first erasing the row. In this
case, it is not necessary to save and
rewrite the other previously programmed
locations.
TABLE 10-1: FLASH MEMORY
ORGANIZATION BY DEVICE
Device Row Erase
(words)
Write
Latches
(words)
PIC12(L)F1501 16 16
PIC12(L)F1501
DS40001615C-page 80 2011-2015 Microchip Technology Inc.
10.2.1 READING THE FLASH PROGRAM
MEMORY
To read a program memory location, the user must:
1. Write the desired address to the
PMADRH:PMADRL register pair.
2. Clear the CFGS bit of the PMCON1 register.
3. Then, set control bit RD of the PMCON1 register.
Once the read control bit is set, the program memory
Flash controller will use the second instruction cycle to
read the data. This causes the second instruction
immediately following the “BSF PMCON1,RD” instruction
to be ignored. The data is available in the very next cycle,
in the PMDATH:PMDATL register pair; therefore, it can
be read as two bytes in the following instructions.
PMDATH:PMDATL register pair will hold this value until
another read or until it is written to by the user.
FIGURE 10-1: FLASH PROGRAM
MEMORY READ
FLOWCHART
Note: The two instructions following a program
memory read are required to be NOPs.
This prevents the user from executing a
2-cycle instruction on the next instruction
after the RD bit is set.
Start
Read Operation
Select
Program or Configuration Memory
(CFGS)
Select
Word Address
(PMADRH:PMADRL)
Initiate Read operation
(RD = 1)
Instruction fetched ignored
NOP execution forced
Data read now in
PMDATH:PMDATL
Instruction fetched ignored
NOP execution forced
End
Read Operation
Rev. 10-000046A
7/30/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 81
PIC12(L)F1501
FIGURE 10-2: FLASH PROGRAM MEMORY READ CYCLE EXECUTION
EXAMPLE 10-1: FLASH PROGRAM MEMORY READ
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
BSF PMCON1,RD
executed here
INSTR(PC + 1)
executed here
PC
PC + 1 PMADRH,PMADRL PC+3 PC + 5
Flash ADDR
RD bit
PMDATH,PMDATL
PC + 3 PC + 4
INSTR (PC + 1)
INSTR(PC - 1)
executed here INSTR(PC + 3)
executed here INSTR(PC + 4)
executed here
Flash Data
PMDATH
PMDATL
Register
INSTR (PC) INSTR (PC + 3) INSTR (PC + 4)
instruction ignored
Forced NOP
INSTR(PC + 2)
executed here
instruction ignored
Forced NOP
* This code block will read 1 word of program
* memory at the memory address:
PROG_ADDR_HI : PROG_ADDR_LO
* data will be returned in the variables;
* PROG_DATA_HI, PROG_DATA_LO
BANKSEL PMADRL ; Select Bank for PMCON registers
MOVLW PROG_ADDR_LO ;
MOVWF PMADRL ; Store LSB of address
MOVLW PROG_ADDR_HI ;
MOVWF PMADRH ; Store MSB of address
BCF PMCON1,CFGS ; Do not select Configuration Space
BSF PMCON1,RD ; Initiate read
NOP ; Ignored (Figure 10-2)
NOP ; Ignored (Figure 10-2)
MOVF PMDATL,W ; Get LSB of word
MOVWF PROG_DATA_LO ; Store in user location
MOVF PMDATH,W ; Get MSB of word
MOVWF PROG_DATA_HI ; Store in user location
PIC12(L)F1501
DS40001615C-page 82 2011-2015 Microchip Technology Inc.
10.2.2 FLASH MEMORY UNLOCK
SEQUENCE
The unlock sequence is a mechanism that protects the
Flash program memory from unintended self-write pro-
gramming or erasing. The sequence must be executed
and completed without interruption to successfully
complete any of the following operations:
•Row Erase
• Load program memory write latches
• Write of program memory write latches to
program memory
• Write of program memory write latches to User
IDs
The unlock sequence consists of the following steps:
1. Write 55h to PMCON2
2. Write AAh to PMCON2
3. Set the WR bit in PMCON1
4. NOP instruction
5. NOP instruction
Once the WR bit is set, the processor will always force
two NOP instructions. When an Erase Row or Program
Row operation is being performed, the processor will stall
internal operations (typical 2 ms), until the operation is
complete and then resume with the next instruction.
When the operation is loading the program memory write
latches, the processor will always force the two NOP
instructions and continue uninterrupted with the next
instruction.
Since the unlock sequence must not be interrupted,
global interrupts should be disabled prior to the unlock
sequence and re-enabled after the unlock sequence is
completed.
FIGURE 10-3: FLASH PROGRAM
MEMORY UNLOCK
SEQUENCE FLOWCHART
Start
Unlock Sequence
End
Unlock Sequence
Write 0x55 to
PMCON2
Write 0xAA to
PMCON2
Initiate
Write or Erase operation
(WR = 1)
Instruction fetched ignored
NOP execution forced
Instruction fetched ignored
NOP execution forced
Rev. 10-000047A
7/30/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 83
PIC12(L)F1501
10.2.3 ERASING FLASH PROGRAM
MEMORY
While executing code, program memory can only be
erased by rows. To erase a row:
1. Load the PMADRH:PMADRL register pair with
any address within the row to be erased.
2. Clear the CFGS bit of the PMCON1 register.
3. Set the FREE and WREN bits of the PMCON1
register.
4. Write 55h, then AAh, to PMCON2 (Flash
programming unlock sequence).
5. Set control bit WR of the PMCON1 register to
begin the erase operation.
See Example 10-2.
After the “BSF PMCON1,WR” instruction, the processor
requires two cycles to set up the erase operation. The
user must place two NOP instructions immediately
following the WR bit set instruction. The processor will
halt internal operations for the typical 2 ms erase time.
This is not Sleep mode as the clocks and peripherals
will continue to run. After the erase cycle, the processor
will resume operation with the third instruction after the
PMCON1 write instruction.
FIGURE 10-4: FLASH PROGRAM
MEMORY ERASE
FLOWCHART
Start
Erase Operation
End
Erase Operation
Disable Interrupts
(GIE = 0)
Select
Program or Configuration Memory
(CFGS)
Select Erase Operation
(FREE = 1)
Select Row Address
(PMADRH:PMADRL)
Enable Write/Erase Operation
(WREN = 1)
Unlock Sequence
(See Note 1)
Re-enable Interrupts
(GIE = 1)
Disable Write/Erase Operation
(WREN = 0)
CPU stalls while
Erase operation completes
(2 ms typical)
Rev. 10-000048A
7/30/2013
Note 1: See Figure 10-3.
PIC12(L)F1501
DS40001615C-page 84 2011-2015 Microchip Technology Inc.
EXAMPLE 10-2: ERASING ONE ROW OF PROGRAM MEMORY
; This row erase routine assumes the following:
; 1. A valid address within the erase row is loaded in ADDRH:ADDRL
; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM)
BCF INTCON,GIE ; Disable ints so required sequences will execute properly
BANKSEL PMADRL
MOVF ADDRL,W ; Load lower 8 bits of erase address boundary
MOVWF PMADRL
MOVF ADDRH,W ; Load upper 6 bits of erase address boundary
MOVWF PMADRH
BCF PMCON1,CFGS ; Not configuration space
BSF PMCON1,FREE ; Specify an erase operation
BSF PMCON1,WREN ; Enable writes
MOVLW 55h ; Start of required sequence to initiate erase
MOVWF PMCON2 ; Write 55h
MOVLW 0AAh ;
MOVWF PMCON2 ; Write AAh
BSF PMCON1,WR ; Set WR bit to begin erase
NOP ; NOP instructions are forced as processor starts
NOP ; row erase of program memory.
;
; The processor stalls until the erase process is complete
; after erase processor continues with 3rd instruction
BCF PMCON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts
Required
Sequence
2011-2015 Microchip Technology Inc. DS40001615C-page 85
PIC12(L)F1501
10.2.4 WRITING TO FLASH PROGRAM
MEMORY
Program memory is programmed using the following
steps:
1. Load the address in PMADRH:PMADRL of the
row to be programmed.
2. Load each write latch with data.
3. Initiate a programming operation.
4. Repeat steps 1 through 3 until all data is written.
Before writing to program memory, the word(s) to be
written must be erased or previously unwritten. Pro-
gram memory can only be erased one row at a time. No
automatic erase occurs upon the initiation of the write.
Program memory can be written one or more words at
a time. The maximum number of words written at one
time is equal to the number of write latches. See
Figure 10-5 (row writes to program memory with 16
write latches) for more details.
The write latches are aligned to the Flash row address
boundary defined by the upper 10-bits of
PMADRH:PMADRL, (PMADRH<6:0>:PMADRL<7:5>)
with the lower five bits of PMADRL, (PMADRL<4:0>)
determining the write latch being loaded. Write opera-
tions do not cross these boundaries. At the completion
of a program memory write operation, the data in the
write latches is reset to contain 0x3FFF.
The following steps should be completed to load the
write latches and program a row of program memory.
These steps are divided into two parts. First, each write
latch is loaded with data from the PMDATH:PMDATL
using the unlock sequence with LWLO = 1. When the
last word to be loaded into the write latch is ready, the
LWLO bit is cleared and the unlock sequence
executed. This initiates the programming operation,
writing all the latches into Flash program memory.
1. Set the WREN bit of the PMCON1 register.
2. Clear the CFGS bit of the PMCON1 register.
3. Set the LWLO bit of the PMCON1 register.
When the LWLO bit of the PMCON1 register is
‘1’, the write sequence will only load the write
latches and will not initiate the write to Flash
program memory.
4. Load the PMADRH:PMADRL register pair with
the address of the location to be written.
5. Load the PMDATH:PMDATL register pair with
the program memory data to be written.
6. Execute the unlock sequence (Section
10.2.2 “Flash Memory Unlock Sequence”).
The write latch is now loaded.
7. Increment the PMADRH:PMADRL register pair
to point to the next location.
8. Repeat steps 5 through 7 until all but the last
write latch has been loaded.
9. Clear the LWLO bit of the PMCON1 register.
When the LWLO bit of the PMCON1 register is
‘0’, the write sequence will initiate the write to
Flash program memory.
10. Load the PMDATH:PMDATL register pair with
the program memory data to be written.
11. Execute the unlock sequence (Section
10.2.2 “Flash Memory Unlock Sequence”).
The entire program memory latch content is now
written to Flash program memory.
An example of the complete write sequence is shown in
Example 10-3. The initial address is loaded into the
PMADRH:PMADRL register pair; the data is loaded
using indirect addressing.
Note: The special unlock sequence is required
to load a write latch with data or initiate a
Flash programming operation. If the
unlock sequence is interrupted, writing to
the latches or program memory will not be
initiated.
Note: The program memory write latches are
reset to the blank state (0x3FFF) at the
completion of every write or erase
operation. As a result, it is not necessary
to load all the program memory write
latches. Unloaded latches will remain in
the blank state.
2011-2015 Microchip Technology Inc. Status DS40001615C-page 86
PIC12(L)F1501
FIGURE 10-5: BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 16 WRITE LATCHES
6 8
14
1414
Write Latch #15
0Fh
1414
Program Memory Write Latches
14 14 14
PMADRH<6:0>:
PMADRL<7:4>
Flash Program Memory
Row
Row
Address
Decode
Addr
Write Latch #14
0Eh
Write Latch #1
01h
Write Latch #0
00h
Addr Addr Addr
000h 000Fh
000Eh
0000h 0001h
001h 001Fh
001Eh
0010h 0011h
002h 002Fh002Eh0020h 0021h
7FEh 7FEFh7FEEh
7FE0h 7FE1h
7FFh 7FFFh7FFEh7FF0h 7FF1h
14
PMADRL<3:0>
800h 8009h - 801Fh8000h - 8003h
Configuration
Words
USERID0-3
8007h –8008h8006h
DEVICE ID
Dev / Rev
reserved reserved
Configuration Memory
CFGS = 0
CFGS = 1
PMADRH PMADRL
76 07 43 0
c3 c2 c1 c0r9 r8 r7 r6 r5 r4 r3-r1 r0r2
PMDATH PMDATL
75 07 0
--
8004h –8005h
411
rA
Rev. 10-000004B
7/25/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 87
PIC12(L)F1501
FIGURE 10-6: FLASH MEMORY WRITE FLOWCHART
Start
Write Operation
End
Write Operation
CPU stalls while Write
operation completes
(2 ms typical)
No delay when writing to
Program Memory Latches
Determine number of
words to be written into
Program or Configuration
Memory. The number of
words cannot exceed the
number of words per row
(word_cnt)
Last word to
write ?
Disable Interrupts
(GIE = 0)
Select
Program or Config.
Memory (CFGS)
Select Row Address
(PMADRH:PMADRL)
Select Write Operation
(FREE = 0)
Load Write Latches Only
(LWLO = 1)
Enable Write/Erase
Operation (WREN = 1)
Load the value to write
(PMDATH:PMDATL)
Update the word counter
(word_cnt--)
Unlock Sequence
(See Note 1)
Increment Address
(PMADRH:PMADRL++)
Write Latches to Flash
(LWLO = 0)
Unlock Sequence
(See Note 1)
Disable Write/Erase
Operation (WREN = 0)
Re-enable Interrupts
(GIE = 1)
Yes
No
Rev. 10-000049A
7/30/2013
Note 1: See Figure 10-3.
PIC12(L)F1501
DS40001615C-page 88 2011-2015 Microchip Technology Inc.
EXAMPLE 10-3: WRITING TO FLASH PROGRAM MEMORY (16 WRITE LATCHES)
; This write routine assumes the following:
; 1. 32 bytes of data are loaded, starting at the address in DATA_ADDR
; 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR,
; stored in little endian format
; 3. A valid starting address (the least significant bits = 00000) is loaded in ADDRH:ADDRL
; 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F (common RAM)
;BCF INTCON,GIE ; Disable ints so required sequences will execute properly
BANKSEL PMADRH ; Bank 3
MOVF ADDRH,W ; Load initial address
MOVWF PMADRH ;
MOVF ADDRL,W ;
MOVWF PMADRL ;
MOVLW LOW DATA_ADDR ; Load initial data address
MOVWF FSR0L ;
MOVLW HIGH DATA_ADDR ; Load initial data address
MOVWF FSR0H ;
BCF PMCON1,CFGS ; Not configuration space
BSF PMCON1,WREN ; Enable writes
BSF PMCON1,LWLO ; Only Load Write Latches
LOOP MOVIW FSR0++ ; Load first data byte into lower
MOVWF PMDATL ;
MOVIW FSR0++ ; Load second data byte into upper
MOVWF PMDATH ;
MOVF PMADRL,W ; Check if lower bits of address are '00000'
XORLW 0x0F ; Check if we're on the last of 16 addresses
ANDLW 0x0F ;
BTFSC STATUS,Z ; Exit if last of 16 words,
GOTO START_WRITE ;
MOVLW 55h ; Start of required write sequence:
MOVWF PMCON2 ; Write 55h
MOVLW 0AAh ;
MOVWF PMCON2 ; Write AAh
BSF PMCON1,WR ; Set WR bit to begin write
NOP ; NOP instructions are forced as processor
; loads program memory write latches
NOP ;
INCF PMADRL,F ; Still loading latches Increment address
GOTO LOOP ; Write next latches
START_WRITE
BCF PMCON1,LWLO ; No more loading latches - Actually start Flash program
; memory write
MOVLW 55h ; Start of required write sequence:
MOVWF PMCON2 ; Write 55h
MOVLW 0AAh ;
MOVWF PMCON2 ; Write AAh
BSF PMCON1,WR ; Set WR bit to begin write
NOP ; NOP instructions are forced as processor writes
; all the program memory write latches simultaneously
NOP ; to program memory.
; After NOPs, the processor
; stalls until the self-write process in complete
; after write processor continues with 3rd instruction
BCF PMCON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts
Required
Sequence
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PIC12(L)F1501
10.3 Modifying Flash Program Memory
When modifying existing data in a program memory
row, and data within that row must be preserved, it must
first be read and saved in a RAM image. Program
memory is modified using the following steps:
1. Load the starting address of the row to be
modified.
2. Read the existing data from the row into a RAM
image.
3. Modify the RAM image to contain the new data
to be written into program memory.
4. Load the starting address of the row to be
rewritten.
5. Erase the program memory row.
6. Load the write latches with data from the RAM
image.
7. Initiate a programming operation.
FIGURE 10-7: FLASH PROGRAM
MEMORY MODIFY
FLOWCHART
Start
Modify Operation
End
Modify Operation
Read Operation
(See Note 1)
An image of the entire row
read must be stored in RAM
Erase Operation
(See Note 2)
Modify Image
The words to be modified are
changed in the RAM image
Write Operation
Use RAM image
(See Note 3)
Rev. 10-000050A
7/30/2013
Note 1: See Figure 10-2.
2: See Figure 10-4.
3: See Figure 10-5.
PIC12(L)F1501
DS40001615C-page 90 2011-2015 Microchip Technology Inc.
10.4 User ID, Device ID and
Configurati on Word Access
Instead of accessing program memory, the User ID’s,
Device ID/Revision ID and Configuration Words can be
accessed when CFGS = 1 in the PMCON1 register.
This is the region that would be pointed to by
PC<15> = 1, but not all addresses are accessible.
Different access may exist for reads and writes. Refer
to Tab le 10-2 .
When read access is initiated on an address outside
the parameters listed in Tab le 1 0-2 , the
PMDATH:PMDATL register pair is cleared, reading
back ‘0’s.
TABLE 10-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1)
EXAMPLE 10-4: CONFIGURATION WORD AND DEVICE ID ACCESS
Address Function Read Access Write Access
8000h-8003h User IDs Yes Yes
8006h Device ID/Revision ID Yes No
8007h-8008h Configuration Words 1 and 2 Yes No
* This code block will read 1 word of program memory at the memory address:
* PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables;
* PROG_DATA_HI, PROG_DATA_LO
BANKSEL PMADRL ; Select correct Bank
MOVLW PROG_ADDR_LO ;
MOVWF PMADRL ; Store LSB of address
CLRF PMADRH ; Clear MSB of address
BSF PMCON1,CFGS ; Select Configuration Space
BCF INTCON,GIE ; Disable interrupts
BSF PMCON1,RD ; Initiate read
NOP ; Executed (See Figure 10-2)
NOP ; Ignored (See Figure 10-2)
BSF INTCON,GIE ; Restore interrupts
MOVF PMDATL,W ; Get LSB of word
MOVWF PROG_DATA_LO ; Store in user location
MOVF PMDATH,W ; Get MSB of word
MOVWF PROG_DATA_HI ; Store in user location
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10.5 Write Verify
It is considered good programming practice to verify that
program memory writes agree with the intended value.
Since program memory is stored as a full page then the
stored program memory contents are compared with the
intended data stored in RAM after the last write is
complete.
FIGURE 10-8: FLASH PROGRAM
MEMORY VERIFY
FLOWCHART
Start
Verify Operation
This routine assumes that the last
rowofdatawrittenwasfroman
image saved on RAM. This image
will be used to verify the data
currently stored in Flash Program
Memory
Fail
Verify Operation
Last word ?
PMDAT =
RAM image ?
Read Operation
(See Note 1)
End
Verify Operation
No
No
Yes
Yes
Rev. 10-000051A
7/30/2013
Note 1: See Figure 10-2.
PIC12(L)F1501
DS40001615C-page 92 2011-2015 Microchip Technology Inc.
10.6 Register Definitions: Flash Program Memory Control
REGISTER 10-1: PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
PMDAT<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PMDAT<7:0>: Read/write value for Least Significant bits of program memory
REGISTER 10-2: PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER
U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
—— PMDAT<13:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 PMDAT<13:8>: Read/write value for Most Significant bits of program memory
REGISTER 10-3: PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
PMADR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PMADR<7:0>: Specifies the Least Significant bits for program memory address
REGISTER 10-4: PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER
U-1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—(1) PMADR<14:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘1’
bit 6-0 PMADR<14:8>: Specifies the Most Significant bits for program memory address
Note 1: Unimplemented, read as ‘1’.
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REGISTER 10-5: PMCON1: PROGRAM MEMORY CONTROL 1 REGISTER
U-1 R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W/HC-x/q(2) R/W-0/0 R/S/HC-0/0 R/S/HC-0/0
—(1) CFGS LWLO FREE WRERR WREN WR RD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware
bit 7 Unimplemented: Read as ‘1’
bit 6 CFGS: Configuration Select bit
1 = Access Configuration, User ID and Device ID Registers
0 = Access Flash program memory
bit 5 LWLO: Load Write Latches Only bit(3)
1 = Only the addressed program memory write latch is loaded/updated on the next WR command
0 = The addressed program memory write latch is loaded/updated and a write of all program memory write latches
will be initiated on the next WR command
bit 4 FREE: Program Flash Erase Enable bit
1 = Performs an erase operation on the next WR command (hardware cleared upon completion)
0 = Performs a write operation on the next WR command
bit 3 WRERR: Program/Erase Error Flag bit
1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set automatically
on any set attempt (write ‘1’) of the WR bit).
0 = The program or erase operation completed normally.
bit 2 WREN: Program/Erase Enable bit
1 = Allows program/erase cycles
0 = Inhibits programming/erasing of program Flash
bit 1 WR: Write Control bit
1 = Initiates a program Flash program/erase operation.
The operation is self-timed and the bit is cleared by hardware once operation is complete.
The WR bit can only be set (not cleared) in software.
0 = Program/erase operation to the Flash is complete and inactive.
bit 0 RD: Read Control bit
1 = Initiates a program Flash read. Read takes one cycle. RD is cleared in hardware. The RD bit can only be set
(not cleared) in software.
0 = Does not initiate a program Flash read.
Note 1: Unimplemented bit, read as ‘1’.
2: The WRERR bit is automatically set by hardware when a program memory write or erase operation is started (WR = 1).
3: The LWLO bit is ignored during a program memory erase operation (FREE = 1).
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DS40001615C-page 94 2011-2015 Microchip Technology Inc.
TABLE 10-3: SUMMARY OF REGISTERS ASSOCIATED WITH FLASH PROGRAM MEMORY
TABLE 10-4: SUMMARY OF CONFIGURATION WORD WITH RESETS
REGISTER 10-6: PMCON2: PROGRAM MEMORY CONTROL 2 REGISTER
W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0
Program Memory Control Register 2
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 Flash Memory Unlock Pattern bits
To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the
PMCON1 register. The value written to this register is used to unlock the writes. There are specific
timing requirements on these writes.
Name Bit 7 B it 6 Bit 5 B it 4 B it 3 B it 2 B it 1 Bit 0 Register on
Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
PMCON1 —(1) CFGS LWLO FREE WRERR WREN WR RD 93
PMCON2 Program Memory Control Register 2 94
PMADRL PMADRL<7:0> 92
PMADRH —(1) PMADRH<6:0> 92
PMDATL PMDATL<7:0> 92
PMDATH ——PMDATH<5:0> 92
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Flash program memory.
Note 1: Unimplemented, read as ‘1’.
Name Bits Bit -/7 Bit -/6 Bi t 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — — — CLKOUTEN BOREN<1:0> —38
7:0 CP MCLRE PWRTE WDTE<1:0> —FOSC<1:0>
CONFIG2 13:8 — — LVP DEBUG LPBOR BORV STVREN —39
7:0 — — — — — —WRT<1:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Resets.
2011-2015 Microchip Technology Inc. DS40001615C-page 95
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11.0 I/O PORTS
Each port has three standard registers for its operation.
These registers are:
• TRISx registers (data direction)
• PORTx registers (reads the levels on the pins of
the device)
• LATx registers (output latch)
Some ports may have one or more of the following
additional registers. These registers are:
• ANSELx (analog select)
• WPUx (weak pull-up)
In general, when a peripheral is enabled on a port pin,
that pin cannot be used as a general purpose output.
However, the pin can still be read.
The Data Latch (LATx registers) is useful for
read-modify-write operations on the value that the I/O
pins are driving.
A write operation to the LATx register has the same
effect as a write to the corresponding PORTx register.
A read of the LATx register reads of the values held in
the I/O PORT latches, while a read of the PORTx
register reads the actual I/O pin value.
Ports that support analog inputs have an associated
ANSELx register. When an ANSEL bit is set, the digital
input buffer associated with that bit is disabled.
Disabling the input buffer prevents analog signal levels
on the pin between a logic high and low from causing
excessive current in the logic input circuitry. A
simplified model of a generic I/O port, without the
interfaces to other peripherals, is shown in Figure 11-1.
FIGURE 11-1: GENERIC I/O PORT
OPERATION
TABLE 11-1: PORT AVAILABILITY PER
DEVICE
Device
PORT A
PORTB
PORTC
PIC12(L)F1501 ●
Write LATx
Write PORTx
Data bus
Read PORTx
To digital peripherals
To analog peripherals
Data Register
TRISx
VSS
I/O pin
ANSELx
DQ
CK
Read LATx
VDD
Rev. 10-000052A
7/30/2013
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DS40001615C-page 96 2011-2015 Microchip Technology Inc.
11.1 Alternate Pin Function
The Alternate Pin Function Control (APFCON) register
is used to steer specific peripheral input and output
functions between different pins. The APFCON register
is shown in Register 11-1. For this device family, the
following functions can be moved between different
pins.
•T1G
•CLC1
• NCO1
•CWG1A
•CWG1B
These bits have no effect on the values of any TRIS
register. PORT and TRIS overrides will be routed to the
correct pin. The unselected pin will be unaffected.
11.2 Register Definitions: Alternate Pin Function Control
REGISTER 11-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER
R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 U-0 R/W-0/0 R/W-0/0
CWG1BSEL CWG1ASEL — — T1GSEL —CLC1SEL NCO1SEL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CWG1BSEL: Pin Selection bit
1 = CWG1B function is on RA4
0 = CWG1B function is on RA0
bit 6 CWG1ASEL: Pin Selection bit
1 = CWG1A function is on RA5
0 = CWG1A function is on RA2
bit 5-4 Unimplemented: Read as ‘0’
bit 3 T1GSEL: Pin Selection bit
1 = T1G function is on RA3
0 = T1G function is on RA4
bit 2 Unimplemented: Read as ‘0’
bit 1 CLC1SEL: Pin Selection bit
1 = CLC1 function is on RA4
0 = CLC1 function is on RA2
bit 0 NCO1SEL: Pin Selection bit
1 = NCO1 function is on RA5
0 = NCO1 function is on RA1
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11.3 PORTA Registers
11.3.1 DATA REGISTER
PORTA is a 6-bit wide, bidirectional port. The
corresponding data direction register is TRISA
(Register 11-3). Setting a TRISA bit (= 1) will make the
corresponding PORTA pin an input (i.e., disable the
output driver). Clearing a TRISA bit (= 0) will make the
corresponding PORTA pin an output (i.e., enables
output driver and puts the contents of the output latch
on the selected pin). The exception is RA3, which is
input-only and its TRIS bit will always read as ‘1’.
Example 11-1 shows how to initialize an I/O port.
Reading the PORTA register (Register 11-2) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch (LATA).
11.3.2 DIRECTION CONTROL
The TRISA register (Register 11-3) controls the
PORTA pin output drivers, even when they are being
used as analog inputs. The user should ensure the bits
in the TRISA register are maintained set when using
them as analog inputs. I/O pins configured as analog
input always read ‘0’.
11.3.3 ANALOG CONTROL
The ANSELA register (Register 11-5) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELA bit high will cause all
digital reads on the pin to be read as ‘0’ and allow
analog functions on the pin to operate correctly.
The state of the ANSELA bits has no effect on digital
output functions. A pin with TRIS clear and ANSEL set
will still operate as a digital output, but the Input mode
will be analog. This can cause unexpected behavior
when executing read-modify-write instructions on the
affected port.
EXAMPLE 11-1: INITIALIZI NG PORTA
11.3.4 PORTA FUNCTIONS AND OUTPUT
PRIORITIES
Each PORTA pin is multiplexed with other functions. The
pins, their combined functions and their output priorities
are shown in Table 11-2.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the highest priority.
Analog input functions, such as ADC and comparator
inputs, are not shown in the priority lists. These inputs
are active when the I/O pin is set for Analog mode using
the ANSELx registers. Digital output functions may
control the pin when it is in Analog mode with the
priority shown below in Table 11-2.
Note: The ANSELA bits default to the Analog
mode after Reset. To use any pins as
digital general purpose or peripheral
inputs, the corresponding ANSEL bits
must be initialized to ‘0’ by user software.
BANKSEL PORTA ;
CLRF PORTA ;Init PORTA
BANKSEL LATA ;Data Latch
CLRF LATA ;
BANKSEL ANSELA ;
CLRF ANSELA ;digital I/O
BANKSEL TRISA ;
MOVLW B'00111000' ;Set RA<5:3> as inputs
MOVWF TRISA ;and set RA<2:0> as
;outputs
TABLE 11-2: PORTA OUTPUT PRIORITY
Pin Name Functio n Priority(1)
RA0 ICSPDAT
DACOUT1
CWG1B(2)
PWM2
RA0
RA1 NCO1(2)
RA1
RA2 DACOUT2
CWG1A(2)
CLC1(2)
C1OUT
PWM1
RA2
RA3 None
RA4 CLKOUT
CWG1B(3)
CLC1(3)
PWM3
RA4
RA5 CWG1A(3)
CLC2
NCO1(3)
PWM4
RA5
Note 1: Priority listed from highest to lowest.
2: Default pin (see APFCON register).
3: Alternate pin (see APFCON register).
PIC12(L)F1501
DS40001615C-page 98 2011-2015 Microchip Technology Inc.
11 .4 Re g i s t er Definition s : P O R TA
REGISTER 11-2: PORTA: PORTA REGISTER
U-0 U-0 R/W-x/x R/W-x/x R-x/x R/W-x/x R/W-x/x R/W-x/x
—— RA5 RA4 RA3 RA2 RA1 RA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 RA<5:0>: PORTA I/O Value bits(1)
1 = Port pin is > VIH
0 = Port pin is < VIL
Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return
of actual I/O pin values.
REGISTER 11-3: TRISA: PORTA TRI-STATE REGISTER
U-0 U-0 R/W-1/1 R/W-1/1 U-1 R/W-1/1 R/W-1/1 R/W-1/1
—— TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 TRISA<5:4>: PORTA Tri-State Control bit
1 = PORTA pin configured as an input (tri-stated)
0 = PORTA pin configured as an output
bit 3 Unimplemented: Read as ‘1’
bit 2-0 TRISA<2:0>: PORTA Tri-State Control bit
1 = PORTA pin configured as an input (tri-stated)
0 = PORTA pin configured as an output
Note 1: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001615C-page 99
PIC12(L)F1501
REGISTER 11-4: LATA: PORTA DATA LATCH REGISTER
U-0 U-0 R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u
——LATA5LATA4— LATA2 LATA1 LATA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 LATA<5:4>: RA<5:4> Output Latch Value bits(1)
bit 3 Unimplemented: Read as ‘0’
bit 2-0 LATA<2:0>: RA<2:0> Output Latch Value bits(1)
Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return
of actual I/O pin values.
REGISTER 11-5: ANSELA: PORTA ANALOG SELECT REGISTER
U-0 U-0 U-0 R/W-1/1 U-0 R/W-1/1 R/W-1/1 R/W-1/1
— — — ANSA4 — ANSA2 ANSA1 ANSA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-5 Unimplemented: Read as ‘0’
bit 4 ANSA4: Analog Select between Analog or Digital Function on pins RA4, respectively
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
0 = Digital I/O. Pin is assigned to port or digital special function.
bit 3 Unimplemented: Read as ‘0’
bit 2-0 ANSA<2:0>: Analog Select between Analog or Digital Function on pins RA<2:0>, respectively
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
0 = Digital I/O. Pin is assigned to port or digital special function.
Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to
allow external control of the voltage on the pin.
PIC12(L)F1501
DS40001615C-page 100 2011-2015 Microchip Technology Inc.
TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
TABLE 11-4: SUMMARY OF CONFIGURATION WORD WITH PORTA
REGISTER 11-6: WPUA: WEAK PULL-UP PORTA REGISTER
U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
—— WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 WPUA<5:0>: Weak Pull-up Register bits(3)
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global WPUEN bit of the OPTION_REG register must be cleared for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is configured as an output.
3: For the WPUA3 bit, when MCLRE = 1, weak pull-up is internally enabled, but not reported here.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA — — —ANSA4 — ANSA2 ANSA1 ANSA0 99
APFCON CWG1BSEL CWG1ASEL — — T1GSEL —CLC1SEL NCO1SEL 96
LATA ——LATA5LATA4— LATA2 LATA1 LATA0 99
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 135
PORTA —— RA5 RA4 RA3 RA2 RA1 RA0 98
TRISA —— TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
WPUA —— WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 100
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA.
Note 1: Unimplemented, read as ‘1’.
Name Bit s Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — — —CLKOUTEN BOREN<1:0> —38
7:0 CP MCLRE PWRTE WDTE<1:0> —FOSC<1:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA.
2011-2015 Microchip Technology Inc. DS40001615C-page 101
PIC12(L)F1501
12.0 INTERRUPT-ON-CHANGE
The PORTA pins can be configured to operate as
Interrupt-on-Change (IOC) pins. An interrupt can be
generated by detecting a signal that has either a rising
edge or a falling edge. Any individual port pin, or
combination of port pins, can be configured to generate
an interrupt. The interrupt-on-change module has the
following features:
• Interrupt-on-Change enable (Master Switch)
• Individual pin configuration
• Rising and falling edge detection
• Individual pin interrupt flags
Figure 12-1 is a block diagram of the IOC module.
12.1 Enabling the Module
To allow individual port pins to generate an interrupt, the
IOCIE bit of the INTCON register must be set. If the
IOCIE bit is disabled, the edge detection on the pin will
still occur, but an interrupt will not be generated.
12.2 Individual Pin Configuration
For each port pin, a rising edge detector and a falling
edge detector are present. To enable a pin to detect a
rising edge, the associated bit of the IOCxP register is
set. To enable a pin to detect a falling edge, the
associated bit of the IOCxN register is set.
A pin can be configured to detect rising and falling
edges simultaneously by setting both associated bits of
the IOCxP and IOCxN registers, respectively.
12.3 Interrupt Flags
The IOCAFx bits located in the IOCAF register are
status flags that correspond to the interrupt-on-change
pins of the associated port. If an expected edge is
detected on an appropriately enabled pin, then the
status flag for that pin will be set, and an interrupt will be
generated if the IOCIE bit is set. The IOCIF bit of the
INTCON register reflects the status of all IOCAFx bits.
12.4 Clearing Interrupt Flags
The individual status flags, (IOCAFx bits), can be
cleared by resetting them to zero. If another edge is
detected during this clearing operation, the associated
status flag will be set at the end of the sequence,
regardless of the value actually being written.
In order to ensure that no detected edge is lost while
clearing flags, only AND operations masking out known
changed bits should be performed. The following
sequence is an example of what should be performed.
EXAMPLE 12-1: CLEARING INTERRUPT
FLAGS
(PORTA EXAMPLE)
12.5 Operation in Sleep
The interrupt-on-change interrupt sequence will wake
the device from Sleep mode, if the IOCIE bit is set.
If an edge is detected while in Sleep mode, the IOCxF
register will be updated prior to the first instruction
executed out of Sleep.
MOVLW 0xff
XORWF IOCAF, W
ANDWF IOCAF, F
PIC12(L)F1501
DS40001615C-page 102 2011-2015 Microchip Technology Inc.
FIGURE 12-1: INTE RRUP T-ON-CHANGE BLOCK DIAGRAM (PORTA EXAMPLE)
IOCANx
IOCAPx
Q2
Q4Q1
data bus =
0 or 1
write IOCAFx
IOCIE
to data bus
IOCAFx
edge
detect
IOC interrupt
to CPU core
from all other
IOCnFx individual
pin detectors
DQ
S
DQ
R
DQ
R
RAx
Q1
Q2
Q3
Q4
Q4Q1
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q4Q1 Q4Q1Q4Q1
FOSC
Rev . 10-000 037A
6/2/201 4
2011-2015 Microchip Technology Inc. DS40001615C-page 103
PIC12(L)F1501
12.6 Register Definitions: Interrupt-on-Change Control
REGISTER 12-1: IOCAP: INTERRUPT-ON-CHANGE PORTA POSITIVE EDGE REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—— IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IOCAP<5:0>: Interrupt-on-Change PORTA Positive Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a positive going edge. IOCAFx bit and IOCIF flag will be set
upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
REGISTER 12-2: IOCAN: INTERRUPT-ON-CHANGE PORTA NEGATIVE EDGE REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—— IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IOCAN<5:0>: Interrupt-on-Change PORTA Negative Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a negative going edge. IOCAFx bit and IOCIF flag will be set
upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
REGISTER 12-3: IOCAF: INTERRUPT-ON-CHANGE PORTA FLAG REGISTER
U-0 U-0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0
—— IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IOCAF<5:0>: Interrupt-on-Change PORTA Flag bits
1 = An enabled change was detected on the associated pin.
Set when IOCAPx = 1 and a rising edge was detected on RAx, or when IOCANx = 1 and a falling edge was
detected on RAx.
0 = No change was detected, or the user cleared the detected change.
PIC12(L)F1501
DS40001615C-page 104 2011-2015 Microchip Technology Inc.
TABLE 12-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA ———ANSA4— ANSA2 ANSA1 ANSA0 99
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
IOCAF —— IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 103
IOCAN —— IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 103
IOCAP —— IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 103
TRISA —— TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupt-on-change.
Note 1: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001615C-page 105
PIC12(L)F1501
13.0 FIXED VOLTAGE REFERENCE
(FVR)
The Fixed Voltage Reference (FVR) is a stable voltage
reference, independent of VDD, with a nominal output
level (VFVR) of 1.024V. The output of the FVR can be
configured to supply a reference voltage to the
following:
• ADC input channel
• Comparator positive input
• Comparator negative input
The FVR can be enabled by setting the FVREN bit of
the FVRCON register.
13.1 Independent Gain Amplifier
The output of the FVR supplied to the peripherals, (listed
above), is routed through a programmable gain amplifier.
Each amplifier can be programmed for a gain of 1x, 2x or
4x, to produce the three possible voltage levels.
The ADFVR<1:0> bits of the FVRCON register are
used to enable and configure the gain amplifier settings
for the reference supplied to the ADC module. Refer-
ence Section 15.0 “Analog-to-Digital Converter
(ADC) Module” for additional information.
The CDAFVR<1:0> bits of the FVRCON register are
used to enable and configure the gain amplifier settings
for the reference supplied to the comparator modules.
Reference Section 17.0 “Comparator Module” for
additional information.
To minimize current consumption when the FVR is
disabled, the FVR buffers should be turned off by
clearing the Buffer Gain Selection bits.
13.2 FVR Stabilization Period
When the Fixed Voltage Reference module is enabled,
it requires time for the reference and amplifier circuits
to stabilize. Once the circuits stabilize and are ready for
use, the FVRRDY bit of the FVRCON register will be
set. See the FVR Stabilization Period characterization
graph, Figure 28-52.
FIGURE 13-1: VOLTAGE REFERENCE BLOCK DIAGRAM
1x
2x
4x
1x
2x
4x
ADFVR<1:0>
CDAFVR<1:0>
FVR_buffer1
(To ADC Module)
FVR_buffer2
(To Comparators)
+
_
FVREN FVRRDY
Note 1
2
2
Rev. 10-000053A
8/6/2013
TABLE 13-1: PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR)
Peripheral Conditions Description
HFINTOSC FOSC<2:0> = 010 and
IRCF<3:0> = 000x
INTOSC is active and device is not in Sleep.
BOR
BOREN<1:0> = 11 BOR always enabled.
BOREN<1:0> = 10 and BORFS = 1BOR disabled in Sleep mode, BOR Fast Start enabled.
BOREN<1:0> = 01 and BORFS = 1BOR under software control, BOR Fast Start enabled.
LDO All PIC12F1501 devices, when
VREGPM = 1 and not in Sleep
The device runs off of the Low-Power Regulator when in Sleep
mode.
PIC12(L)F1501
DS40001615C-page 106 2011-2015 Microchip Technology Inc.
13.3 Register Definitions: FVR Control
TABLE 13-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE FIXED VOLTAGE REFERENCE
REGISTER 13-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER
R/W-0/0 R-q/q R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
FVREN(1) FVRRDY(2) TSEN(3) TSRNG(3) CDAFVR<1:0>(1) ADFVR<1:0>(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 FVREN: Fixed Voltage Reference Enable bit(1)
1 = Fixed Voltage Reference is enabled
0 = Fixed Voltage Reference is disabled
bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(2)
1 = Fixed Voltage Reference output is ready for use
0 = Fixed Voltage Reference output is not ready or not enabled
bit 5 TSEN: Temperature Indicator Enable bit(3)
1 = Temperature Indicator is enabled
0 = Temperature Indicator is disabled
bit 4 TSRNG: Temperature Indicator Range Selection bit(3)
1 =VOUT = VDD - 4VT (High Range)
0 =V
OUT = VDD - 2VT (Low Range)
bit 3-2 CDAFVR<1:0>: Comparator FVR Buffer Gain Selection bits(1)
11 = Comparator FVR Buffer Gain is 4x, with output voltage = 4x VFVR (4.096V nominal)(4)
10 = Comparator FVR Buffer Gain is 2x, with output voltage = 2x VFVR (2.048V nominal)(4)
01 = Comparator FVR Buffer Gain is 1x, with output voltage = 1x VFVR (1.024V nominal)
00 = Comparator FVR Buffer is off
bit 1-0 ADFVR<1:0>: ADC FVR Buffer Gain Selection bit(1)
11 = ADC FVR Buffer Gain is 4x, with output voltage = 4x VFVR (4.096V nominal)(4)
10 = ADC FVR Buffer Gain is 2x, with output voltage = 2x VFVR (2.048V nominal)(4)
01 = ADC FVR Buffer Gain is 1x, with output voltage = 1x VFVR (1.024V nominal)
00 = ADC FVR Buffer is off
Note 1: To minimize current consumption when the FVR is disabled, the FVR buffers should be turned off by clear-
ing the Buffer Gain Selection bits.
2: FVRRDY is always ‘1’ for the PIC12F1501 devices.
3: See Section 14.0 “Temperature Indicator Module” for additional information.
4: Fixed Voltage Reference output cannot exceed VDD.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on page
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR>1:0> ADFVR<1:0> 106
Legend: Shaded cells are unused by the Fixed Voltage Reference module.
2011-2015 Microchip Technology Inc. DS40001615C-page 107
PIC12(L)F1501
14.0 TEMPERATURE INDICATOR
MODULE
This family of devices is equipped with a temperature
circuit designed to measure the operating temperature
of the silicon die. The circuit’s range of operating
temperature falls between -40°C and +85°C. The
output is a voltage that is proportional to the device
temperature. The output of the temperature indicator is
internally connected to the device ADC.
The circuit may be used as a temperature threshold
detector or a more accurate temperature indicator,
depending on the level of calibration performed. A one-
point calibration allows the circuit to indicate a
temperature closely surrounding that point. A two-point
calibration allows the circuit to sense the entire range
of temperature more accurately. Reference Application
Note AN1333, “Use and Calibration of the Internal
Temperature Indicator” (DS01333) for more details
regarding the calibration process.
14.1 Circui t Operation
Figure 14-1 shows a simplified block diagram of the
temperature circuit. The proportional voltage output is
achieved by measuring the forward voltage drop across
multiple silicon junctions.
Equation 14-1 describes the output characteristics of
the temperature indicator.
EQUATION 14-1: VOUT RANGES
The temperature sense circuit is integrated with the
Fixed Voltage Reference (FVR) module. See Section
13.0 “Fixed Voltage Reference (FVR)” for more
information.
The circuit is enabled by setting the TSEN bit of the
FVRCON register. When disabled, the circuit draws no
current.
The circuit operates in either high or low range. The high
range, selected by setting the TSRNG bit of the
FVRCON register, provides a wider output voltage. This
provides more resolution over the temperature range,
but may be less consistent from part to part. This range
requires a higher bias voltage to operate and thus, a
higher VDD is needed.
The low range is selected by clearing the TSRNG bit of
the FVRCON register. The low range generates a lower
voltage drop and thus, a lower bias voltage is needed to
operate the circuit. The low range is provided for low
voltage operation.
FIGURE 14-1: TEMPERATURE CIRCUIT
DIAGRAM
14.2 Minim um Operating VDD
When the temperature circuit is operated in low range,
the device may be operated at any operating voltage
that is within specifications.
When the temperature circuit is operated in high range,
the device operating voltage, VDD, must be high
enough to ensure that the temperature circuit is
correctly biased.
Table 14-1 shows the recommended minimum VDD vs.
range setting.
TABLE 14-1: RECOMMENDED VDD VS.
RANGE
14.3 Temperature Output
The output of the circuit is measured using the internal
Analog-to-Digital Converter. A channel is reserved for
the temperature circuit output. Refer to Section
15.0 “Analog-to-Digital Converter (ADC) Module” for
detailed information.
14.4 ADC Acquisition Time
To ensure accurate temperature measurements, the
user must wait at least 200 s after the ADC input
multiplexer is connected to the temperature indicator
output before the conversion is performed. In addition,
the user must wait 200 s between sequential
conversions of the temperature indicator output.
High Range: VOUT = VDD - 4VT
Low Range: VOUT = VDD - 2VT
Min. VDD, TSRNG = 1Min. VDD, TSRNG = 0
3.6V 1.8V
VOUT
Temp. Indicator To ADC
TSRNG
TSEN
Rev. 10-000069A
7/31/2013
VDD
PIC12(L)F1501
DS40001615C-page 108 2011-2015 Microchip Technology Inc.
TABLE 14-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE T E MPERATURE INDICATOR
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on page
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR>1:0> ADFVR<1:0> 106
Legend: Shaded cells are unused by the temperature indicator module.
2011-2015 Microchip Technology Inc. DS40001615C-page 109
PIC12(L)F1501
15.0 ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESH:ADRESL register pair).
Figure 15-1 shows the block diagram of the ADC.
The ADC voltage reference is software selectable to be
either internally generated or externally supplied.
The ADC can generate an interrupt upon completion of
a conversion. This interrupt can be used to wake-up the
device from Sleep.
FIGURE 15-1: ADC B LOCK DIAGRAM
V
RPOS
V
RNEG
Enable
DACx_output
FVR_buffer1
Temp Indicator
CHS<4:0>
External
Channel
Inputs
GO/DONE
complete
start
ADC
Sample Circuit
Writetobit
GO/DONE
V
SS
V
DD
V
REF
+ pin
V
DD
ADPREF
10-bit Result
ADRESH ADRESL
16
ADFM
10
Internal
Channel
Inputs
.
.
.
AN0
ANa
ANz
set bit ADIF
V
SS
ADON
sampled
input
Q1
Q2
Q4
Fosc
Divider F
OSC
F
OSC
/n
F
RC
ADC
Clock
Select
ADC_clk
ADCS<2:0>
F
RC
ADC CLOCK SOURCE
Trigger Select
Trigger Sources
...
TRIGSEL<3:0>
AUTO CONVERSION
TRIGGER
Positive
Reference
Select
Rev. 10-000033A
7/30/2013
PIC12(L)F1501
DS40001615C-page 110 2011-2015 Microchip Technology Inc.
15.1 ADC Configuration
When configuring and using the ADC the following
functions must be considered:
• Port configuration
• Channel selection
• ADC voltage reference selection
• ADC conversion clock source
• Interrupt control
• Result formatting
15.1.1 PORT CONFIGURATION
The ADC can be used to convert both analog and
digital signals. When converting analog signals, the I/O
pin should be configured for analog by setting the
associated TRIS and ANSEL bits. Refer to Section
11.0 “I/O Ports ” for more information.
15.1.2 CHANNEL SELECTION
There are 7 channel selections available:
• AN<3:0> pins
• Temperature Indicator
• DAC1_output
• FVR_buffer1
The CHS bits of the ADCON0 register determine which
channel is connected to the sample and hold circuit.
When changing channels, a delay (TACQ) is required
before starting the next conversion. Refer to Section
15.2.6 “ADC Conversion Procedure” for more infor-
mation.
15.1.3 ADC VOLTAGE REFERENCE
The ADC module uses a positive and a negative
voltage reference. The positive reference is labeled
ref+ and the negative reference is labeled ref-.
The positive voltage reference (ref+) is selected by the
ADPREF bits in the ADCON1 register. The positive
voltage reference source can be:
•V
REF+ pin
•V
DD
The negative voltage reference (ref-) source is:
•V
SS
15.1.4 CONVERSION CLOCK
The source of the conversion clock is software select-
able via the ADCS bits of the ADCON1 register. There
are seven possible clock options:
•F
OSC/2
•FOSC/4
•F
OSC/8
•FOSC/16
•FOSC/32
•F
OSC/64
• FRC (internal RC oscillator)
The time to complete one bit conversion is defined as
TAD. One full 10-bit conversion requires 11.5 TAD
periods as shown in Figure 15-2.
For correct conversion, the appropriate TAD specifica-
tion must be met. Refer to the ADC conversion require-
ments in Sec tion 27.0 “Electrical S pec ification s” for
more information. Table 15-1 gives examples of
appropriate ADC clock selections.
Note: Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
Note: Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
2011-2015 Microchip Technology Inc. DS40001615C-page 111
PIC12(L)F1501
TABLE 15-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES
FIGURE 15-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
ADC Clock Period (TAD) D evi ce Fr eque ncy (FOSC)
ADC
Clock
Source
ADCS<2:0
>20 MHz 16 MHz 8 MHz 4 MHz 1 MHz
Fosc/2 000 100 ns 125 ns 250 ns 500 ns 2.0 s
Fosc/4 100 200 ns 250 ns 500 ns 1.0 s4.0 s
Fosc/8 001 400 ns 500 ns 1.0 s2.0 s8.0 s
Fosc/16 101 800 ns 1.0 s2.0 s4.0 s16.0 s
Fosc/32 010 1.6 s2.0 s4.0 s8.0 s32.0 s
Fosc/64 110 3.2 s4.0 s8.0 s16.0 s64.0 s
FRC x11 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s 1.0-6.0 s
Legend: Shaded cells are outside of recommended range.
Note: The TAD period when using the FRC clock source can fall within a specified range, (see TAD parameter).
The TAD period when using the FOSC-based clock source can be configured for a more precise TAD period.
However, the FRC clock source must be used when conversions are to be performed with the device in
Sleep mode.
TAD1TAD2TAD3TAD4TAD5TAD6TAD7TAD8TAD9TAD10 TAD11
SetGObit
Conversion Starts
Holding capacitor disconnected
from analog input (THCD).
On the following cycle:
ADRESH:ADRESL is loaded,
GO bit is cleared,
ADIF bit is set,
holding capacitor is reconnected to analog input.
b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
Enable ADC (ADON bit)
and
Select channel (ACS bits)
THCD
TACQ
Rev. 10-000035A
7/30/2013
PIC12(L)F1501
DS40001615C-page 112 2011-2015 Microchip Technology Inc.
15.1.5 INTERRUPTS
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC Interrupt Flag is the ADIF bit in
the PIR1 register. The ADC Interrupt Enable is the
ADIE bit in the PIE1 register. The ADIF bit must be
cleared in software.
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP instruc-
tion is always executed. If the user is attempting to
wake-up from Sleep and resume in-line code execu-
tion, the GIE and PEIE bits of the INTCON register
must be disabled. If the GIE and PEIE bits of the
INTCON register are enabled, execution will switch to
the Interrupt Service Routine.
15.1.6 RESULT FORMATTING
The 10-bit ADC conversion result can be supplied in
two formats, left justified or right justified. The ADFM bit
of the ADCON1 register controls the output format.
Figure 15-3 shows the two output formats.
FIGURE 15-3: 10-BIT ADC CONVERSION RESULT FORMAT
Note 1: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
2: The ADC operates during Sleep only
when the FRC oscillator is selected.
MSB
MSB
LSB
LSB
(ADFM = 0)
(ADFM = 1)
bit 7 bit 7
bit 7bit 7
bit 0
bit 0
bit 0
bit 0
10-bit ADC Result
10-bit ADC Result
Unimplemented: Read as ‘0’
Unimplemented: Read as ‘0’
ADRESH ADRESL
Rev. 10-000054A
7/30/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 113
PIC12(L)F1501
15.2 ADC Operation
15.2.1 STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the GO/
DONE bit of the ADCON0 register to a ‘1’ will start the
Analog-to-Digital conversion.
15.2.2 COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF Interrupt Flag bit
• Update the ADRESH and ADRESL registers with
new conversion result
15.2.3 TERMINATING A CONVERSION
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared in software. The
ADRESH and ADRESL registers will be updated with
the partially complete Analog-to-Digital conversion
sample. Incomplete bits will match the last bit
converted.
15.2.4 ADC OPERATION DURING SLEEP
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. Performing the ADC conversion during Sleep
can reduce system noise. If the ADC interrupt is
enabled, the device will wake-up from Sleep when the
conversion completes. If the ADC interrupt is disabled,
the ADC module is turned off after the conversion com-
pletes, although the ADON bit remains set.
When the ADC clock source is something other than
FRC, a SLEEP instruction causes the present conver-
sion to be aborted and the ADC module is turned off,
although the ADON bit remains set.
15.2.5 AUTO-CONVERSION TRIGGER
The auto-conversion trigger allows periodic ADC mea-
surements without software intervention. When a rising
edge of the selected source occurs, the GO/DONE bit
is set by hardware.
The auto-conversion trigger source is selected with the
TRIGSEL<3:0> bits of the ADCON2 register.
Using the auto-conversion trigger does not assure
proper ADC timing. It is the user’s responsibility to
ensure that the ADC timing requirements are met.
See Table 15-2 for auto-conversion sources.
Note: The GO/DONE bit should not be set in the
same instruction that turns on the ADC.
Refer to Section 15.2.6 “ADC Conver-
sion Procedure”.
Note: A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
TABLE 15-2: AUTO-CONVERSION
SOURCES
Source Peripheral Signal Name
Timer0 T0_overflow
Timer1 T1_overflow
Timer2 T2_match
Comparator C1 C1OUT_sync
CLC1 LC1_out
CLC2 LC2_out
PIC12(L)F1501
DS40001615C-page 114 2011-2015 Microchip Technology Inc.
15.2.6 ADC CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digital conversion:
1. Configure Port:
• Disable pin output driver (Refer to the TRIS
register)
• Configure pin as analog (Refer to the ANSEL
register)
• Disable weak pull-ups either globally (Refer
to the OPTION_REG register) or individually
(Refer to the appropriate WPUx register).
2. Configure the ADC module:
• Select ADC conversion clock
• Configure voltage reference
• Select ADC input channel
• Turn on ADC module
3. Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
• Enable peripheral interrupt
• Enable global interrupt(1)
4. Wait the required acquisition time(2).
5. Start conversion by setting the GO/DONE bit.
6. Wait for ADC conversion to complete by one of
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
7. Read ADC Result.
8. Clear the ADC interrupt flag (required if interrupt
is enabled).
EXAMPLE 15-1: ADC CONVERSION
Note 1: The global interrupt can be disabled if the
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: Refer to Section 15.4 “ADC Acquisi-
tion Re quireme nts”.
;This code block configures the ADC
;for polling, Vdd and Vss references, FRC
;oscillator and AN0 input.
;
;Conversion start & polling for completion
; are included.
;
BANKSEL ADCON1 ;
MOVLW B’11110000’ ;Right justify, FRC
;oscillator
MOVWF ADCON1 ;Vdd and Vss Vref+
BANKSEL TRISA ;
BSF TRISA,0 ;Set RA0 to input
BANKSEL ANSEL ;
BSF ANSEL,0 ;Set RA0 to analog
BANKSEL WPUA
BCF WPUA,0 ;Disable weak
pull-up on RA0
BANKSEL ADCON0 ;
MOVLW B’00000001’ ;Select channel AN0
MOVWF ADCON0 ;Turn ADC On
CALL SampleTime ;Acquisiton delay
BSF ADCON0,ADGO ;Start conversion
BTFSC ADCON0,ADGO ;Is conversion done?
GOTO $-1 ;No, test again
BANKSEL ADRESH ;
MOVF ADRESH,W ;Read upper 2 bits
MOVWF RESULTHI ;store in GPR space
BANKSEL ADRESL ;
MOVF ADRESL,W ;Read lower 8 bits
MOVWF RESULTLO ;Store in GPR space
2011-2015 Microchip Technology Inc. DS40001615C-page 115
PIC12(L)F1501
15.3 Register Definitions: ADC Control
REGISTER 15-1: ADCON0: ADC CONTROL REGISTER 0
U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— CHS<4:0> GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6-2 CHS<4:0>: Analog Channel Select bits
00000 =AN0
00001 =AN1
00010 =AN2
00011 =AN3
00100 = Reserved. No channel connected.
•
•
•
11100 = Reserved. No channel connected.
11101 = Temperature Indicator(1)
11110 = DAC (Digital-to-Analog Converter)(3)
11111 = FVR (Fixed Voltage Reference) Buffer 1 Output(2)
bit 1 GO/DONE: ADC Conversion Status bit
1 = ADC conversion cycle in progress. Setting this bit starts an ADC conversion cycle.
This bit is automatically cleared by hardware when the ADC conversion has completed.
0 = ADC conversion completed/not in progress
bit 0 ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
Note 1: See Section 14.0 “Temperature Indicator Module” for more information.
2: See Section 13.0 “Fixed Voltage Reference (FVR)” for more information.
3: See Section 16.0 “5-Bit Digital-to-Analog Converter (DAC) Module” for more information.
PIC12(L)F1501
DS40001615C-page 116 2011-2015 Microchip Technology Inc.
REGISTER 15-2: ADCON1: ADC CONTROL REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0
ADFM ADCS<2:0> —— ADPREF<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 ADFM: ADC Result Format Select bit
1 = Right justified. Six Most Significant bits of ADRESH are set to ‘0’ when the conversion result is
loaded.
0 = Left justified. Six Least Significant bits of ADRESL are set to ‘0’ when the conversion result is
loaded.
bit 6-4 ADCS<2:0>: ADC Conversion Clock Select bits
000 =F
OSC/2
001 =F
OSC/8
010 =F
OSC/32
011 = FRC (clock supplied from an internal RC oscillator)
100 =FOSC/4
101 =F
OSC/16
110 =F
OSC/64
111 = FRC (clock supplied from an internal RC oscillator)
bit 3-2 Unimplemented: Read as ‘0’
bit 1-0 ADPREF<1:0>: ADC Positive Voltage Reference Configuration bits
00 =V
RPOS is connected to VDD
01 = Reserved
10 =V
RPOS is connected to external VREF+ pin(1)
11 = Reserved
Note 1: When selecting the VREF+ pin as the source of the positive reference, be aware that a minimum voltage
specification exists. See Section 27.0 “Electrical Specifications” for details.
2011-2015 Microchip Technology Inc. DS40001615C-page 117
PIC12(L)F1501
REGISTER 15-3: ADCON2: ADC CONTROL REGISTER 2
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 U-0
TRIGSEL<3:0>(1) — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 TRIGSEL<3:0>: Auto-Conversion Trigger Selection bits(1)
0000 = No auto-conversion trigger selected
0001 =Reserved
0010 =Reserved
0011 = Timer0 – T0_overflow(2)
0100 = Timer1 – T1_overflow(2)
0101 = Timer2 – T2_match
0110 = Comparator C1 – C1OUT_sync
0111 =Reserved
1000 = CLC1 – LC1_out
1001 = CLC2 – LC2_out
1010 =Reserved
1011 =Reserved
1100 =Reserved
1101 =Reserved
1110 =Reserved
1111 = Reserved
bit 3-0 Unimplemented: Read as ‘0’
Note 1: This is a rising edge sensitive input for all sources.
2: Signal also sets its corresponding interrupt flag.
PIC12(L)F1501
DS40001615C-page 118 2011-2015 Microchip Technology Inc.
REGISTER 15-4: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
ADRES<9:2>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 ADRES<9:2>: ADC Result Register bits
Upper eight bits of 10-bit conversion result
REGISTER 15-5: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
ADRES<1:0> — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 ADRES<1:0>: ADC Result Register bits
Lower two bits of 10-bit conversion result
bit 5-0 Reserved: Do not use.
2011-2015 Microchip Technology Inc. DS40001615C-page 119
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REGISTER 15-6: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
— — — — — — ADRES<9:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Reserved: Do not use.
bit 1-0 ADRES<9:8>: ADC Result Register bits
Upper two bits of 10-bit conversion result
REGISTER 15-7: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
ADRES<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 ADRES<7:0>: ADC Result Register bits
Lower eight bits of 10-bit conversion result
PIC12(L)F1501
DS40001615C-page 120 2011-2015 Microchip Technology Inc.
15.4 ADC Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 15-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (VDD), refer
to Figure 15-4. The maximum recommended
impedance for analog sources is 10 k. As the
source impedance is decreased, the acquisition time
may be decreased. After the analog input channel is
selected (or changed), an ADC acquisition must be
done before the conversion can be started. To calculate
the minimum acquisition time, Equation 15-1 may be
used. This equation assumes that 1/2 LSb error is used
(1,024 steps for the ADC). The 1/2 LSb error is the
maximum error allowed for the ADC to meet its
specified resolution.
EQUATION 15-1: ACQUISITION TIME EXAMPLE
TACQ Amplifier Settling Time Ho ld Capacitor Charging Time Temperatu re Co efficient++=
TAMP TCTCOFF++=
2µs TCTemperature - 25°C0.05µs/°C++=
TCCHOLD RIC RSS RS++ ln(1/2047)–=
12.5pF 1k
7k
10k
++– ln(0.0004885)=
1.72=µs
VAPPLIED 1e
Tc–
RC
---------
–



VAPPLIED 11
2n1+
1–
--------------------------–


=
VAPPLIED 11
2n1+
1–
--------------------------–


VCHOLD=
VAPPLIED 1e
TC–
RC
----------
–



VCHOLD=
;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD char ge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Temperature 50°C and external impedance of 10k
5.0V V DD=
Assumptions:
Note: Where n = number of bits of the ADC.
TACQ 2µs 1.72µs 50°C- 25°C0.05µs/°C++=
4.97µs=
Note 1: The reference voltage (VRPOS) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
2011-2015 Microchip Technology Inc. DS40001615C-page 121
PIC12(L)F1501
FIGURE 15-4: ANALOG INPUT MODEL
FIGURE 15-5: ADC TRANSFER FUNCTION
V
DD
Analog
Input pin
CPIN
5pF V
T
§ 0.6V
V
T
§ 0.6V
ILEAKAGE(1)
R
IC
1
K
Legend: C
HOLD
= Sample/Hold Capacitance
C
PIN
= Input Capacitance
I
LEAKAGE
= Leakage Current at the pin due to varies injunctions
R
IC
= Interconnect Resistance
R
SS
= Resistance of Sampling switch
SS = Sampling Switch
V
T
= Threshold Voltage
VA
R
S
R
SS
SS
Sampling
switch
CHOLD = 10 pF
Ref-
567891011
2V
3V
4V
5V
6V
VDD RSS
Sampling Switch
(k )
Rev. 10-000070A
8/2/2013
Note 1: Refer to Section 27.0 “Electrical Specifications”.
3FFh
3FEh
ADC Output Code
3FDh
3FCh
03h
02h
01h
00h
Full-Scale
3FBh
0.5 LSB
Ref- Zero-Scale
Transition Ref+
Transition
1.5 LSB
Full-Scale Range
Analog Input Voltage
PIC12(L)F1501
DS40001615C-page 122 2011-2015 Microchip Technology Inc.
TABLE 15-3: SUMMARY OF REGISTERS ASSOCIATED WITH ADC
Name Bit 7 B it 6 Bit 5 Bit 4 Bit 3 Bit 2 B it 1 Bit 0 Register
on Page
ADCON0 — CHS<4:0> GO/DONE ADON 115
ADCON1 ADFM ADCS<2:0> —— ADPREF<1:0> 116
ADCON2 TRIGSEL<3:0> — — — — 117
ADRESH ADC Result Register High 118, 119
ADRESL ADC Result Register Low 118, 119
ANSELA ———ANSA4— ANSA2 ANSA1 ANSA0 99
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
PIE1 TMR1GIE ADIE ————TMR2IE TMR1IE 65
PIR1 TMR1GIF ADIF ————TMR2IF TMR1IF 68
TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 106
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not
used for ADC module.
Note 1: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001615C-page 123
PIC12(L)F1501
16.0 5-BIT DIGIT AL-TO-ANALOG
CONVERTER (DAC) MODULE
The Digital-to-Analog Converter supplies a variable
voltage reference, ratiometric with the input source,
with 32 selectable output levels.
The positive input source (VSOURCE+) of the DAC can
be connected to:
•External V
REF+ pin
•VDD supply voltage
The negative input source (VSOURCE-) of the DAC can
be connected to:
•Vss
The output of the DAC (DACx_output) can be selected
as a reference voltage to the following:
• Comparator positive input
• ADC input channel
•DACxOUT1 pin
•DACxOUT2 pin
The Digital-to-Analog Converter (DAC) can be enabled
by setting the DACEN bit of the DACxCON0 register.
FIGURE 16-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM
VREF+
VDD
DACPSS
VSOURCE+
VSOURCE-
VSS
R
32
Steps
R
R
R
R
R
R
32-to-1 MUX
To Peripherals
DACxOUT1 (1)
DACOE1
DACx_output
DACEN
DACR<4:0>
5
DACxOUT2 (1)
DACOE2
0
1
Note 1: The unbuffered DACx_output is provided on the DACxOUT pin(s).
Rev. 10-000026A
7/30/2013
PIC12(L)F1501
DS40001615C-page 124 2011-2015 Microchip Technology Inc.
16.1 Output Voltage Selectio n
The DAC has 32 voltage level ranges. The 32 levels
are set with the DACR<4:0> bits of the DACxCON1
register.
The DAC output voltage can be determined by using
Equation 16-1.
16.2 Ratiometric Output Level
The DAC output value is derived using a resistor ladder
with each end of the ladder tied to a positive and
negative voltage reference input source. If the voltage
of either input source fluctuates, a similar fluctuation will
result in the DAC output value.
The value of the individual resistors within the ladder
can be found in Table 27-14.
16.3 DAC Voltage Reference Output
The unbuffered DAC voltage can be output to the
DACxOUTn pin(s) by setting the respective DACOEn
bit(s) of the DACxCON0 register. Selecting the DAC
reference voltage for output on either DACxOUTn pin
automatically overrides the digital output buffer, the
weak pull-up and digital input threshold detector
functions of that pin.
Reading the DACxOUTn pin when it has been
configured for DAC reference voltage output will
always return a ‘0’.
16.4 Operation During Sleep
When the device wakes up from Sleep through an
interrupt or a Watchdog Timer time-out, the contents of
the DACxCON0 register are not affected. To minimize
current consumption in Sleep mode, the voltage
reference should be disabled.
16.5 Effects of a Reset
A device Reset affects the following:
• DACx is disabled.
•DACX output voltage is removed from the
DACxOUTn pin(s).
• The DACR<4:0> range select bits are cleared.
EQUATION 16-1: DAC OUTPUT VOLTAGE
Note: The unbuffered DAC output (DACxOUTn)
is not intended to drive an external load.
IF DACEN = 1
DACx_output VSOURCE+VSOURCE-–
DACR 4:0
25
-----------------------------


VSOURCE-+=
Note: See the DACxCON0 register for the available VSOURCE+ and VSOURCE- selections.
2011-2015 Microchip Technology Inc. DS40001615C-page 125
PIC12(L)F1501
16.6 Register Definitions: DAC Control
TABLE 16-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE
REGISTER 16-1: DACxCON0: VOLTAGE REFERENCE CONTROL REGISTER 0
R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 U-0 U-0
DACEN — DACOE1 DACOE2 —DACPSS — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 DACEN: DAC Enable bit
1 = DACx is enabled
0 = DACx is disabled
bit 6 Unimplemented: Read as ‘0’
bit 5 DACOE1: DAC Voltage Output Enable bit
1 = DACx voltage level is output on the DACxOUT1 pin
0 = DACx voltage level is disconnected from the DACxOUT1 pin
bit 4 DACOE2: DAC Voltage Output Enable bit
1 = DACx voltage level is output on the DACxOUT2 pin
0 = DACx voltage level is disconnected from the DACxOUT2 pin
bit 3 Unimplemented: Read as ‘0’
bit 2 DACPSS: DAC Positive Source Select bit
1 =V
REF+ pin
0 =V
DD
bit 1-0 Unimplemented: Read as ‘0’
REGISTER 16-2: DACxCON1: VOLTAGE REFERENCE CONTROL REGISTER 1
U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— — — DACR<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-5 Unimplemented: Read as ‘0’
bit 4-0 DACR<4:0>: DAC Voltage Output Select bits
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on page
DAC1CON0 DACEN — DACOE1 DACOE2 —DACPSS— — 125
DAC1CON1 — — — DACR<4:0> 125
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used with the DAC module.
PIC12(L)F1501
DS40001615C-page 126 2011-2015 Microchip Technology Inc.
17.0 COMPARATOR MODULE
Comparators are used to interface analog circuits to a
digital circuit by comparing two analog voltages and
providing a digital indication of their relative magnitudes.
Comparators are very useful mixed signal building
blocks because they provide analog functionality
independent of program execution. The analog
comparator module includes the following features:
• Independent comparator control
• Programmable input selection
• Comparator output is available internally/externally
• Programmable output polarity
• Interrupt-on-change
• Wake-up from Sleep
• Programmable Speed/Power optimization
•PWM shutdown
• Programmable and fixed voltage reference
17.1 Comparator Overview
A single comparator is shown in Figure 17-2 along with
the relationship between the analog input levels and
the digital output. When the analog voltage at VIN+ is
less than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of the comparator is a digital high level.
The comparators available for this device are listed in
Table 17-1.
FIGURE 17-1: COMPARATOR MODULE SIMPLIFIED BLOCK DIAGRAM
TABLE 17-1: AVAILABLE COMPARATORS
Device C1 C2
PIC12(L)F1501 ●
Rev. 10-000027B
8/5/2013
000
CxIN0-
CxIN1-
Reserved
Reserved
00
01
10
11
CxIN+
FVR_buffer2
DAC_out
+
CxVN
CxVP
CxPCH<1:0>
CxNCH<2:0>
2
3
CxON(1)
CxON(1)
CxON(1)
CxSP CxHYS
Interrupt
Rising
Edge
DQ
Q1
CxINTP
CxINTN
CxOUT
MCxOUT
CxOUT_async
DQ
0
1
CxSYNC
set bit
CxIF
TRIS bit
CxOUT
CxOUT_sync
CxOE
-
Interrupt
Falling
Edge
FVR_buffer2
CxPOL
Cx
(From Timer1 Module) T1CLK
to
peripherals
001
010
011
100
to
peripherals
2011-2015 Microchip Technology Inc. DS40001615C-page 127
PIC12(L)F1501
FIGURE 17-2: SINGLE COMP ARATOR
17.2 Comparator Control
Each comparator has two control registers: CMxCON0
and CMxCON1.
The CMxCON0 registers (see Register 17-1) contain
Control and Status bits for the following:
• Enable
•Output selection
• Output polarity
• Speed/Power selection
• Hysteresis enable
• Output synchronization
The CMxCON1 registers (see Register 17-2) contain
Control bits for the following:
• Interrupt enable
• Interrupt edge polarity
• Positive input channel selection
• Negative input channel selection
17.2.1 COMPARATOR ENABLE
Setting the CxON bit of the CMxCON0 register enables
the comparator for operation. Clearing the CxON bit
disables the comparator resulting in minimum current
consumption.
17.2.2 COMPARATOR POSITIVE INPUT
SELECTION
Configuring the CxPCH<1:0> bits of the CMxCON1
register directs an internal voltage reference or an
analog pin to the non-inverting input of the comparator:
• CxIN+ analog pin
• DAC1_output
• FVR_buffer2
•V
SS
See Section 13.0 “Fixed Voltage Reference (FVR)”
for more information on the Fixed Voltage Reference
module.
See Section 16.0 “5-Bit Digita l-to-Analog Converter
(DAC) Module” for more information on the DAC input
signal.
Any time the comparator is disabled (CxON = 0), all
comparator inputs are disabled.
17.2.3 COMPARATOR NEGATIVE INPUT
SELECTION
The CxNCH<2:0> bits of the CMxCON0 register direct
one of the input sources to the comparator inverting
input.
17.2.4 COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the CxOUT bit of the CMxCON0 register
or the MCxOUT bit of the CMOUT register. In order to
make the output available for an external connection,
the following conditions must be true:
• CxOE bit of the CMxCON0 register must be set
• Corresponding TRIS bit must be cleared
• CxON bit of the CMxCON0 register must be set
The synchronous comparator output signal
(CxOUT_sync) is available to the following peripheral(s):
• Configurable Logic Cell (CLC)
• Analog-to-Digital Converter (ADC)
•Timer1
The asynchronous comparator output signal
(CxOUT_async) is available to the following peripheral(s):
• Complementary Waveform Generator (CWG)
–
+
VIN+
VIN-Output
Output
VIN+
VIN-
Note: The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
Note: To use CxIN+ and CxINx- pins as analog
input, the appropriate bits must be set in
the ANSEL register and the correspond-
ing TRIS bits must also be set to disable
the output drivers.
Note 1: The CxOE bit of the CMxCON0 register
overrides the PORT data latch. Setting
the CxON bit of the CMxCON0 register
has no impact on the port override.
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
PIC12(L)F1501
DS40001615C-page 128 2011-2015 Microchip Technology Inc.
17.2.5 COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the CxPOL bit of the CMxCON0 register.
Clearing the CxPOL bit results in a non-inverted output.
Table 17-2 shows the output state versus input
conditions, including polarity control.
17.2.6 COMPARATOR SPEED/POWER
SELECTION
The trade-off between speed or power can be opti-
mized during program execution with the CxSP control
bit. The default state for this bit is ‘1’ which selects the
Normal-Speed mode. Device power consumption can
be optimized at the cost of slower comparator propaga-
tion delay by clearing the CxSP bit to ‘0’.
17.3 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 17-3. Since the analog input pins share their
connection with a digital input, they have reverse
biased ESD protection diodes to VDD and VSS. The
analog input, therefore, must be between VSS and VDD.
If the input voltage deviates from this range by more
than 0.6V in either direction, one of the diodes is for-
ward biased and a latch-up may occur.
A maximum source impedance of 10 k is recommended
for the analog sources. Also, any external component
connected to an analog input pin, such as a capacitor or
a Zener diode, should have very little leakage current to
minimize inaccuracies introduced.
FIGURE 17-3: ANALOG INPUT MODEL
TABLE 17-2: COMP ARATOR OUTPUT
STATE VS. INPUT CONDITIONS
Input Condition CxPOL CxOUT
CxVN > CxVP00
CxVN < CxVP01
CxVN > CxVP11
CxVN < CxVP10 Note 1: When reading a PORT register, all pins
configured as analog inputs will read as a
‘0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog levels on any pin defined as a
digital input, may cause the input buffer to
consume more current than is specified.
VA
RS < 10K
VDD
Analog
Input pin
CPIN
5pF VT § 0.6V
VT § 0.6V
ILEAKAGE(1)
VSS
RIC
To Comparator
Legend: CPIN = Input Capacitance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS= Source Impedance
VA= Analog Voltage
VT= Threshold Voltage
Rev. 10-000071A
8/2/2013
Note 1: See Sectio n 27.0 “E lectrical Specifications”.
2011-2015 Microchip Technology Inc. DS40001615C-page 129
PIC12(L)F1501
17.4 Comparator Hysteresis
A selectable amount of separation voltage can be
added to the input pins of each comparator to provide a
hysteresis function to the overall operation. Hysteresis
is enabled by setting the CxHYS bit of the CMxCON0
register.
See Section 27.0 “Electrical Specifications” for
more information.
17.5 Timer1 Gate Operation
The output resulting from a comparator operation can
be used as a source for gate control of Timer1. See
Section 19.5 “Timer1 Gate” for more information.
This feature is useful for timing the duration or interval
of an analog event.
It is recommended that the comparator output be syn-
chronized to Timer1. This ensures that Timer1 does not
increment while a change in the comparator is occur-
ring.
17.5.1 COMPARATOR OUTPUT
SYNCHRONIZATION
The output from the Cx comparator can be
synchronized with Timer1 by setting the CxSYNC bit of
the CMxCON0 register.
Once enabled, the comparator output is latched on the
falling edge of the Timer1 source clock. If a prescaler is
used with Timer1, the comparator output is latched after
the prescaling function. To prevent a race condition, the
comparator output is latched on the falling edge of the
Timer1 clock source and Timer1 increments on the
rising edge of its clock source. See the Comparator
Block Diagram (Figure 17-2) and the Timer1 Block
Diagram (Figure 19-2) for more information.
17.6 Comparator Interrupt
An interrupt can be generated upon a change in the
output value of the comparator for each comparator, a
rising edge detector and a falling edge detector are
present.
When either edge detector is triggered and its associ-
ated enable bit is set (CxINTP and/or CxINTN bits of
the CMxCON1 register), the Corresponding Interrupt
Flag bit (CxIF bit of the PIR2 register) will be set.
To enable the interrupt, you must set the following bits:
• CxON, CxPOL and CxSP bits of the CMxCON0
register
• CxIE bit of the PIE2 register
• CxINTP bit of the CMxCON1 register (for a rising
edge detection)
• CxINTN bit of the CMxCON1 register (for a falling
edge detection)
• PEIE and GIE bits of the INTCON register
The associated interrupt flag bit, CxIF bit of the PIR2
register, must be cleared in software. If another edge is
detected while this flag is being cleared, the flag will still
be set at the end of the sequence.
17.7 Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new reference voltage. This period is referred to as
the response time. The response time of the comparator
differs from the settling time of the voltage reference.
Therefore, both of these times must be considered when
determining the total response time to a comparator
input change. See the Comparator and Voltage Refer-
ence Specifications in Section 27.0 “Electrical Specifi-
cations” for more details.
Note: Although a comparator is disabled, an
interrupt can be generated by changing
the output polarity with the CxPOL bit of
the CMxCON0 register, or by switching
the comparator on or off with the CxON bit
of the CMxCON0 register.
PIC12(L)F1501
DS40001615C-page 130 2011-2015 Microchip Technology Inc.
17.8 Register Definitions: Comparator Control
REGISTER 17-1: CMxCON0: COMPARATOR Cx CONTROL REGISTER 0
R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 U-0 R/W-1/1 R/W-0/0 R/W-0/0
CxON CxOUT CxOE CxPOL —CxSP CxHYS CxSYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CxON: Comparator Enable bit
1 = Comparator is enabled
0 = Comparator is disabled and consumes no active power
bit 6 CxOUT: Comparator Output bit
If CxPOL = 1 (inverted polarity):
1 = CxVP < CxVN
0 = CxVP > CxVN
If CxPOL = 0 (non-inverted polarity):
1 = CxVP > CxVN
0 = CxVP < CxVN
bit 5 CxOE: Comparator Output Enable bit
1 = CxOUT is present on the CxOUT pin. Requires that the associated TRIS bit be cleared to actually
drive the pin. Not affected by CxON.
0 = CxOUT is internal only
bit 4 CxPOL: Comparator Output Polarity Select bit
1 = Comparator output is inverted
0 = Comparator output is not inverted
bit 3 Unimplemented: Read as ‘0’
bit 2 CxSP: Comparator Speed/Power Select bit
1 = Comparator mode in normal power, higher speed
0 = Comparator mode in low-power, low-speed
bit 1 CxHYS: Comparator Hysteresis Enable bit
1 = Comparator hysteresis enabled
0 = Comparator hysteresis disabled
bit 0 CxSYNC: Comparator Output Synchronous Mode bit
1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source.
Output updated on the falling edge of Timer1 clock source.
0 = Comparator output to Timer1 and I/O pin is asynchronous
2011-2015 Microchip Technology Inc. DS40001615C-page 131
PIC12(L)F1501
REGISTER 17-2: CMxCON1: COMPARATOR Cx CONTROL REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0
CxINTP CxINTN CxPCH<1:0> —CxNCH<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CxINTP: Comparator Interrupt on Positive Going Edge Enable bits
1 = The CxIF interrupt flag will be set upon a positive going edge of the CxOUT bit
0 = No interrupt flag will be set on a positive going edge of the CxOUT bit
bit 6 CxINTN: Comparator Interrupt on Negative Going Edge Enable bits
1 = The CxIF interrupt flag will be set upon a negative going edge of the CxOUT bit
0 = No interrupt flag will be set on a negative going edge of the CxOUT bit
bit 5-4 CxPCH<1:0>: Comparator Positive Input Channel Select bits
11 = CxVP connects to VSS
10 = CxVP connects to FVR Voltage Reference
01 = CxVP connects to DAC Voltage Reference
00 = CxVP connects to CxIN+ pin
bit 3 Unimplemented: Read as ‘0’
bit 2-0 CxNCH<2:0>: Comparator Negative Input Channel Select bits
111 = Reserved
110 = Reserved
101 = Reserved
100 = CxVN connects to FVR Voltage reference
011 = Reserved
010 = Reserved
001 = CxVN connects to CxIN1- pin
000 = CxVN connects to CxIN0- pin
REGISTER 17-3: CMOUT: COMPARATOR OUTPUT REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R-0/0
— — — — — — — MC1OUT
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-1 Unimplemented: Read as ‘0’
bit 0 MC1OUT: Mirror Copy of C1OUT bit
PIC12(L)F1501
DS40001615C-page 132 2011-2015 Microchip Technology Inc.
TABLE 17-3: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE
Name B it 7 Bit 6 Bit 5 Bit 4 Bit 3 B it 2 Bit 1 Bit 0 Register
on Page
ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 99
CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 130
CM1CON1 C1NTP C1INTN C1PCH<1:0> — C1NCH<2:0> 131
CMOUT — — — — — — —MC1OUT131
DAC1CON0 DACEN — DACOE1 DACOE2 —DACPSS— — 125
DAC1CON1 — — — DACR<4:0> 125
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 106
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
PIE2 ——C1IE— — NCO1IE — — 66
PIR2 ——C1IF— — NCO1IF — — 69
PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 98
LATA — — LATA5 LATA4 — LATA2 LATA1 LATA0 99
TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
Legend: — = unimplemented location, read as ‘0’. Shaded cells are unused by the comparator module.
Note 1: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001615C-page 133
PIC12(L)F1501
18.0 TIMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
• 8-bit timer/counter register (TMR0)
• 3-bit prescaler (independent of Watchdog Timer)
• Programmable internal or external clock source
• Programmable external clock edge selection
• Interrupt on overflow
• TMR0 can be used to gate Timer1
Figure 18-1 is a block diagram of the Timer0 module.
18.1 Timer0 Operation
The Timer0 module can be used as either an 8-bit timer
or an 8-bit counter.
18.1.1 8-BIT TIMER MODE
The Timer0 module will increment every instruction
cycle, if used without a prescaler. 8-bit Timer mode is
selected by clearing the TMR0CS bit of the
OPTION_REG register.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
18.1.2 8-BIT COUNTER MODE
In 8-Bit Counter mode, the Timer0 module will increment
on every rising or falling edge of the T0CKI pin.
8-Bit Counter mode using the T0CKI pin is selected by
setting the TMR0CS bit in the OPTION_REG register to
‘1’.
The rising or falling transition of the incrementing edge
for either input source is determined by the TMR0SE bit
in the OPTION_REG register.
FIGURE 18-1: TIMER0 BLOCK DIAGRAM
Note: The value written to the TMR0 register
can be adjusted, in order to account for
the two instruction cycle delay when
TMR0 is written.
Rev. 10-000017A
8/5/2013
TMR0SE
0
1
Fosc/4
Prescaler
T0_overflow
R
write
to
TMR0 set bit
TMR0IF
T0CKI
Sync Circuit
FOSC/2
TMR0CS
T0CKI(1)
Note 1: The T0CKI prescale output frequency should not exceed F
OSC
/8.
PS<2:0>
0
1
PSA
TMR0
Q1
PIC12(L)F1501
DS40001615C-page 134 2011-2015 Microchip Technology Inc.
18.1.3 SOFTWARE PROGRAMMABLE
PRESCALER
A software programmable prescaler is available for
exclusive use with Timer0. The prescaler is enabled by
clearing the PSA bit of the OPTION_REG register.
There are eight prescaler options for the Timer0 mod-
ule ranging from 1:2 to 1:256. The prescale values are
selectable via the PS<2:0> bits of the OPTION_REG
register. In order to have a 1:1 prescaler value for the
Timer0 module, the prescaler must be disabled by set-
ting the PSA bit of the OPTION_REG register.
The prescaler is not readable or writable. All instructions
writing to the TMR0 register will clear the prescaler.
18.1.4 TIMER0 INTERRUPT
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The TMR0IF
interrupt flag bit of the INTCON register is set every
time the TMR0 register overflows, regardless of
whether or not the Timer0 interrupt is enabled. The
TMR0IF bit can only be cleared in software. The Timer0
interrupt enable is the TMR0IE bit of the INTCON
register.
18.1.5 8-BIT COUNTER MODE
SYNCHRONIZATION
When in 8-Bit Counter mode, the incrementing edge on
the T0CKI pin must be synchronized to the instruction
clock. Synchronization can be accomplished by
sampling the prescaler output on the Q2 and Q4 cycles
of the instruction clock. The high and low periods of the
external clocking source must meet the timing
requirements as shown in Section 27.0 “Electrical
Specifications”.
18.1.6 OPERATION DURING SLEEP
Timer0 cannot operate while the processor is in Sleep
mode. The contents of the TMR0 register will remain
unchanged while the processor is in Sleep mode.
Note: The Watchdog Timer (WDT) uses its own
independent prescaler.
Note: The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
2011-2015 Microchip Technology Inc. DS40001615C-page 135
PIC12(L)F1501
18.2 Register Definitions: Option Register
TABLE 18-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
REGISTER 18-1: OPTION_REG: OPTI ON REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 WPUEN: Weak Pull-Up Enable bit
1 = All weak pull-ups are disabled (except MCLR, if it is enabled)
0 = Weak pull-ups are enabled by individual WPUx latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 TMR0CS: Timer0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (FOSC/4)
bit 4 TMR0SE: Timer0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assignment bit
1 = Prescaler is not assigned to the Timer0 module
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ADCON2 TRIGSEL<3:0> — — — — 117
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 135
TMR0 Holding Register for the 8-bit Timer0 Count 133*
TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the Timer0 module.
* Page provides register information.
Note 1: Unimplemented, read as ‘1’.
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
Bit Value Timer0 Rate
PIC12(L)F1501
DS40001615C-page 136 2011-2015 Microchip Technology Inc.
19.0 TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer/counter with the
following features:
• 16-bit timer/counter register pair (TMR1H:TMR1L)
• Programmable internal or external clock source
• 2-bit prescaler
• Optionally synchronized comparator out
• Multiple Timer1 gate (count enable) sources
• Interrupt on overflow
• Wake-up on overflow (external clock,
Asynchronous mode only)
• ADC Auto-Conversion Trigger(s)
• Selectable Gate Source Polarity
• Gate Toggle mode
• Gate Single-Pulse mode
• Gate Value Status
• Gate Event Interrupt
Figure 19-1 is a block diagram of the Timer1 module.
FIGURE 19-1: TIMER1 BLOCK DIAGRAM
00
11
10
01
T1G
T0_overflow
C1OUT_sync
Reserved
T1GSS<1:0>
T1GPOL
0
1
Single Pulse
Acq. Control
1
0
T1GSPM
TMR1ON
T1GTM
TMR1GE
TMR1ON
DQ
EN
TMR1LTMR1H
T1_overflow
set flag bit
TMR1IF
TMR1(2)
1
0
Fosc
Internal Clock
Fosc/4
Internal Clock
LFINTOSC
TMR1CS<1:0>
00
11
10
01
Prescaler
1,2,4,8
T1SYNC
Sleep
Input
Fosc/2
Internal
Clock
T1CKPS<1:0>
Synchronized Clock Input
2
det
Synchronize(3)
1: ST Buffer is high speed type when using T1CKI.
2: Timer1 register increments on rising edge.
3: Synchronize does not operate while in Sleep.
(1)
D
QCK
R
Q
Note
T1GGO/DONE
T1CLK
T1CKI
DQ
set bit
TMR1GIF
T1GVAL
Q1
det
Interrupt
Rev. 10-000018D
8/5/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 137
PIC12(L)F1501
19.1 Timer1 Operation
The Timer1 module is a 16-bit incrementing counter
which is accessed through the TMR1H:TMR1L register
pair. Writes to TMR1H or TMR1L directly update the
counter.
When used with an internal clock source, the module is
a timer and increments on every instruction cycle.
When used with an external clock source, the module
can be used as either a timer or counter and incre-
ments on every selected edge of the external source.
Timer1 is enabled by configuring the TMR1ON and
TMR1GE bits in the T1CON and T1GCON registers,
respectively. Table 19-1 displays the Timer1 enable
selections.
19.2 Clock Source Selection
The TMR1CS<1:0> bits of the T1CON register are used
to select the clock source for Timer1. Table 19-2
displays the clock source selections.
19.2.1 INTERNAL CLOCK SOURCE
When the internal clock source is selected, the
TMR1H:TMR1L register pair will increment on multiples
of FOSC as determined by the Timer1 prescaler.
When the FOSC internal clock source is selected, the
Timer1 register value will increment by four counts every
instruction clock cycle. Due to this condition, a 2 LSB
error in resolution will occur when reading the Timer1
value. To utilize the full resolution of Timer1, an
asynchronous input signal must be used to gate the
Timer1 clock input.
The following asynchronous sources may be used:
• Asynchronous event on the T1G pin to Timer1
gate
• C1 or C2 comparator input to Timer1 gate
19.2.2 EXTERNAL CLOCK SOURCE
When the external clock source is selected, the Timer1
module may work as a timer or a counter.
When enabled to count, Timer1 is incremented on the
rising edge of the external clock input T1CKI. The
external clock source can be synchronized to the
microcontroller system clock or it can run
asynchronously.
TABLE 19-1: TIMER1 ENABLE
SELECTIONS
TMR1ON TMR1GE Timer1
Operation
00Off
01Off
10Always On
11Count Enabled
Note: In Counter mode, a falling edge must be
registered by the counter prior to the first
incrementing rising edge after any one or
more of the following conditions:
• Timer1 enabled after POR
• Write to TMR1H or TMR1L
• Timer1 is disabled
• Timer1 is disabled (TMR1ON = 0)
when T1CKI is high then Timer1 is
enabled (TMR1ON=1) when T1CKI is
low.
TABLE 19-2: CLOCK SOURCE SELECTIONS
TMR1CS<1:0> Clock Source
11 LFINTOSC
10 External Clocking on T1CKI Pin
01 System Clock (FOSC)
00 Instruction Clock (FOSC/4)
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DS40001615C-page 138 2011-2015 Microchip Technology Inc.
19.3 Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
19.4 Timer1 Operation in
Asynchronous Counter Mode
If control bit T1SYNC of the T1CON register is set, the
external clock input is not synchronized. The timer
increments asynchronously to the internal phase
clocks. If the external clock source is selected then the
timer will continue to run during Sleep and can
generate an interrupt on overflow, which will wake-up
the processor. However, special precautions in
software are needed to read/write the timer (see
Section 19.4.1 “Reading and Writing Timer1 in
Asynchronous Counter Mode”).
19.4.1 READING AND WRITING TIMER1 IN
ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an external asynchronous clock will ensure a valid
read (taken care of in hardware). However, the user
should keep in mind that reading the 16-bit timer in two
8-bit values itself, poses certain problems, since the
timer may overflow between the reads.
For writes, it is recommended that the user simply stop
the timer and write the desired values. A write
contention may occur by writing to the timer registers,
while the register is incrementing. This may produce an
unpredictable value in the TMR1H:TMR1L register pair.
19.5 Timer1 Gate
Timer1 can be configured to count freely or the count
can be enabled and disabled using Timer1 gate
circuitry. This is also referred to as Timer1 Gate Enable.
Timer1 gate can also be driven by multiple selectable
sources.
19.5.1 TIMER1 GATE ENABLE
The Timer1 Gate Enable mode is enabled by setting
the TMR1GE bit of the T1GCON register. The polarity
of the Timer1 Gate Enable mode is configured using
the T1GPOL bit of the T1GCON register.
When Timer1 Gate Enable mode is enabled, Timer1
will increment on the rising edge of the Timer1 clock
source. When Timer1 Gate Enable mode is disabled,
no incrementing will occur and Timer1 will hold the
current count. See Figure 19-3 for timing details.
19.5.2 TIMER1 GATE SOURCE
SELECTION
Timer1 gate source selections are shown in Table 19-4.
Source selection is controlled by the T1GSS<1:0> bits
of the T1GCON register. The polarity for each available
source is also selectable. Polarity selection is controlled
by the T1GPOL bit of the T1GCON register.
TABLE 19-4: TIMER1 GATE SOURCES
Note: When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce an additional
increment.
TABLE 19-3: TIMER1 GATE ENABLE
SELECTIONS
T1CLK T1GPOL T1G Timer1 Operation
00Counts
01Holds Count
10Holds Count
11Counts
T1GSS Timer1 Gate Source
00 Timer1 Gate pin (T1G)
01 Overflow of Timer0 (T0_overflow)
(TMR0 increments from FFh to 00h)
10 Comparator 1 Output (C1OUT_sync)(1)
11 Reserved
Note 1: Optionally synchronized comparator output.
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19.5.2.1 T1G Pin Gate Operation
The T1G pin is one source for Timer1 gate control. It
can be used to supply an external source to the Timer1
gate circuitry.
19.5.2.2 Timer0 Overflow Gate Operation
When Timer0 increments from FFh to 00h, a low-to-
high pulse will automatically be generated and inter-
nally supplied to the Timer1 gate circuitry.
19.5.3 TIMER1 GATE TOGGLE MODE
When Timer1 Gate Toggle mode is enabled, it is possi-
ble to measure the full-cycle length of a Timer1 gate
signal, as opposed to the duration of a single level
pulse.
The Timer1 gate source is routed through a flip-flop that
changes state on every incrementing edge of the sig-
nal. See Figure 19-4 for timing details.
Timer1 Gate Toggle mode is enabled by setting the
T1GTM bit of the T1GCON register. When the T1GTM
bit is cleared, the flip-flop is cleared and held clear. This
is necessary in order to control which edge is
measured.
19.5.4 TIMER1 GATE SINGLE-PULSE
MODE
When Timer1 Gate Single-Pulse mode is enabled, it is
possible to capture a single pulse gate event. Timer1
Gate Single-Pulse mode is first enabled by setting the
T1GSPM bit in the T1GCON register. Next, the T1GGO/
DONE bit in the T1GCON register must be set. The
Timer1 will be fully enabled on the next incrementing
edge. On the next trailing edge of the pulse, the T1GGO/
DONE bit will automatically be cleared. No other gate
events will be allowed to increment Timer1 until the
T1GGO/DONE bit is once again set in software. See
Figure 19-5 for timing details.
If the Single Pulse Gate mode is disabled by clearing the
T1GSPM bit in the T1GCON register, the T1GGO/DONE
bit should also be cleared.
Enabling the Toggle mode and the Single-Pulse mode
simultaneously will permit both sections to work
together. This allows the cycle times on the Timer1 gate
source to be measured. See Figure 19-6 for timing
details.
19.5.5 TIMER1 GATE VALUE STATUS
When Timer1 Gate Value Status is utilized, it is possible
to read the most current level of the gate control value.
The value is stored in the T1GVAL bit in the T1GCON
register. The T1GVAL bit is valid even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
19.5.6 TIMER1 GATE EVENT INTERRUPT
When Timer1 Gate Event Interrupt is enabled, it is pos-
sible to generate an interrupt upon the completion of a
gate event. When the falling edge of T1GVAL occurs,
the TMR1GIF flag bit in the PIR1 register will be set. If
the TMR1GIE bit in the PIE1 register is set, then an
interrupt will be recognized.
The TMR1GIF flag bit operates even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
Note: Enabling Toggle mode at the same time
as changing the gate polarity may result in
indeterminate operation.
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DS40001615C-page 140 2011-2015 Microchip Technology Inc.
19.6 Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Timer1 interrupt flag bit of the PIR1 register is
set. To enable the interrupt on rollover, you must set
these bits:
• TMR1ON bit of the T1CON register
• TMR1IE bit of the PIE1 register
• PEIE bit of the INTCON register
• GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
19.7 Timer1 Operation During Sleep
Timer1 can only operate during Sleep when setup in
Asynchronous Counter mode. In this mode, an external
crystal or clock source can be used to increment the
counter. To set up the timer to wake the device:
• TMR1ON bit of the T1CON register must be set
• TMR1IE bit of the PIE1 register must be set
• PEIE bit of the INTCON register must be set
• T1SYNC bit of the T1CON register must be set
• TMR1CS bits of the T1CON register must be
configured
The device will wake-up on an overflow and execute
the next instructions. If the GIE bit of the INTCON
register is set, the device will call the Interrupt Service
Routine.
Timer1 oscillator will continue to operate in Sleep
regardless of the T1SYNC bit setting.
19.7.1 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register, APFCON. To determine which pins can be
moved and what their default locations are upon a
Reset, see Section 11.1 “Alternate Pin Function” for
more information.
FIGURE 19-2: TIMER1 INCREMENTING EDGE
Note: The TMR1H:TMR1L register pair and the
TMR1IF bit should be cleared before
enabling interrupts.
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1: Arrows indicate counter increments.
2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock.
2011-2015 Microchip Technology Inc. DS40001615C-page 141
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FIGURE 19-3: TIMER1 GATE ENABLE MODE
FIGURE 19-4: TIMER1 GATE TOGGLE MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1 N N + 1 N + 2 N + 3 N + 4
TMR1GE
T1GPOL
T1GTM
t1g_in
T1CKI
T1GVAL
Timer1
N N + 1 N + 2 N + 3 N + 4 N + 5 N + 6 N + 7 N + 8
PIC12(L)F1501
DS40001615C-page 142 2011-2015 Microchip Technology Inc.
FIGURE 19-5: TIMER1 GATE SINGLE-PULSE MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1 N N + 1 N + 2
T1GSPM
T1GGO/
DONE
Set by software
Cleared by hardware on
falling edge of T1GVAL
Set by hardware on
falling edge of T1GVAL
Cleared by software
Cleared by
software
TMR1GIF
Counting enabled on
rising edge of T1G
2011-2015 Microchip Technology Inc. DS40001615C-page 143
PIC12(L)F1501
FIGURE 19-6: TIME R1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1 NN + 1
N + 2
T1GSPM
T1GGO/
DONE
Set by software
Cleared by hardware on
falling edge of T1GVAL
Set by hardware on
falling edge of T1GVAL
Cleared by software
Cleared by
software
TMR1GIF
T1GTM
Counting enabled on
rising edge of T1G
N + 4
N + 3
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DS40001615C-page 144 2011-2015 Microchip Technology Inc.
19.8 Regist er D e finitions : Tim e r1 C o n tr o l
REGISTER 19-1: T1CON: TIMER1 CONTROL REGISTER
R/W-0/u R/W-0/u R/W-0/u R/W-0/u U-0 R/W-0/u U-0 R/W-0/u
TMR1CS<1:0> T1CKPS<1:0> — T1SYNC —TMR1ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 TMR1CS<1:0>: Timer1 Clock Source Select bits
11 = Timer1 clock source is LFINTOSC
10 = Timer1 clock source is T1CKI pin (on the rising edge)
01 = Timer1 clock source is system clock (FOSC)
00 = Timer1 clock source is instruction clock (FOSC/4)
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3 Unimplemented: Read as ‘0’
bit 2 T1SYNC: Timer1 Synchronization Control bit
1 = Do not synchronize asynchronous clock input
0 = Synchronize asynchronous clock input with system clock (FOSC)
bit 1 Unimplemented: Read as ‘0’
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1 and clears Timer1 gate flip-flop
2011-2015 Microchip Technology Inc. DS40001615C-page 145
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REGISTER 19-2: T1GCON: TIMER1 GATE CONTROL REGISTER
R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x R/W-0/u R/W-0/u
TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
DONE
T1GVAL T1GSS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware
bit 7 TMR1GE: Timer1 Gate Enable bit
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 counting is controlled by the Timer1 gate function
0 = Timer1 counts regardless of Timer1 gate function
bit 6 T1GPOL: Timer1 Gate Polarity bit
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 5 T1GTM: Timer1 Gate Toggle Mode bit
1 = Timer1 Gate Toggle mode is enabled
0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared
Timer1 gate flip-flop toggles on every rising edge.
bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit
1 = Timer1 gate Single-Pulse mode is enabled and is controlling Timer1 gate
0 = Timer1 gate Single-Pulse mode is disabled
bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit
1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge
0 = Timer1 gate single-pulse acquisition has completed or has not been started
bit 2 T1GVAL: Timer1 Gate Value Status bit
Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L.
Unaffected by Timer1 Gate Enable (TMR1GE).
bit 1-0 T1GSS<1:0>: Timer1 Gate Source Select bits
11 = Reserved
10 = Comparator 1 optionally synchronized output (C1OUT_sync)
01 = Timer0 overflow output (T0_overflow)
00 = Timer1 gate pin (T1G)
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DS40001615C-page 146 2011-2015 Microchip Technology Inc.
TABLE 19-5: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA — — —ANSA4 —ANSA2 ANSA1 ANSA0 99
APFCON CWG1BSEL CWGA1SEL —— T1GSEL —CLC1SEL NCO1SEL 96
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
PIE1 TMR1GIE ADIE — — — — TMR2IE TMR1IE 65
PIR1 TMR1GIF ADIF — — — — TMR2IF TMR1IF 68
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Count 140*
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Count 140*
TRISA —— TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
T1CON TMR1CS<1:0> T1CKPS<1:0> —T1SYNC—TMR1ON
144
T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
DONE
T1GVAL T1GSS<1:0> 145
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the Timer1 module.
* Page provides register information.
Note 1: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001615C-page 147
PIC12(L)F1501
20.0 TIMER2 MODULE
The Timer2 module incorporates the following features:
• 8-bit Timer and Period registers (TMR2 and PR2,
respectively)
• Readable and writable (both registers)
• Software programmable prescaler (1:1, 1:4, 1:16,
and 1:64)
• Software programmable postscaler (1:1 to 1:16)
• Interrupt on TMR2 match with PR2
See Figure 20-1 for a block diagram of Timer2.
FIGURE 20-1: TIMER2 BLOCK DIAGRAM
FIGURE 20-2: TIMER2 TIMING DIAGRAM
Prescaler
1:1, 1:4, 1:16, 1:64
Fosc/4
2
T2CKPS<1:0> Comparator Postscaler
1:1 to 1:16
4
T2OUTPS<3:0>
set bit
TMR2IF
TMR2 R
PR2
T2_match To Peripherals
Rev. 10-000019A
7/30/2013
0x03
0x00 0x01 0x02 0x03 0x00 0x01 0x02
1:4
Pulse Width(1)
Note 1: The Pulse Width of T2_match is equal to the scaled input of TMR2.
FOSC/4
Prescale
PR2
TMR2
T2_match
Rev. 10-000020A
7/30/2013
PIC12(L)F1501
DS40001615C-page 148 2011-2015 Microchip Technology Inc.
20.1 Timer2 Operation
The clock input to the Timer2 module is the system
instruction clock (FOSC/4).
TMR2 increments from 00h on each clock edge.
A 4-bit counter/prescaler on the clock input allows direct
input, divide-by-4 and divide-by-16 prescale options.
These options are selected by the prescaler control bits,
T2CKPS<1:0> of the T2CON register. The value of
TMR2 is compared to that of the Period register, PR2, on
each clock cycle. When the two values match, the
comparator generates a match signal as the timer
output. This signal also resets the value of TMR2 to 00h
on the next cycle and drives the output counter/
postscaler (see Section 20.2 “ T imer2 Interrupt”).
The TMR2 and PR2 registers are both directly readable
and writable. The TMR2 register is cleared on any
device Reset, whereas the PR2 register initializes to
FFh. Both the prescaler and postscaler counters are
cleared on the following events:
• a write to the TMR2 register
• a write to the T2CON register
• Power-on Reset (POR)
• Brown-out Reset (BOR)
•MCLR
Reset
• Watchdog Timer (WDT) Reset
• Stack Overflow Reset
• Stack Underflow Reset
•RESET Instruction
20.2 Timer2 Interrupt
Timer2 can also generate an optional device interrupt.
The Timer2 output signal (T2_match) provides the input
for the 4-bit counter/postscaler. This counter generates
the TMR2 match interrupt flag which is latched in
TMR2IF of the PIR1 register. The interrupt is enabled by
setting the TMR2 Match Interrupt Enable bit, TMR2IE of
the PIE1 register.
A range of 16 postscale options (from 1:1 through 1:16
inclusive) can be selected with the postscaler control
bits, T2OUTPS<3:0>, of the T2CON register.
20.3 Timer2 Output
The output of TMR2 is T2_match. T2_match is available
to the following peripherals:
• Configurable Logic Cell (CLC)
• Numerically Controlled Oscillator (NCO)
• Pulse Width Modulator (PWM)
The T2_match signal is synchronous with the system
clock. Figure 20-3 shows two examples of the timing of
the T2_match signal relative to FOSC and prescale
value, T2CKPS<1:0>. The upper diagram illustrates 1:1
prescale timing and the lower diagram, 1:X prescale
timing.
FIGURE 20-3: T2_MATCH TIMING
DIAGRAM
20.4 Timer2 Operation During Sleep
Timer2 cannot be operated while the processor is in
Sleep mode. The contents of the TMR2 and PR2
registers will remain unchanged while the processor is
in Sleep mode.
Note: TMR2 is not cleared when T2CON is
written.
T2_match
FOSC/4
TMR2 = PR2
match
TMR2 = 0
...
PRESCALE = 1:X
(T2CKPS<1:0>=01,10,11)
TCY1TCY2TCYX
...
...
Q1 Q2 Q3
FOSC
TMR2 = PR2
match
TMR2 = 0
Q1Q4
T2_match
FOSC/4
PRESCALE = 1:1
(T2CKPS<1:0>=00)
TCY1
Rev. 10-000021A
7/30/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 149
PIC12(L)F1501
20.5 Regist er D e finitions : Tim e r2 C o n tr o l
TABLE 20-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2
REGISTER 20-1: T2CON: TIMER2 CONTROL REGISTER
U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— T2OUTPS<3:0> TMR2ON T2CKPS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6-3 T2OUTPS<3:0>: Timer2 Output Postscaler Select bits
0000 = 1:1 Postscaler
0001 = 1:2 Postscaler
0010 = 1:3 Postscaler
0011 = 1:4 Postscaler
0100 = 1:5 Postscaler
0101 = 1:6 Postscaler
0110 = 1:7 Postscaler
0111 = 1:8 Postscaler
1000 = 1:9 Postscaler
1001 = 1:10 Postscaler
1010 = 1:11 Postscaler
1011 = 1:12 Postscaler
1100 = 1:13 Postscaler
1101 = 1:14 Postscaler
1110 = 1:15 Postscaler
1111 = 1:16 Postscaler
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits
00 = Prescaler is 1
01 = Prescaler is 4
10 = Prescaler is 16
11 = Prescaler is 64
Name Bit 7 Bit 6 Bit 5 B it 4 B it 3 Bit 2 Bit 1 Bit 0 Register
on Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
PIE1 TMR1GIE ADIE ———— TMR2IE TMR1IE 65
PIR1 TMR1GIF ADIF ———— TMR2IF TMR1IF 68
PR2 Timer2 Module Period Register 147*
T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 149
TMR2 Holding Register for the 8-bit TMR2 Count 147*
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module.
* Page provides register information.
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DS40001615C-page 150 2011-2015 Microchip Technology Inc.
21.0 PULSE-WIDTH MODULATION
(PW M ) MODUL E
The PWM module generates a Pulse-Width Modulated
signal determined by the duty cycle, period, and reso-
lution that are configured by the following registers:
•PR2
•T2CON
• PWMxDCH
• PWMxDCL
•PWMxCON
Figure 21-1 shows a simplified block diagram of PWM
operation.
For a step-by-step procedure on how to set up this
module for PWM operation, refer to Section
21.1.9 “Setup for PWM Operation using PWMx
Pins”.
FIGURE 21-1: SIMPLIFIED PWM BLOCK DIAGRAM
Rev. 10-000022A
8/5/2013
8-bit timer is concatenated with two bits generated by Fosc or two bits of the internal prescaler to
create 10-bit time-base.
Note 1:
PWMxDCH
Duty cycle registers PWMxDCL<7:6>
10-bit Latch
(Not visible to user)
Comparator
Comparator
PR2
(1)
TMR2
TMR2 Module
0
1
PWMxPOL
PWMx
PWMx_out To Peripherals
RTRIS Control
PWMxOE
R
S
Q
Q
T2_match
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21.1 PWMx Pin Configuration
All PWM outputs are multiplexed with the PORT data
latch. The user must configure the pins as outputs by
clearing the associated TRIS bits.
21.1.1 FUNDAMENTAL OPERATION
The PWM module produces a 10-bit resolution output.
Timer2 and PR2 set the period of the PWM. The
PWMxDCL and PWMxDCH registers configure the
duty cycle. The period is common to all PWM modules,
whereas the duty cycle is independently controlled.
All PWM outputs associated with Timer2 are set when
TMR2 is cleared. Each PWMx is cleared when TMR2
is equal to the value specified in the corresponding
PWMxDCH (8 MSb) and PWMxDCL<7:6> (2 LSb) reg-
isters. When the value is greater than or equal to PR2,
the PWM output is never cleared (100% duty cycle).
21.1.2 PWM OUTPUT POLARITY
The output polarity is inverted by setting the PWMxPOL
bit of the PWMxCON register.
21.1.3 PWM PERIOD
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 21-1.
EQUATION 21-1: PWM PERIOD
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
•TMR2 is cleared
• The PWM output is active. (Exception: When the
PWM duty cycle = 0%, the PWM output will
remain inactive.)
• The PWMxDCH and PWMxDCL register values
are latched into the buffers.
21.1.4 PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit
value to the PWMxDCH and PWMxDCL register pair.
The PWMxDCH register contains the eight MSbs and
the PWMxDCL<7:6>, the two LSbs. The PWMxDCH
and PWMxDCL registers can be written to at any time.
Equation 21-2 is used to calculate the PWM pulse width.
Equation 21-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 21-2: PULSE WIDTH
EQUATION 21-3: DUTY CYCLE RATIO
The 8-bit timer TMR2 register is concatenated with the
two Least Significant bits of 1/FOSC, adjusted by the
Timer2 prescaler to create the 10-bit time base. The
system clock is used if the Timer2 prescaler is set to 1:1.
Figure 21-2 shows a waveform of the PWM signal when
the duty cycle is set for the smallest possible pulse.
FIGURE 21-2: PWM OUTPUT
Note: Clearing the PWMxOE bit will relinquish
control of the PWMx pin.
Note: The Timer2 postscaler is not used in the
determination of the PWM frequency. The
postscaler could be used to have a servo
update rate at a different frequency than
the PWM output.
Note: The PWMxDCH and PWMxDCL registers
are double buffered. The buffers are
updated when Timer2 matches PR2. Care
should be taken to update both registers
before the timer match occurs.
PWM Period PR21+4TOSC =
(TM R2 Prescale Value)
Note: TOSC = 1/FOSC
Note: The Timer2 postscaler has no effect on
the PWM operation.
Pulse Width PWMxDCH:PWMxDCL<7:6>
=
TOSC
(TMR2 Prescale Value)
Note: TOSC = 1/FOSC
Duty Cycle Ratio PWMxDCH:PWMxDCL<7:6>
4 PR2 1+
-----------------------------------------------------------------------------------=
Pulse Width
TMR2 = PR2
TMR2 = 0
TMR2 = PWMxDC
FOSC
PWM
Q1 Q2 Q3 Q4 Rev. 10-000023A
7/30/2013
PIC12(L)F1501
DS40001615C-page 152 2011-2015 Microchip Technology Inc.
21.1.5 PWM RESOLUTION
The resolution determines the number of available duty
cycles for a given period. For example, a 10-bit resolu-
tion will result in 1024 discrete duty cycles, whereas an
8-bit resolution will result in 256 discrete duty cycles.
The maximum PWM resolution is ten bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 21-4.
EQUATION 21-4: PWM RESOLUTION
21.1.6 OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the state of the module will not change. If the
PWMx pin is driving a value, it will continue to drive that
value. When the device wakes up, TMR2 will continue
from its previous state.
21.1.7 CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency (FOSC). Any changes in the system clock
frequency will result in changes to the PWM frequency.
Refer to Section 5.0 “Oscillator Module” for
additional details.
21.1.8 EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
PWM registers to their Reset states.
Note: If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
Resolution 4PR2 1+log 2log
------------------------------------------ bits=
TABLE 21-1: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
PWM Frequency 0.31 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescale 64 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
TABLE 21-2: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
PWM Frequency 0.31 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz
Timer Prescale 64 4 1 1 1 1
PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09
Maximum Resolution (bits) 8 8 8 6 5 5
2011-2015 Microchip Technology Inc. DS40001615C-page 153
PIC12(L)F1501
21.1.9 SETUP FOR PWM OPERATION
USING PWMx PINS
The following steps should be taken when configuring
the module for PWM operation using the PWMx pins:
1. Disable the PWMx pin output driver(s) by setting
the associated TRIS bit(s).
2. Clear the PWMxCON register.
3. Load the PR2 register with the PWM period
value.
4. Clear the PWMxDCH register and bits <7:6> of
the PWMxDCL register.
5. Configure and start Timer2:
• Clear the TMR2IF interrupt flag bit of the
PIR1 register. See note below.
• Configure the T2CKPS bits of the T2CON
register with the Timer2 prescale value.
• Enable Timer2 by setting the TMR2ON bit of
the T2CON register.
6. Enable PWM output pin and wait until Timer2
overflows, TMR2IF bit of the PIR1 register is set.
See note below.
7. Enable the PWMx pin output driver(s) by clear-
ing the associated TRIS bit(s) and setting the
PWMxOE bit of the PWMxCON register.
8. Configure the PWM module by loading the
PWMxCON register with the appropriate values.
Note 1: In order to send a complete duty cycle
and period on the first PWM output, the
above steps must be followed in the order
given. If it is not critical to start with a
complete PWM signal, then move Step 8
to replace Step 4.
2: For operation with other peripherals only,
disable PWMx pin outputs.
PIC12(L)F1501
DS40001615C-page 154 2011-2015 Microchip Technology Inc.
21.2 Regist er D e finiti o n s : P W M C o n tr o l
REGISTER 21-1: PWMxCON: PWM CONTROL REGISTER
R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 U-0
PWMxEN PWMxOE PWMxOUT PWMxPOL — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 PWMxEN: PWM Module Enable bit
1 = PWM module is enabled
0 = PWM module is disabled
bit 6 PWMxOE: PWM Module Output Enable bit
1 = Output to PWMx pin is enabled
0 = Output to PWMx pin is disabled
bit 5 PWMxOUT: PWM Module Output Value bit
bit 4 PWMxPOL: PWMx Output Polarity Select bit
1 = PWM output is active-low
0 = PWM output is active-high
bit 3-0 Unimplemented: Read as ‘0’
2011-2015 Microchip Technology Inc. DS40001615C-page 155
PIC12(L)F1501
REGISTER 21-2: PWMxDCH: PWM DUTY CYCLE HIGH BITS
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
PWMxDCH<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 PWMxDCH<7:0>: PWM Duty Cycle Most Significant bits
These bits are the MSbs of the PWM duty cycle. The two LSbs are found in the PWMxDCL register.
REGISTER 21-3: PWMxDCL: PWM DUTY CYCLE LOW BITS
R/W-x/u R/W-x/u U-0 U-0 U-0 U-0 U-0 U-0
PWMxDCL<7:6> — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 PWMxDCL<7:6>: PWM Duty Cycle Least Significant bits
These bits are the LSbs of the PWM duty cycle. The MSbs are found in the PWMxDCH register.
bit 5-0 Unimplemented: Read as ‘0’
TABLE 21-3: SUMMARY OF REGISTERS ASSOCIATED WITH PWM
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
PR2 Timer2 module Period Register 147*
PWM1CON PWM1EN PWM1OE PWM1OUT PWM1POL — — — — 154
PWM1DCH PWM1DCH<7:0> 155
PWM1DCL PWM1DCL<7:6> — — — — — — 155
PWM2CON PWM2EN PWM2OE PWM2OUT PWM2POL — — — — 154
PWM2DCH PWM2DCH<7:0> 155
PWM2DCL PWM2DCL<7:6> — — — — — — 155
PWM3CON PWM3EN PWM3OE PWM3OUT PWM3POL — — — — 154
PWM3DCH PWM3DCH<7:0> 155
PWM3DCL PWM3DCL<7:6> — — — — — — 155
PWM4CON PWM4EN PWM4OE PWM4OUT PWM4POL — — — — 154
PWM4DCH PWM4DCH<7:0> 155
PWM4DCL PWM4DCL<7:6> — — — — — — 155
T2CON —T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 149
TMR2 Timer2 module Register 147*
TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
Legend: - = Unimplemented locations, read as ‘0’, u = unchanged, x = unknown. Shaded cells are not used by the PWM.
* Page provides register information.
Note 1: Unimplemented, read as ‘1’.
PIC12(L)F1501
DS40001615C-page 156 2011-2015 Microchip Technology Inc.
22.0 CONFIGURABLE LOGIC CELL
(CLC)
The Configurable Logic Cell (CLCx) provides program-
mable logic that operates outside the speed limitations
of software execution. The logic cell takes up to 16
input signals, and through the use of configurable
gates, reduces the 16 inputs to four logic lines that drive
one of eight selectable single-output logic functions.
Input sources are a combination of the following:
• I/O pins
• Internal clocks
• Peripherals
•Register bits
The output can be directed internally to peripherals and
to an output pin.
Refer to Figure 22-1 for a simplified diagram showing
signal flow through the CLCx.
Possible configurations include:
• Combinatorial Logic
-AND
-NAND
- AND-OR
- AND-OR-INVERT
-OR-XOR
-OR-XNOR
• Latches
-S-R
- Clocked D with Set and Reset
- Transparent D with Set and Reset
- Clocked J-K with Reset
FIGURE 22-1: CONFIG URABLE LOGIC CELL BLOCK DIAGRAM
Input Data Selection Gates(1)
Logic
Function
(2)
lcxg2
lcxg1
lcxg3
lcxg4
LCxMODE<2:0>
lcxq
LCxEN
LCx_in[0]
LCx_in[1]
LCx_in[2]
LCx_in[3]
LCx_in[4]
LCx_in[5]
LCx_in[6]
LCx_in[7]
LCx_in[8]
LCx_in[9]
LCx_in[10]
LCx_in[11]
LCx_in[12]
LCx_in[13]
LCx_in[14]
LCx_in[15]
LCxPOL
det
Interrupt
det
Interrupt
set bit
CLCxIF
LCXINTN
LCXINTP
LCxOE
TRIS Control
CLCx
to Peripherals
Q1
LCx_out
LCxOUT
MLCxOUT
DQ
Rev. 10-000025A
8/1/2013
Note 1: See Figure 22-2.
2: See Figure 22-3.
2011-2015 Microchip Technology Inc. DS40001615C-page 157
PIC12(L)F1501
22.1 CLCx Setup
Programming the CLCx module is performed by config-
uring the four stages in the logic signal flow. The four
stages are:
• Data selection
• Data gating
• Logic function selection
• Output polarity
Each stage is setup at run time by writing to the corre-
sponding CLCx Special Function Registers. This has
the added advantage of permitting logic reconfiguration
on-the-fly during program execution.
22.1.1 DATA SELECTION
There are 16 signals available as inputs to the configu-
rable logic. Four 8-input multiplexers are used to select
the inputs to pass on to the next stage. The 16 inputs to
the multiplexers are arranged in groups of four. Each
group is available to two of the four multiplexers, in
each case, paired with a different group. This arrange-
ment makes possible selection of up to two from a
group without precluding a selection from another
group.
Data selection is through four multiplexers as indicated
on the left side of Figure 22-2. Data inputs in the figure
are identified by a generic numbered input name.
Table 22-1 correlates the generic input name to the
actual signal for each CLC module. The columns labeled
lcxd1 through lcxd4 indicate the MUX output for the
selected data input. D1S through D4S are abbreviations
for the MUX select input codes: LCxD1S<2:0> through
LCxD4S<2:0>, respectively. Selecting a data input in a
column excludes all other inputs in that column.
Data inputs are selected with CLCxSEL0 and
CLCxSEL1 registers (Register 22-3 and Register 22-5,
respectively).
Note: Data selections are undefined at power-up.
TABLE 22-1: CLCx DATA INPUT SELECTION
Data Input lcxd1
D1S lcxd2
D2S lcxd3
D3S lcxd4
D4S CLC 1 CLC 2
LCx_in[0] 000 — — 100 CLC1IN0 CLC2IN0
LCx_in[1] 001 — — 101 CLC1IN1 CLC2IN1
LCx_in[2] 010 — — 110 C1OUT_sync C1OUT_sync
LCx_in[3] 011 — — 111 Reserved Reserved
LCx_in[4] 100 000 ——FOSC FOSC
LCx_in[5] 101 001 —— T0_overflow T0_overflow
LCx_in[6] 110 010 —— T1_overflow T1_overflow
LCx_in[7] 111 011 —— T2_match T2_match
LCx_in[8] —100 000 — LC1_out LC1_out
LCx_in[9] —101 001 — LC2_out LC2_out
LCx_in[10] —110 010 — Reserved Reserved
LCx_in[11] —111 011 — Reserved Reserved
LCx_in[12] — — 100 000 NCO1_out LFINTOSC
LCx_in[13] — — 101 001 HFINTOSC FRC
LCx_in[14] — — 110 010 PWM3_out PWM1_out
LCx_in[15] — — 111 011 PWM4_out PWM2_out
PIC12(L)F1501
DS40001615C-page 158 2011-2015 Microchip Technology Inc.
22.1.2 DATA GATING
Outputs from the input multiplexers are directed to the
desired logic function input through the data gating
stage. Each data gate can direct any combination of the
four selected inputs.
The gate stage is more than just signal direction. The
gate can be configured to direct each input signal as
inverted or non-inverted data. Directed signals are
ANDed together in each gate. The output of each gate
can be inverted before going on to the logic function
stage.
The gating is in essence a 1-to-4 input
AND/NAND/OR/NOR gate. When every input is
inverted and the output is inverted, the gate is an OR of
all enabled data inputs. When the inputs and output are
not inverted, the gate is an AND or all enabled inputs.
Table 22-2 summarizes the basic logic that can be
obtained in gate 1 by using the gate logic select bits.
The table shows the logic of four input variables, but
each gate can be configured to use less than four. If
no inputs are selected, the output will be zero or one,
depending on the gate output polarity bit.
It is possible (but not recommended) to select both the
true and negated values of an input. When this is done,
the gate output is zero, regardless of the other inputs,
but may emit logic glitches (transient-induced pulses).
If the output of the channel must be zero or one, the
recommended method is to set all gate bits to zero and
use the gate polarity bit to set the desired level.
Data gating is configured with the logic gate select
registers as follows:
• Gate 1: CLCxGLS0 (Register 22-5)
• Gate 2: CLCxGLS1 (Register 22-6)
• Gate 3: CLCxGLS2 (Register 22-7)
• Gate 4: CLCxGLS3 (Register 22-8)
Register number suffixes are different than the gate
numbers because other variations of this module have
multiple gate selections in the same register.
Data gating is indicated in the right side of Figure 22-2.
Only one gate is shown in detail. The remaining three
gates are configured identically with the exception that
the data enables correspond to the enables for that
gate.
22.1.3 LOGIC FUNCTION
There are eight available logic functions including:
• AND-OR
•OR-XOR
•AND
• S-R Latch
• D Flip-Flop with Set and Reset
• D Flip-Flop with Reset
• J-K Flip-Flop with Reset
• Transparent Latch with Set and Reset
Logic functions are shown in Figure 22-3. Each logic
function has four inputs and one output. The four inputs
are the four data gate outputs of the previous stage.
The output is fed to the inversion stage and from there
to other peripherals, an output pin, and back to the
CLCx itself.
22.1.4 OUTPUT POLARITY
The last stage in the configurable logic cell is the output
polarity. Setting the LCxPOL bit of the CLCxCON reg-
ister inverts the output signal from the logic stage.
Changing the polarity while the interrupts are enabled
will cause an interrupt for the resulting output transition.
Note: Data gating is undefined at power-up.
TABLE 22-2: DATA GATING LOGIC
CLCxGLS0 LCxG1POL Gate Logic
0x55 1AND
0x55 0NAND
0xAA 1NOR
0xAA 0OR
0x00 0Logic 0
0x00 1Logic 1
2011-2015 Microchip Technology Inc. DS40001615C-page 159
PIC12(L)F1501
22.1.5 CLCx SETUP STEPS
The following steps should be followed when setting up
the CLCx:
• Disable CLCx by clearing the LCxEN bit.
• Select desired inputs using CLCxSEL0 and
CLCxSEL1 registers (See Tab le 22-1).
• Clear any associated ANSEL bits.
• Set all TRIS bits associated with inputs.
• Clear all TRIS bits associated with outputs.
• Enable the chosen inputs through the four gates
using CLCxGLS0, CLCxGLS1, CLCxGLS2, and
CLCxGLS3 registers.
• Select the gate output polarities with the
LCxPOLy bits of the CLCxPOL register.
• Select the desired logic function with the
LCxMODE<2:0> bits of the CLCxCON register.
• Select the desired polarity of the logic output with
the LCxPOL bit of the CLCxPOL register. (This
step may be combined with the previous gate
output polarity step).
• If driving a device, set the LCxOE bit in the
CLCxCON register and also clear the TRIS bit
corresponding to that output.
• If interrupts are desired, configure the following
bits:
- Set the LCxINTP bit in the CLCxCON register
for rising event.
- Set the LCxINTN bit in the CLCxCON
register or falling event.
- Set the CLCxIE bit of the associated PIE
registers.
- Set the GIE and PEIE bits of the INTCON
register.
• Enable the CLCx by setting the LCxEN bit of the
CLCxCON register.
22.2 CLCx Interrupts
An interrupt will be generated upon a change in the
output value of the CLCx when the appropriate interrupt
enables are set. A rising edge detector and a falling
edge detector are present in each CLC for this purpose.
The CLCxIF bit of the associated PIR registers will be
set when either edge detector is triggered and its asso-
ciated enable bit is set. The LCxINTP enables rising
edge interrupts and the LCxINTN bit enables falling
edge interrupts. Both are located in the CLCxCON
register.
To fully enable the interrupt, set the following bits:
• LCxON bit of the CLCxCON register
• CLCxIE bit of the associated PIE registers
• LCxINTP bit of the CLCxCON register (for a rising
edge detection)
• LCxINTN bit of the CLCxCON register (for a
falling edge detection)
• PEIE and GIE bits of the INTCON register
The CLCxIF bit of the associated PIR registers, must
be cleared in software as part of the interrupt service. If
another edge is detected while this flag is being
cleared, the flag will still be set at the end of the
sequence.
22.3 Output Mirror Copies
Mirror copies of all LCxCON output bits are contained
in the CLCxDATA register. Reading this register reads
the outputs of all CLCs simultaneously. This prevents
any reading skew introduced by testing or reading the
CLCxOUT bits in the individual CLCxCON registers.
22.4 Effects of a Reset
The CLCxCON register is cleared to zero as the result
of a Reset. All other selection and gating values remain
unchanged.
22.5 Operation During Sleep
The CLC module operates independently from the
system clock and will continue to run during Sleep,
provided that the input sources selected remain active.
The HFINTOSC remains active during Sleep when the
CLC module is enabled and the HFINTOSC is
selected as an input source, regardless of the system
clock source selected.
In other words, if the HFINTOSC is simultaneously
selected as the system clock and as a CLC input
source, when the CLC is enabled, the CPU will go idle
during Sleep, but the CLC will continue to operate and
the HFINTOSC will remain active.
This will have a direct effect on the Sleep mode current.
PIC12(L)F1501
DS40001615C-page 160 2011-2015 Microchip Technology Inc.
FIGURE 22-2: INPUT DATA SELECTION AND GATING
lcxg1
LCxG1POL
Data GATE 1
LCxD1G1T
lcxg2
lcxg3
lcxg4
Data GATE 2
Data GATE 3
Data GATE 4
LCxD1G1N
LCxD2G1T
LCxD2G1N
LCxD3G1T
LCxD3G1N
LCxD4G1T
LCxD4G1N
LCxD1S<4:0>
LCxD2S<4:0>
LCxD3S<4:0>
LCxD4S<4:0>
LCx_in[0]
LCx_in[31]
00000
11111
Data Selection
Note: All controls are undefined at power-up.
lcxd1T
lcxd1N
lcxd2T
lcxd2N
lcxd3T
lcxd3N
lcxd4T
lcxd4N
(Same as Data GATE 1)
(Same as Data GATE 1)
(Same as Data GATE 1)
LCx_in[0]
LCx_in[31]
00000
11111
LCx_in[0]
LCx_in[31]
00000
11111
LCx_in[0]
LCx_in[31]
00000
11111
2011-2015 Microchip Technology Inc. DS40001615C-page 161
PIC12(L)F1501
FIGURE 22-3: PROGRAM MABLE LOGIC FUNCTIONS
lcxg1
lcxg2
lcxg3
lcxg4
lcxq
AND-OR OR-XOR
LCxMODE<2:0> = 000 LCxMODE<2:0> = 001
4-input AND S-R Latch
LCxMODE<2:0> = 010 LCxMODE<2:0> = 011
lcxg1
lcxg2
lcxg3
lcxg4
lcxq
S
R
Qlcxq
lcxg1
lcxg2
lcxg3
lcxg4
lcxg1
lcxg2
lcxg3
lcxg4
lcxq
1-Input D Flip-Flop with S and R 2-Input D Flip-Flop with R
J-K Flip-Flop with R 1-Input Transparent Latch with S and R
LCxMODE<2:0> = 100 LCxMODE<2:0> = 101
LCxMODE<2:0> = 110 LCxMODE<2:0> = 111
D
R
Qlcxq
lcxg1
lcxg2
lcxg3
lcxg4
D
R
Q
S
lcxg1
lcxg2
lcxg3
lcxg4
lcxq
J
R
Q
K
lcxg1
lcxg2
lcxg3
lcxg4
lcxq
D
R
Q
S
LE
lcxq
lcxg1
lcxg2
lcxg3
lcxg4
Rev. 10-000122A
7/30/2013
PIC12(L)F1501
DS40001615C-page 162 2011-2015 Microchip Technology Inc.
22.6 Register Definitions: CLC Control
REGISTER 22-1: CLCxCON: CONFIGURABLE LOGIC CELL CONTROL REGISTER
R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
LCxEN LCxOE LCxOUT LCxINTP LCxINTN LCxMODE<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 LCxEN: Configurable Logic Cell Enable bit
1 = Configurable logic cell is enabled and mixing input signals
0 = Configurable logic cell is disabled and has logic zero output
bit 6 LCxOE: Configurable Logic Cell Output Enable bit
1 = Configurable logic cell port pin output enabled
0 = Configurable logic cell port pin output disabled
bit 5 LCxOUT: Configurable Logic Cell Data Output bit
Read-only: logic cell output data, after LCxPOL; sampled from lcx_out wire.
bit 4 LCxINTP: Configurable Logic Cell Positive Edge Going Interrupt Enable bit
1 = CLCxIF will be set when a rising edge occurs on lcx_out
0 = CLCxIF will not be set
bit 3 LCxINTN: Configurable Logic Cell Negative Edge Going Interrupt Enable bit
1 = CLCxIF will be set when a falling edge occurs on lcx_out
0 = CLCxIF will not be set
bit 2-0 LCxMODE<2:0>: Configurable Logic Cell Functional Mode bits
111 = Cell is 1-input transparent latch with S and R
110 = Cell is J-K flip-flop with R
101 = Cell is 2-input D flip-flop with R
100 = Cell is 1-input D flip-flop with S and R
011 = Cell is S-R latch
010 = Cell is 4-input AND
001 = Cell is OR-XOR
000 = Cell is AND-OR
2011-2015 Microchip Technology Inc. DS40001615C-page 163
PIC12(L)F1501
REGISTER 22-2: CLCxPOL: SIGNAL POLARITY CONTROL REGISTER
R/W-0/0 U-0 U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u
LCxPOL — — — LCxG4POL LCxG3POL LCxG2POL LCxG1POL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 LCxPOL: LCOUT Polarity Control bit
1 = The output of the logic cell is inverted
0 = The output of the logic cell is not inverted
bit 6-4 Unimplemented: Read as ‘0’
bit 3 LCxG4POL: Gate 4 Output Polarity Control bit
1 = The output of gate 4 is inverted when applied to the logic cell
0 = The output of gate 4 is not inverted
bit 2 LCxG3POL: Gate 3 Output Polarity Control bit
1 = The output of gate 3 is inverted when applied to the logic cell
0 = The output of gate 3 is not inverted
bit 1 LCxG2POL: Gate 2 Output Polarity Control bit
1 = The output of gate 2 is inverted when applied to the logic cell
0 = The output of gate 2 is not inverted
bit 0 LCxG1POL: Gate 1 Output Polarity Control bit
1 = The output of gate 1 is inverted when applied to the logic cell
0 = The output of gate 1 is not inverted
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REGISTER 22-3: CLCxSEL0: MULTIPLEXER DATA 1 AND 2 SELECT REGISTER
U-0 R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u
— LCxD2S<2:0>(1) — LCxD1S<2:0>(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6-4 LCxD2S<2:0>: Input Data 2 Selection Control bits(1)
111 = LCx_in[11] is selected for lcxd2
110 = LCx_in[10] is selected for lcxd2
101 = LCx_in[9] is selected for lcxd2
100 = LCx_in[8] is selected for lcxd2
011 = LCx_in[7] is selected for lcxd2
010 = LCx_in[6] is selected for lcxd2
001 = LCx_in[5] is selected for lcxd2
000 = LCx_in[4] is selected for lcxd2
bit 3 Unimplemented: Read as ‘0’
bit 2-0 LCxD1S<2:0>: Input Data 1 Selection Control bits(1)
111 = LCx_in[7] is selected for lcxd1
110 = LCx_in[6] is selected for lcxd1
101 = LCx_in[5] is selected for lcxd1
100 = LCx_in[4] is selected for lcxd1
011 = LCx_in[3] is selected for lcxd1
010 = LCx_in[2] is selected for lcxd1
001 = LCx_in[1] is selected for lcxd1
000 = LCx_in[0] is selected for lcxd1
Note 1: See Table 22-1 for signal names associated with inputs.
2011-2015 Microchip Technology Inc. DS40001615C-page 165
PIC12(L)F1501
REGISTER 22-4: CLCxSEL1: MULTIPLEXER DATA 3 AND 4 SELECT REGISTER
U-0 R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u
— LCxD4S<2:0>(1) — LCxD3S<2:0>(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6-4 LCxD4S<2:0>: Input Data 4 Selection Control bits(1)
111 = LCx_in[3] is selected for lcxd4
110 = LCx_in[2] is selected for lcxd4
101 = LCx_in[1] is selected for lcxd4
100 = LCx_in[0] is selected for lcxd4
011 = LCx_in[15] is selected for lcxd4
010 = LCx_in[14] is selected for lcxd4
001 = LCx_in[13] is selected for lcxd4
000 = LCx_in[12] is selected for lcxd4
bit 3 Unimplemented: Read as ‘0’
bit 2-0 LCxD3S<2:0>: Input Data 3 Selection Control bits(1)
111 = LCx_in[15] is selected for lcxd3
110 = LCx_in[14] is selected for lcxd3
101 = LCx_in[13] is selected for lcxd3
100 = LCx_in[12] is selected for lcxd3
011 = LCx_in[11] is selected for lcxd3
010 = LCx_in[10] is selected for lcxd3
001 = LCx_in[9] is selected for lcxd3
000 = LCx_in[8] is selected for lcxd3
Note 1: See Table 22-1 for signal names associated with inputs.
PIC12(L)F1501
DS40001615C-page 166 2011-2015 Microchip Technology Inc.
REGISTER 22-5: CLCxGLS0: GATE 1 LOGIC SELECT REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
LCxG1D4T LCxG1D4N LCxG1D3T LCxG1D3N LCxG1D2T LCxG1D2N LCxG1D1T LCxG1D1N
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 LCxG1D4T: Gate 1 Data 4 True (non-inverted) bit
1 = lcxd4T is gated into lcxg1
0 = lcxd4T is not gated into lcxg1
bit 6 LCxG1D4N: Gate 1 Data 4 Negated (inverted) bit
1 = lcxd4N is gated into lcxg1
0 = lcxd4N is not gated into lcxg1
bit 5 LCxG1D3T: Gate 1 Data 3 True (non-inverted) bit
1 = lcxd3T is gated into lcxg1
0 = lcxd3T is not gated into lcxg1
bit 4 LCxG1D3N: Gate 1 Data 3 Negated (inverted) bit
1 = lcxd3N is gated into lcxg1
0 = lcxd3N is not gated into lcxg1
bit 3 LCxG1D2T: Gate 1 Data 2 True (non-inverted) bit
1 = lcxd2T is gated into lcxg1
0 = lcxd2T is not gated into lcxg1
bit 2 LCxG1D2N: Gate 1 Data 2 Negated (inverted) bit
1 = lcxd2N is gated into lcxg1
0 = lcxd2N is not gated into lcxg1
bit 1 LCxG1D1T: Gate 1 Data 1 True (non-inverted) bit
1 = lcxd1T is gated into lcxg1
0 = lcxd1T is not gated into lcxg1
bit 0 LCxG1D1N: Gate 1 Data 1 Negated (inverted) bit
1 = lcxd1N is gated into lcxg1
0 = lcxd1N is not gated into lcxg1
2011-2015 Microchip Technology Inc. DS40001615C-page 167
PIC12(L)F1501
REGISTER 22-6: CLCxGLS1: GATE 2 LOGIC SELECT REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
LCxG2D4T LCxG2D4N LCxG2D3T LCxG2D3N LCxG2D2T LCxG2D2N LCxG2D1T LCxG2D1N
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 LCxG2D4T: Gate 2 Data 4 True (non-inverted) bit
1 = lcxd4T is gated into lcxg2
0 = lcxd4T is not gated into lcxg2
bit 6 LCxG2D4N: Gate 2 Data 4 Negated (inverted) bit
1 = lcxd4N is gated into lcxg2
0 = lcxd4N is not gated into lcxg2
bit 5 LCxG2D3T: Gate 2 Data 3 True (non-inverted) bit
1 = lcxd3T is gated into lcxg2
0 = lcxd3T is not gated into lcxg2
bit 4 LCxG2D3N: Gate 2 Data 3 Negated (inverted) bit
1 = lcxd3N is gated into lcxg2
0 = lcxd3N is not gated into lcxg2
bit 3 LCxG2D2T: Gate 2 Data 2 True (non-inverted) bit
1 = lcxd2T is gated into lcxg2
0 = lcxd2T is not gated into lcxg2
bit 2 LCxG2D2N: Gate 2 Data 2 Negated (inverted) bit
1 = lcxd2N is gated into lcxg2
0 = lcxd2N is not gated into lcxg2
bit 1 LCxG2D1T: Gate 2 Data 1 True (non-inverted) bit
1 = lcxd1T is gated into lcxg2
0 = lcxd1T is not gated into lcxg2
bit 0 LCxG2D1N: Gate 2 Data 1 Negated (inverted) bit
1 = lcxd1N is gated into lcxg2
0 = lcxd1N is not gated into lcxg2
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REGISTER 22-7: CLCxGLS2: GATE 3 LOGIC SELECT REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
LCxG3D4T LCxG3D4N LCxG3D3T LCxG3D3N LCxG3D2T LCxG3D2N LCxG3D1T LCxG3D1N
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 LCxG3D4T: Gate 3 Data 4 True (non-inverted) bit
1 = lcxd4T is gated into lcxg3
0 = lcxd4T is not gated into lcxg3
bit 6 LCxG3D4N: Gate 3 Data 4 Negated (inverted) bit
1 = lcxd4N is gated into lcxg3
0 = lcxd4N is not gated into lcxg3
bit 5 LCxG3D3T: Gate 3 Data 3 True (non-inverted) bit
1 = lcxd3T is gated into lcxg3
0 = lcxd3T is not gated into lcxg3
bit 4 LCxG3D3N: Gate 3 Data 3 Negated (inverted) bit
1 = lcxd3N is gated into lcxg3
0 = lcxd3N is not gated into lcxg3
bit 3 LCxG3D2T: Gate 3 Data 2 True (non-inverted) bit
1 = lcxd2T is gated into lcxg3
0 = lcxd2T is not gated into lcxg3
bit 2 LCxG3D2N: Gate 3 Data 2 Negated (inverted) bit
1 = lcxd2N is gated into lcxg3
0 = lcxd2N is not gated into lcxg3
bit 1 LCxG3D1T: Gate 3 Data 1 True (non-inverted) bit
1 = lcxd1T is gated into lcxg3
0 = lcxd1T is not gated into lcxg3
bit 0 LCxG3D1N: Gate 3 Data 1 Negated (inverted) bit
1 = lcxd1N is gated into lcxg3
0 = lcxd1N is not gated into lcxg3
2011-2015 Microchip Technology Inc. DS40001615C-page 169
PIC12(L)F1501
REGISTER 22-8: CLCxGLS3: GATE 4 LOGIC SELECT REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
LCxG4D4T LCxG4D4N LCxG4D3T LCxG4D3N LCxG4D2T LCxG4D2N LCxG4D1T LCxG4D1N
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 LCxG4D4T: Gate 4 Data 4 True (non-inverted) bit
1 = lcxd4T is gated into lcxg4
0 = lcxd4T is not gated into lcxg4
bit 6 LCxG4D4N: Gate 4 Data 4 Negated (inverted) bit
1 = lcxd4N is gated into lcxg4
0 = lcxd4N is not gated into lcxg4
bit 5 LCxG4D3T: Gate 4 Data 3 True (non-inverted) bit
1 = lcxd3T is gated into lcxg4
0 = lcxd3T is not gated into lcxg4
bit 4 LCxG4D3N: Gate 4 Data 3 Negated (inverted) bit
1 = lcxd3N is gated into lcxg4
0 = lcxd3N is not gated into lcxg4
bit 3 LCxG4D2T: Gate 4 Data 2 True (non-inverted) bit
1 = lcxd2T is gated into lcxg4
0 = lcxd2T is not gated into lcxg4
bit 2 LCxG4D2N: Gate 4 Data 2 Negated (inverted) bit
1 = lcxd2N is gated into lcxg4
0 = lcxd2N is not gated into lcxg4
bit 1 LCxG4D1T: Gate 4 Data 1 True (non-inverted) bit
1 = lcxd1T is gated into lcxg4
0 = lcxd1T is not gated into lcxg4
bit 0 LCxG4D1N: Gate 4 Data 1 Negated (inverted) bit
1 = lcxd1N is gated into lcxg4
0 = lcxd1N is not gated into lcxg4
PIC12(L)F1501
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REGISTER 22-9: CLCDATA: CLC DATA OUTPUT
U-0 U-0 U-0 U-0 U-0 U-0 R-0 R-0
— — — — — — MLC2OUT MLC1OUT
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’
bit 1 MLC2OUT: Mirror copy of LC2OUT bit
bit 0 MLC1OUT: Mirror copy of LC1OUT bit
2011-2015 Microchip Technology Inc. DS40001615C-page 171
PIC12(L)F1501
TABLE 22-3: SUMMARY OF REGISTERS ASSOCIATED WITH CLCx
Name Bit7 Bit6 Bit5 Bit4 BIt3 Bit2 Bit1 Bit0 Register
on Page
ANSELA — — — ANSA4 —ANSA2 ANSA1 ANSA0 99
CLC1CON LC1EN LC1OE LC1OUT LC1INTP LC1INTN LC1MODE<2:0> 162
CLCDATA — — — — — MLC3OUT MLC2OUT MLC1OUT 170
CLC1GLS0 LC1G1D4T LC1G1D4N LC1G1D3T LC1G1D3N LC1G1D2T LC1G1D2N LC1G1D1T LC1G1D1N 166
CLC1GLS1 LC1G2D4T LC1G2D4N LC1G2D3T LC1G2D3N LC1G2D2T LC1G2D2N LC1G2D1T LC1G2D1N 167
CLC1GLS2 LC1G3D4T LC1G3D4N LC1G3D3T LC1G3D3N LC1G3D2T LC1G3D2N LC1G3D1T LC1G3D1N 168
CLC1GLS3 LC1G4D4T LC1G4D4N LC1G4D3T LC1G4D3N LC1G4D2T LC1G4D2N LC1G4D1T LC1G4D1N 169
CLC1POL LC1POL — — — LC1G4POL LC1G3POL LC1G2POL LC1G1POL 163
CLC1SEL0 — LC1D2S<2:0> —LC1D1S<2:0>
164
CLC1SEL1 — LC1D4S<2:0> —LC1D3S<2:0>
165
CLC2CON LC2EN LC2OE LC2OUT LC2INTP LC2INTN LC2MODE<2:0> 162
CLC2GLS0 LC2G1D4T LC2G1D4N LC2G1D3T LC2G1D3N LC2G1D2T LC2G1D2N LC2G1D1T LC2G1D1N 166
CLC2GLS1 LC2G2D4T LC2G2D4N LC2G2D3T LC2G2D3N LC2G2D2T LC2G2D2N LC2G2D1T LC2G2D1N 167
CLC2GLS2 LC2G3D4T LC2G3D4N LC2G3D3T LC2G3D3N LC2G3D2T LC2G3D2N LC2G3D1T LC2G3D1N 168
CLC2GLS3 LC2G4D4T LC2G4D4N LC2G4D3T LC2G4D3N LC2G4D2T LC2G4D2N LC2G4D1T LC2G4D1N 169
CLC2POL LC2POL — — — LC2G4POL LC2G3POL LC2G2POL LC2G1POL 163
CLC2SEL0 — LC2D2S<2:0> —LC2D1S<2:0>
164
CLC2SEL1 — LC2D4S<2:0> —LC2D3S<2:0>
165
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
PIE3 — — — — — — CLC2IE CLC1IE 67
PIR3 — — — — — — CLC2IF CLC1IF 70
TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
Legend: — = unimplemented read as ‘0’,. Shaded cells are not used for CLC module.
Note 1: Unimplemented, read as ‘1’.
PIC12(L)F1501
DS40001615C-page 172 2011-2015 Microchip Technology Inc.
23.0 NUMERICALLY CONTROLLED
OSCILLATOR (NCO) MODULE
The Numerically Controlled Oscillator (NCOx) module
is a timer that uses the overflow from the addition of an
increment value to divide the input frequency. The
advantage of the addition method over simple counter
driven timer is that the resolution of division does not
vary with the divider value. The NCOx is most useful for
applications that require frequency accuracy and fine
resolution at a fixed duty cycle.
Features of the NCOx include:
• 16-bit increment function
• Fixed Duty Cycle (FDC) mode
• Pulse Frequency (PF) mode
• Output pulse width control
• Multiple clock input sources
• Output polarity control
• Interrupt capability
Figure 23-1 is a simplified block diagram of the NCOx
module.
23.1 NCOx Operation
The NCOx operates by repeatedly adding a fixed value
to an accumulator. Additions occur at the input clock rate.
The accumulator will overflow with a carry periodically,
which is the raw NCOx output (NCO_overflow). This
effectively reduces the input clock by the ratio of the
addition value to the maximum accumulator value. See
Equation 23-1.
The NCOx output can be further modified by stretching
the pulse or toggling a flip-flop. The modified NCOx
output is then distributed internally to other peripherals
and optionally output to a pin. The accumulator
overflow also generates an interrupt (NCO_interrupt).
The NCOx period changes in discrete steps to create
an average frequency. This output depends on the
ability of the receiving circuit (i.e., CWG or external
resonant converter circuitry) to average the NCOx
output to reduce uncertainty.
23.1.1 NCOx CLOCK SOURCES
Clock sources available to the NCOx include:
•HFINTOSC
•F
OSC
• LC1_out
• CLKIN pin
The NCOx clock source is selected by configuring the
NxCKS<2:0> bits in the NCOxCLK register.
23.1.2 ACCUMULATOR
The accumulator is a 20-bit register. Read and write
access to the accumulator is available through three
registers:
• NCOxACCL
• NCOxACCH
• NCOxACCU
23.1.3 ADDER
The NCOx adder is a full adder, which operates
independently from the system clock. The addition of the
previous result and the increment value replaces the
accumulator value on the rising edge of each input clock.
23.1.4 INCREMENT REGISTERS
The increment value is stored in two 8-bit registers
making up a 16-bit increment. In order of LSB to MSB
they are:
• NCOxINCL
• NCOxINCH
When the NCO module is enabled, the NCOxINCH
should be written first, then the NCOxINCL register.
Writing to the NCOxINCL register initiates the incre-
ment buffer registers to be loaded simultaneously on
the second rising edge of the NCOx_clk signal.
The registers are readable and writable. The increment
registers are double-buffered to allow value changes to
be made without first disabling the NCOx module.
When the NCO module is disabled, the increment
buffers are loaded immediately after a write to the
increment registers.
EQUATION 23-1:
Note: The increment buffer registers are not
user-accessible.
FOVERFLOW NCO Clock Frequency Increment Value
2n
----------------------------------------------------------------------------------------------------------------=
n = Accumulator width in bits
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DS40001615C-page 173 Status 2011-2015 Microchip Technology Inc.
FIGURE 23-1: NUME RICA LLY CONTROLLED OSCILLATOR (NCOx) MODULE SIMPLIFIED BLOCK DIAGRAM
NCO1CLK
FOSC
LCx_out
DQ TRIS bit
00
01
10
11
NxCKS<1:0> 2
NxOE
HFINTOSC
NCOxACCU NCOxACCH NCOxACCL
NCOxINCH NCOxINCL
INCBUFH INCBUFL
20
20
20
16
16
NCO_overflow
DQ
Q
_
SQ
Q
_
R
0
1
NxPFM NxPOL
DQ
Q1
NxOUT
NCOx
NCO_interrupt set bit
NCOxIF
EN
Ripple
Counter
3
NxPWS<2:0>
R
Fixed Duty
Cycle Mode
Circuitry
Pulse
Frequency
Mode Circuitry
(1)
NCOx_clk
Note 1: The increment registers are double-buffered to allow for value changes to be made without first disabling the NCO module. The full increment value is loaded into the buffer registers on the
second rising edge of the NCOx_clk signal that occurs immediately after a write to NCOxINCL register. The buffers are not user-accessible and are shown here for reference.
Adder
NCOx_out To Peripherals
Rev. 10-000028A
7/30/2013
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DS40001615C-page 174 2011-2015 Microchip Technology Inc.
23.2 Fixed Duty Cycle (FDC) Mode
In Fixed Duty Cycle (FDC) mode, every time the
accumulator overflows (NCO_overflow), the output is
toggled. This provides a 50% duty cycle, provided that
the increment value remains constant. For more
information, see Figure 23-2.
The FDC mode is selected by clearing the NxPFM bit
in the NCOxCON register.
23.3 Pulse Frequency ( PF) Mode
In Pulse Frequency (PF) mode, every time the accumu-
lator overflows (NCO_overflow), the output becomes
active for one or more clock periods. Once the clock
period expires, the output returns to an inactive state.
This provides a pulsed output.
The output becomes active on the rising clock edge
immediately following the overflow event. For more
information, see Figure 23-2.
The value of the active and inactive states depends on
the polarity bit, NxPOL in the NCOxCON register.
The PF mode is selected by setting the NxPFM bit in
the NCOxCON register.
23.3.1 OUTPUT PULSE WIDTH CONTROL
When operating in PF mode, the active state of the out-
put can vary in width by multiple clock periods. Various
pulse widths are selected with the NxPWS<2:0> bits in
the NCOxCLK register.
When the selected pulse width is greater than the
accumulator overflow time frame, the output of the
NCOx operation is indeterminate.
23.4 Output Polarity Control
The last stage in the NCOx module is the output polar-
ity. The NxPOL bit in the NCOxCON register selects the
output polarity. Changing the polarity while the inter-
rupts are enabled will cause an interrupt for the result-
ing output transition.
The NCOx output can be used internally by source
code or other peripherals. Accomplish this by reading
the NxOUT (read-only) bit of the NCOxCON register.
The NCOx output signal is available to the following
peripherals:
•CLC
•CWG
23.5 Interrupts
When the accumulator overflows (NCO_overflow), the
NCOx Interrupt Flag bit, NCOxIF, of the PIRx register is
set. To enable the interrupt event (NCO_interrupt), the
following bits must be set:
• NxEN bit of the NCOxCON register
• NCOxIE bit of the PIEx register
• PEIE bit of the INTCON register
• GIE bit of the INTCON register
The interrupt must be cleared by software by clearing
the NCOxIF bit in the Interrupt Service Routine.
23.6 Effects of a Reset
All of the NCOx registers are cleared to zero as the
result of a Reset.
23.7 Operation In Sleep
The NCO module operates independently from the
system clock and will continue to run during Sleep,
provided that the clock source selected remains
active.
The HFINTOSC remains active during Sleep when the
NCO module is enabled and the HFINTOSC is
selected as the clock source, regardless of the system
clock source selected.
In other words, if the HFINTOSC is simultaneously
selected as the system clock and the NCO clock
source, when the NCO is enabled, the CPU will go idle
during Sleep, but the NCO will continue to operate and
the HFINTOSC will remain active.
This will have a direct effect on the Sleep mode current.
23.8 Alternate Pin Locations
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register, APFCON. To determine which pins can be
moved and what their default locations are upon a
Reset, see Section 11.1 “Alternate Pin Function” for
more information.
PIC12(L)F1501
DS40001615C-page 175 Status 2011-2015 Microchip Technology Inc.
FIGURE 23-2: NCO – FIXED DUTY CYCLE (FDC) AND PULSE FREQUENCY MODE (PFM) OUTPUT OPERATION DIAGRAM
Rev. 10-000029A
11/7/2013
00000h 04000h 08000h FC000h 00000h 04000h 08000h FC000h 00000h 04000h 08000h
4000h 4000h 4000h
NCO_interrupt
NCOx Output
FDC Mode
NCOx Output
PF Mode
NCOxPWS =
NCOx Output
PF Mode
NCOxPWS =
NCOx
Accumulator
Value
NCOx
Increment
Value
NCOx
Clock
Source
000
001
NCO_overflow
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DS40001615C-page 176 2011-2015 Microchip Technology Inc.
23.9 Register Definitions: NCOx Control Registers
REGISTER 23-2: NCOxCLK: NCOx INPUT CLOCK CONTROL REGISTER
REGISTER 23-1: NCOxCON: NCOx CONTROL REGISTER
R/W-0/0 R/W-0/0 R-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0
NxEN NxOE NxOUT NxPOL — — —NxPFM
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 NxEN: NCOx Enable bit
1 = NCOx module is enabled
0 = NCOx module is disabled
bit 6 NxOE: NCOx Output Enable bit
1 = NCOx output pin is enabled
0 = NCOx output pin is disabled
bit 5 NxOUT: NCOx Output bit
1 = NCOx output is high
0 = NCOx output is low
bit 4 NxPOL: NCOx Polarity bit
1 = NCOx output signal is active low (inverted)
0 = NCOx output signal is active high (non-inverted)
bit 3-1 Unimplemented: Read as ‘0’
bit 0 NxPFM: NCOx Pulse Frequency Mode bit
1 = NCOx operates in Pulse Frequency mode
0 = NCOx operates in Fixed Duty Cycle mode
R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
NxPWS<2:0>(1, 2) ——— NxCKS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-5 NxPWS<2:0>: NCOx Output Pulse Width Select bits(1, 2)
111 = 128 NCOx clock periods
110 = 64 NCOx clock periods
101 = 32 NCOx clock periods
100 = 16 NCOx clock periods
011 = 8 NCOx clock periods
010 = 4 NCOx clock periods
001 = 2 NCOx clock periods
000 = 1 NCOx clock periods
bit 4-2 Unimplemented: Read as ‘0’
bit 1-0 NxCKS<1:0>: NCOx Clock Source Select bits
11 = NCO1CLK pin
10 = LC1_out
01 = F
OSC
00 = HFINTOSC (16 MHz)
Note 1: NxPWS applies only when operating in Pulse Frequency mode.
2: If NCOx pulse width is greater than NCO_overflow period, operation is indeterminate.
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PIC12(L)F1501
REGISTER 23-3: NCOxACCL: NCOx ACCUMULATOR REGISTER – LOW BYTE
REGISTER 23-4: NCOxACCH: NCOx ACCUMULATOR REGISTER – HIGH BYTE
REGISTER 23-5: NCOxACCU: NCOx ACCUMULATOR REGISTER – UPPER BYTE
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
NCOxACC<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 NCOxACC<7:0>: NCOx Accumulator, Low Byte
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
NCOxACC<15:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 NCOxACC<15:8>: NCOx Accumulator, High Byte
U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— — — — NCOxACC<19:16>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-4 Unimplemented: Read as ‘0’
bit 3-0 NCOxACC<19:16>: NCOx Accumulator, Upper Byte
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DS40001615C-page 178 2011-2015 Microchip Technology Inc.
REGISTER 23-6: NCOxINCL: NCOx INCREMENT REGISTER – LOW BYTE(1)
REGISTER 23-7: NCOxINCH: NCOx INCREMENT REGISTER – HIGH BYTE(1)
TABLE 23-1: SUMMARY OF REGISTERS ASSOCIATED WITH NCOx
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1
NCOxINC<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 NCOxINC<7:0>: NCOx Increment, Low Byte
Note 1: Write the NCOxINCH register first, then the NCOxINCL register. See 23.1.4 “Increment Registers” for
more information.
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
NCOxINC<15:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 NCOxINC<15:8>: NCOx Increment, High Byte
Note 1: Write the NCOxINCH register first, then the NCOxINCL register. See 23.1.4 “Increment Registers” for
more information.
Name Bit 7Bit 6Bit 5Bit 4Bit 3Bit 2Bit 1Bit 0
Register on
Page
APFCON CWG1BSEL CWGA1SEL — — T1GSEL —CLC1SEL NCO1SEL 96
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 64
NCO1ACCH NCO1ACC<15:8> 177
NCO1ACCL NCO1ACC<7:0> 177
NCO1ACCU — NCO1ACC<19:16> 177
NCO1CLK N1PWS<2:0> ———N1CKS<1:0>176
NCO1CON N1EN N1OE N1OUT N1POL ———N1PFM176
NCO1INCH NCO1INC<15:8> 178
NCO1INCL NCO1INC<7:0> 178
PIE2 — — C1IE ——NCO1IE— — 66
PIR2 — — C1IF —— NCO1IF — — 69
TRISA ——TRISA5TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
Legend: x = unknown, u = unchanged, — = unimplemented read as ‘0’, q = value depends on condition. Shaded cells are not used for NCOx
module.
Note 1: Unimplemented, read as ‘1’.
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PIC12(L)F1501
24.0 COMPLEMENTARY WAVEFORM
GENERATOR (CWG) MODULE
The Complementary Waveform Generator (CWG)
produces a complementary waveform with dead-band
delay from a selection of input sources.
The CWG module has the following features:
• Selectable dead-band clock source control
• Selectable input sources
• Output enable control
• Output polarity control
• Dead-band control with independent 6-bit rising
and falling edge dead-band counters
• Auto-shutdown control with:
- Selectable shutdown sources
- Auto-restart enable
- Auto-shutdown pin override control
24.1 Fundamental Operation
The CWG generates two output waveforms from the
selected input source.
The off-to-on transition of each output can be delayed
from the on-to-off transition of the other output, thereby,
creating a time delay immediately where neither output
is driven. This is referred to as dead time and is covered
in Section 24.5 “Dead-Band Control”. A typical
operating waveform, with dead band, generated from a
single input signal is shown in Figure 24-2.
It may be necessary to guard against the possibility of
circuit faults or a feedback event arriving too late or not
at all. In this case, the active drive must be terminated
before the Fault condition causes damage. This is
referred to as auto-shutdown and is covered in Section
24.9 “Auto-Shutdown Control”.
24.2 Clock Source
The CWG module allows the following clock sources
to be selected:
• Fosc (system clock)
• HFINTOSC (16 MHz only)
The clock sources are selected using the G1CS0 bit of
the CWGxCON0 register (Register 24-1).
24.3 Selectable Input Sources
The CWG generates the output waveforms from the
input sources in Tabl e 24-1 .
The input sources are selected using the GxIS<2:0>
bits in the CWGxCON1 register (Register 24-2).
24.4 Output Control
Immediately after the CWG module is enabled, the
complementary drive is configured with both CWGxA
and CWGxB drives cleared.
24.4.1 OUTPUT ENABLES
Each CWG output pin has individual output enable
control. Output enables are selected with the GxOEA
and GxOEB bits of the CWGxCON0 register. When an
output enable control is cleared, the module asserts no
control over the pin. When an output enable is set, the
override value or active PWM waveform is applied to
the pin per the port priority selection. The output pin
enables are dependent on the module enable bit,
GxEN. When GxEN is cleared, CWG output enables
and CWG drive levels have no effect.
24.4.2 POLARITY CONTROL
The polarity of each CWG output can be selected
independently. When the output polarity bit is set, the
corresponding output is active-high. Clearing the output
polarity bit configures the corresponding output as
active-low. However, polarity does not affect the
override levels. Output polarity is selected with the
GxPOLA and GxPOLB bits of the CWGxCON0 register.
TABLE 24-1: SELECTABLE INPUT
SOURCES
Source Peripheral Signal Name
Comparator C1 C1OUT_sync
PWM1 PWM1_out
PWM2 PWM2_out
PWM3 PWM3_out
PWM4 PWM4_out
NCO1 NCO1_out
CLC1 LC1_out
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DS40001615C-page 180 Status 2011-2015 Microchip Technology Inc.
FIGURE 24-1: SIMPLIFIED CWG BLOCK DIAGRAM
Rev. 10-000123B
7/10/2015
11
10
00
11
10
00
0
1
1
0
S
QR
QDQ
S
S
QR
Q
6
6
2
2
1
3
EN
R
=
EN
R
=
C1OUT_async
Reserved
PWM1_out
NCO1_out
LC1_out
PWM2_out
PWM3_out
PWM4_out
GxIS
FOSC
HFINTOSC
GxCS
C1OUT_async
LC2_out
CWG1FLT (INT pin)
GxASDSFLT
GxASDSC1
GxASDSCLC2
GxASE Data Bit
WRITE
GxARSEN
Auto-Shutdown
Source
set dominate
GxASE
shutdown
Input Source
cwg_clock
GxPOLA
GxPOLB
CWGxDBR
CWGxDBF
‘0'
‘0'
‘1'
‘1'
GxASDLA
GxASDLB
TRISx
TRISx
GxASDLA = 01
GxASDLB = 01
GxOEA
GxOEB
CWGxB
CWGxA
x = CWG module number
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PIC12(L)F1501
FIGURE 24-2: TYPICAL CWG OPERATION WITH PWM1 (NO AUTO-SHUTDOWN)
24.5 Dead-Band Control
Dead-band control provides for non-overlapping output
signals to prevent shoot-through current in power
switches. The CWG contains two 6-bit dead-band
counters. One dead-band counter is used for the rising
edge of the input source control. The other is used for
the falling edge of the input source control.
Dead band is timed by counting CWG clock periods
from zero up to the value in the rising or falling dead-
band counter registers. See CWGxDBR and
CWGxDBF registers (Register 24-4 and Register 24-5,
respectively).
24.6 Rising Edge Dead Band
The rising edge dead-band delays the turn-on of the
CWGxA output from when the CWGxB output is turned
off. The rising edge dead-band time starts when the
rising edge of the input source signal goes true. When
this happens, the CWGxB output is immediately turned
off and the rising edge dead-band delay time starts.
When the rising edge dead-band delay time is reached,
the CWGxA output is turned on.
The CWGxDBR register sets the duration of the dead-
band interval on the rising edge of the input source
signal. This duration is from 0 to 64 counts of dead band.
Dead band is always counted off the edge on the input
source signal. A count of 0 (zero), indicates that no
dead band is present.
If the input source signal is not present for enough time
for the count to be completed, no output will be seen on
the respective output.
24.7 Falli ng Edge Dead Band
The falling edge dead band delays the turn-on of the
CWGxB output from when the CWGxA output is turned
off. The falling edge dead-band time starts when the
falling edge of the input source goes true. When this
happens, the CWGxA output is immediately turned off
and the falling edge dead-band delay time starts. When
the falling edge dead-band delay time is reached, the
CWGxB output is turned on.
The CWGxDBF register sets the duration of the dead-
band interval on the falling edge of the input source sig-
nal. This duration is from 0 to 64 counts of dead band.
Dead band is always counted off the edge on the input
source signal. A count of 0 (zero), indicates that no
dead band is present.
If the input source signal is not present for enough time
for the count to be completed, no output will be seen on
the respective output.
Refer to Figure 24-3 and Figure 24-4 for examples.
cwg_clock
PWM1
CWGxA
CWGxB
Rising Edge
Dead Band
Rising Edge
Dead Band Rising Edge
Dead Band
Falling Edge
Dead Band
Falling Edge
Dead Band
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PIC12(L)F1501
FIGURE 24-3: DEA D-BAND OPERATION, CWGxDBR = 01H, CWGxDBF = 02H
FIGURE 24-4: DEA D-BAND OPERATION, CWGxDBR = 03H, CWGxDBF = 04H, SOURCE SHORTER THAN DEAD BAND
Input Source
CWGxA
CWGxB
cwg_clock
source shorter than dead band
Input Source
CWGxA
CWGxB
cwg_clock
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PIC12(L)F1501
24.8 Dead-Band Unc ertainty
When the rising and falling edges of the input source
triggers the dead-band counters, the input may be asyn-
chronous. This will create some uncertainty in the dead-
band time delay. The maximum uncertainty is equal to
one CWG clock period. Refer to Equation 24-1 for more
detail.
EQUATION 24-1: DEAD-BAND
UNCERTAINTY
24.9 Auto-Shutdown Control
Auto-shutdown is a method to immediately override the
CWG output levels with specific overrides that allow for
safe shutdown of the circuit. The shutdown state can be
either cleared automatically or held until cleared by
software.
24.9.1 SHUTDOWN
The shutdown state can be entered by either of the
following two methods:
• Software generated
• External Input
24.9.1.1 Software Generated Shutdown
Setting the GxASE bit of the CWGxCON2 register will
force the CWG into the shutdown state.
When auto-restart is disabled, the shutdown state will
persist as long as the GxASE bit is set.
When auto-restart is enabled, the GxASE bit will clear
automatically and resume operation on the next rising
edge event. See Figure 24-6.
24.9.1.2 External Input Source
External shutdown inputs provide the fastest way to
safely suspend CWG operation in the event of a Fault
condition. When any of the selected shutdown inputs
goes active, the CWG outputs will immediately go to
the selected override levels without software delay. Any
combination of two input sources can be selected to
cause a shutdown condition. The sources are:
• Comparator C1 – C1OUT_async
• CLC2 – LC2_out
•CWG1FLT
Shutdown inputs are selected in the CWGxCON2
register. (Register 24-3).
TDEADBAND_UNCERTAINTY 1
Fcwg_clock
-----------------------------=
Therefore:
Fcwg_clock 16 MHz=
1
16 MHz
-------------------=
62.5ns=
TDEADBAND_UNCERTAINTY 1
Fcwg_clock
-----------------------------=
Example:
Note: Shutdown inputs are level sensitive, not
edge sensitive. The shutdown state can-
not be cleared, except by disabling auto-
shutdown, as long as the shutdown input
level persists.
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24.10 Operation During Sleep
The CWG module operates independently from the
system clock and will continue to run during Sleep,
provided that the clock and input sources selected
remain active.
The HFINTOSC remains active during Sleep, provided
that the CWG module is enabled, the input source is
active, and the HFINTOSC is selected as the clock
source, regardless of the system clock source
selected.
In other words, if the HFINTOSC is simultaneously
selected as the system clock and the CWG clock
source, when the CWG is enabled and the input
source is active, the CPU will go idle during Sleep, but
the CWG will continue to operate and the HFINTOSC
will remain active.
This will have a direct effect on the Sleep mode current.
24.11 Configuring t he CWG
The following steps illustrate how to properly configure
the CWG to ensure a synchronous start:
1. Ensure that the TRIS control bits corresponding
to CWGxA and CWGxB are set so that both are
configured as inputs.
2. Clear the GxEN bit, if not already cleared.
3. Set desired dead-band times with the CWGxDBR
and CWGxDBF registers.
4. Setup the following controls in CWGxCON2
auto-shutdown register:
• Select desired shutdown source.
• Select both output overrides to the desired
levels (this is necessary even if not using
auto-shutdown because start-up will be from
a shutdown state).
• Set the GxASE bit and clear the GxARSEN
bit.
5. Select the desired input source using the
CWGxCON1 register.
6. Configure the following controls in CWGxCON0
register:
• Select desired clock source.
• Select the desired output polarities.
• Set the output enables for the outputs to be
used.
7. Set the GxEN bit.
8. Clear TRIS control bits corresponding to
CWGxA and CWGxB to be used to configure
those pins as outputs.
9. If auto-restart is to be used, set the GxARSEN
bit and the GxASE bit will be cleared automati-
cally. Otherwise, clear the GxASE bit to start the
CWG.
24.11.1 PIN OVERRIDE LEVELS
The levels driven to the output pins, while the shutdown
input is true, are controlled by the GxASDLA and
GxASDLB bits of the CWGxCON1 register
(Register 24-3). GxASDLA controls the CWG1A
override level and GxASDLB controls the CWG1B
override level. The control bit logic level corresponds to
the output logic drive level while in the shutdown state.
The polarity control does not apply to the override level.
24.11.2 AUTO-SHUTDOWN RESTART
After an auto-shutdown event has occurred, there are
two ways to have resume operation:
• Software controlled
• Auto-restart
The restart method is selected with the GxARSEN bit
of the CWGxCON2 register. Waveforms of software
controlled and automatic restarts are shown in
Figure 24-5 and Figure 24-6.
24.11.2.1 Software Controlled Restart
When the GxARSEN bit of the CWGxCON2 register is
cleared, the CWG must be restarted after an auto-shut-
down event by software.
Clearing the shutdown state requires all selected shut-
down inputs to be low, otherwise the GxASE bit will
remain set. The overrides will remain in effect until the
first rising edge event after the GxASE bit is cleared.
The CWG will then resume operation.
24.11.2.2 Auto-Restart
When the GxARSEN bit of the CWGxCON2 register is
set, the CWG will restart from the auto-shutdown state
automatically.
The GxASE bit will clear automatically when all shut-
down sources go low. The overrides will remain in
effect until the first rising edge event after the GxASE
bit is cleared. The CWG will then resume operation.
PIC12(L)F1501
DS40001615C-page 185 Status 2011-2015 Microchip Technology Inc.
FIGURE 24-5: SHUTDOWN FUNCTIONALITY, AUTO-REST ART DISABLED (GxARSEN = 0,GxASDLA = 01, GxASDLB = 01)
FIGURE 24-6: SHUTDOWN FUNCTIONALITY, AUTO-RESTART ENABLED (GxARSEN = 1,GxASDLA = 01, GxASDLB = 01)
Shutdown
GxASE Cleared by Software
Output Resumes
No Shutdown
CWG Input
GxASE
CWG1A
Source
Shutdown Source
Shutdown Event Ceases
Tri-State (No Pulse)
CWG1B Tri-State (No Pulse)
Shutdown
Tri-State (No Pulse)
GxASE auto-cleared by hardware
Output Resumes
No Shutdown
CWG Input
GxASE
CWG1A
Source
Shutdown Source
Shutdown Event Ceases
CWG1B
Tri-State (No Pulse)
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DS40001615C-page 186 2011-2015 Microchip Technology Inc.
24.12 Register Definitions: CWG Control
REGISTER 24-1: CWGxCON0: CWG CONTROL REGISTER 0
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0
GxEN GxOEB GxOEA GxPOLB GxPOLA ——GxCS0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 GxEN: CWGx Enable bit
1 = Module is enabled
0 = Module is disabled
bit 6 GxOEB: CWGxB Output Enable bit
1 = CWGxB is available on appropriate I/O pin
0 = CWGxB is not available on appropriate I/O pin
bit 5 GxOEA: CWGxA Output Enable bit
1 = CWGxA is available on appropriate I/O pin
0 = CWGxA is not available on appropriate I/O pin
bit 4 GxPOLB: CWGxB Output Polarity bit
1 = Output is inverted polarity
0 = Output is normal polarity
bit 3 GxPOLA: CWGxA Output Polarity bit
1 = Output is inverted polarity
0 = Output is normal polarity
bit 2-1 Unimplemented: Read as ‘0’
bit 0 GxCS0: CWGx Clock Source Select bit
1 =HFINTOSC
0 =F
OSC
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PIC12(L)F1501
REGISTER 24-2: CWGxCON1: CWG CONTROL REGISTER 1
R/W-x/u R/W-x/u R/W-x/u R/W-x/u U-0 R/W-0/0 R/W-0/0 R/W-0/0
GxASDLB<1:0> GxASDLA<1:0> —GxIS<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7-6 GxASDLB<1:0>: CWGx Shutdown State for CWGxB
When an auto shutdown event is present (GxASE = 1):
11 = CWGxB pin is driven to ‘1’, regardless of the setting of the GxPOLB bit.
10 = CWGxB pin is driven to ‘0’, regardless of the setting of the GxPOLB bit.
01 = CWGxB pin is tri-stated
00 = CWGxB pin is driven to its inactive state after the selected dead-band interval. GxPOLB still will
control the polarity of the output.
bit 5-4 GxASDLA<1:0>: CWGx Shutdown State for CWGxA
When an auto shutdown event is present (GxASE = 1):
11 = CWGxA pin is driven to ‘1’, regardless of the setting of the GxPOLA bit.
10 = CWGxA pin is driven to ‘0’, regardless of the setting of the GxPOLA bit.
01 = CWGxA pin is tri-stated
00 = CWGxA pin is driven to its inactive state after the selected dead-band interval. GxPOLA still will
control the polarity of the output.
bit 3 Unimplemented: Read as ‘0’
bit 2-0 GxIS<2:0>: CWGx Input Source Select bits
111 = CLC1 – LC1_out
110 = NCO1 – NCO1_out
101 = PWM4 – PWM4_out
100 = PWM3 – PWM3_out
011 = PWM2 – PWM2_out
010 = PWM1 – PWM1_out
001 =Reserved
000 = Comparator C1 – C1OUT_async
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DS40001615C-page 188 2011-2015 Microchip Technology Inc.
REGISTER 24-3: CWGxCON2: CWG CONTROL REGISTER 2
R/W-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0
GxASE GxARSEN — — — GxASDSC1 GxASDSFLT GxASDSCLC2
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 GxASE: Auto-Shutdown Event Status bit
1 = An auto-shutdown event has occurred
0 = No auto-shutdown event has occurred
bit 6 GxARSEN: Auto-Restart Enable bit
1 = Auto-restart is enabled
0 = Auto-restart is disabled
bit 5-3 Unimplemented: Read as ‘0’
bit 2 GxASDSC1: CWG Auto-shutdown on Comparator C1 Enable bit
1 = Shutdown when Comparator C1 output (C1OUT_async) is high
0 = Comparator C1 output has no effect on shutdown
bit 1 GxASDSFLT: CWG Auto-shutdown on FLT Enable bit
1 = Shutdown when CWG1FLT input is low
0 =CWG1FLT
input has no effect on shutdown
bit 0 GxASDSCLC2: CWG Auto-shutdown on CLC2 Enable bit
1 = Shutdown when CLC2 output (LC2_out) is high
0 = CLC2 output has no effect on shutdown
2011-2015 Microchip Technology Inc. DS40001615C-page 189
PIC12(L)F1501
REGISTER 24-4: CWGxDBR: COMPLEMENTARY WAVEFORM GENERATOR (CWGx) RISING
DEAD-BAND COUNT REGISTER
REGISTER 24-5: CWGxDBF: COMPLEMENTARY WAVEFORM GENERATOR (CWGx) FALLING
DEAD-BAND COUNT REGISTER
U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
— — CWGxDBR<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 CWGxDBR<5:0>: Complementary Waveform Generator (CWGx) Rising Counts
11 1111 = 63-64 counts of dead band
11 1110 = 62-63 counts of dead band


00 0010 = 2-3 counts of dead band
00 0001 = 1-2 counts of dead band
00 0000 = 0 counts of dead band
U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
— — CWGxDBF<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 CWGxDBF<5:0>: Complementary Waveform Generator (CWGx) Falling Counts
11 1111 = 63-64 counts of dead band
11 1110 = 62-63 counts of dead band


00 0010 = 2-3 counts of dead band
00 0001 = 1-2 counts of dead band
00 0000 = 0 counts of dead band. Dead-band generation is bypassed.
PIC12(L)F1501
DS40001615C-page 190 2011-2015 Microchip Technology Inc.
TABLE 24-2: SUMMARY OF REGISTERS ASSOCIATED WITH CWG
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA — — — ANSA4 —ANSA2ANSA1 ANSA0 99
CWG1CON0 G1EN G1OEB G1OEA G1POLB G1POLA ——G1CS0186
CWG1CON1 G1ASDLB<1:0> G1ASDLA<1:0> — — G1IS<1:0> 187
CWG1CON2 G1ASE G1ARSEN — — — G1ASDSC1 G1ASDSFLT G1ASDSCLC2 188
CWG1DBF — — CWG1DBF<5:0> 189
CWG1DBR — — CWG1DBR<5:0> 189
TRISA — — TRISA5 TRISA4 —(1) TRISA2 TRISA1 TRISA0 98
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by CWG.
Note 1: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001615C-page 191
PIC12(L)F1501
25.0 IN-CIRCUIT SERIAL
PROGRAMMING™ (ICSP™)
ICSP™ programming allows customers to manufacture
circuit boards with unprogrammed devices. Programming
can be done after the assembly process allowing the
device to be programmed with the most recent firmware
or a custom firmware. Five pins are needed for ICSP™
programming:
• ICSPCLK
• ICSPDAT
•MCLR
/VPP
•VDD
•VSS
In Program/Verify mode the program memory, user IDs
and the Configuration Words are programmed through
serial communications. The ICSPDAT pin is a bidirec-
tional I/O used for transferring the serial data and the
ICSPCLK pin is the clock input. For more information on
ICSP™ refer to the “PIC12(L)F1501/PIC16(L)F150X
Memory Programming Specification” (DS41573).
25.1 High-Voltage Programming Entry
Mode
The device is placed into High-Voltage Programming
Entry mode by holding the ICSPCLK and ICSPDAT
pins low then raising the voltage on MCLR/VPP to VIHH.
25.2 Low-Voltage Programming Entry
Mode
The Low-Voltage Programming Entry mode allows the
PIC® Flash MCUs to be programmed using VDD only,
without high voltage. When the LVP bit of Configuration
Words is set to ‘1’, the ICSP Low-Voltage Programming
Entry mode is enabled. To disable the Low-Voltage
ICSP mode, the LVP bit must be programmed to ‘0’.
Entry into the Low-Voltage Programming Entry mode
requires the following steps:
1. MCLR is brought to VIL.
2. A 32-bit key sequence is presented on
ICSPDAT, while clocking ICSPCLK.
Once the key sequence is complete, MCLR must be
held at VIL for as long as Program/Verify mode is to be
maintained.
If low-voltage programming is enabled (LVP = 1), the
MCLR Reset function is automatically enabled and
cannot be disabled. See Section 6.5 “MCLR” for more
information.
The LVP bit can only be reprogrammed to ‘0’ by using
the High-Voltage Programming mode.
25.3 Common Programming Interfaces
Connection to a target device is typically done through
an ICSP™ header. A commonly found connector on
development tools is the RJ-11 in the 6P6C (6-pin,
6-connector) configuration. See Figure 25-1.
FIGURE 25-1: ICD RJ-11 STYLE
CONNECTOR INTERFACE
Another connector often found in use with the PICkit™
programmers is a standard 6-pin header with 0.1 inch
spacing. Refer to Figure 25-2.
1
2
3
4
5
6
Target
Bottom Side
PC Board
VPP/MCLR VSS
ICSPCLK
VDD
ICSPDAT
NC
Pin Description*
1 = VPP/MCLR
2 = VDD Target
3 = VSS (ground)
4 = ICSPDAT
5 = ICSPCLK
6 = No Connect
PIC12(L)F1501
DS40001615C-page 192 2011-2015 Microchip Technology Inc.
FIGURE 25-2: PICkit™ PROGRAMME R STYLE CONNECTOR INTERFACE
For additional interface recommendations, refer to your
specific device programmer manual prior to PCB
design.
It is recommended that isolation devices be used to
separate the programming pins from other circuitry.
The type of isolation is highly dependent on the specific
application and may include devices such as resistors,
diodes, or even jumpers. See Figure 25-3 for more
information.
FIGURE 25-3: TYP ICAL CONNECTION FOR ICSP™ PROGRAMMING
1
3
5
6
4
2
Pin 1 Indicator
Pin Description*
1=V
PP/MCLR
2=V
DD Target
3=V
SS (ground)
4 = ICSPDAT
5 = ICSPCLK
6 = No connect
* The 6-pin header (0.100" spacing) accepts 0.025" square pins
Rev. 10-000128A
7/30/2013
Device to be
Programmed
VDD VDD
VSS VSS
VPP MCLR/VPP
VDD
Data
Clock
ICSPDAT
ICSPCLK
***
External
Programming
Signals
To Normal Connections
* Isolation devices (as required).
Rev. 10-000129A
7/30/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 193
PIC12(L)F1501
26.0 INSTRUCTION SET SUMMARY
Each instruction is a 14-bit word containing the opera-
tion code (opcode) and all required operands. The
opcodes are broken into three broad categories.
• Byte Oriented
• Bit Oriented
• Literal and Control
The literal and control category contains the most
varied instruction word format.
Table 26-3 lists the instructions recognized by the
MPASMTM assembler.
All instructions are executed within a single instruction
cycle, with the following exceptions, which may take
two or three cycles:
• Subroutine takes two cycles (CALL, CALLW)
• Returns from interrupts or subroutines take two
cycles (RETURN, RETLW, RETFIE)
• Program branching takes two cycles (GOTO, BRA,
BRW, BTFSS, BTFSC, DECFSZ, INCSFZ)
• One additional instruction cycle will be used when
any instruction references an indirect file register
and the file select register is pointing to program
memory.
One instruction cycle consists of 4 oscillator cycles; for
an oscillator frequency of 4 MHz, this gives a nominal
instruction execution rate of 1 MHz.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
26.1 Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (R-M-W)
operation. The register is read, the data is modified,
and the result is stored according to either the instruc-
tion, or the destination designator ‘d’. A read operation
is performed on a register even if the instruction writes
to that register.
TABLE 26-1: OPCODE FIELD
DESCRIPTIONS
TABLE 26-2: ABBREVIATION
DESCRIPTIONS
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral field, constant data or label
xDon’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
dDestination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
nFSR or INDF number. (0-1)
mm Pre-post increment-decrement mode
selection
Field Description
PC Program Counter
TO Time-Out bit
CCarry bit
DC Digit Carry bit
ZZero bit
PD Power-Down bit
PIC12(L)F1501
DS40001615C-page 194 2011-2015 Microchip Technology Inc.
FIGURE 26-1: GENE RAL FORMAT FOR
INSTRUCTIONS
Byte-orient e d file register opera tions
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriente d file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
MOVLP instruction only
13 5 4 0
OPCODE k (literal)
k = 5-bit immediate value
MOVLB instruction only
13 9 8 0
OPCODE k (literal)
k = 9-bit immediate value
BRA instruction only
FSR Offset instructions
13 7 6 5 0
OPCODE n k (literal)
n = appropriate FSR
FSR Increment instructions
13 7 6 0
OPCODE k (literal)
k = 7-bit immediate value
13 3 2 1 0
OPCODE n m (mode)
n = appropriate FSR
m = 2-bit mode value
k = 6-bit immediate value
13 0
OPCODE
OPCODE only
2011-2015 Microchip Technology Inc. DS40001615C-page 195
PIC12(L)F1501
TABLE 26-3: ENHANCED MID-RANGE INSTRUCTION SET
Mnemonic,
Operands Description Cycles 14-Bit Opcode Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ADDWFC
ANDWF
ASRF
LSLF
LSRF
CLRF
CLRW
COMF
DECF
INCF
IORWF
MOVF
MOVWF
RLF
RRF
SUBWF
SUBWFB
SWAPF
XORWF
f, d
f, d
f, d
f, d
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
f
f, d
f, d
f, d
f, d
f, d
f, d
Add W and f
Add with Carry W and f
AND W with f
Arithmetic Right Shift
Logical Left Shift
Logical Right Shift
Clear f
Clear W
Complement f
Decrement f
Increment f
Inclusive OR W with f
Move f
Move W to f
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Subtract with Borrow W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
00
11
00
11
11
11
00
00
00
00
00
00
00
00
00
00
00
11
00
00
0111
1101
0101
0111
0101
0110
0001
0001
1001
0011
1010
0100
1000
0000
1101
1100
0010
1011
1110
0110
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0000
dfff
dfff
dfff
dfff
dfff
1fff
dfff
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
00xx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
C, DC, Z
C, DC, Z
Z
C, Z
C, Z
C, Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
C, DC, Z
Z
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
BYTE ORIENTED SKIP OPERATIONS
DECFSZ
INCFSZ
f, d
f, d
Decrement f, Skip if 0
Increment f, Skip if 0
1(2)
1(2)
00
00 1011
1111 dfff
dfff ffff
ffff
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
f, b
f, b
Bit Clear f
Bit Set f
1
1
01
01 00bb
01bb bfff
bfff ffff
ffff
2
2
BIT-ORIENTED SKIP OPERATIONS
BTFSC
BTFSS
f, b
f, b
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1 (2)
1 (2)
01
01 10bb
11bb bfff
bfff ffff
ffff
1, 2
1, 2
LITERAL OPERATIONS
ADDLW
ANDLW
IORLW
MOVLB
MOVLP
MOVLW
SUBLW
XORLW
k
k
k
k
k
k
k
k
Add literal and W
AND literal with W
Inclusive OR literal with W
Move literal to BSR
Move literal to PCLATH
Move literal to W
Subtract W from literal
Exclusive OR literal with W
1
1
1
1
1
1
1
1
11
11
11
00
11
11
11
11
1110
1001
1000
0000
0001
0000
1100
1010
kkkk
kkkk
kkkk
001k
1kkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
C, DC, Z
Z
Z
C, DC, Z
Z
Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle
is executed as a NOP.
2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one
additional instruction cycle.
PIC12(L)F1501
DS40001615C-page 196 2011-2015 Microchip Technology Inc.
TABLE 26-3: ENHANCED MID-RANGE INSTRUCTION SET (CONTINUED)
Mnemonic,
Operands Description Cycles 14-Bit Opcode Status
Affected Notes
MSb LSb
CONTROL OPERATIONS
BRA
BRW
CALL
CALLW
GOTO
RETFIE
RETLW
RETURN
k
–
k
–
k
k
k
–
Relative Branch
Relative Branch with W
Call Subroutine
Call Subroutine with W
Go to address
Return from interrupt
Return with literal in W
Return from Subroutine
2
2
2
2
2
2
2
2
11
00
10
00
10
00
11
00
001k
0000
0kkk
0000
1kkk
0000
0100
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
1011
kkkk
1010
kkkk
1001
kkkk
1000
INHERENT OPERATIONS
CLRWDT
NOP
OPTION
RESET
SLEEP
TRIS
–
–
–
–
–
f
Clear Watchdog Timer
No Operation
Load OPTION_REG register with W
Software device Reset
Go into Standby mode
Load TRIS register with W
1
1
1
1
1
1
00
00
00
00
00
00
0000
0000
0000
0000
0000
0000
0110
0000
0110
0000
0110
0110
0100
0000
0010
0001
0011
0fff
TO, PD
TO, PD
C-COMPILER OPTIMIZED
ADDFSR
MOVIW
MOVWI
n, k
n mm
k[n]
n mm
k[n]
Add Literal k to FSRn
Move Indirect FSRn to W with pre/post inc/dec
modifier, mm
Move INDFn to W, Indexed Indirect.
Move W to Indirect FSRn with pre/post inc/dec
modifier, mm
Move W to INDFn, Indexed Indirect.
1
1
1
1
1
11
00
11
00
11
0001
0000
1111
0000
1111
0nkk
0001
0nkk
0001
1nkk
kkkk
0nmm
kkkk
1nmm
kkkk
Z
Z
2, 3
2
2, 3
2
Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle
is executed as a NOP.
2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require
one additional instruction cycle.
3: See Table in the MOVIW and MOVWI instruction descriptions.
2011-2015 Microchip Technology Inc. DS40001615C-page 197
PIC12(L)F1501
26.2 Instruction Descriptions
ADDFSR Add Literal to FSRn
Syntax: [ label ] ADDFSR FSRn, k
Operands: -32 k 31
n [ 0, 1]
Operation: FSR(n) + k FSR(n)
Status Affected: None
Description: The signed 6-bit literal ‘k’ is added to
the contents of the FSRnH:FSRnL
register pair.
FSRn is limited to the range 0000h -
FFFFh. Moving beyond these bounds
will cause the FSR to wrap-around.
ADDLW Add literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register are
added to the 8-bit literal ‘k’ and the
result is placed in the W register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Description: Add the contents of the W register
with register ‘f’. If ‘d’ is ‘0’, the result is
stored in the W register. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
ADDWFC ADD W and CARRY bit to f
Syntax: [ label ] ADDWFC f {,d}
Operands: 0 f 127
d [0,1]
Operation: (W) + (f) + (C) dest
Status Affected: C, DC, Z
Description: Add W, the Carry flag and data mem-
ory location ‘f’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed in data memory location ‘f’.
ANDLW AND literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
AND’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Description: AND the W register with register ‘f’. If
‘d’ is ‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
ASRF Arithmetic Right Shift
Syntax: [ label ] ASRF f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f<7>) dest<7>
(f<7:1>) dest<6:0>,
(f<0>) C,
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. The MSb remains unchanged. If
‘d’ is ‘0’, the result is placed in W. If ‘d’
is ‘1’, the result is stored back in
register ‘f’.
register f C
PIC12(L)F1501
DS40001615C-page 198 2011-2015 Microchip Technology Inc.
BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BRA Relative Branch
Syntax: [ label ] BRA label
[ label ] BRA $+k
Operands: -256 label - PC + 1 255
-256 k 255
Operation: (PC) + 1 + k PC
Status Affected: None
Description: Add the signed 9-bit literal ‘k’ to the
PC. Since the PC will have incre-
mented to fetch the next instruction,
the new address will be PC + 1 + k.
This instruction is a 2-cycle instruc-
tion. This branch has a limited range.
BRW Relative Branch with W
Syntax: [ label ] BRW
Operands: None
Operation: (PC) + (W) PC
Status Affected: None
Description: Add the contents of W (unsigned) to
the PC. Since the PC will have incre-
mented to fetch the next instruction,
the new address will be PC + 1 + (W).
This instruction is a 2-cycle instruc-
tion.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is set.
BTFSC Bit Test f, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’, in register ‘f’, is ‘0’, the next
instruction is discarded, and a NOP is
executed instead, making this a
2-cycle instruction.
BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is executed.
If bit ‘b’ is ‘1’, then the next
instruction is discarded and a NOP is
executed instead, making this a
2-cycle instruction.
2011-2015 Microchip Technology Inc. DS40001615C-page 199
PIC12(L)F1501
CALL Call Subrout ine
Syntax: [ label ] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<6:3>) PC<14:11>
Status Affected: None
Description: Call Subroutine. First, return address
(PC + 1) is pushed onto the stack.
The 11-bit immediate address is
loaded into PC bits <10:0>. The upper
bits of the PC are loaded from
PCLATH. CALL is a 2-cycle instruc-
tion.
CALLW Subroutine Call With W
Syntax: [ label ] CALLW
Operands: None
Operation: (PC) +1 TOS,
(W) PC<7:0>,
(PCLATH<6:0>) PC<14:8>
Status Affected: None
Description: Subroutine call with W. First, the
return address (PC + 1) is pushed
onto the return stack. Then, the con-
tents of W is loaded into PC<7:0>,
and the contents of PCLATH into
PC<14:8>. CALLW is a 2-cycle
instruction.
CLRF Clear f
Syntax: [ lab el ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Description: The contents of register ‘f’ are cleared
and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z) is
set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Affected: TO, PD
Description: CLRWDT instruction resets the Watch-
dog Timer. It also resets the prescaler
of the WDT.
Status bits TO and PD are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Description: The contents of register ‘f’ are com-
plemented. If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Affected: Z
Description: Decrement register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
PIC12(L)F1501
DS40001615C-page 200 2011-2015 Microchip Technology Inc.
DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are decre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, then a
NOP is executed instead, making it a
2-cycle instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<6:3> PC<14:11>
Status Affected: None
Description: GOTO is an unconditional branch. The
11-bit immediate value is loaded into
PC bits <10:0>. The upper bits of PC
are loaded from PCLATH<4:3>. GOTO
is a 2-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register ‘f’ are incre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are incre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, a NOP is
executed instead, making it a 2-cycle
instruction.
IORLW Inclusive OR literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Affected: Z
Description: The contents of the W register are
OR’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Affected: Z
Description: Inclusive OR the W register with regis-
ter ‘f’. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
2011-2015 Microchip Technology Inc. DS40001615C-page 201
PIC12(L)F1501
LSLF Logical Left Shift
Syntax: [ label ] LSLF f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f<7>) C
(f<6:0>) dest<7:1>
0 dest<0>
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the left through the Carry flag.
A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’,
the result is placed in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
LSRF Logical Right Shift
Syntax: [ label ] LSRF f {,d}
Operands: 0 f 127
d [0,1]
Operation: 0 dest<7>
(f<7:1>) dest<6:0>,
(f<0>) C,
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. A ‘0’ is shifted into the MSb. If ‘d’ is
‘0’, the result is placed in W. If ‘d’ is ‘1’,
the result is stored back in register ‘f’.
register f 0
C
register f C0
MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (dest)
Status Affected: Z
Description: The contents of register f is moved to
a destination dependent upon the
status of d. If d = 0,
destination is W register. If d = 1, the
destination is file register f itself. d = 1
is useful to test a file register since
status flag Z is affected.
Words: 1
Cycles: 1
Example: MOVF FSR, 0
After Instruction
W = value in FSR register
Z= 1
PIC12(L)F1501
DS40001615C-page 202 2011-2015 Microchip Technology Inc.
MOVIW Move INDFn to W
Syntax: [ label ] MOVIW ++FSRn
[ label ] MOVIW --FSRn
[ label ] MOVIW FSRn++
[ label ] MOVIW FSRn--
[ label ] MOVIW k[FSRn]
Operands: n [0,1]
mm [00,01, 10, 11]
-32 k 31
Operation: INDFn W
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
• Unchanged
Status Affected: Z
Mode Syntax mm
Preincrement ++FSRn 00
Predecrement --FSRn 01
Postincrement FSRn++ 10
Postdecrement FSRn-- 11
Description: This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range 0000h -
FFFFh. Incrementing/decrementing it
beyond these bounds will cause it to
wrap-around.
MOVLB Move literal to BSR
Syntax: [ label ] MOVLB k
Operands: 0 k 31
Operation: k BSR
Status Affected: None
Description: The 5-bit literal ‘k’ is loaded into the
Bank Select Register (BSR).
MOVLP Move literal to PCLATH
Syntax: [ label ] MOVLP k
Operands: 0 k 127
Operation: k PCLATH
Status Affected: None
Description: The 7-bit literal ‘k’ is loaded into the
PCLATH register.
MOVLW Move literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Description: The 8-bit literal ‘k’ is loaded into W reg-
ister. The “don’t cares” will assemble as
‘0’s.
Words: 1
Cycles: 1
Example: MOVLW 0x5A
After Instruction
W = 0x5A
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Affected: None
Description: Move data from W register to register
‘f’.
Words: 1
Cycles: 1
Example: MOVWF OPTION_REG
Before Instruction
OPTION_REG = 0xFF
W = 0x4F
After Instruction
OPTION_REG = 0x4F
W = 0x4F
2011-2015 Microchip Technology Inc. DS40001615C-page 203
PIC12(L)F1501
MOVWI Move W to INDFn
Syntax: [ label ] MOVWI ++FSRn
[ label ] MOVWI --FSRn
[ label ] MOVWI FSRn++
[ label ] MOVWI FSRn--
[ label ] MOVWI k[FSRn]
Operands: n [0,1]
mm [00,01, 10, 11]
-32 k 31
Operation: W INDFn
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
Unchanged
Status Affected: None
Mode Syntax mm
Preincrement ++FSRn 00
Predecrement --FSRn 01
Postincrement FSRn++ 10
Postdecrement FSRn-- 11
Description: This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range 0000h -
FFFFh. Incrementing/decrementing it
beyond these bounds will cause it to
wrap-around.
The increment/decrement operation on
FSRn WILL NOT affect any Status bits.
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Affected: None
Description: No operation.
Words: 1
Cycles: 1
Example: NOP
OPTION Load OPTION_REG Register
with W
Syntax: [ label ] OPTION
Operands: None
Operation: (W) OPTION_REG
Status Affected: None
Description: Move data from W register to
OPTION_REG register.
RESET Software Reset
Syntax: [ label ] RESET
Operands: None
Operation: Execute a device Reset. Resets the
nRI flag of the PCON register.
Status Affected: None
Description: This instruction provides a way to
execute a hardware Reset by soft-
ware.
PIC12(L)F1501
DS40001615C-page 204 2011-2015 Microchip Technology Inc.
RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Description: Return from Interrupt. Stack is POPed
and Top-of-Stack (TOS) is loaded in
the PC. Interrupts are enabled by
setting Global Interrupt Enable bit,
GIE (INTCON<7>). This is a 2-cycle
instruction.
Words: 1
Cycles: 2
Example: RETFIE
After Interrupt
PC = TOS
GIE = 1
RETLW Return with literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Affected: None
Description: The W register is loaded with the 8-bit
literal ‘k’. The program counter is
loaded from the top of the stack (the
return address). This is a 2-cycle
instruction.
Words: 1
Cycles: 2
Example:
TABLE
CALL TABLE;W contains table
;offset value
• ;W now has table value
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ; End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Affected: None
Description: Return from subroutine. The stack is
POPed and the top of the stack (TOS)
is loaded into the program counter.
This is a 2-cycle instruction.
RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are rotated
one bit to the left through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
Words: 1
Cycles: 1
Example: RLF REG1,0
Before Instruction
REG1 = 1110 0110
C=0
After Instruction
REG1 = 1110 0110
W = 1100 1100
C=1
Register fC
2011-2015 Microchip Technology Inc. DS40001615C-page 205
PIC12(L)F1501
RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are rotated
one bit to the right through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
SLEEP Enter Sleep mode
Syntax: [ label ]SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Affected: TO, PD
Description: The power-down Status bit, PD is
cleared. Time-out Status bit, TO is
set. Watchdog Timer and its pres-
caler are cleared.
The processor is put into Sleep mode
with the oscillator stopped.
Register fC
SUBLW Subtract W from literal
Syntax: [ label ]SUBLW k
Operands: 0 k 255
Operation: k - (W) W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2’s com-
plement method) from the 8-bit literal
‘k’. The result is placed in the W regis-
ter.
SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method) W
register from register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f.
SUBWFB Subtract W from f with Borrow
Syntax: SUBWFB f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f) – (W) – (B) dest
Status Affected: C, DC, Z
Description: Subtract W and the BORROW flag
(CARRY) from register ‘f’ (2’s comple-
ment method). If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
C = 0W k
C = 1W k
DC = 0W<3:0> k<3:0>
DC = 1W<3:0> k<3:0>
C = 0W f
C = 1W f
DC = 0W<3:0> f<3:0>
DC = 1W<3:0> f<3:0>
PIC12(L)F1501
DS40001615C-page 206 2011-2015 Microchip Technology Inc.
SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of regis-
ter ‘f’ are exchanged. If ‘d’ is ‘0’, the
result is placed in the W register. If ‘d’
is ‘1’, the result is placed in register ‘f’.
TRIS Load TRIS Register with W
Syntax: [ label ] TRIS f
Operands: 5 f 7
Operation: (W) TRIS register ‘f’
Status Affected: None
Description: Move data from W register to TRIS
register.
When ‘f’ = 5, TRISA is loaded.
When ‘f’ = 6, TRISB is loaded.
When ‘f’ = 7, TRISC is loaded.
XORLW Exclusive OR literal with W
Syntax: [ label ] XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W)
Status Affected: Z
Description: The contents of the W register are
XOR’ed with the 8-bit
literal ‘k’. The result is placed in the
W register.
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) destination)
Status Affected: Z
Description: Exclusive OR the contents of the W
register with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If ‘d’
is ‘1’, the result is stored back in regis-
ter ‘f’.
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PIC12(L)F1501
27.0 ELECTRICAL SPECIFICATIONS
27.1 Absolute Maximum Ratings(†)
Ambient temperature under bias...................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin
PIC12F1501 .............................................................................................................. -0.3V to +6.5V
PIC12LF1501 ............................................................................................................ -0.3V to +4.0V
on MCLR pin ........................................................................................................................... -0.3V to +9.0V
on all other pins ............................................................................................................ -0.3V to (VDD + 0.3V)
Maximum current
on VSS pin(1)
-40°C TA +85°C .............................................................................................................. 250 mA
+85°C TA +125°C ............................................................................................................. 85 mA
on VDD pin(1)
-40°C TA +85°C .............................................................................................................. 250 mA
+85°C TA +125°C ............................................................................................................. 85 mA
Sunk by any standard I/O pin ............................................................................................................... 50 mA
Sourced by any standard I/O pin .......................................................................................................... 50 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD) ................................................................................................... 20 mA
Total power dissipation(2) ............................................................................................................................... 800 mW
Note 1: Maximum current rating requires even load distribution across I/O pins. Maximum current rating may be
limited by the device package power dissipation characterizations, see Table 2 7-6 to calculate device
specifications.
2: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
PIC12(L)F1501
DS40001615C-page 208 2011-2015 Microchip Technology Inc.
27.2 Standard Operating Conditions
The standard operating conditions for any device are defined as:
Operating Voltage: VDDMIN VDD VDDMAX
Operating Temperature: TA_MIN TA TA_MAX
VDD — Operating Supply Voltage(1)
PIC12LF1501
VDDMIN (Fosc 16 MHz).......................................................................................................... +1.8V
VDDMIN (16 MHz < Fosc 20 MHz) ......................................................................................... +2.5V
VDDMAX .................................................................................................................................... +3.6V
PIC12F1501
VDDMIN (Fosc 16 MHz).......................................................................................................... +2.3V
VDDMIN (16 MHz < Fosc 20 MHz) ......................................................................................... +2.5V
VDDMAX .................................................................................................................................... +5.5V
TA — Operating Ambient Temperature Range
Industrial Temperature
TA_MIN ...................................................................................................................................... -40°C
TA_MAX .................................................................................................................................... +85°C
Extended Temperature
TA_MIN ...................................................................................................................................... -40°C
TA_MAX .................................................................................................................................. +125°C
Note 1: See Parameter D001, DC Characteristics: Supply Voltage.
2011-2015 Microchip Technology Inc. DS40001615C-page 209
PIC12(L)F1501
FIGURE 27-1: VOLTAGE FREQUENCY GRAPH, -40°C TA +125°C, PIC12F1501 ONLY
FIGURE 27-2: VOLTAGE FREQUENCY GRAPH, -40°C TA +125°C, PIC12LF1501 ONLY
Rev. 10-000130A
8/6/2013
5.5
2.5
2.3
01620
V
DD
(V)
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: Refer to Table 27-8 for each Oscillator mode’s supported frequencies.
3.6
2.5
1.8
01620
V
DD
(V)
Frequency (MHz)
Rev. 10-000131A
8/5/2013
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: Refer to Table 27-8 for each Oscillator mode’s supported frequencies.
PIC12(L)F1501
DS40001615C-page 210 2011-2015 Microchip Technology Inc.
27.3 DC Characteristics
TABLE 27-1: SUPPLY VOLT AGE
PIC12LF1501 Standard Operating Conditions (unless otherwise stated)
PIC12F1501
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
D001 VDD Supply Voltage
VDDMIN
1.8
2.5
—
—
VDDMAX
3.6
3.6
V
V
FOSC 16 MHz
FOSC 20 MHz
D001 2.3
2.5
—
—
5.5
5.5
V
V
FOSC 16 MHz
FOSC 20 MHz
D002* VDR RAM Data Retention Voltage(1)
1.5 — — V Device in Sleep mode
D002* 1.7 — — V Device in Sleep mode
D002A* VPOR Power-on Reset Release Voltage(2)
—1.6— V
D002A* —1.6 — V
D002B* VPORR*Power-on Reset Rearm Vo ltage(2)
—0.8— V
D002B* —1.5 — V
D003 VFVR Fixed Voltage Reference Voltage
1x gain (1.024V nominal)
2x gain (2.048V nominal)
4x gain (4.096V nominal)
-11 — +7 %
VDD 2.5V, -40°C TA +85°C
VDD 2.5V, -40°C TA +85°C
VDD 4.75V, -40°C TA +85°C
D004* SVDD VDD Rise Rate(2) 0.05 — — V/ms Ensures that the Power-on Reset
signal is released properly.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
2: See Figure 27-3, POR and POR REARM with Slow Rising VDD.
2011-2015 Microchip Technology Inc. DS40001615C-page 211
PIC12(L)F1501
FIGURE 27-3: POR AND POR REARM WITH SLOW RISING VDD
VDD
VPOR
VPORR
VSS
VSS
NPOR(1)
TPOR(2)
POR REARM
Note 1: When NPOR is low, the device is held in Reset.
2: TPOR 1 s typical.
3: TVLOW 2.7 s typical.
TVLOW(3)
SVDD
PIC12(L)F1501
DS40001615C-page 212 2011-2015 Microchip Technology Inc.
TABLE 27-2: SUPPLY CURRENT (IDD)(1,2)
PIC12LF1501 Standard Operating Conditions (unless otherwise stated)
PIC12F1501
Param.
No. Device
Characteristics Min. Typ† Max. Units Conditions
VDD Note
D013 — 30 65 A1.8F
OSC = 1 MHz,
External Clock (ECM),
Medium Power mode
—55100A3.0
D013 —65 110 A2.3 FOSC = 1 MHz,
External Clock (ECM),
Medium Power mode
—85 140 A3.0
—115 190 A5.0
D014 — 115 190 A1.8F
OSC = 4 MHz,
External Clock (ECM),
Medium Power mode
— 210 310 A3.0
D014 —180 270 A2.3 FOSC = 4 MHz,
External Clock (ECM),
Medium Power mode
—240 365 A3.0
—295 460 A5.0
D015 — 3.2 12 A1.8F
OSC = 31 kHz,
LFINTOSC,
-40°C TA +85°C
—5.420 A3.0
D015 —13 28 A2.3 FOSC = 31 kHz,
LFINTOSC,
-40°C TA +85°C
—15 30 A3.0
—17 36 A5.0
D016 — 215 360 A1.8F
OSC = 500 kHz,
HFINTOSC
— 275 480 A3.0
D016 —270 450 A2.3 FOSC = 500 kHz,
HFINTOSC
—300 500 A3.0
—350 620 A5.0
D017* — 410 660 A1.8FOSC = 8 MHz,
HFINTOSC
— 630 970 A3.0
D017* —530 750 A2.3 FOSC = 8 MHz,
HFINTOSC
—660 1100 A3.0
—730 1200 A5.0
D018 — 600 940 A1.8F
OSC = 16 MHz,
HFINTOSC
— 970 1400 A3.0
D018 —780 1200 A2.3 FOSC = 16 MHz,
HFINTOSC
—1000 1550 A3.0
—1090 1700 A5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
2011-2015 Microchip Technology Inc. DS40001615C-page 213
PIC12(L)F1501
D019C — 1030 1500 A3.0FOSC = 20 MHz,
External Clock (ECH),
High-Power mode
D019C —1060 1600 A3.0 FOSC = 20 MHz,
External Clock (ECH),
High-Power mode
—1220 1800 A5.0
D019A — 6 16 A1.8F
OSC = 32 kHz,
External Clock (ECL),
Low-Power mode
—822A3.0
D019A —13 28 A2.3 FOSC = 32 kHz,
External Clock (ECL),
Low-Power mode
—15 31 A3.0
—16 36 A5.0
D019B — 19 35 A1.8F
OSC = 500 kHz,
External Clock (ECL),
Low-Power mode
—3255A3.0
D019B —31 52 A2.3 FOSC = 500 kHz,
External Clock (ECL),
Low-Power mode
—38 65 A3.0
—44 74 A5.0
TABLE 27-2: SUPPLY CURRENT (IDD)(1,2) (CONTINUED)
PIC12LF1501 Standard Operating Conditions (unless otherwise stated)
PIC12F1501
Param.
No. Device
Characteristics Min. Typ† Max. Units Conditions
VDD Note
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins tri-stated, pulled to VSS; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
PIC12(L)F1501
DS40001615C-page 214 2011-2015 Microchip Technology Inc.
TABLE 27-3: POWER-DOWN CURRENTS (IPD)(1,2)
PIC12LF1501 Operating Con ditions: (unless otherwise stated)
Low-Power Sleep Mode
PIC12F1501 Low-Power Sleep Mode, VREGPM = 1
Param.
No. Device Characteristics Min. Typ† Max.
+85°C Max.
+125°C Units Conditions
VDD Note
D022 Base IPD — 0.020 1.0 8.0 A 1.8 WDT, BOR, FVR and SOSC
disabled, all Peripherals inactive
— 0.03 2.0 9.0 A3.0
D022 Base IPD —0.25 3.0 10 A2.3 WDT, BOR, FVR and SOSC
disabled, all Peripherals inactive,
Low-Power Sleep mode
—0.30 4.0 12 A3.0
—0.40 6.0 15 A5.0
D022A Base IPD —10 16 18 A2.3 WDT, BOR, FVR and SOSC
disabled, all Peripherals inactive,
Normal Power Sleep mode,
VREGPM = 0
—11 18 20 A3.0
—12 21 26 A5.0
D023 — 0.26 2.0 9.0 A 1.8 WDT Current
— 0.44 3.0 10 A3.0
D023 —0.43 6.0 15 A2.3 WDT Current
—0.53 7.0 20 A3.0
—0.64 8.0 22 A5.0
D023A — 15 28 30 A 1.8 FVR Current
—18 30 33 A3.0
D023A —18 33 35 A2.3 FVR Current
—19 35 37 A3.0
—20 37 39 A5.0
D024 — 6.0 17 20 A 3.0 BOR Current
D024 —7.0 17 30 A3.0 BOR Current
—8.0 20 40 A5.0
D24A — 0.1 4.0 10 A 3.0 LPBOR Current
D24A —0.35 5.0 14 A3.0 LPBOR Current
—0.45 8.0 17 A5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: The peripheral current can be determined by subtracting the base IPD current from this limit. Max. values should be
used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS.
3: ADC clock source is FRC.
2011-2015 Microchip Technology Inc. DS40001615C-page 215
PIC12(L)F1501
D026 — 0.11 1.5 9.0 A 1.8 ADC Current (No te 3),
No conversion in progress
— 0.12 2.7 12 A3.0
D026 —0.30 4.0 11 A2.3 ADC Current (Note 3),
No conversion in progress
—0.35 5.0 13 A3.0
—0.45 8.0 16 A5.0
D026A* — 250 — — A 1.8 ADC Current (Note 3),
Conversion in progress
—250 — — A3.0
D026A* —280 — — A2.3 ADC Current (Note 3),
Conversion in progress
—280 — — A3.0
—280 — — A5.0
D027 — 7 22 25 A 1.8 Comparator,
CxSP = 0
— 8 23 27 A3.0
D027 —17 35 37 A2.3 Comparator,
CxSP = 0
—18 37 38 A3.0
—19 38 40 A5.0
TABLE 27-3: POWER-DOWN CURRENTS (IPD)(1,2) (CONTI N U ED)
PIC12LF1501 Operating Con ditions: (unless otherwise stated)
Low-Power Sleep Mode
PIC12F1501 Low-Power Sleep Mode, VREGPM = 1
Param.
No. Device Characteristics Min. Typ† Max.
+85°C Max.
+125°C Units Conditions
VDD Note
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: The peripheral current can be determined by subtracting the base IPD current from this limit. Max. values should be
used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS.
3: ADC clock source is FRC.
PIC12(L)F1501
DS40001615C-page 216 2011-2015 Microchip Technology Inc.
TABLE 27-4: I/O PORTS
Standard Operating Conditions (unless otherwise stated)
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
VIL Input Low Voltage
I/O PORT:
D030 with TTL buffer — — 0.8 V 4.5V VDD 5.5V
D030A — — 0.15 VDD V1.8V VDD 4.5V
D032 MCLR ——0.2VDD V
VIH Input H i gh Voltage
I/O PORT:
D040 with TTL buffer 2.0 — — V 4.5V VDD 5.5V
D040A 0.25 VDD +
0.8
——V1.8V VDD 4.5V
D042 MCLR 0.8 VDD ——V
IIL Input Leakage Current(1)
D060 I/O Ports — ± 5 ± 125 nA VSS VPIN VDD,
Pin at high-impedance, 85°C
— ± 5 ± 1000 nA VSS VPIN VDD,
Pin at high-impedance, 125°C
D061 MCLR(2) —± 50± 200nAVSS VPIN VDD,
Pin at high-impedance, 85°C
IPUR Weak Pull-up Current
D070* 25 100 200 AV
DD = 3.3V, VPIN = VSS
25 140 300 AVDD = 5.0V, VPIN = VSS
VOL Output Low Volta ge
D080 I/O Ports
——0.6V
IOL = 8 mA, VDD = 5V
IOL = 6 mA, VDD = 3.3V
IOL = 1.8 mA, VDD = 1.8V
VOH Output High Volt a ge
D090 I/O Ports
VDD - 0.7 — — V
IOH = 3.5 mA, VDD = 5V
IOH = 3 mA, VDD = 3.3V
IOH = 1 mA, VDD = 1.8V
Capacitiv e Loa ding S pe c ifications on Outpu t Pins
D101A* CIO All I/O pins — — 50 pF
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Negative current is defined as current sourced by the pin.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
2011-2015 Microchip Technology Inc. DS40001615C-page 217
PIC12(L)F1501
TABLE 27-6: THERMAL CONSIDERATIONS
TABLE 27-5: MEMORY PROGRAMMING SPECIFICATIONS
Standard Operating Conditions (unless othe rwis e stated)
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
Program Memory
Programming Specifications
D110 VIHH Voltage on MCLR/VPP pin 8.0 — 9.0 V (Note 2)
D112 VPBE VDD for Bulk Erase 2.7 — VDDMAX V
D113 VPEW VDD for Write or Row Erase VDDMIN —VDDMAX V
D114 IPPPGM Current on MCLR/VPP during
Erase/Write
—1.0—mA
D115 IDDPGM Current on VDD during
Erase/Write
—5.0—
mA
Program Flash Memory
D121 EPCell Endurance 10K — — E/W -40C TA +85C
(Note 1)
D122 VPRW VDD for Read/Write VDDMIN —VDDMAX V
D123 TIW Self-timed Write Cycle Time — 2 2.5 ms
D124 TRETD Characteristic Retention — 40 — Year Provided no other
specifications are violated
D125 EHEFC High-Endurance Flash Cell 100K — — E/W 0C TA +60°C, lower
byte last 128 addresses
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Self-write and Block Erase.
2: Required only if single-supply programming is disabled.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance Junction to Ambient 89.3 C/W 8-pin PDIP package
149.5 C/W 8-pin SOIC package
211 C/W 8-pin MSOP package
56.7 C/W 8-pin DFN 3X3mm package
68 C/W 8-pin DFN 2X3mm package
60 C/W 8-pin UDFN 2X3mm package
TH02 JC Thermal Resistance Junction to Case 43.1 C/W 8-pin PDIP package
39.9 C/W 8-pin SOIC package
39 C/W 8-pin MSOP package
10.7 C/W 8-pin DFN 3X3mm package
12.7 C/W 8-pin DFN 2X3mm package
11 C/W 8-pin UDFN 2X3mm package
TH03 TJMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1)
TH06 PI/OI/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2)
Note 1:IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: TJ = Junction Temperature.
PIC12(L)F1501
DS40001615C-page 218 2011-2015 Microchip Technology Inc.
27.4 AC Characteristics
Timing Parameter Symbology has been created with one of the following formats:
FIGURE 27-4: LOA D CONDITIONS
1. TppS2ppS
2. TppS
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc CLKIN
ck CLKOUT rd RD
cs CS rw RD or WR
di SDIx sc SCKx
do SDO ss SS
dt Data in t0 T0CKI
io I/O PORT t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
FFall PPeriod
HHigh RRise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
Load Condition
Legend: CL=50 pF for all pins
Pin
CL
VSS
Rev. 10-000133A
8/1/2013
2011-2015 Microchip Technology Inc. DS40001615C-page 219
PIC12(L)F1501
FIGURE 27-5: CLOCK TIMING
TABLE 27-7: CLOCK OSCILLATOR TIMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
OS01 FOSC External CLKIN Frequency(1) DC — 0.5 MHz External Clock (ECL)
DC — 4 MHz External Clock (ECM)
DC — 20 MHz External Clock (ECH)
OS02 TOSC External CLKIN Period(1) 50 — ns External Clock (EC)
OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (T
CY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at “min” values with an external clock applied to CLKIN pin. When an external
clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
CLKIN
CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
OS02
OS03
(CLKOUT mode)
Note: See Tabl e 27-9.
OS11
OS12
PIC12(L)F1501
DS40001615C-page 220 2011-2015 Microchip Technology Inc.
TABLE 27-8: OSCILLATOR PARAMETERS
FIGURE 27-6: HFINTOSC FREQUENCY ACCURACY OVER VDD AND TEMPERATURE
Standard Operating Conditions (unless otherwise stated)
Param.
No. Sym. Characteristic Freq.
Tolerance Min. Typ† Max. Units Conditions
OS08 HFOSC Internal Calibrated HFINTOSC
Frequency(1) ±2% — 16.0 — MHz VDD = 3.0V, TA = 25°C,
(Note 2)
OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz (Note 3)
OS10* TIOSC ST HFINTOSC
Wake-up from Sleep Start-up Time
——515s
OS10A* TLFOSC ST LFINTOSC
Wake-up from Sleep Start-up Time
— — 0.5 — ms -40°C TA +125°C
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
2: See Figure 27-6: “HFINTOSC Frequency Accuracy over Device VDD and Temperature”,
Figure 28-60: “HFINTOSC Accuracy Over Temperature, VDD = 1.8V, PIC12LF1501 Only”, and
Figure 28-61: “HFINTOSC Accuracy Over Temperature, 2.3V VDD 5.5V”.
3: See Figure 28-58: “LFINTOSC Frequency over VDD and Temperature, PIC12LF1501 Only”, and
Figure 28-59: “LFINTOSC Frequency over VDD and Temperature, PIC12F1501”.
V
DD
(V)
125
85
60
25
0
-40
1.8 2.3 5.5
-4.5% to +7%
±12%
±12%
Temperature (°C)
Rev. 10-000135C
12/18/2013
Note: See Figure 28-60: “HFINTOSC Accuracy Over Temperature, VDD = 1.8V, PIC12LF1501 Only”,
and Figure 28-61: “HFINTOSC Accuracy Over Temperature, 2.3V VDD 5.5V”.
2011-2015 Microchip Technology Inc. DS40001615C-page 221
PIC12(L)F1501
FIGURE 27-7: CLKOUT AND I/O TIMING
TABLE 27-9: CLKOUT AND I/O TIMING PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
OS11 TosH2ckL FOSC to CLKOUT(1) — — 70 ns 3.3V VDD 5.0V
OS12 TosH2ckH FOSC to CLKOUT(1) — — 72 ns 3.3V VDD 5.0V
OS13 TckL2ioV CLKOUT to Port out valid(1) — — 20 ns
OS14 TioV2ckH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns
OS15 TosH2ioV Fosc (Q1 cycle) to Port out valid — 50 70* ns 3.3V VDD 5.0V
OS16 TosH2ioI Fosc (Q2 cycle) to Port input invalid
(I/O in setup time)
50 — — ns 3.3V VDD 5.0V
OS17 TioV2osH Port input valid to Fosc(Q2 cycle)
(I/O in setup time)
20 — — ns
OS18* TioR Port output rise time —
—
40
15
72
32
ns VDD = 1.8V
3.3V VDD 5.0V
OS19* TioF Port output fall time —
—
28
15
55
30
ns VDD = 1.8V
3.3V VDD 5.0V
OS20* Tinp INT pin input high or low time 25 — — ns
OS21* Tioc Interrupt-on-change new input level time 25 — — ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25C unless otherwise stated.
Note 1: Measurements are taken in EXTRC mode where CLKOUT output is 4 x TOSC.
FOSC
CLKOUT
I/O pin
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
OS11
OS19
OS13
OS15
OS18, OS19
OS20
OS21
OS17
OS16
OS14
OS12
OS18
Old Value New Value
Write Fetch Read ExecuteCycle
PIC12(L)F1501
DS40001615C-page 222 2011-2015 Microchip Technology Inc.
FIGURE 27-8: RES E T, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMI NG
VDD
MCLR
Internal
POR
PWRT
Time-out
Internal Reset(1)
Watchdog Timer
33
30
31
34
I/O pins
34
Note 1:Asserted low.
Reset(1)
2011-2015 Microchip Technology Inc. DS40001615C-page 223
PIC12(L)F1501
TABLE 27-10: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS
FIGURE 27-9: BROW N-OUT RESET TIMING AND CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
30 TMCLMCLR Pulse Width (low) 2 — — s
31 TWDTLP Low-Power Watchdog Timer
Time-out Period
10 16 27 ms VDD = 3.3V-5V,
1:512 Prescaler used
33* TPWRT Power-up Timer Period 40 65 140 ms PWRTE =0
34* TIOZ I/O high-impedance from MCLR Low
or Watchdog Timer Reset
——2.0s
35 VBOR Brown-out Reset Voltage(1) 2.55
2.35
1.80
2.70
2.45
1.90
2.85
2.58
2.05
V
V
V
BORV = 0
BORV = 1 (PIC12F1501)
BORV = 1 (PIC12LF1501)
36* VHYST Brown-out Reset Hysteresis 0 25 75 mV -40°C TA +85°C
37* TBORDC Brown-out Reset DC Response Time 1 16 35 sVDD VBOR
38 VLPBOR Low-Power Brown-Out Reset Voltage 1.8 2.1 2.5 V LPBOR = 1
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
VBOR
VDD
(Device in Brown-out Reset) (Device not in Brown-out Reset)
33
Reset
(due to BOR)
VBOR and VHYST
37
PIC12(L)F1501
DS40001615C-page 224 2011-2015 Microchip Technology Inc.
FIGURE 27-10: TIMER0 AND TIMER1 EXTERNAL CLOC K TIMINGS
TABLE 27-11: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
42* TT0P T0CKI Period Greater of:
20 or TCY + 40
N
— — ns N = prescale value
45* TT1H T1CKI High
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous, with Prescaler 15 — — ns
Asynchronous 30 — — ns
46* TT1L T1CKI Low
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous, with Prescaler 15 — — ns
Asynchronous 30 — — ns
47* TT1P T1CKI Input
Period
Synchronous Greater of:
30 or TCY + 40
N
— — ns N = prescale value
Asynchronous 60 — — ns
49* TCKEZTMR1 Delay from External Clock Edge to Timer
Increment
2 TOSC —7 TOSC — Timers in Sync
mode
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
T0CKI
T1CKI
40 41
42
45 46
47 49
TMR0 or
TMR1
2011-2015 Microchip Technology Inc. DS40001615C-page 225
PIC12(L)F1501
FIGURE 27-11: CLC PROPAGATION TIMING
TABLE 27-12: CONFIGURATION LOGIC CELL (CLC) CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
CLC01* TCLCIN CLC input time — 7 — ns
CLC02* TCLC CLC module input to output propagation time —
—
24
12
—
—
ns
ns
VDD = 1.8V
VDD > 3.6V
CLC03* TCLCOUT CLC output time Rise Time — OS18 — — (Note 1)
Fall Time — OS19 — — (Note 1)
CLC04* FCLCMAX CLC maximum switching frequency — 45 — MHz
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note1:See Table 27- 9 for OS18 and OS19 rise and fall times.
LCx_in[n](1)
CLC
Output time
CLC
Input time LCx_out(1) CLCx
CLCxINn CLC
Module
CLC01 CLC02 CLC03
LCx_in[n](1) CLC
Output time
CLC
Input time LCx_out(1) CLCx
CLCxINn CLC
Module
Rev. 10-000031A
7/30/2013
Note 1: See FIGURE 22-1:, Configurable Logic Cell Block Diagram, to identify specific CLC signals.
PIC12(L)F1501
DS40001615C-page 226 2011-2015 Microchip Technology Inc.
TABLE 27-13: ANALOG-TO-DIGITAL CONVERTER (ADC) CHARACTERISTICS(1,2,3)
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA = 25°C
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
AD01 NRResolution — — 10 bit
AD02 EIL Integral Error — ±1 ±1.7 LSb VREF = 3.0V
AD03 EDL Differential Error — ±1 ±1 LSb No missing codes
VREF = 3.0V
AD04 EOFF Offset Error — ±1 ±2.5 LSb VREF = 3.0V
AD05 EGN Gain Error — ±1 ±2.0 LSb VREF = 3.0V
AD06 VREF Reference Voltage 1.8 — VDD VVREF = (VRPOS - VRNEG) (Note 4)
AD07 VAIN Full-Scale Range VSS —VREF V
AD08 ZAIN Recommended Impedance of
Analog Voltage Source
—— 10kCan go higher if external 0.01F capacitor is
present on input pin.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1:Total Absolute Error includes integral, differential, offset and gain errors.
2: The ADC conversion result never decreases with an increase in the input voltage and has no missing codes.
3: See Section 28.0 “D C and AC Characteristics Graphs and Charts” for operating characterization.
4: ADC VREF is selected by ADPREF<0> bit.
2011-2015 Microchip Technology Inc. DS40001615C-page 227
PIC12(L)F1501
FIGURE 27-12: ADC CONVERSION TIMING (ADC CLOCK FOSC-BASED)
FIGURE 27-13: ADC CONVERSION TIMING (ADC CLOCK FROM FRC)
AD131
AD130
BSF ADCON0, GO
Q4
ADC_clk
ADC Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
987 3210
1 TCY
6
AD133
1 TCY
AD132
AD132
AD131
AD130
BSF ADCON0, GO
Q4
ADC_clk
ADC Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
9 7 3210
Note 1:If the ADC clock source is selected as FRC, a time of TCY is added before the ADC clock starts. This allows the
SLEEP instruction to be executed.
AD133
6
8
1 TCY
1 TCY
PIC12(L)F1501
DS40001615C-page 228 2011-2015 Microchip Technology Inc.
TABLE 27-14: ADC CONVERSION REQUIREMENTS
TABLE 27-15: COMPARATOR SPECIFICATIONS(1)
Standard Operating Conditions (unless otherwise stated)
Param.
No. Sym. Characteristic Min. Typ† Max. Units Conditions
AD130* TAD ADC Clock Period (TADC)1.0—6.0sFOSC-based
ADC Internal FRC Oscillator Period (TFRC)1.0 2.0 6.0s ADCS<2:0> = x11 (ADC FRC mode)
AD131 TCNV Conversion Time
(not including Acquisition Time)(1) —11—TAD Set GO/DONE bit to conversion
complete
AD132* TACQ Acquisition Time — 5.0 — s
AD133* THCD Holding Capacitor Disconnect Time —
—
1/2 TAD
1/2 TAD + 1TCY
—
—
FOSC-based
ADCS<2:0> = x11 (ADC FRC mode)
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: The ADRES register may be read on the following TCY cycle.
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA = 25°C
Param.
No. Sym. Characteristics Min. Typ. Max. Units Comments
CM01 VIOFF Input Offset Voltage — ±7.5 ±60 mV CxSP = 1,
VICM = VDD/2
CM02 VICM Input Common Mode Voltage 0 — VDD V
CM03 CMRR Common Mode Rejection Ration — 50 — dB
CM04A
TRESP(2)
Response Time Rising Edge — 400 800 ns CxSP = 1
CM04B Response Time Falling Edge — 200 400 ns CxSP = 1
CM04C Response Time Rising Edge — 1200 — ns CxSP = 0
CM04D Response Time Falling Edge — 550 — ns CxSP = 0
CM05* TMC2OV Comparator Mode Change to
Output Valid
——10s
CM06 CHYSTER Comparator Hysteresis — 25 — mV CxHYS = 1,
CxSP = 1
* These parameters are characterized but not tested.
Note 1: See Section 28.0 “DC and AC Characteristics Graphs and Charts” for operating characterization.
2: Response time measured with one comparator input at VDD/2, while the other input transitions from VSS to
VDD.
2011-2015 Microchip Technology Inc. DS40001615C-page 229
PIC12(L)F1501
TABLE 27-16: DIGIT A L-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS(1)
TABLE 27-17:
Operating Conditions (unless otherwis e stated)
VDD = 3.0V, TA = 25°C
Param.
No. Sym. Characteristics Min. Typ. Max. Units Comments
DAC01* CLSB Step Size — VDD/32 — V
DAC02* CACC Absolute Accuracy — — 1/2 LSb
DAC03* CRUnit Resistor Value (R) — 5K —
DAC04* CST Settling Time(2) ——10s
* These parameters are characterized but not tested.
Note 1: See Section 28.0 “DC and AC Characteristics Graphs and Charts” for operating characterization.
2: Settling time measured while DACR<4:0> transitions from ‘00000’ to ‘01111’.
PIC12(L)F1501
DS40001615C-page 230 2011-2015 Microchip Technology Inc.
28.0 DC AND AC CHARACTERISTIC S GRAPHS AND CHARTS
The graphs and tables provided in this section are for design guidance and are not tested.
In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are ensured to operate properly only within the specified range.
“Typical” represents the mean of the distribution at 25C. “MAXIMUM”, “Max.”, “MINIM UM” or “Min.”
represents (mean + 3) or (mean - 3) respectively, where is a standard deviation, over each
temperature range.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
2011-2015 Microchip Technology Inc. DS40001615C-page 231
PIC12(L)F1501
FIGURE 28-1: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 32 kHz,
PIC12LF1501 ONLY
FIGURE 28-2: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 32 kHz, PIC12F1501
ONLY
Typical
Max.
0
2
4
6
8
10
12
14
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (µA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
5
10
15
20
25
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (µA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
PIC12(L)F1501
DS40001615C-page 232 2011-2015 Microchip Technology Inc.
FIGURE 28-3: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 500 kHz,
PIC12LF1501 ONLY
FIGURE 28-4: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 500 kHz,
PIC12F15 01 ONLY
Max.
Typical
0
5
10
15
20
25
30
35
40
45
50
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (µA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
10
20
30
40
50
60
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (µA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
2011-2015 Microchip Technology Inc. DS40001615C-page 233
PIC12(L)F1501
FIGURE 28-5: IDD TYPICAL, EXTERNAL CLOCK (ECM), MEDIUM POWER MODE,
PIC12LF1501 ONLY
FIGURE 28-6: IDD MAXIMUM, EXTERNAL CLOCK (ECM), MEDIUM POWER MODE,
PIC12LF1501 ONLY
4 MHz
1 MHz
0
50
100
150
200
250
300
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (µA)
VDD (V)
Typical: 25°C
4 MHz
1 MHz
0
50
100
150
200
250
300
350
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (µA)
VDD (V)
Max: 85°C + 3ı
PIC12(L)F1501
DS40001615C-page 234 2011-2015 Microchip Technology Inc.
FIGURE 28-7: IDD TYPICAL, EXTERNAL CLOCK (ECM), MEDIUM POWER MODE,
PIC12F15 01 ONLY
FIGURE 28-8: IDD MAXIMUM, EXTERNAL CLOCK (ECM), MEDIUM POWER MODE, PIC12F1501
ONLY
4 MHz
1 MHz
0
50
100
150
200
250
300
350
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (µA)
VDD (V)
Typical: 25°C
4 MHz
1 MHz
0
50
100
150
200
250
300
350
400
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (µA)
VDD (V)
Max: 85°C + 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 235
PIC12(L)F1501
FIGURE 28-9: IDD TYPICAL, EXTERNAL CLOCK (ECH), HIGH-POWER MODE,
PIC12LF1501 ONLY
FIGURE 28-10 : IDD MAXIMUM, EXTERNAL CLOCK (ECH), HIGH-POWER MODE,
PIC12LF1501 ONLY
20 MHz
16 MHz
8 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
I
DD
(mA)
V
DD
(V)
Typical: 25°C
()
20 MHz
16 MHz
8 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
I
DD
(mA)
V
DD
(V)
Max: 85°C + 3ı
PIC12(L)F1501
DS40001615C-page 236 2011-2015 Microchip Technology Inc.
FIGURE 28-11: IDD TYPICAL, EXTERNAL CLOCK (ECH), HIGH-POWER MODE,
PIC12F15 01 ONLY
FIGURE 28-12 : IDD MAXIMUM, EXTERNAL CLOCK (ECH), HIGH-POWER MODE,
PIC12F15 01 ONLY
20 MHz
16 MHz
8 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
I
DD
(mA)
V
DD
(V)
Typical: 25°C
20 MHz
16 MHz
8 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
I
DD
(mA)
V
DD
(V)
Max: 85°C + 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 237
PIC12(L)F1501
FIGURE 28-13 : IDD, LFINTOSC, FOSC = 31 kHz, PIC12LF1501 ONLY
FIGURE 28-14 : IDD, LFINTOSC, FOSC = 31 kHz, PIC12F1501 ONLY
Typical
Max.
0
2
4
6
8
10
12
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (µA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
5
10
15
20
25
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (µA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
PIC12(L)F1501
DS40001615C-page 238 2011-2015 Microchip Technology Inc.
FIGURE 28-15 : IDD, MFINTOSC, FOSC = 500 kHz, PIC12LF1501 ONLY
FIGURE 28-16 : IDD, MFINTOSC, FOSC = 500 kHz, PIC12F1501 ONLY
Typical
Max.
0
50
100
150
200
250
300
350
400
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (µA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
50
100
150
200
250
300
350
400
450
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (µA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
2011-2015 Microchip Technology Inc. DS40001615C-page 239
PIC12(L)F1501
FIGURE 28-17 : IDD TYPICAL, HFINTOSC, PIC12LF1501 ONLY
FIGURE 28-18 : IDD MAXIMUM, HFINTOSC, PIC12LF1501 ONLY
16 MHz
8 MHz
4 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (mA)
VDD (V)
Typical: 25°C
16 MHz
8 MHz
4 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (mA)
VDD (V)
Max: 85°C + 3ı
PIC12(L)F1501
DS40001615C-page 240 2011-2015 Microchip Technology Inc.
FIGURE 28-19 : IDD TYPICAL, HFINTOSC, PIC12F1501 ONLY
FIGURE 28-20 : IDD MAXIMUM, HFINTOSC, PIC12F1501 ONLY
16 MHz
8 MHz
4 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (mA)
VDD (V)
Typical: 25°C
16 MHz
8 MHz
4 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (mA)
VDD (V)
Max: 85°C + 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 241
PIC12(L)F1501
FIGURE 28-21 : IPD BASE, LOW-POWER SLEEP MODE, PIC12LF1501 ONLY
FIGURE 28-22 : IPD BASE, LOW-POWER SLEEP MODE, VREGPM = 1, PIC12F1501 ONLY
450
M85
°
C3
Max.
250
300
350
400
450
D(nA)
Max: 85°C + 3ı
Typical: 25°C
Typical
0
50
100
150
200
250
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IPD (nA)
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
Max.
600
Max.
300
400
500
600
P
D(nA)
Max: 85°C + 3ı
Typical: 25°C
Typical
0
100
200
300
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (nA)
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
PIC12(L)F1501
DS40001615C-page 242 2011-2015 Microchip Technology Inc.
FIGURE 28-23 : IPD, W ATCHDOG TIMER (WDT), PIC12LF1501 ONLY
FIGURE 28-24 : IPD, WAT C H DO G TIME R ( W D T) , PIC12F1501 ONLY
2.0
Max.
08
1.0
1.2
1.4
1.6
1.8
2.0
IPD (µA)
Max: 85°C + 3ı
Typical: 25°C
Typical
0.0
0.2
0.4
0.6
0.8
1.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IPD (µ
A
0.0
0.2
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
Max
1.4
Typical
Max.
0.6
0.8
1.0
1.2
1.4
IPD (µA)
Typical
0.0
0.2
0.4
0.6
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (µ
A
Max: 85°C + 3ı
Typical: 25°C
0.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
2011-2015 Microchip Technology Inc. DS40001615C-page 243
PIC12(L)F1501
FIGURE 28-25 : IPD, FIXED VOLTAGE R EFERE NCE (FVR), PIC12LF1501 ONLY
FIGURE 28-26 : IPD, FIXED VOLTAGE R EFERE NCE (FVR), PIC12F1501 ONLY
45
Max: 85
°
C+3
ı
Typical
Max.
20
25
30
35
40
45
IPD (µA)
Max: 85°C + 3ı
Typical: 25°C
0
5
10
15
20
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IPD (µ
A
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
30
Typical
Max.
15
20
25
30
IPD (µA)
0
5
10
15
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (
µ
Max: 85°C + 3ı
Typical: 25°C
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
PIC12(L)F1501
DS40001615C-page 244 2011-2015 Microchip Technology Inc.
FIGURE 28-27 : IPD, BROWN-OUT RESET (BOR), BORV = 0, PIC12LF1501 ONLY
FIGURE 28-28 : IPD, BROWN-OUT RESET (BOR), BORV = 1, PIC12LF1501 ONLY
Max.
10
Typical
Max.
4
5
6
7
8
9
10
D
(µA)
Max: 85°C + 3ı
Typical: 25°C
0
1
2
3
4
5
16
18
20
22
24
26
28
30
32
34
36
38
IPD (µA)
0
1
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
12
Typical
Max.
6
8
10
12
µ
A)
Max: 85°C + 3ı
Typical: 25°C
Typical
0
2
4
6
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
IPD (µA)
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
2011-2015 Microchip Technology Inc. DS40001615C-page 245
PIC12(L)F1501
FIGURE 28-29 : IPD, BROWN-OUT RESET (BOR), BORV = 0, PIC12F1501 ONLY
FIGURE 28-30 : IPD, BROWN-OUT RESET (BOR), BORV = 1, PIC12F1501 ONLY
M
12
Typical
Max.
6
8
10
12
IPD (µA)
Max: 85°C + 3ı
Typical: 25°C
0
2
4
6
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (µA
)
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
Max
14
Typical
Max.
6
8
10
12
14
IPD (µA)
Max: 85°C + 3ı
Typical: 25°C
0
2
4
6
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (µA
)
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
PIC12(L)F1501
DS40001615C-page 246 2011-2015 Microchip Technology Inc.
FIGURE 28-31 : IPD, COMPARATOR, LOW-POWER MODE (CxSP = 0) , PIC12LF1501 ONLY
FIGURE 28-32 : IPD, COMPARATOR, LOW-POWER MODE (CxSP = 0) , PIC12F1501 ONLY
14
Typical
Max.
6
8
10
12
14
IPD (µA)
Typical
0
2
4
6
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IPD
Max: 85°C + 3ı
Typical: 25°C
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
30
Typical
Max.
15
20
25
30
IPD (µA)
yp
0
5
10
15
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (
µ
Max: 85°C + 3ı
Typical: 25°C
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
2011-2015 Microchip Technology Inc. DS40001615C-page 247
PIC12(L)F1501
FIGURE 28-33 : IPD, COMP AR ATOR, NORM AL POWER MODE ( CxSP = 1) , PIC12LF1501 ONLY
FIGURE 28-34 : IPD, COMP AR ATOR, NORM AL POWER MODE ( CxSP = 1) , PIC 12F 1501 ON LY
40
Typical
Max.
15
20
25
30
35
40
IPD (µA)
Typical
0
5
10
15
20
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
IPD (µ
A
Max: 85°C + 3ı
Typical: 25°C
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
Typical:
25
C
60
Typical
Max.
30
40
50
60
IPD (µA)
Typical
0
10
20
30
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (µ
A
Max: 85°C + 3ı
Typical: 25°C
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
PIC12(L)F1501
DS40001615C-page 248 2011-2015 Microchip Technology Inc.
FIGURE 28-35 : VOH vs. IOH OVER TEMPERATURE, VDD = 5. 5 V, PIC12F1501 ONLY
FIGURE 28-36 : VOL vs. IOL OVER TEMPERATU RE, VDD = 5.5 V, PIC12F1501 ONLY
Min. (-40°C)
Typical (25°C)
Max. (125°C)
0
1
2
3
4
5
6
-45 -40 -35 -30 -25 -20 -15 -10 -5 0
V
OH
(V)
I
OH
(mA)
Max: 125°C + 3ı
Typical: 25°C
Min: -40°C - 3ı
Min. (-40°C)
Typical (25°C)
Max. (125°C)
0
1
2
3
4
5
0 102030405060708090100
V
OL
(V)
I
OL
(mA)
Max: 125°C + 3ı
Typical: 25°C
Min: -40°C - 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 249
PIC12(L)F1501
FIGURE 28-37 : VOH vs. IOH OVER TEMPERATURE, VDD = 3.0V
FIGURE 28-38 : VOL vs. IOL OVER TEMPERATU RE, VDD = 3.0V
Min. (-40°C) Typical (25°C) Max. (125°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-15-13-11-9-7-5-3-1
V
OH
(V)
I
OH
(mA)
Max: 125°C + 3ı
Typical: 25°C
Min: -40°C - 3ı
Min. (-40°C)
Typical (25°C)
Max. (125°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 20 25 30 35 40
V
OL
(V)
I
OL
(mA)
Max: 125°C + 3ı
Typical: 25°C
Min: -40°C - 3ı
PIC12(L)F1501
DS40001615C-page 250 2011-2015 Microchip Technology Inc.
FIGURE 28-39 : VOH vs. IOH OVER TEMPERATURE, VDD = 1.8V, PIC12LF1501 ONLY
FIGURE 28-40 : VOL vs. IOL OVER TEMPERATURE, VDD = 1 .8 V, PIC12LF1501 ONLY
Min. (-40°C) Typical (25°C) Max. (125°C)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0
V
OH
(V)
I
OH
(mA)
Max: 125°C + 3ı
Typical: 25°C
Min: -40°C - 3ı
Min. (-40°C)
Typical (25°C)
Max. (125°C)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
012345678910
V
OL
(V)
I
OL
(mA)
Max: 125°C + 3ı
Typical: 25°C
Min: -40°C - 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 251
PIC12(L)F1501
FIGURE 28-41 : POR RELEASE VOLTAGE
FIGURE 28-42: POR RE ARM VOLTAGE , PIC12F1501 ONLY
Typical
Max.
Min.
1.50
1.52
1.54
1.56
1.58
1.60
1.62
1.64
1.66
1.68
1.70
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
Typical
Max.
Min.
1.34
1.36
1.38
1.40
1.42
1.44
1.46
1.48
1.50
1.52
1.54
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
PIC12(L)F1501
DS40001615C-page 252 2011-2015 Microchip Technology Inc.
FIGURE 28-43: BROWN-OUT RESET VOLT A GE, BOR V = 1, PIC12LF1501 ONLY
FIGURE 28-44: BROWN -OUT RESET H YSTERESIS, B OR V = 1, PIC12LF1501 ONLY
Typical
Max.
Min.
1.80
1.85
1.90
1.95
2.00
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Min: Typical - 3ı
Typical
Max.
Min.
0
10
20
30
40
50
60
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (mV)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 253
PIC12(L)F1501
FIGURE 28-45: BROWN-OUT RESET VOLT A GE, BOR V = 1, PIC12F1501 ONL Y
FIGURE 28-46: BROWN -OUT RESET H YSTERESIS, B OR V = 1, PIC12F1501 ONLY
Typical
Max.
Min.
2.30
2.35
2.40
2.45
2.50
2.55
2.60
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Min: Typical - 3ı
Typical
Max.
Min.
0
10
20
30
40
50
60
70
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (mV)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
PIC12(L)F1501
DS40001615C-page 254 2011-2015 Microchip Technology Inc.
FIGURE 28-47: BROWN-OUT RESET VOLT A GE, BOR V = 0
Typical
Max.
Min.
2.55
2.60
2.65
2.70
2.75
2.80
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Min: Typical - 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 255
PIC12(L)F1501
FIGURE 28-48: LOW-POWER BROWN-OUT RESET VOLT AGE, LPBOR = 0
FIGURE 28-49: LOW-POWER BROWN-OUT RESET HYSTERESIS, LPBOR = 0
Typical
Max.
Min.
1.80
1.90
2.00
2.10
2.20
2.30
2.40
2.50
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Min: Typical - 3ı
Typical
Max.
Min.
0
5
10
15
20
25
30
35
40
45
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (mV)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
PIC12(L)F1501
DS40001615C-page 256 2011-2015 Microchip Technology Inc.
FIGURE 28-50 : WDT TIME-OUT PERIOD
FIGURE 28-51 : PWRT PERIOD
Typical
Max.
Min.
10
12
14
16
18
20
22
24
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (ms)
VDD (V)
Max: Typical + 3ı(-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3ı(-40°C to +125°C)
Typical
Max.
Min.
40
50
60
70
80
90
100
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (ms)
VDD (V)
Max: Typical + 3ı(-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3ı(-40°C to +125°C)
2011-2015 Microchip Technology Inc. DS40001615C-page 257
PIC12(L)F1501
FIGURE 28-52: FVR STABILIZATION PER IOD
Typical
Max.
0
10
20
30
40
50
60
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
Time (us)
VDD (V)
Max: Typical + 3ı
Typical: statistical mean @ 25°C
Note:
The FVR Stabilization Period applies when:
1) coming out of RESET or exiting Sleep mode for PIC12/16LFxxxx devices.
2) when exiting sleep mode with VREGPM = 1for PIC12/16Fxxxx devices
In all other cases, the FVR is stable when released from RESET.
PIC12(L)F1501
DS40001615C-page 258 2011-2015 Microchip Technology Inc.
FIGURE 28-53: COMP ARA TOR HYST ERE SIS, NO RMAL POWER MODE (CxSP = 1, CxHYS = 1)
FIGURE 28-54: COMPARATOR HYSTERESIS, LOW-POWER MODE (CxSP = 0, CxHYS = 1)
Min.
Typical
Max.
0
5
10
15
20
25
30
35
40
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Hysteresis (mV)
VDD (V)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
Min.
Typical
Max.
0
1
2
3
4
5
6
7
8
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Hysteresis (mV)
VDD (V)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 259
PIC12(L)F1501
FIGURE 28-55: COMPARATOR RESPONSE T IME, NORMAL POWER MODE (CxSP = 1)
FIGURE 28-56: COMPARATOR RESPONSE T IME OVER TEMPERATURE,
NORMAL POWER MODE (CxSP = 1)
Max.
Typical
0
50
100
150
200
250
300
350
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (ns)
VDD (V)
Max: Typical + 3ı
Typical: 25°C
Min. (-40°C)
Typical (25°C)
Max. (125°C)
0
50
100
150
200
250
300
350
400
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (ns)
V
DD
(V)
Max: 125°C + 3ı
Typical: 25°C
Min: -45°C - 3ı
PIC12(L)F1501
DS40001615C-page 260 2011-2015 Microchip Technology Inc.
FIGURE 28-57: COMPARATOR INPUT OFFSET AT 25°C, NORMAL POWER MODE (CxSP = 1),
PIC12F1501 ONL Y
Max.
Typical
Min.
-50
-40
-30
-20
-10
0
10
20
30
40
50
0.0 1.0 2.0 3.0 4.0 5.0
Offset Voltage (mV)
Common Mode Voltage (V)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 261
PIC12(L)F1501
FIGURE 28-58: LFINTOSC FREQUENCY OVER VDD AND TEMPERATURE, PIC12LF1501 ONLY
FIGURE 28-59: LFINTOSC FREQUENCY OVER VDD AND TEMPERATURE, PIC12F1501 ONLY
Typical
Max.
Min.
20
22
24
26
28
30
32
34
36
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
Frequency (kHz)
VDD (V)
Max: Typical + 3ı(-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3ı(-40°C to +125°C)
Typical
Max.
Min.
20
22
24
26
28
30
32
34
36
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Frequency (kHz)
VDD (V)
Max: Typical + 3ı(-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3ı(-40°C to +125°C)
PIC12(L)F1501
DS40001615C-page 262 2011-2015 Microchip Technology Inc.
FIGURE 28-60: HFINTOSC ACCURACY OVER TEMPERATURE, VDD = 1.8V,
PIC12LF1501 ONLY
FIGURE 28-61: HFINTOSC ACCURACY OVER TEMPERATURE, 2.3V VDD 5.5V
Typical
Max.
Min.
-10%
-8%
-6%
-4%
-2%
0%
2%
4%
6%
8%
-60 -40 -20 0 20 40 60 80 100 120 140
Accuracy (%)
Temperature (°C)
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
Typical
Max.
Min.
-10%
-8%
-6%
-4%
-2%
0%
2%
4%
6%
8%
-60 -40 -20 0 20 40 60 80 100 120 140
Accuracy (%)
Temperature (°C)
Max: Typical + 3ı
Typical: statistical mean
Min: Typical - 3ı
2011-2015 Microchip Technology Inc. DS40001615C-page 263
PIC12(L)F1501
FIGURE 28-62: SLEEP MODE, WAKE PERIOD WITH HFINTOSC SOURCE, PIC12LF1501 ONLY
Typical
Max.
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
Time (us)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
PIC12(L)F1501
DS40001615C-page 264 2011-2015 Microchip Technology Inc.
FIGURE 28-63: LOW-POWER SLEEP MODE, WAKE PERIOD WITH HFINTOSC SOURCE,
VREGPM = 1, PIC12F 1 501 ONLY
FIGURE 28-64: SLEEP MODE, W AKE PERIOD WITH HFINTOSC SOURCE, VREGPM = 0,
PIC12F15 01 ONL Y
Typical
Max.
0
5
10
15
20
25
30
35
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (us)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
2
4
6
8
10
12
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (us)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
2011-2015 Microchip Technology Inc. DS40001615C-page 265
PIC12(L)F1501
29.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers (MCU) and dsPIC® digital
signal controllers (DSC) are supported with a full range
of software and hardware development tools:
• Integrated Development Environment
- MPLAB® X IDE Software
• Compilers/Assemblers/Linkers
- MPLAB XC Compiler
- MPASMTM Assembler
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB X SIM Software Simulator
•Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers/Programmers
- MPLAB ICD 3
- PICkit™ 3
• Device Programmers
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits and Starter Kits
• Third-party development tools
29.1 MPLAB X Integrated Devel opment
Environment Software
The MPLAB X IDE is a single, unified graphical user
interface for Microchip and third-party software, and
hardware development tool that runs on Windows®,
Linux and Mac OS® X. Based on the NetBeans IDE,
MPLAB X IDE is an entirely new IDE with a host of free
software components and plug-ins for high-
performance application development and debugging.
Moving between tools and upgrading from software
simulators to hardware debugging and programming
tools is simple with the seamless user interface.
With complete project management, visual call graphs,
a configurable watch window and a feature-rich editor
that includes code completion and context menus,
MPLAB X IDE is flexible and friendly enough for new
users. With the ability to support multiple tools on
multiple projects with simultaneous debugging, MPLAB
X IDE is also suitable for the needs of experienced
users.
Feature-Rich Editor:
• Color syntax highlighting
• Smart code completion makes suggestions and
provides hints as you type
• Automatic code formatting based on user-defined
rules
• Live parsing
User-Friendly, Customizable Interface:
• Fully customizable interface: toolbars, toolbar
buttons, windows, window placement, etc.
• Call graph window
Project-Based Workspaces:
• Multiple projects
• Multiple tools
• Multiple configurations
• Simultaneous debugging sessions
File History and Bug Tracking:
• Local file history feature
• Built-in support for Bugzilla issue tracker
PIC12(L)F1501
DS40001615C-page 266 2011-2015 Microchip Technology Inc.
29.2 MPLAB XC Compilers
The MPLAB XC Compilers are complete ANSI C
compilers for all of Microchip’s 8, 16, and 32-bit MCU
and DSC devices. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use. MPLAB XC Compilers run on Windows,
Linux or MAC OS X.
For easy source level debugging, the compilers provide
debug information that is optimized to the MPLAB X
IDE.
The free MPLAB XC Compiler editions support all
devices and commands, with no time or memory
restrictions, and offer sufficient code optimization for
most applications.
MPLAB XC Compilers include an assembler, linker and
utilities. The assembler generates relocatable object
files that can then be archived or linked with other relo-
catable object files and archives to create an execut-
able file. MPLAB XC Compiler uses the assembler to
produce its object file. Notable features of the assem-
bler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command-line interface
• Rich directive set
• Flexible macro language
• MPLAB X IDE compatibility
29.3 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code, and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB X IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multipurpose
source files
• Directives that allow complete control over the
assembly process
29.4 MPLINK Object Linker /
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler. It can link
relocatable objects from precompiled libraries, using
directives from a linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
29.5 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC DSC devices. MPLAB XC Compiler
uses the assembler to produce its object file. The
assembler generates relocatable object files that can
then be archived or linked with other relocatable object
files and archives to create an executable file. Notable
features of the assembler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command-line interface
• Rich directive set
• Flexible macro language
• MPLAB X IDE compatibility
2011-2015 Microchip Technology Inc. DS40001615C-page 267
PIC12(L)F1501
29.6 MPLAB X SIM Software Simulator
The MPLAB X SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB X SIM Software Simulator fully supports
symbolic debugging using the MPLAB XC Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
29.7 MPLAB REAL ICE In-Circuit
Emulator System
The MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs all 8, 16 and 32-bit MCU, and DSC devices
with the easy-to-use, powerful graphical user interface of
the MPLAB X IDE.
The emulator is connected to the design engineer’s
PC using a high-speed USB 2.0 interface and is
connected to the target with either a connector
compatible with in-circuit debugger systems (RJ-11)
or with the new high-speed, noise tolerant, Low-
Voltage Differential Signal (LVDS) interconnection
(CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB X IDE. MPLAB REAL ICE offers
significant advantages over competitive emulators
including full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, logic
probes, a ruggedized probe interface and long (up to
three meters) interconnection cables.
29.8 MPLAB ICD 3 In-Circuit Debugger
System
The MPLAB ICD 3 In-Circuit Debugger System is
Microchip’s most cost-effective, high-speed hardware
debugger/programmer for Microchip Flash DSC and
MCU devices. It debugs and programs PIC Flash
microcontrollers and dsPIC DSCs with the powerful,
yet easy-to-use graphical user interface of the MPLAB
IDE.
The MPLAB ICD 3 In-Circuit Debugger probe is
connected to the design engineer’s PC using a high-
speed USB 2.0 interface and is connected to the target
with a connector compatible with the MPLAB ICD 2 or
MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3
supports all MPLAB ICD 2 headers.
29.9 PICkit 3 In-Circuit De bugger/
Programmer
The MPLAB PICkit 3 allows debugging and program-
ming of PIC and dsPIC Flash microcontrollers at a most
affordable price point using the powerful graphical user
interface of the MPLAB IDE. The MPLAB PICkit 3 is
connected to the design engineer’s PC using a full-
speed USB interface and can be connected to the tar-
get via a Microchip debug (RJ-11) connector (compati-
ble with MPLAB ICD 3 and MPLAB REAL ICE). The
connector uses two device I/O pins and the Reset line
to implement in-circuit debugging and In-Circuit Serial
Programming™ (ICSP™).
29.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages, and a mod-
ular, detachable socket assembly to support various
package types. The ICSP cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices, and incorporates an MMC card for file
storage and data applications.
PIC12(L)F1501
DS40001615C-page 268 2011-2015 Microchip Technology Inc.
29.11 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully
functional systems. Most boards include prototyping
areas for adding custom circuitry and provide applica-
tion firmware and source code for examination and
modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™
demonstration/development board series of circuits,
Microchip has a line of evaluation kits and demonstra-
tion software for analog filter design, KEELOQ® security
ICs, CAN, IrDA®, PowerSmart battery management,
SEEVAL® evaluation system, Sigma-Delta ADC, flow
rate sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
29.12 Third-Party Development Tools
Microchip also offers a great collection of tools from
third-party vendors. These tools are carefully selected
to offer good value and unique functionality.
• Device Programmers and Gang Programmers
from companies, such as SoftLog and CCS
• Software Tools from companies, such as Gimpel
and Trace Systems
• Protocol Analyzers from companies, such as
Saleae and Total Phase
• Demonstration Boards from companies, such as
MikroElektronika, Digilent® and Olimex
• Embedded Ethernet Solutions from companies,
such as EZ Web Lynx, WIZnet and IPLogika®
2011-2015 Microchip Technology Inc. DS40001615C-page 269
PIC12(L)F1501
30.0 PACKAGING INFORMATION
30.1 Package Marking Information
*Standard PICmicro® device marking consists of Microchip part number, year code, week code and
traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP
price.
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
8-Lead SOIC (3.90 mm) Example
NNN
8-Lead PDIP (300 mil) Example
XXXXXXXX
XXXXXNNN
YYWW
12F1501
3
e
I/P
1110
12F1501
I/SN1110
017
017
PIC12(L)F1501
DS40001615C-page 270 2011-2015 Microchip Technology Inc.
Package Marking Information (Continued)
8-Lead MSOP (3x3 mm) Example
F1501I
110017
8-Lead DFN (3x3x0.9 mm) Example
XXXX
NNN
YYWW
PIN 1 PIN 1
MFB1
1110
017
8-Lead DFN (2x3x0.9 mm)
Example
BAK
110
10
8-Lead UDFN (2x3x0.5 mm)
2011-2015 Microchip Technology Inc. DS40001615C-page 271
PIC12(L)F1501
TABLE 30-1: 8-LEAD 2x3 DFN (MC) TOP
MARKING
TABLE 30-2: 8-LEAD 3x3 DFN (MF) TOP
MARKING
Part Number Marking
PIC12F1501-E/MC BAK
PIC12F1501-I/MC BAL
PIC12LF1501-E/MC BAM
PIC12LF1501-I/MC BAP
Part Number Marking
PIC12F1501-E/MF MFA1
PIC12F1501-I/MF MFB1
PIC12LF1501-E/MF MFC1
PIC12LF1501-I/MF MFD1
TABLE 30-3: 8-LEAD 2X3 UDFN (MU) TOP
MARKING
Part Number Marking
PIC12F1501-E/MU BAR
PIC12F1501-I/MU BAQ
PIC12LF1501-E/MU BAT
PIC12LF1501-I/MU BAS
PIC12(L)F1501
DS40001615C-page 272 2011-2015 Microchip Technology Inc.
30.2 Package Details
The following sections give the technical details of the packages.

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 
 

 

 
   

 
 
    
  
   
    
   
   
   
    
   
  
N
E1
NOTE 1
D
123
A
A1
A2
L
b1
b
e
E
eB
c
   
2011-2015 Microchip Technology Inc. DS40001615C-page 273
PIC12(L)F1501
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC12(L)F1501
DS40001615C-page 274 2011-2015 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2015 Microchip Technology Inc. DS40001615C-page 275
PIC12(L)F1501
 ! ""#$%& !'
 

PIC12(L)F1501
DS40001615C-page 276 2011-2015 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2015 Microchip Technology Inc. DS40001615C-page 277
PIC12(L)F1501
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC12(L)F1501
DS40001615C-page 278 2011-2015 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2015 Microchip Technology Inc. DS40001615C-page 279
PIC12(L)F1501
($)*+',--%&(

 
 
 
 
 
 
 

 
   

 
   
    
  
 
 
   
   
   
   
 
D
N
E
NOTE 1
12
EXPOSED PAD
NOTE 1
21
D2
K
L
E2
N
e
b
A3 A1
A
NOTE 2
BOTTOM VIEW
TOP VIEW
   
PIC12(L)F1501
DS40001615C-page 280 2011-2015 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2015 Microchip Technology Inc. DS40001615C-page 281
PIC12(L)F1501
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC12(L)F1501
DS40001615C-page 282 2011-2015 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2015 Microchip Technology Inc. DS40001615C-page 283
PIC12(L)F1501
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC12(L)F1501
DS40001615C-page 284 2011-2015 Microchip Technology Inc.
($)*+.,--%/.(
 

2011-2015 Microchip Technology Inc. DS40001615C-page 285
PIC12(L)F1501
($)*+.,--%/.(
 

PIC12(L)F1501
DS40001615C-page 286 2011-2015 Microchip Technology Inc.
APPENDIX A: DAT A SHEET
REVISION HISTORY
Revision A (11/2011)
Original release.
Revision B (04/2014)
Updated Electrical Specifications and added Charac-
terization Data; Added UDFN package.
Revision C (10/2015)
Added Section 3.2 High Endurance Flash. Updated
Equation 15-1; Figure 24-1; Register 24-3; Sections
22.1.5, 24.9.1.2, 24.11.1, and 27.1; and Tables 1-2,
3-5, and 24-2. Updated Product Identification System
section.
2011-2015 Microchip Technology Inc. DS40001615C-page 287
PIC12(L)F1501
THE MICROCHIP WEBSITE
Microchip provides online support via our website at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the website
at: http://www.microchip.com/support
PIC12(L)F1501
DS40001615C-page 288 2011-2015 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: PIC12LF1501, PIC12F1501
Tape and Reel
Option: Blank = Standard packaging (tube or tray)
T = Tape and Reel(1)
Temperature
Range: I= -40C to +85C(Industrial)
E= -40
C to +125C (Extended)
Package: MC = Micro Lead Frame (DFN) 2x3
MF = Micro Lead Frame (DFN) 3x3
MS = MSOP
MU = Micro Lead Frame (UDFN) 2x3
P=Plastic DIP
SN = SOIC
Pattern: QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
a) PIC12LF1501T - I/SN
Tape and Reel,
Industrial temperature,
SOIC package
b) PIC12F1501 - I/P
Industrial temperature
PDIP package
c) PIC12F1501 - E/MF
Extended temperature,
DFN package
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
2: For other small form-factor package
availability and marking information, please
visit www.microchip.com/packaging or
contact your local sales office.
[X](1)
Tape and Reel
Option
-
2011-2015 Microchip Technology Inc. DS40001615C-page 289
PIC12(L)F1501
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2011-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-915-1
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS40001615C-page 290 2011-2015 Microchip Technology Inc.
AMERICAS
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Austria - Wels
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Worldwid e Sales and Service
07/14/15