OPA336UA/2K5G4 - Texas Instruments

FEATURES

● SINGLE-SUPPLY OPERATION

● RAIL-TO-RAIL OUTPUT (within 3mV)

●

micro

POWER: IQ = 20µA/Amplifier

●

micro

SIZE PACKAGES

● LOW OFFSET VOLTAGE: 125µV max

● SPECIFIED FROM VS = 2.3V to 5.5V

● SINGLE, DUAL, AND QUAD VERSIONS

OPA336

OPA2336

OPA4336

SINGLE-SUPPLY,

micro

Power

CMOS OPERATIONAL AMPLIFIERS

microAmplifier

™ Series

APPLICATIONS

●BATTERY-POWERED INSTRUMENTS

●PORTABLE DEVICES

●HIGH-IMPEDANCE APPLICATIONS

●PHOTODIODE PRE-AMPS

●PRECISION INTEGRATORS

● MEDICAL INSTRUMENTS

● TEST EQUIPMENT

DESCRIPTION

OPA336 series

micro

Power CMOS operational amplifiers

are designed for battery-powered applications. They

operate on a single supply with operation as low as 2.1V.

The output is rail-to-rail and swings to within 3mV of the

supplies with a 100kΩ load. The common-mode range

extends to the negative supply—ideal for single-supply

applications. Single, dual, and quad versions have identical

specifications for maximum design flexibility.

In addition to small size and low quiescent current

(20µA/amplifier), they feature low offset voltage

(125µV max), low input bias current (1pA), and high open-

loop gain (115dB). Dual and quad designs feature

completely independent circuitry for lowest crosstalk and

freedom from interaction.

OPA336 packages are the tiny SOT23-5 surface mount

and SO-8 surface-mount. OPA2336 come in the miniature

MSOP-8 surface-mount, SO-8 surface-mount, and DIP-8

packages. The OPA4336 package is the space-saving

SSOP-16 surface-mount. All are specified from

–40°C to +85°C and operate from –55°C to +125°C.

A macromodel is available for download (at www.ti.com)

for design analysis.

OPA4336

OPA336

OPA2336

SBOS068C – JANUARY 1997 – REVISED JANUARY 2005

www.ti.com

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

V+

–In

Out

V–

+In

OPA336

SOT23-5

V+

Output

–In

+In

V–

OPA336

SO-8

NC = No Connection

V+

Out B

–In B

+In B

Out A

–In A

+In A

V–

OPA2336

DIP-8, SO-8, MSOP-8

Out D

–In D

+In D

V–

+In C

–In C

Out C

Out A

–In A

+In A

V+

+In B

–In B

Out B

OPA4336

SSOP-16

NC = No Connection

OPA336, 2336, 4336

2SBOS068C

www.ti.com

PACKAGE

DRAWING PACKAGE

PRODUCT PACKAGE-LEAD DESIGNATOR MARKING

Single

OPA336N SOT23-5 DBV A36(2)

OPA336NA SOT23-5 DBV A36(2)

OPA336NJ SOT23-5 DBV J36

OPA336U SO-8 Surface-Mount D OPA336U

OPA336UA SO-8 Surface-Mount D OPA336UA

OPA336UJ SO-8 Surface-Mount D OPA336UJ

Dual

OPA2336E MSOP-8 Surface-Mount DGK B36(2)

OPA2336EA MSOP-8 Surface-Mount DGK B36(2)

OPA2336P DIP-8 P OPA2336P

OPA2336PA DIP-8 P OPA2336PA

OPA2336U SO-8 Surface-Mount D OPA2336U

OPA2336UA SO-8 Surface-Mount D OPA2336UA

Quad

OPA4336EA SSOP-16 Surface-Mount DBQ OPA4336EA

NOTES: (1) For the most current package and ordering information, see the package option addendum at the end of this data sheet. (2) Grade will be marked on

the Reel.

PACKAGE/ORDERING INFORMATION(1)

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas

Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper han-

dling and installation procedures can cause damage.

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet its

published specifications.

Supply Voltage ................................................................................... 7.5V

Signal Input Terminals, Voltage(2) .....................(V–) –0.3V to (V+) +0.3V

Current(2) .................................................... 10mA

Output Short-Circuit(3) .............................................................. Continuous

Operating Temperature ..................................................–55°C to +125°C

Storage Temperature .....................................................–55°C to +125°C

Junction Temperature...................................................................... 150°C

Lead Temperature (soldering, 10s)................................................. 300°C

ESD Rating:

Charged Device Model, OPA336 NJ and UJ only (CDM)(4) ....... 1000V

Human Body Model (HBM)(4) ......................................................... 500V

Machine Model (MM)(4) .................................................................. 100V

NOTES: (1) Stresses above these ratings may cause permanent damage.

Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only. Functional opera-

tion of the device at these conditions, or beyond the specified operating

conditions, is not implied. (2) Input terminals are diode-clamped to the power

supply rails. Input signals that can swing more than 0.3V beyond the supply

rails should be current-limited to 10mA or less. (3) Short-circuit to ground,

one amplifier per package. (4) OPA336 NJ and UJ have been tested to CDM

of 1000V. All other previous package versions have been tested using HBM

and MM. Results are shown.

ABSOLUTE MAXIMUM RATINGS(1)

OPA336, 2336, 4336 3

SBOS068C www.ti.com

ELECTRICAL CHARACTERISTICS: VS = 2.3V to 5.5V

Boldface limits apply over the specified temperature range, TA = –40°C to +85°C.

At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted.

OPA336NA, UA

OPA336N, U OPA2336EA, PA, UA

OPA2336E, P, U OPA4336EA OPA336NJ, UJ

PARAMETER CONDITION MIN TYP(1) MAX MIN TYP MAX MIN TYP MAX UNITS

OFFSET VOLTAGE

Input Offset Voltage VOS ±60 ±125 ✻±500 ±500 ±2500 µV

vs Temperature dVOS/dT ±1.5 ✻✻µV/°C

vs Power Supply PSRR VS = 2.3V to 5.5V 25 100 ✻✻✻✻✻µV/V

Over Temperature VS = 2.3V to 5.5V 130 ✻✻ ✻µV/V

Channel Separation, dc 0.1 ✻✻µV/V

INPUT BIAS CURRENT

Input Bias Current IB±1±10 ✻✻ ✻✻pA

Over Temperature ±60 ✻✻pA

Input Offset Current IOS ±1±10 ✻✻ ✻✻pA

NOISE

Input Voltage Noise, f = 0.1 to 10Hz 3 ✻✻µVp-p

Input Voltage Noise Density, f = 1kHz en40 ✻✻nV/√Hz

Current Noise Density, f = 1kHz in30 ✻✻fA/√Hz

INPUT VOLTAGE RANGE

Common-Mode Voltage Range VCM –0.2

(V+) –1

✻✻✻✻V

Common-Mode Rejection Ratio CMRR –0.2V < VCM < (V+) –1V 80 90 76 86 76 86 dB

Over Temperature –0.2V < VCM < (V+) –1V 76 74 74 dB

INPUT IMPEDANCE

Differential 1013 || 2 ✻✻Ω || pF

Common-Mode 1013 || 4 ✻✻Ω || pF

OPEN-LOOP GAIN

Open-Loop Voltage Gain AOL

RL = 25kΩ, 100mV < VO < (V+) – 100mV

100 115 90 ✻90 ✻dB

Over Temperature

RL = 25kΩ, 100mV < VO < (V+) – 100mV

100 90 90 dB

RL = 5kΩ, 500mV < VO < (V+) – 500mV

90 106 ✻✻ ✻✻ dB

Over Temperature

RL = 5kΩ, 500mV < VO < (V+) – 500mV

90 ✻✻dB

FREQUENCY RESPONSE

Gain-Bandwidth Product GBW VS = 5V, G = 1 100 ✻✻kHz

Slew Rate SR VS = 5V, G = 1 0.03 ✻✻V/µs

Overload Recovery Time VIN • G = VS100 ✻✻µs

OUTPUT

Voltage Output Swing from Rail(2) RL = 100kΩ, AOL ≥ 70dB 3 ✻✻mV

RL = 25kΩ, AOL ≥ 90dB 20 100 ✻✻ ✻✻mV

Over Temperature RL = 25kΩ, AOL ≥ 90dB 100 ✻✻mV

RL = 5kΩ, AOL ≥ 90dB 70 500 ✻✻ ✻✻mV

Over Temperature RL = 5kΩ, AOL ≥ 90dB 500 ✻✻mV

Short-Circuit Current ISC ±5✻✻mA

Capacitive Load Drive CLOAD

See Text

✻✻pF

POWER SUPPLY

Specified Voltage Range VS2.3 5.5 ✻✻✻✻V

Minimum Operating Voltage 2.1 ✻✻V

Quiescent Current (per amplifier) IQIO = 0 20 32 ✻✻ 23 38 µA

Over Temperature IO = 0 36 ✻42 µA

TEMPERATURE RANGE

Specified Range –40 +85 ✻✻✻✻°C

Operating Range –55 +125 ✻✻✻✻°C

Storage Range –55 +125 ✻✻✻✻°C

Thermal Resistance θJA

SOT-23-5 Surface-Mount 200 ✻✻°C/W

MSOP-8 Surface-Mount 150 ✻°C/W

SO-8 Surface-Mount 150 ✻✻°C/W

DIP-8 100 ✻°C/W

SSOP-16 Surface-Mount 100 ✻°C/W

DIP-14 80 ✻°C/W

✻Specifications same as OPA2336E, P, U.

NOTES: (1) VS = +5V. (2) Output voltage swings are measured between the output and positive and negative power-supply rails.

OPA336, 2336, 4336

4SBOS068C

www.ti.com

TYPICAL CHARACTERISTICS

At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted.

OPEN-LOOP GAIN/PHASE vs FREQUENCY

100

–20

Voltage Gain (dB)

–45

–90

–135

–180

Phase (°)

Frequency (Hz)

10 100 1k 10k 100k 1M

SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE

Supply Voltage (V)

Short-Circuit Current (mA)

±6

±5

±4

±3

±2

±1

02.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

+ISC

–ISC

POWER-SUPPLY and COMMON-MODE

REJECTION RATIO vs FREQUENCY

100

PSRR, CMRR (dB)

Frequency (Hz)

1 10 100 1k 10k 100k

CMRR

PSRR

SHORT-CIRCUIT CURRENT vs TEMPERATURE

Temperature (°C)

Short-Circuit Current (mA)

0–75 –50 –25 0 25 50 75 100 125

VS = +2.3V

VS = +5V

–ISC

+ISC

–ISC

QUIESCENT CURRENT vs SUPPLY VOLTAGE

Supply Voltage (V)

Quiescent Current (µA)

102.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Per Amplifier

QUIESCENT CURRENT vs TEMPERATURE

Temperature (°C)

Quiescent Current (µA)

0–75 –50 –25 0 25 50 75 100 125

= +2.3V

= +5V

Per Amplifier

OPA336, 2336, 4336 5

SBOS068C www.ti.com

TYPICAL CHARACTERISTICS (Cont.)

At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted.

MAXIMUM OUTPUT VOLTAGE vs FREQUENCY

100k10k

Frequency (Hz)

100 1k

Output Voltage (Vp-p)

= +5.5V

= +2.3V

OFFSET VOLTAGE

PRODUCTION DISTRIBUTION

Percent of Amplifiers (%)

Offset Voltage (µV)

–500

–400

–300

–200

–100

100

200

300

400

500

0.1% 0.2%

0.3% 0.1%

Typical production

distribution of

packaged units.

AOL, CMRR, PSRR vs TEMPERATURE

Temperature (°C)

AOL, CMRR, PSRR (dB)

120

110

100

70–75 –50 –25 0 25 50 75 100 125

AOL

PSRR

CMRR

OFFSET VOLTAGE DRIFT MAGNITUDE

PRODUCTION DISTRIBUTION

Percent of Amplifiers (%)

Offset Voltage Drift (µV/°C)

0.25

0.5

0.75

1.25

1.5

1.75

2.25

2.5

2.75

3.25

3.5

3.75

Typical production

distribution of

packaged units.

INPUT VOLTAGE AND CURRENT NOISE

SPECTRAL DENSITY vs FREQUENCY

Frequency (Hz)

100

1 10 100 1k 10k 100k

Voltage Noise (nV/√Hz)

Current Noise (fA/√Hz)

Voltage Noise

Current Noise

CHANNEL SEPARATION vs FREQUENCY

Frequency (Hz)

Channel Separation (dB)

150

140

130

120

110100 1k 10k 100k

Dual and Quad devices, G = 1, all

channels. Quad measured channel A

to D or B to C—other combinations

yield improved rejection.

OPA336, 2336, 4336

6SBOS068C

www.ti.com

LARGE-SIGNAL STEP RESPONSE

G = 1, CL = 620pF, VS = +5V

200µs/div

500mV/div

SMALL-SIGNAL STEP RESPONSE

G = 1, CL = 200pF, VS = +5V

50µs/div

20mV/div

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

Output Voltage (V)

Output Current (mA)

–0–1–2–3–4–5–6–7–8

–2.5

–2.0

–1.5

–1.0

–0.5

Sinking

Current

+25°C

–55°C

+125°C

VS = ±2.5V

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

Output Voltage (V)

Output Current (mA)

01 2345678

Sourcing

Current

–55°C

+25°C

+125°C

+25°C

–55°C

= +2.3V

= +5V

INPUT BIAS CURRENT

vs INPUT COMMON-MODE VOLTAGE

Input Bias Current (pA)

Common-Mode Voltage (V)

012345

= +5V

INPUT BIAS CURRENT vs TEMPERATURE

Input Bias Current (pA)

Temperature (°C)

–75 –50 –25 0 25 50 75 100 125

100

0.1

TYPICAL CHARACTERISTICS (Cont.)

At TA = +25°C, VS = +5V, and RL = 25kΩ connected to VS/2, unless otherwise noted.

OPA336, 2336, 4336 7

SBOS068C www.ti.com

CAPACITIVE LOAD AND STABILITY

OPA336 series op amps can drive a wide range of capaci-

tive loads. However, all op amps under certain conditions

may become unstable. Op-amp configuration, gain, and

load value are just a few of the factors to consider when

determining stability.

When properly configured, OPA336 series op amps can

drive approximately 10,000pF. An op amp in unity-gain

configuration is the most vulnerable to capacitive load. The

capacitive load reacts with the op amp’s output resistance,

along with any additional load resistance, to create a pole in

the response which degrades the phase margin. In unity gain,

OPA336 series op amps perform well with a pure capacitive

load up to about 300pF. Increasing gain enhances the

amplifier’s ability to drive loads beyond this level.

One method of improving capacitive load drive in the

unity-gain configuration is to insert a 50Ω to 100Ω resistor

inside the feedback loop, as shown in Figure 3. This reduces

ringing with large capacitive loads while maintaining DC

100Ω

OPAx336

CLRL

VIN

VOUT

APPLICATIONS INFORMATION

OPA336 series op amps are fabricated on a state-of-the-art

0.6 micron CMOS process. They are unity-gain stable and

suitable for a wide range of general-purpose applications.

Power-supply pins should be bypassed with 0.01µF ceramic

capacitors. OPA336 series op amps are protected against

reverse battery voltages.

OPERATING VOLTAGE

OPA336 series op amps can operate from a +2.1V to +5.5V

single supply with excellent performance. Most behavior

remains unchanged throughout the full operating voltage

range. Parameters which vary significantly with operating

voltage are shown in the typical characteristics. OPA336

series op amps are fully specified for operation from +2.3V

to +5.5V; a single limit applies over the supply range. In

addition, many parameters are ensured over the specified

temperature range, –40°C to +85°C.

INPUT VOLTAGE

The input common-mode range of OPA336 series op amps

extends from (V–) – 0.2V to (V+) – 1V. For normal

operation, inputs should be limited to this range. The

absolute maximum input voltage is 300mV beyond the

supplies. Thus, inputs greater than the input

common-mode range but less than maximum input volt-

age, while not valid, will not cause any damage to the op

amp. Furthermore, the inputs may go beyond the power

supplies without phase inversion, as shown in Figure 1,

unlike some other op amps.

Normally, input bias current is approximately 1pA. How-

ever, input voltages exceeding the power supplies can

cause excessive current to flow in or out of the input pins.

Momentary voltages greater than the power supply can be

tolerated as long as the current on the input pins is limited

to 10mA. This is easily accomplished with an input resis-

tor, as shown in Figure 2.

5kΩ

OPAx336

10mA max

+5V

VIN

VOUT

IOVERLOAD

FIGURE 1. No Phase Inversion with Inputs Greater than the

Power-Supply Voltage.

FIGURE 2. Input Current Protection for Voltages Exceeding

the Supply Voltage.

FIGURE 3. Series Resistor in Unity-Gain Configuration

Improves Capacitive Load Drive.

OUT

OPA336, 2336, 4336

8SBOS068C

www.ti.com

accuracy. For example, with RL = 25kΩ, OPA336 series op

amps perform well with capacitive loads in excess of 1000pF,

as shown in Figure 4. Without RS, capacitive load drive is

typically 350pF for these conditions, as shown in Figure 5.

Capacitive Load (pF)

Resistive Load (kΩ)

105 100

10k

100

Operation Above Selected Gain

Curve Not Recommended

G = +1

to Ground

G = +2

RL to Ground

G = +1

RL to VS/2 VS = +5V, VO = VS/2

FIGURE 4. Small-Signal Step Response Using Series Re-

sistor to Improve Capacitive Load Drive.

Alternatively, the resistor may be connected in series with

the output outside of the feedback loop. However, if there is

a resistive load parallel to the capacitive load, it and the

series resistor create a voltage divider. This introduces a

Direct Current (DC) error at the output; however, this error

may be insignificant. For instance, with RL = 100kΩ and

RS = 100Ω, there is only about a 0.1% error at the output.

Figure 5 shows the recommended operating regions for the

OPA336. Decreasing the load resistance generally improves

capacitive load drive. Figure 5 also illustrates how stability

differs depending on where the resistive load is connected.

With G = +1 and RL = 10kΩ connected to VS/2, the OPA336

can typically drive 500pF. Connecting the same load to

ground improves capacitive load drive to 1000pF.

= 100Ω, Load = 2kΩ || 1000pF, V

= +5V

50µs/div

20mV/div

FIGURE 5. Stability—Capacitive Load vs Resistive Load.

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2012

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

OPA2336E/250 ACTIVE VSSOP DGK 8 250 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

OPA2336E/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

OPA2336E/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

OPA2336E/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

OPA2336EA/250 ACTIVE VSSOP DGK 8 250 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

OPA2336EA/250G4 ACTIVE VSSOP DGK 8 250 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

OPA2336EA/2K5 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

OPA2336EA/2K5G4 ACTIVE VSSOP DGK 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAUAGLevel-2-260C-1 YEAR

OPA2336P ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

OPA2336PA ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

OPA2336PAG4 ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

OPA2336PG4 ACTIVE PDIP P 8 50 Green (RoHS

& no Sb/Br) CU NIPDAU N / A for Pkg Type

OPA2336U ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA2336U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA2336U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA2336UA ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA2336UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2012

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

OPA2336UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA2336UAG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA2336UG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA336N/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336N/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336N/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336N/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336NA/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336NA/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336NA/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336NA/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336NJ/250 ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336NJ/250G4 ACTIVE SOT-23 DBV 5 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336NJ/3K ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336NJ/3KG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

OPA336P OBSOLETE PDIP P 8 TBD Call TI Call TI

OPA336PA OBSOLETE PDIP P 8 TBD Call TI Call TI

OPA336U ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA336U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2012

Addendum-Page 3

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

OPA336U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA336UA ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA336UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA336UA/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA336UAG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA336UG4 ACTIVE SOIC D 8 75 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA4336EA/250 ACTIVE SSOP DBQ 16 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA4336EA/250G4 ACTIVE SSOP DBQ 16 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA4336EA/2K5 ACTIVE SSOP DBQ 16 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA4336EA/2K5G4 ACTIVE SSOP DBQ 16 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR

OPA4336PA OBSOLETE PDIP N 14 TBD Call TI Call TI

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2012

Addendum-Page 4

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF OPA336 :

•Enhanced Product: OPA336-EP

NOTE: Qualified Version Definitions:

•Enhanced Product - Supports Defense, Aerospace and Medical Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

OPA2336E/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

OPA2336E/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

OPA2336EA/250 VSSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

OPA2336EA/2K5 VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

OPA2336U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

OPA2336UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

OPA336N/250 SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

OPA336N/3K SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

OPA336N/3K SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

OPA336NA/250 SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

OPA336NA/3K SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

OPA336NA/3K SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

OPA336NJ/250 SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

OPA336NJ/3K SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

OPA336NJ/3K SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

OPA336U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

OPA336UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

OPA4336EA/250 SSOP DBQ 16 250 180.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

OPA4336EA/2K5 SSOP DBQ 16 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

OPA2336E/250 VSSOP DGK 8 250 210.0 185.0 35.0

OPA2336E/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0

OPA2336EA/250 VSSOP DGK 8 250 210.0 185.0 35.0

OPA2336EA/2K5 VSSOP DGK 8 2500 367.0 367.0 35.0

OPA2336U/2K5 SOIC D 8 2500 367.0 367.0 35.0

OPA2336UA/2K5 SOIC D 8 2500 367.0 367.0 35.0

OPA336N/250 SOT-23 DBV 5 250 180.0 180.0 18.0

OPA336N/3K SOT-23 DBV 5 3000 203.0 203.0 35.0

OPA336N/3K SOT-23 DBV 5 3000 180.0 180.0 18.0

OPA336NA/250 SOT-23 DBV 5 250 180.0 180.0 18.0

OPA336NA/3K SOT-23 DBV 5 3000 180.0 180.0 18.0

OPA336NA/3K SOT-23 DBV 5 3000 203.0 203.0 35.0

OPA336NJ/250 SOT-23 DBV 5 250 180.0 180.0 18.0

OPA336NJ/3K SOT-23 DBV 5 3000 203.0 203.0 35.0

OPA336NJ/3K SOT-23 DBV 5 3000 180.0 180.0 18.0

OPA336U/2K5 SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

Pack Materials-Page 2

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

OPA336UA/2K5 SOIC D 8 2500 367.0 367.0 35.0

OPA4336EA/250 SSOP DBQ 16 250 210.0 185.0 35.0

OPA4336EA/2K5 SSOP DBQ 16 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Aug-2012

Pack Materials-Page 3

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