NCP1082
http://onsemi.com
16
PACKAGE DIMENSIONS
TSSOP−20 EP
CASE 948AB−01
ISSUE O
DIM
D
MIN MAX
6.60
MILLIMETERS
E1 4.30 4.50
A1.10
A1 0.05 0.15
L0.50 0.70
e0.65 BSC
P--- 4.20
c0.09 0.20
c1 0.09 0.16
b0.19 0.30
b1 0.19 0.25
L2 0.25 BSC
M0 8
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.07 IN EXCESS OF THE LEAD WIDTH AT
MMC. DAMBAR CANNOT BE LOACTED ON THE
LOWER RADIUS OR THE FOOT OF THE LEAD.
4. DIMENSIONS b, b1, c, c1 TO BE MEASURED
BETWEEN 0.10 AND 0.25 FROM LEAD TIP.
5. DATUMS A AND B ARE ARE DETERMINED AT DATUM
H. DATUM H IS LOACTED AT THE MOLD PARTING
LINE AND COINCIDENT WITH LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY.
6. DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION E1 DOES NOT
INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.15 PER SIDE. D AND E1 ARE
DETERMINED AT DATUM H.
PIN 1
REFERENCE
D
E1
0.08
A
SECTION B−B
b
b1
cc1
SEATING
PLANE
20X b
E
e
DETAIL A
6.40
---
4.30
20X
0.98 20X
0.35
0.65
DIMENSIONS: MILLIMETERS
PITCH
SOLDERING FOOTPRINT*
L
L2 GAUGE
DETAIL A
e/2
DETAIL B
A2 0.85 0.95
E6.40 BSC
P1 --- 3.00
PLANE
SEATING
PLANE
C
H
B
B
B
M
END VIEW
A-B
M
0.10 DC
TOP VIEW
SIDE VIEW
A-B0.20 DC
110
1120
B
A
D
DETAIL B
2X 10 TIPS
A1
A2
C
0.05 C
C
P
P1
BOTTOM VIEW 3.106.76
20X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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NCP1082/D
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