BGA2869,115"" - NXP SEMICONDUCTORS

1. Product profile

1.1 General description

Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal

matching circuit in a 6-pin SOT363 plastic SMD package.

1.2 Features and benefits

Internally matched to 50 

A gain of 31.7 dB at 950 MHz

Output power at 1 dB gain compression = 10 dBm at 950 MHz

Supply current = 24.0 mA at a supply voltage of 5.0 V

Reverse isolation > 39 dB up to 2150 MHz

Good linearity with low second order and third order products

Noise figure = 3.1 dB at 950 MHz

Unconditionally stable (K > 1)

No output inductor required

1.3 Applications

LNB IF amplifiers

General purpose low noise wideband amplifier for frequencies between

DC and 2.2 GHz

2. Pinning information

BGA2869

MMIC wideband amplifier

Rev. 2 — 26 August 2013 Product data sheet

Table 1. Pinning

Pin Description Simplified outline Graphic symbol

2, 5 GND2

3RF_OUT

4 GND1

6RF_IN

132

sym052

2, 5

Product data sheet Rev. 2 — 26 August 2013 2 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

3. Ordering information

4. Marking

5. Limiting values

6. Thermal characteristics

7. Characteristics

Tabl e 2. Ordering information

Type number Package

Name Description Version

BGA2869 - plastic surface-mounted package; 6 leads SOT363

Table 3. Marking

Type number Marking code Description

BGA2869 MD* * = - : made in Hong Kong

* = p : made in Hong Kong

* = W : made in China

* = t : made in Malaysia

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCC supply voltage RF input AC coupled 0.5 +7.0 V

ICC supply current - 36 mA

Ptot total power dissipation Tsp = 90 C-200mW

Tstg storage temperature 40 +125 C

Tjjunction temperature - 125 C

Pdrive drive power - 19 dBm

Table 5. Thermal characteris tics

Symbol Parameter Conditions Typ Unit

Rth(j-sp) thermal resistance from junction to

solder point Ptot = 200 mW; Tsp =90C 300 K/W

Table 6. Characteristics

VCC = 5.0 V; ZS = ZL = 50



; Pi =



34 dBm; Tamb = 25



C; measured on demo board; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage 4.5 5.0 5.5 V

ICC supply current 21.8 24.0 26.0 mA

Product data sheet Rev. 2 — 26 August 2013 3 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

Gppower gain f = 250 MHz 30.5 31.1 31.7 dB

f = 950 MHz 31.0 31.7 32.4 dB

f = 2150 MHz 30.7 32.2 33.6 dB

RLin input return loss f = 250 MHz 12 14 16 dB

f = 950 MHz 161820dB

f = 2150 MHz 7 13 20 dB

RLout output return loss f = 250 MHz 10 15 19 dB

f = 950 MHz 202122dB

f = 2150 MHz 8 10 13 dB

ISL isolation f = 250 MHz 41 61 81 dB

f = 950 MHz 464749dB

f = 2150 MHz 37 39 42 dB

NF noise figure f = 250 MHz 2.6 3.1 3.6 dB

f = 950 MHz 2.6 3.1 3.5 dB

f = 2150 MHz 2.8 3.2 3.6 dB

B3dB 3 dB bandwidth 3 dB below gain at 1 GHz 2.8 3.0 3.2 GHz

K Rollett stability factor f = 250 MHz 9 14 19

f = 950 MHz 2 3 4

f = 2150 MHz 1 1 2

PL(sat) saturated output power f = 250 MHz 12 12 13 dBm

f = 950 MHz 101213dBm

f = 2150 MHz 9 10 11 dBm

PL(1dB) output power at 1 dB gain compression f = 250 MHz 9 10 11 dBm

f = 950 MHz 9 10 11 dBm

f = 2150 MHz 8 9 10 dBm

IP3Iinput third-order intercept point Pdrive =41 dBm (for each tone)

f1= 250 MHz; f2= 251 MHz 11 96dBm

f1= 950 MHz; f2= 951 MHz 11 97dBm

f1=2150MHz; f

2=2151MHz 16 13 10 dBm

IP3Ooutput third-order intercept point Pdrive =41 dBm (for each tone)

f1= 250 MHz; f2=251MHz 202325dBm

f1= 950 MHz; f2=951MHz 202325dBm

f1=2150MHz; f

2= 2151 MHz 16 19 22 dBm

PL(2H) second harmonic output power Pdrive =38 dBm

f1H = 250 MHz; f2H =500MHz 69 67 65 dBm

f1H = 950 MHz; f2H =1900MHz 53 51 49 dBm

IM2 second-order intermodulation distance Pdrive =38 dBm (for each tone)

f1= 250 MHz; f2=251MHz 404244dBc

f1= 950 MHz; f2=951MHz 343638dBc

Table 6. Characteristics …continued

VCC = 5.0 V; ZS = ZL = 50



; Pi =



34 dBm; Tamb = 25



C; measured on demo board; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 2 — 26 August 2013 4 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

8. Application information

Figure 1 shows a typical application circuit for the BGA2869 MMIC. The device is

internally matched to 50 , and therefore does not need any externa l matching. The value

of the input and outpu t DC blocking cap acitors C1 and C2 should not be m ore than 470 pF

for applications above 100 MHz. However, when the device is operated below 100 MHz,

the capacitor value should be increased.

The location of the 470 pF supply d ecoupling cap acito r (Cdec) can b e precisely chosen for

optimum performance.

The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to

the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes

as close as possible to the MMIC.

8.1 Application examples

8.2 Tables

Fig 1. Typical application circuit

5)B2875)B,1

*1'

*1'

5)R

XWSXW5)LQSXW

&&

&GHF

DDD

The MMIC is very suitable as IF amplifier in e.g. LNB’s.

The excellent wideband characteristics make it an easy

building block.

As second amplifier after an LNA, the MMIC offers an

easy matching, low noise solution.

Fig 2. Application as IF amplifier Fig 3. Application as RF amplifier

001aaf762

from RF

circuit

oscillator

wideband

amplifier to IF circuit

or demodulator

mixer

001aaf763

antenna

oscillator

wideband

amplifier

LNA to IF circuit

or demodulator

mixer

Table 7. Supply current over temp erature and supply voltages

Typical values.

Symbol Parameter Conditions Tamb (C) Unit

40 +25 +85

ICC supply current VCC = 4.5 V 23.60 21.80 20.30 mA

VCC = 5.0 V 25.80 24.00 22.40 mA

VCC = 5.5 V 27.80 26.00 24.50 mA

Product data sheet Rev. 2 — 26 August 2013 5 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

Table 8. Second harmonic outp ut p ower over temperature and supply voltages

Typical values.

Symbol Parameter Conditions Tamb (C) Unit

40 +25 +85

PL(2H) second harmonic output power f = 250 MHz; Pdrive =38 dBm

VCC = 4.5 V 58 67 68 dBm

VCC =5.0V 72 67 61 dBm

VCC =5.5V 64 60 58 dBm

f = 950 MHz; Pdrive =38 dBm

VCC = 4.5 V 69 55 50 dBm

VCC =5.0V 55 51 48 dBm

VCC =5.5V 51 49 46 dBm

Table 9. Input power at 1 dB gain compression over temperature and supply voltages

Typical values.

Symbol Parameter Conditions Tamb (C) Unit

40 +25 +85

Pi(1dB) input power at 1 dB gain compression f = 250 MHz

VCC = 4.5 V 21 21 21 dBm

VCC =5.0V 20 20 20 dBm

VCC =5.5V 19 20 20 dBm

f = 950 MHz

VCC = 4.5 V 21 21 21 dBm

VCC =5.0V 21 21 21 dBm

VCC =5.5V 20 20 20 dBm

f = 2150 MHz

VCC = 4.5 V 22 22 23 dBm

VCC =5.0V 21 22 23 dBm

VCC =5.5V 21 22 24 dBm

Product data sheet Rev. 2 — 26 August 2013 6 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

Table 10. Output power at 1 dB gain compress ion over temperature and sup ply voltages

Typical values.

Symbol Parameter Conditions Tamb (C) Unit

40 +25 +85

PL(1dB) output power at 1 dB gain compression f = 250 MHz

VCC = 4.5 V 9 9 8 dBm

VCC =5.0V 11 10 10 dBm

VCC =5.5V 12 11 11 dBm

f = 950 MHz

VCC = 4.5 V 9 8 8 dBm

VCC =5.0V 10 10 9 dBm

VCC =5.5V 11 11 10 dBm

f = 2150 MHz

VCC = 4.5 V 9 8 6 dBm

VCC =5.0V 10 9 7 dBm

VCC =5.5V 11 9 7 dBm

Table 11. S aturated output power over temp erature and supply voltages

Typical values.

Symbol Parameter Conditions Tamb (C) Unit

40 +25 +85

PL(sat) saturated output power f = 250 MHz

VCC = 4.5 V 11 11 10 dBm

VCC =5.0V 13 12 12 dBm

VCC =5.5V 14 13 13 dBm

f = 950 MHz

VCC = 4.5 V 11 11 11 dBm

VCC =5.0V 12 12 12 dBm

VCC =5.5V 14 13 13 dBm

f = 2150 MHz

VCC = 4.5 V 10 9 8 dBm

VCC =5.0V 11 10 8 dBm

VCC =5.5V 12 10 9 dBm

Product data sheet Rev. 2 — 26 August 2013 7 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

Table 12. Second-order intermodulation distance over temperature and supply voltages

Typical values.

Symbol Parameter Conditions Tamb (C) Unit

40 +25 +85

IM2 second-order intermodulation distance f1=250MHz;

f2=251MHz;

Pdrive =38 dBm

VCC = 4.5 V 36 39 42 dBc

VCC =5.0V 40 42 45 dBc

VCC =5.5V 43 45 48 dBc

f1=950MHz;

f2=951MHz;

Pdrive =38 dBm

VCC = 4.5 V 33 34 36 dBc

VCC =5.0V 35 36 37 dBc

VCC =5.5V 37 37 37 dBc

Table 13. Output third-orde r intercept point over temperatu re and supply voltages

Typical values.

Symbol Parameter Conditions Tamb (C) Unit

40 +25 +85

IP3Ooutput third-order intercept point f1=250MHz;

f2=251MHz;

Pdrive =41 dBm

VCC =4.5 V 21 21 20 dBm

VCC =5.0V 23 23 22 dBm

VCC =5.5V 25 25 24 dBm

f1=950MHz;

f2=951MHz;

Pdrive =41 dBm

VCC =4.5 V 21 21 20 dBm

VCC =5.0V 23 23 22 dBm

VCC =5.5V 25 24 23 dBm

f1=2150MHz;

f2=2151MHz;

Pdrive =41 dBm

VCC =4.5 V 21 19 17 dBm

VCC =5.0V 22 19 17 dBm

VCC =5.5V 22 20 17 dBm

Table 14. 3 dB bandwidth over temperature and supply voltages

Typical values.

Symbol Parameter Conditions Tamb (C) Unit

40 +25 +85

B3dB 3 dB bandwidth VCC = 4.5 V 3.15 2.98 2.80 GHz

VCC = 5.0 V 3.14 2.96 2.79 GHz

VCC = 5.5 V 3.12 2.95 2.77 GHz

Product data sheet Rev. 2 — 26 August 2013 8 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

9. Test information

[1] For decoupling a decoupling capacitor (Cdec) is used on one of the positions of P5 to P24. The results

mentioned in this data sheet have been obtained using the decoupling capacitor Cdec on position P22.

For decoupling a decoupling capacitor (Cdec) is used on one of the positions of P5 to P24. The

results mentioned in this data sheet have been obtained using the decoupling capacitor Cdec on

position P22. The distance between the center of pin 1 and the center of position P22 is 7.43 mm.

Fig 4. PCB layout and demo board with compo nents

Table 15. List of components used for the typical application

Component Description Value Dimensions Remarks

C1, C2 multilayer ceramic chip

capacitor 470 pF 0603 X7R RF coupling capacitor

P5 to P24 [1] position for multilayer

ceramic chip capacitor Cdec

470 pF 0603 X7R RF decoupling capacitor

IC1 BGA2869 MMIC - SOT363

DDD

3

3

3

3

3

3

3

3

3

3

3

5),1 5)287

3

3

3

3

3

3

3

3

3

*1'

9&&

*1'

&

&



6(0,&21'8&7256

%*$[[[627(9%

Product data sheet Rev. 2 — 26 August 2013 9 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

10. Package outline

Fig 5. Package outline SOT363

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT363 SC-88

wBM

pin 1

index A

detail X

vMA

0 1 2 mm

scale

132

456

Plastic surface-mounted package; 6 leads SOT363

UNIT A1

max bpcDEe1HELpQywv

mm 0.1 0.30

0.20 2.2

1.8

0.25

0.10 1.35

1.15 0.65

1.3 2.2

2.0 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15 0.25

0.15

1.1

0.8

04-11-08

06-03-16

Product data sheet Rev. 2 — 26 August 2013 10 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

11. Abbreviations

12. Revision history

Table 16. Abbreviations

Acronym Description

IF Intermediate Frequency

LNA Low-Noise Amplifier

LNB Low-Noise Block converter

PCB Printed-Circuit Board

SMD Surface Mounted Device

Table 17. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BGA2869 v.2 20130826 Product data sheet - BGA2869 v.1

Modifications: •Table 4 on page 2: the maximum value for VCC has been changed to 7 V

BGA2869 v.1 20120717 Product data sheet - -

Product data sheet Rev. 2 — 26 August 2013 11 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect , incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 26 August 2013 12 of 13

NXP Semiconductors BGA2869

MMIC wideband amplifier

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automotive use. It i s neit her qua lified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BGA2869

MMIC wideband amplifier

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 26 August 2013

Document identifier: BGA2869

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2

8 Application information. . . . . . . . . . . . . . . . . . . 4

8.1 Application examples . . . . . . . . . . . . . . . . . . . . 4

8.2 Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

9 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8

10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

11 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

14 Contact information. . . . . . . . . . . . . . . . . . . . . 12

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13