HLMP-D150, HLMP-D155, HLMP-K150 and HLMP-K155
T-13/4 (5 mm), T-1 (3 mm), Low Current, Double Heterojunction
AlGaAs Red LED Lamps
Data Sheet
x Minimum luminous intensity specified at 1 mA
x High light output at low currents
x Wide viewing angle
x Outstanding material efficiency
x Low power/low forward voltage
x CMOS/MOS compatible
x TTL compatible
x Deep red color
x Low power circuits
x Battery powered equipment
x Telecommunication indicators
These solid state LED lamps utilize double heterojunction
(DH) AlGaAs/GaAs material technology. This LED material
has outstanding light output efficiency at very low drive
currents. The color is deep red at the dominant wave-
length of 637 nanometres. These lamps are ideally suited
for use in applications where high light output is required
with minimum power output.
1.14 (0.045)
0.51 (0.020)
3.43 (0.135)
2.92 (0.115)
4.70 (0.185)
4.19 (0.165)
3.17 (0.125)
2.67 (0.105)
2.79 (0.110)
2.29 (0.090)
1.52 (0.060)
1.02 (0.040)
6.35 (0.250)
5.58 (0.220)
0.55 (0.022)
0.40 (0.016)
0.65 (0.026) MAX.
Package Dimensions
Selection Guide
Luminous Intensity
Iv (mcd) at 1 mA
Package Description Device HLMP- Min. Typ. Max.
T-1 3/4 Red Tinted Diffused D150 1.3 3.0 65 A
D150-C00xx 1.3 3.0 65 A
D150-CD0xx 1.3 3.0 4.2 65 A
T-1 3/4 Red Untinted Non-diffused D155 5.4 10.0 24 B
D155-F00xx 5.4 10.0 24 B
T-1 Red Tinted Diffused K150 1.3 2.0 60 C
K150-C00xx 1.3 2.0 60 C
K150-CD0xx 1.3 3.0 4.2 60 C
T-1 Red Untinted Non-diffused K155 2.1 3.0 45 C
K155-CD0xx 1.3 3.0 4.2 45 C
K155-D00xx 2.1 3.0 45 C
K155-DE0xx 2.1 3.0 6.8 45 C
1. θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value.
Part Numbering System
HLMP - x 1 xx - x x x xx
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1, B1: Right Angle Housing, Uneven Leads
A2, B2: Right Angle Housing, Even Leads
DD, DH: Ammo Pack
Color Bin Options
0: Full color bin distribution
Maximum Iv Bin Options
0: Open (No max. limit)
Others: Please refer to the Iv bin table
Minimum Iv Bin Options
Please refer to the Iv bin table
Lens Option
50: Tinted, Diffused
55: Untinted, Nondiffused
Package Options
D: T-13/4 (5 mm)
K: T-1 (3 mm)
Absolute Maximum Ratings at TA = 25°C
Parameter Value
Peak Forward Current[1] 300 mA
Average Forward Current 20 mA
DC Current[2] 30 mA
Power Dissipation 87 mW
Reverse Voltage (IR = 100 μA) 5 V
Transient Forward Current (10 μs Pulse)[3] 500 mA
LED Junction Temperature 110°C
Operating Temperature Range -20 to +100°C
Storage Temperature Range -40 to +100°C
1. Maximum IPEAK at f = 1 kHz, DF = 6.7%.
2. Derate linearly as shown in Figure 4.
3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
Electrical/Optical Characteristics at TA = 25°C
Symbol Description Min. Typ. Max. Unit Test Condition
VF Forward Voltage 1.6 1.8 V IF = 1 mA
VR Reverse Breakdown Voltage 5.0 15.0 V IR = 100 μA
λp Peak Wavelength 645 nm Measurement at Peak
λd Dominant Wavelength 637 nm Note 1
2 Spectral Line Halfwidth 20 nm Wavelength width at spectral
distribution 1/2 power point.
τS Speed of Response 30 ns Exponential Time Constant, e-t/TS
C Capacitance 30 pF VF = 0, f = 1 MHz
J-PIN Thermal Resistance 260[3]
°C/W Junction to Cathode Lead
ηV Luminous Efficacy 80 Im/W Note 2
1. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the color of the device.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = lVV, where IV is the luminous intensity in candelas and ηV is
luminous efficacy in lumens/watt.
3. HLMP-D150.
4. HLMP-D155.
5. HLMP-K150/-K155.
Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Maximum forward dc current vs. ambient temperature.
Derating based on TJ Max. = 110 °C.
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage.
Figure 5. Relative luminous intensity vs. angular displacement.
Figure 6. Relative luminous intensity vs. angular displacement.
Figure 7. Relative luminous intensity vs. angular displacement.
Figure 8. Relative luminous intensity vs. angular displacement.
Intensity Bin Limits
Intensity Range (mcd)
Color Bin Min. Max.
Red C 1.5 2.4
D 2.4 3.8
E 3.8 6.1
F 6.1 9.7
G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Note: Maximum tolerance for each bin limit is r 18%.
Mechanical Option Matrix
Mechanical Option Code Definition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1
02 Tape & Reel, straight leads, minimum increment 1300 pcs for T-13/4, 1800 pcs for T-1
A1 T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2 T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag
B1 T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2 T-13/4, Right Angle Housing, even leads, minimum increment 500 pcs/bag
DD Ammo Pack, straight leads with minimum 2K increment
DH Ammo Pack, straight leads with minimum 2K increment
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
x Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
x LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering irons tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x Recommended soldering condition:
Wave Manual Solder
Soldering[1],[2] Dipping
Pre-heat Temperature 105°C Max.
Pre-heat Time 60 sec Max.
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.45 x 0.45 mm 0.636 mm 0.98 to 1.08 mm
(0.018 x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
x Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
x Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
x Recommended PC board plated through holes (PTH)
size for LED component leads.
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
1.59 mm
Example of Wave Soldering Temperature Profile for TH LED
0 10 20 30 40 50 60 70 80 90 100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
'HSW,' 0DGH,Q&RXQWU\RI2ULJLQ
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes 5898-4249EN
AV02-1562EN - March 24, 2010
(ii) Avago Baby Label (Only available on bulk packaging)