CY74FCT162H952ATPACT - Texas Instruments

16-Bit Registered Transceivers

CY74FCT16952T

CY74FCT162952T

CY74FCT162H952T

Data sheet acquired from Cypress Semiconductor Corporation.

Data sheet modiﬁed to remove devices not offered.

SCCS065C - August 1994 - Revised September 2001

1CY74FCT162H952

Features

•I

off supports partial-power-down mode operation

•Edge-rate control circuitry for signiﬁcantly improved

noise characteristics

•Typical output skew < 250 ps

•ESD > 2000V

•TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)

packages

•Industrial temperature range of –40˚C to +85˚C

•VCC = 5V ± 10%

CY74FCT16952T Features:

•64 mA sink current, 32 mA source current

• Typical VOLP (ground bounce) <1.0V at

VCC = 5V, TA = 25˚C

CY74FCT162952T Features:

•Balanced 24 mA output drivers

•Reduced system switching noise

• Typical VOLP (ground bounce) <0.6V at

VCC = 5V, TA= 25˚C

CY74FCT162H952T Features:

•Bus hold retains last active state

•Eliminates the need for external pull-up or pull-down

resistors

Functional Description

These 16-bit registered transceivers are high-speed,

low-power devices. 16-bit operation is achieved by connecting

the control lines of the two 8-bit registered transceivers

together. For data ﬂow from bus A-to-B, CEAB must be LOW

to allow data to be stored when CLKAB transitions from

LOW-to-HIGH. The stored data will be present on the output

when OEAB is LOW. Control of data from B-to-A is similar and

is controlled by using the CEBA, CLKBA, and OEBA inputs.

This device is fully speciﬁed for partial-power-down

applications using Ioff. The Ioff circuitry disables the outputs,

preventing damaging current backﬂow through the device

when it is powered down.

The CY74FCT16952T is ideally suited for driving

high-capacitance loads and low-impedance backplanes.

The CY74FCT162952T has 24-mA balanced output drivers

with current-limiting resistors in the outputs. This reduces the

need for external terminating resistors and provides for

minimal undershoot and reduced ground bounce. The

CY74FCT162952T is ideal for driving transmission lines.

TheCY74FCT162H952Tisa24-mAbalancedoutputpartthat

has “bus hold” on the data inputs. The device retains the

input’s last state whenever the input goes to high impedance.

This eliminates the need for pull-up/down resistors and

prevents ﬂoating inputs.

LogicBlockDiagrams Pin Configuration

1OEAB

SSOP/TSSOP

Top View

1CLKBA

1B1

1B2

GND

VCC

GND

FCT16952–1

1B1

TO 7 OTHER CHANNELS

1CEBA

1OEAB

1CEAB

1CLKAB

1OEBA

1A1

1CEAB

1CLKAB

GND

1A1

1A2

1A3

1A4

GND

2A1

2A2

2A3

2A4

VCC

1A5

1A6

1A7

1A8

GND

2A5

2A6

2A7

2A8

2CLKAB

GND

2OEAB

2CEAB

VCC

1OEBA

1CEBA

1CLKBA

GND

2CLKBA

2OEBA

2CEBA

1B3

1B6

1B7

1B8

1B4

1B5

2B1

2B3

2B4

2B2

2B5

2B6

2B7

2B8

VCC

2CLKBA

2B1

2OEAB

2CEAB

2CLKAB

2OEBA

2A1

2CEBA

FCT16952–2

FCT16952–3

TO 7 OTHER CHANNELS

CY74FCT16952T

CY74FCT162952T

CY74FCT162H952T

Maximum Ratings[5, 6]

(Above which the useful life may be impaired. For user

guidelines, not tested.)

Storage Temperature .................................–55°C to +125°C

Ambient Temperature with

Power Applied.............................................–55°C to +125°C

DC Input Voltage ........................................... –0.5V to +7.0V

DC Output Voltage......................................... –0.5V to +7.0V

DC Output Current

(Maximum Sink Current/Pin) ........................–60 to +120 mA

Power Dissipation..........................................................1.0W

Static Discharge Voltage............................................>2001V

(per MIL-STD-883, Method 3015)

Notes:

1. On the CY74FCT162H952T these pins have bus hold.

2. A-to-B data ﬂow is shown: B-to-A data ﬂow is similar but uses, CEBA, CLKBA, and OEBA.

3. H = HIGH Voltage Level.

L = LOW Voltage Level.

X = Don’t Care.

= LOW-to-HIGH Transition.

Z = HIGH Impedance.

4. Level of B before the indicated steady-state input conditions were established.

5. Operationbeyondthelimits setforthmayimpairthe usefullifeofthedevice.Unlessotherwisenoted,theselimits areovertheoperatingfree-airtemperaturerange.

6. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.

Pin Description

Name Description

OEAB A-to-B Output Enable Input (Active LOW)

OEBA B-to-A Output Enable Input (Active LOW)

CEAB A-to-B Clock Enable Input (Active LOW)

CEBA B-to-A Clock Enable Input (Active LOW)

CLKAB A-to-B Clock Input

CLKBA B-to-A Clock Input

A A-to-B Data Inputs or B-to-A Three-State

Outputs[1]

B B-to-A Data Inputs or A-to-B Three-State

Outputs[1]

Function Table[2, 3]

For A-to-B (Symmetric with B-to-A)

Inputs Outputs

CEAB CLKAB OEAB A B

H X L X B[4]

X L L X B[4]

L L L L

L L H H

X X H X Z

Operating Range

Range Ambient

Temperature VCC

Industrial –40°C to +85°C 5V ± 10%

CY74FCT16952T

CY74FCT162952T

CY74FCT162H952T

Note:

7. Typical values are at VCC= 5.0V, TA= +25˚C ambient.

8. This parameter is speciﬁed but not tested.

9. Pins with bus hold are described in the Pin Description.

10. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample

and hold techniques are preferable in order to minimize internal chip heating and more accurately reﬂect operational values. Otherwise prolonged shorting of a

high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests,

IOS tests should be performed last.

11. Tested at +25˚C.

Electrical Characteristics Over the Operating Range

Parameter Description Test Conditions Min. Typ.[7] Max. Unit

VIH Input HIGH Voltage 2.0 V

VIL Input LOW Voltage 0.8 V

VHInput Hysteresis[8] 100 mV

VIK Input Clamp Diode Voltage VCC=Min., IIN= –18 mA –0.7 –1.2 V

IIH Input HIGH Current Standard VCC=Max., VI=VCC ±1µA

Bus Hold ±100

IIL Input LOW Current Standard VCC=Max., VI=GND ±1µA

Bus Hold ±100 µA

IBBH

IBBL Bus Hold Sustain Current on Bus Hold Input[9] VCC=Min. VI=2.0V –50 µA

VI=0.8V +50 µA

IBHHO

IBHLO BusHold OverdriveCurrenton BusHoldInput[9] VCC=Max., VI=1.5V TBD mA

IOZH High Impedance Output Current (Three-State

Output pins) VCC=Max., VOUT=2.7V ±1µA

IOZL High Impedance Output Current (Three-State

Output pins) VCC=Max., VOUT=0.5V ±1µA

IOS Short Circuit Current[10] VCC=Max., VOUT=GND –80 –140 –200 mA

IOOutput Drive Current[10] VCC=Max., VOUT=2.5V –50 –180 mA

IOFF Power-Off Disable VCC=0V, VOUT≤4.5V[11] ±1µA

Output Drive Characteristics for CY74FCT16952T

Parameter Description Test Conditions Min. Typ.[7] Max. Unit

VOH Output HIGH Voltage VCC=Min., IOH= –3 mA 2.5 3.5 V

VCC=Min., IOH= –15 mA 2.4 3.5 V

VCC=Min., IOH= –32 mA 2.0 3.0 V

VOL Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V

Output Drive Characteristics for CY74FCT162952T, CY74FCT162H952T

Parameter Description Test Conditions Min. Typ.[7] Max. Unit

IODL Output LOW Current[10] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA

IODH Output HIGH Current[10] VCC=5V, VIN=VIH or VIL, VOUT=1.5V –60 –115 –150 mA

VOH Output HIGH Voltage VCC=Min., IOH= –24 mA 2.4 3.3 V

VOL Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V

Capacitance[8] (TA = +25˚C, f = 1.0 MHz)

Parameter Description Test Conditions Typ.[7] Max. Unit

CIN Input Capacitance VIN = 0V 4.5 6.0 pF

COUT Output Capacitance VOUT = 0V 5.5 8.0 pF

CY74FCT16952T

CY74FCT162952T

CY74FCT162H952T

Power Supply Characteristics

Parameter Description Test Conditions[12] Typ.[7] Max. Unit

ICC QuiescentPowerSupply Current VCC=Max. VIN<0.2V

VIN>VCC–0.2V 5 500 µA

∆ICC QuiescentPowerSupply Current

(TTL inputs HIGH) VCC=Max. VIN=3.4V[13] 0.5 1.5 mA

ICCD Dynamic Power Supply

Current[14] VCC=Max., One Input Toggling,

50%DutyCycle,OutputsOpen,

OEAB or OEBA=GND

VIN=VCC or

VIN=GND 75 120 µA/MHz

ICTotal Power Supply Current[15] VCC=Max., F1=5 MHz,

F0= 10 MHz (CLKAB)

OEAB = CEAB = GND

OEBA = VCC 50% Duty Cycle,

Outputs Open, One Bit Toggling

VIN=VCC or

VIN=GND 0.8 1.7 mA

VIN=3.4V or

VIN=GND 1.3 3.2

VCC=Max.,f0=10MHz (CLKAB)

f1=2.5 MHz,

OEAB = CEAB = GND

OEBA = VCC 50% Duty Cycle,

Outputs Open,

Sixteen Bit Toggling

VIN=VCC or

VIN=GND 3.8 6.5[16]

VIN=3.4V or

VIN=GND 8.3 20.0[16]

Notes:

12. For conditions shown as Max. or Min., use appropriate value speciﬁed under Electrical Characteristics for the applicable device type.

13. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.

14. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.

15. IC=I

QUIESCENT + IINPUTS + IDYNAMIC

IC=I

CC+∆ICCDHNT+ICCD(f0/2 + f1N1)

ICC = Quiescent Current with CMOS input levels

∆ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)

DH= Duty Cycle for TTL inputs HIGH

NT= Number of TTL inputs at DH

ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)

f0= Clock frequency for registered devices, otherwise zero

f1= Input signal frequency

N1= Number of inputs changing at f1

All currents are in milliamps and all frequencies are in megahertz.

16. Values for these conditions are examples of the ICC formula. These limits are speciﬁed but not tested.

CY74FCT16952T

CY74FCT162952T

CY74FCT162H952T

Switching Characteristics Over the Operating Range[17]

CY74FCT16952AT

CY74FCT162952AT

CY74FCT162H952AT CY74FCT162952BT

Parameter Description Min. Max. Min. Max. Unit Fig. No.[18]

tPLH

tPHL Propagation Delay

CLKAB, CLKBA to B, A 2.0 10.0 2.0 7.5 ns 1, 5

tPZH

tPZL Output Enable Time

OEBA, OEAB to A, B 1.5 10.5 1.5 8.0 ns 1, 7, 8

tPHZ

tPLZ Output Disable Time

OEBA, OEAB to A, B 1.5 10.0 1.5 7.5 ns 1, 7, 8

tSU Set-Up Time, HIGH or LOW

A, B to CLKAB, CLKBA 2.5 — 2.5 — ns 4

tHHold Time, HIGH or LOW

A, B to CLKAB, CLKBA 2.0 — 1.5 — ns 4

tSU Set-Up Time, HIGH or LOW

CEAB, CEBA to CLKAB, CLKBA 3.0 — 3.0 — ns 4

tHHold Time, HIGH or LOW

CEAB, CEBA to CLKAB, CLKBA 2.0 — 2.0 — ns 4

tWPulse Width HIGH or LOW

CLKAB or CLKBA[19] 3.0 — 3.0 — ns 5

tSK(O) Output Skew[20] — 0.5 — 0.5 ns —

CY74FCT16952CT

CY74FCT162H952CT

Parameter Description Min. Max. Unit Fig. No.[18]

tPLH

tPHL Propagation Delay

CLKAB, CLKBA to B, A 2.0 6.3 ns 1, 5

tPZH

tPZL Output Enable Time

OEBA, OEAB to A, B 1.5 7.0 ns 1, 7, 8

tPHZ

tPLZ Output Disable Time

OEBA, OEAB to A, B 1.5 6.5 ns 1, 7, 8

tSU Set-Up Time, HIGH or LOW

A, B to CLKAB, CLKBA 2.5 — ns 4

tHHold Time, HIGH or LOW

A, B to CLKAB, CLKBA 1.5 — ns 4

tSU Set-Up Time, HIGH or LOW

CEAB, CEBA to CLKAB, CLKBA 3.0 — ns 4

tHHold Time, HIGH or LOW

CEAB, CEBA to CLKAB, CLKBA 2.0 — ns 4

tWPulse Width HIGH or LOW

CLKAB or CLKBA[19] 3.0 — ns 5

tSK(O) Output Skew[20] — 0.5 ns —

Notes:

17. Minimum limits are speciﬁed but not tested on Propagation Delays.

18. See “Parameter Measurement Information” in the General Information section.

19. This parameter is speciﬁed but not tested.

20. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.

CY74FCT16952T

CY74FCT162952T

CY74FCT162H952T

Ordering Information CY74FCT16952

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

6.3 CY74FCT16952CTPACT Z56 56-Lead (240-Mil) TSSOP Industrial

10.0 CY74FCT16952ATPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial

Ordering Information CY74FCT162952

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

7.5 CY74FCT162952BTPVC O56 56-Lead (300-Mil) SSOP Industrial

74FCT162952BTPVCT O56 56-Lead (300-Mil) SSOP

10.0 74FCT162952ATPACT Z56 56-Lead (240-Mil) TSSOP Industrial

Ordering Information CY74FCT162H952

Speed

(ns) Ordering Code Package

Name Package Type Operating

Range

6.3 74FCT162H952CTPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial

10.0 74FCT162H952ATPACT Z56 56-Lead (240-Mil) TSSOP Industrial

CY74FCT16952T

CY74FCT162952T

CY74FCT162H952T

Package Diagrams

56-Lead Shrunk Small Outline Package O56

56-Lead Thin Shrunk Small Outline Package Z56

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty . Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

in which TI products or services are used. Information published by TI regarding third–party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Mailing Address:

Texas Instruments

Post Office Box 655303

Dallas, Texas 75265