1PTS240-636GGHS - Advanced Interconnections Corp.

5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com

REV. 8/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).

True BGA Socket™ Features

• No soldering of BGA device required.

• AIC exclusive eutectic solder ball

terminals offer superior processing.

• Uses same footprint as BGA device.

• Designed for production, develop-

ment, programming and test applica-

tions.

• Compact design maximizes PCB real

estate:

TSG = Device Pkg. Size + 0.216/(5.5mm)

TSH = Device Pkg. Size + 0.374/(9.5mm)

• Available with integral, finned heat

sink or coin screw clamp assembly.

• Currently available in 1.0 and

1.27mm pitch.

• New Short Slide Clamp reduces

required installation space on PCB.

Specifications

Terminals: Brass; Copper Alloy

(C36000)

Terminal Support: Polyimide Film

Contacts: Beryllium Copper (C17200)

Plating: G – Gold over Nickel

Spring Material: Beryllium Copper

Clamp Assembly: Aluminum

(Heat Sink/Coin Screw, Clamp, Support Plate)

Insulator Material:

Molded PPS (High Temp. Glass Filled

Thermoplastic), U.L. Rated 94V-O,

-60°C to 260°C (-76°F to 500°F)

Solder Ball:

Eutectic, 63Sn/37Pb,183°C (361°F)

True BGA Socket™

Ball Grid Array Sockets

Type -690

Surface Mount Type -708

Thru-Hole

Standard Terminals

for Test, Development and Production Applications

.183

(4.65)

.125

(3.18)

.018 Dia.

(0.46)

.183

(4.65)

.030 Dia.

(0.76)

Type -712 Type -713

Terminals for LGA or

De-balled BGA Device Applications

.030 Dia.

(0.76)

.193

(4.90)

.193

(4.90)

.125

(3.18)

.018 Dia.

(0.46)

Type -657 Type -709

Type -659

Terminals for BGA Device Test Applications

(Consult Factory for Availability)

.183

(4.65)

.125

(3.18)

.018 Dia.

(0.46)

.183

(4.65)

.125

(3.18)

.016 Dia.

(0.41)

.030 Dia.

(0.76)

.183

(4.65)

How It Works

Step 1

• Solder True BGA Socket™ to PCB

Step 2

• Align and place BGA device on top

of True BGA Socket mating con-

tacts. Place Chip Support Plate

over BGA device.

Step 3

• Slide Clamp over assembly. Allow

space on PCB for sliding clamp

[approximately 33% of device

package size on one side only with

new Short Slide Clamp]. Refer to

Clamp Sliding Directions for pin 1

location (see page 4).

Step 4

• Tighten Coin Screw or Finned Heat

Sink to engage compression stroke.

Support Plate

BGA Device

Solder Ball

Reflowed

P.C.B.

ADVANCED®

Compression

Stroke (Step 4)

Polyimide

Wafer

Guide Box

Heat Sink Clamp Coin Screw

or Finned

Heat Sink

P.C.B.

ADVANCED®

BGA

How To Order

Number of Positions

*See BGA Footprint Booklet

or web site

X TS G XXXX - 690 G G XX

True BGA Socket™

Pitch

G = .050/(1.27mm) pitch

H = .039/(1.0mm) pitch

Terminal Plating

G - Gold

Contact Plating

G - Gold

Clamp Options

YH - Heat Sink (3 Fins Std.)

YC - Coin Screw

Terminal Type

See options above

Footprint Dash #

If Applicable*

1.27mm Pitch Terminal Options

Support Plate

Not Shown

Mechanical specifications for BGA device package required for quoting/ordering.

PATENTED

.024/(0.61) Dia.

.162

(4.11)

.125

(3.18)

.011 Dia.

(0.28)

Type -752

Surface Mount

Type -754

Thru-Hole

1.0mm Pitch Terminals

for Test, Development and Production Applications

.162

(4.11)

5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com

REV. 8/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).

Patented Pop-Top® Action

Finned

Heat Sink

(3 Fins Std.

Consult

Factory

for Options)

Solder

Joint

Solder Ball

.050

(1.27)

BGA

Adapter

Socket

Pop-Top® BGA

Socket Adapter System

Pop-Top® System Features

• Designed for large I/O BGA devices.

• Patented limited-stroke terminal

design allows ultra low insertion and

extraction.

• AIC patented eutectic solder ball

terminals offer superior processing.

• Compact design maximizes PCB real

estate – only 0.139/(3.52mm) nomi-

nal wider than BGA device body size

on clip side.

• Uses same footprint as BGA device.

• Currently available in .050/(1.27mm)

pitch.

• Available with integral, finned heat

sink or coin screw.

Specifications

Terminals: Brass; Copper Alloy

(C36000), ASTM-B-16

Contacts: Beryllium Copper; Copper

Alloy (C17200), ASTM-B-194

Plating: G – Gold over Nickel

Body Material:

Molded PPS (High Temp. Glass Filled

Thermoplastic), U.L. Rated 94V-O,

-60°C to 260°C (-76°F to 500°F)

Solder Ball:

Eutectic, 63Sn/37Pb, 183°C (361.4°F)

How It Works

Step 1

• Solder BGA Socket to PCB.

Step 2

• Solder BGA device to

Adapter.

Step 3

• Align and insert device/

Adapter assembly into BGA

Socket.

Step 4

• Slide Retention Clamp over

entire assembly.

• Turn Coin Screw (CS) or

Number of Positions

*See BGA Footprint Booklet or web site

X PTS XXXX - 636 G G HS

Terminal Plating

G - Gold

Contact Plating

G - Gold

Clamp Options

HS - Heat Sink (3 Fins Std.)

CS - Coin Screw

QH - Heat Sink w/ Support Plate

QS - Coin Screw w/ Support Plate

1.27mm Pitch Terminal Type

Footprint Dash #

If Applicable*

Model Type

PTS = Pop-Top w/ Short Slide clamp

NEW Short Slide Clamp Retention Clamp Sliding

For High Density PC Boards Direction For Pop-Top®

(Also Standard On True BGA Socket™) and True BGA Socket™

• Reduces required installation

space (clearance for sliding

clamp) by 50 to 75%

How To Order

2. After travel & lock down with

screw or heat sink to point B

1. "Zero" Insertion

to point A

Travel

Finned Heat Sink (HS) to engage Adapter into Socket and lock down

ADVANCED

Pin 1 indicator always

shown in lower left

corner on Advanced

footprint drawings.*

Retention Clamp

slides to mechanical

stop on socket.

SLIDE ON SLIDE OFF

*Refer to BGA Footprints Booklet

or AIC Web Site for drawings

ADVANCED

Clearance needed approx.

33% of device package size

on one side only

Mechanical specifications for BGA device package required for quoting/ordering.

5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com

REV. 8/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).