1
FN7288.4
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
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EL7457
40MHz Non-Inverting Quad CMOS Driver
The EL7457 is a high speed, non-inverting, quad CMOS
driver. It is capable of running at clock rates up to 40MHz
and features 2A peak drive capability and a nominal
on-resistance of just 3Ω. The EL7457 is ideal for driving
highly capacitive loads, such as storage and vertical clocks
in CCD applications. It is also well suited to ATE pin driving,
level-shifting, and clock-driving applications.
The EL7457 is capable of running from single or dual power
supplies while using ground referenced inputs. Each output
can be switched to either the high (VH) or low (VL) supply
pins, depending on the related input pin. The inputs are
compatible with both 3V and 5V CMOS and TTL logic. The
output enable (OE) pin can be used to put the outputs into a
high-impedance state. This is especially useful in CCD
applications, where the dr iver should be disabled during
power down.
The EL7457 also features very fast rise and fall times which
are matched to within 1ns. The propagation delay is also
matched between rising and fallin g edges to within 2ns.
The EL7457 is availa ble in 16-pin QSOP, 16-pin SO
(0.150"), and 16-pin QFN packages. All are specified for
operation over the full -40°C to +85°C temper ature range.
Pinouts
Features
Clocking speeds up to 40MHz
4 channels
12ns tR/tF at 1000pF CLOAD
1ns rise and fall time match
1.5ns prop delay match
Low quie scent current - <1mA
Fast output enable functio n - 12ns
Wide output voltage range
•8V VL -5V
•-2V VH 16.5V
2A peak drive
•3Ω on resistance
Input level shifters
TTL/CMOS input-compatible
Pb-free (RoHS compliant)
Applications
CCD drivers
Digital cameras
Pin drivers
Clock/line drivers
Ultrasound transducer drivers
Ultrasonic and RF generators
Level shifting
1
2
3
4
16
15
14
13
5
6
7
12
11
10
8 9
1
2
3
4
12
11
10
9
5
6
7
8
16
15
14
13
INB
VL
VL
GND
INC
IND
VS-
OUTD
OE
INA
VS+
OUTA
OUTB
VH
VH
OUTC
THERMAL
PAD*
INA
OE
INB
VL
GND
NC
INC
IND
VS+
OUTA
OUTB
NC
VH
OUTC
OUTD
VS-
EL7457
[16-PIN SO (0.150”),
QSOP (0.150”)]
TOP VIEW
EL7457
[16-PIN QFN (4X4MM)]
TOP VIEW
* THERMAL PAD CONNECTED
TO PIN 7 (VS-)
Data Sheet January 26, 2012
2FN7288.4
January 26, 2012
Ordering Information
PART NUMBER
(Notes 2, 3) PART
MARKING TEMP.
RANGE (°C) PACKAGE
(Pb-free) PKG.
DWG. #
EL7457CUZ 7457CUZ -40°C to +85°C 16 Ld QSOP (0.150”) MDP0040
EL7457CUZ-T13 (Note 1) 7457CUZ -40°C to +85°C 16 Ld QSOP (0.150”) MDP0040
EL7457CUZ-T7 (Note 1) 7457CUZ -40°C to +85°C 16 Ld QSOP (0.150”) MDP0040
EL7457CUZ-T7A (Note 1) 7457CUZ -40°C to +85°C 16 Ld QSOP (0.150”) MDP0040
EL7457CSZ EL7457CSZ -40°C to +85°C 16 Ld SO (0.150”) MDP0027
EL7457CSZ-T13 (Note 1) EL7457CSZ -40°C to +85°C 16 Ld SO (0.150”) MDP0027
EL7457CSZ-T7 (Note 1) EL7457CSZ -40°C to +85°C 16 Ld SO (0.150”) MDP0027
EL7457CSZ-T7A (Note 1) EL7457CSZ -40°C to +85°C 16 Ld SO (0.150”) MDP0027
EL7457CLZ 7457CLZ -40°C to +85°C 16 Ld QFN (4x4mm) L16.4X4H
EL7457CLZ-T13 (Note 1) 7457CLZ -40°C to +85°C 16 Ld QFN (4x4mm) L16.4X4H
EL7457CLZ-T7 (Note 1) 7457CLZ -40°C to +85°C 16 Ld QFN (4x4mm) L16.4X4H
EL7457CLZ-T7A (Note 1) 7457CLZ -40°C to +85°C 16 Ld QFN (4x4mm) L16.4X4H
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. Th ese Intersil Pb-free pla stic packaged pr oducts emplo y special Pb-free mat erial sets, mo lding compounds/di e attach mater ials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for EL7457. For more information on MSL please see tech brief TB363.
EL7457
3FN7288.4
January 26, 2012
Absolute Maximum Ratings (TA = 25°C) Thermal Information
Supply Voltage (VS+ to VS-) . . . . . . . . . . . . . . . . . . . . . . . . . . .+18V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . .VS- -0.3V, VS+ +0.3V
Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Thermal Resistance θJA (°C/W) θJC (°C/W)
16 Ld QFN (Notes 4, 5) . . . . . . . . . . . . 43 5
16 Ld SOIC (Notes 6, 7). . . . . . . . . . . . 73 45
16 Ld QSOP (Note 6). . . . . . . . . . . . . . 112 N/A
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . .+125°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
7. For θJC, the “case temp” location is taken at the package top center.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications VS+ = +5V, VS- = -5V, VH = +5V, VL = -5V, TA = 25°C, unless otherwise specified.
PARAMETER DESCRIPTION CONDITION MIN
(Note 8) TYP MAX
(Note 8) UNIT
INPUT
VIH Logic “1” Input Voltage 2.0 V
IIH Logic “1” Input Current VIH = 5V 0.1 10 µA
VIL Logic “0” Input Voltage 0.8 V
IIL Logic “0” Input Current VIL = 0V 0.1 10 µA
CIN Input Capacitance 3.5 pF
RIN Input Resistance 50 MΩ
OUTPUT
ROH ON Resistance VH to OUTx IOUT = -100mA 4.5 6 Ω
ROL ON Resistance VL to OUTx IOUT = +100mA 4 6 Ω
ILEAK Output Leakage Current VH = VS+, VL = VS-0.110µA
IPK Peak Output Current Source 2.0 A
Sink 2.0 A
POWER SUPPLY
ISPower Supply Current Inputs = VS+0.51.5mA
SWITCHING CHARACTERISTICS
tRRise Time CL = 1000pF 13.5 ns
tFFall Time CL = 1000pF 13 ns
tRFΔtR, tF Mismatch CL = 1000pF 0.5 ns
tD+ Turn-Off Delay Time CL = 1000pF 12.5 ns
tD- Turn-On Delay Time CL = 1000pF 14.5 ns
tDD tD-1 - tD-2 Mismatch CL = 1000pF 2 ns
tENABLE Enable Delay Time 12 ns
EL7457
4FN7288.4
January 26, 2012
tDISABLE Disable Delay Time 12 ns
Electrical Specifications VS+ = +5V, VS- = -5V, VH = +5V, VL = -5V, TA = 25°C, unless otherwise specified.
PARAMETER DESCRIPTION CONDITION MIN
(Note 8) TYP MAX
(Note 8) UNIT
Electrical Specifications VS+ = +15V, VS- = 0V, VH = +15V, VL = 0V, TA = 25°C, unless otherwise specified
PARAMETER DESCRIPTION CONDITION MIN
(Note 8) TYP MAX
(Note 8) UNIT
INPUT
VIH Logic “1” Input Voltage 2.4 V
IIH Logic “1” Input Current VIH = 5V 0.1 10 µA
VIL Logic “0” Input Voltage 0.8 V
IIL Logic “0” Input Current VIL = 0V 0.1 10 µA
CIN Input Capacitance 3.5 pF
RIN Input Resistance 50 MΩ
OUTPUT
ROH ON Resistance VH to OUT IOUT = -100mA 3.5 5 Ω
ROL ON Resistance VL to OUT IOUT = +100mA 3 5 Ω
ILEAK Output Leakage Current VH = VS+, VL = VS-0.110µA
IPK Peak Output Current Source 2.0 A
Sink 2.0 A
POWER SUPPLY
ISPower Supply Current Inputs = VS+0.82mA
SWITCHING CHARACTERISTICS
tRRise Time CL = 1000pF 11 ns
tFFall Time CL = 1000pF 12 ns
tRFΔtR, tF Mismatch CL = 1000pF 1 ns
tD+ Turn-Off Delay Time CL = 1000pF 11.5 ns
tD- Turn-On Delay Time CL = 1000pF 13 ns
tDD tD-1 - tD-2 Mismatch CL = 1000pF 1.5 ns
tENABLE Enable Delay Time 12 ns
tDISABLE Disable Delay Time 12 ns
NOTE:
8. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
EL7457
5FN7288.4
January 26, 2012
Typical Performance Curves
FIGURE 1. SWITCH THRESHOLD vs SUPPLY VOLTAGE FIGURE 2. QUIESCENT SUPPLY CURRENT vs SUPPLY
VOLTAGE
FIGURE 3. “ON” RESISTANCE vs SUPPLY VOLTAGE FIGURE 4. RISE/FALL TIME vs SUPPLY VOLTAGE
FIGURE 5. RISE/FALL TIME vs TEMPERATURE FIGURE 6. PROPAGATION DELAY vs SUPPLY VOLTAGE
T=25°C HIGH LIMIT=2.4V
LOW LIMIT=0.8V
HYSTERESIS
1.8
1.6
1.4
1.2
15 7 10 12 15
SUPPLY VOLTAGE (V)
INPUT VOLTAGE (V)
T=25°C
ALL INPUTS=0
ALL INPUTS=VS+
2
1.6
1.2
0.8
05 7 10 12 15
SUPPLY VOLTAGE (V)
SUPPLY CURRENT (V)
0.4
IOUT=100mA
T=25°C
VL TO OUT
9
8
6
4
25 7 10 12 15
SUPPLY VOLTAGE (V)
“ON” RESISTANCE (Ω)
3
7
5
VH TO OUT
CL=1000pF
T=25°C
25
20
15
10
55 7 10 12 15
SUPPLY VOLTAGE (V)
RISE/FALL TIME (ns)
tF
tR
CL=1000pF
VS+=15V
16
14
12
8
6
-50 0 50 100 125
TEMPERATURE (°C)
RISE/FALL TIME (ns)
tF
tR
10
25 75-25
CL=1000pF
25
20
15
551015
SUPPLY VOLTAGE (V)
DELAY TIME (ns)
10
127
tD2
tD1
EL7457
6FN7288.4
January 26, 2012
FIGURE 7. PROPAGATION DELAY vs TEMPERATURE FIGURE 8. RISE/FALL TIME vs LOAD
FIGURE 9. SUPPLY CURRENT PER CHANNEL vs CAPACITIVE LOAD
Typical Performance Curves (Continued)
CL=1000pF
VS+=15V
18
14
12
8
6
-50 0 50 100 125
TEMPERATURE (°C)
DELAY TIME (ns)
10
25 75-25
16
tD2
tD1
VS+=15V
140
120
100
20
0
100 1K 4.7K 10K
LOAD CAPACITANCE (pF)
RISE/FALL TIME (ns)
tFtR
60
2.2K470
80
40
VS+=VH=10V
VS-=VL=0V
f=100kHz
12
8
6
2
0
100 1K 10K
LOAD CAPACITANCE (pF)
SUPPLY CURRENT (mA)
4
10
EL7457
7FN7288.4
January 26, 2012
Timing Diagram
Standard Test Configuration (CS/CU)
TABLE 1. NOMINAL OPERATING VOLTAGE RANGE
PIN MIN MAX
VS+ to VS- 5V 16.5V
VS- to GND -5V 0V
VHVS- + 2.5V VS+
VLVS-V
S+
VH to VL0V 16.5V
VL to VS-0V 8V
90%
10%
OUTPUT
2.5V
5V
INPUT
0
tD+
tR
tD-
tF
1
2
3
4
16
15
14
13
5
6
7
12
11
10
8 9
4.7µF 0.1µF
INA
INB
VL
INC
IND
10kΩ
VS+
EN
VS-
OUTD
OUTC
VH
OUTB
OUTA
VS+
0.1µF 4.7µF
1000pF
1000pF
0.1µF 4.7µF
1000pF
1000pF
0.1µF 4.7µF
EL7457
8FN7288.4
January 26, 2012
Pin Descriptions
16-PIN
QSOP (0.150”),
SO (0.150”) 16-PIN QFN
(4x4mm) NAME FUNCTION EQUIVALENT CIRCUIT
1 15 INA Input channel A
CIRCUIT 1
2 16 OE Output Enable (Reference Circuit 1)
3 1 INB Input channel B (Reference Circuit 1)
4 2, 3 VL Low voltage input pin
5 4 GND Input logic ground
6, 13 NC No connection
7 5 INC Input channel C (Reference Circuit 1)
8 6 IND Input channel D (Reference Circuit 1)
9 7 VS- Negative supply voltage
10 8 OUTD Output channel D
CIRCUIT 2
11 9 OUTC Output channel C (Reference Circuit 2)
12 10, 11 VH High voltage input pin
14 12 OUTB Output channel B (Reference Circuit 2)
15 13 OUTA Output channel A (Reference Circuit 2)
16 14 VS+ Positive supply voltage
VS-VS-
VS+
VS+
INPUT
VS-
VS+
OUTPUT
VS-
VL
VH
EL7457
9FN7288.4
January 26, 2012
Block Diagram
Applications Information
Product Descr iption
The EL7457 is a high performance 40MHz high speed quad
driver. Each channel of the EL7457 consi sts of a single
P-channel high side driver and a single N-channel low side
driver . These 3Ω devices will pull the output (OUTX) to either
the high or low voltage, on VH and VL respectively,
depending on the input logic signal (INX). It should be noted
that there is only one set of high and low voltage pins.
A common output enable (OE) pin is available on the
EL7457. This pin, when pulled low will pu t all outputs in to
the high impedance state.
The EL7457 is available in 16-pin SO (0.150"), 16-pin
QSOP, and ultra-small 16-pin QFN packages. The relevant
package should be chosen depending on the calculated
power dissipation.
Supply Voltage Range and Input Compatibility
The EL7457 is designed for operation on supplies from 5V to
15V with 1 0% toleran ce (i.e. 4.5V to 18V). The t able on page
6 shows the specifications for the relationship between the
VS+, VS-, VH, VL, and GND pins. The EL7457 does not
contain a true analog switch and therefore VL should always
be less than VH.
All input pins are compatible with both 3V and 5V CMOS
signals With a positive supply (VS+) of 5V, the EL7457 is
also compatible with TTL inputs.
Power Supply Bypassing
When using the EL7457, it is very important to use adequate
power supply bypassing. The high switching currents
developed by the EL7457 necessitate the use of a bypass
capacitor on both the positive and negative supplies. It is
recommended that a 4.7µF tantalum capacitor be used in
parallel with a 0.1µF low-inductance ceramic MLC capacitor.
These should be placed as close to the supply pins as
possible. It is also recommended that the VH and VL pins
have some level of bypassing, especially if the EL7457 is
driving highly capacitive loads.
Power Dissipation Calculation
When switching at high speeds, or driving heavy loads, the
EL7457 drive capability is limited by the rise in die
temperature brought about by internal power dissipation. For
reliable operation die temperature must be kept below
TJMAX (125°C). It is necessary to calculate the power
dissipation for a given application prior to selecting package
type.
Power dissipation may be calculated:
where:
VS is the total power supply to the EL7457 (from VS+ to
VS-)
VOUT is the swing on the ou tp ut (VH - VL)
CL is the load capacitance
CINT is the internal load capacitance (80pF max)
IS is the quiescent supply current (3mA max)
f is frequency
Having obtained the application’s power dissipation, the
maximum junction temperature can be calculated:
where:
TJMAX is the maximum junction temperature (125 °C)
TMAX is the maximum ambient operating temperature
PD is the power dissipation calculated above
θJA is the thermal resistance, junction to ambient, of the
application (package + PCB combination). Refer to the
Package Power Dissipation curves on page 6.
3-STATE
CONTROL
LEVEL
SHIFTER OUTPUT
VL
VH
OE
INPUT
VS+
GND
VS-
PD VSIS
×()CINT VS
2
×f×()CLVOUT
2
×f×()+
1
4
+= (EQ. 1)
TJMAX TMAX ΘJA PD×+= (EQ. 2)
EL7457
10
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third pa rties which may result
from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent rights of Intersil or its subsidiari es.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7288.4
January 26, 2012
EL7457
Quarter Size Outline Plastic Packages Family (QSOP)
0.010 CAB
SEATING
PLANE
DETAIL X
EE1
1(N/2)
(N/2)+1
N
PIN #1
I.D. MARK
b
0.004 C
c
A
SEE DETAIL "X"
A2
4°±4°
GAUGE
PLANE
0.010
L
A1
D
B
H
C
e
A
0.007 CAB
L1
MDP0040
QUARTER SIZE OUTLINE PLASTIC PACKAGES FAMILY
SYMBOL
INCHES
TOLERANCE NOTESQSOP16 QSOP24 QSOP28
A 0.068 0.068 0.068 Max. -
A1 0.006 0.006 0.006 ±0.002 -
A2 0.056 0.056 0.056 ±0.004 -
b 0.010 0.010 0.010 ±0.002 -
c 0.008 0.008 0.008 ±0.001 -
D 0.193 0.341 0.390 ±0.004 1, 3
E 0.236 0.236 0.236 ±0.008 -
E1 0.154 0.154 0.154 ±0.004 2, 3
e 0.025 0.025 0.025 Basic -
L 0.025 0.025 0.025 ±0.009 -
L1 0.041 0.041 0.041 Basic -
N 16 24 28 Reference -
Rev. F 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not
included.
2. Plastic interlead protrusions of 0.010” maximum per side are not
included.
3. Dimensions “D” and “E1” are measur ed at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
11 FN7288.4
January 26, 2012
EL7457
Small Outline Package Family (SO)
GAUGE
PLANE
A2
A1 L
L1
DETAIL X 4° ±4°
SEATING
PLANE
eH
b
C
0.010 BMCA
0.004 C
0.010 BMCA
B
D
(N/2)
1
E1
E
NN (N/2)+1
A
PIN #1
I.D. MARK
h X 45°
A
SEE DETAIL “X”
c
0.010
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
SYMBOL
INCHES
TOLERANCE NOTESSO-8 SO-14
SO16
(0.150”)
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX -
A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 ±0.003 -
A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 ±0.002 -
b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 ±0.003 -
c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 ±0.001 -
D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 ±0.004 1, 3
E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 ±0.008 -
E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 ±0.004 2, 3
e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic -
L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 ±0.009 -
L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic -
h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference -
N 8 14 16 16 20 24 28 Reference -
Rev. M 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
12 FN7288.4
January 26, 2012
EL7457
Package Outline Drawing
L16.4x4H
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 1/12
located within the zone indicated. The pin #1 identifier may be
Unless otherwise specified, tolerance : Decimal ± 0.05
Tiebar shown (if present) is a non-functional feature.
The configuration of the pin #1 identifier is optional, but must be
between 0.15mm and 0.30mm from the terminal tip.
Dimension applies to the metallized terminal and is measured
Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
6.
either a mold or mark feature.
3.
5.
4.
2.
Dimensions are in millimeters.1.
NOTES:
BOTTOM VIEW
DETAIL "X"
SIDE VIEW
TYPICAL RECOMMENDED LAND PATTERN
TOP VI EW
SEE DETAIL "X"
0.30 ±0.05
BASE PLANE
PIN #1
5
8
( 3 . 6 TYP )
(12x0.65)
(16x0.30) 0 . 20 REF
+0.03/-0.02
C5
4
0.10 CM
INDEX AREA
(4X) 0.15
PIN 1
6
4.00
12
4.00
9
AB
4
0.65
12X
13
4X 1.95
16
1
6
C
SEATING PLANE
0.10 C
AB
16x 0.550±0.05
2.40
( 2.40)
0.90±0.10
(16x0.75)
2.40
INDEX AREA