GE
Data Sheet
March 18, 2021
©2012 General Electric Company. All rights reserved.
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
Features
▪ Compliant to RoHS EU Directive 2011/65/EU and
amended Directive (EU) 2015/863. (Z versions)
▪ Compliant to REACH Directive (EC) No 1907/2006
▪ Compatible in a Pb-free or SnPb reflow environment
▪ High efficiency – 93.5% at 12V full load
▪ Industry standard, DOSA compliant, Eighth brick
footprint
57.9mm x 22.9mm x 7.8mm
(2.28in x 0.90in x 0.31in)
▪ Wide Input voltage range: 36-75 Vdc
▪ Tightly regulated output
▪ Constant switching frequency
▪ Positive Remote On/Off logic
▪ Input under/over voltage protection
▪ Output overcurrent/voltage protection
▪ Over-temperature protection
▪ Remote sense
▪ No minimum load required
▪ No reverse current during output shutdown
▪ Output Voltage adjust: 80% to 110% of Vo,nom
▪ Operating temperature range (-40°C to 85°C)
▪ ANSI/UL* 62368-1 and CAN/CSA† C22.2 No. 62368-1
Recognized, DIN VDE‡ 0868-1/A11:2017 (EN62368-
1:2014/A11:2017)
▪ CE mark meets 2014/35/EU directive§
▪ Meets the voltage and current requirements for ETSI
300-132-2 and complies with and licensed for Basic
insulation
▪ 2250 Vdc Isolation tested in compliance with IEEE
802.3¤ PoE standards
▪ ISO**9001 and ISO 14001 certified manufacturing
facilities
Description
The EVW010A0B, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 10A of output
current and provide a precisely regulated output voltage of 12V over a wide range of input voltages (VIN = 36 - 75Vdc). The
modules achieve typical full load efficiency of 93.5%. The open frame modules construction, available in both surface-mount
and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote
On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection.
RoHS Compliant
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress
ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the
operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the
device reliability.
Parameter
Device
Symbol
Min
Max
Unit
Input Voltage
Continuous
All
VIN
-0.3
80
Vdc
Transient (≤100 ms)
All
VIN,trans
-0.3
100
Vdc
Operating Ambient Temperature
All
TA
-40
85
°C
(see Thermal Considerations section)
Storage Temperature
All
Tstg
-55
125
°C
I/O Isolation voltage (100% factory Hi-Pot tested)
All
⎯
⎯
2250
Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Operating Input Voltage
All
VIN
36
48
75
Vdc
Maximum Input Current
All
IIN,max
3.4
3.7
Adc
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current
All
IIN,No load
75
mA
(VIN = VIN, nom, IO = 0, module enabled)
Input Stand-by Current
All
IIN,stand-by
20
mA
(VIN = VIN, nom, module disabled)
Inrush Transient
All
I2t
0.5
A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN,
max, IO= IOmax ; See Test configuration section)
All
20
mAp-p
Input Ripple Rejection (120Hz)
All
50
dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated
part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a
maximum rating of 8 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush
energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s
data sheet for further information.
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 3
Electrical Specifications (continued)
Parameter
Device
Symbol
Min
Typ
Max
Unit
Nominal Output Voltage Set-point
All
VO, set
11.76
12.0
12.24
Vdc
VIN=VIN, min, IO=IO, max, TA=25°C)
Output Voltage
All
VO
-3.0
⎯
+3.0
% VO, set
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max)
All
⎯
⎯
0.2
% VO, set
Load (IO=IO, min to IO, max)
All
⎯
⎯
0.2
% VO, set
Temperature (Tref=TA, min to TA, max)
All
⎯
⎯
1.0
% VO, set
Output Ripple and Noise on nominal output
(VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth)
All
⎯
⎯
30
mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth)
All
⎯
⎯
100
mVpk-pk
External Capacitance
All
CO
100
⎯
2,000
μF
Output Current
All
Io
0
⎯
10
Adc
Output Current Limit Inception (Hiccup Mode )
All
IO, lim
105
115
130
% Io
(VO= 90% of VO, set)
Output Short-Circuit Current
All
IO, s/c
⎯
3
5
Arms
(VO≤250mV) ( Hiccup Mode )
Efficiency
All
η
93.5
%
VIN= VIN, nom, TA=25°C
IO=IO, max , VO= VO,set
Switching Frequency (Input ripple is ½ fsw)
All
fsw
370
kHz
Dynamic Load Response
(dIo/dt=0.1A/s; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max;
Peak Deviation
All
Vpk
⎯
3
⎯
% VO, set
Settling Time (Vo<10% peak deviation)
All
ts
⎯
200
⎯
s
(dIo/dt=1A/s; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max;
Peak Deviation
All
Vpk
⎯
5
⎯
% VO, set
Settling Time (Vo<10% peak deviation)
All
ts
⎯
200
⎯
s
Isolation Specifications
Parameter
Device
Symbol
Min
Typ
Max
Unit
Isolation Capacitance
All
Ciso
⎯
1000
⎯
pF
Isolation Resistance
All
Riso
10
⎯
⎯
MΩ
I/O Isolation Voltage (100% factory Hi-pot tested)
All
All
⎯
⎯
2250
Vdc
General Specifications
Parameter
Device
Symbol
Min
Typ
Max
Unit
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C, airflow
= 200 lfm, 90% confidence)
All
FIT
323.4
109/Hours
All
MTBF
3,092,530
Hours
Weight (Open Frame)
All
⎯
19
(0.67)
⎯
g
(oz.)
Weight (with Heatplate)
All
⎯
32
(1.13)
⎯
g
(oz.)
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 4
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
See Feature Descriptions for additional information.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current
All
Ion/off
⎯
⎯
1.0
mA
Logic Low - On/Off Voltage
All
Von/off
-0.7
⎯
1.0
Vdc
Logic High Voltage – (Typ = Open Collector)
All
Von/off
2.0
5.0
Vdc
Logic High maximum allowable leakage current
All
Ion/off
⎯
⎯
10
μA
Turn-On Delay1 and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25 oC)
Case 1: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay from
instant at which VIN = VIN, min until VO = 10% of VO,set)
All
Tdelay
―
25
30
msec
Case 2: Input power is applied for at least 1 second
and then the On/Off input is set from OFF to ON (Tdelay from
instant Von/off toggles until VO = 10% of VO, set).
All
Tdelay
―
12
20
msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
All
Trise
―
10
15
msec
Output voltage overshoot – Startup
All
―
3
% VO, set
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
Remote Sense Range
All
VSENSE
10
% VO, set
(Max voltage drop is 0.5V)
Output Voltage Adjustment Range2
All
80
110
% VO, set
Output Overvoltage Protection
All
VO, limit
13.8
⎯
16.5
Vdc
Input Undervoltage Lockout
All
VUVLO
Turn-on Threshold
30
34.5
36
Vdc
Turn-off Threshold
30
32.5
⎯
Vdc
Hysterisis
1.5
2.0
⎯
Vdc
Input Overvoltage Lockout
All
VOVLO
Turn-off Threshold
⎯
80
83
Vdc
Turn-on Threshold
75
78
⎯
Vdc
Hysterisis
1
2
⎯
Vdc
Notes:
1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 4 seconds. The extended Tdelay will occur when the module restarts following either: 1)
the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2)
toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, Tdelay, will occur whenever a
module restarts with input voltage removed from the module for the preceding 1 second.
2. Maximum trim up possible only for Vin>40V.
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 5
Characteristic Curves
The following figures provide typical characteristics for the EVW010A0B (12V, 10A) at 25oC. The figures are identical for either
positive or negative remote On/Off logic.
EFFICIENCY, (%)
70
75
80
85
90
95
0 2 4 6 8 10
Vin = 48V
Vin = 36V
Vin = 75V
OUTPUT VOLTAGE OUTPUT CURRENT
VO (V) (200mV/div) Io(A) (2A/div)
OUTPUT CURRENT, IO (A)
TIME, t (100µs/div)
Figure 1. Converter Efficiency versus Output Current.
Figure 4. Transient Response to 1.0A/µS Dynamic Load
Change from 50% to 75% to 50% of full load (VIN = VIN,NOM).
OUTPUT VOLTAGE
VO (V) (50mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
VO (V) (2V/div) VOn/Off (V) (2V/div)
TIME, t (2s/div)
TIME, t (5ms/div)
Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io =
Io,max).
Figure 5. Typical Start-up Using Remote On/Off, negative logic
version shown (VIN = VIN,NOM, Io = Io,max).
OUTPUT VOLTAGE OUTPUT CURRENT
VO (V) (200mV/div) Io(A) (2A/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (20V/div) VO (V) (2V/div)
TIME, t (100µs/div)
TIME, t (10ms/div)
Figure 3. Transient Response to 0.1A/µS Dynamic Load
Change from 50% to 75% to 50% of full load (VIN = VIN,NOM).
Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Io
= Io,max).
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 6
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 7
Test Configurations
TO OSCILLOSCOPE
CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kHz
33-100μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V
O
(
–
)
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact
Rdistribution
Rcontact
Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN
VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test Setup.
=
VO.
IO
VIN.
IIN
x
100
%
Efficiency
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 8
Design Considerations
Input Filtering
The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the
stability of the power module. For the test configuration in Figure 7 a 33-100μF electrolytic capacitor (ESR<0.1 at 100kHz),
mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.
Safety Considerations
For safety agency approval the power module must be installed in compliance with the spacing and separation requirements of
the end-use safety agency standards, i.e., UL ANSI/UL 62368-1 and CAN/CSA C22.2 No. 62368-1 Recognized, DIN VDE 0868-
1/A11:2017 (EN62368-1:2014/A11:2017)
If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV) or ES1, all of the following
must be true:
▪ The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains.
▪ One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating.
▪ The input pins of the module are not operator accessible.
▪ Another SELV or ES1 reliability test is conducted on the whole system (combination of supply source and subject module),
as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s
output.
Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-
SELV/ES1 voltage to appear between the output pins and ground.
The power module has safety extra-low voltage (SELV) or ES1 outputs when all inputs are SELV or ES1.
All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the in-situ needle flame test
for reduced thickness.
For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable
requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and
unearthed SELV outputs.
The input to these units is to be provided with a maximum 8 A time-delay fuse in the ungrounded lead.
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 9
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and
off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on
during a logic low.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage
(Von/off) between the ON/OFF terminal and the VIN(-) terminal (see Figure 10). Logic low is 0V ≤ Von/off ≤ 1.0V. The maximum Ion/off
during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current.
During a logic high, the typical maximum Von/off generated by the module is 5V, and the maximum allowable leakage current at
Von/off = 5V is 1μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See
Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense
range given in the Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output
voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim.
The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output
current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output
current would increase the power output of the module. Care should be taken to ensure that the maximum output power of
the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max).
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACTAND
DISTRIBUTION LOSSES
SUPPLY II
CONTACT
RESISTANCE
Figure 11. Circuit Configuration for remote sense .
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 10
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to
operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON.
Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold,
VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will
shutdown if the thermal reference point Tref (Figure 13), exceeds 150oC (typical), but the thermal shutdown is not intended as
a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc input
power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart option (4) is
ordered, the module will automatically restart upon cool-down to a safe temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of
failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage
resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an
internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload) condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by
toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will remain
in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back
into its specified range. The average output current during hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external
resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin.
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 12. Circuit Configuration to Trim Output Voltage.
Connecting an external resistor (Rtrim-down) between the TRIM pin and the Vo(-) (or Sense(-)) pin decreases the output voltage
set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%.
The following equation determines the required external resistor value to obtain a percentage output voltage change of Δ%

−
=
−22.10
%
511
downtrim
R
Where
100%,
,
−
=
seto
desiredseto V
VV
For example, to trim-down the output voltage of the module by 8% to 11.04V, Rtrim-down is calculated as follows:
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 11
8% =

−=
−22.10
8
511
downtrim
R
=
−655.53
downtrim
R
Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set
point. The following equations determine the required external resistor value to obtain a percentage output voltage change of
Δ%:

−
−
+
=
−22.10
%
511
%225.1
%)100(11.5 ,seto
uptrim V
R
Where
100%,
,
−
=
seto
setodesired
V
VV
For example, to trim-up the output voltage of the module by 5% to 12.6V, Rtrim-up is calculated is as follows:
5% =

−−
+
=
−22.10
5
511
5225.1 )5100(0.1211.5
uptrim
R
=
−8.938
uptrim
R
The voltage between the Vo(+) and Vo(–) terminals must not exceed the minimum output overvoltage protection value shown
in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output
voltage set-point adjustment trim.
Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output
voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of
power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using
remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase
the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or
below the maximum rated power (Maximum rated power = VO,set x IO,max).
Thermal Considerations
The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help
ensure reliable operation.
Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here
is based on physical measurements taken in a wind tunnel.
The thermal reference point, Tref used in the specifications for open frame modules is shown in Figure 13. For reliable
operation this temperature should not exceed 122oC.
Figure 13. Tref Temperature Measurement Location for open Frame Module.
The thermal reference point, Tref used in the specifications for modules with heat plates (–H) is shown in Figure 14. For reliable
operation this temperature should not exceed 114oC.
AIRFLOW
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 12
Thermal Considerations (continued)
Figure 14. Tref Temperature Measurement Location for Heat plate Module.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by the open frame module versus local ambient temperature (TA) for natural
convection and up to 3m/s (600 ft./min) forced airflow are shown in Figure 15.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
3.0 m/s
(600LFM)
2.0 m/s
(400LFM)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-);
Vin =48V.
For additional power, the module is available with an optional heatplate (-H), that allows for the use of heatsinks to improve
the thermal derating. Derating curves showing the maximum output current that can be delivered by the heatplate module
with different heatsink heights versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min)
forced airflow are shown in Figures 16 -19.
AIRFLOW
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 13
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
3.0 m/s
(600LFM)
2.0 m/s
(400LFM)
1.0 m/s
(200LFM) 0.5 m/s
(100LFM) NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-
); Vin =48V.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
2.0 m/s
(400LFM)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 17. Output Current Derating for the Module with Heatplate and 0.25 in. heatsink; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
2.0 m/s
(400LFM)
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 18. Output Current Derating for the Module with Heatplate and 0.5 in. heatsink; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 14
Thermal Considerations (continued)
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
9
10
20 30 40 50 60 70 80 90
1.0 m/s
(200LFM)
0.5 m/s
(100LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 19. Output Current Derating for the Module with Heatplate and 1.0 in. heatsink; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum device temperatures.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components.
The RoHS-compliant with lead solder exemption (non-Z codes) through-hole products use Sn/Pb solder and RoHS-compliant
components. Both non-Z and Z codes are designed to be processed through single or dual wave soldering machines. The pins
have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate
of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept
below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all
RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional
information is needed, please consult with your GE representative for more details.
Surface Mount Information
Pick and Place
The EVW010A0B modules use an open frame construction and are designed for a fully automated assembly process. The
modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the
requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to
300oC. The label also carries product information such as product code, serial number and the location of manufacture.
Figure 20. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively
large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm.
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 15
Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available.
Reflow Soldering Information
The surface mountable modules in the EVW family use our newest SMT technology called “Column Pin” (CP) connectors. Figure
21 shows the new CP connector before and after reflow soldering onto the end-board assembly.
EVW Board
Insulator
Solder Ball
End assembly PCB
Figure 21. Column Pin Connector Before and After Reflow Soldering.
The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder
for non-Z codes, or Sn/Ag/Cu (SAC) solder for –Z codes. The CP connector design is able to compensate for large amounts of
co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183oC (Sn/Pb solder) or 217-218
oC (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the
plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in
the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and can adversely affect long-term reliability.
Tin Lead Soldering
The recommended linear reflow profile using Sn/Pb solder is shown in Figure 22 and 23. For reliable soldering the solder reflow
profile should be established by accurately measuring the modules CP connector temperatures.
REFLOW TEMP (C)
REFLOW TIME (S)
Figure 22. Recommended Reflow Profile for Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the EVW010A0B modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward
compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or
cause damage to the modules and can adversely affect long-term reliability.
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 16
MAX TEMP SOLDER (C)
Figure 23. Time Limit, Tlim, Curve Above 205oC for Tin/Lead (Sn/Pb) process
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a
recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Fig.
24.
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 24. Recommended linear reflow profile using Sn/Ag/Cu solder
MSL Rating
The EVW010A0B modules have a MSL rating of 2A.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in
J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time
of use. Once the original package is broken, the floor life of the product at conditions of 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12
months from the bag seal date, when stored at the following conditions: <40°C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate
cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly.
For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules: Soldering
and Cleaning Application Note (AN04-001).
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 17
EMC Considerations
The circuit and plots in Figure 25 shows a suggested configuration to meet the conducted emission limits of EN55032 Class B.
0
10
20
30
40
50
60
70
80
Level [dBµV]
150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M
Frequency [Hz]
x
xx
x
x
x
x x MES CE0615090841_fin QP
MES CE0615090841_pre PK
0
10
20
30
40
50
60
70
80
Level [dBµV]
150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M
Frequency [Hz]
+
++
+
+
+
+ + MES CE0615090841_fin AV
MES CE0615090841_pre AV
Figure 25. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 18
Mechanical Outline for Surface Mount Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View#
#Top side label includes GE name, product designation and date code.
Side
View
Bottom
View
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 19
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View#
#Top side label includes GE name, product designation and date code.
Side
View
* For optional pin lengths, see Table 2 Device Options and Coding Scheme
Bottom
View
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 20
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 21
Mechanical Outline for Through-Hole Module with Heat Plate (-H)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View
Side
View
* For optional pin lengths, see Table 2 Device Options and Coding Scheme
Bottom
View#
# Bottom side label includes GE name, product designation and date code.
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 22
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
SMT Recommended Pad Layout (Component Side View)
TH Recommended Pad Layout (Component Side View)
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
March 18, 2021
©2012 General Electric Company. All rights reserved.
Page 23
Packaging Details
The surface mount versions of the EVW surface mount
modules (suffix –S) are supplied as standard in the plastic
tray shown in Figure 26. The tray has external dimensions
of 135.1mm (W) x 321.8mm (L) x 12.42mm (H) or 5.319in
(W) x 12.669in (L) x 0..489in (H).
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays)
Each tray contains a total of 12 power modules. The trays
are self-stacking and each shipping box will contain 4 full
trays plus one empty hold down tray giving a total number
of 48 power modules.
Figure 26. Surface Mount Packaging Tray.
GE
Data Sheet
EVW010A0B Series (Eighth-Brick) DC-DC Power Modules
36–75Vdc Input; 12.0Vdc Output; 10A Output Current
Contact Us
For more information, call us at
USA/Canada:
+1 888 546 3243, or +1 972 244 9288
Asia-Pacific:
+86-21-53899666
Europe, Middle-East and Africa:
+49.89.878067-280
Go.ABB/Industrial
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or
information.
March 18, 2021
©2012 General Electric Company. All International rights reserved.
Version 1_4
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes
Input Voltage
Output
Voltage
Output
Current
On/Off Logic
Connector
Type
Comcodes
EVW010A0B41Z
48V (36-75Vdc)
12V
10A
Negative
Through hole
CC109143203
EVW010A0B64Z
48V (36-75Vdc)
12V
10A
Positive
Through hole
CC109156015
EVW010A0B641Z
48V (36-75Vdc)
12V
10A
Negative
Through hole
CC109158473
EVW010A0B41-HZ
48V (36-75Vdc)
12V
10A
Negative
Through hole
CC109152781
EVW010A0B41-SZ
48V (36-75Vdc)
12V
10A
Negative
Surface mount
CC109153516
Table 2. Device Options and Coding Scheme
Characteristic
Character and Position
Definition
Ratings
Form Factor
E
E = Eighth Brick
Family Designator
V
Input Voltage
W
W = Wide Input Voltage Range, 36V -75V
Output Current
010A0
010A0 = 010.0 Amps Rated Output Current
Output Voltage
B
B = 12.0 Vout Nominal
Options
Pin Length
Omit = No Pin Trim
6
6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
8
8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
Action following
Omit = Latching Mode
Protective Shutdown
4
4 = Auto-restart following shutdown (Overcurrent/Overvoltage)
On/Off logic
Omit = Positive Logic
1
1 = Negative Logic
-
Customer Specific
XY
XY = Customer Specific Modified Code, Omit for Standard Code
Mechanical Features
Omit = Standard open Frame Module
H
H = Heat plate (not available with –S option)
S
S = Surface mount connections
RoHS
Omit = RoHS 5/6, Lead Based Solder Used
Z
Z = RoHS 6/6 Compliant, Lead free