62 EE-SX1107 Photomicrosensor (Transmissive)
Photomicrosensor (Transmissive)
EE-SX1107
■Dimensions
Note: All units are in millimeters unless otherwise indicated.
■Features
•Ultra-compact with a 3.4-mm-wide sensor and a 1-mm-wide slot.
•PCB surface mounting type.
•High resolution with a 0.15-mm-wide aperture.
■Absolute Maximum Ratings (Ta = 25°C)
Note: 1. Refer to the temperature rating chart if the ambient temper-
ature exceeds 25°C.
2. Duty: 1/100; Pulse width: 0.1 ms
3. Complete soldering within 10 seconds for reflow soldering
and within 3 seconds for manual soldering.
■Electrical and Optical Characteristics (Ta = 25°C)
Internal Circuit
Terminal No. Name
A Anode
K Cathode
C Collector
E Emitter
Recommended Soldering
Pattern
Optical
axis
Cross section AA
Unless otherwise specified, the
tolerances are ±0.15 mm.
Item Symbol Rated value
Emitter Forward current IF25 mA
(see note 1)
Pulse forward cur-
rent
IFP 100 mA
(see note 2)
Reverse voltage VR5 V
Detector Collector–Emitter
voltage
VCEO 20 V
Emitter–Collector
voltage
VECO 5 V
Collector current IC20 mA
Collector dissipa-
tion
PC75 mW
(see note 1)
Ambient tem-
perature
Operating Topr –30°C to 85°C
Storage Tstg –40°C to 90°C
Reflow soldering Tsol 255°C
(see note 3)
Manual soldering Tsol 350°C
(see note 3)
Item Symbol Value Condition
Emitter Forward voltage VF1.1 V typ., 1.3 V max. IF = 5 mA
Reverse current IR10 μA max. VR = 5 V
Peak emission wavelength λP940 nm typ. IF = 20 mA
Detector Light current IL50 μA min., 150 μA typ.,
500 μA max.
IF = 5 mA, VCE = 5 V
Dark current ID100 nA max. VCE = 10 V, 0 lx
Leakage current ILEAK --- ---
Collector–Emitter saturated voltage VCE (sat) 0.1 V typ., 0.4 V max. IF = 20 mA, IL = 50 μA
Peak spectral sensitivity wavelength λP900 nm typ. ---
Rising time tr 10 μs typ. VCC = 5 V, RL = 1 kΩ,
IL = 100 μA
Falling time tf 10 μs typ. VCC = 5 V, RL = 1 kΩ,
IL = 100 μA
Be sure to read Precautions on page 25.
EE-SX1107 Photomicrosensor (Transmissive) 63
■Engineering Data
Forward Current vs. Collector
Dissipation Temperature Rating
Forward Current vs. Forward
Voltage Characteristics (Typical)
Light Current vs. Forward Current
Characteristics (Typical)
Light Current vs. Collector−Emitter
Voltage Characteristics (Typical)
Relative Light Current vs. Ambient
Temperature Characteristics (Typical)
Dark Current vs. Ambient Tem-
perature Characteristics (Typical)
Response Time vs. Load Resistance
Characteristics (Typical)
Distance d (mm)
Input
Output
Input
Output
90 %
10 %
Sensing Position Characteristics
(Typical)
Response Time Measurement
Circuit
Distance d (mm)
Sensing Position Character-
istics (Typical)
V
CE
=2 V
V
CE
= 10 V
Ambient temperature Ta (°C)
Collector dissipation PC (mW)
Forward voltage VF (V)
Forward current IF (mA)
Forward current IF (mA)
Forward current IF (mA)
Light current IL (μA)
Collector−Emitter voltage VCE (V)
Light current IL (μA)
Ambient temperature Ta (°C)
Load resistance RL (kΩ)
Ta = 25°C
V
CE
= 5 V
I
F
= 10 mA
I
F
= 5 mA
Ta = 25°CI
F
= 5 mA
V
CE
= 5 V
I
F
= 5 mA
V
CE
= 5 V
VCC = 5 V
Ta = 25°C
Response time tr, tf (μs)
Relative light current IL (%)
Dark current ID (nA)
Relative light current IL (%)
Ambient temperature Ta (°C)
Relative light current IL (%)
I
F
= 5 mA
V
CE
= 5 V
64 EE-SX1107 Photomicrosensor (Transmissive)
Unit: mm (inch)
■Tape and Reel
Reel
Tape
Tape configuration
Tape quantity
2,500 pcs./reel
21±0.8 dia. 2±0.5
13±
0.5 dia.
80±1 dia.
330±2 dia.
12.4 +2
0
18.4 max.
Product name
Quantity
Lot number
1.5 dia.
Terminating part
(40 mm min.)
Pull-out direction
Empty
(40 mm min.)
Parts mounted Leading part
(400 mm min.)
EE-SX1107 Photomicrosensor (Transmissive) 65
Precautions
■Soldering Information
Reflow soldering
•The following soldering paste is recommended:
Melting temperature: 216 to 220°C
Composition: Sn 3.5 Ag 0.75 Cu
•The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm.
•Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered.
Manual soldering
•Use ”Sn 60” (60% tin and 40% lead) or solder with silver content.
•Use a soldering iron of less than 25 W, and keep the temperature of the iron tip at 350°C or below.
•Solder each point for a maximum of three seconds.
•After soldering, allow the product to return to room temperature before handling it.
Storage
To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the
product under the following conditions:
Temperature: 10 to 30°C
Humidity: 60% max.
The product is packed in a humidity-proof envelope. Reflow soldering must be done within 48 hours after opening the envelope, during which time
the product must be stored under 30°C at 80% maximum humidity.
If it is necessary to store the product after opening the envelope, use dry-box storage or reseal the envelope.
Baking
If a product has remained packed in a humidity-proof envelope for six months or more, or if more than 48 hours have lapsed since the envelope
was opened, bake the product under the following conditions before use:
Reel: 60°C for 24 hours or more
Bulk: 80°C for 4 hours or more
260°C max.
Time
120 sec
Temperature
1 to 5°C/s 150 to 180°C
40 sec max.
10 sec max.
1 to 5°C/s 255°C max.
230°C max.
