1/13
www.rohm.com 2009.05 - Rev.A
© 2009 ROHM Co., Ltd. All rights reserved.
Charge Protection IC Series with Built-in FET
St andard
Protection Type
BD6040GUL, BD6041GUL
●Descriptions
The BD6040 GUL , BD6041GUL charger protection IC developed for portable devices provides up to 28V of over voltage
protection for charger ICs. Built-in circuits include overvoltage lockout,overcurrent limit, undervoltage protection, internal start
up delay, and status flag.
●Features
1) 28V (max) overvoltage protection
2) Low quiescent current (45μA)
3) Low Ron (125mΩ) FET
4) Overvoltage lockout (OVLO) circuit
5) Undervoltage lockout (UVLO) circuit
6) Internal 2msec start up delay
7) Overcurrent protection circuit
8) Compact package: VCSP50L1(1.6mm x 1.6mm, t=0.55mm)
●Applications
Mobile phones, MP3 players, Digital S till Camera, PDA, IC recorder, Electronic Dictionary, Handheld Game, Game Controller ,
Camcorder, Bluetooth Headsets, etc
●Line Up
Parameter Over Voltage Lockout
(IN=Increasing) Over Voltage Lockout
(Hysteresis) Package
BD6040GUL 6.40V 30mV VCSP50L1
BD6041GUL 5.85V 100mV VCSP50L1
●Absolute Maximum Ratings (Ta = 25℃)
Contents Symbol Rating Unit Conditions
Input supply voltage 1 Vmax1 -0.3～30 V
IN1,IN2,IN3,IN4
Input supply voltage 2 Vmax2 -0.3～7 V
other
Power dissipation Pd 725 mW
Operating temperature range Topr -35～+85 ℃
Storage temperature range Tstr -55～+150 ℃
※1 When using more than at Ta=25℃, it is reduced 5.8 mW per 1℃.(ROHM specification board 50mm× 58mm mounting.)
●RECOMMENDED OPERATING RANGE (Ta=-35～+85℃))
Parameter Symbol Range Unit Usage
Input voltage range Vin 2.2～28 V
※ This product is not especially designed to be protected from radioactivity.
No.09031EAT01
BD6040GUL, BD6041GUL
Technical Note
2/13
●Electrical Characteristics
(Unless otherwise noted, Ta = 25C, IN=5V)
Parameter Symbol Device Rating Unit Conditions
Min. Typ. Max.
○Electrical
Input Voltage Range VIN BD6040/41 - - 28 V
Supply Quiescent Current ICC BD6040/41 45 90 μA
Under Voltage Lockout UVLO BD6040/41 2.53 2.65 2.77 V IN= decreasing
Under Voltage Lockout Hysteresis UVLOh BD6040/41 50 100 150 mV IN= increasing
Over Voltage Lockout OVLO BD6040 6.2 6.4 6.6 V IN= increasing
BD6041 5.7 5.85 6.0 V
Over Voltage Lockout Hysteresis OVLOh BD6040 10 30 50 mV IN= decreasing
BD6041 50 100 150 mV
Current limit ILM BD6040/41 1.2 - - A
Vin vs. Vout Res. RON BD6040/41 - 125 150 mΩ
OK Output Low Voltage OKVO BD6040/41 - - 400 mV SINK=1mA
OK Leakage Current OKleak BD60 40/41 - - 1 μA
EN input voltage (H) ENH BD60 40/41 1.45 - - V
EN input voltage (L) ENL BD6040/41 - - 0.5 V
EN input current ENC BD60 40/41 12 25 50 μA EN=1.5V
○T i mings
Start Up Delay Ton BD60 40/41 - 2 4 msec
OK Going Up Delay Tok BD6040/41 - 10 15 msec
Output T urn Off Time Toff BD6040/41 - 2 10 μsec
Alert Delay Tovp BD6040/41 - 1.5 10 μsec
* This product is not especially designed to be protected from radioactivity.
BD6040GUL, BD6041GUL
Technical Note
3/13
●Typical Operating Characteristics
○The test conditions for the Typical Operating Characteristics are IN=5V, CIN=1uF, COUT=0.1uF, Rok=100kΩ,
Ta=25℃, Unless otherwise noted
Fig. 1 Start up（0→5V） Fig. 2 Input Steps（0→30V）
Fig. 3 Input Steps（5→30V） Fig. 4 Input Steps（30→5V）
Fig. 5 Output Short Circuit Fig. 6 Output Short Circuit (Zoom)
IN
OUT
OK
IN
OUT
OK
IN
OUT
OK
IN
OUT
OK
OUT
Io
OK
IN
OUT
Io
OK
IN
BD6040GUL, BD6041GUL
Technical Note
4/13
0
1
2
3
4
5
6
7
-50 -30 -10 10 30 50 70 90 110 130 150
TEMP[℃]
OVLO[V]
0
50
100
150
200
250
300
350
400
234567
IN[V]
Ron[mΩ]
Fig. 7 ICC vs. Input Voltage (0-30V) Fig. 8 ICC vs. Input Voltage (0-7V)
Fig. 9 ICC vs. Temperature (IN=5V) Fig. 10 UVLO/OVLO vs. Temperature
Fig. 11 RON vs. Input Voltage Fig. 12 RON vs. Temperature (IN=5V)
0
50
100
150
200
250
300
350
400
-50 -30 -10 10 30 50 70 90 110 130 150
TEMP[℃]
Ron[mΩ]
0
20
40
60
-50-30-101030507090110130150
TEMP[℃]
ICC[uA]
0
50
100
150
200
250
300
0 5 10 15 20 25 30
IN[V]
ICC[uA]
0
10
20
30
40
50
60
70
80
90
100
01234567
IN[V]
ICC[uA]
EN=H(OFF)
EN=L(ON)
EN=H
EN=L
EN=H
EN=L
OVLO
UVLO
BD6040GUL, BD6041GUL
Technical Note
5/13
●Block Diagram
Fig. 13 Block Diagram
●Package Dimensions(VCSP50L 1)
※BD6040GUL is “6040”, BD6041GUL is “6041”.
Fig. 14 Package Dimensions
Initial
Delay
IN 2
UVLO
TSD
OVLO
OSC
VREF
Timing
Generato
r
Initial
Delay
Gate
Driver
A
1B1
A
2
A
3
C 1
IN1
OK
OUT2OUT 1
C 3
IN 3
B 2
IN4
B3
C 2
EN
GND
50k Ω
10k Ω
LOT No.
※Part Number
Bottom View
BD6040GUL, BD6041GUL
Technical Note
6/13
●Ball Configuration
Fig. 15 Ball Configuration
●Pin Descriptions
No. Pin Name I/O ESD Diode Function
IN GND
1 A2 IN1 I - ○
Bypass with 1uF Ceramic capacitor or larger to get full 15KV ESD
protection (Air, IEC61000-4-2) at the input
2 A3 IN2 I - ○
3 B2 IN3 I - ○
4 B3 IN4 I - ○
5 A1 OUT1 O - ○ Output Voltage Pin
6 B1 OUT2 O - ○
7 C3 GND - ○ - Ground Pin
8 C1 OK O - ○ Active-low open drain output to signal if the adapter voltage is correct
9 C2 EN I - ○ Enab le input Drive EN high to turn off OUT (Hi-z output)
OK
OUT
OUT
EN
IN
IN
GND
IN
IN
123
C
B
A
Bottom View
Top View
OK
OUT
OUT
EN
IN
IN
GND
IN
IN
123
C
B
A
BD6040GUL, BD6041GUL
Technical Note
7/13
●Equivalent Circuit
Fig. 16 Block Diagram
●Ty pical A pplication Circuit
28V-OVP Travel
Adapter
Charger
OVP
PMIC
IN1
BATT
CHGIN
OUT1
Li-ion
1cell
IN2
OUT2
OK
GND
EN
IN3
IN4
1.0μF
0.1μF
100kohm
Fig. 17 Application Circuit
・Safety is high because it detects, and it protects it for an abnormal voltage up to 28V.
・It contributes to the miniaturization because all external is built into.
50kΩ
10kΩ
C2 : EN
C1 : OKA1/B1 : OUT
BD6040GUL, BD6041GUL
Technical Note
8/13
●Timing Diagram
OVLO
UVLO
2msec
10msec
(Tok)
(Ton)
IN
OUT
OK
Fig. 18 Start up sequence
Fig. 19 Shutdown by over voltage detection
Fig. 20 Operation by curren t limit detection
OVLO
UVLO
1.5 μsec
2.0 μsec
(Toff)
(Tovp)
IN
OUT
OK
Icc
OUT
O
K
ILM
H
BD6040GUL, BD6041GUL
Technical Note
9/13
●Examples of Application Circuit (Ball Configuration is BOTTOM VIEW)
A: In case of both EN & OK pins are connected.
Fig. 21
B: In case of OK pin is connected.
Fig. 22
BD6040
BD6041
IN OUT PMIC
/
charge
r
A
dapte
r
/ USB
GND
OK
OUT
OUT
EN
IN
IN
GND
IN
IN
1 2 3
C
B
A
OK
OUT
OUT
EN
IN
IN
GND
IN
IN
123
C
B
A
o
r
GND
Short
Open
OK CPU
EN
1 . 0 µF 0.1µF
10kΩ
Li-ion
1 cell
100kΩ
BD6040
BD6041
IN OUT
OK CPU
EN
PMIC
/
charger
A
dapte
r
/ USB
GND
O
K
OUT
OUT
EN
IN
IN
GND
IN
IN
123
C
B
A
1 .0 µF 0.1
µ
F
10kΩ
Li-ion
1 cell
100kΩ
BD6040GUL, BD6041GUL
Technical Note
10/13
C: In case of EN pin is connected.
Fig. 23
D: In case of both EN & OK pins are not connected.
Fig. 24
BD6040
BD6041
IN OUT PMIC
/ charge
r
A
dapte
r
/ USB
GND
OK
OUT
OUT
EN
IN
IN
GND
IN
IN
1 2 3
C
B
A
OK
OUT
OUT
EN
IN
IN
GND
IN
IN
123
C
B
A
o
r
GND
Short
Open
OK
EN
1.0µF 0.1µF Li-ion
1 cell
OK
OUT
OUT
EN
IN
IN
GND
IN
IN
1 2 3
C
B
A
o
r
GND Short
BD6040
BD6041
IN OUT
OK CPU
EN
PMIC
/
charge
r
A
dapte
r
/ USB
GND
OK
OUT
OUT
EN
IN
IN
GND
IN
IN
123
C
B
A
Open
1 .0 µF 0. 1µF Li -ion
1 cell
BD6040GUL, BD6041GUL
Technical Note
11/13
●Notes foer use
(1) Absolute maximum ratings
If applied voltage (VDD, VIN), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there
is a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which
absolute maximum ratings are e xceede d are assumed, consider appl ying fuses or other physical safety measures.
(2) Recommended operating range
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics, it
is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended
operating range, voltage and temperature characteristics are indicated.
(3) Reverse connection of power supply connector
There is a risk of damaging the LSI by reverse connection of the power supply connector. For protection from reverse
connection, ta ke measures such as exte rnally placing a diode betw een the pow er sup ply and the pow er supply pin of the LSI.
(4) Power supply lines
In the design of the board pattern, make power suppl y and GND line wiring low impedance.
When doing so, although the digital power supply and analog power supply are the same potential, separate the digital
power supply pattern and analog power suppl y pattern to deter digital noise from entering the ana log power supply due to
the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well.
Furthermore, for all power supply pins of the LSI, in conjunction with inser ting capacitors bet ween po wer suppl y and GND
pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss occurring
at low temperatures is not a problem for various characteristics of the capacitors used.
(5) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating belo w that. In addition, confirm
that there are no pins for which the potential becomes less than a GND by actually including transition phenomen a.
(6) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the LSI. If it is
installed erroneously, there is a risk of LSI damage. There also is a risk of damage if it is shorted by a foreign substance
getting between pins or between a pin and a power supply or GND.
(7) Operation in strong magnetic fields
Be careful when using the LSI in a strong magnetic fie ld, sin ce it may malfunction.
(8) Inspection in set board
When inspecting the LSI in the set b oard, since there is a risk of stress to the LSI when capacitors are connected to lo w
impedance LSI pins, be sure to discharge for each process. Moreover , when getting it on and of f of a jig in the inspection
process, always connect it after turning off the power supply, perform the inspection, and remove it after turning off the
power supply. Furthermore, as countermeasures against static electricity, use grounding in the assembly process and
take appropriate care in transport and storage.
(9) Input pins
Parasitic elements inevitably are formed on an LSI structure due to potential relationships. Because parasitic elements
operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage.
Accordingly, take care not to apply a lower voltage than GND to an input pin or use the LSI in other ways such that
parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply v oltage is not being
applied to the LSI. Furthermore, when the power supply voltage is being applied, make each input pin a voltage less than
the power supply voltage as well as within the guaranteed values of electrical characteristics.
(10) Ground wiring pattern
When there is a small s ignal GND and a large curre nt GND, it is recommended that you separate the large current GND
pattern and small signal GND pattern and provide single p oint grounding at the reference point of the set so that voltage
variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND voltage
to change. Take care that the GND wiring pattern of externally attached components also does not change.
(11) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a
lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(12) Thermal shutdown circuit (TSD)
When junction temperatures become 170°C (typ) or higher, the thermal shutdown circuit operates and turns a switch OFF.
The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed
at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the
LSI assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
BD6040GUL, BD6041GUL
Technical Note
12/13
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
Ambient temperature
: Ta [°C]
Power dissipation : Pd [W]
Pd=0.725W
Ta_max=85°C
-5.8mW/°C
● Power Dissipation
※ On the ROHM’s spec ificat ion Boar d
Fig. 25 Power dissipation vs. Ta
BD6040GUL, BD6041GUL
Technical Note
13/13
●Ordering p a rt number
B D 6 0 4 0 G U L - E 2
Part No. Part No.
BD6040
BD6041
Package
GUL : VCSP50L1 Packaging and forming specification
E2: Embossed tape and reel
(Unit : mm)
VCSP50L1(BD6040GUL)
S
0.08 S
A
B
BA
0.05
1PIN MARK
3
0.3±0.1
9-φ0.25±0.05
1.6±0.1
2
(φ0.15)INDEX POST
C
1
0.3±0.1
B
0.55MAX
1.6±0.1
A
0.1±0.05
P=0.5×2
P=0.5×2
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
Direction of feed
Reel 1pin
(Unit : mm)
VCSP50L1(BD6041GUL)
S
0.08 S
A
B
BA
0.05
1PIN MARK
3
0.3±0.1
9-φ0.25±0.05
1.6±0.1
2
(φ0.15)INDEX POST
C
1
0.3±0.1
B
0.55MAX
1.6±0.1
A
0.1±0.05
P=0.5×2
P=0.5×2
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
