CPC1117N Single-Pole, Normally Closed 4-Lead SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Rating 60 150 16 1 Units VP mArms / mADC mA Features * Designed for use in security systems complying with EN50130-4 * Only 1mA of LED current required to operate * 1500Vrms Input/Output Isolation * Small 4-Lead SOP Package * TTL/CMOS Compatible input * No Moving Parts * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Immune to radiated EM fields * SMD Pick & Place, Wave Solderable * Tape & Reel Version Available Applications * Security * Passive Infrared Detectors (PIR) * Data Signalling * Sensor Circuitry * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Aerospace * Industrial Controls Description The CPC1117N is a miniature single-pole, normally closed (1-Form-B) solid state relay in a 4-lead SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input/output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division's patented OptoMOS architecture. The optically coupled output is controlled by the input's highly efficient GaAlAs infrared LED. IXYS Integrated Circuits Division's state of the art double-molded vertical construction packaging makes the CPC1117N one of the world's smallest relays. It offers board space savings of at least 20% over the competitor's larger 4-lead SOP relay. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1175739 * EN/IEC 60950-1 Certified Component: TUV Certificate B 10 05 49410 006 Ordering Information Part # CPC1117N CPC1117NTR Description 4-Lead SOP (100/tube) 4-Lead SOP (2000/reel) Pin Configuration + Control - Control 1 4 2 3 Load Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% toff Pb DS-CPC1117N-R08 ton e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1117N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Disipation Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Ratings 60 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms C C Derate linearly 3.33 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate (Output Open) 3 Input Control Current to Deactivate (Output Closed) Input Voltage Drop Reverse Input Current Common Characteristics Capacitance Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IF=0mA t=10ms IF=0mA, IL=120mA IF=1mA, VL=60VP IL ILPK RON ILEAK - 5 - 150 350 16 1 mArms / mADC mAP IF=1mA, VL=50V, f=1MHz ton toff COUT - 0.316 1.55 10 10 10 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.16 0.14 1.2 - 1 1.4 10 mA mA V A - - - 1 - pF IF=2mA, VL=10V A ms pF Load current derates linearly from 150mA @ 25oC to 100mA @85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a LED drive current of 3mA is recommended. www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1117N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA, TA=25C) 35 25 20 15 10 Device Count (N) 25 15 10 5 5 0 15 10 5 0 0 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) 0.28 1.15 0.38 Device Count (N) 15 10 5 35 35 30 30 25 20 15 10 15 10 5 0.15 0.17 0.19 LED Current (mA) 0.21 0 5.0 0.23 1.4 1.3 1.2 IF=5mA IF=2mA IF=1mA 1.0 -40 0 20 40 60 Temperature (C) 80 5.4 5.5 85 5.6 Typical Turn-On Time vs. LED Forward Current (IL=100mA, TA=25C) 0.35 0.34 0.33 0.32 0.31 0.30 0.29 0.28 0.27 0.26 0.25 Turn-On Time (ms) 0.20 0.15 0.10 0 20 40 60 Temperature (C) 80 100 115 Typical Turn-Off Time vs. LED Forward Current (IL=100mA, TA=25C) 3.0 20 30 LED Current (mA) 40 2.5 2.0 1.5 1.0 0 50 Typical Turn-On Time vs. Temperature (IL=100mA) 0.40 IF=10mA IF=5mA IF=2mA IF=1mA 0.35 0.30 10 0.25 20 30 LED Current (mA) 40 50 Typical Turn-Off Time vs. Temperature (IL=100mA) 5 IF=1mA IF=2mA IF=5mA IF=10mA 4 3 2 1 0 0.20 -20 95 100 105 110 Blocking Voltage (VP) 0.0 10 0.45 0.25 -40 90 0.5 0 100 Typical IF for Switch Operation vs. Temperature (IL=100mA) 0.30 LED Current (mA) -20 5.3 Turn-Off Time (ms) IF=50mA IF=20mA IF=10mA Turn-On Time (ms) LED Forward Voltage (V) 1.6 1.1 5.2 On-Resistance (:) Typical LED Forward Voltage Drop vs. Temperature 1.5 5.1 Turn-Off Time (ms) 0.13 2.05 20 0 0.11 1.45 1.60 1.75 1.90 Turn-Off Time (ms) 25 5 0 1.30 Typical Blocking Voltage Distribution (N=50, IF=1mA, TA=25C) Typical On-Resistance Distribution (N=50, IL=150mA, TA=25C) Typical IF for Switch Operation (N=50, IL=150mA, TA=25C) 20 0.30 0.32 0.34 0.36 Turn-On Time (ms) Device Count (N) 1.17 Typical Turn-Off Time (N=50, IF=2mA, IL=100mA, TA=25C) 20 20 Device Count (N) Device Count (N) 30 Device Count (N) Typical Turn-On Time (N=50, IF=2mA, IL=100mA, TA=25C) -40 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R08 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1117N PERFORMANCE DATA* 150 Load Current (mA) On-Resistance (:) 7 6 5 4 3 Typical Load Current vs. Load Voltage (TA=25C) 200 50 0 -50 -100 2 -40 -20 0 20 40 60 80 -0.33 0.33 0.66 110 105 100 50 -40 -20 40 0.25 0.20 0.15 0.10 0.05 90 0 80 20 40 60 80 100 120 Output Capacitance vs. Load Voltage (IF=1mA, f=1MHz, TA=25C) 35 30 25 20 15 10 5 -40 100 0 Temperature (C) 0.30 95 20 40 60 Temperature (C) 75 1.00 Output Capacitance (pF) 115 Leakage (A) Blocking Voltage (VP) 0 0.35 0 100 Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=2mA, VL=60V) 0.40 120 -20 125 Load Voltage (V) Typical Blocking Voltage vs. Temperature (IF=2mA) -40 150 0 -0.66 Temperature (C) 125 175 25 -150 -1.00 100 Maximum Load Current vs. Temperature (IF=0mA) 225 100 Load Current (mA) 8 Typical On-Resistance vs. Temperature (IF=0mA, IL=150mA) -20 0 20 40 60 80 100 Temperature (C) 0 10 20 30 40 Load Voltage(V) 50 60 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10s 100s 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R08 INTEGRATED CIRCUITS DIVISION CPC1117N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1117N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1117N 260C for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R08 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1117N Mechanical Dimensions CPC1117N 4.089 0.203 (0.161 0.008) Recommended PCB Land Pattern 0.200 0.025 (0.008 0.001) 0.60 (0.0217) 6.096 0.102 (0.240 0.004) 3.810 0.076 (0.150 0.003) 0.432 0.127 (0.017 0.005) 5.60 (0.2205) 1.02 0.025 (0.040 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.30 (0.0512) 2.184 Max (0.086 Max) 2.54 (0.10) Lead to package standoff: 0.0637 0.0383 (0.0025 0.0015) 0.762 0.102 (0.030 0.004) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1117NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1117N-R08 (c)Copyright 2012, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/14/2012