Alle Rechte vorbehalten! Ald rights reserved 5 | 4 | 3 2 7 Mating face according to MIL-C-24308 / DIN 41 652 / CECC 75301-802 6,1 No. 1 contact 4,5 3) - a | S| Yt o | 2 2,94 7,3 in | o Grounding pins 0,2x0,6 9,4 Printed board layout(1,640,2 thick) View component side (PCB plating = Tin] [33.3] eT i nit eT [eo raf 2.74] 19, 18 = S Uf WT No. 1 contact x || [x AARAA TTY AL 33,3 *0,1 gt 40,1 39,2 = 2,7 6x| 2,74 |=16, 44 Mounting force on Printed board : 25 - 80N E 09 66 262 6815 M3 2 Dat. Nane D-Sub male low profile Mafstah/ 09 66 262 7815 M3 3 Detail. 23-NOV-01] JB 15 poles with solder pins, 09 66 262 5815 M3 0,76 um Au Insp. AIL Dim. inom nuts, board lock 15s 09 66 262 6816] 4-40 UNC 2 Stand. Orig. Size DIN A & and grounding pins me 09 66 262 7816| 4-40 UNC 3 Blatt/ Page 09 66 262 5816| 4-40 UNC 0,76 um Au 29733 pa-ov-of JB | PARI ANG CURE firs IB 09 66 262 X81x y Part number |nut thread | Performance level Mod. Dat. Name aris Sub,