PIC16C62X Data Sheet EPROM-Based 8-Bit CMOS Microcontrollers 2003 Microchip Technology Inc. DS30235J Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE and PowerSmart are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Accuron, Application Maestro, dsPIC, dsPICDEM, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode, SmartSensor, SmartShunt, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2003, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. DS30235J - page ii 2003 Microchip Technology Inc. PIC16C62X EPROM-Based 8-Bit CMOS Microcontrollers Devices included in this data sheet: Referred to collectively as PIC16C62X. * * * PIC16C620A PIC16C621A PIC16C622A High Performance RISC CPU: * Only 35 instructions to learn * All single cycle instructions (200 ns), except for program branches which are two-cycle * Operating speed: - DC - 40 MHz clock input - DC - 100 ns instruction cycle Program Memory Data Memory PIC16C620 512 80 PIC16C620A 512 96 PIC16CR620A 512 96 PIC16C621 1K 80 PIC16C621A 1K 96 PIC16C622 2K 128 PIC16C622A 2K 128 Device * * * * Interrupt capability 16 special function hardware registers 8-level deep hardware stack Direct, Indirect and Relative addressing modes Peripheral Features: * 13 I/O pins with individual direction control * High current sink/source for direct LED drive * Analog comparator module with: - Two analog comparators - Programmable on-chip voltage reference (VREF) module - Programmable input multiplexing from device inputs and internal voltage reference - Comparator outputs can be output signals * Timer0: 8-bit timer/counter with 8-bit programmable prescaler 2003 Microchip Technology Inc. RA2/AN2/VREF RA3/AN3 RA4/T0CKI MCLR/VPP VSS RB0/INT RB1 RB2 RB3 *1 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 10 RA1/AN1 RA0/AN0 OSC1/CLKIN OSC2/CLKOUT VDD RB7 RB6 RB5 RB4 PIC16C62X PIC16C620 PIC16C621 PIC16C622 PIC16CR620A PDIP, SOIC, Windowed CERDIP PIC16C62X * * * * Pin Diagrams 20 19 18 17 16 15 14 13 12 11 RA1/AN1 RA0/AN0 OSC1/CLKIN OSC2/CLKOUT VDD VDD RB7 RB6 RB5 RB4 SSOP RA2/AN2/VREF RA3/AN3 RA4/T0CKI MCLR/VPP VSS VSS RB0/INT RB1 RB2 RB3 *1 2 3 4 5 6 7 8 9 10 Special Microcontroller Features: * Power-on Reset (POR) * Power-up Timer (PWRT) and Oscillator Start-up Timer (OST) * Brown-out Reset * Watchdog Timer (WDT) with its own on-chip RC oscillator for reliable operation * Programmable code protection * Power saving SLEEP mode * Selectable oscillator options * Serial in-circuit programming (via two pins) * Four user programmable ID locations CMOS Technology: * Low power, high speed CMOS EPROM technology * Fully static design * Wide operating range - 2.5V to 5.5V * Commercial, industrial and extended temperature range * Low power consumption - < 2.0 mA @ 5.0V, 4.0 MHz - 15 A typical @ 3.0V, 32 kHz - < 1.0 A typical standby current @ 3.0V DS30235J-page 1 PIC16C62X Device Differences Voltage Range Oscillator Process Technology (Microns) 2.5 - 6.0 See Note 1 0.9 PIC16C621 2.5 - 6.0 See Note 1 0.9 PIC16C622(3) 2.5 - 6.0 See Note 1 0.9 PIC16C620A(4) 2.7 - 5.5 See Note 1 0.7 PIC16CR620A(2) 2.5 - 5.5 See Note 1 0.7 2.7 - 5.5 See Note 1 0.7 Device PIC16C620(3) (3) PIC16C621A (4) PIC16C622A(4) 2.7 - 5.5 See Note 1 0.7 Note 1: If you change from this device to another device, please verify oscillator characteristics in your application. 2: For ROM parts, operation from 2.5V - 3.0V will require the PIC16LCR62X parts. 3: For OTP parts, operation from 2.5V - 3.0V will require the PIC16LC62X parts. 4: For OTP parts, operations from 2.7V - 3.0V will require the PIC16LC62XA parts. DS30235J-page 2 2003 Microchip Technology Inc. PIC16C62X Table of Contents 1.0 General Description .................................................................................................................................................................. 5 2.0 PIC16C62X Device Varieties .................................................................................................................................................... 7 3.0 Architectural Overview .............................................................................................................................................................. 9 4.0 Memory Organization ............................................................................................................................................................. 13 5.0 I/O Ports.................................................................................................................................................................................. 25 6.0 Timer0 Module ........................................................................................................................................................................ 31 7.0 Comparator Module ................................................................................................................................................................ 37 8.0 Voltage Reference Module ..................................................................................................................................................... 43 9.0 Special Features of the CPU .................................................................................................................................................. 45 10.0 Instruction Set Summary ........................................................................................................................................................ 61 11.0 Development Support ............................................................................................................................................................. 75 12.0 Electrical Specifications .......................................................................................................................................................... 81 13.0 Device Characterization Information ..................................................................................................................................... 109 14.0 Packaging Information .......................................................................................................................................................... 113 Appendix A: Enhancements.............................................................................................................................................................. 119 Appendix B: Compatibility ................................................................................................................................................................. 119 Index ............................................................................................................................................................................................... 121 On-Line Support ................................................................................................................................................................................ 123 Systems Information and Upgrade Hot Line ..................................................................................................................................... 123 Reader Response ............................................................................................................................................................................. 124 Product Identification System ........................................................................................................................................................... 125 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@mail.microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) * The Microchip Corporate Literature Center; U.S. FAX: (480) 792-7277 When contacting a sales office or the literature center, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com/cn to receive the most current information on all of our products. 2003 Microchip Technology Inc. DS30235J-page 3 PIC16C62X NOTES: DS30235J-page 4 2003 Microchip Technology Inc. PIC16C62X 1.0 GENERAL DESCRIPTION The PIC16C62X devices are 18 and 20-Pin ROM/ EPROM-based members of the versatile PICmicro(R) family of low cost, high performance, CMOS, fullystatic, 8-bit microcontrollers. All PICmicro microcontrollers employ an advanced RISC architecture. The PIC16C62X devices have enhanced core features, eight-level deep stack, and multiple internal and external interrupt sources. The separate instruction and data buses of the Harvard architecture allow a 14-bit wide instruction word with the separate 8-bit wide data. The two-stage instruction pipeline allows all instructions to execute in a single cycle, except for program branches (which require two cycles). A total of 35 instructions (reduced instruction set) are available. Additionally, a large register set gives some of the architectural innovations used to achieve a very high performance. PIC16C62X microcontrollers typically achieve a 2:1 code compression and a 4:1 speed improvement over other 8-bit microcontrollers in their class. The PIC16C620A, PIC16C621A and PIC16CR620A have 96 bytes of RAM. The PIC16C622(A) has 128 bytes of RAM. Each device has 13 I/O pins and an 8bit timer/counter with an 8-bit programmable prescaler. In addition, the PIC16C62X adds two analog comparators with a programmable on-chip voltage reference module. The comparator module is ideally suited for applications requiring a low cost analog interface (e.g., battery chargers, threshold detectors, white goods controllers, etc). customization of application programs (detection levels, pulse generation, timers, etc.) extremely fast and convenient. The small footprint packages make this microcontroller series perfect for all applications with space limitations. Low cost, low power, high performance, ease of use and I/O flexibility make the PIC16C62X very versatile. 1.1 Family and Upward Compatibility Those users familiar with the PIC16C5X family of microcontrollers will realize that this is an enhanced version of the PIC16C5X architecture. Please refer to Appendix A for a detailed list of enhancements. Code written for the PIC16C5X can be easily ported to PIC16C62X family of devices (Appendix B). The PIC16C62X family fills the niche for users wanting to migrate up from the PIC16C5X family and not needing various peripheral features of other members of the PIC16XX mid-range microcontroller family. 1.2 Development Support The PIC16C62X family is supported by a full-featured macro assembler, a software simulator, an in-circuit emulator, a low cost development programmer and a full-featured programmer. Third Party "C" compilers are also available. PIC16C62X devices have special features to reduce external components, thus reducing system cost, enhancing system reliability and reducing power consumption. There are four oscillator options, of which the single pin RC oscillator provides a low cost solution, the LP oscillator minimizes power consumption, XT is a standard crystal, and the HS is for High Speed crystals. The SLEEP (Power-down) mode offers power savings. The user can wake-up the chip from SLEEP through several external and internal interrupts and RESET. A highly reliable Watchdog Timer with its own on-chip RC oscillator provides protection against software lock- up. A UV-erasable CERDIP-packaged version is ideal for code development while the cost effective One-TimeProgrammable (OTP) version is suitable for production in any volume. Table 1-1 shows the features of the PIC16C62X midrange microcontroller families. A simplified block diagram of the PIC16C62X is shown in Figure 3-1. The PIC16C62X series fits perfectly in applications ranging from battery chargers to low power remote sensors. The EPROM technology makes 2003 Microchip Technology Inc. DS30235J-page 5 PIC16C62X TABLE 1-1: PIC16C62X FAMILY OF DEVICES PIC16C620(3) PIC16C620A(1)(4) PIC16CR620A(2) PIC16C621(3) PIC16C621A(1)(4) PIC16C622(3) PIC16C622A(1)(4) Clock Maximum Frequency 20 of Operation (MHz) 40 20 20 40 20 40 Memory EPROM Program Memory (x14 words) 512 512 1K 1K 2K 2K 512 Data Memory (bytes) 80 96 96 80 96 128 128 TMR0 TMR0 TMRO TMR0 TMR0 TMR0 TMR0 Comparators(s) 2 2 2 2 2 2 2 Internal Reference Voltage Yes Yes Yes Yes Yes Yes Yes Interrupt Sources 4 4 4 4 4 4 4 I/O Pins 13 13 13 13 13 13 13 2.7-5.5 2.5-5.5 2.5-6.0 2.7-5.5 2.5-6.0 2.7-5.5 Yes Peripherals Timer Module(s) Features Voltage Range (Volts) 2.5-6.0 Brown-out Reset Yes Yes Yes Yes Packages 18-pin DIP, SOIC; 20-pin SSOP 18-pin DIP, SOIC; 20-pin SSOP 18-pin DIP, SOIC; 20-pin SSOP 18-pin DIP, 18-pin DIP, SOIC; SOIC; 20-pin SSOP 20-pin SSOP Yes Yes 18-pin DIP, SOIC; 20-pin SSOP 18-pin DIP, SOIC; 20-pin SSOP All PICmicro(R) Family devices have Power-on Reset, selectable Watchdog Timer, selectable code protect and high I/O current capability. All PIC16C62X Family devices use serial programming with clock pin RB6 and data pin RB7. Note 1: If you change from this device to another device, please verify oscillator characteristics in your application. 2: For ROM parts, operation from 2.0V - 2.5V will require the PIC16LCR62XA parts. 3: For OTP parts, operation from 2.5V - 3.0V will require the PIC16LC62X part. 4: For OTP parts, operation from 2.7V - 3.0V will require the PIC16LC62XA part. DS30235J-page 6 2003 Microchip Technology Inc. PIC16C62X 2.0 PIC16C62X DEVICE VARIETIES A variety of frequency ranges and packaging options are available. Depending on application and production requirements, the proper device option can be selected using the information in the PIC16C62X Product Identification System section at the end of this data sheet. When placing orders, please use this page of the data sheet to specify the correct part number. 2.1 UV Erasable Devices The UV erasable version, offered in CERDIP package, is optimal for prototype development and pilot programs. This version can be erased and reprogrammed to any of the Oscillator modes. Microchip's PICSTART and PRO MATE programmers both support programming of the PIC16C62X. Note: 2.2 Microchip does not recommend code protecting windowed devices. One-Time-Programmable (OTP) Devices The availability of OTP devices is especially useful for customers who need the flexibility for frequent code updates and small volume applications. In addition to the program memory, the configuration bits must also be programmed. 2003 Microchip Technology Inc. 2.3 Quick-Turnaround-Production (QTP) Devices Microchip offers a QTP programming service for factory production orders. This service is made available for users who chose not to program a medium to high quantity of units and whose code patterns have stabilized. The devices are identical to the OTP devices, but with all EPROM locations and configuration options already programmed by the factory. Certain code and prototype verification procedures apply before production shipments are available. Please contact your Microchip Technology sales office for more details. 2.4 Serialized Quick-TurnaroundProductionSM (SQTPSM) Devices Microchip offers a unique programming service where a few user-defined locations in each device are programmed with different serial numbers. The serial numbers may be random, pseudo-random or sequential. Serial programming allows each device to have a unique number, which can serve as an entry-code, password or ID number. DS30235J-page 7 PIC16C62X NOTES: DS30235J-page 8 2003 Microchip Technology Inc. PIC16C62X 3.0 ARCHITECTURAL OVERVIEW The high performance of the PIC16C62X family can be attributed to a number of architectural features commonly found in RISC microprocessors. To begin with, the PIC16C62X uses a Harvard architecture, in which, program and data are accessed from separate memories using separate busses. This improves bandwidth over traditional von Neumann architecture, where program and data are fetched from the same memory. Separating program and data memory further allows instructions to be sized differently than 8-bit wide data word. Instruction opcodes are 14-bits wide making it possible to have all single word instructions. A 14-bit wide program memory access bus fetches a 14-bit instruction in a single cycle. A two-stage pipeline overlaps fetch and execution of instructions. Consequently, all instructions (35) execute in a single cycle (200 ns @ 20 MHz) except for program branches. The PIC16C620(A) and PIC16CR620A address 512 x 14 on-chip program memory. The PIC16C621(A) addresses 1K x 14 program memory. The PIC16C622(A) addresses 2K x 14 program memory. All program memory is internal. The PIC16C62X devices contain an 8-bit ALU and working register. The ALU is a general purpose arithmetic unit. It performs arithmetic and Boolean functions between data in the working register and any register file. The ALU is 8-bits wide and capable of addition, subtraction, shift and logical operations. Unless otherwise mentioned, arithmetic operations are two's complement in nature. In two-operand instructions, typically one operand is the working register (W register). The other operand is a file register or an immediate constant. In single operand instructions, the operand is either the W register or a file register. The W register is an 8-bit working register used for ALU operations. It is not an addressable register. Depending on the instruction executed, the ALU may affect the values of the Carry (C), Digit Carry (DC), and Zero (Z) bits in the STATUS register. The C and DC bits operate as a Borrow and Digit Borrow out bit, respectively, bit in subtraction. See the SUBLW and SUBWF instructions for examples. A simplified block diagram is shown in Figure 3-1, with a description of the device pins in Table 3-1. The PIC16C62X can directly or indirectly address its register files or data memory. All special function registers including the program counter are mapped in the data memory. The PIC16C62X has an orthogonal (symmetrical) instruction set that makes it possible to carry out any operation on any register using any Addressing mode. This symmetrical nature and lack of `special optimal situations' make programming with the PIC16C62X simple yet efficient. In addition, the learning curve is reduced significantly. 2003 Microchip Technology Inc. DS30235J-page 9 PIC16C62X FIGURE 3-1: BLOCK DIAGRAM Device Program Memory Data Memory (RAM) PIC16C620 PIC16C620A PIC16CR620A PIC16C621 PIC16C621A PIC16C622 PIC16C622A 512 x 14 512 x 14 512 x 14 1K x 14 1K x 14 2K x 14 2K x 14 80 x 8 96 x 8 96 x 8 80 x 8 96 x 8 128 x 8 128 x 8 13 8 Data Bus Program Counter Voltage Reference EPROM Program Memory Program Bus RAM File Registers 8-Level Stack (13-bit) 14 RAM Addr (1) 9 Comparator RA0/AN0 Addr MUX Instruction reg Direct Addr 7 8 Indirect Addr FSR reg RA1/AN1 + RA2/AN2/VREF RA3/AN3 + STATUS reg TMR0 3 MUX Power-up Timer Instruction Decode & Control Timing Generation OSC1/CLKIN OSC2/CLKOUT Oscillator Start-up Timer Power-on Reset Watchdog Timer RA4/T0CKI ALU W reg I/O Ports Brown-out Reset PORTB MCLR VDD, VSS Note 1: Higher order bits are from the STATUS register. DS30235J-page 10 2003 Microchip Technology Inc. PIC16C62X TABLE 3-1: Name OSC1/CLKIN PIC16C62X PINOUT DESCRIPTION DIP/SOIC Pin # SSOP Pin # I/O/P Type Buffer Type 16 18 I ST/CMOS OSC2/CLKOUT MCLR/VPP Description Oscillator crystal input/external clock source input. 15 17 O -- Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. In RC mode, OSC2 pin outputs CLKOUT, which has 1/4 the frequency of OSC1 and denotes the instruction cycle rate. 4 4 I/P ST Master Clear (Reset) input/programming voltage input. This pin is an Active Low Reset to the device. PORTA is a bi-directional I/O port. RA0/AN0 17 19 I/O ST Analog comparator input RA1/AN1 18 20 I/O ST Analog comparator input RA2/AN2/VREF 1 1 I/O ST Analog comparator input or VREF output RA3/AN3 2 2 I/O ST Analog comparator input /output 3 3 I/O ST Can be selected to be the clock input to the Timer0 timer/counter or a comparator output. Output is open drain type. RA4/T0CKI PORTB is a bi-directional I/O port. PORTB can be software programmed for internal weak pull-up on all inputs. RB0/INT RB0/INT can also be selected as an external interrupt pin. 6 7 I/O TTL/ST(1) RB1 7 8 I/O TTL RB2 8 9 I/O TTL RB3 9 10 I/O TTL RB4 10 11 I/O TTL Interrupt-on-change pin. RB5 11 12 I/O TTL Interrupt-on-change pin. RB6 12 13 I/O TTL/ST(2) Interrupt-on-change pin. Serial programming clock. RB7 13 14 I/O TTL/ST(2) Interrupt-on-change pin. Serial programming data. VSS 5 5,6 P -- Ground reference for logic and I/O pins. VDD 14 15,16 P -- Positive supply for logic and I/O pins. Legend: O = output I/O = input/output P = power -- = Not used I = Input ST = Schmitt Trigger input TTL = TTL input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode. 2003 Microchip Technology Inc. DS30235J-page 11 PIC16C62X 3.1 Clocking Scheme/Instruction Cycle 3.2 Instruction Flow/Pipelining An "Instruction Cycle" consists of four Q cycles (Q1, Q2, Q3 and Q4). The instruction fetch and execute are pipelined such that fetch takes one instruction cycle while decode and execute takes another instruction cycle. However, due to the pipelining, each instruction effectively executes in one cycle. If an instruction causes the program counter to change (e.g., GOTO) then two cycles are required to complete the instruction (Example 3-1). The clock input (OSC1/CLKIN pin) is internally divided by four to generate four non-overlapping quadrature clocks namely Q1, Q2, Q3 and Q4. Internally, the program counter (PC) is incremented every Q1, the instruction is fetched from the program memory and latched into the instruction register in Q4. The instruction is decoded and executed during the following Q1 through Q4. The clocks and instruction execution flow is shown in Figure 3-2. A fetch cycle begins with the program counter (PC) incrementing in Q1. In the execution cycle, the fetched instruction is latched into the "Instruction Register (IR)" in cycle Q1. This instruction is then decoded and executed during the Q2, Q3 and Q4 cycles. Data memory is read during Q2 (operand read) and written during Q4 (destination write). FIGURE 3-2: CLOCK/INSTRUCTION CYCLE Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Q1 Q2 Internal phase clock Q3 Q4 PC PC OSC2/CLKOUT (RC mode) EXAMPLE 3-1: PC+1 Fetch INST (PC) Execute INST (PC-1) PC+2 Fetch INST (PC+1) Execute INST (PC) Fetch INST (PC+2) Execute INST (PC+1) INSTRUCTION PIPELINE FLOW 1. MOVLW 55h 2. MOVWF PORTB 3. CALL SUB_1 4. BSF PORTA, BIT3 Fetch 1 Execute 1 Fetch 2 Execute 2 Fetch 3 Execute 3 Fetch 4 Flush Fetch SUB_1 Note: Execute SUB_1 All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction is "flushed" from the pipeline, while the new instruction is being fetched and then executed. DS30235J-page 12 2003 Microchip Technology Inc. PIC16C62X 4.0 MEMORY ORGANIZATION 4.1 Program Memory Organization The PIC16C62X has a 13-bit program counter capable of addressing an 8K x 14 program memory space. Only the first 512 x 14 (0000h - 01FFh) for the PIC16C620(A) and PIC16CR620, 1K x 14 (0000h 03FFh) for the PIC16C621(A) and 2K x 14 (0000h 07FFh) for the PIC16C622(A) are physically implemented. Accessing a location above these boundaries will cause a wrap-around within the first 512 x 14 space (PIC16C(R)620(A)) or 1K x 14 space (PIC16C621(A)) or 2K x 14 space (PIC16C622(A)). The RESET vector is at 0000h and the interrupt vector is at 0004h (Figure 4-1, Figure 4-2, Figure 4-3). FIGURE 4-1: FIGURE 4-2: PC<12:0> CALL, RETURN RETFIE, RETLW 13 Stack Level 1 Stack Level 2 Stack Level 8 PROGRAM MEMORY MAP AND STACK FOR THE PIC16C620/PIC16C620A/ PIC16CR620A RESET Vector 000h Interrupt Vector 0004 0005 On-Chip Program Memory PC<12:0> CALL, RETURN RETFIE, RETLW PROGRAM MEMORY MAP AND STACK FOR THE PIC16C621/PIC16C621A 03FFh 13 0400h Stack Level 1 1FFFh Stack Level 2 FIGURE 4-3: Stack Level 8 RESET Vector PROGRAM MEMORY MAP AND STACK FOR THE PIC16C622/PIC16C622A 000h PC<12:0> CALL, RETURN RETFIE, RETLW Interrupt Vector 0004 0005 13 Stack Level 1 Stack Level 2 Stack Level 8 On-Chip Program Memory 01FFh RESET Vector 000h Interrupt Vector 0004 0005 0200h 1FFFh On-Chip Program Memory 07FFh 0800h 1FFFh 2003 Microchip Technology Inc. DS30235J-page 13 PIC16C62X 4.2 Data Memory Organization The data memory (Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7) is partitioned into two banks, which contain the General Purpose Registers and the Special Function Registers. Bank 0 is selected when the RP0 bit is cleared. Bank 1 is selected when the RP0 bit (STATUS <5>) is set. The Special Function Registers are located in the first 32 locations of each bank. Register locations 20-7Fh (Bank0) on the PIC16C620A/CR620A/621A and 20-7Fh (Bank0) and A0-BFh (Bank1) on the PIC16C622 and PIC16C622A are General Purpose Registers implemented as static RAM. Some Special Purpose Registers are mapped in Bank 1. 4.2.1 GENERAL PURPOSE REGISTER FILE The register file is organized as 80 x 8 in the PIC16C620/621, 96 x 8 in the PIC16C620A/621A/ CR620A and 128 x 8 in the PIC16C622(A). Each is accessed either directly or indirectly through the File Select Register FSR (Section 4.4). Addresses F0h-FFh of bank1 are implemented as common ram and mapped back to addresses 70h-7Fh in bank0 on the PIC16C620A/621A/622A/CR620A. DS30235J-page 14 2003 Microchip Technology Inc. PIC16C62X FIGURE 4-4: DATA MEMORY MAP FOR THE PIC16C620/621 File Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h 6Fh INDF(1) TMR0 PCL STATUS FSR PORTA PORTB INDF(1) OPTION PCL STATUS FSR TRISA TRISB PCLATH INTCON PIR1 PCLATH INTCON PIE1 PCON CMCON VRCON File Address File Address 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h A0h General Purpose Register FIGURE 4-5: DATA MEMORY MAP FOR THE PIC16C622 File Address INDF(1) TMR0 PCL STATUS FSR PORTA PORTB INDF(1) OPTION PCL STATUS FSR TRISA TRISB PCLATH INTCON PIR1 PCLATH INTCON PIE1 PCON CMCON General Purpose Register VRCON General Purpose Register 70h 7Fh 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh A0h BFh C0h FFh Bank 0 Bank 1 Unimplemented data memory locations, read as '0'. Note 1: Not a physical register. 2003 Microchip Technology Inc. 7Fh FFh Bank 0 Bank 1 Unimplemented data memory locations, read as '0'. Note 1: Not a physical register. DS30235J-page 15 PIC16C62X FIGURE 4-6: DATA MEMORY MAP FOR THE PIC16C620A/CR620A/621A File Address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h INDF(1) TMR0 PCL STATUS FSR PORTA PORTB INDF(1) OPTION PCL STATUS FSR TRISA TRISB PCLATH INTCON PIR1 PCLATH INTCON PIE1 PCON CMCON VRCON File Address File Address 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h 14h 15h 16h 17h 18h 19h 1Ah 1Bh 1Ch 1Dh 1Eh 1Fh 20h A0h General Purpose Register FIGURE 4-7: DATA MEMORY MAP FOR THE PIC16C622A File Address INDF(1) TMR0 PCL STATUS FSR PORTA PORTB INDF(1) OPTION PCL STATUS FSR TRISA TRISB PCLATH INTCON PIR1 PCLATH INTCON PIE1 PCON VRCON CMCON General Purpose Register General Purpose Register 80h 81h 82h 83h 84h 85h 86h 87h 88h 89h 8Ah 8Bh 8Ch 8Dh 8Eh 8Fh 90h 91h 92h 93h 94h 95h 96h 97h 98h 99h 9Ah 9Bh 9Ch 9Dh 9Eh 9Fh A0h BFh C0h 6Fh 70h 7Fh General Purpose Register Bank 0 F0h Accesses 70h-7Fh FFh Bank 1 Unimplemented data memory locations, read as '0'. Note 1: Not a physical register. DS30235J-page 16 6Fh 70h 7Fh General Purpose Register Bank 0 F0h Accesses 70h-7Fh FFh Bank 1 Unimplemented data memory locations, read as '0'. Note 1: Not a physical register. 2003 Microchip Technology Inc. PIC16C62X 4.2.2 SPECIAL FUNCTION REGISTERS The Special Function Registers can be classified into two sets (core and peripheral). The Special Function Registers associated with the "core" functions are described in this section. Those related to the operation of the peripheral features are described in the section of that peripheral feature. The Special Function Registers are registers used by the CPU and Peripheral functions for controlling the desired operation of the device (Table 4-1). These registers are static RAM. TABLE 4-1: SPECIAL REGISTERS FOR THE PIC16C62X Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Value on all other RESETS(1) Bank 0 00h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 01h TMR0 Timer0 Module's Register 02h PCL Program Counter's (PC) Least Significant Byte 03h STATUS 04h FSR 05h PORTA -- -- -- RA4 RA3 RA2 RA1 06h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 07h-09h Unimplemented 0Ah PCLATH -- 0Bh INTCON 0Ch PIR1 IRP(2) RP1(2) RP0 TO PD Z DC CMCON xxxx xxxx xxxx xxxx uuuu uuuu 0000 0000 0000 0000 0001 1xxx 000q quuu xxxx xxxx uuuu uuuu RA0 ---x 0000 ---u 0000 RB0 xxxx xxxx uuuu uuuu C Indirect data memory address pointer Write buffer for upper 5 bits of program counter -- -- ---0 0000 ---0 0000 -- -- GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u -- CMIF -- -- -- -- -- -- -0-- ---- -0-- ---- 0Dh-1Eh Unimplemented 1Fh xxxx xxxx C2OUT C1OUT -- -- CIS CM2 CM1 CM0 -- -- 00-- 0000 00-- 0000 xxxx xxxx xxxx xxxx 1111 1111 1111 1111 0000 0000 0000 0000 0001 1xxx 000q quuu xxxx xxxx uuuu uuuu Bank 1 80h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 81h OPTION 82h PCL 83h STATUS 84h FSR 85h TRISA -- -- -- TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 ---1 1111 ---1 1111 86h TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111 87h-89h Unimplemented 8Ah PCLATH -- 8Bh INTCON 8Ch PIE1 8Dh Unimplemented 8Eh PCON 8Fh-9Eh Unimplemented 9Fh VRCON RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 PD Z DC C Program Counter's (PC) Least Significant Byte IRP(2) RP1(2) RP0 TO Indirect data memory address pointer Write buffer for upper 5 bits of program counter -- -- ---0 0000 ---0 0000 -- -- GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u -- CMIE -- -- -- -- -- -- -0-- ---- -0-- ---- -- -- -- -- -- -- POR BOR VREN VROE VRR -- VR3 VR2 VR1 VR0 -- -- ---- --0x ---- --uq -- -- 000- 0000 000- 0000 Legend: -- = Unimplemented locations read as `0', u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented Note 1: Other (non Power-up) Resets include MCLR Reset, Brown-out Reset and Watchdog Timer Reset during normal operation. 2: IRP & RP1 bits are reserved; always maintain these bits clear. 2003 Microchip Technology Inc. DS30235J-page 17 PIC16C62X 4.2.2.1 STATUS Register The STATUS register, shown in Register 4-1, contains the arithmetic status of the ALU, the RESET status and the bank select bits for data memory. The STATUS register can be the destination for any instruction, like any other register. If the STATUS register is the destination for an instruction that affects the Z, DC or C bits, then the write to these three bits is disabled. These bits are set or cleared according to the device logic. Furthermore, the TO and PD bits are not writable. Therefore, the result of an instruction with the STATUS register as destination may be different than intended. It is recommended, therefore, that only BCF, BSF, SWAPF and MOVWF instructions are used to alter the STATUS register, because these instructions do not affect any STATUS bit. For other instructions not affecting any STATUS bits, see the "Instruction Set Summary". Note 1: The IRP and RP1 bits (STATUS<7:6>) are not used by the PIC16C62X and should be programmed as '0'. Use of these bits as general purpose R/W bits is NOT recommended, since this may affect upward compatibility with future products. 2: The C and DC bits operate as a Borrow and Digit Borrow out bit, respectively, in subtraction. See the SUBLW and SUBWF instructions for examples. For example, CLRF STATUS will clear the upper-three bits and set the Z bit. This leaves the STATUS register as 000uu1uu (where u = unchanged). REGISTER 4-1: STATUS REGISTER (ADDRESS 03H OR 83H) Reserved Reserved IRP RP1 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x RP0 TO PD Z DC C bit 7 bit 0 bit 7 IRP: Register Bank Select bit (used for indirect addressing) 1 = Bank 2, 3 (100h - 1FFh) 0 = Bank 0, 1 (00h - FFh) The IRP bit is reserved on the PIC16C62X; always maintain this bit clear. bit 6-5 RP<1:0>: Register Bank Select bits (used for direct addressing) 01 = Bank 1 (80h - FFh) 00 = Bank 0 (00h - 7Fh) Each bank is 128 bytes. The RP1 bit is reserved on the PIC16C62X; always maintain this bit clear. bit 4 TO: Time-out bit 1 = After power-up, CLRWDT instruction, or SLEEP instruction 0 = A WDT time-out occurred bit 3 PD: Power-down bit 1 = After power-up or by the CLRWDT instruction 0 = By execution of the SLEEP instruction bit 2 Z: Zero bit 1 = The result of an arithmetic or logic operation is zero 0 = The result of an arithmetic or logic operation is not zero bit 1 DC: Digit carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions)(for borrow the polarity is reversed) 1 = A carry-out from the 4th low order bit of the result occurred 0 = No carry-out from the 4th low order bit of the result bit 0 C: Carry/borrow bit (ADDWF, ADDLW,SUBLW,SUBWF instructions) 1 = A carry-out from the Most Significant bit of the result occurred 0 = No carry-out from the Most Significant bit of the result occurred Note: For borrow the polarity is reversed. A subtraction is executed by adding the two's complement of the second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high or low order bit of the source register. Legend: DS30235J-page 18 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared x = Bit is unknown 2003 Microchip Technology Inc. PIC16C62X 4.2.2.2 OPTION Register Note: The OPTION register is a readable and writable register, which contains various control bits to configure the TMR0/WDT prescaler, the external RB0/INT interrupt, TMR0 and the weak pull-ups on PORTB. REGISTER 4-2: To achieve a 1:1 prescaler assignment for TMR0, assign the prescaler to the WDT (PSA = 1). OPTION REGISTER (ADDRESS 81H) R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 bit 7 bit 0 bit 7 RBPU: PORTB Pull-up Enable bit 1 = PORTB pull-ups are disabled 0 = PORTB pull-ups are enabled by individual port latch values bit 6 INTEDG: Interrupt Edge Select bit 1 = Interrupt on rising edge of RB0/INT pin 0 = Interrupt on falling edge of RB0/INT pin bit 5 T0CS: TMR0 Clock Source Select bit 1 = Transition on RA4/T0CKI pin 0 = Internal instruction cycle clock (CLKOUT) bit 4 T0SE: TMR0 Source Edge Select bit 1 = Increment on high-to-low transition on RA4/T0CKI pin 0 = Increment on low-to-high transition on RA4/T0CKI pin bit 3 PSA: Prescaler Assignment bit 1 = Prescaler is assigned to the WDT 0 = Prescaler is assigned to the Timer0 module bit 2-0 PS<2:0>: Prescaler Rate Select bits Bit Value 000 001 010 011 100 101 110 111 TMR0 Rate 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 1 : 256 WDT Rate 1:1 1:2 1:4 1:8 1 : 16 1 : 32 1 : 64 1 : 128 Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003 Microchip Technology Inc. x = Bit is unknown DS30235J-page 19 PIC16C62X 4.2.2.3 INTCON Register Note: The INTCON register is a readable and writable register, which contains the various enable and flag bits for all interrupt sources except the comparator module. See Section 4.2.2.4 and Section 4.2.2.5 for a description of the comparator enable and flag bits. REGISTER 4-3: Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). INTCON REGISTER (ADDRESS 0BH OR 8BH) R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x GIE PEIE T0IE INTE RBIE T0IF INTF RBIF bit 7 bit 0 bit 7 GIE: Global Interrupt Enable bit 1 = Enables all un-masked interrupts 0 = Disables all interrupts bit 6 PEIE: Peripheral Interrupt Enable bit 1 = Enables all un-masked peripheral interrupts 0 = Disables all peripheral interrupts bit 5 T0IE: TMR0 Overflow Interrupt Enable bit 1 = Enables the TMR0 interrupt 0 = Disables the TMR0 interrupt bit 4 INTE: RB0/INT External Interrupt Enable bit 1 = Enables the RB0/INT external interrupt 0 = Disables the RB0/INT external interrupt bit 3 RBIE: RB Port Change Interrupt Enable bit 1 = Enables the RB port change interrupt 0 = Disables the RB port change interrupt bit 2 T0IF: TMR0 Overflow Interrupt Flag bit 1 = TMR0 register has overflowed (must be cleared in software) 0 = TMR0 register did not overflow bit 1 INTF: RB0/INT External Interrupt Flag bit 1 = The RB0/INT external interrupt occurred (must be cleared in software) 0 = The RB0/INT external interrupt did not occur bit 0 RBIF: RB Port Change Interrupt Flag bit 1 = When at least one of the RB<7:4> pins changed state (must be cleared in software) 0 = None of the RB<7:4> pins have changed state Legend: DS30235J-page 20 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared x = Bit is unknown 2003 Microchip Technology Inc. PIC16C62X 4.2.2.4 PIE1 Register This register contains the individual enable bit for the comparator interrupt. REGISTER 4-4: PIE1 REGISTER (ADDRESS 8CH) U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 -- CMIE -- -- -- -- -- -- bit 7 bit 0 bit 7 Unimplemented: Read as '0' bit 6 CMIE: Comparator Interrupt Enable bit 1 = Enables the Comparator interrupt 0 = Disables the Comparator interrupt bit 5-0 Unimplemented: Read as '0' Legend: 4.2.2.5 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared x = Bit is unknown PIR1 Register This register contains the individual flag bit for the comparator interrupt. Note: Interrupt flag bits get set when an interrupt condition occurs, regardless of the state of its corresponding enable bit or the global enable bit, GIE (INTCON<7>). User software should ensure the appropriate interrupt flag bits are clear prior to enabling an interrupt. REGISTER 4-5: PIR1 REGISTER (ADDRESS 0CH) U-0 R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 -- CMIF -- -- -- -- -- -- bit 7 bit 0 bit 7 Unimplemented: Read as '0' bit 6 CMIF: Comparator Interrupt Flag bit 1 = Comparator input has changed 0 = Comparator input has not changed bit 5-0 Unimplemented: Read as '0' Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003 Microchip Technology Inc. x = Bit is unknown DS30235J-page 21 PIC16C62X 4.2.2.6 PCON Register The PCON register contains flag bits to differentiate between a Power-on Reset, an external MCLR Reset, WDT Reset or a Brown-out Reset. Note: BOR is unknown on Power-on Reset. It must then be set by the user and checked on subsequent RESETS to see if BOR is cleared, indicating a brown-out has occurred. The BOR STATUS bit is a "don't care" and is not necessarily predictable if the brown-out circuit is disabled (by programming BODEN bit in the Configuration word). REGISTER 4-6: PCON REGISTER (ADDRESS 8Eh) U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 -- -- -- -- -- -- POR BOR bit 7 bit 0 bit 7-2 Unimplemented: Read as '0' bit 1 POR: Power-on Reset STATUS bit 1 = No Power-on Reset occurred 0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs) bit 0 BOR: Brown-out Reset STATUS bit 1 = No Brown-out Reset occurred 0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs) Legend: DS30235J-page 22 R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared x = Bit is unknown 2003 Microchip Technology Inc. PIC16C62X 4.3 4.3.2 PCL and PCLATH The program counter (PC) is 13-bits wide. The low byte comes from the PCL register, which is a readable and writable register. The high byte (PC<12:8>) is not directly readable or writable and comes from PCLATH. On any RESET, the PC is cleared. Figure 4-8 shows the two situations for the loading of the PC. The upper example in the figure shows how the PC is loaded on a write to PCL (PCLATH<4:0> PCH). The lower example in the figure shows how the PC is loaded during a CALL or GOTO instruction (PCLATH<4:3> PCH). FIGURE 4-8: LOADING OF PC IN DIFFERENT SITUATIONS PCH PCL 12 8 7 0 PC 8 PCLATH<4:0> 5 Instruction with PCL as Destination ALU result PCLATH PCH 12 11 10 STACK The PIC16C62X family has an 8-level deep x 13-bit wide hardware stack (Figure 4-2 and Figure 4-3). The stack space is not part of either program or data space and the stack pointer is not readable or writable. The PC is PUSHed onto the stack when a CALL instruction is executed or an interrupt causes a branch. The stack is POPed in the event of a RETURN, RETLW or a RETFIE instruction execution. PCLATH is not affected by a PUSH or POP operation. The stack operates as a circular buffer. This means that after the stack has been PUSHed eight times, the ninth push overwrites the value that was stored from the first push. The tenth push overwrites the second push (and so on). Note 1: There are no STATUS bits to indicate stack overflow or stack underflow conditions. 2: There are no instructions/mnemonics called PUSH or POP. These are actions that occur from the execution of the CALL, RETURN, RETLW and RETFIE instructions, or the vectoring to an interrupt address. PCL 8 0 7 PC GOTO,CALL 2 PCLATH<4:3> 11 Opcode <10:0> PCLATH 4.3.1 COMPUTED GOTO A computed GOTO is accomplished by adding an offset to the program counter (ADDWF PCL). When doing a table read using a computed GOTO method, care should be exercised if the table location crosses a PCL memory boundary (each 256 byte block). Refer to the application note, "Implementing a Table Read" (AN556). 2003 Microchip Technology Inc. DS30235J-page 23 PIC16C62X 4.4 Indirect Addressing, INDF and FSR Registers EXAMPLE 4-1: movlw movwf NEXT clrf incf btfss goto The INDF register is not a physical register. Addressing the INDF register will cause indirect addressing. Indirect addressing is possible by using the INDF register. Any instruction using the INDF register actually accesses data pointed to by the File Select Register (FSR). Reading INDF itself indirectly will produce 00h. Writing to the INDF register indirectly results in a no-operation (although STATUS bits may be affected). An effective 9-bit address is obtained by concatenating the 8-bit FSR register and the IRP bit (STATUS<7>), as shown in Figure 4-9. However, IRP is not used in the PIC16C62X. INDIRECT ADDRESSING 0x20 FSR INDF FSR FSR,7 NEXT ;initialize pointer ;to RAM ;clear INDF register ;inc pointer ;all done? ;no clear next ;yes continue CONTINUE: A simple program to clear RAM location 20h-7Fh using indirect addressing is shown in Example 4-1. FIGURE 4-9: DIRECT/INDIRECT ADDRESSING PIC16C62X Direct Addressing RP1 RP0 (1) bank select 6 from opcode Indirect Addressing (1) 0 IRP 7 bank select location select 00 01 10 FSR register 0 location select 11 00h 180h not used Data Memory 7Fh 1FFh Bank 0 Bank 1 Bank 2 Bank 3 For memory map detail see (Figure 4-4, Figure 4-5, Figure 4-6 and Figure 4-7). Note 1: The RP1 and IRP bits are reserved; always maintain these bits clear. DS30235J-page 24 2003 Microchip Technology Inc. PIC16C62X 5.0 I/O PORTS Note: The PIC16C62X have two ports, PORTA and PORTB. Some pins for these I/O ports are multiplexed with an alternate function for the peripheral features on the device. In general, when a peripheral is enabled, that pin may not be used as a general purpose I/O pin. 5.1 PORTA and TRISA Registers On RESET, the TRISA register is set to all inputs. The digital inputs are disabled and the comparator inputs are forced to ground to reduce excess current consumption. TRISA controls the direction of the RA pins, even when they are being used as comparator inputs. The user must make sure to keep the pins configured as inputs when using them as comparator inputs. PORTA is a 5-bit wide latch. RA4 is a Schmitt Trigger input and an open drain output. Port RA4 is multiplexed with the T0CKI clock input. All other RA port pins have Schmitt Trigger input levels and full CMOS output drivers. All pins have data direction bits (TRIS registers), which can configure these pins as input or output. The RA2 pin will also function as the output for the voltage reference. When in this mode, the VREF pin is a very high impedance output and must be buffered prior to any external load. The user must configure TRISA<2> bit as an input and use high impedance loads. A '1' in the TRISA register puts the corresponding output driver in a Hi-impedance mode. A '0' in the TRISA register puts the contents of the output latch on the selected pin(s). In one of the Comparator modes defined by the CMCON register, pins RA3 and RA4 become outputs of the comparators. The TRISA<4:3> bits must be cleared to enable outputs to use this function. Reading the PORTA register reads the status of the pins, whereas writing to it will write to the port latch. All write operations are read-modify-write operations. So a write to a port implies that the port pins are first read, then this value is modified and written to the port data latch. The PORTA pins are multiplexed with comparator and voltage reference functions. The operation of these pins are selected by control bits in the CMCON (comparator control register) register and the VRCON (voltage reference control register) register. When selected as a comparator input, these pins will read as '0's. FIGURE 5-1: Data Bus BLOCK DIAGRAM OF RA1:RA0 PINS D CK Q PORTA MOVLW 0X07 ;Turn comparators off and MOVWF CMCON ;enable pins for I/O ;functions BSF STATUS, RP0 ;Select Bank1 MOVLW 0x1F ;Value used to initialize MOVWF TRISA ;Set RA<4:0> as inputs ;TRISA<7:5> are always ;read as '0'. WR TRISA Q I/O Pin WR TRISA CK RD PORTA VSS VSS Analog Input Mode RD TRISA Schmitt Trigger Input Buffer Q D EN D EN RA2 Pin Q TRIS Latch Schmitt Trigger Input Buffer Q P N VSS Analog Input Mode VDD Q VSS TRIS Latch RD TRISA VDD CK D N Q Q Data Latch P Q CK BLOCK DIAGRAM OF RA2 PIN D WR PORTA Data Latch D ;Initialize PORTA by setting ;output data latches ;data direction Data Bus VDD INITIALIZING PORTA CLRF FIGURE 5-2: Q VDD WR PORTA EXAMPLE 5-1: RD PORTA To Comparator VROE To Comparator 2003 Microchip Technology Inc. VREF DS30235J-page 25 PIC16C62X FIGURE 5-3: Data Bus BLOCK DIAGRAM OF RA3 PIN Comparator Mode = 110 D Q Comparator Output WR PORTA VDD Q CK Data Latch D VDD P Q RA3 Pin N WR TRISA CK Q VSS VSS TRIS Latch Analog Input Mode Schmitt Trigger Input Buffer RD TRISA Q D EN RD PORTA To Comparator FIGURE 5-4: Data Bus BLOCK DIAGRAM OF RA4 PIN Comparator Mode = 110 D Q Comparator Output WR PORTA CK Q Data Latch D Q RA4 Pin N WR TRISA CK Q VSS VSS TRIS Latch Schmitt Trigger Input Buffer RD TRISA Q D EN RD PORTA TMR0 Clock Input DS30235J-page 26 2003 Microchip Technology Inc. PIC16C62X TABLE 5-1: PORTA FUNCTIONS Bit # Buffer Type RA0/AN0 bit0 ST Input/output or comparator input RA1/AN1 bit1 ST Input/output or comparator input RA2/AN2/VREF bit2 ST Input/output or comparator input or VREF output RA3/AN3 bit3 ST Input/output or comparator input/output bit4 ST Input/output or external clock input for TMR0 or comparator output. Output is open drain type. Name RA4/T0CKI Function Legend: ST = Schmitt Trigger input TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Value on All Other RESETS -- -- -- RA4 RA3 RA2 RA1 RA0 ---x 0000 ---u 0000 -- -- TRISA 4 TRISA 3 TRISA 2 TRISA 1 TRISA ---1 1111 0 ---1 1111 -- -- -- CIS CM2 CM1 CM0 00-- 0000 00-- 0000 VRR -- VR3 VR2 VR1 VR0 000- 0000 000- 0000 05h PORTA 85h TRISA 1Fh CMCON C2OUT C1OUT 9Fh VRCON VREN VROE Legend: -- = Unimplemented locations, read as `0', u = unchanged, x = unknown Note: Shaded bits are not used by PORTA. 2003 Microchip Technology Inc. DS30235J-page 27 PIC16C62X 5.2 PORTB and TRISB Registers PORTB is an 8-bit wide, bi-directional port. The corresponding data direction register is TRISB. A '1' in the TRISB register puts the corresponding output driver in a High Impedance mode. A '0' in the TRISB register puts the contents of the output latch on the selected pin(s). Reading PORTB register reads the status of the pins, whereas writing to it will write to the port latch. All write operations are read-modify-write operations. So a write to a port implies that the port pins are first read, then this value is modified and written to the port data latch. Each of the PORTB pins has a weak internal pull-up (200 A typical). A single control bit can turn on all the pull-ups. This is done by clearing the RBPU (OPTION<7>) bit. The weak pull-up is automatically turned off when the port pin is configured as an output. The pull-ups are disabled on Power-on Reset. Four of PORTB's pins, RB<7:4>, have an interrupt on change feature. Only pins configured as inputs can cause this interrupt to occur (e.g., any RB<7:4> pin configured as an output is excluded from the interrupt on change comparison). The input pins (of RB<7:4>) are compared with the old value latched on the last read of PORTB. The "mismatch" outputs of RB<7:4> are OR'ed together to generate the RBIF interrupt (flag latched in INTCON<0>). FIGURE 5-5: RBPU This interrupt can wake the device from SLEEP. The user, in the interrupt service routine, can clear the interrupt in the following manner: a) b) Any read or write of PORTB. This will end the mismatch condition. Clear flag bit RBIF. A mismatch condition will continue to set flag bit RBIF. Reading PORTB will end the mismatch condition and allow flag bit RBIF to be cleared. This interrupt on mismatch feature, together with software configurable pull-ups on these four pins allow easy interface to a key pad and make it possible for wake-up on key-depression. (See AN552, "Implementing Wake-Up on Key Strokes.) Note: If a change on the I/O pin should occur when the read operation is being executed (start of the Q2 cycle), then the RBIF interrupt flag may not get set. The interrupt-on-change feature is recommended for wake-up on key depression operation and operations where PORTB is only used for the interrupt on change feature. Polling of PORTB is not recommended while using the interrupt-on-change feature. FIGURE 5-6: BLOCK DIAGRAM OF RB<3:0> PINS VDD RBPU(1) BLOCK DIAGRAM OF RB<7:4> PINS weak P pull-up VCC VDD (1) weak P pull-up Data Bus VCC Data Latch D Q WR PORTB Data Bus WR PORTB D I/O pin CK Q VSS WR TRISB TRIS Latch D Q WR TRISB TTL Input Buffer CK Q RD TRISB VSS Q TTL Input Buffer CK Q RD TRISB ST Buffer Q RD PORTB Latch Q I/O pin CK Q Data Latch D Q D EN D RB0/INT Set RBIF EN RD PORTB From other RB<7:4> pins Q ST Buffer RD PORTB Note 1: TRISB = 1 enables weak pull-up if RBPU = '0' (OPTION<7>). D EN RD PORTB RB<7:6> in Serial Programming mode Note 1: TRISB = 1 enables weak pull-up if RBPU = '0' (OPTION<7>). DS30235J-page 28 2003 Microchip Technology Inc. PIC16C62X TABLE 5-3: PORTB FUNCTIONS Name Bit # Buffer Type Function RB0/INT bit0 TTL/ST(1) Input/output or external interrupt input. Internal software programmable weak pull-up. RB1 bit1 TTL Input/output pin. Internal software programmable weak pull-up. RB2 bit2 TTL Input/output pin. Internal software programmable weak pull-up. RB3 bit3 TTL Input/output pin. Internal software programmable weak pull-up. RB4 bit4 TTL Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. RB5 bit5 TTL Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. RB6 bit6 TTL/ST(2) Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. Serial programming clock pin. RB7 bit7 TTL/ST(2) Input/output pin (with interrupt-on-change). Internal software programmable weak pull-up. Serial programming data pin. Legend: ST = Schmitt Trigger, TTL = TTL input Note 1: This buffer is a Schmitt Trigger input when configured as the external interrupt. 2: This buffer is a Schmitt Trigger input when used in Serial Programming mode. TABLE 5-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Value on All Other RESETS 06h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu 86h TRISB TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111 81h OPTION RBPU INTEDG 1111 1111 1111 1111 T0CS T0SE PSA PS2 PS1 PS0 Legend: u = unchanged, x = unknown Note 1: Shaded bits are not used by PORTB. 2003 Microchip Technology Inc. DS30235J-page 29 PIC16C62X 5.3 I/O Programming Considerations 5.3.1 EXAMPLE 5-2: BI-DIRECTIONAL I/O PORTS READ-MODIFY-WRITE INSTRUCTIONS ON AN I/O PORT Any instruction which writes, operates internally as a read followed by a write operation. The BCF and BSF instructions, for example, read the register into the CPU, execute the bit operation and write the result back to the register. Caution must be used when these instructions are applied to a port with both inputs and outputs defined. For example, a BSF operation on bit5 of PORTB will cause all eight bits of PORTB to be read into the CPU. Then the BSF operation takes place on bit5 and PORTB is written to the output latches. If another bit of PORTB is used as a bi-directional I/O pin (e.g., bit0) and it is defined as an input at this time, the input signal present on the pin itself would be read into the CPU and re-written to the data latch of this particular pin, overwriting the previous content. As long as the pin stays in the Input mode, no problem occurs. However, if bit0 is switched into Output mode later on, the content of the data latch may now be unknown. ; Initial PORT settings: ; PORTB<7:4> Inputs ; PORTB<3:0> Outputs Reading the port register reads the values of the port pins. Writing to the port register writes the value to the port latch. When using read-modify-write instructions (ex. BCF, BSF, etc.) on a port, the value of the port pins is read, the desired operation is done to this value, and this value is then written to the port latch. ; RB7 to be latched as the pin value (High). ; PORTB<7:6> have external pull-up and are not ; connected to other circuitry ; PORT pins ---------- --------- BCF PORTB, 7 ; 01pp pppp 11pp pppp BCF PORTB, 6 ; 10pp pppp 11pp pppp BSF STATUS,RP0 ; BCF TRISB, 7 ; 10pp pppp 11pp pppp BCF TRISB, 6 ; 10pp pppp 10pp pppp ; Note that the user may have expected the pin ; values to be 00pp pppp. The 2nd BCF caused 5.3.2 SUCCESSIVE OPERATIONS ON I/O PORTS The actual write to an I/O port happens at the end of an instruction cycle, whereas for reading, the data must be valid at the beginning of the instruction cycle (Figure 5-7). Therefore, care must be exercised if a write followed by a read operation is carried out on the same I/O port. The sequence of instructions should be such to allow the pin voltage to stabilize (load dependent) before the next instruction which causes that file to be read into the CPU is executed. Otherwise, the previous state of that pin may be read into the CPU rather than the new state. When in doubt, it is better to separate these instructions with a NOP or another instruction not accessing this I/O port. A pin actively outputting a Low or High should not be driven from external devices at the same time in order to change the level on this pin ("wired-or", "wired-and"). The resulting high output currents may damage the chip. SUCCESSIVE I/O OPERATION Q1 PC PC Instruction Instruction fetched fetched PORT latch ; ; Example 5-2 shows the effect of two sequential readmodify-write instructions (ex., BCF, BSF, etc.) on an I/O port. FIGURE 5-7: ; Q2 Q3 Q4 Q3 PC PC MOVWF,PORTB PORTB MOVWF Write to Write to PORTB PORTB Q1 Q2 Q3 Q2 Q3 Q4 Q4 Q1 Q1 Q2 Q2 Q3 Q4 Q4 Q1 Q2 Q2 Q3 Q4 Q3 PC+1 PC +1 PC+2 PC +2 PC+3 PC +3 MOVF,PORTB, PORTB,W W MOVF ReadPORTB PORTB Read NOP NOP NOP NOP This example shows write to PORTB followed by a read from PORTB. Note that: data setup time = (0.25 TCY - TPD) where TCY = instruction cycle and TPD = propagation delay of Q1 cycle to output valid. RB<7:0> RB <7:0> Port pin Port pin TTPD PD DS30235J-page 30 Note: Therefore, at higher clock frequencies, a write followed by a read may be problematic. sampled here sampled here Execute Execute Execute Execute Execute Execute MOVWF MOVWF MOVF MOVF NOP NOP PORTB PORTB PORTB, W PORTB, W 2003 Microchip Technology Inc. PIC16C62X 6.0 TIMER0 MODULE The prescaler is shared between the Timer0 module and the Watchdog Timer. The prescaler assignment is controlled in software by the control bit PSA (OPTION<3>). Clearing the PSA bit will assign the prescaler to Timer0. The prescaler is not readable or writable. When the prescaler is assigned to the Timer0 module, prescale value of 1:2, 1:4, ..., 1:256 are selectable. Section 6.3 details the operation of the prescaler. The Timer0 module timer/counter has the following features: * * * * * * 8-bit timer/counter Readable and writable 8-bit software programmable prescaler Internal or external clock select Interrupt on overflow from FFh to 00h Edge select for external clock 6.1 Figure 6-1 is a simplified block diagram of the Timer0 module. Timer0 interrupt is generated when the TMR0 register timer/counter overflows from FFh to 00h. This overflow sets the T0IF bit. The interrupt can be masked by clearing the T0IE bit (INTCON<5>). The T0IF bit (INTCON<2>) must be cleared in software by the Timer0 module interrupt service routine before reenabling this interrupt. The Timer0 interrupt cannot wake the processor from SLEEP, since the timer is shut off during SLEEP. See Figure 6-4 for Timer0 interrupt timing. Timer mode is selected by clearing the T0CS bit (OPTION<5>). In Timer mode, the TMR0 will increment every instruction cycle (without prescaler). If Timer0 is written, the increment is inhibited for the following two cycles (Figure 6-2 and Figure 6-3). The user can work around this by writing an adjusted value to TMR0. Counter mode is selected by setting the T0CS bit. In this mode, Timer0 will increment either on every rising or falling edge of pin RA4/T0CKI. The incrementing edge is determined by the source edge (T0SE) control bit (OPTION<4>). Clearing the T0SE bit selects the rising edge. Restrictions on the external clock input are discussed in detail in Section 6.2. FIGURE 6-1: TIMER0 Interrupt TIMER0 BLOCK DIAGRAM Data Bus RA4/T0CKI pin FOSC/4 0 PSout 1 1 Programmable Prescaler 0 TMR0 PSout (2 Tcy delay) T0SE PS<2:0> 8 Sync with Internal clocks Set Flag bit T0IF on Overflow PSA T0CS Note 1: Bits T0SE, T0CS, PS2, PS1, PS0 and PSA are located in the OPTION register. 2: The prescaler is shared with Watchdog Timer (Figure 6-6). FIGURE 6-2: PC (Program Counter) TIMER0 (TMR0) TIMING: INTERNAL CLOCK/NO PRESCALER Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC-1 Instruction Fetch TMR0 PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6 MOVWF TMR0 MOVF TMR0,WMOVF TMR0,WMOVF TMR0,WMOVF TMR0,WMOVF TMR0,W T0 T0+1 Instruction Executed 2003 Microchip Technology Inc. NT0 T0+2 Write TMR0 executed Read TMR0 reads NT0 Read TMR0 reads NT0 NT0+1 Read TMR0 reads NT0 NT0+2 T0 Read TMR0 Read TMR0 reads NT0 + 1 reads NT0 + 2 DS30235J-page 31 PIC16C62X FIGURE 6-3: TIMER0 TIMING: INTERNAL CLOCK/PRESCALE 1:2 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 PC (Program Counter) PC-1 PC PC+1 PC+2 PC+3 PC+4 PC+5 PC+6 MOVWF TMR0 MOVF TMR0,WMOVF TMR0,WMOVF TMR0,WMOVF TMR0,WMOVF TMR0,W Instruction Fetch T0+1 T0 TMR0 Instruction Execute Write TMR0 executed FIGURE 6-4: NT0+1 NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 Read TMR0 reads NT0 + 1 TIMER0 INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT(3) TMR0 timer FEh FFh 1 T0IF bit (INTCON<2>) 00h 01h 02h 1 GIE bit (INTCON<7>) Interrupt Latency Time(2) INSTRUCTION FLOW PC PC Instruction fetched Inst (PC) Instruction executed Inst (PC-1) PC +1 PC +1 Inst (PC+1) Inst (PC) Dummy cycle 0004h 0005h Inst (0004h) Inst (0005h) Dummy cycle Inst (0004h) Note 1: T0IF interrupt flag is sampled here (every Q1). 2: Interrupt latency = 3TCY, where TCY = instruction cycle time. 3: CLKOUT is available only in RC Oscillator mode. DS30235J-page 32 2003 Microchip Technology Inc. PIC16C62X 6.2 Using Timer0 with External Clock When an external clock input is used for Timer0, it must meet certain requirements. The external clock requirement is due to internal phase clock (TOSC) synchronization. Also, there is a delay in the actual incrementing of Timer0 after synchronization. 6.2.1 EXTERNAL CLOCK SYNCHRONIZATION When no prescaler is used, the external clock input is the same as the prescaler output. The synchronization of T0CKI with the internal phase clocks is accomplished by sampling the prescaler output on the Q2 and Q4 cycles of the internal phase clocks (Figure 6-5). Therefore, it is necessary for T0CKI to be high for at least 2TOSC (and a small RC delay of 20 ns) and low for at least 2TOSC (and a small RC delay of 20 ns). Refer to the electrical specification of the desired device. FIGURE 6-5: When a prescaler is used, the external clock input is divided by the asynchronous ripple-counter type prescaler, so that the prescaler output is symmetrical. For the external clock to meet the sampling requirement, the ripple-counter must be taken into account. Therefore, it is necessary for T0CKI to have a period of at least 4TOSC (and a small RC delay of 40 ns) divided by the prescaler value. The only requirement on T0CKI high and low time is that they do not violate the minimum pulse width requirement of 10 ns. Refer to parameters 40, 41 and 42 in the electrical specification of the desired device. 6.2.2 TIMER0 INCREMENT DELAY Since the prescaler output is synchronized with the internal clocks, there is a small delay from the time the external clock edge occurs to the time the TMR0 is actually incremented. Figure 6-5 shows the delay from the external clock edge to the timer incrementing. TIMER0 TIMING WITH EXTERNAL CLOCK Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 External Clock Input or Prescaler output (2) Q1 Q2 Q3 Q4 Small pulse misses sampling (1) External Clock/Prescaler Output after sampling (3) Increment Timer0 (Q4) Timer0 T0 T0 + 1 T0 + 2 Note 1: Delay from clock input change to Timer0 increment is 3Tosc to 7Tosc. (Duration of Q = Tosc). Therefore, the error in measuring the interval between two edges on Timer0 input = 4Tosc max. 2: External clock if no prescaler selected, Prescaler output otherwise. 3: The arrows indicate the points in time where sampling occurs. 2003 Microchip Technology Inc. DS30235J-page 33 PIC16C62X 6.3 Prescaler The PSA and PS<2:0> bits (OPTION<3:0>) determine the prescaler assignment and prescale ratio. An 8-bit counter is available as a prescaler for the Timer0 module, or as a postscaler for the Watchdog Timer, respectively (Figure 6-6). For simplicity, this counter is being referred to as "prescaler" throughout this data sheet. Note that there is only one prescaler available which is mutually exclusive between the Timer0 module and the Watchdog Timer. Thus, a prescaler assignment for the Timer0 module means that there is no prescaler for the Watchdog Timer and vice-versa. FIGURE 6-6: When assigned to the Timer0 module, all instructions writing to the TMR0 register (e.g., CLRF 1, MOVWF 1, BSF 1,x....etc.) will clear the prescaler. When assigned to WDT, a CLRWDT instruction will clear the prescaler along with the Watchdog Timer. The prescaler is not readable or writable. BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER Data Bus CLKOUT (= Fosc/4) 0 T0CKI pin 8 M U X 1 M U X 0 1 SYNC 2 Cycles TMR0 reg T0SE T0CS 0 Watchdog Timer 1 M U X Set flag bit T0IF on Overflow PSA 8-bit Prescaler 8 8-to-1MUX PS<2:0> PSA WDT Enable bit 1 0 MUX PSA WDT Time-out Note: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register. DS30235J-page 34 2003 Microchip Technology Inc. PIC16C62X 6.3.1 SWITCHING PRESCALER ASSIGNMENT To change prescaler from the WDT to the TMR0 module, use the sequence shown in Example 6-2. This precaution must be taken even if the WDT is disabled. The prescaler assignment is fully under software control (i.e., it can be changed "on-the-fly" during program execution). To avoid an unintended device RESET, the following instruction sequence (Example 6-1) must be executed when changing the prescaler assignment from Timer0 to WDT.) EXAMPLE 6-1: 1.BCF STATUS, RP0 MOVWF BCF STATUS, RP0 b'xxxx0xxx' ;Select TMR0, new ;prescale value and ;clock source OPTION_REG STATUS, RP0 ;Clear WDT TMR0 ;Clear TMR0 & Prescaler 4.BSF STATUS, RP0 ;Bank 1 5.MOVLW '00101111'b; ;These 3 lines (5, 6, 7) 6.MOVWF OPTION ;are required only if ;desired PS<2:0> are '00101xxx'b ;Set Postscaler to 7.CLRWDT 9.MOVWF BSF MOVLW ;Clear WDT and ;prescaler ;Skip if already in ;Bank 0 3.CLRF 10.BCF CHANGING PRESCALER (WDTTIMER0) CLRWDT CHANGING PRESCALER (TIMER0WDT) 2.CLRWDT 8.MOVLW EXAMPLE 6-2: ;000 or 001 OPTION ;desired WDT rate STATUS, RP0 ;Return to Bank 0 TABLE 6-1: REGISTERS ASSOCIATED WITH TIMER0 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Value on All Other RESETS Address Name Bit 7 01h TMR0 Timer0 module register 0Bh/8Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u 81h OPTION RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 85h TRISA -- -- -- TRISA4 TRISA3 TRISA2 TRISA1 xxxx xxxx uuuu uuuu TRISA0 ---1 1111 ---1 1111 Legend: -- = Unimplemented locations, read as `0', u = unchanged, x = unknown Note: Shaded bits are not used by TMR0 module. 2003 Microchip Technology Inc. DS30235J-page 35 PIC16C62X NOTES: DS30235J-page 36 2003 Microchip Technology Inc. PIC16C62X 7.0 COMPARATOR MODULE The comparator module contains two analog comparators. The inputs to the comparators are multiplexed with the RA0 through RA3 pins. The OnChip Voltage Reference (Section 8.0) can also be an input to the comparators. REGISTER 7-1: The CMCON register, shown in Register 7-1, controls the comparator input and output multiplexers. A block diagram of the comparator is shown in Figure 7-1. CMCON REGISTER (ADDRESS 1Fh) R-0 R-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 C2OUT C1OUT -- -- CIS CM2 CM1 CM0 bit 7 bit 0 bit 7 C2OUT: Comparator 2 output 1 = C2 VIN+ > C2 VIN0 = C2 VIN+ < C2 VIN- bit 6 C1OUT: Comparator 1 output 1 = C1 VIN+ > C1 VIN0 = C1 VIN+ < C1 VIN- bit 5-4 Unimplemented: Read as `0' bit 3 CIS: Comparator Input Switch When CM<2:0>: = 001: 1 = C1 VIN- connects to RA3 0 = C1 VIN- connects to RA0 When CM<2:0> = 010: 1 = C1 VIN- connects to RA3 C2 VIN- connects to RA2 0 = C1 VIN- connects to RA0 C2 VIN- connects to RA1 bit 2-0 CM<2:0>: Comparator mode. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared 2003 Microchip Technology Inc. x = Bit is unknown DS30235J-page 37 PIC16C62X 7.1 Comparator Configuration There are eight modes of operation for the comparators. The CMCON register is used to select the mode. Figure 7-1 shows the eight possible modes. The TRISA register controls the data direction of the comparator pins for each mode. If the Comparator FIGURE 7-1: RA0/AN0 RA3/AN3 RA1/AN1 RA2/AN2 mode is changed, the comparator output level may not be valid for the specified mode change delay shown in Table 12-2. Note: Comparator interrupts should be disabled during a Comparator mode change otherwise a false interrupt may occur. COMPARATOR I/O OPERATING MODES A VIN- A VIN+ A VIN- A VIN+ + Off (Read as '0') C1 + Off (Read as '0') C2 RA0/AN0 RA3/AN3 RA1/AN1 RA2/AN2 D VIN- D VIN+ D VIN- D VIN+ + C1 Off (Read as '0') C2 Off (Read as '0') + CM<2:0> = 000 Comparators Reset RA0/AN0 RA3/AN3 RA1/AN1 RA2/AN2 A A A A CM<2:0> = 111 Comparators Off VINVIN+ VINVIN+ RA0/AN0 A + C1OUT C1 + C2OUT C2 CIS=0 VIN- RA3/AN3 A CIS=1 VIN+ RA1/AN1 A CIS=0 RA2/AN2 A CIS=1 VINVIN+ + RA0/AN0 RA3/AN3 RA1/AN1 RA2/AN2 A VIN- + D VIN+ A VIN- A VIN+ + C1OUT C1 + RA0/AN0 RA3/AN3 C2OUT C2 CM<2:0> = 011 C2 C2OUT From VREF Module Four Inputs Multiplexed to Two Comparators - C1OUT - CM<2:0> = 100 Two Independent Comparators C1 RA1/AN1 CM<2:0> = 010 A VIN- D VIN+ A VIN- A VIN+ RA2/AN2 RA4 Open Drain + C1 C1OUT C2 C2OUT + CM<2:0> = 110 Two Common Reference Comparators Two Common Reference Comparators with Outputs RA0/AN0 RA3/AN3 RA1/AN1 RA2/AN2 D VIN- D VIN+ A VIN- A VIN+ + C1 Off (Read as '0') RA0/AN0 RA3/AN3 + C2 C2OUT RA1/AN1 RA2/AN2 A CIS=0 VINCIS=1 VIN+ - A VIN- - A VIN+ A + + CM<2:0> = 101 One Independent Comparator C1 C1OUT C2 C2OUT CM<2:0> = 001 Three Inputs Multiplexed to Two Comparators A = Analog Input, Port Reads Zeros Always D = Digital Input CIS = CMCON<3>, Comparator Input Switch DS30235J-page 38 2003 Microchip Technology Inc. PIC16C62X The code example in Example 7-1 depicts the steps required to configure the comparator module. RA3 and RA4 are configured as digital output. RA0 and RA1 are configured as the V- inputs and RA2 as the V+ input to both comparators. EXAMPLE 7-1: INITIALIZING COMPARATOR MODULE MOVLW 0x03 ;Init comparator mode MOVWF CMCON ;CM<2:0> = 011 CLRF PORTA ;Init PORTA BSF STATUS,RP0 ;Select Bank1 MOVLW 0x07 ;Initialize data direction MOVWF TRISA ;Set RA<2:0> as inputs 7.3 Comparator Reference An external or internal reference signal may be used depending on the comparator Operating mode. The analog signal that is present at VIN- is compared to the signal at VIN+, and the digital output of the comparator is adjusted accordingly (Figure 7-2). FIGURE 7-2: SINGLE COMPARATOR VIN+ + VIN- - Output ;RA<4:3> as outputs ;TRISA<7:5> always read `0' BCF STATUS,RP0 ;Select Bank 0 CALL DELAY 10 ;10s delay VVININ- - MOVF CMCON,F ;Read CMCON to end change condition BCF PIR1,CMIF ;Clear pending interrupts VVININ+ + BSF STATUS,RP0 ;Select Bank 1 BSF PIE1,CMIE ;Enable comparator interrupts BCF STATUS,RP0 ;Select Bank 0 BSF INTCON,PEIE ;Enable peripheral interrupts BSF INTCON,GIE 7.2 Output utput ;Global interrupt enable Comparator Operation A single comparator is shown in Figure 7-2 along with the relationship between the analog input levels and the digital output. When the analog input at VIN+ is less than the analog input VIN-, the output of the comparator is a digital low level. When the analog input at VIN+ is greater than the analog input VIN-, the output of the comparator is a digital high level. The shaded areas of the output of the comparator in Figure 7-2 represent the uncertainty due to input offsets and response time. 7.3.1 EXTERNAL REFERENCE SIGNAL When external voltage references are used, the comparator module can be configured to have the comparators operate from the same or different reference sources. However, threshold detector applications may require the same reference. The reference signal must be between VSS and VDD, and can be applied to either pin of the comparator(s). 7.3.2 INTERNAL REFERENCE SIGNAL The comparator module also allows the selection of an internally generated voltage reference for the comparators. Section 10, Instruction Sets, contains a detailed description of the Voltage Reference Module that provides this signal. The internal reference signal is used when the comparators are in mode CM<2:0>=010 (Figure 7-1). In this mode, the internal voltage reference is applied to the VIN+ pin of both comparators. 2003 Microchip Technology Inc. DS30235J-page 39 PIC16C62X 7.4 Comparator Response Time 7.5 Response time is the minimum time, after selecting a new reference voltage or input source, before the comparator output has a valid level. If the internal reference is changed, the maximum delay of the internal voltage reference must be considered when using the comparator outputs. Otherwise the maximum delay of the comparators should be used (Table 12-2). Comparator Outputs The comparator outputs are read through the CMCON register. These bits are read only. The comparator outputs may also be directly output to the RA3 and RA4 I/O pins. When the CM<2:0> = 110, multiplexors in the output path of the RA3 and RA4 pins will switch and the output of each pin will be the unsynchronized output of the comparator. The uncertainty of each of the comparators is related to the input offset voltage and the response time given in the specifications. Figure 7-3 shows the comparator output block diagram. The TRISA bits will still function as an output enable/ disable for the RA3 and RA4 pins while in this mode. Note 1: When reading the PORT register, all pins configured as analog inputs will read as a `0'. Pins configured as digital inputs will convert an analog input according to the Schmitt Trigger input specification. 2: Analog levels on any pin that is defined as a digital input may cause the input buffer to consume more current than is specified. FIGURE 7-3: COMPARATOR OUTPUT BLOCK DIAGRAM PORT PINS MULTIPLEX + - To RA3 or RA4 Pin Bus Data Q RD CMCON Set CMIF Bit D EN Q FROM OTHER COMPARATOR D EN CL RD CMCON NRESET DS30235J-page 40 2003 Microchip Technology Inc. PIC16C62X 7.6 Comparator Interrupts wake up the device from SLEEP mode when enabled. While the comparator is powered-up, higher SLEEP currents than shown in the power-down current specification will occur. Each comparator that is operational will consume additional current as shown in the comparator specifications. To minimize power consumption while in SLEEP mode, turn off the comparators, CM<2:0> = 111, before entering SLEEP. If the device wakes up from SLEEP, the contents of the CMCON register are not affected. The comparator interrupt flag is set whenever there is a change in the output value of either comparator. Software will need to maintain information about the status of the output bits, as read from CMCON<7:6>, to determine the actual change that has occurred. The CMIF bit, PIR1<6>, is the comparator interrupt flag. The CMIF bit must be RESET by clearing `0'. Since it is also possible to write a '1' to this register, a simulated interrupt may be initiated. 7.8 The CMIE bit (PIE1<6>) and the PEIE bit (INTCON<6>) must be set to enable the interrupt. In addition, the GIE bit must also be set. If any of these bits are clear, the interrupt is not enabled, though the CMIF bit will still be set if an interrupt condition occurs. Note: A device RESET forces the CMCON register to its RESET state. This forces the comparator module to be in the comparator RESET mode, CM<2:0> = 000. This ensures that all potential inputs are analog inputs. Device current is minimized when analog inputs are present at RESET time. The comparators will be powered-down during the RESET interval. If a change in the CMCON register (C1OUT or C2OUT) should occur when a read operation is being executed (start of the Q2 cycle), then the CMIF (PIR1<6>) interrupt flag may not get set. 7.9 The user, in the interrupt service routine, can clear the interrupt in the following manner: a) b) Comparator Operation During SLEEP When a comparator is active and the device is placed in SLEEP mode, the comparator remains active and the interrupt is functional if enabled. This interrupt will FIGURE 7-4: Analog Input Connection Considerations A simplified circuit for an analog input is shown in Figure 7-4. Since the analog pins are connected to a digital output, they have reverse biased diodes to VDD and VSS. The analog input therefore, must be between VSS and VDD. If the input voltage deviates from this range by more than 0.6V in either direction, one of the diodes is forward biased and a latchup may occur. A maximum source impedance of 10 k is recommended for the analog sources. Any external component connected to an analog input pin, such as a capacitor or a Zener diode, should have very little leakage current. Any read or write of CMCON. This will end the mismatch condition. Clear flag bit CMIF. A mismatch condition will continue to set flag bit CMIF. Reading CMCON will end the mismatch condition and allow flag bit CMIF to be cleared. 7.7 Effects of a RESET ANALOG INPUT MODEL VDD VT = 0.6V RS < 10K AIN CPIN 5 pF VA VT = 0.6V RIC ILEAKAGE 500 nA VSS Legend CPIN VT ILEAKAGE RIC RS VA 2003 Microchip Technology Inc. = = = = = = Input Capacitance Threshold Voltage Leakage Current at the pin due to various junctions Interconnect Resistance Source Impedance Analog Voltage DS30235J-page 41 PIC16C62X TABLE 7-1: Address REGISTERS ASSOCIATED WITH COMPARATOR MODULE Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Value on All Other RESETS 1Fh CMCON C2OUT C1OUT -- -- CIS CM2 CM1 CM0 00-- 0000 00-- 0000 9Fh VRCON VREN VROE VRR -- VR3 VR2 VR1 VR0 000- 0000 000- 0000 0Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 -- CMIF -- -- -- -- -- -- -0-- ---- -0-- ---- 8Ch PIE1 -- CMIE -- -- -- -- -- -- -0-- ---- -0-- ---- 85h TRISA -- -- -- TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 ---1 1111 ---1 1111 Legend: x = unknown, u = unchanged, - = unimplemented, read as "0" DS30235J-page 42 2003 Microchip Technology Inc. PIC16C62X 8.0 VOLTAGE REFERENCE MODULE 8.1 The Voltage Reference can output 16 distinct voltage levels for each range. The equations used to calculate the output of the Voltage Reference are as follows: The Voltage Reference is a 16-tap resistor ladder network that provides a selectable voltage reference. The resistor ladder is segmented to provide two ranges of VREF values and has a power-down function to conserve power when the reference is not being used. The VRCON register controls the operation of the reference as shown in Register 8-1. The block diagram is given in Figure 8-1. REGISTER 8-1: Configuring the Voltage Reference if VRR = 1: VREF = (VR<3:0>/24) x VDD if VRR = 0: VREF = (VDD x 1/4) + (VR<3:0>/32) x VDD The setting time of the Voltage Reference must be considered when changing the VREF output (Table 12-1). Example 8-1 shows an example of how to configure the Voltage Reference for an output voltage of 1.25V with VDD = 5.0V. VRCON REGISTER(ADDRESS 9Fh) R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 VREN VROE VRR -- VR3 VR2 VR1 VR0 bit 7 bit 0 bit 7 VREN: VREF Enable 1 = VREF circuit powered on 0 = VREF circuit powered down, no IDD drain bit 6 VROE: VREF Output Enable 1 = VREF is output on RA2 pin 0 = VREF is disconnected from RA2 pin bit 5 VRR: VREF Range selection 1 = Low Range 0 = High Range bit 4 Unimplemented: Read as '0' bit 3-0 VR<3:0>: VREF value selection 0 VR [3:0] 15 when VRR = 1: VREF = (VR<3:0>/ 24) * VDD when VRR = 0: VREF = 1/4 * VDD + (VR<3:0>/ 32) * VDD Legend: FIGURE 8-1: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' - n = Value at POR '1' = Bit is set '0' = Bit is cleared x = Bit is unknown VOLTAGE REFERENCE BLOCK DIAGRAM 16 Stages VREN 8R R R R R 8R VREF VRR VR3 (From VRCON<3:0>) 16-1 Analog Mux VR0 Note: R is defined in Table 12-2. 2003 Microchip Technology Inc. DS30235J-page 43 PIC16C62X EXAMPLE 8-1: MOVLW 8.4 VOLTAGE REFERENCE CONFIGURATION 0x02 Effects of a RESET A device RESET disables the voltage reference by clearing bit VREN (VRCON<7>). This reset also disconnects the reference from the RA2 pin by clearing bit VROE (VRCON<6>) and selects the high voltage range by clearing bit VRR (VRCON<5>). The VREF value select bits, VRCON<3:0>, are also cleared. ; 4 Inputs Muxed MOVWF CMCON ; to 2 comps. BSF STATUS,RP0 ; go to Bank 1 MOVLW 0x0F ; RA3-RA0 are MOVWF TRISA ; inputs MOVLW 0xA6 ; enable VREF 8.5 MOVWF VRCON ; low range The voltage reference module operates independently of the comparator module. The output of the reference generator may be connected to the RA2 pin if the TRISA<2> bit is set and the VROE bit, VRCON<6>, is set. Enabling the voltage reference output onto the RA2 pin with an input signal present will increase current consumption. Connecting RA2 as a digital output with VREF enabled will also increase current consumption. ; set VR<3:0>=6 BCF STATUS,RP0 ; go to Bank 0 CALL DELAY10 ; 10s delay 8.2 Voltage Reference Accuracy/Error The full range of VSS to VDD cannot be realized due to the construction of the module. The transistors on the top and bottom of the resistor ladder network (Figure 8-1) keep VREF from approaching VSS or VDD. The voltage reference is VDD derived and therefore, the VREF output changes with fluctuations in VDD. The tested absolute accuracy of the voltage reference can be found in Table 12-2. 8.3 Connection Considerations The RA2 pin can be used as a simple D/A output with limited drive capability. Due to the limited drive capability, a buffer must be used in conjunction with the voltage reference output for external connections to VREF. Figure 8-2 shows an example buffering technique. Operation During SLEEP When the device wakes up from SLEEP through an interrupt or a Watchdog Timer time-out, the contents of the VRCON register are not affected. To minimize current consumption in SLEEP mode, the voltage reference should be disabled. FIGURE 8-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE R(1) RA VREF Module * + - * VREF Output Voltage Reference Output Impedance Note 1: R is dependent upon the Voltage Reference Configuration VRCON<3:0> and VRCON<5>. TABLE 8-1: Address Name REGISTERS ASSOCIATED WITH VOLTAGE REFERENCE Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value On POR Value On All Other RESETS -- VR3 VR2 VR1 VR0 000- 0000 000- 0000 9Fh VRCON VREN VROE VRR 1Fh CMCON C2OUT C1OUT -- -- CIS CM2 CM1 CM0 00-- 0000 00-- 0000 85h TRISA -- -- -- TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 ---1 1111 ---1 1111 Note: - = Unimplemented, read as "0" DS30235J-page 44 2003 Microchip Technology Inc. PIC16C62X 9.0 SPECIAL FEATURES OF THE CPU Special circuits to deal with the needs of real-time applications are what sets a microcontroller apart from other processors. The PIC16C62X family has a host of such features intended to maximize system reliability, minimize cost through elimination of external components, provide power saving operating modes and offer code protection. These are: 1. 2. 3. 4. 5. 6. 7. 8. OSC selection RESET Power-on Reset (POR) Power-up Timer (PWRT) Oscillator Start-up Timer (OST) Brown-out Reset (BOR) Interrupts Watchdog Timer (WDT) SLEEP Code protection ID Locations In-Circuit Serial ProgrammingTM 2003 Microchip Technology Inc. The PIC16C62X devices have a Watchdog Timer which is controlled by configuration bits. It runs off its own RC oscillator for added reliability. There are two timers that offer necessary delays on power-up. One is the Oscillator Start-up Timer (OST), intended to keep the chip in RESET until the crystal oscillator is stable. The other is the Power-up Timer (PWRT), which provides a fixed delay of 72 ms (nominal) on power-up only, designed to keep the part in RESET while the power supply stabilizes. There is also circuitry to RESET the device if a brown-out occurs, which provides at least a 72 ms RESET. With these three functions on-chip, most applications need no external RESET circuitry. The SLEEP mode is designed to offer a very low current Power-down mode. The user can wake-up from SLEEP through external RESET, Watchdog Timer wake-up or through an interrupt. Several oscillator options are also made available to allow the part to fit the application. The RC oscillator option saves system cost, while the LP crystal option saves power. A set of configuration bits are used to select various options. DS30235J-page 45 PIC16C62X 9.1 Configuration Bits The configuration bits can be programmed (read as '0') or left unprogrammed (read as '1') to select various device configurations. These bits are mapped in program memory location 2007h. REGISTER 9-1: CP1 CP0 (2) The user will note that address 2007h is beyond the user program memory space. In fact, it belongs to the special test/configuration memory space (2000h - 3FFFh), which can be accessed only during programming. CONFIGURATION WORD (ADDRESS 2007h) CP1 CP0 (2) CP1 CP0 (2) BODEN CP1 CP0 (2) PWRTE WDTE F0SC1 bit 13 bit 13-8, 5-4: F0SC0 bit 0 CP<1:0>: Code protection bit pairs (2) Code protection for 2K program memory 11 = Program memory code protection off 10 = 0400h-07FFh code protected 01 = 0200h-07FFh code protected 00 = 0000h-07FFh code protected Code protection for 1K program memory 11 = Program memory code protection off 10 = Program memory code protection off 01 = 0200h-03FFh code protected 00 = 0000h-03FFh code protected Code protection for 0.5K program memory 11 = Program memory code protection off 10 = Program memory code protection off 01 = Program memory code protection off 00 = 0000h-01FFh code protected bit 7 Unimplemented: Read as `0' bit 6 BODEN: Brown-out Reset Enable bit (1) 1 = BOR enabled 0 = BOR disabled bit 3 PWRTE: Power-up Timer Enable bit (1, 3) 1 = PWRT disabled 0 = PWRT enabled bit 2 WDTE: Watchdog Timer Enable bit 1 = WDT enabled 0 = WDT disabled bit 1-0 FOSC1:FOSC0: Oscillator Selection bits 11 = RC oscillator 10 = HS oscillator 01 = XT oscillator 00 = LP oscillator Note 1: Enabling Brown-out Reset automatically enables Power-up Timer (PWRT) regardless of the value of bit PWRTE. Ensure the Power-up Timer is enabled anytime Brown-out Detect Reset is enabled. 2: All of the CP<1:0> pairs have to be given the same value to enable the code protection scheme listed. 3: Unprogrammed parts default the Power-up Timer disabled. Legend: R = Readable bit W = Writable bit U = Unimplemented bit, read as `0' -n = Value at POR 1 = bit is set 0 = bit is cleared DS30235J-page 46 x = bit is unknown 2003 Microchip Technology Inc. PIC16C62X 9.2 Oscillator Configurations 9.2.1 OSCILLATOR TYPES LP XT HS RC Low Power Crystal Crystal/Resonator High Speed Crystal/Resonator Resistor/Capacitor 9.2.2 CRYSTAL OSCILLATOR / CERAMIC RESONATORS In XT, LP or HS modes, a crystal or ceramic resonator is connected to the OSC1 and OSC2 pins to establish oscillation (Figure 9-1). The PIC16C62X oscillator design requires the use of a parallel cut crystal. Use of a series cut crystal may give a frequency out of the crystal manufacturers specifications. When in XT, LP or HS modes, the device can have an external clock source to drive the OSC1 pin (Figure 9-2). FIGURE 9-1: CRYSTAL OPERATION (OR CERAMIC RESONATOR) (HS, XT OR LP OSC CONFIGURATION) OSC1 To internal logic C1 XTAL RF SLEEP OSC2 C2 RS See Note CAPACITOR SELECTION FOR CERAMIC RESONATORS Ranges Characterized: The PIC16C62X devices can be operated in four different oscillator options. The user can program two configuration bits (FOSC1 and FOSC0) to select one of these four modes: * * * * TABLE 9-1: PIC16C62X Mode Freq OSC1(C1) OSC2(C2) XT 455 kHz 2.0 MHz 4.0 MHz 22 - 100 pF 15 - 68 pF 15 - 68 pF 22 - 100 pF 15 - 68 pF 15 - 68 pF HS 8.0 MHz 16.0 MHz 10 - 68 pF 10 - 22 pF 10 - 68 pF 10 - 22 pF Higher capacitance increases the stability of the oscillator but also increases the start-up time. These values are for design guidance only. Since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components. TABLE 9-2: CAPACITOR SELECTION FOR CRYSTAL OSCILLATOR Mode Freq OSC1(C1) OSC2(C2) LP 32 kHz 200 kHz 68 - 100 pF 15 - 30 pF 68 - 100 pF 15 - 30 pF XT 100 kHz 2 MHz 4 MHz 68 - 150 pF 15 - 30 pF 15 - 30 pF 150 - 200 pF 15 - 30 pF 15 - 30 pF HS 8 MHz 10 MHz 20 MHz 15 - 30 pF 15 - 30 pF 15 - 30 pF 15 - 30 pF 15 - 30 pF 15 - 30 pF Higher capacitance increases the stability of the oscillator but also increases the start-up time. These values are for design guidance only. Rs may be required in HS mode as well as XT mode to avoid overdriving crystals with low drive level specification. Since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external components. See Table 9-1 and Table 9-2 for recommended values of C1 and C2. Note: A series resistor may be required for AT strip cut crystals. FIGURE 9-2: clock from ext. system EXTERNAL CLOCK INPUT OPERATION (HS, XT OR LP OSC CONFIGURATION) OSC1 PIC16C62X Open OSC2 2003 Microchip Technology Inc. DS30235J-page 47 PIC16C62X 9.2.3 EXTERNAL CRYSTAL OSCILLATOR CIRCUIT Either a prepackaged oscillator can be used or a simple oscillator circuit with TTL gates can be built. Prepackaged oscillators provide a wide operating range and better stability. A well-designed crystal oscillator will provide good performance with TTL gates. Two types of crystal oscillator circuits can be used; one with series resonance or one with parallel resonance. Figure 9-3 shows implementation of a parallel resonant oscillator circuit. The circuit is designed to use the fundamental frequency of the crystal. The 74AS04 inverter performs the 180 phase shift that a parallel oscillator requires. The 4.7 k resistor provides the negative feedback for stability. The 10 k potentiometers bias the 74AS04 in the linear region. This could be used for external oscillator designs. FIGURE 9-3: EXTERNAL PARALLEL RESONANT CRYSTAL OSCILLATOR CIRCUIT +5V To Other Devices 10k 74AS04 4.7k PIC16C62X CLKIN 74AS04 10k XTAL 20 pF Figure 9-4 shows a series resonant oscillator circuit. This circuit is also designed to use the fundamental frequency of the crystal. The inverter performs a 180 phase shift in a series resonant oscillator circuit. The 330 k resistors provide the negative feedback to bias the inverters in their linear region. FIGURE 9-4: RC OSCILLATOR For timing insensitive applications the "RC" device option offers additional cost savings. The RC oscillator frequency is a function of the supply voltage, the resistor (REXT) and capacitor (CEXT) values, and the operating temperature. In addition to this, the oscillator frequency will vary from unit to unit due to normal process parameter variation. Furthermore, the difference in lead frame capacitance between package types will also affect the oscillation frequency, especially for low CEXT values. The user also needs to take into account variation due to tolerance of external R and C components used. Figure 9-5 shows how the R/C combination is connected to the PIC16C62X. For REXT values below 2.2 k, the oscillator operation may become unstable or stop completely. For very high REXT values (e.g., 1 M), the oscillator becomes sensitive to noise, humidity and leakage. Thus, we recommend to keep REXT between 3 k and 100 k. Although the oscillator will operate with no external capacitor (CEXT = 0 pF), we recommend using values above 20 pF for noise and stability reasons. With no or small external capacitance, the oscillation frequency can vary dramatically due to changes in external capacitances, such as PCB trace capacitance or package lead frame capacitance. See Section 13.0 for RC frequency variation from part to part due to normal process variation. The variation is larger for larger R (since leakage current variation will affect RC frequency more for large R) and for smaller C (since variation of input capacitance will affect RC frequency more). See Section 13.0 for variation of oscillator frequency due to VDD for given REXT/CEXT values, as well as frequency variation due to operating temperature for given R, C and VDD values. 10k 20 pF 9.2.4 EXTERNAL SERIES RESONANT CRYSTAL OSCILLATOR CIRCUIT The oscillator frequency, divided by 4, is available on the OSC2/CLKOUT pin, and can be used for test purposes or to synchronize other logic (Figure 3-2 for waveform). FIGURE 9-5: RC OSCILLATOR MODE VDD PIC16C62X REXT OSC1 330 k 330 k 74AS04 74AS04 To Other Devices 74AS04 Internal Clock CEXT PIC16C62X CLKIN VDD FOSC/4 OSC2/CLKOUT 0.1 F XTAL DS30235J-page 48 2003 Microchip Technology Inc. PIC16C62X 9.3 RESET The PIC16C62X differentiates between various kinds of RESET: a) b) c) d) e) f) Power-on Reset (POR) MCLR Reset during normal operation MCLR Reset during SLEEP WDT Reset (normal operation) WDT wake-up (SLEEP) Brown-out Reset (BOR) A simplified block diagram of the on-chip RESET circuit is shown in Figure 9-6. Some registers are not affected in any RESET condition Their status is unknown on POR and unchanged in any other RESET. Most other registers are reset to a "RESET state" on Power-on Reset, FIGURE 9-6: MCLR Reset, WDT Reset and MCLR Reset during SLEEP. They are not affected by a WDT wake-up, since this is viewed as the resumption of normal operation. TO and PD bits are set or cleared differently in different RESET situations as indicated in Table 9-2. These bits are used in software to determine the nature of the RESET. See Table 9-5 for a full description of RESET states of all registers. The MCLR Reset path has a noise filter to detect and ignore small pulses. See Table 12-5 for pulse width specification. SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT External RESET MCLR/ VPP Pin WDT Module SLEEP WDT Time-out Reset VDD rise detect Power-on Reset VDD Brown-out Reset BODEN S Q R Q OST/PWRT OST Chip_Reset 10-bit Ripple-counter OSC1/ CLKIN Pin On-chip(1) RC OSC PWRT 10-bit Ripple-counter Enable PWRT See Table 9-1 for time-out situations. Enable OST Note 1: This is a separate oscillator from the RC oscillator of the CLKIN pin. 2003 Microchip Technology Inc. DS30235J-page 49 PIC16C62X 9.4 9.4.1 Power-on Reset (POR), Power-up Timer (PWRT), Oscillator Start-up Timer (OST) and Brown-out Reset (BOR) The Power-up Time delay will vary from chip-to-chip and due to VDD, temperature and process variation. See DC parameters for details. 9.4.3 POWER-ON RESET (POR) The Oscillator Start-Up Timer (OST) provides a 1024 oscillator cycle (from OSC1 input) delay after the PWRT delay is over. This ensures that the crystal oscillator or resonator has started and stabilized. The on-chip POR circuit holds the chip in RESET until VDD has reached a high enough level for proper operation. To take advantage of the POR, just tie the MCLR pin through a resistor to VDD. This will eliminate external RC components usually needed to create Power-on Reset. A maximum rise time for VDD is required. See Electrical Specifications for details. The OST time-out is invoked only for XT, LP and HS modes and only on Power-on Reset or wake-up from SLEEP. 9.4.4 The POR circuit does not produce an internal RESET when VDD declines. For additional information, refer to Application Note AN607, "Power-up Trouble Shooting". On any RESET (Power-on, Brown-out, Watchdog, etc.) the chip will remain in RESET until VDD rises above BVDD. The Power-up Timer will now be invoked and will keep the chip in RESET an additional 72 ms. POWER-UP TIMER (PWRT) The Power-up Timer provides a fixed 72 ms (nominal) time-out on power-up only, from POR or Brown-out Reset. The Power-up Timer operates on an internal RC oscillator. The chip is kept in RESET as long as PWRT is active. The PWRT delay allows the VDD to rise to an acceptable level. A configuration bit, PWRTE can disable (if set) or enable (if cleared or programmed) the Power-up Timer. The Power-up Timer should always be enabled when Brown-out Reset is enabled. FIGURE 9-7: If VDD drops below BVDD while the Power-up Timer is running, the chip will go back into a Brown-out Reset and the Power-up Timer will be re-initialized. Once VDD rises above BVDD, the Power-Up Timer will execute a 72 ms RESET. The Power-up Timer should always be enabled when Brown-out Reset is enabled. Figure 9-7 shows typical Brown-out situations. BROWN-OUT SITUATIONS VDD INTERNAL RESET BVDD 72 ms VDD INTERNAL RESET BVDD <72 ms 72 ms VDD INTERNAL RESET DS30235J-page 50 BROWN-OUT RESET (BOR) The PIC16C62X members have on-chip Brown-out Reset circuitry. A configuration bit, BODEN, can disable (if clear/programmed) or enable (if set) the Brown-out Reset circuitry. If VDD falls below 4.0V refer to VBOR parameter D005 (VBOR) for greater than parameter (TBOR) in Table 12-5. The brown-out situation will RESET the chip. A RESET won't occur if VDD falls below 4.0V for less than parameter (TBOR). When the device starts normal operation (exits the RESET condition), device operating parameters (voltage, frequency, temperature, etc.) must be met to ensure operation. If these conditions are not met, the device must be held in RESET until the operating conditions are met. 9.4.2 OSCILLATOR START-UP TIMER (OST) BVDD 72 ms 2003 Microchip Technology Inc. PIC16C62X 9.4.5 TIME-OUT SEQUENCE 9.4.6 On power-up the time-out sequence is as follows: First PWRT time-out is invoked after POR has expired. Then OST is activated. The total time-out will vary based on oscillator configuration and PWRTE bit status. For example, in RC mode with PWRTE bit erased (PWRT disabled), there will be no time-out at all. Figure 9-8, Figure 9-9 and Figure 9-10 depict time-out sequences. The power control/STATUS register, PCON (address 8Eh), has two bits. Bit0 is BOR (Brown-out). BOR is unknown on Poweron Reset. It must then be set by the user and checked on subsequent RESETS to see if BOR = 0, indicating that a brown-out has occurred. The BOR STATUS bit is a don't care and is not necessarily predictable if the brown-out circuit is disabled (by setting BODEN bit = 0 in the Configuration word). Since the time-outs occur from the POR pulse, if MCLR is kept low long enough, the time-outs will expire. Then bringing MCLR high will begin execution immediately (see Figure 9-9). This is useful for testing purposes or to synchronize more than one PIC16C62X device operating in parallel. Bit1 is POR (Power-on Reset). It is a `0' on Power-on Reset and unaffected otherwise. The user must write a `1' to this bit following a Power-on Reset. On a subsequent RESET, if POR is `0', it will indicate that a Power-on Reset must have occurred (VDD may have gone too low). Table 9-4 shows the RESET conditions for some special registers, while Table 9-5 shows the RESET conditions for all the registers. TABLE 9-1: POWER CONTROL (PCON)/ STATUS REGISTER TIME-OUT IN VARIOUS SITUATIONS Power-up Oscillator Configuration Brown-out Reset Wake-up from SLEEP PWRTE = 0 PWRTE = 1 XT, HS, LP 72 ms + 1024 TOSC 1024 TOSC 72 ms + 1024 TOSC 1024 TOSC RC 72 ms -- 72 ms -- TABLE 9-2: STATUS/PCON BITS AND THEIR SIGNIFICANCE POR BOR TO PD 0 X 1 1 Power-on Reset 0 X 0 X Illegal, TO is set on POR 0 X X 0 Illegal, PD is set on POR 1 0 X X Brown-out Reset 1 1 0 u WDT Reset 1 1 0 0 WDT Wake-up 1 1 u u MCLR Reset during normal operation 1 1 1 0 MCLR Reset during SLEEP Legend: u = unchanged, x = unknown TABLE 9-3: SUMMARY OF REGISTERS ASSOCIATED WITH BROWN-OUT Address Name 83h STATUS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 TO PD Bit 2 Bit 1 Bit 0 Value on POR Reset Value on all other RESETS(1) 0001 1xxx 000q quuu 8Eh PCON -- -- -- -- -- -- POR BOR ---- --0x ---- --uq Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as `0', q = value depends on condition. Note 1: Other (non Power-up) Resets include MCLR Reset, Brown-out Reset and Watchdog Timer Reset during normal operation. 2003 Microchip Technology Inc. DS30235J-page 51 PIC16C62X TABLE 9-4: INITIALIZATION CONDITION FOR SPECIAL REGISTERS Program Counter Condition STATUS Register PCON Register Power-on Reset 000h 0001 1xxx ---- --0x MCLR Reset during normal operation 000h 000u uuuu ---- --uu MCLR Reset during SLEEP 000h 0001 0uuu ---- --uu WDT Reset 000h 0000 uuuu ---- --uu WDT Wake-up PC + 1 uuu0 0uuu ---- --uu Brown-out Reset 000h 000x xuuu ---- --u0 uuu1 0uuu ---- --uu Interrupt Wake-up from SLEEP PC + 1(1) Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as `0'. Note 1: When the wake-up is due to an interrupt and global enable bit, GIE is set, the PC is loaded with the interrupt vector (0004h) after execution of PC+1. TABLE 9-5: Register W INITIALIZATION CONDITION FOR REGISTERS Address Power-on Reset * MCLR Reset during normal operation * MCLR Reset during SLEEP * WDT Reset * Brown-out Reset (1) * Wake-up from SLEEP through interrupt * Wake-up from SLEEP through WDT time-out -- xxxx xxxx uuuu uuuu uuuu uuuu INDF 00h -- -- -- TMR0 01h xxxx xxxx uuuu uuuu uuuu uuuu PCL 02h 0000 0000 0000 0000 PC + 1(3) STATUS 03h 0001 1xxx 000q quuu(4) uuuq quuu(4) FSR 04h xxxx xxxx uuuu uuuu uuuu uuuu PORTA 05h ---x xxxx ---u uuuu ---u uuuu PORTB 06h xxxx xxxx uuuu uuuu uuuu uuuu CMCON 1Fh 00-- 0000 00-- 0000 uu-- uuuu PCLATH 0Ah ---0 0000 ---0 0000 ---u uuuu INTCON 0Bh 0000 000x 0000 000u uuuu uqqq(2) PIR1 0Ch -0-- ---- -0-- ---- -q-- ----(2,5) OPTION 81h 1111 1111 1111 1111 uuuu uuuu TRISA 85h ---1 1111 ---1 1111 ---u uuuu TRISB 86h 1111 1111 1111 1111 uuuu uuuu PIE1 8Ch -0-- ---- -0-- ---- -u-- ---- PCON VRCON 8Eh ---- --0x 9Fh 000- 0000 ---- --uq(1,6) 000- 0000 ---- --uu uuu- uuuu Legend: Note 1: 2: 3: 4: 5: u = unchanged, x = unknown, - = unimplemented bit, reads as `0',q = value depends on condition. If VDD goes too low, Power-on Reset will be activated and registers will be affected differently. One or more bits in INTCON, PIR1 and/or PIR2 will be affected (to cause wake-up). When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h). See Table 9-4 for RESET value for specific condition. If wake-up was due to comparator input changing, then bit 6 = 1. All other interrupts generating a wake-up will cause bit 6 = u. 6: If RESET was due to brown-out, then bit 0 = 0. All other RESETS will cause bit 0 = u. DS30235J-page 52 2003 Microchip Technology Inc. PIC16C62X FIGURE 9-8: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1 VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2 FIGURE 9-9: VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD) FIGURE 9-10: VDD MCLR INTERNAL POR TPWRT PWRT TIME-OUT TOST OST TIME-OUT INTERNAL RESET 2003 Microchip Technology Inc. DS30235J-page 53 PIC16C62X FIGURE 9-11: VDD EXTERNAL POWER-ON RESET CIRCUIT (FOR SLOW VDD POWER-UP) FIGURE 9-13: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 2 VDD VDD R1 VDD Q1 MCLR D R R2 R1 40k PIC16C62X MCLR PIC16C62X C Note 1: External Power-on Reset circuit is required only if VDD power-up slope is too slow. The diode D helps discharge the capacitor quickly when VDD powers down. 2: < 40 k is recommended to make sure that voltage drop across R does not violate the device's electrical specification. 3: R1 = 100 to 1 k will limit any current flowing into MCLR from external capacitor C in the event of MCLR/VPP pin breakdown due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Note 1: This brown-out circuit is less expensive, albeit less accurate. Transistor Q1 turns off when VDD is below a certain level such that: VDD x R1 = 0.7V R1 + R2 2: Internal Brown-out Reset should be disabled when using this circuit. 3: Resistors should be adjusted for the characteristics of the transistor. FIGURE 9-14: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 3 VDD FIGURE 9-12: EXTERNAL BROWN-OUT PROTECTION CIRCUIT 1 VDD VDD 33k bypass capacitor VDD VDD RST MCLR 10k MCLR 40k PIC16C62X Note 1: This circuit will activate RESET when VDD goes below (Vz + 0.7V) where Vz = Zener voltage. 2: Internal Brown-out Reset circuitry should be disabled when using this circuit. DS30235J-page 54 MCP809 Vss PIC16C62X This brown-out protection circuit employs Microchip Technology's MCP809 microcontroller supervisor. The MCP8XX and MCP1XX families of supervisors provide push-pull and open collector outputs with both high and low active RESET pins. There are 7 different trip point selections to accommodate 5V and 3V systems. 2003 Microchip Technology Inc. PIC16C62X 9.5 Interrupts The PIC16C62X has 4 sources of interrupt: * * * * External interrupt RB0/INT TMR0 overflow interrupt PORTB change interrupts (pins RB<7:4>) Comparator interrupt The interrupt control register (INTCON) records individual interrupt requests in flag bits. It also has individual and global interrupt enable bits. A global interrupt enable bit, GIE (INTCON<7>) enables (if set) all un-masked interrupts or disables (if cleared) all interrupts. Individual interrupts can be disabled through their corresponding enable bits in INTCON register. GIE is cleared on RESET. The "return from interrupt" instruction, RETFIE, exits interrupt routine, as well as sets the GIE bit, which reenable RB0/INT interrupts. The INT pin interrupt, the RB port change interrupt and the TMR0 overflow interrupt flags are contained in the INTCON register. The peripheral interrupt flag is contained in the special register PIR1. The corresponding interrupt enable bit is contained in special registers PIE1. When an interrupt is responded to, the GIE is cleared to disable any further interrupt, the return address is pushed into the stack and the PC is loaded with 0004h. FIGURE 9-15: Once in the interrupt service routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid RB0/ INT recursive interrupts. For external interrupt events, such as the INT pin or PORTB change interrupt, the interrupt latency will be three or four instruction cycles. The exact latency depends when the interrupt event occurs (Figure 9-16). The latency is the same for one or two cycle instructions. Once in the interrupt service routine, the source(s) of the interrupt can be determined by polling the interrupt flag bits. The interrupt flag bit(s) must be cleared in software before re-enabling interrupts to avoid multiple interrupt requests. Note 1: Individual interrupt flag bits are set regardless of the status of their corresponding mask bit or the GIE bit. 2: When an instruction that clears the GIE bit is executed, any interrupts that were pending for execution in the next cycle are ignored. The CPU will execute a NOP in the cycle immediately following the instruction which clears the GIE bit. The interrupts which were ignored are still pending to be serviced when the GIE bit is set again. INTERRUPT LOGIC T0IF T0IE Wake-up (If in SLEEP mode) INTF INTE RBIF RBIE Interrupt to CPU CMIF CMIE PEIE GIE 2003 Microchip Technology Inc. DS30235J-page 55 PIC16C62X 9.5.1 RB0/INT INTERRUPT 9.5.2 TMR0 INTERRUPT An overflow (FFh 00h) in the TMR0 register will set the T0IF (INTCON<2>) bit. The interrupt can be enabled/disabled by setting/clearing T0IE (INTCON<5>) bit. For operation of the Timer0 module, see Section 6.0. External interrupt on RB0/INT pin is edge triggered, either rising if INTEDG bit (OPTION<6>) is set, or falling, if INTEDG bit is clear. When a valid edge appears on the RB0/INT pin, the INTF bit (INTCON<1>) is set. This interrupt can be disabled by clearing the INTE control bit (INTCON<4>). The INTF bit must be cleared in software in the interrupt service routine before reenabling this interrupt. The RB0/INT interrupt can wake-up the processor from SLEEP, if the INTE bit was set prior to going into SLEEP. The status of the GIE bit decides whether or not the processor branches to the interrupt vector following wake-up. See Section 9.8 for details on SLEEP and Figure 9-18 for timing of wakeup from SLEEP through RB0/INT interrupt. 9.5.3 PORTB INTERRUPT An input change on PORTB <7:4> sets the RBIF (INTCON<0>) bit. The interrupt can be enabled/disabled by setting/clearing the RBIE (INTCON<4>) bit. For operation of PORTB (Section 5.2). Note: If a change on the I/O pin should occur when the read operation is being executed (start of the Q2 cycle), then the RBIF interrupt flag may not get set. 9.5.4 COMPARATOR INTERRUPT See Section 7.6 for complete description of comparator interrupts. FIGURE 9-16: INT PIN INTERRUPT TIMING Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 CLKOUT 3 4 INT pin 1 1 INTF flag (INTCON<1>) Interrupt Latency 2 5 GIE bit (INTCON<7>) INSTRUCTION FLOW PC PC Instruction fetched Inst (PC) Instruction executed Inst (PC-1) PC+1 Inst (PC+1) Inst (PC) PC+1 -- Dummy Cycle 0004h 0005h Inst (0004h) Inst (0005h) Dummy Cycle Inst (0004h) Note 1: INTF flag is sampled here (every Q1). 2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time. Latency is the same whether Inst (PC) is a single cycle or a two-cycle instruction. 3: CLKOUT is available only in RC Oscillator mode. 4: For minimum width of INT pulse, refer to AC specs. 5: INTF is enabled to be set anytime during the Q4-Q1 cycles. DS30235J-page 56 2003 Microchip Technology Inc. PIC16C62X TABLE 9-6: SUMMARY OF INTERRUPT REGISTERS Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Value on all other RESETS(1) Address Name 0Bh INTCON GIE PEIE T0IE INTE RBIE T0IF INTF RBIF 0000 000x 0000 000u 0Ch PIR1 -- CMIF -- -- -- -- -- -- -0-- ---- -0-- ---- 8Ch PIE1 -- CMIE -- -- -- -- -- -- -0-- ---- -0-- ---- Note 1: Other (non Power-up) Resets include MCLR Reset, Brown-out Reset and Watchdog Timer Reset during normal operation. 9.6 Context Saving During Interrupts During an interrupt, only the return PC value is saved on the stack. Typically, users may wish to save key registers during an interrupt (e.g., W register and STATUS register). This will have to be implemented in software. Example 9-3 stores and restores the STATUS and W registers. The user register, W_TEMP, must be defined in both banks and must be defined at the same offset from the bank base address (i.e., W_TEMP is defined at 0x20 in Bank 0 and it must also be defined at 0xA0 in Bank 1). The user register, STATUS_TEMP, must be defined in Bank 0. The Example 9-3: * * * * Stores the W register Stores the STATUS register in Bank 0 Executes the ISR code Restores the STATUS (and bank select bit register) * Restores the W register EXAMPLE 9-3: SAVING THE STATUS AND W REGISTERS IN RAM MOVWF W_TEMP ;copy W to temp register, ;could be in either bank SWAPF STATUS,W ;swap status to be saved into W BCF STATUS,RP0 ;change to bank 0 regardless ;of current bank MOVWF STATUS_TEMP ;save status to bank 0 ;register : : (ISR) : SWAPF STATUS_TEMP, W ;swap STATUS_TEMP register ;into W, sets bank to original ;state MOVWF STATUS ;move W into STATUS register SWAPF W_TEMP,F ;swap W_TEMP SWAPF W_TEMP,W ;swap W_TEMP into W 2003 Microchip Technology Inc. DS30235J-page 57 PIC16C62X 9.7 Watchdog Timer (WDT) DC specs). If longer time-out periods are desired, a prescaler with a division ratio of up to 1:128 can be assigned to the WDT under software control by writing to the OPTION register. Thus, time-out periods up to 2.3 seconds can be realized. The Watchdog Timer is a free running on-chip RC oscillator which does not require any external components. This RC oscillator is separate from the RC oscillator of the CLKIN pin. That means that the WDT will run, even if the clock on the OSC1 and OSC2 pins of the device has been stopped, for example, by execution of a SLEEP instruction. During normal operation, a WDT time-out generates a device RESET. If the device is in SLEEP mode, a WDT time-out causes the device to wake-up and continue with normal operation. The WDT can be permanently disabled by programming the configuration bit WDTE as clear (Section 9.1). 9.7.1 The CLRWDT and SLEEP instructions clear the WDT and the postscaler, if assigned to the WDT, and prevent it from timing out and generating a device RESET. The TO bit in the STATUS register will be cleared upon a Watchdog Timer time-out. 9.7.2 It should also be taken in account that under worst case conditions (VDD = Min., Temperature = Max., max. WDT prescaler) it may take several seconds before a WDT time-out occurs. WDT PERIOD The WDT has a nominal time-out period of 18 ms, (with no prescaler). The time-out periods vary with temperature, VDD and process variations from part to part (see FIGURE 9-17: WDT PROGRAMMING CONSIDERATIONS WATCHDOG TIMER BLOCK DIAGRAM From TMR0 Clock Source (Figure 6-6) 0 M 1 Watchdog Timer Postscaler U 8 X 8 - to -1 MUX PS<2:0> PSA WDT Enable Bit To TMR0 (Figure 6-6) 1 0 MUX PSA WDT Time-out Note: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION register. TABLE 9-7: SUMMARY OF WATCHDOG TIMER REGISTERS Address Name Bit 7 2007h Config. bits -- 81h OPTION RBPU Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on POR Reset Value on all other RESETS BODEN CP1 CP0 PWRTE WDTE FOSC1 FOSC0 -- -- INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111 Legend: Shaded cells are not used by the Watchdog Timer. Note: _ = Unimplemented location, read as "0" + = Reserved for future use DS30235J-page 58 2003 Microchip Technology Inc. PIC16C62X 9.8 Power-Down Mode (SLEEP) The Power-down mode is entered by executing a SLEEP instruction. If enabled, the Watchdog Timer will be cleared but keeps running, the PD bit in the STATUS register is cleared, the TO bit is set, and the oscillator driver is turned off. The I/O ports maintain the status they had, before SLEEP was executed (driving high, low, or hiimpedance). For lowest current consumption in this mode, all I/O pins should be either at VDD or VSS with no external circuitry drawing current from the I/O pin and the comparators and VREF should be disabled. I/O pins that are hi-impedance inputs should be pulled high or low externally to avoid switching currents caused by floating inputs. The T0CKI input should also be at VDD or VSS for lowest current consumption. The contribution from on chip pull-ups on PORTB should be considered. The MCLR pin must be at a logic high level (VIHMC). Note: When the SLEEP instruction is being executed, the next instruction (PC + 1) is pre-fetched. For the device to wake-up through an interrupt event, the corresponding interrupt enable bit must be set (enabled). Wake-up is regardless of the state of the GIE bit. If the GIE bit is clear (disabled), the device continues execution at the instruction after the SLEEP instruction. If the GIE bit is set (enabled), the device executes the instruction after the SLEEP instruction and then branches to the interrupt address (0004h). In cases where the execution of the instruction following SLEEP is not desirable, the user should have an NOP after the SLEEP instruction. Note: It should be noted that a RESET generated by a WDT time-out does not drive MCLR pin low. 9.8.1 WAKE-UP FROM SLEEP The device can wake-up from SLEEP through one of the following events: 1. 2. 3. The first event will cause a device RESET. The two latter events are considered a continuation of program execution. The TO and PD bits in the STATUS register can be used to determine the cause of device RESET. PD bit, which is set on power-up, is cleared when SLEEP is invoked. TO bit is cleared if WDT wake-up occurred. If the global interrupts are disabled (GIE is cleared), but any interrupt source has both its interrupt enable bit and the corresponding interrupt flag bits set, the device will immediately wake-up from SLEEP. The SLEEP instruction is completely executed. The WDT is cleared when the device wakes up from SLEEP, regardless of the source of wake-up. External RESET input on MCLR pin Watchdog Timer Wake-up (if WDT was enabled) Interrupt from RB0/INT pin, RB Port change, or the Peripheral Interrupt (Comparator). FIGURE 9-18: WAKE-UP FROM SLEEP THROUGH INTERRUPT Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 OSC1 Tost(2) CLKOUT(4) INT pin INTF flag (INTCON<1>) Interrupt Latency (Note 2) GIE bit (INTCON<7>) Processor in SLEEP INSTRUCTION FLOW PC Instruction fetched Instruction executed PC Inst(PC) = SLEEP Inst(PC - 1) PC+1 PC+2 PC+2 Inst(PC + 1) Inst(PC + 2) SLEEP Inst(PC + 1) PC + 2 Dummy cycle 0004h 0005h Inst(0004h) Inst(0005h) Dummy cycle Inst(0004h) Note 1: XT, HS or LP Oscillator mode assumed. 2: TOST = 1024TOSC (drawing not to scale) This delay will not be there for RC Osc mode. 3: GIE = '1' assumed. In this case, after wake-up, the processor jumps to the interrupt routine. If GIE = '0', execution will continue in-line. 4: CLKOUT is not available in these Osc modes, but shown here for timing reference. 2003 Microchip Technology Inc. DS30235J-page 59 PIC16C62X 9.9 Code Protection If the code protection bit(s) have not been programmed, the on-chip program memory can be read out for verification purposes. Note: 9.10 Microchip does not recommend code protecting windowed devices. ID Locations Four memory locations (2000h-2003h) are designated as ID locations where the user can store checksum or other code identification numbers. These locations are not accessible during normal execution, but are readable and writable during Program/Verify. Only the Least Significant 4 bits of the ID locations are used. 9.11 In-Circuit Serial ProgrammingTM The PIC16C62X microcontrollers can be serially programmed while in the end application circuit. This is simply done with two lines for clock and data and three other lines for power, ground and the programming voltage. This allows customers to manufacture boards with unprogrammed devices and then program the microcontroller just before shipping the product. This also allows the most recent firmware or a custom firmware to be programmed. The device is placed into a Program/Verify mode by holding the RB6 and RB7 pins low, while raising the MCLR (VPP) pin from VIL to VIHH (see programming specification). RB6 becomes the programming clock and RB7 becomes the programming data. Both RB6 and RB7 are Schmitt Trigger inputs in this mode. After RESET, to place the device into Programming/ Verify mode, the program counter (PC) is at location 00h. A 6-bit command is then supplied to the device. Depending on the command, 14-bits of program data are then supplied to or from the device, depending if the command was a load or a read. For complete details of serial programming, please refer to the PIC16C6X/7X/9XX Programming Specification (DS30228). A typical In-Circuit Serial Programming connection is shown in Figure 9-19. FIGURE 9-19: External Connector Signals TYPICAL IN-CIRCUIT SERIAL PROGRAMMING CONNECTION To Normal Connections PIC16C62X +5V VDD 0V VSS VPP MCLR/VPP CLK RB6 Data I/O RB7 VDD To Normal Connections DS30235J-page 60 2003 Microchip Technology Inc. PIC16C62X 10.0 INSTRUCTION SET SUMMARY Each PIC16C62X instruction is a 14-bit word divided into an OPCODE which specifies the instruction type and one or more operands which further specify the operation of the instruction. The PIC16C62X instruction set summary in Table 10-2 lists byte-oriented, bitoriented, and literal and control operations. Table 10-1 shows the opcode field descriptions. For byte-oriented instructions, 'f' represents a file register designator and 'd' represents a destination designator. The file register designator specifies which file register is to be used by the instruction. The destination designator specifies where the result of the operation is to be placed. If 'd' is zero, the result is placed in the W register. If 'd' is one, the result is placed in the file register specified in the instruction. For bit-oriented instructions, 'b' represents a bit field designator which selects the number of the bit affected by the operation, while 'f' represents the number of the file in which the bit is located. For literal and control operations, 'k' represents an eight or eleven bit constant or literal value. TABLE 10-1: OPCODE FIELD DESCRIPTIONS Field Description f Register file address (0x00 to 0x7F) W Working register (accumulator) b Bit address within an 8-bit file register k Literal field, constant data or label x Don't care location (= 0 or 1) The assembler will generate code with x = 0. It is the recommended form of use for compatibility with all Microchip software tools. d The instruction set is highly orthogonal and is grouped into three basic categories: * Byte-oriented operations * Bit-oriented operations * Literal and control operations All instructions are executed within one single instruction cycle, unless a conditional test is true or the program counter is changed as a result of an instruction. In this case, the execution takes two instruction cycles with the second cycle executed as a NOP. One instruction cycle consists of four oscillator periods. Thus, for an oscillator frequency of 4 MHz, the normal instruction execution time is 1 s. If a conditional test is true or the program counter is changed as a result of an instruction, the instruction execution time is 2 s. Table 10-1 lists the instructions recognized by the MPASMTM assembler. Figure 10-1 shows the three general formats that the instructions can have. Note: To maintain upward compatibility with future PICmicro(R) products, do not use the OPTION and TRIS instructions. All examples use the following format to represent a hexadecimal number: 0xhh where h signifies a hexadecimal digit. FIGURE 10-1: GENERAL FORMAT FOR INSTRUCTIONS Byte-oriented file register operations 13 8 7 6 OPCODE d f (FILE #) 0 d = 0 for destination W d = 1 for destination f f = 7-bit file register address Destination select; d = 0: store result in W, d = 1: store result in file register f. Default is d = 1 label Label name TOS Top of Stack PC Program Counter PCLAT Program Counter High Latch H GIE Global Interrupt Enable bit WDT Watchdog Timer/Counter TO Time-out bit PD Power-down bit dest Destination either the W register or the specified register file location [ ] Options ( ) Contents Assigned to <> Register bit field italics In the set of User defined term (font is courier) Bit-oriented file register operations 13 10 9 7 6 OPCODE b (BIT #) f (FILE #) 0 b = 3-bit bit address f = 7-bit file register address Literal and control operations General 13 8 7 OPCODE 0 k (literal) k = 8-bit immediate value CALL and GOTO instructions only 13 11 OPCODE 10 0 k (literal) k = 11-bit immediate value 2003 Microchip Technology Inc. DS30235J-page 61 PIC16C62X TABLE 10-2: Mnemonic, Operands PIC16C62X INSTRUCTION SET Description Cycles 14-Bit Opcode MSb LSb Status Affected Notes BYTE-ORIENTED FILE REGISTER OPERATIONS ADDWF ANDWF CLRF CLRW COMF DECF DECFSZ INCF INCFSZ IORWF MOVF MOVWF NOP RLF RRF SUBWF SWAPF XORWF f, d f, d f f, d f, d f, d f, d f, d f, d f, d f f, d f, d f, d f, d f, d Add W and f AND W with f Clear f Clear W Complement f Decrement f Decrement f, Skip if 0 Increment f Increment f, Skip if 0 Inclusive OR W with f Move f Move W to f No Operation Rotate Left f through Carry Rotate Right f through Carry Subtract W from f Swap nibbles in f Exclusive OR W with f 1 1 1 1 1 1 1(2) 1 1(2) 1 1 1 1 1 1 1 1 1 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 0111 0101 0001 0001 1001 0011 1011 1010 1111 0100 1000 0000 0000 1101 1100 0010 1110 0110 dfff dfff lfff 0000 dfff dfff dfff dfff dfff dfff dfff lfff 0xx0 dfff dfff dfff dfff dfff ffff ffff ffff 0011 ffff ffff ffff ffff ffff ffff ffff ffff 0000 ffff ffff ffff ffff ffff 1 1 1 (2) 1 (2) 01 01 01 01 00bb 01bb 10bb 11bb bfff bfff bfff bfff ffff ffff ffff ffff 1 1 2 1 2 1 1 2 2 2 1 1 1 11 11 10 00 10 11 11 00 11 00 00 11 11 111x 1001 0kkk 0000 1kkk 1000 00xx 0000 01xx 0000 0000 110x 1010 kkkk kkkk kkkk 0110 kkkk kkkk kkkk 0000 kkkk 0000 0110 kkkk kkkk kkkk kkkk kkkk 0100 kkkk kkkk kkkk 1001 kkkk 1000 0011 kkkk kkkk C,DC,Z Z Z Z Z Z Z Z Z C C C,DC,Z Z 1,2 1,2 2 1,2 1,2 1,2,3 1,2 1,2,3 1,2 1,2 1,2 1,2 1,2 1,2 1,2 BIT-ORIENTED FILE REGISTER OPERATIONS BCF BSF BTFSC BTFSS f, b f, b f, b f, b Bit Clear f Bit Set f Bit Test f, Skip if Clear Bit Test f, Skip if Set 1,2 1,2 3 3 LITERAL AND CONTROL OPERATIONS ADDLW ANDLW CALL CLRWDT GOTO IORLW MOVLW RETFIE RETLW RETURN SLEEP SUBLW XORLW k k k k k k k k k Add literal and W AND literal with W Call subroutine Clear Watchdog Timer Go to address Inclusive OR literal with W Move literal to W Return from interrupt Return with literal in W Return from Subroutine Go into Standby mode Subtract W from literal Exclusive OR literal with W C,DC,Z Z TO,PD Z TO,PD C,DC,Z Z Note 1: When an I/O register is modified as a function of itself ( e.g., MOVF PORTB, 1), the value used will be that value present on the pins themselves. For example, if the data latch is '1' for a pin configured as input and is driven low by an external device, the data will be written back with a '0'. 2: If this instruction is executed on the TMR0 register (and, where applicable, d = 1), the prescaler will be cleared if assigned to the Timer0 Module. 3: If Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second cycle is executed as a NOP. DS30235J-page 62 2003 Microchip Technology Inc. PIC16C62X 10.1 Instruction Descriptions Add Literal and W ANDLW AND Literal with W Syntax: [ label ] ADDLW Syntax: [ label ] ANDLW Operands: 0 k 255 Operands: 0 k 255 Operation: (W) + k (W) Operation: (W) .AND. (k) (W) Status Affected: C, DC, Z Status Affected: Z ADDLW Encoding: 11 k 111x kkkk kkkk Encoding: 11 k 1001 kkkk kkkk Description: The contents of the W register are added to the eight bit literal 'k' and the result is placed in the W register. Description: The contents of W register are AND'ed with the eight bit literal 'k'. The result is placed in the W register. Words: 1 Words: 1 Cycles: 1 Cycles: 1 Example ADDLW Example 0x15 Before Instruction W = ADDWF = [ label ] ADDWF Operands: 0 f 127 d [0,1] Operation: (W) + (f) (dest) Status Affected: Description: W 0x25 f,d C, DC, Z Encoding: 00 0111 dfff ffff Add the contents of the W register with register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. [ label ] ANDWF Operands: 0 f 127 d [0,1] Operation: (W) .AND. (f) (dest) Status Affected: Z Encoding: After Instruction W = FSR = 2003 Microchip Technology Inc. 0xD9 0xC2 dfff ffff Words: 1 1 Example 0x17 0xC2 0101 AND the W register with register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. 1 W = FSR = 00 f,d Description: Cycles: Before Instruction 0x03 AND W with f Cycles: FSR, 0 = Syntax: 1 ADDWF 0xA3 ANDWF Words: Example = After Instruction Add W and f Syntax: 0x5F W 0x10 After Instruction W ANDLW Before Instruction ANDWF FSR, 1 Before Instruction W = FSR = 0x17 0xC2 After Instruction W = FSR = 0x17 0x02 DS30235J-page 63 PIC16C62X BCF Bit Clear f Syntax: [ label ] BCF BTFSC Bit Test, Skip if Clear Syntax: [ label ] BTFSC f,b Operands: 0 f 127 0b7 Operands: 0 f 127 0b7 Operation: 0 (f<b>) Operation: skip if (f<b>) = 0 Status Affected: None Status Affected: None Encoding: 01 f,b 00bb bfff ffff Description: Bit 'b' in register 'f' is cleared. Words: 1 Cycles: 1 Example BCF Encoding: 1 Cycles: 1(2) Example HERE FALSE TRUE BTFSC GOTO * * * BSF Bit Set f Syntax: [ label ] BSF Operands: 0 f 127 0b7 Before Instruction Operation: 1 (f<b>) After Instruction Status Affected: None Encoding: 01 PC = 01bb bfff Description: Bit 'b' in register 'f' is set. Words: 1 Cycles: 1 Example BSF FLAG_REG, ffff ffff Words: FLAG_REG = 0xC7 f,b bfff If bit 'b' in register 'f' is '0', then the next instruction is skipped. If bit 'b' is '0', then the next instruction fetched during the current instruction execution is discarded, and a NOP is executed instead, making this a two-cycle instruction. Before Instruction FLAG_REG = 0x47 10bb Description: FLAG_REG, 7 After Instruction 01 FLAG,1 PROCESS_CO DE address HERE if FLAG<1> = 0, PC = address TRUE if FLAG<1>=1, PC = address FALSE 7 Before Instruction FLAG_REG = 0x0A After Instruction FLAG_REG = 0x8A DS30235J-page 64 2003 Microchip Technology Inc. PIC16C62X BTFSS Bit Test f, Skip if Set CALL Call Subroutine Syntax: [ label ] BTFSS f,b Syntax: [ label ] CALL k Operands: 0 f 127 0b<7 Operands: 0 k 2047 Operation: Operation: skip if (f<b>) = 1 Status Affected: None (PC)+ 1 TOS, k PC<10:0>, (PCLATH<4:3>) PC<12:11> Status Affected: None Encoding: Description: 01 bfff ffff If bit 'b' in register 'f' is '1', then the next instruction is skipped. If bit 'b' is '1', then the next instruction fetched during the current instruction execution, is discarded and a NOP is executed instead, making this a two-cycle instruction. Words: 1 Cycles: 1(2) Example 11bb HERE FALSE TRUE BTFSS GOTO * * * FLAG,1 PROCESS_CO DE Encoding: 0kkk kkkk kkkk Description: Call Subroutine. First, return address (PC+1) is pushed onto the stack. The eleven bit immediate address is loaded into PC bits <10:0>. The upper bits of the PC are loaded from PCLATH. CALL is a two-cycle instruction. Words: 1 Cycles: 2 Example HERE CALL THER E Before Instruction Before Instruction PC = 10 PC = Address HERE address HERE After Instruction After Instruction if FLAG<1> = 0, PC = address FALSE if FLAG<1> = 1, PC = address TRUE PC = Address THERE TOS = Address HERE+1 CLRF Clear f Syntax: [ label ] CLRF Operands: 0 f 127 Operation: 00h (f) 1Z Status Affected: Z Encoding: 00 f 0001 1fff ffff Description: The contents of register 'f' are cleared and the Z bit is set. Words: 1 Cycles: 1 Example CLRF FLAG_REG Before Instruction FLAG_REG = 0x5A = = 0x00 1 After Instruction FLAG_REG Z 2003 Microchip Technology Inc. DS30235J-page 65 PIC16C62X CLRW Clear W COMF Complement f Syntax: [ label ] CLRW Syntax: [ label ] COMF Operands: None Operands: Operation: 00h (W) 1Z 0 f 127 d [0,1] Operation: (f) (dest) Status Affected: Z Status Affected: Z Encoding: 00 0001 0000 0011 Description: W register is cleared. Zero bit (Z) is set. Words: 1 Cycles: 1 Example CLRW Before Instruction W = Encoding: = = 1 Cycles: 1 COMF REG1,0 Before Instruction 0x00 1 CLRWDT Clear Watchdog Timer Syntax: [ label ] CLRWDT Operands: None Operation: 00h WDT 0 WDT prescaler, 1 TO 1 PD REG1 Encoding: 0000 0110 = 0x13 = = 0x13 0xEC After Instruction TO, PD 00 ffff Words: REG1 W Status Affected: dfff The contents of register 'f' are complemented. If 'd' is 0, the result is stored in W. If 'd' is 1, the result is stored back in register 'f'. Example 0x5A 1001 Description: After Instruction W Z 00 f,d 0100 DECF Decrement f Syntax: [ label ] DECF f,d Operands: 0 f 127 d [0,1] Operation: (f) - 1 (dest) Status Affected: Z Encoding: 00 0011 dfff ffff Description: CLRWDT instruction resets the Watchdog Timer. It also resets the prescaler of the WDT. STATUS bits TO and PD are set. Description: Decrement register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. Words: 1 Words: 1 Cycles: 1 Cycles: 1 Example Example CLRWDT Before Instruction WDT counter = DS30235J-page 66 CNT, 1 Before Instruction ? After Instruction WDT counter = WDT prescaler= TO = PD = DECF 0x00 0 1 1 CNT Z = = 0x01 0 = = 0x00 1 After Instruction CNT Z 2003 Microchip Technology Inc. PIC16C62X DECFSZ Decrement f, Skip if 0 INCF Increment f Syntax: [ label ] DECFSZ f,d Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) - 1 (dest); Operation: (f) + 1 (dest) Status Affected: None Status Affected: Z Encoding: Description: 00 1011 skip if result = 0 dfff ffff The contents of register 'f' are decremented. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is placed back in register 'f'. If the result is 0, the next instruction, which is already fetched, is discarded. A NOP is executed instead making it a two-cycle instruction. Words: 1 Cycles: 1(2) Example Encoding: 00 INCF f,d 1010 dfff ffff Description: The contents of register 'f' are incremented. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is placed back in register 'f'. Words: 1 Cycles: 1 Example INCF CNT, 1 Before Instruction CNT Z = = 0xFF 0 = = 0x00 1 After Instruction HERE DECFSZ GOTO CONTINUE * * * CNT, 1 LOOP CNT Z Before Instruction PC = address HERE After Instruction CNT if CNT PC if CNT PC = = = = CNT - 1 0, address CONTINUE 0, address HERE+1 GOTO Unconditional Branch Syntax: [ label ] Operands: 0 k 2047 Operation: k PC<10:0> PCLATH<4:3> PC<12:11> Status Affected: None Encoding: 10 GOTO k 1kkk kkkk kkkk Description: GOTO is an unconditional branch. The eleven bit immediate value is loaded into PC bits <10:0>. The upper bits of PC are loaded from PCLATH<4:3>. GOTO is a twocycle instruction. Words: 1 Cycles: 2 Example GOTO THERE After Instruction PC = 2003 Microchip Technology Inc. Address THERE DS30235J-page 67 PIC16C62X INCFSZ Increment f, Skip if 0 IORWF Inclusive OR W with f Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: (f) + 1 (dest), skip if result = 0 Operation: (W) .OR. (f) (dest) Status Affected: None Status Affected: Z Encoding: Description: 00 INCFSZ f,d 1111 dfff ffff The contents of register 'f' are incremented. If 'd' is 0 the result is placed in the W register. If 'd' is 1, the result is placed back in register 'f'. If the result is 0, the next instruction, which is already fetched, is discarded. A NOP is executed instead making it a two-cycle instruction. Words: 1 Cycles: 1(2) Example CNT, LOOP = address HERE After Instruction CNT = if CNT= PC = if CNT PC = CNT + 1 0, address CONTINUE 0, address HERE +1 IORLW Inclusive OR Literal with W Syntax: [ label ] Operands: 0 k 255 Operation: (W) .OR. k (W) Status Affected: Z IORLW k 1000 kkkk kkkk The contents of the W register is OR'ed with the eight bit literal 'k'. The result is placed in the W register. Words: 1 Cycles: 1 IORLW ffff Inclusive OR the W register with register 'f'. If 'd' is 0 the result is placed in the W register. If 'd' is 1 the result is placed back in register 'f'. Words: 1 Cycles: 1 Example RESULT, 0 IORWF Before Instruction RESULT = W = Z = MOVLW Move Literal to W Syntax: [ label ] Operands: 0 k 255 Operation: k (W) Status Affected: None Encoding: 0x13 0x91 11 0x13 0x93 1 MOVLW k 00xx kkkk kkkk Description: The eight bit literal 'k' is loaded into W register. The don't cares will assemble as 0's. Words: 1 Cycles: 1 Example Description: Example dfff Description: 1 Before Instruction 11 0100 After Instruction INCFSZ GOTO CONTINUE * * * Encoding: 00 f,d RESULT = W = HERE PC Encoding: IORWF MOVLW 0x5A After Instruction W = 0x5A 0x35 Before Instruction W = 0x9A After Instruction W Z DS30235J-page 68 = = 0xBF 1 2003 Microchip Technology Inc. PIC16C62X MOVF Move f Syntax: [ label ] Operands: 0 f 127 d [0,1] Operation: (f) (dest) Status Affected: Z Encoding: Encoding: Description: MOVF f,d 00 1000 dfff ffff The contents of register f is moved to a destination dependent upon the status of d. If d = 0, destination is W register. If d = 1, the destination is file register f itself. d = 1 is useful to test a file register since status flag Z is affected. Words: 1 Cycles: 1 Example FSR, 0 MOVF After Instruction W = register Z = value in FSR 1 NOP No Operation Syntax: [ label ] Operands: None Operation: No operation Status Affected: None 00 No operation. Words: 1 Cycles: 1 Example OPTION Load Option Register Syntax: [ label ] Operands: None Operation: (W) OPTION Status Affected: None Encoding: 00 Operands: 0 f 127 Operation: (W) (f) Words: 1 Status Affected: None Cycles: 1 f 1fff ffff Description: Move data from W register to register 'f'. Words: 1 Cycles: 1 Example MOVWF OPTION 0000 0110 0010 The contents of the W register are loaded in the OPTION register. This instruction is supported for code compatibility with PIC16C5X products. Since OPTION is a readable/writable register, the user can directly address it. [ label ] 0000 0000 Description: Syntax: 00 0xx0 NOP Move W to f Encoding: 0000 Description: MOVWF MOVWF NOP Example To maintain upward compatibility with future PICmicro(R) products, do not use this instruction. OPTION Before Instruction OPTION = W = 0xFF 0x4F After Instruction OPTION = W = 2003 Microchip Technology Inc. 0x4F 0x4F DS30235J-page 69 PIC16C62X RETFIE Return from Interrupt RETLW Return with Literal in W Syntax: [ label ] Syntax: [ label ] Operands: None Operands: 0 k 255 Operation: TOS PC, 1 GIE Operation: k (W); TOS PC Status Affected: None Status Affected: None Encoding: Description: 00 0000 0000 1001 Return from Interrupt. Stack is POPed and Top of Stack (TOS) is loaded in the PC. Interrupts are enabled by setting Global Interrupt Enable bit, GIE (INTCON<7>). This is a two-cycle instruction. Words: 1 Cycles: 2 Example RETFIE Encoding: PC = GIE = 01xx kkkk kkkk Description: The W register is loaded with the eight bit literal 'k'. The program counter is loaded from the top of the stack (the return address). This is a two-cycle instruction. Words: 1 Cycles: 2 Example CALL TABLE;W contains table ;offset value * ;W now has table value * * ADDWF PC ;W = offset RETLW k1 ;Begin table RETLW k2 ; * * * RETLW kn ; End of table RETFIE TABLE After Interrupt 11 RETLW k TOS 1 Before Instruction W = 0x07 After Instruction W = value of k8 RETURN Return from Subroutine Syntax: [ label ] Operands: None Operation: TOS PC Status Affected: None Encoding: 00 RETURN 0000 0000 1000 Description: Return from subroutine. The stack is POPed and the top of the stack (TOS) is loaded into the program counter. This is a two-cycle instruction. Words: 1 Cycles: 2 Example RETURN After Interrupt PC = DS30235J-page 70 TOS 2003 Microchip Technology Inc. PIC16C62X RLF Rotate Left f through Carry RRF Rotate Right f through Carry Syntax: [ label ] Syntax: [ label ] Operands: 0 f 127 d [0,1] Operands: 0 f 127 d [0,1] Operation: See description below Operation: See description below Status Affected: C Status Affected: C Encoding: Description: RLF 00 f,d 1101 dfff ffff The contents of register 'f' are rotated one bit to the left through the Carry Flag. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is stored back in register 'f'. C Encoding: Description: 00 Register f C 1 Words: 1 Cycles: 1 Cycles: 1 RLF REG1,0 1100 Example REG1, 0 RRF = = 1110 0110 0 Before Instruction = = = 1110 0110 1100 1100 1 After Instruction REG1 C After Instruction REG1 W C ffff Register f Before Instruction REG1 C dfff The contents of register 'f' are rotated one bit to the right through the Carry Flag. If 'd' is 0, the result is placed in the W register. If 'd' is 1, the result is placed back in register 'f'. Words: Example RRF f,d REG1 W C = = 1110 0110 0 = = = 1110 0110 0111 0011 0 SLEEP Syntax: [ label ] Operands: None Operation: 00h WDT, 0 WDT prescaler, 1 TO, 0 PD Status Affected: TO, PD Encoding: 2003 Microchip Technology Inc. 00 SLEEP 0000 0110 0011 Description: The power-down STATUS bit, PD is cleared. Time-out STATUS bit, TO is set. Watchdog Timer and its prescaler are cleared. The processor is put into SLEEP mode with the oscillator stopped. See Section 9.8 for more details. Words: 1 Cycles: 1 Example: SLEEP DS30235J-page 71 PIC16C62X SUBLW Subtract W from Literal SUBWF Subtract W from f Syntax: [ label ] Syntax: [ label ] Operands: 0 k 255 Operands: Operation: k - (W) (W) 0 f 127 d [0,1] Status Affected: C, DC, Z Operation: (f) - (W) (dest) Status Affected: C, DC, Z Encoding: 00 Encoding: Description: 11 SUBLW k 110x kkkk kkkk The W register is subtracted (2's complement method) from the eight bit literal 'k'. The result is placed in the W register. Words: 1 Cycles: 1 Example 1: SUBLW 0x02 Before Instruction W C = = 1 ? Example 2: = = = = W C Example 3: = = 1 Cycles: 1 Example 1: SUBWF = = REG1= W = C = = = REG1= W = C = 2 ? Example 2: 0 1; result is zero 1 2 1; result is positive Before Instruction REG1= W = C = 2 2 ? After Instruction 3 ? 0xFF 0; result is negative 3 2 ? After Instruction REG1= W = C = After Instruction W C REG1,1 Before Instruction Before Instruction W C ffff Words: 1 1; result is positive After Instruction dfff Subtract (2's complement method) W register from register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. Before Instruction W C 0010 Description: After Instruction W C SUBWF f,d Example 3: 0 2 1; result is zero Before Instruction REG1= W = C = 1 2 ? After Instruction REG1= W = C = DS30235J-page 72 0xFF 2 0; result is negative 2003 Microchip Technology Inc. PIC16C62X SWAPF Swap Nibbles in f XORLW Exclusive OR Literal with W Syntax: [ label ] SWAPF f,d Syntax: Operands: 0 f 127 d [0,1] [ label ] Operands: 0 k 255 Operation: (W) .XOR. k (W) Status Affected: Z Operation: Status Affected: (f<3:0>) (dest<7:4>), (f<7:4>) (dest<3:0>) None Encoding: Description: 00 Encoding: 1110 dfff ffff The upper and lower nibbles of register 'f' are exchanged. If 'd' is 0, the result is placed in W register. If 'd' is 1, the result is placed in register 'f'. Words: 1 Cycles: 1 Example SWAPF REG, XORLW k 11 1010 Words: 1 Cycles: 1 Example: XORLW 0xAF Before Instruction W Before Instruction = W = = 0xA5 0x5A = 0xB5 After Instruction 0xA5 After Instruction REG1 W = 0x1A XORWF Exclusive OR W with f Syntax: [ label ] XORWF Operands: 0 f 127 d [0,1] f,d TRIS Load TRIS Register Syntax: [ label ] TRIS Operands: 5f7 Operation: (W) .XOR. (f) (dest) Operation: (W) TRIS register f; Status Affected: Z Status Affected: None Encoding: Description: 00 f Encoding: 0000 0110 0fff The instruction is supported for code compatibility with the PIC16C5X products. Since TRIS registers are readable and writable, the user can directly address them. Words: 1 Cycles: 1 kkkk The contents of the W register are XOR'ed with the eight bit literal 'k'. The result is placed in the W register. 0 REG1 kkkk Description: 00 0110 dfff ffff Description: Exclusive OR the contents of the W register with register 'f'. If 'd' is 0, the result is stored in the W register. If 'd' is 1, the result is stored back in register 'f'. Words: 1 Cycles: 1 Example XORWF REG 1 Before Instruction Example To maintain upward compatibility with future PICmicro(R) products, do not use this instruction. 2003 Microchip Technology Inc. REG W = = 0xAF 0xB5 = = 0x1A 0xB5 After Instruction REG W DS30235J-page 73 PIC16C62X NOTES: DS30235J-page 74 2003 Microchip Technology Inc. PIC16C62X 11.0 DEVELOPMENT SUPPORT The PICmicro(R) microcontrollers are supported with a full range of hardware and software development tools: * Integrated Development Environment - MPLAB(R) IDE Software * Assemblers/Compilers/Linkers - MPASMTM Assembler - MPLAB C17 and MPLAB C18 C Compilers - MPLINKTM Object Linker/ MPLIBTM Object Librarian - MPLAB C30 C Compiler - MPLAB ASM30 Assembler/Linker/Library * Simulators - MPLAB SIM Software Simulator - MPLAB dsPIC30 Software Simulator * Emulators - MPLAB ICE 2000 In-Circuit Emulator - MPLAB ICE 4000 In-Circuit Emulator * In-Circuit Debugger - MPLAB ICD 2 * Device Programmers - PRO MATE(R) II Universal Device Programmer - PICSTART(R) Plus Development Programmer * Low Cost Demonstration Boards - PICDEMTM 1 Demonstration Board - PICDEM.netTM Demonstration Board - PICDEM 2 Plus Demonstration Board - PICDEM 3 Demonstration Board - PICDEM 4 Demonstration Board - PICDEM 17 Demonstration Board - PICDEM 18R Demonstration Board - PICDEM LIN Demonstration Board - PICDEM USB Demonstration Board * Evaluation Kits - KEELOQ(R) - PICDEM MSC - microID(R) - CAN - PowerSmart(R) - Analog 11.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit microcontroller market. The MPLAB IDE is a Windows(R) based application that contains: * An interface to debugging tools - simulator - programmer (sold separately) - emulator (sold separately) - in-circuit debugger (sold separately) * A full-featured editor with color coded context * A multiple project manager * Customizable data windows with direct edit of contents * High level source code debugging * Mouse over variable inspection * Extensive on-line help The MPLAB IDE allows you to: * Edit your source files (either assembly or C) * One touch assemble (or compile) and download to PICmicro emulator and simulator tools (automatically updates all project information) * Debug using: - source files (assembly or C) - absolute listing file (mixed assembly and C) - machine code MPLAB IDE supports multiple debugging tools in a single development paradigm, from the cost effective simulators, through low cost in-circuit debuggers, to full-featured emulators. This eliminates the learning curve when upgrading to tools with increasing flexibility and power. 11.2 MPASM Assembler The MPASM assembler is a full-featured, universal macro assembler for all PICmicro MCUs. The MPASM assembler generates relocatable object files for the MPLINK object linker, Intel(R) standard HEX files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging. The MPASM assembler features include: * Integration into MPLAB IDE projects * User defined macros to streamline assembly code * Conditional assembly for multi-purpose source files * Directives that allow complete control over the assembly process 2003 Microchip Technology Inc. DS30235J-page 75 PIC16C62X 11.3 MPLAB C17 and MPLAB C18 C Compilers The MPLAB C17 and MPLAB C18 Code Development Systems are complete ANSI C compilers for Microchip's PIC17CXXX and PIC18CXXX family of microcontrollers. These compilers provide powerful integration capabilities, superior code optimization and ease of use not found with other compilers. For easy source level debugging, the compilers provide symbol information that is optimized to the MPLAB IDE debugger. 11.4 MPLINK Object Linker/ MPLIB Object Librarian The MPLINK object linker combines relocatable objects created by the MPASM assembler and the MPLAB C17 and MPLAB C18 C compilers. It can link relocatable objects from pre-compiled libraries, using directives from a linker script. The MPLIB object librarian manages the creation and modification of library files of pre-compiled code. When a routine from a library is called from a source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The object linker/library features include: * Efficient linking of single libraries instead of many smaller files * Enhanced code maintainability by grouping related modules together * Flexible creation of libraries with easy module listing, replacement, deletion and extraction 11.5 MPLAB C30 C Compiler The MPLAB C30 C compiler is a full-featured, ANSI compliant, optimizing compiler that translates standard ANSI C programs into dsPIC30F assembly language source. The compiler also supports many commandline options and language extensions to take full advantage of the dsPIC30F device hardware capabilities, and afford fine control of the compiler code generator. MPLAB C30 is distributed with a complete ANSI C standard library. All library functions have been validated and conform to the ANSI C library standard. The library includes functions for string manipulation, dynamic memory allocation, data conversion, timekeeping, and math functions (trigonometric, exponential and hyperbolic). The compiler provides symbolic information for high level source debugging with the MPLAB IDE. DS30235J-page 76 11.6 MPLAB ASM30 Assembler, Linker, and Librarian MPLAB ASM30 assembler produces relocatable machine code from symbolic assembly language for dsPIC30F devices. MPLAB C30 compiler uses the assembler to produce it's object file. The assembler generates relocatable object files that can then be archived or linked with other relocatable object files and archives to create an executable file. Notable features of the assembler include: * * * * * * Support for the entire dsPIC30F instruction set Support for fixed-point and floating-point data Command line interface Rich directive set Flexible macro language MPLAB IDE compatibility 11.7 MPLAB SIM Software Simulator The MPLAB SIM software simulator allows code development in a PC hosted environment by simulating the PICmicro series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any pin. The execution can be performed in Single-Step, Execute Until Break, or Trace mode. The MPLAB SIM simulator fully supports symbolic debugging using the MPLAB C17 and MPLAB C18 C Compilers, as well as the MPASM assembler. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent, economical software development tool. 11.8 MPLAB SIM30 Software Simulator The MPLAB SIM30 software simulator allows code development in a PC hosted environment by simulating the dsPIC30F series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user defined key press, to any of the pins. The MPLAB SIM30 simulator fully supports symbolic debugging using the MPLAB C30 C Compiler and MPLAB ASM30 assembler. The simulator runs in either a Command Line mode for automated tasks, or from MPLAB IDE. This high speed simulator is designed to debug, analyze and optimize time intensive DSP routines. 2003 Microchip Technology Inc. PIC16C62X 11.9 MPLAB ICE 2000 High Performance Universal In-Circuit Emulator The MPLAB ICE 2000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PICmicro microcontrollers. Software control of the MPLAB ICE 2000 in-circuit emulator is advanced by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICE 2000 is a full-featured emulator system with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of different processors. The universal architecture of the MPLAB ICE in-circuit emulator allows expansion to support new PICmicro microcontrollers. The MPLAB ICE 2000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft(R) Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 11.10 MPLAB ICE 4000 High Performance Universal In-Circuit Emulator The MPLAB ICE 4000 universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for highend PICmicro microcontrollers. Software control of the MPLAB ICE in-circuit emulator is provided by the MPLAB Integrated Development Environment, which allows editing, building, downloading and source debugging from a single environment. The MPLAB ICD 4000 is a premium emulator system, providing the features of MPLAB ICE 2000, but with increased emulation memory and high speed performance for dsPIC30F and PIC18XXXX devices. Its advanced emulator features include complex triggering and timing, up to 2 Mb of emulation memory, and the ability to view variables in real-time. 11.11 MPLAB ICD 2 In-Circuit Debugger Microchip's In-Circuit Debugger, MPLAB ICD 2, is a powerful, low cost, run-time development tool, connecting to the host PC via an RS-232 or high speed USB interface. This tool is based on the FLASH PICmicro MCUs and can be used to develop for these and other PICmicro microcontrollers. The MPLAB ICD 2 utilizes the in-circuit debugging capability built into the FLASH devices. This feature, along with Microchip's In-Circuit Serial ProgrammingTM (ICSPTM) protocol, offers cost effective in-circuit FLASH debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by setting breakpoints, single-stepping and watching variables, CPU status and peripheral registers. Running at full speed enables testing hardware and applications in real-time. MPLAB ICD 2 also serves as a development programmer for selected PICmicro devices. 11.12 PRO MATE II Universal Device Programmer The PRO MATE II is a universal, CE compliant device programmer with programmable voltage verification at VDDMIN and VDDMAX for maximum reliability. It features an LCD display for instructions and error messages and a modular detachable socket assembly to support various package types. In Stand-Alone mode, the PRO MATE II device programmer can read, verify, and program PICmicro devices without a PC connection. It can also set code protection in this mode. 11.13 PICSTART Plus Development Programmer The PICSTART Plus development programmer is an easy-to-use, low cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus development programmer supports most PICmicro devices up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus development programmer is CE compliant. The MPLAB ICE 4000 in-circuit emulator system has been designed as a real-time emulation system with advanced features that are typically found on more expensive development tools. The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. 2003 Microchip Technology Inc. DS30235J-page 77 PIC16C62X 11.14 PICDEM 1 PICmicro Demonstration Board 11.17 PICDEM 3 PIC16C92X Demonstration Board The PICDEM 1 demonstration board demonstrates the capabilities of the PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The sample microcontrollers provided with the PICDEM 1 demonstration board can be programmed with a PRO MATE II device programmer, or a PICSTART Plus development programmer. The PICDEM 1 demonstration board can be connected to the MPLAB ICE in-circuit emulator for testing. A prototype area extends the circuitry for additional application components. Features include an RS-232 interface, a potentiometer for simulated analog input, push button switches and eight LEDs. The PICDEM 3 demonstration board supports the PIC16C923 and PIC16C924 in the PLCC package. All the necessary hardware and software is included to run the demonstration programs. 11.15 PICDEM.net Internet/Ethernet Demonstration Board The PICDEM.net demonstration board is an Internet/ Ethernet demonstration board using the PIC18F452 microcontroller and TCP/IP firmware. The board supports any 40-pin DIP device that conforms to the standard pinout used by the PIC16F877 or PIC18C452. This kit features a user friendly TCP/IP stack, web server with HTML, a 24L256 Serial EEPROM for Xmodem download to web pages into Serial EEPROM, ICSP/MPLAB ICD 2 interface connector, an Ethernet interface, RS-232 interface, and a 16 x 2 LCD display. Also included is the book and CD-ROM "TCP/IP Lean, Web Servers for Embedded Systems," by Jeremy Bentham 11.16 PICDEM 2 Plus Demonstration Board The PICDEM 2 Plus demonstration board supports many 18-, 28-, and 40-pin microcontrollers, including PIC16F87X and PIC18FXX2 devices. All the necessary hardware and software is included to run the demonstration programs. The sample microcontrollers provided with the PICDEM 2 demonstration board can be programmed with a PRO MATE II device programmer, PICSTART Plus development programmer, or MPLAB ICD 2 with a Universal Programmer Adapter. The MPLAB ICD 2 and MPLAB ICE in-circuit emulators may also be used with the PICDEM 2 demonstration board to test firmware. A prototype area extends the circuitry for additional application components. Some of the features include an RS-232 interface, a 2 x 16 LCD display, a piezo speaker, an on-board temperature sensor, four LEDs, and sample PIC18F452 and PIC16F877 FLASH microcontrollers. DS30235J-page 78 11.18 PICDEM 4 8/14/18-Pin Demonstration Board The PICDEM 4 can be used to demonstrate the capabilities of the 8-, 14-, and 18-pin PIC16XXXX and PIC18XXXX MCUs, including the PIC16F818/819, PIC16F87/88, PIC16F62XA and the PIC18F1320 family of microcontrollers. PICDEM 4 is intended to showcase the many features of these low pin count parts, including LIN and Motor Control using ECCP. Special provisions are made for low power operation with the supercapacitor circuit, and jumpers allow onboard hardware to be disabled to eliminate current draw in this mode. Included on the demo board are provisions for Crystal, RC or Canned Oscillator modes, a five volt regulator for use with a nine volt wall adapter or battery, DB-9 RS-232 interface, ICD connector for programming via ICSP and development with MPLAB ICD 2, 2x16 liquid crystal display, PCB footprints for HBridge motor driver, LIN transceiver and EEPROM. Also included are: header for expansion, eight LEDs, four potentiometers, three push buttons and a prototyping area. Included with the kit is a PIC16F627A and a PIC18F1320. Tutorial firmware is included along with the User's Guide. 11.19 PICDEM 17 Demonstration Board The PICDEM 17 demonstration board is an evaluation board that demonstrates the capabilities of several Microchip microcontrollers, including PIC17C752, PIC17C756A, PIC17C762 and PIC17C766. A programmed sample is included. The PRO MATE II device programmer, or the PICSTART Plus development programmer, can be used to reprogram the device for user tailored application development. The PICDEM 17 demonstration board supports program download and execution from external on-board FLASH memory. A generous prototype area is available for user hardware expansion. 2003 Microchip Technology Inc. PIC16C62X 11.20 PICDEM 18R PIC18C601/801 Demonstration Board 11.23 PICDEM USB PIC16C7X5 Demonstration Board The PICDEM 18R demonstration board serves to assist development of the PIC18C601/801 family of Microchip microcontrollers. It provides hardware implementation of both 8-bit Multiplexed/De-multiplexed and 16-bit Memory modes. The board includes 2 Mb external FLASH memory and 128 Kb SRAM memory, as well as serial EEPROM, allowing access to the wide range of memory types supported by the PIC18C601/801. The PICDEM USB Demonstration Board shows off the capabilities of the PIC16C745 and PIC16C765 USB microcontrollers. This board provides the basis for future USB products. 11.21 PICDEM LIN PIC16C43X Demonstration Board The powerful LIN hardware and software kit includes a series of boards and three PICmicro microcontrollers. The small footprint PIC16C432 and PIC16C433 are used as slaves in the LIN communication and feature on-board LIN transceivers. A PIC16F874 FLASH microcontroller serves as the master. All three microcontrollers are programmed with firmware to provide LIN bus communication. 11.22 PICkitTM 1 FLASH Starter Kit A complete "development system in a box", the PICkit FLASH Starter Kit includes a convenient multi-section board for programming, evaluation, and development of 8/14-pin FLASH PIC(R) microcontrollers. Powered via USB, the board operates under a simple Windows GUI. The PICkit 1 Starter Kit includes the user's guide (on CD ROM), PICkit 1 tutorial software and code for various applications. Also included are MPLAB(R) IDE (Integrated Development Environment) software, software and hardware "Tips 'n Tricks for 8-pin FLASH PIC(R) Microcontrollers" Handbook and a USB Interface Cable. Supports all current 8/14-pin FLASH PIC microcontrollers, as well as many future planned devices. 2003 Microchip Technology Inc. 11.24 Evaluation and Programming Tools In addition to the PICDEM series of circuits, Microchip has a line of evaluation kits and demonstration software for these products. * KEELOQ evaluation and programming tools for Microchip's HCS Secure Data Products * CAN developers kit for automotive network applications * Analog design boards and filter design software * PowerSmart battery charging evaluation/ calibration kits * IrDA(R) development kit * microID development and rfLabTM development software * SEEVAL(R) designer kit for memory evaluation and endurance calculations * PICDEM MSC demo boards for Switching mode power supply, high power IR driver, delta sigma ADC, and flow rate sensor Check the Microchip web page and the latest Product Line Card for the complete list of demonstration and evaluation kits. DS30235J-page 79 PIC16C62X NOTES: DS30235J-page 80 2003 Microchip Technology Inc. PIC16C62X 12.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Ambient Temperature under bias .............................................................................................................. -40 to +125C Storage Temperature ................................................................................................................................ -65 to +150C Voltage on any pin with respect to VSS (except VDD and MCLR) .......................................................-0.6V to VDD +0.6V Voltage on VDD with respect to VSS ................................................................................................................ 0 to +7.5V Voltage on MCLR with respect to VSS (Note 2) .................................................................................................0 to +14V Voltage on RA4 with respect to VSS ...........................................................................................................................8.5V Total power Dissipation (Note 1)...............................................................................................................................1.0W Maximum Current out of VSS pin ..........................................................................................................................300 mA Maximum Current into VDD pin .............................................................................................................................250 mA Input Clamp Current, IIK (VI <0 or VI> VDD) ...................................................................................................................... 20 mA Output Clamp Current, IOK (VO <0 or VO>VDD)................................................................................................................ 20 mA Maximum Output Current sunk by any I/O pin ........................................................................................................25 mA Maximum Output Current sourced by any I/O pin...................................................................................................25 mA Maximum Current sunk by PORTA and PORTB...................................................................................................200 mA Maximum Current sourced by PORTA and PORTB..............................................................................................200 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL). 2: Voltage spikes below VSS at the MCLR pin, inducing currents greater than 80 mA, may cause latchup. Thus, a series resistor of 50-100 should be used when applying a "low" level to the MCLR pin rather than pulling this pin directly to VSS. NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2003 Microchip Technology Inc. DS30235J-page 81 PIC16C62X PIC16C62X VOLTAGE-FREQUENCY GRAPH, -40C TA +125C FIGURE 12-1: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. PIC16LC62X VOLTAGE-FREQUENCY GRAPH, -40C TA +125C FIGURE 12-2: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. DS30235J-page 82 2003 Microchip Technology Inc. PIC16C62X PIC16C62XA VOLTAGE-FREQUENCY GRAPH, 0C TA +70C FIGURE 12-3: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. FIGURE 12-4: PIC16C62XA VOLTAGE-FREQUENCY GRAPH, -40C TA 0C, +70C TA +125C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. 2003 Microchip Technology Inc. DS30235J-page 83 PIC16C62X FIGURE 12-5: PIC16LC620A/LC621A/LC622A VOLTAGE-FREQUENCY GRAPH, -40C TA 0C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.7 2.5 2.0 0 4 10 Frequency (MHz) 20 25 Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. FIGURE 12-6: PIC16LC620A/LC621A/LC622A VOLTAGE-FREQUENCY GRAPH, 0C TA +125C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. DS30235J-page 84 2003 Microchip Technology Inc. PIC16C62X PIC16CR62XA VOLTAGE-FREQUENCY GRAPH, 0C TA +70C FIGURE 12-7: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. PIC16CR62XA VOLTAGE-FREQUENCY GRAPH, -40C TA 0C, +70C TA +125C FIGURE 12-8: 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. 2003 Microchip Technology Inc. DS30235J-page 85 PIC16C62X PIC16LCR62XA VOLTAGE-FREQUENCY GRAPH, -40C TA +125C FIGURE 12-9: 6.0 5.5 5.0 VDD (VOLTS) 4.5 4.0 3.5 3.0 2.5 2.0 0 4 10 20 25 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. DS30235J-page 86 2003 Microchip Technology Inc. PIC16C62X FIGURE 12-10: PIC16C620A/C621A/C622A/CR620A - 40 VOLTAGE-FREQUENCY GRAPH, 0C TA +70C 6.0 5.5 5.0 VDD (Volts) 4.5 4.0 3.5 3.0 2.5 0 4 10 20 25 40 Frequency (MHz) Note 1: The shaded region indicates the permissible combinations of voltage and frequency. 2: The maximum rated speed of the part limits the permissible combinations of voltage and frequency. Please reference the Product Identification System section for the maximum rated speed of the parts. 3: Operation between 20 to 40 MHz requires the following: * VDD between 4.5V. and 5.5V * OSC1 externally driven * OSC2 not connected * HS mode * Commercial temperatures Devices qualified for 40 MHz operation have -40 designation (ex: PIC16C620A-40/P). 2003 Microchip Technology Inc. DS30235J-page 87 PIC16C62X 12.1 DC Characteristics: PIC16C62X-04 (Commercial, Industrial, Extended) PIC16C62X-20 (Commercial, Industrial, Extended) PIC16LC62X-04 (Commercial, Industrial, Extended) PIC16C62X Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended PIC16LC62X Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Operating voltage VDD range is the PIC16C62X range. Param. Sym No. Characteristic D001 VDD Supply Voltage D001 VDD Supply Voltage VDR D002 Min Typ Max Units Conditions 3.0 -- 6.0 V See Figures 12-1, 12-2, 12-3, 12-4, and 12-5 2.5 -- 6.0 V See Figures 12-1, 12-2, 12-3, 12-4, and 12-5 (1) -- 1.5* -- V Device in SLEEP mode (1) RAM Data Retention Voltage D002 VDR RAM Data Retention Voltage -- 1.5* -- V Device in SLEEP mode D003 VPOR VDD start voltage to ensure Power-on Reset -- Vss -- V See section on Power-on Reset for details D003 VPOR VDD start voltage to ensure Power-on Reset -- VSS -- V See section on Power-on Reset for details D004 SVDD VDD rise rate to ensure Power-on Reset 0.05* -- -- V/ms See section on Power-on Reset for details D004 SVDD VDD rise rate to ensure Power-on Reset 0.05* -- -- V/ms See section on Power-on Reset for details D005 VBOR Brown-out Detect Voltage 3.7 4.0 4.3 V D005 VBOR Brown-out Detect Voltage 3.7 4.0 4.3 V D010 IDD -- 1.8 3.3 mA -- 35 70 A -- 9.0 20 mA -- 1.4 2.5 mA -- 26 53 A IDD D010 Supply Current (2) Supply Current(2) BOREN configuration bit is cleared BOREN configuration bit is cleared FOSC = 4 MHz, VDD = 5.5V, WDT disabled, XT mode, (Note 4)* FOSC = 32 kHz, VDD = 4.0V, WDT disabled, LP mode FOSC = 20 MHz, VDD = 5.5V, WDT disabled, HS mode FOSC = 2.0 MHz, VDD = 3.0V, WDT disabled, XT mode, (Note 4) FOSC = 32 kHz, VDD = 3.0V, WDT disabled, LP mode D020 IPD Power-down Current(3) -- 1.0 2.5 15 A A VDD=4.0V, WDT disabled (125C) D020 IPD Power-down Current(3) -- 0.7 2 A VDD=3.0V, WDT disabled * Note 1: 2: 3: 4: 5: These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula: Ir = VDD/2REXT (mA) with REXT in k. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. DS30235J-page 88 2003 Microchip Technology Inc. PIC16C62X 12.1 DC Characteristics: PIC16C62X-04 (Commercial, Industrial, Extended) PIC16C62X-20 (Commercial, Industrial, Extended) PIC16LC62X-04 (Commercial, Industrial, Extended) (CONT.) PIC16C62X Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended PIC16LC62X Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Operating voltage VDD range is the PIC16C62X range. Param . No. Sym Characteristic Min Typ Max Units D022 IWDT WDT Current(5) -- 6.0 D022A D023 IBOR ICOM Brown-out Reset Current(5) Comparator Current for each Comparator(5) VREF Current(5) -- -- 350 P D023A IVREF D022 D022A D023 IWDT IBOR ICOM P D023A WDT Current(5) Brown-out Reset Current(5) Comparator Current for each Comparator(5) VREF Current(5) Conditions -- 20 25 425 100 A A A A VDD=4.0V (125C) BOD enabled, VDD = 5.0V VDD = 4.0V -- -- 300 A VDD = 4.0V -- -- -- 6.0 350 -- 15 425 100 A A A VDD=3.0V BOD enabled, VDD = 5.0V VDD = 3.0V -- -- 300 A VDD = 3.0V IVREF 1A FOSC LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 -- -- -- -- 200 4 4 20 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures 1A FOSC LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 -- -- -- -- 200 4 4 20 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures * Note 1: 2: 3: 4: 5: These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula: Ir = VDD/2REXT (mA) with REXT in k. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 2003 Microchip Technology Inc. DS30235J-page 89 PIC16C62X 12.2 DC Characteristics: PIC16C62XA-04 (Commercial, Industrial, Extended) PIC16C62XA-20 (Commercial, Industrial, Extended) PIC16LC62XA-04 (Commercial, Industrial, Extended) PIC16C62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended PIC16LC62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Param. Sym No. Characteristic Min Typ Max Units Conditions D001 VDD Supply Voltage 3.0 -- 5.5 V See Figures 12-1, 12-2, 12-3, 12-4, and 12-5 D001 VDD Supply Voltage 2.5 -- 5.5 V See Figures 12-1, 12-2, 12-3, 12-4, and 12-5 D002 VDR RAM Data Retention Voltage(1) -- 1.5* -- V Device in SLEEP mode D002 VDR RAM Data Retention Voltage(1) -- 1.5* -- V Device in SLEEP mode D003 VPOR VDD start voltage to ensure Power-on Reset -- VSS -- V See section on Power-on Reset for details D003 VPOR VDD start voltage to ensure Power-on Reset -- VSS -- V See section on Power-on Reset for details D004 SVDD VDD rise rate to ensure Power-on Reset 0.05* -- -- V/ms See section on Power-on Reset for details D004 SVDD VDD rise rate to ensure Power-on Reset 0.05* -- -- V/ms See section on Power-on Reset for details D005 VBOR Brown-out Detect Voltage 3.7 4.0 4.35 V BOREN configuration bit is cleared D005 VBOR Brown-out Detect Voltage 3.7 4.0 4.35 V BOREN configuration bit is cleared * Note 1: 2: 3: 4: 5: 6: These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula: Ir = VDD/2REXT (mA) with REXT in k. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. Commercial temperature range only. DS30235J-page 90 2003 Microchip Technology Inc. PIC16C62X 12.2 DC Characteristics: PIC16C62XA-04 (Commercial, Industrial, Extended) PIC16C62XA-20 (Commercial, Industrial, Extended) PIC16LC62XA-04 (Commercial, Industrial, Extended) (CONT.) PIC16C62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended PIC16LC62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Param. No. Sym IDD D010 IDD D010 Characteristic Supply Current(2, 4) Supply Current(2) Min Typ Max Units -- 1.2 2.0 mA -- 0.4 1.2 mA -- 1.0 2.0 mA -- 4.0 6.0 mA -- 4.0 7.0 mA -- 35 70 A -- 1.2 2.0 mA -- -- 1.1 mA -- 35 70 A Conditions FOSC = 4 MHz, VDD = 5.5V, WDT disabled, XT mode, (Note 4)* FOSC = 4 MHz, VDD = 3.0V, WDT disabled, XT mode, (Note 4)* FOSC = 10 MHz, VDD = 3.0V, WDT disabled, HS mode, (Note 6) FOSC = 20 MHz, VDD = 4.5V, WDT disabled, HS mode FOSC = 20 MHz, VDD = 5.5V, WDT disabled*, HS mode FOSC = 32 kHz, VDD = 3.0V, WDT disabled, LP mode FOSC = 4 MHz, VDD = 5.5V, WDT disabled, XT mode, (Note 4)* FOSC = 4 MHz, VDD = 2.5V, WDT disabled, XT mode, (Note 4) FOSC = 32 kHz, VDD = 2.5V, WDT disabled, LP mode D020 IPD Power-down Current(3) -- -- -- -- -- -- -- -- 2.2 5.0 9.0 15 A A A A VDD = 3.0V VDD = 4.5V* VDD = 5.5V VDD = 5.5V Extended Temp. D020 IPD Power-down Current(3) -- -- -- -- -- -- -- -- 2.0 2.2 9.0 15 A A A A VDD = 2.5V VDD = 3.0V* VDD = 5.5V VDD = 5.5V Extended Temp. * Note 1: 2: 3: 4: 5: 6: These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula: Ir = VDD/2REXT (mA) with REXT in k. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. Commercial temperature range only. 2003 Microchip Technology Inc. DS30235J-page 91 PIC16C62X 12.2 DC Characteristics: PIC16C62XA-04 (Commercial, Industrial, Extended) PIC16C62XA-20 (Commercial, Industrial, Extended) PIC16LC62XA-04 (Commercial, Industrial, Extended (CONT.) PIC16C62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended PIC16LC62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Param. No. Sym Characteristic Min Typ Max Units D022 IWDT WDT Current(5) -- 6.0 D022A D023 IBOR ICOMP -- -- D023A IVREF Brown-out Reset Current(5) Comparator Current for each Comparator(5) VREF Current(5) (5) Conditions 75 30 10 12 125 60 A A A A VDD = 4.0V (125C) BOD enabled, VDD = 5.0V VDD = 4.0V -- 80 135 A VDD = 4.0V A A A A VDD=4.0V (125C) BOD enabled, VDD = 5.0V VDD = 4.0V VDD = 4.0V D022 IWDT WDT Current -- 6.0 D022A D023 IBOR ICOMP Brown-out Reset Current(5) Comparator Current for each Comparator(5) VREF Current(5) -- -- 75 30 10 12 125 60 D023A IVREF -- 80 135 A 1A FOSC LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 -- -- -- -- 200 4 4 20 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures 1A FOSC LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 -- -- -- -- 200 4 4 20 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures * Note 1: 2: 3: 4: 5: 6: These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula: Ir = VDD/2REXT (mA) with REXT in k. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. Commercial temperature range only. DS30235J-page 92 2003 Microchip Technology Inc. PIC16C62X 12.3 DC CHARACTERISTICS: PIC16CR62XA-04 (Commercial, Industrial, Extended) PIC16CR62XA-20 (Commercial, Industrial, Extended) PIC16LCR62XA-04 (Commercial, Industrial, Extended) PIC16CR62XA-04 PIC16CR62XA-20 PIC16LCR62XA-04 Param. Sym No. Characteristic Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Min Typ Max Units Conditions D001 VDD Supply Voltage 3.0 -- 5.5 V See Figures 12-7, 12-8, 12-9 D001 D002 VDD VDR Supply Voltage 2.5 -- 5.5 V See Figures 12-7, 12-8, 12-9 RAM Data Retention Voltage(1) -- 1.5* -- V Device in SLEEP mode D002 VDR RAM Data Retention -- 1.5* -- V Device in SLEEP mode Voltage(1) D003 VPOR VDD start voltage to ensure Power-on Reset -- VSS -- V See section on Power-on Reset for details D003 VPOR -- VSS -- V See section on Power-on Reset for details D004 SVDD 0.05* -- -- V/ms See section on Power-on Reset for details D004 SVDD VDD start voltage to ensure Power-on Reset VDD rise rate to ensure Power-on Reset VDD rise rate to ensure Power-on Reset 0.05* -- -- V/ms See section on Power-on Reset for details D005 VBOR Brown-out Detect Voltage 3.7 4.0 4.35 V BOREN configuration bit is cleared D005 VBOR Brown-out Detect Voltage 3.7 4.0 4.35 V BOREN configuration bit is cleared D010 IDD Supply Current(2) -- 1.2 1.7 mA -- 500 900 A -- 1.0 2.0 mA -- -- -- 4.0 3.0 35 7.0 6.0 70 mA mA A -- 1.2 1.7 mA -- 400 800 A -- 35 70 A D010 IDD Supply Current(2) 2003 Microchip Technology Inc. FOSC = 4 MHz, VDD = 5.5V, WDT disabled, XT mode, (Note 4)* FOSC = 4 MHz, VDD = 3.0V, WDT disabled, XT mode, (Note 4) FOSC = 10 MHz, VDD = 3.0V, WDT disabled, HS mode, (Note 6) FOSC = 20 MHz, VDD = 5.5V, WDT disabled*, HS mode FOSC = 20 MHz, VDD = 4.5V, WDT disabled, HS mode FOSC = 32 kHz, VDD = 3.0V, WDT disabled, LP mode FOSC = 4.0 MHz, VDD = 5.5V, WDT disabled, XT mode, (Note 4)* FOSC = 4.0 MHz, VDD = 2.5V, WDT disabled, XT mode (Note 4) FOSC = 32 kHz, VDD = 2.5V, WDT disabled, LP mode DS30235J-page 93 PIC16C62X PIC16CR62XA-04 PIC16CR62XA-20 PIC16LCR62XA-04 Param. Sym No. * Note 1: 2: 3: 4: 5: 6: Characteristic Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Min Typ Max Units Conditions These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula: Ir = VDD/2REXT (mA) with REXT in k. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. Commercial temperature range only. DS30235J-page 94 2003 Microchip Technology Inc. PIC16C62X 12.3 DC CHARACTERISTICS: PIC16CR62XA-04 (Commercial, Industrial, Extended) PIC16CR62XA-20 (Commercial, Industrial, Extended) PIC16LCR62XA-04 (Commercial, Industrial, Extended) (CONT.) PIC16CR62XA-04 PIC16CR62XA-20 PIC16LCR62XA-04 Param. No. Sym Characteristic D020 IPD Power-down Current(3) D020 IPD Power-down Current(3) D022 IWDT WDT Current(5) D022A D023 IBOR ICOMP D023A D022 IVREF IWDT D022A D023 IBOR ICOMP D023A 1A IVREF FOSC 1A FOSC * Note 1: 2: 3: 4: 5: 6: Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Min Typ Max Units Conditions VDD = 3.0V VDD = 4.5V* VDD = 5.5V VDD = 5.5V Extended Temp. -- -- -- -- -- -- -- -- -- 200 0.400 0.600 5.0 200 200 0.600 5.0 6.0 Brown-out Reset Current(5) Comparator Current for each Comparator(5) VREF Current(5) WDT Current(5) -- -- 75 30 950 1.8 2.2 9.0 850 950 2.2 9.0 10 12 125 60 -- 80 -- 6.0 Brown-out Reset Current(5) Comparator Current for each Comparator(5) VREF Current(5) -- -- 75 30 -- 80 135 A LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 -- -- -- -- 200 4 4 20 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 -- -- -- -- 200 4 4 20 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures nA A A A nA nA A A A A A A VDD = 2.5V VDD = 3.0V* VDD = 5.5V VDD = 5.5V Extended VDD=4.0V (125C) BOD enabled, VDD = 5.0V VDD = 4.0V 135 A VDD = 4.0V 10 12 125 60 A A A A VDD=4.0V (125C) BOD enabled, VDD = 5.0V VDD = 4.0V VDD = 4.0V These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. This is the limit to which VDD can be lowered without losing RAM data. The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. For RC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula: Ir = VDD/2REXT (mA) with REXT in k. The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. Commercial temperature range only. 2003 Microchip Technology Inc. DS30235J-page 95 PIC16C62X 12.4 DC Characteristics: PIC16C62X/C62XA/CR62XA (Commercial, Industrial, Extended) PIC16LC62X/LC62XA/LCR62XA (Commercial, Industrial, Extended) PIC16C62X/C62XA/CR62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended PIC16LC62X/LC62XA/LCR62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Param. No. Sym VIL Characteristic Min Typ Max Units Conditions Input Low Voltage I/O ports D030 with TTL buffer VSS -- 0.8V 0.15 VDD V D031 with Schmitt Trigger input VSS -- 0.2 VDD V D032 MCLR, RA4/T0CKI,OSC1 (in RC mode) Vss -- 0.2 VDD V D033 OSC1 (in XT and HS) Vss -- 0.3 VDD V OSC1 (in LP) Vss -- 0.6 VDD1.0 V with TTL buffer VSS -- 0.8V 0.15 VDD V with Schmitt Trigger input VIL VDD = 4.5V to 5.5V otherwise (Note 1) Input Low Voltage I/O ports D030 VSS -- 0.2 VDD V D032 MCLR, RA4/T0CKI,OSC1 (in RC mode) Vss -- 0.2 VDD V D033 OSC1 (in XT and HS) Vss -- 0.3 VDD V OSC1 (in LP) Vss -- 0.6 VDD1.0 V V D031 VIH VDD = 4.5V to 5.5V otherwise (Note 1) Input High Voltage I/O ports D040 with TTL buffer 2.0V 0.25 VDD + 0.8V -- VDD VDD D041 with Schmitt Trigger input 0.8 VDD -- VDD VDD D042 MCLR RA4/T0CKI 0.8 VDD -- D043 D043A OSC1 (XT, HS and LP) OSC1 (in RC mode) 0.7 VDD 0.9 VDD -- * VDD VDD = 4.5V to 5.5V otherwise V V (Note 1) These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1 pin is a Schmitt Trigger input. It is not recommended that the PIC16C62X(A) be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as coming out of the pin. DS30235J-page 96 2003 Microchip Technology Inc. PIC16C62X 12.4 DC Characteristics: PIC16C62X/C62XA/CR62XA (Commercial, Industrial, Extended) PIC16LC62X/LC62XA/LCR62XA (Commercial, Industrial, Extended) (CONT.) PIC16C62X/C62XA/CR62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended PIC16LC62X/LC62XA/LCR62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Param. Sym No. VIH Characteristic Min Typ Max Units Conditions Input High Voltage I/O ports D040 with TTL buffer 2.0V 0.25 VDD + 0.8V -- D041 with Schmitt Trigger input 0.8 VDD -- VDD VDD D042 MCLR RA4/T0CKI 0.8 VDD -- D043 D043A OSC1 (XT, HS and LP) OSC1 (in RC mode) 0.7 VDD 0.9 VDD -- 50 200 D070 IPURB PORTB weak pull-up current D070 IPURB PORTB weak pull-up current IIL Input Leakage Current(2, 3) I/O ports (Except PORTA) 50 VDD V VDD = 4.5V to 5.5V otherwise V V (Note 1) A VDD = 5.0V, VPIN = VSS 400 A VDD = 5.0V, VPIN = VSS 1.0 A VSS VPIN VDD, pin at hi-impedance -- 0.5 A Vss VPIN VDD, pin at hi-impedance 1.0 200 D060 PORTA D061 RA4/T0CKI -- -- D063 OSC1, MCLR -- -- IIL -- VDD VDD 400 5.0 A Vss VPIN VDD A Vss VPIN VDD, XT, HS and LP osc configuration Current(2, 3) Input Leakage I/O ports (Except PORTA) 1.0 A VSS VPIN VDD, pin at hi-impedance D060 PORTA -- -- 0.5 A Vss VPIN VDD, pin at hi-impedance D061 RA4/T0CKI -- -- 1.0 A Vss VPIN VDD D063 OSC1, MCLR -- -- 5.0 A Vss VPIN VDD, XT, HS and LP osc configuration -- -- 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40 to +85C -- -- 0.6 V IOL = 7.0 mA, VDD = 4.5V, +125C -- -- 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40 to +85C -- -- 0.6 V IOL = 1.2 mA, VDD = 4.5V, +125C VOL Output Low Voltage D080 I/O ports D083 OSC2/CLKOUT (RC only) * These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1 pin is a Schmitt Trigger input. It is not recommended that the PIC16C62X(A) be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as coming out of the pin. 2003 Microchip Technology Inc. DS30235J-page 97 PIC16C62X 12.4 DC Characteristics: PIC16C62X/C62XA/CR62XA (Commercial, Industrial, Extended) PIC16LC62X/LC62XA/LCR62XA (Commercial, Industrial, Extended) (CONT.) PIC16C62X/C62XA/CR62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended PIC16LC62X/LC62XA/LCR62XA Standard Operating Conditions (unless otherwise stated) Operating temperature -40C TA +85C for industrial and 0C TA +70C for commercial and -40C TA +125C for extended Param. Sym No. VOL Characteristic I/O ports D083 OSC2/CLKOUT (RC only) D090 Output High Voltage OSC2/CLKOUT (RC only) VOH Conditions Output High Voltage -- -- 0.6 V IOL = 8.5 mA, VDD = 4.5V, -40 to +85C -- -- 0.6 V IOL = 7.0 mA, VDD = 4.5V, +125C -- -- 0.6 V IOL = 1.6 mA, VDD = 4.5V, -40 to +85C -- -- 0.6 V IOL = 1.2 mA, VDD = 4.5V, +125C VDD-0.7 -- -- V IOH = -3.0 mA, VDD = 4.5V, -40 to +85C VDD-0.7 -- -- V IOH = -2.5 mA, VDD = 4.5V, +125C VDD-0.7 -- -- V IOH = -1.3 mA, VDD = 4.5V, -40 to +85C VDD-0.7 -- -- V IOH = -1.0 mA, VDD = 4.5V, +125C VDD-0.7 -- -- V IOH = -3.0 mA, VDD = 4.5V, -40 to +85C VDD-0.7 -- -- V IOH = -2.5 mA, VDD = 4.5V, +125C VDD-0.7 -- -- V IOH = -1.3 mA, VDD = 4.5V, -40 to +85C VDD-0.7 -- -- V IOH = -1.0 mA, VDD = 4.5V, +125C RA4 pin PIC16C62X, PIC16LC62X RA4 pin PIC16C62XA, PIC16LC62XA, PIC16CR62XA, PIC16LCR62XA (3) I/O ports (Except RA4) D092 Typ Max Units Output Low Voltage D080 VOH Min (3) D090 I/O ports (Except RA4) D092 OSC2/CLKOUT (RC only) *D150 VOD Open-Drain High Voltage 10* 8.5* V *D150 VOD Open-Drain High Voltage 10* 8.5* V RA4 pin PIC16C62X, PIC16LC62X RA4 pin PIC16C62XA, PIC16LC62XA, PIC16CR62XA, PIC16LCR62XA pF In XT, HS and LP modes when external clock used to drive OSC1. Capacitive Loading Specs on Output Pins D100 COSC 2 OSC2 pin D101 CIO All I/O pins/OSC2 (in RC mode) 15 50 pF Capacitive Loading Specs on Output Pins D100 COSC 2 OSC2 pin D101 CIO All I/O pins/OSC2 (in RC mode) * 15 50 pF In XT, HS and LP modes when external clock used to drive OSC1. pF These parameters are characterized but not tested. Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: In RC oscillator configuration, the OSC1 pin is a Schmitt Trigger input. It is not recommended that the PIC16C62X(A) be driven with external clock in RC mode. 2: The leakage current on the MCLR pin is strongly dependent on applied voltage level. The specified levels represent normal operating conditions. Higher leakage current may be measured at different input voltages. 3: Negative current is defined as coming out of the pin. DS30235J-page 98 2003 Microchip Technology Inc. PIC16C62X 12.5 DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(7) (Commercial) PIC16CR620A-40(7) (Commercial) Standard Operating Conditions (unless otherwise stated) DC CHARACTERISTICS Param No. Sym Operating temperature Characteristic Min Typ Max Units 0C TA +70C for commercial Conditions D001 D002 VDD VDR Supply Voltage RAM Data Retention Voltage(1) 3.0 -- -- 1.5* 5.5 -- V V FOSC = DC to 20 MHz Device in SLEEP mode D003 VPOR -- VSS -- V See section on Power-on Reset for details D004 SVDD VDD start voltage to ensure Power-on Reset VDD rise rate to ensure Power-on Reset 0.05 * -- -- D005 D010 VBOR IDD Brown-out Detect Voltage Supply Current(2,4) 3.65 -- 4.0 1.2 4.35 2.0 V mA -- 0.4 1.2 mA -- 1.0 2.0 mA -- 4.0 6.0 mA -- 4.0 7.0 mA -- 35 70 A V/ms See section on Power-on Reset for details BOREN configuration bit is cleared FOSC = 4 MHz, VDD = 5.5V, WDT disabled, XT OSC mode, (Note 4)* FOSC = 4 MHz, VDD = 3.0V, WDT disabled, XT OSC mode, (Note 4) FOSC = 10 MHz, VDD = 3.0V, WDT disabled, HS OSC mode, (Note 6) FOSC = 20 MHz, VDD = 4.5V, WDT disabled, HS OSC mode FOSC = 20 MHz, VDD = 5.5V, WDT disabled*, HS OSC mode FOSC = 32 kHz, VDD = 3.0V, WDT disabled, LP OSC mode D020 IPD Power Down Current(3) -- -- -- -- -- -- -- -- 2.2 5.0 9.0 15 A A A A VDD = 3.0V VDD = 4.5V* VDD = 5.5V VDD = 5.5V Extended D022 IWDT WDT Current(5) -- 6.0 Brown-out Reset Current(5) Comparator Current for each Comparator(5) VREF Current(5) -- -- 75 30 10 12 125 60 A A A A VDD = 4.0V (125C) BOD enabled, VDD = 5.0V VDD = 4.0V -- 80 135 A VDD = 4.0V IEE Write IEE Read IEE IEE Operating Current Operating Current Standby Current Standby Current -- -- -- -- 3 1 30 100 mA mA A A VCC = 5.5V, SCL = 400 kHz FOSC LP Oscillator Operating Frequency RC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency 0 0 0 0 200 4 4 20 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures D022A IBOR D023 ICOMP D023A IVREF 1A -- -- -- -- VCC = 3.0V, EE VDD = VCC VCC = 3.0V, EE VDD = VCC * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C, unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. 4: For RC OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/ 2REXT (mA) with REXT in k. 5: The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 6: Commercial temperature range only. 7: See Section 12.1 and Section 12.3 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified characteristics. 2003 Microchip Technology Inc. DS30235J-page 99 PIC16C62X 12.5 DC CHARACTERISTICS: PIC16C620A/C621A/C622A-40(7) (Commercial) PIC16CR620A-40(7) (Commercial) DC CHARACTERISTICS Param No. Sym VIL D030 D031 D032 D033 VIH D040 D041 D042 D043 D043A D070 IPURB IIL D060 D061 D063 VOL Characteristic Input Low Voltage I/O ports with TTL buffer with Schmitt Trigger input MCLR, RA4/T0CKI, OSC1 (in RC mode) OSC1 (in XT and HS) OSC1 (in LP) Input High Voltage I/O ports with TTL buffer with Schmitt Trigger input MCLR RA4/T0CKI OSC1 (XT, HS and LP) OSC1 (in RC mode) PORTB Weak Pull-up Current Input Leakage Current(2, 3) I/O ports (except PORTA) PORTA RA4/T0CKI OSC1, MCLR D080 Output Low Voltage I/O ports D083 OSC2/CLKOUT (RC only) D090 Output High Voltage(3) I/O ports (except RA4) D092 OSC2/CLKOUT (RC only) VOH *D150 VOD D100 COSC2 Open Drain High Voltage Capacitive Loading Specs on Output Pins OSC2 pin D101 CIO All I/O pins/OSC2 (in RC mode) Standard Operating Conditions (unless otherwise stated) Operating temperature 0C TA +70C for commercial Min Typ Max Unit VSS -- V VDD = 4.5V to 5.5V, otherwise VSS VSS -- 0.8V 0.15VDD 0.2VDD 0.2VDD V V (Note 1) VSS VSS -- -- 0.3VDD 0.6VDD - 1.0 V V VDD VDD VDD VDD VDD V 2.0V -- 0.25 VDD + 0.8 0.8 VDD 0.8 VDD -- 0.7 VDD -- 0.9 VDD 50 200 Conditions VDD = 4.5V to 5.5V, otherwise V V 400 (Note 1) A VDD = 5.0V, VPIN = VSS -- -- -- -- -- -- 1.0 0.5 1.0 5.0 A A A A VSS VPIN VDD, pin at hi-impedance Vss VPIN VDD, pin at hi-impedance Vss VPIN VDD Vss VPIN VDD, XT, HS and LP OSC configuration -- -- -- -- -- -- -- -- 0.6 0.6 0.6 0.6 V V V V IOL = 8.5 mA, VDD = 4.5V, IOL = 7.0 mA, VDD = 4.5V, IOL = 1.6 mA, VDD = 4.5V, IOL = 1.2 mA, VDD = 4.5V, VDD-0.7 VDD-0.7 VDD-0.7 VDD-0.7 -- -- -- -- -- -- -- -- 8.5 V V V V V IOH = -3.0 mA, VDD = 4.5V, IOH = -2.5 mA, VDD = 4.5V, IOH = -1.3 mA, VDD = 4.5V, IOH = -1.0 mA, VDD = 4.5V, RA4 pin 15 pF In XT, HS and LP modes when external clock used to drive OSC1. 50 pF -40 to +85C +125C -40 to +85C +125C -40 to +85C +125C -40 to +85C +125C * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C, unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption. The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD, MCLR = VDD; WDT enabled/disabled as specified. 3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. 4: For RC OSC configuration, current through REXT is not included. The current through the resistor can be estimated by the formula Ir = VDD/ 2REXT (mA) with REXT in k. 5: The current is the additional current consumed when this peripheral is enabled. This current should be added to the base IDD or IPD measurement. 6: Commercial temperature range only. 7: See Section 12.1 and Section 12.3 for 16C62X and 16CR62X devices for operation between 20 MHz and 40 MHz for valid modified characteristics. DS30235J-page 100 2003 Microchip Technology Inc. PIC16C62X 12.6 PIC16C620A/C621A/C622A-40(3) (Commercial) PIC16CR620A-40(3) (Commercial) DC Characteristics: Standard Operating Conditions (unless otherwise stated) DC CHARACTERISTICS Power Supply Pins Operating temperature 0C TA +70C for commercial Sym Min Typ(1) Max Units VDD 4.5 -- 5.5 V IDD -- -- 5.5 7.7 11.5 16 mA mA HS Oscillator Operating Frequency FOSC 20 -- 40 Input Low Voltage OSC1 VIL VSS -- 0.2VDD V HS mode, OSC1 externally driven Input High Voltage OSC1 VIH 0.8VDD -- VDD V HS mode, OSC1 externally driven Characteristic Supply Voltage Supply Current (2) Conditions HS Option from 20 - 40 MHz FOSC = 40 MHz, VDD = 4.5V, HS mode FOSC = 40 MHz, VDD = 5.5V, HS mode MHz OSC1 pin is externally driven, OSC2 pin not connected * These parameters are characterized but not tested. Note 1: Data in the Typical ("Typ") column is based on characterization results at 25C. This data is for design guidance only and is not tested. 2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in Active Operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT disabled, HS mode with OSC2 not connected. 3: For device operation between DC and 20 MHz. See Table 12-1 and Table 12-2. 12.7 PIC16C620A/C621A/C622A-40(2) (Commercial) PIC16CR620A-40(2) (Commercial) AC Characteristics: Standard Operating Conditions (unless otherwise stated) AC CHARACTERISTICS All Pins Except Power Supply Pins Characteristic Operating temperature Sym Min Typ(1) Max Units 0C TA +70C for commercial Conditions External CLKIN Frequency FOSC 20 -- 40 External CLKIN Period TOSC 25 -- 50 ns HS mode (40), OSC1 externally driven Clock in (OSC1) Low or High Time TOSL, TOSH 6 -- -- ns HS mode, OSC1 externally driven Clock in (OSC1) Rise or Fall Time TOSR, TOSF -- -- 6.5 ns HS mode, OSC1 externally driven OSC1 (Q1 cycle) to Port out valid TOSH2IOV -- -- 100 ns -- OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) TOSH2IOI 50 -- -- ns -- MHz HS mode, OSC1 externally driven Note 1: Data in the Typical ("Typ") column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. 2: For device operation between DC and 20 MHz. See Table 12-1 and Table 12-2. 2003 Microchip Technology Inc. DS30235J-page 101 PIC16C62X TABLE 12-1: COMPARATOR SPECIFICATIONS Operating Conditions: VDD range as described in Table 12-1, -40C<TA<+125C. Current consumption is specified in Table 12-1. Characteristics Sym Min Input offset voltage Input common mode voltage Typ Max Units 5.0 10 mV VDD - 1.5 V 0 CMRR +55* Response Time(1) Comments 150* Comparator mode change to output valid 400* 600* ns ns 10* s PIC16C62X(A) PIC16LC62X * These parameters are characterized but not tested. Note 1: Response time measured with one comparator input at (VDD - 1.5)/2, while the other input transitions from VSS to VDD. TABLE 12-2: VOLTAGE REFERENCE SPECIFICATIONS Operating Conditions:VDD range as described in Table 12-1, -40C<TA<+125C. Current consumption is specified in Table 12-1. Characteristics Resolution Sym Min Typ Max VDD/24 VDD/32 Absolute Accuracy Unit Resistor Value (R) (1) Settling Time +1/4 +1/2 Units LSB LSB Low Range (VRR=1) High Range (VRR=0) LSB LSB Low Range (VRR=1) High Range (VRR=0) 2K* 10* Comments Figure 8-1 s * These parameters are characterized but not tested. Note 1: Settling time measured while VRR = 1 and VR<3:0> transitions from 0000 to 1111. DS30235J-page 102 2003 Microchip Technology Inc. PIC16C62X 12.8 Timing Parameter Symbology The timing parameter symbols have been created with one of the following formats: 1. TppS2ppS 2. TppS T F Frequency T Time Lowercase subscripts (pp) and their meanings: pp ck CLKOUT osc OSC1 io I/O port t0 T0CKI mc MCLR Uppercase letters and their meanings: S F Fall P Period H High R Rise I Invalid (Hi-impedance) V Valid L Low Z Hi-Impedance FIGURE 12-11: LOAD CONDITIONS Load condition 2 Load condition 1 VDD/2 RL CL Pin VSS RL = 464 CL = 50 pF for all pins except OSC2 15 pF for OSC2 output 2003 Microchip Technology Inc. CL Pin VSS DS30235J-page 103 PIC16C62X 12.9 Timing Diagrams and Specifications FIGURE 12-12: EXTERNAL CLOCK TIMING Q4 Q1 Q3 Q2 Q4 Q1 OSC1 1 3 3 4 4 2 CLKOUT TABLE 12-3: Parameter No. 1A EXTERNAL CLOCK TIMING REQUIREMENTS Sym Fosc Characteristic External CLKIN Frequency(1) Oscillator Frequency(1) 1 Tosc External CLKIN Period(1) Oscillator Period(1) (1) 2 TCY Instruction Cycle Time 3* TosL, TosH External Clock in (OSC1) High or Low Time 4* 2: * 3: Note 1: TosR, TosF External Clock in (OSC1) Rise or Fall Time Min Typ Max Units Conditions DC DC -- 4 MHz XT and RC Osc mode, VDD=5.0V -- 20 MHz HS Osc mode DC -- 200 kHz LP Osc mode DC -- 4 MHz RC Osc mode, VDD=5.0V 0.1 -- 4 MHz XT Osc mode 1 -- 20 MHz HS Osc mode DC -- 200 kHz 250 -- -- ns LP Osc mode XT and RC Osc mode 50 -- -- ns HS Osc mode 5 -- -- s LP Osc mode 250 -- -- ns RC Osc mode 250 -- 10,000 ns XT Osc mode 50 -- 1,000 ns HS Osc mode 5 -- -- s LP Osc mode TCYS=FOSC/4 1.0 FOSC/4 DC s 100* -- -- ns XT oscillator, TOSC L/H duty cycle 2* -- -- s LP oscillator, TOSC L/H duty cycle 20* -- -- ns HS oscillator, TOSC L/H duty cycle 25* -- -- ns XT oscillator 50* -- -- ns LP oscillator 15* -- -- ns HS oscillator These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Instruction cycle period (TCY) equals four times the input oscillator time-base period. All specified values are based on characterization data for that particular oscillator type under standard operating conditions with the device executing code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current consumption. All devices are tested to operate at "min." values with an external clock applied to the OSC1 pin. When an external clock input is used, the "Max." cycle time limit is "DC" (no clock) for all devices. DS30235J-page 104 2003 Microchip Technology Inc. PIC16C62X FIGURE 12-13: CLKOUT AND I/O TIMING Q1 Q4 Q2 Q3 OSC1 11 10 22 23 CLKOUT 13 14 19 12 18 16 I/O Pin (input) 17 I/O Pin (output) 15 new value old value 20, 21 Note: All tests must be done with specified capacitance loads (Figure 12-11) 50 pF on I/O pins and CLKOUT. 2003 Microchip Technology Inc. DS30235J-page 105 PIC16C62X TABLE 12-4: Parameter No. 10* CLKOUT AND I/O TIMING REQUIREMENTS Sym Characteristic Min Typ Max Units Conditions TosH2ckL OSC1 to CLKOUT(1) -- -- 75 -- 200 400 ns ns PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA 11* TosH2ck H OSC1 to CLKOUT(1) -- -- 75 -- 200 400 ns ns PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA 12* TckR CLKOUT rise time(1) -- -- 35 -- 100 200 ns ns PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA 13* TckF CLKOUT fall time(1) -- -- 35 -- 100 200 ns ns PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA 14* TckL2ioV CLKOUT to Port out valid(1) -- -- 20 ns TOSC +200 ns TOSC +400 ns -- -- -- -- ns ns 0 -- -- ns -- -- 50 150 300 ns ns PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA 100 200 -- -- -- -- ns ns PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA (1) 15* TioV2ckH Port in valid before CLKOUT 16* TckH2ioI 17* TosH2ioV OSC1 (Q1 cycle) to Port out valid 18* TosH2ioI 19* TioV2osH Port input valid to OSC1 (I/O in setup time) 0 -- -- ns 20* TioR Port output rise time -- -- 10 -- 40 80 ns ns PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA 21* TioF Port output fall time -- -- 10 -- 40 80 ns ns PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA 22* Tinp RB0/INT pin high or low time 25 40 -- -- -- -- ns ns PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA 23 Trbp RB<7:4> change interrupt high or low time TCY -- -- ns Port in hold after CLKOUT (1) OSC1 (Q2 cycle) to Port input invalid (I/O in hold time) PIC16C62X(A) PIC16LC62X(A) PIC16CR62XA PIC16LCR62XA * These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Measurements are taken in RC Mode where CLKOUT output is 4 x TOSC. DS30235J-page 106 2003 Microchip Technology Inc. PIC16C62X FIGURE 12-14: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING VDD MCLR 30 Internal POR 33 PWRT Timeout 32 OSC Timeout Internal RESET Watchdog Timer RESET 31 34 34 I/O Pins FIGURE 12-15: BROWN-OUT RESET TIMING BVDD VDD 35 TABLE 12-5: Parameter No. * RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER REQUIREMENTS Sym Characteristic Min 2000 -- -- ns -40 to +85C 7* 18 33* ms VDD = 5.0V, -40 to +85C 30 TmcL MCLR Pulse Width (low) 31 Twdt Watchdog Timer Time-out Period (No Prescaler) Typ Max Units Conditions 32 Tost Oscillation Start-up Timer Period -- 1024 TOSC -- -- TOSC = OSC1 period 33 Tpwrt Power-up Timer Period 28* 72 132* ms VDD = 5.0V, -40 to +85C 34 TIOZ I/O hi-impedance from MCLR low -- 2.0 s 35 TBOR Brown-out Reset Pulse Width -- -- s 100* 3.7V VDD 4.3V These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C, unless otherwise stated. These parameters are for design guidance only and are not tested. 2003 Microchip Technology Inc. DS30235J-page 107 PIC16C62X FIGURE 12-16: TIMER0 CLOCK TIMING RA4/T0CKI 41 40 42 TMR0 TABLE 12-6: Parameter No. 40 TIMER0 CLOCK REQUIREMENTS Sym Tt0H Characteristic T0CKI High Pulse Width 41 Tt0L T0CKI Low Pulse Width 42 Tt0P T0CKI Period * Min Typ Max Units No Prescaler 0.5 TCY + 20* -- -- ns With Prescaler 10* -- -- ns No Prescaler 0.5 TCY + 20* -- -- ns With Prescaler 10* -- -- ns TCY + 40* N -- -- ns Conditions N = prescale value (1, 2, 4, ..., 256) These parameters are characterized but not tested. Data in "Typ" column is at 5.0V, 25C, unless otherwise stated. These parameters are for design guidance only and are not tested. DS30235J-page 108 2003 Microchip Technology Inc. PIC16C62X 13.0 DEVICE CHARACTERIZATION INFORMATION The graphs and tables provided in this section are for design guidance and are not tested. In some graphs or tables, the data presented is outside specified operating range (e.g., outside specified VDD range). This is for information only and devices will operate properly only within the specified range. The data presented in this section is a statistical summary of data collected on units from different lots over a period of time. "Typical" represents the mean of the distribution, while "max" or "min" represents (mean + 3) and (mean - 3) respectively, where is standard deviation. FIGURE 13-1: IDD VS. FREQUENCY (XT MODE, VDD = 5.5V) 1.20 1.00 IDD (mA) 0.8 0.6 0.4 0.2 0.00 0.20 1.00 2.00 4.00 Frequency (MHz) FIGURE 13-2: PIC16C622A IPD VS. VDD (WDT DISABLE) 0.35 0.30 0.25 IPD (uA) 0.20 0.15 0.10 0.05 0.00 -0.05 3 4 5 6 VDD (V) 2003 Microchip Technology Inc. DS30235J-page 109 PIC16C62X FIGURE 13-3: IDD VS. VDD (XT OSC 4 MHZ) 1.00 0.9 0.8 IDD (mA) 0.7 0.6 0.5 0.4 0.3 0.2 2.5 3 3.5 4 4.5 5 5.5 VDD (VOLTS) IOI VS. VOL, VDD = 3.0V) FIGURE 13-4: 50 45 MAX -40C 40 35 IOI (mA) TYP 25C 30 MIN 85C 25 20 15 10 5 0 0 .5 1 1.5 2 2.5 3 Vol (V) DS30235J-page 110 2003 Microchip Technology Inc. PIC16C62X FIGURE 13-5: IOH VS. VOH, VDD = 3.0V) 0 IOH (mA) -5 -10 MIN 85C TYP 25C -15 MAX -40C -20 -25 0 .5 1 1.5 2 2.5 3 VOH (V) IOI VS. VOL, VDD = 5.5V) FIGURE 13-6: 100 MAX -40C 90 80 TYP 25C IOI (mA) 70 60 MIN 85C 50 40 30 20 10 0 0 .5 1 1.5 2 2.5 3 Vol (V) 2003 Microchip Technology Inc. DS30235J-page 111 PIC16C62X FIGURE 13-7: IOH VS. VOH, VDD = 5.5V) 0 IOH (mA) -10 -20 MIN 85C -30 TYP 25C -40 MAX -40C -50 3 3.5 4 4.5 5 5.5 VOH (V) DS30235J-page 112 2003 Microchip Technology Inc. PIC16C62X 14.0 PACKAGING INFORMATION 18-Lead Ceramic Dual In-line with Window (JW) - 300 mil (CERDIP) E1 D W2 2 n 1 W1 E A2 A c L A1 eB B1 p B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Ceramic Package Height Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Window Width Window Length * Controlling Parameter Significant Characteristic JEDEC Equivalent: MO-036 Drawing No. C04-010 2003 Microchip Technology Inc. A A2 A1 E E1 D L c B1 B eB W1 W2 MIN .170 .155 .015 .300 .285 .880 .125 .008 .050 .016 .345 .130 .190 INCHES* NOM 18 .100 .183 .160 .023 .313 .290 .900 .138 .010 .055 .019 .385 .140 .200 MAX .195 .165 .030 .325 .295 .920 .150 .012 .060 .021 .425 .150 .210 MILLIMETERS NOM 18 2.54 4.32 4.64 3.94 4.06 0.38 0.57 7.62 7.94 7.24 7.37 22.35 22.86 3.18 3.49 0.20 0.25 1.27 1.40 0.41 0.47 8.76 9.78 3.30 3.56 4.83 5.08 MIN MAX 4.95 4.19 0.76 8.26 7.49 23.37 3.81 0.30 1.52 0.53 10.80 3.81 5.33 DS30235J-page 113 PIC16C62X 18-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c A1 B1 p B eB Units Dimension Limits n p MIN INCHES* NOM 18 .100 .155 .130 MAX MILLIMETERS NOM 18 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 22.61 22.80 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane .015 A1 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width .240 .250 .260 E1 Overall Length D .890 .898 .905 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .058 .070 Lower Lead Width B .014 .018 .022 eB Overall Row Spacing .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-007 DS30235J-page 114 MAX 4.32 3.68 8.26 6.60 22.99 3.43 0.38 1.78 0.56 10.92 15 15 2003 Microchip Technology Inc. PIC16C62X 18-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) E p E1 D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D h L c B MIN .093 .088 .004 .394 .291 .446 .010 .016 0 .009 .014 0 0 A1 INCHES* NOM 18 .050 .099 .091 .008 .407 .295 .454 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .462 .029 .050 8 .012 .020 15 15 MILLIMETERS NOM 18 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.39 7.49 11.33 11.53 0.25 0.50 0.41 0.84 0 4 0.23 0.27 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 11.73 0.74 1.27 8 0.30 0.51 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-051 2003 Microchip Technology Inc. DS30235J-page 115 PIC16C62X 20-Lead Plastic Shrink Small Outline (SS) - 209 mil, 5.30 mm (SSOP) E E1 p D B 2 1 n c A2 A L A1 Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Foot Angle Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D L c B MIN .068 .064 .002 .299 .201 .278 .022 .004 0 .010 0 0 INCHES* NOM 20 .026 .073 .068 .006 .309 .207 .284 .030 .007 4 .013 5 5 MAX .078 .072 .010 .322 .212 .289 .037 .010 8 .015 10 10 MILLIMETERS NOM 20 0.65 1.73 1.85 1.63 1.73 0.05 0.15 7.59 7.85 5.11 5.25 7.06 7.20 0.56 0.75 0.10 0.18 0.00 101.60 0.25 0.32 0 5 0 5 MIN MAX 1.98 1.83 0.25 8.18 5.38 7.34 0.94 0.25 203.20 0.38 10 10 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-150 Drawing No. C04-072 DS30235J-page 116 2003 Microchip Technology Inc. PIC16C62X 14.1 Package Marking Information 18-Lead PDIP Example XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX AABBCDE 18-Lead SOIC (.300") XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX AABBCDE PIC16C622A -04I / P456 9923CBA Example PIC16C622 -04I / S0218 9918CDK 18-Lead CERDIP Windowed Example XXXXXXXX XXXXXXXX AABBCDE 20-Lead SSOP XXXXXXXXXX XXXXXXXXXX AABBCDE Legend: Note: * XX...X Y YY WW NNN 16C622 /JW 9901CBA Example PIC16C622A -04I / 218 9951CBP Customer specific information* Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Standard PICmicro device marking consists of Microchip part number, year code, week code, and traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. 2003 Microchip Technology Inc. DS30235J-page 117 PIC16C62X NOTES: DS30235J-page 118 2003 Microchip Technology Inc. PIC16C62X APPENDIX A: ENHANCEMENTS APPENDIX B: COMPATIBILITY The following are the list of enhancements over the PIC16C5X microcontroller family: To convert code written for PIC16C5X to PIC16CXX, the user should take the following steps: 1. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. Instruction word length is increased to 14 bits. This allows larger page sizes both in program memory (4K now as opposed to 512 before) and register file (up to 128 bytes now versus 32 bytes before). A PC high latch register (PCLATH) is added to handle program memory paging. PA2, PA1, PA0 bits are removed from STATUS register. Data memory paging is slightly redefined. STATUS register is modified. Four new instructions have been added: RETURN, RETFIE, ADDLW, and SUBLW. Two instructions TRIS and OPTION are being phased out, although they are kept for compatibility with PIC16C5X. OPTION and TRIS registers are made addressable. Interrupt capability is added. Interrupt vector is at 0004h. Stack size is increased to 8 deep. RESET vector is changed to 0000h. RESET of all registers is revisited. Five different RESET (and wake-up) types are recognized. Registers are reset differently. Wake-up from SLEEP through interrupt is added. Two separate timers, Oscillator Start-up Timer (OST) and Power-up Timer (PWRT) are included for more reliable power-up. These timers are invoked selectively to avoid unnecessary delays on power-up and wake-up. PORTB has weak pull-ups and interrupt-onchange feature. Timer0 clock input, T0CKI pin is also a port pin (RA4/T0CKI) and has a TRIS bit. FSR is made a full 8-bit register. "In-circuit programming" is made possible. The user can program PIC16CXX devices using only five pins: VDD, VSS, VPP, RB6 (clock) and RB7 (data in/out). PCON STATUS register is added with a Poweron-Reset (POR) STATUS bit and a Brown-out Reset STATUS bit (BOD). Code protection scheme is enhanced such that portions of the program memory can be protected, while the remainder is unprotected. PORTA inputs are now Schmitt Trigger inputs. Brown-out Reset reset has been added. Common RAM registers F0h-FFh implemented in bank1. 2003 Microchip Technology Inc. 2. 3. 4. 5. Remove any program memory page select operations (PA2, PA1, PA0 bits) for CALL, GOTO. Revisit any computed jump operations (write to PC or add to PC, etc.) to make sure page bits are set properly under the new scheme. Eliminate any data memory page switching. Redefine data variables to reallocate them. Verify all writes to STATUS, OPTION, and FSR registers since these have changed. Change RESET vector to 0000h. DS30235J-page 119 PIC16C62X NOTES: DS30235J-page 120 2003 Microchip Technology Inc. PIC16C62X INDEX A ADDLW Instruction ............................................................. 63 ADDWF Instruction ............................................................. 63 ANDLW Instruction ............................................................. 63 ANDWF Instruction ............................................................. 63 Architectural Overview .......................................................... 9 Assembler MPASM Assembler..................................................... 75 B BCF Instruction ................................................................... 64 Block Diagram TIMER0....................................................................... 31 TMR0/WDT PRESCALER .......................................... 34 Brown-Out Detect (BOD) .................................................... 50 BSF Instruction ................................................................... 64 BTFSC Instruction............................................................... 64 BTFSS Instruction ............................................................... 65 C C Compilers MPLAB C17 ................................................................ 76 MPLAB C18 ................................................................ 76 MPLAB C30 ................................................................ 76 CALL Instruction ................................................................. 65 Clocking Scheme/Instruction Cycle .................................... 12 CLRF Instruction ................................................................. 65 CLRW Instruction ................................................................ 66 CLRWDT Instruction ........................................................... 66 Code Protection .................................................................. 60 COMF Instruction ................................................................ 66 Comparator Configuration................................................... 38 Comparator Interrupts ......................................................... 41 Comparator Module ............................................................ 37 Comparator Operation ........................................................ 39 Comparator Reference ....................................................... 39 Configuration Bits................................................................ 46 Configuring the Voltage Reference ..................................... 43 Crystal Operation ................................................................ 47 D Data Memory Organization ................................................. 14 DC Characteristics ...................................................... 87, 101 PIC16C717/770/771 ............... 88, 89, 90, 91, 96, 97, 98 DECF Instruction................................................................. 66 DECFSZ Instruction ............................................................ 67 Demonstration Boards PICDEM 1 ................................................................... 78 PICDEM 17 ................................................................. 78 PICDEM 18R PIC18C601/801.................................... 79 PICDEM 2 Plus ........................................................... 78 PICDEM 3 PIC16C92X ............................................... 78 PICDEM 4 ................................................................... 78 PICDEM LIN PIC16C43X ........................................... 79 PICDEM USB PIC16C7X5.......................................... 79 PICDEM.net Internet/Ethernet .................................... 78 Development Support ......................................................... 75 E Errata .................................................................................... 3 Evaluation and Programming Tools .................................... 79 External Crystal Oscillator Circuit ....................................... 48 G General purpose Register File ............................................ 14 GOTO Instruction ................................................................ 67 2003 Microchip Technology Inc. I I/O Ports ............................................................................. 25 I/O Programming Considerations ....................................... 30 ID Locations........................................................................ 60 INCF Instruction.................................................................. 67 INCFSZ Instruction ............................................................. 68 In-Circuit Serial Programming............................................. 60 Indirect Addressing, INDF and FSR Registers ................... 24 Instruction Flow/Pipelining .................................................. 12 Instruction Set ADDLW....................................................................... 63 ADDWF ...................................................................... 63 ANDLW....................................................................... 63 ANDWF ...................................................................... 63 BCF ............................................................................ 64 BSF............................................................................. 64 BTFSC........................................................................ 64 BTFSS ........................................................................ 65 CALL........................................................................... 65 CLRF .......................................................................... 65 CLRW ......................................................................... 66 CLRWDT .................................................................... 66 COMF ......................................................................... 66 DECF.......................................................................... 66 DECFSZ ..................................................................... 67 GOTO ......................................................................... 67 INCF ........................................................................... 67 INCFSZ....................................................................... 68 IORLW........................................................................ 68 IORWF........................................................................ 68 MOVF ......................................................................... 69 MOVLW ...................................................................... 68 MOVWF...................................................................... 69 NOP............................................................................ 69 OPTION...................................................................... 69 RETFIE....................................................................... 70 RETLW ....................................................................... 70 RETURN..................................................................... 70 RLF............................................................................. 71 RRF ............................................................................ 71 SLEEP ........................................................................ 71 SUBLW....................................................................... 72 SUBWF....................................................................... 72 SWAPF....................................................................... 73 TRIS ........................................................................... 73 XORLW ...................................................................... 73 XORWF ...................................................................... 73 Instruction Set Summary .................................................... 61 INT Interrupt ....................................................................... 56 INTCON Register................................................................ 20 Interrupts ............................................................................ 55 IORLW Instruction .............................................................. 68 IORWF Instruction .............................................................. 68 M MOVF Instruction................................................................ 69 MOVLW Instruction............................................................. 68 MOVWF Instruction ............................................................ 69 MPLAB ASM30 Assembler, Linker, Librarian ..................... 76 MPLAB ICD 2 In-Circuit Debugger ..................................... 77 MPLAB ICE 2000 High Performance Universal In-Circuit Emulator .............................................................. 77 MPLAB ICE 4000 High Performance Universal In-Circuit Emulator .............................................................. 77 MPLAB Integrated Development Environment Software.... 75 MPLINK Object Linker/MPLIB Object Librarian .................. 76 DS30235J-page 121 PIC16C62X N V NOP Instruction................................................................... 69 Voltage Reference Module ................................................. 43 VRCON Register ................................................................ 43 O One-Time-Programmable (OTP) Devices............................. 7 OPTION Instruction............................................................. 69 OPTION Register ................................................................ 19 Oscillator Configurations ..................................................... 47 Oscillator Start-up Timer (OST) .......................................... 50 P W Watchdog Timer (WDT)...................................................... 58 WWW, On-Line Support ....................................................... 3 X XORLW Instruction ............................................................. 73 XORWF Instruction............................................................. 73 Package Marking Information ........................................... 117 Packaging Information ...................................................... 113 PCL and PCLATH ............................................................... 23 PCON Register ................................................................... 22 PICkit 1 FLASH Starter Kit .................................................. 79 PICSTART Plus Development Programmer ....................... 77 PIE1 Register ...................................................................... 21 PIR1 Register...................................................................... 21 Port RB Interrupt ................................................................. 56 PORTA................................................................................ 25 PORTB................................................................................ 28 Power Control/Status Register (PCON) .............................. 51 Power-Down Mode (SLEEP)............................................... 59 Power-On Reset (POR) ...................................................... 50 Power-up Timer (PWRT)..................................................... 50 Prescaler ............................................................................. 34 PRO MATE II Universal Device Programmer ..................... 77 Program Memory Organization ........................................... 13 Q Quick-Turnaround-Production (QTP) Devices ...................... 7 R RC Oscillator ....................................................................... 48 Reset................................................................................... 49 RETFIE Instruction.............................................................. 70 RETLW Instruction .............................................................. 70 RETURN Instruction............................................................ 70 RLF Instruction.................................................................... 71 RRF Instruction ................................................................... 71 S Serialized Quick-Turnaround-Production (SQTP) Devices ... 7 SLEEP Instruction ............................................................... 71 Software Simulator (MPLAB SIM)....................................... 76 Software Simulator (MPLAB SIM30)................................... 76 Special Features of the CPU............................................... 45 Special Function Registers ................................................. 17 Stack ................................................................................... 23 Status Register.................................................................... 18 SUBLW Instruction.............................................................. 72 SUBWF Instruction.............................................................. 72 SWAPF Instruction.............................................................. 73 T Timer0 TIMER0 ....................................................................... 31 TIMER0 (TMR0) Interrupt ........................................... 31 TIMER0 (TMR0) Module ............................................. 31 TMR0 with External Clock........................................... 33 Timer1 Switching Prescaler Assignment................................. 35 Timing Diagrams and Specifications................................. 104 TMR0 Interrupt .................................................................... 56 TRIS Instruction .................................................................. 73 TRISA.................................................................................. 25 TRISB.................................................................................. 28 DS30235J-page 122 2003 Microchip Technology Inc. PIC16C62X ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape(R) or Microsoft(R) Internet Explorer. Files are also available for FTP download from our FTP site. Connecting to the Microchip Internet Web Site The Microchip web site is available at the following URL: SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. 092002 www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events 2003 Microchip Technology Inc. DS30235J-page 123 PIC16C62X READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Device: PIC16C62X Y N Literature Number: DS30235J Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS30235J-page 124 2003 Microchip Technology Inc. PIC16C62X PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. -XX X Device Frequency Range Temperature Range /XX XXX Package Pattern Device PIC16C62X: VDD range 3.0V to 6.0V PIC16C62XT: VDD range 3.0V to 6.0V (Tape and Reel) PIC16C62XA: VDD range 3.0V to 5.5V PIC16C62XAT: VDD range 3.0V to 5.5V (Tape and Reel) PIC16LC62X: VDD range 2.5V to 6.0V PIC16LC62XT: VDD range 2.5V to 6.0V (Tape and Reel) PIC16LC62XA: VDD range 2.5V to 5.5V PIC16LC62XAT: VDD range 2.5V to 5.5V (Tape and Reel) PIC16CR620A: VDD range 2.5V to 5.5V PIC16CR620AT: VDD range 2.5V to 5.5V (Tape and Reel) PIC16LCR620A: VDD range 2.0V to 5.5V PIC16LCR620AT: VDD range 2.0V to 5.5V (Tape and Reel) Frequency Range 04 04 20 200 kHz (LP osc) 4 MHz (XT and RC osc) 20 MHz (HS osc) Temperature Range I E = = = Package P SO SS JW* Pattern 3-Digit Pattern Code for QTP (blank otherwise) Examples: a) PIC16C621A - 04/P 301 = Commercial temp., PDIP package, 4 MHz, normal VDD limits, QTP pattern #301. b) PIC16LC622- 04I/SO = Industrial temp., SOIC package, 200 kHz, extended VDD limits. 0C to +70C -40C to +85C -40C to +125C = = = = PDIP SOIC (Gull Wing, 300 mil body) SSOP (209 mil) Windowed CERDIP * JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of each oscillator type. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2003 Microchip Technology Inc. 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