Ericsson Internal
PRODUCT SPECIFICATION 1 (4)
Prepared (also subject responsible if other) No.
EAB/FC/P Maria Rosendahl 1/1301-BMR658
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) MICTOJO 2008-06-03 B
Key Features
• Industry standard low profile Eighth-brick
58.4 x 22.7 x 10.1 mm (2.3 x 0.894 x 0.397 in.)
• High efficiency, typ. 95 % at 12 V half load
• 1500 Vdc input to output isolation
• Meets isolation requirements equivalent to basic
insulation according to IEC/EN/UL 60950
• More than 1.3 million hours MTBF
General Characteristics
• N+1 parallelable
• Input under voltage protection
• Over temperature protection
• Output over voltage protection
• Output short-circuit protection
• Remote control
• Optional baseplate
• Highly automated manufacturing ensures quality
• ISO 9001/14001 certified supplier
Safety Approvals Design for Environment
Meets requirements in high-
temperature lead-free
soldering processes.
Limited Internal
TABLE OF CONTENTS 1 (1)
Prepared (also subject responsible if other) No.
SEC/S David Xie 001 52-EN/LZT 146 384 Uen
Approved Checked Date Rev Reference
EWEIXIE 2008-12-15 C
Contents
General Information ............................................................. 2
Safety Specification ............................................................. 3
Absolute Maximum Ratings ............................................................. 4
Product Program Ordering No.
5.0 V, 40 A / 200 W Electrical Specification PKB 4201B PI................................. 5
12.0 V, 20 A / 240 W Electrical Specification PKB 4204B PI................................. 8
EMC Specification ........................................................... 11
Operating Information ........................................................... 12
Thermal considerations ........................................................... 13
Connections ........................................................... 14
Mechanical Information ........................................................... 15
Soldering Information ........................................................... 18
Delivery Information ........................................................... 19
Product Qualification Specification ........................................................... 20
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
Ericsson Internal
PRODUCT SPECIFICATION 2 (4)
Prepared (also subject responsible if other) No.
EAB/FC/P Maria Rosendahl 1/1301-BMR658
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) MICTOJO 2008-06-03 B
General Information
Ordering Information
See Contents for individual product ordering numbers.
Option Suffix Ordering No.
Surface mount
Positive Remote Control Logic
Lead length 3.69 mm (0.145 in)
Lead length 4.57 mm (0.180 in)
Increased stand-off height
Baseplate
SI
P
LA
LB
M
HS
PKB 4204B SI
PKB 4204B PIP
PKB 4204B PILA
PKB 4204B PILB
PKB 4204B PIM
PKB 4204B PIHS
Note 1: As an example a positive logic, short pin product with baseplate
would be PKB 4204 PIPHSLA.
Reliability
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (T
A
) of
+40°C, which is a typical condition in Information and
Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses Telcordia SR332.
Predicted MTBF for the series is:
- 1.3 million hours according to Telcordia SR332, issue
1, Black box technique.
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
- Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
- Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
- Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
General Terms and Conditions of Sale.
Limitation of Liability
Ericsson does not make any other warranties, expressed or
implied including any warranty of merchantability or fitness
for a particular purpose (including, but not limited to, use in
life support applications, where malfunctions of product
can cause injury to a person’s health or life).
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
2
Ericsson Internal
PRODUCT SPECIFICATION 3 (4)
Prepared (also subject responsible if other) No.
EAB/FC/P Maria Rosendahl 1/1301-BMR658
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) MICTOJO 2008-06-03 B
Safety Specification
General information
Ericsson Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with safety
standards IEC/EN/UL60950,
Safety of Information
Technology Equipment
.
IEC/EN/UL60950 contains requirements to prevent injury
or damage due to the following hazards:
• Electrical shock
• Energy hazards
• Fire
• Mechanical and heat hazards
• Radiation hazards
• Chemical hazards
On-board DC-DC converters and DC/DC regulators are
defined as component power supplies. As components
they cannot fully comply with the provisions of any Safety
requirements without “Conditions of Acceptability”.
Clearance between conductors and between conductive
parts of the component power supply and conductors on
the board in the final product must meet the applicable
Safety requirements. Certain conditions of acceptability
apply for component power supplies with limited stand-off
(see Mechanical Information for further information). It is
the responsibility of the installer to ensure that the final
product housing these components complies with the
requirements of all applicable Safety standards and
Directives for the final product.
Component power supplies for general use should comply
with the requirements in IEC60950, EN60950 and
UL60950
“Safety of information technology equipment”.
There are other more product related standards, e.g.
IEEE802.3af “Ethernet LAN/MAN Data terminal equipment
power”, and ETS300132-2 “Power supply interface at the
input to telecommunications equipment; part 2: DC”, but
all of these standards are based on IEC/EN/UL60950 with
regards to safety.
Ericsson Power Modules DC/DC converters and DC/DC
regulators are UL60950 recognized and certified in
accordance with EN60950.
The flammability rating for all construction parts of the
products meets requirements for V-0 class material
according to IEC 60695-11-10.
The products should be installed in the end-use
equipment, in accordance with the requirements of the
ultimate application. Normally the output of the DC/DC
converter is considered as SELV (Safety Extra Low
Voltage) and the input source must be isolated by
minimum Double or Reinforced Insulation from the primary
circuit (AC mains) in accordance with IEC/EN/UL60950.
Isolated DC/DC converters
It is recommended that a slow blow fuse with a rating
twice the maximum input current per selected product be
used at the input of each DC/DC converter. If an input filter
is used in the circuit the fuse should be placed in front of
the input filter.
In the rare event of a component problem in the input filter
or in the DC/DC converter that imposes a short circuit on
the input source, this fuse will provide the following
functions:
• Isolate the faulty DC/DC converter from the input
power source so as not to affect the operation of
other parts of the system.
• Protect the distribution wiring from excessive
current and power loss thus preventing
hazardous overheating.
The galvanic isolation is verified in an electric strength test.
The test voltage (V
iso
) between input and output is
1500 Vdc or 2250 Vdc for 60 seconds (refer to product
specification).
Leakage current is less than 1 µA at nominal input voltage.
24 V DC systems
The input voltage to the DC/DC converter is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
48 and 60 V DC systems
If the input voltage to the DC/DC converter is 75 Vdc or
less, then the output remains SELV (Safety Extra Low
Voltage) under normal and abnormal operating conditions.
Single fault testing in the input power supply circuit should
be performed with the DC/DC converter connected to
demonstrate that the input voltage does not exceed
75 Vdc.
If the input power source circuit is a DC power system, the
source may be treated as a TNV2 circuit and testing has
demonstrated compliance with SELV limits and isolation
requirements equivalent to Basic Insulation in accordance
with IEC/EN/UL60950.
Non-isolated DC/DC regulators
The input voltage to the DC/DC regulator is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
3
Ericsson Internal
PRODUCT SPECIFICATION 1 (8)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Magnus Broman) (MICHORG) 2008-12-18 D
Absolute Maximum Ratings
Characteristics min typ max Unit
Tref Operating Temperature (see Thermal Consideration section) -40 +125 °C
TS Storage temperature -40 +125 °C
VI Input voltage -0.5 +80 V
Viso Isolation voltage (input to output test voltage) 1500 Vdc
Vtr Input voltage transient (tp 100 ms) 100 V
Positive logic option -0.5 15 V
VRC Remote Control pin voltage
(see Operating Information section) Negative logic option -0.5 15 V
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are
normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and
performance may degrade in an unspecified manner.
Fundamental Circuit Diagram
RC
Control
+IN
-OUT
+OUT
-IN
OVP
Driver
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
4
Ericsson Internal
PRODUCT SPECIFICATION 2 (8)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Magnus Broman) (MICHORG) 2008-12-18 D
5 V, 40 A / 200 W Electrical Specification PKB 4201B PI
Tref = -30 to +90 ºC, VI = 36 to 75 V, unless otherwise specified under Conditions.
Typical values given at: Tref = +25 °C, VI= 53 V, max IO, unless otherwise specified under Conditions.
Characteristics Conditions min Typ max Unit
VI Input voltage range 36 75 V
VIoff Turn-off input voltage Decreasing input voltage 32 33 35 V
VIon Turn-on input voltage Increasing input voltage 33 35 36 V
CI Internal input capacitance 11 μF
VI = 75 V 0 194
VI = 53 V 0 194
PO Output power
VI = 36 V 0 194
W
50 % of max IO , VI = 53 V 94.5
η Efficiency max IO , VI = 53 V 94.0 %
Pd Power Dissipation max IO 12 18 W
Pli Input idling power IO = 0 A, VI = 53 V 4 W
PRC Input standby power VI = 53 V (turned off with RC) 0.12 W
fs Switching frequency 0-100 % of max IO 180 kHz
VOi Output voltage initial setting and
accuracy Tref = +25 °C, VI = 53 V, IO = 20 A 4.9 5.0 5.1 V
Output voltage tolerance band 0-100 % of max IO,
VI = 36 V to 75 V, see Note 3 4.5 5.5 V
Idling voltage IO = 0 A 4.75 5.5 V
Line regulation VI = 36 V to 75 V 0.04 V
VO
Load regulation VI = 53 V, 0-100 % of max IO 0.1 0.25 0.4 V
Vtr Load transient
voltage deviation 0.27 V
ttr Load transient recovery time
VI = 53 V, Load step 50-75-50 % of
max IO, di/dt = 1 A/μs, see Note 1 0.06 ms
tr Ramp-up time
(from 10−90 % of VOi) 1 4 7 ms
ts Start-up time
(from VI connection to 90 % of VOi)
0-100 % of max IO, see Note 1 & 2
5 10 14 ms
max IO, see Note 1 0.5
ms
tf VI shut-down fall time
(from VI off to 10 % of VO) IO = 0 A, see Note 1 16 s
RC start-up time max IO, see Note 1 & 2 7 ms
max IO, see Note 1 0.3 ms
tRC RC shut-down fall time
(from RC off to 10 % of VO) IO = 0 A, see Note 1 16 s
IO Output current 0 40 A
Ilim Current limit threshold Tref < max Tref 42 50 65 A
Isc Short circuit current Tref = 25 ºC 53 A
Cout Recommended Capacitive Load Tref = 25ºC, see Note 4 1000 µF
VOac Output ripple & noise See ripple & noise section,
max IO 110 220 mVp-p
Input over voltage protection 79
OVP Output over voltage protection 7.3 V
Note 1: A 1 mF external output capacitance was used (ESR approx. 20 mohm).
Note 2: At ramp up with low load will the output voltage have a negative slope during a short time.
Note 3: Negative temperature coefficient: -3 mV/ºC.
Note 4: Low ESR type.
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
5
Ericsson Internal
PRODUCT SPECIFICATION 3 (8)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Magnus Broman) (MICHORG) 2008-12-18 D
5 V, 40 A / 200 W Typical Characteristics
Efficiency Power Dissipation
80
85
90
95
100
0 10203040[A]
[%]
36 V
48 V
53 V
75 V
0
5
10
15
20
0 10203040[A]
[W]
36 V
48 V
53 V
75 V
Efficiency vs. load current and input voltage at Tref = +25 °C Dissipated power vs. load current and input voltage at Tref = +25 °C
Output Current Derating, open frame Output Current Derating, base plate option
0
10
20
30
40
0 20406080100[°C]
[A]
3.0 m/s
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
0
10
20
30
40
0 2040 6080100[°C]
[A]
3.0 m/s
2.0 m/s
1. 5 m/ s
1. 0 m / s
0.5 m/s
Nat. Conv.
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Output Characteristics Current Limit Characteristics
4.50
4.75
5.00
5.25
5.50
0 10203040[A]
[V]
36 V
48 V
53 V
75 V
3.5
4.0
4.5
5.0
5.5
40 44 48 52 56 60 [A ]
[V]
36 V
48 V
53 V
75 V
Output voltage vs. load current at Tref = +25 °C Output voltage vs. load current at IO > max IO , Tref = +25 °C
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
6
Ericsson Internal
PRODUCT SPECIFICATION 4 (8)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Magnus Broman) (MICHORG) 2008-12-18 D
5 V, 40 A / 200 W Typical Characteristics PKB 4201B PI
Start-up Shut-down
Start-up enabled by connecting VI at:
Tref = +25 °C, VI = 53 V,
IO = 40 A resistive load.
Cout = 1 mF.
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (5 ms/div.).
Shut-down enabled by disconnecting VI at:
Tref = +25 °C, VI = 53 V,
IO = 40 A resistive load.
Cout = 1 mF.
Top trace: output voltage (2 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (1 ms/div.).
Output Ripple & Noise Output Load Transient Response
Output voltage ripple at:
Tref = +25 °C, VI = 53 V,
IO = 40 A resistive load.
Trace: output voltage (50 mV/div.).
Time scale: (2 μs/div.).
Output voltage response to load current step-
change (20-30-20 A) at:
Tref =+25 °C, VI = 53 V, Cout = 1 mF.
Top trace: output voltage (0.5 V/div.).
Bottom trace: load current (20 A/div.).
Time scale: (0.1 ms/div.).
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
7
Ericsson Internal
PRODUCT SPECIFICATION 5 (8)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Magnus Broman) (MICHORG) 2008-12-18 D
12 V, 20 A / 240 W Electrical Specification PKB 4204B PI
Tref = -30 to +90 ºC, VI = 36 to 75 V, unless otherwise specified under Conditions.
Typical values given at: Tref = +25 °C, VI= 53 V, max IO, unless otherwise specified under Conditions.
Characteristics Conditions min Typ max Unit
VI Input voltage range 36 75 V
VIoff Turn-off input voltage Decreasing input voltage 32 33 35 V
VIon Turn-on input voltage Increasing input voltage 33 35 36 V
CI Internal input capacitance 11 μF
VI = 75 V 0 234
VI = 53 V 0 234
PO Output power
VI = 36 V 0 220
W
50 % of max IO , VI = 53 V 95.5
η Efficiency max IO , VI = 53 V 94.5 %
Pd Power Dissipation max IO 13.5 23 W
Pli Input idling power IO = 0 A, VI = 53 V 3 W
PRC Input standby power VI = 53 V (turned off with RC) 0.1 W
fs Switching frequency 0-100 % of max IO 180 kHz
VOi Output voltage initial setting and
accuracy Tref = +25 °C, VI = 53 V, IO = 10 A 11.85 12.00 12.15 V
Output voltage tolerance band 0-100 % of max IO,
VI = 38 V to 75 V, see Note 1 10.8 12.6 V
Idling voltage IO = 0 A 11.4 12.6 V
Line regulation VI = 38 V to 75 V, see Note 2 0.2 V
VO
Load regulation VI = 53 V, 0-100 % of max IO 0.3 0.6 0.9 V
Vtr Load transient
voltage deviation 0.4 V
ttr Load transient recovery time
VI = 53 V, Load step 50-75-50 % of
max IO, di/dt = 1 A/μs, see Note 3 0.25 ms
tr Ramp-up time
(from 10−90 % of VOi) 2 5.5 9 ms
ts Start-up time
(from VI connection to 90 % of VOi)
0-100 % of max IO
6 11 16 ms
max IO 0.1 ms
tf VI shut-down fall time
(from VI off to 10 % of VO) IO = 0 A 0.35 s
RC start-up time max IO 8 ms
max IO 0.1 ms
tRC RC shut-down fall time
(from RC off to 10 % of VO) IO = 0 A 0.35 s
IO Output current 0 20 A
Ilim Current limit threshold Tref < max Tref 21 27 33 A
Cout Recommended Capacitive Load Tref = 25ºC 0 µF
Isc Short circuit current Tref = 25 ºC 29 A
VOac Output ripple & noise See ripple & noise section,
max IO 80 240 mVp-p
Input over voltage protection 79
OVP Output over voltage protection 13.5 V
Note 1: At VI = 36 V to 38 V is the lower limit 10.5 V.
Note 2: At VI = 36 V to 75 V is the typical value 0.6 V.
Note 3: A 220 μF external output capacitance was with low ESR was used.
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
8
Ericsson Internal
PRODUCT SPECIFICATION 6 (8)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Magnus Broman) (MICHORG) 2008-12-18 D
12 V, 20 A / 240 W Typical Characteristics PKB 4204B PI
Efficiency Power Dissipation
80
85
90
95
100
0 5 10 15 20 [A]
[%]
36 V
38 V
53 V
75 V
0
5
10
15
20
0 5 10 15 20 [A]
[W]
36 V
38 V
53 V
75 V
Efficiency vs. load current and input voltage at Tref = +25 °C Dissipated power vs. load current and input voltage at Tref = +25 °C
Output Current Derating, open frame Output Current Derating, base plate option
0
5
10
15
20
0 20406080100[°C]
[A]
3.0 m/s
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
0
5
10
15
20
0 20406080100[°C]
[A]
3.0 m/s
2.0 m/s
1.5 m/s
1.0 m/s
0.5 m/s
Nat. Conv.
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Available load current vs. ambient air temperature and airflow at
VI = 53 V. See Thermal Consideration section.
Output Characteristics Current Limit Characteristics
10.0
10.5
11.0
11.5
12.0
12.5
13.0
0 5 10 15 20 [A]
[V]
36 V
38 V
53 V
75 V
6
8
10
12
14
20 22 24 26 28 30 [A]
[V]
36 V
38 V
53 V
75 V
Output voltage vs. load current at Tref = +25 °C Output voltage vs. load current at IO > max IO , Tref = +25 °C
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
9
Ericsson Internal
PRODUCT SPECIFICATION 7 (8)
Prepared (also subject responsible if other) No.
EAB/FJB/GMG Tord Johansson 2/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GM (Magnus Broman) (MICHORG) 2008-12-18 D
12 V, 20 A / 240 W Typical Characteristics PKB 4204B PI
Start-up Shut-down
Start-up enabled by connecting VI at:
Tref = +25 °C, VI = 53 V,
IO = 20 A resistive load.
Top trace: output voltage (5 V/div).
Bottom trace: input voltage (50 V/div).
Time scale: (5 ms/div).
Shut-down enabled by disconnecting VI at:
Tref = +25 °C, VI = 53 V,
IO = 20 A resistive load.
Top trace: output voltage (5 V/div.).
Bottom trace: input voltage (50 V/div.).
Time scale: (0.1 ms/div.).
Output Ripple & Noise Output Load Transient Response
Output voltage ripple at:
Tref = +25 °C, VI = 53 V,
IO = 20 A resistive load.
Trace: output voltage (50 mV/div).
Time scale: (2 μs/div.).
Output voltage response to load current step-
change (10-15-10 A) at:
Tref =+25 °C, VI = 53 V, Cout = 220 μF.
Top trace: output voltage (0.5 V/div.).
Bottom trace: load current (5 A/div).
Time scale: (0.1 ms/div.).
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
10
Ericsson Internal
PRODUCT SPECIFICATION 1 (5)
Prepared (also subject responsible if other) No.
EAB/FJB/GKJ Tord Johansson 3/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKG (Magnus Broman) (MICMROS) 2008-06-03 A
EMC Specification
Conducted EMI measured according to EN55022, CISPR 22
and FCC part 15J (see test set-up). See Design Note 009 for
detailed information. The fundamental switching frequency is
180 kHz for PKB 4204B PI @ V
I
= 53 V, max I
O
.
Conducted EMI Input terminal value (typ)
EMI without filter
External filter (class B)
Required external input filter in order to meet class B in
EN 55022, CISPR 22 and FCC part 15J.
Components:
C1,2,3 = 1 µF
(100 V, ceramic)
C4,5 = 2.2 nF
(2 kV, ceramic)
C6 = 220 µF
(100 V, electrolytic)
L1,2 = 809 µH
(common mode)
EMI with filter
Test set-up
Layout recommendation
The radiated EMI performance of the DC/DC converter will
depend on the PCB layout and ground layer design.
It is also important to consider the stand-off of the DC/DC
converter.
If a
g
round la
y
er is used, it should be connected to the output
of the DC/DC converter and the equipment ground or
chassis.
A ground layer will increase the stray capacitance in the PCB
and improve the high frequency EMC performance.
Output ripple and noise
Output ripple and noise measured according to figure below.
See Design Note 022 for detailed information.
10uF
0.1uF
-Vout
+Vout
*Conductor from Vout to capacitors = 50mm [1.97in.]
BNC
Connector
to Scope
Tantalum
Capacitor
Ceramic
Capacitor
+
Output ripple and noise test setup
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
11
Ericsson Internal
PRODUCT SPECIFICATION 2 (5)
Prepared (also subject responsible if other) No.
EAB/FJB/GKJ Tord Johansson 3/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKG (Magnus Broman) (MICMROS) 2008-06-03 A
Operating information
Input Voltage
The input voltage range 36 to 75 Vdc meets the requirements
of the European Telecom Standard ETS 300 132-2 for normal
input voltage range in —48 and —60 Vdc systems,
-40.5 to -57.0 V and —50.0 to -72 V respectively.
At input voltages exceeding 75 V, the power loss will be
higher than at normal input voltage and T
ref
must be limited to
absolute max 125 °C. The absolute maximum continuous
input voltage is 80 Vdc.
Turn-off Input Voltage
The DC/DC converters monitor the input voltage and will turn
on and turn off at predetermined levels.
The minimum hysteresis between on and off input
voltage is 1.0 V.
Remote Control (RC)
The products are fitted with a
remote control function referenced
to the primary negative input
connection (- In), with positive lo
g
ic
option available. The RC function
allows the product to be turned
on/off by an external device like a
semiconductor or mechanical
switch. The RC pin has an internal
pull up resistor to + In.
The maximum required sink current is less than 1 mA. When
the RC pin is left open, the volta
g
e
g
enerated on the RC pin is
5-10 V. The second option is “positive logic” remote control,
which can be ordered by adding the suffix “P” to the end of
the part number. The DC/DC converter will turn on when the
input voltage is applied with the RC pin open. Turn off is
achieved by connecting the RC pin to the - In. To ensure safe
turn off the voltage difference between RC pin and the - In pin
shall be less than 1 V. The DC/DC converter will restart
automatically when this connection is opened.
Input and Output Impedance
The impedance of both the input source and the load will
interact with the impedance of the DC/DC converter. It is
important that the input source has low characteristic
impedance. Minimum recommended external input
capacitance is 220 µF. The performance in some applications
can be enhanced by addition of external capacitance as
described under External Decoupling Capacitors.
External Decoupling Capacitors
When powering loads with significant dynamic current
requirements, the voltage regulation at the point of load can
be improved b
y
addition of decouplin
g
capacitors at the load.
The most effective technique is to locate low ESR ceramic
and electrolytic capacitors as close to the load as possible,
using several parallel capacitors to lower the effective ESR.
The ceramic capacitors will handle high-frequency dynamic
load changes while the electrolytic capacitors are used to
handle low frequency dynamic load changes. Ceramic
capacitors will also reduce any high frequency noise at the
load.
It is equally important to use low resistance and low
inductance PCB layouts and cabling.
For semi regulated DC/DC converters, such as PKB-B
intermediate bus converters, there is no limit on the value of
output capacitance that may be used. The user should be
aware, however, that large values of capacitance will affect
the ramp-up time of the DC/DC converter output voltage
during start-up.
For further information please contact your local Ericsson
Power Modules representative.
Parallel Operation
The converters can be paralleled for redundancy if external o-
ring diodes are used in series with the outputs.
Over Temperature Protection (OTP)
The DC/DC converters are protected from thermal overload
by an internal over temperature shutdown circuit.
When T
ref
as defined in thermal consideration section
exceeds 125°C the DC/DC converter will shut down. The
DC/DC converter will make continuous attempts to start up
(non-latching mode) and resume normal operation
automatically when the temperature has dropped below the
temperature threshold.
Over Voltage Protection (OVP)
The DC/DC converters have an output over volta
g
e protection
that normally will clamp the output voltage to the OVP
threshold level. If the output voltage should increase to the
OVP threshold level very fast then the DC/DC converter can
shut down and make attempts to start up (non-latching
mode). After removal of the over voltage condition the DC/DC
converter will resume to normal operation automatically.
Over Current Protection (OCP)
The DC/DC converters include current limiting circuitry for
protection at continuous overload.
The output voltage will decrease towards zero for output
currents in excess of max output current (max I
O
). The DC/DC
converter will resume normal operation after removal of the
overload. The load distribution should be designed for the
maximum output short circuit current specified.
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
12
Ericsson Internal
PRODUCT SPECIFICATION 3 (5)
Prepared (also subject responsible if other) No.
EAB/FJB/GKJ Tord Johansson 3/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKG (Magnus Broman) (MICMROS) 2008-06-03 A
Thermal Consideration
General
The products are designed to operate in different thermal
environments and sufficient cooling must be provided to
ensure reliable operation.
For products mounted on a PCB without a heat sink attached
coolin
g
is achieved mainl
y
b
y
conduction, from the pins to the
host board, and convection, which is dependant on the
airflow across the product. Increased airflow enhances the
cooling of the converter.
The Output Current Derating graph found in the Output
section for each model provides the available output current
vs. ambient air temperature and air velocity at V
in
= 53 V.
The product is tested on a 254 x 254 mm,
35 µm (1 oz), 16-layer test board mounted vertically in a wind
tunnel with a cross-section of 305 x 305 mm.
Proper cooling of the DC/DC converter can be verified by
measuring the temperature at positions P1, P2, P3, P4 and
P5. The temperature at these positions should not exceed the
max values provided in the table below. The number of points
may vary with different thermal design and topology.
See Design Note 019 for detailed information.
Position Description Max value
P1 Reference point (T
ref
) 125 ºC
P2 Transistor 125 ºC
P3 Optocoupler 100 ºC
P5 Reference point (T
ref
) 125 ºC
P6 Transistor 125 ºC
P7 Base plate 105 ºC
Open frame
Base plate
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
13
Ericsson Internal
PRODUCT SPECIFICATION 4 (5)
Prepared (also subject responsible if other) No.
EAB/FJB/GKJ Tord Johansson 3/1301-BMR 658 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKG (Magnus Broman) (MICMROS) 2008-06-03 A
Connections
Pin Designation Function
1 +In Positive input
2 RC Remote control
3 -In Negative input
4 -Out Negative output
5 +Out Positive output
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
14
Ericsson Confidential
PRODUCT SPEC. MECHANICAL 1 (4)
Prepared (also subject responsible if other) No.
EXXUYNG 4/1301-BMR 658 Uen
Approved Checked Date Rev Reference
SEC/D (Betty Wu) See §1 2008-11-27 C
Mechanical Information - Hole Mount, Open Frame Version
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
15
Ericsson Confidential
PRODUCT SPEC. MECHANICAL 2 (4)
Prepared (also subject responsible if other) No.
EXXUYNG 4/1301-BMR 658 Uen
Approved Checked Date Rev Reference
SEC/D (Betty Wu) See §1 2008-11-27 C
Mechanical Information - Hole Mount, Base Plate Version
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
16
Ericsson Confidential
PRODUCT SPEC. MECHANICAL 3 (4)
Prepared (also subject responsible if other) No.
EXXUYNG 4/1301-BMR 658 Uen
Approved Checked Date Rev Reference
SEC/D (Betty Wu) See §1 2008-11-27 C
Mechanical Information - Surface Mount Version
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
17
Ericsson Confidential
PRODUCT SPEC. 1 (4)
Prepared (also subject responsible if other) No.
EXXUYNG 5/1301- BMR 658 Uen
Approved Checked Date Rev Reference
SEC/D (Betty Wu) See §1 2008-11-27 B
Soldering Information - Surface Mounting
The surface mount product is intended for forced convection
or vapor phase reflow soldering in SnPb and Pb-free
processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and it is also recommended
to minimize the time in reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 4 is chosen as reference location for the minimum
pin temperature recommendation since this will likely be the
coolest solder joint during the reflow process.
SnPb solder processes
For SnPb solder processes, a pin temperature (T
PIN
) in excess
of the solder melting temperature, (T
L
, 183°C for Sn63Pb37)
for more than 30 seconds and a peak temperature of 210°C is
recommended to ensure a reliable solder joint.
For dry packed products only: depending on the type of
solder paste and flux system used on the host board, up to a
recommended maximum temperature of 245°C could be
used, if the products are kept in a controlled environment (dr
y
pack handling and storage) prior to assembly.
General reflow process specifications SnPb eutectic Pb-free
Average ramp-up (T
PRODUCT
) 3°C/s max 3°C/s max
Typical solder melting (liquidus)
temperature T
L
183°C 221°C
Minimum reflow time above T
L
30 s 30 s
Minimum pin temperature T
PIN
210°C 235°C
Peak product temperature T
PRODUCT
225°C 260°C
Average ramp-down (T
PRODUCT
) 6°C/s max 6°C/s max
Maximum time 25°C to peak 6 minutes 8 minutes
T
PRODUCT
maximum
T
PIN
minimum
Time
Pin
profile
Product
profile
T
L
Time in
reflow
Time in preheat
/ soak zone
Time 25°C to peak
Temperature
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (T
PIN
) in
excess of the solder melting temperature (T
L
, 217 to 221°C for
SnAgCu solder alloys) for more than 30 seconds and a peak
temperature of 235°C on all solder joints is recommended to
ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PCB near pin 2 is chosen as reference
location for the maximum (peak) allowed product temperature
(T
PRODUCT
) since this will likely be the warmest part of the
product during the reflow process.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL 1
according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT
must not exceed 225 °C at any time.
Pb-free solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow T
PRODUCT
must not exceed 260 °C at any time.
Dry Pack Information
Products intended for Pb-free reflow soldering processes are
delivered in standard moisture barrier bags according to
IPC/JEDEC standard J-STD-033 (Handlin
g
, packin
g
, shippin
g
and use of moisture/reflow sensitivit
y
surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Thermocouple Attachment
Pin 4 for measurement of minimum pin (solder
j
oint) temperature,
T
PIN
Top of PCB near pin 2 for measurement of
maximum product temperature, T
PRODUCT
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
18
Ericsson Confidential
PRODUCT SPEC. 2 (4)
Prepared (also subject responsible if other) No.
EXXUYNG 5/1301- BMR 658 Uen
Approved Checked Date Rev Reference
SEC/D (Betty Wu) See §1 2008-11-27 B
Soldering Information - Hole Mounting
The hole mounted product is intended for plated throu
g
h hole
mounting by wave or manual soldering. The pin temperature
is specified to maximum to 270°C for maximum 10 seconds.
A maximum preheat rate of 4°C/s and maximum preheat
temperature of 150°C is suggested. When soldering by hand,
care should be taken to avoid direct contact between the hot
soldering iron tip and the pins for more than a few seconds in
order to prevent overheating.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleanin
g
residues ma
y
affect
long time reliability and isolation voltage.
Delivery Package Information
Surface Mount Version
The products are delivered in antistatic injection molded tra
y
s
(Jedec design guide 4.10D standard).
Tray Specifications
Material Antistatic PPE
Surface resistance 10
5
< Ohm/square < 10
12
Bakability The trays can be baked at maximum
125°C for 48 hours
Tray thickness 17.4 mm [0.685 inch]
Box capacity 100 products (5 full trays/box)
Tray weight 120 g empty, 640 g full tray
Delivery Package Information
Hole Mount, Open Frame version
Hole Mount, Base Plate version
The products are delivered in antistatic trays.
Tray Specifications
Material PE Foam
Surface resistance 10
5
< Ohm/square < 10
12
Bakability The trays are not bakeable
Tray thickness 22 mm [0.87 inch]
Box capacity 75 products (3 full trays/box)
Tray weight
Open frame version
40 g empty, 690 g full tray
Base plate version
40 g empty, 1165 g full tray
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
19
Ericsson Confidential
PRODUCT SPEC. 3 (4)
Prepared (also subject responsible if other) No.
EXXUYNG 5/1301- BMR 658 Uen
Approved Checked Date Rev Reference
SEC/D (Betty Wu) See §1 2008-11-27 B
Product Qualification Specification
Characteristics
External visual inspection IPC-A-610
Change of temperature
(Temperature cycling) IEC 60068-2-14 Na
Temperature range
Number of cycles
Dwell/transfer time
-40 to 100°C
1000
15 min/0-1 min
Cold (in operation) IEC 60068-2-1 Ad Temperature T
A
Duration
-45°C
72 h
Damp heat IEC 60068-2-67 Cy
Temperature
Humidity
Duration
85°C
85 % RH
1000 hours
Dry heat IEC 60068-2-2 Bd Temperature
Duration
125°C
1000 h
Electrostatic discharge
susceptibility
IEC 61340-3-1, JESD 22-A114
IEC 61340-3-2, JESD 22-A115
Human body model (HBM)
Machine Model (MM)
Class 2, 2000 V
Class 3, 200 V
Immersion in cleaning solvents IEC 60068-2-45 XA, method 2
Water
Glycol ether
Isopropyl alcohol
55°C
35°C
35°C
Mechanical shock IEC 60068-2-27 Ea Peak acceleration
Duration
100 g
6 ms
Moisture reflow sensitivity
1
J-STD-020C Level 1 (SnPb-eutectic)
Level 3 (Pb Free)
225°C
260°C
Operational life test MIL-STD-202G, method 108A Duration 1000 h
Resistance to soldering heat
2
IEC 60068-2-20 Tb, method 1A Solder temperature
Duration
270°C
10-13 s
Robustness of terminations IEC 60068-2-21 Test Ua1
IEC 60068-2-21 Test Ue1
Through hole mount products
Surface mount products
All leads
All leads
Solderability
IEC 60068-2-58 test Td
1
IEC 60068-2-20 test Ta
2
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
150°C dry bake 16 h
215°C
235°C
Steam ageing
235°C
245°C
Vibration, broad band random IEC 60068-2-64 Fh, method 1
Frequency
Spectral density
Duration
10 to 500 Hz
0.07 g
2
/Hz
10 min in each direction
Notes
1
Only for products intended for reflow soldering (surface mount products)
2
Only for products intended for wave soldering (plated through hole products)
E
PKB 4000B PI
Intermediate Bus Converters, Input 36-75 V, 40 A / 240 W
EN/LZT 146 384 R2A Dec 2008
© Ericsson Power Modules AB
Technical Specification
20
