Film Capacitors
Metallized Polypropylene Film Capacitors (MKP)
Series/Type: B32774 ... B32778
Date: June 2018
© EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
Typical applications
Frequency converters
Industrial and high-end power supplies
Solar inverters
Climatic
Max. operating temperature: 105 °C (case)
Climatic category (IEC 60068-1:2013):
40/105/56
Construction
Dielectric: Polypropylene (MKP)
Plastic case (UL 94 V-0)
Epoxy resin sealing (UL 94 V-0)
Features
Capacitance values up to 480 μF
High CV product, compact
Good self-healing properties
Over-voltage capability
Low losses with high current capability
High reliability
Long useful life
RoHS-compatible
Terminals
Parallel wire leads, lead-free tinned
2-pin, 4-pin and 12-pin versions
Standard lead lengths: 6 1mm
Marking
Manufacturer's logo and lot number,
date code, rated capacitance (coded),
capacitance tolerance (code letter) and
rated DC voltage
Delivery mode
Bulk (untaped)
Metallized polypropylene film capacitors (MKP) B32774 ... B32778
MKP DC link high density series up to 480 μF
Page2of48Please read Cautions and warnings and
Important notes at the end of this document.
Dimensional drawings
Number of wires Lead spacing ±0.4 Lead diameter d1±0.05 Type
2-pin 27.5 0.8 B32774D
2-pin 37.5 1.0 B32776E
2-pin 37.5 1.0 B32776T
4-pin 37.5 1.2 B32776G
4-pin 37.5 1.2 B32776T
4-pin 52.5 1.2 B32778T
4-pin 52.5 1.2 B32778G
12-pin 52.5 1.2 B32778J
Dimensions in mm
Dimensional drawings 2-pin versions
B32774D, B32776E
B32774D B32776E
Lead spacing ±0.4: 27.5 37.5
Lead diameter d1: 0.8 1.0
Dimensions in mm
B32776T (low profile)
Lead spacing ±0.4: 37.5
Lead diameter d1: 1.0
Dimensions in mm
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page3of48Please read Cautions and warnings and
Important notes at the end of this document.
Dimensional drawings 4-pin versions
B32776G, B32778G
B32776G B32778G
Lead spacing ±0.4: 37.5 52.5
Lead diameter d1: 1.2 1.2
Dimensions in mm
B32776T, B32778T (low profile)
B32776T B32778T
Lead spacing ±0.4: 37.5 52.5
Lead diameter d1: 1.2 1.2
Dimensions in mm
Dimensional drawing 12-pin version
B32778J
Lead spacing ±0.4: 52.5
Lead diameter d1: 1.2
Dimensions in mm
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page4of48Please read Cautions and warnings and
Important notes at the end of this document.
Overview of available types
Lead spacing 27.5 mm 37.5 mm
Type B32774 B32776
Page 7 8
VR(V DC) 450 800 1100 1300 450 575 800 900 1100 1300
CR(μF)
1.5
2.0
2.7
3.0
3.3
3.5
3.9
5.0
6.8
7.0
7.5
8.0
8.5
9.0
10
12
13
14
15
16
20
22
25
27
30
35
40
45
50
60
65
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page5of48Please read Cautions and warnings and
Important notes at the end of this document.
Overview of available types
Lead spacing 52.5 mm
Type B32778
Page 11
VR(V DC) 450 575 800 900 1100 1300
CR(μF)
14
20
25
27
30
35
38
40
42
45
50
55
58
60
70
75
80
90
100
110
120
130
150
170
180
200
210
270
360
480
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page6of48Please read Cautions and warnings and
Important notes at the end of this document.
1) Capacitance value measured at 1 kHz
2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT≤20 °CatΔESRtyp ≤±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Ordering codes and packing units (lead spacing 27.5 mm)
CR1)
μF
Max. dimensions
w×h×l
mm
Ordering code
(composition see
below)
IRMS,max2)
70 °C
10 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
ESLtyp3)
70 °C
10 kHz
nH
tan δ
1 kHz
10-3
tan δ
10 kHz
10-3
Un-
taped
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
J= ±5%
K=±10%
Packing code:
000 = untaped (lead length 6 1 mm)
VR,70 °C= 450 V DC, Vop,85 °C= 450VDC
5.0 11.0 ×21.0 ×31.5 B32774D4505+000 5.0 21.1 19.0 1.2 10.7 2352
10.0 15.0 ×24.5 ×31.5 B32774D4106+000 8.0 10.9 24.0 1.2 11.0 1680
22.0 22.0 ×36.5 ×31.5 B32774D4226+000 14.5 5.4 30.0 1.3 12.1 784
VR,70 °C= 800 V DC, Vop,85 °C= 700VDC
3.0 11.0 ×21.0 ×31.5 B32774D8305+000 4.5 24.8 19.0 0.9 7.6 2352
5.0 14.0 ×24.5 ×31.5 B32774D8505+000 6.5 15.3 23.0 0.9 7.7 1848
12.0 22.0 ×36.5 ×31.5 B32774D8126+000 13.0 6.8 34.0 1.0 8.3 784
VR,70 °C= 1100 V DC, Vop,85 °C= 920VDC
2.0 12.5 ×21.5 ×31.5 B32774D0205+000 4.5 26.3 19.0 0.7 5.3 2100
3.3 18.0 ×27.5 ×31.5 B32774D0335+000 7.0 16.2 22.0 0.7 5.4 1428
5.0 19.0 ×30.0 ×31.5 B32774D0505+000 9.0 10.9 27.0 0.7 5.5 896
7.0 22.0 ×36.5 ×31.5 B32774D0705+000 12.0 8.1 30.0 0.7 5.8 784
VR,70 °C= 1300 V DC, Vop,85 °C=1100VDC
1.5 12.5 ×21.5 ×31.5 B32774D1155K000 4.4 31.3 20.0 0.6 4.8 2100
3.0 18.0 ×27.5 ×31.5 B32774D1305K000 7.0 16.0 24.0 0.6 4.9 1428
5.0 22.0 ×36.5 ×31.5 B32774D1505K000 10.5 9.8 33.0 0.7 5.1 784
B32774
MKP DC link high density series up to 480 μF
Page7of48Please read Cautions and warnings and
Important notes at the end of this document.
1) Capacitance value measured at 1 kHz
2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT≤20 °CatΔESRtyp ≤±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Ordering codes and packing units (lead spacing 37.5 mm)
CR1)
μF
Max. dimensions
w×h×l
mm
P1
mm
Ordering code
(composition see
below)
IRMS,max2)
70 °C
10 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
ESLtyp3)
70 °C
10 kHz
nH
tan δ
1 kHz
10-3
tan δ
10 kHz
10-3
Un-
taped
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
J= ±5%
K=±10%
Packing code:
000 = untaped (lead length 6 1 mm)
VR,70 °C= 450 V DC, Vop,85 °C= 450VDC
12 24.0 ×15.0 ×41.5 B32776T4126K000 7.0 17.1 19.0 2.2 21.0 1040
16 24.0 ×19.0 ×41.5 B32776T4166K000 8.0 13.0 18.0 2.3 21.2 780
30 20.0 ×39.5 ×41.5 10.2 B32776G4306+000 14.0 7.0 11.0 2.3 21.3 640
30 20.0 ×39.5 ×41.5 B32776E4306+000 14.0 7.3 28.0 2.4 22.3 640
35 28.0 ×37.0 ×42.0 10.2 B32776G4356+000 16.5 6.0 10.0 2.3 21.4 440
35 28.0 ×37.0 ×42.0 B32776E4356+000 16.0 6.4 24.0 2.4 22.6 440
40 28.0 ×37.0 ×42.0 10.2 B32776G4406+000 17.5 5.3 11.0 2.3 21.4 440
40 28.0 ×37.0 ×42.0 B32776E4406+000 17.0 5.6 26.0 2.4 22.7 440
40 43.0 ×22.0 ×41.5 20.3 B32776T4406K000 17.0 5.2 13.0 2.3 21.2 280
50 28.0 ×42.5 ×41.5 10.2 B32776G4506+000 20.0 4.3 12.0 2.3 21.7 440
50 28.0 ×42.5 ×41.5 B32776E4506+000 19.0 4.7 30.0 2.5 23.8 440
60 30.0 ×45.0 ×42.0 20.3 B32776G4606+000 23.5 3.6 14.0 2.4 22.3 400
60 30.0 ×45.0 ×42.0 B32776E4606+000 22.0 4.0 32.0 2.5 24.2 400
65 33.0 ×48.0 ×42.0 20.3 B32776G4656+000 25.5 3.3 14.0 2.3 22.2 180
VR,70 °C= 575 V DC, Vop,85 °C= 500VDC
8.5 24.0 ×15.0 ×41.5 B32776T5855+000 6.5 19.9 19.0 1.9 17.2 1040
12 24.0 ×19.0 ×41.5 B32776T5126K000 8.0 14.4 18.0 1.9 17.4 780
25 20.0 ×39.5 ×41.5 10.2 B32776G5256K000 14.0 7.0 12.0 1.9 17.5 640
25 20.0 ×39.5 ×41.5 B32776E5256K000 13.5 7.4 28.0 2.0 18.3 640
27 43.0 ×22.0 ×41.5 20.3 B32776T5276K000 15.5 6.4 14.0 1.9 17.5 280
30 28.0 ×37.0 ×42.0 10.2 B32776G5306K000 16.5 5.8 11.0 1.9 17.6 440
30 28.0 ×37.0 ×42.0 B32776E5306K000 16.5 6.1 26.0 2.0 18.5 440
35 28.0 ×42.5 ×41.5 10.2 B32776G5356+000 19.0 5.0 12.0 1.9 17.8 440
35 28.0 ×42.5 ×41.5 B32776E5356+000 18.0 5.3 29.0 2.0 19.0 440
45 30.0 ×45.0 ×42.0 20.3 B32776G5456K000 22.0 4.0 13.0 1.9 17.9 400
45 30.0 ×45.0 ×42.0 B32776E5456K000 21.0 4.4 32.0 2.1 19.7 400
50 33.0 ×48.0 ×42.0 20.3 B32776G5506K000 25.0 3.5 14.0 2.0 18.1 180
B32776
MKP DC link high density series up to 480 μF
Page8of48Please read Cautions and warnings and
Important notes at the end of this document.
1) Capacitance value measured at 1 kHz
2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT≤20 °CatΔESRtyp ≤±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Ordering codes and packing units (lead spacing 37.5 mm)
CR1)
μF
Max. dimensions
w×h×l
mm
P1
mm
Ordering code
(composition see
below)
IRMS,max2)
70 °C
10 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
ESLtyp3)
70 °C
10 kHz
nH
tan δ
1 kHz
10-3
tan δ
10 kHz
10-3
Un-
taped
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
J= ±5%
K=±10%
Packing code:
000 = untaped (lead length 6 1 mm)
VR,70 °C= 800 V DC, Vop,85 °C= 700VDC
6.8 24.0 ×15.0 ×41.5 B32776T8685+000 6.0 22.1 18.0 1.7 15.1 1040
8.5 24.0 ×19.0 ×41.5 B32776T8855+000 7.5 17.8 18.0 1.7 15.1 780
14 18.0 ×32.5 ×41.5 B32776E8146+000 10.0 11.5 23.0 1.8 16.3 720
15 20.0 ×39.5 ×41.5 10.2 B32776G8156+000 12.0 9.6 10.0 1.7 15.2 640
15 20.0 ×39.5 ×41.5 B32776E8156+000 11.5 10.3 24.0 1.7 15.7 640
20 28.0 ×37.0 ×42.0 10.2 B32776G8206+000 14.5 7.5 10.0 1.7 15.3 440
20 28.0 ×37.0 ×42.0 B32776E8206+000 14.5 7.8 24.0 1.7 15.9 440
20 43.0 ×22.0 ×41.5 20.3 B32776T8206K000 14.5 7.2 14.0 1.7 15.1 280
22 28.0 ×37.0 ×42.0 10.2 B32776G8226+000 15.5 6.8 11.0 1.7 15.3 440
22 28.0 ×37.0 ×42.0 B32776E8226+000 15.0 7.1 25.0 1.7 16.0 440
25 28.0 ×42.5 ×41.5 10.2 B32776G8256+000 17.0 6.1 11.0 1.7 15.4 440
25 28.0 ×42.5 ×41.5 B32776E8256+000 16.5 6.4 28.0 1.8 16.3 440
30 30.0 ×45.0 ×42.0 20.3 B32776G8306+000 19.5 5.1 12.0 1.7 15.6 400
30 30.0 ×45.0 ×42.0 B32776E8306+000 19.0 5.5 30.0 1.8 16.7 400
35 33.0 ×48.0 ×42.0 20.3 B32776G8356+000 22.0 4.3 14.0 1.7 15.7 180
VR,70 °C= 900 V DC, Vop,85 °C= 800VDC
524.0 ×15.0 ×41.5 B32776T9505+000 5.5 26.1 19.0 1.5 13.4 1040
7.5 24.0 ×19.0 ×41.5 B32776T9755K000 7.5 17.8 18.0 1.5 13.5 780
15 20.0 ×39.5 ×41.5 10.2 B32776G9156K000 12.5 9.1 12.0 1.5 13.6 640
15 20.0 ×39.5 ×41.5 B32776E9156K000 12.0 9.4 28.0 1.5 14.1 640
16 43.0 ×22.0 ×41.5 20.3 B32776T9166K000 14.0 8.1 14.0 1.5 13.5 280
20 28.0 ×37.0 ×42.0 10.2 B32776G9206K000 15.0 7.0 11.0 1.5 13.6 440
20 28.0 ×37.0 ×42.0 B32776E9206K000 15.0 7.3 26.0 1.6 14.2 440
22 28.0 ×42.5 ×41.5 10.2 B32776G9226K000 17.0 6.3 12.0 1.5 13.7 440
22 28.0 ×42.5 ×41.5 B32776E9226K000 16.5 6.6 29.0 1.6 14.5 440
25 30.0 ×45.0 ×42.0 20.3 B32776G9256+000 19.0 5.5 13.0 1.5 13.8 400
25 30.0 ×45.0 ×42.0 B32776E9256+000 18.5 5.9 32.0 1.6 14.7 400
30 33.0 ×48.0 ×42.0 20.3 B32776G9306+000 21.5 4.7 14.0 1.5 13.9 180
B32776
MKP DC link high density series up to 480 μF
Page9of48Please read Cautions and warnings and
Important notes at the end of this document.
1) Capacitance value measured at 1 kHz
2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT≤20 °CatΔESRtyp ≤±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Ordering codes and packing units (lead spacing 37.5 mm)
CR1)
μF
Max. dimensions
w×h×l
mm
P1
mm
Ordering code
(composition see
below)
IRMS,max2)
70 °C
10 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
ESLtyp3)
70 °C
10 kHz
nH
tan δ
1 kHz
10-3
tan δ
10 kHz
10-3
Un-
taped
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
J= ±5%
K=±10%
Packing code:
000 = untaped (lead length 6 1 mm)
VR,70 °C= 1100 V DC, Vop,85 °C= 920VDC
3.9 24.0 ×15.0 ×41.5 B32776T0395+000 5.0 30.5 18.0 1.4 12.1 1040
524.0 ×19.0 ×41.5 B32776T0505+000 6.5 23.6 18.0 1.4 12.1 780
12 20.0 ×39.5 ×41.5 10.2 B32776G0126+000 12.0 10.2 12.0 1.4 12.2 640
12 20.0 ×39.5 ×41.5 B32776E0126+000 11.5 10.5 28.0 1.4 12.6 640
13 43.0 ×22.0 ×41.5 20.3 B32776T0136K000 13.0 8.9 14.0 1.4 12.1 280
14 28.0 ×37.0 ×42.0 10.2 B32776G0146+000 13.5 8.7 21.0 1.4 12.2 440
14 28.0 ×37.0 ×42.0 B32776E0146+000 13.5 9.0 25.0 1.4 12.6 440
16 28.0 ×42.5 ×41.5 10.2 B32776G0166+000 15.5 7.4 12.0 1.4 12.3 440
16 28.0 ×42.5 ×41.5 B32776E0166+000 15.0 7.8 30.0 1.4 12.9 440
20 30.0 ×45.0 ×42.0 20.3 B32776G0206+000 18.0 6.0 14.0 1.4 12.4 400
20 30.0 ×45.0 ×42.0 B32776E0206+000 17.5 6.5 32.0 1.4 13.1 400
22 33.0 ×48.0 ×42.0 20.3 B32776G0226+000 21.0 4.9 15.0 1.3 11.4 180
VR,70 °C= 1300 V DC, Vop,85 °C=1100VDC
2.7 24.0 ×15.0 ×41.5 B32776T1275+000 5.0 34.7 19.0 1.1 9.6 1040
3.5 24.0 ×19.0 ×41.5 B32776T1355+000 6.0 27.4 18.0 1.1 9.7 780
8.0 20.0 ×39.5 ×41.5 10.2 B32776G1805+000 11.0 12.1 12.0 1.1 9.7 640
8.0 20.0 ×39.5 ×41.5 B32776E1805+000 10.5 12.4 24.0 1.2 10.0 640
9.0 43.0 ×22.0 ×41.5 20.3 B32776T1905K000 12.0 10.7 13.0 1.1 9.7 280
10 28.0 ×37.0 ×42.0 10.2 B32776G1106+000 13.0 9.6 11.0 1.1 9.7 440
10 28.0 ×37.0 ×42.0 B32776E1106+000 12.5 9.9 26.0 1.2 10.0 440
12 28.0 ×42.5 ×41.5 10.2 B32776G1126+000 14.5 8.1 12.0 1.1 9.8 440
12 28.0 ×42.5 ×41.5 B32776E1126+000 14.0 8.5 28.0 1.2 10.1 440
14 30.0 ×45.0 ×42.0 20.3 B32776G1146+000 17.0 6.8 14.0 1.1 10.1 400
14 30.0 ×45.0 ×42.0 B32776E1146+000 16.5 7.3 32.0 1.2 10.4 400
16 33.0 ×48.0 ×42.0 20.3 B32776G1166+000 19.0 6.0 15.0 1.1 9.9 180
B32776
MKP DC link high density series up to 480 μF
Page 10 of 48Please read Cautions and warnings and
Important notes at the end of this document.
1) Capacitance value measured at 1 kHz
2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT≤20 °CatΔESRtyp ≤±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Ordering codes and packing units (lead spacing 52.5 mm, P1= 20.3 mm)
CR1)
μF
Max. dimensions
w×h×l
mm
Ordering code
(composition see
below)
IRMS,max2)
70 °C
10 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
ESLtyp3)
70 °C
10 kHz
nH
tan δ
1 kHz
10-3
tan δ
10 kHz
10-3
Un-
taped
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
J= ±5%
K=±10%
Packing code:
000 = untaped (lead length 6 1 mm)
VR,70 °C= 450 V DC, Vop,85 °C= 450VDC
55 43.0 ×24.0 ×57.5 B32778T4556K000 16.5 7.2 13.0 4.3 41.7 560
75 30.0 ×45.0 ×57.5 B32778G4756+000 21.0 5.6 12.0 4.4 42.6 280
80 30.0 ×45.0 ×57.5 B32778G4806+000 21.5 5.3 13.0 4.4 42.7 280
100 35.0 ×50.0 ×57.5 B32778G4107+000 26.0 4.3 14.0 4.5 43.3 108
110 35.0 ×50.0 ×57.5 B32778G4117K000 27.0 3.9 15.0 4.5 43.6 108
150 130.0 ×24.0 ×57.5 B32778J4157K000 43.5 2.7 4.0 4.4 42.1 80
170 45.0 ×57.0 ×57.5 B32778G4177+000 36.5 2.6 17.0 4.6 45.7 140
180 60.0 ×45.0 ×57.5 B32778G4187+000 39.0 2.5 19.0 4.6 44.6 200
480 130.0 ×58.0 ×57.5 B32778J4487K000 79.5 0.9 6.0 4.8 45.4 40
VR,70 °C= 575 V DC, Vop,85 °C= 500VDC
40 43.0 ×24.0 ×57.5 B32778T5406K000 15.5 8.5 13.0 3.6 34.5 560
60 30.0 ×45.0 ×57.5 B32778G5606+000 20.5 5.8 13.0 3.7 35.3 280
80 35.0 ×50.0 ×57.5 B32778G5806+000 25.5 4.4 15.0 3.7 36.0 108
110 130.0 ×24.0 ×57.5 B32778J5117K000 40.5 3.0 5.0 3.6 34.5 80
120 45.0 ×57.0 ×57.5 B32778G5127+000 34.5 3.1 17.0 3.8 37.2 140
130 60.0 ×45.0 ×57.5 B32778G5137+000 36.5 2.8 19.0 3.8 36.7 200
360 130.0 ×58.0 ×57.5 B32778J5367K000 75.0 1.0 6.0 4.0 37.3 40
VR,70 °C= 800 V DC, Vop,85 °C= 700VDC
30 43.0 ×24.0 ×57.5 B32778T8306K000 14.5 9.8 14.0 3.2 30.2 560
45 30.0 ×45.0 ×57.5 B32778G8456+000 19.5 6.6 14.0 3.2 30.9 280
50 30.0 ×45.0 ×57.5 B32778G8506+000 20.0 6.3 13.0 3.2 30.9 280
55 35.0 ×50.0 ×57.5 B32778G8556+000 23.0 5.6 14.0 3.2 31.1 108
60 35.0 ×50.0 ×57.5 B32778G8606+000 23.5 5.1 15.0 3.3 31.2 108
80 130.0 ×24.0 ×57.5 B32778J8806K000 37.5 3.6 4.0 3.2 30.2 80
90 45.0 ×57.0 ×57.5 B32778G8906+000 32.5 3.5 17.0 3.3 32.2 140
100 60.0 ×45.0 ×57.5 B32778G8107+000 34.5 3.2 19.0 3.3 31.9 200
270 130.0 ×58.0 ×57.5 B32778J8277K000 70.5 1.2 6.0 3.5 32.4 40
B32778
MKP DC link high density series up to 480 μF
Page 11 of 48Please read Cautions and warnings and
Important notes at the end of this document.
1) Capacitance value measured at 1 kHz
2) Max ripple current IRMS at 70 °C, 10 kHz for ΔT≤20 °CatΔESRtyp ≤±5%
3) Typical ESL value measured at resonance frequency (see specific graphs of Z versus frequency)
Ordering codes and packing units (lead spacing 52.5 mm, P1= 20.3 mm)
CR1)
μF
Max. dimensions
w×h×l
mm
Ordering code
(composition see
below)
IRMS,max2)
70 °C
10 kHz
A
ESRtyp
70 °C
10 kHz
mΩ
ESLtyp3)
70 °C
10 kHz
nH
tan δ
1 kHz
10-3
tan δ
10 kHz
10-3
Un-
taped
pcs./
MOQ
MOQ = Minimum Order Quantity, consisting of 4 packing units.
Intermediate capacitance values are available on request.
Composition of ordering code
+ = Capacitance tolerance code:
J= ±5%
K=±10%
Packing code:
000 = untaped (lead length 6 1 mm)
VR,70 °C= 900 V DC, Vop,85 °C= 800VDC
25 43.0 ×24.0 ×57.5 B32778T9256K000 13.5 10.7 13.0 2.8 26.8 560
35 30.0 ×45.0 ×57.5 B32778G9356+000 18.0 7.7 13.0 2.9 27.3 280
50 35.0 ×50.0 ×57.5 B32778G9506K000 22.5 5.6 15.0 2.9 27.7 108
70 45.0 ×57.0 ×57.5 B32778G9706+000 31.0 3.8 18.0 3.0 28.5 140
70 130.0 ×24.0 ×57.5 B32778J9706K000 36.0 3.8 4.0 2.9 27.2 80
75 60.0 ×45.0 ×57.5 B32778G9756+000 32.5 3.6 20.0 2.9 28.2 200
210 130.0 ×58.0 ×57.5 B32778J9217K000 66.0 1.3 6.0 3.1 28.6 40
VR,70 °C= 1100 V DC, Vop,85 °C= 920VDC
20 43.0 ×24.0 ×57.5 B32778T0206K000 13.0 11.9 13.0 2.6 24.1 560
30 30.0 ×45.0 ×57.5 B32778G0306+000 17.5 8.2 13.0 2.6 24.5 280
40 35.0 ×50.0 ×57.5 B32778G0406+000 21.5 6.2 15.0 2.7 25.9 108
58 45.0 ×57.0 ×57.5 B32778G0586+000 29.0 4.3 17.0 2.7 25.4 140
60 60.0 ×45.0 ×57.5 B32778G0606+000 30.5 4.0 19.0 2.7 25.2 200
60 130.0 ×24.0 ×57.5 B32778J0606K000 34.5 4.1 4.0 2.7 25.1 80
200 130.0 ×58.0 ×57.5 B32778J0207K000 66.0 1.4 6.0 3.0 26.8 40
VR,70 °C= 1300 V DC, Vop,85 °C=1100VDC
14 43.0 ×24.0 ×57.5 B32778T1146K000 12.0 13.8 13.0 2.1 19.5 560
20 30.0 ×45.0 ×57.5 B32778G1206+000 16.0 9.7 13.0 2.1 19.8 280
25 35.0 ×50.0 ×57.5 B32778G1256+000 19.0 7.8 15.0 2.1 19.9 108
27 35.0 ×50.0 ×57.5 B32778G1276+000 19.5 7.3 15.0 2.1 20.0 108
38 130.0 ×24.0 ×57.5 B32778J1386K000 31.5 5.1 4.0 2.1 19.5 80
40 45.0 ×57.0 ×57.5 B32778G1406+000 26.5 5.0 17.0 2.2 20.3 140
42 60.0 ×45.0 ×57.5 B32778G1426+000 28.0 4.7 19.0 2.2 20.2 200
120 130.0 ×58.0 ×57.5 B32778J1127K000 58.5 1.7 6.0 2.3 20.5 40
B32778
MKP DC link high density series up to 480 μF
Page 12 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Technical data
Reference standard: IEC 61071:2007. All data given atT=20°C, unless otherwise specified.
Operating temperature range (case) Max. operating temperature, Top,max
Upper category temperature Tmax
Lower category temperature Tmin
+105 °C
+105 °C
–40 °C
Insulation resistance Rins
given as time constant
τ=C
RRins, rel. humidity ≤65%
(minimum as-delivered values)
τ> 10 000 s (after 1 min.)
For VR≥500 V measured at 500 V
For VR< 500 V measured at VR
DC test voltage between terminals (10 s) 1.5 VR
Voltage test terminal to case (10 s) 2110 V AC, 50 Hz
Pulse Handling Capability (V/μs) IP(A)/C(μF)
Reliability: Failure rate λ10 fit (≤110-9/h) at 0.5 VR,40°C
For conversion to other operating conditions and
temperatures, refer to chapter "Quality, 2 Reliability".
Service life tSL 100 000 h at VRand 70 °C
VR(V DC) 450 575 800 900 1100 1300
Continuous operation voltage
Vop (V DC) at 70 °C 450 575 800 900 1100 1300
Continuous operation voltage
Vop (V DC) at 85 °C 450 500 700 800 920 1100
For temperatures between
85 °C and 105 °C1.33%/°CofV
op derating compared to Vop at 85 °C
Typical waveforms
Restrictions:
VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which
the capacitor has been designed for continuous operation.
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 13 of 48Please read Cautions and warnings and
Important notes at the end of this document.
AC ≤0.2 VR
Overvoltage Maximum duration within one day Observation
1.1 VR
1.15 VR
1.2 VR
1.3 VR
30% of on-load duration
30 min.
5 min.
1 min.
System regulation
System regulation
System regulation
System regulation
NOTE 1 An overvoltage equal to 1.5 VRfor 30 ms is permitted 1000 times during the life of the
capacitor.
The amplitudes of the overvoltages that may be tolerated without significant reduction in the life
time of the capacitor depend on their duration, the number of application and the capacitor
temperature.
In addition these values assume that the overvoltages may appear when the internal temperature
of the capacitor is less than 0 °C but within the temperature category.
NOTE 2 The average applied voltage must not be higher than the specified voltage.
Pulse handling capability
"dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal
voltages, expressed in V/μs.
Note:
The values of dV/dt provided below must not be exceeded in order to avoid damaging the
capacitor.
dV/dt values
Lead spacing 27.5 mm 37.5 mm 52.5 mm
Type B32774 B32776 B32778
VR(V DC) 450 800 1100 1300 450 575 800 900 1100 1300 450 575 800 900 1100 1300
dV/dt in V/μs 30 40 75 100 21 22 22 35 54 73 14 14 15 22 35 50
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 14 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
(typical values)
Lead spacing 27.5 mm
450VDC
ESR versus frequency f
(typical values)
Lead spacing 27.5 mm
450VDC
Impedance Z versus frequency f
(typical values)
Lead spacing 27.5 mm
800VDC
ESR versus frequency f
(typical values)
Lead spacing 27.5 mm
800VDC
B32774
MKP DC link high density series up to 480 μF
Page 15 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Additional technical information can be found under "Design support" on www.epcos.com.
Impedance Z versus frequency f
(typical values)
Lead spacing 27.5 mm
1100 V DC
ESR versus frequency f
(typical values)
Lead spacing 27.5 mm
1100 V DC
Impedance Z versus frequency f
(typical values)
Lead spacing 27.5 mm
1300 V DC
ESR versus frequency f
(typical values)
Lead spacing 27.5 mm
1300 V DC
B32774
MKP DC link high density series up to 480 μF
Page 16 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
450VDC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
450VDC
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
450VDC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
450VDC
B32776
MKP DC link high density series up to 480 μF
Page 17 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
575VDC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
575VDC
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
575VDC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
575VDC
B32776
MKP DC link high density series up to 480 μF
Page 18 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
B32776E8*/800 V DC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
B32776E8*/800 V DC
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
800VDC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
800VDC
B32776
MKP DC link high density series up to 480 μF
Page 19 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
900VDC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
900VDC
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
900VDC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
900VDC
B32776
MKP DC link high density series up to 480 μF
Page 20 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
1100 V DC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
1100 V DC
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
1100 V DC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
1100 V DC
B32776
MKP DC link high density series up to 480 μF
Page 21 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
1300 V DC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
1300 V DC
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm
1300 V DC
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm
1300 V DC
B32776
MKP DC link high density series up to 480 μF
Page 22 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm (low profile, 2 pins)
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm (low profile, 2 pins)
Impedance Z versus frequency f
(typical values)
Lead spacing 37.5 mm (low profile, 4 pins)
ESR versus frequency f
(typical values)
Lead spacing 37.5 mm (low profile, 4 pins)
B32776
MKP DC link high density series up to 480 μF
Page 23 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 52.5 mm
450VDC
ESR versus frequency f
(typical values)
Lead spacing 52.5 mm
450VDC
Impedance Z versus frequency f
(typical values)
Lead spacing 52.5 mm
575VDC
ESR versus frequency f
(typical values)
Lead spacing 52.5 mm
575VDC
B32778
MKP DC link high density series up to 480 μF
Page 24 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 52.5 mm
800VDC
ESR versus frequency f
(typical values)
Lead spacing 52.5 mm
800VDC
Impedance Z versus frequency f
(typical values)
Lead spacing 52.5 mm
900VDC
ESR versus frequency f
(typical values)
Lead spacing 52.5 mm
900VDC
B32778
MKP DC link high density series up to 480 μF
Page 25 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 52.5 mm
B32778G0*/1100 V DC
ESR versus frequency f
(typical values)
Lead spacing 52.5 mm
B32778G0*/1100 V DC
Impedance Z versus frequency f
(typical values)
Lead spacing 52.5 mm
1300 V DC
ESR versus frequency f
(typical values)
Lead spacing 52.5 mm
1300 V DC
B32778
MKP DC link high density series up to 480 μF
Page 26 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Impedance Z versus frequency f
(typical values)
Lead spacing 52.5 mm (low profile)
ESR versus frequency f
(typical values)
Lead spacing 52.5 mm (low profile)
Impedance Z versus frequency f
(typical values)
Lead spacing 52.5 mm (12 pins)
ESR versus frequency f
(typical values)
Lead spacing 52.5 mm (12 pins)
B32778
MKP DC link high density series up to 480 μF
Page 27 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Permissible current IRMS versus frequency f at 70 °C
Lead spacing 27.5 mm
B32774D*
B32774
MKP DC link high density series up to 480 μF
Page 28 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Permissible current IRMS versus frequency f at 70 °C
Lead spacing 37.5 mm
B32776E*
B32776G*
B32776
MKP DC link high density series up to 480 μF
Page 29 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Permissible current IRMS versus frequency f at 70 °C
Lead spacing 37.5 mm
B32776T*
B32776
MKP DC link high density series up to 480 μF
Page 30 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Permissible current IRMS versus frequency f at 70 °C
Lead spacing 52.5 mm
B32778G* (4 pins)
B32778T* (4 pins)
B32778
MKP DC link high density series up to 480 μF
Page 31 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Characteristics curves
Permissible current IRMS versus frequency f at 70 °C
Lead spacing 52.5 mm
B32778J* (12 pins)
B32778
MKP DC link high density series up to 480 μF
Page 32 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Curves characteristics (IRMS derating versus temperature)
Maximum IRMS current as function of the ambient temperature: IRMS (TA) = Factor ×IRMS (70 °C)
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 33 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Heat transference for self heating calculation
Figure 1
Box dimensions Equivalent heat
coefficient
w (mm) h (mm) l (mm) G (mW/°C)
11.0 19.0 31.5 25
11.0 21.0 31.5 28
12.5 21.5 31.5 30
13.5 23.0 31.5 32
14.0 24.5 31.5 35
15.0 24.5 31.5 36
16.0 32.0 31.5 45
18.0 27.5 31.5 44
18.0 33.0 31.5 48
19.0 30.0 31.5 48
20.0 11.0 31.5 65
21.0 31.0 31.5 51
22.0 36.5 31.5 58
12.0 22.0 41.5 70
14.0 25.0 41.5 43
16.0 28.5 41.5 50
18.0 32.5 41.5 59
20.0 39.5 41.5 72
24.0 19.0 41.5 50
24.0 15.0 41.5 44
28.0 37.0 42.0 83
28.0 42.5 41.5 90
30.0 45.0 42.0 100
33.0 48.0 42.0 100
43.0 22.0 41.5 80
30.0 45.0 57.5 125
35.0 50.0 57.5 145
43.0 24.0 57.5 103
45.0 57.0 57.5 185
60.0 45.0 57.5 192
130.0 24.0 57.5 200
130.0 58.0 57.5 300
The equivalent heat coefficient "G (mW/ºC)" is given for measuring the temperature on the lateral
surface of the plastic box as figure1 shows. By using a thermocouple and avoiding effect of
radiation and convection the temperature measured during operation conditions should be a
result of the dissipated power divided by the equivalent heat coefficient.
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 34 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Self Heating by power dissipation & equivalent heat coefficient
The IRMS and consequently the power dissipation must be limited during operation in order to not
exceed the maximum limit of ΔT allowed for this series. ΔTmax given for this series is equal or
lower than 20 °C at rated temperature (70 °C), for higher ambient temperatures ΔTmax (T) will have
the same derating factor than IRMS versus temperature and then an equivalent derating as per:
ambient temperatures ΔTmax (T) will have the same derating factor than IRMS versus temperature
and then an equivalent derating as per:
ΔTmax (T) = (Factor)2×ΔT (70 °C).
For any particular IRMS the ΔT may be calculated by:
ΔT(°C)=P
dis (mW) / G(mW/°C).
Where ΔT(°C) is the difference between the temperature measured on the box (see figure 1) and
the ambient temperature when capacitor is working during normal operation;
ΔT(°C)=T
op (°C) TA(°C).
It represents the increasing of temperature provoked by the IRMS during operation.
G (mW/°C) is the equivalent heat coefficient described above and Pdis (mW) is the dissipated
power defined by:
Pdis (mW) = ESRtyp (mΩ)×Irms2(ARMS).
Example for thermal calculation:
We will take as reference B32778G0306K (30 μF/1100 V) type for thermal calculation.
Considering the following load and capacitor characteristics:
IRMS :12A
RMS at 20 kHz TA:85°C30×45 ×57.5 box
G (mW/°C): 125
Then we have to find the ESRtyp at 20 kHz what is approx . 8.2 mΩ.
So according to:
Pdis (mW) = ESRtyp (mΩ)×Irms2(ARMS)
we have the following:
Pdis (mW) = 8.2 mΩ×12 ARMS2= 1181 mW
and as per:
ΔT(°C)=P
dis (mW) / G (mW/°C)
we have the following:
ΔT(°C) = 1181 (mW) / 125 (mW/°C) = 9.5 °C.
What is below of the
ΔTmax (85 °C) = (Factor)2×ΔT (70 °C) = (0.7)2×20 °C=9.8°C.
On the other hand we may confirm that max IRMS at 20 kHz at 70 °C = 17.5 ARMS
And then max IRMS for 85 °C of ambient temperature is defined as follows:
IRMS (85 °C) = Factor ×IRMS (70 °C) = 0.7 ×17.5 ARMS = 12.25 ARMS.
What confirms once again that IRMS (12 ARMS at 20 kHz) is below the max specified for such
frequency and ambient temperature.
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 35 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Life time expectancy - typical curves
B3277x-4 (450 V DC)
B3277x-5/8/9/0/1 (575 V DC / 800 V DC / 900 V DC / 1100 V DC / 1300 V DC )
Note: Confidence level of 95%
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 36 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Testing and Standards
Test Reference Conditions of test Performance
requirements
Electrical
parameters
(Routine test)
IEC61071:2007 Voltage between terminals,
1.5 VR, during 10 s
Insulation resistance, Rins at
VRif VR<500Vor
500VifV
R≥500 V
Capacitance, C at 1 kHz
(room temperature)
Dissipation factor, tan δat
1/10 kHz (room temperature)
Within specified limits
Robustness
of termina-
tions
(Type test)
IEC 60068-2-21-2006 Tensile strength (test Ua1) Capacitance and tan δ
within specified limits
Wire diameter Tensile
force
0.5 < d1≤0.8 mm
0.8 < d1≤1.25 mm
10 N
20 N
Resistance to
soldering
heat
(Type test)
IEC 60068-2-20:2008,
test Tb,
method 1A
Solder bath temperature at
260 ±5°C, immersion for
10 seconds
ΔC/C0≤2%
Δtan δ≤0.002
Rapid
change of
temperature
(Type test)
IEC 60384-16:2005 TA= lower category temperature
TB= upper category temperature
Five cycles, duration t = 30 min.
ΔC/C0≤2%
Δtan δ≤0.002
Rins ≥50% of initial limit
Vibration
(Type test)
IEC 60384-16:2005 Test FC: vibration sinusoidal
Displacement: 0.75 mm
Accleration: 98 m/s2
Frequency: 10 Hz ... 500 Hz
Test duration: 3 orthogonal axes,
2 hours each axe
No visible damage
Bump
(Type test)
IEC 60384-16:2005 Test Eb: Total 4000 bumps with
390 m/s2mounted on PCB
6 ms duration
No visible damage
ΔC/C0≤2%
Δtan δ≤0.002
Rins ≥50% of initial limit
Climatic
sequence
(Type test)
IEC 60384-16:2005 Dry heat Tb / 16 h
Damp heat cyclic, 1st cycle
+55 °C / 24 h / 95% ... 100% RH
Cold Ta/2h
Damp heat cyclic, 5 cycles
+55 °C / 24 h / 95% ... 100% RH
No visible damage
ΔC/C0≤3%
Δtan δ≤0.001
Rins ≥50% of initial limit
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 37 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Test Reference Conditions of test Performance
requirements
Damp heat,
steady state
(Type test)
IEC 60384-16:2005 Test Ca
40 °C / 93% RH / 56 days
No visible damage
ΔC/C0≤5%
Δtan δ≤0.005
Rins ≥50% of initial limit
Endurance
(Type test)
IEC 60384-16:2005 70 °C / 1.25 VR/ 1000 hours or
85 °C / 1.25 Vop / 1000 hours or
100 °C / 1.25 Vop / 1000 hours
No visible damage
ΔC/C0≤5% at 1 kHz
Δtan δ≤0.005
Rins ≥50% of initial limit
Mounting guidelines
1 Soldering
1.1 Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1.
Before a solderability test is carried out, terminals are subjected to accelerated ageing (to
IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 °C). Since the ageing temperature is far
higher than the upper category temperature of the capacitors, the terminal wires should be cut off
from the capacitor before the ageing procedure to prevent the solderability being impaired by the
products of any capacitor decomposition that might occur.
Solder bath temperature 235 ±5°C
Soldering time 2.0 ±0.5 s
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Evaluation criteria:
Visual inspection Wetting of wire surface by new solder ≥90%,
free-flowing solder
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 38 of 48Please read Cautions and warnings and
Important notes at the end of this document.
1.2 Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1.
Conditions:
Series Solder bath temperature Soldering time
MKT boxed (except 2.5 ×6.5 ×7.2 mm)
coated
uncoated (lead spacing >10 mm)
260 ±5°C 10 ±1s
MFP
MKP (lead spacing >7.5 mm)
MKT boxed (case 2.5 ×6.5 ×7.2 mm) 5±1s
MKP
MKT
(lead spacing ≤7.5 mm)
uncoated (lead spacing ≤10 mm)
insulated (B32559)
<4 s
recommended soldering
profile for MKT uncoated
(lead spacing ≤10 mm) and
insulated (B32559)
Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane
Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between
capacitor body and liquid solder
Evaluation criteria:
Visual inspection No visible damage
ΔC/C0
2% for MKT/MKP/MFP
5% for EMI suppression capacitors
tan δAs specified in sectional specification
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 39 of 48Please read Cautions and warnings and
Important notes at the end of this document.
1.3 General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper cate-
gory temperature Tmax. Long exposure to temperatures above this type-related temperature limit
can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical
characteristics. For short exposures (as in practical soldering processes) the heat load (and thus
the possible effects on a capacitor) will also depend on other factors like:
Pre-heating temperature and time
Forced cooling immediately after soldering
Terminal characteristics:
diameter, length, thermal resistance, special configurations (e.g. crimping)
Height of capacitor above solder bath
Shadowing by neighboring components
Additional heating due to heat dissipation by neighboring components
Use of solder-resist coatings
The overheating associated with some of these factors can usually be reduced by suitable coun-
termeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced
cooling process may possibly have to be included.
EPCOS recommendations
As a reference, the recommended wave soldering profile for our film capacitors is as follows:
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 40 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Body temperature should follow the description below:
MKP capacitor
During pre-heating: Tp≤110 °C
During soldering: Ts≤120 °C, ts≤45 s
MKT capacitor
During pre-heating: Tp≤125 °C
During soldering: Ts≤160 °C, ts≤45 s
When SMD components are used together with leaded ones, the film capacitors should not pass
into the SMD adhesive curing oven. The leaded components should be assembled after the SMD
curing step.
Leaded film capacitors are not suitable for reflow soldering.
In order to ensure proper conditions for manual or selective soldering, the body temperature of
the capacitor (Ts) must be ≤120 °C.
One recommended condition for manual soldering is that the tip of the soldering iron should
be <360 °C and the soldering contact time should be no longer than 3 seconds.
For uncoated MKT capacitors with lead spacings ≤10 mm (B32560/B32561) the following mea-
sures are recommended:
pre-heating to not more than 110 °C in the preheater phase
rapid cooling after soldering
Please refer to EPCOS Film Capacitor Data Book in case more details are needed.
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 41 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Cautions and warnings
Do not exceed the upper category temperature (UCT).
Do not apply any mechanical stress to the capacitor terminals.
Avoid any compressive, tensile or flexural stress.
Do not move the capacitor after it has been soldered to the PC board.
Do not pick up the PC board by the soldered capacitor.
Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified
lead spacing.
Do not exceed the specified time or temperature limits during soldering.
Avoid external energy inputs, such as fire or electricity.
Avoid overload of the capacitors.
Consult us if application is with severe temperature and humidity condition.
There are no serviceable or repairable parts inside the capacitor. Opening the capacitor or
any attempts to open or repair the capacitor will void the warranty and liability of EPCOS.
Please note that the standards referred to in this publication may have been revised in the
meantime.
The table below summarizes the safety instructions that must always be observed. A detailed de-
scription can be found in the relevant sections of the chapters "General technical information" and
"Mounting guidelines".
Topic Safety information Reference chapter
"General technical
information"
Storage
conditions
Make sure that capacitors are stored within the specified
range of time, temperature and humidity conditions.
4.5
"Storage conditions"
Flammability Avoid external energy, such as fire or electricity (passive
flammability), avoid overload of the capacitors (active
flammability) and consider the flammability of materials.
5.3
"Flammability"
Resistance to
vibration
Do not exceed the tested ability to withstand vibration.
The capacitors are tested to IEC 60068-2-6:2007.
EPCOS offers film capacitors specially designed for
operation under more severe vibration regimes such as
those found in automotive applications. Consult our
catalog "Film Capacitors for Automotive Electronics".
5.2
"Resistance to
vibration"
Topic Safety information Reference chapter
"Mounting guidelines"
Soldering Do not exceed the specified time or temperature limits
during soldering.
1 "Soldering"
Cleaning Use only suitable solvents for cleaning capacitors. 2 "Cleaning"
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 42 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Topic Safety information Reference chapter
"Mounting guidelines"
Embedding of
capacitors in
finished
assemblies
When embedding finished circuit assemblies in plastic
resins, chemical and thermal influences must be taken
into account.
Caution: Consult us first, if you also wish to embed other
uncoated component types!
3 "Embedding of
capacitors in finished
assemblies"
Display of ordering codes for EPCOS products
The ordering code for one and the same product can be represented differently in data sheets,
data books, other publications and the website of EPCOS, or in order-related documents such as
shipping notes, order confirmations and product labels. The varying representations of the or-
dering codes are due to different processes employed and do not affect the specifications
of the respective products. Detailed information can be found on the Internet under
www.epcos.com/orderingcodes.
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 43 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Symbols and terms
Symbol English German
αHeat transfer coefficient Wärmeübergangszahl
αCTemperature coefficient of capacitance Temperaturkoeffizient der Kapazität
ACapacitor surface area Kondensatoroberfläche
βCHumidity coefficient of capacitance Feuchtekoeffizient der Kapazität
CCapacitance Kapazität
CRRated capacitance Nennkapazität
ΔCAbsolute capacitance change Absolute Kapazitätsänderung
ΔC/C Relative capacitance change (relative
deviation of actual value)
Relative Kapazitätsänderung (relative
Abweichung vom Ist-Wert)
ΔC/CRCapacitance tolerance (relative deviation
from rated capacitance)
Kapazitätstoleranz (relative Abweichung
vom Nennwert)
dt Time differential Differentielle Zeit
ΔtTime interval Zeitintervall
ΔTAbsolute temperature change
(self-heating)
Absolute Temperaturänderung
(Selbsterwärmung)
Δtan δAbsolute change of dissipation factor Absolute Änderung des Verlustfaktors
ΔVAbsolute voltage change Absolute Spannungsänderung
dV/dt Time differential of voltage function (rate
of voltage rise)
Differentielle Spannungsänderung
(Spannungsflankensteilheit)
ΔV/ΔtVoltage change per time interval Spannungsänderung pro Zeitintervall
EActivation energy for diffusion Aktivierungsenergie zur Diffusion
ESL Self-inductance Eigeninduktivität
ESR Equivalent series resistance Ersatz-Serienwiderstand
fFrequency Frequenz
f1Frequency limit for reducing permissible
AC voltage due to thermal limits
Grenzfrequenz für thermisch bedingte
Reduzierung der zulässigen
Wechselspannung
f2Frequency limit for reducing permissible
AC voltage due to current limit
Grenzfrequenz für strombedingte
Reduzierung der zulässigen
Wechselspannung
frResonant frequency Resonanzfrequenz
FDThermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur
Diffusion
FTDerating factor Deratingfaktor
iCurrent (peak) Stromspitze
ICCategory current (max. continuous
current)
Kategoriestrom (max. Dauerstrom)
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 44 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
IRMS (Sinusoidal) alternating current,
root-mean-square value
(Sinusförmiger) Wechselstrom
izCapacitance drift Inkonstanz der Kapazität
k0Pulse characteristic Impulskennwert
LSSeries inductance Serieninduktivität
λFailure rate Ausfallrate
λ0Constant failure rate during useful
service life
Konstante Ausfallrate in der
Nutzungsphase
λtest Failure rate, determined by tests Experimentell ermittelte Ausfallrate
Pdiss Dissipated power Abgegebene Verlustleistung
Pgen Generated power Erzeugte Verlustleistung
QHeat energy Wärmeenergie
ρDensity of water vapor in air Dichte von Wasserdampf in Luft
RUniversal molar constant for gases Allg. Molarkonstante für Gas
ROhmic resistance of discharge circuit Ohmscher Widerstand des
Entladekreises
RiInternal resistance Innenwiderstand
Rins Insulation resistance Isolationswiderstand
RPParallel resistance Parallelwiderstand
RSSeries resistance Serienwiderstand
Sseverity (humidity test) Schärfegrad (Feuchtetest)
tTime Zeit
TTemperature Temperatur
τTime constant Zeitkonstante
tan δDissipation factor Verlustfaktor
tan δDDielectric component of dissipation
factor
Dielektrischer Anteil des Verlustfaktors
tan δPParallel component of dissipation factor Parallelanteil des Verlfustfaktors
tan δSSeries component of dissipation factor Serienanteil des Verlustfaktors
TATemperature of the air surrounding the
component
Temperatur der Luft, die das Bauteil
umgibt
Tmax Upper category temperature Obere Kategorietemperatur
Tmin Lower category temperature Untere Kategorietemperatur
tOL Operating life at operating temperature
and voltage
Betriebszeit bei Betriebstemperatur und
-spannung
Top Operating temperature, TA+ΔT Beriebstemperatur, TA+ΔT
TRRated temperature Nenntemperatur
Tref Reference temperature Referenztemperatur
tSL Reference service life Referenz-Lebensdauer
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 45 of 48Please read Cautions and warnings and
Important notes at the end of this document.
Symbol English German
VAC AC voltage Wechselspannung
VCCategory voltage Kategoriespannung
VC,RMS Category AC voltage (Sinusförmige)
Kategorie-Wechselspannung
VCD Corona-discharge onset voltage Teilentlade-Einsatzspannung
Vch Charging voltage Ladespannung
VDC DC voltage Gleichspannung
VFB Fly-back capacitor voltage Spannung (Flyback)
ViInput voltage Eingangsspannung
VoOutput voltage Ausgangssspannung
Vop Operating voltage Betriebsspannung
VpPeak pulse voltage Impuls-Spitzenspannung
Vpp Peak-to-peak voltage Impedance Spannungshub
VRRated voltage Nennspannung
RAmplitude of rated AC voltage Amplitude der Nenn-Wechselspannung
VRMS (Sinusoidal) alternating voltage,
root-mean-square value
(Sinusförmige) Wechselspannung
VSC S-correction voltage Spannung bei Anwendung "S-correction"
Vsn Snubber capacitor voltage Spannung bei Anwendung
"Beschaltung"
ZImpedance Scheinwiderstand
Lead spacing Rastermaß
B32774 ... B32778
MKP DC link high density series up to 480 μF
Page 46 of 48Please read Cautions and warnings and
Important notes at the end of this document.
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical re-
quirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application.
As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar
with them than the customers themselves. For these reasons, it is always ultimately incum-
bent on the customer to check and decide whether an EPCOS product with the properties de-
scribed in the product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or
failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in
which the malfunction or failure of an electronic component could endanger human life or
health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by
means of suitable design of the customer application or other action taken by the customer
(e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by
third parties in the event of malfunction or failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Ma-
terial Data Sheets on the Internet (www.epcos.com/material). Should you have any more de-
tailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order. We also
reserve the right to discontinue production and delivery of products. Consequently, we
cannot guarantee that all products named in this publication will always be available. The
aforementioned does not apply in the case of individual agreements deviating from the fore-
going for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current ver-
sion of the "General Terms of Delivery for Products and Services in the Electrical In-
dustry" published by the German Electrical and Electronics Industry Association
(ZVEI).
Important notes
Page 47 of 48
7. Our manufacturing sites serving the automotive business apply the IATF 16949
standard. The IATF certifications confirm our compliance with requirements regarding the
quality management system in the automotive industry. Referring to customer requirements
and customer specific requirements (“CSR”) TDK always has and will continue to have the
policy of respecting individual agreements. Even if IATF 16949 may appear to support the
acceptance of unilateral requirements, we hereby like to emphasize that only requirements
mutually agreed upon can and will be implemented in our Quality Management System.
For clarification purposes we like to point out that obligations from IATF 16949 shall only
become legally binding if individually agreed upon.
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP,
CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD,
MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine,
PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,
ThermoFuse, WindCap are trademarks registered or pending in Europe and in other coun-
tries. Further information will be found on the Internet at www.epcos.com/trademarks.
Release 2018-06
Important notes
Page 48 of 48
