PMLL4153,135 - NXP - Datasheet.Directory

1. Product profile

1.1 General description

High-speed switching diode fabricated in planar technology, and encapsulated in a small

hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package.

1.2 Features and benefits

High switching speed: max. 4 ns

General application

Reverse voltage: max. 50 V

Repetitive peak reverse voltage: max. 75 V

Repetitive peak forward curre nt: max. 450 mA

Small hermetically sealed glass SMD package

1.3 Applications

High-speed switching

Military and industrial applications

1.4 Quick reference data

[1] Device mounted on an FR4 Printed-Circuit Board (PCB).

2. Pinning information

[1] The marking band indicates the cathode.

PMLL4153

High-speed diode

Rev. 3 — 19 August 2010 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

IFforward current [1] --200mA

VRreverse voltage - - 50 V

VFforward voltage IF=50mA 740 - 880 mV

Ta ble 2. Pin nin g

Pin Description Simplified outline Graphic symbol

1 cathode [1]

2 anode ka

006aab04

Product data sheet Rev. 3 — 19 August 2010 2 of 10

NXP Semiconductors PMLL4153

High-speed diode

3. Ordering information

4. Marking

5. Limiting values

[1] Device mounted on an FR4 PCB.

[2] Tj=25°C prior to surge.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB.

Table 3. Ordering i nformation

Type number Package

Name Description Version

PMLL4153 - hermetically sealed glass surface-mounted package;

2 connectors SOD80C

Table 4. Marking codes

Type number Marking code

PMLL4153 marking band

Ta ble 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRRM repetitive peak reverse

voltage -75V

VRreverse voltage - 50 V

IFforward current [1] -200mA

IFRM repetitive peak forward

current -450mA

IFSM non-repetitive peak

forward current square wave [2]

tp=1μs-4A

tp=1ms - 1 A

tp=1s - 0.5 A

Ptot total power dissipation Tamb ≤25 °C[1] -500mW

Tjjunction temperature - 200 °C

Tstg storage temperature −65 +200 °C

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-t) thermal resistance from

junction to tie-point - - 300 K/W

Rth(j-a) thermal resistance from

junction to ambient in free air [1] - - 350 K/W

Product data sheet Rev. 3 — 19 August 2010 3 of 10

NXP Semiconductors PMLL4153

High-speed diode

7. Characteristics

[1] When switched from IF= 10 mA to IR=10mA; R

L= 100 Ω; measured at IR=1mA.

[2] When switched from IF= 10 mA to IR=60mA; R

L= 100 Ω; measured at IR=1mA.

[3] When switched to IF= 200 mA; tr= 0.4 ns; measured at VF=1V.

Ta ble 7. Characteristics

Tj=25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF= 0.1 mA 490 - 550 mV

IF= 0.25 mA 530 - 590 mV

IF= 1 mA 590 - 670 mV

IF= 2 mA 620 - 700 mV

IF= 10 mA 700 - 810 mV

IF= 50 mA 740 - 880 mV

IRreverse current VR=50V --0.05μA

VR=50V; T

j= 150 °C --50μA

Cddiode capacitance VR=0V; f=1MHz --2pF

trr reverse recovery time [1] --4ns

[2] --2ns

tfr forward recovery time [3] --10ns

Device mounted on an FR4 Printed-Circuit Board (PCB). (1) Tj= 175 °C; typical values

(2) Tj=25°C; typical values

(3) Tj=25°C; maximum values

Fig 1. Forward current as a function of ambient

temperature; derating curve Fig 2. Forward current as a function of forward

voltage

0 100 200

300

200

100

mbg451

Tamb (°C)

(mA)

012

600

200

400

mbg464

VF (V)

(mA)

(1) (2) (3)

Product data sheet Rev. 3 — 19 August 2010 4 of 10

NXP Semiconductors PMLL4153

High-speed diode

Based on square wave currents.

Tj=25°C prior to surge

Fig 3. No n-repetitive peak forward current as a function of pulse duration; maximum values

(1) VR= 75 V; maximum values

(2) VR= 75 V; typical values

(3) VR= 20 V; typical values

f=1MHz; T

j=25°C

Fig 4. Reverse current as a func tion of junction

temperature Fig 5. Diode capacitance as a function of reverse

voltage; typical values

mbg704

102

IFSM

(A)

10−1

tp (μs)

110

103

10 102

0 100 Tj (°C) 200

103

102

10−1

10−2

10 (1) (2)

(μA)

mgd006

(3)

01020

1.2

1.0

0.6

0.4

0.8

mgd004

VR (V)

(pF)

Product data sheet Rev. 3 — 19 August 2010 5 of 10

NXP Semiconductors PMLL4153

High-speed diode

8. Test information

9. Package outline

Fig 6. Re verse recovery voltage test circuit and waveforms

Input signal: forward pulse rise time tr= 0.4 ns; forward pulse duration tp= 100 ns; duty factor δ=0.01

Fig 7. Forward recovery time test circuit and waveforms

trr

(1)

+ I

output signal

10 %

90 %

input signal

V = V

= 50 ΩI

D.U.T.

= 50 Ω

SAMPLING

OSCILLOSCOPE

mga881

10%

90%

input

signal

= 50 Ω

OSCILLOSCOPE

1 kΩ450 Ω

D.U.T.

mbh181

output

signal

(V)

1.0

Fig 8. Package outline SOD80C

06-03-16Dimensions in mm

1.60

1.45

0.3

3.7

3.3

0.3

Product data sheet Rev. 3 — 19 August 2010 6 of 10

NXP Semiconductors PMLL4153

High-speed diode

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

11. Soldering

Table 8. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

2500 10000

PMLL4153 SOD80C 4 mm pitch, 8 mm tape and reel -115 -135

Fig 9. Reflow soldering footprint SOD80C

Fig 10. Wave soldering footprint SOD80C

sod080c

2.30

4.30

4.55

1.601.702.25

0.90

(2x)

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

sod080c

2.70

4.90

6.30

1.702.90

1.90

solder lands

tracks

solder resist

occupied area

Dimensions in mm

Product data sheet Rev. 3 — 19 August 2010 7 of 10

NXP Semiconductors PMLL4153

High-speed diode

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PMLL4153 v.3 20100819 Product data sheet - PMLL4150_2

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Type numbers PMLL4150 and PMLL4151 removed.

•Legal texts have been adapted to the new company name where appropriate .

•Table 1 “Quick reference data”: added

•Section 4 “Marking”: added

•Figure 1: updated

•Figure 8: superseded by minimized package outline drawing

•Section 10 “Packing information”: added

•Section 11 “Soldering”: added

•Section 13 “Legal information”: updated

PMLL4150_2 19960918 Product specification - PMLL4150_1

PMLL4150_1 19960423 Product specification - -

Product data sheet Rev. 3 — 19 August 2010 8 of 10

NXP Semiconductors PMLL4153

High-speed diode

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

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profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

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contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconduct ors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

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authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe propert y or environment al

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 19 August 2010 9 of 10

NXP Semiconductors PMLL4153

High-speed diode

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed produ ct cl aims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PMLL4153

High-speed diode

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 19 August 2010

Document iden tifier: P M LL4153

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

10 Packing information . . . . . . . . . . . . . . . . . . . . . 6

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

13 Legal in formation. . . . . . . . . . . . . . . . . . . . . . . . 8

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10