Effective May 2017 Supersedes March 2010 Technical Data 4321 3216TD HALOGEN Time-delay ChipTM surface mount fuse HF FREE Pb Environmental data * Operating temperature range: -55 C to +125 C with proper derating * Vibration: MIL-STD-202, Method 204 Condition D * Solderability: ANSI/J-STD-002C, Test B Soldering method Product features * * * * * Time-delay, surface mount fuse RoHS compliant, lead-free and halogen-free High inrush withstand capability Wire-in-Air performance Compatible with leaded and lead-free reflow and wave solder * cURus Recognition File number: E19180 Product Code 3216TD6.3-R 3216TD7-R 3216TD8-R 3216TD10-R 3216TD12-R Specifications Voltage Rating Vaac Vdc 32 32 32 32 32 32 32 32 32 32 Ordering * Specify packaging and product code (i.e., TR/3216TD1-R) Electrical Characteristics % of Amp Rating Opening Time 100% 4 Hours Minimum 200% 1 Sec. Minimum, 120 Sec. Maximum 300% 0.05 Sec. Minimum, 3 Sec. Maximum 800% 0.002 Sec. Minimum, 0.05 Sec. Maximum Agency information Current Rating Amps 6.3 7 8 10 12 * Wave immersion: 260C, 10 Sec. max. * Infrared reflow: 260C, 30 Sec. max. * Hand solder: 350C, 3 Sec. max. Interrupting Rating (Amps)* AC C DC 35 35 35 35 35 35 35 35 35 35 Typical Resistance ()** 0.006 0.006 0.0055 0.0045 0.00425 Typical Melt I 2t DC 10.54 12.03 16.03 42.71 45.56 Typical Voltage Drop (mV) 56 64 65 72 79 * AC Interrupting Rating (Measured at rated voltage with a unity power factor); DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds, battery source) ** DC Cold Resistance (Measured at 10% of rated current) Typical Melting2tI (Measured with a battery bank at rated DC voltage, 10x-rated current at 1 microsecond, not to exceed IR. Above 7A uses 70 micron thickness copper layer test board of IEC 60127-3 Others uses 35 micron thickness copper layer. Typical Voltage Drop (Measured at rated current after temperature stabilizes) Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended, with further derating required at elevated ambient temperatu 3216TD Time-delay ChipTM surface mount fuse Technical Data 4321 Effective May 2017 Dimensions - mm (in) Drawing Not to Scale Time-Current Curves Time In Seconds Recommended Pad Layout - mm (in) Current In Amps Packaging Code Prefix TR Packaging Description 2500 fuses on 12mm tape-and-reel on a 180mm reel per EIA-481-A & IEC286-3 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics (c) 2017 Eaton All Rights Reserved Printed in USA Publication No. 4321 BU-SB10214 May 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.