Technical Data 4321
Effective May 2017
Supersedes March 2010
Product features
3216TD
Time-delay Chip™ surface mount fuse
•Time-delay, surface mount fuse
•RoHS compliant, lead-free and halogen-free
•High inrush withstand capability
•Wire-in-Air performance
•Compatible with leaded and lead-free reflow and
wave solder
Pb
HALOGEN
HF
FREE
Agency information
Soldering method
•cURus Recognition File number: E19180
•Wave immersion: 260°C, 10 Sec. max.
•Infrared reflow: 260°C, 30 Sec. max.
•Hand solder: 350°C, 3 Sec. max.
Environmental data
•Operating temperature range: -55 °C to +125 °C
with proper derating
•Vibration: MIL-STD-202, Method 204 Condition D
•Solderability: ANSI/J-STD-002C, Test B
Ordering
•Specify packaging and product code
(i.e., TR/3216TD1-R)
Electrical Characteristic s
% of Amp RatingOpening Time
100% 4 Hours Minimum
200% 1 Sec. Minimum, 120 Sec . Maximum
300%0.05 Sec . Minimum, 3 Sec. Maximum
800%0.002 Sec . Minimum, 0.05 Sec . Maximum
Specications
Current Interrupting Typical Typical Typical
Product Code Rating Voltage Rating Rating (Amps)* Resistance Melt I
2
t† Voltage
Amps Vaacc Vdc ACC DC DC Drop (mV)‡
3216TD6.3-R 6.3 32 32 3355 35
0.006 10.54 56
3216TD7-R 7 32 32 3355 35
0.006 12.03 64
3216TD8-R 8 32 32 3355 35
0.0055 16.03 65
3216TD10-R 10 32 32 3355 35
0.0045 42.71 72
3216TD12-R 12 32 32 3355 35
0.00425 45.56 79
*AC Interrupting Rating (Measured at rated voltage with a unity power factor); DC Interrupting Rating (Measured at rated voltage, time constant of less than 50 microseconds,battery source)
** DC Cold Resistance (Measured at 10% of rated current)
† Typical Melting
2
It (Measured with a battery bank at rated DC voltage, 10x-rated current at 1 microsecond,not to exceed IR. Above 7A uses 70 micron thickness copper layer test board of IEC 60127-3
Others uses 35 micron thickness copper layer.
‡ Typical Voltage Drop (Measured at rated current after temperature stabilizes)
Device designed to carry rated current for four hours minimum. An operating current of 80% or less of rated current is recommended,with further derating required at elevated ambient temperatu
(Ω)**
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4321 BU-SB10214
May 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
3216TD
Time-delay Chip™ surface mount fuse
Technical Data 4321
Effective May 2017
Recommended Pad Layout - mm (in)
Dimensions - mm (in)
Drawing Not to Scale
Time-Current Curves
Current In Amps
Time In Seconds
Packaging
Packaging Code PrexDescription
TR 2500 fuses on 12mm tape-and-reel on a 180mm reel per EIA-481-A & IEC286-3