DSPIC30F6013A-20I/PF - Microchip Technology, Inc.

dsPIC30F6011A/6012A/6013A/6014A

Data Sheet

High-Performance

Digital Signal Controllers

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

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written approval by Microchip. No licenses are conveyed,

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Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICST ART ,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are

registered trademarks of Microchip Technology Incorporated

in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, M XDEV, MXLAB,

PICMASTER, SEEVAL, SmartSensor and The Embedded

Control Solutions Company are registered trademarks of

Microchip Technology In corporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,

dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,

FanSense, FlexROM, fu zzy LAB, In-Circuit Serial

Programming, ICSP, ICEPI C, Linear Active Ther mistor,

MPASM, MPLIB, MPLINK, MPSI M, PICkit, PIC DEM,

PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,

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SQTP is a service mark of Microchip Technology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrit y of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’s code protection feature may be a violat ion of the Digital Millennium Copyright Act. If suc h ac t s

allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 quality system certification for

its worldwide headquarters, design and wafer fabrication facilities in

Chandler and Tempe, Arizona and Mountain View, California in

October 2003. The Company’s quality system processes and

procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping

devices, Serial EEPROMs, micro peripherals, nonvolat ile memory and

analog products. In addition, Microchip’s quality system for the design

and manufacture of development systems is ISO 9001:2000 certified.

dsPIC30F6011A/6012A/6013A/6014A

High-Performance Modified RISC CPU:

• Modified Harvard architecture

• C compiler optimized instruction set architectur e

• Flexible addressing modes

• 84 base instructions

• 24-bit wide instructions, 16-bit wide data pa th

• Up to 144 Kbytes on-chip Flash program space

• Up to 48K in struct ion words

• Up to 8 Kbytes of on-chip data RAM

• Up to 4 Kbytes of nonvolatile data EEPROM

• 16 x 16-bit working register array

• Up to 30 MIPs operation:

- DC to 40 MHz external clock input

- 4 MHz-10 MHz oscillator input with PLL

active (4x, 8x, 16x)

• Up to 41 interrupt sources:

- 8 user selectable priority levels

- 5 external interrupt sources

- 4 processor traps

DSP Features:

• Dual data fetch

• Modulo and Bit-Reversed modes

• Two 40-bit wide accumulators with optional

saturati on log ic

• 17-bit x 17-bit si ngl e-cyc le hard w are frac tio nal /

integer multiplier

• All DSP instructions are single cycle

- Multiply-Accumulate (MAC) operation

• Single-cycle ±16 shift

Peripheral Feat ures:

• High-current sink/source I/O pins: 25 mA/25 mA

• Five 16-bit timers/counters; optionally pair up

16-bit timers into 32-bit timer modules

• 16-bit Capture input functions

• 16-bit Compare/PWM output functions:

• Data Converter Interface (DCI) supports common

audio Codec protocols, including I2S and AC’97

• 3-wire SPI™ modules (supports 4 Frame modes)

•I

2C™ module supports Multi-Master/Slave mode

and 7-bit/10-bit addressing

• Two addressable UART modules with FIFO

buffers

• Two CAN bus mo dules compliant with CAN 2.0B

standard

Analog Features:

• 12-bit Analog-to-Digital Converter (ADC) with:

- 200 Ksps conversi on rate

- Up to 16 input channels

- Conversion available during Sleep and Idle

• Programmable Low-Voltage Detection (PLVD)

• Programmable Brown-out Detection and Reset

generation

Special Microcontroller Features:

• Enhanced Flash program memory:

- 10,000 erase/write cycle (min.) for

industrial temperature range, 100K (typical)

• Data EEPROM memory:

- 100,000 erase/wri t e cycle (min.) for

industrial temperature range, 1M (typical)

• Self-reprogrammable under software control

• Power-on Reset (POR), Power-up Timer (PWRT)

and Oscillator Start-up Timer (OST)

• Flexible Watchdog Timer (WDT) with on-chip

low-power RC oscillator for reliable operation

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the dsPIC30F

Programmer’s Reference Manual (DS70030).

dsPIC30F6011A/6012A/6013A/6014A High-Performance

Digital Signal Controllers

dsPIC30F6011A/6012A/6013A/6014A

Special Microcontroller Features (Cont.):

• Fail-Safe Clock Monitor operation:

- Detect s clo ck failure and swit ch es to on-c hip

low-power RC oscillator

• Programmable code protection

• In-Circuit Serial Programming™ (ICSP™)

• Selectable Power Management modes:

- Sleep, Idle and Alternate Clock modes

CMOS Technology:

• Low-power, high-speed Flash technology

• Wide operating voltage range (2.5V to 5.5V)

• Industrial and Extended temperature ranges

• Low power consumption

dsPIC30F6011A/6012A/6013A/6014A Controller Families

Device Pins Program Memory SRAM

Bytes EEPROM

Bytes Timer

16-bit Input

Cap

Output

Comp/Std

PWM

Codec

Interface

ADC

12-bit

100 Ksps

UART

SPI™

I2C™

CAN

Bytes Instructions

dsPIC30F6011A 64 132K 44K 6144 2048 5 8 8 — 16 ch 2 2 1 2

ds PIC30F6012A 64 144K 48K 8192 4096 5 8 8 AC’97, I2S 16 ch 2 2 1 2

dsPIC30F6013A 80 132K 44K 6144 2048 5 8 8 — 16 ch 2 2 1 2

ds PIC30F6014A 80 144K 48K 8192 4096 5 8 8 AC’97, I2S 16 ch 2 2 1 2

dsPIC30F6011A/6012A/6013A/6014A

Pin Diagrams

Note: For descriptions of individual pins, see Section 1.0 “Device Overview”.

13 36

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/T4CK/CN1/RC13

EMUC2/OC1/RD0

IC4/INT4/RD11

IC2/INT2/RD9

IC1/INT1/RD8

VSS

OSC2/CLKO/RC15

OSC1/CLKI

VDD

SCL/RG2

EMUC3/SCK1/INT0/RF6

U1RX/SDI1/RF2

EMUD3/U1TX/SDO1/RF3

RG15

T2CK/RC1

T3CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

VSS

VDD

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

AN1/VREF-/CN3/RB1

AN0/VREF+/CN2/RB0

OC8/CN16/RD7

RG13

RG12

RG14

VSS

C2TX/RG1

C1TX/RF1

C2RX/RG0

EMUD2/OC2/RD1

OC3/RD2

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD//AN7/RB7

AVDD

AVSS

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

VSS

VDD

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

U2TX/CN18/RF5

U2RX/CN17/RF4

SDA/RG3

SS2/CN11/RG9

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

IC3/INT3/RD10

VDD

C1RX/RF0

OC4/RD3

OC7/CN15/RD6

OC6/IC6/CN14/RD5

OC5/IC5/CN13/RD4

64-Pin TQFP

dsPIC30F6011A

dsPIC30F6011A/6012A/6013A/6014A

Pin Diagrams (Continued)

Note: For descriptions of individual pins, see Sect ion 1.0 “Dev ice Over vi ew ”.

13 36

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/T4CK/CN1/RC13

EMUC2/OC1/RD0

IC4/INT4/RD11

IC2/INT2/RD9

IC1/INT1/RD8

VSS

OSC2/CLKO/RC15

OSC1/CLKI

VDD

SCL/RG2

EMUC3/SCK1/INT0/RF6

U1RX/SDI1/RF2

EMUD3/U1TX/SDO1/RF3

COFS/RG15

T2CK/RC1

T3CK/RC2

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

VSS

VDD

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

AN1/VREF-/CN3/RB1

AN0/VREF+/CN2/RB0

OC8/CN16/RD7

CSDO/RG13

CSDI/RG12

CSCK/RG14

VSS

C2TX/RG1

C1TX/RF1

C2RX/RG0

EMUD2/OC2/RD1

OC3/RD2

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD/AN7/RB7

AVDD

AVSS

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

VSS

VDD

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

U2TX/CN18/RF5

U2RX/CN17/RF4

SDA/RG3

SS2/CN11/RG9

AN5/IC8/CN7/RB5

AN4/IC7/CN6/RB4

IC3/INT3/RD10

VDD

C1RX/RF0

OC4/RD3

OC7/CN15/RD6

OC6/IC6/CN14/RD5

OC5/IC5/CN13/RD4

64-Pin TQFP

dsPIC 30 F60 12A

dsPIC30F6011A/6012A/6013A/6014A

Pin Diagrams (Continued)

Note: For descriptions of individual pins, see Section 1.0 “Device Overview”.

22 80

IC5/RD12

OC4/RD3

OC3/RD2

EMUD2/OC2/RD1

RG14

CN23/RA7

CN22/RA6

C2RX/RG0

C2TX/RG1

C1TX/RF1

C1RX/RF0

RG13

RG12

OC8/CN16/RD7

OC6/CN14/RD5

EMUC2/OC1/RD0

IC4/RD11

IC2/RD9

IC1/RD8

INT4/RA15

IC3/RD10

INT3/RA14

VSS

OSC1/CLKI

VDD

SCL/RG2

U1RX/RF2

U1TX/RF3

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/CN1/RC13

VREF+/RA10

VREF-/RA9

AVDD

AVSS

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

VDD

U2RX/CN17/RF4

IC8/CN21/RD15

U2TX/CN18/RF5

AN6/OCFA/RB6

AN7/RB7

T3CK/RC2

T4CK/RC3

T5CK/RC4

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

SS2/CN11/RG9

AN4/CN6/RB4

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

PGC/EMUC/AN1/CN3/RB1

PGD/EMUD/AN0/CN2/RB0

VSS

VDD

RG15

T2CK/RC1

INT2/RA13

INT1/RA12

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

VDD

VSS

OC5/CN13/RD4

IC6/CN19/RD13

SDA/RG3

SDI1/RF7

EMUD3/SDO1/RF8

AN5/CN7/RB5

VSS

OSC2/CLKO/RC15

OC7/CN15/RD6

EMUC3/SCK1/INT0/RF6

IC7/CN20/RD14

80-Pin TQFP

dsPIC30F6013A

dsPIC30F6011A/6012A/6013A/6014A

Pin Diagrams (Continued)

Note: For descriptions of individual pins, see Sect ion 1.0 “Dev ice Over vi ew ”.

22 80

IC5/RD12

OC4/RD3

OC3/RD2

EMUD2/OC2/RD1

CSCK/RG14

C2RX/RG0

C2TX/RG1

C1TX/RF1

C1RX/RF0

CSDO/RG13

CSDI/RG12

OC8/CN16/RD7

OC6/CN14/RD5

EMUC2/OC1/RD0

IC4/RD11

IC2/RD9

IC1/RD8

INT4/RA15

IC3/RD10

INT3/RA14

VSS

OSC1/CLKI

VDD

SCL/RG2

U1RX/RF2

U1TX/RF3

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/CN1/RC13

VREF+/RA10

VREF-/RA9

AVDD

AVSS

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

VDD

U2RX/CN17/RF4

IC8/CN21/RD15

U2TX/CN18/RF5

AN6/OCFA/RB6

AN7/RB7

T3CK/RC2

T4CK/RC3

T5CK/RC4

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

MCLR

SS2/CN11/RG9

AN4/CN6/RB4

AN3/CN5/RB3

AN2/SS1/LVDIN/CN4/RB2

PGC/EMUC/AN1/CN3/RB1

PGD/EMUD/AN0/CN2/RB0

VSS

VDD

COFS/RG15

T2CK/RC1

INT2/RA13

INT1/RA12

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

VDD

VSS

OC5/CN13/RD4

IC6/CN19/RD13

SDA/RG3

SDI1/RF7

EMUD3/SDO1/RF8

AN5/CN7/RB5

VSS

OSC2/CLKO/RC15

OC7/CN15/RD6

EMUC3/SCK1/INT0/RF6

IC7/CN20/RD14

80-Pin TQFP

dsPIC30F6014A

CN23/RA7

CN22/RA6

© 2005 Microchip Technology Inc. Preliminary DS70143B-page 7
dsPIC30F6011A/6012A/6013A/6014A
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 CPU Architecture Overview........................................................................................................................................................ 15
3.0 Memory O rganization. ................................................................................................................................................................ 25
4.0 Address Generato r Units............................................................................................................................................................ 39
5.0 Interrupts.................................................................................................................................................................................... 45
6.0 Flash Pro g ram Memory............................ ....................... ................... ....................... ................................................................. 51
7.0 Data EEPR OM Mem o ry........ ............... ....................... ................... ....................... ..................................................................... 57
8.0 I/O Ports.......................... ....................... ....................... ....................... ...................................................................................... 63
9.0 Timer1 Module ........................................................................................................................................................................... 69
10.0 Timer2/3 Module ................. ....... .. .. .. .... .. .. .. ....... .. .. .. .... .. .. ..... .... .. .. .. .. .... ..... .. .. .... .. .. .. .. ................................................................. 73
11.0 Timer4/5 Module  ......................... .. .. .... .. .. .. ....... .. .. .. .. .... .. ..... .. .... .. .. .. .. ....... .. .. .. .... .. .. .. ..... ............................................................ 79
12.0 Input Capture Module......................... .. .. .... ....... .. .. .. .... .. .. ....... .... .. .. .. .... ....... .. .. .... .. .. .. ....... .......................................................... 83
13.0 Output Compa re Module.......................... ................... ................... ................... ......................................................................... 87
14.0 SP I Module................................................................................................................................................................................. 91
15.0 I2C Module................................................................................................................................................................................. 95
16.0 U nivers al Asynchr onous Receiver  Transmi tter (UART) Module .............................................................................................. 103
17.0 CAN Module............................................................................................................................................................................. 111
18.0 Data Converter Interface (DCI) Module.............................................. ........... .... .... .... ........... .... ................................................ 123
19.0 12-bit Analog- to-Digital Converter (ADC) Module .................................................................................................................... 133
20.0 System Inte g r a tion .. ................... ................... ....................... ................... .................. ............................................................... 143
21.0 Instruction Set Summary.......................................................................................................................................................... 163
22.0 Development Support............................................................................................................................................................... 171
23.0 Electrical Characteristics.......................................................................................................................................................... 175
24.0 Packagin g  In fo rmation........................ ................... ....................... ................... ......................................................................... 215
Appendix A: Revision History . ............................................................................................................................................................ 221
Appendix B: Device Comparisons ..................................................................................................................................................... 223
Appendix C: Migration from dsPIC30F601x to dsPIC30F601xA Devices.......................................................................................... 225
Index .................................................................................................................................................................................................. 227
The Micro chip Web Site..................... ....................... ....................... ....................... ........................................................................... 233
Customer Change Notification Service.............................................................................................................................................. 233
Customer Support............................................................... .... ............. ...... ............. ...... .... ................................................................. 233
Reader Response.............................................................................................................................................................................. 234
Product Identification System ............................................................................................................................................................ 235

dsPIC30F6011A/6012A/6013A/6014A

TO OUR VALUED CUSTO MERS

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welcome your feedback.

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Customer Noti fic atio n Syst em

dsPIC30F6011A/6012A/6013A/6014A

1.0 DEVICE OVERVIEW This document contains specific information for the

dsPIC30F6011A/6012A/6013A/6014A Digital Signal

Controller (DSC) devices. The dsPIC30F devices

cont ain ex tens iv e D ig it a l Sig nal Proc es so r (DSP) func -

tionality within a high-performance 16-bit

microcontroller (MCU) architecture. Figure 1-1 and

Figure 1-2 show device block diagrams for

dsPIC30F6011A/6012A and dsPIC30F6013A/6014A,

respectively.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the dsPIC30F

Programmer’s Reference Manual (DS70030).

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 1-1: dsPIC30F6011A/6012A BLOCK DIAGRAM

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

Power-up

Timer

Oscillator

S tart-up Timer

POR/BOR

Reset

Watchdog

Timer

Instruction

Decode &

Control

OSC1/CLKI

MCLR

, V

AN4/CN6/RB4

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

Low-Voltage

Detect

UART1,

CAN2

Timing

Generation

CAN1,

AN5/CN7/RB5

PCH PCL

Program Counter

ALU<16>

X Data Bus

C™

DCI

PGC/EMUC/AN6/OCFA/RB6

PGD/EMUD/AN7/RB7

PCU

12-bit ADC

Timers

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

SS2/CN11/RG9

Input

Capture

Module

Output

Compare

Module

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/CN1/RC13

T2CK/RC1

PORTB

C2RX/RG0

C2TX/RG1

SCL/RG2

SDA/RG3

PORTG

PORTD

16 16

16 x 16

W Reg Array

Divide

Unit

Engine

DSP

Decode

ROM Latch

Y Data Bus

Effective Address

X RAGU

X WAGU

Y AGU

AN0/CN2/RB0

AN1/CN3/RB1

AN2/SS1/LVDIN/CN4/RB2

AN3/CN5/RB3

OSC2/CLKO/RC15

, A V

UART2

SPI2

PORTC

Interrupt

Controller

PSV & Table

Data Access

Control Block

Stack

Control

Logic

Loop

Control

Logic

Data LatchData Latch

Y Data

RAM X Data

RAM

Address

Latch Address

Latch

Control Signals

to Various Blocks

EMUC2/OC1/RD0

EMUD2/OC2/RD1

OC3/RD2

OC4/RD3

OC5/CN13/RD4

OC6/CN14/RD5

OC7/CN15/RD6

OC8/CN16/RD7

IC1/RD8

IC2/RD9

IC3/RD10

IC4/RD11

CSDI/RG12

CSDO/RG13

CSCK/RG14

COFS/RG15

T3CK/RC2

SPI1,

Address Latch

Program Memory

(Up to 144 Kbytes)

Data Latch

Data EEPROM

(Up to 4 Kbytes)

U2TX/CN18/RF5

EMUC3/SCK1/INT0/RF6

C1RX/RF0

C1TX/RF1

U1RX/SDI1/RF2

EMUD3/U1TX/SDI1/RF3

U2RX/CN17/RF4

PORTF

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 1-2 : dsPIC30F6013A/6014A BLOCK DIAGRAM

AN8/RB8

AN9/RB9

AN10/RB10

AN11/RB11

Power-up

Timer

Oscillator

S tart-up Timer

POR/BOR

Reset

Watchdog

Timer

Instruction

Decode &

Control

OSC1/CLKI

MCLR

, V

AN4/CN6/RB4

AN12/RB12

AN13/RB13

AN14/RB14

AN15/OCFB/CN12/RB15

Low-Voltage

Detect

UART1,

INT4/RA15

INT3/RA14

REF

+/RA10

REF

-/RA9

CAN2

Timing

Generation

CAN1,

AN5/CN7/RB5

PCH PCL

Program Counter

ALU<16>

X Data Bus

C™

DCI

AN6/OCFA/RB6

AN7/RB7

PCU

12-bit ADC

Timers

SCK2/CN8/RG6

SDI2/CN9/RG7

SDO2/CN10/RG8

SS2/CN11/RG9

U2TX/CN18/RF5

EMUC3/SCK1/INT0/RF6

SDI1/RF7

EMUD3/SDO1/RF8

Input

Capture

Module

Output

Compare

Module

EMUC1/SOSCO/T1CK/CN0/RC14

EMUD1/SOSCI/CN1/RC13

T4CK/RC3

T2CK/RC1

PORTB

C1RX/RF0

C1TX/RF1

U1RX/RF2

U1TX/RF3

C2RX/RG0

C2TX/RG1

SCL/RG2

SDA/RG3

POR TG

PORTD

16 16

16 x 16

W Reg Array

Divide

Unit

Engine

DSP

Decode

ROM Latch

Y Data Bus

Effective Address

X RAGU

X WAGU

Y AGU

PGD/EMUD/AN0/CN2/RB0

PGC/EMUC/AN1/CN3/RB1

AN2/SS1/LVDIN/CN4/RB2

AN3/CN5/RB3

OSC2/CLKO/RC15

U2RX/CN17/RF4

, A V

UART2

SPI2

16 PORTA

PORTC

PORTF

Interrupt

Controller

PSV & Table

Data Access

Control Block

Stack

Control

Logic

Loop

Control

Logic

Data LatchData Latch

Y Data

RAM X Data

RAM

Address

Latch Address

Latch

Control Signals

to Various Blocks

EMUC2/OC1/RD0

EMUD2/OC2/RD1

OC3/RD2

OC4/RD3

OC5/CN13/RD4

OC6/CN14/RD5

OC7/CN15/RD6

OC8/CN16/RD7

IC1/RD8

IC2/RD9

IC3/RD10

IC4/RD11

IC5/RD12

IC6/CN19/RD13

IC7/CN20/RD14

IC8/CN21/RD15

CSDI/RG12

CSDO/RG13

CSCK/RG14

COFS/RG15

T3CK/RC2

SPI1,

INT1/RA12

INT2/RA13

CN23/RA7

CN22/RA6

T5CK/RC4

Address Latch

Program Memory

(Up to 144 Kbytes)

Data Latch

Data EEPROM

(Up to 4 Kbytes)

dsPIC30F6011A/6012A/6013A/6014A

Table 1-1 provides a brief description of device I/O

pinouts and the functions that may be multiplexed to a

port pin. Multiple functions may exist on one port pin.

When multiplexing occurs, the peripheral module’s

functional requirements may force an override of the

data direction of the port pin.

TABLE 1-1: PINOUT I/O DESCRIPTIONS

Pin Name Pin

Type Buffer

Type Description

AN0- AN15 I Analog Analog inpu t chan nels.

AN0 and AN1 are also u sed for device prog ra m m i ng da ta and

clock inputs, respectively.

AVDD P P Positive sup pl y f or a nalog modu le .

AVSS P P Groun d re fe re nce for analog module.

CLKI

CLKO

ST/CMOS

—

Ext ern al clock source input. Alway s associated with OSC1 pin

function.

Oscillat or crystal ou tp ut . Co nnects to crys tal or re sonator in

Crystal Oscillator mode. Optionally functions as CLKO in RC

and EC modes. Alway s associate d wi th OS C 2 pin function.

CN0- C N23 I ST Input change notifi cati on inputs.

Can be software programmed for internal weak pull-ups on all

inputs.

COFS

CSCK

CSDI

CSDO

I/O

—

Data Converter Interface frame synchronization pin.

Data Conve rter In te rf ac e serial cloc k i nput/output pi n.

Data Conve rter In te rface serial data input pin.

Data Conve rter In te rface serial data output pin.

C1RX

C1TX

C2RX

C2TX

—

CAN1 bus receiv e pin.

CAN1 bus transmit pin.

CAN2 bus receiv e pin.

CAN2 bus transmit pin

EMUD

EMUC

EMUD1

EMUC1

EMUD2

EMUC2

EMUD3

EMUC3

I/O

ICD Prim ar y C o mmunica t io n Channel d ata inpu t/output pin.

ICD Primary Communication Channel clock input/output pin.

ICD Secondary Communication Channel data

input/ou tp ut pin.

ICD Seco ndary Com m unication Channel cl ock input/output pin.

ICD Tertiary Communication Channel data input/output pin.

ICD Tertiary Communication Channel clock input/ou tput pi n.

ICD Quaternary Communication Channel data

input/ou tp ut pin.

ICD Quat er nary Comm unication C hannel cl ock in put / output pin.

IC1-IC 8 I ST Capture in puts 1 through 8.

INT0

INT1

INT2

INT3

INT4

External interru p t 0.

External interru p t 1.

External interru p t 2.

External interru p t 3.

External interru p t 4.

LVDIN I Analog Low-Voltage Detect Reference Voltage input pin.

MCLR I/P ST Maste r Cl ear (Reset) in put or program m i ng voltage input . T his

pin is an active low Reset to the device.

OCFA

OCFB

OC1-OC8

—

Compare Fau lt A i nput (for Compare channels 1, 2, 3 and 4).

Compare Fau lt B i nput (for Compare channels 5, 6, 7 and 8).

Compare outputs 1 throug h 8.

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = Output

I = Input P = Power

dsPIC30F6011A/6012A/6013A/6014A

OSC1

OSC2

I/O

ST/CMOS

—

Oscillator cr ysta l input. ST buffer whe n configured i n RC m ode;

CMOS ot he rwise.

Oscillat or crystal ou tp ut . Co nnects to crys tal or re sonator in

Crystal Oscillator mode. Optionally functions as CLKO in RC

and EC modes.

PGD

PGC I/O

IST

ST In-Circu it Seri al Pro gr am m ing™ da ta input /output pin.

In-Circu it Seri al Pro gram ming clock inp ut pi n.

RA6-RA7

RA9-RA10

RA12-RA15

I/O

PORTA is a bidirectional I/O port.

RB0-RB15 I/O ST PORTB is a bidirectional I/O port.

RC1-RC4

RC13-RC15 I/O

I/O ST

ST PORTC is a bidirec tional I/O port.

RD0-RD15 I/O ST PORTD is a bidirectional I/O port.

RF0-R F8 I/O ST PORTF is a bid irec tio nal I/O port.

RG0-RG3

RG6-RG9

RG12-RG15

I/O

PORTG is a bidirec tional I/O port.

SCK1

SDI1

SDO1

SS1

SCK2

SDI2

SDO2

SS2

I/O

—

Synchro nous serial cl ock input/ou tp ut fo r SPI1.

SPI1 Data In.

SPI1 Data Out.

SPI1 Slave Sy nchronization.

Synchro nous serial cl ock input/ou tp ut fo r SPI2.

SPI2 Data In.

SPI2 Data Out.

SPI2 Slave Sy nchronization.

SCL

SDA I/O

I/O ST

ST Synchronous se rial cl oc k in put/output fo r I 2C™.

Synchro nous serial data inp ut / out put for I2C.

SOSCO

SOSCI O

I—

ST/CMOS 3 2 kHz low-power oscilla to r crystal output.

32 kHz low-power oscillator crystal input. ST buffer when config-

ured in RC m ode; CMO S otherwise.

T1CK

T2CK

T3CK

T4CK

T5CK

Timer1 external cloc k input.

Timer2 external cloc k input.

Timer3 external cloc k input.

Timer4 external cloc k input.

Timer5 external cloc k input.

U1RX

U1TX

U1ARX

U1ATX

U2RX

U2TX

—

UART1 Receive.

UART1 Transmit.

UART1 Alternate Receiv e.

UART1 Alternate Transmi t.

UART2 Receive.

UART2 Transmit.

VDD P — Positive supply for logic and I/O pins.

VSS P — Ground reference for logic and I/O pins.

VREF+ I Analog Analog Voltage Reference (High) input.

VREF- I Analog Analog Voltage Reference (Low) input.

TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)

Pin Name Pin

Type Buffer

Type Description

Legend: CMOS = CMOS compatible input or output Analog = Analog input

ST = Schmitt Trigger input with CMOS levels O = Output

I = Input P = Power

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

2.0 CPU ARCHITECTURE

OVERVIEW

2.1 Core Overview

This section contains a brief overview of the CPU

architecture of the dsPIC30F. For additional hard-

ware and programming information, please refer to

the dsPIC30F Family Reference Manual and

the dsPIC30F Programmer’s Reference Manual

respectively.

The core has a 24-bit instruction word. The Program

Counter (PC) is 23-bits wide with the Least Significant

bit (LSb) always clear (refer to Section 3.1 “Program

Address Space”), and the Most Significant bit (MSb)

is ign ored du ring no rmal program executi on, ex cept for

certain specialized instructions. Thus, the PC can

address up to 4M instruction words of user program

space. An instruction prefetch mechanism is used to

help maintain throughput. Program loop constructs,

free from loop count management overhead, are sup-

ported using the DO and REPEAT instructions, both of

which are interruptible at any point.

The work ing re giste r array c onsist s o f 16 x 16 -bit re gis-

ters, each of which can act as data, address or offset

registers. One working register (W15) operates as a

software Stack Poi nte r for interrup t s and calls .

The data space is 64 Kbytes (32K words) and is split

into two blocks, referred to as X and Y data memory.

Each block has its own independent Address Genera-

tion Unit (AGU). Most instructions operate solely

through the X memory, AGU, which provides the

appearance of a single unified data space. The

Multiply-Accumulate (MAC) class of dual source DSP

instructions operate through both the X and Y AGUs,

splitting the data address space into two parts (see

Section 3.2 “Data Address Space”). The X and Y

data space boundary is device specific and cannot be

alter ed by the user . Each dat a word consis ts of 2 bytes,

and mos t instruction s can address data eith er as words

or bytes.

There are two methods of accessing data stored in

program memory:

• The upper 32 Kbytes of data space memory can

be mappe d into the low e r hal f (us er space) of pro-

gram space at any 16K program word boundary,

defined by the 8-bi t Program Sp ace Vis ibility Page

(PSVPAG) register. This lets any instruction

access program space as if it were data space,

with a limitation that the access requires an addi-

tional cycle. Moreover, onl y the lower 16 bits of

each instruction word can be accessed using this

method.

• Linear indirect access of 32K word pages within

progra m spac e is also possibl e using any w orking

Table read and write instructions can be used to

access all 24 bits of an instruction word.

Overhead-free circular buffers (modulo addressing) are

supported in both X and Y address spaces. This is pri-

marily intended to remove the loop overhead for DSP

algorithms.

The X AGU also supports bit-reversed addressing on

dest inatio n ef fectiv e addres ses to great ly simpl ify inp ut

or output data reordering for radix-2 FFT algorithms.

Refer to Section 4.0 “Address Generator Units” for

details on modulo and bit-reversed addressing.

The core supports Inherent (no operand), Relative,

Literal, Memory Direct, Register Direct, Register

Indirect, Register Offset and Literal Offset Addressing

modes. Instructions are associated with predefined

Addressing modes, depending upon their functional

requirements.

For m os t i ns tru c ti o ns , the c or e i s c apa bl e of e xe c ut i ng

a data (or program data) memory read, a working reg-

ister (data) read, a data memory write and a program

(instruction) memory read per instruction cycle. As a

result, 3-operand instructions are supported, allowing

C = A+B operations to be executed in a single cycle.

A DSP engine has been included to significantly

enhance the core arithmetic capability and thr oughput.

It features a high-speed 17-bit by 17-bit multiplier, a

40-bit ALU, two 40-bit saturating accumulators and a

40-bit b idi rec tio nal b arrel shi fter. Data in the acc umul a-

tor or any worki ng r egist er can be shif ted up to 16 bits

right, or 16 bits left in a single cycle. The DSP instruc-

tions ope rate sea mles sly with all other in struct ions an d

have be en desi gned for o ptimal re al-time p erforma nce.

The MAC class of instructions can concurrently fetch

two data operands from memory while multiplying two

W registers. To enable this concurrent fetching of data

operands, the data space has been split for these

instructions and linear for all others. This has been

achiev ed in a tran sp a r en t and fle xib le mann er, by ded-

icating cert ain worki ng registe rs to e ach addre ss spac e

for the MAC class of instructions.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the dsPIC30F

Programmer’s Reference Manual (DS70030).

dsPIC30F6011A/6012A/6013A/6014A

The core does not support a multi-stage instruction

pipeline. However, a single stage instruction prefetch

mechanism is used, which accesses and partially

decodes instructions a cycle ahead of execution, in

order to maximize available execution time. Most

instructions execute in a single cycle with certain

exceptions.

The core features a vectored exception processing

structure for traps and interrupts, with 62 independent

vectors. The exceptions consist of up to 8 traps (of

which 4 are re served ) a nd 54 interrupt s . Ea ch in terru pt

is priorit ized based on a use r assigned prio rity between

1 and 7 (1 being the lowest priority and 7 being the

highest), in conjunction with a predetermined ‘natural

order’. Traps have fixed priorities ranging from 8 to 15.

2.2 Programmer’s Model

The programmer’s model is shown in Figure 2-1 and

consists of 16 x 16-bit working registers (W0 through

W15), 2 x 40-bit accumulators (AccA and AccB),

STATUS register (SR), Data Table Page register

(TBLPAG), Program Space Visibility Page register

(PSVPAG), DO and REPEAT registers (DOSTART,

DOEND, DCOUNT and RCOUNT) and Program

Counter (PC). The working registers can act as data,

address or offset registers. All registers are memory

mapped. W0 acts as the W register for file register

addressing.

Some of these registers have a shadow register asso-

ciated with each of them, as shown in Figure 2-1. The

shadow registe r is used as a te mporary holding register

and can tr ansfer it s contents to or fro m i t s hos t reg is ter

upon the occurrence of an event. None of the shadow

registers are accessible directly. The following rules

apply for transfer of registers into and out of shadows.

•PUSH.S and POP.S

W0, W1, W2, W3, SR (DC, N, OV, Z and C bits

only) are transferred.

•DO instruction

DOSTART, DOEND, DCOUNT shadows are

pushed on loop start, and popped on loop end.

When a byte operation is performed on a working reg-

ister, only th e Least Significan t Byte (LSB) of th e targ et

mapped working registers is that both the Least and

Most Significant Bytes can be manipulated through

byte wide data memory space accesses .

2.2.1 SOFTWARE STACK POINTER/

FRAM E POIN TE R

The dsPIC® DSC devices contain a software stack.

W15 is the dedicated software Stack Pointer (SP), and

will be automatically modified by exception processing

and sub routine calls and returns. However , W15 can be

referenced by any instruction in the same manner as all

other W registers. This simplifies the reading, writing

and manipulation of the Stack Pointer (e.g., creating

stac k fram es ).

W15 is initialized to 0x0800 during a Reset. The user

may reprogram the SP during initialization to any

location within data space.

W14 has been dedicated as a Stack Frame Pointer as

defined by the LNK and ULNK instructions. However,

W14 can be referenced by any instruction in the same

manner as all other W registers.

2.2.2 STATUS REGISTER

The dsPIC DSC core has a 16-bit STATUS register

(SR), the LSB of which is referred to as the SR Low

byte (SRL) an d the Most Si gni fic an t Byte (MSB) a s th e

SR High byte (SRH). See Figure 2-1 for SR layout.

SRL contains all the MCU ALU operation status flags

(includ ing the Z bit ), as well as the CPU Inter rupt Prior-

ity Level status bits, IPL<2:0> and the Repeat Active

status bit, RA. During exception processing, SRL is

concatenated with the MSB of the PC to form a com-

plete word value which is th en stacked.

The upper byte of the STATUS register contains the

DSP Adder/Subtracter status bits , the DO Loop Active

bit (DA) and the Digit Carry (DC) status bit.

2.2.3 PROGRA M COUNTER

The Program Counter is 23-bits wide; bit 0 is always

clear. Therefore, the PC can address up to 4M

instruction words.

Note: In order to protect against misaligned

stack accesses, W15<0> is always clear.

dsPIC30F6011A/6012A/6013A/6014A

FIGUR E 2-1: PROGRAMMER’S MODEL

TABPAG

PC22 PC0

7 0

D0D15

Program Counter

Data Table Page Address

STATUS R egi ster

Working Registers

DSP Operand

Registers

W10

W11

W12/DSP Offset

W13/DSP Write Back

W14/Frame Pointer

W15/Stack Pointer

DSP Address

Registers

AD39 AD0AD31

DSP

Accumulators AccA

AccB

PSVPAG

7 0Program Space Visibility Page Address

OA OB SA SB

RCOUNT

15 0REPEAT Loop Counter

DCOUNT

15 0DO Loop Counter

DOSTART

22 0 DO Loop Start Address

IPL2 IPL1

SPLIM Stack Pointer Limit Register

AD15

SRL

PUSH.S Shadow

DO Shadow

OAB SAB

15 0Core Configuration Register

Legend

CORCON

DA DC RA N

TBLPAG

PSVPAG

IPL0 OV

W0/WREG

SRH

DO Loop End Address

DOEND

dsPIC30F6011A/6012A/6013A/6014A

2.3 Divide Support

The dsPIC DSC devices feature a 16/16-bit signed

fraction al d iv ide ope rati on , as w ell as 32/1 6-b it a nd 1 6/

16-bit signed and unsigned integer divide operations, in

the form of single instruction iterative divides. The fol-

lowing instructions and data sizes are supported:

1. DIVF - 16/16 signed fract ion al div id e

2. DIV.sd - 32/16 signed divide

3. DIV.ud - 32/16 unsigned divide

4. DIV.sw - 16/16 signed divide

5. DIV.uw - 16/16 unsigned divide

The 16/16 divides are simila r to the 32/16 (same number

of iterations), but the dividend is eithe r zero-extended or

sign-extended during the first iteration.

The divide instructions must be executed within a

REPEAT loop. Any other form of execution (e.g., a

series of discrete divide instructions) will not function

correctly because the instruction flow depends on

RCOUNT. The divide instruction does not automaticall y

set up the RCOUNT value and it must, therefore, be

explic itly and correctl y specifi ed in the REPEAT instruc-

tion as shown in Table 2-1 (REPEAT will execute the t ar-

get ins truc tio n {ope rand v alu e+1 } ti me s). The REPEAT

loop count must be setup for 18 iterations of the DIV/

DIVF instruction. Thus, a complete divide operation

requires 19 cycles.

TABLE 2-1: DIVIDE INSTRUCTIONS

Note: The divide flow is interruptible. However,

the user needs to save the context as

appropriate.

Instruction Function

DIVF Signed fractional divide: Wm/Wn → W0; Rem → W1

DIV.sd Signed divide: (Wm + 1:Wm)/Wn → W0; Rem → W1

DIV.sw or DIV.s Signed divide: Wm/Wn → W0; Rem → W1

DIV.ud Unsigned divide: (Wm + 1:Wm)/Wn → W0; Rem → W1

DIV.uw or DIV.u Unsigned divide: Wm/Wn → W0; Rem → W1

dsPIC30F6011A/6012A/6013A/6014A

2.4 DSP Engine

The DSP engine consists of a high-speed 17-bit x

17-bit multiplier, a barrel shifter and a 40-bit adder/

subtracter (with two target accumulators, round and

saturati on log ic ).

The dsPIC30F is a single-cycle instruction flow archi-

tecture, therefore, concurrent operation of the DSP

engine with MCU instruction flow is not possible.

However, some MCU ALU and DSP engine resources

may be used concurrently by the same instruction

(e.g., ED, EDAC).

The DSP engine also has the capability to perform

inherent accumulator-to-accumulator operations,

which require no additi onal data. These in structions are

ADD, SUB and NEG.

The DSP engine has vari ous options selected through

various bits in the CPU Core Configuration register

(CORCON), as listed below:

1. Fractional or integer DSP multiply (IF).

2. Signed or unsigned DSP multiply (US).

3. Conventional or convergent rounding (RND).

4. Automatic saturation on/off for AccA (SATA).

5. Automatic saturation on/off for AccB (SATB).

6. Automatic saturation on/off for writes to data

memory (SATDW).

7. Accumulator Saturation mode selection

(ACCSAT).

A block diagram of the DSP engine is shown in

Figure 2-2.

Note: For CORCON layout, see Table 3-3.

TABLE 2-2: DSP INSTRUCTIONS SUMMARY

Instruction Algebraic Operation ACC Write Back

CLR A = 0 Yes

ED A = (x – y)2No

EDAC A = A + (x – y)2No

MAC A = A + (x * y) Yes

MAC A = A + x2No

MOVSAC No change in A Yes

MPY A = x * y No

MPY A = x 2No

MPY.N A = – x * y No

MSC A = A – x * y Yes

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 2-2: DSP ENGINE BLOCK DIAGRAM

Zero Backfill

Sign-Extend

Barrel

Shifter

40-bit Accumula tor A

40-bit Accumula tor B Round

Logic

X Data Bus

To/From W Array

Adder

Saturate

Negate

16 16

40 40

Y Data Bus

Carry/Borrow Out

Carry/Borrow In

Multiplier/Scaler

17-bit

dsPIC30F6011A/6012A/6013A/6014A

2.4.1 MULTIPLIER

The 17 x 17-bit multiplier is capable of signed or

unsign ed ope ration an d can m ultiplex its output u sing a

scaler to support either 1.31 fractional (Q31) or 32-bit

integer results. Unsigned operands are zero-extended

into the 17th bit of the multiplier input value. Signed

operands are sign-extended into the 17th bit of the mul-

tiplier input value. The output of the 17 x 17-bit multi-

plier/scaler is a 33-bit value which is sign-extended to

40 bits. Integer data is inherently represented as a

signed two’s complement value, where the MSB is

defined as a sign bit. Generally speaking, the range of

an N- bit tw o’s comple ment in teger i s -2N-1 to 2N-1 – 1.

For a 16-bit integer, the data range is -32768 (0x8000)

to 32767 (0x7FFF) including ‘0’. For a 32-bit integer,

the data range is -2,147,483,648 (0x8000 0000) to

2,147,48 3,6 47 (0x7FFF FFFF).

When the multiplier is configured for fractional multipli-

cation, the data is represented as a two’s complement

fraction , where the M SB is define d as a sign b it and the

radix po int is im plied to lie just a fter the si gn bit (QX f or-

mat). The range of an N-bit two’s complement fraction

with this implied radix point is -1.0 to (1 – 21-N). For a

16-bit fraction, the Q15 data range is -1.0 (0x8000) to

0.999969482 (0x7FFF) including ‘0’ and has a preci-

sion of 3.01518x10-5. In Fractional mode, the 16x16

multiply operation generates a 1.31 product which has

a precision of 4.65661 x 10-10.

The same multiplier is used to support the MCU multi-

ply instructions which include integer 16-bit signed,

unsigned and mixed sign multiplies.

The MUL instruction may be directed to use byte or

word size d opera nds. By te opera nds wil l direct a 1 6-bit

result, and word operands will direct a 32-bit result to

the specified register(s) in the W array.

2.4.2 DATA ACCUMULATORS AND

ADDER/SUBTRACTER

The data accumulator consists of a 40-bit adder/

subtracter with automatic sign extension logic. It can

select one of two accumulators (A or B) as its pre-

accumulation source and post-accumulation destina-

tion. For the ADD and LAC instructions, the data to be

accum ulated or l oaded ca n be optio nally sca led via th e

barrel shifter, prior to accumulation.

2.4.2.1 Adder/Subtracter, Overflow and

Saturation

The adder/subtracter is a 40-bit adder with an optional

zero inpu t into on e side a nd eithe r true , or comp leme nt

data into the other input. In the case of addition, the

carry/borrow input is active high and the other input is

true data (not complemented), whereas in the case of

subtrac tion, the carry/borrow input is active low and the

other input is complemented. The adder/subtracter

generates overflow status bits SA/SB and OA/OB,

which are la tched and reflected in the ST ATUS register:

• Overflow from bit 39: this is a catastrophic

overflow in which the sign of the accumulator is

destroyed.

• Overflow into guard bits 32 through 39: this is a

recoverable overflow. This bit is set whenever all

the guard bits are not identical to each other.

The adder has an additional saturation block which

controls accumulator data saturation, if selected. It

uses the result of the adder, the overflow status bits

described above, and the SATA/B (CORCON<7:6>)

and ACCSAT (CORCON<4>) mode control bits to

determine when and to what value to saturate.

Six STATUS register bits have been provided to

support saturation and overflow; they are:

1. OA:

AccA overflowed into guard bits

2. OB:

AccB overflowed into guard bits

3. SA:

AccA saturated (bit 31 overflow and saturation)

AccA overflowed into guard bits and saturated

(bit 39 overflow and satur ation)

4. SB:

AccB saturated (bit 31 overflow and saturation)

AccB overflowed into guard bits and saturated

(bit 39 overflow and satur ation)

5. OAB:

Logical OR of OA and OB

6. SAB:

Logical OR of SA and SB

The OA and OB bits are modified each time data

passes through the adder/subtracter. When set, they

indicate that the most recent operation has overflowed

into the accumulator guard bits (bits 32 through 39).

The OA and OB bits can also optionally generate an

arithmetic warning trap when set and the correspond-

ing ove rflow trap flag enable bit (O V A T EN, OVBTEN) in

the INTCON1 register (refer to Section 5.0 “Inter-

rupts”) is set. This allows the user to take immediate

action, for example, to correct system gain.

dsPIC30F6011A/6012A/6013A/6014A

The SA and SB bits are modified each time data

passes through the adder/subtracter but can only be

cleared by the user. When set, they indicate that the

accumula tor has overfl owed it s m aximum range (b it 31

for 32-bit saturation, or bit 39 for 40-bit saturation) and

will be saturated (if saturation is enabled). When satu-

ration is not en ab led , SA and SB defa ult to bit 3 9 over-

flow an d th us in di ca te th at a c ata str o ph ic ov erf l ow h as

occu rred. If the COV TE bit in the INTCO N1 reg ister is

set, SA an d SB bit s wil l generate an ari thmeti c warnin g

trap when saturation is disabled.

The overflow and saturation status bits can optionally

be viewed in the STATUS register (SR) as the logical

OR of OA an d OB (in bit OAB) and the logical OR of SA

and SB (in bit SAB). Th is allows programm ers to check

one bit in the STATUS register to determine if either

accumulator has overflowed, or one bit to determine if

either a ccum ulator has satu rated. T his w ould be usefu l

for complex number arithmetic which typically uses

both the accu mulators.

The device supports three saturation and overflow

modes:

1. Bit 39 Overflow and Saturation:

When bit 39 overflow and saturation occurs, the

saturation logic load s the maximally positive 9.31

(0x7FFFFFFFFF), or maximally negative 9.31

value (0x8000000000) into the target accumula-

tor. The SA or SB bit is set and remains set until

cleared by the user. This is referr ed to as ‘super

saturation’ and provides protection against erro-

neous data, or unexpected algorithm problems

(e.g., gain calculations).

2. Bit 31 Overflow and Saturation:

When bit 31 overflow and saturation occurs, the

saturation logic then loads the maximally posi-

tive 1.31 value (0x007FFFFFFF), or maximally

negative 1.31 value (0x0080000000) into the

target accumulator. The SA or SB bit is set and

remains set until cleared by the user. When this

Saturation mode is in effect, the guard bits are

not used (so the OA, OB or OAB bits are never

set).

3. Bit 39 Catastrophic Overflow:

The bit 39 overflow status bit from the adder is

used to set the SA or SB bit which remain set

until cleared by the user. No saturation operation

is performed and the accumulator is allowed to

overflow (destroying it s sign). If the COVTE b it in

the INTCON1 register is set, a catastrophic

ove rflo w can initiate a trap exceptio n.

2.4.2.2 Accumulator ‘Write Back’

The MAC class of instructions (with the exception of

MPY, MPY.N, ED and EDAC) can optionally write a

rounded version of the high word (bits 31 through 16)

of the acc umulato r that is not targe ted by the instruction

into dat a spac e memory. The write is perfo rmed acros s

the X bus into combined X and Y address space. The

following Addressing modes are supported:

1. W13, Registe r Dire ct:

The rounded contents of the non-target

accumulator are written into W13 as a 1.15

fraction.

2. [W13] + = 2, Register Indirect with Post-Increment:

The round ed contents of the non-t arget accumu-

lator are written into the address pointed to by

W13 as a 1.15 fraction. W13 is then

incremented by 2 ( for a word write) .

2.4.2.3 Round Logic

The round logic is a combinational block which per-

forms a conventional (biased) or convergent (unbi-

ased) round function during an accumulator write

(store). The Round mode is determined by the state of

the RND bit in the CORCON register . It generates a 16-

bit, 1.15 data value which is passed to the data space

write satura tion logic . If rounding is not indica ted by the

instruction, a truncated 1.15 data value is stored and

the least significant word (lsw) is simply discarded.

Conventional rounding takes bit 15 of the accumulator ,

zero-extends it and adds it to the AC CxH w ord (bi t s 16

through 31 of the accumulator). If the ACCxL word

(bits 0 through 15 of the accumulator) is between

0x8000 and 0xFFFF (0x8000 included), ACCxH is

incremented. If ACCxL is between 0x0000 and 0x7FFF,

ACCxH is left unchanged. A consequence of this

algorith m is that over a su ccessio n of random roun ding

operations, the value will tend to be biased slightly

positive.

Convergent (or unbiased) rounding operates in the

same manner as conventional rounding, except when

ACCxL equals 0x8000. If this is the case, the LSb

(bit 16 of the accumulator) of ACCxH is examined. If it

is ‘1’, ACCxH is incremented. If it is ‘0’, ACCxH is not

modif ied . Assu min g th at bit 16 is effec tive ly ra ndom in

nature, th is s c hem e w i ll re mo ve any rou ndi ng b ias th at

may accumulate.

The SAC and SAC.R instructions store either a trun-

cated (SAC) or rounded (SAC.R) version of the cont ents

of th e ta rget ac cumu lator t o d ata memo ry vi a th e X bu s

(subject to data saturation, see Section 2.4.2.4 “Data

Space Write Saturation”). Note that for th e MAC cl as s

of instructions, the accumulator write back operation

will fu nction in t he same ma nner , a ddressing combine d

MCU (X and Y) data space though the X bus. For this

class of instructions, the data is always subject to

rounding.

dsPIC30F6011A/6012A/6013A/6014A

2.4.2.4 Data Space Write Saturation

In addition to adder/sub tracter saturation, writes to data

space may also be saturated but without affecting the

contents of the source accumulator. The data space

write saturation logic block accepts a 16-bit, 1.15 frac-

tional value from the round logic block as its input,

together with overflow status from the original source

(accumulator) and the 16-bit round adder. These are

combined and used to select the appropriate 1.15

fractional value as output to write to data space

memory.

If the SATDW bit in the CORCON register is set, data

(after roundi ng or trun ca tio n) is tes te d for ove rflo w and

adjusted accordingly, For input data greater than

0x007FF F, data writte n to memory i s forced to the max-

imum posit ive 1. 15 val ue, 0x7FFF. For input data le ss

than 0x FF8000, dat a wri tten to memo ry is f orced to the

maximum negative 1.15 value, 0x8000. The MSb of the

source (bit 39) is used to determine the sign of the

operand bei ng tes ted.

If the SATDW bit i n the CORCON register is not set, th e

input data is always passed through unmodified under

all con dit ion s.

2.4.3 BARREL SHIFTER

The barrel shifter is capable of performing up to 16-bit

arithmetic or logic right shifts, or up to 16-bit left shifts

in a single cycle. The s ource can be either of the two

DSP accumulators, or the X bus (to support multi-bit

shifts of register or memory data).

The sh ifter requi res a s ign ed bi nary v al ue to de term in e

both the m agnitude (number of bits) and dir ection of the

shift operation. A positive value will shift the operand

right. A negative value will shift the operand left. A

value of ‘0’ will not modify the operand.

The barrel shifter is 40 bits wide, thereby obtaining a

40-bit res ult for DSP shift ope rations an d a 16-bit resu lt

for MCU shift operations. Data from the X bus is pre-

sented to the barrel shifter between bit positions 16 to

31 for right sh ifts, and bit positio ns 0 to 16 for left sh ifts.

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

3.0 MEMORY ORGANIZATION

3.1 Program Address Space

The program address space is 4M instruction words. It

is addressable by a 24-bit value from either the 23-bit

PC, table instruction Effective Address (EA), or data

space EA, when program space is mapped into data

space as defined by Table 3-1. Note that the program

spa ce add ress i s increm ented b y tw o betwee n suc ces-

sive program words in order to provide compatibility

with data space addressing.

User program space access is restricted to the lower

4M instruction word address range (0x000000 to

0x7FFFFE) for al l acces se s other than TBLRD/TBLWT,

which use TBLPAG<7> to determin e user or conf igura-

tion space access. In Table 3-1, Program Space

Address Construction, bit 23 allows access to the

Device ID, the Unit ID and the configuration bits.

Otherwise, bit 23 is always clear.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the dsPIC30F

Programmer’s Reference Manual (DS70030). Note: The address map sho wn in Figure 3-1 and

Figure 3-2 is conceptual, and the actual

memory configuration may vary across

individual devices depending on available

memory.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 3-1:

PROGRAM SPACE MEMORY

MAP FOR dsPIC30F601 1A/

6013A

FIGURE 3-2:

PROGRAM SPACE MEMORY

MAP F OR dsPIC 30F60 12A/

6014

Reset – Target Address

User Memory

Space

000000

00007E

000002

000080

Device Configuration

User Flash

Program Memory

016000

015FFE

Configuration Memory

Space

Data EEPROM

(44K instructions)

(2 Kbytes)

800000

F80000

Registers F8000E

F80010

DEVID (2) FEFFFE

FF0000

FFFFFE

Reserved F7FFFE

Reserved

7FF800

7FF7FE

(Read ‘0’s)

8005FE

800600

UNITID (32 instr.)

Vector Tables

8005BE

8005C0

Reset – GOTO Instruction

000004

Reserved

7FFFFE

Reserved

000100

0000FE

000084

Alternate Vector Table

Reserved

Interru pt Vector Tab le

Reset – Target Address

User Memory

Space

000000

00007E

000002

000080

Device Configuration

User Flash

Progra m Mem ory

018000

017FFE

Configuration Memory

Space

Data EEPROM

(48K instructions)

(4 Kbytes )

800000

F80000

Registers F8000E

F80010

DEVID (2) FEFFFE

FF0000

FFFFFE

Reserved F7FFFE

Reserved

7FF000

7FEFFE

(Read ‘0’s)

8005FE

800600

UNITID (32 instr.)

Vector Tables

8005BE

8005C0

Reset – GOTO Instruction

000004

Reserved

7FFFFE

Reserved

000100

0000FE

000084

Al ternate Vector Table

Reserved

Interrupt V e ctor Table

dsPIC30F6011A/6012A/6013A/6014A

TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION

FIGURE 3-3: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION

Access Type Access

Space Program Space Address

<23> <22:16> <15> <14:1> <0>

Instruction Access User 0PC<22:1> 0

TBLRD/TBLWT User

(TBLPAG<7> = 0)TBLPAG<7:0> Data EA<15:0>

TBLRD/TBLWT Configuration

(TBLPAG<7> = 1)TBLPAG<7:0> Data EA<15:0>

Program Space Visibility User 0PSVPAG<7:0> Data EA<14:0>

0Program Counter

23 bits

PSVPAG Reg

8 bits

15 bits

Program

Using

Select

TBLPAG Reg

8 bits

16 b i ts

Using

Byte

24-bit EA

1/0

Select

User/

Configuration

Table

Instruction

Program

Space

Counter

Using

Space

Select

Visibility

Note: Program space visibi lity cannot be used to access bit s <23:16> of a word in program memo ry .

dsPIC30F6011A/6012A/6013A/6014A

3.1.1 DATA ACCESS FROM PROGRAM

MEMORY USING TABLE

INSTRUCTIONS

This arc hit ec ture f etc hes 24 -bi t w ide pro gram memo ry.

Consequently, instructions are always aligned.

However, as the architecture is modified Harvard, data

can also be present in program space.

There are two methods by which program space can

be accessed: via special table instructions, or through

the rema ppi ng of a 16 K w ord prog ram space page in to

the u pp e r half o f da ta space (s ee Section 3.1.2 “Data

Access From Program Memory using Program

Space Visibility”). The TBLRDL and TBLWTL instruc-

tions offer a direct method of reading or writing the lsw

of any address within program space, without going

through da ta space. The TBLRDH and TBLWTH instruc-

tions are th e only metho d whereby the upp er 8 bits of a

program space word can be accessed as data.

The PC is incremented by two for each successive

24-bit program word. This allows program memory

addresses to directly map to data space addresses.

Program memory can thus be regarded as two 16-bit

word wide address s p ac es , res id ing si de by si de, eac h

with the same address range. TBLRDL and TBLWTL

access the space which contains the Least Significant

Data Word, and TBLRDH and TBLWTH access the

space which contains the Most Significant Data Byte.

Figure 3-3 show s h ow th e EA is created fo r t a ble op er-

ations and data space accesses (PSV = 1). Here,

P<23:0> refers to a program space word, whereas

D<15:0> refers to a data space word.

A set of t able in struction s a re p r ov ide d t o m ov e by te or

word siz ed data to and from program space.

1. TBLRDL: Tab le Re ad Low

Word: Read the lsw of the program address;

P<15:0> maps to D<15:0>.

Byte: Read one of the LSBs of the program

address;

P<7:0> maps to the destination byte when byte

select = 0;

P<15:8> m aps to the d estination byte when byte

select = 1.

2. TBLWTL: Tabl e Write Lo w (re fer t o Section 6.0

“Flash Program Memory” for details on Flash

Programming)

3. TBLRDH: Tab le Re ad Hi gh

Word: Read the mo st sign ificant word o f the pr o-

gram address; P<23:16> maps to D<7:0>;

D<15:8> will always be = 0.

Byte: Read one of the MSBs of the program

address;

P<23:16> maps to the destination byte when

byte select = 0;

The destination byte will always be = 0 when

byte select = 1.

4. TBLWTH: Table Write High (ref er to Section 6.0

“Flash Program Memory” for details on Flash

Programming).

FIGURE 3-4: PR OGRAM DATA TABLE ACCESS (LEAST SIGNIFICANT WORD)

PC Address

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ Byte

(read as ‘0’)

TBLRDL.W

TBLRDL.B (Wn<0> = 1)

TBLRDL.B (Wn<0> = 0)

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 3-5: PROGRAM DATA TABLE ACCESS (MSB)

3.1.2 DATA ACCESS FROM PROGRAM

MEMORY USING PROGRAM

SPACE VISIBILITY

The upper 32 Kbytes of data space may optionally be

mapped into any 16K word program space page. This

provides transparent access of stored constant data

from X data space without the need to use special

instruc tio ns (i.e ., TBLRDL/H, TBLWTL/H ins tru cti ons).

Program space access through the data space occurs

if the MSb of the data space EA is set and program

space visibility is enabled by setting the PSV bit in the

Core Control register (CORCON). The functions of

CORCON are dis cuss ed in Section 2.4, DSP Engine.

Data accesses to this area add an additional cycle to

the instruction being executed, since two program

memory fetch es are requ ire d.

Note that the upper half of addressable data space is

always part of the X data space. Therefore, when a

DSP ope ration uses p rogram sp ace mapp ing to acces s

this m em ory regi on , Y d ata space should ty pic al ly co n-

tain state (variable) data for DSP operations, whereas

X data space should typically contain coefficient

(constant) data.

Although each dat a sp ace address, 0x8000 and higher ,

maps directly into a corresponding program memory

address (see Figure 3-6), only the lower 16 bits of the

24-bit program word are used to contain the data. The

upper 8 bits shoul d be progra mmed to forc e an illeg al

instruction to maintain machine robustness. Refer to

the dsPIC30F Programmer’s Reference Manual

(DS70030) for details on instruction encoding.

Note that by incrementing the PC by 2 for each

program memory word, the Least Significant 15 bits of

data space addresses directly map to the Least Signif-

icant 15 bits in the corresponding program space

address es. The remainin g bits are prov ided by the Pro-

gram Sp ace V is ibilit y Page regi ster, PSVPAG<7:0>, as

shown in Figure 3-6.

For instructions that use PSV which are executed

outside a REPEAT loop:

• The following instructions will require one

ins truction cycle in addition to the specifi ed

execution time:

-MAC class of instructions with data operand

prefetch

-MOV instr uctions

-MOV.D instructions

• All other instructions will require two instruction

cycl es in addition to the specified execution time

of the instruction.

For instructions that use PSV which are executed

inside a REPEAT loop:

• The follo wing inst ances will re quire two ins truction

cycl es in addition to the specified execution time

of the instruction:

- Execution in the first iteration

- Execution in the last iteration

- Execution prior to exiting the loop due to an

interrupt

- Execution upon re-entering the loop after an

interr upt is servi ced

• Any other iteration of the REPEAT loop will allow

the instruction accessing data, using PSV, to

execute in a single cycle.

PC Address

0x000000

0x000002

0x000004

0x000006

00000000

Program Memory

‘Phantom’ Byte

(read as ‘0’)

TBLRDH.W

TBLRDH.B (Wn<0> = 1)

TBLRDH.B (Wn<0> = 0)

Note: PSV acc ess is tempo raril y disabl ed durin g

table reads/writes.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 3-6: DATA S PACE WINDOW INTO PROGRAM SPACE OPERATION

23 15 0

PSVPAG(1)

EA<15> =

EA<15> = 1

Data

Space

Data Space

Program Space

15 23

0x0000

0x8000

0xFFFF

0x02

0x000100

0x017FFF

Data Read

Upper Half of Dat a

Space is Mapped

into Program Space

0x010000

Address

Concatenation

BSET CORCON,#2 ; PSV bit set

MOV #0x02, W0 ; Set PSVPAG register

MOV W0, PSVPAG

MOV 0x8000, W0 ; Access program memory location

; using a data space access

Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address (i.e., it defines

the page in program space to which the upper half of data space is being mapped).

dsPIC30F6011A/6012A/6013A/6014A

3.2 Data Address Space

The core has two data spaces. The data spaces can be

considered either separate (for some DSP instruc-

tions), o r as o ne u nified lin ear a ddress ran ge (fo r MC U

instruc tions). The dat a spaces are accessed usi ng two

Address Generation Units (AGUs) and separate data

paths.

3.2.1 DATA SPACE MEMORY MAP

The data space memory is split into two blocks, X and

Y data space. A key element of th is archi tec ture is that

Y space is a subset of X space, and is fully contained

within X space. In order to provide an apparent linear

addressing space, X and Y spaces have contiguous

addresses.

When executing any instruction other than one of the

MAC class of instructions, the X block consists of the 64-

Kbyte data address space (including all Y addresses).

When executing one of the MAC class of instructions,

the X block consists of the 64-Kbyte data address

space excluding the Y address block (for data reads

only). In other words, all other instructions regard the

entire data memory as one composite address space.

The MAC class inst ructions extract the Y addre ss spac e

from data space and address it using EAs sourced from

W10 and W11. The remaining X data space is

address ed using W8 a nd W9. Both addre ss space s are

concurrently accessed only with the MAC class

instructions.

The dat a sp ace mem ory ma ps are sh own in Figu re 3-8

and Figure 3-9.

3.2.2 DATA SPACES

The X data space is used by all instructions and sup-

ports all Addressing modes. There are separate read

and write data buse s. The X read data bus is the return

data path for all instructions that view data space as

combined X and Y address space. It is also the X

address space data path for the dual operand read

instructions (MAC class). The X write data bus is the

only write path to data space for all instructions.

The X data space also supports modulo addressing for

all instructions, subject to Addressing mode restric-

tions. Bit-reversed addressing is only supported for

writes to X data space.

The Y data space is used in concert with the X data

space by the MAC class of instructions (CLR, ED, EDAC,

MAC, MOVSAC, MPY, MPY.N and MSC) to provide two

concurre nt dat a re ad p aths. No writes o ccur a cross th e

Y bus. This c lass of inst ructi ons de dicat es two W reg-

ister poi nters, W 10 and W11, to always ad dress Y dat a

space, independent of X data space, whereas W8 and

W9 always address X data space. Note that during

accum ulator wr ite back , the dat a addres s sp ace is co n-

sidered a combination of X and Y data spaces, so the

write occurs across the X bus. Consequently, the write

can be to any address in the entire data space.

The Y data space can only be used for the data

prefetch operation associated with the MAC class of

instructions. It also supports modulo addressing for

automat ed c irc ula r buffers. Of course, a ll o the r ins truc -

tions can access the Y dat a address sp ace through the

X data path as part of the composite linear space.

The boundary between the X and Y data spaces is

defined as shown in Figure 3-7 and Figure 3-8 and is

not user programmable. Should an EA point to data

outside its own assigned address space, or to a loca-

tion outside physica l memory, an all zero wo rd/byte wil l

be returne d. For exam ple, althou gh Y address spac e is

visible by all non-MAC instructions using any Address-

ing mode , an attem pt by a MAC ins tructi on to fetc h dat a

from tha t sp ace u sing W8 or W 9 (X sp ace poin ters) wil l

return 0x0000.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 3-7: DATA SPACE MEMORY MAP FOR dsPIC30F6011A/6013A

0x0000

0x07FE

0x17FE

0xFFFE

LSB

Address

16 bits

LSBMSB

MSB

Address

0x0001

0x07FF

0x17FF

0xFFFF

0x8001 0x8000

Optionally

Mapped

into Program

Memory

0x1FFF 0x1FFE

0x20000x2001

0x0801 0x0800

0x1801 0x1800

Near

Data

0x1FFE 0x1FFF

2 Kbyte

SFR Space

6 Kbyte

SRAM Space

8 Kbyte

Space

SFR Space

X Data RAM (X)

X Data

Unimplemented (X)

Y Data RAM (Y)

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 3-8: DATA SPACE MEMORY MAP FOR dsPIC30F6012A/6014A

0x0000

0x07FE

0x17FE

0xFFFE

LSB

Address

16 bit s

LSBMSB

MSB

Address

0x0001

0x07FF

0x17FF

0xFFFF

0x8001 0x8000

Optionally

Mapped

into Program

Memory

0x27FF 0x27FE

0x28000x2801

0x0801 0x0800

0x1801 0x1800

Near

Data

0x1FFE 0x1FFF

2 Kbyt e

SFR Space

8 Kbyte

SRAM Space

8 Kbyt e

Space

SFR Space

X Data RAM (X)

X Data

Unimplement ed (X)

Y Data RAM (Y)

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 3- 9: DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS EXAMPLE

TABLE 3-2: EFFECT OF INVALID

MEMORY ACCESSES

All effective addresses are 16 bits wide and point to

bytes within the data space. Therefore, the data space

address range is 64 Kbytes or 32K words.

3.2.3 DATA SPACE WIDTH

The core data width is 16 bits. All internal registers are

organ ized as 16-bit wide words. Dat a sp ac e mem ory is

organized in byte addressable, 16-bit wide blocks.

3.2.4 DATA ALIGNMENT

To help maintain backward compatibility with

PICmicro® devices and improve data space memory

usage ef ficiency, the dsPIC30F ins truction set support s

both word and byte operations. Data is aligned in data

memory and regi sters as words, b ut all da ta sp ace EA s

resolve to bytes. Data byte re ads will rea d the comp lete

word whic h co nt ains the byt e, us ing the L S b of an y EA

to determine which byte to select. The selected byte is

placed onto the LSB of the X data path (no byte

acces ses are possible fro m the Y data pa th as the MAC

class of instruction can only fetch words). That is, data

memory and registers are organized as two parallel

byte wide entities with shared (word) address decode

but separate write lines. Data byte writes only write to

the corresponding side of the array or register which

matches the byte address.

As a consequence of this byte accessibility , al l Effective

Address c alculati ons (includin g those gene rated by the

DSP operations which are restricted to word sized

data) a re inter nally scale d to step thro ugh word ali gned

memory. For example, the core would recognize that

Post-Modified Register Indirect Addressing mode

[Ws++] will result in a value of Ws+1 fo r byte operations

and Ws+2 for word operations.

SFR SPACE

(Y SPACE)

X SPACE

SFR SPACE

UNUSED

X SPACE

Y SPACE

UNUSED

Non-MAC Class Ops (Read) MAC Class Ops (Read)

Indirect EA from any W Indirect EA from W10, W11 Indirect EA from W8, W9

Attempted Operatio n D ata Returned

EA = an unimplemented address 0x0000*

W8 or W9 used to access Y data

spa ce in a MAC instru ction 0x0000

W10 or W11 used to access X

data space in a MAC instruction 0x0000

* An address error trap is gen era ted when an

unimplemented memory address is accessed.

dsPIC30F6011A/6012A/6013A/6014A

All wo rd accesses must be aligned to an eve n address .

Misaligned word data fetches are not supported so

care must b e taken w hen mixing byte and word oper a-

tions, or translating from 8-bit MCU code. Should a mis-

aligned read or write be attempted, an address error

trap wil l be ge ner ated . I f th e er ror oc curre d o n a read ,

the instruction underway is completed, whereas if it

occurre d on a write, the ins truction w ill be execu ted but

the write will not occur. In either case, a trap will then

be exec uted, a llow ing the syst em and /or use r to exam-

ine the machine state prior to execution of the address

fault.

FIGUR E 3-10: DATA ALIGNMENT

All byte loads into any W register are loaded into the

LSB. The MSB is not modified.

A sign-extend (SE) instruction is provided to allow

users to translate 8-bit signed data to 16-bit signed

values. Alternatively, for 16-bit unsigned data, users

can clear the MSB of any W register by executing a

zero-extend (ZE) instruction on the appropriate

address.

Although m os t i ns truc tio ns are capab le of opera t ing o n

word or byte data sizes, it should be noted that some

instructions, including the DSP instructions, operate

only on words.

3.2.5 NEAR DATA SPACE

An 8-Kbyte ‘near’ data space is reserved in X address

memory space between 0x0000 and 0x1FFF, which is

directly add res sab le via a 13-bit abso lute addr ess fiel d

within all memory direct instructions. The remaining X

address space and all of the Y address space is

address able indirec tly. Addi tionally, the whole of X da ta

space is addressable using MOV instructions, which

support memory direct addressing with a 16-bit

address field.

3.2.6 SOFTWARE STACK

The dsPI C DSC de vices c ontai n a softwa re st ack. W1 5

is used as the Stack Pointer.

The Stack Pointer always points to the first available

free word and grows from lower addresses towards

higher ad dresses. It pre-decrement s for stack pops and

post-increments f or stack pushes as shown in Figure 3-

11. Note that for a PC push during any CALL instruc-

tion, the MSB of the PC is zero-extended before the

push, ensuring that the MSB is always clear.

There is a Stack Pointer Limit register (S PLIM) associ-

ated with the Stack Pointer. SPLIM is uninitialized at

Reset. As is t he case f or t h e Stack Point er, SPLIM < 0>

is forced to ‘0’ because all stack operations must be

word aligned. Whenever an Effective Address (EA) is

generated using W15 as a source or destination

pointer, the address thus generated is compared with

the valu e i n SPL IM. If the c ont ents of the Stack Po int er

(W15) and the SPLIM register are equal and a push

operation is performed, a Stack Error Trap will not

occur. The Stac k Error Trap will occ ur on a s ubseq uent

push operation. Thus, for example, if it is desirable to

cause a S t ack Error T rap when the st ack grows bey ond

address 0x2000 in RAM, initialize the SPLIM with the

value, 0x1FFE.

Similarl y, a St ack Pointe r un derflow ( sta ck erro r) trap is

generated when the Stack Pointer address is found to

be less than 0x0800, thus preventing the stack from

interfering with the Special Function Register (SFR)

space.

A write to the SPLIM reg ister should not be immediately

follow ed by an ind irec t read ope rati on usi ng W15.

FIGURE 3-1 1 : CALL STACK FRAME

15 8 7 0

0001

0003

0005

0000

0002

0004

Byte1 Byte 0

Byte3 Byte 2

Byte5 Byte 4

LSBMSB

Note: A PC push during exception processing

will concatenate the SRL register to the

MSB of the PC prior to the push.

PC<15:0>

000000000

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Toward s

Higher Address

0x0000

PC<22:16>

POP : [--W15]

PUSH : [W15++]

dsPIC30F6011A/6012A/6013A/6014A

TA BLE 3-3: CORE REGISTER MAP

SFR Name Address

(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

W0 0000 W0 / WREG 0000 0000 0000 0000

W1 0002 W1 0000 0000 0000 0000

W2 0004 W2 0000 0000 0000 0000

W3 0006 W3 0000 0000 0000 0000

W4 0008 W4 0000 0000 0000 0000

W5 000A W5 0000 0000 0000 0000

W6 000C W6 0000 0000 0000 0000

W7 000E W7 0000 0000 0000 0000

W8 0010 W8 0000 0000 0000 0000

W9 0012 W9 0000 0000 0000 0000

W10 0014 W10 0000 0000 0000 0000

W11 0016 W11 0000 0000 0000 0000

W12 0018 W12 0000 0000 0000 0000

W13 001A W13 0000 0000 0000 0000

W14 001C W14 0000 0000 0000 0000

W15 001E W15 0000 1000 0000 0000

SPLIM 0020 SPLIM 0000 0000 0000 0000

ACCAL 0022 ACCAL 0000 0000 0000 0000

ACCAH 0024 ACCAH 0000 0000 0000 0000

ACCAU 0026 Sign-Extension (ACCA<39>) ACCAU 0000 0000 0000 0000

ACCBL 0028 ACCBL 0000 0000 0000 0000

ACCBH 002A ACCBH 0000 0000 0000 0000

ACCBU 002C Sig n-Extensio n (ACCB<39>) ACCBU 0000 0000 0000 0000

PCL 002E PCL 0000 0000 0000 0000

PCH 0030 — — — — — — — — —PCH0000 0000 0000 0000

TBLPAG 0032 — — — — — — — —TBLPAG0000 0000 0000 0000

PSVPAG 0034 — — — — — — — — PSVPAG 0000 0000 0000 0000

RCOUNT 0036 RCOUNT uuuu uuuu uuuu uuuu

DCOUNT 0038 DCOUNT uuuu uuuu uuuu uuuu

DOSTARTL 003A DOSTARTL 0uuuu uuuu uuuu uuu0

DOSTARTH 003C — — — — — — — — —DOSTARTH0000 0000 0uuu uuuu

DOENDL 003E DOENDL 0uuuu uuuu uuuu uuu0

DOENDH 0040 — — — — — — — — — DOENDH 0000 0000 0uuu uuuu

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000 0000 0000 0000

CORCON 0044 — — — US EDT DL2 DL1 DL0 SATA SATB SATDW ACCSAT IPL3 PSV RND IF 0000 0000 0010 0000

MODCON 0046 XMODEN YMODEN —— BWM<3:0> YWM<3:0> XWM<3:0> 0000 0000 0000 0000

XMODSRT 0048 XS<15:1> 0 uuuu uuuu uuuu uuu0

XMODEND 004A XE<15:1> 1 uuuu uuuu uuuu uuu1

YMODSRT 004C YS<15:1> 0 uuuu uuuu uuuu uuu0

YMODEND 004E YE<15:1> 1 uuuu uuuu uuuu uuu1

XBREV 0050 BREN XB<14:0> uuuu uuuu uuuu uuuu

DISICNT 0052 —— DISICNT<13:0> 0000 0000 0000 0000

TA BLE 3-3: CORE REGISTER MAP (CONTINUED)

SFR Name Address

(Home) Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

4.0 ADDRESS GENERATOR UNITS

The dsPIC DSC core contains two independent

address generator un its: the X AGU and Y AGU. The Y

AGU supports word sized data reads for the DSP MAC

class of instructions only. The dsPIC30F AGUs sup-

port:

• Linear Addressing

• Modulo (Circular) Addressing

• Bit-Revers ed Addre ss in g

Linear and Modulo Data Addressing modes can be

applied to data space or program space. Bit-reversed

address ing is only applic able t o dat a s pa ce add resses .

4.1 Instruction Addressing Mode s

The Addressing modes in Table 4-1 form the basis of

the Addre ssing modes optimized to supp ort the specific

features of individual instructions. The Addressing

modes provided in the MAC class of instructions are

somewhat different from those in the other instruction

types.

4.1.1 FILE REGISTER INSTRUCTIONS

Most Fi le register in structions us e a 13-bit add ress field

(f) to directly address data present in the first 8192

bytes of data memory (Near data space). Most File

whic h is den oted as WREG in these i nstruc tions. The

destination is typically either the same File register or

WREG (with the exception of the MUL instruction),

which w rites the re sult t o a re gister or regi ster p air. The

MOV instruction allows additional flexibility and can

access the entire data space.

4.1.2 MCU INSTRUCTIONS

The three-operand MCU instructions are of the form:

Operand 3 = Operand 1 <function> Operand 2

where O pe rand 1 is alw a ys a work in g reg ister (i.e., th e

Addressing mode can only be register direct) which is

referred to as Wb. Operand 2 can be a W register,

fetched from data memory or a 5-bit literal. The result

location can be either a W register or a data memory

location. The following addressing modes are

supported by MCU instructions:

• Register Direct

• Register Indirect

• Register Indirect Post-modified

• Register Indirect Pre-modified

• 5-bit or 10-bit Literal

TABLE 4-1: FUNDAMENTAL ADDRESSING MODES SUPPORTED

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the dsPIC30F

Programmer’s Reference Manual (DS70030).

Note: Not all instructions support all the

Addressi ng modes given abo ve. Individual

instructions may support different subsets

of these Addres sing mode s.

Addressing Mode Description

File Register Direct The address of the File register is specified explicitly.

decremented) by a constant value.

to form the EA.

dsPIC30F6011A/6012A/6013A/6014A

4.1.3 MOVE AND ACCUMULATOR

INSTRUCTIONS

Move instructions and the DSP accumulator class of

instructions provide a greater degree of addressing

flexibility than other instructions. In addition to the

Addressing modes supported by most MCU instruc-

tions, move and accumulator instructions also support

mode, also referred to as Register Indexed mode.

In summary, the following Addressing modes are

supported by move and accumulator instructions:

• Register Direc t

• Register Indi rec t

• Register Indi rec t Post-mod ifi ed

• Register Indi rec t Pre- mo dif ied

• Register Indirect with Register Offset (Indexed)

• Register Indirect with Literal Offset

• 8-bit Literal

• 16-bit Literal

4.1.4 MAC INSTRUCTIONS

The dual source operand DSP instructions (CLR, ED,

EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also

referred to a s MAC instruction s, utilize a si mplified se t of

Addressing modes to allow the user to effectively

manipulate the data pointers through register indirect

tables.

The 2 source operand prefetch registers must be a

member of the set {W8, W9, W10, W11}. For data

reads, W8 and W9 will always be directed to the X

RAGU and W10 and W11 will always be directed to th e

Y AGU. The ef fective addresses generated (before and

after modification) must, therefore, be valid addresses

within X data space for W8 and W9 and Y data space

for W10 and W11.

In summary, the following Addressing modes are

supported by the MAC class of instructions:

• Register Indirect

• Register Indirect Post-modified by 2

• Register Indirect Post-modified by 4

• Register Indirect Post-modified by 6

• Register Indirect with Register Offset (Indexed)

4.1.5 OTHER INSTRUCTIONS

Besides the various Ad dressing mo des outlined above,

some i nstructio ns use li teral con sta nts of various sizes.

For example, BRA (branch) instructions use 16-bit

signed l iterals to spe cify the branch de stination dire ctly ,

whereas the DISI instruction uses a 14-bit unsigned

literal field. In some instructions, such as ADD Acc, the

source of an operand or result is implied by the opc ode

it self. Cert ain opera tions, such as NOP, do not have any

operands.

4.2 Modulo Addressing

Modulo addressing is a method of providing an auto-

mated means to support circular data buffers using

hardwa re. The obj ective is to remo ve the ne ed for so ft-

ware to perform data address boundary checks when

executing tightly looped code, as is typical in many

DSP algorithms.

Modulo addressing can operate in either data or pro-

gram space (since the data pointer mechanism is

essentially the same for both). One circular buffer can

be support ed in e ach o f the X ( which also provide s th e

pointers int o p rogra m space) and Y d ata spaces. Mod-

ulo addressing can operate on any W register pointer.

However, it is not advisable to use W14 or W15 for mod-

ulo addressing since these two registers are used as

the Stack Frame Pointer and Stack Pointer, respec-

tively.

In general, any particular circular buffer can only be

configu red to o perate in one direc tion, as t here are cer-

tain restrictions on the buffer start address (for incre-

menting buffers), or end address (for decrementing

buffers) based upon the direction of the buffer.

The only exception to the usage restrictions is for buff-

ers which have a power-of-2 length. As these buffers

satisfy the start and end address criteria, they may

operate in a Bidirecti onal mode (i.e., addres s boundar y

checks will be performed on both the lower and upper

address boundaries).

Note: For the MOV instructions, the Addressing

mode specified in the instruction can differ

for the source and destination EA.

However, the 4-bit Wb (register offset)

field is shared between both source and

destination (but typically only used by

one).

Note: Not all instructions support all the

Addressi ng modes given abo ve. Individual

instructions may support different subsets

of these Addres sing mode s.

Note: Register indirect with register offset

addressing is only available for W9 (in X

spa ce) and W11 (in Y spac e).

dsPIC30F6011A/6012A/6013A/6014A

4.2.1 START AND END ADDRESS

The modul o addressing scheme requires that a sta rting

and an endi ng address be specified and loaded into the

16-bit Modulo Buffer Address registers: XMODSRT,

XMODEND, YMODSRT, YMODEND (see Table 3-3).

The leng th of a ci rcular buffer is not di rectly s pecified. It

is determined by the difference between the corre-

sponding start and end addresses. The maximum

possible length of the circular buffer is 32K words

(64 Kbytes).

4.2.2 W ADDRESS REGISTER

SELECTION

The Mod ulo an d Bi t-Rev ers ed Add ress in g Co ntro l re g-

ister M O DCON <1 5:0 > c on t ai ns enable fla gs as w ell a s

a W register field to specify the W address registers.

The XWM and YWM fields select which registers will

operate with modulo addressing. If XWM = 15, X

RAGU and X WAGU modulo addressing is disabled.

Similarly, if YWM = 15, Y AGU modulo addressing is

disabled.

The X Address Space Pointer W register (XWM), to

which modulo addressing is to be applied, is stored in

MODCON <3 :0> (s ee Table 3-3). Modul o ad dres si ng is

enabled for X data sp ace when XWM is set to any value

other than ‘15’ and the XMODEN bit is set at

MODCON<15>.

The Y Address Space Pointer W register (YWM), to

which modulo addressing is to be applied, is stored in

MODCON<7:4>. Modulo addressing is enabled for Y

data space when YWM is set to any value other than

‘15’ and the YMODEN bit is set at MODCON<14>.

FIGURE 4-1: MODULO ADDRESSING OPERATION EXAMPLE

Note: Y space modulo addressing EA calcula-

tions assume word sized data (LSb of

ever y EA is always clea r ).

0x1100

0x1163

Start Addr = 0x110 0

End Addr = 0x1163

Length = 0x0032 words

Byte

Address MOV #0x1100,W0

MOV W0,XMODSRT ;set modulo start address

MOV #0x1163,W0

MOV W0,MODEND ;set modulo end address

MOV #0x8001,W0

MOV W0,MODCON ;enable W1, X AGU for modulo

MOV #0x0000,W0 ;W0 holds buffer fill value

MOV #0x1110,W1 ;point W1 to buffer

DO AGAIN,#0x31 ;fill the 50 buffer locations

MOV W0,[W1++] ;fill the next location

dsPIC30F6011A/6012A/6013A/6014A

4.2.3 MODULO ADDRESSING

APPLICABILITY

Modulo addressing can be applied to the Effective

Address (EA) calculation associated with any W regis-

ter. It is important to realize that the address bound-

aries ch eck for address es less than, or greate r than the

upper (for incrementing buffers), and lower (for decre-

menting buffers) boundary addresses (not just equal

to). Address changes may, therefore, jump beyond

boundaries and still be adjusted correctly.

4.3 Bit-Reversed Addressing

Bit-reversed addressing is intended to simplify data re-

ordering for radix-2 FFT algorithms. It is supported by

the X AGU for data writes only.

The m odifier, which ma y be a c onstant value or reg ister

content s, is re garded as having its b it order reve rsed. The

address source and destination are kept in normal order .

Thus, the only operand requiring reversal is the modifier .

4.3. 1 BIT-REVERSED ADDRESSING

IMPLEMENTATION

Bit-revers ed addres sing is ena ble d wh en:

1. BWM (W register selection) in the MODCON

cannot be accessed using bit-reversed

addressing) and

2. the BREN bit is set in the XBREV register and

3. the Addressing mode used is Register Indirect

with Pre-Increment or Post-Increment.

If the length of a bit-reversed buffer is M = 2N bytes,

then the last ‘N’ bits of the data buffer start address

must be zero s.

XB<14:0> is th e b it-re versed ad dres s mo difier or ‘pivot

point’, which is typically a constant. In the case of an

FFT computation, its value is equal to half of the FFT

dat a buffer size.

When enabled, bit-reversed addressing will only be

executed for register indirect with pre-increment or

post-inc remen t addres sing an d word siz ed dat a wri tes.

It will no t functio n for any ot her Addres sing m ode or for

byte sized data, and normal addresses will be gener-

ated instead. When bit-reversed addressing is active,

the W address pointer will always be added to the

address modifier (XB) and the offset associated with

the Register Indirect Addressing mode will be ignored.

In addition, as word sized data is a requirement, the

LSb of the EA is ignored (and always clear).

If bit -reversed address ing has already been enable d by

setting t he BREN (XBREV<1 5>) bit, then a wr ite to th e

XBREV regist er shou ld not be imm ediate ly follo wed by

an indire ct read operat ion using th e W register that ha s

been designated as the bit-reversed pointer.

Note: The m odulo correcte d Effective Address is

written back to the re giste r only when Pre-

Modify or Post-Modify Addressing mode is

used to compute the Effective Address.

When an address of fset (e.g., [W7+W2]) is

used, modulo address correction is per-

formed but the contents of the register

remain unc han ged.

Note: All bit-reversed EA calculations assume

word sized data (LSb of every EA is

always clear). The XB value is scaled

accordingly to generate compatible (byte)

addresses.

Note: Modulo addressing and bit-reversed

addressing should not be enabled together .

In the event that the user attempts to do

this, bit-reversed addressing will assume

priority when active for the X W AGU, and X

W AGU modulo addressing will be disabled.

However, modulo addressing will continue

to function in the X RAGU.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 4-2: BIT-REVERSED ADDRESS EXAMPLE

TABLE 4-2: BIT-REVERSED ADDRESS SEQUENCE (16-ENTRY)

TABLE 4-3: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER

Normal Address Bit-Reversed Address

A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal

0000 00000 0

0001 11000 8

0010 20100 4

0011 31100 12

0100 40010 2

0101 51010 10

0110 60110 6

0111 71110 14

1000 80001 1

1001 91001 9

1010 10 0101 5

1011 11 1101 13

1100 12 0011 3

1101 13 1011 11

1110 14 0111 7

1111 15 1111 15

Buffer Size (Words) XB<14:0> Bit-Reversed Address Modifier Value

4096 0x0800

2048 0x0400

1024 0x0200

512 0x0100

256 0x0080

128 0x0040

64 0x0020

32 0x0010

16 0x0008

8 0x0004

4 0x0002

2 0x0001

b3 b2 b1 0

b2 b3 b4 0

Bit Locations Swapped Left-to-Right

Around Center of Binary Value

Bit-Reversed Address

XB = 0x0008 for a 16-word Bit-Reversed Buffer

b7 b6 b5 b1

b7 b6 b5 b4b11 b10 b9 b8

b11 b10 b9 b8

b15 b14 b13 b12

Sequential Address

Pivot Point

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

5.0 INTERRUPTS

The dsPIC30F Sensor and General Purpose Family

has up to 41 interrupt sources and 4 processor excep-

tions (traps) which must be arbitrated based on a

priority scheme.

The CPU i s respons ible for rea ding the I nterrupt Vector

Table (IVT) and transferring the address contained in

the interrupt vector to the Program Counter. The inter-

rupt vector is transferred from the program data bus

into the Program Counter via a 24-bit wide multiplexer

on the input of the Program Counter.

The Inte rrupt Vecto r Table (IVT ) and A lter nate In terrupt

Vector Table (AIVT) are placed near the beginning of

program memory (0x000004). The IVT and AIVT are

shown in Table 5-1.

The interrupt controller is responsible for pre-

processing the interrupts and processor exceptions

prior to them being presented to the processor core.

The peripheral interrupts and traps are enabled, priori-

tized and co ntrolle d using cen tral ized Specia l Functio n

Registers:

• IFS0<15:0>, IFS1<15:0>, IFS2<15:0>

All interrupt request flags are maintained in these

three registers. The flags are set by their respec-

tive peripherals or external signals, and they are

cleared via software.

• IEC0<15:0>, IEC1<15:0>, IEC2<15:0>

All interrupt enable control bits are maintained in

these three registers. These control bits are used

to individually enable interrupts from the

peripherals or external signals.

• IPC0<15:0>... IPC10<7:0>

The user assignable priority level associated with

each of these 41 interrupts is held centrally in

these twelve registers.

• IPL<3:0>

The current CPU priority level is explicitly stored

in the IPL bi ts. IPL< 3> i s p res en t in the C ORCO N

STATUS register (SR) in the processor core.

• INTCON1< 15:0>, INTCO N2<15 :0>

Global interrupt control functions are deriv ed from

these two registers. INTCON1 contains the con-

trol and status flags for the processor exceptions.

The INTCON2 register controls the external

interrupt request signal behavior and the use of

the alternate vector table.

All interrupt sources can be user assigned to one of 7

priori ty levels, 1 thro ugh 7, via the IPCx registers . Each

interrupt source is associated with an interrupt vector,

as shown in Table 5-1. Levels 7 and 1 represent the

highest and lowest maskable priorities, respectively.

If the NSTDIS bit (INTCON1<15>) is set, nesting of

interrupts i s prev en ted . Th us , i f a n i nte rrupt is curre ntl y

being serviced, processing of a new interrupt is pre-

vented even if the new interrupt is of higher priorit y than

the one currently being serviced.

Certain interrupts have specialized control bits for fea-

tures like edge or level triggered interrupts, interrupt-

on-change, etc. Control of these features remains

within the peripheral module which generates the

interrupt.

The DISI instruction can be used to disable the pro-

cessing of interrupts of priorities 6 and lower for a cer-

tain number of instructions, during which the DISI bit

(INTCON2<14>) remains set.

When an interrupt is serviced, the PC is loaded with the

address stor ed in the vector locati on in program mem-

ory that cor respond s to the interrupt. Ther e are 63 dif-

feren t vectors within the IVT (refer to Table 5-1) . These

vectors are contained in locations 0x000004 through

0x0000FE of program memory (refer to Table 5-1).

These locations contain 24-bit addresses and in order

to preserve robustness, an address error trap will take

place should the PC attempt to fetch any of these

words during normal execution. This prevents execu-

tion of random data as a result of accidentally decre-

menting a PC into vector space, accidentally mapping

a data space address into vec tor sp ac e, or the PC roll-

ing over to 0x000000 after reaching the end of imple-

mented program memory space. Execution of a GOTO

instruction to this vector space will also generate an

address error trap.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the dsPIC30F

Programmer’s Reference Manual (DS70030). Note: Interrupt flag bit s get set whe n an interrupt

conditi on occ urs, regar dless o f the s tate of

its corresponding enable bit. User soft-

ware should ensure the appropriate inter-

rupt flag bits are clear prior to enabling an

interrupt.

Note: Assigning a priority level of ‘0’ to an inter-

rupt source is equivalent to disabling that

interrupt.

Note: The IPL bits become read only whenever

the NSTDIS bit has been set to ‘1’.

dsPIC30F6011A/6012A/6013A/6014A

5.1 Interrupt Priority

The user assignable interrupt priority (IP<2:0>) bits for

each ind ividual interrupt source are located in the Least

Significant 3 bits of each nibble within the IPCx regis-

ter(s). Bit 3 of each nibble is not used and is read as a

‘0’. These bits define the priority level assigned to a

particular interrupt by the user.

Natural order priority is dete rmined by the po sition of an

interrupt in the vector table, and only affects interrupt

operation when multiple interrupts with the same user-

assigned priority become pending at the same time.

Table 5-1 lists the interrupt numbers and interrupt

sources for the dsPIC DSC device and their associated

vector numbers.

The ability for the user to assign every interrupt to one

of sev en priority l ev els i mp lie s that the u se r c an as sig n

a very high overall priority level to an interrupt with a

low natural order priority. For example, the PLVD

(Low-Voltage Detect) can be given a priority of 7. The

INT0 (External Interrupt 0) may be assigned to priority

level 1, thus giving it a very low effective priority.

TABLE 5-1: INTERRUPT VECTOR TABLE

Note: The user selectable priority levels start at

0 as the lo west pri ority an d level 7 as the

highest priority.

Note 1: The natural order priority scheme has 0

as the highest priority and 53 as the

lowest priority.

2: The natural order priority number is the

same as the INT number.

INT

Number Vector

Number Interrupt Source

Highest Natural Order Priority

0 8 INT0 – External Interrupt 0

1 9 IC1 – I nput Captur e 1

2 10 OC1 – O ut put Com pare 1

3 11 T1 – Timer 1

4 12 IC2 – Inp ut Capt ur e 2

5 13 OC2 – O ut put Com pare 2

6 14 T2 – Timer 2

7 15 T3 – Timer 3

816SPI1

9 17 U1RX – UART1 Receiver

10 18 U1TX – U ART1 Transmitter

11 19 ADC – ADC Convert Done

12 20 NVM – NVM Write Complete

13 21 SI2C – I2C™ Slave Interrupt

14 22 MI2C – I2C M aster Interr upt

15 23 Input Change Interrupt

16 24 INT1 – External Interr upt 1

17 25 IC7 – Inp ut Ca pt ur e 7

18 26 IC8 – Inp ut Ca pt ur e 8

19 27 OC3 – O ut put C om par e 3

20 28 OC4 – O ut put C om par e 4

21 29 T4 – Timer 4

22 30 T5 – Timer 5

23 31 INT2 – External Interr upt 2

24 32 U2RX – UART2 Receiver

25 33 U2TX – UART2 Transm itter

26 34 SPI2

27 35 C1 – Combined IRQ for CAN1

28 36 IC3 – Input Captur e 3

29 37 IC4 – Input Captur e 4

30 38 IC5 – Input Captur e 5

31 39 IC6 – Input Captur e 6

32 40 OC5 – Output Com pare 5

33 41 OC6 – Output Com pare 6

34 42 OC7 – Output Com pare 7

35 43 OC8 – Output Com pare 8

36 44 INT3 – External Interr upt 3

37 45 INT4 – External Interr upt 4

38 46 C2 – Combined IRQ for CAN2

39-40 47-48 Reserved

41 49 DCI – Codec Transfer Done*

42 50 LVD – Low-Volta ge Detect

43-53 51-61 Reserved

Lowest Natural Order Priority

* Reserved on dsPIC30F6011A and

dsPIC30F6013A beca use the DCI module

is no t available on these devices.

dsPIC30F6011A/6012A/6013A/6014A

5.2 Reset Sequence

A Reset is not a true exception, because the interrupt

controll er is not involv ed in the Reset proce ss. The pro-

cessor initializes its registers in response to a Reset

which forces the PC to zero. The processor t hen begins

program execution at location 0x000000. A GOTO

instruction is stored in the first program memory loca-

tion immediately followed by the address target for the

GOTO instruction. The processor executes the GOTO to

the speci f ie d add res s and then begi ns op erat ion at the

specified target (start) address.

5.2.1 RESET SOURCES

In addition to external Reset and Power-on Reset

(POR), there are 6 sources of error conditions which

‘trap’ to the Reset vector.

• Watchdog Time-out:

The watchdog has timed out, indicating that the

process or is no longer ex ecu tin g the corre ct flo w

of code.

• Uninitialized W Register Trap:

An attempt to use an uninitialized W register as

an address pointer will cause a Reset.

• Illegal Instruction Trap:

Attempted execution of any unused opcodes will

result in an illegal instruction trap. Note that a

fetch of an illegal instruction does not result in an

illegal instruction trap if that instruction is flushed

prior to execution due to a flow change.

• Brown-out Reset (BOR):

A momentary dip in the power supply to the

device has been detected which may result in

malfunction.

• Trap Lockout:

Occurrence of multiple trap cond itio ns

simultaneously will cause a Reset.

• Software Reset Instruction

5.3 Traps

Traps can be considered as non-maskable interrupts

indicating a software or hardware error, which adhere

to a predef ined priority , as shown in Table 5-1. They a re

intended to provide the user a means to correct

erroneous o pera t io n d uri ng deb ug and whe n o per atin g

within the application.

Note that many of these trap conditions can only be

detected when th ey occur. Consequently, the ques tion-

able instruction is allowed to complete prior to trap

exception processing. If the user chooses to recover

from the error, the result of the erroneous action that

caused the trap may have to be corrected.

There are 8 fixed priority levels for traps: level 8 through

level 15, which implies that the IPL3 is always set

during processing of a trap.

If the us er is n ot cur rentl y execu ting a trap, a nd he s et s

the IPL<3:0> bits to a value of ‘0111’ (level 7 ), then all

interr upts are disabl ed b ut trap s can st ill be proces sed.

5.3.1 TRAP SOURCES

The following traps are provided with increasing prior-

ity. However, since all traps can be nested, priority has

little effect.

Math Error Trap:

The math error trap executes under the following four

circumstances:

1. Should an attempt be made to divide by zero,

the divide operation will be aborted on a cycle

boundary and the trap taken.

2. If enabled, a math error trap will be taken when

an arithmetic operation on either accumulator A

or B causes an overflow from bit 31 and the

accumulator guard bits are not utilized.

3. If enabled, a math error trap will be taken when

an arithmetic operation on either accumulator A

or B causes a catastrophic overflow from bit 39

and all saturation is disabled.

4. If the shift amount specified in a shift instruction

is greater than the maximum allowed shift

amount, a trap will occur.

Address Error Trap:

This trap is initiated when any of the following

circumstances occ urs:

1. A misaligned data word access is attempted.

2. A data fetch from and unimplemented data

memory location is attempted.

3. A data fetch from an unimplemented program

memory location is attempted.

4. An instruction fetch from vector space is

attempted.

Note: If the user does not intend to take correc-

tive action in the event of a trap error con-

dition, these vectors must be loaded with

the address of a default handler that sim-

ply contains the RESET instruction. If, on

the ot her hand, one of the vectors contai n-

ing an invalid address is called, an

address error trap is generated.

Note: In the MAC class of instructions, wherein

the data space is split into X and Y data

space, unimplemented X space includes

all of Y space, and unimplemented Y

space includes all of X space.

dsPIC30F6011A/6012A/6013A/6014A

5. Execution of a “BRA #literal” instruction or a

“GOTO #literal” ins truc ti on, w he re literal

is an u nimplem ented pr ogram me mory addr ess.

6. Executing instructions after modifying the PC to

point to unimplemented program memory

addresses. The PC may be modified by loading

a value into the stack and executing a RETURN

instruction.

Stack Error Trap:

This trap is initiated under the following conditions:

1. The Stack Pointer is loaded with a value which

is greater than the (user programmable) limit

value written into the SPLIM register (stack

overflow).

2. The Stack Pointer is loaded with a value which

is less than 0x0800 (simple stack underflow).

Oscillato r Fail Trap:

This trap is initiated if the external oscillator fails and

operation becomes reliant on an internal RC backup.

5.3.2 HARD AND SOFT TRAPS

It is possible that multiple traps can become active

within the same cycle (e.g., a misaligned word stack

write to an overflowed address). In such a case, the

fixed priority shown in Figure 5-1 is implemented,

whic h may requir e the user t o check if oth er traps are

pending in order to completely correct the fault.

‘Soft’ traps includ e exceptions of priority le vel 8 through

level 11, inclusive. The arithmetic error trap (level 11)

falls into this category of traps.

‘Hard’ traps include exceptions of priority level 12

through level 15, inclusive. The address error (level

12), stack error (level 13) and oscillator error (level 14)

traps fall into this category.

Each hard trap that occurs must be Acknowledged

before code execution of any type may continue. If a

lower priority hard trap occurs while a higher priority

trap is pending, Acknowledged, or is being processed,

a hard trap conflict will occur.

The device is automatically reset in a hard trap conflict

condition. The TRAPR status bit (RCON<15>) is set

when the Reset occurs so that the condition may be

detected in software.

FI G U RE 5 -1 : TRAP VECTORS

5.4 Interrupt Sequence

All interr upt event flags are sampled in the be ginning of

each instruction cycle by the IFSx registers. A pending

Interrupt Request (IRQ) is indicated by the flag bit

being equal to a ‘1’ in an IFSx register. The IRQ will

cause an interrupt to occur if the corresponding bit in

the Interrupt Enable (IECx) register is set. For the

remainder of the instruction cycle, the priorities of all

pending interrupt requests are evaluated.

If there is a pending IRQ with a priority level greater

than the current processor priority level in the IPL bits,

the processor will be interrupted.

The processor then stacks the current Program

Counter and the low byte of the processor STATUS

the STATUS register contains the processor priority

level at the time prior to the beginning of the interrupt

cycle. The processor then loads the priority level for

this interrupt into the STATUS register. This action will

disable all lower priority interrupts until the completion

of the Interrupt Service Routine.

Stack Error Trap Vector

Oscillator Fail Trap Vector

Address Error Trap Vector

Reserved Vector

Math Error Trap Vector

Reserved

Oscillator Fail Trap Vector

Address Error Trap Vector

Reserved Vector

Interrupt 0 Vector

Interrupt 1 Vector

Interrupt 52 Vector

Interrupt 53 Vector

Math E rror Trap Vector

Decreasing

Priority

0x000000

0x000014

Reserved

Stack Error Trap Ve ctor

Reserved Vector

Interrupt 0 Vector

Interrupt 1 Vector

Interrupt 52 Vector

Interrupt 53 Vector

IVT

AIVT

0x000080

0x00007E

0x0000FE

Reserved

0x000094

Reset - GOTO Instruction

Reset - GOTO Address 0x000002

Reserved 0x000082

0x000084

0x000004

Reserved Vector

dsPIC30F6011A/6012A/6013A/6014A

FIGUR E 5-2: INTERRUPT STACK

FRAME

The RETFIE (return from interrupt) instruction will

unst ack the Prog ram Counter and STATUS reg isters to

return the processor to its state prior to the interrupt

sequence.

5.5 Alternate Vector Table

In program memory, the Interrupt Vector Table (IVT) is

follow ed b y the A ltern ate I nte rrupt Vector Ta ble (AI V T),

as shown in Table 5-1. Access to the alternate vector

tabl e is provided by the ALTIVT bit in the INTCON2 reg-

ister. If the ALTIVT bit is set, all in terrupt and ex ce ption

processes will use the alternate vectors instead of the

default vectors. The alternate vectors are organized in

the same manner as the default ve ctors. The AIVT sup-

ports emulation and debugging efforts by providing a

means to s wit c h betwe en an applicatio n and a support

environment without requiring the interrupt vectors to

be reprogram m ed. This featu re als o en abl es switc hin g

between applications for evaluation of different

software algorithms at run time.

If the AIVT is not required, the program memory allo-

cated to the AIVT may be used for other purposes.

AIVT is not a protected section and may be freely

programmed by the user.

5.6 Fast Context Saving

A context saving option is available using shadow reg-

isters. Shadow registers are provided for the DC, N,

OV, Z and C bits i n SR, and th e registe rs W0 throu gh

W3. The shadows are only one level deep. The shadow

registers are accessible using the PUSH.S and POP.S

inst ruc tion s onl y.

When the processor vectors to an interrupt, the

PUSH.S instruction can be used to store the current

value of the aforementioned registers into their

respective shadow registers.

If an ISR of a certain priority uses the PUSH.S and

POP.S instructions for fast context saving, then a

higher priority IS R shou ld no t inc lude the s ame ins truc-

tions. Users must save the key registers in software

during a lo wer priorit y interru pt if the hi gher pri ority ISR

uses fast context saving.

5.7 External Interrupt Requests

The interrupt controller supports up to five external

interrupt request signals, INT0-INT4. These inputs are

edge sensitive; they require a low-to-high or a high-to-

low transition to generate an interrupt request. The

INTCON2 register has five bits, INT0EP-INT4EP, that

select the polarity of the edge detection circuitry.

5.8 W ake-up from Sleep and Idle

The interrupt controller may be used to wake-up the

processor from either Sleep or Idle modes, if Sleep or

Idle mode is active when the interrupt is generated.

If an enabled interrupt request of sufficient priority is

received by the interrupt controller, then the standard

interrupt request is presented to the processor. At the

same time, the processor will wake-up from Sleep or

Idle and begin execution of the Interrupt Service

Routine (ISR) needed to process the interrupt request.

Note 1: The user can always lower the priority

level by writing a new value into SR. The

Interrupt Service Routine must clear the

interrupt flag bits in the IFSx register

before lowering the processor interrupt

priority, in order to avoid recursive

interrupts.

2: The IPL3 bit (CORCON<3>) is always

clear when interrupts are being pro-

cessed. It is set only during execution of

traps.

015

W15 (before CALL)

W15 (after CALL)

Stack Grows Towards

Higher Address

0x0000

PC<15:0>

SRL IPL3 PC<22:16>

POP : [--W15]

PUSH: [W15++]

dsPIC30F6011A/6012A/6013A/6014A

TABLE 5-2: INTERRUPT CONTROLLER REGISTER MAP

Note 1: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

2: These bits are not available on the dsPIC30F6011A and dsPIC30F6013A because the DCI module is not available on these devices.

SFR

Name1ADR Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

INTCON1 0080 NSTDIS ———— OVATE OVBTE COVTE — — — MATHERR ADDRERR STKERR OSCFAIL —0000 0000 0000 0000

INTCON2 0082 ALTIVT — — — — — — — — — — INT4EP INT3EP INT2EP INT1EP INT0EP 0000 0000 0000 0000

IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF U1TXIF U1RXIF SPI1IF T3IF T2IF OC2IF IC2IF T1IF OC1IF IC1IF INT0IF 0000 0000 0000 0000

IFS1 0086 IC6IF IC5IF IC4IF IC3IF C1IF SPI2IF U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF IC8IF IC7IF INT1IF 0000 0000 0000 0000

IFS2 0088 — — — — —LVDIF

DCIIF2—— C2IF INT4IF INT3IF OC8IF OC7IF OC6IF OC5IF 0000 0000 0000 0000

IEC0 008C CNIE MI2CIE SI2CIE NVMIE ADIE U1TXIE U1RXIE SPI1IE T3IE T2IE OC2IE IC2IE T1IE OC1IE IC1IE INT0IE 0000 0000 0000 0000

IEC1 008E IC6IE IC5IE IC4IE IC3IE C1IE SPI2IE U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE IC8IE IC7IE INT1IE 0000 0000 0000 0000

IEC2 0090 — — — — —LVDIE

DCIIE2—— C2IE INT4IE INT3IE OC8IE OC7IE OC6IE OC5IE 0000 0000 0000 0000

IPC0 0094 — T1IP<2:0> —OC1IP<2:0>— IC1IP<2:0> — INT0IP<2:0> 0100 0100 0100 0100

IPC1 0096 — T31P<2:0> — T2IP<2:0> — OC2IP<2:0> — IC2IP<2:0> 0100 0100 0100 0100

IPC2 0098 —ADIP<2:0>— U1TXIP<2:0> — U1RXIP<2:0> — SPI1IP<2:0> 0100 0100 0100 0100

IPC3 009A — CNIP<2:0> —MI2CIP<2:0>— SI2CIP<2:0> — NVMIP<2:0> 0100 0100 0100 0100

IPC4 009C —OC3IP<2:0>—IC8IP<2:0>— IC7IP<2:0> — INT1IP<2:0> 0100 0100 0100 0100

IPC5 009E — INT2IP<2:0> — T5IP<2:0> — T4IP<2:0> — OC4IP<2:0> 0100 0100 0100 0100

IPC6 00A0 — C1IP<2:0> — SPI2IP<2:0> — U2TXIP<2:0> — U2RXIP<2:0> 0100 0100 0100 0100

IPC7 00A2 — IC6IP<2:0> —IC5IP<2:0>— IC4IP<2:0> — IC3IP<2:0> 0100 0100 0100 0100

IPC8 00A4 —OC8IP<2:0>—OC7IP<2:0>— OC6IP<2:0> — OC5IP<2:0> 0100 0100 0100 0100

IPC9 00A6 — — — — — C2IP<2:0> — INT41IP<2:0> — INT3IP<2:0> 0000 0100 0100 0100

IPC10 00A8 — — — — — LVDIP<2:0> —DCIIP<2:0>2— — — — 0000 0100 0100 0000

dsPIC30F6011A/6012A/6013A/6014A

6.0 FLASH PROGRAM MEMORY

The dsPIC30F family of devices contains internal pro-

gram Fla sh memory f or executing user code. Th ere are

two methods by which the user can program this

memory:

1. Run-Time Self-Program ming (RTSP)

2. In-Circuit Serial Programming™ (ICSP™)

6.1 In-Circuit Serial Programming

(ICSP)

dsPIC30F devices can be serially programmed while i n

the end ap plica tion ci rcuit. Th is is s imply do ne wit h two

lines for Programming Clock and Programming Data

(which are named PGC and PGD respectively), and

three other lines for Power (VDD), Ground (VSS) and

Master Clear (MCLR). this allows customers to manu-

facture boards with unprogrammed devices, and then

program the microcontroller just before shipping the

product. This also allows the most recent firmware or a

custom firmware to be programmed.

6.2 Run-Time Self-Programming

(RTSP)

RTSP is accomplished using TBLRD (table read) and

TBLWT (table wr ite) ins tru cti ons .

With RTSP, the user may erase program memory, 32

instruc tions (96 by tes ) at a tim e an d c an wr it e pro gram

memory data, 32 instructions (96 bytes) at a time.

6.3 Table Instruction Operation

Summary

The TBLRDL and the TBLWTL instructions are used to

read or write to bits<15:0> of program memory.

TBLRDL and TBLWTL can access program memory in

Word or Byte mode.

The TBLRDH and TBLWTH instruc tions are us ed to read

or write to bits<23:16> of program memory. TBLRDH

and TBLWTH can access program memory in Word or

Byte mode.

A 24-bit program memory address is formed using

bits<7:0> of the TBLPAG register and the Effective

Address (EA) from a W register specified in the table

instruction, as shown in Figure 6-1.

FIGURE 6-1: ADDRESSING FOR TABLE AND NVM REGISTERS

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the dsPIC30F

Programmer’s Reference Manual (DS70030).

Program Counter

24 bits

NVMADRU Reg

8 bits 16 bits

Program

Using

TBLPAG Reg

8 bits

Working Reg EA

16 bits

Using

Byte

24-bit EA

1/0

Select

Table

Instruction

NVMADR

Addressing

Counter

Using

NVMADR Reg EA

User/Configuration

Space Select

dsPIC30F6011A/6012A/6013A/6014A

6.4 RTSP Operation

The dsPIC30F Flash program memory is organized

into rows and panels. Each row consists of 32 instruc-

tions or 96 bytes. Each panel consists of 128 rows or

4K x 24 instru ctions. RTSP allows the user to erase one

row (32 instructions) at a time and to program four

instructions at one time. RTSP may be used to program

multiple program memory panels, but the table pointer

must be changed at each panel boundary.

Each panel of program memory contains write latches

that hold 32 instructions of programming data. Prior to

the actual programming operation, the write data must

be loaded into the panel write latches. The data to be

programmed into the panel is loaded in sequential

order into the write latches: instruction 0, instruction 1,

etc. T he i ns truc tio n words load ed m us t a lw ay s be fro m

a group of 32 boundary.

The basi c sequence for R TSP programming is to set up

a table point er, then do a se ries o f TBLWT instructions

to load th e wri te latc hes. Program ming is perfo rmed by

setting the special bits in the NVMCON register. Four

TBLWTL and four TBLWTH instructions are required to

load the four instructions. If multiple panel program-

ming is required, the table pointer needs to be changed

and the next set of multiple write latches written.

All of the table write operations are single word writes

(2 instruction cycles) because only the table latches

are written. A programming cycle is required for

programming each row.

The Flash program memory is readable, writable, and

erasable during normal operation over the entire VDD

range.

6.5 Control Registers

The four SFRs used to read and write the program

Flash memory are:

•NVMCON

• NVMADR

• NVMADRU

• NVMKEY

6.5.1 NVMCON REGISTER

The NVMCON register controls which blocks are to be

erased, which memory type is to be programmed and

start of the programming cycle.

6.5.2 NVMADR REGISTER

The NVMADR register is used to hold the lower two

bytes of the Effective Address. The NVMADR register

captures the EA<15 :0> of the last table instru ct ion that

has been executed and selects the row to write.

6.5.3 NVMADRU REGISTER

The NVMADRU register is used to hold the upper byte

of the Effective Address. The NVMADRU register cap-

tures the EA<23:16> of the last table instruction that

has been exec uted.

6.5. 4 NVMKEY REGISTER

NVMKEY is a write only register that is used for write

protection. To start a programming or an erase

sequence, the user must consecutively write 0x55 and

0xAA to the NVMKEY register. Refer to Section 6.6

“Programming Operations” for further details.

Note: The user can also directly write to the

NVMADR and NVMADRU registers to

specify a program memory address for

erasing or programming.

dsPIC30F6011A/6012A/6013A/6014A

6.6 Programming Operations

A complete programming sequence is necessary for

programming or erasing the internal Flash in RTSP

mode. A progra mming operati on is nominally 2 ms ec in

duration and the processor stalls (waits) until the oper-

ation is finished. Setting the WR bit (NVMCON<15>)

starts the operation, and the WR bit is automatically

cleared when the operation is finished.

6.6.1 PROGRAMMING ALGORITHM FOR

PROGRAM FLASH

The user can erase and program one row of program

Flash memory at a time. The general process is:

1. Read one row of program Flash (32 instruction

words) and store into data RAM as a data

“image”.

2. Update the data image with the desired new

data.

3. Eras e program Flash row.

a) Setup NVMCON register for multi-word,

program Flash, erase, and set WREN bit.

b) Write address of row to be erased into

NVMADRU/NVMADR.

c) Write ‘55’ to NVMKEY.

d) Write ‘AA’ to NVMKEY.

e) Set the WR bit. This will begin erase cycle.

f) CPU will stall for the duration of the erase

cycle.

g) The WR bit is cleared when erase cycle

ends.

4. Write 32 instruction words of data from data

RAM “image” into the program Flash write

latches.

5. Program 32 instruction words into program

Flash.

a) Setup NVMCON register for multi-word,

program Flash, program, and set WREN

bit.

b) Write ‘55’ to NVMKEY.

c) Write ‘AA’ to NVMKEY.

d) Set the WR bit. This will begin program

cycle.

e) CPU will stall for duration of the program

cycle.

f) The WR bit is cleared by the hardware

when program cycle ends.

6. Repeat step s 1 through 5 as needed to program

desired amount of program Flash memory.

6.6.2 ERASING A ROW OF PROGRAM

MEMORY

Example 6-1 sho ws a code se quence tha t can be used

to erase a row (32 instructions) of program memory.

EXAMPLE 6-1: ERASING A ROW OF PROGRAM MEMORY

; Setup NVMCON for erase operation, multi word write

; program memory selected, and writes enabled

MOV #0x4041,W0 ;

MOV W0,NVMCON ; Init NVMCON SFR

; Init pointer to row to be ERASED

MOV #tblpage(PROG_ADDR),W0 ;

MOV W0,NVMADRU ; Initialize PM Page Boundary SFR

MOV #tbloffset(PROG_ADDR),W0 ; Intialize in-page EA[15:0] pointer

MOV W0, NVMADR ; Initialize NVMADR SFR

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

dsPIC30F6011A/6012A/6013A/6014A

6.6.3 LOADING WRITE LATCHES

Example 6-2 shows a sequ ence of instructio ns that can

be used to load the 96 bytes of write latches. 32

TBLWTL and 32 TBLWTH instructions are needed to

load the write latches selected by the table pointer.

EXAMP L E 6-2: LOADING WRIT E LA TCHES

6.6.4 INITIATING THE PROGRAMMING

SEQUENCE

For protec tion, the w rite i nitiate sequenc e for N VMKEY

must be used to allow any erase or program operation

to procee d. After the prog ramming comm and has bee n

executed, the user must wait for the programming time

until programming is complete. The two instructions

following the start of the programming sequence

should be NOPs.

EXAMPLE 6-3: INITIATING A PROGRAMMING SEQUENCE

; Set up a pointer to the first program memory location to be written

; program memory selected, and writes enabled

MOV #0x0000,W0 ;

MOV W0,TBLPAG ; Initialize PM Page Boundary SFR

MOV #0x6000,W0 ; An example program memory address

; Perform the TBLWT instructions to write the latches

; 0th_program_word

MOV #LOW_WORD_0,W2 ;

MOV #HIGH_BYTE_0,W3 ;

TBLWTL W2,[W0] ; Write PM low word into program latch

TBLWTH W3,[W0++] ; Write PM high byte into program latch

; 1st_program_word

MOV #LOW_WORD_1,W2 ;

MOV #HIGH_BYTE_1,W3 ;

TBLWTL W2,[W0] ; Write PM low word into program latch

TBLWTH W3,[W0++] ; Write PM high byte into program latch

; 2nd_program_word

MOV #LOW_WORD_2,W2 ;

MOV #HIGH_BYTE_2,W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

•

; 31st_program_word

MOV #LOW_WORD_31,W2 ;

MOV #HIGH_BYTE_31,W3 ;

TBLWTL W2, [W0] ; Write PM low word into program latch

TBLWTH W3, [W0++] ; Write PM high byte into program latch

Note: In Example 6-2, the contents of the upper byte of W3 has no effect.

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start the erase sequence

NOP ; Insert two NOPs after the erase

NOP ; command is asserted

dsPIC30F6011A/6012A/6013A/6014A

TABLE 6-1: NVM REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

File Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All RESETS

NVMCON 0760 WR WREN WRERR — — — —TWRI — PROGOP<6:0> 0000 0000 0000 0000

NVMADR 0762 NVMADR<15:0> uuuu uuuu uuuu uuuu

NVMADRU 0764 — — — — — — — — NVMADR<23:16> 0000 0000 uuuu uuuu

NVMKEY 0766 — — — — — — — — KEY<7:0> 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

7.0 DATA EEPROM MEMORY

The Data EEPROM Memory is readable and writable

during no rmal operatio n over the enti re VDD range. The

data EEPROM memory is directly mapped in the

program memory address space.

The four SFRs used to read and write the program

Flash memory are used to access data EEPROM

memory, as well. As described in Section 6.5 “Control

Registers”, these re gisters are:

•NVMCON

• NVMADR

• NVMADRU

• NVMKEY

The EEPR OM data memory allows read and writ e of

single words and 16-word blocks. When interfacing to

data memory, NVMADR in conjunction with the

NVMADRU register are used to address the EEPROM

location being accessed. TBLRDL and TBLWTL

instructions are used to read and write data EEPROM.

The dsPIC30F devices have up to 8 Kbytes (4K

words) of data EEPROM with an address ran ge from

0x7FF00 0 to 0x 7FFF FE .

A word wri te operatio n should be prec eded by an e rase

of the corresponding memory location(s). The write typ-

ically requires 2 ms to complete but the write time will

vary w ith voltage and temperature.

A program or erase operation on the data EEPROM

does n ot sto p the ins truc tion fl ow. The us er is re spon-

sible for waiting for the appropriate duration of time

before initiating another data EEPROM write/erase

operation. Attempting to read the data EEPROM while

a programming or erase operation is in progress result s

in unspecified data.

Control bit WR initiates write operations similar to pro-

gram Flash w rit es . Th is bi t c an not be cl eared, on ly se t,

in software. They are cleared in hardware at the com-

pletion of the write operation. The inability to clear the

WR bit in software prevents the accidental or

premature termination of a write operation.

The WREN bit, when set, will allow a write operation.

On powe r-up, the WR EN bit is clear. The WR ERR bit is

set when a write operation is interrupted by a MCLR

Reset or a WDT Time-out Reset during normal opera-

tion. In these situations, following Reset, the user can

check the WRERR bit and rewrite the location. The

address register NVMADR remains unchanged.

7.1 Reading the Data EEPROM

A TBLRD instruction reads a word at the current pro-

gram word address. This example uses W0 as a

pointer to data EEPROM. The result is placed in

EXAMPLE 7-1: DATA EEPROM READ

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the dsPIC30F

Programmer’s Reference Manual (DS70030).

Note: Interrupt flag bit NVMIF in the IFS0 regis-

ter is set when write is complete. It must be

cleared in software.

MOV #LOW_ADDR_WORD,W0 ; Init Pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1

TBLPAG

TBLRDL [ W0 ], W4 ; read data EEPROM

dsPIC30F6011A/6012A/6013A/6014A

7.2 Erasing Dat a EEPROM

7.2.1 ERASI NG A BLOCK OF DATA

EEPROM

In order to erase a block of data EEPROM, the

NVMADRU and NVMAD R registers must initially point

to the block of memory to be erased. Configure

NVMCON for erasing a block of data EEPROM, and

set the ERASE and WREN bits in the NVMCON

shown in Ex ample 7-2.

EXAMPLE 7-2: DAT A EEPROM BLOCK ERASE

7.2.2 ERASING A WO RD OF DATA

EEPROM

The TBLPAG and NVMADR re gisters must point to th e

bloc k. Sele ct erase a block of data F lash, an d set t he

ERASE and WREN bits in the NVMCON register. Set-

ting the WR bit initiates the erase as shown in

Example 7-3.

EXAMPLE 7-3: DATA EEPROM WORD ERASE

; Select data EEPROM block, ERASE, WREN bits

MOV #0x4045,W0

MOV W0,NVMCON ; Initialize NVMCON SFR

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate erase sequence

NOP

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

; Select data EEPROM word, ERASE, WREN bits

MOV #0x4044,W0

MOV W0,NVMCON

; Start erase cycle by setting WR after writing key sequence

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0 ;

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1 ;

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate erase sequence

NOP

; Erase cycle will complete in 2mS. CPU is not stalled for the Data Erase Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine erasure complete

dsPIC30F6011A/6012A/6013A/6014A

7.3 Writing to the Data EEPROM

To write an EEPROM data location, the following

sequen ce must be foll owed :

1. Erase data EEPROM word.

a) Select word, data EEPROM erase and set

WREN bit in NVMCO N regis ter.

b) Write address of word to be erased into

NVMADR.

c) Enable NVM interrupt (optional).

d) Write ‘55’ to NVMKEY.

e) Write ‘AA’ to NVMKEY.

f) Set the WR bit. This will begin erase cycle.

g) Either poll NVMIF bit or wait for NVMIF

interrupt.

h) The WR bit is cle are d when th e erase cycl e

ends.

2. Write data word into data EEPROM write

latches.

3. Program 1 data word into data EEPROM.

a) Select word, data EEPROM program and

set WREN bit in NVMCON register.

b) Enable NVM write done i nterrup t (optio nal).

c) Write ‘55’ to NVMKEY.

d) Write ‘AA’ to NVMKEY.

e) Set the WR bit. This will begin program

cycle.

f) Either poll NVMIF bit or wait for NVM

interrupt.

g) The WR bit is cleared when the write cycle

ends.

The write will not initiate if the above sequence is not

exactly followed (write 0x55 to NVMKEY, write 0xAA to

NVMCON, then set WR bit) for each word. It is strongly

recommended that interrupts be disabled during this

code segment.

Additionally, the WREN bit in NVMCON must be set to

enable writes. This mechanism prevents accidental

writes to data EEPROM due to unexpected code exe-

cution. The WREN bit should be kept clear at all times

except when updating the EEPROM. The WREN bit is

not cleared by hardware.

After a write sequence has been initiated, clearing the

WREN bit wil l not affect the current write cycl e. The WR

bit will be inhibited from being set unless the WREN bit

is set. The WREN bit must be set o n a previous instruc -

tion. Both WR a nd WREN c an not be se t with th e s am e

instruction.

At the completion of the write cycle, the WR bit is

cleared in hardware and the Non-Volatile Memory

Write Complete Interrupt Flag bit (NVMIF) is set. The

user may either enable this interrupt or poll this bit.

NVMIF must be cleared by software.

7.3.1 WRITING A WORD OF DATA

EEPROM

Once the user has erased the word to be programme d,

then a table write instruction is used to write one write

latch, as shown in Example 7-4.

EXAMPLE 7-4: DATA EEPROM WORD WRITE

; Point to data memory

MOV #LOW_ADDR_WORD,W0 ; Init pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1,TBLPAG

MOV #LOW(WORD),W2 ; Get data

TBLWTL W2,[ W0] ; Write data

; The NVMADR captures last table access address

; Select data EEPROM for 1 word op

MOV #0x4004,W0

MOV W0,NVMCON

; Operate key to allow write operation

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Initiate program sequence

NOP

; Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle

; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete

dsPIC30F6011A/6012A/6013A/6014A

7.3.2 WRITING A BLOCK OF DATA

EEPROM

To write a block of data EEPROM, write to all sixteen

latches first, then set the NVMCON register and

progra m the block .

EXAMPLE 7-5: DATA EEPROM BLOCK WRITE

MOV #LOW_ADDR_WORD,W0 ; Init pointer

MOV #HIGH_ADDR_WORD,W1

MOV W1,TBLPAG

MOV #data1,W2 ; Get 1st data

TBLWTL W2,[ W0]++ ; write data

MOV #data2,W2 ; Get 2nd data

TBLWTL W2,[ W0]++ ; write data

MOV #data3,W2 ; Get 3rd data

TBLWTL W2,[ W0]++ ; write data

MOV #data4,W2 ; Get 4th data

TBLWTL W2,[ W0]++ ; write data

MOV #data5,W2 ; Get 5th data

TBLWTL W2,[ W0]++ ; write data

MOV #data6,W2 ; Get 6th data

TBLWTL W2,[ W0]++ ; write data

MOV #data7,W2 ; Get 7th data

TBLWTL W2,[ W0]++ ; write data

MOV #data8,W2 ; Get 8th data

TBLWTL W2,[ W0]++ ; write data

MOV #data9,W2 ; Get 9th data

TBLWTL W2,[ W0]++ ; write data

MOV #data10,W2 ; Get 10th data

TBLWTL W2,[ W0]++ ; write data

MOV #data11,W2 ; Get 11th data

TBLWTL W2,[ W0]++ ; write data

MOV #data12,W2 ; Get 12th data

TBLWTL W2,[ W0]++ ; write data

MOV #data13,W2 ; Get 13th data

TBLWTL W2,[ W0]++ ; write data

MOV #data14,W2 ; Get 14th data

TBLWTL W2,[ W0]++ ; write data

MOV #data15,W2 ; Get 15th data

TBLWTL W2,[ W0]++ ; write data

MOV #data16,W2 ; Get 16th data

TBLWTL W2,[ W0]++ ; write data. The NVMADR captures last table access address.

MOV #0x400A,W0 ; Select data EEPROM for multi word op

MOV W0,NVMCON ; Operate Key to allow program operation

DISI #5 ; Block all interrupts with priority <7 for

; next 5 instructions

MOV #0x55,W0

MOV W0,NVMKEY ; Write the 0x55 key

MOV #0xAA,W1

MOV W1,NVMKEY ; Write the 0xAA key

BSET NVMCON,#WR ; Start write cycle

NOP

dsPIC30F6011A/6012A/6013A/6014A

7.4 Write Verify

Depending on the application, good programming

practice may dictate that the value written to the mem-

ory should be verified against the original value. This

should be used in applications where excessive writes

can stress bits near the specification limit.

7.5 Protection Against Spurious Wri te

There are conditions when the device may not want to

write to the data EEPROM memory. To protect against

spurious EEPROM writes, various mechanisms have

been built-in. On power-up, the WREN bit is cleared;

also, the Power-up Timer prevents EEPROM write.

The writ e in iti ate sequence an d the WR EN bi t together

help prevent an accidental write during brown-out,

power glitch, or software malfunction.

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

8.0 I/O PORTS

All of the device pins (except VDD, VSS, MCLR and

OSC1/CLKI) are shared between the peripherals and

the parallel I/O ports.

All I/O input ports feature Schmitt Trigger inputs for

improved noise immunity.

8.1 Pa ra l le l I/O (PI O ) P o rts

When a peripheral is enabled and the peripheral is

actively driving an associated pin, the use of the pin as

a general purpose output pin is disabled. The I/O pin

may b e read but t he output dri ver for the parallel port bit

will be disabled. If a peripheral is enabled but the

peripheral is not actively driving a pin, that pin may be

driven by a port.

All port pins have three registers directly associated

with the operation of the port pin. The Data Direction

or an output. If the data direction bit is a ‘1’, then the pi n

is an input. All port pins are defined as inputs after a

Reset. Reads from the latch (LATx), read the latch.

Writes to the latch, write the latch (LATx). Reads from

the port (PORTx), read the port pins and writes to the

port pins, write the latch (LATx).

Any bit and its associated data and control registers

that are not valid for a particular device will be dis-

abled. Th at m ean s the corres po ndi ng LATx and TRIS x

registers and the port pin will read as zeros.

When a pin is shared with another peripheral or func-

tion that is defined as an input only, it is nevertheless

regarded as a dedicated port because there is no

other competing source of outputs. An example is the

INT4 pin.

The format of the registers for PORTA are shown in

Table 8-1.

The TRISA (Data Direction Control) register controls

the direction of the RA<7:0> pins, as well as the INTx

pins and the VREF pins. The LATA register supplies

data to the outputs and is readable/writable. Reading

the PORTA register yields the state of the input pins,

while writing the PORTA register modifies the contents

of the LATA register.

A parallel I/O (PIO) port that shares a pin with a periph-

eral is, in general, subservient to the peripheral. The

peripheral’s output buffer data and control signals are

provided to a pair of multiplexers. The multiplexers

select whether the peripheral or the associated port

has own ership of the outp ut dat a and co ntrol si gnals of

the I/O pad cell. Figure 8-2 shows how po rts are shared

with oth er perip herals and the a ssociat ed I/O c ell (p ad)

to which they are connected. Table 8-2 through

Table 8-9 show the formats of the registers for the

shared ports, PORTB through PORTG.

FIGURE 8-1: BLOCK DIAGRAM OF A DEDICATED PORT STRUCTURE

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

Note: The actual bits in use vary between

devices.

WR LAT +

TRIS Latch

I/O Pad

WR Port

Data Bus

Data Latch

Read LAT

Read Port

Read TRIS

WR TRIS

I/O Cell

Dedicated Port Module

dsPIC30F6011A/6012A/6013A/6014A

8.2 Configuring Analog Port Pins

The use of the ADPC FG and TRIS registers control the

operation of the ADC port pins. The port pins that are

desired as analog inputs must have their correspond-

ing TRIS bit set (input). If the TRIS bit is cleared (out-

put), the digital output level (VOH or VOL) will be

converted.

When reading the Port register, all pins configured as

analog input channels will read as cleared (a low level).

Pins configured as digit al inputs will not convert an ana-

log input. Analog levels on any pin that is defined as a

digital input (including the ANx pins) may cause the

input buffer to consume current that exceeds the

device specifications.

FIGURE 8-2: BLOCK DIAGRAM OF A SHARED PORT STRUCTURE

WR LAT +

TRIS Latch

I/O Pad

WR Port

Data Bus

Data Latch

Read LA T

Read Port

Read TRIS

WR TRIS

Peripheral Output Data Output Enable

Peripheral Input Data

I/O Ce l l

Peripheral Module

Peripheral Output Enable

PIO Module

Output Multiplexers

Output Data

Input Data

Peripheral Module Enable

dsPIC30F6011A/6012A/6013A/6014A

TABLE 8-1: PORTA REGISTER MAP FOR dsPIC30F6013A/6014A

TABLE 8-2: PORTB REGISTER MAP FOR dsPIC30F6011A/6012A/6013A/6014A

TABLE 8-3: PORTC REGISTER MAP FOR dsPIC30F6011A/6012A

TABLE 8-4: PORTC REGISTER MAP FOR dsPIC30F6013A/6014A

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISA 02C0 TRISA15 TRISA14 TRISA13 TRISA12 — TRISA10 TRISA9 — TRISA7 TRISA6 — — — — — — 1111 0110 1100 0000

PORTA 02C2 RA15 RA14 RA13 RA12 — RA10 RA9 —RA7RA6 — — — — — — 0000 0000 0000 0000

LATA 02C4 LATA15 LATA14 LATA13 LATA12 — LATA10 LATA9 —LATA7LATA6 — — — — — — 0000 0000 0000 0000

Note: PORTA is not implemented in the dsPIC30F6011A/6012A devices.

SFR

Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISB 02C6 TRISB15 TRISB14 TRISB13 TRISB12 TRISB11 TRISB10 TRISB9 TRISB8 TRISB7 TRISB6 TRISB5 TRISB4 TRISB3 TRISB2 TRISB1 TRISB0 1111 1111 1111 1111

PORTB 02C8 RB15 RB14 RB13 RB12 RB11 RB10 RB9 RB8 RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 0000 0000 0000 0000

LATB 02CB LATB15 LATB14 LATB13 LATB12 LATB11 LATB10 LATB9 LATB8 LATB7 LATB6 LATB5 LATB4 LATB3 LATB2 LATB1 LATB0 0000 0000 0000 0000

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISC 02CC TRISC15 TRISC14 TRISC13 — — — — — — — — — — TRISC2 TRISC1 —1110 0000 0000 0110

PORTC 02CE RC15 RC14 RC13 — — — — — — — — — — RC2 RC1 —0000 0000 0000 0000

LATC 02D0 LATC15 LATC14 LATC13 — — — — — — — — — —LATC2LATC1—0000 0000 0000 0000

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISC 02CC TRISC15 TRISC14 TRISC13 ———————— TRISC4 TRISC3 TRISC2 TRISC1 —1110 0000 0001 1110

PORTC 02CE RC15 RC14 RC13 ———————— RC4 RC3 RC2 RC1 —0000 0000 0000 0000

LATC 02D0 LATC15 LATC14 LATC13 ———————— LATC4 LATC3 LATC2 LATC1 —0000 0000 0000 0000

dsPIC30F6011A/6012A/6013A/6014A

TABLE 8-5: PORTD REGISTER MAP FOR dsPIC30F6011A/6012A

TABLE 8-6: PORTD REGISTER MAP FOR dsPIC30F6013A/6014A

TABLE 8-7: PORTF REGISTER MAP FOR dsPIC30F6011A/6012A

TABLE 8-8: PORTF REGISTER MAP FOR dsPIC30F6013A/6014A

TABLE 8-9: PORTG REGISTER MAP FOR dsPIC30F6011A/6012A/6013A/6014A

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISD 02D2 ———— TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 0000 1111 1111 1111

PORTD 02D4 ———— RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000

LATD 02D6 ———— LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISD 02D2 TRISD15 TRISD14 TRISD13 TRISD12 TRISD11 TRISD10 TRISD9 TRISD8 TRISD7 TRISD6 TRISD5 TRISD4 TRISD3 TRISD2 TRISD1 TRISD0 1111 1111 1111 1111

PORTD 02D4 RD15 RD14 RD13 RD12 RD11 RD10 RD9 RD8 RD7 RD6 RD5 RD4 RD3 RD2 RD1 RD0 0000 0000 0000 0000

LATD 02D6 LATD15 LATD14 LATD13 LATD12 LATD11 LATD10 LATD9 LATD8 LATD7 LATD6 LATD5 LATD4 LATD3 LATD2 LATD1 LATD0 0000 0000 0000 0000

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISF 02DE — — — — — — — — — TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0000 0111 1111

PORTF 02E0 — — — — — — — — — RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000

LATF 02E2 — — — — — — — — — LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISF 02DE — — — — — — — TRISF8 TRISF7 TRISF6 TRISF5 TRISF4 TRISF3 TRISF2 TRISF1 TRISF0 0000 0001 1111 1111

PORTF 02E0 — — — — — — — RF8 RF7 RF6 RF5 RF4 RF3 RF2 RF1 RF0 0000 0000 0000 0000

LATF 02E2 — — — — — — — LATF8 LATF7 LATF6 LATF5 LATF4 LATF3 LATF2 LATF1 LATF0 0000 0000 0000 0000

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TRISG 02E4 TRISG15 TRISG14 TRISG13 TRISG12 —— TRISG9 TRISG8 TRISG7 TRISG6 —— TRISG3 TRISG2 TRISG1 TRISG0 1111 0011 1100 1111

PORTG 02E6 RG15 RG14 RG13 RG12 — — RG9 RG8 RG7 RG6 — — RG3 RG2 RG1 RG0 0000 0000 0000 0000

LATG 02E8 LATG15 LATG14 LATG13 LATG12 —— LATG9 LATG8 LATG7 LATG6 —— LATG3 LATG2 LATG1 LATG0 0000 0000 0000 0000

dsPIC30F6011A/6012A/6013A/6014A

8.3 Input Change Notification Module

The input change notification module provides the

dsPIC30F devices the ability to generate interrupt

requests to the processor, in response to a change of

state on selected input pins. This module is capable of

detecting input change of states even in Sleep mode,

when the cl ocks are disabled. The re are up to 24 exter-

nal signals (CN0 through CN23) that may be selected

(enabled) for generating an interrupt request on a

change of state.

TABLE 8-10:

INPUT CHANGE NOTIFICATION RE GISTER MAP FOR dsPIC30F6011A/6012A

(BITS 15-8)

TABLE 8-11: INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F6011A/6012A

(BITS 7-0)

TABLE 8-12: INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F6013A/6014A

(BIT S 15-8 )

TABLE 8-13: INPUT CHANGE NOTIFICATION REGISTER MAP FOR dsPIC30F6013A/6014A

(BITS 7-0)

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State

CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000

CNEN2 00C2 — — — — — — — — 0000 0000 0000 0000

CNPU1 00C4 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE 0000 0000 0000 0000

CNPU2 00C6 — — — — — — — — 0000 0000 0000 0000

SFR

Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000

CNEN2 00C2 ————— CN18IE CN17IE CN16IE 0000 0000 0000 0000

CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000

CNPU2 00C6 ————— CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Reset State

CNEN1 00C0 CN15IE CN14IE CN13IE CN12IE CN11IE CN10IE CN9IE CN8IE 0000 0000 0000 0000

CNEN2 00C2 — — — — — — — — 0000 0000 0000 0000

CNPU1 00C4 CN15PUE CN14PUE CN13PUE CN12PUE CN11PUE CN10PUE CN9PUE CN8PUE 0000 0000 0000 0000

CNPU2 00C6 — — — — — — — — 0000 0000 0000 0000

SFR

Name Addr. Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

CNEN1 00C0 CN7IE CN6IE CN5IE CN4IE CN3IE CN2IE CN1IE CN0IE 0000 0000 0000 0000

CNEN2 00C2 CN23IE CN22IE CN21IE CN20IE CN19IE CN18IE CN17IE CN16IE 0000 0000 0000 0000

CNPU1 00C4 CN7PUE CN6PUE CN5PUE CN4PUE CN3PUE CN2PUE CN1PUE CN0PUE 0000 0000 0000 0000

CNPU2 00C6 CN23PUE CN22PUE CN21PUE CN20PUE CN19PUE CN18PUE CN17PUE CN16PUE 0000 0000 0000 0000

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

9.0 TIMER1 MODULE

This section describes the 16-bit General Purpose

(GP) Timer1 module and associated Operational

modes. Figure 9-1 de pict s the s impli fied blo ck diagra m

of the 16-bit Timer1 module.

The following sections provide a detailed description

including setup and control registers, along with asso-

ciated bloc k dia grams for t he O peratio nal m odes of th e

timers.

The T imer1 mo dule is a 16-bit timer which can serv e as

the time count er for the rea l-time clo ck, o r operate as a

free-running interval timer/counter . The 16-bit timer has

the following modes:

• 16-bit Timer

• 16-bit Synchronous Counter

• 16-bit Asynchronous Counter

Further, the following operational characteristics are

supported:

• Timer gate operation

• Selectable p rescaler settings

• Timer operation during CPU Idle and Sleep

modes

• Interrupt on 16-bit Period register match or falling

edge of external gate signal

These Operating modes are determined by setting the

appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1

presents a bloc k diagram of the 16-bit T imer1 modu le.

16-bit T imer Mode: In t he 16-bi t T imer m ode, the timer

increments on every instruction cycle up to a match

value preloaded into the Period register PR1, then

resets to ‘0’ and continues to count.

When the CPU goes into the Idle mode, the timer will

stop incrementing unless the TSIDL (T1CON<13>)

bit = 0. If TSIDL = 1, the timer m odule logi c will resum e

the incrementing sequence upon termination of the

CPU Idle mode.

16-bit Synchronous Counter Mode: In the 16-bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal

which is synchronized with the internal phase clocks.

The timer counts up to a match v alue preloaded in PR1,

then reset s to ‘0’ and conti nue s.

When the CPU goes into the Idle mode, the timer will

stop incrementing unless the respective TSIDL bit = 0.

If TSIDL = 1, the timer module logic will resume the

incrementing sequence upon termination of the CPU

Idle mode.

16-bit Asynchronous Counter Mode: In the 16-bit

Asynchronous Counter mode, the timer increments on

every rising edge of the applied external clock signal.

The timer counts up to a match v alue preloaded in PR1,

then reset s to ‘0’ and conti nue s.

When the timer is configured for the Asynchronous

mode of operation and the CPU goes into the Idle

mode, the timer will stop incrementing if TSIDL = 1.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 9-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM

9.1 Timer Gate Operation

The 16-bit timer can be placed in the Gated Time

Accumu lation mode. Th is mode allow s the int ernal TCY

to increment the respective timer when the gate input

signal (T1CK pin) is asserted high. Control bit TGATE

(T1CON<6>) must be set to enable this mode. The

timer must be enabled (TON = 1) and the timer clock

source se t to interna l (TCS = 0).

When the CPU goes into the Idle mode, the timer will

stop incrementing unless TSIDL = 0. If TSIDL = 1, the

timer will resume the incrementing sequence upon

termination of the CPU Idle mode.

9.2 Timer Prescaler

The input clock (FOSC/4 or external clock) to the 16-bit

T imer has a pre scale optio n of 1:1, 1:8, 1:64 a nd 1:256,

selected by control bits TCKPS<1:0> (T1CON<5:4>).

The prescaler counter is cleared when any of the

following occurs:

• a write to the TMR1 register

• a write to the T1CON register

• device Reset, su ch as POR and BOR

However, if the timer is disabled (TON = 0), then the

timer prescaler cannot be reset since the prescaler

clock is halted.

TMR1 is not cleared when T1CON is written. It is

cleared by writing to the TM R1 register.

9.3 Timer Operation During Sleep

Mode

During CPU Sleep mode, the timer will operate if:

• The timer module is enabled (TON = 1) and

• The timer clock sourc e is selected as external

(TCS = 1) and

• The TSYNC bit (T1CON<2>) is asser ted to a logic

‘0’ which defines the external clock source as

asynchronous.

When all three conditions are true, the timer will con-

tinue to count up to the Period register and be reset to

0x0000.

When a ma tch betwe en the tim er and th e Period re gis-

ter occurs, an interrupt can be generated if the

respective timer interrupt enable bit is asserted.

TON

Sync

SOSCI

SOSCO/

PR1

T1IF

Equal Comparator x 16

TMR1

Reset

LPOSCEN

Event Flag

TSYNC

TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

T1CK

TCS

1 x

0 1

TGATE

0 0

Gate

Sync

dsPIC30F6011A/6012A/6013A/6014A

9.4 Timer Interrupt

The 16 -bit timer has the ability to generate an inter rupt on

period match. When the timer count matches the Period

generated if enabled. The T1IF bit must be cleared in

software. The timer interrupt flag, T1IF, is located in the

IFS0 Control register in the interrupt controller.

When the Gated Time Accumulation mode is enabled,

an interr upt will al so be generat ed on the f alling edge of

the gate signal (at the end of the accumulation cycle).

Enabling an interrupt is accomplished via the respec-

tive timer interrupt enable bit, T1IE. The timer interrupt

enable bit is located in the IEC0 Control register in the

inter rupt co ntro lle r.

9.5 Real-Time Clock

Timer1, when operating in Real-Time Clock (RTC)

mode, provides time of day and event time-stamping

capabilities. Key operational features of the RTC are:

• Operation from 32 kHz LP oscillator

• 8-bit prescaler

• Low power

• Real-Time Clock interrupts

These Operating modes are determined by setting the

appropriate bit(s) in the T1CON Control register.

FIGURE 9-2: RECOMMENDE D

COMPONENTS FOR

TI MER1 LP OSCILLATOR

RTC

9.5.1 RTC OSCILLATOR OPERATIO N

When the TON = 1, TCS = 1 and TG ATE = 0, the timer

increme nt s on the ris in g e dge of the 3 2 k H z LP os c ill a-

tor output sig nal, up to the val ue specified in the Period

The TSYNC bit must be asserted to a logic ‘0’

(Asynchronous mode) for correct operation.

Enabling LPOSCEN (OSCCON<1>) will disable the

normal Timer and Counter modes and enable a timer

carry-out wake-up event.

When the CPU enters Sleep mode, the RTC will con-

tinue to operate provided the 32 kHz external crystal

oscillator is active and the control bits have not been

changed. The TSIDL bit should be cleared to ‘0’ in

order for R TC to contin ue ope rati on in Idle mode .

9.5.2 RTC INTERRUPTS

When an interrupt event oc curs, the respectiv e interrupt

flag, T1IF, is asserted and an in terrupt will be generated

if enabled. The T1IF bit must be cleared in software. The

respective Timer interrupt flag, T1IF, is located in the

IFS0 status register in the interrupt controller.

Enabling an interrupt is accomplished via the respec-

tive timer interrupt enable bit, T1IE. The timer interrupt

enable bit is located in the IEC0 Control register in the

interrupt con trol le r.

SOSCI

SOSCO

dsPIC30FXXXX

32.768 kHz

XTAL

C1 = C2 = 18 pF; R = 100K

dsPIC30F6011A/6012A/6013A/6014A

TABLE 9-1: TIMER1 REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR1 0100 Timer1 Register uuuu uuuu uuuu uuuu

PR1 0102 Period Register 1 1111 1111 1111 1111

T1CON 0104 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 —TSYNCTCS —0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

10.0 TIMER2/3 MODULE

This section describes the 32-bit General Purpose

(GP) Timer module (Timer2/3) and associated Opera-

tional modes. Figure 10-1 depicts the simplified block

diagram of the 32-bit Timer2/3 module. Figure 10-2

and Figure 10-3 show Timer2/3 configured as two

independent 16-bit timers, Timer2 and Timer3,

respectively.

The Timer2/3 module is a 32-bit timer (which can be

configured as two 16-bit timers) with selectable

Operating modes. These timers are utilized by other

periphe ral mo dules, such as:

• Input Capture

• Output Compare/Simple PWM

The following sections provide a detailed description,

including setup and control registers, along with asso-

ciated bloc k dia grams for t he O peratio nal m odes of th e

timers.

The 32-bit timer has the following modes:

• Two independent 16-bit timers (Timer2 and

Timer3) with all 16-bit Operating modes (except

Asynchronous Counter mode)

• Single 32-bit timer operation

• Single 32-bit synchronous counter

Further, the following operational characteristics are

supported:

• ADC event trigger

• Timer gate operation

• Selectable p rescaler settings

• Timer operation during Idle and Sleep modes

• Interrupt on a 32-bit period register match

These Operating modes are determined by setting the

appropriate bit(s) in the 16-bit T2CON and T3CON

SFRs.

For 32-bit timer/counter operation, Timer2 is the lsw

and Timer3 is the Most Significant Word (msw) of the

32-bit timer.

16-bit Timer Mode: In the 16-bit mode, Timer2 and

Timer3 can be configured as two independent 16-bit

timers. Each timer can be set up in either 16-bit Timer

mode or 16-bit Synchronous Counter mode. See

Section 9.0 “Timer1 Module”, Timer1 Module for

details on these two Operating modes.

The only functional difference between Timer2 and

Timer3 is that Timer2 provides synchronization of the

clock prescal er output. This is usefu l for high frequenc y

external clock inputs.

32-bit T imer Mode: In t he 32-bi t T imer m ode, the timer

increments on every instruction cycle, up to a match

value preloaded into the combined 32-bit Period

count.

For synchronous 32-bit reads of the Timer2/Timer3

pair, reading the lsw (TMR2 register) will cause the

msw to be read and la tch ed into a 16-bit hold in g regis -

ter, termed TMR3HLD.

For synchronous 32-bit writes, the holding register

(TMR3HLD) must first be written to. When followed by

a write to the TMR2 re gister, the c ontents of TMR3HLD

will be transferred and latched into the MSB of the

32-bit timer (TMR3).

32-bit Synchronous Counter Mode: In the 32-bit

Synchronous Counter mode, the timer increments on

the rising edge of the applied external clock signal

which is synchronized with the internal phase clocks.

The timer counts up to a match value preloaded in the

combined 32-bit period register PR3/PR2, then resets

to ‘0’ and continues.

When the timer is configured for the Synchronous

Counter mode of operation and the CPU goes into the

Idle mode, the timer will stop incrementing unless the

TSIDL (T2CON<13>) bit = 0. If TSIDL = 1, the timer

module logic will resume the incrementing sequence

upon termination of the CPU Idle mode.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

Note: For 32-bit timer operation, T3CON control

bits are ignored. Only T2CON control bits

are used for setup and control. Timer2

clock and gate inputs are utilized for the

32-bit tim er module but an in terrupt is gen-

erated w ith the T imer3 interru pt flag (T3 IF)

and the interrupt is enabled with the

Timer3 interrupt enable bit (T3IE).

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM

TMR3 TMR2

T3IF

Equal Comparator x 32

PR3 PR2

Reset

LSB MSB

Event Flag

Note: Timer conf iguration bit T32 (T2CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control

bits are respective to the T2CON register.

Data Bus<15:0>

Read TMR2

Write TMR2 16

TGATE (T 2 CON<6 >)

(T2CON<6>)

TGATE

TON TCKPS<1:0>

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T2CK

Sync

ADC Event T r igger

Sync

TMR3HLD

Prescaler

1, 8, 64, 256

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 10-2: 16- BIT TI MER2 BLOCK DIAGRAM

FIGURE 10-3: 16- BIT TI MER3 BLOCK DIAGRAM

TON

Sync

PR2

T2IF

Equal Comparator x 16

TMR2

Reset

Event Flag TGATE

TCKPS<1:0>

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T2CK

Sync Prescaler

1, 8, 64, 256

TON

PR3

T3IF

Equal Comparator x 16

TMR3

Reset

Event Flag TGATE

TCKPS<1:0>

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

T3CK

ADC Event Trigger

Sync

Prescaler

1, 8, 64, 256

dsPIC30F6011A/6012A/6013A/6014A

10.1 Timer Gate Operation

The 32-bi t timer can be pl aced in the Ga ted Ti me Accu-

mulation mode. This mode allows the internal TCY to

increm ent the respec tive timer when the gate input si g-

nal (T2CK pin) is asserted high. Control bit TGATE

(T2CO N<6>) mus t be se t to enable this mode . When in

this mode, Timer2 is the originating clock source. The

TGATE setting is ign ored for T imer3. The tim er must be

enabled (TON = 1) and the timer clock source set to

internal (TCS = 0).

The falling edge of the external signal terminates the

count operation but does not reset the timer. The user

must reset the timer in order to start counting from ze ro.

10.2 ADC Event Trigger

When a matc h occurs betwe en the 32-bit timer (TM R3/

TMR2) and the 32-bit combined period register (PR3/

PR2), or be twee n the 16-b it ti me r TM R3 and the 16-b it

period re gister PR3 , a spe cial ADC tri gger ev ent si gnal

is generated by Timer3.

10.3 Timer Prescaler

The in put cloc k (FOSC/4 or external clock) to the timer

has a prescale option of 1:1, 1:8, 1:64, and 1:256,

selected by control bits TCKPS<1:0> (T2CON<5:4>

and T3CON<5:4>). For the 32-bit timer operation, the

originating clock source is Timer2. The prescaler oper-

ation for Timer3 is not applicable in this mode. The

prescaler counter is cleared when any of the following

occurs:

• a write to the TMR2/TMR3 register

• a write to the T2CON/T3CON register

• device Reset, su ch as POR and BOR

However, if the timer is disabled (TON = 0), then the

Timer 2 prescaler cannot be reset since the prescaler

clock is halted.

TMR2/TMR3 is not cleared when T2CON/T3CON is

written.

10.4 Timer Operation During Sleep

Mode

During CPU Sleep mode, the timer will not operate

because the internal clocks are disabled.

10.5 Timer Interrupt

The 32-bit timer module can generate an interrupt on

period ma tch or on the fall ing edg e of the ext ernal ga te

signal. When the 32-bit timer count matches the

respective 32-bit period register, or the falling edge of

the external “gate” signal is detected, the T3IF bit

(IFS0<7>) is asserted and an interrupt will be gener-

ated if enabled. In this mode, the T3IF interrupt flag is

used as the source of the interrupt. The T3IF bit must

be cleared in sof tw are.

Enabling an interrupt is accomplished via the

respective timer interrupt enable bit, T3IE (IEC0<7>).

dsPIC30F6011A/6012A/6013A/6014A

TABLE 10-1: TIMER2/3 REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR2 0106 Timer2 Register uuuu uuuu uuuu uuuu

TMR3HLD 0108 Timer3 Holding Register (for 32-bit timer operations only) uuuu uuuu uuuu uuuu

TMR3 010A Timer3 R egist er uuuu uuuu uuuu uuuu

PR2 010C Period Register 2 1111 1111 1111 1111

PR3 010E Period Register 3 1111 1111 1111 1111

T2CON 0110 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 T32 —TCS —0000 0000 0000 0000

T3CON 0112 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 ——TCS —0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

11.0 TIMER4/5 MODULE

This section describes the second 32-bit General Pur-

pose (GP) Timer module (Timer4/5) and associated

Operational modes. Figure 11-1 depicts the simplified

block diagram of the 32-bit Timer4/5 module.

Figure 11-2 and Figure 11-3 show T i me r4/5 co nfi gure d

as two independent 16-bit timers, Timer4 and Timer5,

respectively.

The Timer4/5 module is similar in operation to the

T imer2/3 module. Howe ver , there ar e some diff erences

which are as follows:

• The Timer4/5 module does not support the ADC

event trigger feature

• Timer4/5 can not be utilized by other peripheral

modules, such as input capt ure a nd

output compare

The Operating modes of the Timer4/5 module are

determined by setting the appropriate bit(s) in the

16-bit T4CON and T5CON SFRs.

For 32-bit timer/counter operation, Timer4 is the lsw

and Timer5 is the msw of the 32-bit timer.

FIGURE 11-1: 32-BIT TIMER 4/5 BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

Note: For 32-bit timer operation, T5CON control

bits are ignored. Only T4CON control bits

are used for setup and control. Timer4

clock and gate inputs are utilized for the

32-bit tim er module but an in terrupt is gen-

erated with the T imer5 int errupt flag (T5IF)

and the interrupt is enabled with the

Timer5 interrupt enable bit (T5IE).

TMR5 TMR4

T5IF

Equal Comparator x 32

PR5 PR4

Reset

LSB

MSB

Event Flag

Note: Timer configuration bit T32 (T4CON<3>) must be set to ‘1’ for a 32-bit timer/counter operation. All control

bits are respective to the T4CON register.

Data Bus<15:0>

TMR5HLD

Read TMR4

Writ e T MR4 16

TGATE (T4CON<6>)

(T4CON<6>)

TGATE

TON TCKPS<1:0>

Prescaler

1, 8, 64, 256

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T4CK

Sync

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 11-2: 16-BIT TIMER4 BLOCK DIAGRAM

FIGURE 11-3: 16-BIT TIMER5 BLOCK DIAGRAM

TON

Sync

PR4

T4IF

Equal Comparator x 16

TMR4

Reset

Event Flag TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

Gate

T4CK

Sync

TON

PR5

T5IF

Equal Comparator x 16

TMR5

Reset

Event Flag TGATE

TCKPS<1:0>

Prescaler

1, 8, 64, 256

TGATE

TCY

TCS

1 x

0 1

TGATE

0 0

T5CK

ADC Event Trigger

Sync

Note: In the dsPIC30F6011A and dsPIC30F6012A devices, there is no T5CK pin. Therefore, in this device the

following modes should not be used for Timer5:

TCS = 1 (16-bit counter)

TCS = 0, TGATE = 1 (gated time accumulation)

dsPIC30F6011A/6012A/6013A/6014A

TABLE 11-1: TIMER4/5 REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

TMR4 0114 Timer 4 Register uuuu uuuu uuuu uuuu

TMR5HLD 0116 Timer 5 Holding Register (for 32-bit operations only) uuuu uuuu uuuu uuuu

TMR5 0118 Timer 5 Register uuuu uuuu uuuu uuuu

PR4 011A Period Register 4 1111 1111 1111 1111

PR5 011C Period Regi ster 5 1111 1111 1111 1111

T4CON 011E TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 T32 —TCS—0000 0000 0000 0000

T5CON 0120 TON —TSIDL— — — — — — TGATE TCKPS1 TCKPS0 ——TCS—0000 0000 0000 0000

Legend: u = uninitialized

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

12.0 INPUT CAPTURE MODULE

This section describes the input capture module and

associated Operational modes. The features provided

by this module are useful in applications requiring fre-

quency (period) and pulse measurement. Figure 12-1

depicts a block diagram of the input capture module.

Input capture is useful for such modes as:

• Frequency/Period/Pulse Measurements

• Additional Sources of External Interrupts

The key operational features of the input capture

module are:

• Simple Capture Event mode

• Timer2 and Timer3 mode selection

• Interrupt on input capture event

These Operating modes are determined by setting the

appropriate bits in the ICxCON register (where

x = 1,2,...,N). The dsPIC DSC devices contain up to 8

capture channels (i.e., the maximum value of N is 8).

12.1 Simple Capture Event Mode

The simple capture events in the dsPIC30F product

family are:

• Capture every falling edge

• Capture every rising edge

• Capture every 4th rising edge

• Capture every 16th rising edge

• Capture every rising and falling edge

These simple Input Capture modes are configured by

setting the appropriate bits ICM<2:0> (ICxCON<2:0>).

12.1.1 CAPTURE PRESCALER

There are four input capture prescaler settings speci-

fied by bits ICM<2:0> (ICxCON<2:0>). Whenever the

capture c hanne l is turn ed of f, the pre scaler co unter w ill

be cleared. In addition, any Reset will clear the

prescaler counter.

FIGURE 12-1: INPUT CAPTURE MODE BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

ICxBUF

Prescaler

ICx pin

ICM<2:0>

Mode Select

Note: Where ‘x’ is shown, reference is made to the registers or bits associated to the respective input capture

channels 1 through N.

Set Flag

ICxIF

ICTMR

T2_CNT T3_CNT

Edge

Detection

Logic

Clock

Synchronizer

1, 4, 16

From GP Timer Module

16 16

FIFO

R/W

Logic

ICI<1:0>

ICBN E, IC OV

ICxCON Interrupt

Logic

Set Flag

ICxIF

Data Bus

dsPIC30F6011A/6012A/6013A/6014A

12.1.2 CAPTURE BUFFER OPERATION

Each capture channel has an associated FIFO buffer

which is four 16-bit words deep. There are two status

flags which provide status on the FIFO buffer:

• ICBFNE - Input Capture Buffer Not Empty

• ICOV - Input Capture Overflow

The ICBFNE will be set on the fir st input ca ptu r e event

and remain set until all capture events have been read

from the FIF O. As each word is read fro m the FIF O, the

remaining words are advanced by one position within

the buffer.

In the event that the FIFO is full with four capture

events and a fifth capture event occurs prior to a read

of the FIFO, an overflow condition will occur and the

ICOV bit will be s et to a logic ‘1’. The fifth capture event

is lost and is not stored in the FIFO. No additional

events will be captured until all four events have been

read from the buffer.

If a FIFO read is performed after the last read and no

new capture event has been received, the read will

yield indetermina te results.

12.1.3 TIMER2 AND TIMER3 SELECTION

MODE

The inp ut capture mod ule cons ist s of up to 8 input cap-

ture chann els. Each channel can select between on e of

two timers for the time base, Timer2 or Timer3.

Selection of the timer resource is accomplished

through SFR bit, ICTMR (ICxCON<7>). Timer3 is the

default timer resource available for the input capture

module.

12.1.4 HALL SENSOR MODE

When the input capture module is set for capture on

every ed ge, rising a nd falli ng, ICM <2:0> = 001, the fol-

lowing operations are performed by the input capture

logic:

• The input capture interrupt flag is set on every

edge, rising and falling.

• The interrupt on Capture mode setting bits,

ICI<1:0>, is ignored since every capture

generates an interrupt.

• A capture overflow condition is not generated in

this mode.

12.2 Input Capture Operati on During

Sleep and Idle Modes

An input capture event will generate a device wake-up

or interrupt, if enabled, if the device is in CPU Idle or

Sleep mode.

Independent of the timer being enabled, the input cap-

ture module will wake-up from the CPU Sleep or Idle

mode when a capture event occurs if ICM<2:0> = 111

and the interrupt enable bit is asserted. The s ame wake-

up can generate an interrupt if the conditions for pro-

cessing the interrupt have been satisfied. The wake-up

feature is useful as a method of adding extra external pin

interrupts.

12.2.1 INPUT CAPTURE IN CPU SLEEP

MODE

CPU Sleep mode allows input capture module opera-

tion w ith reduced function ality. In the CPU Sl eep mod e,

the ICI<1:0> bits are not applicable and the input cap-

ture module can only function as an external interrupt

source.

The capture module must be configured for interrupt

only on rising edge (ICM<2:0> = 111) in order for the

input capture module to be used while the device is in

Sleep mode. The prescale settings of 4:1 or 16:1 are

not applicable in this mode.

12.2.2 INPUT CAPTURE IN CPU IDLE

MODE

CPU Idle mode allows input capture module operation

with full functionality. In the CPU Idle mode, the Inter-

rupt mode selected by the ICI<1:0> bits is applicable,

as well as the 4:1 and 16:1 capture prescale settings

which are defi ned by c on trol bits IC M< 2:0 >. T his m od e

requires the selected timer to be enabled. Moreover,

the ICSIDL bit must be asserted to a logic ‘0’.

If the input capture module is defined as

ICM<2:0> = 111 in CPU Idle mode, the input capture

pin will serve only as an external interrupt pin.

12.3 Input Capture Int e rrupts

The inpu t captur e channe ls have the a bility to generate

an interrupt based upon the selected number of cap-

ture even t s . The sele cti on num be r is se t b y c ont rol bit s

ICI<1:0> (ICxCON<6:5>).

Each chan nel provide s an interrupt flag (ICxI F) bit. The

respective capture channel interrupt flag is located in

the corresponding IFSx status register.

Enabling an interrupt is accomplished via the respec-

tive capture channel interrupt enable (ICxIE) bit. The

capture interrupt enable bit is located in the

corresponding IEC control register.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 12-1: INPUT CAPTURE REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

IC1BUF 0140 Input 1 Capture Register uuuu uuuu uuuu uuuu

IC1CON 0142 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC2BUF 0144 Input 2 Capture Register uuuu uuuu uuuu uuuu

IC2CON 0146 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC3BUF 0148 Input 3 Capture Register uuuu uuuu uuuu uuuu

IC3CON 014A ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC4BUF 014C Input 4 Capture Register uuuu uuuu uuuu uuuu

IC4CON 014E ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC5BUF 0150 Input 5 Capture Register uuuu uuuu uuuu uuuu

IC5CON 0152 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC6BUF 0154 Input 6 Capture Register uuuu uuuu uuuu uuuu

IC6CON 0156 ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC7BUF 0158 Input 7 Capture Register uuuu uuuu uuuu uuuu

IC7CON 015A ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

IC8BUF 015C Input 8 Capture Register uuuu uuuu uuuu uuuu

IC8CON 015E ——ICSIDL— — — — — ICTMR ICI<1:0> ICOV ICBNE ICM<2:0> 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

13.0 OUTPUT COMPARE MODULE

This sec tion desc ribes the ou tput comp are modu le and

associated Operational modes. The features provided

by this module are useful in applications requiring

Operational modes, such as:

• Generation of Variable Width Output Pulses

• Pow er Factor Correction

Figure 13-1 depicts a block diagram of the output

compare module.

The key operational features of the output compare

module include:

• Timer2 and Timer3 Selection mode

• Simple Output Compare Match mode

• Dual Output Compare Match mode

• Simple PWM mode

• Output Compare During Sleep and Idle modes

• Interrupt on Output Compare/PWM Event

These Operating modes are determined by setting the

appropriate bits in the 16-bit OCxCON SFR (where

x = 1,2,3,...,N). The dsPIC DSC devices contain up to

8 compare channels (i.e., the maximum value of N is 8).

OCxRS and OCxR in Figure 13-1 represent the Dual

Compare registers. In the Dual Compare mode, the

OCxR register is used for the f irst comp are and O CxRS

is used for the second compare.

FIGURE 13-1: OUTPUT COMPARE MODE BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

OCxR

Comparator

Output

Logic QS

OCM<2:0>

Output OCx

Set Flag bit

OCxIF

OCxRS

Mode Select

Note: Where ‘x’ is shown, reference is made to the registers associated with the respective output compare

channels 1 through N.

OCFA

OCTSEL 01

T2P2_MATCHTMR2<15:0 TMR3<15:0> T3P3_MATCH

From GP

(for x = 1, 2, 3 or 4)

or OCFB

(for x = 5, 6, 7 or 8)

Timer Module

Enable

dsPIC30F6011A/6012A/6013A/6014A

13.1 Timer 2 and Timer3 Selecti on Mode

Each output compare channel can select between one

of two 16-bit timers, Timer2 or Timer3.

The selection of the timers is controlled by the OCTSEL

bit (OCxCON<3> ). T im er2 is the de fault ti mer reso urce

for the output compare module.

13.2 Simple Output Compare Match

Mode

When control bits OCM<2:0> (OCxCON<2:0>) = 001,

010 or 011, the selected output compare channel is

configured for one of three simple Output Compare

Match modes:

• Compare forces I/O pin low

• Compare forces I/O pin high

• Compare toggles I/O pin

The OCxR reg is ter i s us ed in th es e m ode s. Th e O C xR

selected incrementing timer count. When a compare

occurs, o ne of these Compare Match modes occurs. If

the counter resets to zero before reaching the value in

OCxR, the state of the OCx pin remains unchanged.

13.3 Dual Output Compare Match Mode

When control bits OCM<2:0> (OCxCON<2:0>) = 100

or 101, the selec ted outp ut compare channel is co nfig-

ured for one of two Dual Output Compare modes,

which ar e:

• Single Output Pulse mode

• Continuous Output Pulse mode

13.3.1 SINGLE PULSE MODE

For the use r to confi gure the modul e for the ge ner ation

of a single output pulse, the following steps are

required (assuming timer is off):

• Determine instruction cycle time TCY.

• Calcu la te d es ired pulse w id t h v al ue based on TCY.

• Calcu late ti me to s tart pulse from ti mer st a rt valu e

of 0x0000.

• Write pulse width start and stop times into OCxR

and OCxRS Compare registers (x denotes

channel 1, 2, ...,N).

• Set Timer Period register to value equal to, or

greater than value in OCxRS Compare register.

• Set OCM<2:0> = 100.

• Enable timer, TON (TxCON<15>) = 1.

To initiate another single pulse, issue another write to

set OCM<2:0> = 100.

13.3.2 CONTINUOUS PULSE MODE

For the use r to confi gure the modul e for the ge neratio n

of a continuous stream of output pulses, the following

steps are required:

• Determine instruction cycle time TCY.

• Calculate desired pulse value based on TCY.

• Calcu late timer to st art pulse width from timer sta rt

value of 0x0000.

• Write pulse width start and stop times into OCxR

and OCxRS (x denotes channel 1, 2, ...,N)

Compare registers, respectively.

• Set Timer Period register to value equal to, or

greater than value in OCxRS Compare register.

• Set OCM<2:0> = 101.

• Enable timer, TON (TxCON<15>) = 1.

13.4 Simple PWM Mode

When control bits OCM<2:0> (OCxCON<2:0>) = 110

or 111, the se lected output co mp are chan nel is co nfig-

ured for th e PWM mode of opera tion. When co nfigured

for the PWM mode of operation, OCxR is the ma in latch

(read only) and OCxRS is the secondary latch. This

enables glitchless PWM transitions.

The user must perform the following steps in order to

configure the output compare module for PWM

operation:

1. Set the PWM pe riod by writing to the appropriate

period register.

2. Set the PWM duty cy cle by writ ing to the OCxRS

3. Configure the output compare module for PWM

operation.

4. Set the TMRx prescale value and enable the

Timer, TON (TxCON<15>) = 1.

13.4.1 INPUT PIN FAULT PROTECTION

FOR PWM

When control bits OCM<2:0> (OCxCON<2:0>) = 111,

the selected output compare channel is again config-

ured fo r the PWM mode of op eration with the add itional

feature of input Fault protection. While in this mode, if

a logic ‘0’ is detected on the OCF A/B pin, the respective

PWM output pin is placed in the high-impedance input

state . The O CFLT bit (OCxCO N<4>) in dicate s wh ether

a Fault con di t ion has oc cur red. This st a t e wil l be mai n-

ta ine d un til both of the foll ow in g ev ents have occurred:

• The external Fault condition has been removed.

• The PWM mode has been re-enabled by writing

to the appropriate control bits.

dsPIC30F6011A/6012A/6013A/6014A

13.4.2 PWM PERIOD

The PWM period is specified by writing to the PRx

Equation 13-1.

EQUATION 13-1:

PWM frequency is defined as 1 / [PWM period].

When the selected TMRx is equal to its respective

period reg ister, PRx, th e followi ng four e vent s occur o n

the next increment cycle:

• TMRx is clear e d.

• The OCx pin is set.

- Exception 1: If PWM duty cycle is 0x0000,

the OCx pin will remain low.

- Exception 2: If d uty cycl e is gr eater tha n PRx,

the pin will remain high.

• The PWM duty cycle is latched from OCxRS into

OCxR.

• The corresponding timer interrupt flag is set.

See Figure 13-2 for key PWM period comparisons.

Timer3 is referred to in Figure 13-2 for clarity.

FIGURE 13-2: PWM OUTPUT TIMING

13.5 Output Compare Operation During

CPU Sleep Mode

When the CPU enters Sleep mode, all internal clocks

are stopped. Therefore, when the CPU enters the

Sleep state, the output compare channel will drive the

pin to the active state that was observed prior to

entering the CPU Sleep state.

For exam ple, if the pin was hi gh when the CPU entere d

the Sleep st ate, the pi n will remain high . Likew ise, if the

pin wa s low when the CPU entered th e Sleep st ate, th e

pin will remain low. In either case, the output compare

module will resume operation when the device wakes

up.

13.6 Output Compare Operation During

CPU Idle Mode

When the CPU enters the Idle mode, the output

compare module can operate with full functionality.

The output compare channel will operate during the

CPU Idle m ode if th e O CSID L bi t (O CxCO N<13 >) is at

logic ‘0’ and the sel ec ted tim e b ase (Timer2 or Timer3)

is enable d and the TSIDL bit of the sele cted timer is set

to logic ‘0’.

13.7 Output Compare Interrupts

The outpu t comp are channels have the abil ity to gener-

ate an interrupt on a compare match, for whichever

Match mode has been selected.

For all m odes exc ept the PWM mode, when a comp are

event occurs, the respective interrupt flag (OCxIF) is

asserted and an interrupt will be generated if enabled.

The OCxIF bit is located in the corresponding IFS

status register and must be cleared in software. The

interrupt is enabled via the respective compare inter-

rupt enable (OCxIE) bit located in the corresponding

IEC control register.

For the PWM mode, when a n event occurs, the respec-

tive timer interrupt flag (T2IF or T3IF) is asserted and

an interrupt will be generated if enabled. The IF bit is

located in the IFS0 status register and must be cleared

in software. The interrupt is enabled via the respective

timer int errupt enab le bi t (T2I E or T 3IE) locat ed in t he

IEC0 control register . The output compare interrupt flag

is never set during the PWM mode of operation.

PWM period = [(PRx) + 1] • 4 • TOSC •

(TMRx prescale value)

Period

Duty Cycle

TMR3 = Duty Cycle TMR3 = Duty Cycle

TMR3 = PR3

T3IF = 1

(Interrupt Flag)

OCxR = OCxRS

TMR3 = PR3

(Interrupt Flag)

OCxR = OCxRS

T3IF = 1

(OCxR) (OCxR)

dsPIC30F6011A/6012A/6013A/6014A

TABLE 13-1: OUTPUT COMPARE REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset St ate

OC1RS 0180 Output Compare 1 Secondary Register 0000 0000 0000 0000

OC1R 0182 Output Compare 1 Main Register 0000 0000 0000 0000

OC1CON 0184 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC2RS 0186 Output Compare 2 Secondary Register 0000 0000 0000 0000

OC2R 0188 Output Compare 2 Main Register 0000 0000 0000 0000

OC2CON 018A ——OCSIDL— — — — — — — — OCFLT OCTSE OCM<2:0> 0000 0000 0000 0000

OC3RS 018C Output Compare 3 Secondary Register 0000 0000 0000 0000

OC3R 018E Output Compare 3 Main Register 0000 0000 0000 0000

OC3CON 0190 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC4RS 0192 Output Compare 4 Secondary Register 0000 0000 0000 0000

OC4R 0194 Output Compare 4 Main Register 0000 0000 0000 0000

OC4CON 0196 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC5RS 0198 Output Compare 5 Secondary Register 0000 0000 0000 0000

OC5R 019A Output Compare 5 Main Register 0000 0000 0000 0000

OC5CON 019C ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC6RS 019E Output Compare 6 Secondary Register 0000 0000 0000 0000

OC6R 01A0 Output Compare 6 Main Register 0000 0000 0000 0000

OC6CON 01A2 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC7RS 01A4 Output Compare 7 Secondary Register 0000 0000 0000 0000

OC7R 01A6 Output Compare 7 Main Register 0000 0000 0000 0000

OC7CON 01A8 ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

OC8RS 01AA Output Compare 8 Secondary Register 0000 0000 0000 0000

OC8R 01AC Output Compare 8 Main Register 0000 0000 0000 0000

OC8CON 01AE ——OCSIDL— — — — — — — — OCFLT OCTSEL OCM<2:0> 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

14.0 SPI MODULE

The Serial Peripheral Interface (SPI) module is a syn-

chronou s serial inte rface. It is usefu l for commun icating

with othe r periphera l devices, such as EEPROMs, shift

registers, display drivers and A/D converters, or other

microc ont roll ers . It is comp at ibl e w ith Motorol a' s SPI™

and SIOP interfaces.

14.1 Operating Function Description

Each SPI module consists of a 16-bit shift register,

SPIxSR (whe re x = 1 or 2), us ed for shifti ng data in and

out, and a buffer register, SPIxBUF. A control register,

SPIxCON , configures th e module. Ad ditionally, a statu s

The seria l interfac e consis ts of 4 p ins: SDIx (se rial dat a

input), SDOx (serial data output), SCKx (shift clock

input or output), and SSx (active low slave select).

In Mas ter m od e o pera tio n, SCK is a cl ock o utpu t b ut i n

Slave mode, it is a clock input.

A series of eight (8) or sixteen (16) clock pulses shift

out bits from the SPIxSR to SDOx pin and simulta-

neousl y s hi ft in dat a from SD Ix pin . An interrup t is ge n-

erated when the transfer is complete and the

corresponding interrupt flag bit (SPI1IF or SPI2IF) is

set. This interrupt can be disabled through an interrupt

enable bit (SPI1IE or SPI2IE).

The receive operation is double-buf fered. When a com-

plet e by te i s r ecei ved , i t is tra nsf erre d f rom S PIxS R to

SPIxBUF.

If the re ceive buf fer is full when new data is b eing trans-

ferred from SPIxSR to SPIxBUF, th e module will set th e

SPIROV bit i ndicating an overflow cond ition. The tran s-

fer of the data from SPIxSR to SPIxBUF will not be

completed and the new data will be lost. The module

will no t respond to SCL tran sitions w hile SPIROV is ‘1’,

effectively disabling the module until SPIxBUF is read

by user software.

Transmit writes are also double-buffered. The user

write s to SPIxBU F. When t he master o r sl ave transf er

is completed, the content s of the shift register (SPIxSR)

are moved to the receive buf fer . If any transmit data ha s

been written to the buffer register, the contents of the

transmit buffer are moved to SPIxSR. The received

data is thus placed in SPIxB UF and the transmit dat a in

SPIxSR is ready for the next transfer.

In Master mode, the clock is generated by prescaling

the system clock. Data is transmitted as soon as a

value is written to SPIxBUF. The interrupt is generated

at the middle of the transfer of the last bit.

In Slave mode, data is transmitted and received as

external clock pulses appear on SCK. Again, the inter-

rupt is generated when the last bit is latched. If SSx

control i s enabled , then tran smission and recepti on are

enabled only w hen SS x = low. The SDOx ou tput will be

disabled in SSx mode with SSx high.

The clock provided to the module is (FOSC/4). This

clock is then prescaled by the primary (PPRE<1:0>)

and the secondary (SPRE<2:0>) prescale factors. The

CKE bit determines whether transmit occurs on transi-

tion from active clock state to Idle clock state, or vice

versa. The CKP bit selects the Idle state (high or low)

for the clock.

14.1.1 WORD AND BYTE

COMMUNICATION

A control bit, MODE16 (SPIxCON<10>), allows the

module to communicate in either 16-bit or 8-bit mode.

16-bit operation is identical to 8-bit operation except

that the number of bits transmitted is 16 instead of 8.

The user software must disable the module prior to

changing the MODE16 bit. The SPI module is reset

when the MODE16 bit is changed by the user.

A basic dif ference betwee n 8-bit and 16-bit operat ion is

that the data is transmitted out of bit 7 of the SPIxSR for

8-bit operation, and data is transmitted out of bit15 of

the SPIxSR for 16-bit opera tion. In both mode s, dat a is

shifted into bit 0 of the SPIxSR.

14.1.2 SDOx DISABLE

A control bit , DISSDO, is provided to the SPIxCON reg-

ister to allow the SDOx output to be disabled. This will

allow the SPI module to be connected in an input only

configuration. SDO can also be used for general

purpose I/O.

14.2 Framed SPI Support

The module supports a basic framed SPI protocol in

Master or Sla ve mode. The co ntrol bit FRMEN enables

framed SPI supp ort and c auses the SSx pi n to perform

the frame synchronization pulse (FSYNC) function.

The control bit SPIFSD determines whether the SSx

pin is an input or an output (i.e., whether the module

receives or generates the frame synchronization

pulse). The frame pulse is an active high pulse for a

single SPI clock cycle. When frame synchronization is

enabled, the data transmission starts only on the

subsequent transmit edge of the SPI clock.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

Note: Both the transmit buffer (SPIxTXB) and

the receive buffer (SPIxRXB) are mapped

to the same register address, SPIxBUF.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 14-1: SPI™ BLOCK DIAGRAM

FIGURE 14-2: SPI™ MASTER/SLAVE CONNECTION

Note: x = 1 or 2.

Read Write

Internal

Data Bus

SDIx

SDOx

SSx

SCKx

SPIxSR

SPIxBUF

bit 0

Shift

Clock Edge

Select

FCY

Primary

1, 4, 16, 64

Enable Master Clock

Prescaler

Secondary

Prescaler

1:1 – 1:8

SS and FSYNC

Control Clock

Control

Transmit

SPIxBUF

Receive

Serial Input Buffer

(SPIxBUF)

Shift Register

(SPIxSR)

MSb LSb

SDOx

SDIx

PROCESSOR 1

SCKx

SPI™ Master

Serial Input Buffer

(SPIyBUF)

Shift Register

(SPIySR)

LSb

MSb

SDIy

SDOy

PROCESSOR 2

SCKy

SPI Slav e

Serial Clock

Note: x = 1 or 2, y = 1 or 2.

dsPIC30F6011A/6012A/6013A/6014A

14.3 Slave Select Synchronization

The SSx pin allows a Synchronous Slave mode. The

SPI must be configured in SPI Slave mode with SSx pin

control enabled (SSEN = 1). When the SSx pin is lo w,

transmi ssio n and rec ep tio n are en abled and the SD Ox

pin is driven. W hen SSx pi n goes high , the SDO x pi n is

no longer driven. Also, the SPI module is re-

synchronized, and all counters/control circuitry are

reset. Therefore, when the SSx pin is asserted low

again, transmission/reception will begin at the MSb

even if SSx had been de-asserted in the middle of a

transmit/receive.

14.4 SPI Operation During CPU Sleep

Mode

During Sleep mode, the SPI m odule is sh utd own. If th e

CPU enters Sleep mode while an SPI transaction is in

progress, then the transmission and reception is

aborted.

The transmitter and receiver will stop in Sleep mode.

Howeve r , regi ster conten ts are not af fected by entering

or exiting Sleep mode.

14.5 SPI Operation During CPU Idle

Mode

When the device enters Idle mode, all clock sources

remain functional. The SPISIDL bit (SPIxSTAT<13>)

select s if the SPI modul e will stop o r conti nue on Idle . If

SPISIDL = 0, t he module will contin ue to op erate w hen

the CPU enters Idle mode. If SPISIDL = 1, the module

will stop when the CPU enters Idle mode.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 14-1: SPI1 REGISTER MAP

TABLE 14-2: SPI2 REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

SPI1STAT 0220 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000

SPI1CON 0222 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000

SPI1BUF 0224 Transmit and Receive Buffer 0000 0000 0000 0000

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset St ate

SPI2STAT 0226 SPIEN — SPISIDL — — — — — — SPIROV — — — — SPITBF SPIRBF 0000 0000 0000 0000

SPI2CON 0228 — FRMEN SPIFSD — DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000 0000 0000 0000

SPI2B UF 022A T ransmit and Rece ive Buffer 0000 0000 0000 0000

dsPIC30F6011A/6012A/6013A/6014A

15.0 I2C MODULE

The Inter-Integrated Circuit (I2C) module provides

complete hardware support for both Slave and Multi-

Master modes of the I2C serial communication

standard, with a 16-bit interface.

This module offers the following key features:

•I

2C interface supporting both master and slave

operation.

•I

2C Slave mode supports 7 and 10-bit address.

•I

2C Master mode supports 7 and 10-bit address.

•I

2C port allows bidirectional transfers between

master and slav es.

• Serial clock synchronization for I2C port can be

used as a ha ndshake mechanis m to suspen d and

resume serial transfer (SCLREL control).

•I

2C supports multi-master operation; detects bus

collision and will arbitrate accordingly.

15.1 Operating Function Description

The hardw are fully imple ments al l the master an d slave

functions of the I2C Standard and Fast mode

specifications, as well as 7 and 10-bit addressing.

Thus, the I2C module can operate either as a slave or

a master on an I2C b us .

15.1.1 VARIOUS I2C MODES

The following types of I2C operation are supported:

•I

2C slave operation with 7-bit address

•I

2C slave operation with 10-bit address

•I

2C master operation with 7 or 10-bit address

See the I2C programmer’s model in Figure 15-1.

15.1.2 PIN CONFIGURATION IN I2C MODE

I2C has a 2-pin interface: the SCL pin is clock and the

SDA pin is data.

15.1.3 I2C REGISTERS

I2CCON and I2C STAT are control and s ta tus reg isters ,

respect ively. The I2CCON register is readable and writ-

able. The lower 6 bits of I2CSTAT are read only. The

remaining bits of the I2CSTAT are read/write.

I2CRSR is the shift register used for shifting data,

whereas I2CRCV is the buffer register to which data

bytes are written, or from which data bytes are read.

I2CRCV is the receive buffer as shown in Figure 15-1.

I2CTRN is the transmit register to which bytes are

written during a transmit operation, as shown in

Figure 15-2.

The I2CADD regis ter hol ds the s lave a ddress. A status

bit, ADD10, indicates 10-bit Address mode. The

I2CBRG acts as the Baud Rate Generator reload

value.

In receive operations, I2CRSR and I2CRCV together

form a double-buffered receiver. When I2CRSR

receives a complete byte, it is transferred to I2CRCV

and an interrupt pulse is generated. During

transmission, the I2CTRN is not double-buffered.

FIGUR E 15-1: PROGRAMMER’S MODEL

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

Note: Following a RESTART condition in 10-bit

mode, the user only needs to match the

first 7-bit addre ss.

Bit 7 Bit 0 I2CRCV (8 bits)

Bit 7 Bit 0 I2CTRN (8 bits)

Bit 8 Bit 0 I2CBRG (9 bits)

Bit 15 Bit 0 I2CCON (16 bits)

Bit 15 Bit 0 I2CSTAT (16 bits)

Bit 9 Bit 0 I2CADD (10 bits)

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 15-2: I2C™ BLOCK DIAGRAM

I2CRSR

I2CRCV

Internal

Data Bus

SCL

SDA

Shift

Mat ch Det ect

I2CADD

Start and

St op bit Detect

Clock

Addr_Match

Clock

Stretching

I2CTRN LSB

Shift

Clock

Write

Read

BRG Down I2CBRG

Reload

Control

FCY

Start , RESTART,

Stop bit Generate

Write

Read

Acknowledge

Generation

Collision

Detect

Write

Read

Write

Read

I2CCON

Write

Read

I2CSTAT

Control Logic

Read

LSB

Counter

dsPIC30F6011A/6012A/6013A/6014A

15.2 I2C Module Addresses

The I2CADD register contains the Slave mode

addresses. The register is a 10-bit register.

If the A10M bit (I2CCON<10>) is ‘0’, the address is

inter prete d by the mo dul e as a 7 - bit add ress . When an

address is received, it is compared to the 7 Least

Significant bits of the I2CADD register.

If the A10M bit is ‘1’, the address is assumed to be a

10-bit address. When an address is received, it will be

compared with the binary value ‘11110 A9 A8’ (where

A9 and A8 are t wo Mo st Si gn i f ic ant b its of I2 C AD D) . I f

that valu e m atc hes , th e ne xt ad dre ss will be c om p are d

with the Least Significa nt 8 bits of I2CADD, as specifie d

in the 10-bit addressing protocol.

7-bit I2C Slave Addresses supported by dsPIC30F:

15.3 I2C 7-bit Slave Mode Operation

Once enabled (I2CEN = 1), the slave module will wait

for a S t art bit to occur (i.e., the I2C module is ‘I dle’). Fol-

lowin g t he det ection o f a Start bit , 8 bi t s are s hif ted into

I2CRSR and the address is compared against

I2CADD. In 7-bit mode (A10M = 0), bits I2CADD<6:0>

are compared against I2CRSR<7:1> and I2CRSR<0>

is the R_W bit. All incoming bits are sampled on the

rising edge of SCL.

If an address match occurs, an Acknowledgement will

be sent, and the slave event interrupt flag (SI2CIF) is

set on the falling edge of the ninth (ACK) bit. The

address value is loaded into the I2CRCV buffer, and

the RBF bit is set.

15.3.1 SLAVE TRANSMISSION

If the R_W bit received is a ‘1’, then the serial port will

go into Transmi t mode. It will s end AC K on the ninth b it

and then hold SCL to ‘0’ un til the CPU responds b y writ-

ing to I2C TRN. SCL is rele ased by settin g the SCLREL

bit, and 8 bits of data are shifted out. Data bits are

shifted out on the fa lling edge of SCL, s uch that SDA i s

valid during SCL high. The interrupt pulse is sent on the

falling edge of the ninth clock pulse, regardless of the

status of the ACK received from the master.

15.3.2 SLAVE RECEPTION

If the R_W bit received is a ‘0’ during an address

match, then Receive mode is initiated. Incoming bits

are sampled on the rising edge of SCL. After 8 bits are

received, if I2CRCV is not full or I2COV is not set,

I2CRSR is transferred to I2CRCV. ACK is sent on the

ninth clock.

If the RBF flag is set, indicating that I2CRCV is still

holding data from a pre vious operati on (RBF = 1), the n

ACK is not sent; however, the interrupt pulse is gener-

ated. In the case of an overflow, the contents of the

I2CRSR are not loaded into the I2CRCV.

15.4 I2C 10-bit Slave Mode Operation

In 10-bit mode, the basic receive and transmit opera-

tions are the same as in the 7-bit mode. However, the

criteria for address match is more complex.

The I2C specification dictates that a slave must be

address ed for a write operatio n with two ad dress byte s

following a Start bit.

The A10M bit is a control bit that signifies that the

address in I2CADD is a 10-bit address rather than a 7-bit

address. The address detection protocol for the first byte

of a message address is identical for 7-bit and 10-bit

mess ag es , b ut the bi ts be in g com p a r ed ar e d ifferent.

I2CADD holds the entire 10-bit address. Upon receiv-

ing an address following a Start bit, I2CRSR <7:3> is

compared against a literal ‘11110’ (the default 10-bit

address) and I2CRSR<2:1> are compared against

I2CADD<9:8>. If a match occurs and if R_W = 0, the

interrupt pu lse is sent. Th e ADD10 bit will be cleare d to

indicate a partial address match. If a match fails or

R_W = 1, the ADD10 bit is cleared and the module

returns to the Idle state.

The low byte of the address is then received and com-

pared with I2CADD<7:0>. If an address match occurs,

the interrupt pulse is generated and the ADD10 bit is

set, indicating a complete 10-bit address match. If an

address match did not occur, the ADD10 bit is cleared

and the module returns to the Idle state.

15.4.1 10-BIT MODE SLAVE

TRANSMISSION

Once a slave is addressed in this fashion with the full

10-bit address (we will refer to this state as

“PRIOR_ADDR_MATCH”), the master can begin

sending data bytes for a slave reception operation.

0x00 General call address or start byte

0x01-0x03 Reserved

0x04-0x77 Valid 7-bit addresses

0x78-0x7 b Valid 10-bit addresses (lower 7

bits)

0x7c-0x7f Reserved

Note: The I2CRCV will be loaded if the I2COV

bit = 1 and the RBF flag = 0. In this case,

a read of the I2CRCV was performed but

the user did not clear the state of the

I2COV bit before the next receive

occurred. The Acknowledgement is not

sent (ACK = 1) and the I2CRCV is

updated.

dsPIC30F6011A/6012A/6013A/6014A

15.4.2 10-BIT MODE SLAVE RECEPTION

Once ad dress ed, the ma ster ca n genera te a Rep eated

Start, reset the high byte of the address and set the

R_W bit without generating a Stop bit, thus initiating a

slave tran sm it ope ratio n.

15.5 Automatic Clock Stretch

In the Slave modes, the module can synchronize buffer

reads and write to the master device by clock stretching.

15.5.1 TRANSMIT CLOCK STRETCHING

Both 10-bit and 7-bit Transmit modes implement clock

stretching by asserting the SCLREL bit after the falling

edge of the ninth cloc k, if the TBF bit is c leared, indic at-

ing the buffer is empty.

In Slave Transmit modes, clock stretching is always

performed irrespective of the STREN bit.

Clock synchronization takes place following the ninth

clock of the transmit sequence. If the device samples

an AC K on the falling edge of the ninth clock and if the

TBF bit is still clear, then the SCLREL bit is automati-

cally cleared. The SCLREL being cleared to ‘0’ will

assert the SCL line low. The user’s ISR must set the

SCLRE L bit bef ore transmis sion is allowed to cont inue.

By holding the SCL line low, the user has time to

service the ISR and load the contents of the I2CTRN

before the master device can initiate another transmit

sequence.

15.5.2 RECEIVE CLOCK STRETCHING

The STREN bit in the I2CCON register can be used to

enable clock stretching in Slave Receive mode. When

the STR EN bit is s et, the SCL p in will be held low at the

end of each data receive sequence.

15.5.3 CLOCK STRETCHING DURING

7-BIT AD DRESSING (ST REN = 1)

When the S TREN bit is set in Slave R eceive mode , the

SCL lin e is hel d low when th e buf fer register i s full . The

method for stretching the SCL output is the same for

both 7 and 10-bit Addressing modes.

Clock stretch ing ta kes place fo llowing t he nin th cloc k of

the receive sequence. On the falling edge of the ninth

clock at the end of the ACK sequence, if the RBF bit is

set, the SCLREL bit is automatically cleared, forcing

the SCL output t o be hel d low. The use r’s ISR must set

the SCLREL bit before reception is allowed to continue.

By holding the SCL line low, the user has time to ser-

vice the ISR and read the contents of the I2CRCV

before the master device can initiate another receive

sequence. This will prevent buffer overruns from

occurring.

15.5.4 CLOCK STRETCHING DURING

10-BIT ADDRESSING (STREN = 1)

Clock stretching takes place automatically during the

addressing sequence. Because this module has a

the protocol to wait for the address to be updated.

After the address phase is complete, clock stretching

will occur on each data receiv e or transmit sequ ence as

was described earlier.

15.6 Software Control led Clock

Stretching (STREN = 1)

When the STREN bit is ‘1’, the SCLREL bit may be

cleared by software to allow software to control the

clock stretching. The logic will synchronize writes to the

SCLREL bit with the SCL clock. Clearing the SCLREL

bit will not assert the SCL output until the module

detects a falling edge on the SCL output and SCL is

sampled low. If the SCLREL bit is cleared by the user

while the SCL line has been sample d low, the SCL ou t-

put will be asserted (held low). The SCL output will

remain low until the SCLREL bit is set, and all other

devices on the I2C bus have de-asserted SCL. This

ens ures that a write to t he SCLR EL bit will not viol ate

the minimum high time requirement for SCL.

If the STREN bit is ‘0’, a software write to the SCLREL

bit will be disregarded and have no effect on the

SCLREL bit.

15.7 Interrupts

The I2C module generates two interrupt flags, MI2CIF

(I2C Master In terrupt Flag) and SI2 CIF (I2C Slave Inter-

rupt Flag). The MI2CIF interrupt flag is activated on

completion of a master message event. The SI2CIF

interrupt flag is activated on detection of a message

directed to the slave.

Note 1: If the user loads the contents of I2CTRN,

setting the TBF bit before the fallin g edge

of the n int h c lo ck , th e SC LREL bit w il l n ot

be cleared and clock stretching will not

occur.

2: The SCLREL bit can be set in software,

regardless of the state of the TBF bit.

Note 1: If the user reads the contents of the

I2CRCV, clearing the RBF bit before the

falling edge of the ninth clock, the

SCLREL bit will not be cleared and clock

stretching will not occur.

2: The SCLREL bit can be set in software

regardles s of the state of the RBF bit. The

user should be car eful to clear the RBF bit

in the ISR before the next receive

sequence in order to prevent an overflow

condition.

dsPIC30F6011A/6012A/6013A/6014A

15.8 Slope Control

The I2C standard requires slope control on the SDA

and SCL signals for Fast mode (400 kHz). The control

bit, DISSLW , enab les the user to disa ble slew rate co n-

trol if desired. It is necessary to disable the slew rate

control for 1 MHz mode.

15.9 IPMI Support

The con trol bit, IPM IEN, enabl es the modul e to supp ort

Intelligent Peripheral Management Interface (IPMI).

When this bit i s s et, t he m od ule ac ce pts an d ac t s upo n

all addres ses .

15.10 General Call Address Support

The general call address can address all devices.

When this address is used, all devices should, in

theor y, respond with an Acknowledg em ent .

The general call address is one of eight addresses

reserved for specific purposes by the I2C protocol. It

consists of all ‘0’s with R_W = 0.

The general call address is recognized when the Gen-

eral Call Enable (GCEN) bit is set (I2 CCON<15> = 1).

Following a Start bit detection, 8 bits are shifted into

I2CRSR and the address is compared with I2CADD,

and is also compared with the general call address

which is fixed in hardware.

If a gen eral cal l addre ss matc h occurs, the I2CRS R is

transferred to the I2CRCV after the eighth clock, the

RBF flag is set and on the falling edge of the ninth bit

(ACK bit), the master event interrupt flag (MI2CIF) is

set.

When the i nte rrupt is servic ed, the s ou r ce for th e int er-

rupt can be checked by reading the contents of the

I2CRCV to determine if the address was device

specific or a general call address.

15.11 I2C Master Support

As a master device, six operations are supported:

• Assert a Start condition on SDA and SCL.

• Assert a RESTART condition on SDA and SCL.

• Write to the I2CTRN register initiating

transmission of data/address.

• Generate a Stop condition on SDA and SCL.

• Configure the I2C port to receive data.

• Generate an ACK condition at the end of a

received byte of data.

15.12 I2C Master Operation

The master device generates all of the serial clock

pulses and the Start and Stop conditions. A transfer is

ended with a Stop condition or with a Repeated Start

condition. Since the Repeated Start condition is also

the begi nning of the next seria l transfer, the I2C bus will

not be rel eased.

In Master Transmitter mode, serial data is output

through SDA, while SCL outputs the serial clock. The

first byte transmitted contains the slave address of the

receiving device (7 bits) and the data direction bit. In

this ca se, the da ta direc tion bit (R_ W) is logi c ‘0’. Serial

data is transmitted 8 bits at a time. After each byte is

transmitted , an ACK bit i s received . S t art and Stop co n-

ditions are output to indicat e the beginn ing and the en d

of a serial transfer.

In Master Rec eive mode, the firs t byte transmitte d con-

tains the slave address of the transmitting device

(7 bits) and the data direction bit. In this case, the data

directio n bit (R_W) is lo gic ‘1’. Thus, the first byte trans -

mitted is a 7-b it slave a ddress, f oll ow ed b y a ‘1’ to indi-

cate re ceive bi t. Serial data is rece ived via SD A while

SCL outputs the serial clock. Serial data is received

8 bits a t a ti me . Afte r ea ch by te is re cei ve d, a n ACK bit

is transmitted. Start and Stop conditions indicate the

beginning and end of transmission.

15.12.1 I2C MASTER TRANSMISSION

T ransmission of a data byte, a 7-bit address, or the sec-

ond half of a 10-bit address is accomplished by simply

writing a value to I2CTRN register. The user should

only write to I2CTRN when the module is in a Wait

state . This actio n will set th e Buf fer Full Flag (TBF ) and

allow the Baud Rate Generator to begin counting and

start the next transmission. Each bit of address/data

will be shifted out onto the SDA pin after the falling

edge of SCL is asserted. The Transmit Status Flag,

TRSTAT (I2CSTAT<14>), indicates that a master

transmit is in progress.

15.12.2 I2C MASTER RECEPTION

Master mode recepti on is enabl ed by progra mmin g the

Receive Enable bit, RCEN (I2CCON<11>). The I2C

module must be Idle before the RCEN bit is set, other-

wise the RCEN bit will be disregarded. The Baud Rate

Generator begins counting and, on each rollover, the

state of the SCL pin ACK and data are shifted into the

I2CRSR on the rising edge of each clock.

dsPIC30F6011A/6012A/6013A/6014A

15.12.3 BAUD RATE GENERATOR

In I2C Master mode, the reload value for the BRG is

located in the I2CBRG register. When the BRG is

loaded w ith th is v alu e, the BRG c ou nt s d own to ‘0’ and

stop s until anothe r reload has t aken place. If clock arb i-

tration i s taking place, for instance, th e BRG is reloaded

when the SCL pin is sampled high.

As per the I2C standard, FSCK may be 100 kHz or

400 kHz. However, the user can specify any baud rate

up to 1 MHz. I2CBRG values of ‘0’ or ‘1’ are illegal.

EQUATION 15-1: SERIAL CLOCK RATE

15.12.4 CLOCK ARBITRATION

Clock arbitration occurs when the master de-asserts

the SCL pin (SCL allowed to float high) during any

receive, transmit, or RESTART/Stop condition. When

the SCL pin is allowed to float hi gh, the Baud Rate Gen-

erat or is sus pen ded from cou nti ng u nt il t he SC L pin is

actually sampled high. When the SCL pin is sampled

high, the Baud Rate Generator is reloaded with the

content s of I2CB RG and begin s counting. Th is ensures

that t he S CL high tim e w i ll a lway s be at l eas t o ne BRG

rollover count in the event that the clock is held low by

an external device.

15.12.5 MULTI-MASTER COMMUNICATION,

BUS CO LLISION AND BUS

ARBITRATION

Multi-m aster operation support is achiev ed by bus arbi-

tration. When the master outputs address/data bits

onto the SDA pin, arbitration takes place when the

master outputs a ‘1’ on SDA by letting SDA float high

whil e another mast er asserts a ‘0’. When the SCL pin

floats high, data should be stable. If the expected data

on SDA is a ‘1’ and the data sampled on the SDA

pin = 0, then a bus collision has taken place. The

master will set the MI2CIF pulse and reset the master

portion of the I2C port to its Idle state.

If a transmit was in progress when the bus collision

occurred, the transmission is halted, the TBF flag is

cleared, the SDA and SCL lines are de-asserted and a

value can now be written to I2CTRN. When the user

services the I2C master event Interrupt Service Rou-

tine, if the I2C bus is free (i.e ., t he P bit is s et), the us er

can resume communication by asserting a Start

condition.

If a Start, RESTART, Stop or Acknowledge condition

was in progress when the bus collision occurred, the

condition is aborted, the SDA and SCL lines are de-

asserte d, and the respecti ve control bi ts in the I2 CCON

bus collision Interrupt Service Routine, and if the I2C

bus is free, the user can resume communication by

asserting a Start condition.

The master will continue to monitor the SDA and SCL

pins, and if a Stop condition occurs, the MI2CIF bit will

be set.

A write to the I2CTR N will start the trans mission of dat a

at the first data bit regardless of where the transmitter

left off when bus collision occurred.

In a multi-mas ter en vi ronment, the i nte rrupt genera t io n

on the d etecti on of Start a nd Stop co nditio ns allow s th e

determination of when the bus is free. Control of the I2C

bus can be taken when the P bit is set in the I2CSTAT

cleared.

15.13 I2C Module Operation During CPU

Sleep and Idle Modes

15.13.1 I2C OPERATION DURING CPU

SLEE P MOD E

When the device enters Sleep mode, all clock sources

to the module are shutdown and stay at logic ‘0’. If

Sleep occurs in the middle of a transmission and the

state machine is partially into a transmission as the

clocks s top, the n the tra nsmiss ion is ab orted. Si milarl y,

if Sleep occurs in the middle of a reception, then the

reception is aborted.

15.13.2 I2C OPERATION DURING CPU IDLE

MODE

For the I2C, the I2CSIDL bit selects if the module will

stop on Idle or continue on Idle. If I2CSIDL = 0, the

module will continue operation on assertion of the Idle

mode. If I2CSIDL = 1, the module will stop on Idle.

I2CBRG = FCY FCY

FSCK 1,111,111 – 1

–

()

dsPIC30F6011A/6012A/6013A/6014A

TABLE 15-1: I2C™ REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

I2CRCV 0200 — — — — — — — — Receiv e Register 0000 0000 0000 0000

I2CTRN 0202 — — — — — — — — Transmit Register 0000 0000 1111 1111

I2CBRG 0204 — — — — — — — Baud Rate Generator 0000 0000 0000 0000

I2CCON 0206 I2CEN — I2CSIDL SCLREL IPMIEN A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 0001 0000 0000 0000

I2CSTAT 0208 ACKSTAT TRSTAT — — — BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000 0000 0000 0000

I2CADD 020A — — — — — — Address Regist er 0000 0000 0000 0000

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

16.0 UNIVERSAL ASYNCHRONOUS

RECEIVER TRANSMITTER

(UART) MODULE

This section describes the Universal Asynchronous

Receiver Transmitter co mmunicat ions modul e.

16.1 UART Module Overview

The key features of the UART module are:

• Full-duplex, 8 or 9-bit data communication

• Even, odd or no parity options (for 8-bit data)

• One or two Stop bits

• Fully integ rate d Baud R ate Ge nera tor with 16-bit

prescaler

• Baud rates range from 38 bps to 1.875 Mbps at a

30 MHz instruction r ate

• 4-word deep transmit data buffer

• 4-word deep receive data buffer

• Parity, framing and buffer overrun error detection

• Support for interrupt only on address detect

(9th bit = 1)

• Separate transmit and receive interrupts

• Loopback mode for diagnostic support

FIGURE 16-1: UART TRANSMITTER BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

Write Write

UTX8 UxTXREG Low Byte

Load TSR

Transmit Control

– Control TSR

– Control Buffer

– Generate Flags

– Generate Interrupt

Control and Status bits

UxTXIF

Data

‘0’ (Start )

‘1’ (Stop)

Parity Parity

Generator

Transmit Shift R egister (UxT SR)

16 Divider

Control

Signals

16x Baud Clock

from Baud Rate

Generator

Internal Data Bus

UTXBRK

UxTX

Note: x = 1 or 2.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 16-2: UART RECEIVER BLOCK DIAGRAM

Read

URX8 UxRXREG Low Byte

Load RSR

UxMODE

Receive Buffer Control

– Generate Flags

– Generate Interrupt

UxRXIF

UxRX

· Start bit Detect

Receive Shift Register

16 Divider

Control

Signals

UxSTA

– Shift Data Characters

Read Read

Write Write

to Buffer

8-9

(UxRSR)

PERR

FERR

· Parity Check

· Stop bit Detect

· Shift Clock Generation

· Wake Logic

Internal Da ta Bus

LPBACK

From UxTX

16x Baud Clock from

Baud Rate Generator

dsPIC30F6011A/6012A/6013A/6014A

16.2 Enabling and Setting Up UART

16.2.1 ENABLING THE UART

The UART module is enabled by setting the UARTEN

bit in the UxMODE register (where x = 1 or 2). Once

enabled , the UxTX and UxRX pins are configured as an

output and an input respectively, overriding the TRIS

and LATCH register bit settings for the corresponding

I/O port pins. The UxTX pin is at logic ‘1’ when no

transmission is taking place.

16.2.2 DISABLING THE UART

The UAR T module is di sabled by cle aring the UAR TEN

bit in the UxMODE register. This is the default state

after any Reset. If the UART is disabled, all I/O pins

operate as port pins under the control of the latch and

TRIS bits of the corresponding port pins.

Disab ling the UAR T module reset s the buf fers to empty

states. Any data characters in the buffers are lost and

the baud rate counter is reset.

All error and status flags associated with the UART

module are reset when the module is disabled. The

URXDA, OERR, FERR, PERR, UTXEN, UTXBRK and

UTXBF bits are cleared, whereas RIDLE and TRMT

are set. Other control bits, including ADDEN,

URXISEL<1:0>, UTXISEL, as well as the UxMODE

and UxBRG registers, are not affected.

Clearing the UARTEN bit while the UART is active will

abort all pending transmissions and receptions and

reset the module as defined above. Re-enabling the

UART will restart the UART in the same configuration.

16.2.3 SETTING UP DATA, PARITY AND

STOP BIT SELECTIONS

Control bits PDSEL<1:0> in the UxMODE register are

used to select the data length and parity used in the

transmission. The data length may either be 8 bits with

even, odd or no parity, or 9 bits with no parity.

The STSEL bit determines wh ether one or two S top bit s

will be used during data transmi ssion.

The defa ult (powe r-on) settin g of the UA RT is 8 bits, n o

parity and 1 Stop bit (typically represented as 8, N, 1).

16.3 Transmitting Data

16.3.1 TRANSMITTING IN 8-BIT DATA

MODE

The following steps must be performed in order to

transmit 8-bit data:

1. Set up the UART:

First, the data length, parity and number of S top

bits must be selected. Then, the transmit and

receive interrupt enable and priority bits are set

up in the UxMODE and UxSTA registers. Also,

the appropriate baud rate value must be written

to the UxBRG register.

2. Enable the UART by setting the UARTEN bit

(UxMODE<15>).

3. Set the UTXEN bit (UxSTA<10>), thereby

enabling a transmission.

4. Write the byte to be t ransmitted to the lower byte

of UxTXREG. The value will be transferred to the

Transmit Shift register (UxTSR) immediately

and the serial bit stream will start shifting out

during the next rising edge of the baud clock.

Alternatively, the data byte may be written while

UTXEN = 0, following which, the user may set

UTXEN. This will cause the serial bit stream to

begin immediately because the baud clock will

start from a cleared state.

5. A transmit interrupt will be generated, depend-

ing on the value of the interrupt control bit

UTXISEL (UxSTA<15>).

16.3.2 TRANSMITTING IN 9-BIT DATA

MODE

The sequence of steps involved in the transmission of

9-bit data is similar to 8-bit transmission, except that a

16-bit data word (of which the upper 7 bits are always

clear) must be written to the UxTXREG register.

16.3.3 TRANSMIT BUFFER (UXTXB)

The transmit buffer is 9 bits wide and 4 characters

deep. Including the Transmit Shift register (UxTSR),

the user effectively has a 5-deep FIFO (First-In, First-

Out) buffer. The UTXBF status bit (UxSTA<9>)

indicates whether the transmit buffer is full.

If a user attempts to write to a full buffer, the new data

will not be ac cepted i nto the FIF O, and n o data shift wil l

occur within the buffer. This enables recovery from a

buffer overrun condition.

The FIFO is reset during any device Reset but is not

affected when the device enters or wakes up from a

Power Saving mode.

dsPIC30F6011A/6012A/6013A/6014A

16.3.4 TRANS MI T INTERRUPT

The transmit interrupt flag (U1TXIF or U2TXIF) is

located in the corresponding interrupt flag register.

The transmitter generates an edge to set the UxTXIF

bit. The cond itio n for gene ratin g the in terru pt depe nds

on the UTXISEL control bit:

a) If UTXISEL = 0, an interrupt is generated when

a word is transferred from the transmit buffer to

the T ransmit Shift register (UxT SR). This implies

that the transmit buffer has at least one empty

word.

b) If UTXISEL = 1, an interrupt is generated when

a word is transferred from the transmit buffer to

the Transmit Shift register (UxTSR) and the

transmit buffer is empty.

Switching between the two Interrupt modes during

operation is possible and sometimes offers more

flexibility.

16.3.5 TRANSMIT BREAK

Setting the UTXBRK bit (UxSTA<11>) will cause the

UxTX line to be driven to logic ‘0’. The UTXBRK bit

overrides all transmission activity. Therefore, the user

should generally wait for the transmitter to be Idle

before setting UTXBRK.

To send a break character , the UTXBRK bit must be set

by soft ware and must rema in set for a mini mum of 13

baud clock cycles. The UTXBRK bit is then cleared by

software to generate Stop bits. The user must wait for

a duration of at least one or two baud clock cycles in

order to ensure a valid Stop bit(s) before reloading the

UxTX B, or s tar t i ng o t he r t r an sm itt e r ac ti v it y. Transm is -

sion of a break character does not generate a transmit

interrupt.

16.4 Receiving Data

16.4.1 RECEIVING IN 8-BIT OR 9-BIT

DATA MODE

The following steps must be performed while receiving

8-bit or 9-bit data:

1. Set up the UART (see Section 16.3.1 “Trans-

mitting in 8-bit data mode”).

2. Enable the UART (see Section 16.3.1 “Trans-

mitting in 8-bit data mode”).

3. A receive interrupt will be generated when one

or more data words have been received,

depending on the receive interrupt settings

specified by the URXISEL bits (UxSTA<7:6>).

4. Read the OERR bit to determine if an overrun

error has occ urred. The OERR bit must be reset

in software.

5. Read the received dat a from UxRXREG. The act

of reading UxRXREG will move the next word to

the top of the receive FIFO, and the PERR and

FERR values will be updated.

16.4.2 RECEIVE BUFFER (UXRXB)

The receive buffer is 4 words deep. Including the

Receive Shift register (UxRSR), the user effectively

has a 5-word deep FIFO buffer.

URXDA (UxSTA<0>) = 1 indicates that the receive

buffer has data available. URXDA = 0 implies that the

buffer is empty. If a user attempts to read an empty

buffer, the old values in the buffer will be read and no

data shift will occur within the FIFO.

The FIFO is reset during any device Reset. It is not

affected when the device enters or wakes up from a

Power Saving mode.

16.4.3 RECEIVE INTERRUPT

The receive interrupt flag (U1RXIF or U2RXIF) can be

read from the c orresp onding interru pt fla g register. The

interrupt flag is set by an edge generated by the

rece iver. The cond iti on f or se tti ng t he re ceiv e int err upt

flag depends on the settings specified by the

URXISEL<1:0> (UxSTA<7:6>) control bits.

a) If URXISEL<1:0> = 00 or 01, an interrupt is gen-

erated every time a data word is transferred

from the Receive Shift register (UxRSR) to the

receive buffer. There may be one or more

charact ers in the receive buffer .

b) If URXISEL<1:0> = 10, an interrupt is generated

when a word is transferred from the Receive Shift

result of the transfer, contains 3 characters.

c) If URXISEL<1:0> = 11, an interrupt is set when

a word is transf erred from th e Receive Shift reg-

ister (UxRSR) to the receive buffer, which as a

result of the tr ans fe r, cont a ins 4 c ha rac ters (i.e .,

becomes full).

Switching between the Interrupt modes during opera-

tion is possible, though generally not advisable during

normal operation.

16.5 Reception Error Handling

16.5.1 RECEIVE BUFFER OVERRUN

ERROR (OERR BIT)

The OERR bit (UxSTA<1>) is set if all of the following

conditions occur:

a) The receive buffer is full.

b) The Receive Shift register is full, but unable to

transfer the character to the receive buffer.

c) The Stop bit of the character in the UxRSR is

detected, indicating that the UxRSR needs to

transfer the character to the buffer.

dsPIC30F6011A/6012A/6013A/6014A

Once OER R is se t, no furthe r data is shifted in UxRSR

(until the OERR bit is cleared in software or a Reset

occurs). The data held in UxRSR and UxRXREG

remains val id.

16.5.2 FRAMING ERROR (FERR)

The FERR bit (UxSTA<2>) is set if a ‘0’ is detected

instead of a Stop bit. If two Stop bits are selected, both

Stop bits must be ‘1’, otherwise FERR will be set. The

read only FERR bit is buffered along with the received

data. It is cleared on any Reset.

16.5.3 PARITY ER ROR (PER R)

The PERR bit (UxSTA<3>) is set if the parity of the

received word is incorrect. This error bit is applicable

only if a Parity mode (odd or even) is selected. The

read only PERR bit is buffered along with the received

data bytes. It is cleared on any Reset.

16.5.4 IDLE STATUS

When the receiver is active (i.e., between the initial

detecti on of the Start bit and the co mple tion of the S to p

bit), the RIDLE bit (UxST A<4>) is ‘0’. Between the com-

pletion of the Stop bit and d etection of the n ext Start bi t,

the RIDLE bit is ‘1’, indicating that the UART is Idle.

16.5.5 RECEIV E BRE AK

The receiver will count and expect a certain number of

bit times based on the values programmed in the

PDSEL (UxMODE<2:1>) and STSEL (UxMODE<0>)

bits.

If the break is longer than 13 bit times, the reception is

considered complete after the number of bit times

specif ied by PDSEL and STSEL. The URXDA bit is se t,

FERR is set, zeros are loaded into the receive FIFO,

interrupts are generated if appropriate and the RIDLE

bit is set.

When the module rec eiv es a lo ng b r ea k s ign al a nd th e

receive r has detected the S t art bit, the dat a bits and the

invalid Stop bit (which sets the FERR), the receiver

must wai t for a val id Stop bit before looki ng for the next

Sta rt bit. It cann ot assume that th e break cond ition on

the line is the next Start bit.

Break is reg arded as a characte r containin g all ‘0’s with

the FERR bit set. The break c haracter is loaded into the

buffer. No further reception can occur until a Stop bit is

received. Note that RIDLE goes high when the Stop bit

has not yet been received.

16.6 Address Detect Mode

Setting the ADDEN bit (UxSTA<5>) enables this spe-

cial mode in which a 9th bit (URX8) value of ‘1’ identi-

fies the rec ei ve d wo rd a s a n a ddress, ra the r th an data.

This m ode is o nly a pplicabl e for 9-bit data co mm un ic a-

tion. The URXISEL control bit does not have any

impact on interrupt generation in this mode since an

interrupt (if enabled) will be generated every time the

received word has the 9th bit set.

16.7 Loopback Mode

Setting the LPBACK bit enables this special mode in

which the UxT X pin is int ernally conne cted to the UxRX

pin. When configured for the Loopback mode, the

UxRX pin is disconnected from the internal UART

receive logic. However, the UxTX pin still functions as

in a normal operation.

To select this mode:

a) Configure UART for desired mode of operation.

b) Set LPBACK = 1 to enable Loopback mode.

c) Enable tran sm is si on as def ine d in Section 16.3

“Transmitting Data”.

16.8 Baud Rate Generator

The UART has a 16-bit Baud Rate Generator to allow

maximu m fl exib ilit y in b aud r ate ge nera tio n. Th e Baud

Rate Generator register (UxBRG) is readable and

writable. The baud rate is computed as follows:

BRG = 16-bit value held in UxBRG register

(0 through 65535)

FCY = Instruction Clock Rate (1/TCY)

The Baud Rate is given by Equati on 16-1.

EQUATION 16-1: BAUD RATE

Therefore, the maximum baud rate possible is

FCY /16 (if BRG = 0),

and the minimum baud rate possible is

FCY / (16* 65536).

With a full 16-bit Baud Rate Generator at 30 MIPs

operation, the minimum baud rate achievable is

28.5 bps.

Baud Rate = FCY / (16*(BRG+1))

dsPIC30F6011A/6012A/6013A/6014A

16.9 Auto-Baud Support

To allow the system to determine baud rates of

received characters, the input can be optionally linked

to a capture input (IC1 for UART1, IC2 for UART 2). To

enable th is mode, the user must program the input cap-

ture modul e to detect the falling and rising edges of the

Start bit.

16.10 UART Operation During CPU

Sleep and Idle Modes

16.10.1 UART OPERATION DURING CPU

SLEEP MODE

When the device enters Sleep mode, all clock sources

to the mo dule are shut down and st ay at logic ‘0’. If entry

into Sleep mode occurs while a transmission is in

progress, then the transmission is aborted. The UxTX

pin is driven to logic ‘1’. Similarly, if entry into Sleep

mode occurs while a reception is in progress, then the

reception is aborted. The UxSTA, UxMODE, transmit

and receive registers and buffers, and the UxBRG

If the W AKE bit (UxMODE <7>) is set before the device

enters Sleep mode, then a falling edge on the UxRX pin

will gen era te a rec eive interrupt. The Recei ve Interru pt

Select mode bit (URXISEL) has no effect for this func-

tion. If the receive interrupt is enabled, then this will

wake-u p the dev ic e from Sl eep . Th e UA RTEN bit must

be set in order to generate a wake-up interrupt.

16.10.2 UART OPERATION DURING CPU

IDLE MODE

For the UART, the USIDL bit selects if the module will

stop operation when the device enters Idle mode or

whethe r the m odu le wi ll co nti nue on Idl e. If U SID L = 0,

the module will continue operation during Idle mode. If

USIDL = 1, the module will stop on Idle.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 16-1: UART1 REGISTER MAP

TABLE 16-2: UART2 REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

U1MODE 020C UARTEN —USIDL— — — — — WAKE LPBACK ABAUD —— PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000

U1STA 020E UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000

U1TXREG 0210 — — — — — — — UTX8 Transmit Register 0000 000u uuuu uuuu

U1RXREG 0212 — — — — — — — URX8 Receive Register 0000 0000 0000 0000

U1BRG 0214 Baud Rate Generator Prescaler 0000 0000 0000 0000

Legend: u = uninitialized bit

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

U2MODE 0216 UARTEN —USIDL— — — — — WAKE LPBACK ABAUD —— PDSEL1 PDSEL0 STSEL 0000 0000 0000 0000

U2STA 0218 UTXISEL — — — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0000 0001 0001 0000

U2TXREG 021A — — — — — — — UTX8 Transmit Register 0000 000u uuuu uuuu

U2RXREG 021C — — — — — — — URX8 Receive Register 0000 0000 0000 0000

U2BRG 021E Baud Rate Generator Prescaler 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

17.0 CAN MODULE

17.1 Overview

The Controller Area Network (CAN) module is a serial

interface, useful for communicating with other CAN

modules or microcontroller devices. This interface/

protocol was designed to allow communications within

noisy env iro nm ents.

The C AN mo du le i s a co mm un i ca tio n co ntr o ll er i mp le -

menting the CAN 2.0 A/B protocol, as defined in the

BOSCH specification. The module will support

CAN 1.2, CAN 2 .0A, CAN 2 .0B Pass ive and CA N 2.0B

Active v ersio ns of th e protocol . Th e m od ule im ple me n-

tation is a full CAN system. The CAN specification is

not covered within this data sheet. The reader may

refer to the BOSCH CAN specification for further

details.

The module features are as follows:

• Implementation of the CAN protocol CAN 1.2,

CAN 2.0A and CAN 2.0B

• Standard and extended data frames

• 0-8 bytes data len gth

• Programmable bit rate up to 1 Mbit/sec

• Support for remote frames

• Doubl e-bu f fe red receiver with two priori tiz ed

received message storage buffers (each buffer

may contain up to 8 bytes of data)

• 6 full (standard/extended identifier) acceptance

filters, 2 associated with the high priority receive

buffer and 4 associated with the low priority

rece ive buffer

• 2 full acceptance filter masks, one each

associated with the high and low priority receive

buffers

• Three transmit buffers with application specified

priori tization and abort c apabilit y (each buf fer may

contain up to 8 bytes of data)

• Programmable wake-up functionality with

integrated low-pass filter

• Programm abl e Loopba ck m ode su pp orts s elf -tes t

operation

• Signaling via interrupt capabilities for all CAN

receiver and transmitter error states

• Programmable clock source

• Programm abl e lin k to Input Capt ure m odu le (IC2,

for both CAN1 and CAN2) for time-stamping and

netw ork synchronization

• Low-power Sleep and Idle mode

The CAN bus modu le consist s of a protocol engi ne and

message buffering/control. The CAN protocol engine

handles all functions for receiving and transmitting

messages on the CAN bus. Messages are transmitted

by first loading the appropriate data registers. Status

and errors can be checked by reading the appropriate

registers. Any message detected on the CAN bus is

checked for errors and then matched against filters to

see if it should be received and stored in one of the

receive registers.

17.2 Frame Types

The CAN module transmits various types of frames

which include data messages or remote transmission

requ es ts i ni tia t e d b y th e us er, as ot her f ram es t ha t are

automatically generated for control purposes. The

following frame types are supported:

• Standard Data Frame:

A standard data frame is generated by a node

when the node wishes to transmit data. It includes

an 11-bit S tand ard Identifi er (SID) but not an 18-bit

Extended Identifier (EID).

• Extended Data Frame:

An extended data frame is similar to a standard

data frame but includes an extended identifier as

well.

• Remote Frame:

It is possible for a destination node to request the

data from the source. For this purpose, the desti-

nation node sends a remote frame with an identi-

fier that ma tches the iden tifier o f the re quired dat a

frame. T he approp riate dat a sou rce n ode will then

send a data frame as a response to this remote

request.

• Error Frame:

An error frame is generated by any node that

detects a bus error. An error frame consists of 2

fields: an error flag field and an error delimiter

field.

• Overload Frame:

An overl oad fram e can b e generat ed by a node a s

a result of 2 conditions. First, the node detects a

dominant bit during interframe space which is an

illegal condition. Second, due to internal condi-

tions, the node is not yet able to start reception of

the next message. A node may generate a maxi-

mum of 2 s equ ent ial ove rload frame s to dela y th e

start of the next message.

• Interframe Space:

Interframe space separates a proceeding frame

(of wha tever type ) from a follo wing da ta or remo te

frame.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 17-1: CAN BUFFERS AND PROTOCOL ENGINE BLOCK DIAGRAM

Acceptance Filter

RXF2

Identifier

Data Field Data Field

Identifier

Acceptance Mas k

RXM1

Acceptance Filter

RXF3

Acceptance Filter

RXF4

Acceptance Filter

RXF5

Acceptance Mask

RXM0

Acceptance Filter

RXF0

Acceptance Filter

RXF1

MSGREQ

TXB2

TXABT

TXLARB

TXERR

MTXBUFF

MESSAGE

Message

Queue

Control Transmit Byte Sequencer

MSGREQ

TXB1

TXABT

TXLARB

TXERR

MTXBUFF

MESSAGE

MSGREQ

TXB0

TXABT

TXLARB

TXERR

MTXBUFF

MESSAGE

Receive ShiftTransmit Shift

Receive

Error

Transmit

Error

Protocol

RERRCNT

TERRCNT

Err Pas

Bus Off

Finite

State

Machine

Counter

Transmit

Logic

Bit

Timing

Logic

CiTX(1) CiRX(1)

Bit Timing

Generator

PROTOCOL

ENGINE

BUFFERS

CRC Check

CRC Generator

Note 1: i = 1 or 2 refers to a particular CAN module (CAN1 or CAN2).

dsPIC30F6011A/6012A/6013A/6014A

17.3 Modes of Operation

The CAN module can operate in one of several Operation

modes selected by the user . These modes include:

• Initialization Mode

• Disable Mode

• Normal Operation Mode

• List en On ly Mode

• Loop bac k Mo de

• Error Recognition Mode

Modes are requested by setting the REQOP<2:0> bits

(CiCTRL<10:8>), except the Error Recognition mode

which is requested through the RXM<1:0> bits

(CiRXnCON<6:5>, where n = 0 or 1 represents a par-

ticular receive buffer). Entry into a mode is Acknowl-

edged by monitoring the OPMODE<2:0> bits

(CiCTRL<7:5>). The module will not change the mode

and the OPMODE bits until a change in mode is

acceptable, generally during bus Idle time which is

defined as at least 11 consecutive reces siv e bits.

17.3.1 INITIALIZATION MODE

In the Ini tialization mode, the module will not tra nsmit or

receive. The error counters are cleared and the inter-

rupt flags remain unchanged. The programmer will

have access to configuration registers that are access

restricted in other modes. The module will protect the

user from accidentally violating the CAN protocol

through p rogramming er rors. All registe rs which contro l

the configuration of the module can not be modified

while the module is on-line. The CAN module will not

be allowed to enter the Configuration mode while a

transmission is taking place. The Configuration mode

serves as a lock to protect the following registers.

• All Module Control Registers

• Baud Rate and Interrupt Configuration Registers

• Bus Timing Registers

• Identifier Acceptance Filter Registers

• Identifier Acceptance Mask Registers

17.3.2 DISABLE MODE

In Disable mode, the module will not transmit or

receive . The mo dule has the ability to set the W AKIF b it

due to bus activity, however, any p ending inte rrupts wil l

remain and the error counters will reta in their value.

If the REQOP<2:0> bits (CiCTRL<10:8>) = 001, the

module will enter the Module Disable mode. If the module

is activ e, the m odule wil l wait for 11 reces sive bi ts on the

CAN bus, detect that condition as an Idle bus, then

accept the module disable command. When the

OPMODE<2:0> bits (CiCTRL<7:5>) = 001, that indi-

cates whether the module successfully went into Module

Disable mode. The I/O pins will revert to normal I/O

function when the mod ule is in the Module Disable mode.

The module can be programmed to apply a low-pass

filter function to the C iRX inp ut line whil e the modu le or

the CPU is in Sleep mode. The WAKFIL bit

(CiCFG2<14>) enables or disables the filter.

17.3.3 NORMAL OPERATION MODE

Normal Operating mode is selected when

REQOP<2:0> = 000. In this mode, the module is acti-

vated and the I/O pins will assume the CAN bus func-

tions. The module will transmit and receive CAN bus

messages via the CxTX and CxRX pins.

17.3.4 LISTEN ONLY MODE

If the Li st en O nl y mode is acti va ted , the module on th e

CAN bus is passive. The transmitter buffers revert to

the port I/O function. The receive pins remain inputs.

For the rec eiv er, n o e rror fla gs or Ackn owledge s ign al s

are sent. The error counters are deactivated in this

state. The Listen Only mode can be used for detecting

the baud rate on the CAN bus. To use this, it is neces-

sary that there are at least two further nodes that

communicate with each other.

17.3.5 LISTEN ALL MESS AGE S MODE

The module can be set to ignore all errors and receive

any message. The Error Recognition mode is activated

by setting REQOP<2:0> = 111. In this mode, the data

which is in the message assembly buffer until the time

an error occurred, is copied in the receive buffer and

can be read via the CPU interface.

17.3.6 LOOPBACK MODE

If the Loopbac k mode is activ ated, the mo dule will con-

nect the internal transmit signal to the internal receive

signal at the module boundary. The transmit and

receive pins revert to their port I/O function.

Note: Typically, if the CAN module is allowed to

transmit in a particular mode of operation

and a transmission is requested immedi-

ately after the CAN module has been

placed in tha t mode of operati on, the mod-

ule waits for 11 consecutive recessive bits

on the bus before starting transmission. If

the user switches to Disable mode within

this 11-bit perio d, then this tran smis sion is

aborted and the corresponding TXABT bit

is set and TXREQ bit is cleared.

dsPIC30F6011A/6012A/6013A/6014A

17.4 Message Reception

17.4.1 RECEIV E BU FFER S

The CAN bus module has 3 receive buffers. However,

one of the rece iv e b uffers is al w ays c om mitted to mon-

itoring the bus for incoming messages. This buffer is

called the Message Assembly Buffer (MAB). So there

are 2 receive b uf fers v isibl e, RXB0 and RXB1, that ca n

essentially instantaneously receive a complete

message from the protocol engine.

All messages are assembl ed by the MAB and are trans-

ferred to the RXBn buffers only if the acceptance filter

criterion are met. When a message is received, the

RXnIF flag (CiINTF<0> or CiINRF<1>) will be set. This

bit can only be set by the module when a message is

received. The bit is cleared by the CPU when it has com-

pleted processing the message in the buffer. If the

RXnIE bit (CiINTE<0> or CiINTE<1>) is set, an interrupt

will be generated when a mess age is rec eived.

RXF0 and RXF1 fil ters with RXM0 mask are associated

with RXB0. The filters RXF2, RXF3, RXF4, and RXF5

and the mask RXM1 are associated with RXB1.

17.4.2 MESSAGE ACCEPTANCE FILTERS

The me ssage acc eptance filters and masks ar e used to

determine if a message in the message assembly

buffer should be loaded into either of the receive buff-

ers. Once a valid message has been received into the

Message Assembly Buf fer (MAB), the identifier fields of

the message are compared to the filter values. If there

is a match, that message will be loaded into the

appropri ate rec eiv e buffer .

The acceptance filter looks at incoming messages for

the RXIDE bit (CiRXnSID<0>) to determine how to

compare the identifiers. If the RXIDE bit is clear, the

message is a standard frame and only filters with the

EXIDE bit (CiRXFnSID<0>) clear are compared. If the

RXIDE bit is set, the message is an extended frame,

and only filters with the EXIDE bit set are compared.

Configuring the RXM<1:0> bits to ‘01’ or ‘10’ can

ove rrid e the E XIDE bit.

17.4.3 MESSAGE ACCEPTANCE FILTER

MASKS

The mask bits e ssential ly determi ne which bit s to appl y

the filter to. If any m as k bit is se t to a zero, then that bit

will automatically be accepted regardless of the filter

bit. There are 2 prog rammab le ac cept ance filter ma sks

assoc iated with the receive bu ffers, one for each bu ffer .

17.4.4 RECEIVE OVERRUN

An overrun condition occurs when the Message

Assembly Buffer (MAB) has assembled a valid

received message, the message is accepted through

the acceptance filters and when the receive buffer

associated with the filter has not been designated as

clear of the previous message.

The overrun error flag, RXnOVR (CiINTF<15> or

CiINTF<14>), and the ERRIF bit (CiINTF<5>) will be

set and the message in the MAB will be discarded.

If the D BEN bi t i s cle ar, RXB1 a nd RXB0 opera te inde-

pendently. When this is the case, a message intended

for RXB0 will not be diverted into RXB1 if RXB0 con-

tains an unread message and the RX0OVR bit will be

set.

If the DBEN bit is set, the overrun for RXB0 is handled

differently. If a va lid mes sa ge is r ece iv ed fo r R XB0 an d

RXFUL = 1 indicates that RXB0 is full and RXFUL = 0

indicates that RXB1 is empty, the message for RXB0

will be loaded into RXB1. An overrun error will not be

generated for RXB0. If a valid message is received for

RXB0 an d RXFUL = 1, indicating that both RXB0 and

RXB1 are full, the message will be lost and an overrun

will be indicated for RXB1.

17.4.5 RECEIVE ERRORS

The CAN module will detect the following receive

errors:

• Cyclic Redundancy Check (CRC) Error

• Bit Stuffing Error

• Invalid Message Receive Error

These receive errors do not generate an interrupt.

However, the receive error counter is incremented by

one in case one of these errors occur. The RXWAR bit

(CiINTF<9>) indicates that the receive error counter

has reached the CPU warning limit of 96 and an

interrupt is genera ted.

17.4.6 RECEIVE INTERRUPTS

Receive interrupts can be divided into 3 major groups,

each including various conditions that generate

interrupts:

• Receive Interrupt:

A message has been successfully received and

loaded into one of the receive buffers. This inter-

rupt is activated immediately after receiving the

End of Fr ame (EOF) field. Reading the R XnIF flag

will indicate which receive buffer caused the

interrupt.

• Wake-up Interrupt:

The CAN module has woken up from Disable

mode or the device has woken up from Sleep

mode.

dsPIC30F6011A/6012A/6013A/6014A

• Receive Error Interrupts:

A receive error interrupt will be indicated by the

ERRIF bit. This bit shows that an error condition

occurred. The source of the error can be deter-

mined by checking the bits in the CAN Interrupt

stat us register, CiINTF.

- Invalid Message Received:

If any type of error occurred during reception of

the last message, an error will be indicated by

the IVRIF bit.

- Receiver Overrun:

The RXnOVR bit indicates that an overrun

conditi on oc curred.

- Receiver Warning:

The RXWAR bit indicates that the receive error

counter (RERRCNT<7:0>) has reached the

warning limit of 96.

- Receiver Error Passive:

The RXEP bit indicates that the receive error

counter has exceeded the error passive limit of

127 and the mo dul e has go ne in to error pa ss iv e

state.

17.5 Message Transmission

17.5.1 TRANSMI T BUFFERS

The CAN module has three transmit buffers. Each of

the thre e buf fers occ upies 14 bytes of d ata. Ei ght of th e

bytes a re the maximum 8 bytes of the transm itted me s-

sage. Five bytes hold the standard and extended

identifiers and other message arbitration information.

17.5.2 TRANSMIT MESSAGE PRIORITY

Transmit priority is a prioritization within each node of

the pending transmittable messages. There are

4 levels of transmit priority. If TXPRI<1:0>

(CiTXnCON<1:0>, wh ere n = 0, 1 or 2 represe nts a par-

ticular transmit buffer) for a particular message buffer is

set to ‘11’, that buffer has the highest priority. If

TXPRI<1:0> for a particular message buffer is set to

‘10’ or ‘01’, that buffer has an intermediate priority. If

TXPRI<1:0 > for a parti cular message buffe r is ‘00’, that

buffe r has the lowest priority.

17.5.3 TRANSMISSION SEQUENCE

To initiate transmission of the message, the TXREQ bit

(CiTXnCON<3>) must be set. The CAN bus module

resolves any timing conflicts between setting of the

TXREQ bit and the S tart of Frame (SOF), ensuring that if

the priority was changed, it is resolved correctly before the

SOF occurs. When TXREQ is set, the TXABT

(CiTXnCON<6>), TXLARB (CiTXnCON<5>) and TXERR

(CiTXnCON<4>) flag bits are automatically cleared.

Setting TXREQ bit simply flags a message buffer as

enqueued for transmission. When the module detects

an available bus, it begins transmitting the message

which has been determi ned to have the highest priori ty .

If the transmission completes successfully on the first

attempt, the TXREQ bit is cleared automatic ally , and an

interrupt is generated if TXIE was set.

If the mes sa ge tra ns miss io n fai ls, one of the erro r co n-

dition flags will be set, and the TXREQ bit will remain

set indicating that the message i s still p ending for trans-

mission. If the message e ncountered an error conditio n

during the transmission attempt, the TXERR bit will be

set, and the error condition may cause an interrupt. If

the message loses arbitration during the transmission

attempt, the TXLARB bit is set. No interrupt is

generated to signal the loss of arbitration.

17.5.4 ABORTI NG MESSAGE

TRANSMISSION

The system can also abort a message by clearing the

TXREQ bit associated with each message buffer. Set-

ting the ABAT bit (CiCTRL<12>) will req uest an abort of

all pending messages. If the message has not yet

started transmission, or if the message started but is

interrupted by loss of arbitration or an error, the abort

will be processed. The abort is indicated when the

module sets the TXABT bit and the TXnIF flag is not

automatically set.

17.5.5 TRANSMISSION ERRORS

The CAN module wil l dete ct the foll owing transm iss io n

errors:

• Acknowledge Error

• Form Error

• Bit Error

These transmission errors will not necessarily generate

an interrupt but are indicated by the transmission error

counter. However, each of these errors will cause the

transmission error counter to be incremented by one.

Once the value of the error counter exceeds the value

of 96, the ERRIF (CiINTF<5>) and the TXWAR bit

(CiINTF<10>) are set. Once the value of the error

counter exceeds the value of 96, an interrupt is

generate d and the TXW A R bit in the Erro r Flag regist er

is set.

dsPIC30F6011A/6012A/6013A/6014A

17.5.6 TRANS MI T INTERRUPTS

T ransmit interrupts can be divided into 2 major groups,

each including various conditions that generate

interrupts:

• Transmit Interrupt:

At least one of the three transmit buffers is empty

(not scheduled) and can be loaded to schedule a

message for transmission. Reading the TXnIF

flags will ind icate which transmit buf fer is available

and caused the interrupt.

• Transmit Error Interrupts:

A transmission error interrupt will be indicated by

the ERRIF flag. T his fl ag show s that an erro r co n-

dition occurred. The source of the error can be

determi ned by check ing the error fl ags in the CAN

Interrupt status register, CiINTF. The flags in this

- Transmitter Warning Interrupt:

The TXWAR bit indicates that the transmit error

counter has reached the CPU warning limit of

96.

- Transmitter Error Passive:

The TXEP bit (CiINTF<12>) indicates that the

transmit error counter has exceeded the error

pas siv e lim it of 127 and the modul e has go ne to

error passive state.

- Bus Off:

The TXBO bit (CiINTF<13>) indicates that the

transmit error counter has exceeded 255 and

the module has gone to the bus off state.

17.6 Baud Rate Setting

All nodes on any particular CAN bus must have the

same nomin al bit rate. In ord er to set the baud rate, the

following parameters have to be initialized:

• Syn chronization Ju mp Width

• Baud Rate Prescaler

• Phase Segments

• Length determination of Phase Segment 2

• Sample Point

• Propag ati on Segm en t bit s

17.6.1 BIT TI MING

All controllers on the CAN bus must have the same

baud rate and bit length. However, different controllers

are not required to have the same master oscillator

clock. At different clock frequencies of the individual

controllers, the baud rate has to be adjusted by

adjusti ng the num be r of time quan t a in eac h segm en t.

The nomi nal bit time can be though t of as being div ided

into separate non-overlapping time segments. These

segments are shown in Figure 17-2.

• Synchronization Segment (Sync Seg)

• Propagation Time Segment (Prop Seg)

• Phase Segment 1 (Phase1 Seg)

• Phase Segment 2 (Phase2 Seg)

The time segments and also the nominal bit time are

made up of integer units of time called time quanta or

TQ. By definition, the nominal bit time has a minimum

of 8 TQ and a maximum of 25 TQ. Also, by definition,

the minimum nominal bit time is 1 μsec corresponding

to a maximum bit rate of 1 MHz.

FIGURE 17-2: CAN BIT TIMING

Input Signal

Sync Prop

Segment Phase

Segment 1 Phase

Segment 2 Sync

Sample Point

dsPIC30F6011A/6012A/6013A/6014A

17.6.2 PRESCALER SETTING

There is a programmable prescaler with integral values

ranging from 1 to 64, in addition to a fixed divide-by-2

for clock generation. The time quantum (TQ) is a fixed

unit of time derived from the oscillator period, and is

given by Equation 17-1.

EQUATION 17-1: TIME QUANTUM FOR

CLOCK GENERATION

17.6.3 PROPAGATION SEGMENT

This p art of t he bit time is u sed to com pensa te phy sica l

delay ti me s withi n the ne twork . These delay times co n-

sist of the signal propagation time on the bus line and

the inte rnal delay time of the no de s. The Prop Seg can

be programmed from 1 TQ to 8 TQ by setting the

PRSEG<2:0> bits (CiCFG2<2: 0>).

17.6.4 PHASE SEGMENTS

The phase segments are used to optimally locate the

sampling of the received bit within the transmitted bit

time. The sampling point is between Phase1 Seg and

Phase2 Seg. These segmen ts are lengthen ed or sho rt-

ened by res ynchronizatio n. The end of the Phase1 Seg

determines the sampling point within a bit period. The

segment is programmable from 1TQ to 8 TQ. Phase2

Seg provides delay to the next transmitted data transi-

tion. Th e segment is progr ammable fr om 1 TQ to 8 TQ,

or it may be defined to be equal to the greater of

Phase1 Seg or the in form ati on pro ce ssin g tim e (2 TQ).

The Phase1 Seg is initialized by setting bits

SEG1PH<2:0> (CiCFG2<5:3>), and Phase2 Seg is

initialized by setting SEG2PH<2:0> (CiCFG2<10:8>).

The following requirement must be fulfille d while setting

the lengths of the phase segments:

Prop Seg + Phase1 Seg > = Phase2 Seg

17.6.5 SAMPLE POINT

The sample point is the point of time at which the bus

level is read and interpret ed as the value of that respec-

tive bi t. The lo ca tion is at the en d of Phas e1 Seg . I f th e

bit timin g is slow and cont ains many TQ, it is possible to

specify multiple sampling of the bus line at the sample

point. The level determin ed by the CAN bus then co rre-

sponds to the result from the majority decision of three

values. The majority samples are taken at the sample

point and twice before with a distance of TQ/2. The

CAN module allows the user to choose between sam-

pling thre e times at the s ame point or once at the same

point, by setting or clea ring the SAM bit (CiC FG2<6>).

Typically, the sampling of the bit should take place at

about 60-70% through the bit time, depending on the

system parameters.

17.6.6 SYNCHRONIZATION

To compensate for phase shifts between the oscillator

frequencies of the different bus stations, each CAN

controller must be able to synchronize to the relevant

signal edge of the incoming signal. When an edge in

the transmitted data is detected, the logic will compare

the loc ation of the edge t o th e expec ted tim e (Syn chro-

nous Segment). The circuit will then adjust the values

of Phase1 Seg and Phase2 Seg. There are 2

mechanisms used to synchronize.

17.6.6. 1 Hard Synchr onization

Hard synchronization is only done whenever there is a

‘rece ssive’ to ‘ dominant’ edge during bus Idle indicatin g

the start of a message. After hard synchronization, the

bit time coun ters are rest arted wi th the Syn c Seg. Ha rd

synchronization forces the edge which has caused the

hard synchronization to lie within the synchronization

segmen t of the rest arted bit time. If a hard synchron iza-

tion is don e, there will not be a res ynchroniza tion within

that bit time.

17.6.6.2 Resynchronization

As a result of resynchronization, Phase1 Seg may be

lengthened or Phase2 Seg may be shortened. The

amount of lengthening or shortening of the phase

buf f er s egm en t h as an upper bou nd k no w n a s t he sy n-

chronization jump width, and is specified by the

SJW<1:0> bits (CiCFG1<7:6>). The value of the syn-

chronization jump width will be added to Phase1 Seg or

subtracted from Phase2 Seg. The resynchronization

jump width is programmable between 1TQ and 4 TQ.

The following requirement must be fulfilled while setting

the SJW<1:0> bits:

Phase2 Seg > Synchronizat ion Jump Width

Note: FCAN must not exceed 30 MHz. If

CANCKS = 0, then FCY must not exceed

7.5 MHz.

TQ = 2 (BRP<5:0> + 1) / FCAN

dsPIC30F6011A/6012A/6013A/6014A

TABLE 17-1: CAN1 REGISTER MAP

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

C1RXF0SID 0300 — — — Receive Acceptance Filter 0 Standard Identifier <10:0> —EXIDE 000u uuuu uuuu uu0u

C1RXF0EIDH 0302 — — — — Receive Acceptance Filter 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1R XF0EIDL 0304 Receive Accept ance Filter 0 E xtended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF1SID 0308 — — — Receive Acceptance Filter 1 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF1EIDH 030A — — — — Receive Acceptance Filter 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1R XF1EIDL 030C Receive Acceptance Filter 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF2SID 0310 — — — Receive Acceptance Filter 2 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF2EIDH 0312 — — — — Receive Acceptance Filter 2 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1R XF2EIDL 0314 Receive Accept ance Filter 2 E xtended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF3SID 0318 — — — Receive Acceptance Filter 3 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF3EIDH 031A — — — — Receive Acceptance Filter 3 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1R XF3EIDL 031C Receive Acceptance Filter 3 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF4SID 0320 — — — Receive Acceptance Filter 4 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF4EIDH 0322 — — — — Receive Acceptance Filter 4 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1R XF4EIDL 0324 Receive Accept ance Filter 4 E xtended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXF5SID 0328 — — — Receive Acceptance Filter 5 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C1RXF5EIDH 032A — — — — Receive Acceptance Filter 5 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1R XF5EIDL 032C Receive Acceptance Filter 5 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXM0SID 0330 — — — Receive Acceptance Mask 0 Standard Identifier <10:0> —MIDE000u uuuu uuuu uu0u

C1RXM0EIDH 0332 — — — — Receive Acceptance Mask 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXM0 EIDL 0334 Receive Acceptance Mask 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1RXM1SID 0338 — — — Receive Acceptance Mask 1 Standard Identifier <10:0> —MIDE000u uuuu uuuu uu0u

C1RXM1EIDH 033A — — — — Receive Acceptance Mask 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RXM1EIDL 033C Receive Acceptance Mask 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C1TX2SID 0340 Transmit Buffer 2 Standard Identifier <10:6> — — — Transmit Buffer 2 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1TX2EID 0342 Transmit Bu ffer 2 Exten ded Identifier

<17:14> — — — — Transmit Buffer 2 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C1TX2DLC 0344 Transmit Buffer 2 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C1TX2B1 0346 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu

C1TX2B2 0348 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu

C1TX2B3 034A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu

C1TX2B4 034C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu

C1TX2CON 034E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C1TX1SID 0350 Transmit Buffer 1 Standard Identifier <10:6> — — — Transmit Buffer 1 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1TX1EID 0352 Transmit Buf fer 1 Extende d Identifier <17:14> — — — — Transmit Buffer 1 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C1TX1DLC 0354 Transmit Buffer 1 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

C1TX1B1 0356 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C1TX1B2 0358 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C1TX1B3 035A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C1TX1B4 035C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C1TX1CON 035E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C1TX0SID 0360 Transmit Buffer 0 Standard Identifier <10:6> — — — Transmit Buffer 0 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C1TX0EID 0362 Transmit Bu ffer 0 Exten ded Identifier

<17:14> — — — — Transmit Buffer 0 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C1TX0DLC 0364 Transmit Buffer 0 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C1TX0B1 0366 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C1TX0B2 0368 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C1TX0B3 036A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C1TX0B4 036C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C1TX0CON 036E — — — — — — — — — TXABT TXLARB TXERR TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C1RX1SID 0370 — — — Receive Buffer 1 Standard I dentif ier <10:0> SRR RXIDE 000u uuuu uuuu uuuu

C1RX1EID 0372 — — — — Receive Buffer 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RX1DLC 0374 Receive Buffer 1 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C1RX1B1 0376 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C1RX1B2 0378 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C1RX1B3 037A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C1RX1B4 037C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C1RX1CON 037E — — — — — — — —RXFUL— — — RXRTRRO FILHIT<2:0> 0000 0000 0000 0000

C1RX0SID 0380 — — — Receive Buffer 0 Standard I dentif ier <10:0> SRR RXIDE 000u uuuu uuuu uuuu

C1RX0EID 0382 — — — — Receive Buffer 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C1RX0DLC 0384 Receive Buffer 0 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C1RX0B1 0386 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C1RX0B2 0388 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C1RX0B3 038A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C1RX0B4 038C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C1RX0CON 038E — — — — — — — —RXFUL— — — RXRTRRO DBEN JTOFF FILHIT0 0000 0000 0000 0000

C1CTRL 0390 CANCAP — CSIDLE ABAT CANCKS REQOP<2:0> OPMODE<2:0> —ICODE<2:0>—0000 0100 1000 0000

C1CFG1 0392 — — — — — — — — SJW<1:0> BRP<5:0> 0000 0000 0000 0000

C1CFG2 0394 —WAKFIL— — — SEG2PH<2:0> SEG2PHTS SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu

C1INTF 0396 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000

C1INTE 0398 — — — — — — — — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000

C1EC 039A Transmit Error Count Register Receive Error Count Register 0000 0000 0000 0000

TABLE 17-1: CAN1 REGISTER MAP (CONTINUED)

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

TABLE 17-2: CAN2 REGISTER MAP

SFR Name

Addr.

Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

C2RXF0SID 03C0 — — — Receive Acc eptance Fi lter 0 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF0EIDH

03C2 — — — — Receive Acceptance Filter 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF0EIDL 03C4 Receive Acceptance Filter 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF1SID 03C8 — — — Receive Acc eptance Fi lter 1 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF1EIDH 03CA

— — — — Receive Acceptance Filter 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF1EIDL

03CC

Receive A ccept ance Filter 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF2SID 03D0 — — — Receive Acc eptance Fi lter 2 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF2EIDH

03D2 — — — — Receive Acceptance Filter 2 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF2EIDL 03D4 Receive Acceptance Filter 2 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF3SID 03D8 — — — Receive Acc eptance Fi lter 3 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF3EIDH 03DA

— — — — Receive Acceptance Filter 3 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF3EIDL

03DC

Receive A ccept ance Filter 3 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF4SID 03E0 — — — Recei ve Acceptance Filter 4 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF4EIDH

03E2 — — — — Receive Acceptance Filter 4 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF4EIDL 03E4 Receive Acceptance Filter 4 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXF5SID 03E8 — — — Recei ve Acceptance Filter 5 Standard Identifier <10:0> — EXIDE 000u uuuu uuuu uu0u

C2RXF5EIDH

03EA — — — — Receive Acceptance Filter 5 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXF5EIDL

03EC

Receive A ccept ance Filter 5 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXM0SID 03F0 — — — Receive Acceptance Mask 0 Standard Identifier <10:0> —MIDE000u uuuu uuuu uu0u

C2RXM0EIDH

03F2 — — — — Receive Acceptance Mask 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXM0EIDL

03F4 Receive Acceptance Mask 0 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2RXM1SID 03F8 — — — Receive Acceptance Mask 1 Standard Identifier <10:0> —MIDE000u uuuu uuuu uu0u

C2RXM1EIDH

03FA — — — — Receive Acceptance Mask 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RXM1EIDL

03FC Receive Acceptance Mask 1 Extended Identifier <5:0> — — — — — — — — — — uuuu uu00 0000 0000

C2TX2SID 0400 Transmit Buffer 2 Standard Identifier <10:6> — — — T ransmit Buffer 2 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C2TX2EID 0402

Transmit Buf f er 2 Extended I dentifier <17: 14>

— — — — Transmit Buffer 2 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C2TX2DLC 0404 Transmit Buffer 2 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C2TX2B1 0406 Transmit Buffer 2 Byte 1 Transmit Buffer 2 Byte 0 uuuu uuuu uuuu uuuu

C2TX2B2 0408 Transmit Buffer 2 Byte 3 Transmit Buffer 2 Byte 2 uuuu uuuu uuuu uuuu

C2TX2B3 040A Transmit Buffer 2 Byte 5 Transmit Buffer 2 Byte 4 uuuu uuuu uuuu uuuu

C2TX2B4 040C Transmit Buffer 2 Byte 7 Transmit Buffer 2 Byte 6 uuuu uuuu uuuu uuuu

C2TX2CON 040E — — — — — — — — —

TXABT

TXLARB

TXERR

TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C2TX1SID 0410 Transmit Buffer 1 Standard Identifier <10:6> — — — T ransmit Buffer 1 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C2TX1EID 0412

Transmit Buf f er 1 Extended I dentifier <17: 14>

— — — — Transmit Buffer 1 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C2TX1DLC 0414 Transmit Buffer 1 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

dsPIC30F6011A/6012A/6013A/6014A

C2TX1B1 0416 Transmit Buffer 1 Byte 1 Transmit Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C2TX1B2 0418 Transmit Buffer 1 Byte 3 Transmit Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C2TX1B3 041A Transmit Buffer 1 Byte 5 Transmit Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C2TX1B4 041C Transmit Buffer 1 Byte 7 Transmit Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C2TX1CON 041E — — — — — — — — —

TXABT

TXLARB

TXERR

TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C2TX0SID 0420 Transmit Buffer 0 Standard Identifier <10:6> — — — T ransmit Buffer 0 Standard Identifier <5:0> SRR TXIDE uuuu u000 uuuu uuuu

C2TX0EID 0422

Transmit Buf f er 0 Extended I dentifier <17: 14>

— — — — Transmit Buffer 0 Extended Identifier <13:6> uuuu 0000 uuuu uuuu

C2TX0DLC 0424 Transmit Buffer 0 Extended Identifier <5:0> TXRTR TXRB1 TXRB0 DLC<3:0> — — — uuuu uuuu uuuu u000

C2TX0B1 0426 Transmit Buffer 0 Byte 1 Transmit Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C2TX0B2 0428 Transmit Buffer 0 Byte 3 Transmit Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C2TX0B3 042A Transmit Buffer 0 Byte 5 Transmit Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C2TX0B4 042C Transmit Buffer 0 Byte 7 Transmit Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C2TX0CON 042E — — — — — — — — —

TXABT

TXLARB

TXERR

TXREQ — TXPRI<1:0> 0000 0000 0000 0000

C2RX1SID 0430 — — — Receive Buffer 1 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu

C2RX1EID 0432 — — — — Receive Buffer 1 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RX1DLC 0434 Receive Buffer 1 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C2RX1B1 0436 Receive Buffer 1 Byte 1 Receive Buffer 1 Byte 0 uuuu uuuu uuuu uuuu

C2RX1B2 0438 Receive Buffer 1 Byte 3 Receive Buffer 1 Byte 2 uuuu uuuu uuuu uuuu

C2RX1B3 043A Receive Buffer 1 Byte 5 Receive Buffer 1 Byte 4 uuuu uuuu uuuu uuuu

C2RX1B4 043C Receive Buffer 1 Byte 7 Receive Buffer 1 Byte 6 uuuu uuuu uuuu uuuu

C2RX1CON 043E — — — — — — — —RXFUL— — —

RXRTRRO

FILHIT<2:0> 0000 0000 0000 0000

C2RX0SID 0440 — — — Receive Buffer 0 Standard Identifier <10:0> SRR RXIDE 000u uuuu uuuu uuuu

C2RX0EID 0442 — — — — Receive Buffer 0 Extended Identifier <17:6> 0000 uuuu uuuu uuuu

C2RX0DLC 0444 Receive Buffer 0 Extended Identifier <5:0> RXRTR RXRB1 — — — RXRB0 DLC<3:0> uuuu uuuu 000u uuuu

C2RX0B1 0446 Receive Buffer 0 Byte 1 Receive Buffer 0 Byte 0 uuuu uuuu uuuu uuuu

C2RX0B2 0448 Receive Buffer 0 Byte 3 Receive Buffer 0 Byte 2 uuuu uuuu uuuu uuuu

C2RX0B3 044A Receive Buffer 0 Byte 5 Receive Buffer 0 Byte 4 uuuu uuuu uuuu uuuu

C2RX0B4 044C Receive Buffer 0 Byte 7 Receive Buffer 0 Byte 6 uuuu uuuu uuuu uuuu

C2RX0CON 044E — — — — — — — —RXFUL— — —

RXRTRRO

DBEN JTOFF FILHIT0 0000 0000 0000 0000

C2CTRL 0450 CANCAP — CSIDLE ABAT CANCKS REQOP<2:0> OPMODE<2:0> —ICODE<2:0>—0000 0100 1000 0000

C2CFG1 0452 — — — — — — — — SJW<1:0> BRP<5:0> 0000 0000 0000 0000

C2CFG2 0454 —WAKFIL— — — SEG2PH<2:0>

SEG2PHTS

SAM SEG1PH<2:0> PRSEG<2:0> 0u00 0uuu uuuu uuuu

C2INTF 0456 RX0OVR RX1OVR TXBO TXEP RXEP TXWAR

RXWAR EWARN

IVRIF WAKIF ERRIF TX2IF TX1IF TX0IF RX1IF RX0IF 0000 0000 0000 0000

C2INTE 0458 — — — — — — — — IVRIE WAKIE ERRIE TX2IE TX1IE TX0IE RX1E RX0IE 0000 0000 0000 0000

C2EC 045A Transmit Error Count Register Receive Error Count Register 0000 0000 0000 0000

TABLE 17-2: CAN2 REGISTER MAP (CONTINUED)

SFR Name

Addr.

Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

Legend: u = uninitialized bit

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

18.0 DATA CONVERTER

INTERFACE (DCI) MODULE

18.1 Module Introduction

The dsPIC30F Data Converter Interface (DCI) module

allows simple interfacing of devices, such as audio

coder/decoders (Codecs), A/D converters and D/A

converters. The following interfaces are supported:

• Framed Synchronous Serial Transfer (Single or

Multi-Channel)

• Inter-IC Sound (I2S) Interfac e

• AC-Link Compliant mode

The DCI module provides the following general

features:

• Programmable word size up to 16 bits

• Support for up to 16 time slots, for a maximum

frame size of 256 bits

• Data buffering for up to 4 samples without CPU

overhead

18.2 Module I/O Pins

There are four I/O pins associated with the module.

When enabled, the module controls the data direction

of each of the four pins.

18.2.1 CSCK PIN

The CSCK pin provides the serial clock for the DCI

module. The CSCK pin may be configured as an input

or output using the CSCKD control bit in the DCICON2

SFR. When configured as an output, the serial clock is

provided by the dsPIC30F. When configured as an

input, the serial clock must be provided by an external

device.

18.2.2 CSDO PIN

The serial data output (CSDO) pin is configured as an

output only pin when the module is enabled. The

CSDO pin drives the serial bus whenever data is to be

tran smit ted. Th e CSDO pi n is tri- state d or driv en t o ‘0’

during CSCK periods when data is not transmitted,

depending on the state of th e CSDOM control bi t. This

allows other devices to place data on the serial bus

during transmission periods not used by the DCI

module.

18.2.3 CSDI PIN

The serial data input (CSDI) pin is configured as an

input only pin when the module is enabled.

18.2.3.1 COFS PIN

The Co dec Fra me Sync hroniz ation (COFS) pin i s used

to synchronize data transfers that occur on the CSDO

and CSDI pins. The COFS pi n may be configured as an

input or an ou tpu t. The data dire cti on for the COFS pi n

is determined by the COFSD control bit in the

DCICON1 register.

The DCI module accesses the shadow registers while

the CPU is in the process of accessing the memory

mapped buffer registers.

18.2.4 BUFFER DATA ALIGNMENT

Data values are always stored left justified in the buff-

ers since most Codec data is represented as a signed

2’s comp lemen t fracti onal n umber. If the received w ord

length is less than 16 bits, the unused LSbs in the

receive buffer registers are set to ‘0’ by the module. If

the transmitted word length is less than 16 bits, the

unused LSb s in the transm it buf fer regis ter are ignore d

by the module. The word length setup is described in

subsequent sections of this document.

18.2.5 TRANSMIT/RECEIVE SHIFT

The DCI module has a 16-bit shift register for shifting

serial data in and out of the module. Data is shifted in/

out of th e shift reg ister MSb f irst, since audio PCM data

is transmitted in signed 2’s complement format.

18.2.6 DCI BUFFER CONTROL

The DCI m odule con tains a buffe r control uni t for trans-

ferring data between the shadow buffer memory and

the serial shift register. The buffer control unit is a sim-

ple 2-bit address counter that points to word locations

in the shadow buffer memory. For the receive memory

spac e (high addres s portion of DCI bu ffer me mory), the

address counter is concatenated with a ‘0’ in th e MS b

locatio n to form a 3-bi t ad dres s. For th e tran sm it mem -

ory space (high portion of DCI buffer memory), the

address counter is concatenated with a ‘1’ in th e MS b

location.

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

Note: The DCI buffer control unit always

access es the sam e rel ati ve lo cat ion in the

transmit and receive buffers, so only one

address counter is provided.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 18-1: DCI MODULE BLOCK DIAGRAM

BCG Control bits

16-bit Data Bus

Sample Rate

Generator

SCKD

FSD

DCI Buffer

Frame

Synchronization

Generator

Control Unit

DCI Shift Register

Receive Buffer

Registers w/Shadow

FOSC/4

Word Size Selection bits

Frame Length Selection bits

DCI Mode Selection bits

CSCK

COFS

CSDI

CSDO

15 0

Transmit Buffer

Registers w/Shadow

dsPIC30F6011A/6012A/6013A/6014A

18.3 DCI Module Operation

18.3.1 MODULE ENABLE

The DCI module is enabled or disabled by setting/

clearing the DCIEN control bit in the DCICON1 SFR.

Clearing the DCIEN control bit has the effect of reset-

ting the module. In particular, all counters associated

with CSCK generation, frame sync, and the DCI buffer

control unit are reset.

The DCI clocks are shutdown when the DCIEN bit is

cleared.

When enabled, the DCI controls the data direction for

the four I/O pins associated with the module. The Port,

LAT and TRIS register values for these I/O pins are

overridden by the DCI module when the DCIEN bit is set.

It is also possible to override the CSCK pin separately

when the bit clock generator is enabled. This permits

the bit clock generator to operate without enabling the

rest of the DCI module.

18.3.2 WORD SIZE SELECTION BITS

The WS<3:0> word size selection bits in the DCICON2

SFR determine the number of bits in each DCI data

word. Essentially, the WS<3:0> bits determine the

counting period for a 4-bit counter clocked from the

CSCK signal.

Any data length, up to 16-bits, may be selected. The

value loaded into the WS<3:0> bits is one less the

desired word length. For example, a 16-bit data word

size is sele cted when WS< 3:0> = 1111.

18.3.3 FRAME SYNC GENERATOR

The frame sync generator (COFSG) is a 4-bit counter

that sets the frame length in data words. The frame

sync gen erator is incre mente d each tim e the word size

counter is reset (refer to Section 18.3.2 “Word Size

Selection Bits”). The period for the frame synchroni-

zation generator is set by writing the COFSG<3:0>

control bits in the DCICON2 SFR. The COFSG period

in clock cycles is determined by the following formula:

EQUATION 18-1: COFSG PERIOD

Frame lengths, up to 16 data words, may be selected.

The frame length in CSCK periods can vary up to a

maximum of 256 depending on the word size that is

selected.

18.3.4 FRAME SYNC MODE

CONTROL BITS

The type of frame sync signal is selected using the

Frame Synchronization mode control bits

(COFSM<1:0>) in the DCICON1 SFR. The following

operating modes can be selected:

• Multi-Channel mode

•I

2S mode

• AC-Link mode (16-bit)

• AC-Link mode (20-bit)

The operation of the COFSM control bits depends on

whether the DCI module generates the frame sync

signal as a master device, or receives the frame sync

signal as a slave device.

The master device in a DSP/Codec pair is the device

that generates the frame sync signal. The frame sync

signal initiates data transfers on the CSDI and CSDO

pins and usually has the same frequency as the data

sample rate (COFS).

The DCI module is a frame sync master if the COFSD

control bit is cleared and is a frame sync slave if the

COFSD cont rol bit is set.

18.3.5 MASTER FRAME SYNC

OPERATION

When the DCI module is operating as a frame sync

master device (COFSD = 0), the COFSM mode bits

determine the type of frame sync pulse that is

generated by the frame sync generator logic.

A new COFS signal is generated when the frame sync

generator resets to ‘0’.

In the Multi-Channel mode, the frame sync pulse is

drive n high for the CSC K period to init iate a d at a trans-

fer. The number of CSCK cycles between successive

frame sync pulses will depend on the word size and

frame sync generator control bits. A timing diagram for

the frame sync signal in Multi-Channel mode is shown

in Figure 18-2.

In the AC-Link mode of operation, the frame sync sig-

nal has a fixed period and duty cycle. The AC-Link

frame sy nc signal is high for 16 CSCK cycles an d is low

for 240 CSCK cycles. A timing diagram with the timing

details at the start of an AC-Link frame is shown in

Figure 18-3.

In the I2S mode, a frame sync signal havi ng a 50% dut y

cycle is generated. The period of the I2S frame sync

signal in CSCK cycles is determined by the word size

and frame sync generator control bits. A new I2S data

transfer boundary is marked by a high-to-low or a

low-to-high transition edge on the COFS pin.

Note: These WS<3:0> control bits are used only

in the Multi-Channel and I2S modes. These

bits have no effect in AC-Link mode since

the dat a slot sizes are fixed by the protocol.

Note: The CO FSG control bits will h ave no ef fect

in AC-Lin k mode since the frame length is

set to 256 CSCK periods by the protocol.

Frame Leng th = Word L ength • (FSG Value + 1)

dsPIC30F6011A/6012A/6013A/6014A

18.3.6 SLAVE FRAME SYNC OPERATION

When the DCI module is operating as a frame sync

slave (COFSD = 1), data tra nsfers are co ntrolled by the

Codec device attached to the DCI module. The

COFSM control bits control how the DCI module

responds to incoming COFS signals.

In the Multi-Channel mode, a new data frame transfer

will begin one CSCK cycle after the COFS pin is sam-

pled high (see Figure 18-2). The pulse on the COFS

pin resets the frame sync generator logic.

In the I2S mode, a new data word will be transferred

one CSCK cycle after a low-to-high or a high-to-low

transition is sampled on the COFS pin. A rising or fall-

ing edge on the COFS pin resets the frame sync

generator logic.

In the AC -Li nk mo de, the tag s lot and subs equ ent data

slots for the next frame will be transferred one CSCK

cycl e after the COFS pin is sampled high.

The COFSG and WS bits must be configured to pro-

vide the proper frame length when the module is oper-

ating in the Slave mode. On ce a va lid frame syn c pulse

has been sampl ed by th e mo dule on the COFS pin, an

entire data frame transfer will take place. The module

will not respond to further frame sync pulses until the

data fram e tr ansfer has com ple ted .

FIGURE 18-2: FRAME SYNC TIMING, MULTI-CHANNEL MODE

FIGURE 18-3: FRAME SYNC TIMING, AC-LINK START OF FRAME

FIGURE 18-4: I 2S INT ERFACE FRAME SYN C TIMING

CSCK

CSDI/CSDO

COFS

MSB LSB

Tag

MSb

BIT_CLK

CSDO or CSDI

SYNC

Tag

bit 14

S12

LSb

S12

bit 1

S12

bit 2 Tag

bit 13

MSB LSB MSB LSB

CSCK

CSDI or CSDO

Note: A 5-bit transfer is show n here for illustration purposes. The I2S protocol does not specify word length – this

will be system dependent.

dsPIC30F6011A/6012A/6013A/6014A

18.3.7 BI T CLOCK GENERATOR

The DCI module has a dedicated 12-bit time base that

produ ces the bit cl ock. The bit clock r ate (period ) is set

by writing a non-zero 12-bit value to the BCG<11:0>

control bits in the DCICON1 SFR.

When the BCG<11:0> bits are set to zero, the bit clock

will be disabled . If the BCG<11:0> bit s are set to a no n-

zero value, the bit clock generator is enabled. These

bits shou ld be set t o ‘0’ and the CSCKD bit set to ‘1’ if

the seri al clo ck for t he DCI is r ece ived from an ext ernal

device.

The formula for the bit clock frequency is given in

Equation 18-2.

EQUATION 18-2: BIT CLOCK FREQUENCY

The required bit clock frequency will be determined by

the system sampling rate and frame size. Typical bit

clock frequenc ies range from 16x to 512 x the converter

sample rate depending on the data converter and the

communication protocol that is used.

To achieve bit clock frequencies associated with com-

mon audio sampling rates, the user will need to select

a crystal frequency that has an ‘even’ binary value.

Examples of such crystal frequencies are listed in

Table 18-1.

TABLE 18-1: DEVICE FREQUENCIES FOR COMMON CODEC CSCK FREQUENCIES

FBCK = FCY

2 (BCG + 1)

•

FS (KHz) FCSCK/FSFCSCK (MHz )(1) FOSC (MHZ)PLLFCY (MIPS) BCG(2)

8 256 2.048 8.192 4 8.192 1

12 256 3.072 6.144 8 12.288 1

32 32 1.024 8.192 8 16.384 7

44.1 32 1.4112 5.6448 8 11.2896 3

48 64 3.072 6.144 16 24.576 3

Note 1: When the CSC K signal is appl ied externall y (CSCKD = 1), the e xternal cloc k high and l ow times mus t meet

the device timing requirements.

2: When the CSCK signal is applied externally (CSCKD = 1), the BCG<11:0> bits have no effect on the

operation of the DCI module.

dsPIC30F6011A/6012A/6013A/6014A

18.3.8 SAMPLE CLOCK EDGE

CONTROL BIT

The sample clock edge (CSCKE) control bit determines

the sam pling edge for the CSCK si gnal. If the C SCK bit

is cleared (default), data will be sampled on the falling

edge of the CSCK signal. The AC-Link protocols and

most Multi-Channel formats require that data be sam-

pled on the falling edge of the CSCK signal. If the

CSCK bi t is set, da ta will be sampl ed on the rising edg e

of CSCK. The I2S protocol requires that data be

sampled on the rising edge of the CSCK signal.

18.3.9 DATA JUSTIFICATION

CONTROL BIT

In most applications, the data transfer begins one

CSCK cycle after the COFS signal is sampled active.

This is the de fault conf igura tion of t he DCI module. An

alternate data alignment can be selected by setting the

DJST control bit in the DCICON2 SFR. When DJST = 1,

data transfers will begin during the same CSCK cycle

when the COFS signal is sampled active.

18.3.10 TRANSMIT SLOT ENABLE BITS

The TSCON SFR has control bits that are used to

enable up t o 16 ti me sl ots for tran smis sion. The se co n-

trol bits are t he TSE <15 :0> bi ts. Th e siz e of ea ch time

slot is determined by the WS<3:0> word size selection

bits and can vary up to 16 bits.

If a transmit tim e slot is enabl ed via one of the TSE bit s

(TSEx = 1), the contents of the current transmit shadow

buff er locatio n will be lo aded into the CSDO Sh ift regis-

ter and the DCI buffer control unit is incremented to

point to the next location.

During an u nus ed t r ansmit time s lo t, the C SDO pi n w il l

drive ‘0’s or will be tri-stated during all disabled time

slots depending on the state of the CSDOM bit in the

DCICON1 SFR.

The dat a frame size in bit s is determine d by the chosen

data word size and the number of data word elements

in the frame. If the chosen frame size has less than 16

elements, the additional slot enable bits will have no

effect.

Each tran smit dat a word is written to the 16-bit trans mit

buffer as lef t just ified da ta. If th e sele cted wo rd size is

less than 16 bits, then the LSbs of the transmit buffer

memory will have no ef fect on the transmitted data. The

user should write ‘0’s to the unused LSbs of each

transmit buffer location.

18.3.11 RECEIVE SLOT ENABLE BITS

The RSCON SFR cont ains control bit s that are used to

enable up to 16 time slots for reception. These control

bits are the RSE<15:0> bits. The size of each receive

time slot is determined by the WS<3:0> word size

selection bits and c an vary from 1 to 16 bits.

If a recei ve t im e sl ot i s e nab led vi a one of the RSE bits

(RSEx = 1), the sh ift register co nte nt s will be w ritte n to

the curre nt D CI rec ei ve shad ow b uffer location and th e

buffer control unit will be incremented to point to the

next buffer location.

Data is not packed in the receive memory buffer loca-

tions if the selected w ord size is less than 16 bits . Each

received slot data word is stored in a separate 16-bit

buffer location. Data is always stored in a left justified

format in the receive memory buffer.

18.3.12 SLOT ENABL E BITS OP ERATION

WITH FRAME SYNC

The TSE and RSE control bits operate in concert with

the DCI frame sync generator. In the Master mode, a

COFS signal is generated whenever the frame sync

generator is reset. In the Slave mode, the frame sync

generato r is reset whenev er a COFS pulse is receive d.

The TSE and R SE control bit s all ow up to 16 co ns ecu-

tive time slots to be enabled for transmit or receive.

After the last enabled time slot has been transmitted/

received, the DCI will stop buffering data until the next

occurring COFS pulse.

18.3.13 SYNCHRONOUS DATA

TRANSFERS

The DCI buffer control unit will be incremented by one

word location whenever a given time slot has been

enabled for transmission or reception. In most cases,

data input and output transfers will be synchronized,

which means that a data sample is received for a given

channel at the s am e ti me a d ata s am pl e is t r ans mi tte d.

Therefore, th e trans mit a nd rec eive buf fers will be fille d

with equal amounts of data when a DCI interrupt is

generated.

In some cases, the amount of data transmitted and

rece ived dur ing a data fr ame may no t be eq ual . As an

example, assume a two-word data frame is used. Fur-

thermore, assume that data is only received during

slot #0 but is transmitted during slot #0 and slot #1. In

this c ase, the bu ffer cont rol unit counter would be incre-

mented twice during a data frame but only one receive

dsPIC30F6011A/6012A/6013A/6014A

18.3.14 BUFFER LENGTH CONTROL

The amount of data that is buffered between interrupts

is dete rmined by the buf fer le ngth (BLEN< 1:0> ) contro l

bits in the DCISTAT SFR. The size of the transmit and

receive buffers may be varied from 1 to 4 data words

using the BLEN control bits. The BLEN control bits are

compared to the current value of the DCI buffer control

unit address counter. When the 2 LSbs of the DCI

address counter match the BLEN<1:0> value, the

buffer control unit will be reset to ‘0’. In addition, the

contents of the receive shadow registers are trans-

ferred to the receive buffer registers and the contents

of the transmit buffer registers are transferred to the

transmit shadow registers.

18.3.15 BUFFER ALIGNME NT WITH DATA

FRAMES

There is no direct coupling between the position of the

AGU address pointer and the data frame boundaries.

This mea ns tha t t here will be an im pl ied ass ign me nt of

each transmit and receive buffer that is a function of the

BLEN control bits and the number o f enabled dat a slots

via the TSE and RSE control bits.

As an example, assume that a 4-word data frame is

chosen and that we want to transmit on all four time

slots in the frame. This configuration would be estab-

lished by setting the TSE0, TSE1, TSE2 and TSE3

control bits in the TSCON SFR. With t his module s etup,

the TXBUF0 register would be naturally assigned to

slot #0, the TXBUF1 register would be naturally

assigned to slot #1, and so on.

18.3.16 TRANSMI T STATUS BITS

There are two tran smit status bits in the DCISTA T SFR.

The TMPTY bit is set when th e con tent s of th e t ransmit

buffer registers are transferred to the transmit shadow

registers. The TMPTY bit may be polled in software to

determine when the transmit buffer registers may be

written. The TMPTY bit is cleared automatically by the

hardware when a write to one of the four transmit

buffers occurs.

The T UNF bi t is re ad onl y a nd indic ate s that a trans mit

underflow has occurred for at least one of the transmit

buff er registers that is in use. The TUNF bit is set at the

time the transmit buffer registers are transferred to the

transmit shadow registers. The TUNF status bit is

cleared automatically when the buffer register that

underflowed is written by the CPU.

18.3.17 RECEIVE STATUS BITS

There are tw o re cei ve st a tus bits in the DCISTAT SFR.

The RFUL st atus bit is read onl y and indicate s that new

data is availa ble in the rec eive buf fers . The RFUL bit is

cleared automatically when all receive buffers in use

have been read by the CPU.

The ROV status bit is read only and indicates that a

receive overflow has occurred for at least one of the

receive buffer locations. A receive overflow occurs

when the buffer location is not read by the CPU before

new dat a is transfe rred from the sha dow regis ters. Th e

ROV st atus bit is clea red auto matic ally when th e b uff er

When a receive overflow occurs for a specific buffer

location, the old contents of the buffer are overwritten.

Note: When more than four time slots are active

within a data frame, the user code must

keep track of which time slots are to be

read/written at each interrupt. In some

cases, the alignment between transmit/

receive buffers and their respective slot

assignments could be lost. Examples of

such cases include an emulation break-

point or a hardware trap. In these situa-

tions, th e user should po ll the SLOT st atus

bits to determine what data should be

loaded into the buffer registers to

resynchronize the software with the DCI

module.

Note: The transmit status bits only indicate sta-

tus for b uffer locations that are used by the

module. If the buffer length is set to less

than four words, for example, the unused

buffer locations will not affect the transmit

statu s bits.

Note: The re ceive s tatus bits only ind icate st atus

for buffer locations that are used by the

module. If the buffer length is set to less

than four words, for example, the unused

buffer locations will not affect the transmit

statu s bits.

dsPIC30F6011A/6012A/6013A/6014A

18.3.18 SLOT STATUS BITS

The SLOT<3:0> status bits in the DCISTAT SFR indi-

cate the current active time slot. These bits will corre-

spond t o the value o f the frame sy nc generator counter .

The user may poll these status bits in software when a

DCI interrupt occurs to determine what time slot data

was last received and which time slot data should be

loaded into the TXBUF registers.

18.3.19 CSDO MODE BIT

The CSDOM control bit controls the behavior of the

CSDO pin during unused transmit slots. A given trans-

mit time slot is unused if it’s corresponding TSEx bit in

the TSCON SFR is cleared.

If the C SDOM bit is clea red (defaul t), the C SDO pin wil l

be low during unused time slot periods. This mode will

be used when there are only two devices attached to

the serial bus.

If the CSDOM bit is se t, the CSDO pin will be tri-s t ate d

during unu sed time slot peri ods. This mode allow s mul-

tiple devices to share the same CSDO line in a multi-

channel application. Each device on the CSDO line is

configured so that it will only transmit data during

specific time slots. No two devices will transmit data

during the same time slot.

18.3.20 DIGITAL LOOPBACK MODE

Digital Loopback mode is enabled by setting the

DLOOP control bit in the DCISTAT SFR. When the

DLOOP bit is set, the module internally connects the

CSDO signal to CSDI. The actual data input on the

CSDI I/O pin will be ignored in Digital Loopback mode.

18.3.21 UNDERFLOW MODE CONTROL BIT

When an underflow occurs, one of two actions may

occur depending on the state of the Underflow mode

(UNFM) control bit in the DCICON2 SFR. If the UNFM

bit is cleared (default), the module will transmit ‘0’s on

the C SDO pin duri ng t he a cti ve ti me sl ot for t he bu ffer

location. In this Operating mode, the Codec device

attached to the DCI module will simply be fed digital

‘silence’. If the UNFM control bit is set, the module will

transmi t the la st dat a writte n to the buf fer loc ation. This

Operating mode permits the user to send continuous

data to the Codec device without consuming CPU

overhead.

18.4 DCI Module Interrupts

The frequency of DCI module interrupts is dependent

on the BLEN<1:0> control bits in the DCICON2 SFR.

An interrupt to the CPU is generated each time the set

buffer length has been reached and a shadow register

transfer takes place. A shadow register transfer is

defined as the time when the previously written TXBUF

values are transf erred to the trans mit sh adow regis ter s

and new received values in the receive shadow

registers are transferred into the RXBUF registers.

18.5 DCI Module Operation During CPU

Sleep and Idle Modes

18.5.1 DCI MODULE OPERATION DURING

CPU SLEEP MODE

The DCI module has the ability to operate while in

Sleep mod e and wak e the C PU when th e CSCK signa l

is supplied by an external device (CSCKD = 1). The

DCI module will generate an asynchronous interrupt

when a DC I buffer t ransfer has co mpleted and th e CPU

is in Sleep mode.

18.5.2 DCI MODULE OPERATION DURING

CPU IDLE MODE

If the DCISIDL control bit is cleared (default), the mod-

ule wil l continue to operate normal ly even in Id le mode.

If the DCISIDL bit is set, the module will halt when Idle

mode is asserted.

18.6 AC-Link Mode Operation

The AC-L in k p roto co l i s a 2 56 -bit fram e w ith on e 1 6-b it

data slot, followed by twelve 20-bit data slots. The DCI

module has two Operating modes for the AC-Link pro-

tocol. These Operating modes are selected by the

COFSM<1:0> control bits in the DCICON1 SFR. The

first AC-Link mode is called ‘16-bit AC-Link mode’ and

is selected by setting COFSM<1:0> = 10. The seco nd

AC-Link mode is called ‘20-bit AC-Link mode’ and is

selected by settin g COFSM<1:0> = 11.

18.6.1 16-BIT AC-LINK MODE

In the 16-bit AC-Link mode, data word lengths are

restricted to 16 bits. Note that this restriction only

affects the 20-bit data time slots of the AC-Link proto-

col. For received time slots, the incoming data is simply

truncate d to 16 bit s. For outgoing tim e slots, the 4 LSb s

of the dat a w ord are s et to ‘ 0’ by the modul e. This tru n-

cation of the tim e s lo t s limit s th e AD C and D AC da t a to

16 bit s but p ermits proper da ta ali gnment in t he TXBUF

and RXBUF reg isters. Ea ch RXBUF and TXBUF regis -

ter will contain one data time slot value.

18.6.2 20-BIT AC-LINK MODE

The 20-bit AC -Link mode al lows all bits in the dat a time

slot s to be trans mitted and rece ived but doe s not main-

tain data alignment in the TXBUF and RXBUF

registers.

The 20-bit AC -Lin k mo de fun ct ions simi lar to the Mult i-

Channel mode of the DCI module, except for the duty

cycle of th e fra me sy nchronizat ion si gnal. The AC -L in k

frame s ynchro nizat ion sign al sh oul d rema in hig h for 1 6

CSCK cycles and should be low for the following

240 cycles.

dsPIC30F6011A/6012A/6013A/6014A

The 20-bit mode treats each 256-bit AC-Link frame as

sixteen, 16-bit time slots. In the 20-bit AC-Link mode,

the module operates as if COFSG<3:0> = 1111 and

WS<3:0> = 1111. The data alignment for 20-bit data

slots is ignored. For example, an entire AC-Link data

frame can be transmitted and received in a packed

fashion by setting all bits in the TSCON and RSCON

SFRs. Since the total available buffer length is 64 bits,

it would take 4 consecutive interrupts to transfer the

AC-Link frame. The application software must keep

track of the cur rent AC-Link frame s egment.

18.7 I2S Mode Operatio n

The DCI module is configured for I2S mode by writing

a value of ‘01’ to the COFSM<1:0> control bits in the

DCICON1 SFR. When operating in the I2S mode, the

DCI module will generate frame synchronization sig-

nals with a 50% duty cycle. Each edge of the frame

synchronization signal marks the boundary of a new

data word transfer.

The user must also select the frame length and data

word size using the COFSG and WS control bits in the

DCICON2 SFR.

18.7.1 I2S FRAME AND DATA WORD

LENGTH SELECTION

The WS and COFSG control bit s are set to produce the

period for one half of an I2S data frame. That is, the

frame length is the total number of CSCK cycles

required for a left or a right data word transfer.

The BLEN bits must be set for the desired buffer length.

Setting BLEN<1:0> = 01 will p r od uc e a CP U i n te rr u pt ,

once per I2S frame.

18.7.2 I2S DATA JUSTIFICATION

As per the I2S specification, a data word transfer will, by

default, begin one CSCK cycle after a transition of the

WS signal. A MSb left justified option can be selected

using the DJST control bit in the DCICON2 SFR.

If DJST = 1, the I2S data transfers will be MSb left jus-

tified. The MSb of the data word will be presented on

the CSDO pin during the same CSCK cycle as the ris-

ing or falling edge of the COFS signal. The CSDO pin

is tri-stated after the data word has been sent.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 18-2: DCI REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

DCICON1 0240 DCIEN — DCISIDL — DLOOP CSCKD CSCKE COFSD UNFM CSDOM DJST — — — COFSM1 COFSM0 0000 0000 0000 0000

DCICON2 0242 — — — — BLEN1 BLEN0 — COFSG<3:0> — WS<3:0> 0000 0000 0000 0000

DCICON3 0244 — — — — BCG<11:0> 0000 0000 0000 0000

DCISTAT 0246 — — — — SLOT3 SLOT2 SLOT1 SLOT0 — — — — ROV RFUL TUNF TMPTY 0000 0000 0000 0000

TSCON 0248 TSE15 TSE14 TSE13 TSE12 TSE11 TSE10 TSE9 TSE8 TSE7 TSE6 TSE5 TSE4 TSE3 TSE2 TSE1 TSE0 0000 0000 0000 0000

RSCON 024C RSE15 RSE14 RSE13 RSE12 RSE11 RSE10 RSE9 RSE8 RSE7 RSE6 RSE5 RSE4 RSE3 RSE2 RSE1 RSE0 0000 0000 0000 0000

RXBUF0 0250 Receive Buffer #0 Data Register 0000 0000 0000 0000

RXBUF1 0252 Receive Buffer #1 Data Register 0000 0000 0000 0000

RXBUF2 0254 Receive Buffer #2 Data Register 0000 0000 0000 0000

RXBUF3 0256 Receive Buffer #3 Data Register 0000 0000 0000 0000

TXBUF0 0258 Transmit Buffer #0 Data Register 0000 0000 0000 0000

TXBUF1 025A Transmit Buffer #1 Data Register 0000 0000 0000 0000

TXBUF2 025C Transmit Buffer #2 Data Register 0000 0000 0000 0000

TXBUF3 025E Transmit Buffer #3 Data Register 0000 0000 0000 0000

dsPIC30F6011A/6012A/6013A/6014A

19.0 12-BIT ANALOG-TO-DIGITAL

CONVERTER (ADC) MODULE

The 12-bit Analog-to-Digital Converter (ADC) allows

conversion of an analog input signal to a 12-bit digital

number. This module is based on a Successive

Approximation Register (SAR) architecture and pro-

vides a maxim um sa mp lin g rate of 20 0 ksp s. The ADC

module has up to 16 analog inputs which are multi-

plexed into a sample and hold amplifier. The output of

the sample and hold is the input into the converter

which generates the result. The analog reference volt-

age is software selectable to either the device supply

voltage (AVDD/AVSS) or the voltage level on the

(VREF+/VREF-) pin. The ADC has a unique feature of

being a ble to op erate wh ile the d evice i s in Slee p mode

with RC oscillator selection.

The ADC module has six 16-bit registers:

• ADC Control Register 1 (ADCON1)

• ADC Control Register 2 (ADCON2)

• ADC Control Register 3 (ADCON3)

• ADC Input Select Register (ADCHS)

• ADC Port Configuration Register (ADPCFG)

• ADC Input Scan Selection Register (ADCSSL)

The ADCON1, ADCON2 and ADCON3 registers con-

trol the ope ration of the ADC module. Th e ADCHS reg-

ister selects the input channels to be converted. The

ADPCFG register configures the port pins as analog

inputs or as digital I/O. The ADCSSL register selects

input s for sca nni ng .

The block diagram of the 12-bit ADC module is shown

in Figure 19-1.

FIGURE 19-1: 12-BIT ADC FUNCTIONAL BLOCK DIAGRAM

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046).

Note: The SSRC<2:0>, ASAM, SMPI<3:0>,

BUFM and ALTS bits, as well as the

ADCON3 and ADCSSL registers, must

not be written to while ADON = 1. This

would lead to indeterminate results.

Comparator

12-bit SAR Conversion Logic

REF

DAC

Data

16-word, 12-bit

Dual Port

RAM

Bus Interface

AN12

0000

0101

0111

1001

1101

1110

1111

1100

0001

0010

0011

0100

0110

1000

1010

1011

AN13

AN14

AN15

AN8

AN9

AN10

AN11

AN4

AN5

AN6

AN7

AN0

AN1

AN2

AN3

CH0

AN1

REF

Sample/Sequence

Control

Sample

Input M UX

Control

Input

Switches

S/H

Format

dsPIC30F6011A/6012A/6013A/6014A

19.1 ADC Result Buffer

The module contains a 16-word dual port read only

buff er, call ed ADCBUF0...ADCBUFF, to buf fer the ADC

results. The RAM is 12 bits wide but the data obtained

is represented in one of four different 16-bit data for-

mats. The contents of the sixteen ADC Result Buffer

registers, ADCBUF0 through ADCBUFF, cannot be

written by user software.

19.2 Conversion Operation

After the ADC mo dule has been configured, the sample

acquisition is started by setting the SAMP bit. Various

sources, such as a programmable bit, timer time-outs

and extern al event s, will ter minate acq uisition and st art

a conversion. When the A/D conversion is complete,

the result is loaded into ADCBUF0...ADCBUFF, and

the DONE bit and the ADC interrupt flag ADIF are set

after the number of samples specified by the SMPI bit.

The ADC module can be configured for different inter-

rupt rates as describ ed in Section 19.3 “Sel ecting the

Conversion Sequence”.

The following steps should be followed for doing an

conversion:

1. Conf igure the ADC modul e:

• Configure analog pins, voltage reference and

digital I/O.

• Select ADC input channels.

• Select ADC conv ersion clock.

• Select A DC conversion trigger.

• Turn on ADC module.

2. Configure ADC interrupt (if required):

• Clear ADIF bit.

• Select ADC interrupt priority.

3. Start sampling.

4. Wait the required acquisition time.

5. Trigger acquisition end, start conversion:

6. Wait for ADC conversion to complete, by either:

• Waiting for the ADC interrupt, or

• Waiting for the DONE bit to get set.

7. Read ADC result buffer, clear ADIF if required.

19.3 Selecting the Conversion

Sequence

Several groups of control bits select the sequence in

which the ADC connects inputs to the sample/hold

channel, converts a channel, writes the buffer memory

and generates interrupts.

The sequence is controlled by the sampling clocks.

The SMPI bits select the number of acquisition/

convers io n s eq uen ce s that w oul d b e p erfo r me d b efo re

an interrupt occurs. This can vary from 1 sample per

interrupt to 16 samples per interrupt.

The BUFM bit will split the 16-word results buffer into

two 8-word groups. Writing to the 8-word buffers will be

alternated on each interrupt event.

Use of the BUFM bit will depend on how much time is

available for the moving of the buffers after the

interrupt.

If the processor can quickly unload a full buffer within

the time it takes to acquire and convert one channel,

the B UFM bit can be ‘0’ a nd up to 16 c onv ers io ns (c or-

responding to the 16 input channels) may be done per

interrupt. The processor will have one acquisition and

conversion time to move the sixteen conversions.

If the processor cannot unload the buffer within the

acquisition and conversion time, the BUFM bit should be

‘1’. For example, if SMPI<3:0> (ADCON2<5:2>) = 0111,

then eight conversions will be loaded into 1/2 of the

buffer, following which an interrupt occurs. The next

eight conversions w ill b e load ed into the o ther 1/2 o f the

buffer. The processor will have the entire time between

interrupts to move the eig ht convers ions.

The ALTS bit can be used to alternate the inputs

selected during the sampling sequence. The input

multiplexer has two sets of sample inputs: MUX A and

MUX B. If the ALTS bit is ‘0’ , only the MUX A inpu ts are

selected for sampling. If the ALTS bit is ‘1’ and

SMPI<3:0> = 0000 on the first sample/convert

sequence, the MUX A inputs are selected and, on the

next acquire/convert sequence, the MUX B inputs are

selected.

The CSCNA bit (ADCON2<10>) will allow the multi-

plexer input to be alternately scanned across a

select ed number of analog i nputs for the MUX A g roup.

The inputs are selected by the ADCSSL register. If a

particular bit in the ADCSSL register is ‘1’, the corre-

sponding input is selected. The inputs are always

scanne d from low er to higher numbered in puts, st arting

after each interrupt. If the number of inputs selected is

greate r than the number of s amples ta ken per int errupt,

the higher numbered inputs are unused.

dsPIC30F6011A/6012A/6013A/6014A

19.4 Programming the S tart of

Conversion Trigger

The conversion trigger will terminate acquisition and

start the requested conversions.

The SSRC<2:0> bits select the source of the conver-

sion tri gger . The SSRC bi ts provide fo r up to 4 alterna te

sources of conversion trigger.

When SSRC<2:0> = 000, the conversion trigger is

under software control. Clearing the SAMP bit will

cause the co nve rsion trigger ev ent afte r ~11 TAD.

When SSRC<2:0> = 111 (Auto-Start mode), the con-

version trigger is under ADC clock control. The SAMC

bit s se lect th e numb er of AD C cloc ks be tween the st art

of acquis ition and the st art of conversi on. This provide s

the fastest conversion rates on multiple channels.

SAMC must always be at least 1 clock cycle.

Other trigger sources can come from timer modules or

external interrupts.

19.5 Aborting a Conversion

Clearing the ADON bit during a conversion will abort

the cu rrent conv ersion a nd stop the sam pling s equenc-

ing until the next sampl ing trigger . The ADCBUF will not

be updated with the partially completed ADC conver-

sion s ample . That is, th e ADCBUF will conti nue to con-

tain the value of the last completed conversion (or the

last value written to the ADCBUF register).

If the clearing of the ADON bit coincides with an auto-

start, the clearing has a higher priority and a new

conversi on will not start.

19.6 Selecting the ADC Conversion

Clock

The ADC conversion requires 14 TAD. The source of

the AD C conv ersio n clo ck is softw are s elect ed, u sing a

six-bit counter. There are 64 possible options for TAD.

EQUATION 19-1: ADC CONVERSION

CLOCK

The internal RC oscillator is selected by setting the

ADRC bit.

For correct ADC conversions, the ADC conversion

clock (TAD) must be selected to ensure a m ini mum TAD

time of 334 nsec (for VDD = 5V). Refer to the Electrical

Specifications section for minimum TAD under other

operating conditions.

Example 19-1 shows a sample calculation for the

ADCS<5:0> bits, assuming a device operating speed

of 30 MIPS.

EXAMPLE 19-1: ADC CON VERSION

CLOCK AND SAMPLING

RATE CALCULATION

TAD = TCY * (0.5*(ADCS<5:0> + 1))

Minimu m TAD = 334 nsec

ADCS<5:0> = 2 – 1

TAD

TCY

TCY = 33 .33 nsec (30 MIPS)

= 2 • – 1

334 ns ec

33.33 nsec

= 19.04

Therefore,

Set ADCS<5 :0> = 19

Actual TAD = (ADCS<5:0> + 1)

TCY

= (19 + 1)

33.33 ns e c

= 334 ns ec

If SSRC<2:0> = ‘111’ and SAMC<4:0> = ‘00001’

Since,

Sampling Time = Acquisition Time + Conversion Time

= 1 TAD + 14 TAD

= 15 x 334 nsec

Therefore,

Samplin g Rat e =

= ~200 kHz

(15 x 33 4 ns e c)

dsPIC30F6011A/6012A/6013A/6014A

19.7 ADC Speeds

The dsPIC 30F 12-bit ADC s pecif ications permit a max-

imum of 20 0 ksp s sampli ng rate. The t able bel ow sum-

marize s the conversio n speeds for t he dsPIC30F 12-b it

ADC and the required operating conditions.

TABLE 19-1: 12-BIT ADC EXTENDED CONVERSION RATES

dsPIC30F 12-bit ADC Conversion Rates

Speed TAD

Minimum Sampling

Time Min Rs Max VDD Temperature Channels Configuration

Up to 200

ksps(1) 334 ns 1 TAD 2.5 kΩ4.5V to 5.5V -40°C to +85°C

Up to 100

ksps 668 ns 1 TAD 2.5 kΩ3.0V to 5.5V -40°C to +125°C

Note 1: External VREF- and VREF+ pins must be used for correct operation. See Figure 19-2 for recommended

circuit.

REF

-V

REF

ADC

ANx S/H CH

REF

-V

REF

ADC

ANx S/H CH

ANx or V

REF

dsPIC30F6011A/6012A/6013A/6014A

The following figure depicts the recommended circuit

for the conversion rates above 100 ksps. The

dsPIC30F6014A is shown as an example.

FIGURE 19-2: ADC VOLTAGE REFERENCE SCHEMATIC

The configuration procedures below give the required

setup values for the conversion speeds above 100

ksps.

19.7.1 200 KSPS CONFIGURATION

GUIDELINE

The following configuration items are required to

achieve a 200 ksps conversion rate.

• Compl y with con di t ion s provided in Table 19-2 .

• Connect external VREF+ and VREF- pins following

the recommended circuit shown in Figure 19-2.

• Set SSRC<2.0> = 111 in the ADCO N1 regist er to

enable the auto convert opt ion .

• Enable automatic sampling by setting the ASAM

control bit in the ADCON1 register.

• Write the SMPI<3 .0> con trol bit s in the ADCON2

between interrupts.

• Configure the ADC clock period to be:

by writing to the ADCS<5:0> control bits in the

ADCON3 register.

• Configure the sampling time to be 1 TAD by

writing: SAMC<4:0> = 00001.

The following figure shows the timing diagram of the

ADC running at 200 ksps. The T AD selection i n conjunc-

tion with the guidelines described above allows a con-

version speed of 200 ksp s. See Ex ample 19-1 f or code

example.

VDD

VSS

VDD

VREF-

VREF+

AVDD

AVSS

VSS

VDD

VSS

22 80

dsPIC30F6014A

VDD

0.1 μFC1

0.01 μFR1

1 μF

VDD

0.1 μF

VDD

0.01 μF

AVDD

1 μF

AVDD

0.1 μF

AVDD

0.01 μF

See Note 1:

Note 1: Ensure adequate bypass capacitors are provided on each VDD pin.

(14 + 1) x 200,000 = 334 ns

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 19-3: CONVERTING 1 CHANNEL AT 200 KSPS, AUTO-SAMPLE START, 1 TAD

SAMPLING TIME

19.8 ADC Acquisition Requirements

The analog input model of the 12-bit ADC is shown in

Figure 19-4. The total sampling time for the ADC is a

function of the internal amplifier settling time and the

holding capacit or ch arge time.

For the AD C to meet it s s pe ci fie d ac cu rac y, the charg e

holding capacitor (CHOLD) must be allowed to fully

charge to the volta ge level on the an alog input pin . The

source impedance (RS), the interconnect impedance

(RIC), and the internal sampling switch (RSS) imped-

ance combine to directly affect the time required to

charge th e capacitor C HOLD. The combin ed imp edance

of the analog sources must therefore be small enough

to fully charge the holding capacitor within the chosen

sample time. To mi nimize the effects of pin lea kage cur-

rents on the accuracy of the ADC, the maximum rec-

ommended source impedance, RS, is 2.5 kΩ. After the

analog input channel is selected (changed), this sam-

pling function must be completed prior to starting the

conversion. The internal holding capacitor will be in a

discharged state prior to each sample operation.

FIGURE 19-4: 12-BIT ADC ANALOG INPUT MODEL

TCONV

= 14 TAD

TSAMP

= 1 TAD TSAMP

= 1 TAD

ADCLK

SAMP

DONE

ADCBUF0

ADCBUF1

Instruction Execution BSET ADCON1, ASAM

TCONV

= 14 TAD

CPIN

Rs ANx VT = 0.6V

VT = 0.6V I leakage

RIC ≤ 250ΩSampling

Switch

RSS

CHOLD

= DAC capacitance

VSS

VDD

= 18 pF

± 500 nA

Legend: CPIN

I leakage

RIC

RSS

CHOLD

= input capacitance

= threshold voltage

= leakage current at the pin due to

= interconnect resistance

= sampling switch resistance

= sample/hold capacitance (from DAC)

various junctions

Note: CPIN value depends on device package and is not tested. Effect of CPIN negligible if Rs ≤ 2.5 kΩ.

RSS ≤ 3 kΩ

dsPIC30F6011A/6012A/6013A/6014A

19.9 Module Power-down Modes

The module has 2 internal Power modes.

When the ADON bit is ‘1’, the module is in Acti ve mode;

it is fully powered and functional.

When AD ON is ‘0’, the mod ule is in Of f mode. The di g-

ital and analog portions of the circuit are disabled for

maximum current savings .

In order to return to the Acti ve mode from O ff mode, th e

user must wait for the ADC circuitry to stabilize.

19.10 ADC Operation During CPU Sleep

and Idle Modes

19.10.1 ADC OPERATION DURING CPU

SLEEP MODE

When the de vice ente rs Sleep mod e, all cl ock sourc es

to the module are shutdow n and stay at logic ‘0’.

If Sleep occurs in the middle of a conversion, the con-

version is aborted. The conv erte r will not c onti nue with

a partially completed conversion on exit from Sleep

mode.

entering or leaving Sleep mode.

The ADC module can operate during Sleep mode if the

ADC clock source is set to RC (ADRC = 1). When the

RC clock source is selected, the ADC module waits one

instruction cycle before starting the conversion. This

allows the SLEEP instru ction t o be ex ecuted which elim-

inates all digital switching noise from the conversion.

When the convers ion is complete, the CONV bit will be

cleared and the result loaded into the ADCBUF register.

If the ADC int errupt is enable d, the de vice wi ll wake-u p

from Sleep. If the ADC interrupt is not enabled, the

ADC module will then be turned off, although the

ADON bit will remain set.

19.10.2 ADC OPERATION DURING CPU

IDLE MODE

The ADSIDL bit select s if the mod ule will stop on Idle or

continue on Idle. If ADSIDL = 0, the module will con-

tinue operation on assertion of Idle mode. If ADSIDL =

1, the module will stop on Idle.

19.11 Effects of a Reset

A device Reset forces all registers to their Reset state.

This forces the ADC module to be turned off, and any

conversion and sampling sequen ce is aborted. T he val-

ues that ar e in th e ADCBUF reg isters are not m odifie d.

The ADC Result register will contain unknown data

after a Power-on Reset.

19.12 Output Formats

The ADC re su lt i s 12 bits w i de. The da t a b uffer RAM is

also 12 b it s wid e. The 12 -bit data can be read in one of

four different formats. The FORM<1:0> bits select the

format. Each of the outpu t format s trans lates t o a 16-bit

result on the data bus.

FIGURE 19-5: ADC OUTPUT DATA FORMATS

RAM Contents: d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Read to Bus:

Signed Fractional d11 d10d09d08d07d06d05d04d03d02d01d000000

Fractional d11d10d09d08d07d06d05d04d03d02d01d000000

Signed Integer d11 d11 d11 d11 d11 d10 d09 d08 d07 d06 d05 d04 d03 d02 d01 d00

Integer 0000d11d10d09d08d07d06d05d04d03d02d01d00

dsPIC30F6011A/6012A/6013A/6014A

19.13 Configuring Analog Port Pins

The use of the ADPC FG and TRIS registers control the

operation of the ADC port pins. The port pins that are

desired as analog inputs must have their correspond-

ing TRIS bit set (input). If the TRIS bit is cleared (out-

put), the digital output level (VOH or VOL) will be

converted.

The ADC operation is independent of the state of the

CH0SA<3:0>/CH0SB<3:0> bits and the TRIS bits.

When reading the Port register, all pins configured as

analog input channels will read as cleared.

Pins configured as digit al inputs will not convert an ana-

log input. Analog levels on any pin that is defined as a

digital input (including the ANx pins) may cause the

input buffer to consume current that exceeds the

device specifications.

19.14 Connection Considerations

The anal og inp uts h ave diod es to VDD and V SS as ESD

protection. This requires that the analog input be

betwee n VDD and VSS. If the input voltage exceeds this

range by greater th an 0.3V (eit her direct ion), one o f the

diodes becomes forward b iased and it may damage the

device if the input curre nt specific ati on is exce ede d.

An external RC filter is sometimes added for anti-

aliasi ng of the input signal. The R component should be

select ed to ens ure that the sampl ing time requir ement s

are satisfied. Any external components connected (via

high-impedance) to an analog input pin (capacitor,

zener diode, etc.) should have very little leakage

current at the pin.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 19-2: ADC REGISTER MAP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

SFR

Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

ADCBUF0 0280 — — — — ADC Data Buffer 0 0000 uuuu uuuu uuuu

ADCBUF1 0282 — — — — ADC Data Buffer 1 0000 uuuu uuuu uuuu

ADCBUF2 0284 — — — — ADC Data Buffer 2 0000 uuuu uuuu uuuu

ADCBUF3 0286 — — — — ADC Data Buffer 3 0000 uuuu uuuu uuuu

ADCBUF4 0288 — — — — ADC Data Buffer 4 0000 uuuu uuuu uuuu

ADCBUF5 028A — — — — ADC Data Buffer 5 0000 uuuu uuuu uuuu

ADCBUF6 028C — — — — ADC Data Buffer 6 0000 uuuu uuuu uuuu

ADCBUF7 028E — — — — ADC Data Buffer 7 0000 uuuu uuuu uuuu

ADCBUF8 0290 — — — — ADC Data Buffer 8 0000 uuuu uuuu uuuu

ADCBUF9 0292 — — — — ADC Data Buffer 9 0000 uuuu uuuu uuuu

ADCBUFA 0294 — — — — ADC Data Buffer 10 0000 uuuu uuuu uuuu

ADCBUFB 0296 — — — — ADC Data Buffer 11 0000 uuuu uuuu uuuu

ADCBUFC 0298 — — — — ADC Data Buffer 12 0000 uuuu uuuu uuuu

ADCBUFD 029A — — — — ADC Data Buffer 13 0000 uuuu uuuu uuuu

ADCBUFE 029C — — — — ADC Data Buffer 14 0000 uuuu uuuu uuuu

ADCBUFF 029E — — — — ADC Data Buffer 15 0000 uuuu uuuu uuuu

ADCON1 02A0 ADON —ADSIDL— — — FORM<1:0> SSRC<2:0> —— ASAM SAMP DONE 0000 0000 0000 0000

ADCON2 02A2 VCFG<2:0> —— CSCNA ——BUFS— SMPI<3:0> BUFM ALTS 0000 0000 0000 0000

ADCON3 02A4 — — — SAMC<4:0> ADRC — ADCS<5:0> 0000 0000 0000 0000

ADCHS 02A6 — — — CH0NB CH0SB<3:0> — — — CH0NA CH0SA<3:0> 0000 0000 0000 0000

ADPCFG 02A8 PCFG15 PCFG14 PCFG13 PCFG12 PCFG11 PCFG10 PCFG9 PCFG8 PCFG7 PCFG6 PCFG5 PCFG4 PCFG3 PCFG2 PCFG1 PCFG0 0000 0000 0000 0000

ADCSSL 02AA CSSL15 CSSL14 CSSL13 CSSL12 CSSL11 CSSL10 CSSL9 CSSL8 CSSL7 CSSL6 CSSL5 CSSL4 CSSL3 CSSL2 CSSL1 CSSL0 0000 0000 0000 0000

Legend: u = uninitialized bit

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

20.0 SYSTEM INTEGRATION

There are several features intended to maximize

system reliability, minimize cost through elimination of

external components, provide power-saving operating

modes and of fer code protecti on:

• Oscillator Selection

• Reset

- Power-on Reset (POR)

- Power-up Timer (PWRT)

- Oscillator Start-up Ti mer (OST)

- Programmable Brown-out Reset (BOR)

• Watchdog Timer (WDT)

• Power-Saving modes (Sleep and Idle)

• Code Protection

• Unit ID Locations

• In-Circuit Serial Programming (ICSP)

dsPIC30F devices have a Watchdog Timer, which is

permanently enabled via the Configuration bits or can

be software controlled. It runs off its own RC oscillator

for added reliability. There are two timers that offer

necessary delays on power-up. One is the Oscillator

Start-up Timer (OST), intended to keep the chip in

Reset until the crystal oscillator is stable. The other is

the Power-up Timer (PWRT), which provides a delay

on power-up only, designed to keep the part in Reset

while the power supply stabilizes. With these two tim-

ers on-chip, most applications need no external Reset

circuitry.

Sleep mode is designed to offer a very low-current

Power-Down mode. The us er ca n wake -up fro m Slee p

through external Reset, Watchdog Timer Wake-up or

through an inte rrupt. Several os cillator opti ons are also

made available to allow the part to fit a wide variety of

applications. In the Idle mode, the clock sources are

still active, but the CPU is shut-off. The RC oscillator

option saves system cost, while the LP crystal option

saves power.

20.1 Oscillator System Overview

The dsPIC30F oscillator system has the following

modules and features:

• Various external and internal oscillator options as

clock source s

• An on-chip PLL to boost internal operating

frequency

• A clock switching mechanism between various

clock source s

• Programm abl e c loc k pos t s ca ler for system po w er

savings

• A Fail-Safe Clock Monitor (FSCM) that detects

clock failure and takes fail-safe measures

• Clock Control register (OSCCON)

• Configuration bits for main oscillator selection

Configuration bits determine the clock source upon

Power-on Reset (POR) and Brown-out Reset (BOR).

Thereafter, the clock source can be changed between

permiss ible c lock sourc es. The O SCCO N registe r co n-

trols the clock switching and reflects system clock

related status bits.

Table 20-1 provides a summary of the dsPIC30F

oscillator operating modes. A simplified diagram of the

oscillator system is shown in Figure 20-1.

Note: This data sheet summarizes features of this

group of dsPIC30 F devi ces and is not intende d to be

a complete reference source. For more information

on the CPU, peripherals, register descriptions and

general device functionality, refer to the dsPIC30F

Family Reference Manual (DS70046). For more

information on the device instruction set and pro-

gramming, refer to the dsPIC30F Programmer’s

Reference Manual (DS70030).

dsPIC30F6011A/6012A/6013A/6014A

TABLE 20-1: OSCILLATOR OPERATING MODES

Oscillator Mode Description

XTL 200 kHz-4 MHz crystal on OSC1:OSC2

XT 4 MHz-10 MHz crystal on OSC1:OSC2

XT w/PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2, 4x PLL enabled

XT w/PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2, 8x PLL enabled

XT w/PLL 16x 4 MHz-7.5 MHz crystal on OSC1:OSC2, 16x PLL enabled(1)

LP 32 kHz crystal on SOSCO:SOSCI(2)

HS 10 MHz-25 MHz crystal.

HS/2 w/PL L 4x 10 MHz-20 MHz crystal, divide by 2, 4x PLL enabled(3)

HS/2 w/PL L 8x 10 MHz-20 MHz crystal, divide by 2, 8x PLL enabled(3)

HS/2 w/PLL 16x 10 MHz-15 MHz crystal, divide by 2, 16x PLL enabled(1)

HS/3 w/PL L 4x 12 MHz-25 MHz crystal, divide by 3, 4x PLL enabled(4)

HS/3 w/PL L 8x 12 MHz-25 MHz crystal, divide by 3, 8x PLL enabled(4)

HS/3 w/PLL 16x 12 MHz-22.5 MHz crystal, divide by 3, 16x PLL enabled(1)(4)

EC External clock input (0-40 MHz)

ECIO External clock input (0-40 MHz), OSC2 pin is I/O

EC w/PLL 4x External clock input (4-10 MHz), OSC2 pin is I/O, 4x PLL enabled

EC w/PLL 8x External clock input (4-10 MHz), OSC2 pin is I/O, 8x PLL enabled

EC w/PLL 16x External clock input (4-7.5 MHz), OSC2 pin is I/O, 16x PLL enabled(1)

ERC External RC oscillator, OSC2 pin is FOSC/4 outp ut(5)

ERCIO External RC oscillator, OSC2 pin is I/O(5)

FRC 7.37 MHz internal RC oscillator

FRC w/PLL 4x 7.37 MHz internal RC oscillator, 4x PLL enabled

FRC w/PLL 8x 7.37 MHz internal RC oscillator, 8x PLL enabled

FRC w/PLL 16x 7.37 MHz internal RC oscillator, 16x PLL enabled

LPRC 512 kHz internal RC oscillator

Note 1: Any higher will violate device operating frequency range.

2: LP oscillator can be conveniently shared as system clock, as well as Real-Time Clock for Timer1.

3: Any higher will violate PLL input range.

4: Any lower will violate PLL input range.

5: Requires external R and C. Frequency operation up to 4 MHz.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 20-1: OSCILLATOR SYSTEM BLOCK DIAGRAM

Primary

OSC1

OSC2

SOSCO

SOSCI

Oscillator

32 kHz LP

Clock

and Control

Block

Switching

Oscillator

x4, x8, x16

PLL

Primary

Oscillator

Stability Detector

Secondary

Oscillator

Programmable

Clock Divider

Oscillator

Start-up

Timer

Fail-Safe Clock

Monitor (FSCM)

Internal Fast RC

Oscillator (FRC)

Internal Low-

Power RC

Oscillator (LPRC)

PWRSAV Instruction

Wake-up Request

Oscillator Configuration bits

System

Clock

Oscillator Trap

to Timer1

LPRC

Secondary Osc

POR Done

Primary Osc

FPLL

POST<1:0>

FCKSM<1:0> 2

PLL

Lock COSC<2:0>

NOSC<2:0>

OSWEN

TUN<3:0>

dsPIC30F6011A/6012A/6013A/6014A

20.2 Oscillator Configurations

20.2.1 INITIAL CLOCK SOURCE

SELECTION

While coming out of Power-on Reset or Brown-out

Reset, the device selects its cl ock source based on:

a) FOS<2:0> Configuration bits that select one of

four osci llator groups, and

b) FPR<4:0> Configuration bits that select the

oscillator choices within the primary group.

The selection is as shown in Table 20-2.

TABLE 20-2: CONFIGURATION BIT VALUES FOR CLOCK SELECTION

Oscillator Mode Oscillator

Source FOS<2:0> FPR<4:0> OSC2 Function

ECIO w/PLL 4x PLL 11101101 I/O

ECIO w/PLL 8x PLL 11101110 I/O

ECIO w/PLL 16x PLL 11101111 I/O

FRC w/PLL 4x PLL 11100001 I/O

FRC w/PLL 8x PLL 11101010 I/O

FRC w/PLL 16x PLL 11100011 I/O

XT w/PLL 4x PLL 11100101 OSC2

XT w/PLL 8x PLL 11100110 OSC2

XT w/PLL 16x PLL 11100111 OSC2

HS/2 w/PLL 4x PLL 11110001 OSC2

HS/2 w/PLL 8x PLL 11110010 OSC2

HS/2 w/PLL 16x PLL 11110011 OSC2

HS/3 w/PLL 4x PLL 11110101 OSC2

HS/3 w/PLL 8x PLL 11110110 OSC2

HS/3 w/PLL 16x PLL 11110111 OSC2

ECIO External 01101100 I/O

XT External 01100100 OSC2

HS External 01100010 OSC2

EC External 01101011 CLKOUT

ERC External 01101001 CLKOUT

ERCIO External 01101000 I/O

XTL External 01100000 OSC2

LP Secondary 000xxxxx (Note 1, 2)

FRC Internal FRC 001xxxxx (Note 1, 2)

LPRC Internal LPRC 010xxxxx (Note 1, 2)

Note 1: OSC2 pin function is determined by FPR<4:0>.

2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is

selected at all times.

dsPIC30F6011A/6012A/6013A/6014A

20.2.2 OSCILLAT OR STAR T-UP TIMER

(OST)

In order to ensure that a crystal oscillator (or ceramic

resonator) has started and stabilized, an Oscillator

Start-up Timer is included. It is a simple 10-bit counter

that counts 1024 TOSC cycles before releasing the

oscil lator clock t o th e rest of the syste m. The t ime-ou t

period is designated as TOST. The TOST time is involve d

every time the oscillator has to restart (i.e., on POR,

BOR and wak e-u p fro m Sleep ). Th e O scil lato r Start-u p

Timer is applied to the LP, XT, XTL and HS Oscillator

modes (upon wake-up from Sleep, POR and BOR) for

the primary oscillator.

20.2.3 LP OSCILLATOR CONTROL

Enabling the LP oscillator is controlled with two

elements:

1. The current oscillator group bits COSC<2:0>

2. The LPOSCEN bit (OSCCON regist er)

The LP oscillator is ON (even during Sleep mode) if

LPOSCEN = 1. The LP oscillator is the device clock if:

•

COSC<2:0> =

000

(LP sele cte d a s m a in o scillato r)

and

• LPOSCEN = 1

Keeping the LP oscillator ON at all times allows for a

fast swit ch to the 3 2 kHz syst em cl oc k f or lowe r powe r

operation. Returning to the faster main oscillator will

still require a start-up time.

20.2.4 PHASE LOCKED LOOP (PLL)

The PLL multi plies the clo ck whic h is gen era ted by the

primary oscillator. The PLL is selectable to have either

gains of x4, x8 and x16. Input and output frequency

ranges are summarized in Table 20-3.

TABLE 20-3: PLL FREQUENCY RANGE

The PLL fe atures a loc k output, which i s asserted when

the PLL enters a phase locked state. Should the loop

fall out of lock (e.g ., due to nois e), the lock signal will b e

rescinded. The state of this signal is reflected in the

read-only LOCK bit in the OSCCON r egister.

20.2.5 FAST RC OSCILLATOR (FRC)

The FRC oscillator is a fast (7.37 MHz ±2% nominal)

internal RC o sc il lato r. This os cil la tor i s in ten ded to pro-

vide reasonable device operating speeds without the

use of an external cryst al, ceramic resonator or RC net-

work. The FRC oscillator can be used with the PLL to

obtain higher clock frequencies.

The dsPIC3 0F o pera tes fro m th e FRC o scil lat or w he n-

ever the current oscillator selection control bits in the

OSCCON register (OSCCON<14:12>) are set to ‘001’.

The six bit field specified by TUN<3:0>

(OSCTUN<3:0>) allows the user to tune the internal

fast RC oscillator (nominal 7.37 MHz). The user can

tune the FRC oscillator within a range of ±6% in steps

of 0.75% around the factory-calibrated setting (see

Table 20-4).

If OSCCON<1 4:12> are set to ‘111’ and F PR<4:0> a re

set to ‘00101’, ‘00110’ or ‘00111’, then a PLL

multiplier of 4, 8 or 16 (respectively) is applied.

TABLE 20-4: FRC TUNING

Fin PLL

Multiplier Fout

4 MHz-10 MHz x4 16 MHz-40 MHz

4 MHz-10 MHz x8 32 MHz-80 MHz

4 MHz-7.5 MHz x16 64 MHz-120 MHz

Note: When a 16x PLL is used, the FRC oscilla-

tor must not be tuned to a frequency

greater than 7.5 MHz.

TUN<3:0>

Bits FRC Frequency

0111 +5.25%

0110 +4.50%

0101 +3.75%

0100 +3.00%

0011 +2.25%

0010 +1.50%

0001 +0.75%

0000 Center Frequency (oscillator is

running at calibrated frequency)

1111 -0.75%

1110 -1.50%

1101 -2.25%

1100 -3.00%

1011 -3.75%

1010 -4.50%

1001 -5.25%

1000 -6.00%

dsPIC30F6011A/6012A/6013A/6014A

20.2.6 LOW-POWER RC OSCILLATOR

(LPRC)

The LPRC oscillator is a component of the Watchdog

Timer (WDT) and oscillates at a nominal frequency of

512 kHz. The LPRC oscillator is the clock source for

the Power-up Timer (PWRT) circuit, WDT and clock

monitor circuits. It may also be used to provide a low

frequency clock source option for applications where

power consumption is critical, and timing accuracy is

not required.

The LPRC oscillator is always enabled at a Power-on

Reset, because it is the clock source for the PWRT.

After the PWRT expires, the LPRC oscillator will remain

ON if one of the following is TRUE:

• The Fail-Safe Clock Monitor is enabled

• The WDT is enabled

• The LPRC oscillator is selected as the system

clock via the COSC<2:0> control bits in the

OSCCO N regi st er

If one of the abo ve co nditio ns is not tru e, th e LPRC wil l

shut-off after the PWRT expires.

20.2.7 FAIL-SAFE CLOCK MONITOR

The Fail-Saf e Cl oc k Mo nit or (F SCM) al low s the dev ic e

to conti nue to operate even i n the e vent o f an os cilla tor

failure. The FSCM func ti on i s e nab le d by ap pro priately

programming the FCKSM Configuration bits (Clock

Switch and Monitor Selection bits) in the FOSC device

Configuration register. If the FSCM function is

enabled, the LPRC internal oscillator will run at all

times (except during Sleep mode) and will not be

subject to control by the SWDTEN bit.

In the event of an oscillator failure, the FSCM will

generate a clock failure trap event and will switch the sys-

tem clock over to the FRC oscillator. The user will then

have th e option to eith er attemp t to re start the osc illat or

or execute a controlled shutdown. The user may decide

to treat the trap as a warm Reset by simply loading the

Reset address into the oscillator fail trap vector. In this

event, the CF (Clock Fail) status bit (OSCCON<3>) is

also se t w h en ev e r a c loc k fa il ur e i s recogn iz ed .

In the event of a clock failure, the WDT is unaffected

and continues to run on the LPRC clock.

If the oscillator has a very slow start-up time coming

out of POR, BOR or Sleep, it is possible that the

PWRT timer will expire before the oscillator has

started. In such cases, the FSCM will be activated and

the FSCM will initiate a clock failure trap, and the

COSC<2:0> bits are loaded with FRC oscillator selec-

tion. This will effectively shut-off the original oscillator

that was trying to start.

The user may detect this situation and restart the

oscillator in the clock fail trap ISR.

Upon a clock failure detection, the FSCM module will

initiate a clock switch to the FRC oscillator as follows:

1. The COSC bits (OSCCON<14:12>) are loaded

with the FRC oscillator selection value.

2. CF bit is set (OSCCON<3>).

3. OSWEN control bit (OSCCON<0>) is cleared.

For the purpose of clock switching, the clock sources

are sectioned into four groups:

1. Primary

2. Secondary

3. Internal FRC

4. Internal LPRC

The user can switch between these functional groups,

but canno t switch between options within a group. If the

primary group is selected, then the choice within the

group is always determined by the FPR<4:0>

Configuration bits.

The OSC CON register ho lds the control and status bits

related to clock switching.

• COSC<2:0>: Read-only status bits always reflect

the current oscillator group in effect.

• NOSC<2:0>: Control bits which are written to

indicate the new oscillator group of choice.

- On POR and BOR, COSC<2:0> and

NOSC<2:0> are both loaded with the

Configuration bit values FOS<2:0>.

• LOCK: The LOCK status bit indicates a PLL lock.

• CF: Read-only status bit indicating if a clock fail

detect has occurred.

• OSWEN: Control b it ch an ge s fro m a ‘0’ to a ‘1’

when a cl oc k transi t io n se qu ence i s init ia ted .

Clearing the OSWEN control bit will abort a clock

tran si ti on in p rogress (u se d for hang -up s i tua tions) .

If Configuration bits FCKSM<1:0> = 1x, then the clock

switching and Fail-Safe Clock Monitor functions are

disabled. This is the default Configuration bit setting.

If clock switching is disabled, then the FOS<2:0> and

FPR<4:0> bits directly control the oscillator selection

and the COSC<2:0> bits do not control the clock

selection. However, these bits will reflect the clock

source selection.

Note 1: OSC2 pin function is determined by the

Primary Oscillator mode selection

(FPR<4:0>).

2: Note that O SC1 pin c annot be u sed as a n

I/O pi n, ev en i f the s ec ond ary oscill ato r o r

an internal clock source is selected at all

times.

Note: The application should not attempt to

switch to a clock of frequency lower than

100 kHz when the Fail-Safe Clock Monitor

is enable d. If c loc k s w itc hin g is perfo rme d,

the device may generate an oscillator fail

trap and switch to the fast RC oscillator.

dsPIC30F6011A/6012A/6013A/6014A

20.2.8 PROTECTION AGAINST

ACCIDENTAL WRITES TO OSCCON

A write to the OSCCON register is intentionally made

difficult because it controls clock switching and clock

scaling.

To write to the OSCCON low byte, the following code

sequence must be executed without any other

instruc tions in betwe en:

Byte wri te is allow ed for one i nstruction c ycle. Write the

desired value or use bit manipulation instruction.

To write to the OSCCON high byte, the following

instructions must be executed without any other

instruc tions in betwe en:

Byte wri te is allow ed for one i nstruction c ycle. Write the

desired value or use bit manipulation instruction.

20.3 Oscillator Control Registers

The oscillators are controlled with two SFRs,

OSCCON and OSCTUN and one Configuration

Byte Write “0x46” to OSCCON low

Byte Write “0x57” to OSCCON low

Byte Write “0x78” to OSCCON high

Byte Write “0x9A” to OSCCON high

Note: The description of the OSCCON and

OSCTUN SFRs, as well as the FOSC

Configuration register provided in this

section are applicable only to the

dsPIC30F6011A/6012A/6013A/6014A

devices in the dsPIC30F product family.

Upper Byte:

U-0 R-y R-y R-y U-0 R/W-y R/W-y R/W-y

— COSC<2:0> —NOSC<2:0>

bit 15 bit 8

Lower Byte:

R/W-0 R/W-0 R-0 U-0 R/W-0 U-0 R/W-0 R/W-0

POST<1:0> LOCK —CF— LPOSCEN OSWEN

bit 7 bit 0

bit 15 Unimplemented: Read as ‘0’

bit 14-12 COSC<2:0>: Current Oscillator Group Selection (Read Only)

111 = PLL Oscillator; PLL source selected by FPR<4:0> bits

011 = External Oscillator; OSC1/OSC2 pins; External Oscillator configuration selected by FPR<4:0> bits

010 = LPRC internal low-power RC

001 = FRC internal fast RC

000 = LP crystal oscillator; SOSCI/SOSCO pins

Set to FOS<2:0> values on POR or BOR.

Loaded with NOSC<2:0> at the completion of a successful clock switch.

Set to FRC value when FSCM detects a failure and switches clock to FRC.

bit 11 Unimplemented: Read as ‘0’

dsPIC30F6011A/6012A/6013A/6014A

bit 10-8 NOSC<2:0>: New Oscillator Group Selection

111 = PLL Oscillator; PLL source selected by FPR<4:0> bits

011 = External Oscillator; OSC1/OSC2 pins; External Oscillator configuration selected by FPR<4:0> bits

010 = LPRC internal low-power RC

001 = FRC internal fast RC

000 = LP crystal oscillator; SOSCI/SOSCO pins

Set to FOS<2:0> values on POR or BOR.

bit 7-6 POST<1:0>: Oscillator Postscale r Selectio n bits

11 = Oscillator postscaler divides clock by 64

10 = Oscillator postscaler divides clock by 16

01 = Oscillator postscaler divides clock by 4

00 = Oscillator postscaler does not alter clock

bit 5 LOCK: PLL Lock status bit (Read Only)

1 = Indicates that PLL is in lock

0 = Indicates that PLL is out of lock (or disabled)

bit 4 Unimplemented: Read as ‘0’

bit 3 CF: Clock Fail Detect (Read/Clearable by application)

1 = FSCM has detec ted clock failur e

0 = FSCM has NOT detected clock failure

bit 2 Unimplemented: Read as ‘0’

bit 1 LPOSCEN: 32 KHz Secondary (LP) Oscillator Enable

1 = Secondary Oscillator is enabled

0 = Secondary Oscillator is disabled

bit 0 OSWEN: Oscillator Switch Enable bit

1 = Request Oscillator switch to selection specified by NOSCG<2:0> bits

0 = Oscillator switch is complete

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

y = Value set from Configuration bits on POR

dsPIC30F6011A/6012A/6013A/6014A

Upper Byte:

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

— — — — — — — —

bit 15 bit 8

Lower Byte:

U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0

— — — —TUN<3:0>

bit 7 bit 0

bit 15-4 Unimplemented: Read as ‘0’

bit 3-0 TUN<3:0>: Lower two bits of TUN field. The four bit field specified by TUN<3:0> specifies the user tuning

capability for the internal fast RC oscillator (nominal 7.37 MHz).

0111 = Maximum Frequency

0110 =

0101 =

0100 =

0011 =

0010 =

0001 =

0000 = Center Frequency, Oscillator is running at calibrated frequency

1111 =

1110 =

1101 =

1100 =

1011 =

1010 =

1001 =

1000 = Minimum Frequency

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

y = Value set from Configuration bits on POR

dsPIC30F6011A/6012A/6013A/6014A

Upper Byte:

UUUUUUUU

— — — — — — — —

bit 23 bit 16

Middle Byte:

R/P R/P U U U R/P R/P R/P

FCKSM<1:0> — — —FOS<2:0>

bit 15 bit 8

Lower Byte:

U U U R/P R/P R/P R/P R/P

— — —FPR<4:0>

bit 7 bit 0

bit 23-16 Unimplemented: Read as ‘0’

bit 15-14 FCKSM<1:0>: Clock Switching and Monitor Selection Configuration bits

1x = Clock switching is disabled, fail safe clock monitor is disabled

01 = Clock switching is enabled, fail safe clock monitor is disabled

00 = Clock switching is ena bled, fail s afe clock monitor is enabled

bit 13-10 Unimplemented: Read as ‘0’

bit 9-8 FOS<2:0>: Oscillator Group Selection on POR

111 = PLL Oscillator; PLL source selected by FPR<4:0> bits. See Table 20-2.

011 = EXT: External Oscillator; OSC1/OSC2 pins; External Oscillator configuration selected by

FPR<4:0> bits

010 = LPRC: Internal Low-power RC

001 = FRC: Internal Fast RC

000 = LPOSC: Low-power Crystal Oscillator; SOSCI/SOSCO pins

bit 7-4 Unimplemented: Read as ‘0’

bit 3-0 FPR<4:0>: Oscillator Selection within Primary Group, see Table 20-2.

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

dsPIC30F6011A/6012A/6013A/6014A

20.4 Reset

The dsPIC30F differentiates between various kinds of

Reset:

a) Power-on Reset (POR)

b) MCLR Reset during normal operation

c) MCLR Reset during Sleep

d) Watchdog Timer (WDT) Reset (during normal

operation)

e) Programmable Brown-out Reset (BOR)

f) RESET Inst ruction

g) Reset caused by trap lockup (TRAPR)

h) Reset caused by illegal opcode, or by using an

uninitialized W register as an Address Pointer

(IOPUWR)

Different registers are affected in different ways by

various Reset conditions. Most registers are not

af fected b y a WDT wake -up, si nce this is viewed as the

resumption of normal operation. Status bits from the

RCON reg ister are s et o r cleared differently in d ifferent

Reset s itu atio ns , a s in dic ate d in Table 20-5. These bits

are used in software to determine the nature of the

Reset.

A block di agram of the on-ch ip Reset circuit is shown in

Figure 20-2.

A MCLR noise filter is provided in the MCLR Reset

path. The filter detects and ignores small pulses.

Internall y generated Res ets do not drive M CLR pin low .

FIGURE 20-2: RESET SYSTEM BLOCK DIAGRAM

MCLR

VDD

VDD Rise

Detect POR

SYSRST

Sleep or Idle

Brown-out

Reset BOREN

RESET

Instruction

WDT

Module

Digital

Glitch Filter

BOR

Trap Conflict

Illegal Opcode/

Uninitialized W Register

dsPIC30F6011A/6012A/6013A/6014A

20.4.1 POR: POWER-O N RESE T

A power-on event will generate an internal POR pulse

when a VDD rise is detected. The Reset pulse w ill occur

at the POR circuit threshold voltage (VPOR), which is

nominally 1.85V. The device supply voltage character-

istics mus t meet spec ified sta rting v olt ag e and rise ra te

requirements. The POR pulse will reset a POR timer

and place the device in the Reset state. The POR also

selects the device clock source identified by the

oscillator configuration fuses.

The POR circuit inserts a small delay, TPOR, which is

nominally 10 μs and ensures that the device bias

circuit s are stable. Furthermore, a user selected po wer-

up time-out (TPWRT) is applied. The TPWRT par am e te r

is based on device Configuration bits and can be 0 ms

(no delay), 4 ms, 16 ms or 64 ms. The total delay is at

device power-up TPOR + TPWRT. When these delays

have expired, SYSRST will be negated on the next

leading edge of the Q1 clock, and the PC will jump to

the Reset vector.

The timing for the SYSRST signal is shown in

Figure 20-3 through Figure 20-5.

FIGURE 20-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD)

FIGURE 20-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 1

TPWRT

TOST

VDD

Internal POR

PWRT Time-out

OST Time-out

Internal Reset

MCLR

TPWRT

TOST

VDD

Internal POR

PWRT T ime-out

OST Time-out

Internal Reset

MCLR

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 20-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO VDD): CASE 2

20.4.1.1 POR with Long Crystal Start-up Time

(with FSCM Enabled)

The oscillat or start-up cir cui try is not lin ked t o the POR

circuitry . Some crystal circuits (especially low frequency

crystals) will have a relatively long start-up time. There-

fore, one or more of the following conditions is possible

after the POR timer and the PWRT have expired:

• The oscillator circuit has not begun to oscillate.

• The Oscillator Start-up Timer has NOT expired (if

a crystal oscillator is used).

• The PLL has not achiev ed a LOCK (if PLL is

used).

If th e FSCM is enabled and one of th e above c onditions

is true, then a clock failure trap will occur. The device

will automatically switch to the FRC oscillator and the

user can switch to the desired crystal oscillator in the

trap ISR.

20.4.1.2 Operating without FSCM and PWRT

If the FSCM is disabled and the Power-up Timer

(PWRT) is also disabled, then the device will exit rapidly

from Reset on power-up. If the clock source is FRC,

LPRC, EXTRC or EC, it will be active immediately.

If the FSCM is disabled and the system clock has not

start ed, the de vice w ill be in a frozen st ate at th e Res et

vector until the system clock starts. From the user’s

perspective, the device will appear to be in Reset until

a system clock is available.

20.4.2 BOR: PROGRAMMABLE

BROWN-OUT RESET

The BOR (Brown-out Reset) module is based on an

internal voltage reference circuit. The main purpose of

the BOR mod ule is to generate a device Reset whe n a

brown-out condition occurs. Brown-out conditions are

generally caused by glitches on the AC mains (i.e.,

missing portions of the AC cycle waveform due to bad

power transm issi on lin es or volt age sags due to ex ces-

sive cu rren t draw wh en a larg e inductiv e l oad is t urne d

on).

The BOR module allows selection of one of the

following voltage trip points:

•2.0V

•2.7V

•4.2V

•4.5V

A BOR will generate a Reset pulse whi ch will rese t the

device. The BOR will select the clock source, based on

the device Configuration bit values (FOS<2:0> and

FPR<4:0>). Furthermore, if an oscillator mode is

selected, the BOR will activate the Oscillator Start-up

Timer (OST). The system clock is held until OST

expires. If the PLL is used, then the clock will be held

until the LOCK bit (OSCCON<5>) is ‘1’.

VDD

MCLR

Internal POR

PWRT Time-out

OST Time-out

Internal Reset

TPWRT

TOST

Note: The BOR volta ge trip point s indica ted here

are nominal values provided for design

guidance only.

dsPIC30F6011A/6012A/6013A/6014A

Concurrently, the POR time-out (TPOR) and the PWRT

time-out (TPWRT) will be applied before the internal

Reset is released. If TPWRT = 0 and a crystal oscillator

is being use d, the n a nom inal dela y of T FSCM = 100 μs

is applied. The total delay in this case is

(TPOR +TFSCM).

The BOR status bit (RCON<1>) will be set to indicate

that a BOR has occurred. The BOR circuit, if enabled,

will continue to operate while in Sleep or Idle modes

and wi ll reset th e device sh ould VDD fall below t he BOR

threshold voltage.

FIGURE 20-6: EXTERNAL POWER-ON

RESET CIRCUIT (FOR

SLOW VDD POWER-UP)

Note: Dedicated supervisory devices, such as

the MCP1XX and MCP8XX, may also be

used as an external Power-on Reset

circuit.

Note 1: External Power-on Reset circuit is

requ ir ed on ly if the VDD power-up slope

is too s low . Th e dio de D help s dis charge

the c apacitor quickly when VDD powers

down.

2: R should be suitably chosen so as to

make sure that the voltage drop across

R does not vio late the devi ce’s electrical

specification.

3: R1 should be suitably chosen so as to

limit any curren t flo wing into MCL R from

external capacitor C, in the event of

MCLR/VPP pin breakdown due to Elec-

trostatic Discharge (ESD) or Electrical

Overstress (EOS).

VDD

dsPIC30F

MCLR

dsPIC30F6011A/6012A/6013A/6014A

Table 20-5 shows the Reset conditions for the RCON

are R/W , the information in the table implies that all the

bits are negated prior to the action specified in the

conditi on column.

TABLE 20-5: INITIALIZATION CONDITION FOR RCON REGISTER CASE 1

Table 20-6 shows a second example of the bit

conditions for the RCON register. In this case, it is not

assu med th e use r has s et/ cle ared s peci fic bits pr ior to

action specified in the condition column.

TABLE 20-6: INITIALIZATION CONDITION FOR RCON REGISTER CASE 2

Condition Program

Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR

Power-on Reset 0x000000 000000011

Brown-out Reset 0x000000 000000001

MCLR Reset during normal

operation 0x000000 001000000

Software Reset during

normal ope rati on 0x000000 000100000

MCLR Reset during Sleep 0x000000 001000100

MCLR Reset during Idle 0x000000 001001000

WDT Time-out Reset 0x000000 000010000

WDT Wake-up PC + 2 000010100

Interrupt Wake-up from

Sleep PC + 2(1) 000000100

Clock Failure Trap 0x000004 000000000

Trap Reset 0x000000 100000000

Illegal Operation Trap 0x000000 010000000

Note 1: When the w ake-up is due to an ena bled i nterrupt , the PC is loade d wi th the c orresp onding interru pt vector.

Condition Program

Counter TRAPR IOPUWR EXTR SWR WDTO IDLE SLEEP POR BOR

Power-on Reset 0x000000 000000011

Brown-out Reset 0x000000 uuuuuuu01

MCLR Reset during normal

operation 0x000000 uu10000uu

Software Reset during

normal ope rati on 0x000000 uu01000uu

MCLR Reset during Sleep 0x000000 uu1u001uu

MCLR Reset during Idle 0x000000 uu1u010uu

WDT Time-out Reset 0x000000 uu00100uu

WDT Wake-up PC + 2 uuuu1u1uu

Interrupt Wake-up from

Sleep PC + 2(1) uuuuuu1uu

Clock Failure Trap 0x000004 uuuuuuuuu

Trap Reset 0 x000000 1uuuuuuuu

Illegal Operation Reset 0x000000 u1uuuuuuu

Legend: u = unchanged

Note 1: When the wake-up is due to an enable d interrupt, the PC is loa ded with the corres ponding interrup t vector .

dsPIC30F6011A/6012A/6013A/6014A

20.5 Watchdog Timer (WDT)

20.5.1 WATCHDOG TIMER OP ERATION

The primary function of the Watchdog Timer (WDT) is

to reset the processor in the event of a software

malfunction. The WDT is a free running timer, which

runs off an on-chip RC oscillator, requiring no external

component. Therefore, the WDT timer will continue to

operate even if the main processor clock (e.g., the

crystal oscillator) fails.

20.5.2 ENABLING AND DISABLING THE

WDT

The Watchdog Timer can be “Enabled” or “Disabled”

only through a Configuration bit (FWDTEN) in the

Configurati on register FWDT.

Setting FWDTEN = 1 enables the Watchdog Timer.

The enabling is done when programming the device.

By default, after chip-erase, FWDTEN bit = 1. Any

device programmer capable of programming

dsPIC30F devices allows programming of this and

other Configuration bits.

If enabled, the WDT will increment until it overflows or

“times out”. A WDT time-out will force a device Reset

(except during Sleep). To prevent a WDT time-out, the

user must clear the Watchdog Timer using a CLRWDT

instruction.

If a WDT times out during Sleep, the device will wake-

up. The WDT O bit in the RCO N register wil l be cleare d

to indicate a wake-up resulting from a WDT time-out.

Setting FWDTEN = 0 allows user software to enable/

disable the Watchdog Timer via the SWDTEN

(RCON<5>) control bit.

20.6 Low-Voltage Detect

The Low-Voltage Detect (LVD) module is used to

detect when the VDD of the device drops below a

threshold value, VLVD, which is determined by the

LVDL<3:0> bits (RCON<11:8>) and is thus user pro-

grammable. The internal voltage reference circuitry

requires a nominal amount of time to stabilize, and the

BGST bit (RCON<13>) indicates when the voltage ref-

erence has stabilized.

In some devices, the LVD threshold voltage may be

applied extern al ly on the LVDIN pin.

The LVD module is enabled by setting the LVDEN bit

(RCON<12>).

20.7 Power-Saving Modes

There are tw o powe r-savin g st ates th at can be en tered

through the exe cu tio n of a spe ci al ins truc ti on, PWRSAV.

These are: Sleep and Idle.

The format of the PWRSAV instruction is as follows:

PWRSAV <parameter>, where ‘parameter’ d efines

Idle or Sleep mode.

20.7.1 SLEEP MODE

In Sleep m ode, th e clo ck to the C PU and periphe rals i s

shutdown. If an on-chip oscillator is being used, it is

shutdown.

The Fail-Safe Clock Monitor is not functional during

Sleep, since there is no clock to monitor. However,

LPRC clock remains active if WDT is operational durin g

Sleep.

The Brown -out protect ion circui t, if enable d, will remai n

functional during Sleep.

The processor wakes up from Sleep if at least one of

the following conditions has occurred:

• any interrupt that is individually enabled and

meets the required priority level

• any Reset (POR, BOR and MCLR)

• WDT time-out

On waking up from Sleep mode, the processor will

restart the same clock that was active prior to entry

into Sleep mode. When clock switching is enabled,

bits COSC<2:0> will determine the oscillator source

that will be used on wake-up. If clock switch is

disabled, then there is onl y one sy ste m cl ock .

If the clock source is an oscillator, the clock to the

device is held off until OST times out (indicating a

stable oscillator). If PLL is used, the system clock is

held off until LOCK = 1 (indicating that the PLL is

stable).

Either way, T

POR

, T

LOCK

and T

PWRT

delays are

applied

If EC, FRC, LPRC o r EXTRC o scillato rs are used, then

a delay of TPOR (~ 10 μs) is applied. This is the smallest

delay possible on wake-up from Sleep.

Moreover, if LP oscillator was active during Sleep, and

LP is the oscillator used on wake-up, then the start-up

delay will be equal to TPOR. PWRT delay and OST

timer delay are not applied. In order to have the small-

est poss ible sta rt-up delay when waking up fro m Sleep,

one of these faste r wake-up optio ns shoul d be selecte d

before entering Sleep.

Note: If a POR or BOR occurred, the selection of

the oscillator is based on the FOS<2:0>

and FPR<4:0> Configuration bits.

dsPIC30F6011A/6012A/6013A/6014A

Any interrupt that is individually enabled (using the

corresponding IE bit) and meets the prevailing priority

level will be able to wake-up the processor. The proces-

sor will process the interrupt and branch to the ISR. The

Sleep status bit in RCON register is set upon wake-up

All Resets will wake-up the processor from Sleep

mode. Any Reset, other than POR, will set the Sleep

status bit. In a POR, the Sleep bit is cleared.

If Watchdog Timer is enabled, then the processor will

wake-up from Sleep mode upon WDT time-out. The

Sleep and WDTO status bits are both set.

20.7.2 IDLE MODE

In Idle mode, the clock to the CPU is shutdown while

periphera ls keep running. Unlike Sleep mode, the clock

sour ce rem ains act ive .

Several peripherals have a control bit in each module

that allows them to operate during Idle.

LPRC fail-safe clock remains active if clock failure

detect is enabled.

The processor wakes up from Idle if at least one of the

following conditions is true:

• on any interrupt that is individually enabled (IE bit

is ‘1’) and meets the required priority level

• on any Reset (POR, BOR, MCLR)

• on WDT time-out

Upon wake-up from Idle mode, the clock is re-applied

to the CPU and instruction execution begins immedi-

ately, starti ng w ith the in stru cti on fol lowi ng the PWRSAV

instruction.

Any interrupt that is individually enabled (using IE bit)

and meets the prevailing priority level will be able to

wake-up th e process or. The processor wil l p r oces s th e

interrupt and branch to the ISR. The Idle status bit in

RCON register is set upon wake-up.

Any Reset, other than POR, will set the Idle status bit.

On a POR, the Idle bit is cleared.

If Watchdog Timer is enabled, then the processor will

wake-up from Idle mode upon WDT time-out. The Idle

and WDTO status bits are both set.

Unlike wake-up from Sleep, there are no time delays

involv ed in wa ke -up from Idle.

20.8 Device Configuration Registers

The Configuration bits in each device Configuration

programmed by a device programmer, or by using the

In-Circuit Serial Programming (ICSP) feature of the

device. Each device Configuration register is a 24-bit

used to hold configuration data. There are four device

Configuration registers avai lable to the use r:

1. FOSC (0xF80000): Oscillator Configuration

2. FWDT (0xF80002): Watchdog Timer

Configuration register

3. FBORPOR (0xF80004): BOR and POR

Configuration register

4. FGS (0xF8000A): General Code Segment

Configuration register

The pl aceme nt of the Co nfigur ati on bits is au tomati call y

handle d when yo u select the dev ice in your device p ro-

grammer . The desired state of the Configuration bits may

be specified in the source code (dependent on the lan-

guage tool used), or through the programming interf ace.

After the device has been programmed, the application

software may read the Configuration bit values through

the table read instructions. For additional information,

please refer to the programming specifications of the

device.

Note:

In spite of various delays applied (T

POR

LOCK

and T

PWRT

), the crystal oscillator

(and PLL) may not be active at the end of

the time-out (e.g., for low-frequency crys-

tals). In such cases, if FSCM is enabled,

then the device will detect this as a clock

failure and process the clock failure trap,

the FRC oscillator will be enabled, and the

user will have to re-enable the crystal oscil-

lator. If FSCM is not enabled, then the

device will simply suspend execution of

code until the clock is stable, and will

remain in Sleep until the oscillator clock has

started.

Note: If the code protection Configuration Fuse

bits (FGS<GCP> and FGS<GWRP>)

have been programmed, an erase of the

entire code-protected device is only

possib le at vol tag es VDD ≥ 4.5V.

dsPIC30F6011A/6012A/6013A/6014A

20.9 Peripheral Module Disable (PMD)

Registers

The Peripheral Module Disable (PMD) registers pro-

vide a method to disable a peripheral module by stop-

ping all clock so urc es supplied to that modu le. When a

peripheral is disabled via the appropriate PMD control

bit, the peripheral is in a minimum power consumption

state. The control and status registers associated with

the peripheral will also be disabled so writes to those

registers will have no effect and read values will be

invalid.

A peripheral module will only be enabled if both the

associated bit in the PMD register is cleared and the

peripher al is supported by the specific ds PIC DSC va ri-

ant. If the peripheral is present in the device, it is

enabled in the PMD register by default.

20.10 In-Circui t Debugger

When MPLAB® ICD 2 is selected as a debugger, the

in-circuit debugging functionality is enabled. This func-

tion all ows simp le de buggin g func tions whe n used w ith

MPLAB IDE. When the device has this feature enabled,

some of the resources are not available for general

use. These resources include the first 80 bytes of data

RAM and two I/O pins.

One of fo ur pairs of deb ug I/O p ins m ay b e se lec ted b y

the user using configuration options in MPLAB IDE.

These pin pairs are named EMUD/EMUC,

EMUD1/EMUC1, EMUD2/EMUC2 and MUD3/EMUC3.

In each c as e, th e se lec te d EMU D p in i s th e Em ula tio n/

Debug Data line, and the EMUC pin is the Emulation/

Debug Clock line. These pins will interface to the

MPLAB ICD 2 module available from Microchip. The

selected pair of debug I/O pins is used by MPLAB ICD 2

to send commands and receive responses, as well as

to send a nd receive dat a. To use the in-circuit debugger

function of the device, the design must implement ICSP

connections to MCLR, VDD, VSS, PGC, PGD and the

selected EMUDx/EMUCx pin pair.

This gives rise to two possibilities:

1. If EMUD/EMUC is selected as the debug I/O pi n

pair, then only a 5-pin interface is required, as

the EMUD and EMUC pin functions are multi-

plexed with the PGD and PGC pin functions in

all dsPIC30F devices.

2. If EMUD1/EMUC1, EMUD2/EMUC2 or EMUD3/

EMUC3 is selected as the debug I/O pin pair,

then a 7-pin interface is required, as the

EMUDx/EMUCx pin functions (x = 1, 2 or 3) are

not multiplexed with the PGD and PGC pin

functions.

Note: If a PMD bit is set, the corresponding mo d-

ule is d isabled after a delay of 1 instruc tion

cycle. Sim ilarly, if a PM D bit i s clea red, th e

corresponding module is enabled after a

delay of 1 instruction cycle (assuming the

module control registers are already

configured to enable module operation).

dsPIC30F6011A/6012A/6013A/6014A

TABLE 20-7: SYSTEM INTEGRATION REGISTER MAP FOR dsPIC30F601XA

TABLE 20-8: DEVICE CONFIGURATION REGISTER MAP

SFR

Name Addr

.Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Reset State

RCON 0740 TRAPR IOPUWR BG ST LVDEN LVDL<3:0> EXTR SWR SWDTEN WDTO SLEE P IDLE BOR POR Depends on type of Rese t.

OSCCON 0742 —COSC<2:0>— NOSC<2:0> POST<1:0> LOCK —CF— LPOSCEN OSWEN Depends on Configuration bits.

OSCTUN 0744 — — — — — — — — — — — — TUN<3:0> 0000 0000 0000 0000

PMD1 0770 T5MD T4MD T3MD T2MD T1MD — — DCIMD I2CMD U2MD U1MD SPI2MD SPI1MD C2MD C1MD ADCMD 0000 0000 0000 0000

PMD2 0772 IC8MD IC7MD IC6MD IC5MD IC4MD IC3MD IC2MD IC1MD OC8MD OC7MD OC6MD OC5MD OC4MD OC3MD OC2MD OC1MD 0000 0000 0000 0000

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

File Name Addr. Bits 23-16 Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

FOSC F80000 —FCKSM<1:0>— — —FOS<2:0> — — —FPR<4:0>

FWDT F80002 —FWDTEN— — — — — — — — — FWPSA<1:0> FWPSB<3:0>

FBORPOR F80004 — MCLREN — — — — PWMPIN HPOL LPOL BOREN — BORV<1:0> ——FPWRT<1:0>

FGS F8000A — — — — — — — — — — — — — —GSS<1:0>GWRP

Note: Refer to dsPIC30F Family Reference Manual (DS70046) for descriptions of register bit fields.

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

21.0 INSTRUCTION SET SUMMARY

The dsPIC30F instruction set adds many

enhancements to the previous PICmicro MCU instruc-

tion sets, while maintaining an easy migration from

PICmicro MCU instruction sets.

Most instructions are a single program memory word

(24 bits). Only three instructions require two program

memory locations.

Each single-word instruction is a 24-bit word divided

into an 8-bit opcode which specifies the instruction

type, and one or more operands which further specify

the operati on of the instruction.

The instruction set is highly orthogonal and is grouped

into five bas ic ca tego ries:

• Word or byte-oriented operations

• Bit-oriented operations

• Literal operations

• DSP operations

• Control operations

Table 21-1 shows the general symbols used in

des c ribing the instructio ns.

The dsPIC30F instruction set summary in Table 21-2

lists all the instructions, along with the status flags

affected by each instr uction.

Most word or byte-oriented W register instructions

(including barrel shift instructions) have three

operands:

• The first source operand which is typically a

• The second source operand which is typically a

• The destination of the result which is typically a

However , word or byte-ori ented file register instructions

have two operands:

• The file register specified by the value ‘f’

• The destination, which could either be the file

‘WREG’

Most bit-oriented instructions (including simple rotate/

shift instructions) have two operands:

• The W register (with or without an address

modifier) or file register (specified by the value of

‘Ws’ or ‘f’)

• The bit in the W register or file register

(specified by a literal value or indirectly by the

contents of register ‘Wb’)

The litera l instruct ions that invo lve data m ovement ma y

use some of the following operands:

• A lite ral value to be lo aded i nto a W regi ster or file

• The W register or file register where the literal

value is to be loaded (specified by ‘Wb’ or ‘f’)

However, literal instructions that involve arithmetic or

logical operations use some of the following operands:

• The first source operand which is a register ‘Wb’

without any address modifier

• The second source operand which is a literal

value

• The destination of th e resu lt (o nly if not the same

as the first source operand) which is typically a

The MAC class of DSP instructions may use some of the

following operands:

• The accumulator (A or B) to be used (required

operand)

• The W re gisters to be used as the two opera nds

• The X and Y address space prefetch operations

• The X and Y address space prefetch destinations

• The accum ula tor wr ite bac k destination

The other DSP instructions do not involve any

multipl ic ati on, and may inclu de:

• The accumulator to be used (requir ed)

• The source o r destin ation ope rand (des ignated as

Wso or Wdo, respectively) with or without an

address modifier

• The amou nt of s hift sp ecifi ed by a W regis ter ‘Wn ’

or a literal value

The control instructions may use some of the following

operands:

• A program memory address

• The mode of the table read and table write

instructions

Note: This data sheet summarizes features of this group

of dsPIC30F devices and is not intended to be a complete

reference source. For more information on the CPU,

peripherals, register descriptions and general device

functionality, refer to the dsPIC30F Family Reference

Manual (DS70046). For more information on the device

instruction set and programming, refer to the dsPIC30F

Programmer’s Reference Manual (DS70030).

dsPIC30F6011A/6012A/6013A/6014A

All instructions are a single word, except for certain

double word instructions, which were made double

word instructions so that all the required information is

available in these 48 bits. In the second word, the

8MSbs are ‘0’s. I f t hi s s e co nd w o rd i s e x ec ut e d a s an

instruction (by itself), it will execute as a NOP.

Most single-word instructions are executed in a single

instruc tion cyc le , u nle ss a conditio nal test is tru e o r th e

Program Counter is changed as a r esult of the in struc -

tion. In these cases, the executio n takes tw o instructio n

cycles with the additional instruction cycle(s) executed

as a NOP. Notable exceptions are the BRA (uncondi-

tional/c ompu ted bra nch), i ndirec t CALL/GOTO, al l t abl e

reads and writes, and RETURN/RETFIE instructions,

which a re single -word in struction s but t ake two or thre e

cycles. Certain instructions that involve skipping over

the subsequent instruction require either two or three

cycles if the skip is performed, depending on whether

the instruction being skipped is a single-word or two-

word in struction. Mo reover , doubl e word moves re quire

two cycles. The double word instructions execute in

two instruction cycles.

Note: For more details on the instruction set,

refer to the Programmer’s Reference

Manual.

TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS

Field Description

#text Means literal defined by “text”

(text) Means “content of text”

[text] Means “the location addressed by text”

{ } Optional field or operation

<n:m> Register bit field

.b Byte mode selection

.d Double Word mode selection

.S Shadow register select

.w Word mode selection (default)

Acc O ne of two accumu lators {A, B}

A WB Accumulator write back destination address register ∈ {W13, [W13] + = 2}

bit4 4-bit bit selection field (used in word addressed instructions) ∈ {0...15}

C, DC, N, OV, Z MCU status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero

Expr Absolute address, label or expression (resolved by the linker)

f File register address ∈ {0x0000...0x1FFF}

lit1 1-bit unsigned literal ∈ {0,1}

lit4 4-bit unsigned literal ∈ {0...15}

lit5 5-bit unsigned literal ∈ {0...31}

lit8 8-bit unsigned literal ∈ {0...255}

lit10 10-bit unsigned literal ∈ {0...255} for Byte mode, {0:1023} for Word mode

lit14 14-bit unsigned literal ∈ {0...16384}

lit16 16-bit unsigned literal ∈ {0...65535}

lit23 23-bit unsigned literal ∈ {0...8388608}; LSB must be 0

None Field does not require an entry, may be blank

OA, OB, SA , SB DSP status bits: Ac cA Overf l o w, AccB Overflow, AccA Saturate, AccB Satu rate

PC Program Counter

Slit10 10-bit signed literal ∈ {-512...511}

Slit16 16-bit signed literal ∈ {-32768...32767}

Slit6 6 -bit signed literal ∈ {-16...16}

dsPIC30F6011A/6012A/6013A/6014A

Wb Base W register ∈ {W0..W15}

Wd Destination W register ∈ { Wd, [Wd], [Wd++], [Wd-- ], [++Wd], [--Wd] }

Wdo Destination W register ∈

{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }

Wm,Wn Dividend, Divisor working register pair (direct addressing)

Wm*Wm Multiplicand and Multiplier working register pair for Square instructions ∈

{W4 * W4,W5 * W5,W6 * W6,W7 * W7}

Wm*Wn Multiplicand and Multiplier working register pair for DSP instructions ∈

{W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7}

Wn One of 16 working registers ∈ {W0..W15}

Wnd One of 16 destination working registers ∈ {W0..W15}

Wns One of 16 source working registers ∈ {W0..W15}

WREG W0 (working register used in file register instructions)

Ws Source W register ∈ { Ws, [W s ] , [Ws++ ], [Ws--] , [+ + Ws], [- -Ws ] }

Wso Source W register ∈

{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }

Wx X data space prefetch address register for DSP instructions

∈ {[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2,

[W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2,

[W9 + W12],none}

Wxd X data space prefetch destination register for DSP instructions ∈ {W4..W7}

Wy Y data space prefetch address register for DSP instructions

∈ {[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2,

[W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2,

[W11 + W12], none}

Wyd Y data space prefetch destination register for DSP instructions ∈ {W4..W7}

TABLE 21-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)

Field Description

dsPIC30F6011A/6012A/6013A/6014A

TABLE 21-2: INSTRUCTION SET OVERVIEW

Base

Instr #

Assembly

Mnemonic Assembly Syntax Description # of

Words # of

Cycles Status Flags

Affected

1 ADD ADD Acc Add Accumulators 1 1 OA,OB,SA,SB

ADD f f = f + WREG 1 1 C,DC,N,OV,Z

ADD f,WREG WREG = f + WREG 1 1 C,DC,N,OV,Z

ADD #lit10,Wn Wd = lit10 + Wd 1 1 C,DC,N,OV,Z

ADD Wb,Ws,Wd Wd = Wb + Ws 1 1 C,DC,N,OV,Z

ADD Wb,#lit5,Wd Wd = Wb + lit5 1 1 C,DC,N,OV,Z

ADD Wso,#Slit4,Acc 16-bit Signed Add to Accumulat or 1 1 OA,OB,SA,SB

2 ADDC ADDC f f = f + WREG + (C) 1 1 C,DC,N,OV,Z

ADDC f,WREG WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z

ADDC #lit10,Wn Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z

ADDC Wb,Ws,Wd Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z

ADDC Wb,#lit5,Wd Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z

3 AND AND f f = f .AND. WREG 1 1 N,Z

AND f,WREG WREG = f .AND. WREG 1 1 N,Z

AND #lit10,Wn Wd = lit10 .AND. Wd 1 1 N,Z

AND Wb,Ws,Wd Wd = Wb .AND. Ws 1 1 N,Z

AND Wb,#lit5,Wd Wd = Wb .AND. lit5 1 1 N,Z

4 ASR ASR f f = Arithmetic Right Shift f 1 1 C,N,OV,Z

ASR f,WREG WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z

ASR Ws,Wd Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z

ASR Wb,Wns,Wnd Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z

ASR Wb,#lit5,Wnd Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z

5 BCLR BCLR f,#bit4 Bit Clear f 1 1 None

BCLR Ws,#bit4 Bit Clear Ws 1 1 None

6 BRA BRA C,Expr Branch if Carry 1 1 (2) None

BRA GE,Expr Branch if greater than or equal 1 1 (2) None

BRA GEU,Expr Branch if unsigned greater than or equal 1 1 (2) None

BRA GT,Expr Branch if greater than 1 1 (2) None

BRA GTU,Expr Branch if unsigned greater than 1 1 (2) None

BRA LE,Expr Branch if less than or equal 1 1 (2) None

BRA LEU,Expr Branch if unsigned less than or equal 1 1 (2 ) None

BRA LT,Expr Branch if less than 1 1 (2) None

BRA LTU,Expr Branch if unsigned less than 1 1 (2) None

BRA N,Expr B ranch if Negative 1 1 (2) None

BRA NC,Expr Branch if Not Carry 1 1 (2) None

BRA NN,Expr Branch if Not Negative 1 1 (2) None

BRA NOV,Expr Branch if Not Overflow 1 1 (2) None

BRA NZ,Expr Branch if Not Zero 1 1 (2) None

BRA OA,Expr Branch if Accumulator A overflow 1 1 (2) None

BRA OB,Expr Branch if Accumulator B overflow 1 1 (2) None

BRA OV,Expr Branch if Overflow 1 1 (2) None

BRA SA,Expr Branch if Accumulator A saturated 1 1 (2) None

BRA SB,Expr Branch if Accumulator B saturated 1 1 (2) None

BRA Expr Branch Unconditionally 1 2 None

BRA Z,Expr Branc h if Zero 1 1 (2) None

BRA Wn Computed Branch 1 2 None

7 BSET BSET f,#bit4 Bit Set f 1 1 None

BSET Ws,#bit4 Bit Set Ws 1 1 None

8 BSW BSW.C Ws,Wb Write C bit to Ws<Wb> 1 1 None

BSW.Z Ws,Wb Write Z bit to Ws<Wb> 1 1 None

dsPIC30F6011A/6012A/6013A/6014A

9 BTG BTG f,#bit4 Bit Toggle f 1 1 None

BTG Ws,#bit4 Bit Toggle Ws 1 1 None

10 BTSC BTSC f,#bit4 Bit Test f, Skip if Clear 1 1

(2 or 3) None

BTSC Ws,#bit4 Bit Test Ws, Skip if Clear 1 1

(2 or 3) None

11 BTSS BTSS f,#bit4 B it Test f, Skip if Set 1 1

(2 or 3) None

BTSS Ws,#bit4 Bit Test Ws, Skip if Set 1 1

(2 or 3) None

12 BTST BTST f,#bit4 Bit Test f 1 1 Z

BTST.C Ws,#bit4 Bit Test Ws to C 1 1 C

BTST.Z Ws,#bit4 Bit Test Ws to Z 1 1 Z

BTST.C Ws,Wb Bit Test Ws<Wb> to C 1 1 C

BTST.Z Ws,Wb Bit Test Ws<Wb> to Z 1 1 Z

13 BTSTS BTSTS f,#bit4 Bit Test then Set f 1 1 Z

BTSTS.C Ws,#bit4 Bit Test Ws to C, then Set 1 1 C

BTSTS.Z Ws,#bit4 Bit Test Ws to Z, then Set 1 1 Z

14 CALL CALL lit23 Call subroutine 2 2 None

CALL Wn Call indirect subroutine 1 2 None

15 CLR CLR f f = 0x0000 1 1 None

CLR WREG WREG = 0x0000 1 1 None

CLR Ws Ws = 0x0000 1 1 None

CLR Acc,Wx,Wxd,Wy,Wyd,AWB Clear Accumulator 1 1 OA,OB,SA,SB

16 CLRWDT CLRWDT Clear Watchdog Timer 1 1 WDTO,Sleep

17 COM COM f f = f 11 N,Z

COM f,WREG WREG = f 11 N,Z

COM Ws,Wd Wd = Ws 11 N,Z

18 CP CP f Compare f with WREG 1 1 C,DC,N,OV,Z

CP Wb,#lit5 Compare Wb with lit5 1 1 C,DC,N,OV,Z

CP Wb,Ws Compare Wb with Ws (Wb - Ws) 1 1 C,DC,N,OV,Z

19 CP0 CP0 f Compare f with 0x0000 1 1 C,DC,N,OV,Z

CP0 Ws Compare Ws with 0x0000 1 1 C,DC,N,OV,Z

20 CP1 CP1 f Compare f with 0xFFFF 1 1 C,DC,N,OV,Z

CP1 Ws Compare Ws with 0xFFFF 1 1 C,DC,N,OV,Z

21 CPB CPB f Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z

CPB Wb,#lit5 Co mpare Wb with lit5, with Borrow 1 1 C,DC,N,OV,Z

CPB Wb,Ws Compare Wb with Ws, with Borrow

(Wb - Ws - C)1 1 C,DC,N,OV,Z

22 CPSEQ CPSEQ Wb, Wn Compare Wb with Wn, skip if = 1 1

(2 or 3) None

23 CPSGT CPSGT Wb, Wn Compare Wb with Wn, skip if > 1 1

(2 or 3) None

24 CPSLT CPSLT Wb, Wn Compare Wb with Wn, skip if < 1 1

(2 or 3) None

25 CPSNE CPSNE Wb, Wn Compare Wb with Wn, skip if ≠11

(2 or 3) None

26 DAW DAW Wn Wn = decimal adjust Wn 1 1 C

27 DEC DEC f f = f -1 1 1 C,DC,N,OV,Z

DEC f,WREG WREG = f -1 1 1 C,DC,N,OV,Z

DEC Ws,Wd Wd = Ws - 1 1 1 C,DC,N,OV,Z

28 DEC2 DEC2 f f = f -2 1 1 C,DC,N,OV,Z

DEC2 f,WREG WREG = f -2 1 1 C,DC,N,OV,Z

DEC2 Ws,Wd Wd = Ws - 2 1 1 C,DC,N,OV,Z

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr #

Assembly

Mnemonic Assembly Syntax Description # of

Words # of

Cycles Status Flags

Affected

dsPIC30F6011A/6012A/6013A/6014A

29 DISI DISI #lit14 Disable Interrupts for k instruction cycles 1 1 None

30 DIV DIV.S Wm,Wn Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.SD Wm,Wn Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.U Wm,Wn Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV

DIV.UD Wm,Wn Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV

31 DIVF DIVF Wm,Wn Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV

32 DO DO #lit14,Expr Do code to PC + Expr, lit14 + 1 times 2 2 None

DO Wn,Expr Do code to PC + Expr, (Wn) + 1 times 2 2 None

33 ED ED Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance (no accumulate) 1 1 OA,OB,OAB,

SA,SB,SAB

34 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd Euclidean Distance 1 1 OA,OB,OAB,

SA,SB,SAB

35 EXCH EXCH Wns,Wnd Swap Wns with Wnd 1 1 None

36 FBCL FBCL Ws,Wnd Find Bit Change from Left (MSb) Side 1 1 C

37 FF1L FF1L Ws,Wnd Find First One from Left (MSb) Side 1 1 C

38 FF1R FF1R Ws,Wnd Find First One from Right ( LSb) Side 1 1 C

39 GOTO GOTO Expr Go to address 2 2 None

GOTO Wn Go to indirect 1 2 None

40 INC INC f f = f + 1 1 1 C,DC,N,OV,Z

INC f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z

INC Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z

41 INC2 INC2 f f = f + 2 1 1 C,DC,N,OV,Z

INC2 f,WREG WREG = f + 2 1 1 C,DC,N,OV,Z

INC2 Ws,Wd Wd = Ws + 2 1 1 C,DC,N,OV,Z

42 IOR IOR f f = f .IOR. WREG 1 1 N,Z

IOR f,WREG WREG = f .IOR. WREG 1 1 N,Z

IOR #lit10,Wn Wd = lit10 .IOR. Wd 1 1 N,Z

IOR Wb,Ws,Wd Wd = Wb .IOR. Ws 1 1 N,Z

IOR Wb,#lit5,Wd Wd = Wb .IOR. lit5 1 1 N,Z

43 LAC LAC Wso,#Slit4,Acc Load Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

44 L NK LNK #lit1 4 Link frame pointer 1 1 None

45 LSR LSR f f = Logical Right Shift f 1 1 C,N,OV,Z

LSR f,WREG WREG = Logical Right Shift f 1 1 C,N,OV,Z

LSR Ws,Wd Wd = Logical Right Shift Ws 1 1 C,N,OV,Z

LSR Wb,Wns,Wnd Wnd = Logical Right Shift Wb by Wns 1 1 N,Z

LSR Wb,#lit5,Wnd Wnd = Logical Right Shift Wb by lit5 1 1 N,Z

46 MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd,

AWB Multiply and Accumulate 1 1 OA,OB,OAB,

SA,SB,SAB

MAC Wm*W m,A cc,Wx ,Wxd ,Wy,Wyd Square and Accum ulate 1 1 OA,OB ,O A B,

SA,SB,SAB

47 MOV MOV f,Wn Move f to Wn 1 1 None

MOV f Move f to f 1 1 N,Z

MOV f,WREG Move f to WREG 1 1 N,Z

MOV #lit16,Wn Move 16-bit literal to Wn 1 1 None

MOV.b #lit8,Wn Move 8-bit literal to Wn 1 1 None

MOV Wn,f Move Wn to f 1 1 None

MOV Wso,Wdo Move Ws to Wd 1 1 None

MOV WREG,f Move WREG to f 1 1 N,Z

MOV.D Wns,Wd Move Double from W(ns):W(ns + 1) to Wd 1 2 None

MOV.D Ws,Wnd Move Double from Ws to W(nd + 1):W(nd) 1 2 None

48 MOVSAC MOVSAC Acc,Wx,Wxd,Wy, Wyd,AWB Prefetch and store accumulator 1 1 None

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr #

Assembly

Mnemonic Assembly Syntax Description # of

Words # of

Cycles Status Flags

Affected

dsPIC30F6011A/6012A/6013A/6014A

49 MPY MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd Square Wm to Accumulator 1 1 OA,OB,OAB,

SA,SB,SAB

50 MPY.N MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd -(Multiply Wm by Wn) to Accumulator 1 1 None

51 MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd,

AWB Mult iply and Su btr act from Accu mu lator 1 1 OA,OB,O AB,

SA,SB,SAB

52 MUL MUL.SS Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * signed(Ws) 1 1 None

MUL.SU Wb,Ws,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(Ws) 1 1 None

MUL.US Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) * signed(Ws) 1 1 None

MUL.UU Wb,Ws,Wnd {Wnd + 1, Wnd} = unsigned(Wb) *

unsigned(Ws) 11 None

MUL.SU Wb,#lit5,Wnd {Wnd + 1, Wnd} = signed(Wb) * unsigned(lit5) 1 1 None

MUL.UU Wb,#lit5,Wnd {Wnd + 1, Wnd} = unsigned(Wb) *

unsigned(lit5) 11 None

MUL f W3:W2 = f * WREG 1 1 None

53 NEG NEG Acc Negate Ac cum ulator 1 1 OA ,OB,O A B,

SA,SB,SAB

NEG f f = f + 1 1 1 C,DC, N,OV,Z

NEG f,WREG WREG = f + 1 1 1 C,DC,N,OV,Z

NEG Ws,Wd Wd = Ws + 1 1 1 C,DC,N,OV,Z

54 NOP NOP No Operation 1 1 None

NOPR No Operation 1 1 None

55 POP POP f Pop f from Top-of-Stack (TOS) 1 1 None

POP Wdo Pop from Top-of-Stack (TOS) to Wdo 1 1 None

POP.D Wnd Pop from Top-of-Stack (TOS) to

W(nd):W(nd+1) 12 None

POP.S Pop Shadow Registers 1 1 All

56 PUSH PUSH f Push f to Top-of-Stack (TOS) 1 1 None

PUSH Wso Push Wso to Top-of-Stack (TOS) 1 1 None

PUSH.D W ns Push W(ns):W(n s+ 1) to Top-of-Stack (TOS) 1 2 None

PUSH.S Push Shadow Registe rs 1 1 No ne

57 PWRSAV PWRSAV #lit1 Go into Sleep or Idle mode 1 1 WDTO,Sleep

58 RCALL RCALL Expr Relative Call 1 2 None

RCALL Wn Computed Call 1 2 None

59 REPEAT REPEAT #lit14 Repeat Next Instruction lit14 + 1 times 1 1 None

REPEAT Wn Repeat Next Instruc tion (Wn) + 1 times 1 1 None

60 RESET RESET Software device Reset 1 1 None

61 RETFIE RETFIE Return from interrupt 1 3 (2) None

62 RETLW RETLW #lit10,Wn Return with literal in Wn 1 3 (2) None

63 RETURN RETURN Return from Subroutine 1 3 (2) None

64 RLC RLC f f = Rotate Left through Carry f 1 1 C,N,Z

RLC f,WREG WREG = Rotate Left through Carry f 1 1 C,N,Z

RLC Ws,Wd Wd = Rotate Left through Carry Ws 1 1 C,N,Z

65 RLNC RLNC f f = Rotate Left (No Carry) f 1 1 N,Z

RLNC f,WREG WREG = Rotate Left (No Carry) f 1 1 N,Z

RLNC Ws,Wd Wd = Rotate Left (No Carry) Ws 1 1 N,Z

66 RRC RRC f f = Rotate Right through Carry f 1 1 C,N,Z

RRC f,WREG WREG = Rotate Right through Carry f 1 1 C,N,Z

RRC Ws,Wd Wd = Rotate Right through Carry Ws 1 1 C,N,Z

67 RRNC RRNC f f = Rotate Right (No Carry) f 1 1 N,Z

RRNC f,WREG WREG = Rotate Right (No Carry) f 1 1 N,Z

RRNC Ws,Wd Wd = Rotate Right (No Carry) Ws 1 1 N,Z

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr #

Assembly

Mnemonic Assembly Syntax Description # of

Words # of

Cycles Status Flags

Affected

dsPIC30F6011A/6012A/6013A/6014A

68 SAC SAC Acc,#Slit4,Wdo Store Ac cumulator 1 1 None

SAC.R Acc,#Slit4,Wdo Store Rounded Accumulator 1 1 None

69 SE SE Ws,Wnd Wnd = sign-extended Ws 1 1 C,N,Z

70 SETM SETM f f = 0xFFFF 1 1 None

SETM WREG WREG = 0xFFFF 1 1 None

SETM Ws Ws = 0xFFFF 1 1 None

71 SFTAC SFTAC Acc,Wn Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB,

SA,SB,SAB

SFTAC Acc,#Slit6 Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB,

SA,SB,SAB

72 SL SL f f = Left Shift f 1 1 C,N,OV,Z

SL f,WREG WREG = Left Shift f 1 1 C,N,OV,Z

SL Ws,Wd Wd = Left Shift Ws 1 1 C,N,OV,Z

SL Wb,Wns,Wnd Wnd = Left Shift Wb by Wns 1 1 N,Z

SL Wb,#lit5,Wnd Wnd = Left Shift Wb by lit5 1 1 N,Z

73 SUB SUB Acc Subtract Accum ulat ors 1 1 OA,OB,O AB,

SA,SB,SAB

SUB f f = f - WREG 1 1 C,DC,N,OV,Z

SUB f,WREG WREG = f - WREG 1 1 C,DC,N,OV,Z

SUB #lit10,Wn Wn = Wn - lit10 1 1 C,DC,N,OV,Z

SUB Wb,Ws,Wd Wd = Wb - Ws 1 1 C,DC,N,OV,Z

SUB Wb,#lit5,Wd Wd = Wb - lit5 1 1 C,DC,N,OV,Z

74 SUBB SUBB f f = f - WREG - (C) 1 1 C,DC,N,OV,Z

SUBB f,WREG WREG = f - WREG - (C) 1 1 C,DC,N,OV,Z

SUBB #lit10,Wn Wn = Wn - lit10 - (C) 1 1 C,DC,N,OV,Z

SUBB Wb,Ws,Wd Wd = Wb - Ws - (C) 1 1 C,DC,N,OV,Z

SUBB Wb,#lit5, Wd Wd = Wb - lit5 - (C) 1 1 C,DC,N,OV,Z

75 SUBR SUBR f f = WREG - f 1 1 C,DC,N,OV,Z

SUBR f,WREG WREG = WREG - f 1 1 C,DC,N,OV,Z

SUBR Wb,Ws,Wd Wd = Ws - Wb 1 1 C,DC,N,OV,Z

SUBR Wb,#lit5,Wd Wd = lit5 - Wb 1 1 C,DC,N,OV,Z

76 SUBBR SUBBR f f = WREG - f - (C) 1 1 C,DC,N,OV,Z

SUBBR f,WREG WREG = WREG -f - (C) 1 1 C,DC,N,OV,Z

SUBBR Wb,Ws,Wd Wd = Ws - Wb - (C) 1 1 C,DC,N,OV,Z

SUBBR Wb,#lit5,Wd Wd = lit5 - Wb - (C) 1 1 C,DC,N,OV,Z

77 SWAP SWAP.b Wn Wn = nibble swap Wn 1 1 None

SWAP Wn Wn = byte swap Wn 1 1 None

78 TBLRDH TBLRDH Ws,Wd Read Prog<23:16> to Wd<7:0> 1 2 None

79 TBLRDL TBLRDL Ws,Wd Read Prog<15:0> to Wd 1 2 None

80 T BLWTH TBLW TH Ws,Wd Write Ws<7:0> to Prog< 23: 16> 1 2 None

81 T BLWTL T B LWTL W s,W d Write Ws to Prog<15:0> 1 2 Non e

82 ULNK ULNK Unlink frame pointer 1 1 Non e

83 XOR XOR f f = f .XOR. WREG 1 1 N,Z

XOR f,WREG WREG = f .XOR. WREG 1 1 N,Z

XOR #lit10,Wn Wd = lit10 .XOR. Wd 1 1 N,Z

XOR Wb,Ws,Wd Wd = Wb .XOR. Ws 1 1 N,Z

XOR Wb,#lit5,Wd Wd = Wb .XOR. lit5 1 1 N,Z

84 ZE ZE Ws,Wnd Wnd = Zero-extend Ws 1 1 C,Z,N

TABLE 21-2: INSTRUCTION SET OVERVIEW (CONTINUED)

Base

Instr #

Assembly

Mnemonic Assembly Syntax Description # of

Words # of

Cycles Status Flags

Affected

dsPIC30F6011A/6012A/6013A/6014A

22.0 DEVELOPMENT SUPPORT

The PIC micro micr ocontrollers are sup ported w ith a full

range of hardware and software development tools:

• Integrated Development Environment

- MPLAB IDE Software

• Assemblers/Compilers/Linkers

- MPASMTM Assembler

- MPLAB C18 and MPLAB C30 C Compilers

-MPLINK

TM Object Linker/

MPLIBTM Object Librarian

- MPLAB ASM30 Assembler/Linker/Library

• Simulators

- MPLAB SIM Software Simulator

•Emulators

- MPLAB ICE 2000 In-Circuit Emulator

- MPLAB ICE 4000 In-Circuit Emulator

• In-Circuit Debugger

- MPLAB ICD 2

• Device Progra mmers

- PICSTART® Plus Development Programmer

- MPLAB PM3 Device Programmer

• Low-Cost Demonstration and Development

Boards and Evaluation Kits

22.1 MPLAB Integrated Development

Environment Software

The MPLAB IDE software brings an ease of software

development previously unseen in the 8/16-bit micro-

controller market. The MPLAB IDE is a Windows®

operating system-based application that contains:

• A single graphical interface to all debugging tools

- Simulator

- Programmer (sold separately)

- Emulator (sold separatel y)

- In-Circuit D ebugger (sold separately)

• A full-featured editor with color-coded context

• A multiple project manager

• Customizable data windows with direct edit of

contents

• High-level source code debugging

• Visual device initializer for easy register

initialization

• Mouse over variable inspection

• Drag and drop variables from source to watch

windows

• Exten si ve on-l in e help

• Integration of select third par ty to ols, su ch as

HI-TECH Software C Compilers and IAR

C Compilers

The MPLAB IDE allows you to:

• Edit your sour ce fil es (either assembly or C)

• One touch assemble (or compile) and download

to PICmicro MCU emulator and simulator tools

(automatically updates all project information)

• Debug us ing :

- Source files (assembly or C)

- Mixed assembly and C

- Machine code

MPLAB IDE supports multiple debugging tools in a

single development paradigm, from the cost-effective

simulators, through low-cost in-circuit debuggers, to

full-featured emulators. This eliminates the learning

curve when upgrading to tools with increased flexibility

and power.

dsPIC30F6011A/6012A/6013A/6014A

22.2 MPASM Assembler

The MPASM Assembler is a full-featured, universal

macro assembler for all PICmicro MCUs.

The MPASM Assembler generates relocatable object

files fo r the MPLINK Ob ject Linker , Int el® standa rd HEX

files, MAP files to detail memory usage and symbol

reference, absolute LST files that contain source lines

and generated machine code and COFF files for

debugging.

The MPASM Assembler features include:

• Integration into MPLAB IDE projects

• User-defined macros to streamline

assembly co de

• Conditional assembly for multi-purpose

sour ce fil es

• Directives that allow complete control over the

assembly process

22.3 MPLAB C18 and MPLAB C30

C Compilers

The MPLAB C18 and MPLAB C30 Code Development

Systems are complete ANSI C compilers for

Microchip’s PIC18 family of microcontrollers and

dsPIC30F family of digital signal controllers. These

compilers provide powerful integration capabilities,

superior code optimization and ease of use not found

with other compilers.

For easy source level debugging, the compilers provide

symbol info rmation tha t is optimized to the MPLAB IDE

debugger.

22.4 MPLINK Object Linker/

MPLIB Object Librari an

The MPLINK Object Linker combines relocatable

objects created by the MPASM Assembler and the

MPLAB C18 C Compiler. It can link relocatable objects

from precompiled libraries, using directives from a

linker script.

The MPLIB O bject Li brarian manag es the cre ation an d

modification of library files of precompiled code. When

a routine from a library is called from a source file , only

the modules that contain that routine will be linked in

with the application. This allows large libraries to be

used efficiently in many different applications.

The object linker/library features include:

• Efficient linking of single libraries instead of many

smaller files

• Enhanced code maintainability by grouping

related modules together

• Flexible creation of libraries with easy module

listing, replacement , deletion and extr action

22.5 MPLAB ASM30 Assembler, Linker

and Librarian

MPLAB ASM30 Assembler produces relocatable

machine code from symbolic assembly language for

dsPIC30F devices. MPLAB C30 C Compiler uses the

assembler to produce its object file. The assembler

generates relocatable object files that can then be

archived or lin ked with other relocatable ob ject files and

arch ives to c rea te an e xecu tabl e fil e. N otabl e fe atu res

of the assembler include:

• Support for the entire dsPIC30F instruction set

• Support for fixed-point and floating-point data

• Command line interface

• Rich dire cti ve set

• Flexible macro language

• MPLAB IDE compatibility

22.6 MPLAB SIM Software Simulator

The MPLAB SIM Software Simulator allows code

development in a PC-hosted environment by simulat-

ing the PICmicro MCUs and dsPIC DSCs on an instruc-

tion level . On any giv en inst ru cti on, the dat a areas can

be examined or modified and stimuli can be applied

from a comprehensive stimulus controller. Registers

can be lo gged to fi le s for furth er run-time an al ys is . Th e

trace buffer and logic analyzer display extend the

power of the simulator to record and track program

executi on , ac ti ons o n I/O, as w e ll as in ternal regi sters.

The MPLAB SIM Software Simulator fully supports

symbolic debugging using the MPLAB C18 and

MPLAB C30 C Compilers, and the MPASM and

MPLAB ASM30 Assemblers. The software simulator

offers the flexibility to develop and debug code outside

of the laboratory environment, making it an excellent,

economical software development tool.

dsPIC30F6011A/6012A/6013A/6014A

22.7 MPLAB ICE 2000

High-Performance

In-Circui t Emu lator

The MPLAB ICE 2000 In-Circuit Emulator is intended

to provide the product development engineer with a

complete microcontroller design tool set for PICmicro

microcontrollers. Software control of the MPLAB ICE

2000 In-Circuit Emulator is advanced by the MPLAB

Integrated Development Environment, which allows

editing, building, downloading and source debugging

from a single environment.

The MPLAB ICE 2000 is a full-featured emulator

system with enhanced trace, trigger and data monitor-

ing feat ures. Interc hangeabl e proces sor modul es allow

the system to be easily reconfigured for emulation of

different processors. The architecture of the MPLAB

ICE 2000 In-Circuit Emulator allows expansion to

support new PICmicro microcontrollers.

The MPLAB ICE 2000 In-Circuit Emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft® Windows® 32-bit operating system were

chosen to best make these features available in a

simple, unified application.

22.8 MPLAB ICE 4000

High-Performance

In-Circui t Emu lator

The MPLAB ICE 4000 In-Circuit Emu lator is intende d to

provide the product development engineer with a

complete microcontroller design tool set for high-end

PICmicro MCUs and dsPIC DSCs. Software control of

the MPLAB ICE 4000 In-Circuit Emulator is provided by

the MPLAB Integrated Development Environment,

which allows editing, building, downloading and source

debugging from a single environm ent.

The MPLAB ICE 4000 is a premium emulator system,

providing the features of MPLAB ICE 2000, but with

increased emulation memory and high-speed perfor-

mance for dsPIC30F and PIC18XXXX devices. Its

advanc ed emulator fe atures inc lude complex t riggering

and timing, and up to 2 Mb of emulation memory.

The MPLAB ICE 4000 In-Circuit Emulator system has

been designed as a real-time emulation system with

advanced features that are typically found on more

expensive development tools. The PC platform and

Microsoft Windows 32-bit operating system were

chosen to best make these features available in a

simple, unified application.

22.9 MPLAB ICD 2 In-Circuit Debugger

Microchip’s In-Circuit Debugger, MPLAB ICD 2, is a

powerful, low-cost, run-time development tool,

connecting to the host PC via an RS-232 or high-speed

USB interface. This tool is based on the Flash PICmicro

MCUs and can be used to develop for these and other

PICmicro MCUs and dsPIC DSCs. The MPLAB ICD 2

utilizes the in-circuit debugging capability built into

the Flash devices. This feature, along with Microchip’s

In-Circuit Serial Programming (ICSP) protocol, offers

cost-effective, in-circuit Flash debugging from the graph-

ical user interface of the MPLAB Integrated Develop-

ment Envi ronmen t. This en ables a desig ner to develo p

and debug source code by setting breakpoints, single

stepping and watching variables, and CPU status and

peripheral registers. Running at full speed enables

testing hardware and applications in real time. MPLAB

ICD 2 also serves as a development programmer for

selected PICmicro devices.

22.10 MPLAB PM3 Device Programmer

The MPLAB PM3 Device Programmer is a universal,

CE compliant device programmer with programmable

voltage verification at VDDMIN and VDDMAX for

maximum reliability. It features a large LCD display

(128 x 64 ) for men us an d error m essages and a m odu-

lar, detachable socket assembly to support various

package types. The ICSPcable assembly is included

as a standard item. In Stand-Alone mode, the MPLAB

PM3 Devic e Programmer ca n read, verif y and program

PICmicro devices without a PC connection. It can also

set code protection in this mode. The MPLAB PM3

connects to the host PC via an RS-232 or USB cable.

The MPLAB PM3 h as high-spe ed co mmunicat ions and

optimized algorithms for quick programming of large

memory devices and in corporates an SD/MMC card for

file storage and secure data applications.

dsPIC30F6011A/6012A/6013A/6014A

22.11 PICSTART Plus Development

Programmer

The PICSTART Plus Development Programmer is an

easy-to-use, low-cost, prototype programmer. It

connects to the PC via a COM (RS-232) port. MPLAB

Inte grated Dev elopmen t En vironme nt so ftware makes

using the programmer simple and efficient. The

PICSTART Plus Development Programmer supports

most PICmicro devices in DIP packages up to 40 pins .

Larger pin count devices, such as the PIC16C92X and

PIC17C76 X, may be sup ported with an a dapter socket.

The PICSTART Plus Development Programmer is CE

compliant.

22.12 Demonstration, Development and

Evaluation Boards

A wide variety of demonstration, development and

evaluation boards for various PICmicro MCUs and dsPIC

DSCs allows quick application development on fully func-

tional systems. Most boards inclu de prototyping a reas for

adding custom circuitry and provide application firmware

and source code for examination and modification.

The board s support a variety of features, including LEDs,

temperature sensors, switches, speakers, RS-232

interfaces, LCD displays, potentiometers and additional

EEPROM memory .

The demonstration and development boards can be

used in teaching environments, for prototyping custom

circuits and for learning about various microcontroller

applications.

In addition to the PICDEM™ and dsPICDEM™ demon-

stration/development board series of circuits, Microchip

has a line of evaluation kits and demonstration software

for analog filter design, KEELOQ® security ICs, CAN,

IrDA®, PowerSmart® battery management, SEEVAL®

evaluation system, Sigma-Delta ADC, flow rate

sensing, plus many more.

Check the Microchip web page (www.microchip.com)

and the latest Product Selector Guide (DS00148) for

the complete list of demonstration, development and

evaluation kits.

dsPIC30F6011A/6012A/6013A/6014A

23.0 ELECTRICAL CHARACTERISTICS

This section provid es an overview of dsPIC30F electrical characteristics. Additional information will be provided in future

revisions of this document as it becomes available.

For detailed information about the dsPIC30F architecture and core, refer to dsPIC30F Family Reference Manual

(DS70046).

Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for

extende d peri ods may aff ec t devi ce re liabil ity. Functio nal o peratio n of t he devi ce at these or a ny ot her condi tions abov e

the parameters indicated in the operation listings of this specification is not implied.

Absolute Maximum Ratings(†)

Ambient temperature under bias.............................................................................................................-40°C to +125°C

Storage temperature.............................................................................................................................. -65°C to +150°C

Voltage on any pin with respect to VSS (except VDD and MCLR)(1)................................................-0.3V to (VDD + 0.3V)

Volta ge on VDD with respect to VSS ......................................................................................................... -0.3V to +5.5V

Volta ge on MCLR with respect to VSS ....................................................................................................... 0V to +13.25V

Maximum curr ent out of VSS pin ...........................................................................................................................300 mA

Maximum curr ent into VDD pin(2)...........................................................................................................................250 mA

Input clamp current, IIK (VI < 0 or VI > VDD)..........................................................................................................±20 mA

Output clamp cur rent, IOK (VO < 0 or VO > VDD)...................................................................................................±20 mA

Maximum output current sunk by any I/O pin..........................................................................................................25 mA

Maximum output current sourced by any I/O pin ....................................................................................................25 mA

Maximum current sunk by all ports.......................................................................................................................200 mA

Maximum current sourced by all ports(2)...............................................................................................................200 mA

Note 1: Vo lt a ge sp ik es below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup.

Thus, a se ries res is tor of 5 0-10 0Ω sho uld be us ed when apply in g a “lo w ” level to t he M CLR/VPP pin, rather

than pulling this pin directly to VSS.

2: Maximum allowable current is a function of device maximum power dissipaton. See Table 23-2 for PDMAX.

23.1 DC Characteristics

†NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device . This is a stres s rating onl y and funct ional ope ration of the device at tho se or any other co nditio ns above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

TABLE 23-1: OPERATING MIPS VS. VOLTAGE

VDD Range Temp Range Max MIPS

dsPIC30F601xA-30I dsPIC30F601xA-20I dsPIC30F601xA-20E

4.5-5.5V -40°C to 85°C 3 0 20 —

4.5-5.5V -40°C to 125°C — — 20

3.0-3.6V -40°C to 85°C 2 0 15 —

3.0-3.6V -40°C to 125°C — — 15

2.5-3.0V -40°C to 85°C 1 0 7.5 —

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-2: THERMAL OPERATING CONDITIONS

Rating Symbol Min Typ Max Unit

dsPIC30F601xA-30I

Operating Junction Temperature Range TJ-40 +125 °C

Operating Ambient Temperature Range TA-40 +85 °C

dsPIC30F601xA-20I

Operati ng Junction Temp erature Rang e TJ-40 +150 °C

Operating Ambient Temperature Range TA-40 +85 °C

dsPIC30F601xA-20E

Operati ng Junction Temp erature Rang e TJ-40 +150 °C

Operating Ambient Temperature Range TA-40 +125 °C

Power Dissi pation:

Internal ch ip pow er dis sip ation:

PDPINT + PI/OW

I/O Pin power dissipation:

Maximum Allo wed Power Dissipa tion PDMAX (TJ - TA) / θJA W

TABLE 23-3: THERMAL PACKAGING CHARACTERISTICS

Characteristic Symbol Typ Max Unit Notes

Package Thermal Resistance, 80-pin TQFP (14x14x1mm) θJA 34 °C/W 1

Package Thermal Resistance, 64-pin TQFP (14x14x1m m ) θJA 34 °C/W 1

Package Thermal Resistance, 80-pin TQFP (12x12x1mm) θJA 39 °C/W 1

Package Thermal Resistance, 64-pin TQFP (10x10x1mm) θJA 39 °C/W 1

Note 1: Junction to ambient thermal resistance, Theta-ja (θJA) numbers are achieved by package simulations.

TABLE 23-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85° C for Industri al

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Operating Voltage(2)

DC10 VDD Supply Voltage 2.5 — 5.5 V Industri al tem pera ture

DC11 VDD Supply Voltage 3.0 — 5.5 V Extended temperature

DC12 VDR RAM Data Retention Voltage(3) —1.5—V

DC16 VPOR VDD Start Voltage

to ensure internal

Power-on Reset signal

—VSS —V

DC17 SVDD VDD Rise Rate

to ensure internal

Power-on Reset signal

0.05 V/ms 0-5V in 0.1 se c

0-3V in 60 ms

Note 1: Data in “Typ” column is at 5V, 25°C unless o therw ise st ate d. Parame ters are for desi gn gui dance only an d

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: This is the limit to which VDD can be lowered without losing RAM data.

INT VDD IDD IOH

∑

–()×=

PI/OVDD VOH

–{}IOH

×()

∑VOL IOL

×()

∑

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

DC31 — — mA -40°C

3.3V

0.128 MIPS

LPRC (512 kHz)

DC31a 1.5 — mA 25°C

DC31b — — mA 85°C

DC31c — — mA 125°C

DC31d — — mA -40°C

DC31e 2.5 — mA 25°C

DC31f — — mA 85°C

DC31g — — mA 125°C

DC20 — — mA -40°C

3.3V

1 MIPS

DC20a 4 — mA 25°C

DC20b — — mA 85°C

DC20c — — mA 125°C

DC20d — — mA -40°C

DC20e 7 — mA 25°C

DC20f — — mA 85°C

DC20g — — mA 125°C

DC30 — — mA -40°C

3.3V

1.8 MIPS

FRC (7.37 MHz)

DC30a 7 — mA 25°C

DC30b — — mA 85°C

DC30c — — mA 125°C

DC30d — — mA -40°C

DC30e 12 — mA 25°C

DC30f — — mA 85°C

DC30g — — mA 125°C

DC23 — — mA -40°C

3.3V

4 MIPS

DC23a 13 — mA 25°C

DC23b — — mA 85°C

DC23c — — mA 125°C

DC23d — — mA -40°C

DC23e 22 — mA 25°C

DC23f — — mA 85°C

DC23g — — mA 125°C

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have

an imp act on the current c onsumpti on. The tes t condi tions fo r all IDD measur ement s are as follow s: OSC1

driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD.

MCLR = VDD, WDT, FSCM and BOR are disabled. CPU, SRAM, program memory and data memory are

operational. No peripheral modules are operating.

dsPIC30F6011A/6012A/6013A/6014A

DC25 — — mA -40°C

3.3V

8 MIPS

DC25a 23 — mA 25°C

DC25b — — mA 85°C

DC25c — — mA 125°C

DC25d — — mA -40°C

DC25e 41 — mA 25°C

DC25f — — mA 85°C

DC25g — — mA 125°C

DC24 — — mA -40°C

3.3V

10 MIPS

DC24a 29 — mA 25°C

DC24b — — mA 85°C

DC24c — — mA 125°C

DC24d — — mA -40°C

DC24e 50 — mA 25°C

DC24f — — mA 85°C

DC24g — — mA 125°C

DC28 — — mA -40°C 3.3V

16 MIPS

DC28a 42 — mA 25°C

DC28b — — mA 85°C

DC28c — — mA -40°C

DC28d 76 — mA 25°C

DC28e — — mA 85°C

DC28f — — mA 125°C

DC27 — — mA -40°C 3.3V

20 MIPS

DC27a 50 — mA 25°C

DC27b — — mA 85°C

DC27c — — mA -40°C

DC27d 90 — mA 25°C

DC27e — — mA 85°C

DC27f — — mA 125°C

TABLE 23-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTI N U ED)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have

an imp act on the current c onsumpti on. The tes t condi tions fo r all IDD measur ement s are as follow s: OSC1

driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD.

MCLR = VDD, WDT, FSCM and BOR are disabled. CPU, SRAM, program memory and data memory are

operational. No peripheral modules are operating.

dsPIC30F6011A/6012A/6013A/6014A

DC29 — — mA -40°C

5V 30 MIPS

DC29a 146 — mA 25°C

DC29b — — mA 85°C

DC29c — — mA 125°C

TABLE 23-5: DC CHARACTERISTICS: OPERATING CURRENT (IDD) (CONTI N UE D )

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Operating Current (IDD)(2)

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O

pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have

an imp act on the current c onsumpti on. The tes t condi tions fo r all IDD measur ement s are as follow s: OSC1

driven with external square wave from rail to rail. All I/O pins are configured as inputs and pulled to VDD.

MCLR = VDD, WDT, FSCM and BOR are disabled. CPU, SRAM, program memory and data memory are

operational. No peripheral modules are operating.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Idle Current (IIDLE): Core OFF Clock ON Base Current(2)

DC51 — — mA -40°C

3.3V

0.128 MIPS

LPRC (512 kHz)

DC51a 1 — mA 25°C

DC51b — — mA 85°C

DC51c — — mA 125°C

DC51d — — mA -40°C

DC51e 1.5 — mA 25°C

DC51f — — mA 85°C

DC51g — — mA 125°C

DC40 — — mA -40°C

3.3V

1 MIPS

DC40a 3 — mA 25°C

DC40b — — mA 85°C

DC40c — — mA 125°C

DC40d — — mA -40°C

DC40e 5 — mA 25°C

DC40f — — mA 85°C

DC40g — — mA 125°C

DC50 — — mA -40°C

3.3V

1.8 MIPS

FRC (7.37 MHz)

DC50a 4 — mA 25°C

DC50b — — mA 85°C

DC50c — — mA 125°C

DC50d — — mA -40°C

DC50e 7 — mA 25°C

DC50f — — mA 85°C

DC50g — — mA 125°C

DC43 — — mA -40°C

3.3V

4 MIPS

DC43a 7.7 — mA 25°C

DC43b — — mA 85°C

DC43c — — mA 125°C

DC43d — — mA -40°C

DC43e 13 — mA 25°C

DC43f — — mA 85°C

DC43g — — mA 125°C

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: Base IIDLE current is measured with core off, clock on and all modules turned off.

dsPIC30F6011A/6012A/6013A/6014A

DC45 — — mA -40°C

3.3V

8 MIPS

DC45a 13 — mA 25°C

DC45b — — mA 85°C

DC45c — — mA 125°C

DC45d — — mA -40°C

DC45e 24 — mA 25°C

DC45f — — mA 85°C

DC45g — — mA 125°C

DC44 — — mA -40°C

3.3V

10 MIPS

DC44a 15 — mA 25°C

DC44b — — mA 85°C

DC44c — — mA 125°C

DC44d — — mA -40°C

DC44e 29 — mA 25°C

DC44f — — mA 85°C

DC44g — — mA 125°C

DC48 — — mA -40°C 3.3V

16 MIPS

DC48a 24 — mA 25°C

DC48b — — mA 85°C

DC48c — — mA -40°C

DC48d 43 — mA 25°C

DC48e — — mA 85°C

DC48f — — mA 125°C

DC47 — — mA -40°C 3.3V

20 MIPS

DC47a 29 — mA 25°C

DC47b — — mA 85°C

DC47c — — mA -40°C

DC47d 52 — mA 25°C

DC47e — — mA 85°C

DC47f — — mA 125°C

DC49 — — mA -40°C

5V 30 MIPS

DC49a 73 — mA 25°C

DC49b — — mA 85°C

DC49c — — mA 125°C

TABLE 23-6: DC CHARACTERISTICS: IDLE CURRENT (IIDLE) (CONTINUED)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Idle Current (IIDLE): Core OFF Clock ON Base Current(2)

Note 1: Data in “Typical” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only

and are not tested.

2: Base IIDLE current is measured with core off, clock on and all modules turned off.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-7: DC CHARACTERISTICS: POWER-DOWN CURRENT (IPD)

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operati ng tem pera ture -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Parameter

No. Typical(1) Max Units Conditions

Power-Down Current (IPD)(2)

DC60 — — μA-40°C

3.3V

Base Power-Down Current(3)

DC60a 0.1 — μA 25°C

DC60b — — μA 85°C

DC60c — — μA 125°C

DC60d — — μA-40°C

DC60e 0.2 — μA 25°C

DC60f — — μA 85°C

DC60g — — μA 125°C

DC61 — — μA-40°C

3.3V

Watchdog Timer Current: ΔIWDT(3)

DC61a 6.8 — μA 25°C

DC61b — — μA 85°C

DC61c — — μA 125°C

DC61d — — μA-40°C

DC61e 16 — μA 25°C

DC61f — — μA 85°C

DC61g — — μA 125°C

DC62 — — μA-40°C

3.3V

Timer1 w/32 kHz Crystal: ΔITI32(3)

DC62a 5.5 — μA 25°C

DC62b — — μA 85°C

DC62c — — μA 125°C

DC62d — — μA-40°C

DC62e 7.5 — μA 25°C

DC62f — — μA 85°C

DC62g — — μA 125°C

DC63 — — μA-40°C

3.3V

BOR On: ΔIBOR(3)

DC63a 32 — μA 25°C

DC63b — — μA 85°C

DC63c — — μA 125°C

DC63d — — μA-40°C

DC63e 38 — μA 25°C

DC63f — — μA 85°C

DC63g — — μA 125°C

Note 1: Data in the Typical column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance

only and are not tested.

2: Base IPD is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and

pulled high. BOR, WDT, etc. are all switched off.

3: The Δ current is the additional current consumed when the module is enabled. This current should be

added to the base IPD current.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +1 25°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VIL Input Low Voltage(2)

DI10 I/O pins:

with Schmitt Trigger buffer VSS —0.2VDD V

DI15 MCLR VSS —0.2VDD V

DI16 OSC1 (in XT, HS and LP modes) VSS —0.2VDD V

DI17 OSC1 (in RC mode)(3) VSS —0.3VDD V

DI18 SDA, SCL TBD — TBD V SM bus disabled

DI19 SDA, SCL TBD — TBD V SM bus enabled

VIH Input High Voltage(2)

DI20 I/O pins:

with Schmitt Trigger buffer 0.8 VDD —VDD V

DI25 MCLR 0.8 VDD —VDD V

DI26 OSC1 (in XT, HS and LP modes) 0.7 VDD —VDD V

DI27 OSC1 (in RC mode)(3) 0.9 VDD —VDD V

DI28 SDA, SCL TBD — TBD V SM bus disabled

DI29 SDA, SCL TBD — TBD V SM bus enabled

ICNPU CNXX Pull-up Current(2)

DI30 50 250 400 μAVDD = 5V, VPIN = VSS

DI31 TBD TBD TBD μAVDD = 3V, VPIN = VSS

IIL Input Leakage Current(2)(4)(5)

DI50 I/O ports — 0.01 ±1 μAVSS ≤ VPIN ≤ VDD,

Pin at high-i mpedance

DI51 Analog input pins — 0.50 — μAV

SS ≤ VPIN ≤ VDD,

Pin at high-i mpedance

DI55 MCLR —0.05±5μAVSS ≤ VPIN ≤ VDD

DI56 OSC1 — 0.05 ±5 μAVSS ≤ VPIN ≤ VDD, XT, HS

and LP Osc mode

Legend: TBD = To Be Determined

Note 1: Data in “Typ” column is at 5V, 25°C unless o therw ise st ate d. Parame ters are for desi gn gui dance only an d

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: In RC oscillator configuration, the OSC1/CLKl pin is a Schmitt Trigger input. It is not recommended that

the dsPIC30F device be driven with an external clock while in RC mode.

4: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified

levels represent normal operating conditions. Higher leakage current may be measured at different input

voltages.

5: Negative current is defined as current sourced by the pin.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-1: LOW-VOLTAGE DETECT CHARACTERISTICS

TABLE 23-9: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85° C for Industri al

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

VOL Output Low Voltage(2)

DO10 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 5V

——TBDVI

OL = 2.0 mA, VDD = 3V

DO16 OSC2/CLKOUT — — 0.6 V IOL = 1.6 mA, VDD = 5V

(RC or EC Osc mode) — — TBD V IOL = 2.0 mA, VDD = 3V

VOH Output High Voltage(2)

DO20 I/O ports VDD – 0.7 — — V IOH = -3.0 mA, VDD = 5V

TBD — — V IOH = -2.0 mA, VDD = 3V

DO26 OSC2/CLKOUT VDD – 0.7 — — V IOH = -1.3 mA, VDD = 5V

(RC or EC Osc mode) TBD — — V IOH = -2.0 mA, VDD = 3V

Capacitive Loading Specs

on Output Pins(2)

DO50 COSC2 OSC2/SOSC2 pin — — 15 pF In XTL, XT, HS and LP mo des

when e xternal cloc k is used to

drive OSC1.

DO56 CIO All I/O pins and OSC2 — — 50 pF RC or EC Osc mode

DO58 CBSCL, SDA — — 400 pF In I2C™ mode

Legend: TBD = To Be Determined

Note 1: Dat a i n “Typ” column is at 5V, 25°C un les s o the rw is e s t ate d. Pa ram ete rs ar e for desig n gu idance on ly and

are not tested.

2: These parameters are characterized but not tested in manufacturing.

LV10

LVDIF

VDD

(LVDIF set by hardware)

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-2: BROWN-OUT RESET CHARACTERISTICS

TABLE 23-10: ELECTRICAL CHARACTERISTICS: LVDL

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ Max Units Conditions

LV10 VPLVD L VDL V oltage on VDD transition

high to low LVDL = 0000(2) ———V

LVDL = 0001(2) ———V

LVDL = 0010(2) ———V

LVDL = 0011(2) ———V

LVDL = 0100 2.50 — 2.65 V

LVDL = 0101 2.70 — 2.86 V

LVDL = 0110 2.80 — 2.97 V

LVDL = 0111 3.00 — 3.18 V

LVDL = 1000 3.30 — 3.50 V

LVDL = 1001 3.50 — 3.71 V

LVDL = 1010 3.60 — 3.82 V

LVDL = 1011 3.80 — 4.03 V

LVDL = 1100 4.00 — 4.24 V

LVDL = 1101 4.20 — 4.45 V

LVDL = 1110 4.50 — 4.77 V

LV15 VLVDIN External LVD input pin

threshold voltage LVDL = 1111 ———V

Note 1: These parameters are characterized but not tested in manufacturing.

2: These values not in usable operating range.

BO10

RESET (due to BOR)

VDD

(Device in Brown-out Reset)

(Device not in Brown-out Reset)

Power Up T ime-out

BO15

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-11: ELECTRICAL CHARACTERISTICS: BOR

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operati ng tem per ature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

BO10 VBOR BOR Voltage(2) on

VDD transition high to

low

BORV = 11(3) — — — V Not in operating

range

BORV = 10 2.6 — 2.71 V

BORV = 01 4.1 — 4.4 V

BORV = 00 4.38 — 4.53 V

BO15 VBHYS —5—mV

Note 1: Data in “Typ” column is at 5V, 25°C unless o therw ise st ate d. Parame ters are for desi gn gui dance only an d

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: 11 values not in usable operating range.

TABLE 23-12: DC CHARACTERISTICS: PROGRAM AND EEPROM

DC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operati ng tem pera ture -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

Data EEPROM Memory(2)

D120 EDByte Endurance 100K 1M — E/W -40°C ≤ TA ≤ +85°C

D121 VDRW VDD for Read/Write VMIN — 5.5 V Using EECON to read/write

VMIN = Minimum operating

voltage

D122 TDEW Erase/Write Cycle Time — 2 — ms

D123 TRETD Characteristic Retention 40 100 — Year Provided no other specifications

are violated

D124 IDEW IDD During Programming — 10 30 mA Row Erase

Program FLASH Memory(2)

D130 EPCell Endurance 10K 100K — E/W -40°C ≤ TA ≤ +85°C

D131 VPR VDD for Read VMIN —5.5VVMIN = Minimum operating

voltage

D132 VEB VDD for Bulk Erase 4.5 — 5.5 V

D133 VPEW VDD for Erase/Write 3.0 — 5.5 V

D134 TPEW Erase/Write Cycle Time — 2 — ms

D135 TRETD Characteristic Retention 40 100 — Year Provided no other specifications

are violated

D136 TEB ICSP Block Erase Time — 4 — ms

D137 IPEW IDD During Programming — 10 30 mA Row Erase

D138 IEB IDD During Programming — 10 30 mA Bulk Erase

Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

2: These parameters are characterized but not tested in manufacturing.

dsPIC30F6011A/6012A/6013A/6014A

23.2 AC Characteristi cs and Timing Parameters

The information contained in this section defines dsPIC30F AC characteristics and timing parameters.

TABLE 23-13: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC

FIGURE 23-3: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS

FIGURE 23-4: EXTERNAL CLOCK TIMING

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operati ng tem pera ture -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Operati ng voltage VDD range as described in DC Spec Section 23.0.

VDD/2

VSS

RL= 464 Ω

CL= 50 pF for all pins except OSC2

5 pF for OSC2 output

Load Cond itio n 1 – for all pins except OSC2 Load Condition 2 – for OSC2

OSC1

CLKOUT

Q4 Q1 Q2 Q3 Q4 Q1

OS20

OS25

OS30 OS30

OS40 OS41

OS31 OS31

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-14: EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise sta ted)

Operating temperature -40°C ≤ TA ≤ +85°C for Indu stri al

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ(1) Max Units Conditions

OS10 FOSC External CLKIN Frequency(2)

(External clocks allowed only

in EC mode)

—

7.5(3)

MHz

EC with 4x PLL

EC with 8x PLL

EC with 16x PLL

Osci lla tor Freq uen cy(2) DC

0.4

12(4)

—

32.768

7.5(3)

20(4)

15(3)

22.5(3)

—

MHz

kHz

XTL

XT with 4x PLL

XT with 8x PLL

XT with 16x PLL

HS/2 with 4x PLL

HS/2 with 8x PLL

HS/2 with 16x PLL

HS/3 with 4x PLL

HS/3 with 8x PLL

HS/3 with 16x PLL

OS20 TOSC TOSC = 1/FOSC — — — — See parameter OS1 0

for FOSC value

OS25 TCY Instr uction Cycle Time(2)(5) 33 — DC ns See Table 23-16

OS30 TosL,

TosH External Clock(2) in (OSC1 )

High or Low Time .45 x TOSC ——nsEC

OS31 TosR,

TosF External Clock(2) in (OSC1 )

Rise or Fall Time ——20nsEC

OS40 TckR CLKOUT Rise Time(2)(6) — — — ns See parameter D0 31

OS41 TckF CLKOUT Fall Time(2)(6) — — — ns See parameter D032

Note 1: Data i n “Typ” col umn is at 5V, 25°C un less oth erw is e s t at ed. Param ete rs are for desi gn g ui dance onl y a nd

are not tested.

2: These parameters are characterized but not tested in manufacturing.

3: Limited by the PLL output frequency range.

4: Limited by the PLL input frequency range.

5: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values

are based on characterization data for that particular oscillator type under standard operating conditions

with the device executing code. Exceeding these specified limits may result in an unstable oscillator

operation and/or higher than expected current consumption. All devices are tested to operate at “min.”

values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the

“Max.” cycle time limit is “DC” (no clock) for all devices.

6: Measurements are taken in EC or ERC modes. The CLKOUT signal is measured on the OSC2 pin.

CLKOUT is low for the Q1-Q2 period (1/2 TCY) and high for the Q3-Q4 period (1/2 TCY).

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-15: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.5 TO 5.5 V)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OS50 FPLLI PLL Input Frequency Range(2) 4

5(3)

—

7.5(4)

8.33(3)

7.5(4)

MHz

EC with 4x PLL

EC with 8x PLL

EC with 16x PLL

XT with 4x PLL

XT with 8x PLL

XT with 16x PLL

HS/2 with 4x PLL

HS/2 with 8x PLL

HS/2 with 16x PLL

HS/3 with 4x PLL

HS/3 with 8x PLL

HS/3 with 16x PLL

OS51 FSYS On-Chip PLL Output(2) 16 — 120 MHz EC, XT , HS/2, HS/3 modes

with PLL

OS52 TLOC PLL Start-up Time (Lock Time) — 20 50 μs

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data i n “Typ” column is at 5V, 25°C un les s ot he rwis e s t ate d. Pa ram ete rs are for des ig n gu ida nc e on ly and

are not tested.

3: Limited by oscillator frequency range.

4: Limited by device operating frequency range.

TABLE 23-16: PLL JITTER

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temp erature - 40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ(1) Max Units Conditions

OS61 x4 PLL — 0.251 0.413 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V

— 0.251 0.413 % -40°C ≤ TA ≤ +125°C VDD = 3.0 to 3.6V

— 0.256 0.47 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V

— 0.256 0.47 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V

x8 PLL — 0.355 0.584 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V

— 0.355 0.584 % -40°C ≤ TA ≤ +125°C VDD = 3.0 to 3.6V

— 0.362 0.664 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V

— 0.362 0.664 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V

x16 PLL — 0.67 0.92 % -40°C ≤ TA ≤ +85°C VDD = 3.0 to 3.6V

— 0.632 0.956 % -40°C ≤ TA ≤ +85°C VDD = 4.5 to 5.5V

— 0.632 0.956 % -40°C ≤ TA ≤ +125°C VDD = 4.5 to 5.5V

Note 1: These parameters are characterized but not tested in manufacturing.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-17: INTERNAL CLOCK TIMING EXAMPLES

Clock

Oscillator

Mode

FOSC

(MHz)(1) TCY (μsec)(2) MIPS(3)

w/o PLL MIPS(3)

w PLL x4 MIPS(3)

w PLL x8 MIPS(3)

w PLL x16

EC 0.200 20.0 0.05 — — —

4 1.0 1.0 4.0 8.0 16.0

10 0.4 2.5 10.0 20.0 —

25 0.16 6.25 — — —

XT 4 1.0 1.0 4.0 8.0 16.0

10 0.4 2.5 10.0 20.0 —

Note 1: Assumption: Oscillator Postscaler is divide by 1.

2: Ins truction Execution Cycle Time : TCY = 1 / MIPS.

3: Ins truction Ex ecution Frequency: MIPS = (FOSC * PLLx) / 4 (since there are 4 Q clocks per instruction

cycle).

TABLE 23-18: AC CHARACTERISTICS: INTERNAL FRC JITTER ACCURACY AND DRIFT(2)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temp erature - 40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

Internal FRC Jitter @ FRC Freq. = 7.37 MHz(1)

OS62 FRC — +0.04 +0.16 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V

—+

0.07 +0.23 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V

FRC with 4x PLL — +0.31 +0.62 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V

—+0.34 +0.77 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V

FRC with 8x PLL — +0.44 +0.87 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V

—+0.48 +1.08 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V

FRC with 16x PLL — +0.71 +1.23 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V

Internal FRC Accuracy @ FRC Freq. = 7.37 MHz(1)

OS63 FRC — — +0.75 % -40°C ≤ TA ≤ +125°C VDD = 3.0-5.5V

Internal FRC Drift @ FRC Freq. = 7.37 MHz(1)

OS64 -0.7 — 0.5 % -40°C ≤ TA ≤ +85°C VDD = 3.0-3.6V

-0.7 — 0.7 % -40°C ≤ TA ≤ +125°C VDD = 3.0-3.6V

-0.7 — 0.5 % -40°C ≤ TA ≤ +85°C VDD = 4.5-5.5 V

-0.7 — 0.7 % -40°C ≤ TA ≤ +125°C VDD = 4.5-5.5V

Note 1: Frequency calibrated at 7.372 MHz ±2%, 25°C and 5V. TUN bits (OSCCON<3:0>)can be used to

compensate for temperature drift.

2: Overall FRC variation can be calculated by adding the absolute values of jitter, accuracy and drift

percentages.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-5: CLKOUT AND I/O TIMING CHARACTERISTICS

TABLE 23-19: INTERNAL LPRC ACCURACY

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operati ng tem pera ture -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Characteristic Min Typ Max Units Conditions

LPRC @ Freq. = 512 kHz(1)

OS65 -20 — +40 % —

Note 1: Change of LPRC frequency as VDD changes.

Note: Refer to Figure 23-3 for load conditions.

I/O Pin

(Input)

I/O Pin

(Output)

DI35

Old Value New Value

DI40

DO31

DO32

TABLE 23-20: CLKOUT AND I/O TI MING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operati ng tem pera ture -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1)(2)(3) Min Typ(4) Max Units Conditions

DO31 TIOR Port output rise time — 7 20 ns —

DO32 TIOF Port output fall time — 7 20 ns —

DI35 TINP INTx pin high or low time (output) 20 — — ns —

DI40 TRBP CNx high or low time (input) 2 TCY ——ns —

Note 1: These parameters are asynchronous events not related to any internal clock edges

2: Measurements are taken in RC mode and EC mode where CLKOUT output is 4 x TOSC.

3: These parameters are characterized but not tested in manufacturing.

4: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP

TIMER TIMING CHARACTERISTICS

VDD

MCLR

Internal

POR

PWRT

Time-out

OSC

Time-out

Internal

RESET

Watchdog

Timer

RESET

SY11

SY10

SY20

SY13

I/O Pins

SY13

Note: Refer to Figure 23-3 for load conditions.

FSCM

Delay

SY35

SY30

SY12

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-7: BAND GAP START-UP TIME CHARACTERISTICS

TABLE 23-21: RESET, WATCHDOG TIMER, OSCILLATOR START-UP T IMER, POWER-UP TIMER

AND BROWN-OUT RESET TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SY10 TmcL MCLR Pulse Width (low) 2 — — μs -40°C to +85°C

SY11 TPWRT Power-up Timer Period 3

ms -40°C to +85°C

User program ma ble

SY12 TPOR Power On Reset Delay(3) 31030μs -40°C to +85°C

SY13 TIOZ I/O High-impedance from MCLR

Low or Watchdog Timer Reset —0.81.0μs

SY20 TWDT1 W at chdog Timer T ime -out Perio d

(No Prescaler) 1.8 2.0 2.2 ms VDD = 5V, -40°C to +85°C

TWDT2 1.9 2.1 2.3 ms VDD = 3V, -40°C to +85°C

SY25 TBOR Brown-out Reset Pulse Width(4) 100 — — μsVDD ≤ VBOR (D034)

SY30 TOST O scill ati on Start-u p Timer Period — 1024 TOSC ——TOSC = OSC1 period

SY35 TFSCM Fail-Safe Clock Monitor Delay — 500 900 μs -40°C to +85°C

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

3: Characterized by design but not tested

4: Refer to Figure 23-2 and Table 23-11 for BOR.

VBGAP

Enable Band Gap

Band Gap

(see Note)

Stable

Note: Set LVDEN bit (RCON<12>) or FBORPOR<7>set.

SY40

TABLE 23-22: BAND GAP ST ART-UP TIME REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SY40 TBGAP Ba nd Ga p Start-up Time — 40 65 µs Defined as the time betwe en the

instant that the band gap is enabled

and the moment that the band gap

reference voltage is stable.

RCON<13>Status bit

Note 1: These parameters are characterized but not tested in manufacturing.

2: Data in “Typ” column is at 5V, 25°C unless otherwise stated.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-8: TYPE A, B AND C TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS

Note: Refer to Figure 2 3-3 f or lo ad conditions.

Tx11

Tx15

Tx10

Tx20

TMRX OS60

TxCK

TABLE 23-23: TYPE A TIMER (TIMER1) EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operati ng tem pe rature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TA10 TTXH TxCK High Ti me Synchronous,

no presca ler 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA11 TTXL TxCK Low Time Synchronous,

no presca ler 0.5 TCY + 20 — — ns Must also meet

parameter TA15

Synchronous,

with prescaler 10 — — ns

Asynchronous 10 — — ns

TA15 TTXP TxCK Input Period Synchronous,

no presca ler TCY + 10 — — ns

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

———N = prescale

value

(1, 8, 64, 256)

Asynchronous 20 — — ns

OS60 Ft1 SOSC1/T1CK oscillator input

frequency range (oscillator enabled

by setting bit TCS (T1CON, bit 1))

DC — 50 kHz

TA20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY 1.5 TCY —

Note: Timer1 is a Type A.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-24: TYPE B TIMER (TIMER2 AND TIMER4) EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operati ng tem pe rature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TB10 TtxH TxC K H igh Time Sync hro nou s,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler 10 — — ns

TB11 Ttx L TxCK Low Time Synchronous,

no prescaler 0.5 TCY + 20 — — ns Must also meet

parameter TB15

Synchronous,

with prescaler 10 — — ns

TB15 TtxP TxCK Input Period Synchronous,

no prescaler TCY + 10 — — ns N = prescal e

value

(1, 8, 64, 256)

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

TB20 TCKEXT-

MRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY — 1.5 TCY —

Note: Timer2 and Timer4 are Type B.

TABLE 23-25: TYPE C TIMER (TIMER3 AND TIMER5) EXTERNAL CLOCK TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operati ng tem pera ture -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Typ Max Units Conditions

TC10 TtxH TxCK High Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC11 TtxL TxCK Low Time Synchronous 0.5 TCY + 20 — — ns Must also meet

parameter TC15

TC15 TtxP TxCK Input Period Synchronous,

no prescaler TCY + 10 — — ns N = prescale

value

(1, 8, 64, 256)

Synchronous,

with prescaler Greater of:

20 ns or

(TCY + 40)/N

TC20 TCKEXTMRL Delay from External TxCK Clock

Edge to Timer Increment 0.5 TCY —1.5

TCY —

Note: Timer3 and Timer5 are Type C.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-9: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS

FIGURE 23-10: OUTPUT COMPARE MODULE (OCx) TIMING CHARACTERISTICS

ICX

IC10 IC11

IC15

Note: Refer to Figure 23-3 for load conditions.

TABLE 23-26: INPUT CAPTURE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85° C for Industri al

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Max Units Conditions

IC10 TccL ICx Input Low Time No Prescaler 0.5 TCY + 20 — ns

With Prescaler 10 — ns

IC11 TccH ICx Input High Time No Prescaler 0 .5 TCY + 2 0 — ns

With Prescaler 10 — ns

IC15 TccP ICx Input Period (2 TCY + 40)/N — ns N = prescale

value (1, 4, 16)

Note 1: These parameters are characterized but not tested in manufacturing.

OCx

OC11 OC10

(Output Compare

Note: Refer to Figure 23-3 for load conditions.

or PWM Mode)

TABLE 23-27: OUTPUT COMPARE MODULE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Ope rati ng temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

OC10 TccF OCx Output Fall Time — — — ns See Parameter D032

OC11 TccR OCx Output Rise Time — — — ns S ee Parameter D031

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” column is at 5V, 25°C unles s otherwi se st ated. Para meters are for desi gn guida nce onl y and

are not tested.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-11: OC/PWM MODULE TIMING CHARACTERISTICS

OCFA/OCFB

OCx

OC20

OC15

TABLE 23-28: SIMPLE OC/PWM MODE TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Para

No.

Symb

ol Characteristic(1) Min Typ(2) Max Units Conditions

OC15 TFD Fault Input to PWM I/O

Change — — 50 ns —

OC20 TFLT Faul t Input Puls e Width 50 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” col umn i s at 5V, 25°C unle ss ot herwise st ated. Par ame ters ar e for des ign g uidanc e only and

are not tested.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-12: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING CHARACTERISTICS

COFS

CSCK

(SCKE =

)

CSCK

(SCKE =

)

CSDO

CSDI

CS11 CS10

CS40 CS41

CS21

CS20

CS35

CS21

MSb LSb

MSb IN LSb IN

CS31

HIGH-Z HIGH-Z

CS30

CS51 CS50

CS55

Note: Refer to Figure 23-3 for load conditi ons.

CS20

CS56

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-29: DCI MODULE (MULTICHANNEL, I2S MODES) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industri al

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

CS10 TcSCKL CSCK Input Low Time

(CSCK pin is an input) TCY / 2 +

20 ——ns —

CSCK Output Low Time(3)

(CSCK pin is an output) 30 — — ns —

CS11 TcSCKH CSCK Input High Time

(CSCK pin is an input) TCY / 2 +

20 ——ns —

CSCK Output High Time(3)

(CSCK pin is an output) 30 — — ns —

CS20 TcSCKF CSCK Output Fall Time(4)

(CSCK pin is an output) —1025ns —

CS21 TcSCKR CSCK Output Rise Time(4)

(CSCK pin is an output) —1025ns —

CS30 TcSDOF CSDO Data Output Fall Ti me(4) —1025ns —

CS31 TcSDOR CSDO Data Output Rise Ti me(4) —1025ns —

CS35 TDV Clock edge to CSDO data valid — — 10 ns —

CS36 TDIV Clock edge to CSDO tri-stated 10 — 20 ns —

CS40 TCSDI Setup time of CSDI data input to

CSCK edge (CSCK pin is input

or output)

20 — — ns —

CS41 THCSDI Hold time of CSDI d ata input to

CSCK edge (CSCK pin is input

or output)

20 — — ns —

CS50 TcoFSF COFS Fall Time

(COFS pin is output) —1025nsNote 1

CS51 TcoFSR COFS Rise Time

(COFS pin is output) —1025nsNote 1

CS55 TscoFS Setup time of COFS data input to

CSCK edge (COFS pin is input) 20 — — ns —

CS56 THCOFS Hold time of COFS data input to

CSCK edge (COFS pin is input) 20 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” column is at 5V, 25°C unle ss ot herwi se st ate d. Param eters a re for d esign guida nce o nly an d

are not tested.

3: The minimum clock period for CSCK is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all DCI pins.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-13: DCI MODULE (AC-LINK MODE) TIMING CHARACTERISTICS

SYNC

BIT_CLK

SDO

SDI

CS61 CS60

CS65 CS66

CS80

CS21

MSb IN

CS75

LSb

CS76

(COFS)

(CSCK)

LSb

MSb

CS72

CS71 CS70

CS76 CS75

(CSDO)

(CSDI)

CS62 CS20

TABLE 23-30: DCI MODULE (AC-LINK MODE) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85° C for Industri al

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1)(2) Min Typ(3) Max Units Conditions

CS60 TBCLKL BIT_CLK Low Time 36 40.7 45 ns —

CS61 TBCLKH BIT_CLK High Time 36 40.7 45 ns —

CS62 TBCLK BIT_CLK Period — 81.4 — ns Bit clock is input

CS65 TSACL Input Setup Time to

Falling Edge of BIT_CLK ——10ns —

CS66 THACL Input Hold Time from

Falling Edge of BIT_CLK ——10ns —

CS70 TSYNCLO SYNC Data Output Low Time — 19.5 — μsNote 1

CS71 TSYNCHI SYNC Data Output High Time — 1.3 — μsNote 1

CS72 TSYNC SYNC Data Output Period — 20.8 — μsNote 1

CS75 TRACL Rise Time, SYNC,

SDATA_OUT —1025 nsCLOAD = 50 pF, V DD = 5V

CS76 TFACL Fall Time, SYNC, SDATA_OUT — 10 25 ns CLOAD = 50 pF, VDD = 5V

CS77 TRACL Rise Time, SYNC,

SDATA_OUT —TBDTBD nsCLOAD = 50 pF, V DD = 3V

CS78 TFACL Fall Time, SYNC, SDATA_OUT — TBD TBD ns CLOAD = 50 pF, VDD = 3V

CS80 TOVDACL Output valid delay from rising

edge of BIT_CLK ——15ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: These values assume BIT_CLK frequency is 12.288 MHz.

3: Dat a in “Typ” colu mn is a t 5V, 25°C un less ot herwis e st ated. Par ameters are for d esign guidan ce onl y and

are not tested.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-14: SPI™ MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS

SCKx

(CKP = 0)

SCKx

(CKP = 1)

SDOx

SDIx

SP11 SP10

SP40 SP41

SP21

SP20

SP35

SP20

SP21

MSb LSb

BIT14 - - - - - -1

MSb IN LSb IN

BIT14 - - - -1

SP30

SP31

Note: Refer to Figure 23-3 for load co nditions .

TABLE 23-31: SPI™ MASTER MODE (CKE = 0) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operati ng tem per ature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCKX Output Low Time(3) TCY / 2 — — ns —

SP11 TscH SCKX Output High Time(3) TCY/2 — — ns —

SP20 TscF SCKX Output Fall Time(4) — — — ns See parameter D0 32

SP21 TscR SCKX Output Rise Time(4) — — — ns See parameter D031

SP30 TdoF SDOX Data Output Fall Ti me(4) — — — ns See parameter D032

SP31 TdoR SDOX Data Ou tput Rise Time(4) — — — ns See parame ter D0 31

SP35 TscH2doV,

TscL2doV SDOX Data Output Valid after

SCKX Edge ——30ns —

SP40 TdiV2scH,

TdiV2scL Setup Time of SDIX Data Input

to SCKX Edge 20 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIX Data Input

to SCKX Edge 20 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” colu mn is a t 5V, 25°C un less ot herwis e st ated. Par ameters are for d esign guidan ce onl y and

are not tested.

3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI™ pins.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-15: SPI™ MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS

SCKX

(CKP = 0)

SCKX

(CKP = 1)

SDOX

SDIX

SP36

SP30,SP31

SP35

MSb

MSb IN

BIT14 - - - - - -1

LSb IN

BIT14 - - - -1

LSb

Note: Refer to Figure 23-3 for load conditions.

SP11 SP10 SP20

SP21

SP20

SP40

SP41

TABLE 23-32: SPI™ MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industri al

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP10 TscL SCKX output low time(3) TCY/2 — — ns —

SP11 TscH SCKX output high time(3) TCY/2 — — ns —

SP20 TscF SCKX output fall time(4) — — — ns See parameter

D032

SP21 TscR SCKX output rise time(4) — — — n s See parameter

D031

SP30 TdoF SDOX data output fall time(4) — — — ns See parameter

D032

SP31 TdoR SDOX data output rise time(4) — — — ns See parameter

D031

SP35 TscH2doV,

TscL2doV SDOX data output valid after

SCKX edge — — 30 ns —

SP36 TdoV2sc,

TdoV2scL SDOX data output setup to

first SCKX edge 30 — — ns —

SP40 TdiV2scH,

TdiV2scL Setup time of SDIX data in put

to SCKX edge 20 — — ns —

SP41 TscH2diL,

TscL2diL Hold time of SDIX data input

to SCKX edge 20 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” colu mn is a t 5V, 25°C un less ot herwis e st ated. Par ameters are for d esign guidan ce onl y and

are not tested.

3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI™ pins.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-16: SPI™ MODULE SLAVE MODE (CKE = 0) T IMING CHARACTERISTICS

SCK

(CKP =

)

SCK

(CKP =

)

SDO

SDI

SP50

SP40 SP41

SP30,SP31 SP51

SP35

SDI

MSb LSb

BIT14 - - - - - -1

MSb IN BIT14 - - - -1 LSb IN

SP52

SP73

SP72

SP73

SP71 SP70

Note: Refer to Figure 23-3 for load conditions.

TABLE 23-33: SPI™ MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operati ng tem pe rature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscL SCKX Input Low Time 30 — — ns —

SP71 TscH SCKX Input High Time 30 — — ns —

SP72 TscF SCKX Input Fall Time(3) —1025ns —

SP73 TscR SCKX Input Rise Time(3) —1025ns —

SP30 TdoF SDOX Data Output Fall Time(3) — — — ns See parameter

D032

SP31 TdoR SDOX Data Output Rise Time(3) — — — ns See parameter

D031

SP35 TscH2doV,

TscL2doV SDOX Data Output Valid after

SCKX Edge ——30ns —

SP40 TdiV2scH,

TdiV2scL Setup Time of SDIX Data Input

to SCKX Edge 20 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIX Data Input

to SCKX Edge 20 — — ns —

SP50 TssL2scH,

TssL2scL SSX↓ to SCKX↑ or SCKX↓ Input 120 — — ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” c olu mn i s at 5V, 25 °C unless o the rw ise s t a ted. Paramete rs are fo r d es ign g uid anc e on ly a nd

are not tested.

3: Assumes 50 pF load on all SPI™ pins.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-17: SPI™ MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS

SP51 TssH2doZ SSX↑ to SDOX Out put

High-impedance(3) 10 — 50 ns —

SP52 TscH2ssH

TscL2ssH SSX after SCK Edge 1.5 TCY +

40 ——ns —

TABLE 23-33: SPI™ MODULE SLAVE MODE (CKE = 0) TIMING REQUIREMENTS (CONTINUED)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise stated)

Operati ng tem pe rature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” c olu mn i s at 5V, 25 °C unless o the rw ise s t a ted. Paramete rs are fo r d es ign g uid anc e on ly a nd

are not tested.

3: Assumes 50 pF load on all SPI™ pins.

SSX

SCKX

(CKP = 0)

SCKX

(CKP = 1)

SDOX

SDI

SP50

SP60

SDIX

SP30,SP31

MSb BIT14 - - - - - -1 LSb

SP51

MSb IN BIT14 - - - -1 LSb IN

SP35

SP52

SP73

SP72

SP73

SP71 SP70

SP40 SP41

Note: Refer to Figure 2 3-3 for load conditi ons.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-34: SPI™ MODULE SLAVE MODE (CKE = 1) TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operati ng tem pera ture -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

SP70 TscL SCKX Input Low Time 30 — — ns —

SP71 TscH SCKX Input High Time 30 — — ns —

SP72 TscF SCKX Input Fall Time(3) —1025ns —

SP73 TscR SCKX Input Rise Time(3) —1025ns —

SP30 TdoF SDOX Data Output Fall Time(3) — — — ns See param eter

D032

SP31 TdoR SDOX Data Output Rise Time(3) — — — ns See parameter

D031

SP35 TscH2doV,

TscL2doV SDOX Data Output Valid after

SCKX Edge — — 30 ns —

SP40 TdiV2scH,

TdiV2scL Setup Time of SDIX Data Input

to SCKX Edge 20 — — ns —

SP41 TscH2diL,

TscL2diL Hold Time of SDIX Data Input

to SCKX Edge 20 — — ns —

SP50 TssL2scH,

TssL2scL SSX↓ to SCKX↓ or SCKX↑ inpu t 120 — — ns —

SP51 TssH2doZ SS↑ to SDOX Output

High-impedance(4) 10 — 50 ns —

SP52 TscH2ssH

TscL2ssH SSX↑ after SCKX Edge 1.5 TCY + 40 — — ns —

SP60 TssL2doV SDOX Data Output Valid after

SSX Edge — — 50 ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” colum n is a t 5V, 25°C unless otherwi se st ated. Paramete rs are for d esign guidan ce onl y and

are not tested.

3: The minimum clock period for SCK is 100 ns. Therefore, the clock generated in Master mode must not

violate this specification.

4: Assumes 50 pF load on all SPI™ pins.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-18 : I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)

FIGURE 23-19 : I2C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE)

IM31 IM34

SCL

SDA

Start

Condition Stop

Condition

IM30 IM33

Note: Refer to Figure 23-3 for load conditions.

IM11 IM10 IM33

IM11 IM10

IM20

IM26 IM25

IM40 IM40 IM45

IM21

SCL

SDA

Out

Note: Re fer to Figure 23-3 for load conditions.

dsPIC30F6011A/6012A/6013A/6014A

)

TABLE 23-35: I2C™ BUS DATA TIMING REQUIREMENTS (MASTER MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min(1) Max Units Conditions

IM10 TLO:SCL Clock Low Time 100 kHz mode TCY / 2 (BRG + 1) — µs —

400 kHz mode TCY / 2 (BRG + 1) — µs —

1 MHz mode(2) TCY / 2 (BRG + 1) — µs —

IM11 THI:SCL Clock High Time 100 kHz mode TCY / 2 (BRG + 1) — µs —

400 kHz mode TCY / 2 (BRG + 1) — µs —

1 MHz mode(2) TCY / 2 (BRG + 1) — µs —

IM20 TF:SCL SDA and SCL

Fall Time 100 kHz mode — 300 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 100 ns

IM21 TR:SCL SDA and SCL

Rise Time 100 kHz mode — 1000 ns CB is specified to be

from 10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(2) — 300 ns

IM25 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns —

400 kHz mode 100 — ns

1 MHz mode(2) TBD — ns

IM26 THD:DAT Data Input

Hold Time 100 kHz mode 0 — ns —

400 kHz mode 0 0.9 µs

1 MHz mode(2) TBD — ns

IM30 TSU:STA Start Condition

Setup Time 100 kHz mode TCY / 2 (BRG + 1) — µs Only relevant for

repeated Star t

condition

400 kHz mode TCY / 2 (BRG + 1) — µs

1 MHz mode(2) TCY / 2 (BRG + 1) — µs

IM31 THD:STA Start Condit ion

Hold Time 100 kHz mode TCY / 2 (BRG + 1) — µs After this period the

first clock pulse is

generated

400 kHz mode TCY / 2 (BRG + 1) — µs

1 MHz mode(2) TCY / 2 (BRG + 1) — µs

IM33 TSU:STO Stop Condit ion

Setup Time 100 kHz mode TCY / 2 (BRG + 1) — µs —

400 kHz mode TCY / 2 (BRG + 1) — µs

1 MHz mode(2) TCY / 2 (BRG + 1) — µs

IM34 THD:STO Stop Condition 100 kHz mode TCY / 2 (BRG + 1) — ns —

Hold Time 400 kHz mode TCY / 2 (BRG + 1) — ns

1 MHz mode(2) TCY / 2 (BRG + 1) — ns

IM40 TAA:SCL Output Valid

From Clock 100 kHz mode — 3500 ns —

400 kHz mode — 1000 ns —

1 MHz mode(2) ——ns —

IM45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — µs Time the bus must be

free before a new

transmission can start

400 kHz mode 1.3 — µs

1 MHz mode(2) TBD — µs

IM50 CBBus Capacitive Loading — 400 pF

Note 1: BRG is the value of the I2C™ Baud Rate Generator. Refer to Section 21 “Inter-Integrated Circuit™

(I2C)” in the dsPIC30F Family Reference Manual (DS70046).

2: Maximum pin capacitance = 10 pF for all I2C pins (for 1 MHz mode only).

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-20 : I2C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE)

FIGURE 23-21 : I2C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)

IS31 IS34

SCL

SDA

Start

Condition Stop

Condition

IS30 IS33

IS30 IS31 IS33

IS11

IS10

IS20

IS26 IS25

IS40 IS40 IS45

IS21

SCL

SDA

Out

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-36: I2C™ BUS DATA TIMING REQUIREMENTS (SLAVE MODE)

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min Max Units Conditions

IS10 TLO:SCL Clock Low Time 100 kHz mode 4.7 — μs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 1.3 — μs Device must operate at a

minimum of 10 MHz.

1 MHz mode(1) 0.5 — μs—

IS11 THI:SCL Clock High Time 100 kHz mode 4.0 — μs Device must operate at a

minimum of 1.5 MHz

400 kHz mode 0.6 — μs Device must operate at a

minimum of 10 MHz

1 MHz mode(1) 0.5 — μs—

IS20 TF:SCL SDA and SCL

Fall Time 100 kHz mode — 300 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) — 100 ns

IS21 TR:SCL SDA and SCL

Rise Time 100 kHz mode — 1000 ns CB is specified to be from

10 to 400 pF

400 kHz mode 20 + 0.1 CB300 ns

1 MHz mode(1) — 300 ns

IS25 TSU:DAT Data Input

Setup Time 100 kHz mode 250 — ns —

400 kHz mode 100 — ns

1 MHz mode(1) 100 — ns

IS26 THD:DAT Data Input

Hold Time 100 kHz mode 0 — ns —

400 kHz mode 0 0.9 μs

1 MHz mode(1) 00.3μs

IS30 TSU:STA Start Condition

Setup Time 100 kHz mode 4.7 — μs Only relevant for repeated

Start condition

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.25 — μs

IS31 THD:STA Start Condition

Hold Time 100 kHz mode 4.0 — μs After this period the first

clock pulse is generated

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.25 — μs

IS33 TSU:STO Stop Condit ion

Setup Time 100 kHz mode 4.7 — μs—

400 kHz mode 0.6 — μs

1 MHz mode(1) 0.6 — μs

IS34 THD:STO Stop Condition 100 kHz mode 4000 — ns —

Hold Time 400 kHz mode 600 — ns

1 MHz mode(1) 250 ns

IS40 TAA:SCL Output Valid

From Clock 100 kHz mode 0 3500 ns —

400 kHz mode 0 1000 ns

1 MHz mode(1) 0 350 ns

IS45 TBF:SDA Bus Free Time 100 kHz mode 4.7 — μs Time the bus must be free

before a new transmission

can start

400 kHz mode 1.3 — μs

1 MHz mode(1) 0.5 — μs

IS50 CBBus Capacitive

Loading — 400pF —

Note 1: Maximum pin capacitance = 10 pF for all I2C™ pins (for 1 MHz mode only).

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-22: CAN MODULE I/O TIMING CHARACTERISTICS

CXTX Pin

(output)

CA10 CA11

Old Value New Value

CA20

CXRX Pin

(input)

TABLE 23-37: CAN MODULE I/O TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.5V to 5.5V

(unless otherwise st ated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic(1) Min Typ(2) Max Units Conditions

CA10 TioF Port Output Fall Time — — — ns See parameter D032

CA11 TioR Port Output Rise Time — — — ns See parameter D031

CA20 Tcwf Pulse Width to Trigger

CAN W ake-up Filter 500 ns —

Note 1: These parameters are characterized but not tested in manufacturing.

2: Dat a in “Typ” c olu mn i s at 5V, 25 °C unless o the rw ise s t a ted. Paramete rs are fo r d es ign g uid anc e on ly a nd

are not tested.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-38: 12-BIT ADC MODULE SPECIFICATIONS

AC CHARACTERISTICS

Standard Operating Conditions: 2.7V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Device Supply

AD01 AVDD Module VDD Supp ly Greater of

VDD - 0.3

or 2.7

— Lesser of

VDD + 0.3

or 5.5

V—

AD02 AVSS Module VSS Supply VSS - 0.3 — VSS + 0.3 V —

Reference Inputs

AD05 VREFH Reference Voltage High AVSS + 2.7 — AVDD V—

AD06 VREFL Reference Voltage Low AVSS —AVDD - 2.7 V —

AD07 VREF Absolute Reference

Voltage AVSS - 0.3 — AVDD + 0.3 V —

AD08 IREF Current Drain — 150

.001 200

1μA

μA operating

off

Analog Input

AD10 VINH-VINL Full-Scale Input Span VREFL VREFH VSee Note

AD11 VIN Absolute Input Voltage AVSS - 0.3 AVDD + 0.3 V —

AD12 — Leakage Current — ±0.001 ±0.610 μAVINL = AVSS = VREFL =

0V, AV DD = VREFH = 5V

Source Impedance =

2.5 KΩ

AD13 — Leakage Current — ±0.001 ±0.610 μAV

INL = AVSS = VREFL =

0V, AV DD = VREFH = 3V

Source Impedance =

2.5 KΩ

AD15 RSS Switch Resistance — 3.2K — Ω—

AD16 CSAMPLE Sample Capacitor — 18 pF —

AD17 RIN Recomm ended Im pedance

of Analog Voltage Source — — 2.5K Ω—

DC Accuracy

AD20 Nr Resolution 12 data bits bits

AD21 INL Integral Nonlinearity — — <±1 LSb VINL = AVSS = VREFL =

0V, AV DD = VREFH = 5V

AD21A INL Integral Nonlinearity — — <±1 LSb VINL = AVSS = VREFL =

0V, AV DD = VREFH = 3V

AD22 DNL Differential Nonlinearity — — <±1 LSb VINL = AVSS = VREFL =

0V, AV DD = VREFH = 5V

AD22A DNL Differential Nonlinearity — — <±1 LSb VINL = AVSS = VREFL =

0V, AV DD = VREFH = 3V

AD23 GERR Gain Error +1.25 +1.5 +3 LSb VINL = AVSS = VREFL =

0V, AV DD = VREFH = 5V

AD23A GERR Gain Error +1.25 +1.5 +3 LSb VINL = AVSS = VREFL =

0V, AV DD = VREFH = 3V

Note 1: The ADC conversion result never decreases with an increase in the input voltage, and has no missing

codes.

2: Parameters are characterized but not tested. Use as design guidance only.

dsPIC30F6011A/6012A/6013A/6014A

AD24 EOFF Offset Error -2 -1.5 -1.25 LSb VINL = AVSS = VREFL =

0V, AV DD = VREFH = 5V

AD24A EOFF Offset Error -2 -1.5 -1.25 LSb VINL = AVSS = VREFL =

0V, AV DD = VREFH = 3V

AD25 — Monotonicity(1) — — — — Guaranteed

AD26 CMRR Common-Mo de R eje cti on — TBD — dB —

AD27 PSRR Power Supply Rejection

Ratio —TBD— dB —

AD28 CTLK Channel to Channel

Crosstalk —TBD— dB —

Dynamic Performance

AD30 THD Total Harmoni c Distortion — -71 — dB See Note 2

AD31 SINAD Signal to Noise and

Distortion — 68 — dB See Note 2

AD32 SFDR Spurious Free Dynamic

Range — 83 — dB See Note 2

AD33 FNYQ Input Signal Bandwidth — — 100 kHz —

AD34 ENOB Effective Number of Bits 10.95 11.1 — bits —

TABLE 23-38: 12-BIT ADC MODULE SPECIFICATIONS (CONTINUED)

AC CHARACTERISTICS

Standard Operating Conditions: 2.7V to 5.5V

(unless otherwise stated)

Operating temperature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Note 1: The ADC conversion result never decreases with an increase in the input voltage, and has no missing

codes.

2: Parameters are characterized but not tested. Use as design guidance only.

dsPIC30F6011A/6012A/6013A/6014A

FIGURE 23-23: 12-BIT ADC TIMING CHARACTERISTICS (ASAM = 0, SSRC = 000)

AD55

TSAMP

Clear SAMPSet SAMP

AD61

ADCLK

Instruction

SAMP

ch0_dischrg

ch0_samp

AD60

DONE

ADIF

ADRES(0)

1 2 3 4 5 6 87

1– Software sets ADCON. SAMP to start sampling.

2– Sampling starts after discharge period.

3– Software clears ADCON. SAMP to start conversion.

4– Sampling ends, conversion sequence starts.

5– Convert bit 11.

9– One TAD for end of conversion.

AD50

eoc

6– Convert bit 10.

7– Convert bit 1.

8– Convert bit 0.

Execution

TSAMP is described in the dsPIC30F Family Reference Manual (DS70046), Sec tion 18.

dsPIC30F6011A/6012A/6013A/6014A

TABLE 23-39: 12-BIT ADC TIMING REQUIREMENTS

AC CHARACTERISTICS

Standard Operating Conditions: 2.7V to 5.5V

(unless otherwise stated)

Operati ng tem pe rature -40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

No. Symbol Characteristic Min. Typ Max. Units Conditions

Clock Parameters

AD50 TAD ADC Clock Period 334 — ns VDD = 3-5.5V (Note 1)

AD51 tRC ADC Internal RC Oscillator Period 1.2 1.5 1.8 μs—

Conversion Rate

AD55 tCONV Conversion Time — 14 TAD ns —

AD56 FCNV Throughput Rate — 200 — ksps VDD = VREF = 3-5.5V

AD57 TSAMP Samp le Time — 1 TAD —nsVDD = 3-5.5V

Source resistance

Rs = 0-2.5 kΩ

Timing Parameters

AD60 tPCS Conversion Start from Sample

Trigger —1 TAD —ns —

AD61 tPSS Sample Start from Setting

Sample (SAMP) Bit 0.5 TAD —1.5

TAD ns —

AD62 tCSS Conversion Completion to

Sample Start (ASAM = 1)—0.5 TAD —ns —

AD63 tDPU Time to Stabili z e Analog Stage

from ADC Off to ADC On —20—μs—

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz can affect linearity

performance, especially at elevated temperatures.

dsPIC30F6011A/6012A/6013A/6014A

24.0 PACKAGING INFORMATION

24.1 Package Marking Information

Legend: XX...X Customer specific information*

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week c ode (week of January 1 is we ek ‘01’)

NNN Alphanumeric traceability code

Note: In the event the fu ll Mic rochip part n umber cann ot be mark ed on one line, it wil l

be carried over to the next line thus limiting the number of available characters

for customer specific information.

*Standard device marking consists of Microchip part number, year code, week code, and traceability

code. For device marking beyond this, certain price adders apply. Please check with your Microchip

Sales Office. For QTP devices, any special marking adders are included in QTP price.

XXXXXXXXXXXX

YYWWNNN

64-Lead TQFP

dsPIC30F6011A

-30I/PF

0512XXX

Example

XXXXXXXXXXXX

YYWWNNN

80-Lead TQFP

dsPIC30F6014A

-30I/PF

0512XXX

Example

dsPIC30F6011A/6012A/6013A/6014A

64-Lead Plastic Thin Quad Flatp ack 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-026

Drawing No. C04-085

1510515105

Mold Draft Angle Bottom 1510515105

Mold Draft Angle Top

0.270.220.17.011.009.007BLead Width 0.230.180.13.009.007.005

Lead Thickness

1616n1Pins per Side

10.1010.009.90.398.394.390D1Molded Package Length 10.1010.009.90.398.394.390E1Molded Package Width 12.2512.0011.75.482.472.463DOverall Length 12.2512.0011.75.482.472.463EOverall Width 73.5073.50

Foot Angle

0.750.600.45.030.024.018LFoot Length 0.250.150.05.010.006.002A1Standoff § 1.051.000.95

.041.039.037A2Molded Package Thickness 1.201.101.00.047.043.039AOverall Height

0.50.020

Pitch 6464

Number of Pin s MAXNOMMINMAXNOMMINDi m en sion Limi ts MILLIMETERS*INCHESUnits

DD1

#leads=n1

CH x 45°

βφ

(F)

Footprint (Reference) (F) .039 1.00

Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14

§ Significant Characteristic

dsPIC30F6011A/6012A/6013A/6014A

64-Lead Plastic Thin Quad Flatp ack 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-026

Drawing No. C04-085

13 11

Mold Draft Angle Bottom 1311 11

Mold Draft Angle Top

0.450.320.30.018.013.019BLead Width 0.20 0.09 .008 .004

Lead Thickness

1616n1Pins per Side

14.00 .551 D1Molded Package Length 14.00 .551 E1Molded Package Width 16.00 .630 DOverall Length 16.00 .630 EOverall Width 7 07 0

Foot Angle

0.750.600.45.030.024.018LFoot Length 0.15 0.05.006 .002A1Standoff § 1.051.000.95.041.039

.037A2Molded Package Thickness 1.20.047 AOverall Height

0.80.032

Pitch 6464

Number of Pins MAXNOMMINMAXNOMMIND imension Limits MILLIMETERS*INCHESUnits

DD1

#leads=n1

CH x 45°

βφ

(F)

Footpri nt (Ref ere nce ) (F) .039 1.00

Pin 1 Corner Chamfer CH

§ Significant Characteristic

11 13

dsPIC30F6011A/6012A/6013A/6014A

80-Lead Plastic Thin Quad Flatpack 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-026

Drawing No. C04-092

1.101.00.043.039

1.140.890.64.045.035.025CHPin 1 Corner Chamfer

1.00.039

(F)

Footprint (Reference)

(F)

#leads=n1

D1 D

βL

A1 A2

Units INCHES MILLIMETERS*

Dimen sion Li mits M IN NOM MAX MIN NOM MAX

Number of Pin s n80 80

Pitch p.020 0.50

Overall Height A .047 1.20

Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05

Standoff § A1 .002 .004 .006 0.05 0.10 0.15

Foot Length L .018 .024 .030 0.45 0.60 0.75

Foot Angle φ03.5 7 03.5 7

Overall Width E .541 .551 .561 13.75 14.00 14.25

Overal l Length D .541 .551 .56 1 13.75 14.00 1 4.2 5

Molded Package Width E1 .463 .472 .482 11.75 12.00 12.25

Molded Package Length D1 .463 .472 .482 11.75 12.00 12.25

Pins per Side n1 20 20

Lead Thickness c.004 .006 .008 0.09 0.15 0.20

Lead Width B .007 .009 .011 0.17 0.22 0.27

Mold Draft Angle Top α5 10 15 5 10 15

Mold Draft Angle Bottom β5 10 15 5 10 15

CH x 45°

§ Significant Characteristic

dsPIC30F6011A/6012A/6013A/6014A

80-Lead Plastic Thin Quad Flatpack 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)

* Controlling Parameter

Notes:

Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-026

Drawing No. C04-092

CHPin 1 Corner Chamfer

1.00.039

(F)

Footprint (Reference)

(F)

#leads=n1

D1 D

βL

A1 A2

Units INCHES MILLIMETERS*

Dimen sion Li mits M IN NOM MAX MIN NOM MAX

Number of Pin s n80 80

Pitch p.026 0.65

Overall Height A .047 1.20

Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05

Standoff § A1 .002 .006 0.05 0.15

Foot Length L .018 .024 .030 0.45 0.60 0.75

Foot Angle φ0 7 0 7

Overall Width E .6 30 16 .00

Overall Len gth D .630 16.00

Molded Package Width E1 .551 14.00

Molded Package Length D1 . .551 14.00

Pins per Side n1 20 20

Lead Thickness c.004 .008 0.09 0.20

Lead Width B .009 .013 .015 0.22 0.32 0.38

Mold Draft Angle Top α11 13 11 13

Mold Draft Angle Bottom β11 13 11 13

CH x 45°

§ Significant Characteristic

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

© 2005 Microchip Technology Inc. Preliminary DS70143B-page 221
dsPIC30F6011A/6012A/6013A/6014A
APPENDIX A: REVISION HISTORY
Revision A (January 2005)
Origina l data s heet for dsPIC 30F6011A, 60 12A, 6013A
and 6014A devices.
Revision B (September 2005)
Revision B of this data sheet reflects these changes:
• 12-Bit ADC allows up to 200 ksps sampling rate 
(see Section 19.6 “Selecting the ADC Conver-
sion Clock” and Sectio n 19.7 “ADC Speeds”),
• FRC Oscillator revised to allow tuning in ±0.75% 
increments (see Section 20.2.5 “Fast RC Oscil-
lator (FRC)” and Table 20-4).
• Revised electrical characteristics:
- Operating Current (IDD) (see Table 23-5)
- Idle Current (IIDLE) (see Table 23-6)
- Power-Down Current (IPD) (seeTable 23-7)
- Brown-Out Reset (BOR) (see Table 23-11)
- External Clock Timing Require me nt s  (see 
Table 23-14)
- PLL C lock Timing Specifictation (VDD = 2.5-
5.5 V) (see Table 23-15)
- PLL Jitter (seeTable 23-16 )
- Internal FRC Jitter Accuracy and Drift (see 
Table 23-18)
- 12-Bit ADC Module Specifications (see 
Table 23-38)
- 12-Bit A DC Conver sion T iming  Requirement s 
(see Table 23-39)

dsPIC30F6011A/6012A/6013A/6014A

NOTES:

dsPIC30F6011A/6012A/6013A/6014A

APPENDIX B: DEVICE

COMPARISONS

This appendix outlines the differences between the

dsPIC30F6011 and the dsPIC30F6011A (Table B-1),

between the dsPIC30F6012 and the dsPIC30F6012A

(Table B-2), between the dsPIC30F6013 and the

dsPIC30F6013A (Table B-3) and between the

dsPIC30F6014 and the dsPIC30F6014A (Table B-4).

Differences are highlighted in the tables.

TABLE B-1: dsPIC30F6011 AND dsPIC30F6011A COMPARISON

TABLE B-2: dsPIC30F6012 AND dsPIC30F6012A COMPARISON

Features dsPIC30F6011 dsPIC30F6011A

Program Memory (K Bytes) 132 132

Data Memory (Bytes) 6144 6144

Data EEPROM (Bytes) 2048 2048

Timers (16-bit) 5 5

Input Capture Channels 8 8

Output Compare/Standard PWM Channels 8 8

Codec Interface — —

ADC 12-bit 100 ksps 16 channels 16 channels

UART 2 2

SPI™ 2 2

I2C™ 1 1

CAN 2 2

PGC (ICSP Clock Input)

PGD (ICSP Data Input/Outp ut) RB1/AN1

RB0/AN0 RB6/AN6

RB7/AN7

Packages 64-pin TQFP (14x14x1mm) 64-pin TQFP (14x14x1mm)

64-pin TQFP (10x10x1mm)

I/O Pins (max) 52 52

Features dsPIC30F6012 dsPIC30F6012A

Program Memory (K Bytes) 144 144

Data Memory (Bytes) 8192 8192

Data EEPROM (Bytes) 4096 4096

Timers (16-bit) 5 5

Input Capture Channels 8 8

Output Compare/Standard PWM Channels 8 8

Codec Interface AC97, I2S AC97, I2S

ADC 12-bit 100 ksps 16 channels 16 channels

UART 2 2

SPI™ 2 2

I2C™ 1 1

CAN 2 2

PGC (ICSP Clock Input)

PGD (ICSP Data Input/Outp ut) RB1/AN1

RB0/AN0 RB6/AN6

RB7/AN7

Packages 64-pin TQFP (14x14x1mm) 64-pin TQFP (14x14x1mm)

64-pin TQFP (10x10x1mm)

I/O Pins (max) 52 52

dsPIC30F6011A/6012A/6013A/6014A

TABLE B-3: dsPIC30F6013 AND dsPIC30F6013A COMPARISON

TABLE B-4: dsPIC30F6014 AND dsPIC30F6014A COMPARISON

Features dsPIC30F6013 dsPIC30F6013A

Program Memory (K Bytes) 132 132

Data Memory (Bytes) 6144 6144

Data EEPROM (Bytes) 2048 2048

Timers (16-bit) 5 5

Input Capture Channels 8 8

Output Compare/Standard PWM Channels 8 8

Codec Interface — —

ADC 12-bit 100 ksps 16 channels 16 channels

UART 2 2

SPI™ 2 2

I2C™ 1 1

CAN 2 2

PGC (ICSP Clock Input)

PGD (ICSP Data Input/Outp ut) RB1/AN1

RB0/AN0 RB1/AN1

RB0/AN0

Packages 80-pin TQFP (14x14x1mm) 80-pin TQFP (14x14x1mm)

80-pin TQFP (12x12x1mm)

I/O Pins (max) 68 68

Features dsPIC30F6014 dsPIC30F6014A

Program Memory (K Bytes) 144 144

Data Memory (Bytes) 8192 8192

Data EEPROM (Bytes) 4096 4096

Timers (16-bit) 5 5

Input Capture Channels 8 8

Output Compare/Standard PWM Channels 8 8

Codec Interface AC97, I2S AC97, I2S

ADC 12-bit 100 ksps 16 channels 16 channels

UART 2 2

SPI™ 2 2

I2C™ 1 1

CAN 2 2

PGC (ICSP Clock Input)

PGD (ICSP Data Input/Outp ut) RB1/AN1

RB0/AN0 RB1/AN1

RB0/AN0

Packages 80-pin TQFP (14x14x1mm) 80-pin TQFP (14x14x1mm)

80-pin TQFP (12x12x1mm)

I/O Pins (max) 68 68

dsPIC30F6011A/6012A/6013A/6014A

APPENDIX C: MIGRATION FROM

dsPIC30F601x TO

dsPIC30F601xA

DEVICES

The dsPIC30F601xA devices supercede the

dsPIC30F601x devices. The “A” version of the silicon is

identical in nearly all aspects compared to the

dsPID30F601x devices. Review the latest

dsPIC3 0F601x Silicon Errat a document s posted on the

Microc hip web to see what is fix ed i n the “A” v ers ion of

the silicon. This appendix describes the differences

betwee n the dsPIC30F 6011, 6012, 6013 and 60 14 and

the dsPIC30F6011A, 6012A, 6013A and 6014A

devi ce s, res pec tiv ely.

C.1 PGC and PGD Programming Pins

The Programming Clock (PGC) and Data (PGD) pins

for the dsPIC30F6011A and dsPIC30F6012A devices

have been moved relative to the dsPIC30F6011 and

dsPIC30F6012 devices, respectively. The PGC/EMUC

function is now provided on the AN6/OCFA/RB6 pin

and the PGD/EMUD function is now provided on the

AN7/RB7 pin for the dsPIC30F6011A and

dsPIC30F6012A devices. Programming of these two

devices must use the new PGC/EMUC and PGD/

EMUD pins.

The PGC/EMUC and PGD/EMUD pins on the

dsPIC30F6013A and dsPIC30F6014A devices have

not been changed relative to the dsPIC30F6013 and

dsPIC30F6014 devices, respectively.

C.2 Code Compatibi li ty

For the most part, dsPIC30F code developed with the

MPLAB C30 C Compiler and MPLAB ASM30 Assem-

bler is directly portable between the dsPIC30F601x

and dsPIC 30F601xA devic es. However , in som e cases

small changes may be required depending on which

featur es hav e been en hance d. To mi grate sou rce code

to the “A” version of the devices, perform these two

steps:

1. Include the appropriate dsPIC30F601xA device

header (.h), linker (.gld) and include (.inc)

files in the source code files.

2. Remove any workarounds implemented in

source code or MPLAB C30 Compiler com-

mand-line options for errata described in the

dsPIC30F6 011/6012/6013/ 6014 R ev. B2 Silico n

Errata (DS80198B) document.

Other changes are called out in this section. Read the

latest dsPIC30F601xA Silicon Errata documents

posted on the Microchip web site.

C.3 Oscillator Operation

Several oscillator modes have been added to the

dsPIC30F601xA devices:

• FRC with x4, x8 and x16 PLL mode

• HS/2 with x4, x8 and x16 PLL mod e

• HS/3 with x4, x8 and x16 PLL mod e

The new oscillator modes are presented in

Section 20.0 "System Integration".

In support of the FRC, the OSCTUN Special Function

four FRC tuni ng bit s (TUN <4:1>). Th is is a ne w feature

and hen ce there are no code or o peratio nal c omp atibi l-

ity issues to address.

Another important change deals with the OSCCON

SFR. Bits have been added to both the COSC and

NOSC fun ctional definit ions. Use the “A” d evice header

(.h), linker (.gld) and include (.inc) files to achieve

code portability with the OSCCON SFR.

C.4 Device Configuration Registers

In suppo rt of the ne w Oscillato r modes, the F OSC Con-

figuration Register has been modified. The

dsPIC30F6011A/6012A/6013A/6014A device header

and incl ude files provide the updated bit field defi nitions

and macros for the device Configuration Registers.

Please refer to these new macros when embedding

specific device configuration information in the C and

Assembly source files.

C.5 Electrical Characteri stics

The dsPI C30F6011A/6012A/6013 A/6014A de vices are

rated at 30MIPs @ 4.5-5.5Vdc and 20MIPs @

3.0-3.6Vdc for the Industrial Temperature range.

Even though compatible devices are tested to the

same electrical specifications, the device characteris-

tics may have changed due to normal process varia-

tions. These differences should not affect the systems

that were designed well within the device specifica-

tions. For systems that operate close to or outside the

specification limits, manufacturing differences may

cause the device to behave differently.

Note: Oscillator operation should be verified to

ensure that it starts and performs as

expected. Y o u may need to adjust the loa d

capacitor and/or the Oscillator mode to

achieve the proper values.

dsPIC30F6011A/6012A/6013A/6014A

C.6 Device Packages

The dsP IC30F 6011A/601 2A/6013A/60 14A devi ces are

of fe red in the foll owi ng TQF P pa ckages:

dsPIC30F6011A/6012A:

• 64-pin TQFP 10x10x1mm (new designs)

• 64-pin TQFP 14x14x1mm (migration support)

dsPIC30F6013A/6014A:

• 80-pin TQFP 12x12x1mm (new designs)

• 80-pin TQFP 14x14x1mm (migration support)

Refer to Section 24.0 "Packaging Information" for

details on these packages .

© 2005 Microchip Technology Inc. DS70143B-page 227
dsPIC30F6011A/6012A/6013A/6014A
INDEX
A
AC Characteristics............................................................187
Internal FRC Jitter, Accuracy and Drift .....................190
Internal LPRC Accuracy............................................191
Load Conditions...................... ....... .. .. .. .. .. .. ....... .. .. .. ..187
AC Temperature and Voltage Specifications....................187
AC-Link Mode Operation ............................... .. .. ....... .. .. ....130
16-bit Mode...............................................................130
20-bit Mode...............................................................130
ADC ..................................................................................133
Aborti n g  a  Conver sion .. ............... ................... ..........135
ADCHS Register.......................................................133
ADCON1 Register.....................................................133
ADCON2 Register.....................................................133
ADCON3 Register.....................................................133
ADCSSL Register.....................................................133
ADPCFG Register.....................................................133
Configuring Analog Port Pins..............................64, 140
Connection Considerations.......................... ....... .. ....140
Conversi o n  Op eration... ................... ............... ..........134
Effects of a Reset......................................................139
Operation During CPU Idle Mode.............................139
Operation During CPU Sleep Mode..........................139
Output Fo rmats..... .............. ....................... ...............139
Power-down Modes. .................................................139
Programming the Start of Conversion Trigger..........135
Register Map............... ................... ....................... ....141
Result Buffer..................... ................... ................... ..134
Sampling Requirements....................... .. .... .. ....... .. .. ..138
Selec t i n g  th e  C o n ve r sion C l o ck.... ...... ...... .. ..... ...... .. .135
Selecting the Conversion Sequence.........................134
ADC Conversion Speeds..................................................136
Address Generator Units ....................................................39
Alternate Vector Table........................................................49
Analog-to-Digital Converter. See ADC.
Assembler
MPASM Assembler...................................................172
Automatic Clock Stretch ......................................................98
During 10-bit Addressing (STREN = 1).......................98
During 7-bit Addressing (STREN = 1).........................98
Receive Mode.............................................................98
Transmit Mode... ........................ .................. ...............98
B
Band Gap Start-up Time
Requirements............................................................193
Timing Cha racteris tics ............ ............... ............... ....193
Barrel Shifter.......................................................................23
Bit-Reversed Add ressing.............. ................... ...................42
Example......................................................................43
Implementation ...........................................................42
Modifier Values Table... ................... ....................... ....43
Sequence Table (16-Entry).......................... ......... .... ..43
Block Diagrams
12-bit ADC Functional...............................................133
16-bit Timer1 Module..................................................70
16-bit Timer2...............................................................75
16-bit Timer3...............................................................75
16-bit Timer4...............................................................80
16-bit Timer5...............................................................80
32-bit Timer2/3............................................................74
32-bit Timer4/5............................................................79
CAN Buffers and Protocol Engine.............................112
DCI Module................... .. ..... .. .. .. .. .. .. .. ..... .. .... .. .. .. .. .. .. 124
Dedica te d  Po rt Stru cture........... ........................... ...... 63
DSP Engine............ ....................... ....................... ...... 20
dsPIC30F6011A/6012A.............................................. 10
dsPIC30F6013A/6014A.............................................. 11
External Power-on Reset Circuit .............................. 156
I2C .............................................................................. 96
Input Capture Mode.................................................... 83
Oscillat o r Sys tem.... ............... .......... ............... .......... 145
Output Com p a re Mode.......... ................... .................. 87
Reset System........................ ....................... ............ 153
Shared Po rt Structure........ ........................... .............. 64
SPI.............................................................................. 92
SPI Master/Slave Connection . .................................... 92
UART Receiver......................................................... 104
UART Transmitter..................................................... 103
BOR. See Brown-out Reset
Brown-o u t Re set................... ................... ................... ...... 143
Characteristics.................................................. 185, 186
Timing Re q uirements . ............... ................... ............ 193
C
C Compilers
MPLAB C18........ ....................... ....................... ........ 172
MPLAB C30........ ....................... ....................... ........ 172
CAN Module ....................... .... ....... .. .... .. .... .. ....... .... .. .... .. .. 111
Baud Rate Setting .................................................... 116
CAN1 Registe r  Map.... ............... ............... ................ 118
CAN2 Registe r  Map.... ............... ............... ................ 120
Frame Types ............................................................ 111
I/O Timin g  Chara cteris tics....... ................... .............. 210
I/O Timing Requirements.................................. .... .. .. 210
Message Reception.................................................. 114
Message Transmission............................................. 115
Modes of Ope ration.... ............... ................... ............ 113
Overview................................................................... 111
CLKOUT and I/O Timing
Characteristics.......................................................... 191
Requirements........................................................... 191
Code Examples
Data EEPRO M Block Erase.... .......... ................... ...... 58
Data EEPRO M Block Write..... ................... ................ 60
Data EEPRO M Read...... ................... ................... ...... 57
Data EEP RO M Word Er a se ........................... ............ 58
Data EEPRO M Word Write ......... ................... ............ 59
Erasing a Row of Program Memory ........................... 53
Initiating a Programming Sequence ................... .. .. .... 54
Loading Write Latches............. .. .. .... .. .. ..... .. .... .. .. .. .. .. .. 54
Code Protection................................................................ 143
Core Architecture
Overview..................................................................... 15
CPU Archit e ct u re Overview..................... ............... ............ 15
Customer Change Notification Service............................. 233
Customer Support............................ .... .... .... ........... .... ...... 233

dsPIC30F6011A/6012A/6013A/6014A
DS70143B-page 228 © 2005 Microchip Technology Inc.
D
Data Accumulators and Adder/Subtractor...........................21
Data Space Write Saturatio n .... ................... ...............23
Overflow and Saturation ......... .... .... ........... .... .... .........21
Round Logic................................................................22
Write Back...................................................................22
Data Address Space...........................................................31
Alignment....................................................................34
Alignment (Figure) ......................................................35
Effect of Invalid Memory Accesses (Table) .................34
MCU and DSP (MAC Class) Instructions Example.....34
Memory Map...............................................................31
Memory Map for dsPIC30F6011A/6013A...................32
Memory Map for dsPIC30F6012A/6014A...................33
Near Data Space ........................................................35
Softwa re Stack......... ....................... ................... .........35
Spaces........................................................................31
Width...........................................................................34
Data Converter Interface (DCI) Module .... ........................123
Data EEPROM Memory......................................................57
Erasing........................................................................58
Erasing, Block.............................................................58
Erasing, Word.............................................................58
Protection Agai n s t Spurious  Write ............... ...............61
Reading.......................................................................57
Write Verify .................................................................61
Writing.........................................................................59
Writing , Block.................... ................... .......................60
Writing , Wo rd ..... ............... ................... ................... ....59
DC Characteristics............................................................175
Brown-out Reset ...............................................185, 186
I/O Pin Input Specifications.......................................183
I/O Pin Output Specifications....................................184
Idle Current (IIDLE) ....................................................180
Low-Voltage Detect...................................................184
LVDL.........................................................................185
Operating Current (IDD).............................................177
Power-Down Current (IPD)........................................182
Program and EEPROM.............................................186
DCI Module
Bit Clock Generator.......................................... .... .....127
Buffer Alignment with Data Frames..........................129
Buffe r Con trol............................ ................... .............123
Buffe r Data  Alignment........................ .................. .....123
Buffer Length Control.................... ....... .... .. .. .... .. .......129
COFS Pin........................ ................... .................. .....123
CSCK Pin........................ ................... .................. .....123
CSDI Pin........ ............... .............. ............... ...............123
CSDO Mode Bit ........................................................130
CSDO Pin .................................................................123
Data Justification Control Bit.....................................128
Device Frequencies for Common Codec 
CSCK Frequencies (Table)...............................127
Digital Loopback Mode ............................ .... .. .... .......130
Enable.......................................................................125
Frame Sync Generator .............................................125
Frame Sync Mode Control Bits.................................125
I/O Pi n s...... .............. ....................... ........................ ..123
Interrupts...................................................................130
Introduction ...............................................................123
Master Frame Sync Operation..................................125
Operation ..................................................................125
Operation During CPU Idle Mode.............................130
Operation During CPU Sleep Mode..........................130
Receive Slot Enable Bits............................ .... .. .... .....128
Receive St a tu s Bits............... ................... ................. 129
Register Map ..... ................... ................... ................. 132
Sample Clock Edge Control Bit ................. ....... .... .. .. 128
Slave Fra me Sync Opera tion..... .................. ............. 12 6
Slot Enable Bits Operation with Frame Sync . ........... 128
Slot St a tus Bits......... ................... ....................... ......130
Synchronous Data Transfers.................................... 128
Timing Characteristics
AC-Li n k Mode............... ....................... ............. 200
Multichannel, I2S Modes................ .. .... ..... .. .. .. .. 198
Timing Requirements
AC-Li n k Mode............... ....................... ............. 200
Multichannel, I2S Modes................ .. .... ..... .. .. .. .. 199
Transmit Slot Enable Bits ......................................... 128
Transmit Status Bits.................................................. 129
Transmit/Receive Shift Register............................... 123
Underflow Mode Control Bit................... .. .... ....... .. .. ..130
Word Size Selection Bits.......................................... 125
Development Support....................................................... 171
Device Configuration
Register Map ..... ................... ....................... ............. 161
Device Configuration Registers........................................ 159
FBORPOR................................................................ 159
FGS .......................................................................... 159
FOSC........................................................................ 159
FWDT ....................................................................... 159
Device Overview1, 9, 15, 25, 39, 45, 51, 57, 63, 69, 73, 79, 83, 
87, 91, 95, 103, 111, 123, 133, 163
Disabling th e  UART.......... .............. ............... ............... .... 105
Divide Support . .. .. .... .. ....... .... .. .... .. ....... .... .. .... .. .... ....... .. .... .. 18
Instruction s (Ta b l e )......... ................... ................... ...... 18
DSP Engine.................... ....................... ....................... ...... 1 9
Multiplier ..................................................................... 21
Dual Output Compare Match  Mod e........................ ............ 88
Continuous Pulse Mode....................... .... .. ....... .... .... .. 88
Single Pulse Mode ...................................................... 88
E
Electrical Characteristics .................................................. 175
AC............................................................................. 187
DC ............................................................................ 175
Enabling and Setting Up UART
Setting Up Data, Parity and Stop Bit Selections....... 105
Enabling the UART........................................................... 105
Equations
ADC Convers io n  Cl o ck..... ........... ................... .......... 135
Baud Rate................................................................. 107
Bit Clock Frequency................................... ........... .... 127
COFSG Perio d ...................... ....................... ............. 125
Serial Clock Rate...................................................... 100
Time Quantum for Clock Generation...................... .. 117
Errata.................................................................................... 8
External Clock Timing Characteristics
Type A, B and C Timer............................................. 194
Exter n a l  C l o c k Timi n g  Requireme n ts ....... ...... ...... ..... ...... . 188
Type A Timer............................................................ 194
Type B Timer............................................................ 195
Type C Timer............................................................ 195
External Interrupt Requests................................................ 49

© 2005 Microchip Technology Inc. DS70143B-page 229
dsPIC30F6011A/6012A/6013A/6014A
F
Fast Context Saving............................................................49
Flash Pr o g ram Memory .................. ............................ ........51
Control Reg isters.... .......... ............... ............... ............52
NVMADR ............................................................52
NVMADRU..........................................................52
NVMCON............................................................52
NVMKEY.............................................................52
I
I/O Pin Specifications
Input..........................................................................183
Output.......................................................................184
I/O Ports............. ....................... ....................... ...................63
Paral l e l  (P IO) ... ............... ................... ....................... ..63
I2C 10-bit Slave Mode Operation........................................97
Reception....................................................................98
Transmission...............................................................97
I2C 7-bit Slave Mode Operation..........................................97
Reception....................................................................97
Transmission...............................................................97
I2C Master Mode Operation................................................99
Baud Rate Generator................................................100
Clock Arbitration........................................................100
Multi-Master Communication, Bus Collision 
and Bus Arbitration ... .... ............. .... ...... ........... ..100
Reception....................................................................99
Transmission...............................................................99
I2C Master Mode Support ...................................................99
I2C Module..........................................................................95
Addresses...................................................................97
Bus Data Timing Characteristics
Master Mode.....................................................206
Slave Mode.......................................................208
Bus Data Timing Requirements
Master Mode.....................................................207
Slave Mode.......................................................209
Bus Start/Stop Bits Timing Characteristics
Master Mode.....................................................206
Slave Mode.......................................................208
General Call Address Support....................................99
Interrupts.....................................................................98
IPMI Support............................................ ............... ....99
Operating Function Description ..................................95
Operation During CPU Sleep and Idle Modes..........100
Pin Configuration ........................................................95
Programmer’s Model...................................................95
Register Map............... ................... ....................... ....101
Registers.....................................................................95
Slope Control..............................................................99
Software Controlled Clock Stretching (STREN = 1)....98
Various Modes.......... .. .... .... .. ......... .... .. .... .... ....... .... .. ..95
I2S Mode Operation..........................................................131
Data Just ificatio n..... .......... ............... ................... ......131
Frame and Data Word Length Selection...................131
Idle Current (IIDLE) ............................................................180
In-Circuit Debugger (ICD 2)..............................................160
In-Circuit Serial Programming (ICSP).........................51, 143
Initi al i z a tio n Condition for RCON Registe r  Case 1 ......... ..157
Initi al i z a tio n Condition for RCON Registe r  Case 2 ......... ..157
Input Capture (CAPX) Timing Characteristics ................ ..196
Input Capture Module ............................ .... .. .. .... .. ....... .. .. ....83
Interrupts.....................................................................84
Register Map............... ....................... ................... ......85
Input Capture Operation During Sleep and Idle Modes......84
CPU Idle Mode.................. .................. ................... .... 84
CPU Sleep Mode........................................................ 84
Input Capture Timing Requirements................................. 196
Input Change Notification Module....................................... 67
Register Map for dsPIC30F6011A/6012 A 
(Bits 7-0)............................................................. 67
Register Map for dsPIC30F6011A/6012A 
(Bits 15-8)........................................................... 67
Register Map for dsPIC30F6013A/6014A 
(Bits 15-8)........................................................... 67
Register Map for dsPIC30F6013A/6014A 
(Bits 7-0)..................................................................... 67
Instruction Addressing Modes .. .......................................... 39
File Register Instructions............................................ 39
Fundamental Modes Supported..................... .. .... .. .... 39
MAC Instru ctions....................... ................... .............. 40
MCU Instru ction s............ ........................ .................. .. 39
Move and Accumulator Instructions ........................... 40
Other Ins tructions..... ....................... ....................... .... 40
Instruction Set
Overview................................................................... 166
Summary.................................................................. 163
Inter n e t Ad d ress................... ....................... ..................... 233
Interrupt Controller
Register Map...... ............... .................. ................... .... 50
Interrupt Priority.................................................................. 46
Interrupt Sequence............................................................. 48
Interrupt Stack Frame................................................. 49
Interrupts ............................................................................ 45
L
Load Conditions................................................................ 187
Low Volta g e Detec t (LVD)......... .............. ............... .......... 158
Low-Voltage Detect Characteristics.................................. 184
LVDL Charact e ristics...... ............... .............. ............... ...... 185
M
Memory Organization 1, 9, 15, 25, 39, 45, 51, 57, 63, 69, 73, 
79, 83, 87, 91, 95, 103, 111, 123, 133, 163
Core Register Map ..................................................... 36
Microc h i p  In te rnet Web Site....................... ................... .... 233
Modes of Operation
Disable...................................................................... 113
Initialization............................................................... 113
Listen All Messages...................................... .. .... .. .... 113
Listen On ly............ ................... ................... .............. 113
Loopback.................................................................. 113
Normal Operation.............. .............. ................... ...... 113
Module................................................................................ 95
Modulo Addressing............................................................. 40
Applicability................................................................. 42
Operation Example..................................................... 41
Start and End Address ............................................... 41
W Addres s Reg ister Selec tio n........... ............... .......... 41
MPLAB ASM30 Assemble r, Link e r, Librar ia n..... .............. 172
MPLAB ICD 2 In-Circuit Debugger..................... .. .... .... .... 173
MPLAB ICE 2000 High-Perf orm ance Univers a l 
In-Circuit Emulator.................................................... 173
MPLAB ICE 4000 High-Perf orm ance Univers a l 
In-Circuit Emulator.................................................... 173
MPLAB Integrated Development Environment 
oftware...................................................................... 171
MPLAB PM3 Device Programmer.................................... 173
MPL IN K Obje ct Link e r / M PLIB Ob j e ct Libra ri a n........... ..... 172

dsPIC30F6011A/6012A/6013A/6014A
DS70143B-page 230 © 2005 Microchip Technology Inc.
N
NVMRegister Map.... ............... ................... .................. .......55
O
OC/PWM Module Timing Characteristics..........................197
Operating Current (IDD).....................................................177
Oscillator
Control Reg i sters....... ............... ............... .................149
Operating Modes (Table)..........................................144
Syste m Over view....... ................... ....................... .....143
Oscillator Configurations...................................................146
Fail-Safe Clock Monitor .............................................148
Fast RC (FRC)..........................................................147
Initial Clock Source Selection ...................................146
Low-Power RC (LPRC).............................................148
LP Oscillator Control.................................................147
Phase Locked Loop (PLL) ............ ......... .. .... .... .. .......147
Start- u p  Timer (OST )......................... .......................147
Oscillator Selection ...........................................................143
Oscillator Start-up Timer
Timing Cha racteris tics ............ ........... .......... .............192
Timing Requirements................ .... .. ..... .... .. .. .. .... .. .....193
Output Co mpa re Interrupts ......... ................... .............. .......89
Output Compare Module..................... .... ..... .... .. .... .. .. ....... ..87
Register Map.... .......... ........................ .................. .......90
Timing Cha racteris tics ............ ........... .......... .............196
Timing Requirements................ .... .. ..... .... .. .. .. .... .. .....196
Output Compare Operation During CPU Idle Mode............89
Output Compare Sleep Mode Operation.............................89
P
Packagi n g  In formation...................... ................... .............215
Marking.....................................................................215
Peripheral Module Disable (PMD) Registers ....................160
PICSTART Plus Developm ent Programm er .....................174
Pinout Descriptions...................................... .. .... .. .... .. .. .......12
POR. See Power-on Reset.
PORTA
Register Map for dsPIC30F6013A/6014A...................65
PORTB
Register Map for dsPIC30F6011A/6012A/
6013A/6014A......................................................65
PORTC
Register Map for dsPIC30F6011A/6012A...................65
Register Map for dsPIC30F6013A/6014A...................65
PORTD
Register Map for dsPIC30F6011A/6012A...................66
Register Map for dsPIC30F6013A/6014A...................66
PORTF
Register Map for dsPIC30F6011A/6012A...................66
Register Map for dsPIC30F6013A/6014A...................66
PORTG
Register Map for dsPIC30F6011A/6012A/
6013A/6014A......................................................66
Power Saving Modes
Idle............................................................................159
Sleep.........................................................................158
Power-Down Current (IPD)................................................182
Power-on  Res e t (POR).... ............... ................... ...............143
Oscillator Start-up Timer (OST)................. ...... ....... ..143
Power-up  Timer (PWRT) ..................... .............. .......143
Power-Saving Modes........................................................158
Power-Saving Modes (Sleep and Idle) ..............................143
Power-up Timer
Timing Ch a rac te rist ics...... ........... .............. ............... 192
Timing Re q uirements ................... ................... .......... 193
Program Address Space..................................................... 25
Construction ............................................................... 27
Data Access from Program Memory 
Using Program Space Visibility .......................... 29
Data Access from Program Memory Using 
Table Ins tructions......... ................... ................... 28
Data Acce ss from, Addr e ss Generation......... ............ 27
Data Space Window into Operation............................ 30
Data Table Access (Least Significant Word).............. 28
Data Table Access (MSB )...... ........... ....................... .. 29
Memory Map for dsPIC30F6011A/6013A................... 26
Memory Map for dsPIC30F6012A/6014A................... 26
Table Instructions
TBLRDH............................................................. 28
TBLRDL.............................................................. 28
TBLWTH............................................................. 28
TBLWTL ............................................................. 28
Program and EEPRO M Charac terist ics................. ........... 186
Program Counter ................................................................ 16
Programmable.................................................................. 143
Programm er’s Model .......................................................... 16
Diagram...................................................................... 17
Programming Opera tio n s........ ................... ................... ...... 53
Algor ith m for Progr a m Flash...... .................. ............... 53
Erasing a Row of Program Memory............................ 53
Initiating the Programming Sequence......................... 54
Loading Write Latches................... .... .. .. .. .. .. ....... .. .. .. .. 54
Protection Against Accidental Writes to OSCCON........... 149
R
Reader Response............................................................. 234
Reset ........................................................................ 143, 153
Reset Sequence .................................... .. .... .... .. ......... .... .. .. 47
Reset Sources............................... ................... .......... 47
Reset Sources
Brown-o u t Re set (BOR)............... .............. ................. 47
Illegal Instruction Trap ................................. ........... .... 47
Trap Lock o u t.............................. .................. ............... 47
Uninitialized W Register Trap..................................... 47
Watchdog Time-out ......................... .. .. .... .. ....... .. .... .. .. 47
Reset Timi ng  Char a ct e ristics............. .............. ............... .. 192
Reset Timing Requirements....................................... .. .... 193
Resets
Brown-o u t Re st (BOR), Pro g r a mm a b l e.................... 155
POR with Long Crystal Start-up Time....................... 155
POR, Operating without FSCM and PWRT.............. 155
Power-on Reset (POR)............................................. 154
RTSP Operatio n................... ............... ................... ............ 52
Run-Time Self-Programming (RTSP)................................. 51
S
Serial Peripheral Interface. See SPI
Simple Capture Event Mode............................................... 83
Buffe r Ope ration........................ ....................... ..........84
Hall Sensor Mode... .......... ............... ............... ............ 84
Prescaler .................................................................... 83
Timer2 and Timer3 Selection Mode.................... .... .... 84
Simple OC/PWM Mode Timing Requirements ................. 197
Simp le  Output Co m p a re Ma tch Mo d e .......... ...... ..... ...... ..... 88
Simple PWM Mode............................................................. 88
Input Pin  Fa u l t Protection...................... ..................... 88
Period ......................................................................... 89

© 2005 Microchip Technology Inc. DS70143B-page 231
dsPIC30F6011A/6012A/6013A/6014A
Softwa re Simulator ( MP L AB SIM).................. ...................172
Software Stack Pointer, Frame Pointer...............................16
CALL Stack Frame......................................................35
SPI Module .........................................................................91
Framed SPI Support...................................................91
Operating Function Description ..................................91
Operation During CPU Idle Mode...............................93
Operation During CPU Sleep Mode............................93
SDOx Disable .............................................................91
Slave Select Synchronization .....................................93
SPI1 Register Map......................................................94
SPI2 Register Map......................................................94
Timing Characteristics
Master Mode (CKE = 0)....................................201
Master Mode (CKE = 1)....................................202
Slave Mode (CKE = 1)..............................203, 204
Timing Requirements
Master Mode (CKE = 0)....................................201
Master Mode (CKE = 1)....................................202
Slave Mode (CKE = 0)......................................203
Slave Mode (CKE = 1)......................................205
Word and Byte Communication ..................................91
STATUS Regi ster ...... ............... ................... ................... ....16
Symbols used in Opcode Descriptions . ............................164
Syste m Inte g ration..... ................... ................... .................143
Register Map for dsPIC30F601xA ............................161
T
Table Instruction Operation Summary................................51
Temperature and Voltage Specifications
AC.............................................................................187
Timer1 Module....................................................................69
16-bit Asynchronous Counter Mode ...........................69
16-bit Synchronous Counter Mode.............................69
16-bit Timer Mode.......................................................69
Gate Operation ...........................................................70
Interrupt.......................................................................71
Operation During Sleep Mode ....................................70
Prescaler.....................................................................70
Real-Time Clock .........................................................71
Interrupts.............................................................71
Oscillator Operation............................................71
Register Map............... ................... ....................... ......72
Timer2 and Timer3 Selection Mode................. .. ......... .. .... ..88
Timer2/3 Module..................... .... .. .. ....... .... .. .. .... .. ....... .... .. ..73
16-bit Timer Mode.......................................................73
32-bit Synchronous Counter Mode.............................73
32-bit Timer Mode.......................................................73
ADC Event Trigger......................................................76
Gate Operation ...........................................................76
Interrupt.......................................................................76
Operation During Sleep Mode ....................................76
Register Map............... ................... ....................... ......77
Timer Prescaler...........................................................76
Timer4/5 Module..................... .... .. .. ....... .... .. .. .... .. ....... .... .. ..79
Register Map............... ................... ....................... ......81
Timing Characteristics
ADCLow-speed (ASAM = 0, SSRC = 000) ..............213
Band Gap Start-up Time...........................................193
CAN Module I/O........................................................210
CLKOUT and I/O. . .....................................................191
DCI Module
AC-Li n k Mode..... ............... ....................... ........200
Multichannel, I2S Modes...................................198
External Clock...........................................................187
I2C Bus Data
Master Mode.............................. ....... .. .... .. .... .. .. 206
Slave Mode ................... ....................... ............ 208
I2C Bus Start/Stop Bits
Master Mode.............................. ....... .. .... .. .... .. .. 206
Slave Mode ................... ....................... ............ 208
Input Capture (CAPX)............................................... 196
OC/PWM Module . ..................................................... 197
Oscillator Start-up Timer...... ..................................... 192
Output Com p a re Module............... ................... ........ 196
Power-up Timer. ....................................................... 192
Reset........................................................................ 192
SPI Module
Master Mode (CKE = 0)...................... .. .... .. .. .. .. 201
Master Mode (CKE = 1)...................... .. .... .. .. .. .. 202
Slave Mode (CKE = 0)............................ ...... .... 203
Slave Mode (CKE = 1)............................ ...... .... 204
Type A, B and C Timer External Clock..................... 194
Watchdog Timer (WDT)........................................ .... 192
Timing Diagrams
CAN Bit......... .................. ................... ................... .... 116
Frame Sync, AC-Link Start of Frame ....................... 126
Frame Sync, Multi-Channel Mode............................ 126
I2S Interface Frame Sync......................................... 126
PWM Output... ................... ....................... .................. 89
Time-out Sequence on Power-up (MCLR Not 
Tied to VDD), Case 1 ........................................ 154
Time-out Sequence on Power-up (MCLR Not 
Tied to VDD), Case 2 ........................................ 155
Time-out Sequence on Power-up (MCLR Tied 
to VDD).............................................................. 154
Timing Diagrams.See Timing Characteristics
Timing Requirements
Band Gap Start-up Time........................................... 193
Brown-o u t Re set..... ........... .................. ................... .. 193
CAN Module I/O .......................... .. .... .. ......... .. .. .... .. .. 210
CLKOUT and I/O...................................................... 191
DCI Module
AC-Li nk Mod e....... ................... ................... ...... 200
Multichannel, I2S Modes................................... 199
External Clock .......................................................... 188
I2C Bus Data (Master Mode) .................................... 207
I2C Bus Data (Slave Mode)...................................... 209
Input Capture............................................................ 196
Oscillator Start-up Timer...... ..................................... 193
Output Com p a re Module............... ................... ........ 196
Power-up Timer. ....................................................... 193
Reset........................................................................ 193
Simple OC/PWM Mode ............................................ 197
SPI Module
Master Mode (CKE = 0)...................... .. .... .. .. .. .. 201
Master Mode (CKE = 1)...................... .. .... .. .. .. .. 202
Slave Mode (CKE = 0)............................ ...... .... 203
Slave Mode (CKE = 1)............................ ...... .... 205
Type A Timer Ex te rnal Cloc k....... ............... .............. 194
Type B Timer Ex te rnal Cloc k....... ............... .............. 195
Type C Timer External Clock.................................... 195
Watchdog Timer (WDT)........................................ .... 193
Timing Specifications
External Clock Requirements................................... 188
PLL Clock................................................................. 189
PLL Jitter .................................................................. 189

dsPIC30F6011A/6012A/6013A/6014A
DS70143B-page 232 © 2005 Microchip Technology Inc.
Trap Vec to rs....... ................... ....................... .......................48
Traps...................................................................................47
Hard and Soft..............................................................48
Sources.......................................................................47
Address Error Trap .............................................47
Math Error Trap....................... ........................ ....47
Oscillator Fail Trap..............................................48
Stack Error Trap..................................................48
U
UART Module
Address Detect Mode ...............................................107
Auto Baud Support........................ .. ......... .. .... .... .. .....108
Baud Rate Generator................................................107
Enabling and Setting Up ............... ....... .. .. .... .. .. .. .. .....105
Framing Error (FERR) ...............................................107
Idle Status.................................................................107
Loopback Mode .................. .. .... .. .... ..... .... .. .... .. .. .......107
Operation During CPU Sleep and Idle Modes..........108
Overview...................................................................103
Parity Error (PERR) ..................................................107
Receive Break...........................................................107
Receive Buffer (UxRXB) ...........................................106
Receive Buffer Overrun Error (OERR Bit) ................106
Receive Interrupt.......................................................106
Receiving Data ..........................................................106
Receiving in 8-bit or 9-bit Data Mode........................106
Reception Error Handlin g............ ........... .......... .........106
Transmit Brea k................ ........................... ...............106
Trans mit Buffe r (UxTXB).................... .......................105
Transmit Interrupt....... ................... ....................... .....106
Transmitting Data ......................................................105
Transmitting  in 8-b i t Da ta  Mode.... ............... .............105
Transmitting  in 9-b i t Da ta  Mode.... ............... .............105
UART1 Register Map................................................109
UART2 Register Map................................................109
UART Operation
Idle Mode..................................................................108
Sleep Mode. ..............................................................108
Unit ID Locations...............................................................143
Universal Asynchronous Receiver  Transmi tter. See UART
W
Wake-up from Sleep.........................................................143
Wake-up from Sleep and Idle..............................................49
Watchdog Timer (WDT)....................................... .. ...143, 158
Enabling and Disabling .............................................158
Operation ..................................................................158
Timing Cha racteris tics ............ ........... .......... .............192
Timing Requirements................ .... .. ..... .... .. .. .. .... .. .....193
WWW Address..................................................................233
WWW, On-Line Support ........................................................8

dsPIC30F6011A/6012A/6013A/6014A

THE MICROCHIP WEB SITE

Microc hip pro vides onl ine s upport v ia our W WW site at

www.microc hi p.c om. Thi s w eb si te i s us ed as a m ean s

to make files and information easily available to

customers. Accessible by using your favorite Internet

browser, the web site contains the following

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•Product Support – Data sheets and errata,

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resources, user’s guides and hardware support

docume nts , latest softw are releas es and archived

software

•General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,

online dis cu ss io n gr oups, Microchip consul t an t

program member listing

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listing of sem inar s and events, listings of

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representatives

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To register, access the Microchip web site at

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Users of Microchip products can receive assistance

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Customers should contact their distributor,

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Technic al support is avail able throug h the web si te

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In addition, there is a Development Systems

Information Line which lists the latest versions of

Microchip’s development systems software products.

This line also provides information on how customers

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The Development Systems Information Line

numbers are:

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dsPIC30F6011A/6012A/6013A/6014A

READER RESPONSE

It is ou r intention to pro vi de you wit h th e b es t docume ntation poss ib le to ens ure suc c es sfu l u se of y ou r Mic r oc hip pro d-

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DS70143BdsPIC30F6011A/6012A/

1. W hat are the best features of this doc ument?

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dsPIC30F6011A/6012A/6013A/6014A

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

dsPIC30F6011AT-30I/PF-ES

Example:

dsPIC30F6011AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A

Trademark

Architecture

Flash

E = Extended High Temp -40°C to +125°C

I = Industrial -40°C to +85°C

Temperature

Device ID

Package

PF = TQFP 14x14

S = Die (Waffle Pack)

W = Die (Wafers)

PT = TQFP 10x10

PT = TQFP 12x12

Memory Size in Bytes

0 = ROMles s

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4 = 25K to 48K

5 = 49K to 96K

6 = 97K to 192K

7 = 193K to 384K

8 = 385K to 768K

9 = 769K and Up

Custom ID (3 digits) or

T = Tape and Reel

A,B,C… = Revision Level

Engineering Sample (ES)

Speed

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WORLDWIDE SALES AND SERVICE

08/24/05