Advance Data Sheet
October 1999
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
The SMLC/SMLW010 Single-Output, Low-Profile, PCB Mount
P ower Modules use adv anced, surface-mount technology and
deliver high-quality, compact, dc-dc conversion at an eco-
nomical price.
Applications
■
Communications equipment
■
Computer equipment
■
Distributed power architectures
■
Surface-mount applications
Features
■
Low profile: 8.2 mm x 22.6 mm x 47.8 mm
(0.323 in. x 0.89 in. x 1.88 in.)
■
Wide input voltage range: 18 Vdc to 36 Vdc and
36 Vdc to 75 Vdc
■
Input-to-output isolation: 1500 V
■
Operating case temperature range: –40 °C to
+105 °C
■
Overcurrent protection, unlimited duration
■
Positive remote on/off logic
■
Output voltage adjustment: 90% to 110% of V
O, nom
■
Output overvoltage protection
■
Undervoltage lockout
■
UL
*
1950 Recognized,
CSA
†
C22.2 No. 950-95
Certified, VDE 0805 (EN60950, IEC950) Licensed
■
CE mark meets 73/23/EEC and 93/68/EEC
directives
‡
(SMLW only)
■
Within FCC Class A radiated limits
Options
■
Input voltage turn-on adjustment
■
Synchronization
■
Tight output voltage regulation
■
Parallel capability
Description
The SMLC/SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules are lo w-profile, dc-dc con verters
that operate over an input voltage range of 18 Vdc to 36 Vdc or 36 Vdc to 75 Vdc and provide a precisely regu-
lated output. The output is isolated from the input, allowing versatile polarity configurations and grounding con-
nections. Built-in filtering for both input and output minimiz es the need for external filtering. These modules are
designed and manufactured to be gull-winged surface-mounted power modules that are reflowed with other
surface-mount components in a typical surface-mount fashion.
*
UL
is a registered trademark of Underwriters Laboratories, Inc.
†
CSA
is a registered trademark of Canadian Standards Association.
‡This product is intended for integ ration into end-use equipment. All the required procedures for CE marking of end-use equipment should
be followed. (The CE mark is placed on selected products.)
2 Tyco Electronics Corp.
Advance Data Sheet
October 1999
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.
* See derating curves, Figure 8, for details.
Electrical Specifications
Table 1. Input Specifications
Fusing Considerations
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This encapsulated power module can be used in a wide variety of applications, ranging from simple stand-alone
operation to an integrated part of a sophisticated power architecture. To preser ve maximum flexibility, internal
fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse.
The safety agencies require a normal-blow fuse with a maximum r ating of 5 A (see Safety Considerations section).
Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same
type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data for further information.
Parameter Device Symbol Min Typ Max Unit
Input Voltage:
Continuous
Transient (100 ms)
SMLC
SMLW
All
V
I
V
I
V
I, trans
0
0
0
—
—
—
50
80
100
Vdc
Vdc
V
Operating Case Temperature
(See Thermal Considerations section.) All T
C
–40 — 105* °C
Storage Temperature All T
stg
–55 — 125 °C
I/O Isolation Voltage (for 1 minute) All — — — 1500 Vdc
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage SMLC
SMLW V
I
V
I
18
36 24
48 36
75 Vdc
Vdc
Maximum Input Current
(V
I
= 0 to V
I, max
; I
O
= I
O, max
)SMLC
SMLW I
I, max
I
I, max
—
——
—1.2
0.6 A
A
Inrush Transient All I
2
t— — 0.2 A
2
s
Input Reflected-ripple Current
(5 Hz to 20 MHz; 12 µH source imped-
ance; T
A
= 25 °C; see Figure 1 and
Design Considerations section.)
All I
I
— 2 — mAp-p
Input Ripple Rejection (100 Hz—120 Hz) All — — 50 — dB
Tyco Electronics Corp. 3
Advance Data Sheet
October 1999 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Electrical Specifications
(continued)
Table 2. Output Specifications
* For output voltages below 2.5 V, the G is trimmable down to 1.5 V.
† Engineering estimate.
Parameter Device Code
or Suffix Symbol Min Typ Max Unit
Output Voltage Set Point
(V
I
= V
I, nom
; I
O
= I
O, max
; T
A
= 25 °C) G*
F
A
B
C
V
O, set
V
O, set
V
O, set
V
O, set
V
O, set
2.45
3.23
4.85
11.52
14.40
2.5
3.3
5.0
12.0
15.0
2.55
3.37
5.15
12.48
15.60
Vdc
Vdc
Vdc
Vdc
Vdc
Output Voltage
(Over all line , load, and temperature conditions
until end of life; see Figure 3.)
G
F
A
B
C
V
O
V
O
V
O
V
O
V
O
2.41
3.19
4.80
11.50
14.25
—
—
—
—
—
2.59
3.41
5.20
12.50
15.75
Vdc
Vdc
Vdc
Vdc
Vdc
Output Regulation:
Line (V
I
= V
I, min
to V
I, max
)
Load (I
O
= I
O, min
to I
O, max
)
Temperature (T
C
= –40 °C to +85 °C)
A, F, G
B, C
A, F, G
B, C
A, F, G
B, C
—
—
—
—
—
—
—
—
—
—
—
—
1
0.01
10
0.1
25
0.5
—
—
—
—
—
—
mV
%V
O
mV
%V
O
mV
%V
O
Output Ripple and Noise Voltage
(Across one 0.1 µF ceramic capacitor; see
Figure 2.):
RMS
Peak-to-peak (5 Hz to 20 MHz)
A, F, G
B, C
A, F, G
B, C
—
—
—
—
—
—
—
—
—
—
—
—
25
35
75
100
†
mVrms
mVrms
mVp-p
mVp-p
External Load Capacitance A, F, G
B, C —
—0
0—
—220
33 µF
µF
Output Current
(At I
O
< I
O , min
, the modules ma y exceed output
ripple specifications, but operation is guaran-
teed. For A, F, and G codes, the output v oltage
may exceed specifications when I
O
< I
O, min
.)
G
F
A
B
C
I
O
I
O
I
O
I
O
I
O
0.15
†
0.13
†
0.10
0.06
0.05
—
—
—
—
—
3.0
2.7
2.0
0.83
0.67
A
A
A
A
A
Output Current-limit Inception
(V
O
= 90% V
O, set
)All I
O
— 115 — %I
O, max
Output Short-circuit Current
(V
O
= 0.25 V at 25 °C) All I
O
— 200 — %I
O, max
4 Tyco Electronics Corp.
Advance Data Sheet
October 1999
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Electrical Specifications
(continued)
Table 2.
Output Specifications
(continued)
* For output voltages below 2.5 V, the G is trimmable down to 1.5 V.
† Engineering estimate.
Table 3. Isolation Specifications
Table 4. General Specifications
Parameter Device Code
or Suffix Symbol Min Typ Max Unit
Efficiency
(V
I
= V
I, nom
; I
O
= I
O, max
; T
A
= 25 °C; see
Figure 3.)
SMLC010G
SMLC010F
SMLC010A
SMLC010B
SMLC010C
SMLW010G
SMLW010F
SMLW010A
SMLW010B
SMLW010C
η
η
η
η
η
η
η
η
η
η
—
—
—
—
—
—
—
—
—
—
70
†
74
†
77
†
77
†
77
†
73
†
76
†
79
79
†
79
†
—
—
—
—
—
—
—
—
—
—
%
%
%
%
%
%
%
%
%
%
Switching Frequency A, F
B, C, G —
— —
— 475†
350†—
— kHz
kHz
Dynamic Response
(∆IO/∆t = 1A/10 µs; VI = VI, nom; T A = 25 °C):
Load Change from IO = 50% to 75% of IO, max:
Peak Deviation
Settling Time (VO < 10% of peak deviation)
Load Change from IO = 50% to 25% of IO, max:
Peak Deviation
Settling Time (VO < 10% of peak deviation)
All
All
All
All
—
—
—
—
—
—
—
—
3
1.5
3
1.5
—
—
—
—
%VO, set
ms
%VO, set
ms
Parameter Device Min Typ Max Unit
Isolation Capacitance (engineering estimate) All — 1100 — pF
Isolation Resistance All 10 — — MΩ
Parameter Device Min Typ Max Unit
Calculated MTBF
(IO = 80% of IO, max; TC = 40 °C) All 5,500,000 hours
Weight (engineering estimate) All — — 17 (0.6) g (oz.)
Tyco Electronics Corp. 5
Advance Data Sheet
October 1999 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Electrical Specifications (continued)
Table 5. Feature Specifications
* The SMLx010C module will only trim down.
Parameter Device Code
or Suffix Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VI = VI, min to VI, max; open collector or
equivalent compatible; signal referenced to
VI(–) terminal. See Figure 4 and Feature
Descriptions.):
Logic Low—Module Off
Logic High—Module On
Module Specifications:
On/Off Current—Logic Low
On/Off Voltage:
Logic Low
Logic High (Ion/off = 0 mA)
Open Collector Switch Specifications:
Leakage Current During Logic High
(Von/off = 6 V)
Output Low Voltage During Logic Low
(Ion/off = 1 mA)
All
All
All
All
All
Ion/off
Von/off
Von/off
Ion/off
Von/off
—
–0.7
—
—
—
—
—
—
—
—
1.0
1.2
6
50
1.2
mA
V
V
µA
V
Turn-on Delay and Rise Times
(at 80% of IO, max; TA = 25 °C):
Case 1: On/Off Input Is Set f or Logic High and
then Input Power Is Applied (Delay from
Point at Which VI = VI, min until VO = 10% of
VO, nom).
Case 2: Input Power Is Applied for at Least
One Second, and then the On/Off Input Is
Set to Logic High (Dela y from P oint at Which
Von/off = 0.9 V until VO = 10% of VO, nom).
Output Voltage Rise Time (Time f or VO to Rise
from 10% of VO, nom to 90% of VO, nom)
Output Voltage Overshoot (at 80% of IO, max;
TA = 25 °C)
All
All
All
All
Tdelay
Tdelay
Trise
—
—
—
—
—
15
4
2
—
60
10
10
5
ms
ms
ms
%
Output Voltage Set Point Adjustment Range A, B, C, F
GVtrim
Vtrim 90
60 —
—110*
110 %VO, nom
%VO, nom
Output Overvoltage Protection (clamp) G
F
A
B
C
VO, clamp
VO, clamp
VO, clamp
VO, clamp
VO, clamp
3.0
3.7
5.6
13.2
16.5
—
—
—
—
—
5.7
6.3
7.7
17.6
23.1
V
V
V
V
V
Undervoltage Lockout SMLC
SMLW —
—11
20 14
27 —
—V
V
Advance Data Sheet
October 1999
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
6 Tyco Electronics Corp.
Test Configurations
8-203(C)
Note: Input reflected-ripple current is measured with a simulated
source impedance of 12 µH. Capacitor Cs offsets possible
battery impedance. Current is measured at the input of the
module.
Figure 1. Input Reflected-Ripple Test Setup
8-513(C)
Note: Use one 0.1 µF ceramic capacitor. Scope measurement
should be made using a BNC socket. Position the load
between 50 mm and 75 mm (2 in. and 3 in.) from the module.
Figure 2. P eak-to-Peak Output Noise Measurement
Test Setup
8-204(C)
Note: All measurements are taken at the module terminals. When
socketing, place Kelvin connections at module terminals to
avoid measurement errors due to socket contact resistance.
Figure 3. Output Voltage and Efficiency
Measurement Test Setup
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance input source. Highly inductive source
impedances can affect the stability of the power mod-
ule. If the source inductance exceeds 10 µH, a 33 µF
electrolytic capacitor (ESR < 0.7 Ω at 100 kHz)
mounted close to the power module helps ensure
stability of the unit. (See Figure 1.)
Solder Recommendations
Large surface-mount components typically require a
thicker stencil than smaller components to ensure a
reliable solder joint. The SMLC/SMLW010 Single-
Output, Low-Profile, PCB Mount Power Modules have
been e v aluated f or solder joint reliability and shoc k and
vibration requirements using 170,000 cubic mils
(2.8 mm3) of solder. This volume can be obtained by
printing solder 12 mils thick on the copper pads or
ov erprinting the copper pads 13 mils (0.33 mm) around
the pad area with 8 mils of printed solder . Although this
volume is recommended, tests have been conducted
using lower volumes with successful results. Contact
technical support for further assistance.
Safety Considerations
SMLC Modules
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e.,
UL
1950,
CSA
C22.2 No. 950-95, and VDE 0805
(EN60950, IEC950).
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the
input must meet SELV requirements.
The power module has extra-low v oltage (ELV) outputs
when all inputs are ELV.
The input to these units is to be provided with a maxi-
mum 5 A normal-blow fuse in the ungrounded lead.
TO OSCILLOSCOPE
12 µH
CS 220 µF
IMPEDANCE < 0.1 Ω
@ 20 °C, 100 kHz
VI(+)
VI(–)
BATTERY 33 µF
CURRENT
PROBE
LTEST
VO(+)
VO(–)
RESISTIVE
LOAD
SCOPE
0.1 µF
COPPER STRIP
V
I
(+)
V
I
(–)
V
O
(+)
V
O
(–)
I
I
I
O
SUPPLY
CONTACT RESISTANCE
CO
NTA
C
T AND
DISTRIBUTION LOSSES
LOAD
ηVO(+) VO(–)–[]IO
VI(+) VI(–)–[]II
-----------------------------------------------
100 %×=
Advance Data Sheet
October 1999 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Tyco Electronics Corp. 7
Safety Considerations (continued)
SMLW Modules
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e.,
UL
1950,
CSA
C22.2 No. 950-95, and VDE 0805
(EN60950, IEC950).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75 Vdc), for the module's output to be considered
meeting the requirements of safety extra-low voltage
(SELV), all of the following must be true:
■The input source is to be provided with reinforced
insulation from any other hazardous voltages, includ-
ing the ac mains.
■One VI pin and one V O pin are to be grounded or both
the input and output pins are to be kept floating.
■The input pins of the module are not operator acces-
sible.
■Another SELV reliability test is conducted on the
whole system, as required by the saf ety agencies, on
the combination of supply source and the subject
module to verify that under a single fault, hazardous
voltages do not appear at the module's output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low v oltage (ELV) outputs
when all inputs are ELV.
The input to these units is to be provided with a maxi-
mum 5 A normal-blow fuse in the ungrounded lead.
Feature Descriptions
Overcurrent Protection
To provide protection in a fault (output overload) condi-
tion, the unit is equipped with internal current-limiting
circuitry and can endure current limiting for an unlim-
ited duration. At the point of current-limit inception, the
unit shifts from voltage control to current control. If the
output voltage is pulled very low during a severe fault,
the current-limit circuit can exhibit either foldback or
tailout characteristics (output-current decrease or
increase). The unit operates normally once the output
current is brought back into its specified range.
Remote On/Off
Positiv e logic remote on/off turns the module on during
a logic-high voltage on the remote ON/OFF pin, and off
during a logic low.
To turn the power module on and off, the user must
supply a switch to control the voltage between the
on/off terminal and the VI(–) terminal (Von/off). The
switch may be an open collector or equivalent (see
Figure 4). A logic low is Von/off = –0.7 V to 1.2 V. The
maximum Ion/off during a logic low is 1 mA. The switch
should maintain a logic-low voltage while sinking 1 mA.
During a logic high, the maximum Von/off generated by
the power module is 6 V. The maximum allowable leak-
age current of the switch at Von/off = 6 V is 50 µA.
The module has internal capacitance to reduce noise
at the ON/OFF pin. Additional capacitance is not gen-
erally needed and may degrade the start-up character-
istics of the module.
8-758(C).a
Figure 4. Remote On/Off Implementation
Output V oltage Adjustment
Output voltage set-point adjustment allows the user to
increase or decrease the output voltage set point of a
module. This is accomplished by connecting an exter-
nal resistor between the TRIM pin and either the VO(+)
or V O(–) pins. With an external resistor between the
TRIM and VO(+) pins (Radj-down), the output voltage set
point (VO, adj) decreases (see Figure 5). The following
equation determines the required external resistor
v alue to obtain an output voltage change from V O , nom to
VO, adj:
where Radj-down is the resistance value connected
between TRIM and VO(+), and G, H, and L are defined
in the table below.
+
Ion/off
–
Von/off
REMOTE
ON/OFF
VI(+)
VI(–)
Radj-down VO adj,L–()G
VO nom,VO adj,–()
--------------------------------------- H–Ω=
88 Tyco Electronics Corp.
Advance Data Sheet
October 1999
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Feature Descriptions (continued)
Output V oltage Adjustment (continued)
8-715(C).e
Figure 5. Circuit Configuration to Decrease
Output V oltage
With an external resistor connected between the TRIM
and V O(–) pins (Radj-up), the output voltage set point
(VO, adj) increases (see Figure 6). The following equa-
tion determines the required external resistor value to
obtain an output voltage from VO, nom to VO, adj:
where Radj-up is the resistance value connected
between TRIM and VO(–), and the values of G, H, K,
and L are shown in the following table.
The combination of the output voltage adjustment
and the output voltage regulation cannot exceed 110%
of the nominal output voltage between the VO(+) and
VO(–) terminals.
8-715(C).d
Figure 6. Circuit Configuration to Increase Output
Voltage
The SMLC/SMLW010 Power Modules hav e a fixed cur-
rent-limit set point. Therefore, as the output voltage is
adjusted down, the available output power is reduced.
In addition, the minimum output current is a function of
the output voltage. As the output voltage is adjusted
down, the minimum required output current can
increase (i.e., minimum power is constant). As the out-
put voltage is adjusted up, the output power should be
held constant (maximum load current decreases).
Output Overvoltage Protection
The output overvoltage clamp consists of control cir-
cuitry, almost entirely independent of the primary regu-
lation loop, that monitors the voltage on the output
terminals. This control loop has a higher voltage set
point than the primary loop (see Feature Specifications
table). In a fault condition, the overvoltage clamp
ensures that the output voltage does not exceed
VO, clamp, max. This provides a redundant voltage-control
that reduces the risk of output overvoltage.
Input V oltage T urn-On Adjustment
(Optional)
The input voltage at which the unit turns on can be
adjusted upward to add additional hysteresis between
the points at which the modules turn on and turn off.
This f eature can be useful when the po wer system has
high impedance between the source voltage and the
power unit causing the input to drop as the supply is
turned on. Please consult the factory for application
guidelines and/or a description of how to use this fea-
ture.
GHKL
SMLx010G 2870 511 1.28 1.23
SMLx010F 5110 2490 2.07 1.23
SMLx010A 4750 2490 3.77 1.23
SMLx010B 11500 2490 10.77 1.23
SMLx010C 11500 2490 13.77 1.23
V
I
(+)
V
I
(–)
V
O
(+)
V
O
(–)
TRIM
R
adj-down
R
LOAD
Radj-up GL
VO adj,L–()K–[]
-----------------------------------------H–
Ω=
VI(+)
VI(–)
VO(+)
VO(–)
TRIM
Radj-up
RLOAD
Tyco Electronics Corp. 9
Advance Data Sheet
October 1999 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Feature Descriptions (continued)
Synchronization (Optional)
With external circuitry, the unit is capable of synchroni-
zation from an independent time base with a switching
rate equal to the nominal s witching frequency sho wn in
the Output Specifications table . Other frequencies ma y
be available; please consult the factory for application
guidelines and/or a description of the external circuit
needed to use this feature.
Parallel Capability (Optional)
Units with the –P option can be operated in parallel by
directly connecting the output voltage pins (pin 1 and
pin 2). The load regulation of the parallel units pro vides
the load sharing capability. When paralleling modules,
the output power should not exceed:
POUT = 0.9 x PO, max x n
where:
n = number of paralleled converters
PO, max = output power of a single converter
Note: Units with parallel capability have wider load
regulation and voltage tolerance specifications.
Call technical support for details.
Thermal Considerations
The power module operates in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation of the unit.
Heat-dissipating components inside the unit are ther-
mally coupled to the case. Heat is removed by conduc-
tion, convection, and radiation to the surrounding
environment. Proper cooling can be verified by mea-
suring the case temperature. The case temperature
(TC) should be measured at the position indicated in
Figure 7.
8-1363(C).e
Note: Dimensions are in millimeters and (inches). Pin locations are
for reference only.
Figure 7. SMLC and SMLW Case Temperature
Measurement Location
Note that the view in Figure 7 is of the surface of the
module. The temperature at this location should not
exceed the maximum case temperature indicated on
the derating curves. The output power of the module
should not exceed the rated power for the module as
listed in the Ordering Information table.
Heat T ransfer Characteristics
Increasing airflow over the module enhances the heat
transfer via convection. Figure 8 shows the maximum
power that can be dissipated by the module without
e xceeding the maximum case temperature versus local
ambient temperature (TA) for natural convection
through 3.0 ms–1 (600 ft./min.).
Systems in which these power modules are used typi-
cally generate natural convection airflow rates of
0.25 ms–1 (50 ft./min.) due to other heat-dissipating
components in the system. Therefore, the natural con-
vection condition represents airflow rates of approxi-
mately 0.25 ms–1 (50 ft./min.). Use of Figure 8 is shown
in the following example.
Example
What is the minimum airflow necessary for an
SMLW010A operating at VI = 48 V, an output current of
1.6 A, and a maximum ambient temperature of 86 °C?
Solution
Given: V I = 48 V, IO = 1.6 A (IO, max), TA = 86 °C
Determine PD (Figure 9): PD = 2.1 W
Determine airflow (Figure 8): v = 1 ms–1 (200 ft./min.)
Lucent
PATENT PENDING
SMLW010A
DC-DC Power Module
IN:DC 36-75V, 0.6A OUT:DC 5V, 2A
1
24 (0.94)
11
(0.45)
1010 Tyco Electronics Corp.
Advance Data Sheet
October 1999
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Thermal Considerations (continued)
Heat T ransfer Characteristics (continued)
8-2793(C).a
Figure 8. SMLW010A Forced Convection Power
Derating; Either Orientation
8-2790(C)
Figure 9. SMLW010A Typical Power Dissipation
vs. Normalized Output Current at
TA = 25 °C
Module Derating
The derating curves in Figure 8 were derived by mea-
surements obtained in an experimental apparatus
shown in Figure 10. Note that the module and the
printed-wiring board (PWB) that it is mounted on are
both vertically oriented. The passage has a rectangular
cross section.
8-1126(C).e
Note: Dimensions are in millimeters and (inches).
Figure 10. Experimental Test Setup
Surface-Mount Power Module Solder
Reflow Recommendation
The SMLC/SMLW010 Single-Output, Low-Profile, PCB
Mount Power Modules are constructed with SMT (sur-
face-mount technology) components and assembly
guidelines. Such large mass/low thermal resistance
devices heat up slower than typical SMT components.
It is recommended that the customer review data
sheets in order to customize the solder reflo w profile for
application board assembly.
It is recommended that a reflow profile m ust be char ac-
terized for the module on the application board assem-
bly. The solder paste type, component, and board
thermal sensitivity must be considered in order to form
the desired fused solder fillet. The power module leads
are plated with tin (Sn) solder to prevent corrosion and
ensure good solderability. Typically, the eutectic solder
melts at 183 °C , wets the land, and subsequently wic ks
the device lead. Sufficient time must be allocated to
fuse the plating on the lead and ensure a reliable sol-
der joint.
55 7065 80 85 95
90 100
0.0
3.0
MAX AMBIENT TEMPERATURE, T
A
(
C
)
2.0
1.5
2.5
105 11050
POWER DISSIPATION, P
D
(W)
1.0
0.5
3.5
60 75
3.0 ms
–1
(600 ft./min.)
2.0 ms
–1
(400 ft./min.)
1.5 ms
–1
(300 ft./min.)
1.0 ms
–1
(200 ft./min.)
NATURAL CONVECTION
MAX CASE TEMPERATURE
0.2 0.4 1.2 1.4 1.6 1.8
0.0
2.5
OUTPUT CURRENT, I
O
(A)
1.5
1.0
2.0
2.00.0
3.0
0.5
0.8 1.00.6
POWER DISSIPATION, P
D
(W)
V
I
= 75 V
V
I
= 60 V
V
I
= 48 V
V
I
= 36 V
AIR VELOCITY
AND AMBIENT
TEMPERATURE
MEASURED
BELOW THE
MODULE
AIRFLOW
13 (0.5)
FACING PWB
MODULE
76 (3.0)
PWB
25 (1.0)
Tyco Electronics Corp. 11
Advance Data Sheet
October 1999 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Surface-Mount Power Module Solder Reflow Recommendation (continued)
There are several types of SMT reflow technologies currently used in the industry. These surface-mount power
modules can be adequately soldered using natural convection, IR (radiant infrared), convection/IR, or forced con-
vection technologies. The surface-mount power module solder reflow profile is established by accurately measur-
ing the module gull-wing lead surface temperature.
The maximum oven temperature and conveyor speed should prevent the lead temperature from exceeding the
maximum thermal profile limits as shown in Figure 11. The lead temperature during a typical reflow profile is shown
in Figure 12. Failure to observe these maxim um lead temperatures and duration may result in permanent damage
to the power module.
Relative temper atures of the module gull-wing leads vary according to many factors , including surrounding compo-
nents, internal paths, and connecting paths. Typically, pin 1 is a good choice f or a conservativ e measurement since
it is usually connected to heavy paths for current conduction which also tend to heat the lead faster. These vari-
ables make it difficult to compare various types of surface-mount modules; how ever, the unit has been found to be
more robust during temperature profiles compared with other SMT modules available in the industry.
8-2275(C)
Figure 11. Maximum Thermal Profile Limits
8-2274(C).a
Figure 12. Typical Reflow Soldering Profile
4 C/s MAX
90 s MAX
6 MINUTES MAX
230 C MAX
(PEAK)
183 C
150 C
120 C
TIME (s)
GULL-WING LEAD
TEMPERATURE ( C)
2:30 5:00 7:30 10:00
MELTING POINT
(60/40 SOLDER)
250
200
150
100
50
TIME
(
min.
)
GULL-WING LEAD
TEMPERATURE ( C)
12 Tyco Electronics Corp.
Advance Data Sheet
October 1999
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Packaging Information
Vacuum Formed Trays
The SMLC/SMLW010 Single-Output, Low-Profile, PCB Mount Power Modules are delivered in plastic vacuum
formed trays (see Figure 13) that allow automated placement of the modules via a surface-mount pick and place
machine.
8-2792(C)
Note: Dimensions are in millimeters and (inches).
Figure 13. Vacuum Formed Tray
Specifications:
■Material: PVC (ESD protected)
■Capacity: 24 pieces/tray
■Weight: 90 g (3.2 oz.)
212 (8.33)
3 (0.11)
45 (1.78)
105 (4.14)
165 (6.50)
285 (11.22)
345 (13.58)
378 (14.89)
381 (15.00)
225 (8.86)
0.00
216 (8.50)
184 (7.25)
137 (5.40)
90 (3.55)
43 (1.70)
12 (0.48)
0.00 19
(0.75)
848276036
12
(0.47)
4 (0.16)
Tyco Electronics Corp. 13
Advance Data Sheet
October 1999 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Outline Diagram
Dimensions are in millimeters and (inches). See next page for pin descriptions.
Tolerances: x.x ± 0.5 mm (0.020 in.); x.xx ± 0.38 mm (0.015 in.).
T op View
Side View
Bottom View
8-2791(C)
22.6
(0.89)
PIN 1 MARK
47.8 (1.88)
Lucent
PATENT PENDING
SMLW010A
DC-DC Power Module
IN:DC 36-75V, 0.6A OUT:DC 5V, 2A
1
0.30 ± 0.1
(0.012 ± 0.004)
0.25
(0.010)
8.5
(0.335)
MAX
42.60 (1.677)
37.62 (1.481)
32.61 (1.284)
12.60 (0.496)
7.59 (0.299)
2.62 (0.103)
0 (0.000)
28.4
(1.12)
2.54
(0.100)
5.0
(0.197) 3.89
(
0.153
)
12 3 654
789101112
14 Tyco Electronics Corp.
Advance Data Sheet
October 1999
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Recommended Hole Pattern
Component-side footprint. Dimensions are in millimeters and (inches).
Tolerances: x.x ± 0.5 mm (0.020 in.); x.xx ± 0.38 mm (0.015 in.).
CAUTION: Care must be taken to ensure the board in the periphery of the footprint is flat.
8-1507(C).d
* The recommended solder paste volume is 2.8 cubic mm (170,000 cubic mils/pin). See Design Considerations section.
†NC may be used for internal module connections and should not be connected by the customer.
Pin SMLW Function SMLC Function
1VO(+) VO(+)
2VO(–) VO(–)
3 TRIM TRIM
4NC
†NC†
5NC
†NC†
6NC
†NC†
7VI TRIM (optional) VI TRIM (optional)
8 ON/OFF ON/OFF
9 SYNC (optional) SYNC (optional)
10 NC†NC†
11 VI(–) VI(+)
12 VI(+) VI(–)
30.0
(
1.181
)
3.3
(0.13)
5.0
(0.197)
2.8
(0.110)
FOOTPRINT
PERIPHERY
29.87
(1.176)
24.28
(0.956)
PIN 1 PAD*
Tyco Electronics Corp. 15
Advance Data Sheet
October 1999 18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Ordering Information
Table 6. Device Codes
Optional features may be ordered using the device code suffixes shown below. The feature suffixes are listed
numerically in descending order. Please contact your Tyco Electronics’ Account Manager or Field Application Engi-
neer for pricing and availability.
Table 7. Device Options
* Custom option. May not be available on all codes.
Input Voltage Output Voltage Output Current Output Power Device Code Comcode
24 V 2.5 V 3 A 5 W SMLC010G TBD
24 V 3.3 V 2.75 A 7 W SMLC010F TBD
24 V 5 V 2 A 10 W SMLC010A TBD
24 V 12 V 0.83 A 10 W SMLC010B TBD
24 V 15 V 0.67 A 10 W SMLC010C TBD
48 V 2.5 V 3 A 5 W SML W010G TBD
48 V 3.3 V 2.75 A 7 W SML W010F TBD
48 V 5 V 2 A 10 W SML W010A 108520396
48 V 12 V 0.83 A 10 W SML W010B TBD
48 V 15 V 0.67 A 10 W SML W010C TBD
Option Device Code Suffix
Synchronization* 3
Parallel Capability –P
Advance Data Sheet
October 1999
18 Vdc to 36 Vdc and 36 Vdc to 75 Vdc Input; 10 W
SMLC/SMLW010 Single-Output Low-Profile Power Modules:
Printed on
Recycled Paper
Tyco Electronics Power Systems, Inc.
3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819 FAX: +1-888-315-5182
(Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900
http://power.tycoeleectronics.com
Tyco Electronics Corportation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
No rights under any patent accompany the sale of any such product(s) or information.
© 2001 Tyco Electronics Corporation, Harrisburg, PA. All International Rights Reserved.
Printed in U.S.A.
October 1999
DS99-282EPS
