December 2008 Rev 5 1/19
19
Features
Low on-voltage drop (VCE(sat))
Low CRES / CIES ratio (no cross-conduction
susceptibility)
Very soft ultra fast recovery antiparallel diode
Applications
High frequency motor controls
SMPS and PFC in both hard switch and
resonant topologies
Motor drivers
Description
This IGBT utilizes the advanced PowerMESH™
process resulting in an excellent trade-off
between switching performance and low on-state
behavior.
Figure 1. Internal schematic diagram
D²PAK
TO-220
123
1
3
12
3
TO-220FP
1
3
2
DPAK
Table 1. Device summary
Order codes Marking Package Packaging
STGB10NC60HDT4 GB10NC60HD D²PAK Tape and reel
STGD10NC60HDT4 GD10NC60HD DPAK
STGF10NC60HD GF10NC60HD TO-220FP Tu b e
STGP10NC60HD GP10NC60HD TO-220
STGB10NC60HD - STGD10NC60HD
STGF10NC60HD - STGP10NC60HD
600 V - 10 A - very fast IGBT
www.st.com
Contents STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
2/19
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD Electrical ratings
3/19
1 Electrical ratings
Table 2. Absolute maximum ratings
Symbol Parameter
Value
Unit
TO-220 /
D²PAK DPAK TO-220FP
VCES Collector-emitter voltage (VGE = 0) 600 V
IC(1)
1. Calculated according to the iterative formula:
Collector current (continuous) at TC = 25 °C 20 9 A
IC(1) Collector current (continuous) at TC = 100 °C 10 6 A
ICL(2)
2. Vclamp = 80 % (VCES), VGE = 15 V, RG = 10 Ω, TJ = 150 °C
Turn-off latching current 30 A
ICP(3)
3. Pulse width limited by max junction temperature allowed
Pulsed collector current 30 A
VGE Gate-emitter voltage ±20 V
IFDiode RMS forward current at TC = 25 °C 10 A
IFSM
Surge not repetitive forward current
tp = 10 ms sinusoidal 20 A
PTOT Total dissipation at TC = 25 °C 65 62 24 W
VISO
Insulation withstand voltage (RMS) from all
three leads to external heat sink
(t = 1 s; TC = 25 °C)
2500 V
TJOperating junction temperature – 55 to 150 °C
Table 3. Thermal resistance
Symbol Parameter
Value
Unit
D²PAK
TO-220 DPAK TO-220FP
Rthj-case Thermal resistance junction-case IGBT max. 1.9 2.0 5.1 °C/W
Rthj-case Thermal resistance junction-case diode max. 4 4.5 7 °C/W
Rthj-amb Thermal resistance junction-ambient max. 62.5 100 62.5 °C/W
ICTC
() Tjmax()
TC
Rthj cVCE sat()max()
Tjmax()
ICTC
(),()×
-------------------------------------------------------------------------------------------------------=
Electrical characteristics STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
4/19
2 Electrical characteristics
(TCASE = 25 °C unless otherwise specified)
Table 4. Static
Symbol Parameter Test conditions Min. Typ. Max. Unit
V(BR)CES
Collector-emitter
breakdown voltage
(VGE= 0)
IC= 1 mA 600 V
VCE(sat) Collector-emitter saturation
voltage
VGE = 15 V, IC = 5 A
VGE = 15 V, IC = 5 A,
TC = 125 °C
1.9
1.7
2.5 V
V
VGE(th) Gate threshold voltage VCE= VGE, IC= 250 µA 3.75 5.75 V
ICES
Collector cut-off current
(VGE = 0)
VCE = 600 V
VCE = 600 V, TC = 125 °C
150
1
µA
mA
IGES
Gate-emitter leakage
current (VCE = 0) VGE = ± 20 V ±100 nA
gfs (1)
1. Pulse duration = 300 μs, duty cycle 1.5 %
Forward transconductance VCE = 15 V, IC= 5 A 3.5 S
Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Cies
Coes
Cres
Input capacitance
Output capacitance
Reverse transfer
capacitance
VCE = 25 V, f = 1 MHz,
VGE = 0
365
43
8.3
pF
pF
pF
Qg
Qge
Qgc
Total gate charge
Gate-emitter charge
Gate-collector charge
VCE = 390 V, IC = 5 A,
VGE = 15 V
(see Figure 19)
19.2
4.5
7
nC
nC
nC
STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD Electrical characteristics
5/19
Table 6. Switching on/off (inductive load)
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on)
tr
(di/dt)on
Turn-on delay time
Current rise time
Turn-on current slope
VCC = 390 V, IC = 5 A
RG= 10 Ω, VGE= 15 V,
(see Figure 18)
(see Figure 20)
14.2
5
1000
ns
ns
A/µs
td(on)
tr
(di/dt)on
Turn-on delay time
Current rise time
Turn-on current slope
VCC = 390 V, IC = 5 A
RG= 10 Ω, VGE= 15 V,
TC = 125 °C
(see Figure 18)
(see Figure 20)
14
5
920
ns
ns
A/µs
tr(Voff)
td(off)
tf
Off voltage rise time
Turn-off delay time
Current fall time
Vcc = 390 V, IC = 5 A,
RGE = 10 Ω,
VGE = 15 V
(see Figure 18)
(see Figure 20)
27
72
85
ns
ns
ns
tr(Voff)
td(off)
tf
Off voltage rise time
Turn-off delay time
Current fall time
Vcc = 390 V, IC = 5 A,
RGE=10 Ω, VGE =15 V,
TC = 125 °C
(see Figure 18)
(see Figure 20)
50
108
139
ns
ns
ns
Table 7. Switching energy (inductive load)
Symbol Parameter Test conditions Min. Typ. Max. Unit
Eon(1)
Eoff(2)
Ets
1. Eon is the turn-on losses when a typical diode is used in the test circuit in Figure 18. If the IGBT is offered
in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the
same temperature (25 °C and 125 °C)
2. Turn-off losses include also the tail of the collector current
Turn-on switching losses
Turn-off switching losses
Total switching losses
VCC = 390 V, IC = 5 A
RG= 10 Ω, VGE = 15 V,
(see Figure 18)
31.8
95
126.8
µJ
µJ
µJ
Eon(1)
Eoff(2)
Ets
Turn-on switching losses
Turn-off switching losses
Total switching losses
VCC = 390 V, IC = 5 A
RG= 10 Ω, VGE = 15 V,
TC = 125 °C
(see Figure 18)
61.8
173
234.8
µJ
µJ
µJ
Electrical characteristics STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
6/19
Table 8. Collector-emitter diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
VFForward on-voltage IF = 5 A
IF = 5 A, TC = 125 °C
2
1.7
2.45 V
V
trr
Qrr
Irrm
Reverse recovery time
Reverse recovery charge
Reverse recovery current
IF = 5 A, VR = 40 V,
di/dt = 100 A/μs
(see Figure 21)
22
14
1.3
ns
nC
A
trr
Qrr
Irrm
Reverse recovery time
Reverse recovery charge
Reverse recovery current
IF = 5 A,VR = 40 V,
TC =125 °C, di/dt = 100 A/μs
(see Figure 21)
33
30
1.85
ns
nC
A
STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD Electrical characteristics
7/19
2.1 Electrical characteristics (curves)
Figure 2. Output characteristics Figure 3. Transfer characteristics
Figure 4. Transconductance Figure 5. Collector-emitter on voltage vs
temperature
Figure 6. Gate charge vs gate-source voltage Figure 7. Capacitance variations
Electrical characteristics STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
8/19
Figure 8. Normalized gate threshold voltage
vs temperature
Figure 9. Collector-emitter on voltage vs
collector current
Figure 10. Normalized breakdown voltage vs
temperature
Figure 11. Switching losses vs temperature
Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector
current
STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD Electrical characteristics
9/19
Figure 14. Thermal impedance for
TO-220 / D²PAK / DPAK
Figure 15. Turn-off SOA
Figure 16. Thermal impedance for TO-220FP Figure 17. Emitter-collector diode
characteristics



    
+
4PULSE;S=
SINGLEPULSE






0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
012345
I(A)
FM
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(maximum values)
j
T =125°C
(typical values)
j
Test circuit STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
10/19
3 Test circuit
Figure 18. Test circuit for inductive load
switching
Figure 19. Gate charge test circuit
Figure 20. Switching waveform Figure 21. Diode recovery time waveform
STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD Package mechanical data
11/19
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Package mechanical data STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
12/19
D²PAK (TO-263) mechanical data
Dim mm inch
Min Typ Max Min Typ Max
A 4.40 4.60 0.1730.181
A1 0.030.230.001 0.009
b0.70 0.93 0.027 0.037
b2 1.14 1.70 0.045 0.067
c 0.45 0.60 0.017 0.024
c2 1.231.360.0480.053
D8.959.350.352 0.368
D1 7.50 0.295
E 10 10.40 0.3940.409
E1 8.50 0.334
e 2.54 0.1
e1 4.88 5.280.1920.208
H15 15.850.5900.624
J1 2.492.690.099 0.106
L2.292.790.090 0.110
L1 1.27 1.40 0.05 0.055
L2 1.30 1.75 0.051 0.069
R 0.4 0.016
V2 8°0° 8°
0079457_M
STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD Package mechanical data
13/19
DIM. mm.
min. typ max.
A 2.20 2.40
A1 0.901.10
A2 0.030.23
b0.64 0.90
b4 5.20 5.40
c 0.45 0.60
c2 0.480.60
D 6.00 6.20
D1 5.10
E 6.40 6.60
E1 4.70
e2.28
e1 4.40 4.60
H9.35 10.10
L1
L1 2.80
L2 0.80
L4 0.60 1
R0.20
V2 0 o8o
TO-252 (DPAK) mechanical data
0068772_G
Package mechanical data STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
14/19
Dim.
mm
.xaM.pyT.niM
6.44.4A
7.25.2B
57.25.2D
7.054.0E
157.0F
07.151.11F
5.151.12F
2.559.4G
7.24.21G
4.0101H
612L
6.036.823L
6.018.94L
6.39.25L
4.619.516L
3.997L
2.33aiD
7012510_Rev_J
AB
H
Dia
L7
D
E
L6 L5
L2
L3
L4
F1 F2
F
G
G1
TO-220FP mechanical data
STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD Package mechanical data
15/19
TO-220 mechanical data
Dim mm inch
Min Typ Max Min Typ Max
A 4.40 4.60 0.1730.181
b0.61 0.88 0.024 0.034
b1 1.14 1.70 0.044 0.066
c0.480.70 0.0190.027
D 15.25 15.75 0.6 0.62
D1 1.27 0.050
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F1.231.32 0.0480.051
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L1314 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L3028.90 1.137
P3.75 3.85 0.147 0.151
Q2.65 2.95 0.104 0.116
Package mechanical data STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
16/19
4.1 Packaging mechanical data
TAPE AND REEL SHIPMENT
D2PAK FOOTPRINT
* on sales type
DIM. mm inch
MIN. MAX. MIN. MAX.
A 330 12.992
B1.5 0.059
C 12.8 13.2 0.504 0.520
D20.2 0795
G 24.4 26.4 0.960 1.039
N100 3.937
T 30.4 1.197
BASE QTY BULK QTY
1000 1000
REEL MECHANICAL DATA
DIM. mm inch
MIN. MAX. MIN. MAX.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W23.7 24.3 0.933 0.956
TAPE MECHANICAL DATA
STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD Package mechanical data
17/19
TAPE AND REEL SHIPMENT
DPAK FOOTPRINT
DIM. mm inch
MIN. MAX. MIN. MAX.
A 330 12.992
B1.5 0.059
C 12.8 13.2 0.504 0.520
D20.2 0.795
G 16.4 18.4 0.645 0.724
N50 1.968
T 22.4 0.881
BASE QTY BULK QTY
2500 2500
REEL MECHANICAL DATA
DIM. mm inch
MIN. MAX. MIN. MAX.
A0 6.8 7 0.267 0.275
B0 10.4 10.6 0.409 0.417
B1 12.1 0.476
D1.5 1.6 0.059 0.063
D1 1.5 0.059
E1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299
K0 2.55 2.75 0.100 0.108
P0 3.9 4.1 0.153 0.161
P1 7.9 8.1 0.311 0.319
P2 1.9 2.1 0.075 0.082
R40 1.574
W 15.7 16.3 0.618 0.641
TAPE MECHANICAL DATA
All dimensions are in millimeters
Revision history STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
18/19
5 Revision history
Table 9. Document revision history
Date Revision Changes
30-Jan-2006 1 Initial release
06-Nov-2006 2 Complete version
08-Feb-2007 3 The document has been reformatted
05-Oct-2007 4 Added TO-220FP, Ta b le 2 has been updated
16-Dec-2008 5 Added DPAK package
STGB10NC60HD, STGD10NC60HD, STGF10NC60HD, STGP10NC60HD
19/19
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2008 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com