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Parameters
Speed NA
Tem perature C
Voltage 5.0 V
Status New
Sample Yes
Minim um Order Quantity 650
Factory Order Increm ent 650
Package
Package FCBGA 655 (RJ655)
Description FLIP CHIP BGA 24.5 X 19.5
MM 0.80 MM PIT
Status Active
Class PLASTIC
Category RoHS
Pb (Lead) Free No
Mark RJ
Package Type FCBGA
Lead Count 655
Length 24.5 mm
Width 19.5 mm
Thickness 2.55 mm
Pitch 0.8 mm
Tube / Tray TRAY
Quantity per Tube/Tray 40
Quantity per Reel 650
Moisture Sensitivity
Level (MSL) 4
Moisture Exposure
Floor Life 72 hrs@<30C/60%RH
Peak Reflow
Tem perature 245°C
Rebake Conditions 48hrs@125C
Related Package
Docum ents view documents
Home > Products > Advanced Memory Buffers > AMB0582C1 > AMB0582C1RJ8
AMB0582C1RJ8
Category: Advanced Memory Buffers
Generic Part: AMB0582C1
Market Group: AMB
Description: AMB
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Docum ents
Type Title Size Revision
Date
Flyer IDT Quick Reference Guide
475
KB
01/28/2008
Advance Memory Buffer (AMB) Flyer
728
KB
03/27/2008
Product Change
Notice
PCN# : TB0801-01 Add SPIL Taiw an as Alternate Test and Backend for
IDT AMB Products
87 KB
01/27/2008
White Paper Green Semiconductor Packaging
960
KB
07/12/2006
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