Advance Data Sheet
August 1997
NH050x-LP Series Power Modules:
5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
The NH050x-LP P ower Modules use ad vanced, surface-mount
technology and deliver high-quality, compact, dc-dc conver-
sion at an economical price.
Applications
■
Distributed power architectures
■
Servers
■
Workstations
■
Desktop computers
Features
■
Non-isolated output
■
Small size: 76.2 mm x 25.4 mm x 8.6 mm
(3.00 in. x 1.00 in. x 0.34 in.)
■
High efficiency: 91% typical
■
Constant frequency
■
Remote sense
■
Remote on/off
■
Output voltage adjustment: 90% to 110% of V
O , nom
■
Overcurrent protection
■
Thermal shutdown
■
Synchronization capability
■
Parallelable (current sharing)
■
Interleaved control
■
Designed to meet EN60950
■
UL
* Recognition,
CSA
†
Certification, and
VDE Licensing pending
■
Meets FCC and VDE Class A radiated limits
*
UL
is a registered trademark of Underwriters Laboratories, Inc.
†
CSA
is a registered trademark of Canadian Standards Association.
Description
The NH050x-LP Power Modules are non-isolated dc-dc converters that operate over an input voltage range of
4.5 Vdc to 5.5 Vdc and provide a regulated output of 3.3 Vdc, 2.5 Vdc, 2.0 Vdc, or 1.5 Vdc. The open frame
power modules have a maximum output current rating of 15 A at typical full-load efficiencies of 91%. Modules
can be connected in parallel for increased current capability. Synchronization pins are provided to lock operat-
ing frequencies. Interleaved control reduces input and output ripple currents during parallel operation.
2 Tyco Electronics Corp.
Advance Data Sheet
August 1997
5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Ratings apply to all devices.
* Forced convection—400 lfm minimum. Higher ambient temperatures possible with increased airflow and/or decreased power output. See the
Thermal Considerations section for more details.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Table 1. Input Specifications
Fusing Considerations
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple stand-alone operation to an
integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not
included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety
agencies require a normal-blow, dc fuse with a maximum rating of 20 A (see Saf ety Consider ations section). Based
on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of
fuse with a lower rating can be used. Refer to the fuse manufacturer’s data for further information.
Parameter Symbol Min Max Unit
Input Voltage Continuous V
I
— 7.0 V
On/Off Terminal Voltage V
on/off
— 6.0 Vdc
Operating Ambient Temperature*:
NH050x-LP T
A
045°C
Storage Temperature T
stg
–55 125 °C
Parameter Symbol Min Typ Max Unit
Operating Input Voltage:
Start-up
Continuous Operation V
I
V
I
4.75
4.5 —
5.0 —
5.5 Vdc
Vdc
Maximum Input Current (V
I
= 0 V to 5.5 V; I
O
= I
O, max
):
NH050x-LP I
I, max
— — 16 A
Input Reflected-ripple Current, Peak-to-peak
(5 Hz to 20 MHz, 500 nH source impedance;
see Figure 1.)
— — 300 — mAp-p
Input Ripple Rejection (120 Hz) — — 60 — dB
Tyco Electronics Corp. 3
Advance Data Sheet
August 1997 5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Electrical Specifications
(continued)
Table 2. Output Specifications
* Forced convection—400 lfm minimum.
General Specifications
Parameter Device Symbol Min Typ Max Unit
Output Voltage
(Over all operating input voltage,
resistive load, and temperature
conditions until end of life.) (See
Figure 3.)
NH050M-LP
NH050S1R8-LP
NH050G-LP
NH050F-LP
V
O
V
O
V
O
V
O
1.43
1.71
2.40
3.16
—
—
—
—
1.58
1.89
2.60
3.44
Vdc
Vdc
Vdc
Vdc
Output Voltage Set Point
(V
I
= 5.0 V; I
O
= I
O, max
; T
A
= 25 °C) NH050M-LP
NH050S1R8-LP
NH050G-LP
NH050F-LP
V
O, set
V
O, set
V
O, set
V
O, set
1.46
1.74
2.43
3.18
1.5
1.8
2.5
3.3
1.55
1.86
2.58
3.39
Vdc
Vdc
Vdc
Vdc
Output Regulation:
Line (V
I
= 4.5 V to 5.5 V)
Load (I
O
= 0 to I
O, max
)
Temperature (T
A
= 0 °C to 50 °C)
All
All
All
—
—
—
—
—
—
0.1
0.1
—
0.3
0.3
17
%
%
mV
Output Ripple and Noise (See Figure 2.):
RMS
Peak-to-peak (5 Hz to 20 MHz) All
All —
——
——
—25
100 mVrms
mVp-p
Output Current* All I
O
0 — 15.0 A
Output Current-limit Inception
(V
O
= 90% of V
O, set
; see Feature
Descriptions section.)
All I
O
103 — 200 %I
O, max
Efficiency
(V
I
= 5.0 V; I
O
= I
O, max
; T
A
= 25 °C;
see Figure 3.)
NH050M-LP
NH050S1R8-LP
NH050G-LP
NH050F-LP
η
η
η
η
TBD
TBD
TBD
TBD
82
83
88
91.5
—
—
—
—
%
%
%
%
Dynamic Response
(
∆
I
O
/
∆
t = 1 A/10 µs, V
I
= 5.0 V,
T
A
= 25 °C):
Load Change from I
O
= 0% to 100% of
I
O, max
:
Peak Deviation
Settling Time (V
O
< 10% peak
deviation)
Load Change from I
O
= 100% to 0% of
I
O, max
:
Peak Deviation
Settling Time (V
O
< 10% peak
deviation)
All
All
All
All
—
—
—
—
—
—
—
—
20
200
20
200
—
—
—
—
mV
µs
mV
µs
Parameter Min Typ Max Unit
Calculated MTBF (I
O
= 80% of I
O, max
; T
A
= 40 °C) 1,000,000 hr
Weight — — 14 (0.5) g (oz.)
4 Tyco Electronics Corp.
Advance Data Sheet
August 1997
5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Cleanliness Requirements
The open frame (no case or potting) po w er modules meet specification J-STD-001B. These requirements state that
solder balls must be attached and their size should not compromise minim um electrical spacing of the power module .
The cleanliness designator of the open frame power module is C00 (per J specification).
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions and Design Considerations sections for further information.
Parameter Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(V
I
= 4.5 V to 5.5 V; open collector pnp transistor or
equivalent; signal referenced to GND terminal; see
Figure 6 and Feature Descriptions section.):
Logic Low (ON/OFF pin open)—Module On:
I
on/off
= 0.0 µA
V
on/off
= 0.3 V
Logic High (V
on/off
> 2.8 V)—Module Off:
I
on/off
= 10 mA
V
on/off
= 5.5 V
Turn-on Time
(I
O
= 80% of I
O, max
; V
O
within ±1% of steady
state)
V
on/off
I
on/off
V
on/off
I
on/off
—
0
—
—
—
—
—
—
—
—
3.0
0.3
50
6.0
10
—
V
µA
V
mA
ms
Output Voltage Adjustment
(See Feature Descriptions section.):
Output Voltage Remote-sense Range:
F or V
O
≥
2.5 V
F or V
O
< 2.5 V
Output Voltage Set-point Adjustment Range (Trim):
F or V
O
≥
2.5 V
F or V
O
< 2.5 V
—
—
—
—
—
—
90
100
—
—
—
—
10
20
110
120
% V
O
,
nom
% V
O
,
nom
% V
O
,
nom
% V
O
,
nom
Over Temperature Shutdown
(See Feature Descriptions section.) T
C
— 120 — °C
Current Share Accuracy—2 Units in Parallel — — 10 — %I
O
,
rated
External Synchronization:
Clock Amplitude
Duty Cycle
Rise and Fall Time of Clock Signal
Capture Frequency Range
Fan-out
—
—
—
—
—
4.5
5
—
285
—
5.0
50
50
300
—
5.5
95
75
325
1
Vp-p
%
ns
kHz
—
Tyco Electronics Corp. 5
Advance Data Sheet
August 1997 5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Test Configurations
8-203(C).m
Note: Input reflected-ripple current is measured with a simulated
source inductance of 500 nH. Capacitor C
S
offsets possible
battery impedance. Current is measured at the input of the
module.
Figure 1. Input Reflected-Ripple Test Setup
8-513(C).k
Note: Use a 0.1 µF ceramic capacitor and a 47 µF aluminum or
tantalum capacitor (ESR < 0.1 @ 100 kHz). Scope measure-
ment should be made using a BNC socket. Position the load
between 50 mm and 80 mm (2 in. and 3 in.) from the module.
Figure 2. Peak-to-Peak Output Noise
Measurement Test Setup
8-1173(C).a
Note: All measurements are taken at the module terminals. When
socketing, place Kelvin connections at module terminals to
avoid measurement errors due to socket contact resistance.
Figure 3. Single-Output Voltage and Efficiency
Measurement Test Setup
Design Considerations
Input Source Impedance
The power module should be connected to a low ac-
impedance input source. Highly inductive source
impedances can affect the stability of the power mod-
ule. Adding external capacitance close to the input pins
of the module can reduce the ac impedance and
ensure system stability. The minimum recommended
input capacitance (C
1
) is a 470 µF electrolytic capacitor
with an ESR
≤
0.02
Ω
@ 100 kHz. Verify the quality and
layout of these capacitors by ensuring that the ripple
across the module input terminals is less than 1 Vp-p at
full load. (See Figures 1, 4, and 5.)
The 470 µF electrolytic capacitor (C
1
) should be added
across the input of the pow er module to ensure stability
of the unit. The electrolytic capacitor should be
selected for ESR and RMS current ratings to ensure
saf e operation in the case of a f ault condition. The input
capacitor for the power module should be rated to han-
dle 10 Arms.
When using a tantalum input capacitor , tak e care not to
e xceed the tantalum capacitor pow er rating because of
the capacitor’s failure mechanism (f or example, a short
circuit).
TO OSCILLOSCOPE
500 nH
C
S
220 µF
ESR < 0.1 Ω
@ 20 °C, 100 kHz
V
I
GND
BATTERY
L
TEST
CURRENT
PROBE
470 µF
ESR < 0.02 Ω
@ 100 kHz
VO
GND
RESISTIVE
LOAD
SCOPE
0.1 µF
COPPER STRIP
47 µF
V
I
V
O
I
I
I
O
SUPPLY
CONTACT RESISTANCE
CONTACT AND
DISTRIBUTION LOSSES
LOAD
GND
SENSE(+)
SENSE(–)
ηVO IO×
VI II×
-----------------------x 100=
66 Tyco Electronics Corp.
Advance Data Sheet
August 1997
5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Design Considerations
(continued)
Input Source Impedance
(continued)
8-1215(C).a
Figure 4. Setup with External Capacitor to Reduce
Input Ripple Voltage
To reduce the amount of ripple current fed back to the
input supply (input reflected ripple current), an external
input filter can be added. Up to 10 µF of ceramic
capacitance (C
2
) may be externally connected to the
input of the power module, provided the source induc-
tance (L
SOURCE
) is less than 1 µH (see Figure 4).
To further reduce the input reflected ripple current, a
filter inductor (L
FILTER
) can be connected between the
supply and the e xternal input capacitors (see Figure 5).
The filter inductor should be rated to handle the maxi-
mum power module input current of 16 Adc for the
NH050F-LP.
If the amount of input reflected-ripple current is unac-
ceptable with an external L-C filter, more capacitance
may be added across the input supply to form a C-L-C
filter. For best results, the filter components should be
mounted close to the power module.
8-1216(C).a
Figure 5. Setup with External Input Filter to
Reduce Input Reflected-Ripple Current
and Ensure Stability
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e.,
UL
-1950,
CSA
22.2-950, and EN60950.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the
input must meet SELV requirements.
If the input meets extra-low voltage (ELV) require-
ments, then the converter’s output is considered ELV.
The input to these units is to be provided with a maxi-
mum 20 A normal-blow fuse in the ungrounded lead.
Electrical Descriptions
Overcurrent Protection
To provide protection in a fault condition, the unit is
equipped with internal overcurrent protection. The unit
operates normally once the fault condition is removed.
Under some extreme overcurrent conditions, the unit
ma y latch off. Once the fault is remov ed, the unit can be
reset by toggling the remote on/off signal for one sec-
ond or by cycling the input power.
TO OSCILLOSCOPE
1 µH (MAX)
C
2
V
I
GND
SUPPLY
CURRENT
PROBE
L
SOURCE
10 µF (MAX)
+
C
1
470 µF
TO OSCILLOSCOPE
C
1
V
I
GND
SUPPLY
CURRENT
PROBE
L
SOURCE
470 µF
L
FILTER
+
C
2
Tyco Electronics Corp. 7
Advance Data Sheet
August 1997 5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Feature Descriptions
Remote On/Off
To turn the power module on and off, the user must
supply a switch to control the voltage at the on/off ter-
minal (Von/off). The switch should be an open collector
pnp transistor connected between the on/off terminal
and the VI terminal or its equivalent (see Figure 6).
During a logic low when the ON/OFF pin is open, the
power module is on and the maxim um Von/off generated
by the power module is 0.3 V. The maximum allowable
leakage current of the switch when Von/off = 0.3 V and
VI = 5.5 V (Vswitch = 5.2 V) is 50 µA.
During a logic high, when Von/off = 2.8 V to 5.5 V, the
power module is off and the maximum Ion/off is 10 mA.
The switch should maintain a logic high while sourcing
10 mA.
CAUTION: Never ground the on/off terminal.
Grounding the on/off terminal disables
an important safety feature and may
damage the module or the customer
system.
If not using the remote on/off feature, leave the
ON/OFF pin open.
8-1175(C).a
Figure 6. Remote On/Off Implementation
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections. The voltage between the remote-sense
pins and the output terminals must not exceed the out-
put voltage sense range given in the Feature Specifica-
tions table.
The voltage betw een the VOUT and GND terminals must
not exceed 110% of VO, nom for VO ≥ 2.5 V or 120% of
VO, nom for VO < 2.5 V. This limit includes any increase in
voltage due to remote-sense compensation and output
voltage set-point adjustment (trim). See Figure 7.
If not using the remote-sense feature to regulate the
output at the point of load, then connect SENSE(+) to
VOUT and SENSE(–) to GND at the module.
8-651(C).i
Figure 7. Effective Circuit Configuration for Single-
Module Remote-Sense Operation
Vo
I
on/off
ON/OFF
V
I
GND
+
V
on/off
+
V
switch
V
OUT
SENSE(+)
SENSE(–)
V
IN
I
O
CONTACT AND
DISTRIBUTION LOSSES
I
I
CONTACT
RESISTANCE
GND
SUPPLY LOAD
88 Tyco Electronics Corp.
Advance Data Sheet
August 1997
5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Feature Descriptions (continued)
Output Voltage Set-Point Adjustment (Trim)
Output voltage set-point adjustment allows the output
voltage set point to be increased or decreased by con-
necting an external resistor between the TRIM pin and
either the VO pin (decrease output voltage) or GND pin
(increase output voltage). The trim range for modules
that produce 2.5 V OUT or greater is ±10% of VO, nom. The
trim range for modules that produce less than 2.5 VOUT
is +20%, –0%.
Connecting an e xternal resistor (Rtrim-down) between the
TRIM and VO pin decreases the output voltage set
point as defined in the following equation.
For the F (3.3 VOUT) module:
For the G (2.5 VOUT) module:
Note: Output voltages below 2.5 V cannot be trimmed
down.
Connecting an external resistor (Rtrim-up) between the
TRIM and GND pins increases the output voltage set
point to VO, adj as defined in the following equation.
For the G (2.5 VOUT) module:
For all other modules:
If not using the trim feature, leave the TRIM pin open.
Overtemperature Shutdown
To provide additional protection in a fault condition, the
unit is equipped with a nonlatched thermal shutdown
circuit. The shutdown circuit engages when Q32
exceeds approximately 120 °C. The unit attempts to
restart when Q32 cools down. The unit cycles on and
off if the fault condition continues to exist. Recovery
from shutdown is accomplished when the cause of the
overheating condition is removed.
Parallel Operation
F or additional power requirements, the power modules
can be configured for parallel operation with forced
load sharing (see Figure 8).
Good layout techniques should be observed for noise
immunity. To implement forced load sharing, the follow-
ing connections must be made:
■The PARALLEL pins of all units must be connected
together. The paths of these connections should be
as direct as possible.
■Connect the SYNC OUT pin of one module to the
SYNC IN pin of another module according to the
Module Synchronization section on the next page.
■All remote-sense pins must be connected to the
power bus at the same point, i.e., connect all
SENSE(+) pins to the (+) side of the power b us at the
same point and all SENSE(–) pins to the (–) side of
the power b us at the same point. Close pro ximity and
directness are necessary for good noise immunity.
8-581(C).b
Figure 8. Wiring Configuration for Parallel Opera-
tion
Rtrim-down 18.23
VOVO adj,–
------------------------------ 47.2–
kΩ=
Rtrim-down 6.98
VOVO adj,–
------------------------------ 24–
kΩ=
Rtrim-up 28
VO adj,VO–
------------------------------ 10–
kΩ=
Rtrim-up 28
VO adj,VO–
------------------------------ 33.2–
kΩ=
VOUT
PARALLEL
SENSE(+)
SENSE(–)
SYNC
IN
SYNC
OUT
VIN
VOUT
PARALLEL
SENSE(+)
SENSE(–)
VIN
SYNC
IN
SYNC
OUT
MA
S
TER
SLAVE
GND
GND
Tyco Electronics Corp. 9
Advance Data Sheet
August 1997 5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Feature Descriptions (continued)
Module Synchronization
Any module can be synchronized to any other module
or to an external clock using the SYNC IN or SYNC
OUT pins.
SYNC IN Pin
The SYNC IN signal is ref erenced to VI(–). This pin can
be connected either to an external clock or directly to
the SYNC OUT pin of another NH050x-LP module.
If an external clock signal is applied to the SYNC IN
pin, the signal must have the characteristics as shown
in the Feature Specifications table. Operation outside
the specified frequency band will detrimentally affect
the performance of the module and must be avoided.
If the SYNC IN pin is connected to the SYNC OUT pin
of another module, the connection should be as direct
as possible, and the VI(–) pins of the modules must be
shorted together.
If no connection is made to the SYNC IN pin, the mod-
ule will operate from its own internal clock.
SYNC OUT Pin
This pin contains a clock signal referenced to the
VI(–) pin. The frequency of this signal will equal either
the module’s internal clock frequency or the frequency
established by an external clock applied to the
SYNC IN pin.
When synchronizing several modules together, the
modules should be connected in a daisy-chain fashion
where the SYNC OUT pin of one module is connected
to the SYNC IN pin of another module. Each module in
the chain will synchronize to the frequency of the first
module in the chain.
To avoid loading effects, ensure that the SYNC OUT
pin of any one module is connected to the SYNC IN pin
of only one module. Any number of modules can be
synchronized in this daisy-chain fashion.
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation of the unit.
Heat is removed by conduction, convection, and radia-
tion to the surrounding environment.
The thermal data presented is based on measure-
ments taken in a wind tunnel. The test setup shown in
Figure 9 was used to collect data for Figure 12. Note
that the airflow is parallel to the long axis of the module .
The derating data applies to airflow along either direc-
tion of the module’s long axis.
8-1199(C).a
Note: Dimensions are in millimeters and (inches).
Figure 9. Thermal Test Setup
AIRFLOW
203.2 (8.0)
76.2 (3.0)
AIR VELOCITY
AND AMBIENT
TEMPERATURE
MEASURED HERE
POWER MODULE
25.4 (1.0)
1010 Tyco Electronics Corp.
Advance Data Sheet
August 1997
5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Thermal Considerations (continued)
Proper cooling can be verified b y measuring the pow er
module’s temperature at lead 7 of Q32 as shown in
Figure 10. The temperature at this location should not
exceed 115 °C.
8-1149(C).b
Figure 10. Temperature Measurement Location
Convection Requirements for Cooling
To predict the approximate cooling needed for the mod-
ule, determine the power dissipated by the unit for the
particular application. Figure 11 shows typical heat dis-
sipation for the module over a range of output currents.
8-1428(C)
Figure 11. NH050F Power Dissipation vs. Output
Current, TA = 25 °C
With the known heat dissipation and a given local
ambient temperature, the minimum airflow can be cho-
sen from the derating curves in Figure 12.
8-1426(C)
Figure 12. NH050x Power Derating vs. Local
Ambient Temperature and Air Velocity
For example, if the NH050F-LP dissipates 3.5 W of
heat, the minimum airflow in a 60 °C environment is
0.5 m/s (100 ft./min.).
Keep in mind that these derating curves are approxi-
mations of the ambient temperatures and airflows
required to keep the power module temperature below
its maximum rating. Once the module is assembled in
the actual system, the module’s temperature should be
checked as shown in Figure 10 to ensure it does not
exceed 115 °C.
LEAD #7
Q32
02 4 6 8 10 12
0.0
2.5
3.0
OUTPUT CURRENT, I
O
(A)
POWER DISSIPATION, P
D
(W)
2.0
1.5
1.0
0.5
3.5
4.0
4.5
5.0
14
HIGH LINE = 5.5 V
NOM LINE = 5.0 V
LOW LINE = 4.5 V
POWER DISSIPATION, P
D
(W)
0 30 50 60 120
0
1
5
AMBIENT TEMPERATURE, T
A
(°C)
40 70
2
3
4
80 90 100 110
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.5 m/s (300 ft./min.)
1.0 m/s (200 ft./min.)
0.5 m/s (100 ft./min.)
NAT. CONVECT.
6
130
Tyco Electronics Corp. 11
Advance Data Sheet
August 1997 5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Outline Diagram
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.)
x.xx mm ± 0.25 mm (x.xxx in. ± 0.010 in.)
T op View
Side View
Bottom View
8-1176(C).c
* Label includes product designation and date code.
76.2 (3.00)
25.4
(1.00)
LUCENT
TECHNOLOGIES
LABEL*
5.84
(0.230)
8.6
(0.34)
MAX
25.4
(1.00)
45.7 (1.80)
48.3 (1.90)
43.2 (1.70)
40.6 (1.60)
2.54 (0.100) 1.8
(0.07)
7.62
(0.300)
5.08
(0.200)
20.3
(0.80)
2.54
(0.100)
23
.
6
(0.93)
17.8
(0.70)
10.16
(0.400)
12 Tyco Electronics Corp.
Advance Data Sheet
August 19975 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Recommended Hole Pattern
Dimensions are in millimeters and (inches).
Tolerances: x.xx mm ± 0.13 mm (x.xxx in. ± 0.005 in.).
8-1176(C).c
Ordering Information
Please contact your Tyco Electronics Account Manager or Field Application Engineer For pricing and availability.
Pin Function Pin Function
J1 - 1 Remote ON/OFF J2 - 1 SENSE(–)
J1 - 2 PARALLEL J2 - 2 SENSE(+)
J1 - 3 TRIM J2 - 3 VOUT
J1 - 4 GND J2 - 4 VOUT
J1 - 5 SYNC IN J2 - 5 VOUT
J1 - 6 SYNC OUT J2 - 6 VOUT
J1 - 7 GND J2 - 7 GND
J1 - 8 VIN J2 - 8 GND
J1 - 9 VIN
J1 - 10 VIN
Input V oltage Output V oltage Output Power Device Code Comcode
5 V 1.5 V 22.5 W NH050M-LP TBD
5 V 1.8 V 27 W NH050S1R8-LP TBD
5 V 2.5 V 37.5 W NH050G-LP TBD
5 V 3.3 V 50 W NH050F-LP 108013715
45.72 (1.800)
76.7 (3.02) MAX
14
58 65
10 1
48.26 (1.900)
43.18 (1.700)
40.64 (1.600)
2.54 (0.100)
23.88
(0.940)
25.9
(1.02)
MAX
J2
J1 2.03
(0.080)
7.62
(0.300)
5.08
(0.200)
2.54
(0.100) 20.32
(0.800)
10.16
(0.400)
17.78
(0.700)
PLATED HOLE SIZE
1.32 (0.052)
Tyco Electronics Corp. 13
Advance Data Sheet
August 1997 5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Notes
14 Tyco Electronics Corp.
Advance Data Sheet
August 19975 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Notes
Tyco Electronics Corp. 15
Advance Data Sheet
August 1997 5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Notes
Advance Data Sheet
August 19975 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 15 A
NH050x-LP Series Power Modules:
Printed on
Recycled Paper
Tyco Electronics Power Systems, Inc.
3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819 FAX: +1-888-315-5182
(Outside U.S.A.: +1-972-284-2626, FAX: +1-972-284-2900
http://power.tycoeleectronics.com
Tyco Electronics Corportation reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application.
No rights under any patent accompany the sale of any such product(s) or information.
© 2001 Tyco Electronics Corporation, Harrisburg, PA. All International Rights Reserved.
Printed in U.S.A.
August 1997
DS97-208EPS
