MMPQ6700_NL - Fairchild Semiconductor

Quad NPN & PNP General Purpose Amplifier

These complementary devices can be used in switches with collector currents of 10 µA to

100 mA. These devices are best used when space is the primary consideration. Sourced

from Process 23 & 66. See 2N3904 (NPN) & 2N3906 (PNP) for characteristics.

Absolute Maximum Ratings* T A = 25°C unless otherwise noted

*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.

Thermal Characteristics T A = 25°C unless otherwise noted

Symbol Parameter Value Units

VCEO Collec t or-Emitter Volt age 40 V

VCBO Collec t or-Base Volt age 40 V

VEBO Emi tter-Base Voltage 5.0 V

ICCollect or Current - Continuous 200 mA

TJ, Tstg Operating and Storage Junction Temperature Range -55 to +150 °C

Symbol Characteristic Max Units

MMPQ6700

PDTotal Device Dissipation

Derate above 25°C1000

8.0 mW

mW/°C

RθJA Thermal Res i stance, Junction t o Ambient

Effective 4 Die

Each Die 125

240 °C/W

°C/W

 1997 Fairchild Semiconductor Corporation

MMPQ6700

NOTES:

1) These ratings are based on a maximum junction temperature of 150 degrees C.

2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.

3) All voltages (V) and currents (A) are negative polarity for PNP transistors.

MMPQ6700

TRANSISTOR TYPE

C1 B1 E1 & C2 B2 E2 NPN

C3 B3 E3 & C4 B4 E4 PNP

SOIC-16

Mark: MMPQ6700 C1C1C2C2C3C3C4C4

E1 B1E2B2E3 B3E4B4

pin #1

Electrical Characteristics T A = 25°C unless otherwise noted

OFF CHARACTERISTICS

Symbol Parameter Test Conditions Min Max Units

V(BR)CEO Collector-Emitter Breakdown

Voltage* IC = 10 mA, IB = 0 40 V

V(BR)CBO Collector-Base Breakdown Voltage IC = 10 µA, IE = 0 40 V

V(BR)EBO Emitter-B ase Breakdown Voltage IE = 10 µA, IC = 0 5.0 V

ICBO Collec tor-Cutoff Current VCB = 30 V, I E = 0 50 nA

IEBO Emitter-Cutoff Current VEB = 4.0 V, I C = 0 50 nA

ON CHARACTERISTICS*

hFE DC Current Gain VCE = 1.0 V , IC = 0.1 m A

VCE = 1.0 V, I C = 1. 0 mA

VCE = 1.0 V, I C = 10 mA

VCE(sat)Collector-Em i t ter Saturati on Voltage IC = 10 mA , IB = 1.0 m A 0.25 V

VBE(sat)Base-Emitter Saturation Voltage IC = 10 mA, I B = 1.0 mA 0.90 V

SMALL SIGNAL CHARACTERISTICS

Cob Output Capacitance VCB = 5.0 V, f = 100 kHz 4.5 pF

Cib Input Capacitance VBE = 0.5 V, f = 100 kHz PNP

VBE = 0.5 V, f = 100 kHz NPN 10

8.0 pF

fTCurrent-Gain Bandwidth Product IC = 10 mA , VCE = 20 V,

f = 100 MHz 200 MHz

*Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%

Quad NPN & PNP General Purpose Amplifier

(continued)

MMPQ6700

F63TNR Label

ESD Label

F63TNR Label

343mm x 342mm x 64mm

St a nd ard Inte r m ed ia te bo x

SOIC(16lds) Packaging

Configuration: Fi

ure 1.0

Components

SOIC(16lds) Tape Leader and Trailer

Configuration: Fi

ure 2.0

Cover Tape

Carrier Tape

Note/Comments

Packa ging Option

SOIC (16lds) Packaging Information

Standard

(no flow c ode) L86Z

Packa ging type

Reel Size

TNR

13" Dia

Rail/Tube

Qty per Reel/Tube/Bag 2,500 45

Box Dimension (mm) 343x64x343 530x130x83

Max qty per Box 5,000 13,500

Weight per unit (gm) 0.1437 0.1437

Weight per Reel (kg) 0.7735 -

F63TNR Label sample

LOT: CBVK741B019

FSID: NDM3000

D/C1: D9842 QTY1: SPEC REV:

SPEC:

QTY: 2500

D/C2: QTY2: CPN: N/F: F (F63TNR)3

SOIC-1 6 Unit Or ient a tion

D85AB

NDM3001

D85AB

NDM3001

Pi n 1

Static Dissipative

Embossed Carrier Tape

F63TNR

Label

Antistatic Cover Tape

ESD Label

ELECTROSTATIC

SENSITIVE DEVICES

DO NOT SHI P OR STORE NEAR STRONG ELECTROSTATIC

ELECTROMAGNETIC, MAGNETIC OR R ADIOACTI VE FIELDS

TN R DA T E

PT NUM B ER

PEEL STRENGTH MIN _________ __ ___gms

MAX _____________ gms

Customized

Label

Packaging Description:

SOIC-16 parts are shipped in tape. The carrier tape is

made from a dissipative (carbon filled) polycarbonate

resin. The cover tape is a multilayer film (Heat Activated

Adhesive in nature) primarily composed of polyester film,

adhesive layer, sealant, and anti-static sprayed a

ent.

These reeled parts in standard option are shipped with

2,5 00 uni t s pe r 13" or 33 0c m d ia met er re el . The re el s are

dark blue in color and is made of polystyrene plastic (anti-

static coated). This and some other options are further

described in the Packa

Information tab le.

These full reels are individually barcode labeled and

placed inside a standard intermediate box (illustrated in

ure 1.0) made of recyclable corru

ated brown paper.

One box contains two reels maximum. And these boxes

are placed inside a barcode labeled shippin

box which

comes in different sizes dependin

on the nu mbe r of pa rts

shipped.

Leader Tape

1680mm minimum or

210 empt

pocket s

Tr aile r Tape

640mm min imum or

80 empt

pocket s

D85AB

NDM3001

D85AB

NDM3001

D85AB

NDM3001

SOIC-16 Tape and Reel Data

October 1999, Rev. B

SOIC-16 Tape and Reel Data, continued

July 1999, Rev. B

A0 D1

Dimensions are in inches and millimeters

Tape Size Reel

Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)

16m m 13" Dia 13.00

330 0.059

1.5 512 +0.020/-0.0 08

13 +0.5/-0.2 0.795

20.2 4.00

100 0.646 +0.078/-0.000

16.4 +2/0 0.882

22.4 0.626 – 0.764

15.9 – 19.4

13" Diameter Option

Dim A

Max

W2 max Measured at Hub

W1 Measured at Hub

Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481

rotational and lateral movement requirements (see sketches A, B, and C).

10 deg maximum component rotation

0.9mm

maximum

0.9mm

maximum

Sketch C (Top View)

Component lateral movement

Typical

component

cavity

center line

10 deg maximum

Typical

component

center line

Sketch B (Top View)

Component Rotation

Sketch A (Side or F ront Sectional View)

Component Rotation

User Direction of Feed

SOIC(16lds) Embossed Carrier Tape

Configuration: Fi

ure 3.0

SOIC(16lds) Reel Configuratio n: Fi

ure 4. 0

Dimensions are in millimeter

Pk g type

A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc

SOIC

(

16lds

)

(16mm)

6.60

+/-0.30 10.35

+/-0.25 16.0

+/-0.3 1.55

+/-0.05 1.60

+/-0.10 1.75

+/-0.10 14.25

min 7.50

+/-0.05 8.0

+/-0.1 4.0

+/-0.1 2.40

+/-0.40 0.450

+/-0.150 13.0

+/-0.3 0.06

+/-0.02

Dim D

min

Dim C

B Min

DETAIL AA

See detail AA

Dim A

max Dim N

SOIC-16 (FS PKG Code S3)

SOIC-16 Package Dimensions

October 1999, Rev. A1

1:1

Scale 1:1 on letter size paper

Dimensions shown belo w are in:

inches [millimeters]

Part Weight per unit (gram): 0.1437

TRADEMARKS

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is

not intended to be an exhaustive list of all such trademarks.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF F AIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or

systems which, (a) are intended for surgical implant into

the body, or (b) support or sustain life, or (c) whose

failure to perform when properly used in accordance

with instructions for use provided in the labeling, can be

reasonably expected to result in significant injury to the

user.

2. A critical component is any component of a life

support device or system whose failure to perform can

be reasonably expected to cause the failure of the life

support device or system, or to affect its safety or

effectiveness.

PRODUCT ST A TUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information

Preliminary

No Identification Needed

Obsolete

This datasheet contains the design specifications for

product development. Specifications may change in

any manner without notice.

This datasheet contains preliminary data, and

supplementary data will be published at a later date.

Fairchild Semiconductor reserves the right to make

changes at any time without notice in order to improve

design.

This datasheet contains final specifications. Fairchild

Semiconductor reserves the right to make changes at

any time without notice in order to improve design.

This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.

The datasheet is printed for reference information only.

Formative or

In Design

First Production

Full Production

Not In Production

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER

NOTICE TO ANY PRODUCTS HEREIN T O IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD

DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT

OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PA TENT

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