ADP1271 - Panasonic - Datasheet.Directory

PF (ADP1)

ORDERING INFORMATION

PRECISION

SEMICONDUCTOR

PRESSURE SENSOR PF PRESSURE

SENSOR

<Cross-section of Sensor Chip>

FEATURES

1. A wide range of rated pressure,

including a minute pressure

There are 10 types of sensors cov ering a

wide range of rated pressure from a

minute pressure between 4.9 kPa {0.05

kgf/cm2}, to a maximum pressure of

980.7 kPa {10 kgf/cm2}.

2. Highly accurate, linear

characteristics

This sensor employs a semiconductor

strain gauge method, ensuring accurate

and linear detection characteristics. It

also has excellent repeatability of

pressure characteristics.

3. Wide range of products

• Taking their place alongside the

standard 5kΩ bridge resistance models

are those with a 3.3kΩ resistance which

is optimally suited to 5V drive circuits.

• Economy model (no glass base) gives

outstanding value for consumer

appliances

40 kPa (0.4 kgf/cm2) and 49 kPa (0.5 kgf/

cm2) units are also available.

Example of pressure characteristics

(ADP1141)

Drive current: 1.5 mA rated current;

ambient temperature: 25°C 77°F

TYPICAL APPLICATIONS

• Medical equipment: Electronic

hemodynamometer

• Home appliance: Vacuum cleaner

• Gas equipment: Microprocessor gas

meter, gas leakage detector

• Industrial equipment: Absorption

device, etc.

Silicon Piezo resistance

strain gauge

Anode

junction

Glass

base

Pressure

High reliability

die bonding

technology

Very strong,

heat resistant body

Highly reliable wire

bonding technology

100

49 98.1

Output voltage, mV

Pressure (gauge pressure), (kPa)

Part No.

ADP1:

PF pressure sensor

Terminal profile and direction

1: DIP terminal:

2: DIP terminal:

Direction opposite

the pressure inlet

direction

Pressure inlet

direction

Rated pressure

4.9 kPa

14.7 kPa

34.3 kPa

49.0 kPa

98.1 kPa

196.1 kPa

343.2 kPa

490.3 kPa

833.6 kPa

980.7 kPa

40.0 kPa

Type

1: Standard type

(With glass base)

2: Economy type

(Without glass base)

Bridge resistance

Ex. ADP 1

Nill:

3: 5.0kΩ

3.3kΩ

Note: Some part numbers may not be available depending on the combination. Please refer to the Table of Product Types, below.

RoHS compliant

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PF (ADP1)

PRODUCT TYPES

SPECIFICATIONS

Notes) 1 Unless otherwise speciﬁed, measurements were taken with a drive current of1.5 mA ±0.01 mA at a temperature of 25°C 77°F and humidity ranging from 25% to

85%.

2. Please consult us if a pressure medium other than air is to be used.

3. This is the regulation which applies within the compensation temperature range.

4. Please consult us if the intended use involves a negative pressure.

Type Standard type (With glass base) Economy type

(Without glass base)

Type of pressure Gauge pressure

Pressure medium Air (For other medium, please consult us.)

Rated

pressure Unit: kPa 4.9 14.7 34.3 49.0 98.1 196.1 343.2 490.3 833.6 980.7 40.0 49.0

Max. applied pressure Twice the rated pressure 1.5 times the rated

pressure Twice the rated

pressure

Bridge resistance 5000±1000 Ω3300

±600 Ω5000

±1000 Ω

Ambient temperature –20 to 100°C –4 to 212°F (no freezing or condensation)

–5 to

+50°C

+23 to

+122°F

–20 to

+100°C

–4 to

+212°F

Storage temperature –40 to 120°C –40 to 248°F (no freezing or condensation)

–20 to

+70°C

–4 to

+158°F

–40 to

+120°C

–40 to

+248°F

Temperature

compensation range 0 to 50°C 32 to 122°F5 to 45°C

41 to

113°F

0 to 50°C

32 to

122°F

Drive current

(constant current) 1.5 mA DC 1.5 mA DC

Output span voltage 40±20

mV 100±40 mV

43.5±22.5

mV 85±45

Offset voltage ±20 mV ±15 mV ±25 mV

Linearity ±0.7%FS ±0.5%FS ±0.3%FS ±0.5%FS ±0.6%FS ±0.3%FS

Pressure hysteresis ±0.6%FS ±0.4%FS ±0.2%FS ±0.4%FS ±0.7%FS

Offset voltage-temperature

characteristics

(0 to 50°C 32 to 122°F)±15%FS ±5.0%FS ±10%FS ±8%FS

Sensitivity-temperature

characteristics

(0 to 50°C 32 to 122°F)±10%FS ±2.5%FS ±1.3%FS ±2.5%FS

1. DIP terminal 5.0kΩ3.3kΩ

Pressure Terminal DIP terminal:

Direction opposite

the pressure inlet

direction

DIP terminal:

Pressure inlet

direction

DIP terminal:

Direction opposite

the pressure inlet

direction

DIP terminal:

Pressure inlet

direction

Standard type

(with glass

base)

4.9kPa ADP1101 ADP1201 — —

14.7kPa ADP1111 ADP1211 — —

34.3kPa ADP1121 ADP1221 — —

49.0kPa ADP1131 ADP1231 — —

98.1kPa ADP1141 ADP1241 — —

196.1kPa ADP1151 ADP1251 — —

343.2kPa ADP1161 ADP1261 — —

490.3kPa ADP1171 ADP1271 — —

833.6kPa ADP1181 ADP1281 — —

980.7kPa ADP11910 ADP1291 — —

Economy type

(without glass

base)

40.0kPa — — ADP11A23 ADP12A23

49.0kPa ADP1132 ADP1232 — —

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PF (ADP1)

DATA

1. Characteristics data

2. Pressure cycle range (0 to rated pressure)

Tested sample: ADP1131, temperature: 25°C 77°F

3. Evaluation test

Note: For details other than listed above, please consult us.

Tested item Tested condition Result

Environmental

characteristics

Storage at high temperature Temperature: Left in a 120°C 248°F constant temperature bath

Time: 1,000 hrs. Passed

Storage at low temperature Temperature: Left in a –40°C –40°F constant temperature bath

Time: 1,000 hrs. Passed

Humidity Temperature/humidity: Left at 40°C 104°F, 90% RH

Time: 1,000 hrs. Passed

Temperature cycle Temperature: –40°C to 120°C –40°F to 248 °F

1 cycle: 30 min.

Times of cycle: 100 Passed

Endurance

characteristics High temperature/high humidity

operation Temperature/humidity: 40°C 104°F, 90% RH

Operation times: 106, rated voltage applied Passed

Mechanical

characteristics

Vibration resistance Double amplitude: 1.5 mm .059 inch

Vibration: 10 to 55 Hz

Applied vibration direction: X, Y, Z 3 directions

Times: 2 hrs each Passed

Dropping resistance Dropping height: 75 cm 29.528 inch

Times: 2 times Passed

Terminal strength Pulling strength: 9.8 N {1 kgf}, 10 sec.

Bending strength: 4.9 N {0.5 kgf}, left and right 90° 1 time Passed

Soldering

Resistance

Soldered in DIP soldering bath Temperature: 230°C 446°F

Time: 5 sec. Passed

Temperature Temperature: 260°C 500°F

Time: 10 sec. Passed

1-(1) Output characteristics

ADP1141

Drive current: 1.5 mA; temperature: 25°C 77°F

1-(2) Offset voltage – temperature

characteristics

ADP1141

Drive current: 1.5 mA; rating ±5%FS

1-(3) Sensitivity – temperature characteristics

(%FS)

ADP1141

Drive current: 1.5 mA; rating ±2.5%FS

100

–20

–40 490 98.1

kPa

Output voltage (mV)

Rated pressure

–2

–1

32 50

122

Temperature (°C °F)

Offset voltage – temperature characteristics (%FS)

–2

–1

Sensitivity – temperature characteristics (%FS)

32 50

122

Temperature (°C °F)

2-(1) Offset voltage range 2-(2) Output span voltage range

Even after testing for 1 million times,

the variations in the offset voltage and

output span voltage are minimal.

–2

–1

1×1055×1051×106

Pressure cycle (cycle)

Offset voltage range (%FS)

Output span voltage range (%FS)

–2

–1

1×1055×1051×106

Pressure cycle (cycle)

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PF (ADP1)

DIMENSIONS mm inch General tolerance: ±0.3 ±.012

1. Terminal direction: Direction opposite the pressure inlet derection ADP11 ()

0 to 15°

2.54

.100

0.5

.020

1.2

.047

2.54

.100

.400

10.16

.394

3 dia.

.118 dia.

JAPAN

321

456

Atmospheric pressure

inlet hole Pressure inlet hole

0.8 dia. .031 dia.

0.6

.024

0.25

.010

R0.5

R.020

C0.5

C.020

8.6

.339

1.1

.043

3.3

4.9

.236

.130

.193

Recommended PC board pattern

(BO TTOM VIEW)

Tolerance: ±0.1 ±.004

Terminal connection diagram

6-.035 dia.

6-0.9 dia.

2.54

5.08

.100

.200

10.16

.400

2.54

.100

+Output −Output

−Input

+Input

R2R1

R4R3

Note: Leave terminal 4 unconnected.

Terminal No. Name

1 Output (–)

2Power supply (+)

3 Output (+)

4 No connection

5Power supply (–)

6 Output (–)

2. Terminal direction: Pressure inlet direction ADP12 ()

0 to 15°

1.2

0.5

2.54 2.54

.047

.020

.100 .100

10.16

.400

.118 dia.

3 dia.

.394

JAPAN

321

456

Atmospheric pressure

inlet hole Pressure inlet hole

0.8 dia. .031 dia.

0.25

.010 C0.5

.020

R0.5

.020

.024

0.6

0.25

.010

3.3

.236

.130

.157

8.6

.339

Recommended PC board pattern

(BO TTOM VIEW)

Tolerance: ±0.1 ±.004

Terminal connection diagram

6-.035 dia.

6-0.9 dia.

2.54

5.08

.100

.200

10.16

.400

2.54

.100

6 dia.

.236 dia.

+Output −Output

−Input

+Input

R2R1

R4R3

Note: Leave terminal 4 unconnected.

Terminal No. Name

1 Output (–)

2Power supply (+)

3 Output (+)

4 No connection

5Power supply (–)

6 Output (–)

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PF (ADP1)

NOTES

1. Mounting

Use lands on the printed-circuit boards to

which the sensor can be securely ﬁxed.

2. Soldering

Due to its small size, the thermal capacity

of the pressure sensor DIP type is low.

Therefore, take steps to minimize the ef-

fects of external heat.

Damage and changes to characteristics

may occur due to heat deformation.

Use a non-corrosive resin type of ﬂux.

Since the pressure sensor DIP type is ex-

posed to the atmosphere, do not allow

ﬂux to enter inside.

1) Manual soldering

• Set the soldering tip from 260 to 300°C

500 to 572°F (30W), and solder for no

more than 5 seconds.

• Please note that output may change if

the pressure is applied on the terminals

when the soldering.

• Thoroughly clean the soldering iron.

2) DIP soldering (DIP terminal type)

• Please keep the DIP solder bath temper-

ature no higher than 260°C 500°F. When

soldering, heat should be applied no long-

er than ﬁve seconds.

• When mounting onto a PCB of low ther-

mal capacity, please avoid DIP soldering

as this may cause heat deformity.

3) Solder reworking

• Finish reworking in one operation.

• For re working of the solder bridge, use a

soldering iron with a ﬂat tip. Please do not

add more ﬂux when reworking.

• Please use a soldering iron that is below

the temperature given in the speciﬁcations

in order to maintain the correct tempera-

ture at the tip of the soldering iron.

4) Too much force on the terminals will

cause deformation and loss in effective-

ness of the solder. Therefore, please

avoid dropping and careless handling of

the product.

5) Please control warping of the PCB

within 0.05 mm of the sensor width.

6) When cut folding the PCB after mount-

ing the sensor, take measures to prevent

stress to the soldered parts.

7) The sensor terminals are designed to

be exposed, so contact of the terminals

with metal shards and the like will cause

output errors. Therefore , please be careful

and prevent things such as metal shards

and hands from contacting the terminals.

8) To prevent degradation of the PCB in-

sulation after soldering, please be careful

not to get chemicals on the sensor when

coating.

9) Please consult us regarding the use of

lead-free solder.

3. Cleaning

1) Since the pressure sensor chip is ex-

posed to the atmosphere, do not allow

cleaning ﬂuid to enter inside.

2) Avoid ultrasonic cleaning since this

may cause breaks or disconnections in

the wiring.

4. Environment

1) Please avoid using or storing the pres-

sure sensor chip in a place exposed to

corrosive gases (such as the gases given

off by organic solvents, sulfurous acid

gas, h ydrogen sulﬁdes, etc.) which will ad-

versely aff ect the performance of the pres-

sure sensor chip.

2) Since this pressure sensor chip does

not have a water-proof construction,

please do not use the sensor in a location

where it may be sprayed with water, etc.

3) Avoid using the pressure sensors chip

in an environment where condensation

may form.

Furthermore, its output may ﬂuctuate if

any moisture adhering to it freezes.

4) The pressure sensor chip is construct-

ed in such a way that its output will ﬂuctu-

ate when it is exposed to light. Especially

when pressure is to be applied by means

of a transparent tube, take steps to pre-

vent the pressure sensor chip from being

exposed to light.

5) Avoid using the pressure sensor chip

where it will be susceptible to ultrasonic or

other high-frequency vibration.

5. Quality check under actual loading

conditions

To assure reliability, check the sensor un-

der actual loading conditions. Avoid any

situation that may adversely affect its per-

formance.

6. Other handling precautions

1) That using the wrong pressure range or

mounting method may result in accidents.

2) The only direct pressure medium you

can use is dry air. The use of other media,

in particular, corrosive gases (organic sol-

vent based gases, sulfurous acid based

gases, and hydrogen sulﬁde based gases,

etc.) and media that contains moisture or

foreign substances will cause malfunction

and damage. Please do not use them.

3) The pressure sensor chip is positioned

inside the pressure inlet. Never poke

wires or other foreign matter through the

pressure inlet since they may damage the

chip or block the inlet. A v oid use when the

atmospheric pressure inlet is blocked.

4) Use an operating pressure which is

within the rated pressure range. Using a

pressure beyond this range may cause

damage.

5) Since static charge can damage the

pressure sensor chip, bear in mind the fol-

lowing handling precautions.

• When storing the pressure sensor chips,

use a conductive material to short the

pins or wrap the entire chip in aluminum

foil. Plastic containers should not be used

to store or transport the chips since they

readily become charged.

• When using the pressure sensor chips,

all the charged articles on the bench sur-

face and the work personnel should be

grounded so that any ambient static will

be safely discharged.

6) Based on the pressure involved, give

due consideration to the securing of the

pressure sensor DIP type and to the se-

curing and selection of the inlet tube. Con-

sult us if you have any queries.

APPLICATION CIRCUIT

DIAGRAM (EXAMPLE)

The pressure sensor is designed to con-

vert a voltage by means of constant cur-

rent drive and then, if necessary, it

ampliﬁes the voltage for use. The circuit

shown belo w is a typical example of a cir-

cuit in which the pressure sensor is used.

MOUNTING METHOD

The general method for transmitting air

pressures differs depending on whether

the pressure is low or high.

• Checkpoints for use

<1> Select a pressure inlet pipe which is

sturdy enough to prevent pressure leaks.

<2> Fix the pressure inlet pipe securely

so as to prevent pressure leaks.

<3> Do not block the pressure inlet pipe.

Methods of transmitting air pressures

AMP

Constant current

circuit unit Pressure

sensor

Amplifier circuit unit

When the pressure

is low When the pressure

is high

(4.9 to 98.1 kPa) (196.1 to 980.7 kPa)

If a tube is used as the pressure inlet pipe,

it may become disengaged. Therefore, use

a sturdy tube and secure it using O-rings.

Tube

Printed-

circuit

board

Printed-

circuit

board

O-ring

Pressure

inlet pipe

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