LM741QML LM741QML Operational Amplifier Literature Number: SNOSAN4 LM741QML Operational Amplifier General Description Features The LM741 is a general purpose operational amplifier which features improved performance over industry standards such as the LM709. They are direct, plug-in replacements for the 709C, LM201, MC1439 and 748 in most applications. The amplifier offers many features which make their application nearly foolproof: overload protection on the input and output, no latch-up when the common mode range is exceeded, as well as freedom from oscillations. Ordering Information NS Part Number JAN Part Number NS Package Number Package Description LM741H/883 H08C LM741J/883 J08A 8LD CERDIP LM741W/883 W10A 10LD CERPACK LM741WG/883 8 LD Metal Can WG10A 10LD Ceramic SOIC Connection Diagrams Metal Can Package Dual-In-LinePackage 20143903 20143902 See NS Package Number H08C See NS Package Number J08A Ceramic Flatpak and SOIC Package 20143906 See NS Package Number W10A & WG10A (c) 2005 National Semiconductor Corporation DS201439 www.national.com LM741QML Operational Amplifier August 2005 LM741QML Schematic Diagram 20143901 www.national.com 2 LM741QML Absolute Maximum Ratings (Note 1) 22V Supply Voltage Power Dissipation (Note 2) 500 mW 30V 15V Differential Input Voltage Input Voltage (Note 3) Output Short Circuit Duration Continuous Operating Temperature Range -55C TA +125C Storage Temperature Range -65C TA +150C Junction Temperature (TJ) 150C Lead Temperature (Soldering, 10 Seconds) 300C Thermal Resistance JA Metal Can (Still Air) 167C/W Metal Can (500LF / Min Air Flow) 100C/W CERDIP (Still Air) TBD CERDIP (500LF / Min Air Flow) TBD CERPACK (Still Air) 228C/W CERPACK (500LF / Min Air Flow) 154C/W Ceramic SOIC (Still Air) 228C/W Ceramic SOIC (500LF / Min Air Flow) 154C/W JC Metal Can 44C/W CERDIP TBD CERPACK 27C/W Ceramic SOIC 27C/W Package Weight (typical) Metal Can 1000mg CERDIP 1100mg CERPACK 260mg Ceramic SOIC 225mg ESD Tolerance (Note 4) 400V Quality Conformance Inspection Mil-Std-883, Method 5005 - Group A Subgroup Description Temp C 1 Static tests at 25 2 Static tests at 125 3 Static tests at -55 4 Dynamic tests at 25 5 Dynamic tests at 125 6 Dynamic tests at -55 7 Functional tests at 25 8A Functional tests at 125 8B Functional tests at -55 9 Switching tests at 25 10 Switching tests at 125 11 Switching tests at -55 12 Settling time at 25 13 Settling time at 125 14 Settling time at -55 3 www.national.com LM741QML Electrical Characteristics DC Parameters The following conditions apply to all the following parameters, unless otherwise specified. DC: VCC = 15V, VCM = 0V Symbol VIO Parameter Input Offset Voltage Conditions Notes VCM = -12V VCM = 12V +VCC = 5V Min Offset Null IIO Input Offset Current 5.0 mV 1 6.0 mV 2, 3 -5.0 5.0 mV 1 -6.0 6.0 mV 2, 3 -5.0 5.0 mV 1 -6.0 6.0 mV 2, 3 -5.0 5.0 mV 1 6.0 mV 2, 3 -6.0 mV 1, 2, 3 6.0 VCM = -12V VCM = 12V VCC = 5V IIB Input Bias Current VCM = -12V VCM = 12V VCC = 5V ICC mV 1, 2, 3 -200 200 nA 1 -500 500 nA 2, 3 -200 200 nA 1 -500 500 nA 2, 3 -200 200 nA 1 -500 500 nA 2, 3 -200 200 nA 1 -500 500 nA 2, 3 0.0 500 nA 1 0.0 1500 nA 2, 3 0.0 500 nA 1 0.0 1500 nA 2, 3 0.0 500 nA 1 0.0 1500 nA 2, 3 0.0 500 mA 1 0.0 1500 nA 2, 3 2.8 mA 1 2.5 mA 2 Power Supply Current 3.5 +AVS -AVS Open Loop Voltage Gain Open Loop Voltage Gain RL = 2K, VO = 0 to 10V RL = 2K, VO = 0 to -10V Subgroup -5.0 Offset Null +VIO Adj Unit -6.0 -6.0 -VIO Adj Max mA 3 (Note 7) 50 V/mV 1 (Note 7) 25 V/mV 2, 3 (Note 7) 50 V/mV 1 (Note 7) 25 V/mV 2, 3 +PSRR Power Supply Rejection Ratio +VCC = 15V to 5V, -VCC = -15V 77 dB 1, 2, 3 -PSRR Power Supply Rejection Ratio -VCC = -15V to -5V, +VCC = +15V 77 dB 1, 2, 3 CMRR Common Mode Rejection Ratio -12V VCM 12V 70 dB 1, 2, 3 +IOS Output Short Circuit Current -45 -5.0 mA 1,2 -50 -5.0 mA 3 5.0 45 mA 1,2 5.0 50 mA 3 -IOS +VOpp Output Short Circuit Current Output Voltage Swing www.national.com RL = 10K 12 V 1, 2, 3 RL = 2K 10 V 1, 2, 3 VCC = 20V, RL = 10K 16 V 1, 2, 3 VCC = 20V, RL = 2K 15 V 1, 2, 3 4 LM741QML Electrical Characteristics (Continued) DC Parameters (Continued) The following conditions apply to all the following parameters, unless otherwise specified. DC: VCC = 15V, VCM = 0V Symbol Output Voltage Swing -VOpp Max Unit Subgroup RL = 10K -12 V 1, 2, 3 RL = 2K -10 V 1, 2, 3 VCC = 20V, RL = 10K -16 V 1, 2, 3 VCC = 20V, RL = 2K -15 V 1, 2, 3 Parameter Conditions Notes Min RI Input Resistance (Note 6) 0.3 M 1 VI Input Voltage Range VCC = 15V (Note 5) V 1, 2, 3 VO Output Voltage Swing VCC = 5V (Note 6) 12 2.0 V 1, 2, 3 Unit Subgroup AC Parameters The following conditions apply to all the following parameters, unless otherwise specified. AC: VCC = 15V, VCM = 0V Symbol Parameter Conditions Notes Min Max +SR Slew Rate VI = -5V to 5V, AV = 1, RL = 2K 0.2 V/S 7 -SR Slew Rate VI = 5V to -5V, AV =1, RL = 2K 0.2 V/S 7 tR Rise Time RL = 2K, AV = 1, CL = 100pF 1.0 S 7 OS Overshoot RL = 2K, AV = 1, CL = 100pF 30 % 7 GBW Gain Bandwidth VI = 50mVRMS, = 20KHz, RL = 2K KHz - 250 Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), JA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax - TA)/JA or the number given in the Absolute Maximum Ratings, whichever is lower. Note 3: For supply voltages less than 15V, the absolute maximum input voltage is equal to the supply voltage. Note 4: Human body model, 1.5 k in series with 100 pF. Note 5: Guaranteed by CMRR, IIB, IIO, VIO Note 6: Guaranteed parameter, not tested. Note 7: Datalog reading in K = V/mV Typical Application Offset Nulling Circuit 20143907 5 www.national.com LM741QML Revision History Date Released 08/22/05 www.national.com Revision A Section Originator Changes New Release to the corporate format L. Lytle 1 MDS datasheet converted into one corporate datasheet format. Since drift is not performed on 883 product, the table was removed. MNLM741-X Rev 1A0 will be archived. 6 LM741QML Physical Dimensions inches (millimeters) unless otherwise noted Metal Can Package (H) NS Package Number H08C Ceramic Dual-In-Line Package (J) NS Package Number J08A 7 www.national.com LM741QML Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 10-Lead Ceramic SOIC (WG) NS Package Number WG10A 10-Lead Ceramic Flatpak (W) NS Package Number W10A www.national.com 8 LM741QML Operational Amplifier Notes National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ``Banned Substances'' as defined in CSP-9-111S2. Leadfree products are RoHS compliant. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Francais Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated