DSC1103/23
Features
Applications
General Description
Block Diagram
Pin 6
V
DD
Pin 1
Enable
Pin 4
Output
Pin 3
GND
Divider
Driver
MEMS
Oscillator
PLL
Temp. Sensor &
Compensation
Circuitry
Pin 2
NC
Pin 5
Output
Low-Jitter Precision LVDS Oscillator
DSC1103/23
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
†Notice:
ELECTRICAL CHARACTERISTICS
Parameters Sym. Min. Typ. Max. Units Conditions
LVDS Outputs
Note 1:
2:
3:
4:
DSC1103/23
ELECTRICAL CHARACTERISTICS (CONTINUED)
Parameters Sym. Min. Typ. Max. Units Conditions
Note 1:
2:
3:
4:
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Note 1:
DSC1103/23
DSC1103/23
2.0 PIN DESCRIPTIONS
TABLE 2-1: PIN FUNCTION TABLE
Pin Number
7x5 with Pad
Pin Number
7x5 w/o Pad
Pin Number
5x3.2
Pin Number
3.2x2.5
Pin Number
2x2.5
Pin
Name Description
TABLE 2-2: OUTPUT ENABLE MODES
EN Pin DSC1103 DSC1123
DSC1103/23
3.0 NOMINAL PERFORMANCE PARAMETERS
-80
-70
-60
-50
-40
-30
-20
-10
0
0.1 1 10 100 1000 10000
Rejection (dBc)
Supply Noise Frequency (kHz)
50 mV
100 mV
FIGURE 3-1: Power Supply Rejection
Ratio.
0.0
0.5
1.0
1.5
2.0
2.5
0 200 400 600 800 1000
Phase Jitter (ps RMS)
Low-end of integration BW: x kHz to 20 MHz
156MHz-LVDS
212MHz-LVDS
320MHz-LVDS
410MHz-LVDS
FIGURE 3-2: Phase Jitter (Integrated
Phase Noise).
DSC1103/23
4.0 TERMINATION SCHEME
VDD
0.1uF
100 100
2
34
5
6
FIGURE 4-1: Typical Termination Scheme.
5.0 OUTPUT WAVEFORM
VIL
1/
f
o
Output
Enable
t
DA
t
EN
t
F
t
R
VIH
80
%
20%
50%
Output
830 mv
350 mV
FIGURE 5-1: Output Waveform.
DSC1103/23
6.0 TEST CIRCUIT
FIGURE 6-1: Test Circuit.
7.0 RECOMMENDED BOARD LAYOUT
1
34
6
5
2
4
5
2
3
6
1
Via to GND layer
Via to GND layer
Supply bypass
capacitor
FIGURE 7-1: DSC1103/23 Recommended Board Layout.
DSC1103/23
8.0 SOLDER REFLOW PROFILE
60-150
Sec
20-40
Sec
60-180
Sec
8 min max
Pre heat
ReŇow
Cool
Time
Temperature (°C)
3
°
C/Sec Max.
6
°
C/Sec Max.
200
°
C
217
°
C
150
°
C
25
°
C
260
°
C
3
°
C/Sec Max.
60-150
Sec
20-40
Sec
60-180
Sec
8 min max
Pre heat
ReŇow
Cool
Time
Temperature (°C)
200
°
C
217
°
C
150
°
C
25
°
C
260
°
C
60-150
Sec
20-40
Sec
60-180
Sec
8 min max
Pre heat
ReŇow
Cool
Time
Temperature (°C)
200
°
C
217
°
C
150
°
C
25
°
C
260
°
C
MSL 1 @ 260°C refer to JSTD-020C
DSC1103/23
9.0 PACKAGE MARKING INFORMATION
6-Lead VDFN 2.5 mm x 2.0 mm Package Outline and Recommended Land Pattern
DSC1103/23
DSC1103/23
DSC1103/23
6-Lead VDFN 3.2 mm x 2.5 mm Package Outline and Recommended Land Pattern
RECOMMENDED LAND PATTERN
Dimension Limits
Units
X1Contact Pad Width (X4)
Contact Pitch
MILLIMETERS
1.05 BSC
MIN
E
MAX
1.00
Contact Pad Length (X6)
Contact Pad Width (X2)
Y
X2
0.85
Microchip Technology Drawing C04-3007A
NOM
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
SILK SCREEN
12
6
CContact Pad Spacing 1.60
Space Between Contacts (X4) G1 0.25
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C
E
X1
Y
X2
G
0.60
B
A
0.05 C
0.05 C
0.07 C A B
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
12
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
12
N
0.10 C
0.08 C
Microchip Technology Drawing C04-1007A Sheet 1 of 2
2X
6X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
D
E
e
2X b2
4X b1
L
L1
A
A1
DSC1103/23
Microchip Technology Drawing C04-1007A Sheet 2 of 2
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
6-Lead Very Thin Plastic Dual Flatpack No-Lead (H5A) - 3.2x2.5 mm Body [VDFN]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Terminal Width
Pitch
Standoff
Units
Dimension Limits
A1
A
b2
b1
e
L
E
N
1.05 BSC
0.85
0.65
0.45
0.80
0.00
0.50
0.70
0.90
0.85
0.02
2.50 BSC
MILLIMETERS
MIN NOM
6
0.95
0.75
0.55
0.90
0.05
MAX
L1 0.10 REFTerminal Pullback
Overall Length D 3.20 BSC
DSC1103/23
DSC1103/23
6-Lead CDFN 5.0 mm x 3.2 mm Package Outline and Recommended Land Pattern
DSC1103/23
6-Lead VDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.90
2.90
MILLIMETERS
2.54 BSC
MIN
E
MAX
Contact Pad Length (X6)
Contact Pad Width (X6)
Y1
X1
1.35
1.50
Microchip Technology Drawing C04-3010A
NOM
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
12
6
CContact Pad Spacing 3.70
Contact Pad to Center Pad (X2) G 0.20
Thermal Via Diameter (X6) V
Thermal Via Pitch EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
With 2.8x1.8 mm Exposed Pad
C
E
X1
Y1
X2
Y2
EV
EV ØV G
SILK SCREEN
B
A
0.20 C
0.20 C
0.10 C A B
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
12
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
12
N
0.10 C A B
0.10 C A B
0.10 C
Microchip Technology Drawing C04-1010A Sheet 1 of 2
2X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
D
E
e
6X b
D2
E2
6X L (K)
A
A1
0.08 C
6X
DSC1103/23
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
e
L
E
N
2.54
1.70
1.00
1.35
0.80
0.00
1.40
1.10
1.80
0.85
0.02
5.00 BSC
MILLIMETERS
MIN NOM
6
1.90
1.20
1.45
0.90
0.05
MAX
K0.20 REF
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Overall Length
Exposed Pad Length
D
D2 2.70
7.00 BSC
2.80 2.90
Microchip Technology Drawing C04-1010A Sheet 2 of 2
6-Lead Very Thin Plastic Quad Flat, No Lead Package (H8A) - 7x5 mm Body [VDFN]
With 2.8x1.8 mm Exposed Pad
DSC1103/23
DSC1103/23
6-Lead CDFN 7.0 mm x 5.0 mm Package Outline and Recommended Land Pattern
DSC1103/23
APPENDIX A: REVISION HISTORY
Revision A (March 2017)
Revision B (October 2018)
Revision C (October 2019)
DSC1103/23
NOTES:
DSC1103/23
PRODUCT IDENTIFICATION SYSTEM
Examples:
PART NO.
Device
Device:
Enable Modes:
Package:
Temperature
Range:
Stability:
Frequency Code:
Packing:
X
Enable
xxx.xxxx
Frequency
Modes
X
Package
X
Temp.
X
Stability
X
Packing
Range
Note 1:
(First 2
Digits)
3
Device
(Last
Digit)
Note:
DSC1103/23
NOTES:
.
Trademarks
Note the following details of the code protection feature on Microchip devices:
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
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