IRF7240
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
ISContinuous Source Current MOSFET symbol
(Body Diode) showing the
ISM Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
VSD Diode Forward Voltage ––– ––– -1.2 V TJ = 25°C, IS = -2.5A, VGS = 0V
trr Reverse Recovery Time ––– 43 65 ns TJ = 25°C, IF = -2.5A
Qrr Reverse Recovery Charge ––– 75 110 nC di/dt = -100A/µs
Source-Drain Ratings and Characteristics
A
-43
–––
–––
–––
-2.5
–––
S
D
G
Repetitive rating; pulse width limited by
max. junction temperature.
Notes:
Pulse width ≤ 400µs; duty cycle ≤ 2%.
Surface mounted on 1 in square Cu board, t ≤ 5sec.
Parameter Min. Typ. Max. Units Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage -40 ––– –– – V VGS = 0V, ID = -250µA
∆V(BR)DSS/∆TJBreakdown Voltage Temp. Coefficient ––– -0.025 ––– V/°C Reference to 25°C, ID = -1mA
––– – –– 0.015 VGS = -10V, ID = -10.5A
––– – –– 0.025 VGS = -4.5V, ID = -8.4A
VGS(th) Gate Threshold Voltage -1.0 ––– -3.0 V VDS = VGS, ID = -250µA
gfs Forward Transconductance 17 ––– ––– S VDS = -10V, ID = -10.5A
––– ––– -15 VDS = -32V, VGS = 0V
––– ––– -25 VDS = -32V, VGS = 0V, TJ = 70°C
Gate-to-Source Forward Leakage ––– ––– -100 VGS = -20V
Gate-to-Source Reverse Leakage ––– –– – 10 0 VGS = 20V
QgTotal Gate Charge –– – 73 1 10 ID = -10.5A
Qgs Gate-to-Source Charge ––– 31 47 nC VDS = -20V
Qgd Gate-to-Drain ("Miller") Charge ––– 17 26 VGS = -10V
td(on) Turn-On Delay Time ––– 52 – –– VDD = -20V
trRise Time ––– 490 ––– ID = -1.0A
td(off) Turn-Off Delay Time ––– 210 ––– RG = 6.0Ω
tfFall Time ––– 97 ––– VGS = -10V
Ciss Input Capacitance ––– 9250 ––– VGS = 0V
Coss Output Capacitance ––– 580 ––– pF VDS = -25V
Crss Reverse Transfer Capacitance ––– 520 – –– ƒ = 1.0kHz
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
IGSS
µA
Ω
RDS(on) Static Drain-to-Source On-Resistance
IDSS Drain-to-Source Leakage Current
nA
ns