79RV308133PFM - Integrated Device Technology

5.5 1

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

MILITARY AND COMMERCIAL TEMPERATURE RANGES SEPTEMBER 1995

1995 Integrated Device Technology, Inc. 5.5 DSC-9064/4

IDT 79R3081, 79R3081E

IDT 79RV3081, 79RV3081E

IDT79R3081

RISController

with FPA

R3081 BLOCK DIAGRAM

Clock Generator

Unit/Clock Doubler Master Pipeline Control

System Control

Coprocessor

(CP0) Integer

CPU Core

Exception/Control

Registers

Memory Management

Registers

Translation

Lookaside Buffer

(64 entries)

General Registers

(32 x 32)

ALU

Shifter

Mult/Div Unit

Address Adder

PC Control

Virtual Address

Configurable

Data

Cache

(4kB/8kB)

Configurable

Instruction

Cache

(16kB/8kB)

Physical Address Bus

BIU

Control

DMA

Arbiter

4-deep

Write

Buffer

ClkIn

Int(5:0)

BrCond(3:2,0)

Data Bus

R3051 Superset Bus Interface Unit

Address/

Data DMA

Ctrl Rd/Wr

Ctrl

SysClk

(16 x 64)

Exponent Unit

Add Unit

Divide Unit

Multiply Unit

Floating Point

Coprocessor

(CP1)

Coherency

Logic

Invalidate

Control

Exception/Control

Data Bus

FP Interrupt

Parity

Generator

4-deep

Read

Buffer

2889 drw 01

The IDT logo is a registered trademark, and RISController, R3041, R3051, R3052, R3071, R3081, R3720, R4400, R4600, IDT/kit, and IDT/sim are trademarks of Integrated Device Technology, Inc.

FEATURES

• Instruction set compatible with IDT79R3000A, R3041,

R3051, and R3071 RISC CPUs

• High level of integration minimizes system cost

— R3000A Compatible CPU

— R3010A Compatible Floating Point Accelerator

— Optional R3000A compatible MMU

— Large Instruction Cache

— Large Data Cache

— Read/Write Buffers

• 43VUPS at 50MHz

— 13MFlops

• Flexible bus interface allows simple, low cost designs

• Optional 1x or 2x clock input

• 20 through 50MHz operation

• "V" version operates at 3.3V

• 50MHz at 1x clock input and 1/2 bus frequency only

• Large on-chip caches with user configurability

— 16kB Instruction Cache, 4kB Data Cache

— Dynamically configurable to 8kB Instruction Cache,

8kB Data Cache

— Parity protection over data and tag fields

• Low cost 84-pin packaging

• Superset pin- and software-compatible with R3051, R3071

• Multiplexed bus interface with support for low-cost, low-

speed memory systems with a high-speed CPU

• On-chip 4-deep write buffer eliminates memory write stalls

• On-chip 4-deep read buffer supports burst or simple block

reads

• On-chip DMA arbiter

• Hardware-based Cache Coherency Support

• Programmable power reduction mode

• Bus Interface can operate at half-processor frequency

Integrated Device Technology, Inc.

5.5 2

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

• The R3051, which incorporates 4kB of instruction cache

and 2kB of data cache, but omits the TLB, and instead uses

a simpler virtual to physical address mapping.

• The R3081E, which incorporates a 16kB instruction cache,

a 4kB data cache, and full function memory management

unit (MMU) including 64-entry fully associative Translation

Lookaside Buffer (TLB). The cache on the R3081E is user

configurable to an 8kB Instruction Cache and 8kB Data

Cache.

• The R3081, which incorporates a 16kB instruction cache,

a 4kB data cache, but uses the simpler memory mapping

of the R3051/52, and thus omits the TLB. The cache on the

R3081 is user configurable to an 8kB Instruction Cache and

8kB Data Cache.

Figure 1 shows a block level representation of the functional

units within the R3081E. The R3081E could be viewed as the

embodiment of a discrete solution built around the R3000A

and R3010A. However, by integrating this functionality on a

single chip, dramatic cost and power reductions are achieved.

CPU Core

The CPU core is a full 32-bit RISC integer execution

engine, capable of sustaining close to single cycle execution.

The CPU core contains a five stage pipeline, and 32 orthogonal

32-bit registers. The R3081 uses the same basic integer

execution core as the entire R3051 family, which is the

R3000A implementation of the MIPS instruction set. Thus, the

R3081 family is binary compatible with the R3051, R3052,

R3000A, R3001, and R3500 CPUs. In addition, the R4000

represents an upwardly software compatible migration path to

still higher levels of performance.

The execution engine in the R3081 uses a five-stage

pipeline to achieve near single-cycle instruction execution

rates. A new instruction can be initiated in each clock cycle;

the execution engine actually processes five instructions

concurrently (in various pipeline stages). Figure 2 shows the

concurrency achieved in the R3081 execution pipeline.

System Control Co-Processor

The R3081 family also integrates on-chip the System

Control Co-processor, CP0. CP0 manages both the exception

handling capability of the R3081, as well as the virtual to

physical address mapping.

As with the R3051 and R3052, the R3081 offers two

versions of memory management and virtual to physical

address mapping: the extended architecture versions, the

R3051E, R3052E, and R3081E, incorporate the same MMU

as the R3000A. These versions contain a fully associative 64-

entry TLB which maps 4kB virtual pages into the physical

address space. The virtual to physical mapping thus includes

kernel segments which are hard-mapped to physical

addresses, and kernel and user segments which are mapped

page by page by the TLB into anywhere in the 4GB physical

address space. In this TLB, 8 pages can be “locked” by the

kernel to insure deterministic response in real-time applications.

Figure 3 illustrates the virtual to physical mapping found in the

R3081E.

INTRODUCTION

The IDT R3051 family is a series of high-performance 32-

bit microprocessors featuring a high-level of integration, and

targeted to high-performance but cost sensitive processing

applications. The R3051 family is designed to bring the high-

performance inherent in the MIPS RISC architecture into

low-cost, simplified, power sensitive applications.

Thus, functional units have been integrated onto the CPU

core in order to reduce the total system cost, rather than to

increase the inherent performance of the integer engine.

Nevertheless, the R3051 family is able to offer 43VUPS

performance at 50MHz without requiring external SRAM or

caches.

The R3081 extends the capabilities of the R3051 family, by

integrating additional resources into the same pin-out. The

R3081 thus extends the range of applications addressed by

the R3051 family, and allows designers to implement a single,

base system and software set capable of accepting a wide

variety of CPUs, according to the price/performance goals of

the end system.

In addition to the embedded applications served by the

R3051 family, the R3081 allows low-cost, entry level computer

systems to be constructed. These systems will offer many

times the performance of traditional PC systems, yet cost

approximately the same. The R3081 is able to run any

standard R3000A operation system, including ACE UNIX.

Thus, the R3081 can be used to build a low-cost ARC

compliant system, further widening the range of performance

solutions of the ACE Initiative.

An overview of this device, and quantitative electrical

parameters and mechanical data, is found in this data sheet;

consult the

"R3081 Family Hardware User's Guide"

for a

complete description of this processor.

DEVICE OVERVIEW

As part of the R3051 family, the R3081 extends the offering

of a wide range of functionality in a compatible interface. The

R3051 family allows the system designer to implement a

single base system, and utilize interface-compatible processors

of various complexity to achieve the price-performance goals

of the particular end system.

Differences among the various family members pertain to

the on-chip resources of the processor. Current family members

include:

• The R3052E, which incorporates an 8kB instruction cache,

a 2kB data cache, and full function memory management

unit (MMU) including 64-entry fully associative Translation

Lookaside Buffer (TLB).

• The R3052, which also incorporates an 8kB instruction

cache and 2kB data cache, but does not include the TLB,

and instead uses a simpler virtual to physical address

mapping.

• The R3051E, which incorporates 4kB of instruction cache

and 2kB of data cache, along with the full function MMU/

TLB of the R3000A.

5.5 3

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

The extended architecture versions of the R3051 family

(the R3051E, R3052E, and R3081E) allow the system designer

to implement kernel software which dynamically manages

user task utilization of system resources, and also allows the

Kernel to protect certain resources from user tasks. These

capabilities are important in general computing applications

such as ARC computers, and are also important in a variety of

embedded applications, from process control (where protection

may be important) to X-Window display systems (where

virtual memory management can be used). The MMU can

also be used to simplify system debug.

R3051 family base versions (the R3051, R3052, and R3081)

remove the TLB and institute a fixed address mapping for the

various segments of the virtual address space. These devices

still support distinct kernel and user mode operation, but do

not require page management software, leading to a simpler

software model. The memory mapping used by these devices

is shown in Figure 4. Note that the reserved spaces are for

compatiblity with future family members, which may map on-

chip resources to these addresses. References to these

addresses in the R3081 will be translated in the same fashion

as the rest of their respective segments, with no traps or

exceptions signalled.

When using the base versions of the architecture, the

system designer can implement a distinction between the

user tasks and the kernel tasks, without having to implement

page management software. This distinction can be

implemented by decoding the output physical address. In

systems which do not need memory protection, and wish to

have the kernel and user tasks operate out of the same

memory space, high-order address lines can be ignored by

the address decoder, and thus all references will be seen in

the lower gigabyte of the physical address space.

Floating Point Co-Processor

The R3081 also integrates an R3010A compatible floating

point accelerator on-chip. The FPA is a high-performance co-

processor (co-processor 1 to the CPU) providing separate

add, multiply, and divide functional units for single and double

precision floating point arithmetic. The floating point accelerator

features low latency operations, and autonomous functional

units which allow differing types of floating point operations to

function concurrently with integer operations. The R3010A

appears to the software programmer as a simple extension of

the integer execution unit, with 16 dedicated 64-bit floating

point registers (software references these as 32 32-bit registers

when performing loads or stores). Figure 5 illustrates the

functional block diagram of the on-chip FPA.

Clock Generator Unit

The R3081 is driven from a single input clock which can be

either at the processor rated speed, or at twice that speed. On-

chip, the clock generator unit is responsible for managing the

interaction of the CPU core, caches, and bus interface. The

R3081 includes an on-chip clock doubler to provide higher

frequency signals to the internal execution core; if 1x clock

mode is selected, the clock doubler will internally convert it to

Figure 4. Virtual to Physical Mapping of Base Architecture Versions

1MB Kernel Rsvd

Kernel Cacheable

Tasks

Kernel/User

Cacheable

Tasks

Inaccessible

Kernel Boot

and I/O

0xffffffff

0xc0000000

0xa0000000

0x80000000

0x00000000

1024 MB

2048 MB

512 MB

VIRTUAL PHYSICAL

Kernel Cached

(kseg2)

Kernel Uncached

(kseg1)

Kernel Cached

(kseg0)

User

Cached

(kuseg)

1MB User Rsvd

2889 drw 04

Figure 3. Virtual to Physical Mapping of Extended Architecture

Versions

Kernel Mapped

(kseg2)

Kernel Uncached

(kseg1)

Kernel Cached

(kseg0)

User Mapped

Cacheable

(kuseg)

Physical

Memory

0xffffffff

0xc0000000

0xa0000000

0x80000000

0x00000000

3548MB

512 MB

Any

VIRTUAL PHYSICAL

2889 drw 03

Figure 2. R3081 5-Stage Pipeline

Current

CPU

Cycle

I#1 ALURD MEM WB

I#2 ALURD MEM WB

I#3 ALURD MEM WB

I#4 ALURD MEM WB

I#5 ALURD MEM WB

2889 drw 02

5.5 4

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

a double frequency clock. The 2x clock mode is provided for

compatiblity with the R3051. The clock generator unit replaces

the external delay line required in R3000A based applications.

Instruction Cache

The R3081 implements a 16kB Instruction Cache. The

system may choose to repartition the on-chip caches, so that

the instruction cache is reduced to 8kB but the data cache is

increased to 8kB. The instruction cache is organized with a

line size of 16bytes (four entries). This large cache achieves

hit rates in excess of 98% in most applications, and substantially

contributes to the performance inherent in the R3081. The

cache is implemented as a direct mapped cache, and is

capable of caching instructions from anywhere within the 4GB

physical address space. The cache is implemented using

physical addresses (rather than virtual addresses), and thus

does not require flushing on context switch.

The instruction cache is parity protected over the instruction

word and tag fields. Parity is generated by the read buffer

during cache refill; during cache references, the parity is

checked, and in the case of a parity error, a cache miss is

processed.

Data Cache

The R3081 incorporates an on-chip data cache of 4kB,

organized as a line size of 4 bytes (one word). The R3081

allows the system to reconfigure the on-chip cache from the

default 16kB I-Cache/4kB D-Cache to 8kB of Instruction and

8kB of Data caches.

The relatively large data cache achieves hit rates in excess

of 95% in most applications, and contributes substantially to

the performance inherent in the R3081. As with the instruction

cache, the data cache is implemented as a direct mapped

physical address cache. The cache is capable of mapping any

word within the 4GB physical address space.

The data cache is implemented as a write-through cache,

to insure that main memory is always consistent with the

internal cache. In order to minimize processor stalls due to

data write operations, the bus interface unit incorporates a 4-

deep write buffer which captures address and data at the

processor execution rate, allowing it to be retired to main

memory at a much slower rate without impacting system

performance. Further, support has been provided to allow

hardware based data cache coherency in a multi-master

environment, such as one utilizing DMA from I/O to memory.

The data cache is parity protected over the data and tag

fields. Parity is generated by the read buffer during cache refill;

during cache references, the parity is checked, and in the case

of a parity error, a cache miss is processed.

Bus Interface Unit

The R3081 uses its large internal caches to provide the

majority of the bandwidth requirements of the execution

engine, and thus can utilize a simple bus interface connected

to slower memory devices. Alternately, a high-performance,

low-cost secondary cache can be implemented, allowing the

processor to increase performance in systems where bus

bandwidth is a performance limitation.

As part of the R3051 family, the R3081 bus interface utilizes

a 32-bit address and data bus multiplexed onto a single set of

pins. The bus interface unit also provides an ALE (Address

Latch Enable) output signal to de-multiplex the A/D bus, and

Figure 5. FPA Functional Block Diagram

Cache

Data Data Bus

Instructions Operands

Condition

Codes

Exponent Part Fraction

(32) (32)

Control Unit

and Clocks

(11) (11) (11) (53) (53) (53)

(53) (53) (56)

A B Result Result

Exponent

Unit

Add Unit Round

ResultAB

Divide Unit

Multiply Unit

2889 drw 05

5.5 5

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

simple handshake signals to process CPU read and write

requests. In addition to the read and write interface, the R3051

family incorporates a DMA arbiter, to allow an external master

to control the external bus.

The R3081 also supports hardware based cache coherency

during DMA writes. The R3081 can invalidate a specified line

of data cache, or in fact can perform burst invalidations during

burst DMA writes.

The R3081 incorporates a 4-deep write buffer to decouple

the speed of the execution engine from the speed of the

memory system. The write buffers capture and FIFO processor

address and data information in store operations, and present

it to the bus interface as write transactions at the rate the

memory system can accommodate.

The R3081 read interface performs both single datum

reads and quad word reads. Single reads work with a simple

handshake, and quad word reads can either utilize the simple

handshake (in lower performance, simple systems) or utilize

a tighter timing mode when the memory system can burst data

at the processor clock rate. Thus, the system designer can

choose to utilize page or nibble mode DRAMs (and possibly

use interleaving, if desired, in high-performance systems), or

use simpler techniques to reduce complexity.

In order to accommodate slower quad word reads, the

R3081 incorporates a 4-deep read buffer FIFO, so that the

external interface can queue up data within the processor

before releasing it to perform a burst fill of the internal caches.

The R3081 is R3051 superset compatible in its bus interface.

Specifically, the R3081 has additional support to simplify the

design of very high frequency systems. This support includes

the ability to run the bus interface at one-half the processor

execution rate, as well as the ability to slow the transitions

between reads and writes to provide extra buffer disable time

for the memory interface. However, it is still possible to design

a system which, with no modification to the PC Board or

software, can accept either an R3041, R3051, R3052, R3071,

or R3081.

SYSTEM USAGE

The IDT R3051 family has been specifically designed to

allow a wide variety of memory systems. Low-cost systems

can use slow speed memories and simple controllers, while

other designers may choose to incorporate higher frequencies,

faster memories, and techniques such as DMA to achieve

maximum performance. The R3081 includes specific support

for high perfromance systems, including signals necessary to

implement external secondary caches, and the ability to

perform hardware based cache coherency in multi-master

systems.

Figure 6 shows a typical system implementation.

Transparent latches are used to de-multiplex the R3081

address and data busses from the A/D bus. The data paths

between the memory system elements and the A/D bus is

managed by simple octal devices. A small set of simple PALs

is used to control the various data path elements, and to

control the handshake between the memory devices and the

CPU.

Depending on the cost vs. performance tradeoffs appropriate

to a given application, the system design engineer could

include true burst support from the DRAM to provide for high-

performance cache miss processing, or utilize a simpler,

lower performance memory system to reduce cost and simplify

the design. Similarly, the system designer could choose to

implement techniques such as external secondary cache, or

DMA, to further improve system performance.

DEVELOPMENT SUPPORT

The IDT R3051 family is supported by a rich set of

development tools, ranging from system simulation tools

through PROM monitor and debug support, applications

software and utility libraries, logic analysis tools, sub-system

modules, and shrink wrap operating systems. The R3081,

which is pin and software compatible with the R3051, can

directly utilize these existing tools to reduce time to market.

Figure 7 is an overview of the system development process

typically used when developing R3051 family applications.

The R3051 family is supported in all phases of project

development. These tools allow timely, parallel development

of hardware and software for R3051 family applications, and

include tools such as:

• Optimizing compilers from MIPS, the acknowledged leader

in optimizing compiler technology.

• Cross development tools, available in a variety of

development environments.

• The IDT Evaluation Board, which includes RAM, EPROM,

I/O, and the IDT PROM Monitor.

• IDT/sim, which implements a full prom monitor

(diagnostics, remote debug support, peek/poke, etc.).

• IDT/kit, which implements a run-time support package for

R3051 family systems.

PERFORMANCE OVERVIEW

The R3081 achieves a very high-level of performance. This

performance is based on:

•An efficient execution engine. The CPU performs ALU

operations and store operations in a single cycle, and has

an effective load time of 1.3 cycles, and branch execution

rate of 1.5 cycles (based on the ability of the compilers to

avoid software interlocks). Thus, the execution engine

achieves over 35 VUPS performance when operating out

of cache.

•A full featured floating point accelerator/co-processor.

The R3081 incorporates an R3010A compatible floating

point accelerator on-chip, with independent ALUs for floating

point add, multiply, and divide. The floating point unit is fully

hardware interlocked, and features overlapped operation

and precise exceptions. The FPA allows floating point

adds, multiplies, and divides to occur concurrently with

each other, as well as concurrently with integer operations.

•Large on-chip caches. The R3051 family contains caches

which are substantially larger than those on the majority of

today’s microprocessors. These large caches minimize the

number of bus transactions required, and allow the R3051

family to achieve actual sustained performance very close

to its peak execution rate. The R3081 doubles the cache

available on the R3052, making it a suitable engine for

5.5 6

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 6. R3081 RISChipset Based System

ClkIn

IDT R3081

RISController

Address/Data Control

I/O Controller DRAM

Controller

DRAM DRAMPROM I/O I/O

IDT73720

Bus Exchanger

R3051

Local Bus

2889 drw 06

Figure 7. R3051 Family Development Toolchain

Cache-3051

SPP

Benchmarks

Evaluation Board

Laser Printer System

X-Terminal System

DBG Debugger

PIXIE Profiler

MIPS Compiler Suite

Stand-Alone Libraries

Floating Point Library

Cross Development Tools

Adobe PostScript PDL

MicroSoft TrueImage PDL

PeerlessPage Printer OS

X-Server

Hardware Models

General CAD Tools

Evaluation Board

Laser Printer System

Support Chips

Logic Analysis

Diagnostics

IDT/sim

IDT/kit

In-Circuit Emulation

Remote Debug

Real-Time OS

Software

Hardware

System

Integration

and Verfification

System

Development

Phase

System

Architecture

Evaluation

2889 drw 07

5.5 7

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

many general purpose computing applications, such as

ARC compliant systems.

•Autonomous multiply and divide operations. The R3051

family features an on-chip integer multiplier/divide unit

which is separate from the other ALU. This allows the CPU

to perform multiply or divide operations in parallel with other

integer operations, using a single multiply or divide

instruction rather than “step” operations.

•Integrated write buffer. The R3081 features a four deep

write buffer, which captures store target addresses and

data at the processor execution rate and retires it to main

memory at the slower main memory access rate. Use of on-

chip write buffers eliminates the need for the processor to

stall when performing store operations.

•Burst read support. The R3051 family enables the system

designer to utilize page mode or nibble mode RAMs when

performing read operations to minimize the main memory

read penalty and increase the effective cache hit rates.

These techniques combine to allow the processor to achieve

over 43 VUPS integer performance, 13MFlops of Linpack

performance, and 70,000 dhrystones without the use of external

caches or zero wait-state memory devices.

The performance differences between the various family

members depends on the application software and the design

of the memory system. The impact of the various cache sizes,

and the hardware floating point, can be accurately modeled

using Cache-3051. Since the R3041, R3051, R3052, R3071,

and R3081 are all pin and software compatible, the system

designer has maximum freedom in trading between

performance and cost. A system can be designed, and later

the appropriate CPU inserted into the board, depending on the

desired system performance.

SELECTABLE FEATURES

The R3081 allows the system designer to configure certain

aspects of operation. Some of these options are established

when the device is reset, while others are enabled via the

Config registers:

•BigEndian vs. LittleEndian Byte Ordering. The part can

be configured to operate with either byte ordering. ACE/

ARC systems typically use Little Endian byte ordering.

However, various embedded applications, written originally

for a Big Endian processor such as the MC680x0, are

easier to port to a Big Endian system.

•Data Cache Refill of one or four words. The memory

system must be capable of performing four word refills of

instruction cache misses. The R3081 allows the system

designer to enable D-Cache refill of one or four words

dynamically. Thus, specialized algorithms can choose one

refill size, while the rest of the system can operate with the

other.

•Half-frequency bus mode. The processor can be

configured such that the external bus interface is at one-

half the frequency of the processor core. This simplifies

system design; however, the large on-chip caches mitigate

the performance impact of using a slower system bus clock.

•Slow bus turn-around. The R3081 allows the system

designer to space processor operations, so that more time

is allowed for transitions between memory and the processor

on the multiplexed address/data bus.

•Configurable cache. The R3081 allows the system

designer to use software to select either a 16kB Instruction

Cache/4kB Data Cache organization, or an 8kB Instruction/

8kB Data Cache organization.

•Cache Coherent Interface. The R3081 has an optional

hardware based cache coherency interface intended to

support multi-master systems such as those utilizing DMA

between memory and I/O.

•Optional 1x or 2x clock input. The R3081 can be driven

with an R3051 compatible 2x clock input, or a lower

frequency 1x clock input.

THERMAL CONSIDERATIONS

The R3081 utilizes special packaging techniques to improve

the thermal properties of high-speed processors. Thus, the

R3081 is packaged using cavity down packaging, with an

embedded thermal slug to improve thermal transfer to the

suurrounding air.

The R3081 utilizes the 84-pin MQUAD package (the "MJ"

package), which is an all aluminum package with the die

attached to a normal copper lead-frame mounted to the

aluminum casing. The MQUAD package allows for an efficient

thermal transfer between the die and the case due to the heat

spreading effect of the aluminum. The aluminum offers less

internal resistance from one end of the package to the other,

reducing the temperature gradient across the package and

therefore presenting a greater area for convection and

conduction to the PCB for a given temperature. Even nominal

amounts of airflow will dramatically reduce the junction

temperature of the die, resulting in cooler operation. The

MQUAD package is available at all frequencies, and is pin and

form compatible with the PLCC used for the R3051. Thus,

designers can inter-change R3081s and R3051s in a particular

design, without changing their PC Board.

The R3081 is guaranteed in a case temperature range of

0°C to +85°C. The type of package, speed (power) of the

device, and airflow conditions, affect the equivalent ambient

temperature conditions which will meet this specification.

The equivalent allowable ambient temperature, TA, can be

calculated using the thermal resistance from case to ambient

(ØCA) of the given package. The following equation relates

ambient and case temperatures:

TA = TC - P * ØCA

where P is the maximum power consumption at hot

temperature, calculated by using the maximum Icc specification

for the device.

Typical values for ØCA at various airflows are shown in

Table 1.

Note that the R3081 allows the operational frequency to be

turned down during idle periods to reduce power consumption.

This operation is described in the

R3081 Hardware User's

Guide

. Reducing the operation frequency dramatically reduces

power consumption.

5.5 8

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

ØCA

Airflow (ft/min) 0 200 400 600 800 1000

"MJ" Package* 22 14 12 11 9 8

PLCC Package 29 26 21 18 16 15

2889 tbl 01

Table 1. Thermal Resistance (ØCA) at Various Airflows

(*estimated: final values tbd)

NOTES ON SYSTEM DESIGN

The R3081 has been designed to simplify the task of high-

speed system design. Thus, set-up and hold-time requirements

have been kept to a minimum, allowing a wide variety of

system interface strategies.

To minimize these AC parameters, the R3081 employs

feedback from its SysClk output to the internal bus interface

unit. This allows the R3081 to reference input signals to the

reference clock seen by the external system. The

SysClk

output is designed to provide relatively large AC drive to

minimize skew due to slow rise or fall times. A typical part will

have less than 2ns rise or fall (10% to 90% signal times) when

driving the test load.

Therefore, the system designer should use care when

designing for direct SysClk use. Total loading (due to devices

connected on the signal net and the routing of the net itself)

should be minimized to ensure the SysClk output has a

smooth and rapid transition. Long rise and/or fall times may

cause a degradation in the speed capability of an individual

device.

Similarly, the R3081 employs feedback on its ALE output to

ensure adequate address hold time to ALE. The system

designer should be careful when designing the ALE net to

minimize total loading and to minimize skew between ALE and

the A/D bus, which will ensure adequate address access latch

time.

IDT's field and factory applications groups can provide the

system designer with assistance for these and other design

issues.

5.5 9

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

PIN DESCRIPTION

PIN NAME I/O DESCRIPTION

A/D(31:0) I/O Address/Data: A 32-bit time multiplexed bus which indicates the desired address for a bus transaction

in one phase, and which is used to transmit data between the CPU and external memory resources during

the rest of the transfer.

Bus transactions on this bus are logically separated into two phases: during the first phase, information

about the transfer is presented to the memory system to be captured using the ALE output. This

information consists of:

Address(31:4): The high-order address for the transfer is presented on A/D(31:4).

(3:0): These strobes indicate which bytes of the 32-bit bus will be involved in

the transfer, and are presented on A/D(3:0).

During write cycles, the bus contains the data to be stored and is driven from the internal write buffer.

On read cycles, the bus receives the data from the external resource, in either a single data transaction

or in a burst of four words, and places it into the on-chip read buffer.

During cache coherency operations, the R3081 monitors the A/D bus at the start of a DMA write to capture

the write target address for potential data cache invalidates.

Addr(3:2) O Low Address (3:2) A 2-bit bus which indicates which word is currently expected by the processor.

Specifically, this two bit bus presents either the address bits for the single word to be transferred (writes

or single datum reads) or functions as a two bit counter starting at ‘00’ for burst read operations.

During cache coherency operations, the R3081 monitors the Addr bus at the start of a DMA write to

capture the write target address for potential data cache invalidates.

Diag(1) O Diagnostic Pin 1. This output indicates whether the current bus read transaction is due to an on-chip

cache miss, and also presents part of the miss address. The value output on this pin is time multiplexed:

Cached: During the phase in which the A/D bus presents address information, this

pin is an active HIGH output which indicates whether the current read is

a result of a cache miss.

Miss Address (3): During the remainder of the read operation, this output presents address

bit (3) of the address the processor was attempting to reference when the

cache miss occurred. Regardless of whether a cache miss is being

processed, this pin reports the transfer address during this time.

On write cycles, this output signals whether the data being written as retained in the on-chip data cache.

The value of this pin is time multiplexed during writes:

Cached: During the address phase of write transactions, this signal is an active

high output which indicates that the store data was retained in the on-chip

data cache.

Reserved: The value of this pin during the data phase of writes is reserved.

Diag(0) O Diagnostic Pin 0. This output distinguishes cache misses due to instruction references from those

due to data references, and presents the remaining bit of the miss address. The value output on this

pin is also time multiplexed:

:If the “Cached” Pin indicates a cache miss, then a high on this pin at this

time indicates an instruction reference, and a low indicates a data

reference. If the read is not due to a cache miss but rather an uncached

reference, then this pin is undefined during this phase.

Miss Address (2): During the remainder of the read operation, this output presents

address bit (2) of the address the processor was attempting to

reference when the cache miss occurred. Regardless of whether a

cache miss is being processed, this pin reports the transfer address

during this time.

During write cycles, the value of this pin during both the address and data phases is reserved.

2889 tbl 02

5.5 10

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

PIN DESCRIPTION (Continued):

PIN NAME I/O DESCRIPTION

ALE I/O Address Latch Enable: Used to indicate that the A/D bus contains valid address information for the bus

transaction. This signal is used by external logic to capture the address for the transfer, typically using

transparent latches.

During cache coherency operations, the R3081 monitors ALE at the start of a DMA write, to capture the write

target address for potential data cache invalidates.

ORead: An output which indicates that the current bus transaction is a read.

I/O Write: An output which indicates that the current bus transaction is a write. During coherent DMA, this input

indicates that the current transfer is a write.

DataEn

OExternal Data Enable: This signal indicates that the A/D bus is no longer being driven by the processor during

read cycles, and thus the external memory system may enable the drivers of the memory system onto this bus

without having a bus conflict occur. During write cycles, or when no bus transaction is occurring, this signal is

negated, thus disabling the external memory drivers

Burst/

OBurst Transfer/Write Near: On read transactions, the

Burst

signal indicates that the current bus read is

WrNear

requesting a block of four contiguous words from memory. This signal is asserted only in read cycles due to

cache misses; it is asserted for all I-Cache miss read cycles, and for D-Cache miss read cycles if quad word refill

is currently selected.

On write transactions, the

WrNear

output tells the external memory system that the bus interface unit is

performing back-to-back write transactions to an address within the same 512 word page as the prior write

transaction. This signal is useful in memory systems which employ page mode or static column DRAMs, and

allows near writes to be retired quickly.

Ack

IAcknowledge: An input which indicates to the device that the memory system has sufficiently processed the

bus transaction, and that the CPU may either terminate the write cycle or process the read data from this read

transfer.

During Coherent DMA, this input indicates that the current write transfer is completed, and that the internal

invalidation address counter should be incremented.

RdCEn

IRead Buffer Clock Enable: An input which indicates to the device that the memory system has placed valid

data on the A/D bus, and that the processor may move the data into the on-chip Read Buffer.

SysClk

OSystem Reference Clock: An output from the CPU which reflects the timing of the internal processor "Sys"

clock. This clock is used to control state transitions in the read buffer, write buffer, memory controller, and bus

interface unit. This clock will either be at the same frequency as the CPU execution rate clock, or at one-half

that frequency, as selected during reset.

BusReq

IDMA Arbiter Bus Request: An input to the device which requests that the CPU tri-state its bus interface signals

so that they may be driven by an external master.

BusGnt

ODMA Arbiter Bus Grant. An output from the CPU used to acknowledge that a

BusReq

has been detected, and

that the bus is relinquished to the external master.

IvdReq

IInvalidate Request. An input provided by an external DMA controller to request that the CPU invalidate the

Data Cache line corresponding to the current DMA write target address. This signal is the same pin as Diag(0)

CohReq

ICoherent DMA Request. An input used by the external DMA controller to indicate that the requested DMA

operations could involve hardware cache coherency. This signal is the Rsvd(0) of the R3051.

SBrCond(3:2) I Branch Condition Port: These external signals are internally connected to the CPU signals CpCond(3:0).

BrCond(0) These signals can be used by the branch on co-processor condition instructions as input ports. There are two

types of Branch Condition inputs: the SBrCond inputs have special internal logic to synchronize the inputs, and

thus may be driven by asynchronous agents. The direct Branch Condition inputs must be driven synchronously.

Note that BrCond(1) is used by the internal FPA, and thus is not available on an external pin.

BusError

IBus Error: Input to the bus interface unit to terminate a bus transaction due to an external bus error. This signal

is only sampled during read and write operations. If the bus transaction is a read operation, then the CPU will

take a bus error exception.

2889 tbl 03

5.5 11

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

PIN NAME I/O DESCRIPTION

Int

(5:3) I Processor Interrupt: During normal operation, these signals are logically the same as the

Int

(5:0)

SInt

(2:0)

signals of the R3000. During processor reset, these signals perform mode initialization of the CPU, but in a

different (simpler) fashion than the interrupt signals of the R3000.

There are two types of interrupt inputs: the

SInt

inputs are internally synchronized by the processor, and may

be driven by an asynchronous external agent. The direct interrupt inputs are not internally synchronized, and

thus must be externally synchronized to the CPU. The direct interrupt inputs have one cycle lower latency than

the synchronized interrupts. Note that the interrupt used by the on-chip FPA will not be monitored externally.

ClkIn I Master Clock Input: This input clock can be provided at the execution frequency of the CPU (1x clock mode)

or at twice that frequency (2x clock mode), as selected at reset.

Reset

IMaster Processor Reset: This signal initializes the CPU. Mode selection is performed during the last cycle

Reset

Rsvd(4:1) I/O Reserved: These four signal pins are reserved for testing and for future revisions of this device. Users must not

connect these pins. Note that Rsvd(0) of the R3051 is now used for the

CohReq

input pin.

PIN DESCRIPTION (Continued):

ABSOLUTE MAXIMUM RATINGS(1, 3)

Symbol Rating Commercial Military Unit

VTERM Terminal Voltage –0.5 to +7.0 –0.5 to +7.0 V

with Respect

to GND

TCOperating Case 0 to +85 –55 to +125 °C

Temperature

TBIAS Case Temperature –55 to +125 –65 to +135 °C

Under Bias

TSTG Storage –55 to +125 –65 to +155 °C

Temperature

VIN Input Voltage –0.5 to +7.0 –0.5 to +7.0 V

NOTES:

1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS

may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any other conditions

above those indicated in the operational sections of this specification is not

implied. Exposure to absolute maximum rating conditions for extended

periods may affect reliability.

2. VIN minimum = –3.0V for pulse width less than 15ns.

VIN should not exceed VCC +0.5V.

3. Not more than one output should be shorted at a time. Duration of the short

should not exceed 30 seconds.

2889 tbl 05

OUTPUT LOADING FOR AC TESTING

Signal CLD

SysClk

50 pf

All Others 25 pf

2889 tbl 08

Symbol Parameter Min. Max. Unit

VIH Input HIGH Voltage 3.0 — V

VIL Input LOW Voltage — 0 V

VIHS Input HIGH Voltage 3.0 — V

VILS Input LOW Voltage — 0 V

2889 tbl 06

AC TEST CONDITIONS—RV3081

–

+To Device

Under Test

CLD

–4mA

+4mA

VREF

+1.5V

2889 drw 08

AC TEST CONDITIONS—R3081

2889 tbl 06

Symbol Parameter Min. Max. Unit

VIH Input HIGH Voltage 3.0 — V

VIL Input LOW Voltage — 0 V

VIHS Input HIGH Voltage 3.5 — V

VILS Input LOW Voltage — 0 V

2889 tbl 04

RECOMMENDED OPERATING

TEMPERATURE AND SUPPLY VOLTAGE

2889 tbl 07

Grade Temperature(Case) GND VCC

Military –55°C to +125°C 0V 5.0 ±10%

Commercial 0°C to +85°C 0V 5.0 ±5%

Commercial 0°C to +85°C 0V 3.3 ±5%

5.5 12

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

20MHz 25MHz

Symbol Parameter Test Conditions Min. Max. Min. Max. Units

VOH Output HIGH Voltage VCC = Min., IOH = –4mA 2.4 — 2.4 — V

VOL Output LOW Voltage VCC = Min., IOL = 4mA — 0.4 — 0.4 V

VIH Input HIGH Voltage(3) — 2.0 — 2.0 — V

VIL Input LOW Voltage(1) — — 0.8 — 0.8 V

VIHS Input HIGH Voltage(2,3) — 2.8 — 2.8 — V

VILS Input LOW Voltage(1,2) — — 0.4 — 0.4 V

CIN Input Capacitance(4,5) — — 10 — 10 pF

COUT Output Capacitance(4,5) — — 10 — 10 pF

ICC Operating Current VCC = 3.3V, TA = 25°C — 375 — 425 mA

IIH Input HIGH Leakage VIH = VCC — 100 — 100 µA

IIL Input LOW Leakage VIL = GND –100 — –100 — µA

IOZ Output Tri-state Leakage VOH = 2.4V, VOL = 0.5V –100 100 –100 100 µA

DC ELECTRICAL CHARACTERISTICS RV3081

COMMERCIAL TEMPERATURE RANGE(1, 2)— (TC = 0°C to +85°C, VCC = +3.3V ±5%)

2889 tbl 09

NOTES:

1. VIL Min. = –3.0V for pulse width less than 15ns. VIL should not fall below -0.5V for larger periods.

2. VIHS and VILS apply to CIkIn and

Reset

3. VIH should not be held above VCC + 0.5V.

4. Guaranteed by design.

5. ALE is 12pF for SysClk values CIN and COUT for all speeds.

AC ELECTRICAL CHARACTERISTICS RV3081

COMMERCIAL TEMPERATURE RANGE (1, 2)— (TC = 0°C to +85°C, VCC = +3.3V ±5%)

20MHz 25MHz

Symbol Signals Description Min. Max. Min. Max. Unit

BusReq

Ack

BusError

, Set-up to

SysClk

rising 6 — 5 — ns

RdCEn

CohReq

t1a A/D Set-up to

SysClk

falling 7 — 6 — ns

BusReq

Ack

BusError

, Hold from

SysClk

rising 4 — 4 — ns

RdCEn

CohReq

t2a A/D Hold from

SysClk

falling 2 — 2 — ns

t3 A/D, Addr, Diag, ALE,

Tri-state from

SysClk

rising — 10 — 10 ns

Burst

WrNear

DataEn

t4 A/D, Addr, Diag, ALE,

Driven from

SysClk

falling — 10 — 10 ns

Burst

WrNear

DataEn

BusGnt

Asserted from

SysClk

rising — 8 — 7 ns

BusGnt

Negated from

SysClk

falling — 8 — 7 ns

Burst

WrNear

, A/D Valid from

SysClk

rising — 5 — 5 ns

t8 ALE Asserted from

SysClk

rising — 4 — 4 ns

t9 ALE Negated from

SysClk

falling — 4 — 4 ns

t10 A/D Hold from ALE negated(3) 2— 2— ns

t11

DataEn

Asserted from

SysClk

falling — 15 — 15 ns

t12

DataEn

Asserted from A/D tri-state(3) 0— 0— ns

t14 A/D Driven from

SysClk

rising(3) 0— 0— ns

t15

DataEn

Burst

WrNear

Negated from

SysClk

falling — 7 — 6 ns

t16 Addr(3:2) Valid from

SysClk

—6 —6 ns

t17 Diag Valid from

SysClk

— 12 — 11 ns

5.5 13

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

AC ELECTRICAL CHARACTERISTICS RV3081 (cont.)

COMMERCIAL TEMPERATURE RANGE(1, 2)— (TC = 0°C to +85°C, VCC = +3.3V ±5%)

20MHz 25MHz

Symbol Signals Description Min. Max. Min. Max. Unit

t18 A/D Tri-state from

SysClk

falling — 10 — 10 ns

t19 A/D

SysClk

falling to data valid — 13 — 12 ns

t20 ClkIn (2x clock mode) Pulse Width HIGH 10 — 8 — ns

t21 ClkIn (2x clock mode) Pulse Width LOW 10 — 8 — ns

t22 ClkIn (2x clock mode) Clock Period 25 250 20 250 ns

t23

Reset

Pulse Width from Vcc valid 200 — 200 — µs

t24

Reset

Minimum Pulse Width 32 — 32 — tsys

t25

Reset

Set-up to

SysClk

falling 6 — 5 — ns

t26

Int

Mode set-up to

Reset

rising 10 — 9 — ns

t27

Int

Mode hold from

Reset

rising 0 — 0 — ns

t28

SInt

, SBrCond Set-up to

SysClk

falling 6 — 5 — ns

t29

SInt

, SBrCond Hold from

SysClk

falling 3 — 3 — ns

t30

Int

, BrCond Set-up to

SysClk

falling 6 — 5 — ns

t31

Int

, BrCond Hold from

SysClk

falling 3 — 3 — ns

tsys

SysClk

(full frequency mode) Pulse Width(5) 2*t22 2*t22 2*t22 2*t22 ns

t32

SysClk

(full frequency mode) Clock High Time(5) t22-2 t22+2 t22-2 t22+2 ns

t33

SysClk

(full frequency mode) Clock LOW Time(5) t22-2 t22+2 t22-2 t22+2 ns

tsys/2

SysClk

(half frequency mode) Pulse Width(5)4*t22 4*t22 4*t22 4*t22 4*t22 ns

t34

SysClk

(half frequency mode) Clock HIGH Time(5) 2*t22-2 2*t22+2 2*t22-2 2*t22+2 ns

t35

SysClk

(half frequency mode) Clock LOW Time(5) 2*t22-2 2*t22+2 2*t22-2 2*t22+2 ns

t36 ALESet-up to

SysClk

falling 9 — 8 — ns

t37 ALEHold from

SysClk

falling 2 — 2 — ns

t38 A/DSet-up to ALE falling 10 — 9 — ns

t39 A/DHold from ALE falling 2 — 2 — ns

t40

Set-up to

SysClk

rising 10 — 9 — ns

t41

Hold from

SysClk

rising 3 — 3 — ns

t42 ClkIn (1x clock mode) Pulse Width HIGH(6) 20 — 16 — ns

t43 ClkIn (1x clock mode) Pulse Width LOW(6) 20 — 16 — ns

t44 ClkIn (1x clock mode) Clock Period(6) 50 50 40 50 ns

tderate All outputs Timing deration for loading — 1 — 1 ns/

over CLD(3, 4) 25pF

NOTES: 2889 tbl 11

1. All timings referenced to 1.5V. All timings measured with respect to a 2.5ns rise and fall time.

2. The AC values listed here reference timing diagrams contained in the

R3081 Family Hardware User's Manual

3. Guaranteed by design.

4. This parameter is used to derate the AC timings according to the loading of the system. This parameter provides a deration for loads over the specified

test condition; that is, the deration factor is applied for each 25pF over the specified test load condition.

5. In 1x clock mode, t22 is replaced by t44/2.

6. In 1x clock mode, the design guarantees that the input clock rise and fall times can be as long as 5ns.

5.5 14

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

33MHz 40MHz

Symbol Parameter Test Conditions Min. Max. Min. Max. Units

VOH Output HIGH Voltage VCC = Min., IOH = –4mA 2.4 — 2.4 — V

VOL Output LOW Voltage VCC = Min., IOL = 4mA — 0.4 — 0.4 V

VIH Input HIGH Voltage(3) — 2.0 — 2.0 — V

VIL Input LOW Voltage(1) — — 0.8 — 0.8 V

VIHS Input HIGH Voltage(2,3) — 2.8 — 2.8 — V

VILS Input LOW Voltage(1,2) — — 0.4 — 0.4 V

CIN Input Capacitance(4,5) — — 10 — 10 pF

COUT Output Capacitance(4,5) — — 10 — 10 pF

ICC Operating Current VCC = 3.3V, TA = 25°C — 525 — 600 mA

IIH Input HIGH Leakage VIH = VCC — 100 — 100 µA

IIL Input LOW Leakage VIL = GND –100 — –100 — µA

IOZ Output Tri-state Leakage VOH = 2.4V, VOL = 0.5V –100 100 –100 100 µA

DC ELECTRICAL CHARACTERISTICS RV3081

COMMERCIAL TEMPERATURE RANGE(1, 2)— (TC = 0°C to +85°C, VCC = +3.3V ±5%)

2889 tbl 09

NOTES:

1. VIL Min. = –3.0V for pulse width less than 15ns. VIL should not fall below -0.5V for larger periods.

2. VIHS and VILS apply to CIkIn and

Reset

3. VIH should not be held above VCC + 0.5V.

4. Guaranteed by design.

5. ALE is 12pF for SysClk values CIN and COUT for all speeds.

AC ELECTRICAL CHARACTERISTICS RV3081

COMMERCIAL TEMPERATURE RANGE (1, 2)— (TC = 0°C to +85°C, VCC = +3.3V ±5%)

33MHz 40MHz

Symbol Signals Description Min. Max. Min. Max. Unit

BusReq

Ack

BusError

, Set-up to

SysClk

rising 4 — 3 — ns

RdCEn

CohReq3

t1a A/D Set-up to

SysClk

falling 5 — 4.5 — ns

BusReq

Ack

BusError

, Hold from

SysClk

rising 3 — 3 — ns

RdCEn

CohReq

t2a A/D Hold from

SysClk

falling 1 — 1 — ns

t3 A/D, Addr, Diag, ALE,

Tri-state from

SysClk

rising — 10 — 10 ns

Burst

WrNear

DataEn

t4 A/D, Addr, Diag, ALE,

Driven from

SysClk

falling — 10 — 10 ns

Burst

WrNear

DataEn

BusGnt

Asserted from

SysClk

rising — 6 — 5 ns

BusGnt

Negated from

SysClk

falling — 6 — 5 ns

Burst

WrNear

, A/D Valid from

SysClk

rising — 4 — 3.5 ns

t8 ALE Asserted from

SysClk

rising — 3 — 3 ns

t9 ALE Negated from

SysClk

falling — 3 — 3 ns

t10 A/D Hold from ALE negated(3) 1.5 — 1.5 — ns

t11

DataEn

Asserted from

SysClk

falling — 13 — 12 ns

t12

DataEn

Asserted from A/D tri-state(3) 0— 0— ns

t14 A/D Driven from

SysClk

rising(3) 0— 0— ns

t15

DataEn

Burst

WrNear

Negated from

SysClk

falling — 5 — 4 ns

t16 Addr(3:2) Valid from

SysClk

— 5 — 4.5 ns

t17 Diag Valid from

SysClk

—10 —9 ns

5.5 15

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

AC ELECTRICAL CHARACTERISTICS RV3081 (cont.)

COMMERCIAL TEMPERATURE RANGE(1, 2)— (TC = 0°C to +85°C, VCC = +3.3V ±5%)

33MHz 40MHz

Symbol Signals Description Min. Max. Min. Max. Unit

t18 A/D Tri-state from

SysClk

falling — 9 — 8 ns

t19 A/D

SysClk

falling to data valid — 11 — 10 ns

t20 ClkIn (2x clock mode) Pulse Width HIGH 6.5 — 5.6 — ns

t21 ClkIn (2x clock mode) Pulse Width LOW 6.5 — 5.6 — ns

t22 ClkIn (2x clock mode) Clock Period 15 250 12.5 250 ns

t23

Reset

Pulse Width from Vcc valid 200 — 200 — µs

t24

Reset

Minimum Pulse Width 32 — 32 — tsys

t25

Reset

Set-up to

SysClk

falling 4 — 3 — ns

t26

Int

Mode set-up to

Reset

rising 8 — 7 — ns

t27

Int

Mode hold from

Reset

rising 0 — 0 — ns

t28

SInt

, SBrCond Set-up to

SysClk

falling 4 — 3 — ns

t29

SInt

, SBrCond Hold from

SysClk

falling 2 — 2 — ns

t30

Int

, BrCond Set-up to

SysClk

falling 4 — 3 — ns

t31

Int

, BrCond Hold from

SysClk

falling 2 — 2 — ns

tsys

SysClk

(full frequency mode) Pulse Width(5) 2*t22 2*t22 2*t22 2*t22 ns

t32

SysClk

(full frequency mode) Clock High Time(5) t22-1 t22+1 t22-1 t22+1 ns

t33

SysClk

(full frequency mode) Clock LOW Time(5) t22-1 t22+1 t22-1 t22+1 ns

tsys/2

SysClk

(half frequency mode) Pulse Width(5)4*t22 4*t22 4*t22 4*t22 4*t22 ns

t34

SysClk

(half frequency mode) Clock HIGH Time(5) 2*t22-1 2*t22+1 2*t22-1 2*t22+1 ns

t35

SysClk

(half frequency mode) Clock LOW Time(5) 2*t22-1 2*t22+1 2*t22-1 2*t22+1 ns

t36 ALESet-up to

SysClk

falling 7 — 6 — ns

t37 ALEHold from

SysClk

falling 1 — 1 — ns

t38 A/DSet-up to ALE falling 8 — 8 — ns

t39 A/DHold from ALE falling 1 — 1 — ns

t40

Set-up to

SysClk

rising 8 — 7 — ns

t41

Hold from

SysClk

rising 3 — 3 — ns

t42 ClkIn (1x clock mode) Pulse Width HIGH(6) 13 — 11(6) —ns

t43 ClkIn (1x clock mode) Pulse Width LOW(6) 13 — 11(6) —ns

t44 ClkIn (1x clock mode) Clock Period(6) 30 50 25 50 ns

tderate All outputs Timing deration for loading — 1 — 1 ns/

over CLD(3, 4) 25pF

NOTES: 2889 tbl 11

1. All timings referenced to 1.5V. All timings measured with respect to a 2.5ns rise and fall time.

2. The AC values listed here reference timing diagrams contained in the

R3081 Family Hardware User's Manual

3. Guaranteed by design.

4. This parameter is used to derate the AC timings according to the loading of the system. This parameter provides a deration for loads over the specified

test condition; that is, the deration factor is applied for each 25pF over the specified test load condition.

5. In 1x clock mode, t22 is replaced by t44/2.

6. In 1x clock mode, the design guarantees that the input clock rise and fall times can be as long as 5ns .

5.5 16

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

20MHz 25MHz 33.33MHz 40MHz 50MHZ

Symbol Parameter Test Conditions Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units

VOH Output HIGH Voltage VCC = Min., IOH = –4mA 3.5 — 3.5 — 3.5 — 3.5 — 3.5 — V

VOL Output LOW Voltage VCC = Min., IOL = 4mA — 0.4 — 0.4 — 0.4 — 0.4 — 0.4 V

VIH Input HIGH Voltage(3) — 2.0 — 2.0 — 2.0 — 2.0 — 2.0 — V

VIL Input LOW Voltage(1) — — 0.8 — 0.8 — 0.8 — 0.8 — 0.8 V

VIHS Input HIGH Voltage(2,3) — 3.0 — 3.0 — 3.0 — 3.0 — 3.0 — V

VILS Input LOW Voltage(1,2) — — 0.4 — 0.4 — 0.4 — 0.4 — 0.4 V

CIN Input Capacitance(4) — — 10 — 10 — 10 — 10 — 10 pF

COUT Output Capacitance(4) — — 10 — 10 — 10 — 10 — 10 pF

ICC Operating Current VCC = 5V, TA = 25°C — 475 — 525 — 625 — 700 — 825 mA

IIH Input HIGH Leakage VIH = VCC — 100 — 100 — 100 — 100 — 100 µA

IIL Input LOW Leakage VIL = GND –100 — –100 — –100 — –100 — –100 — µA

IOZ Output Tri-state Leakage VOH = 2.4V, VOL = 0.5V –100 100 –100 100 –100 100 –100 100 –100 100 µA

DC ELECTRICAL CHARACTERISTICS R3081

COMMERCIAL TEMPERATURE RANGE — (TC = 0°C to +85°C, VCC = +5.0V ±5%)

2889 tbl 09

NOTES:

1. VIL Min. = –3.0V for pulse width less than 15ns. VIL should not fall below -0.5V for larger periods.

2. VIHS and VILS apply to CIkIn and

Reset

3. VIH should not be held above VCC + 0.5V.

4. Guaranteed by design.

5.5 17

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

20MHz 25MHz

Symbol Signals Description Min. Max. Min. Max. Unit

BusReq

Ack

BusError

, Set-up to

SysClk

rising 6 — 5 — ns

RdCEn

CohReq

t1a A/D Set-up to

SysClk

falling 7 — 6 — ns

BusReq

Ack

BusError

, Hold from

SysClk

rising 4 — 4 — ns

RdCEn

CohReq

t2a A/D Hold from

SysClk

falling 2 — 2 — ns

t3 A/D, Addr, Diag, ALE,

Tri-state from

SysClk

rising — 10 — 10 ns

Burst

WrNear

DataEn

t4 A/D, Addr, Diag, ALE,

Driven from

SysClk

falling — 10 — 10 ns

Burst

WrNear

DataEn

BusGnt

Asserted from

SysClk

rising — 8 — 7 ns

BusGnt

Negated from

SysClk

falling — 8 — 7 ns

Burst

WrNear

, A/D Valid from

SysClk

rising — 5 — 5 ns

t8 ALE Asserted from

SysClk

rising — 4 — 4 ns

t9 ALE Negated from

SysClk

falling — 4 — 4 ns

t10 A/D Hold from ALE negated 2 — 2 — ns

t11

DataEn

Asserted from

SysClk

falling — 15 — 15 ns

t12

DataEn

Asserted from A/D tri-state(3) 0—0—ns

t14 A/D Driven from

SysClk

rising(3) 0—0—ns

t15

DataEn

Burst

WrNear

Negated from

SysClk

falling — 7 — 6 ns

t16 Addr(3:2) Valid from

SysClk

—6—6ns

t17 Diag Valid from

SysClk

— 12 — 11 ns

t18 A/D Tri-state from

SysClk

falling — 10 — 10 ns

t19 A/D

SysClk

falling to data valid — 13 — 12 ns

t20 ClkIn (2x clock mode) Pulse Width HIGH 10 — 8 — ns

t21 ClkIn (2x clock mode) Pulse Width LOW 10 — 8 — ns

t22 ClkIn (2x clock mode) Clock Period 25 250 20 250 ns

t23

Reset

Pulse Width from VCC valid 200 — 200 — µs

t24

Reset

Minimum Pulse Width 32 — 32 — tsys

t25

Reset

Set-up to

SysClk

falling 6 — 5 — ns

t26

Int

Mode set-up to

Reset

rising 10 — 9 — ns

t27

Int

Mode hold from

Reset

rising 0 — 0 — ns

t28

SInt

, SBrCond Set-up to

SysClk

falling 6 — 5 — ns

t29

SInt

, SBrCond Hold from

SysClk

falling 3 — 3 — ns

t30

Int

, BrCond Set-up to

SysClk

falling 6 — 5 — ns

t31

Int

, BrCond Hold from

SysClk

falling 3 — 3 — ns

tsys

SysClk

(full frequency mode) Pulse Width(5) 2*t22 2*t22 2*t22 2*t22 ns

t32

SysClk

(full frequency mode) Clock HIGH Time(5) t22-2 t22+2 t22-2 t22+2 ns

AC ELECTRICAL CHARACTERISTICS R3081

COMMERCIAL TEMPERATURE RANGE (1, 2) (20, 25MHz)—(TC = 0°C to +85°C, VCC = +5.0V ±5%)

2889 tbl 10

NOTES:

1. All timings referenced to 1.5V. All timings measured with respect to a 2.5ns rise and fall time.

2. The AC values listed here reference timing diagrams contained in the

R3081 Family Hardware User's Manual

3. Guaranteed by design.

4. This parameter is used to derate the AC timings according to the loading of the system. This parameter provides a deration for loads over the specified

test condition; that is, the deration factor is applied for each 25pF over the specified test load condition.

5. In 1x clock mode, t22 is replaced by t44/2.

6. In 1x clock mode, the design guarantees that the input clock rise and fall times can be as long as 5ns, 3ns for 40MHz and 50MHz.

7. When using the Reduced Frequency feature, the minimum allowed internal CPU speed is 0.5 MHz.

5.5 18

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

33MHz 40MHz

Symbol Signals Description Min. Max. Min. Max. Unit

BusReq

Ack

BusError

, Set-up to

SysClk

rising 4 — 3 — ns

RdCEn

CohReq

t1a A/D Set-up to

SysClk

falling 5 — 4.5 — ns

BusReq

Ack

BusError

, Hold from

SysClk

rising 3 — 3 — ns

RdCEn

CohReq

t2a A/D Hold from

SysClk

falling 1 — 1 — ns

t3 A/D, Addr, Diag, ALE,

Tri-state from

SysClk

rising — 10 — 10 ns

Burst

WrNear

DataEn

t4 A/D, Addr, Diag, ALE,

Driven from

SysClk

falling — 10 — 10 ns

Burst

WrNear

DataEn

BusGnt

Asserted from

SysClk

rising — 6 — 5 ns

BusGnt

Negated from

SysClk

falling — 6 — 5 ns

Burst

WrNear

, A/D Valid from

SysClk

rising — 4 — 3.5 ns

t8 ALE Asserted from

SysClk

rising — 3 — 3 ns

t9 ALE Negated from

SysClk

falling — 3 — 3 ns

t10 A/D Hold from ALE negated 1.5 — 1.5 — ns

t11

DataEn

Asserted from

SysClk

falling — 13 — 12 ns

t12

DataEn

Asserted from A/D tri-state(3) 0— 0—ns

t14 A/D Driven from

SysClk

rising(3) 0— 0—ns

t15

DataEn

Burst

WrNear

Negated from

SysClk

falling — 5 — 4 ns

20MHz 25MHz

Symbol Signals Description Min. Max. Min. Max. Unit

t33

SysClk

(full frequency mode) Clock LOW Time(5) t22-2 t22+2 t22-2 t22+2 ns

tsys/2

SysClk

(half frequency mode) Pulse Width (5) 4*t22 4*t22 4*t22 4*t22 ns

t34

SysClk

(half frequency mode) Clock HIGH Time(5) 2*t22-2 2*t22+2 2*t22-2 2*t22+2 ns

t35

SysClk

(half frequency mode) Clock LOW Time(5) 2*t22-2 2*t22+2 2*t22-2 2*t22+2 ns

t36 ALE Set-up to

SysClk

falling 9 — 8 — ns

t37 ALE Hold from

SysClk

falling 2 — 2 — ns

t38 A/D Set-up to ALE falling 10 — 9 — n s

t39 A/D Hold from ALE falling 2 — 2 — ns

t40

Set-up to

SysClk

rising 10 — 9 — ns

t41

Hold from

SysClk

rising 3 — 3 — ns

t42 ClkIn (1x clock mode) Pulse Width HIGH(6) 20 — 16 — ns

t43 ClkIn (1x clock mode) Pulse Width LOW(6) 20 — 16 — ns

t44 ClkIn (1x clock mode) Clock Period(6) 50 50 40 50 ns

tderate All outputs Timing deration for loading — 1 — 1 ns/

over CLD(3, 4) 25pF

AC ELECTRICAL CHARACTERISTICS R3081 (cont.)

COMMERCIAL TEMPERATURE RANGE(1, 2) (20, 25MHz)— (TC = 0°C to +85°C, VCC = +5.0V ±5%)

2889 tbl 11

NOTES:

1. All timings referenced to 1.5V. All timings measured with respect to a 2.5ns rise and fall time.

2. The AC values listed here reference timing diagrams contained in the

R3081 Family Hardware User's Manual

3. Guaranteed by design.

4. This parameter is used to derate the AC timings according to the loading of the system. This parameter provides a deration for loads over the specified

test condition; that is, the deration factor is applied for each 25pF over the specified test load condition.

5. In 1x clock mode, t22 is replaced by t44/2.

6. In 1x clock mode, the design guarantees that the input clock rise and fall times can be as long as 5ns, 3ns for 40MHz and 50MHz.

7. When using the Reduced Frequency feature, the minimum allowed internal CPU speed is 0.5 MHz.

AC ELECTRICAL CHARACTERISTICS R3081

COMMERCIAL TEMPERATURE RANGE (1, 2) (33, 40MHz)— (TC = 0°C to +85°C, VCC = +5.0V ±5%)

2889 tbl 11

5.5 19

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

33MHz 40MHz

Symbol Signals Description Min. Max. Min. Max. Unit

t16 Addr(3:2) Valid from

SysClk

— 5 — 4.5 ns

t17 Diag Valid from

SysClk

—10 —9 ns

t18 A/D Tri-state from

SysClk

falling — 9 — 8 ns

t19 A/D

SysClk

falling to data valid — 11 — 10 ns

t20 ClkIn (2x clock mode) Pulse Width HIGH 6.5 — 5.6 — ns

t21 ClkIn (2x clock mode) Pulse Width LOW 6.5 — 5.6 — ns

t22 ClkIn (2x clock mode) Clock Period 15 250 12.5 250 ns

t23

Reset

Pulse Width from VCC valid 200 — 200 — µs

t24

Reset

Minimum Pulse Width 32 — 32 — tsys

t25

Reset

Set-up to

SysClk

falling 4 — 3 ns

t26

Int

Mode set-up to

Reset

rising 8 — 7 — ns

t27

Int

Mode hold from

Reset

rising 0 — 0 — ns

t28

SInt

, SBrCond Set-up to

SysClk

falling 4 — 3 — ns

t29

SInt

, SBrCond Hold from

SysClk

falling 2 — 2 — ns

t30

Int

, BrCond Set-up to

SysClk

falling 4 — 3 — ns

t31

Int

, BrCond Hold from

SysClk

falling 2 — 2 — ns

tsys

SysClk

(full frequency mode) Pulse Width(5) 2*t22 2*t22 2*t22 2*t22 ns

t32

SysClk

(full frequency mode) Clock HIGH Time(5) t22-1 t22+1 t22-1 t22+1 ns

t33

SysClk

(full frequency mode) Clock LOW Time(5) t22-1 t22+1 t22-1 t22+1 ns

tsys/2

SysClk

(half frequency mode) Pulse Width(5) 4*t22 4*t22 4*t22 4*t22 ns

t34

SysClk

(half frequency mode) Clock HIGH Time(5) 2*t22-1 2*t22+1 2*t22-1 2*t22+1 ns

t35

SysClk

(half frequency mode) Clock LOW Time(5) 2*t22-1 2*t22+1 2*t22-1 2*t22+1 ns

t36 ALE Set-up to

SysClk

falling 7 — 6 — ns

t37 ALE Hold from

SysClk

falling 1 — 1 — ns

t38 A/D Set-up to ALE falling 8 — 8 — ns

t39 A/D Hold from ALE falling 1 — 1 — ns

t40

Set-up to

SysClk

rising 8 — 7 — ns

t41

Hold from

SysClk

rising 3 — 3 — ns

t42 ClkIn (1x clock mode) Pulse Width HIGH(6) 13 — 11(6) —ns

t43 ClkIn (1x clock mode) Pulse Width LOW(6) 13 — 11(6) —ns

t44 ClkIn (1x clock mode) Clock Period(6) 30 50 25 50 ns

tderate All outputs Timing deration for loading over CLD(3, 4) — 1 — 1 ns/

25pF

AC ELECTRICAL CHARACTERISTICS R3081 (cont.)

COMERCIAL TEMPERATURE RANGE (1, 2) (33, 40MHz)— (TC = 0°C to +85°C, VCC = +5.0V ±5%)

2889 tbl 11

NOTES:

1. All timings referenced to 1.5V. All timings measured with respect to a 2.5ns rise and fall time.

2. The AC values listed here reference timing diagrams contained in the

R3081 Family Hardware User's Manual

3. Guaranteed by design.

4. This parameter is used to derate the AC timings according to the loading of the system. This parameter provides a deration for loads over the specified

test condition; that is, the deration factor is applied for each 25pF over the specified test load condition.

5. In 1x clock mode, t22 is replaced by t44/2.

6. In 1x clock mode, the design guarantees that the input clock rise and fall times can be as long as 5ns, 3ns for 40 and 50MHz.

7. When using the Reduced Frequency feature, the minimum allowed internal CPU speed is 0.5 MHz.

5.5 20

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

50MHz

Symbol Signals Description Min. Max. Unit

BusReq

Ack

BusError

, Set-up to

SysClk

rising 5 — ns

RdCEn

CohReq

t1a A/D Set-up to

SysClk

falling 6 — ns

BusReq

Ack

BusError

, Hold from

SysClk

rising 4 — ns

RdCEn

CohReq

t2a A/D Hold from

SysClk

falling 2 — ns

t3 A/D, Addr, Diag, ALE,

Tri-state from

SysClk

rising — 10 ns

Burst

WrNear

DataEn

t4 A/D, Addr, Diag, ALE,

Driven from

SysClk

falling — 10 ns

Burst

WrNear

DataEn

BusGnt

Asserted from

SysClk

rising — 7 ns

BusGnt

Negated from

SysClk

falling — 7 ns

Burst

WrNear

, A/D Valid from

SysClk

rising — 5 ns

t8 ALE Asserted from

SysClk

rising — 4 ns

t9 ALE Negated from

SysClk

falling — 4 ns

t10 A/D Hold from ALE negated 1.5 — ns

t11

DataEn

Asserted from

SysClk

falling — 15 ns

t12

DataEn

Asserted from A/D tri-state(3) 0—ns

t14 A/D Driven from

SysClk

rising(3) 0—ns

t15

DataEn

Burst

WrNear

Negated from

SysClk

falling — 6 ns

t16 Addr(3:2) Valid from

SysClk

—6ns

t17 Diag Valid from

SysClk

—11ns

t18 A/D Tri-state from

SysClk

falling — 10 ns

t19 A/D

SysClk

falling to data valid — 12 ns

t20 ClkIn (2x clock mode) Pulse Width HIGH N/A (8) ns

t21 ClkIn (2x clock mode) Pulse Width LOW N/A (8) ns

t22 ClkIn (2x clock mode) Clock Period N/A (7, 8) ns

t23

Reset

Pulse Width from VCC valid 200 — µs

t24

Reset

Minimum Pulse Width 32 — tsys

t25

Reset

Set-up to

SysClk

falling 5 ns

t26

Int

Mode set-up to

Reset

rising 9 — ns

t27

Int

Mode hold from

Reset

rising 0 — ns

t28

SInt

, SBrCond Set-up to

SysClk

falling 5 — ns

t29

SInt

, SBrCond Hold from

SysClk

falling 3 — ns

t30

Int

, BrCond Set-up to

SysClk

falling 5 — ns

t31

Int

, BrCond Hold from

SysClk

falling 3 — ns

tsys

SysClk

(full frequency mode) Pulse Width(5) N/A (8) N/A (8) ns

t32

SysClk

(full frequency mode) Clock HIGH Time(5) N/A (8) N/A (8) ns

t33

SysClk

(full frequency mode) Clock LOW Time(5) N/A (8) N/A (8) ns

AC ELECTRICAL CHARACTERISTICS R3081

COMMERCIAL TEMPERATURE RANGE (1, 2) (50MHz)— (TC = 0°C to +85°C, VCC = +5.0V ±5%)

NOTES:

1. All timings referenced to 1.5V. All timings measured with respect to a 2.5ns rise and fall time.

2. The AC values listed here reference timing diagrams contained in the

R3081 Family Hardware User's Manual

3. Guaranteed by design.

4. This parameter is used to derate the AC timings according to the loading of the system. This parameter provides a deration for loads over the specified

test condition; that is, the deration factor is applied for each 25pF over the specified test load condition.

5. In 1x clock mode, t22 is replaced by t44/2.

6. In 1x clock mode, the design guarantees that the input clock rise and fall times can be as long as 5ns, 3ns for 40MHz and 50MHz.

7. When using the Reduced Frequency feature, the minimum allowed internal CPU speed is 0.5 MHz.

8. For the 50MHz version, 1x Clock Mode and half-frequency bus mode only.

2889 tbl 11

5.5 21

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

AC ELECTRICAL CHARACTERISTICS R3081 (cont.)

COMERCIAL TEMPERATURE RANGE (1, 2) (50MHz)— (TC = 0°C to +85°C, VCC = +5.0V ±5%)

50MHz

Symbol Signals Description Min. Max. Unit

tsys/2

SysClk

(half frequency mode) Pulse Width(5) 2*t44 2*t44 ns

t34

SysClk

(half frequency mode) Clock HIGH Time(5) t44-1 t44+1 ns

t35

SysClk

(half frequency mode) Clock LOW Time(5) t44-1 t44+1 ns

t36 ALE Set-up to

SysClk

falling 8 — ns

t37 ALE Hold from

SysClk

falling 2 — ns

t38 A/D Set-up to ALE falling 9 — ns

t39 A/D Hold from ALE falling 2 — ns

t40

Set-up to

SysClk

rising 9 — ns

t41

Hold from

SysClk

rising 3 — ns

t42 ClkIn (1x clock mode) Pulse Width HIGH(6) 16(6) —ns

t43 ClkIn (1x clock mode) Pulse Width LOW(6) 16(6) —ns

t44 ClkIn (1x clock mode) Clock Period(6) 40 50 ns

tderate All outputs Timing deration for loading over CLD(3, 4) — 1 ns/

25pF

NOTES:

1. All timings referenced to 1.5V. All timings measured with respect to a 2.5ns rise and fall time.

2. The AC values listed here reference timing diagrams contained in the

R3081 Family Hardware User's Manual

3. Guaranteed by design.

4. This parameter is used to derate the AC timings according to the loading of the system. This parameter provides a deration for loads over the specified

test condition; that is, the deration factor is applied for each 25pF over the specified test load condition.

5. In 1x clock mode, t22 is replaced by t44/2.

6. In 1x clock mode, the design guarantees that the input clock rise and fall times can be as long as 5ns, 3ns for 40MHz and 50MHz.

7. When using the Reduced Frequency feature, the minimum allowed internal CPU speed is 0.5 MHz.

8. For the 50MHz version, 1x Clock Mode and half-frequencybus mode only.

5.5 22

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

AC ELECTRICAL CHARACTERISTICS R3081

MILITARY TEMPERATURE RANGE (1, 2)— (TC(7) = -55°C to +125°C, VCC = +5.0V ±10%)

20MHz 25MHz

Symbol Signals Description Min. Max. Min. Max. Unit

BusReq

Ack

BusError

, Set-up to

SysClk

rising 6 — 5 — ns

RdCEn

CohReq

t1a A/D Set-up to

SysClk

falling 7 — 6 — ns

BusReq

Ack

BusError

, Hold from

SysClk

rising 4 — 4 — ns

RdCEn

CohReq

t2a A/D Hold from

SysClk

falling 2 — 2 — ns

t3 A/D, Addr, Diag, ALE,

Tri-state from

SysClk

rising — 10 — 10 ns

Burst

WrNear

DataEn

t4 A/D, Addr, Diag, ALE,

Driven from

SysClk

falling — 10 — 10 ns

Burst

WrNear

DataEn

BusGnt

Asserted from

SysClk

rising — 8 — 7 ns

BusGnt

Negated from

SysClk

falling — 8 — 7 ns

Burst

WrNear

, A/D Valid from

SysClk

rising — 5 — 5 ns

t8 ALE Asserted from

SysClk

rising — 4.5 — 4.5 ns

t9 ALE Negated from

SysClk

falling — 4 — 4 ns

t10 A/D Hold from ALE negated(3) 1.5 — 1.5 — ns

t11

DataEn

Asserted from

SysClk

falling — 15 — 15 ns

t12

DataEn

Asserted from A/D tri-state(3) 0—0—ns

t14 A/D Driven from

SysClk

rising(3) 0—0—ns

t15

DataEn

Burst

WrNear

Negated from

SysClk

falling — 7 — 6 ns

t16 Addr(3:2) Valid from

SysClk

—6—6ns

t17 Diag Valid from

SysClk

— 12 — 11 ns

20MHz 25MHz

Symbol Parameter Test Conditions Min. Max. Min. Max. Units

VOH Output HIGH Voltage VCC = Min., IOH = –4mA 2.4 — 2.4 — V

VOL Output LOW Voltage VCC = Min., IOL = 4mA — 0.4 — 0.4 V

VIH Input HIGH Voltage(3) — 2.0 — 2.0 — V

VIL Input LOW Voltage(1) — — 0.8 — 0.8 V

VIHS Input HIGH Voltage(2,3) — 2.8 — 2.8 — V

VILS Input LOW Voltage(1,2) — — 0.4 — 0.4 V

CIN Input Capacitance(4) — — 12 — 12 pF

COUT Output Capacitance(4) — — 12 — 12 pF

ICC Operating Current VCC = 5.0V, TA = 25°C — 550 — 650 mA

IIH Input HIGH Leakage VIH = VCC — 100 — 100 µA

IIL Input LOW Leakage VIL = GND –100 — –100 — µA

IOZ Output Tri-state Leakage VOH = 2.4V, VOL = 0.5V –100 100 –100 100 µA

DC ELECTRICAL CHARACTERISTICS R3081

MILITARY TEMPERATURE RANGE— (TC(5) = -55°C to +125°C, VCC = +5.0V ±10%)

2889 tbl 09

NOTES:

1. VIL Min. = –3.0V for pulse width less than 15ns. VIL should not fall below -0.5V for larger periods.

2. VIHS and VILS apply to CIkIn and

Reset

3. VIH should not be held above VCC + 0.5V.

4. Guaranteed by design.

5. Case Temperatures are "instant on."

5.5 23

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

AC ELECTRICAL CHARACTERISTICS R3081 (cont.)

MILITARY TEMPERATURE RANGE(1, 2)— (TC(7) = -55°C to +125°C, VCC = +5.0V ±10%)

20MHz 25MHz

Symbol Signals Description Min. Max. Min. Max. Unit

t18 A/D Tri-state from

SysClk

falling — 10 — 10 ns

t19 A/D

SysClk

falling to data valid — 13 — 12 ns

t20 ClkIn (2x clock mode) Pulse Width HIGH 10 — 8 — ns

t21 ClkIn (2x clock mode) Pulse Width LOW 10 — 8 — ns

t22 ClkIn (2x clock mode) Clock Period 25 250 20 250 ns

t23

Reset

Pulse Width from Vcc valid 200 — 200 — µs

t24

Reset

Minimum Pulse Width 32 — 32 — tsys

t25

Reset

Set-up to

SysClk

falling 6 — 5 — ns

t26

Int

Mode set-up to

Reset

rising 10 — 9 — ns

t27

Int

Mode hold from

Reset

rising 0 — 0 — ns

t28

SInt

, SBrCond Set-up to

SysClk

falling 6 — 5 — ns

t29

SInt

, SBrCond Hold from

SysClk

falling 3.5 — 3 — ns

t30

Int

, BrCond Set-up to

SysClk

falling 6 — 5 — ns

t31

Int

, BrCond Hold from

SysClk

falling 3.5 — 3 — ns

tsys

SysClk

(full frequency mode) Pulse Width(5) 2*t22 2*t22 2*t22 2*t22 ns

t32

SysClk

(full frequency mode) Clock High Time(5) t22-2 t22+2 t22-2 t22+2 ns

t33

SysClk

(full frequency mode) Clock LOW Time(5) t22-2 t22+2 t22-2 t22+2 ns

tsys/2

SysClk

(half frequency mode) Pulse Width(5) 4*t22 4*t22 4*t22 4*t22 ns

t34

SysClk

(half frequency mode) Clock HIGH Time(5) 2*t22-2 2*t22+2 2*t22-2 2*t22+2 ns

t35

SysClk

(half frequency mode) Clock LOW Time(5) 2*t22-2 2*t22+2 2*t22-2 2*t22+2 ns

t36 ALE Set-up to

SysClk

falling 9 — 8 — ns

t37 ALE Hold from

SysClk

falling 2 — 2 — ns

t38 A/D Set-up to ALE falling 10 — 9 — ns

t39 A/D Hold from ALE falling 2 — 2 — ns

t40

Set-up to

SysClk

rising 10 — 9 — ns

t41

Hold from

SysClk

rising 3 — 3 — ns

t42 ClkIn (1x clock mode) Pulse Width HIGH(6) 20 — 16 — ns

t43 ClkIn (1x clock mode) Pulse Width LOW(6) 20 — 16 — ns

t44 ClkIn (1x clock mode) Clock Period(6) 50 50 40 50 ns

tderate All outputs Timing deration for loading — 1 — 1 ns/

over CLD(3, 4) 25pF

NOTES: 2889 tbl 11

1. All timings referenced to 1.5V. All timings measured with respect to a 2.5ns rise and fall time.

2. The AC values listed here reference timing diagrams contained in the

R3081 Family Hardware User's Manual

3. Guaranteed by design.

4. This parameter is used to derate the AC timings according to the loading of the system. This parameter provides a deration for loads over the specified

test condition; that is, the deration factor is applied for each 25pF over the specified test load condition.

5. In 1x clock mode, t22 is replaced by t44/2.

6. In 1x clock mode, the design guarantees that the input clock rise and fall times can be as long as 5ns.

7. Case Temperatures are "instant on."

5.5 24

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

PIN CONFIGURATIONS

NOTE:

Reserved Pins must not be connected.

Vss

Vcc

A/D(14)

A/D(13)

A/D(12)

A/D(11)

A/D(10)

A/D(9)

Vcc

Vss

A/D(8)

A/D(7)

A/D(6)

A/D(5)

A/D(4)

A/D(3)

Vss

Vcc

A/D(2)

A/D(1)

A/D(0)

Burst/WrNear

Addr(3)

Addr(2)

Vcc

Vss

Diag(1)

ALE

DataEn

Vcc

Vss

SysClk

BusGnt

Reset

BusError

Ack

RdCEn

BusReq

BrCond(0)

Vss

Vcc

ClkIn

Rsvd(4)

Rsvd(3)

Rsvd(2)

Rsvd(1)

CohReq

Int(5)

Vss

Vcc

Int(4)

Int(3)

SInt(2)

SInt(1)

SInt(0)

SBrCond(3)

SBrCond(2)

Vss

Vcc

A/D(15)

A/D(16)

A/D(17)

A/D(18)

A/D(19)

A/D(20)

Vss

Vcc

A/D(21)

A/D(22)

A/D(23)

A/D(24)

A/D(25)

A/D(26)

Vcc

Vss

A/D(27)

A/D(28)

A/D(29)

A/D(30)

A/D(31)

184

12 75

33 54

Diag(0)/

IvdReq

2889 drw 08

84-Pin MQUAD/PLCC

Top View

5.5 25

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Vss

Vcc

A/D(14)

A/D(13)

A/D(12)

A/D(11)

A/D(10)

A/D(9)

Vcc

Vss

A/D(8)

A/D(7)

A/D(6)

A/D(5)

A/D(4)

A/D(3)

Vss

Vcc

A/D(2)

A/D(1)

A/D(0)

Burst/WrNear

Addr(3)

Addr(2)

Vcc

Vss

Diag(1)

ALE

DataEn

Vcc

Vss

SysClk

BusGnt

Reset

BusError

Ack

RdCEn

BusReq

BrCond(0)

Vss

Vcc

ClkIn

Rsvd(4)

Rsvd(3)

Rsvd(2)

Rsvd(1)

CohReq

Int(5)

Vss

Vcc

Int(4)

Int(3)

SInt(2)

SInt(1)

SInt(0)

SBrCond(3)

SBrCond(2)

Vss

Vcc

A/D(15)

A/D(16)

A/D(17)

A/D(18)

A/D(19)

A/D(20)

Vss

Vcc

A/D(21)

A/D(22)

A/D(23)

A/D(24)

A/D(25)

A/D(26)

Vcc

Vss

A/D(27)

A/D(28)

A/D(29)

A/D(30)

A/D(31)

43 64

Diag(0)/

IvdReq

PIN CONFIGURATIONS

NOTE:

Reserved Pins must not be connected.

84-Pin FD

Top View

5.5 26

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

2905 drw 06

1121314 2345678910111516171819202122232425

50 545253 55565758596051 616263646566676869707172737475

100

RV3081 Y

100-Pin

TQFP

(Cavity Up)

Top View

VCC

A/D(14)

A/D(13)

A/D(12)

A/D(11)

A/D(10)

A/D(9)

VCC

VSS

A/D(8)

A/D(7)

A/D(6)

A/D(5)

A/D(4)

A/D(3)

VSS

VCC

A/D(2)

A/D(1)

A/D(0)

VSS

SBrCond(2)

SBrCond(3)

VCC

ClkIn

Int(5)

VSS

VCC

Int(4)

Int(3)

SInt(2)

SInt(1)

SInt(0)

VSS

VCC

RSVD(4)

RSVD(3)

RSVD(2)

RSVD(1)

CohReQ

VSS

VCC

Burst/WrNear

Addr(3)

Addr(2)

Diag(1)

ALE

DataEn

SysClk

BusGnt

Reset

BusError

Ack

RdCEn

BusReq

BrCond(0)

DIAG0/

IvdReq

A/D(15)

A/D(16)

A/D(17)

A/D(18)

A/D(19)

A/D(20)

A/D(21)

A/D(22)

A/D(23)

A/D(24)

A/D(25)

A/D(26)

A/D(27)

A/D(28)

A/D(29)

A/D(30)

A/D(31)

5.5 27

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 8 (a). R3081 Clocking (1x clock input mode, full frequency bus)

Figure 8 (b). R3081Clocking (1x clock input mode, half-frequency bus)

Figure 8 (c). R3081 Clocking (2x clock input mode, half-frequency bus)

Figure 8 (d). R3081 Clocking (2x clock input mode, full-frequency bus)

ClkIn

SysClk

sys

2889 drw 12

ClkIn

SysClk

t42 t43

t44

t34

tsys/2

t35

2889 drw 13

ClkIn

SysClk

t20 t21

t22

t35

tsys/2

t34

2889 drw 14

ClkIn

SysClk

t20 t21

t22

t32

tSYS

t33

2889 drw 15

5.5 28

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 9. Power-On Reset Sequence

Figure 10. Warm Reset Sequence

Figure 11. Mode Selection and Negation of Reset

Vcc

ClkIn

Reset

t23

2889 drw 16

ClkIn

Reset

t24

2889 drw 17

SysClk

Reset

Int(n)

t25

t26

t27 2889 drw 18

5.5 29

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 12. Single Datum Read in R3081

SysClk

A/D(31:0)

ALE

Addr(3:2)

DataEn

RdCEn

Ack

Burst

Diag(1)

Diag(0)

Addr

Word Address

Start

Read Turn

Bus Ack? Ack? Sample

Data End

Read

Ack/

RdCen

Cached?

I/D Miss Address(2)

Miss Address(3)

Data Input

t14

t10

t12

t15

t2a

t15

t1a t14

t17 t17

t18

t16

t11

2889 drw 19

5.5 30

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 13. R3081 Burst Read

SysClk

A/D(31:0)

ALE

Addr(3:2)

DataEn

RdCEn

Ack

Burst

Diag(1)

Diag(0)

Addr

'00'

Start

Read Turn

Bus Sample

Data New

Transaction

Ack/

RdCen

Cached?

I/D

t14

t10

t8t9

t12

t17 t17

t18

t15

Word 0

t2a

t1a t14

t15

Word 1

t2a

t1a

Word 2

t2a

t1a

Word 3

t2a

t1a

'01' '10' '11'

t16 t16 t16

Sample

Data Sample

Data

RdCEn RdCEn RdCEn

Miss Address(2)

Miss Address(3)

t16

t11

2889 drw 20

5.5 31

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 14 (b). End of Throttled Quad Read

Figure 14 (a). Start of Throttled Quad Read

SysClk

A/D(31:0)

ALE

Addr(3:2)

DataEn

RdCEn

Ack

Burst

'00'

Sample

Data

Word 0

t2a

t1a

Word 1

t2a

t1a

'01' '10'

t16 t16

Sample

Data Sample

Data

RdCEn RdCEnRdCEn

2889 drw 21

SysClk

A/D(31:0)

ALE

Addr(3:2)

DataEn

RdCEn

Ack

Burst

New

Transaction

Ack

Word 2 Word 3

'01' '11'

Sample

Data Sample

Data

RdCEn RdCEn

2889 drw 22

5.5 32

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 16. Request and Relinquish of R3081 Bus to External Master

Figure 15. R3081 Write Cycle

SysClk

A/D(31:0)

ALE

Addr(3:2)

Ack

WrNear

Diag(1)

Diag(0)

Addr

Word Address

Start

Write Data

Out Ack? Ack? Negate

Wr New

Transfer

Ack

t14

t10

t15

t14

t19 Data

Out

t15

t16

t17

Reserved

ReservedReserved

Cached

2889 drw 23

A/D(31:0)

Addr(3:2)

Diag(1:0)

SysClk

BusReq

BusGnt

ALE

Burst/

WrNear

2889 drw 24

5.5 33

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 17. R3081 Regaining Bus Mastership

SysClk

BusReq

BusGnt

A/D(31:0)

Addr(3:2)

Diag(1:0)

ALE

Burst/

WrNear

t1t2

2889 drw 25

Figure 18. Synchronized Interrupt Input Timing

Figure 19. Direct Interrupt Input Timing

SysClk

Int(n)

2889 drw 27

SysClk

SInt(n)

2889 drw 26

5.5 34

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 20. Synchronized Branch Condition Input Timing

SysClk

SBrCond(n)

t28 t29 2889 drw 28

Figure 22. Coherent DMA Request

SysClk

BusReq

BusGnt

A/D(31:0)

Addr(3:2)

Diag(1:0)

ALE

Burst/

WrNear

CohReq

∫∫

2889 drw 30

Figure 21. Direct Branch Condition Input Timing

SysClk

BrCond(n)

t30 t31 2889 drw 29

5.5 35

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 23. Beginning of Coherent DMA Write

SysClk

ALE

A/D

Addr

Internal

Invalidate

Address

T36

T37

T40 T41

T38 T39

2889 drw 31

Figure 24. Cache Word Invalidation

SysClk

Ack

IvdReq

Internal

Ivd

Internal

Invalidate

Address

T1T2

2988 drw 32

Figure 25. End of Coherent Write

SysClk

Ack

2889 drw 33

5.5 36

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

Figure 26. End of Coherent DMA Request

SysClk

BusReq

BusGnt

A/D(31:0)

Addr(3:2)

Diag(1:0)

ALE

Burst/

WrNear

CohReq

t1t2

2889 drw 34

5.5 37

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

NOTES:

1. All dimensions are in inches, unless otherwise noted.

2. BSC—Basic lead Spacing between Centers.

3. D & E do not include mold flash or protutions.

4. Formed leads shall be planar with respect to one another and within .004 inches at the seating plane.

5. ND & NE represent the number of leads in the D & E directions respectively.

6. D1 & E1 should be measured from the bottom of the package.

7. MQUAD is pin & form compatible with PLCC.

2874 drw 27

D1 PIN 1

E1 E

45° x .045

C1 SEATING PLANE

D2/E2

D3/E3

84 LEAD PLCC/MQUAD(7) (SQUARE)

DWG # J84-1 MJ84-1

# of Leads 84 84

Symbol Min. Max. Min. Max.

A 165 .180 165 .180

A1 .095 .115 .094 .114

B .026 .032 .026 .032

b1 .013 .021 .013 .021

C .020 .040 .020 .040

C1 .008 .012 .008 .012

D 1.185 1.195 1.185 1.195

D1 1.150 1.156 1.140 1.150

D2/E2 1.090 1.130 1.090 1.130

D3/E3 1.000 REF 1.000 REF

E 1.185 1.195 1.185 1.195

E1 1.150 1.156 1.140 1.150

e .050 BSC .050 BSC

ND/NE 21 21

5.5 38

IDT79R3081 RISController MILITARY AND COMMERCIAL TEMPERATURE RANGES

ORDERING INFORMATION

IDT XXXXX

Device Type

Speed

Package

–X

Process/

Temp. Range

Blank

79R3081

79R3081E

79RV3081

79RV3081E

Commercial Temperature Range

Compliant to MIL-STD-883, Class B

Military Temperature Range Only

84-Pin MQUAD

84-lead Cavity-down Flatpack with

Integral Thermal Slug

84-lead PLCC

100-lead TQFP

20.0MHz

25.0MHz

33.33MHz

40.0MHz

50.0MHz

No TLB; V

= 5V

With TLB; V

= 5V

No TLB; V

= 3.3V

With TLB; V

= 3.3V

2889 drw 37

5V Only

VALID COMBINATIONS

IDT 79R3081 (E) – 20, 25, 33, 40, 50 MJ Package

79RV3081 (E) – 20, 25, 33 PF Package

79RV3081(E) – 20, 25, 33, 40 MJ Package

79R3081E – 20, 25 (FDB/FDM) FD Package Only

(5V Only)