RP132x SERIES Low Voltage 1A Voltage Regulator (LDO Regulator) NO.EA-265-171220 OUTLINE The RP132x is a voltage-regulator with a built-in low ON-resistance transistor and output current is 1A capability. This IC has two versions: fixed output voltage type and externally adjustable output voltage type. The minimum output voltage can be set from 1.4V. Otherwise, the load regulation of RP132x has much improved when compared with conventional regulators. It's Typ.5mV at IOUT=0.1mA to 1A. This IC consists of a voltage reference unit, an error amplifier, a resistor net for setting output voltage, current limit circuits to prevent over-current and a thermal-shutdown circuit. A standby mode with ultra low supply current can be realized with the chip enable function. Additionally, E/F Version with delay pin for inrush current limit time setting are also available. The packages for these ICs are DFN(PLP)1820-6, SOT-89-5, HSOP-6J and TO-252-5-P2. DFN(PLP)1820-6 is suitable for high density mounting of the ICs on boards. SOT-89-5, HSOP-6J and TO-252-5-P2 are supporting high wattage. FEATURES * * * * * * * * * * * * * * * * * Output Current ******************************************* Min. 1A Supply Current ******************************************** Typ. 65A Standby Current ***************************************** Typ. 0.15A Input Voltage Range ************************************ 1.4V to 6.5V Output Voltage Range *********************************** Fixed Output Voltage Type: 0.8V to 5.5V (0.1V steps) Adjustable Output Voltage Type: 0.8V to 5.5V (For other voltages, please refer to MARK INFORMATIONS.) Dropout Voltage ******************************************* Typ. 0.52V (VOUT=2.8V, IOUT=1A) Ripple Rejection ******************************************* Typ. 70dB (f=1kHz, VOUT=2.8V) Output Voltage Accuracy ******************************** 1.0% Output Voltage Temperature-Drift Coefficient ****** Typ. 60ppm/C Line Regulation ******************************************** Typ. 0.052%/V Load Regulation ***************************************** Typ. 3mV at IOUT=300mA, Typ. 5mV at IOUT=1A Packages ************************************************** DFN(PLP)1820-6, SOT-89-5, HSOP-6J,TO-252-5-P2 Inrush Current Limit Circuit *************************** Typ. 500mA B/D version: Inrush current limit time is 500s. E/F version: Inrush current limit time is adjustable. Fold-Back Protection Circuit ************************** Typ. 250mA (Current at short mode) Thermal Shutdown Circuit ***************************** Thermal Shutdown Temperature: Typ. 165C Released Temperature: Typ. 95C Auto Discharge Function ****************************** D, F version Ceramic capacitors are recommended to be used with this IC **** 2.2F or more (VOUT 3.6V) 4.7F or more (VOUT > 3.6V) 1 RP132x NO.EA-265-171220 APPLICATIONS * * * * Power source for battery-powered equipment. Power source for portable communication equipment Power source for electrical appliances such as cameras, VCRs and camcorders. Power source for home appliances and Notebook PC. SELECTION GUIDE The output voltage, the auto discharge function(1), and the package type for the IC can be selected at the user's request. Product Name RP132K001-TR RP132Kxx1-TR RP132H001#-T1-FE RP132Hxx1#-T1-FE RP132S001#-E2-FE RP132Sxx1-E2-FE RP132J001#-T1-FE RP132Jxx1#-T1-FE Package Quantity per Reel Pb Free Halogen Free DFN(PLP)1820-6 5,000 pcs Yes Yes SOT-89-5 1,000 pcs Yes Yes HSOP-6J 1,000 pcs Yes Yes TO-252-5-P2 3,000 pcs Yes Yes RP132x001x is the adjustable output voltage type. xx: The output voltage can be designated in the range from 0.8V(08) to 5.5V(55) in 0.1V step. : The combination of the auto discharge function and delay pin (for setting inrush current limit time) are as follows. B: without auto discharge function D: with auto discharge function E: without auto discharge function, with delay pin (for setting inrush current limit time) F: with auto discharge function and delay pin (for setting inrush current limit time) #: The auto discharge function at off state are options as follows. B: without auto discharge function at off state D: with auto discharge function at off state (1) Auto-discharge function quickly lowers the output voltage to 0V, when the chip enable signal is switched from the active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor. 2 RP132x NO.EA-265-171220 BLOCK DIAGRAMS * Fixed Output Voltage Type HSOP-6J / SOT89-5 RP132Sxx1B / RP132Hxx1B VDD RP132Sxx1D / RP132Hxx1D VOUT VDD VOUT Vref Vref Current Limit Thermal Shutdown CE * Current Limit Thermal Shutdown GND CE GND Fixed Output Voltage TypeTO-252-5-P2 / DFN(PLP)1820-6 RP132Jxx1B / RP132Kxx1B VDD RP132Jxx1D / RP132Kxx1D VOUT VDD VOUT VFB VFB Vref Vref Current Limit Thermal Shutdown CE * Current Limit Thermal Shutdown GND CE GND Fixed Output Voltage Type with DELAY pinHSOP-6J RP132Sxx1E VDD RP132Sxx1F VOUT VDD VOUT Vref Vref Current Limit Thermal Shutdown CE Current Limit Thermal Shutdown GND DELAY CE GND DELAY 3 RP132x NO.EA-265-171220 * Fixed Output Voltage Type with DELAY pinDFN(PLP)1820-6 RP132Kxx1E VDD RP132Kxx1F VOUT VDD VOUT VFB VFB Vref Vref Current Limit Thermal Shutdown CE Current Limit Thermal Shutdown GND CE GND DELAY * DELAY Adjustable Output Voltage TypeHSOP-6J / SOT-89-5 / TO-252-5-P2 /DFN(PLP)1820-6 RP132S001B / RP132H001B / RP132S001D / RP132H001D / RP132J001B / RP132K001B VDD RP132J001D / RP132K001D VOUT VDD VOUT VFB VFB Vref Vref Current Limit Thermal Shutdown CE * Current Limit Thermal Shutdown GND CE GND Adjustable Output Voltage Type with DELAY pinDFN(PLP)1820-6 RP132K001E VDD RP132K001F VOUT VDD VOUT VFB VFB Vref Vref Current Limit Thermal Shutdown CE GND DELAY 4 Current Limit Thermal Shutdown CE GND DELAY RP132x NO.EA-265-171220 PIN DESCRIPTIONS Top View 6 5 Bottom View 4 4 5 6 2 1 5 4 6 5 4 1 2 3 1 2 3 3 1 2 3 1 RP132K (DFN(PLP)1820-6) RP132H (SOT-89-5) RP132S (HSOP-6J) 2 3 4 5 RP132J (TO-252-5-P2) RP132K(1) (DFN(PLP)1820-6) Pin Description Pin No. Symbol Pin Description 1 VOUT 2 VFB Feed Back Pin(2) 3 GND Ground Pin 4 CE Chip Enable Pin ("H" Active) NC No Connection (RP132K001B/D, RP132Kxx1B/D) 5 6 DELAY VDD Output Pin(2) Delay Pin for setting inrush current limit time (RP132K001E/F, RP132Kxx1E/F) Input Pin Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but leaving it open is also acceptable. (1) When using Adjustable Output Voltage Type (RP132K001x), please follow "Notes on the Adjustable Output Voltage Type Settings". (2) When using Fixed Output Voltage Type(RP132Kxx1x), the VOUT pin and the VFB pin should be connected. 5 RP132x NO.EA-265-171220 RP132H(1) (SOT-89-5) Pin Description Pin No. 1 2 3 Symbol Pin Description CE Chip Enable Pin ("H" Active) (RP132Hxx1B/D) VFB Feed Back Pin (RP132H001B/D) GND Ground Pin NC No Connection (RP132Hxx1B/D) CE Chip Enable Pin ("H" Active) (RP132H001B/D) 4 VDD 5 VOUT Input Pin Output Pin RP132S(1) (HSOP-6J) Pin Description Pin No. Symbol 1 VOUT Output Pin 2 GND Ground Pin(2) 3 Pin Description NC No Connection (RP132Sxx1B/D) VFB Feed Back Pin (RP132S001B/D) DELAY Delay Pin for setting inrush current limit time (RP132Sxx1E/F) 4 CE Chip Enable Pin ("H" Active) 5 GND Ground Pin(2) 6 VDD Input Pin RP132J(1) (TO-252-5-P2) Pin Description Pin No. Symbol Pin Description 1 CE 2 VDD Input Pin 3 GND Ground Pin 4 VOUT Output Pin(3) 5 VFB Chip Enable Pin ("H" Active) Feed Back Pin(3) Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but leaving it open is also acceptable. (1) When using Adjstable Output Voltage Type (RP132x001x), please follow "Notes on Adjustable Output Voltage Type Settings". (2) GND pins must be wired each other when mounted on boards. (3) When using Fixed Output Voltage Type(RP132Jxx1x),VOUT pin and VFB pin should be connected. 6 RP132x NO.EA-265-171220 ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit 7.0 V VIN Input Voltage VCE Input Voltage (CE Pin) -0.3 to 7.0 V VFB Input Voltage (VFB Pin) -0.3 to 7.0 V VOUT Output Voltage -0.3 to VIN+0.3 V PD Power Dissipation(1) DFN(PLP)1820-6, JEDEC STD.51-7 2200 SOT-89-5, JEDEC STD.51-7 2600 HSOP-6J, JEDEC STD.51-7 2700 TO-252-5-P2, JEDEC STD.51-7 3800 mW Tj Junction Temperature Range -40 to 125 C Tstg Storage Temperature Range -55 to 125 C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings are not assured. RECOMMENDED OPERATING CONDITIONS Symbol Item Rating Unit VIN Input Voltage 1.4 to 6.5 V Ta Operating Temperature Range -40 to 85 C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such ratings by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) Refer to POWER DISSIPATION for detailed information. 7 RP132x NO.EA-265-171220 ELECTRICAL CHARACTERISTICS VIN=Set VOUT+1.0V, IOUT=1mA, CIN=2.2F, COUT=2.2F (VOUT 3.6V) / 4.7F(VOUT3.6V) The specification in is checked and guaranteed by design engineering at -40C Ta 85C, unless otherwise noted. RP132xxx1B/D(Fixed Output Voltage Type) / RP132S/Kxx1E/F(Fixed Output Voltage Type with DELAY pin) Symbol Item Conditions Ta = 25C VOUT Output Voltage -40C Ta 85C ILIM Load Regulation VDIF Dropout Voltage ISS Supply Current Istandby Standby Current x0.99 x1.01 V VOUT 1.5V -15 15 mV VOUT > 1.5V x0.981 x1.019 V VOUT 1.5V -29 29 mV 1 3 20 0.1mA IOUT 1A 5 60 IOUT=0mA (VIN=6.5V) 65 85 A VCE=0V, VIN=6.5V 0.15 0.60 A 0.05 0.10 %/V Set VOUT+0.5V VIN 6.5V However, VIN 1.6V RR Ripple Rejection f=1kHz Ripple 0.2Vp-p IOUT=100mA ISC Short Current Limit IPD CE Pull-down Current VCEH CE Input Voltage "H" VCEL CE Input Voltage "L" en mV Refer to the following "Dropout Voltage" Line Regulation Input Voltage A 0.1mA IOUT 300mA VOUT/ VIN VIN Typ. VOUT > 1.5V Output Current Limit VOUT/ IOUT Min. (Ta = 25C) Max. Unit VOUT 3.3V 70 VOUT > 3.3V 60 dB 1.4 VOUT=0V 6.5 250 0.3 V mA 0.7 1.0 A V 0.4 V Output Noise BW=10Hz to 100kHz 70 Vrms TTSD Thermal Shutdown Temperature Junction Temperature 165 C TTSR Thermal Shutdown Released Temperature Junction Temperature 95 C RLOW Low Output Nch Tr. ON VIN=4.0V, VCE=0V Resistance (D/F version) 50 IDELAY DELAY pin Current (DELAY pin version) VIN=4.0V 0.7 1.2 1.7 A All test items listed under Electrical Characteristics are done under the pulse load condition (TjTa=25C) except Output Noise, Ripple Rejection, Dropout Voltage at 1A Output Current and Load Regulation and Thermal Shutdown. 8 RP132x NO.EA-265-171220 The specification in otherwise noted. is checked and guaranteed by design engineering at -40C Ta 85C, unless Dropout Voltage Output Voltage VOUT (V) (Ta = 25C) Dropout Voltage VDIF (V) Typ. Max. Typ. Max. 0.8 VOUT < 0.9 0.67 0.89 1.20 1.54 0.9 VOUT < 1.0 0.59 0.82 1.10 1.46 1.0 VOUT < 1.1 0.51 0.73 1.05 1.39 0.42 0.63 0.96 1.31 0.36 0.54 0.90 1.23 1.5 VOUT < 2.6 0.24 0.33 0.78 1.05 2.6 VOUT < 3.3 0.15 0.21 0.52 0.72 3.3 VOUT 5.5 0.13 0.18 0.46 0.68 1.1 VOUT < 1.2 1.2 VOUT < 1.5 Condition IOUT=300mA Condition IOUT=1A 9 RP132x NO.EA-265-171220 VIN=Set VOUT+1.0V, IOUT=1mA, CIN=2.2F, COUT=2.2F, VOUT 3.6V, 4.7F VOUT3.6V The specification in is checked and guaranteed by design engineering at -40C Ta 85C, unless otherwise noted. RP132x001B/D(Adjustable Output Voltage Type) / RP132K001E/F(Adjustable Output Voltage Type with DELAY pin) Symbol Item VFB Feedback Voltage VOUT Output Voltage Adjusting Range ILIM Output Current Limit Conditions Ta =25C -40C Ta 85C VOUT=VFB 0.785 0.800 0.815 0.771 0.829 0.8 5.5 1 V V A 3 20 0.1mA IOUT 1A 5 60 IOUT=300mA 0.67 0.89 IOUT=1A 1.20 1.54 65 85 A VCE=0V, VIN=6.5V 0.15 0.60 A 0.05 0.10 %/V Load Regulation VDIF Dropout Voltage VOUT=VFB ISS Supply Current VOUT=VFB, IOUT=0mA (VIN=6.5V) VOUT/ VIN Line Regulation VOUT=VFB, 1.6V VIN 6.5V RR Ripple Rejection f=1kHz, Ripple 0.2Vp-p, IOUT=100mA VIN Input Voltage ISC Short Current Limit IPD CE Pull-down Current VCEH CE Input Voltage "H" VCEL CE Input Voltage "L" en Typ. 0.1mA IOUT 300mA VOUT/ IOUT Istandby Standby Current VOUT=VFB Min. (Ta = 25C) Max. Unit VOUT=VFB 70 1.4 VOUT=VFB =0V V dB 6.5 250 0.3 mV V mA 0.7 1.0 A V 0.4 V Output Noise BW=10Hz to 100kHz 70 Vrms TTSD Thermal Shutdown Temperature Junction Temperature 165 C TTSR Thermal Shutdown Released Temperature Junction Temperature 95 C RLOW Low Output Nch Tr. ON VIN=4.0V, VCE=0V Resistance (D/F version) 50 IDELAY DELAY pin Current (DELAY pin version) VIN=4.0V 0.7 1.2 1.7 A All test items listed under Electrical Characteristics are done under the pulse load condition (TjTa=25C) except Output Noise, Ripple Rejection, Dropout Voltage at 1A Output Current and Load Regulation and Thermal Shutdown. 10 RP132x NO.EA-265-171220 APPLICATION INFORMATION Typical Application Circuits Fixed Output Voltage Type (HSOP-6J/ SOT89-5) VOUT VDD VOUT RP132S/H xx1x CIN CE CE Control COUT GND Fixed Output Voltage Type (TO-252-5-P2/ DFN(PLP)1820-6) VDD CIN VOUT VOUT RP132J/K xx1x VFB CE CE Control COUT GND Adjustable Output Voltage Type (HSOP-6J / SOT89-5/ TO-252-5-P2 / DFN(PLP)1820-6 VDD CIN VOUT VOUT RP132x 001x VFB R1 COUT R2 CE Control CE GND 11 RP132x NO.EA-265-171220 Fixed Output Voltage Type with DELAY pin (HSOP-6J) VDD VOUT VOUT RP132S xx1E/F CIN CE CE Control COUT GND DELAY CD Fixed Output Voltage Type with DELAY pin (DFN(PLP)1820-6) VDD CIN CE Control VOUT VOUT RP132K xx1E/F VFB CE COUT GND DELAY CD Adjustable Output Voltage Type with DELAY pin (DFN(PLP)1820-6) VDD CIN VOUT VOUT RP132K 001E/F R1 COUT VFB R2 CE Control CE DELAY 12 GND CD RP132x NO.EA-265-171220 Recommended External Components VOUT VOUT 3.6V VOUT > 3.6V Capacitors CIN (C1) Kyocera 2.2F (size:1005) [CM05X5R225M06A] COUT (C2) Kyocera 2.2F (size:1608) [CM105X5R225K06AB] CIN (C1) Kyocera 2.2F (size:1005) [CM05X5R225K06A] COUT (C2) Kyocera 4.7F (size:1608) [CM105X5R475M06AB] Please refer to "Technical Notes on Adjustable Output Voltage Type" when using R1 and R2 as output capacitors. Also refer to "Inrush Current Limit Time Settings" concerning with CD. Technical Notes on the External Components When using this IC, consider the following points: Phase Compensation In this IC, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a 4.7F or more capacitor COUT between VOUT pin and GND pin, and as close as possible to the pins. If a tantalum capacitor is used, and its ESR (Equivalent Series Resistance) of COUT is large, the loop oscillation may result. Because of this, select COUT carefully considering its frequency characteristics. PCB Layout Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect a 2.2 F or more capacitor CIN between VDD and GND pin with a capacitance value as "Recommendation value of the external capacitors" above or more, and as close as possible to the pins. Set external components, especially the output capacitor COUT, as close as possible to the IC, and make wiring as short as possible. When using the Adjustable Output Voltage Type, the transient response could be affected by the external resistors. Evaluate the circuit taking the actual conditions of use into account. Output Voltage Setting Method (Adjustable Output Voltage Type) RP132x081x can be adjusted the output voltage up to 5.5V by using the external divider resistors. Also, please use 16k or less for R2 resistor. If the VFB voltage is described as setVFB, the output voltage can be set by using the following equations. SetVFB is equal to 0.8V. The VOUT pin of RP132x081x should be connected to the VFB pin. 13 RP132x NO.EA-265-171220 VOUT R1 I1 VFB VOUT IIC RIC R2 I2 SetVFB GND I1= IIC + I2 ....................................................................................................................................... (1) I2= setVFB / R2 ............................................................................................................................... (2) Thus, I1= IIC + setVFB /R2.......................................................................................................................... (3) Therefore, VOUT = setVFB x R1 x I1 ................................................................................................................... (4) Put Equation (3) into Equation (4), then VOUT = setVFB + R1(IIC + setVFB / R2) = setVFB x (1+R1/ R2) + R1 x IIC ............................................................................................. (5) In Equation (5), R1x IIC is the error-causing factor in VOUT. As for IIC, IIC = setVFB / RIC .............................................................................................................................. (6) Therefore, the error-causing factor R1x IIC can be described as follows. R1xIIC = R1 x setVFB / RIC = setVFB x R1 / RIC ................................................................................................................ (7) For better accuracy, choosing R1 (<<RIC) reduces this error. Without the error-causing factor R1x IIC, the output voltage can be calculated by the following equation VOUT = setVFB x ((R1 + R2) / R2) ................................................................................................... (8) RIC of RP132x is approximately Typ.1.3M (Ta=25C, this value is guaranteed by design.). The value could be affected by the temperature, therefore evaluate the circuit taking the actual conditions of use into account. Inrush Current Limit Time Settings The RP132xSeries include the circuit which can limit the inrush current at start-up to 500mA or less. The current limit time of B/D version is fixed internally as approximately Typ.500s. On the other hand, the current limit times of E/F versions are adjustable by controlling the DELAY pin value, which is the capacitance value connected between DLEAY pin and GND pin. The relation between Inrush Current Limit Time (tD[s]) and the DELAY pin capacitance (CD[F]) can be 14 described in the following equation. RP132x NO.EA-265-171220 tD=(CD+70x10-12)x0.525x106 When not using CD on E/F versions, DELAY pin should be open. In this case, CD=0 is applied to the above equation and as a result, 37s can be obtained. That means, when using CD on E/F versions, the inrush current limit time will be more than 37s. Please note that during the inrush current limit time, the load current cannot be more than the limited current. ESR vs. Output Current The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions when the white noise level is under 40V (Avg.) are marked as the hatched area in the graph. Measurement Conditions Frequency Band : 10Hz to 2MHz Temperature : -40C to 85C Hatched Area : Noise level is under 40Vms (Avg.) CIN (C1) : 2.2F (Kyocera CM05X5R225M06A) COUT (C2) : 2.2F (VOUT = 0.8V, Kyocera CM105X5R225K06AB) 4.7F (VOUT = 5.5V, Kyocera CM105X5R475M06AB) RP132x081x RP132x551x VIN = 1.4 V to 6.5 V C1 = 2.2 F, C2 = 2.2 F VIN = 5.5 V to 6.5 V C1 = 2.2 F, C2 = 4.7 F 100 100 Ta=85C 10 ESR () ESR () Ta=-40, 85C Ta=-40C 10 1 0.1 1 0.1 0.01 0.01 0 100 200 300 400 500 600 700 800 900 100 0 Output Current IOUT (mA) 0 100 200 300 400 500 600 700 800 900 1000 Output Current IOUT (mA) 15 RP132x NO.EA-265-171220 TYPICAL CHARACTERISTICS Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Voltage vs. Input Voltage (Ta=25C) RP132x151x 1.0 1.8 0.9 1.6 0.8 1.4 0.7 0.6 0.5 Iout=1mA 0.4 Iout=50mA 0.3 Iout=100mA 0.2 Output Voltage V OUT (V) Output Voltage V OUT (V) RP132x081x Iout=300mA 1.2 1.0 0.0 0 0 0.0 RP132x331x 2 4 Input Voltage V IN (V) 6 RP132x551x 6 3.0 5 2.5 2.0 Iout=1mA Iout=50mA 1.0 Iout=100mA 0.5 Iout=300mA Output Voltage V OUT (V) Output Voltage V OUT (V) Iout=300mA 0 6 3.5 1.5 Iout=100mA 0.4 0.2 2 4 Input Voltage V IN (V) Iout=50mA 0.6 0.1 0 Iout=1mA 0.8 4 3 Iout=1mA 2 Iout=50mA Iout=100mA 1 0 0.0 Iout=300mA 0 0 2 4 Input Voltage V IN (V) 6 0 2 4 Input Voltage V IN (V) 6 2) Supply Current vs. Input Voltage (Ta=25C) RP13x081x RP132x151x 80 70 70 Supply Current Iss (A) Supply Current Iss (A) 60 50 40 30 20 10 50 40 30 20 10 0 0 0 2 4 Input Voltage V IN (V) 16 60 6 0 2 4 Input Voltage V IN (V) 6 RP132x NO.EA-265-171220 RP132x331x RP132x551x 90 140 120 70 Supply Current Iss (A) Supply Current Iss (A) 80 60 50 40 30 20 100 80 60 40 20 10 0 0 0 2 4 6 0 2 Input Voltage V IN (V) 4 6 Input Voltage V IN (V) 3) Supply Current vs. Temperature RP132x151x 90 90 80 80 Supply Current ISS (A) Supply Current ISS (A) RP132x081x 70 60 50 40 30 20 60 50 40 30 20 10 10 0 -50 70 -25 0 25 50 75 0 -50 100 -25 RP132x331x 50 75 100 RP132x551x 90 90 80 80 Supply Current ISS (A) Supply Current ISS (A) 25 Temperature Topt (C) Temperature Topt (C) 70 60 50 40 30 20 10 0 -50 0 70 60 50 40 30 20 10 -25 0 25 50 75 Temperature Topt (C) 100 0 -50 -25 0 25 50 75 100 Temperature Topt (C) 17 RP132x NO.EA-265-171220 4) Output Voltage vs. Temperature RP132x151x 0.84 1.54 0.83 1.53 Output Voltage V OUT (V) Output Voltage V OUT (V) RP132x081x 0.82 0.81 0.80 0.79 0.78 1.52 1.51 1.50 1.49 1.48 1.47 0.77 -50 -25 0 25 50 75 100 -50 -25 25 50 75 100 75 100 Temperature (C) Temperature (C) RP132x331x RP132x551x 3.34 5.54 3.33 5.53 Output Voltage V OUT (V) Output Voltage V OUT (V) 0 3.32 3.31 3.30 3.29 3.28 5.52 5.51 5.50 5.49 5.48 5.47 3.27 -50 -25 0 25 50 75 -50 100 -25 0 25 50 Temperature (C) Temperature (C) 5) Dropout Voltage vs. Output Current RP132x151x 1.4 1.2 1.2 Dropout Voltage V DIF (V) Dropout Voltage V DIF (V) RP132x081x 1.4 1.0 0.8 0.6 0.4 85C 25C 0.2 1.0 0.8 85C 0.6 25C -40C 0.4 0.2 -40C 0 0.0 0.0 0 200 400 600 800 Output Current IOUT (mA) 18 1000 0 200 400 600 800 Output Current IOUT (mA) 1000 RP132x NO.EA-265-171220 RP132x551x 1.4 1.2 1.2 Dropout Voltage V DIF (V) Dropout Voltage V DIF (V) RP132x331x 1.4 1.0 85C 0.8 25C 0.6 -40C 0.4 0.2 1.0 85C 0.8 25C 0.6 -40C 0.4 0.2 0.0 0 0.0 0 0 200 400 600 800 0 1000 Output Current IOUT (mA) 200 400 600 800 1000 Output Current IOUT (mA) 6) Dropout Voltage vs. Set Output Voltage Dropout Voltage V DIF (V) 1.2 1A 800mA 600mA 300mA 100mA 1.0 0.8 0.6 0.4 0.2 0 0.0 0 2 4 6 Set Output Voltage V REG (V) 7) Ripple Rejection vs. Input Voltage (CIN=none, Ripple=0.2Vp-p, Ta=25C) RP132x331x RP132x331x C2=Ceramic2.2F IOUT=1mA 90 80 Ripple Rejection RR(dB) 80 Ripple Rejection RR(dB) C2=Ceramic2.2F IOUT=30mA 90 70 60 50 40 f=0.2kHz 30 f=1kHz 20 f=10kHz f=100kHz 10 0 70 60 50 40 30 f=0.2kHz 20 f=1kHz 10 f=10kHz f=100kHz 0 3.0 3.5 4.0 4.5 5.0 5.5 Input Voltage V IN (V) 6.0 6.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 Input Voltage V IN (V) 19 RP132x NO.EA-265-171220 RP132x331x RP131x551x C2=Ceramic2.2F IOUT=50mA 90 80 Ripple Rejection RR(dB) Ripple Rejection RR(dB) 80 70 60 50 40 f=0.2kHz 30 f=1kHz 20 f=10kHz f=100kHz 10 70 60 50 40 f=0.2kHz 30 f=1kHz 20 f=10kHz f=100kHz 10 0 0 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 5.5 5.7 5.9 6.1 6.3 Input Voltage V IN (V) Input Voltage V IN (V) RP132x551x RP132x551x C2=Ceramic4.7F IOUT=10mA 90 6.5 C2=Ceramic4.7F IOUT=100mA 90 80 80 Ripple Rejection RR(dB) Ripple Rejection RR(dB) C2=Ceramic4.7F IOUT=1mA 90 70 60 50 40 f=0.2kHz 30 f=1kHz 20 f=10kHz f=100kHz 10 70 60 50 40 f=0.2kHz 30 f=1kHz 20 f=10kHz f=100kHz 10 0 0 5.5 5.7 5.9 6.1 6.3 6.5 5.5 5.7 Input Voltage V IN (V) 5.9 6.1 6.3 6.5 Input Voltage V IN (V) 8) Ripple Rejection vs. Frequency (CIN =none, Ta=25C) RP132x081x 100 90 90 80 80 70 60 50 40 Iout=1mA 30 Iout=30mA 20 Iout=100mA 10 0 70 60 50 40 30 Iout=1mA 20 Iout=30mA 10 Iout=100mA 0 0.1 1 10 100 Frequency f (kHz) 20 C2=Ceramic 2.2F 100 Ripple Rejention RR (dB) Ripple Rejention RR (dB) RP132x331x C2=Ceramic 2.2F 1000 0.1 1 10 100 Frequency f (kHz) 1000 RP132x NO.EA-265-171220 RP132x551x C2=Ceramic 4.7F 100 Ripple Rejention RR (dB) 90 80 70 60 50 40 30 Iout=1mA 20 Iout=30mA 10 Iout=100mA 0 0.1 1 10 100 1000 Frequency f (kHz) 9) Input Transient Response (CIN =none, IOUT=100mA, tr=tf=5s, Ta=25C) RP132x081x RP132x331x 6.0 0.84 3.0 3.34 5.0 0.83 2.0 Input Voltage 1.8V 2.8V 0.82 1.0 0.81 0.80 Output Voltage 0.79 - 0.78 -10 0 Output Voltage V OUT (V) 3.35 Input Voltage V IN (V) Output Voltage V OUT (V) 4.0 3.33 Input Voltage 4.3V 5.3V 3.32 3.30 Output Voltage 3.29 -10 Time t (s) 3.0 3.31 3.28 10 20 30 40 50 60 70 80 90 4.0 Input Voltage V IN (V) C2=Ceramic2.2F C2=Ceramic2.2F 0.85 0 10 20 30 40 50 60 70 80 90 Time t (s) RP132x551x 7.5 5.54 6.5 5.53 Input Voltage 5.8V 6.5V 5.52 5.51 5.50 Output Voltage 5.49 5.5 Input Voltage V IN (V) Output Voltage V OUT (V) C2=Ceramic4.7F 5.55 5.48 -10 0 10 20 30 40 50 60 70 80 90 Time t (s) 21 RP132x NO.EA-265-171220 10) Load Transient Response (VIN=VOUT+1.0V, CIN =Ceramic 2.2F, tr=tf=0.5s, Ta=25C) RP132x081x RP132x081x 1.3 600 0.84 100 1.2 400 50 Output Current 50mA 100mA 0 0.81 0.80 Output Voltage 0.79 0.78 -20 0 1.0 0.8 Output Voltage 0.6 -20 0 20 40 Time t (s) 60 80 100 120 140 160 180 Time t (s) RP132x081x RP132x331x C2=Ceramic2.2F 60 3.35 150 0.88 30 3.34 100 0.86 0 Output Current 0mA 30mA 0.84 0.82 0.80 Output Voltage 0.78 0.76 -20 0 20 40 Output Voltage V OUT (V) 0.90 Output CurrentIOUT (mA) Output Voltage V OUT (V) C2=Ceramic2.2F Output Current 50mA 100mA 3.33 0 3.31 3.30 Output Voltage 3.29 3.28 -20 60 80 100 120 140 160 180 0 20 40 60 80 100 120 140 160 180 Time t (s) RP132x331x RP132x331x C2=Ceramic2.2F C2=Ceramic2.2F 600 3.40 60 3.7 400 3.38 30 3.6 Output Current 100mA 500mA 3.5 200 0 3.4 3.3 Output Voltage 3.2 3.1 -20 0 20 40 60 80 100 120 140 160 180 Time t (s) Output Voltage V OUT (V) 3.8 Output CurrentIOUT (mA) Output Voltage V OUT (V) 50 3.32 Time t (s) 22 0 0.9 0.7 20 40 60 80 100 120 140 160 180 200 Output Current 100mA 500mA Output CurrentIOUT (mA) 0.82 1.1 3.36 Output Current 0mA 30mA 3.34 0 3.32 3.30 Output Voltage 3.28 3.26 -20 0 20 40 60 80 100 120 140 160 180 Time t (s) Output CurrentIOUT (mA) 0.83 Output Voltage V OUT (V) 150 Output CurrentIOUT (mA) Output Voltage V OUT (V) 0.85 Output CurrentIOUT (mA) C2=Ceramic2.2F C2=Ceramic2.2F RP132x NO.EA-265-171220 RP132x551x RP132x551x 400 0 5.51 5.50 Output Voltage 5.49 5.48 -20 0 Output Voltage V OUT (V) 100 Output CurrentIOUT (mA) Output Voltage V OUT (V) 600 50 Output Current 50mA 100mA 5.52 150 200 Output Current 100mA 500mA 0 5.5 5.4 Output Voltage 5.3 5.2 -20 20 40 60 80 100 120 140 160 180 0 20 40 Time t (s) Output CurrentIOUT (mA) C2=Ceramic4.7F C2=Ceramic4.7F 60 80 100 120 140 160 180 Time t (s) RP132x551x C2=Ceramic4.7F Output Voltage V OUT (V) 30 0 Output Current 0mA 30mA 5.54 5.52 5.50 Output Voltage 5.48 5.46 -20 0 20 40 Output CurrentIOUT (mA) 60 60 80 100 120 140 160 180 Time t (s) 11) Turn on Speed with CE pin (CIN =Ceramic 2.2F, Ta=25C) 2.0 7.0 2 6.0 1 CE Input Voltage 1.6 Iout=0mA 1.2 Iout=100mA 0 0.8 0.4 Output Voltage 0 0.0 Output Voltage V OUT (V) 2.4 3 CE Input Voltage VCE (V) 2.8 Output Voltage V OUT (V) RP132x331x C2=Ceramic2.2F C2=Ceramic2.2F 6 4 CE Input Voltage 5.0 2 4.0 0 3.0 2.0 Iout=0mA 1.0 Output Voltage Iout=100mA CE Input Voltage VCE (V) RP132x081x 0 0.0 -50 0 50 100 150 200 250 300 350 400 450 Time t (s) -50 0 50 100 150 200 250 300 350 400 450 Time t (s) 23 RP132x NO.EA-265-171220 RP132x551x Output Voltage V OUT (V) 12 9 6 CE Input Voltage 10 3 8 0 6 4 Iout=0mA 2 0 -50 Output Voltage 0 Iout=100mA CE Input Voltage VCE (V) C2=Ceramic4.7F 14 50 100 150 200 250 300 350 400 450 Time t (s) 12) Turn off Speed with CE pin (D version) (CIN =Ceramic 2.2F, Ta=25C) RP132x081D RP132x331D 6 2 6 4 1 CE Input Voltage 2 7 0 1.6 1.2 Iout=0mA Output Voltage 0.8 Iout=100mA 0.4 0 -0.2 0 0.2 0.4 0.6 0.8 1 Output Voltage 2 Iout=0mA VIN=6.5V COUT =Ceramic4.7F 9 14 6 CE Input Voltage 8 3 0 6 4 Output Voltage Iout=0mA 2 0 -0.2 0 Iout=100mA 0.2 0.4 0.6 0.8 1 Times [ms] 1.2 1.4 1.6 1.8 CE Input Voltage [V] 12 10 Iout=100mA 0 0.2 0.4 0.6 0.8 1 Times [ms] RP132x551D Output Voltage [V] 0 3 0 -0.2 1.2 1.4 1.6 1.8 2 CE Input Voltage 4 1 Times [ms] 24 5 1.2 1.4 1.6 1.8 CE Input Voltage [V] Output Voltage [V] 2.4 3 Output Voltage [V] 2.8 V IN=4.3V C2=Ceramic2.2F CE Input Voltage [V] V IN=1.8V C2=Ceramic2.2F RP132x NO.EA-265-171220 13) Inrush Current (CIN =Ceramic 2.2F, IOUT=100mA, Ta=25C) RP132x081x RP132x331x V IN=2.3V,C2=Ceramic2.2F 600 6 2.5 500 2.0 400 1.5 300 Output Voltage 200 1.0 0.5 100 Inrush Current 0 0.0 CE Input Voltage 5 4 Output Voltage 3 Time t (s) 400 300 2 0 -40 600 500 Inrush Current 1 0 40 80 120 160 200 240 280 320 360 -40 0 700 200 Inrush Current (mA) CE Input Voltage 7 CE Input Voltage VCE (V) Output Voltage V OUT (V) CE Input Voltage VCE (V) Output Voltage V OUT (V) 3.0 V IN=4.8V,C2=Ceramic2.2F 700 Inrush Current (mA) 3.5 100 0 0 40 80 120 160 200 240 280 320 360 Time t (s) RP132x551x V IN=6.5V,C2=Ceramic4.7F 7 700 CE Input Voltage 600 5 500 Output Voltage 4 400 3 300 2 200 Inrush Current 1 Inrush Current (mA) CE Input Voltage VCE (V) Output Voltage V OUT (V) 6 100 0 -40 0 0 40 80 120 160 200 240 280 320 360 Time t (s) 14) Minimum Operating Voltage Input Voltage V IN(V) RP132x081x 2.2 2.1 2.0 2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.01 The operation rage that can output 0.8V is shown by the hatched area in the graph. 0 200 400 600 800 1000 Output Current IOUT (mA) 25 RP132x NO.EA-265-171220 15) Inrush Current Limit Time vs. CD Capacitance (E / F Version) Inrush Current Limit Time (ms) RP132x081x VIN=4.0V 12 10 8 6 4 2 0 0 5 10 CD (nF) 15 20 16) Inrush Current Limit Time vs. Input Voltage (E / F Version) Inrush Current Limit Time (ms) RP132x081x 12 10 CD=20nF CD=10nF CD=2nF CD=1nF CD=none 8 6 4 2 0 1 26 3 5 Input Voltage VIN (V) 7 POWER DISSIPATION DFN(PLP)1820-6 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm x 114.3 mm x 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square 0.2 mm x 34 pcs Measurement Result (Ta = 25C, Tjmax = 125C) Item Measurement Result Power Dissipation Thermal Resistance (ja) Thermal Characterization Parameter (jt) 2200 mW ja = 45C/W jt = 18C/W ja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter Power Dissipation (mW) 3000 2700 2500 2700 2000 2200 1500 1000 500 0 0 25 50 75 85 100 125 150 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125C and Tjmax = 150C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i PACKAGE DIMENSIONS DFN(PLP)1820-6 Ver. A 1.60.1 A 1.80 B 5 4 0.200.1 6 2.00 1.00.1 INDEX 0.6MAX. 3 0.05 S 0.05min S 0.250.1 0.250.1 X4 0.05 0.05 M AB 0.5 2 1 0.1NOM. 0.30.1 Bottom View DFN(PLP)1820-6 Package Dimensions (Unit: mm) * The tab on the bottom of the package is substrate level (GND). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. i POWER DISSIPATION SOT-89-5 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm x 114.3 mm x 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square 0.3 mm x 13 pcs Measurement Result (Ta = 25C, Tjmax = 125C) Item Measurement Result Power Dissipation Thermal Resistance (ja) Thermal Characterization Parameter (jt) 2600 mW ja = 38C/W jt = 13C/W ja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 4000 Power Dissipation (mW) 3500 3200 3000 2200 2500 2600 2000 1500 1000 500 0 0 25 50 75 85 100 125 150 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125C and Tjmax = 150C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i SOT-89-5 PACKAGE DIMENSIONS Ver. A 4.50.1 1.50.1 0.40.3 2 5 4.350.1 1.0 1 4 4 2.50.1 1.000.2 5 0.40.1 0.30.2 0.420.1 0.1 S 3 0.40.1 3 2 1 0.30.2 1.60.2 S 0.420.1 0.420.1 0.470.1 1.50.1 1.50.1 SOT-89-5 Package Dimensions i POWER DISSIPATION HSOP-6J Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm x 114.3 mm x 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square 0.3 mm x 28 pcs Measurement Result (Ta = 25C, Tjmax = 125C) Item Measurement Result Power Dissipation Thermal Resistance (ja) Thermal Characterization Parameter (jt) 2700 mW ja = 37C/W jt = 7C/W ja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 4000 3400 Power Dissipation (mW) 3500 3000 2500 2700 2000 1500 1000 500 0 0 25 50 75 85 100 125 150 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125C and Tjmax = 150C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i HSOP-6J PACKAGE DIMENSIONS Ver. A HSOP-6J Package Dimensions i POWER DISSIPATION TO-252-5 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Board Material Board Dimensions Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm x 114.3 mm x 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square 0.3 mm x 21 pcs Copper Ratio Through-holes Measurement Result Item (Ta = 25C, Tjmax = 125C) Measurement Result Power Dissipation Thermal Resistance (ja) 3800 mW ja = 26C/W Thermal Characterization Parameter (jt) jt = 7C/W ja: Junction-to-Ambient Thermal Resistance jt: Junction-to-Top Thermal Characterization Parameter 4800 Power Dissipation (mW) 5000 4000 3800 3000 2000 1000 0 0 25 50 75 85 100 125 150 Ambient Temperature (C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125C and Tjmax = 150C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i TO-252-5-P2 PACKAGE DIMENSIONS Ver. A TO-252-5-P2 Package Dimensions The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this tab be connected to the ground plane on the board but it is possible to leave the tab floating. i 1.The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refertoRicohsalesrepresentativesforthelatestinformationthereon. 2.The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written consentofRicoh. 3.Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise takingoutofyourcountrytheproductsorthetechnicalinformationdescribedherein. 4.Thetechnicalinformationdescribedinthisdocumentshowstypicalcharacteristicsofandexampleapplicationcircuits fortheproducts.Thereleaseofsuchinformationisnottobeconstruedasawarrantyoforagrantoflicenseunder Ricoh'soranythirdparty'sintellectualpropertyrightsoranyotherrights. 5.Theproductslistedinthisdocumentareintendedanddesignedforuseasgeneralelectroniccomponentsinstandard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality andreliability,forexample,inahighlyspecificapplicationwherethefailureormisoperationoftheproductcouldresult inhumaninjuryordeath(aircraft,spacevehicle,nuclearreactorcontrolsystem,trafficcontrolsystem,automotiveand transportationequipment,combustionequipment,safetydevices,lifesupportsystemetc.)shouldfirstcontactus. 6.Wearemakingourcontinuousefforttoimprovethequalityandreliabilityofourproducts,butsemiconductorproducts arelikelytofailwithcertainprobability.Inordertopreventanyinjurytopersonsordamagestopropertyresultingfrom suchfailure,customersshouldbecarefulenoughtoincorporatesafetymeasuresintheirdesign,suchasredundancy feature,firecontainmentfeatureandfail-safefeature.Wedonotassumeanyliabilityorresponsibilityforanylossor damagearisingfrommisuseorinappropriateuseoftheproducts. 7.Anti-radiationdesignisnotimplementedintheproductsdescribedinthisdocument. 8.The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristicsintheevaluationstage. 9.WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristicsoftheproductsunderoperationorstorage. 10.There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the caseofrecognizingthemarkingcharacteristicwithAOI,pleasecontactRicohsalesorourdistributorbeforeattempting touseAOI. 11.PleasecontactRicohsalesrepresentativesshouldyouhaveanyquestionsorcommentsconcerningtheproductsor thetechnicalinformation. Halogen Free Ricoh is committed to reducing the environmental loading materials in electrical devices with a view to contributing to the protection of human health and the environment. Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since April 1, 2012. https://www.e-devices.ricoh.co.jp/en/ Sales&SupportOffices RicohElectronicDevicesCo.,Ltd. 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