RP132x SERIES
Low Voltage 1A Voltage R egulator (LDO Regulator)
NO.EA-265-171220
1
OUTLINE
The RP132x is a voltage-regulator with a built-in low ON-resistance transistor and output current is 1A
capability. This IC has two versions: fixed output voltage t ype and exter nally adjustable output voltage type.
The minimum output voltage can be set from 1.4V. Otherwise, the load regulation of RP132x has much
improved when compared with conventional regulators. It's Typ.5mV at IOUT=0.1mA to 1A.
This IC consists of a voltage reference unit, an error amplifier, a resistor net for setting output voltage, current
limit circuits to prevent over-current and a thermal-shutdown circuit. A standby mode with ultra low supply
current can be realized with the chip enable function. Additionally, E/F V ersion with delay pin for inrush current
limit time setting are also available.
The pac kages for these ICs are DFN( PLP)18 20-6, SOT-89-5, HSOP-6J a nd TO-252-5-P2. DFN( PLP) 1820-6
is suitable for high density mounting of the ICs on boards. SOT-89-5, HSOP-6J and TO-252-5-P2 are
supporting hi gh wat ta ge.
FEATURES
• Output Current ··········································· Min. 1A
• Supply Current ············································ Typ. 65µA
• Standby Current ········································· Typ. 0.15µA
• Input Voltage Range ···································· 1.4V to 6.5V
• Output Voltage Range ··································· Fixed Output Voltage Type: 0.8V to 5.5V (0.1V steps)
Adjustable Output Voltage Type: 0.8V to 5.5V
(For other voltages, please refer to MARK INFORMATIONS.)
• Dropout Voltag e ··········································· Typ. 0.52V (VOUT=2.8V, IOUT=1A)
• Ripple Rejec ti on ··········································· Typ. 70dB (f=1kHz, VOUT=2.8V)
• Output Voltage Accuracy ································ ±1.0%
• Output Voltage Temperature-Drift Coefficient ······ Typ. ±60ppm/°C
• Line Regulation ············································ Typ. 0.052%/V
• Load Regulation ········································· Typ. 3mV at IOUT=300mA, T yp. 5mV at IOUT=1A
• Packages ·················································· DFN(PLP)1820-6, SOT-89-5, HSOP-6J,TO-252-5-P2
• Inrush Current Limit Circuit ··························· Typ. 500mA
B/D version: Inrush current limit time is 500µs.
E/F version: Inrush current limit time is adjustable.
• Fold-Back Protection Circuit ·························· Typ. 250mA (Current at short mode)
• Thermal Shutdown Circuit ····························· Thermal Shutdown Temperature: Typ. 165°C
Released Temperature: Typ. 95°C
• Auto Discharge Function ······························ D, F version
• Ceramic capacitors are recommended to be used with this IC ···· 2.2µF or more (VOUT ≤ 3.6V)
4.7µF or more (VOUT
>
3.6V)
RP132x
NO.EA-265-171220
2
APPLICATIONS
• Power source for battery-powered eq uipm ent .
• Power source for portable communication equipment
• Power source for electrical appliances such as cameras, VCRs and camcorders.
• Power source for home appliances and Notebook PC.
SELECTION GUIDE
The output voltage, the auto discharge function(1), and the package type for the IC can be selected at the
user’s request.
Product Name Package Quantity per Reel Pb Free Halogen Free
RP132K001∗-TR DFN(PLP)1820-6 5,000 pcs Yes Yes
RP132Kxx1∗-TR
RP132H001#-T1-FE SOT-89-5 1,000 pcs Yes Yes
RP132Hxx1#-T1-FE
RP132S001#-E2-FE HSOP-6J 1,000 pcs Yes Yes
RP132Sxx1∗-E2-FE
RP132J001#-T1-FE TO-252-5-P2 3,000 pcs Yes Yes
RP132Jxx1#-T1-FE
RP132x001x is the adjustable output voltage type.
xx: The output voltage can be designated in the range from 0.8V(08) to 5.5V(55) in 0.1V step.
∗: The combination of the auto discharge function and delay pin (for setting inrush current limit time) are
as follows.
B: without auto discharge function
D: with auto discharge function
E: without auto discharge function, with delay pin (for setting inrush current limit time)
F: with auto discharge function and delay pin (for setting inrush current limit time)
#: The auto discharge function at off state are options as follows.
B: without auto discharge function at off state
D: with auto discharge function at off state
(1) Auto-discharge function quickly lowers the output voltage to 0V, when the chip enable signal is switched from the
active mode to the standby mode, by releasing the elec trical charge accumulated in the external capacitor.
RP132x
NO.EA-265-171220
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BLOCK DIAGRAMS
• Fixed Output Voltage Type
（
HSOP-6J / SOT89-5
）
RP132Sxx1B / RP132Hxx1B RP132Sxx1D / RP132Hxx1D
VDD
GND
VOUT
Vref
Current Limit
Thermal Shutdown
VDD
GND
VOUT
Vref
Current Limit
Thermal Shutdown
• Fixed Output Voltage Type
（
TO-252-5-P2 / DFN( PLP) 1820-6
）
RP132Jxx1B / RP132Kxx1B RP132Jxx1D / RP132Kxx1D
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
VFB
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
VFB
• Fixed Output Voltage Type wi t h DELAY pin
（
HSOP-6J
）
RP132Sxx1E RP132Sxx1F
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
DELAY
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
DELAY
RP132x
NO.EA-265-171220
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• Fixed Output Voltage Type wi t h DELAY pin
（
DFN(PLP)1820-6
）
RP132Kxx1E RP132Kxx1F
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
VFB
DELAY
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
VFB
DELAY
• Adjustabl e Output Voltage Type
（
HSOP-6J / SOT-89-5 / TO-252-5-P2 /DFN(PLP)1820-6
）
RP132S001B / RP132H001B / RP132S001D / RP132H001D /
RP132J001B / RP132K001B RP132J001D / RP132K001D
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
VFB
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
VFB
• Adjustabl e Output Voltage Type with DEL AY pin
（
DFN(PLP)1820-6
）
RP132K001E RP132K001F
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
VFB
DELAY
VDD
GND
VOUT
CE
Vref
Current Limit
Thermal Shutdown
VFB
DELAY
RP132x
NO.EA-265-171220
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PIN DESCRIPTIONS
Top View Bottom View
6
5
4
1
2
3
4
5
6
3
2
1
∗
1
3
5
4
2
1
3
6
4
2
5
1
2
3
4
5
RP132K
(DFN(PLP)1820-6)
RP132H
(SOT-89-5)
RP132S
(HSOP-6J)
RP132J
(TO-252-5-P2)
RP132K(1) (DFN(PLP)1820-6) Pin Description
Pin No.
Symbol
Pin Description
1
VOUT
Output Pin
(2)
2
VFB
Feed Back Pin
(2)
3
GND
Ground Pin
4
CE
Chip Enable Pin ("H" Active)
5
NC
No Connection (RP132K001B/D, RP132Kxx1B/D)
DELAY
Delay Pin for setting inrush current limit time (RP132K001E/F, RP132Kxx1E/F)
6
VDD
Input Pin
∗Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but
leaving it open is also accept a ble.
(1) When using Adjustable Output Voltage Type (RP132K001x), please follow "Notes on the Adjustable Output Voltage
Type Settings".
(2) When using Fixed Output Voltage Type(RP132Kxx1x), the VOUT pin and the VFB pin sh ould be conn ect ed.
RP132x
NO.EA-265-171220
6
RP132H(1) (SOT-89-5) Pin Description
Pin No.
Symbol
Pin Description
1
CE
Chip Enable Pin ("H" Active) (RP132Hxx1B/D)
VFB
Feed Back Pin (RP132H001B/D)
2
GND
Ground Pin
3
NC
No Connection (RP132Hxx1B/D)
CE
Chip Enable Pin ("H" Active) (RP132H001B/D)
4
VDD
Input Pin
5
VOUT
Output Pin
RP132S(1) (HSOP-6J) Pin Description
Pin No.
Symbol
Pin Description
1
VOUT
Output Pin
2
GND
Ground Pin
(2)
3
NC
No Connection (RP132Sxx1B/D)
VFB
Feed Back Pin (RP132S001B/D)
DELAY Delay Pin for setting inrush current limit time (RP132Sxx1E/F)
4
CE
Chip Enable Pin ("H" Active)
5
GND
Ground Pin
(2)
6
VDD
Input Pin
RP132J(1) (TO-252-5-P2) Pin Description
Pin No.
Symbol
Pin Description
1 CE Chip Enable Pin ("H" Active)
2 VDD Input Pin
3 GND Ground Pin
4 VOUT Output Pi n(3)
5 VFB Feed Back Pin(3)
∗Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but
leaving it open is also acceptable.
(1) When using Adjstable Output Voltage Type (RP132x001x), please follow "Notes on Adjustable Output Voltage Type
Settings".
(2) GND pins must be wired each other when mounted on boards.
(3) When using Fixed Output Voltage Type(RP132Jxx1x),VOUT pin and VFB pin should be conne cted.
RP132x
NO.EA-265-171220
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ABSOLUTE MAXIMUM RATINGS
Symbol
Item
Rating
Unit
VIN Input Voltage 7.0 V
VCE Input Voltage (CE Pin) −0.3 to 7.0 V
VFB Input Voltage (VFB Pin) −0.3 to 7.0 V
VOUT Output Volta ge −0.3 to VIN+0.3 V
PD Power Dissip ati on(1)
DFN(PLP)1820-6, JEDEC STD.51-7
2200
mW
SOT-89-5, JEDEC STD.51-7
2600
HSOP-6J, JEDEC STD.51-7
2700
TO-252-5-P2, JED EC STD.51 -7
3800
Tj Junction Temperature Range −40 to 125 °C
Tstg Storage Temperature Range −55 to 125 °C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent
damages and may degrade the life time and safety for both device and system using the device in the field.
The functional operation at or over these absolute maximum rat ing s are not assured.
RECOMMENDED OPERATING CONDITIONS
Symbol
Item
Rating
Unit
VIN Input Voltag e 1.4 to 6.5 V
Ta Operating Temperature Range −40 to 85 °C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating co ndit ion s, ev en i f when they are us ed ov er such ratings by mo ment ary ele ctr o ni c no is e or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended
operating con dit ion s.
(1) Refer to POWER DISSIPATION for detailed information.
RP132x
NO.EA-265-171220
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ELEC TRICAL CHARACTERIS TICS
VIN=Set VOUT+1.0 V, IOUT=1mA, CIN=2.2µF, COUT=2.2µF (VOUT ≤ 3.6V) / 4.7µF(VOUT＞3.6V)
The specification in is checked and guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C, unless
otherwise noted.
RP132xxx1B/D(Fixed Output Voltage Type) /
RP132S/Kxx1E/F(Fixed Output Voltage Type w ith DELAY pin) (Ta = 25°C)
Symbol
Item
Conditions
Min.
Typ.
Max.
Unit
VOUT Output Vo lta ge
Ta = 25°C
V
OUT
> 1.5V
×0.99
×1.01
V
VOUT ≤ 1.5V
−15
15
mV
−40°C ≤ Ta ≤ 85°C
V
OUT
> 1.5V
×
0.981
×
1.019
V
V
OUT
≤ 1.5V
−29
29
mV
I
LIM
Output Current Limit
1
A
∆VOUT/
∆IOUT Load Regulation
0.1mA ≤ I
OUT
≤ 300mA
3
20
mV
0.1mA ≤ I
OUT
≤ 1A
5
60
VDIF
Dropout Voltage
Refer to the following "Dr op out Vol tag e"
ISS
Supply Current
IOUT=0mA (VIN=6.5V)
65
85
µA
Istandby
Standby Current
V
CE
=0V, V
IN
=6.5V
0.15
0.60
µA
∆V
OUT
/
∆VIN
Line Regulation
Set V
OUT
+0.5V ≤ V
IN
≤ 6.5V
∗ However, VIN ≥1.6V
0.05 0.10
%/V
RR Ripple Rejec ti on
f=1kHz
Ripple 0.2Vp-p
IOUT=100mA
VOUT ≤ 3.3V 70 dB
VOUT > 3.3V 60
VIN
Input Voltage
1.4
6.5
V
I
SC
Short Current Limit
V
OUT
=0V
250
mA
I
PD
CE Pull-down Current
0.3
0.7
µA
V
CEH
CE Input Vo lta ge "H "
1.0
V
V
CEL
CE Input Vo lta ge "L"
0.4
V
en
Output Noise
BW=10Hz to 100kHz
70
µVrms
TTSD
Thermal Shutdown
Temperature
Junction Temperature 165 °C
TTSR
Thermal Shutdown
Released Temperature
Junction Temperature 95 °C
RLOW
Low Output Nch Tr. ON
Resistance (D/F version)
VIN=4.0V, VCE=0V 50 Ω
IDELAY
DELAY pin Current
(DELAY pin version)
VIN=4.0V 0.7 1.2 1.7
µA
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj≈Ta=25ºC) except Output
Noise, Ripple Rejection, Dropout Voltage at 1A Output Current and Load Reg ulat ion and Thermal Shutdown.
RP132x
NO.EA-265-171220
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The specification in is checked and guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C, unless
otherwise noted.
Dropout Voltage (Ta = 25°C)
Output Voltage
VOUT (V) Dropout Voltage VDIF (V)
Condition Typ. Max. Condition Typ. Max.
0.8 ≤ VOUT < 0.9
IOUT=300mA
0.67 0.89
IOUT=1A
1.20 1.54
0.9 ≤ VOUT < 1.0 0.59 0.82 1.10 1.46
1.0 ≤ VOUT < 1.1 0.51 0.73 1.05 1.39
1.1 ≤ VOUT < 1.2 0.42 0.63 0.96 1.31
1.2 ≤ VOUT < 1.5 0.36 0.54 0.90 1.23
1.5 ≤ VOUT < 2.6 0.24 0.33 0.78 1.05
2.6 ≤ VOUT < 3.3 0.15 0.21 0.52 0.72
3.3 ≤ VOUT ≤ 5.5 0.13 0.18 0.46 0.68
RP132x
NO.EA-265-171220
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VIN=Set VOUT+1.0 V, IOUT=1mA, CIN=2.2µF, COUT=2.2µF, VOUT ≤ 3.6V, 4.7µF VOUT＞3.6V
The specification in is checked and guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C, unless
otherwise noted.
RP132x001B/D(Adjustable Output Voltage Typ e) /
RP132K001E/F(Adjustable Output Voltage Typ e w it h DELAY pin) (Ta = 25°C)
Symbol
Item
Conditions
Min.
Typ.
Max.
Unit
VFB Feedback Voltage
Ta
=25°C
VOUT=VFB
0.785
0.800
0.815
V
−40°C ≤ Ta
≤ 85°C
0.771
0.829
VOUT
Output Volta ge
Adjusting Range
0.8 5.5 V
I
LIM
Output Cur r ent Limit
V
OUT
=V
FB
1
A
∆VOUT/
∆IOUT Load Regulation
0.1mA ≤ IOUT ≤ 300mA
3
20
mV
0.1mA ≤ I
OUT
≤ 1A
5
60
VDIF Dropout Voltage VOUT=VFB
I
OUT
=300mA
0.67
0.89
V
I
OUT
=1A
1.20
1.54
ISS
Supply Current
V
OUT
=V
FB
, I
OUT
=0mA (V
IN=
6.5V)
65
85
µA
Istandby
Standby Current
V
CE
=0V, V
IN
=6.5V
0.15
0.60
µA
∆V
OUT
/
∆
VIN
Line Regulation VOUT=VFB, 1.6V ≤ VIN ≤ 6.5V 0.05 0.10
%/V
RR Ripple Rejec ti on
f=1kHz,
Ripple 0.2Vp-p,
IOUT=100mA
VOUT=VFB 70 dB
V
IN
Input Voltage
1.4
6.5
V
ISC
Short Current Limit
VOUT=VFB =0V
250
mA
I
PD
CE Pull-down Current
0.3
0.7
µA
V
CEH
CE Input Vo lta ge "H "
1.0
V
V
CEL
CE Input Vo lta ge "L"
0.4
V
en
Output Noise
BW=10Hz to 100kHz
70
µVrms
TTSD
Thermal Shutdown
Temperature
Junction Temperature 165 °C
TTSR
Thermal Shutdown
Released Temperature
Junction Temperature 95 °C
RLOW
Low Output Nch Tr. ON
Resistance (D/F version)
VIN=4.0V, VCE=0V 50 Ω
IDELAY
DELAY pin Current
(DELAY pin version)
VIN=4.0V 0.7 1.2 1.7 µA
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj≈Ta=25ºC) except Output
Noise, Ripple Rejection, Dropout Voltage at 1A Output Current and Load Reg ulat ion and Thermal Shutdown.
RP132x
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APPLICATION IN FORMATI ON
Typical Application Circuits
Fixed Output Voltage Type (HSOP-6J/ SOT89-5)
C
IN
VDD
VOUT
CE
GND
C
OUT
V
OUT
RP132S/H
xx1x
CE Control
Fixed Output Voltage Type (TO-252-5-P2/ DFN(PLP)1820-6)
VOUT
C
IN
RP132J/K
xx1x
VDD
VOUT
GND
C
OUT
CE
VFB
CE Control
Adjustable Output Voltage Type (HSOP-6J / SOT89-5/ TO-252-5-P2 / DFN(PLP)1820-6
）
VOUT
C
IN
RP132x
001x
VDD
VOUT
GND
C
OUT
CE
VFB
R2
R1
CE Control
RP132x
NO.EA-265-171220
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Fixed Output Voltage Type with DELAY pin (HS OP-6J)
C
IN
VDD
VOUT
CE
GND
C
OUT
V
OUT
RP132S
xx1E/F
DELAY
C
D
CE Control
Fixed Output Voltage Type with DELAY pin (DFN(PLP )1820-6)
VOUT
C
IN
RP132K
xx1E/F
VDD
VOUT
GND
C
OUT
CE
VFB
DELAY
CD
CE Control
Adjustable Output Voltage Type with DELAY pin (DFN(PLP)1820-6)
VOUT
C
IN
RP132K
001E/F
VDD
VOUT
GND
C
OUT
CE
VFB
R2
R1
DELAY
CD
CE Control
RP132x
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Recommended External Components
VOUT Capacitors
VOUT ≤ 3.6V CIN (C1) Kyocera 2.2µF (size:1005) [CM05X5R225M06A]
COUT (C2)
Kyocera 2.2
µ
F (size:1608) [CM105X5R225K06AB]
VOUT > 3.6V CIN (C1) Kyocera 2.2µF (size:1005) [CM05X5R225K06A]
COUT (C2)
Kyocera 4.7
µ
F (size:1608) [CM105X5R475M06AB]
Please refer to "Technical Notes on Adjustable Output Voltage Type" when using R1 and R2 as output
capacitors. Also refer to "Inrush Current Limit Time Settings" concerning with CD.
Technical Notes on the Ext er nal Components
When using this IC, consider the following points:
Phase Compe nsation
In this IC, phase compensation is made for securing stable operation even if the load current is varied. For this
purpose, use a 4.7µF or more capacitor COUT between VOUT pin and GND pin, and as close as possible to the
pins.
If a tantalum capacitor is used, and its ESR (Equivalent Series Resistance) of COUT is large, the loop oscillation
may result. Because of this, select COUT carefully considering its frequency characteristics.
PCB Layout
Make VDD and G ND lines s ufficient. If their im pedance is high, nois e pick up or uns table operat ion ma y result.
Connect a 2.2 µF or more capacitor CIN between VDD and GND pin with a capacitance value as
"Recommendation value of the external capacitors" above or more, and as close as possible to the pins.
Set external components, especially the output capacitor COUT, as close as possible to the IC, and make wiring
as short as possible.
When using the Adjustable Output Voltage Type, the transient response could be affected by the external
resistors. Evaluate the circuit taking the actual conditions of use into account.
Output Voltage Setting Method (A djustable Output Voltage Type)
RP132x081x can be adjusted the output voltage up to 5.5V by using the external divider resistors. Also, please
use 16kΩ or less for R2 resistor. If the VFB voltage is described as setVFB, the output voltage can be set by
using the following equations. SetVFB is equal to 0.8V. The VOUT pin of RP132x081x should be connected to
the VFB pin.
RP132x
NO.EA-265-171220
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GND
V
FB
R
IC
R2
I
IC
I1
I2
R1
SetV
FB
VOUT
V
OUT
I1= IIC + I2 ....................................................................................................................................... (1)
I2= setVFB / R2 ............................................................................................................................... (2)
Thus, I1= IIC + setVFB /R2.......................................................................................................................... (3)
Therefore, VOUT = setVFB × R1 × I1 ................................................................................................................... (4)
Put Equation (3) into Equation (4), then
VOUT = setVFB + R1(IIC + setVFB / R2)
= setVFB × (1+R1/ R2) + R1 × IIC ............................................................................................. (5)
In Equation (5), R1x IIC is the error-causing factor in VOUT.
As for IIC, IIC = setVFB / RIC .............................................................................................................................. (6)
Therefore, the error-causing factor R1x IIC can be described as follows.
R1×IIC = R1 × setVFB / RIC
= setVFB × R1 / RIC ................................................................................................................ (7)
For better accuracy, choosing R1 (<<RIC) reduces this error.
Without the error-causing factor R1x IIC, the output voltage can be calculated by the following equation
VOUT = setVFB × ((R1 + R2) / R2) ................................................................................................... (8)
RIC of RP13 2x is appr oximately Typ.1.3MΩ (Ta=25°C, th is value is guaranteed by design.) . The valu e could
be affected by the temperature, therefore evaluate the circuit taking the actual conditions of use into account.
Inrush Current Limit Time Settings
The RP132xSeries include the circuit which can limit the inrush current at start-up to 500mA or less. The
current limit time of B/D version is fixed internally as approximately Typ.500µs. On the other hand, the current
limit tim es of E/F versions ar e adjustable by controlling the DEL AY pin value, which is the capacit ance value
connecte d between DLEAY pin and G ND pin. The relation b etween I nrush Cur rent Lim it Tim e (tD[s]) and the
DELAY pin capacitance (CD[F]) can be described in the following equation.
RP132x
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tD=(CD+70×10-12)×0.525×106
When not using CD on E/F versions, DELAY pin should be open. In this case, CD=0 is applied to the above
equation and as a result, 37µs can be obtained. That means, when using CD on E/F versions, the inrush current
limit time will be more than 37µs. Please note that during the inrush current limit time, the load current cannot
be more than the limited current.
ESR vs. Output Current
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions
when the white noise le ve l is under 40 µV (Avg.) are marked as the hatched area in the graph.
Measurement Conditions
Frequency Band : 10Hz to 2MHz
Temperature : −40°C to 85°C
Hatched Area : Noise level is under 40µVms (Avg.)
CIN (C1) : 2.2µF (Kyocera CM05X5R225M06A)
COUT (C2) : 2.2µF (VOUT = 0.8 V, Kyocera CM105X5R225K06AB)
4.7µF (VOUT = 5.5V, Kyocera CM105X5R475M06AB)
RP132x081x
RP132x551x
0.01
0.1
1
10
100
0100 200 300 400 500 600 700 800 900 100
0
O utput Cur r ent I
OUT
(mA)
ESR (Ω)
VIN = 1.4 V to 6.5 V
C1 = 2.2 µF, C2 = 2.2 µF
Ta=85°C
Ta=-40°C
0.01
0.1
1
10
100
0100 200 300 400 500 600 700 800 900 1000
Output Current I
OUT
(mA)
ESR (Ω)
VIN = 5.5 V to 6.5 V
C1 = 2.2 µF, C2 = 4.7 µ F
T a= - 40, 85°C
RP132x
NO.EA-265-171220
16
TYPICAL CHARACTERISTICS
Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Voltage vs. Input Voltage (Ta=25
°
C)
RP132x081x RP132x151x
RP132x331x RP132x551x
2) Supply Current vs. Input Voltage (Ta=25
°
C)
RP13x081x RP132x151x
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0246
Input Voltage VIN (V)
Output Voltage VOUT (V)
Iout=1mA
Iout=50mA
Iout=100mA
Iout=300mA
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0246
Input Voltage VIN (V)
Output Voltage VOUT (V)
Iout=1mA
Iout=50mA
Iout=100mA
Iout=300mA
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0246
Input Voltage VIN (V)
Output Voltage VOUT (V)
Iout=1mA
Iout=50mA
Iout=100mA
Iout=300mA
0
0
1
2
3
4
5
6
0 2 4 6
Input Voltage VIN (V)
Output Voltage VOUT (V)
Iout=1mA
Iout=50mA
Iout=100mA
Iout=300mA
0
10
20
30
40
50
60
70
0246
Input Voltage V
IN
(V)
Supply Current Iss (µA )
0
10
20
30
40
50
60
70
80
0246
Input Voltage VIN (V)
Supply Current Iss (µA )
RP132x
NO.EA-265-171220
17
RP132x331x RP132x551x
3) Supply Current vs. Temperature
RP132x081x RP132x151x
RP132x331x RP132x551x
0
10
20
30
40
50
60
70
80
90
0246
Input Voltage V
IN
(V)
Supply Current Iss (µA)
0
20
40
60
80
100
120
140
0 2 4 6
Input Voltage V
IN
(V)
Supply Current Iss (µA)
0
10
20
30
40
50
60
70
80
90
-50 -25 025 50 75 100
Temperature Topt (°C)
Supply Current I
SS
(µA)
0
10
20
30
40
50
60
70
80
90
-50 -25 025 50 75 100
Temperature Topt (°C)
Supply Current I
SS
(µA)
0
10
20
30
40
50
60
70
80
90
-50 -25 025 50 75 100
Temperature Topt (°C)
Supply Current I
SS
(µA)
0
10
20
30
40
50
60
70
80
90
-50 -25 025 50 75 100
Temperature Topt (°C)
Supply Current I
SS
(µA)
RP132x
NO.EA-265-171220
18
4) Output Voltage vs. Temperature
RP132x081x RP132x151x
RP132x331x RP132x551x
5) Dropout Voltage vs. Output Current
RP132x081x RP132x151x
0.77
0.78
0.79
0.80
0.81
0.82
0.83
0.84
-50 -25 025 50 75 100
Temperature (° C)
Output Voltage VOUT (V)
1.47
1.48
1.49
1.50
1.51
1.52
1.53
1.54
-50 -25 025 50 75 100
Temperature (° C)
Output Voltage V
OUT
(V)
3.27
3.28
3.29
3.30
3.31
3.32
3.33
3.34
-50 -25 025 50 75 100
Temperature (° C)
Output Voltage VOUT (V)
5.47
5.48
5.49
5.50
5.51
5.52
5.53
5.54
-50 -25 025 50 75 100
Temperature (° C)
Output Voltage V
OUT
(V)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0200 400 600 800 1000
O utput Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
85°C
25°C
-40°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0200 400 600 800 1000
O utput Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
85°C
25°C
-40°C
0
RP132x
NO.EA-265-171220
19
RP132x331x RP132x551x
6) Dropout Voltage vs. Set Output Voltage
7) Ripple Rejection vs. Input Voltage (CIN=none, Ripple=0.2Vp-p, Ta=25
°
C)
RP132x331x RP132x331x
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0200 400 600 800 1000
Output Current IOUT (mA)
Dropout Voltage VDIF (V)
85°C
25°C
-40°C
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0200 400 600 800 1000
Output Current I
OUT
(mA)
Dropout Voltage V
DIF
(V)
85°C
25°C
-40°C
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 2 4 6
Set Output Voltage VREG (V)
Dropout Voltage VDIF (V)
1A
800mA
600mA
300mA
100mA
0
0
10
20
30
40
50
60
70
80
90
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Input Voltage V
IN
(V)
Ripple Rejecti on RR(dB)
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
C2=Ceramic2.2μF
I
OUT
=1mA
0
10
20
30
40
50
60
70
80
90
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Input Voltage V
IN
(V)
Ripple Rejecti on RR(dB)
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
C2=Ceramic2.2μF
I
OUT
=30mA
RP132x
NO.EA-265-171220
20
RP132x331x RP131x551x
RP132x551x RP132x551x
8) Ripple Rejection vs. Frequency (CIN =none, Ta=25°C)
RP132x081x RP132x331x
0
10
20
30
40
50
60
70
80
90
3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
Input Voltage V
IN
(V)
Ripple Rejecti on RR(dB)
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
C2=Ceramic2.2μF
I
OUT
=50mA
0
10
20
30
40
50
60
70
80
90
5.5 5.7 5.9 6.1 6.3 6.5
Input Voltage V
IN
(V)
Ripple Rejecti on RR(dB)
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
C2=Ceramic4.7μF
I
OUT
=1mA
0
10
20
30
40
50
60
70
80
90
5.5 5.7 5.9 6.1 6.3 6.5
Input Voltage VIN (V)
Ripple Rejecti on RR(dB)
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
C2=Ceramic4.7μF
IOUT=10mA
0
10
20
30
40
50
60
70
80
90
5.5 5.7 5.9 6.1 6.3 6.5
Input Voltage V
IN
(V)
Ripple Rejecti on RR(dB)
f=0.2kHz
f=1kHz
f=10kHz
f=100kHz
C2=Ceramic4.7μF
I
OUT
=100mA
0
10
20
30
40
50
60
70
80
90
100
0.1 110 100 1000
Frequency f (kHz)
Ripple Rejention RR (dB)
Iout=1mA
Iout=30mA
Iout=100mA
C2=Ceramic 2.2μF
0
10
20
30
40
50
60
70
80
90
100
0.1 110 100 1000
Frequency f (kHz)
Ripple Rejention RR (dB)
Iout=1mA
Iout=30mA
Iout=100mA
C2=Ceramic 2.2μF
RP132x
NO.EA-265-171220
21
RP132x551x
9) Input Transient Response (CIN =none, IOUT=100mA, tr=tf=5
µ
s, Ta=25
°
C)
RP132x081x RP132x331x
RP132x551x
0
10
20
30
40
50
60
70
80
90
100
0.1 110 100 1000
Frequency f (kHz)
Ripple Rejention RR (dB)
Iout=1mA
Iout=30mA
Iout=100mA
C2=Ceramic 4.7μF
0.78
0.79
0.80
0.81
0.82
0.83
0.84
0.85
-10 010 20 30 40 50 60 70 80 90
Time t (µs)
Output Voltage VOUT (V)
-
-
-
1.0
2.0
3.0
4.0
Input Vol tage VIN (V)
C2=Ceramic2.2μF
Input Voltage
1.8V ⇔ 2.8V
Output Voltage
3.28
3.29
3.30
3.31
3.32
3.33
3.34
3.35
-10 010 20 30 40 50 60 70 80 90
Time t (µs)
Output Voltage VOUT (V)
-
3.0
4.0
5.0
6.0
Input Vol tage VIN (V)
C2=Ceramic2.2μF
Input Voltage
4.3V ⇔ 5.3V
Output Voltage
5.48
5.49
5.50
5.51
5.52
5.53
5.54
5.55
-10 010 20 30 40 50 60 70 80 90
Time t (µs)
Output Voltage V
OUT
(V)
5.5
6.5
7.5
Input Vol tage V
IN
(V)
C2=Ceramic4.7μF
Input Voltage
5.8V ⇔ 6.5V
Output Voltage
RP132x
NO.EA-265-171220
22
10) Load Transient Response (VIN=VOUT+1.0V, CIN =Ceramic 2.2
µ
F, tr=tf=0.5
µ
s, Ta=25
°
C)
RP132x081x RP132x081x
RP132x081x RP132x331x
RP132x331x RP132x331x
0.78
0.79
0.80
0.81
0.82
0.83
0.84
0.85
-20 020 40 60 80 100 120 140 160 180
Time t (µs)
Output Voltage V
OUT
(V)
0
50
100
150
Output Current　I
OUT
(mA)
Output Current
50mA ⇔ 100mA
Output Voltage
C2=Ceramic2.2μF
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
-20 020 40 60 80 100 120 140 160 180
Time t (µs)
Output Voltage V
OUT
(V)
0
200
400
600
Output Current　I
OUT
(mA)
Output Current
100mA ⇔ 500mA
Output Voltage
C2=Ceramic2.2μF
0.76
0.78
0.80
0.82
0.84
0.86
0.88
0.90
-20 020 40 60 80 100 120 140 160 180
Time t (µs)
Output Voltage VOUT (V)
0
30
60
Output Current　IOUT (mA)
Output Voltage
C2=Ceramic2.2μF
Output Current
0mA ⇔ 30mA
3.28
3.29
3.30
3.31
3.32
3.33
3.34
3.35
-20 020 40 60 80 100 120 140 160 180
Time t (µs)
Output Voltage VOUT (V)
0
50
100
150
Output Current　IOUT (mA)
Output Current
50mA ⇔ 100mA
Output Voltage
C2=Ceramic2.2μF
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
-20 020 40 60 80 100 120 140 160 180
Time t (µs)
Output Voltage VOUT (V)
0
200
400
600
Output Current　IOUT (mA)
Output Current
100mA ⇔ 500mA
Output Voltage
C2=Ceramic2.2μF
3.26
3.28
3.30
3.32
3.34
3.36
3.38
3.40
-20 020 40 60 80 100 120 140 160 180
Time t (µs)
Output Voltage VOUT (V)
0
30
60
Output Current　IOUT (mA)
Output Voltage
C2=Ceramic2.2μF
Output Current
0mA ⇔ 30mA
RP132x
NO.EA-265-171220
23
RP132x551x RP132x551x
RP132x551x
11) Turn on Speed w ith CE pin (CIN =Ceramic 2.2
µ
F, Ta=25
°
C)
RP132x081x RP132x331x
5.48
5.49
5.50
5.51
5.52
-20 020 40 60 80 100 120 140 160 180
Time t (µs)
Output Voltage VOUT (V)
0
50
100
150
Output Current　IOUT (mA)
Output Current
50mA ⇔ 100mA
Output Voltage
C2=Ceramic4.7μF
5.2
5.3
5.4
5.5
-20 020 40 60 80 100 120 140 160 180
Time t (µs)
Output Voltage VOUT (V)
0
200
400
600
Output Current　IOUT (mA)
Output Current
100mA ⇔ 500mA
Output Voltage
C2=Ceramic4.7μF
5.46
5.48
5.50
5.52
5.54
-20 020 40 60 80 100 120 140 160 180
Time t (µs)
Output Voltage VOUT (V)
0
30
60
Output Current　IOUT (mA)
Output Current
0mA ⇔ 30mA
Output Voltage
C2=Ceramic4.7μF
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
-50 050 100 150 200 250 300 350 400 450
Time t (µs)
Output Voltage V
OUT
(V)
0
1
2
3
CE Input Voltage V
CE
(V)
Iout=0mA
Iout=100mA
Output Voltage
CE Input Voltage
C2=Ceramic2.2μF
0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
-50 050 100 150 200 250 300 350 400 450
Time t (µs)
Output Voltage V
OUT
(V)
0
2
4
6
CE Input Voltage V
CE
(V)
Iout=0mA
Iout=100mA
Output Voltage
CE Input Voltage
C2=Ceramic2.2μF
0
RP132x
NO.EA-265-171220
24
RP132x551x
12) Turn off Speed with CE pin (D version) (CIN =Ce ram ic 2 .2
µ
F, Ta=25
°
C)
RP132x081D RP132x331D
RP132x551D
0
2
4
6
8
10
12
14
-50 050 100 150 200 250 300 350 400 450
Time t (µs)
Output Voltage VOUT (V)
0
3
6
9
CE Input Voltage VCE (V)
Iout=0mA
Iout=100mA
Output Voltage
CE Input Voltage
C2=Ceramic4.7μF
0
0.4
0.8
1.2
1.6
2
2.4
2.8
-0.2 00.2 0.4 0.6 0.8 11.2 1.4 1.6 1.8
Times [ms]
Output Voltage [V]
0
1
2
3
CE Input Voltage [V]
Iout=0mA
Iout=100mA
Output Voltage
CE Input Voltage
V
IN
=1.8V
C2=Ceramic2.2μF
0
1
2
3
4
5
6
7
-0.2 00.2 0.4 0.6 0.8 11.2 1.4 1.6 1.8
Times [ms]
Output Voltage [V]
0
2
4
6
CE Input Voltage [V]
Iout=0mA
Iout=100mA
Output Voltage
CE Input Voltage
V
IN
=4.3V
C2=Ceramic2.2μF
0
2
4
6
8
10
12
14
-0.2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Times [ms]
Output Voltage [V]
0
3
6
9
CE Input Voltage [V]
Iout=0mA
Iout=100mA
Output Voltage
CE Input Voltage
V
IN
=6.5V
COUT =Ceramic4.7µF
RP132x
NO.EA-265-171220
25
13) Inrush Current (CIN =Ceramic 2.2
µ
F, IOUT=100mA, Ta=25
°
C)
RP132x081x RP132x331x
RP132x551x
14) Minimum Operating Voltage
RP132x081x
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-40 040 80 120 160 200 240 280 320 360
Time t (µs)
CE Input Voltage VCE (V)
Output Voltage VOUT (V)
0
100
200
300
400
500
600
700
Inrush Current (mA)
CE Input Voltage
O utput Voltage
Inrush Current
VIN=2.3V,C2=Ceramic2.2μF
0
0
1
2
3
4
5
6
7
-40 040 80 120 160 200 240 280 320 360
Time t (µs)
CE Input Voltage VCE (V)
Output Voltage VOUT (V)
0
100
200
300
400
500
600
700
Inrush Current (mA)
CE Input Voltage
O utput Voltage
Inrush Current
VIN=4.8V,C2=Ceramic2.2μF
0
1
2
3
4
5
6
7
-40 040 80 120 160 200 240 280 320 360
Time t (µs)
CE Input Voltage VCE (V)
Output Voltage VOUT (V)
0
100
200
300
400
500
600
700
Inrush Current (mA)
CE Input Voltage
O utput Voltage
Inrush Current
VIN=6.5V,C2=Ceramic4.7μF
Output Current I
OUT
(mA)
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2
2.1
2.2
0200 400 600 800 1000
Input Voltage V
IN
(V)
2.0
1.0
The operat ion r age that c an o utput 0.8 V is s hown
by the hatched area in the graph.
RP132x
NO.EA-265-171220
26
15) Inrush Current Limit Time vs. CD Capaci t ance (E / F Version)
RP132x081x
16) Inrush Current Limit Time vs. Input Voltage (E / F Version)
RP132x081x
0
2
4
6
8
10
12
0 5 10 15 20
C
D
(nF )
I nrush Current Li m i t T im e (m s)
V
IN
=4.0V
0
2
4
6
8
10
12
1 3 5 7
Input V ol tage V
IN
(V )
I nrush Current Li m i t T im e (m s)
CD=20nF
CD=10nF
CD=2nF
CD=1nF
CD=none
POWER DISSIPAT I ON DFN(PLP)1820-6
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
φ 0.2 mm × 34 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissip ati on
2200 mW
Thermal Resistance (
θ
ja)
θja = 45°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 18°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
0
500
1000
1500
2000
2500
3000
025 50 75 100 125 150
Power Dissipation (mW)
Ambient Temperature (°C)
85
2200
2700
2700
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
PACKAGE DIMENSIONS DFN(PLP)1820-6
Ver. A
i
2.00
1.80
0.25±0.1
0.25±0.1
0.1NOM.
0.3±0.1
0.5
0.6MAX.
A
B
0.05
X4
0.05
M
AB
INDEX
S
0.05min
1
2
3
4
5
6
1.6±0.1
1.0±0.1
0.20±0.1
※
0.05
S
Bottom View
DFN(PLP)1820-6 Package Dimensions (Unit: mm)
*
∗ The tab on the bottom of the package is substrate level (GND). It is recommended that the tab be connected to the
ground plane on the board, or otherwise be left floating.
POWER DISSIPAT I ON SOT-89-5
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
φ 0.3 mm × 13 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissip ati on
2600 mW
Thermal Resistance (
θ
ja)
θja = 38°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 13°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
0
500
1000
1500
2000
2500
3000
3500
4000
025 50 75 100 125 150
Power Dissipation (mW)
Ambient Temperature (°C)
85
2200
2600
3200
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
PACKAGE DIMENSIONS
SOT-89-5
Ver. A
i
SOT-89-5 Package Dimensions
1.5±0.1 1.5±0.1
0.47±0.1
0.42±0.1 0.42±0.1
1.5±0.1
0.4±0.1
0.4±0.1
0.1 S
S
0.3±0.2 0.3±0.2
4 5
33 2 1
0.42±0.1
4.5±0.1
1.6±0.2
4.35±0.1
2.5±0.1 0.4±0.3
5 4
1 2 3
φ1.0
1.00±0.2
POWER DISSIPAT I ON HSOP-6J
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
φ 0.3 mm × 28 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissip ati on
2700 mW
Thermal Resistance (
θ
ja)
θja = 37°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 7°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
0
500
1000
1500
2000
2500
3000
3500
4000
025 50 75 100 125 150
Power Dissipation (mW)
Ambient Temperature (°C)
85
2700
3400
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
PACKAGE DIMENSIONS
HSOP-6J
Ver. A
i
HSOP-6J Package Dimensions
POWER DISSIPAT I ON
TO-252-5
Ver. A
i
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
φ
0.3 mm × 21 pcs
Measurement Result (Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissip ati on
3800 mW
Thermal Resistance (
θ
ja)
θ
ja = 26°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 7°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
0
1000
2000
3000
4000
5000
025 50 75 100 125 150
Power Dissipation (mW)
Ambient Temperature (°C)
85
4800
3800
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours 9 years
PACKAGE DIMENSIONS
TO-252-5-P2
Ver. A
i
TO-252-5-P2 Package Dimensions
∗ The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this
tab be connected to the ground plane on the board but it is possible to leave the tab floating.
Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
Halogen Free
https://www.e-devices.ricoh.co.jp/en/
Sales&SupportOffices
RicohElectronicDevicesCo.,Ltd.
Shin-YokohamaOffice(InternationalSales)
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1.The productsand the productspecifications described inthis document aresubjectto change ordiscontinuation of
productionwithout noticefor reasons
suchas improvement.Therefore, before deciding to usethe products,please
refertoRicohsalesrepresentativesforthelatestinformationthereon.
2.The materials in thisdocument may notbe copiedor otherwise reproducedin wholeor in partwithout priorwritten
consentofRicoh.
3.Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
takingoutofyourcountrytheproductsorthetechnicalinformationdescribedherein.
4.Thetechnicalinformationdescribedinthisdocumentshowstypicalcharacteristicsofandexampleapplicationcircuits
fortheproducts.Thereleaseofsuchinformationisnottobeconstruedasawarrantyoforagrantoflicenseunder
Ricoh'soranythirdparty'sintellectualpropertyrightsoranyotherrights.
5.Theproductslistedinthisdocumentareintendedanddesignedforuseasgeneralelectroniccomponentsinstandard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusementequipmentetc.). Those customersintending to useaproduct inanapplication requiring extremequality
andreliability,forexample,inahighlyspecificapplicationwherethefailureormisoperationoftheproductcouldresult
inhumaninjuryordeath(aircraft,spacevehicle,nuclearreactorcontrolsystem,trafficcontrolsystem,automotiveand
transportationequipment,combustionequipment,safetydevices,lifesupportsystemetc.)shouldfirstcontactus.
6.Wearemakingourcontinuousefforttoimprovethequalityandreliabilityofourproducts,butsemiconductorproducts
arelikelytofailwithcertainprobability.Inordertopreventanyinjurytopersonsordamagestopropertyresultingfrom
suchfailure,customersshouldbecarefulenoughtoincorporatesafetymeasuresintheirdesign,suchasredundancy
feature,firecontainmentfeatureandfail-safefeature.Wedonotassumeanyliability
orresponsibilityforanylossor
damagearisingfrommisuseorinappropriateuseoftheproducts.
7.Anti-radiationdesignisnotimplementedintheproductsdescribedinthisdocument.
8.The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristicsintheevaluationstage.
9.WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristicsoftheproductsunderoperationorstorage.
10.There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
caseofrecognizingthemarkingcharacteristicwithAOI,pleasecontactRicohsalesorourdistributorbeforeattempting
touseAOI.
11.
PleasecontactRicohsalesrepresentativesshouldyouhaveanyquestionsorcommentsconcerningtheproductsor
thetechnicalinformation.