C2220X331JBRALTM - KEMET Electronics Corporation

One WORLD One Brand One Strategy One Focus One Team One KEMET

Benets

• -55°C to +125°C operating temperature range

• Superior ex performance (up to 5mm)

• Pb-Free and RoHS compliant

• EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220 and 2225 case sizes

• DC voltage ratings of 500V, 630V, 1KV, 1.5KV, 2KV, 2.5KV and 3KV

• Capacitance offerings ranging from 62pF to 0.27μF

• Available capacitance tolerances of ±5%, ±10% or ±20%.

• Low ESR and ESL

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated end metallization allowing for

excellent solderability

• SnPb plated end metallization option available upon request (5% min)

Applications

Typical applications include switch mode power supplies (input

lters, resonators, tank circuits, snubber circuits, output lters),

high voltage coupling and DC blocking, lighting ballasts, voltage

multiplier circuits, DC/DC converters and coupling capacitors in

Ćuk converters. Markets include power supply, LCD uorescent

backlight ballasts, HID lighting, telecom equipment, industrial and

medical equipment/control, LAN/WAN interface, analog and digital

modems, and automotive. X7R dielectrics are not designed for AC

line ltering or pulse applications.

Overview

KEMET’s High Voltage with Flexible Termination (HV FT-CAP)

surface mount MLCCs in X7R dielectric combine high voltage and

exible termination technologies. Featuring a 125°C maximum

operating temperature and considered “temperature stable,”

these devices address the primary failure mode of MLCCs—ex

cracks, which are typically the result of excessive shear stresses

produced during board exure or thermal cycling. Utilizing a

conductive silver epoxy between the base metal and nickel

barrier layers of KEMET’s standard termination system, exible

termination technology directs board ex stress away from the

ceramic body and into the termination area, therefore mitigating

ex cracks which can result in low IR or short circuit failures.

Although exible termination technology does not eliminate the

potential for mechanical damage that may propagate during

extreme environmental and handling conditions, it does provide

superior ex performance over standard termination systems.

The HV FT-CAP offers low leakage current, exhibits low ESR at

high frequencies and nds conventional use as snubbers or lters

in applications such as switching power supplies and lighting

ballasts. Their exceptional performance at high frequencies has

made them a preferred choice of design engineers worldwide.

In addition to their use in power supplies, these capacitors

are widely used in industries related to telecommunications,

medical, military, aerospace, semiconductors and test/diagnostic

equipment.

Combined with the stability of an X7R dielectric and designed to

accommodate all capacitance requirements, these ex-robust

devices are RoHS-compliant, offer up to 5mm of ex-bend

capability and exhibit a predictable change in capacitance with

respect to time and voltage. Capacitance change with reference

to ambient temperature is limited to ±15% from -55°C to +125°C.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage with Flexible Termination System (HV FT-CAP)

X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

1 Additional termination options may be available. Contact KEMET for details.

2 Additional reeling or packaging options may be available. Contact KEMET for details.

Ordering Information

C 1210 X 473 K C R A C TU

Ceramic Case Size

(L" x W")

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance Voltage Dielectric Failure Rate/

Design End Metallization1Packaging/Grade

(C-Spec)2

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination

2 Sig. Digits +

Number of Zeros

J = ±5%

K = ±10%

M = ±20%

C = 500V

B = 630V

D = 1000V

F = 1500V

G = 2000V

Z = 2500V

H = 3000V

R = X7R A = N/A C = 100% Matte Sn

L = SnPb (5% min)

Blank = Bulk

TU = 7" Reel

Unmarked

TM = 7" Reel Marked

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Dimensions – Millimeters (Inches)

Qualication/Certication

Commercial grade products are subject to internal qualication. Details regarding test methods and conditions are referenced in Table

4, Performance and Reliability.

Environmental Compliance

RoHS PRC ( Peoples Republic of China) compliant

Electrical Parameters/Characteristics

Item Parameters/Characteristics

Operating Temperature Range: -55°C to +125°C

Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC): ±15%

Aging Rate (Max % Cap Loss/Decade Hour): 0%

Dielectric Withstanding Voltage:

150% of rated voltage for voltage rating of < 1000V

120% of rated voltage for voltage rating of ≥ 1000V

Dissipation Factor (DF) Maximum Limit @ 25ºC: 2.5%

Insulation Resistance (IR) Limit @ 25°C: 1000 megohm microfarads or 100GΩ

Insulation Resistance (IR) Limit @ 125°C: 100 megohm microfarads or 10GΩ

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and Dissipation Factor (DF) measured under the following conditions:

1kHz and 1 Vrms if capacitance >1000pF

EIA Size

Code

Metric Size

Code L Length W Width B Bandwidth T Thickness

Mounting

Technique

0805

2012

2.1 (.083) ± 0.30 (.012)

1.25 (.049) ± 0.20 (.008)

0.50 (0.02) ± 0.25 (.010)

See Table 2 for

Thickness

Solder Wave or

Solder Reow

1206 3216 3.3 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008) 0.60 (.024) ± 0.25 (.010)

1210 3225 3.3 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008) 0.60 (.024) ± 0.25 (.010)

Solder Reow

Only

1808 4520 4.7 (.185) ± 0.50 (.020) 2.00 (.079) ± 0.20 (.008) 0.70 (.028) ± 0.35 (.014)

1812 4532 4.5 (.178) ± 0.40 (.016) 3.20 (.126) ± 0.30 (.012) 0.70 (.028) ± 0.35 (.014)

1825 4564 4.6 (.181) ± 0.40 (.016) 6.40 (.252) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014)

2220 5650 5.9 (.232) ± 0.75 (.030) 5.00 (.197) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014)

2225 5664 5.9 (.232) ± 0.75 (.030) 6.40 (.248) ± 0.40 (.016) 0.70 (.028) ± 0.35 (.014)

Ceramic Surface Mount

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 1A – (0805 - 1812 Case Sizes)

UD = Under Developement

Cap Cap

Code

Series C0805 C1206 C1210 C1808 C1812

Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H

Voltage VDC 500 630 1000 500 630 1000 1500 2000 500 630 1000 1500 2000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Cap Tolerance Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

10 pF 100 J K M

11 pF 110 J K M

12 pF 120 J K M

13 pF 130 J K M

15 pF 150 J K M

16 pF 160 J K M

18 pF 180 J K M

20 pF 200 J K M

22 pF 220 J K M

24 pF 240 J K M

27 pF 270 J K M

30 pF 300 J K M

33 pF 330 J K M

36 pF 360 J K M

39 pF 390 J K M

43 pF 430 J K M

47 pF 470 J K M

51 pF 510 J K M

56 pF 560 J K M

62 pF 620 J K M DG DG DG

68 pF 680 J K M DG DG DG

75 pF 750 J K M DG DG DG EG EG EG EG EG LB LB LB LB LB LB LB

82 pF 820 J K M DG DG DG EG EG EG EG EG LB LB LB LB LB LB LB

91 pF 910 J K M DG DG DG EG EG EG EG EG LB LB LB LB LB LB LB

100 pF 101 J K M DG DG DG EG EG EG EG EG LB LB LB LB LB LB LB

110 pF 111 J K M DG DG DG EF EF EF EF EG LB LB LB LB LB LB LB

120 pF 121 J K M DG DG DG EF EF EF EF EG LA LA LA LA LB LB LB

130 pF 131 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LB LB

150 pF 151 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LB LB GK GK GK GK GK GK GK

180 pF 181 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LB LB GK GK GK GK GK GK GK

220 pF 221 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LB LB GK GK GK GK GK GK GK

270 pF 271 J K M DG DG DG EF EF EF EF FL FL FL FL FL LA LA LA LA LB LB LC GK GK GK GK GK GK GK

330 pF 331 J K M DG DG DG EF EF EF EF FL FL FL FL FL LA LA LA LA LB LB LC GK GK GK GK GK GK GK

390 pF 391 J K M DG DG DG EF EF EF EF FL FL FL FL FL LA LA LA LA LB LB LC GK GK GK GK GK GK GK

470 pF 471 J K M DG DG DG EF EF EF EF FL FL FL FL FL LA LA LA LA LB LB LC GH GH GH GH GH GK GK

560 pF 561 J K M DG DG DG EF EF EF EF FL FL FL FL FL LA LA LA LA LB LB LC GH GH GH GH GH GK GK

680 pF 681 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LC LC GH GH GH GH GH GK GK

820 pF 821 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LC LC GH GH GH GH GH GK GK

1,000 pF 102 J K M DG DG DG EF EF EF EF EG FL FL FL FL FL LA LA LA LA LB LC LC GH GH GH GH GH GK GK

1,200 pF 122 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LB LB LB LB LC GH GH GH GH GH GK GK

1,500 pF 152 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LA LA LA LB LC GH GH GH GH GH

1,800 pF 182 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LA LA LA LB LC GH GH GH GH GH

2,000 pF 202 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LA LA LA LB LC GH GH GH GH GH

2,200 pF 222 J K M DG DG DG EF EF EF EG EG FL FL FL FL FM LA LA LA LB LC GH GH GH GH GH

2,700 pF 272 J K M DG DG DG EF EF EF EG FL FL FL FL FM LA LA LA LB LC GH GH GH GH GK

3,300 pF 332 J K M DG DG DG EF EF EF EG FL FL FL FL FM LA LA LA LB GH GH GH GH GK

3,900 pF 392 J K M DG UD UD EF EF EF EG FL FL FL FL FK LA LA LA LB GH GH GH GH GK

4,700 pF 472 J K M DG UD UD EF EF EF EG FL FL FL FL FK LA LA LA LB GH GH GH GH

5,600 pF 562 J K M DG UD UD EF EF EF FL FL FL FM LA LB LB LC GH GH GH GK

6,800 pF 682 J K M DG UD UD EG EG EG FL FL FL FM LA LB LB LC GH GH GH GK

8,200 pF 822 J K M DG UD UD EG EG EG FL FL FL FK LA LB LB LC GH GH GH GK

10,000 pF 103 J K M UD UD UD EG EG EG FL FL FL FK LA LB LB LC GH GH GH GK

12,000 pF 123 J K M UD UD UD EG UD UD FL FL FL FK LA LC LC GH GK GK GK

15,000 pF 153 J K M UD UD UD EG UD UD FL FL FL LA LC LC GH GK GK

18,000 pF 183 J K M UD UD UD UD UD UD FL FL FL LA UD UD GH GK GK

22,000 pF 223 J K M UD UD UD UD FL FM FM LA UD UD GH GK GK

27,000 pF 273 J K M UD UD UD UD FM FK FK LA UD UD GH

Cap Cap

Code

Voltage VDC 500 630 1000 500 630 1000 1500 2000 500 630 1000 1500 2000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H

Series C0805 C1206 C1210 C1808 C1812

Roll Over for

Order Info.

C 1210 X 473 K C R A C TU

Ceramic Case Size

(L" x W")

Speci cation/

Series

Capacitance

Code (pF)

Capacitance

Tolerance Voltage Dielectric Failure Rate/

Design End Metallization1Packaging/Grade

(C-Spec)2

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination

2 Sig. Digits +

Number of Zeros

J = ±5%

K = ±10%

M = ±20%

C = 500V

B = 630V

D = 1000V

F = 1500V

G = 2000V

Z = 2500V

H = 3000V

R = X7R A = N/A C = 100% Matte Sn

L = SnPb (5% min)

Blank = Bulk

TU = 7" Reel

Unmarked

TM = 7" Reel Marked

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 1A con't – (0805 - 1812 Case Sizes)

UD = Under Developement.

Cap Cap

Code

Series C0805 C1206 C1210 C1808 C1812

Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H

Voltage VDC 500 630 1000 500 630 1000 1500 2000 500 630 1000 1500 2000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Cap Tolerance Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

33,000 pF 333 J K M UD UD UD UD FM UD UD LC UD UD GH

39,000 pF 393 J K M UD UD UD FK UD UD LC UD UD GH

47,000 pF 473 J K M UD UD UD FK UD UD LC UD UD GH

56,000 pF 563 J K M UD UD UD UD LC UD UD GH

68,000 pF 683 J K M UD UD UD UD UD UD UD GK

82,000 pF 823 J K M UD UD UD UD UD UD UD GK

0.10 uF 104 J K M UD UD UD UD UD UD UD GK

0.12 uF 124 J K M UD UD

0.15 uF 154 J K M UD UD

0.18 uF 184 J K M UD UD

0.22 uF 224 J K M UD UD

0.27 uF 274

0.33 uF 334

Cap Cap

Code

Voltage VDC 500 630 1000 500 630 1000 1500 2000 500 630 1000 1500 2000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Voltage Code C B D C B D F G C B D F G C B D F G Z H C B D F G Z H

Series C0805 C1206 C1210 C1808 C1812

Table 1B – (1825 - 2225 Case Sizes)

Cap Cap

Code

Series C1825 C2220 C2225

Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H

Voltage VDC 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Cap Tolerance Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

100 pF 101 J K M

110 pF 111 J K M

120 pF 121 J K M

130 pF 131 J K M

150 pF 151 J K M

180 pF 181 J K M

220 pF 221 J K M

270 pF 271 J K M

330 pF 331 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP

390 pF 391 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP

470 pF 471 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

560 pF 561 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

680 pF 681 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

820 pF 821 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

1,000 pF 102 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

1,200 pF 122 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

1,500 pF 152 J K M HG HG HG HG HG HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

1,800 pF 182 J K M HE HE HE HE HE HG HG JP JP JP JP JP JP JP KF KF KF KF KF KF KF

2,000 pF 202 J K M HE HE HE HE HE HG HG JE JE JE JE JE JP JP KF KF KF KF KF KF KF

2,200 pF 222 J K M HE HE HE HE HE HG HG JE JE JE JE JE JP JP KF KF KF KF KF KF KF

2,700 pF 272 J K M HE HE HE HE HE HG HG JE JE JE JE JE JP JP KE KE KE KE KE KF KF

3,300 pF 332 J K M HE HE HE HE HE HG HG JE JE JE JE JE JP JP KE KE KE KE KE KF KF

3,900 pF 392 J K M HE HE HE HE HE JE JE JE JE JE JP JP KE KE KE KE KE KF KF

4,700 pF 472 J K M HE HE HE HE HE JE JE JE JE JP KE KE KE KE KE KF KF

5,600 pF 562 J K M HE HE HE HE HE JE JE JE JE JP KE KE KE KE KE KF KF

6,800 pF 682 J K M HE HE HE HE HE JE JE JE JE JP KE KE KE KE KF

Cap Cap

Code

Voltage VDC 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H

Series C1825 C2220 C2225

C 1210 X 473 K C R A C TU

Ceramic Case Size

(L" x W")

Speci cation/

Series

Capacitance

Code (pF)

Capacitance

Tolerance Voltage Dielectric Failure Rate/

Design End Metallization1Packaging/Grade

(C-Spec)2

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination

2 Sig. Digits +

Number of Zeros

J = ±5%

K = ±10%

M = ±20%

C = 500V

B = 630V

D = 1000V

F = 1500V

G = 2000V

Z = 2500V

H = 3000V

R = X7R A = N/A C = 100% Matte Sn

L = SnPb (5% min)

Blank = Bulk

TU = 7" Reel

Unmarked

TM = 7" Reel Marked

Roll Over for

Order Info.

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 1B con't – (1825 - 2225 Case Sizes)

Cap Cap

Code

Series C1825 C2220 C2225

Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H

Voltage VDC 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Cap Tolerance Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

8,200 pF 822 J K M HE HE HE HE HE JE JE JE JE JP KE KE KE KE KF

10,000 pF 103 J K M HE HE HE HE JE JE JE JE KE KE KE KE KF

12,000 pF 123 J K M HE HE HE HG JE JP JP JP KE KE KE KE KF

15,000 pF 153 J K M HE HE HE HG JE JP JP JP KE KE KE KE

18,000 pF 183 J K M HE HE HE HG JE JP JP JP KE KE KE KE

22,000 pF 223 J K M HE HG HG HG JE JP JP JP KE KF KF KF

27,000 pF 273 J K M HE HG HG HG JE JP JP JP KE KF KF KF

33,000 pF 333 J K M HE HG HG JE JP JP JP KE KF KF KF

39,000 pF 393 J K M HE HG HG JE JP JP KE KF KF KF

47,000 pF 473 J K M HE HG HG JE JP JP KE KF KF KF

56,000 pF 563 J K M HE JE KE KF KF

68,000 pF 683 J K M HG JE KE KF KF

82,000 pF 823 J K M HG JE KE KF KF

0.10 uF 104 J K M HG JE KE

0.12 uF 124 J K M HG JE KE

0.15 uF 154 J K M HG JP KF

0.18 uF 184 J K M HG JP KF

0.22 uF 224 J K M HG JP KF

0.27 uF 274 J K M KF

0.33 uF 334 J K M

0.39 uF 394 J K M

0.47 uF 474 J K M

0.56 uF 564 J K M

0.68 uF 684 J K M

0.82 uF 824 J K M

1.0 uF 105 J K M

1.2 uF 125 J K M

1.5 uF 155 J K M

1.8 uF 185 J K M

2.2 uF 225 J K M

2.7 uF 275 J K M

3.3 uF 335 J K M

Cap Cap

Code

Voltage VDC 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Voltage Code C B D F G Z H C B D F G Z H C B D F G Z H

Series C1825 C2220 C2225

C 1210 X 473 K C R A C TU

Ceramic Case Size

(L" x W")

Speci cation/

Series

Capacitance

Code (pF)

Capacitance

Tolerance Voltage Dielectric Failure Rate/

Design End Metallization1Packaging/Grade

(C-Spec)2

0805

1206

1210

1808

1812

1825

2220

2225

X = Flexible

Termination

2 Sig. Digits +

Number of Zeros

J = ±5%

K = ±10%

M = ±20%

C = 500V

B = 630V

D = 1000V

F = 1500V

G = 2000V

Z = 2500V

H = 3000V

R = X7R A = N/A C = 100% Matte Sn

L = SnPb (5% min)

Blank = Bulk

TU = 7" Reel

Unmarked

TM = 7" Reel Marked

Roll Over for

Order Info.

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 2 – Chip Thickness / Packaging Quantities

Thickness

Code

Chip

Size

Thickness ±

Range (mm)

Qty per Reel

7" Plastic

Qty per Reel

13" Plastic

Qty per Reel

7" Paper

Qty per Reel

13" Paper

Qty per Bulk

Cassette

AA 01005 0.20 ± 0.02 15000

AB 0201 0.30 ± 0.03 15000

BB 0402 0.50 ± 0.05 10000 50000 50000

CB 0603 0.80 ± 0.07 4000 10000 15000

CC 0603 0.80 ± 0.10 4000 10000

CD 0603 0.80 ± 0.15 4000 10000

DC 0805 0.78 ± 0.10 4000 10000

DD 0805 0.90 ± 0.10 4000 10000

DL 0805 0.95 ± 0.10 4000 10000

DE 0805 1.00 ± 0.10 2500 10000

DF 0805 1.10 ± 0.10 2500 10000

DG 0805 1.25 ± 0.15 2500 10000

DH 0805 1.25 ± 0.20 2500 10000

EB 1206 0.78 ± 0.10 4000 10000 4000 10000

EK 1206 0.80 ± 0.10 2000 8000

EC 1206 0.90 ± 0.10 4000 10000

EN 1206 0.95 ± 0.10 4000 10000

ED 1206 1.00 ± 0.10 2500 10000

EE 1206 1.10 ± 0.10 2500 10000

EF 1206 1.20 ± 0.15 2500 10000

EM 1206 1.25 ± 0.15 2500 10000

EG 1206 1.60 ± 0.15 2000 8000

EH 1206 1.60 ± 0.20 2000 8000

EJ 1206 1.70 ± 0.20 2000 8000

FB 1210 0.78 ± 0.10 4000 10000

FC 1210 0.90 ± 0.10 4000 10000

FD 1210 0.95 ± 0.10 4000 10000

FE 1210 1.00 ± 0.10 2500 10000

FF 1210 1.10 ± 0.10 2500 10000

FG 1210 1.25 ± 0.15 2500 10000

FL 1210 1.40 ± 0.15 2000 8000

FO 1210 1.50 ± 0.20 2000 8000

FH 1210 1.55 ± 0.15 2000 8000

FP 1210 1.60 ± 0.20 2000 8000

FM 1210 1.70 ± 0.20 2000 8000

FJ 1210 1.85 ± 0.20 2000 8000

FN 1210 1.85 ± 0.20 2000 8000

FT 1210 1.90 ± 0.20 1500 4000

FK 1210 2.10 ± 0.20 2000 8000

FR 1210 2.25 ± 0.20 2000 8000

FS 1210 2.50 ± 0.20 1000 4000

PA 1220 0.80 ± 0.10 4000 10000

MA 1632 0.80 ± 0.10 4000 10000

NA 1706 0.90 ± 0.10 4000 10000

LD 1808 0.90 ± 0.10 2500 10000

LA 1808 1.40 ± 0.15 1000 4000

LB 1808 1.60 ± 0.15 1000 4000

LC 1808 2.00 ± 0.15 1000 4000

GB 1812 1.00 ± 0.10 1000 4000

GC 1812 1.10 ± 0.10 1000 4000

GD 1812 1.25 ± 0.15 1000 4000

GE 1812 1.30 ± 0.10 1000 4000

GH 1812 1.40 ± 0.15 1000 4000

GF 1812 1.50 ± 0.10 1000 4000

GG 1812 1.55 ± 0.10 1000 4000

GK 1812 1.60 ± 0.20 1000 4000

GJ 1812 1.70 ± 0.15 1000 4000

GN 1812 1.70 ± 0.20 1000 4000

GL 1812 1.90 ± 0.20 1000 4000

GM 1812 2.00 ± 0.20 1000 4000

GO 1812 2.50 ± 0.20 500 2000

HB 1825 1.10 ± 0.15 1000 4000

HC 1825 1.15 ± 0.15 1000 4000

HD 1825 1.30 ± 0.15 1000 4000

HE 1825 1.40 ± 0.15 1000 4000

HF 1825 1.50 ± 0.15 1000 4000

HG 1825 1.60 ± 0.20 1000 4000

JB 2220 1.00 ± 0.15 1000 4000

JC 2220 1.10 ± 0.15 1000 4000

JD 2220 1.30 ± 0.15 1000 4000

JE 2220 1.40 ± 0.15 1000 4000

JF 2220 1.50 ± 0.15 1000 4000

JP 2220 1.60 ± 0.20 1000 4000

JG 2220 1.70 ± 0.15 1000 4000

JH 2220 1.80 ± 0.15 1000 4000

JO 2220 2.40 ± 0.15 500 2000

KB 2225 1.00 ± 0.15 1000 4000

KC 2225 1.10 ± 0.15 1000 4000

KD 2225 1.30 ± 0.15 1000 4000

KE 2225 1.40 ± 0.15 1000 4000

KF 2225 1.60 ± 0.20 1000 4000

Package Quantity

Based on Finished Chip

Thickness Specications

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reow only

Recommended Soldering Prole

• KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351

EIA

Size

Code

Metric

Size

Code

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

C Y X V1 V2 C Y X V1 V2 C Y X V1 V2

0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20

0805 2012 1.05 1.45 1.55 4.60 2.60 0.95 1.25 1.45 3.70 2.00 0.85 1.05 1.35 3.00 1.70

1206 3216 1.60 1.65 1.90 5.90 2.90 1.50 1.45 1.80 5.00 2.30 1.40 1.25 1.70 4.30 2.00

1210 3225 1.60 1.65 2.80 5.90 3.80 1.50 1.45 2.70 5.00 3.20 1.40 1.25 2.60 4.30 2.90

1808 4520 2.25 1.85 2.30 7.40 3.30 2.15 1.65 2.20 6.50 2.70 2.05 1.45 2.10 5.80 2.40

1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70

1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00

2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60

2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7.20 7.00

Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication

testing based on the conditions outlined in IPC standard 7351 (IPC-7351).

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress Reference Test or Inspection Method

Ripple Current

"Heat Generation

∆T : 20ºC max."

"Reow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve.

(Ripple voltage must be < rated voltage)"

Terminal Strength JIS-C-6429 Appendix 1, Note: Force of 1.8kg for 60 seconds.

Board Flex JIS-C-6429 Appendix 2, Note: 2mm (min) for all except 3mm for C0G.

Solderability J-STD-002

Magnication 50X. Conditions:

a) Method B, 4 hrs @ 155°C, dry heat @ 235°C

b) Method B @ 215°C category 3

c) Method D, category 3 @ 260°C

Temperature Cycling JESD22 Method JA-104 1000 Cycles (-55°C to +125°C), Measurement at 24 hrs. +/- 2 hrs after test conclusion.

Biased Humidity MIL-STD-202 Method 103

Load Humidity: 1000 hours 85°C/85%RH and 300VDC Max. Add 100K ohm resistor. Measurement

at 24 hrs. +/- 2 hrs after test conclusion.

Low Volt Humidity: 1000 hours 85C°/85%RH and 1.5V. Add 100K ohm resistor. Measurement at

24 hrs. +/- 2 hrs after test conclusion.

Moisture Resistance MIL-STD-202 Method 106

t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hrs. +/- 2 hrs after

test conclusion.

Thermal Shock MIL-STD-202 Method 107

-55°C/+125°C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell

time-15 minutes. Air-Air.

High Temperature Life MIL-STD-202 Method 108 1000 hours at 125°C (85°C for X5R, Z5U and Y5V) with rated voltage applied.

Storage Life MIL-STD-202 Method 108 150°C, 0VDC, for 1000 Hours.

Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F.

Resistance to Solvents MIL-STD-202 Method 215 Add Aqueous wash chemical - OKEM Clean or equivalent.

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Tape & Reel Packaging Information

KEMET offers Multilayer Ceramic Chip Capacitors packaged in

8mm, 12mm and 16mm tape on 7" and 13" reels in accordance

with EIA standard 481. This packaging system is compatible with

all tape fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

Table 5 – Carrier Tape Conguration (mm)

*Refer to Figure 1 for W and P1 carrier tape reference locations.

*Refer to Table 6 for tolerance specications.

8mm, 12mm

or 16mm Carrier Tape

178mm (7.00")

330mm (13.00")

Anti-Static Reel

Embossed Plastic* or

Punched Paper Carrier.

Embossment or Punched Cavity

Anti-Static Cover Tape

(.10mm (.004") Max Thickness)

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 & 2225 Military)

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

KEMET

Bar Code Label

Sprocket Holes

EIA Case Size Tape size (W)* Pitch (P1)*

01005 - 0402 8 2

0603 - 1210 8 4

1805 - 1808 12 4

≥ 1812 12 8

KPS 1210 12 8

KPS 1812 & 2220 16 12

Array 0508 & 0612 8 4

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 5).

3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).

4. B1 dimension is a reference dimension for tape feeder clearance only.

5. The cavity dened by A0, B0 and K0 shall surround the component with sufcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12mm tapes and 10° maximum for 16mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4).

(e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket.

(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

Constant Dimensions — Millimeters (Inches)

Tape Size D0

Min.

Note 1

E1P0 P2

R Ref.

Note 2

Min.

Note 3

T Max. T1 Max.

8mm

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.0

(0.039)

1.75 ± 0.10

(0.069 ± 0.004)

4.0 ± 0.10

(0.157 ± 0.004)

2.0 ± 0.05

(0.079 ± 0.002)

25.0

(0.984)

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12mm 1.5

(0.059)

(1.181)

16mm

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch

Max.

Note 4

E2 Min. F P1 T2 Max W Max A0,B0 & K0

8mm Single (4mm)

4.35

(0.171)

6.25

(0.246)

3.5 ± 0.05

(0.138 ± 0.002)

4.0 ± 0.10

(0.157 ± 0.004)

2.5

(0.098)

8.3

(0.327)

Note 512mm

Single (4mm) &

Double (8mm)

8.2

(0.323)

10.25

(0.404)

5.5 ± 0.05

(0.217 ± 0.002)

8.0 ± 0.10

(0.315 ± 0.004)

4.6

(0.181)

12.3

(0.484)

16mm Triple (12mm)

12.1

(0.476)

14.25

(0.561)

5.5 ± 0.05

(0.217 ± 0.002)

8.0 ± 0.10

(0.315 ± 0.004)

4.6

(0.181)

16.3

(0.642)

Center Lines of Cavity

User Direction of Unreeling

Cover Tape

is for tape feeder reference only,

including draft concentric about B

ØD

ØDo

Embossment

For cavity size,

see Note 1 Table 6

[10 pitches cumulative

tolerance on tape ±0.2 mm]

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

1. The cavity dened by A0, B0 and T shall surround the component with sufcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 5).

Constant Dimensions — Millimeters (Inches)

Tape Size D0E1P0P2T1Max G Min

R Ref.

Note 2

8mm 1.5 +0.10-0.0

(0.059 +0.004, -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.10

(.004) Max.

0.75

(.030)

(.984)

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch E2 Min F P1 T Max W Max A0 B0

8mm Half (2mm) 6.25

(0.246)

3.5 ± 0.05

(0.138 ± 0.002)

2.0 ± 0.05

(0.079 ± 0.002)

1.1

(0.098)

8.3

(0.327)

Note 5

8mm Single (4mm)

4.0 ± 0.10

(0.157 ± 0.004)

8.3

(0.327)

User Direction of Unreeling

Top Cover Tape

Center Lines of Cavity

ØDo Po

Cavity Size,

See

Note 1, Table 7

Bottom Cover Tape

[10 pitches cumulative

tolerance on tape ±0.2 mm]

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg Minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180° from the plane of the

carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.

Figure 3 – Maximum Component Rotation

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

0.5 mm maximum

8mm & 12mm Tape

1.0 mm maximum

16mm Tape

Bending

Radius

Embossed

Carrier

Punched

Carrier

Tape Width Peel Strength

8mm 0.1 Newton to 1.0 Newton (10g to 100g)

12mm & 16mm 0.1 Newton to 1.3 Newton (10g to 130g)

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Tape Maximum

Width (mm) Rotation ( °

8,12 20

16-200 10 Tape Maximum

Width (mm) Rotation ( °

8,12 20

16-56 10

72-200 5

Typical Pocket Centerline

Typical Component Centerline

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 6 – Reel Dimensions

Table 8 – Reel Dimensions

Metric Dimensions Will Govern

AD(See Note)

Full Radius,

See Note

B(see Note)

Access Hole at

Slot Location

(Ø 40 mm min.)

If present,

tape slot in core

for tape start:

2.5 mm min. width x

10.0 mm min. depth

W3(Includes

flange distortion

at outer edge)

W2(Measured at hub)

W1(Measured at hub)

(Arbor hole

diameter)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Constant Dimensions — Millimeters (Inches)

Tape Size A B Min C D Min

8mm

178 ± 0.20

(7.008 ± 0.008)

330 ± 0.20

(13.000 ± 0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12mm

16mm

Variable Dimensions — Millimeters (Inches)

Tape Size N Min W1 W2 Max W3

8mm

(1.969)

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

Shall accommodate tape width

without interference

12mm

12.4 +2.0/-0.0

(0.488 +0.078/-0.0)

18.4

(0.724)

16mm

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Figure 8 – Maximum Camber

Trailer

160 mm minimum,

Carrier Tape

END START

Round Sprocket Holes

Elongated Sprocket Holes

(32 mm tape and wider)

Top Cover Tape

Punched Carrier

8 mm & 12 mm only

Embossed Carrier

Components

100 mm Min.

Leader

400 mm Minimum,

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

Elongated sprocket holes

(32 mm & wider tapes)

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 9 – Bulk Cassette Packaging (Ceramic Chips Only)

Meets Dimensional Requirements IEC-286 and EIAJ 7201

Unit mm *Reference

Table 9 – Capacitor Dimensions for Bulk Cassette

Cassette Packaging – Millimeters

Table 10 – Capacitor Marking

Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to

identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any

Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional – Not Available for 0402 Size)

Example shown is 1,000 pF capacitor

EIA Size

Code

Metric Size

Code

L Length W Width B Bandwidth

S Separation

minimum

T Thickness

Number of

Pcs/Cassette

0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.2 to 0.4 0.3 0.5 ± .05 50,000

0603 1608 1.6 ± 0.07 0.8 ± 0.07 0.2 to 0.5 0.7 0.8 ± .07 15,000

110 ± 0.7

31.5 ± 0

0.2

36 ± 0

0.2

19.0*

5 0*

10*

53 3*

6 8 ± 0.1

8 8 ± 0.1

12.0 ± 0.1

3.0 ± 0

0.2

2.0 ± 0.1

1.5 ± 0

0.1

Numeral

Alpha

Character

Capacitance (pF) For Various Numeral Identiers

0.1

100

1000

10000

100000

1000000

10000000

0.11

1.1

110

1100

11000

110000

1100000

11000000

0.12

1.2

120

1200

12000

120000

1200000

12000000

0.13

1.3

130

1300

13000

130000

1300000

13000000

0.15

1.5

150

1500

15000

150000

1500000

15000000

0.16

1.6

160

1600

16000

160000

1600000

16000000

0.18

1.8

180

1800

18000

180000

1800000

18000000

0.2

200

2000

20000

200000

2000000

20000000

0.22

2.2

220

2200

22000

220000

2200000

22000000

0.24

2.4

240

2400

24000

240000

2400000

24000000

0.27

2.7

270

2700

27000

270000

2700000

27000000

0.3

300

3000

30000

300000

3000000

30000000

0.33

3.3

330

3300

33000

330000

3300000

33000000

0.36

3.6

360

3600

36000

360000

3600000

36000000

0.39

3.9

390

3900

39000

390000

3900000

39000000

0.43

4.3

430

4300

43000

430000

4300000

43000000

0.47

4.7

470

4700

47000

470000

4700000

47000000

0.51

5.1

510

5100

51000

510000

5100000

51000000

0.56

5.6

560

5600

56000

560000

5600000

56000000

0.62

6.2

620

6200

62000

620000

6200000

62000000

0.68

6.8

680

6800

68000

680000

6800000

68000000

0.75

7.5

750

7500

75000

750000

7500000

75000000

0.82

8.2

820

8200

82000

820000

8200000

82000000

0.91

9.1

910

9100

91000

910000

9100000

91000000

0.25

2.5

250

2500

25000

250000

2500000

25000000

0.35

3.5

350

3500

35000

350000

3500000

35000000

0.4

400

4000

40000

400000

4000000

40000000

0.45

4.5

450

4500

45000

450000

4500000

45000000

0.5

500

5000

50000

500000

5000000

50000000

0.6

600

6000

60000

600000

6000000

60000000

0.7

700

7000

70000

700000

7000000

70000000

0.8

800

8000

80000

800000

8000000

80000000

0.9

900

9000

90000

900000

9000000

90000000

SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

Other KEMET Resources

Disclaimer

All product speci cations, statements, information and data (collectively, the “Information”) are subject to change without notice.

All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute – and we

speci cally disclaim – any warranty concerning suitability for a speci c customer application or use. This Information is intended for use only by customers who have the requisite

experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the

use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.

Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur.

Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or

redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not

be required.

Tools

Resource Location

Con gure A Part: CapEdge http://capacitoredge.kemet.com

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Search Our FAQs: KnowledgeEdge http://www.kemet.com/keask

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Resource Location

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Techniques) http://www.kemet.com/technicalpapers

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Quality Documents http://www.kemet.com/qualitydocuments

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Resource Location

Sample Request http://www.kemet.com/sample

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Contact

Resource Location

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Investor Relations http://www.kemet.com/ir

Call Us 1-877-MyKEMET

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SMD MLCCs – High Voltage with Flexible Termination System (HV FT-CAP), X7R Dielectric, 500VDC-3000VDC (Commercial Grade)

KEMET Corporation

World Headquarters

P.O. Box 5928

Greenville, SC 29606

2835 KEMET Way

Simpsonville, SC 29681

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

North America

Corporate Of ces

101 NE Third Avenue

Tower 101, Suite 1700

Fort Lauderdale, FL 33301

Tel: 954-766-2800

Fax: 954-766-2805

Southeast

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Lake Mary, FL 32746

Tel: 407-855-8886

Northeast

340-X Fordham Road

Wilmington, MA 01887

Tel: 978-658-1663

Fax: 978-658-1790

Central

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Schaumburg, IL 60195

Tel: 847-882-3590

Fax: 847-882-3046

West

1551 McCarthy Boulevard, Suite 117

Milpitas, CA 95035

Tel: 408-433-9946

Fax: 408-433-9946

Mexico

Tezozomoc No. 47

Col. Ciudad del Sol

Zapopan, Jalisco C.P. 45050

Mexico

Tel: 52-33-3123-2141

Fax: 52-33-3123-2144

Europe

Southern Europe

15bis chemin des Mines, 4th  oor

1202 Geneva

Switzerland

Tel: 41-22-715-0100

Fax: 41-22-715-0170

Zac Paris Rive Gauche

118-122 avenue de France

75013 Paris

France

Tel: 33-1-4646-1009

Fax: 33-1-4646-1599

Via San Lorenzo 19

Sasso Marconi, BO

40037

Italy

Tel: 39-051-939111

Fax: 39-051-840684

Viale Milano ori 1

Palazzo E1

20090 Assago

Milano

Italy

Tel: 39-02-57518176

Fax: 39-02-57512093

Central Europe

Hermann-Koehl-Str. 2

Landsberg am Lech

86899 Germany

Tel: 49-8191-3350800

Fax: 49-8191-3350990

Ruhrallee 9

Dortmund

44139 Germany

Tel: 49-2307-3619672

Fax: 49-2307-961527

Northern Europe

Unit 1, Ducketts Wharf

South Street

Bishops Stortford

Hertfordshire CM23 3AL

United Kingdom

Tel: 44-1279-757201

Fax: 44-1279-465237

20-21 Cumberland Drive

Granby Industrial Estate

Weymouth, Dorset DT4 9TE

United Kingdom

Tel: 44-1305-830747

Fax: 44-1305-760670

Thörnblads Väg 6

Färjestaden 386 90

Sweden

Tel: 46-485-563934

Fax: 46-485-563938

Stella Business Park

Lars Sonckin kaari 16

Espoo 02600

Finland

Tel: 358-9-5406-5000

Fax: 358-9-5406-5010

Asia

Northeast Asia

30 Canton Road, Room 1512

Silvercord Tower II

Tsimshatshui, Kowloon

Hong Kong

Tel: 852-2305-1168

Fax: 852-2759-0345

Room 1411, 14/F New China

Insurance Edi ce

Mintian Road, CBD Futian District

Shenzhen 518001

China

Tel: 1-867-55-25181306

Fax: 1-867-55-25181307

Floor 17, Tower B, Ping An IFC

No.1-3 Xin Yuan South Road

Chao Yang District

Beijing 100027

China

Tel: 86-10-5829-1711

Fax: 86-10-5829-1963

Room 2602, Grand Gateway Tower 1

No.1 Hong Qiao Road

Shanghai 200030

China

Tel: 86-21-6447-0707

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Sec. 4, Chung Hsiao East Road

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Taiwan ROC

Tel: 886-2-27528585

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Southeast Asia

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229832 Singapore

Tel: 65-6586-1900

Fax: 65-6586-1901

1-5-20 Krystal Point 2

Lebuh Bukit Kecil 6

11900 Bayan Baru

Penang

Malaysia

Tel: 6- 04-6430200

Fax: 6 -04-6444220

Of ce No. 605, 6th Floor

Barton Centre M.G. Road

Bangalore 560 001

India

Tel: 91-80-653-76817

Fax: 91-80-2532-0160

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.