*R & oHS AE C C OM AP P PR LI OV AN ED T Features High power ratings Surface mount packaging for automated assembly Compliant with AEC-Q200 Rev-C- Stress Test Qualification for Passive Components in Automotive Applications Low profile Compatible with Pb and Pb-free solder reflow profiles RoHS compliant* and halogen free** Agency recognition: Standard 7555 mm (2920 mils) footprint MF-LSMF Series - PTC Resettable Fuses Electrical Characteristics Ihold Itrip Resistance V max. Volts I max. Amps MF-LSMF185/33X 33.0 40 1.85 3.70 Ohms at 23 C RMin. R1Max. 0.045 0.150 MF-LSMF260X 24.0 20 2.60 5.20 0.020 0.075 MF-LSMF300X 6.0 40 3.00 5.00 0.015 MF-LSMF300/24X 24.0 20 3.00 5.20 0.020 Model*** (R) Amperes at 23 C Hold Trip Max. Time To Trip Tripped Power Dissipation Watts at 23 C Typ. Amperes at 23 C Seconds at 23 C 8.0 2.50 1.5 8.0 5.00 1.5 0.048 8.0 20.00 1.5 0.075 8.0 5.00 1.5 TM *** Features Multifuse Free Xpansion Design for MF-LSMF Series. Environmental Characteristics Operating Temperature......................................... -40 C to +85 C Maximum Device Surface Temperature in Tripped State .................................................... 125 C Passive Aging ....................................................... +85 C, 1000 hours............................................... 5 % typical resistance change Humidity Aging ..................................................... +85 C, 85 % R.H. 1000 hours ............................. 5 % typical resistance change Thermal Shock ..................................................... +85 C to -40 C, 20 times ................................... 10 % typical resistance change Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change Vibration ............................................................... MIL-STD-883C, Method 2007.1, .......................... No change Condition A Test Procedures And Requirements For Model MF-LSMF Series Test Test Conditions Accept/Reject Criteria Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description Resistance ............................................................ In still air @ 23 C .................................................. Rmin R R1max Time to Trip........................................................... At specified current, Vmax, 23 C ........................ T max. time to trip (seconds) Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage UL File Number .................................................... E174545 http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545 *RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. **Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of "halogen-free" is: Bromine (Br) content: 900 ppm; Chlorine (Cl) content: 900 ppm; Total Br + Cl content: 1500 ppm. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Applications Automotive electronics Industrial controls IEEE ports Portable electronics MF-LSMF Series - PTC Resettable Fuses Product Dimensions A Model Min. 6.73 (0.265) 6.73 (0.265) 6.73 (0.265) 6.73 (0.265) MF-LSMF185/33X MF-LSMF260X MF-LSMF300X MF-LSMF300/24X B Max. 7.98 (0.312) 7.98 (0.312) 7.98 (0.312) 7.98 (0.312) Min. 4.80 (0.189) 4.80 (0.189) 4.80 (0.189) 4.80 (0.189) C Max. 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) 5.44 (0.214) Min. 0.75 (0.030) 0.75 (0.030) 0.35 (0.014) 0.75 (0.030) Max. 1.60 (0.063) 1.60 (0.063) 0.85 (0.033) 1.60 (0.063) Packaging: 3000 pcs. per reel. Top View D Min. 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) 0.30 (0.012) E Min. 0.25 (.010) 0.25 (.010) 0.25 (.010) 0.25 (.010) Max. 2.00 (.079) 2.00 (.079) 2.00 (.079) 2.00 (.079) DIMENSIONS: Bottom View Side View A Recommended Pad Layout Terminal material: Electroless Ni under immersion Au C 9 5.3 0.10 (.209 .004) B X D 2.0 0.05 (.079 .002) E MM (INCHES) 4.6 0.10 (.181 .004) Termination pad solderability: Standard Au finish: Meets ANSI/J-STD-002 Category 2. Recommended Storage: 40 C max./70 % RH max. Typical Time to Trip at 23 C 100 The Time to Trip curves represent typical performance of a device in a simulated application environment. Actual performance in specific customer applications may differ from these values due to the influence of other variables. MF-LSMF260X Time to Trip (seconds) 10 MF-LSMF185/33X 1 MF-LSMF300/24X MF-LSMF300X 0.1 0.01 1 10 100 Fault Current (Amps) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 3312 - 2 mm SMD Trimming Potentiometer MF-LSMF Series - PTC Resettable Fuses Thermal Derating Chart - Ihold (Amps) Ambient Operating Temperature 23 C 40 C 50 C Model -40 C -20 C 0 C 60 C 70 C 85 C MF-LSMF185/33X 2.80 2.47 2.17 1.85 1.54 1.39 1.22 1.07 0.85 MF-LSMF260X 3.75 3.35 3.00 2.60 2.35 2.15 2.05 1.80 1.30 MF-LSMF300X 4.53 4.02 3.51 3.00 2.52 2.26 1.99 1.75 1.34 MF-LSMF300/24X 4.00 3.55 3.20 3.00 2.50 2.25 2.15 1.85 1.50 Solder Reflow Recommendations 300 Preheating How to Order Soldering (R) Multifuse Product Designator Series LSMF = 7555 mm (2920 mils) Surface Mount Component Hold Current, Ihold 185-300 (1.85 Amps - 3.00 Amps) Higher Voltage Option /24 = 24 Volt Rated /33 = 33 Volt Rated X = Multifuse(R) freeXpansionTM Design MF-LSMF Series Packaging Packaged per EIA 481-1 -2 = Tape and Reel 250 Temperature (C) MF - LSMF 185/33X - 2 Cooling 200 150 100 50 0 160-220 10-20 120 Time (seconds) Notes: * MF-LSMF models cannot be wave soldered. Please contact Bourns for hand soldering recommendations. * If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. * Compatible with Pb and Pb-free solder reflow profiles. Typical Part Marking Represents total content. Layout may vary. PART IDENTIFICATION EXAMPLES: MF-LSMF185/33X = 9 MF-LSMF260X = E MF-LSMF300X = F MF-LSMF300/24X = J E X MF-LSMF SERIES, REV. A, 12/10 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. BI-WEEKLY DATE CODE: WEEKS 47-48 = X MF-LSMF Series Tape and Reel Specifications NOTE: Effective December 1, 2010 (product date code "X"), the cover tape will be changed to the new 3MTM Universal Cover Tape (UCT). Tape Dimensions W P0 P1 P2 A0 B0 B1 max. D0 F E1 E2 min. T max. T1 max. K0 Leader min. Trailer min. MF-LSMF300X per EIA 481-2 16.0 0.30 (0.630 0.012) 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 2.0 0.05 (0.079 0.002) 5.74 0.10 (0.226 0.004) 8.02 0.10 (0.316 0.004) 12.1 (0.476) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 7.5 0.05 (0.295 0.002) 1.75 0.10 (0.069 0.004) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 0.91 0.10 (0.036 0.004) 390 (15.35) 160 (6.30) MF-LSMF185/33X, MF-LSMF260X, MF-LSMF300/24X per EIA 481-2 16.0 0.30 (0.630 0.012) 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 2.0 0.05 (0.079 0.002) 5.70 0.10 (0.224 0.004) 8.10 0.10 (0.319 0.004) 12.1 (0.476) 1.5 + 0.10/-0.0 (0.059 + 0.004/-0) 7.5 0.05 (0.295 0.002) 1.75 0.10 (0.069 0.004) 14.25 (0.561) 0.6 (0.024) 0.1 (0.004) 1.70 0.10 (0.067 0.004) 390 (15.35) 160 (6.30) 331 (13.03) 50 (1.97) 16.4 + 2.0/-0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) 331 (13.03) 50 (1.97) 16.4 + 2.0/-0.0 (0.646 + 0.079/-0.0) 22.4 (0.882) Reel Dimensions A max. N min. W1 W2 max. DIMENSIONS: MM (INCHES) P0 T D0 P2 E1 W2(MEASURED AT HUB) COVER TAPE F E2 W B1 A N(HUB DIA.) B0 K0 T1 P1 A0 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. W1(MEASURED AT HUB)