Features
■ High power ratings
■ Compliant with AEC-Q200 Rev-C- Stress
Test Qualifi cation for Passive Components
in Automotive Applications
■ Low profi le
■ Compatible with Pb and Pb-free solder
refl ow profi les
■ RoHS compliant* and halogen free**
■ Surface mount packaging for automated
assembly
■ Agency recognition:
■ Standard 7555 mm (2920 mils) footprint
MF-LSMF Series - PTC Resettable Fuses
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
**Bourns is using the defi nition that appears to be the prevalent defi nition used as the industry standard at this time. The Bourns defi nition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
Environmental Characteristics
Operating Temperature ......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change
Humidity Aging ..................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times ................................... ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1, .......................... No change
Condition A
Electrical Characteristics
Model*** V max.
Volts
I max.
Amps
Ihold Itrip Resistance Max. Time
To Tr i p
Tripped
Power
Dissipation
Amperes
at 23 °C
Ohms
at 23 °C
Amperes
at 23 °C
Seconds
at 23 °C
Watts
at 23 °C
Hold Trip RMin. R1Max. Typ.
MF-LSMF185/33X 33.0 40 1.85 3.70 0.045 0.150 8.0 2.50 1.5
MF-LSMF260X 24.0 20 2.60 5.20 0.020 0.075 8.0 5.00 1.5
MF-LSMF300X 6.0 40 3.00 5.00 0.015 0.048 8.0 20.00 1.5
MF-LSMF300/24X 24.0 20 3.00 5.20 0.020 0.075 8.0 5.00 1.5
*RoHS COMPLIANT
& AEC APPROVED
*** Features Multifuse® Free Xpansion Design™ for MF-LSMF Series.
Test Procedures And Requirements For Model MF-LSMF Series
Test Test Conditions Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C .................................................. Rmin ≤ R ≤ R1max
Time to Trip ........................................................... At specifi ed current, Vmax, 23 °C ........................ T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certifi cations, then UL File No., enter E174545
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
MF-LSMF Series - PTC Resettable Fuses
Product Dimensions
DIMENSIONS: MM
(INCHES)
Applications
■ Automotive electronics
■ Industrial controls
■ IEEE ports
■ Portable electronics
Model ABCDE
Min. Max. Min. Max. Min. Max. Min. Min. Max.
MF-LSMF185/33X 6.73
(0.265)
7.98
(0.312)
4.80
(0.189)
5.44
(0.214)
0.75
(0.030)
1.60
(0.063)
0.30
(0.012)
0.25
(.010)
2.00
(.079)
MF-LSMF260X 6.73
(0.265)
7.98
(0.312)
4.80
(0.189)
5.44
(0.214)
0.75
(0.030)
1.60
(0.063)
0.30
(0.012)
0.25
(.010)
2.00
(.079)
MF-LSMF300X 6.73
(0.265)
7.98
(0.312)
4.80
(0.189)
5.44
(0.214)
0.35
(0.014)
0.85
(0.033)
0.30
(0.012)
0.25
(.010)
2.00
(.079)
MF-LSMF300/24X 6.73
(0.265)
7.98
(0.312)
4.80
(0.189)
5.44
(0.214)
0.75
(0.030)
1.60
(0.063)
0.30
(0.012)
0.25
(.010)
2.00
(.079)
Packaging: 3000 pcs. per reel.
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au fi nish:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
Typical Time to Trip at 23 ˚C
The Time to Trip curves represent typical performance
of a device in a simulated application environment.
Actual performance in specifi c customer applications
may differ from these values due to the infl uence of
other variables.
Top View Bottom View Side View Recommended Pad Layout
9
X
A
B
D E
C
5.3 ± 0.10
(.209 ± .004)
4.6 ± 0.10
(.181 ± .004)
2.0 ± 0.05
(.079 ± .002)
001011
Fault Current (Amps)
0.1
0.01
1
10
100
Time to Trip (seconds)
MF-LSMF260X
MF-LSMF300/24X
MF-LSMF300X
MF-LSMF185/33X
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
3312 - 2 mm SMD Trimming Potentiometer
MF-LSMF Series - PTC Resettable Fuses
Thermal Derating Chart - Ihold (Amps)
Model
Ambient Operating Temperature
-40 ˚C -20 ˚C 0 ˚C 23 ˚C 40 ˚C 50 ˚C 60 ˚C 70 ˚C 85 ˚C
MF-LSMF185/33X 2.80 2.47 2.17 1.85 1.54 1.39 1.22 1.07 0.85
MF-LSMF260X 3.75 3.35 3.00 2.60 2.35 2.15 2.05 1.80 1.30
MF-LSMF300X 4.53 4.02 3.51 3.00 2.52 2.26 1.99 1.75 1.34
MF-LSMF300/24X 4.00 3.55 3.20 3.00 2.50 2.25 2.15 1.85 1.50
160–220
300
250
200
150
100
50
0
10–20
Temperature (°C)
120
Preheating Soldering Cooling
Time (seconds)
Solder Refl ow Recommendations
Notes:
• MF-LSMF models cannot be wave soldered. Please contact Bourns for hand soldering
recommendations.
• If refl ow temperatures exceed the recommended profi le, devices may not meet the performance
requirements.
• Compatible with Pb and Pb-free solder refl ow profi les.
How to Order
MF - LSMF 185/33X - 2
Multifuse® Product
Designator
Series
LSMF = 7555 mm (2920 mils)
Surface Mount Component
Hold Current, Ihold
185-300 (1.85 Amps - 3.00 Amps)
Higher Voltage Option
/24 = 24 Volt Rated
/33 = 33 Volt Rated
X = Multifuse® freeXpansion™ Design
MF-LSMF Series
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Typical Part Marking
Represents total content. Layout may vary.
MF-LSMF SERIES, REV. A, 12/10
PART IDENTIFICATION EXAMPLES:
MF-LSMF185/33X = 9
MF-LSMF260X = E
MF-LSMF300X = F
MF-LSMF300/24X = J
BI-WEEKLY DATE CODE:
WEEKS 47-48 = X
E
X
MF-LSMF185/33X, MF-LSMF260X,
MF-LSMF300X MF-LSMF300/24X
Tape Dimensions per EIA 481-2 per EIA 481-2
W 16.0 ± 0.30 16.0 ± 0.30
(0.630 ± 0.012) (0.630 ± 0.012)
P0 4.0 ± 0.10 4.0 ± 0.10
(0.157 ± 0.004) (0.157 ± 0.004)
P1 8.0 ± 0.10 8.0 ± 0.10
(0.315 ± 0.004) (0.315 ± 0.004)
P2 2.0 ± 0.05 2.0 ± 0.05
(0.079 ± 0.002) (0.079 ± 0.002)
A0 5.74 ± 0.10 5.70 ± 0.10
(0.226 ± 0.004) (0.224 ± 0.004)
B0 8.02 ± 0.10 8.10 ± 0.10
(0.316 ± 0.004) (0.319 ± 0.004)
B1 max. 12.1 12.1
(0.476) (0.476)
D0 1.5 + 0.10/-0.0 1.5 + 0.10/-0.0
(0.059 + 0.004/-0) (0.059 + 0.004/-0)
F 7.5 ± 0.05 7.5 ± 0.05
(0.295 ± 0.002) (0.295 ± 0.002)
E1 1.75 ± 0.10 1.75 ± 0.10
(0.069 ± 0.004) (0.069 ± 0.004)
E2 min. 14.25 14.25
(0.561) (0.561)
T max. 0.6 0.6
(0.024) (0.024)
T1 max. 0.1 0.1
(0.004) (0.004)
K0 0.91 ± 0.10 1.70 ± 0.10
(0.036 ± 0.004) (0.067 ± 0.004)
Leader min. 390 390
(15.35) (15.35)
Trailer min. 160 160
(6.30) (6.30)
Reel Dimensions
A max. 331 331
(13.03) (13.03)
N min. 50 50
(1.97) (1.97)
W1 16.4 + 2.0/-0.0 16.4 + 2.0/-0.0
(0.646 + 0.079/-0.0) (0.646 + 0.079/-0.0)
W2 max. 22.4 22.4
(0.882) (0.882)
MF-LSMF Series Tape and Reel Specifi cations
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
B1
N(HUB DIA.)
(MEASURED
AT HUB)
A
T
COVER
TAPE
K0
T1A0
W2
(MEASURED
AT HUB)
W
1
P1
B0
F
D0P2
P
0
E2
E1
W
DIMENSIONS: MM
(INCHES)
NOTE: Effective December 1, 2010 (product date code “X”), the cover tape will be changed to the new 3M™ Universal Cover Tape (UCT).
