SHANGHAI SUNRISE ELECTRONICS CO., LTD.
FEATURES
• Glass passivated junction chip
• Ideal for printed circuit board
• Reliable low cost construction utilizing
molded plastic technique
• Surge overload rating: 120 A peak
• High temperature soldering guaranteed:
250oC/10sec/ 0.375"
(
9.5mm
)
lead len
g
th
at 5 lbs tension
MECHANICAL DATA
• Terminal: Plated leads solderable per
MIL-STD 202E, method 208C
• Case: UL-94 Class V-O recognized flame
retardant epoxy
• Polarity: Polarity symbol marked on body
• Mounting position: Any
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
SYMBOL D3SB
10 D3SB
20 D3SB
40 D3SB
60 D3SB
80 UNITS
VRRM 100 200 400 600 800 V
VRMS 70 140 280 420 560 V
VDC 100 200 400 600 800 V
VFV
Maximum DC Reverse Current Ta=25oCµA
(at rated DC blocking voltage) Ta=125oCµA
Storage and Operating Junction Temperature TSTG,TJoC
http://www.sse-diode.com
D3SB10 THRU D3SB80
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Peak Forward Surge Current (8.3ms single
half sine-wave superimposed on rated load)
500
120
Maximum Instantaneous Forward Voltage
(at forward current 2.0A DC)
IR
IFSM
SINGLE PHASE GLASS
PASSIVATED SIP BRIDGE RECTIFIER
VOLTAGE: 100 TO 800V CURRENT: 4.0A
-55 to + 150
RATINGS
(Single-phase, half-wave, 60Hz, resistive or inductive load rating at 25oC, unless otherwise stated, for
capacitive load, derate current by 20%)
Maximum Average Forward Rectified Current
(Ta=50oC) IF(AV) 4.0 A
A
1.1
10
D3-SB
Dimensions in inches and (millimeters)
TECHNICAL
SPECIFICATION