Agilent AFBR-59R5LZ
Digital Diagnostic 2x7 SFF
850 nm 4.25/2.125/1.0625 GBd,
RoHS-Compliant Optical Transceiver
Data Sheet
Description
Agilent’s AFBR-59R5LZ optical
transceiver supports high-speed
serial links over multimode
optical fiber at signaling rates
up to 4.25 GBd. Compliant
with the Small Form Factor
(SFF) Multi Source Agreement
(MSA) 2x5/2x10 mechanical
specifications for LC Duplex
transceivers, ANSI Fibre
Channel FC-PI and IEEE 802.3
for gigabit applications the part
is electrically interoperable
with 2x5 and 2x6 conformant
devices. The AFBR-59R5LZ is
dimensionally compliant with
the SFF MSA form factor with
the exception of two additional
pins for communicating with
the diagnostic interface.
As an enhancement to the
conventional SFF 2x5 interface
defined in the SFF MSA
(Multi-Source Agreement) , the
AFBR-59R5LZ is compliant to
SFF-8472 (digital diagnostic
interface for optical
transceivers). Using the 2-wire
serial interface defined in the
SFF-8472 MSA, the AFBR-
59R5LZ provides real time
temperature, supply voltage,
laser bias current, laser
average output power and
received average input power.
Features
Fully RoHS Compliant
Diagnostic Features Per SFF-8472
“Diagnostic Monitoring Interface
for Optical Transceivers”
Real time monitoring of:
- Transmitted Optical Power
- Received Optical Power
- Laser Bias Current
- Temperature
- Supply Voltage
Wide Temp and supply voltage
operation (0°C to 70°C)
(3.3 +/- 10%)
Transceiver Specifications per
SFF 2x5 Multi-Source Agreement
and SFF-8472 (revision 9.3)
- 4.25 GBd Fibre Channel
operation for
FC-PI 400-M5-SN-I and
400-M6-SN-I
- 2.125 GBd Fibre Channel
operation for FC-PI 200-M5-
SN-1 and 200-M6-SN-I
- 1.0625 GBd Fibre Channel
operation for FC-PI 100-M5-
SN-I and 100-M6-SN-I
Link Lengths at 4.25 Gbd:
-150 m with 50 um MMF,
70 m with 62.5 um MMF
Link Lengths at 2.125 Gbd
300m with 50um MMF
150m with 65.5um MMF
Link Lengths at 1.0625 GBd:
- 500 m with 50 µm MMF,
300 m with 62.5 µm MMF
LC Duplex optical connector
interface conforming to ANSI
TIA/EIA604-10 (FOCIS 10A)
850nm Vertical Cavity Surface
Emitting Laser (VCSEL) Source
Technology
IEC 60825-1 Class 1/CDRH Class 1
laser eye safe
Compatible with Gigabit Ethernet
Application
Fibre Channel and iSCSI HBA
Cards
Related Products
AFBR-57R5APZ: 850 nm +3.3 V LC
SFP for 4.25/2.125/1.0625 GBd
Fibre Channel
2
Figure 1. Transceiver Functional Diagram
This information is in addition
to conventional SFP/GBIC base
data. The digital diagnostic
interface also adds the ability
to disable the transmitter
(TX_DISABLE), monitor for
Transmitter Faults (TX_FAULT)
and monitor for Receiver
Signal Detect (Sig_Det). This
2x7 package also includes one
dedicated ‘hard’ pin for
TX_FAULT.
Digital Diagnostic Interface and
Serial Identification
The 2-wire serial interface is
based on ATMEL AT24C01A
series EEPROM protocol and
signaling detail. Conventional
EEPROM memory, bytes 0-255
at memory address 0xA0, is
organized in compliance with
SFF-8074i. New digital
diagnostic information, bytes 0-
255 at memory address 0xA2,
is compliant to SFF-8472. The
new diagnostic information
provides the opportunity for
Predictive Failure
Identification, Compliance
Prediction, Fault Isolation and
Component Monitoring.
Predictive Failure Identification
The predictive failure feature
allows a host to identify
potential link problems before
system performance is
impacted. Prior identification
of link problems enables a host
to service an application via
“fail over” to a redundant link
or replace a suspect device,
maintaining system uptime in
the process. For applications
where ultra-high system
uptime is required, a digital
SFF provides a means to
monitor two real-time laser
metrics associated with
observing laser degradation
and predicting failure: average
laser bias current (Tx_Bias)
and average laser optical
power (Tx_Power).
Compliance Prediction:
Compliance prediction is the
ability to determine if an
optical transceiver is operating
within its operating and
environmental requirements.
AFBR-59R5LZ devices provide
real-time access to transceiver
internal supply voltage and
temperature, allowing a host to
identify potential component
compliance issues. Received
optical power is also available
to assess compliance of a cable
plant and remote transmitter.
When operating out of
requirements, the link cannot
guarantee error free
transmission.
Fault Isolation
The fault isolation feature
allows a host to quickly
pinpoint the location of a link
failure, minimizing system
downtime. For optical links,
the ability to identify a fault at
a local device, remote device
or cable plant is crucial to
speeding service of an
installation. AFBR-59R5LZ
real-time monitors of Tx_Bias,
Tx_Power, Vcc, Temp and Rx
average power can be used to
assess local transceiver current
operating conditions. In
addition, status flags Tx
Disable and Rx Signal Detect
are mirrored in memory and
available via the two-wire
serial interface.
3
Transmit Disable (Tx_Disable)
The AFBR-59R5LZ accepts a
TTL transmit disable control
signal input which shuts down
the transmitter. A high signal
implements this function while
a low signal allows normal
transceiver operation. In the
event of a fault (e.g. eye safety
circuit activated), cycling this
control signal resets the
module as depicted in Figure
5. An internal pull down
resistor enables the laser if the
line is not connected on the
host board. Host systems
should allow a 10ms interval
between successive assertions
of this control signal.
Tx_Disable can be asserted via
the two-wire serial interface
(address A2h, byte 110, bit 6)
and monitored (address A2h,
byte 110, bit 7).
The contents of A2h, byte 110
bit 6 are logic Or’d with the
TX_DISABLE pin to control the
transmit output.
Eye Safety Circuit
The AFBR-59R5LZ provides
Class 1 (single fault tolerant)
eye safety by design and has
been tested for compliance
with the requirements listed in
Table 1. The eye safety circuit
continuously monitors optical
output power levels and will
disable the transmitter upon
detecting an unsafe condition
beyond the scope of Class 1
certification. Such unsafe
conditions can be due to
inputs from the host board
(Vcc fluctuation, unbalanced
code) or a fault within the
transceiver.
Receiver Section
The receiver section contains a
PIN photodiode and custom
transimpedance preamplifier,
located at the optical interface
which mates with the LC
optical connector. The output
is fed to a custom IC that
provides post-amplification and
quantization.
Signal Detect (Sig_Det)
The post-amplification IC also
includes the transition
detection circuitry which
monitors the ac level of
incoming optical signals and
provides a TTL status signal to
the host. An adequate optical
input results in high signal
detect output while a low
signal detect output indicates
an unusable optical input. The
signal detect thresholds are set
so that a low output indicates
a definite optical fault has
occurred. Signal Detect can be
monitored via the two-wire
serial (address A2h, byte 110,
bit 1).
Component Monitoring
The AFBR-59R5LZ real-time
monitors of Tx_Bias, Tx_Power,
Vcc, Temp and Rx Average
Power may potentially be used
as a debugging aid for system
installation and design, and
transceiver parametric
evaluation for factory or field
qualification. For example,
temperature per module can be
observed in high-density
applications to facilitate
thermal evaluation of blades
and systems.
Transmitter Section
The transmitter section
contains 850nm VCSEL
(Vertical Cavity Surface
Emitting Laser) light source,
located at the optical interface
which mates with the LC
optical connector. The VCSEL
is driven by a custom IC which
uses the incoming differential
(PECL compatible) high speed
logic signal to modulate laser
diode driver current. This Tx
laser driver circuit regulates
optical output power at a
constant level provided the
incoming data pattern is dc
balanced (8B/10B code, for
example).
4
Functional Data I/O
The AFBR-59R5LZ interfaces
with the host circuit board
through fourteen I/O pins (2x7)
identified by function in Table
2. These pins are sized for the
use in boards between 0.062
in. and 0.100 in. thick. The
board layout for this interface
is depicted in Figure 7.
The AFBR-59R5LZ transmit
and receive interfaces are
PECL compatible. To simplify
board requirements, transmitter
bias resistors and ac coupling
capacitors are incorporated
into the transceiver module
and so are not required on the
host board. The Tx_Disable and
Signal Detect lines require TTL
lines on the host board if they
are to be utilized. The
transceiver will operate
normally if these lines are not
connected on the host board.
Figure 2 depicts the
recommended interface circuit
to link the AFBR-59R5LZ to
the supporting physical layer
ICs. Timing for MSA compliant
control signals implemented in
the transceiver are listed on
Page 12 and diagramed in
Figure 5.
Ordering Information
Please contact your local field
sales engineer or one of
Agilent Technologies franchised
distributors for ordering
information. For technical
information, please visit Agilent
Technologies’ WEB page at
www.agilent.com or contact
Agilent Technologies
Semiconductor Products
Customer Response Center at
1-800-235-0312. For
information related to SFF
Committee documentation visit
www.sffcommittee.org
PCB Assembly Process Compatibility
The AFBR-59R5LZ is
compatible with industry
standard wave solder and
aqueous wash processes as
detailed on Page 13. The
transceiver is shipped with a
process plug to keep out
impinging liquids, but is not
intended to be immersed. After
assembly, the process plug
should be kept in place as a
dust plug when the transceiver
is not in use.
Caution
There are no user serviceable
parts nor maintenance
requirements for the AFBR-
59R5LZ. All mechanical
adjustments are made at the
factory before shipping.
Tampering with, modifying,
misusing or improperly
handling the AFBR-59R5LZ will
void the product warranty. It
may also result in improper
operation and possibly
overstress the laser source.
Performance degradation or
device failure may result.
Connection of the AFBR-
59R5LZ to a light source not
compliant to IEEE 802.3 or
ANSI FC-PI specifications,
operating above the maximum
operating conditions or in a
manner inconsistent with it’s
design and function may result
in exposure to hazardous light
radiation and may constitute
an act of modifying or
manufacturing a laser product.
Persons performing such an act
are required by law to re-
certify and re-identify the laser
product under the provisions
of U.S. 21 CFR (Subchapter J)
and the TUV.
5
Table 1. Regulatory Compliance
Regulatory Compliance
The AFBR-59R5LZ complies
with all applicable laws and
regulations as detailed in Table
1. Certification level is
dependent on the overall
configuration of the host
equipment. The transceiver
performance is offered as a
figure of merit to assist the
designer.
Electrostatic Discharge (ESD)
The AFBR-59R5LZ is
compatible with ESD levels
found in typical manufacturing
and operating environments as
described in Table 1. In the
normal handling and operation
of optical transceivers, ESD is
of concern in two
circumstances.
The first case is during
handling of the transceiver
prior to soldering onto the host
board. To protect the device,
it’s important to use normal
ESD handling precautions.
These include using grounded
wrist straps, workbenches and
floor mats wherever the
transceiver is handled.
The second case to consider is
static discharges to the exterior
of the host equipment chassis
after assembly. If the optical
interface is exposed to the
exterior of host equipment
cabinet, the transceiver may be
subject to system level ESD
requirements.
Electromagnetic Interference (EMI)
Equipment incorporating gigabit
transceivers is typically subject
to regulation by the FCC in the
United States, TUV and
CENELEC EN55022 (CISPR 22)
in the European Union and
VCCI in Japan. The AFBR-
59R5LZ’s compliance to these
standards is detailed in Table
1. The metal housing and
shielded design of the AFBR-
59R5LZ minimize the EMI
challenge facing the equipment
designer.
Flammability
The AFBR-59R5LZ optical
transceiver is made of metal
and high strength, heat
resistant, chemical resistant
and UL 94V-0 flame retardant
plastic.
EMI Immunity
Due to its shielded design, the
EMI immunity of the AFBR-
59R5LZ exceeds typical
industry standards.
Feature Test Method Performance
Electrostatic Discharge (ESD) to the
Electrical Pins
MIL-STD-883C
Method 3015.4
Class 1 (> 2000 Volts)
Electrostatic Discharge (ESD) to the
Duplex LC Receptacle
Variation of IEC 61000-4-2 Typically withstands at least 15 kV without damage
when the duplex LC connector receptacle is
contacted by a Human Body Model probe. Fulfills
Live Traffic ESD testing up to 8 kV with less than 1
errored second.
Electromagnetic Interference (EMI) FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class 1
System margins are dependent on customer board
and chassis design.
Immunity Variation of IEC 61000-4-3 Typically shows no measurable effect from a 10
V/m field swept from 10 MHz to 1 GHz applied to
the transceiver without a chassis enclosure
Laser Eye Safety and Equipment Type
Test i n g
US FDA CDRH AEL Class 1
US21 CFR, Subchapter J per Paragraphs
1002.10 and 1002.12.
(IEC) EN60825-1: 1994 + A11+A2
(IEC) EN60825-2: 1994 + A1
(IEC) EN60950: 1992 + A1 + A2 + A3
+ A4 + A11
CDRH certification #9720151-57
TUV file #72042669
Component Recognition Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment Including Electrical Business
Equipment
UL File # E173874
Must comply with UL1950 or CUL 1950.
RoHS Compliance Less than 1000ppm of cadmium, lead, mercury,
hexavalent chromium, polybrominated biphenyls,
and polybrominated biphenyl ethers
6
Figure 2. Typical Application Configuration
Figure 3. Recommended Power Supply Filter
LASER DRIVER
RX_SD
SCL
SDA
Tx_FAULT
Tx_DISABLE
TD+
Tx FAULT
Tx DIS
TDÐ
RD+
RX_SD
SDA
SCL
V
CC
,R
GND
50
50
4.7 k to 10 k
PROTOCOL IC
V
CC
,T
GND
V
CC
,R
1 H
1 H
10 F 0.1 F
0.1 F
10 F 0.1 F
3.3 V
3.3 V
SERDES IC
GND,T
0.01 F
0.01 F
POST AMPLIFIER
100
4.7 k to 10 k
100
6.8 k
0.01 F
V
CC
,R
0.01 F
4.7 k to 10 k
V
CC
,R
RD-
GND
1 µH
1 µH
0.1 µF
V
CC
R
SFF MODULE
10 µF
V
CC
T
0.1 µF 10 µF
3.3 V
HOST BOARD
0.1 µF
NOTE: INDUCTORS MUST HAVE LESS THAN 1 W SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFF MODULE.
7
Table 2. Pin Description
Figure 4. Module pin configuration.
6
7
8
9
10
5
4
3
2
1
TOP VIEW
B
D
A
C
Pin Name Function/Description Notes
1V
EER Receiver Signal Ground 7
2V
CCR Receiver Power Supply: +3.3V 5
3 SD TTL Signal Detect: Active High 3
4 RD- Received Data Out Bar 4
5RD+ Received Data Out 4
6V
CCT Transmitter Power Supply: +3.3V 5
7V
EET Transmitter Signal Ground 7
8 TX_DISABLE TTL Transmitter Disable: Active High, (Open = Enabled) 1
9 TD+ Transmitter Data In 6
10 TD- Transmitter Data In Bar 6
A SDA Serial Interface Data I/O (Mod-def2) 2
B SCL Serial Interface Clock Input (Mod-def1) 2
CNC
D TX_FAULT Transmitter Fault Indication - High Indicates a
fault condition
8
Notes:
1. TX_DISABLE is an input that is used to shut down the transmitter optical output. It is pulled down with 6.8 kW internal to the transceiver.
Low (0 – 0.8 V) or Open: Transmitter Enabled
Between (0.8 V and 2.0 V): Undefined
High (2.0 – VCC max): Transmitter Disabled
The TX_DISABLE pin state is logic Or’d with the contents of EEPROM address A2h, byte 110 bit 6 (soft disable control bit) to control the transmit
output.
2. The signals SDA and SCL designate the two wire serial interface pins. They must be pulled up with a 4.7 k – 10 kW resistor on the host board. SCL
is the serial clock line of two wire serial interface. SDA is the serial data line of two wire serial interface
3. Signal Detect is a normally high LVTTL output. When high it indicates the received optical power is adequate for normal operation. When Low, it
indicates the received optical power is insufficient to guarantee error free operation. In the low state, the output will be pulled to < 0.8 V.
4. RD-/+ designate the differential receiver outputs. They are ac coupled 100 W differential lines which should be terminated with 100 W differential
at the host SerDes input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these lines will be
between 600 and 1600 mV differential (300 – 800 mV single ended) when properly terminated.
5. VCCR and VCCT are the receiver and transmitter power supplies. They are defined at the transceiver pins.
6. TD-/+ designate the differential transmitter inputs. They are ac coupled differential lines with 100 W
differential termination inside the module.
The ac coupling is done inside the module and is not required on the host board. The inputs will accept differential swings of 400 – 2400 mV (200 –
1200 mV single ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single ended) be used for best
EMI performance.
7. Transmitter and Receiver Ground are common internally on the transceiver PCB. They are electrically connected to signal ground within the
transceiver.
8. TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7k – 10kW resistor on the host board. When high, this output
indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.
8
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short
period of time. See Reliability Data Sheet for specific reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is not
implied, and damage to the device may occur over an extended period of time.
3. The module supply voltages, VCCT and VCCR must not differ by more than 0.5 V or damage to the device may occur.
4. Maximum wave or flow soldering temperature should not be applied for more than 10 seconds.
5. Recommended Operating Conditions are those values for which functional performance and device reliability is implied.
6. Filter per SFF specification is required on host board to remove 10 Hz to 4 MHz content.
7. SCL and SDA are to be pulled up externally with a 4.7 k – 10 kW resistor on the host board to 3.3 V.
Table 5. Transceiver Electrical Characteristics
(TC = -10°C to +70°C, VCCT, VCCR = 3.3 V ± 10%)
Table 4. Recommended Operating Conditions
Parameter Symbol Minimum Maximum Unit Notes
Storage Temperature TS-40 +100 °C 1, 2
Case Operating Temperature TC-40 +100 °C 1, 2
Aqueous Wash Pressure 110 psi
Maximum Wave or Flow Soldering Temperature TF+260 °C 4
Relative Humidity,
non condensing
RH 5 95 % 1
Supply Voltage VCCT, R -0.5 3.8 V 1, 2, 3
Voltage to any pin -0.5 3.8 V
Low Speed Input Voltage VIN -0.5 VCC + 0.5 V 1
Parameter Symbol Minimum Maximum Unit Notes
Case Operating Temperature TC-10 +70 °C 5, 6
Supply Voltage VCCT, R 2.97 3.63 V 6, 7
Data Rate 1.0625 4.25 Gb/s 6
Parameter Symbol Minimum Maximum Unit Notes
AC Electrical Characteristics
Power Supply Noise Rejection (Peak-to-Peak) PSNR 100 mV 6
DC Electrical Characteristics
Module Supply Current ICC 210 mA TX + RX
Power Dissipation PDISS 765 mW
Low Speed Outputs:
Signal Detect [SD], SDA VOH
VOL
2.0 VCCT, R + 0.3
0.8
V
V
Low Speed Inputs:
Transmitter Disable [TX_DIS], SCL, SDA VIH
VIL
2.0
0
VCC
0.8
V
V
7
Table 3. Absolute Maximum Ratings
9
Table 6. Transmitter and Receiver Electrical Characteristics
(TC = -10°C to +70°C, VCCT, VCCR = 3.3 V ± 10%)
Notes:
1. Internally ac coupled and terminated (100 Ohm differential).
2. Internally ac coupled but requires an external load termination (100 Ohm differential).
3. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern
4. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter
(measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is
allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ remain
within their specified FC-PI maximum limits with the worst case specified component jitter input.
5. 20%-80% electrical rise & fall times measured with a 500 MHz signal utilizing a 1010 data pattern.
Parameter Symbol Minimum Maximum Unit Notes
High Speed Data Input:
Transmitter Differential Input Voltage (TD +/-)
VI400 2400 mV 1
High Speed Data Output:
Receiver Differential Output Voltage (RD +/-)
VO600 1600 mV 2
Receiver Contributed Total Jitter (4.25 Gb/s) TJ 0.26 UI 4
62 ps
Receiver Contributed Total Jitter (2.125 Gb/s) TJ 0.262 UI 4
123 ps
Receiver Contributed Total Jitter (1.0625 Gb/s) TJ 0.218 UI 4
205 ps
Receiver Electrical Output Rise & Fall Times (20-80%) tr, tf 50 150 ps 5
10
Notes:
1. Max Pout is the lesser of Class 1 safety limits (CDRH and EN 60825) or receiver power max.
2. Into 50/125 µm (0.2 NA) and 62.5/125 µm (0.275 NA)multimode optical fiber.
3. An OMA of 196 is approximately equal to an average power of –9 dBm assuming an Extinction Ratio of 9 dB.
4. An OMA of 156 is approximately equal to an average power of –10 dBm assuming an Extinction Ratio of 9 dB.
5. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern.
6. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter
(measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ is
allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ remain
within their specified FC-PI maximum limits with the worst case specified component jitter input.
7. Measured 20-80%.
8. An OMA of 247 µW is approximately equal to an average power of –8 dBm,avg assuming an Extinction Ratio of 9 dB.
Table 7. Transmitter Optical Characteristics
(TC = -10°C to +70°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter Symbol Minimum Maximum Unit Notes
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 4.25 Gb/s
OMA 247 µW 8
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 2.125 Gb/s
OMA 196 µW 3
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 1.0625 Gb/s
OMA 156 µW 4
Average Optical Output Power Pout -9.0 dBm 1, 2
Center Wavelength lC830 860 nm
Spectral Width - rms s,rms 0.85 nm
Optical Rise/Fall Time tr, tf 90 ps 7
RIN 12 (OMA) RIN -118 dB/Hz
Transmitter Contributed
To ta l J it t e r
(4.25 Gb/s)
TJ 0.25 UI 6
60 ps
Transmitter Contributed Total Jitter (2.125 Gb/s) TJ 0.254 UI 6
120 ps
Transmitter Contributed Total Jitter (1.0625 Gb/s) TJ 0.267 UI 6
251 ps
Pout TX_DISABLE Asserted POFF -35 dBm
11
Table 8. Receiver Optical Characteristics
(TC = -10°C to +70°C, VCCT, VCCR = 3.3 V ± 10%)
Notes:
1. 50/125 µm. An OMA of 49 is approximately equal to an average power of –15 dBm with an Extinction Ratio of 9dB.
2. 50/125 µm. An OMA of 31 is approximately equal to an average power of –17 dBm with an Extinction Ratio of 9 dB.
3. 2.125 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 1.26 dB for 50 µm fiber and 2.03 dB for 62.5 µm fiber. Stressed receiver DCD
component min (at TX) is 40 ps.
4. 1.0625 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 0.96 dB for 50 µm fiber and 2.18 dB for 62.5 µm fiber. Stressed receiver DCD
component min (at TX) is 80 ps.
5. These average power values are specified with an Extinction Ratio of 9 dB. The signal detect circuitry responds to valid 8B/10B encoded peak to
peak input optical power, not average power.
6. Input Optical Modulation Amplitude (commonly known as sensitivity) requires a valid 8B/10B encoded input.
7. 50/125um. An OMA of 61 µW is approximately equal to an average power of –14 dBm with an Extinction Ratio of 9 dB.
8. 4.25 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 1.67 dB for 50 µm fiber and 2.14 dB for 62.5 µm fiber. Stressed receiver DCD
component min (at TX) is 20 ps.
Parameter Symbol Minimum Maximum Unit Notes
Input Optical Power [Overdrive] PIN 0dBm, avg
Input Optical Modulation Amplitude (p-p) 4.25 Gb/s OMA 61 µW, OMA 6, 7
Input Optical Modulation Amplitude (p-p) 2.125 Gb/s OMA 49 µW, OMA 1, 6
Input Optical Modulation Amplitude (p-p) 1.0625 Gb/s OMA 31 µW, OMA 2, 6
Stressed receiver sensitivity (OMA) 4.25 Gb/s
Stressed receiver sensitivity (OMA) 4.25 Gb/s
138 µW, OMA 50/125 µm fiber, 8
148 µW, OMA 62.5/125 µm fiber, 8
Stressed receiver sensitivity (OMA) 2.125 Gb/s 96 µW, OMA 50/125 µm fiber, 3
109 µW, OMA 62.5/125 µm fiber, 3
Stressed receiver sensitivity (OMA) 1.0625 Gb/s 55 µW, OMA 50/125 µm fiber, 4
67 µW, OMA 62.5/125 µm fiber, 4
Return Loss 12 dB
Signal Detect - Deassert PD27.5 uW, OMA
-30 -17.5 dBm, avg 5
Signal Detect - Assert PA31 uW, OMA
-17.0 dBm, avg 5
Loss of Signal Hysteresis PA - PD0.5 dB
12
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.
4. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
5. Time from loss of optical signal to Signal Detect De-Assertion.
6. Time from valid optical signal to Signal Detect Assertion.
7. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured from
falling clock edge after stop bit of write transaction.
8. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of nominal.
9. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
10. Time for two-wire interface de-assertion of Signal Detect (A2h, byte 110, bit 1) from loss of optical signal.
11. Time for two-wire interface assertion of Signal Detect (A2h, byte 110, bit 1) from presence of valid optical signal.
12. From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
13. Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).
14. Time from stop bit to completion of a 1-8 byte write command.
Table 9. Transceiver Soft Diagnostic Timing Characteristics
(TC = -10°C to +70°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter Symbol Minimum Typical Maximum Unit Notes
Hardware TX_DISABLE Assert Time t_off 10 µs 1
Hardware TX_DISABLE Negate Time t_on 1 ms 2
Time to initialize, including reset of TX_FAULT t_init 300 ms 3
Hardware TX_DISABLE to Reset t_reset 10 µs 4
Hardware Signal_Detect Deassert Time t_loss_on 100 µs 5
Hardware Signal_Detect Assert Time t_loss_off 100 µs 6
Software TX_DISABLE Assert Time t_off_soft 100 ms 7
Software TX_DISABLE Negate Time t_on_soft 100 ms 8
Software Tx_FAULT Assert Time t_fault_soft 100 ms 9
Software Signal_Detect DeAssert Time t_loss_on_soft 100 ms 10
Software Signal_Detect Assert Time t_loss_off_soft 100 ms 11
Analog parameter data ready t_data 1000 ms 12
Serial bus hardware ready t_serial 300 ms 13
Write Cycle Time t_write 10 ms 14
Serial ID Clock Rate f_serial_clock 400 kHz
13
Table 10. PCB Assembly Process Compatibility
Parameter Symbol Min Units Notes
Transceiver (Internal) Temperature
Accuracy
TINT ± 3.0 °C Temperature is measured internal to the transceiver and does not
reflect case temperature. Valid from = -10°C to +70 °C internal
transceiver temperature.
Transceiver (Internal) Supply Voltage
Accuracy
VINT ± 0.1 V Supply voltage is measured internal to the transceiver and can, with
less accuracy, be correlated to voltage at the SFF Vcc pin. Valid over 3.3
V ± 10%.
Transmitter Laser DC Bias Current
Accuracy
IBIAS ± 10 % IBIAS is better than ± 10% of the nominal value.
Transmitted Optical Output Power
Accuracy (AVG - average power)
PT± 3.0 dB Coupled into 50/125 µm multimode fiber. Valid from 100 µW,avg to
500 µW, avg.
Received Optical Input Power Accuracy
(Average power))
PR± 3.0 dB Coupled from 50/125 µm multimode fiber. Valid from 31 µW,OMA to
500 µW,OMA.
Parameter Symbol Minimum Typical Maximum Unit Notes
Hand Lead Soldering
Temperature/Time
TSOLD/tSOLD + 260/10 °C/sec
Wave Soldering and Aqueous
Wash
TSOLD/tSOLD + 260/10 °C/sec
Aqueous Wash Pressure 110 psi
Table 11. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
(TC = 10 °C to +70 °C, VCCT, VCCR = 3.3 V ± 10%)
14
Figure 5. Transceiver Timing Diagrams (Tx_FAULT as reported by A2h Byte 110 Bit 2)
Tx_FAULT
V
CC
> 2.97 V
t_init
Tx_DISABLE
TRANSMITTED SIGNAL
t_init
Tx_FAULT
V
CC
> 2.97 V
Tx_DISABLE
TRANSMITTED SIGNAL
t-init: TX DISABLE NEGATED t-init: TX DISABLE ASSERTED
t_off
Tx_FAULT
Tx_DISABLE
TRANSMITTED SIGNAL
t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
t_on
Tx_FAULT
OCCURANCE OF FAULT
t_fault
Tx_DISABLE
TRANSMITTED SIGNAL
Tx_FAULT
OCCURANCE OF FAULT
Tx_DISABLE
TRANSMITTED SIGNAL
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
t_reset t_init*
* CANNOT READ INPUT...
Tx_FAULT
OCCURANCE OF FAULT
t_fault
Tx_DISABLE
TRANSMITTED SIGNAL
OPTICAL SIGNAL
LOS
t-fault: TX DISABLE ASSERTED THEN NEGATED,
TX SIGNAL NOT RECOVERED
t-loss-on & t-loss-off
t_loss_on
t_init*
t_reset
* SFP SHALL CLEAR Tx_FAULT IN
t_init IF THE FAILURE IS TRANSIENT
t_loss_off
OCCURANCE
OF LOSS
15
Table 12. EEPROM Serial ID Memory Contents – Conventional SFF Memory (Address A0h)
Notes:
1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec. 200 MBytes/sec is a serial bit rate of 2.125 GBit/sec. 400 MBytes/sec is a
serial bit rate of 4.25 GBit/sec.
2. Link distance with 50/125um cable at 1.0625 Gbit/sec is 500m. Link distance at 2.125 Gbit/sec is 300m.
3. Link distance with 62.5/125um cable at 1.0625 Gbit/sec is 300m. Link distance with 62.5/125um cable at 2.125 Gbit/sec is 150m.
4. The IEEE Organizationally Unique Identifier (OUI) assigned to Agilent Technologies is 00-30-D3 (3 bytes of hex).
5. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.
6. Addresses 63 and 95 are checksums calculated (per SFF-8472 and SFF-8074i) and stored prior to product shipment.
7. Addresses 68-83 specify the AFBR-59R5LZ ASCII serial number and will vary on a per unit basis.
8. Addresses 84-91 specify the AFBR-59R5LZ ASCII date code and will vary on a per date code basis.
Byte #
Decimal
Data
Hex
Notes Byte #
Decimal
Data
Hex
Notes
0 02 SFF physical device (soldered device) 37 00 Hex Byte of Vendor OUI4
1 04 Serial ID function supported 38 30 Hex Byte of Vendor OUI4
2 07 LC optical connector 39 D3 Hex Byte of Vendor OUI4
3 00 40 41 "A" - Vendor Part Number ASCII character
4 00 41 46 "F" - Vendor Part Number ASCII character
5 00 42 42 "B" - Vendor Part Number ASCII character
6 00 43 52 "R" - Vendor Part Number ASCII character
7 20 Intermediate distance (per FC-PI) 44 2D "-" - Vendor Part Number ASCII character
8 40 Shortwave laser w/o OFC (open fiber control) 45 35 "5" - Vendor Part Number ASCII character
9 0C Multi-mode 50 µm and 62.5 µm optical media 46 39 "9" - Vendor Part Number ASCII character
10 15 100, 200 & 400 MBytes/sec FC-PI speed 147 52 "R" - Vendor Part Number ASCII character
11 01 Compatible with 8B/10B encoded data 48 35 "5" - Vendor Part Number ASCII character
12 2B 4300 MBit/sec nominal bit rate (4.25 Gbit/s) 49 4C "L" - Vendor Part Number ASCII character
13 00 50 5A "Z" - Vendor Part Number ASCII character
14 00 51 20 " " - Vendor Part Number ASCII character
15 00 52 20 " " - Vendor Part Number ASCII character
16 0F 150m of 50/125 µm fiber @ 4.25GBit/sec253 20 " " - Vendor Part Number ASCII character
17 07 70m of 62.5/125um fiber @ 4.25GBit/sec354 20 " " - Vendor Part Number ASCII character
18 00 55 20 " " - Vendor Part Number ASCII character
19 00 56 20 " " - Vendor Part Number ASCII character
20 41 "A" - Vendor Name ASCII character 57 20 " " - Vendor Part Number ASCII character
21 47 "G" - Vendor Name ASCII character 58 20 " " - Vendor Part Number ASCII character
22 49 "I" - Vendor Name ASCII character 59 20 " " - Vendor Part Number ASCII character
23 4C "L" - Vendor Name ASCII character 60 03 Hex Byte of Laser Wavelength5
24 45 "E" - Vendor Name ASCII character 61 52 Hex Byte of Laser Wavelength5
25 4E "N" - Vendor Name ASCII character 62 00
26 54 "T" - Vendor Name ASCII character 63 Checksum for Bytes 0-626
27 20 " " - Vendor Name ASCII character 64 00
28 20 " " - Vendor Name ASCII character 65 1C Hardware SFF TX_DISABLE, TX_FAULT & Sig-Det
29 20 " " - Vendor Name ASCII character 66 00
30 20 " " - Vendor Name ASCII character 67 00
31 20 " " - Vendor Name ASCII character 68-83 Vendor Serial Number ASCII characters7
32 20 " " - Vendor Name ASCII character 84-91 Vendor Date Code ASCII characters8
33 20 " " - Vendor Name ASCII character 92 68 Digital Diagnostics, Internal Cal, Rx Avg Pwr
34 20 " " - Vendor Name ASCII character 93 F0 A/W, Soft TX_DISABLE, TX_FAULT & "RX_LOS"
(signal detect)
35 20 " " - Vendor Name ASCII character 94 01 SFF-8472 Compliance to revision 9.3
36 00 95 Checksum for Bytes 64-946
96 - 255 00
16
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256 degrees C.
2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 uV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 uA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 uW.
5. Received average power (RX Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 uW.
6. Bytes 56-94 are not intended for use with AFBR-59R5LZ, but have been set to default values per SFF-8472.
7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
8. Bytes 128-247 are write enabled (customer writeable) .
Table 13. EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h)
Byte #
Decimal
Notes Byte #
Decimal
Notes Byte #
Decimal
Notes
0Temp H Alarm MSB
126 Tx Pwr L Alarm MSB4104 Real Time Rx Pwr, MSB5
1Temp H Alarm LSB
127 Tx Pwr L Alarm LSB4105 Real Time Rx Pwr, LSB5
2Temp L Alarm MSB
128 Tx Pwr H Warning MSB4106 Reserved
3 Temp L Alarm LSB129 Tx Pwr H Warning LSB4107 Reserved
4 Temp H Warning MSB130 Tx Pwr L Warning MSB4108 Reserved
5 Temp H Warning LSB131 Tx Pwr L Warning LSB4109 Reserved
6 Temp L Warning MSB132 Rx Pwr H Alarm MSB5110 Status/Control - See Table 14
7 Temp L Warning LSB133 Rx Pwr H Alarm LSB5111 Reserved
8V
CC H Alarm MSB234 Rx Pwr L Alarm MSB5112 Flag Bits - See Table 15
9V
CC H Alarm LSB235 Rx Pwr L Alarm LSB5113 Flag Bits - See Table 15
10 VCC L Alarm MSB236 Rx Pwr H Warning MSB5114 Reserved
11 VCC L Alarm LSB237 Rx Pwr H Warning LSB5115 Reserved
12 VCC H Warning MSB238 Rx Pwr L Warning MSB5116 Flag Bits - See Table 15
13 VCC H Warning LSB239 Rx Pwr L Warning LSB5117 Flag Bits - See Table 15
14 VCC L Warning MSB240-55 Reserved 118 Reserved
15 VCC L Warning LSB256-94 External Calibration Constants6119 Reserved
16 Tx Bias H Alarm MSB395 Checksum for Bytes 0-947120-127 Reserved
17 Tx Bias H Alarm LSB396 Real Time Temperature MSB1128-247 Customer Writeable8
18 Tx Bias L Alarm MSB397 Real Time Temperature LSB1248-254 Vendor Specific
19 Tx Bias L Alarm LSB398 Real Time VCC MSB2
20 Tx Bias H Warning MSB399 Real Time VCC LSB2
21 Tx Bias H Warning LSB3100 Real Time Tx Bias MSB3
22 Tx Bias L Warning MSB3101 Real Time Tx Bias LSB3
23 Tx Bias L Warning LSB3102 Real Time Tx Power MSB4
24 Tx Pwr H Alarm MSB4103 Real Time Tx Power LSB4
25 Tx Pwr H Alarm LSB4
17
Table 14. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110)
Notes:
1. The response time for soft commands of the AFBR-59R5LZ is 100msec as specified by the MSA SFF-8472
2. Bit 6 is logic OR’d with the SFF TX_DISABLE input pin 8 either asserted will disable the SFF transmitter.
3. AFBR-59R5LZ meets the MSA SFF-8472 data ready timing of 1000 msec.
Table 15. EEPROM Serial ID Memory Contents – Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117)
Bit # Status/Control Name Description Notes
7 TX_ DISABLE State Digital state of SFF TX_ DISABLE Input Pin (1 = TX_DISABLE asserted) 1
6 Soft TX_ DISABLE Read/write bit for changing digital state of SFF TX_DISABLE function11, 2
5 reserved
4 reserved
3 reserved
2 TX_FAULT State Digital state of the laser fault function (1 = Laser Fault Detected) 1
1 Signal Detect State Digital state of the SFF Sig_Det Output Pin (1 = Signal Detect asserted) 1
0 Data Ready (Bar) Indicates transceiver is powered and real time sense data is ready. (0 = Ready) 1
Byte Bit Flag Bit Name Description
112 7 Temp High Alarm Set when transceiver internal temperature exceeds high alarm threshold.
6 Temp Low Alarm Set when transceiver internal temperature exceeds low alarm threshold.
5V
CC High Alarm Set when transceiver internal supply voltage exceeds high alarm threshold.
4V
CC Low Alarm Set when transceiver internal supply voltage exceeds low alarm threshold.
3 Tx Bias High Alarm Set when transceiver laser bias current exceeds high alarm threshold.
2 Tx Bias Low Alarm Set when transceiver laser bias current exceeds low alarm threshold.
1 Tx Power High Alarm Set when transmitted average optical power exceeds high alarm threshold.
0 Tx Power Low Alarm Set when transmitted average optical power exceeds low alarm threshold.
113 7 Rx Power High Alarm Set when received average optical power exceeds high alarm threshold.
6 Rx Power Low Alarm Set when received average optical power exceeds low alarm threshold.
0-5 reserved
116 7 Temp High Warning Set when transceiver internal temperature exceeds high warning threshold.
6 Temp Low Warning Set when transceiver internal temperature exceeds low warning threshold.
5V
CC High Warning Set when transceiver internal supply voltage exceeds high warning threshold.
4V
CC Low Warning Set when transceiver internal supply voltage exceeds low warning threshold.
3 Tx Bias High Warning Set when transceiver laser bias current exceeds high warning threshold.
2 Tx Bias Low Warning Set when transceiver laser bias current exceeds low warning threshold.
1 Tx Power High Warning Set when transmitted average optical power exceeds high warning threshold.
0 Tx Power Low Warning Set when transmitted average optical power exceeds low warning threshold.
117 7 Rx Power High Warning Set when received average optical power exceeds high warning threshold.
6 Rx Power Low Warning Set when received average optical power exceeds low warning threshold.
0-5 reserved
18
Figure 6. Mechanical Drawing
AFBR-59R5LZ
14.23
Figure 7. Assembly Drawing
19
Figure 8. Board Layout
www.agilent.com/
semiconductors
For product information and a complete list
of distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312
or (916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (65) 6756 2394
India, Australia, New Zealand: (65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/Inter-
national), or 0120-61-1280(Domestic Only)
Korea: (65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (65) 6755 2044
Taiwan: (65) 6755 1843
Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
Obsoletes 5989-3018EN
September 29, 2005
5989-3624EN