July 2005 / B
Page 1
SEMICONDUCTOR
TAK CHEONG
®
500 mW LL-34 Hermetically
Sealed Glass – High Voltage
Switching Diodes
Absolute Maximum Ratings TA = 25°C unless otherwise noted
Symbol Parameter Value Units
VRRM Maximum Repetitive Reverse Voltage 250 V
TSTG Storage Temperature Range -65 to +200 °C
TJ Operating Junction Temperature 200 °C
IF (AV) Average Rectified Forward Current 200 mA
IFSM Non-repetitive Peak Forward Current
Pulse Width = 1.0 Second
Pulse Width = 1.0 µsecond
1.0
4.0
A
A
These ratings are limiting values above which the serviceability of the diode may be impaired.
Thermal Characteristics
Symbol Parameter Value Units
PD Power Dissipation 500 mW
RθJA Thermal Resistance, Junction to Ambient 350 °C/W
Specification Features:
LL-34 (Mini-MELF) Package
Surface Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
All external surfaces are corrosion resistant and terminals are readily solderable
1st band indicates negative polarity
Electrical Characteristics TA = 25°C unless otherwise noted
Limits
Symbol Parameter Test Condition
Min Max
Unit
BV Breakdown Voltage TC BAV100
TCBAV101
TCBAV102
TCBAV103
IR=100µA
60
120
200
250
---
---
---
---
Volts
Volts
Volts
Volts
IR Reverse Leakage Current TCBAV100
TCBAV101
TCBAV102
TCBAV103
VR=50V
VR=100V
VR=150V
VR=200V
---
---
---
---
100
100
100
100
nA
nA
nA
nA
VF Forward Voltage IF=100mA --- 1.0 Volts
TRR Reverse Recovery Time IF=IR=30mA
RL=100Ω
IRR=3mA
--- 50 nS
C Capacitance VR=0V, f =1MHZ --- 5.0 pF
TCBAV100/TCBAV101/TCBAV102/TCBAV103
Cathode Anode
ELECTRICAL SYMBOL
DEVICE MARKING DIAGRAM
Cathode Band Color : Black
SURFACE MOUNT
LL34
July 2005 / B
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SEMICONDUCTOR
TAK CHEONG
®
Electrical Symbol Definition Typical Characteristics
Symbol Parameter
BV Breakdown Voltage @ IR
IR Reverse Leakage Current @ VR
VR Reverse Voltage
IF Forward Current
VF Forward Voltage @ IF
Ordering Information
Device Pack Option Package Quantity
TCBAVxxx 7” Reel Tape and Reel 2,500
TCBAVxxxR13 13” Reel Tape and Reel 10,000
TCBAVxxx Others (…contact Tak Cheong sales representatives)
LL34 (Mini-MELF) Tape Packaging Standards
This standard practices for surface-mount tape packaging of leadless (Mini-MELF) components meets the requirements of EI A Standard
RS-481-A.
V
I
(mV)
(V)
(mA)
(µA)
VF
IF
BV
IR
IR
VR
(nA)
July 2005 / B
Page 3
SEMICONDUCTOR
TAK CHEONG
®
LL-34 (Mini-MELF) Tape & Reel Packaging Information
Label
Antistatic Cover Tape
Static Dissipative Embossed
Carrier Tape
Cathode
Label
LL34 UNIT ORIENTATION
Carrier Tape
Cover Tape Trailer Tape
80mm minimum or
20 empty pockets.
Leader Tape
500mm minimum or
125 empty pockets.
Components
Packaging Description:
LL34 parts are shipped in tape and reel.
The c arrier ta pe is mad e from a dis sipati ve
(carton filled) polycarbonate resin. The
cover tape is a multiplayer film (Heat
Activated Adhesive in nature) primarily
composed of polyester film, adhesive layer,
sealant, and anti-static sprayed agent.
These reeled parts in standard option are
shipped with 2,500 units per 7” or 178mm
diameter reel. The reels are blue in color
and made of recyclable plastic. Other
option comes in 10,000 units per 13” or
330mm diameter reel
LL-34 Packaging Outline
LL-34 Leader and Trailer
July 2005 / B
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SEMICONDUCTOR
TAK CHEONG
®
LL-34 (Mini-MELF) Tape & Reel Packaging Information
LL-34 Reel Outline
Dimensions are in millimeters
Tape Size QTY Option Dim A Dim B Dim C Dim D Dim N W1 W2 W3
2,500 178 1.5 13 20.2 55 8.4 14.4 7.9 – 10.9
8mm
10,000 330 1.5 13 20.2 100 8.4 14.4 7.9 – 10.9
July 2005 / B
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SEMICONDUCTOR
TAK CHEONG
®
Package Outline
Package Case Outline
LL34
LL-34
Millimeters Inches
DIM
Min Max Min Max
A 3.302 3.505 0.130 0.138
B 1.397 1.499 0.055 0.059
C 0.350 0.500 0.014 0.020
Notes: 1. LL34 polarity denoted by a band.
2. ‘Expansion Gap’ has no relation to the location of polarity.
