TLP181
2009-11-12
1
TOSHIBA Photocoupler GaAs Ired & Photo−Transistor
TLP181
Office Machine
Programmable Controllers
AC Adapter
I/O Interface Board
The TOSHIBA mini flat coupler TLP181 is a small outline coupler, suitable
for surface mount assembly.
TLP181 consist of a photo transistor optically coupled to a gallium arsenide
infrared emitting diode. Since TLP181 is smaller than DIP package, it’s
suitable for high-density surface mounting applications such as
programmable controllers
• Collector−emitter voltage: 80V (min)
• Current transfer ratio: 50% (min)
Rank GB: 100% (min)
• Isolation voltage: 3750Vrms (min)
• Operation Temperature:-55 to 110 ˚C
• Safety Standards
UL recognized: UL1577, File No. E67349
cUL recognized: CSA Component Acceptance Service No. 5A
File No.E67349
• BSI approved: BS EN60065:2002, certificate No.8285
BS EN60950-1:2006 certificate No.8286
Option (V4) type
VDE approved : EN60747-5-2
Maximum Operating Insuration Voltage: 565 Vpk
Highest Permissible Overvoltage: 6000 Vpk
(Note) : When a EN60747-5-2 approved type is needed,
Please designate “Option(V4)”
Pin Configuration (top view)
6
1: Anode
3: Cathode
4: Emitter
6: Collector
4
1
3
Unit in mm
TOSHIBA 11−4C1
Weight: 0.09 g (Typ.)
TLP181
2009-11-12
2
Current Transfer Ratio
Current Transfer Ratio (%)
(IC / IF)
IF = 5mA, VCE = 5V, Ta = 25°C
Type Classification
*1
Min Max
Marking Of Classification
Blank 50 600
Blank ,Y,Y■,YE,G,G■,GR,B, B■,BL,GB
Rank Y 50 150 YE
Rank GR 100 300 GR
Rank BL 200 600 BL
Rank GB 100 600 GB
Rank YH 75 150 Y■
Rank GRL 100 200 G
Rank GRH 150 300 G■
TLP181
Rank BLL 200 400 B
*1: EX, Rank GB: TLP181 (GB)
(Note) Application, type name for certification test, please use standard product type name, i, e.
TLP181 (GB): TLP181
TLP181
2009-11-12
3
Absolute Maximum Ratings (Ta = 25°C)
Characteristic Symbol Rating Unit
Forward current IF 50 mA
Forward current detating ΔIF / °C −1.4 (Ta ≥89°C) mA / °C
Pulse forward current
(100μs pulse, 100pps) IFP 1 A
Reverse voltage VR 5 V
LED
Junction temperature Tj 125 °C
Collector−emitter voltage VCEO 80 V
Emitter−collector voltage VECO 7 V
Collector current IC 50 mA
Collector power dissipation
(1 Circuit) PC 150 mW
Collector power dissipation
derating (1 Circuit Ta ≥ 25°C) ΔPC / °C −1.5 mW / °C
Detector
Junction temperature Tj 125 °C
Storage temperature range Tstg −55 to 125 °C
Operating temperature range Topr −55 to 110 °C
Lead soldering temperature Tsol 260 (10s) °C
Total package power dissipation PT 200 mW
Total package power dissipation
derating (Ta ≥ 25°C) ΔPT / °C −2.0 mW / °C
Isolation voltage
(AC, 1min., R.H. ≤ 60%) (Note 1) BVS 3750
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
(Note 1) Device considered a two−terminal device: Pin1, 3 shorted together and pins 4, 6 shorted together
Recommended Operating Conditions
Characteristic Symbol Min Typ. Max Unit
Supply voltage VCC ― 5 48 V
Forward current IF ― 16 20 mA
Collector current IC ― 1 10 mA
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.
TLP181
2009-11-12
4
Individual Electrical Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Forward voltage VF I
F = 10 mA 1.0 1.15 1.3 V
Reverse current IR V
R = 5 V — — 10 μA
LED
Capacitance CT V = 0, f = 1 MHz — 30 — pF
Collector−emitter
breakdown voltage V(BR) CEO I
C = 0.5 mA 80 — — V
Emitter−collector
breakdown voltage V(BR) ECO I
E = 0.1 mA 7 — — V
VCE = 48 V, ( Ambient light
below 1000 lx) — 0.01
(2)
0.1
(10) μA
Collector dark current ICEO
VCE = 48 V, Ta = 85°C, ( Ambient
light below 1000 lx) — 2
(4)
50
(50) μA
Detector
Capacitance
(collector to emitter) CCE V = 0, f = 1 MHz — 10 — pF
Coupled Electrical Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition MIn Typ. Max Unit
50 — 600
Current transfer ratio IC / IF IF = 5 mA, VCE = 5 V
Rank GB 100 — 600
%
— 60 —
Saturated CTR IC / IF (sat) IF = 1 mA, VCE = 0.4 V
Rank GB 30 — —
%
IC = 2.4 mA, IF = 8 mA — — 0.4
— 0.2 —
Collector−emitter
saturation voltage VCE (sat) IC = 0.2 mA, IF = 1 mA
Rank GB — — 0.4
V
Off−state collector current IC (off) V
F = 0.7V, VCE = 48 V — 1 10 μA
Isolation Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Capacitance
(input to output) CS VS = 0V, f = 1 MHz — 0.8 — pF
Isolation resistance RS VS = 500 V, R.H. ≤ 60% 1×1012 1014 — Ω
AC, 1 minute 3750 — —
AC, 1 second, in oil — 10000 —
Vrms
Isolation voltage BVS
DC, 1 minute, in oil — 10000 — Vdc
TLP181
2009-11-12
5
Switching Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Rise time tr — 2 —
Fall time tf — 3 —
Turn−on time ton — 3 —
Turn−off time toff
VCC = 10 V, IC = 2 mA
RL = 100Ω
— 3 —
μs
Turn−on time tON — 2 —
Storage time ts — 25 —
Turn−off time tOFF
RL = 1.9 kΩ (Fig.1)
VCC = 5 V, IF = 16 mA
— 40 —
μs
Fig. 1 Switching time test circuit
tOFF
tON
VCE
IF
tS
4.5V
0.5V
IF VCC
RL
VCE
TLP181
2009-11-12
6
PC – Ta
200
−20 0 20 40 60 80 100 120
160
120
80
40
0
Allowable collector power
dissipation PC (mW)
Ambient temperature Ta (°C)
IFP – DR
Duty cycle ratio DR
Pulse forward current IFP (mA)
3000
10
3
Pulse width ≤ 100μs
Ta = 25° C
10−3 3 10−2 3 10−1 3 100
30
50
100
300
1000
500
ΔVF / ΔTa – IF
Forward current IF (mA)
Forward voltage temperature
coefficient ΔVF / ΔTa ( m V / ° C )
−3.2
−0.4
0.1
−2.8
−2.4
−2.0
−1.6
−1.2
−0.8
0.3 0.5 1 3 5 10 30 50
IFP – VFP
Pulse forward voltage VFP (V)
1000
1
0.6
Pulse width ≤ 10μs
Repetitive
Frequency = 100Hz
Ta = 25°C
500
300
100
50
30
10
5
3
1.0 1.4 1.8 2.2 2.6 3.0
Pulse forward current IFP (mA)
IF – Ta
Ambient temperature Ta (°C)
Allowable forward current
IF (mA)
100
−20
80
60
40
20
0
0 20 40 60 80 100 120
IF – VF
Forward voltage VF (V)
Forward current IF (mA)
100
0.001
0
10
1
0.1
0.01
0.4 0.8 1.2 1.6 2
−25°C 85°C 25
°C
TLP181
2009-11-12
7
Collector current IC (mA)
IC – VCE
50
0
Collector-emitter voltage VCE (V)
0
40
30
20
10
2 4 6 8 10
50mA
30mA
20mA
15mA
10mA
PC (max)
IF = 5mA
Ta = 25°C
Collector-emitter voltage VCE (V)
IC – VCE
30
0
0 1.0
0.2 0.4 0.6 0.8
20
10
Collector current IC (mA)
50mA
Ta = 25°C
40mA
30mA
20mA
10mA
5mA
2mA
IC – IF
Forward current IF (mA)
0.1
0.1
0.3
0.5
1
3
5
10
30
50
100
0.3 0.5 1 3 5 10 30 50
Sample A
Sample B
Ta = 25°C
VCE = 10V
VCE = 5V
VCE = 0.4V
Collector current IC (mA)
Forward current IF (mA)
1000
10
IC / IF – IF
0.1 0.3 0.5 1 3 5 10 30 50
30
50
100
300
500
VCE = 10V
VCE = 5V
VCE = 0.4V
Ta = 25°C
Current transfer ratio
I
C / IF (%)
Sample B
Sample A
Collector dark current ICEO (μA)
ICEO – Ta
0
10
1
VCE = 48V
5V
10V
24V
20 40 60 80 100
Ambient temperature Ta (°C)
10
0
10
−
1
10
−
2
10
−
3
10
−
4
TLP181
2009-11-12
8
Collector-emitter saturation
voltage VCE(sat) (V)
VCE(sat) – Ta
0.24
0
Ambient temperature Ta (°C)
−40
0.20
0.12
0.08
0.04
−20 0 40 80 100 20 60
0.16
IF = 1mA
IC = 0.2mA
IC – Ta
100
1
−20 100
0 20 40 80
30
5
Collector current IC (mA)
VCE = 5V
60
0.1
0.3
0.5
3
10
50
1mA
0.5mA
5mA
10mA
IF = 25mA
Ambient temperature Ta (°C)
Switching Time – RL
Load resistance RL (kΩ)
1
10
30
50
100
300
500
1000
3 5 30 50
Switching time (μs)
5
3
1
Ta = 25°C
IF = 16mA
VCC = 5V
tOFF
ts
tON
100 10
Switching time (μs)
Switching Time – Ta
0
160
−20 20 40 60 80
Ambient temperature Ta (°C)
30
10
1
0.5
0.1
100
0.3
3
5
50 tOFF
ts
tON
IF = 16mA
VCC = 5V
RL = 1.9kΩ
TLP181
2009-11-12
9
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
